Dicing and die bonding integrated film, its manufacturing method, and semiconductor device manufacturing method

Abstract

To provide a dicing / die-bonding integrated film having a plurality of pressure-sensitive adhesive layers, capable of suppressing the occurrence of defects in a pick-up process, and a manufacturing method thereof.SOLUTION: A dicing / die-bonding integrated film 10 includes a dicing film 4 having a substrate layer 1, a first adhesive layer 2, and a second adhesive layer 3 in this order, and a die bonding film 5 placed on the second adhesive layer 3 of the dicing film 4. Corona processing is performed on at least one of the surface 2A of the first adhesive layer 2 on the second adhesive layer 3 side and the surface 3A of the second adhesive layer 3 on the first adhesive layer 2 side.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a dicing-die bonding integrated film, a manufacturing method thereof, and a manufacturing method of a semiconductor device. [Background technology]

[0002] Conventionally, semiconductor devices are manufactured through the following steps: First, a wafer lamination step is performed in which a semiconductor wafer is attached to a dicing adhesive sheet, and then a singulation step is performed in which the semiconductor wafer is singulated into semiconductor chips with the semiconductor wafer attached. Then, a pickup step, a die bonding step, etc. are performed.

[0003] In the manufacturing process of semiconductor devices, a film called a dicing / die-bonding integrated film is used, which has the functions of fixing a semiconductor wafer in a singulation process and bonding a semiconductor chip to a substrate in a die-bonding process. This film has a structure in which a base layer, a pressure-sensitive adhesive layer, and an adhesive layer (die-bonding film) are laminated in this order, and is used, for example, as follows: First, the adhesive layer side is attached to a semiconductor wafer, and the semiconductor wafer is singulated with a dicing ring (singulation process). This results in the semiconductor wafer being singulated into multiple semiconductor chips. Next, if necessary, the adhesive layer is irradiated with ultraviolet light to reduce the adhesive strength of the adhesive layer (ultraviolet light irradiation process), and the semiconductor chip is picked up from the adhesive layer together with the adhesive pieces formed by singulating the adhesive layer (pickup process). This is followed by a die-bonding process in which the semiconductor chip is pressure-bonded to a substrate or the like via the adhesive pieces, thereby producing a semiconductor device.

[0004] As described above, a pressure-sensitive adhesive layer whose adhesive strength decreases when irradiated with ultraviolet light is called an ultraviolet-curing pressure-sensitive adhesive layer. In contrast, a pressure-sensitive adhesive layer whose adhesive strength remains constant without being irradiated with ultraviolet light in the semiconductor device manufacturing process can also be used. Such a pressure-sensitive adhesive layer is called a pressure-sensitive adhesive layer.

[0005] Required properties of a dicing / die bonding integrated film include, for example, not peeling off from the dicing ring during the singulation process, maintaining the distance between semiconductor chips (kerf width) after the singulation process, and having sufficiently low adhesion between the pressure-sensitive adhesive layer and the adhesive layer for excellent pickup properties during the pickup process.

[0006] As a means for satisfying these properties, it has been considered to separate the functions by forming a pressure-sensitive adhesive layer into multiple layers. For example, Patent Documents 1 and 2 disclose a dicing film or a dicing / die-bonding integrated film that includes a base layer and two pressure-sensitive adhesive layers (a first pressure-sensitive adhesive layer and a second pressure-sensitive adhesive layer). [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-049507 [Patent Document 2] Japanese Patent Application Laid-Open No. 2012-060038 Summary of the Invention [Problem to be solved by the invention]

[0008] However, when the inventors further investigated the possibility of separating the functions of the adhesive layer by dividing it into multiple layers, they found that problems such as peeling occurring between the first adhesive layer and the second adhesive layer (at the interface) could occur during the pickup process.

[0009] Therefore, the main object of the present disclosure is to provide a dicing-die bonding integrated film having multiple adhesive layers that can suppress the occurrence of defects during the pickup process, and a method for manufacturing the same. [Means for solving the problem]

[0010] The present inventors conducted research to solve the above-mentioned problems and discovered that by subjecting at least one of the surface of the first adhesive layer that contacts the second adhesive layer and the surface of the second adhesive layer that contacts the first adhesive layer to corona treatment, the adhesion between the first adhesive layer and the second adhesive layer can be improved, and as a result, defects in the pick-up process can be suppressed, leading to the completion of the invention of the present disclosure.

[0011] One aspect of the present disclosure relates to a dicing-die bonding integrated film. The dicing-die bonding integrated film includes a dicing film having a base layer, a first adhesive layer, and a second adhesive layer in this order, and a die bonding film disposed on the second adhesive layer of the dicing film. In the dicing-die bonding integrated film, at least one of the surface of the first adhesive layer facing the second adhesive layer and the surface of the second adhesive layer facing the first adhesive layer is subjected to a corona treatment. This dicing-die bonding integrated film improves adhesion between the first adhesive layer and the second adhesive layer, making it possible to suppress defects during the pickup process.

[0012] The corona treatment may be performed on the surface of the first pressure-sensitive adhesive layer facing the second pressure-sensitive adhesive layer. That is, as long as the corona treatment is performed on the surface of the first pressure-sensitive adhesive layer facing the second pressure-sensitive adhesive layer, the corona treatment may or may not be performed on the surface of the second pressure-sensitive adhesive layer facing the first pressure-sensitive adhesive layer. For ease of implementation, the corona treatment may be performed only on the surface of the first pressure-sensitive adhesive layer facing the second pressure-sensitive adhesive layer.

[0013] From the viewpoint of pickup properties, the second adhesive layer in contact with the die bonding film is preferably an ultraviolet-curable adhesive layer whose adhesive strength can be adjusted by ultraviolet irradiation.

[0014] Another aspect of the present disclosure relates to a method for producing the above-mentioned dicing-die bonding integrated film, which includes the steps of preparing a first laminate having a base layer and a first pressure-sensitive adhesive layer provided on the base layer, and a second laminate having a support film and a second pressure-sensitive adhesive layer provided on the support film, performing a corona treatment on at least one of the surface of the first pressure-sensitive adhesive layer of the first laminate opposite the base layer and the surface of the second pressure-sensitive adhesive layer of the second laminate opposite the support film, laminating the first pressure-sensitive adhesive layer of the first laminate with the second pressure-sensitive adhesive layer of the second laminate to obtain a dicing film, and disposing a die-bonding film on the second pressure-sensitive adhesive layer of the obtained dicing film to obtain the dicing-die bonding integrated film.

[0015] Another aspect of the present disclosure relates to a method for manufacturing a semiconductor device, comprising the steps of attaching the die bonding film of the above-mentioned dicing and die bonding integrated film to a semiconductor wafer, singulating the semiconductor wafer and the die bonding film, picking up the semiconductor chips with the die bonding film pieces from the second adhesive layer of the dicing film, and adhering the semiconductor chips with the die bonding film pieces to a support substrate via the die bonding film pieces. [Effects of the Invention]

[0016] According to the present disclosure, a dicing-die bonding integrated film having multiple pressure-sensitive adhesive layers and a method for manufacturing the same that can suppress defects in the pickup process are provided. The present disclosure also provides a method for manufacturing a semiconductor device using such a dicing-die bonding integrated film. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a schematic cross-sectional view showing one embodiment of a dicing / die bonding integrated film. [Figure 2] 2A, 2B, 2C, and 2D are schematic cross-sectional views showing one embodiment of a method for producing a dicing film, each of which is a cross-sectional view showing each step. [Figure 3] 3A, 3B, 3C, 3D, 3E, and 3F are schematic cross-sectional views showing one embodiment of a method for manufacturing a semiconductor device, in which (a), (b), (c), (d), (e), and (f) are cross-sectional views showing each step. [Figure 4] FIG. 4 is a schematic cross-sectional view showing one embodiment of a semiconductor device. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings as appropriate. However, the present disclosure is not limited to the following embodiments. In the following embodiments, the components (including steps, etc.) are not essential unless specifically stated. The sizes of the components in each figure are conceptual, and the relative size relationships between the components are not limited to those shown in each figure.

[0019] The same applies to the numerical values ​​and ranges in the present disclosure, and do not limit the present disclosure. In this specification, a numerical range indicated using "to" indicates a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In the numerical ranges described in stages in this specification, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. Furthermore, in the numerical ranges described in this specification, the upper or lower limit value of that numerical range may be replaced with a value shown in the examples.

[0020] In this specification, the term "layer" includes not only a structure with a shape formed over the entire surface when observed in a plan view, but also a structure with a shape formed on a portion of the surface. Furthermore, in this specification, the term "process" includes not only an independent process, but also a process that cannot be clearly distinguished from other processes as long as the intended effect of the process is achieved.

[0021] In this specification, (meth)acrylate means an acrylate or the corresponding methacrylate. The same applies to other similar expressions such as a (meth)acrylic resin and a (meth)acrylic monomer.

[0022] Unless otherwise specified, each of the components and materials exemplified in this specification may be used alone or in combination of two or more.

[0023] [Dicing and die bonding integrated film] Fig. 1 is a schematic cross-sectional view showing one embodiment of a dicing and die bonding integrated film. The dicing and die bonding integrated film 10 shown in Fig. 1 includes a dicing film 4 having a base layer 1, a first pressure-sensitive adhesive layer 2, and a second pressure-sensitive adhesive layer 3 in this order, and a die bonding film 5 (an adhesive layer made of the die bonding film) disposed on second pressure-sensitive adhesive layer 3 of dicing film 4.

[0024] <Dicing film> Each layer constituting the dicing film 4 may be pre-cut to a predetermined shape in accordance with the process, equipment, etc. The dicing film 4 may be cut into individual semiconductor wafers or may be in the form of a long roll. A separator may be provided on the second adhesive layer as appropriate. Each layer constituting the dicing film 4 will be described below.

[0025] (base material layer) Examples of the substrate layer 1 include plastic films such as polytetrafluoroethylene film, polyethylene terephthalate film, polyethylene film, polypropylene film, polymethylpentene film, and polyimide film. Furthermore, the substrate layer 1 may be subjected to surface treatment such as primer coating, UV treatment, corona discharge treatment, polishing treatment, and etching treatment, as needed. The thickness of the substrate layer 1 may be, for example, 10 to 150 μm or 20 to 130 μm.

[0026] (Adhesive layer) The pressure-sensitive adhesive layer includes a first pressure-sensitive adhesive layer 2 and a second pressure-sensitive adhesive layer 3. At least one of the surface 2A of the first pressure-sensitive adhesive layer 2 facing the second pressure-sensitive adhesive layer 3 and the surface 3A of the second pressure-sensitive adhesive layer 3 facing the first pressure-sensitive adhesive layer 2 is subjected to a corona treatment. The corona treatment may be applied to all (the entire) or part of the surface 2A, preferably the entire surface 2A. The corona treatment may be applied to all (the entire) or part of the surface 3A, preferably the entire surface 3A. By applying the corona treatment to at least one of the surfaces 2A and 3A, it is possible to improve the adhesion between the first pressure-sensitive adhesive layer 2 and the second pressure-sensitive adhesive layer 3. The corona treatment may be applied to the surface 2A. In other words, as long as the corona treatment is applied to the surface 2A, it does not matter whether the corona treatment is applied to the surface 3A or not. The corona treatment may be applied only to the surface 2A for ease of implementation.

[0027] The corona treatment can be performed using, for example, a corona discharge device (e.g., corona treatment device (KG0602W-65, manufactured by Kasuga Electric Co., Ltd.) or the like), a known method known as a surface modification method using corona discharge. The wetting tension of the surface (surface 2A or surface 3A) immediately after the corona treatment may be 50 to 80 mN / m, or may be 60 mN / m or more. In this specification, the wetting tension of the corona-treated surface refers to the value measured in accordance with JIS K6768 using a mixture for wetting tension testing (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.). More specifically, the wetting tension refers to the value of the surface tension of the mixture applied to the corona-treated surface and determined to wet the surface.

[0028] The first adhesive layer 2 and the second adhesive layer 3 may be adhesive layers made of adhesives commonly used in the field of dicing films, and may be pressure-sensitive adhesive layers made of pressure-sensitive adhesives, or ultraviolet-curing adhesive layers made of ultraviolet-curing adhesives. The ultraviolet-curing adhesive layer may have the property of decreasing its adhesiveness when irradiated with ultraviolet light.

[0029] From the viewpoint of separating the functions, it is preferable that one of the first pressure-sensitive adhesive layer 2 and the second pressure-sensitive adhesive layer 3 is a pressure-sensitive adhesive layer and the other is an ultraviolet-curable adhesive layer. From the viewpoint of pickup properties, the second pressure-sensitive adhesive layer 3 in contact with the die bonding film 5 is preferably an ultraviolet-curable adhesive layer whose adhesive strength can be adjusted by ultraviolet irradiation, and the first pressure-sensitive adhesive layer 2 is preferably a pressure-sensitive adhesive layer.

[0030] The following description will focus on an embodiment in which the first pressure-sensitive adhesive layer 2 is a pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer 3 is an ultraviolet-curable pressure-sensitive adhesive layer.

[0031] The thickness of the first pressure-sensitive adhesive layer 2 may be, for example, 1 μm or more or 2 μm or more, or 30 μm or less or 15 μm or less. When the thickness of the first pressure-sensitive adhesive layer 2 is 1 μm or more, sufficient adhesion tends to be easily obtained, and when the thickness of the first pressure-sensitive adhesive layer 2 is 30 μm or less, ultraviolet light tends to easily transmit through, and the curing reaction of the second pressure-sensitive adhesive layer 3 tends to be less inhibited.

[0032] The thickness of the second pressure-sensitive adhesive layer 3 may be, for example, 1 μm or more or 2 μm or more, or 30 μm or less or 15 μm or less. When the thickness of the second pressure-sensitive adhesive layer 3 is 1 μm or more, sufficient adhesion tends to be easily obtained, and when the thickness of the second pressure-sensitive adhesive layer 3 is 30 μm or less, stress is sufficiently transmitted to the die bonding film 5 (adhesive layer made of the die bonding film) in the pick-up step, and a decrease in separability and pick-up ability tends to be suppressed.

[0033] The pressure-sensitive adhesive layer serving as the first adhesive layer 2 can be obtained, for example, by forming an adhesive composition containing a (meth)acrylic resin (A) and a crosslinking agent (C) into a film and aging the film for a certain period of time. The (meth)acrylic resin (A) may be crosslinked with the crosslinking agent (C).

[0034] The first pressure-sensitive adhesive layer 2 can be formed, for example, by preparing a first pressure-sensitive adhesive varnish containing a (meth)acrylic resin (A), a crosslinking agent (C), and an organic solvent, applying the first pressure-sensitive adhesive varnish to the base layer 1, and removing the volatile components. The first pressure-sensitive adhesive layer 2 can also be formed by applying such a first pressure-sensitive adhesive varnish to a support film, removing the volatile components to form a pressure-sensitive adhesive layer, and then transferring the resulting pressure-sensitive adhesive layer to the surface of the base layer 1. A first pressure-sensitive adhesive layer 2 having a corona-treated surface can be obtained by subjecting the surface 2A of the formed first pressure-sensitive adhesive layer 2 facing the second pressure-sensitive adhesive layer 3 to corona treatment.

[0035] The ultraviolet-curable pressure-sensitive adhesive layer serving as the second pressure-sensitive adhesive layer 3 can be obtained, for example, by forming a pressure-sensitive adhesive composition containing a (meth)acrylic resin (B), a crosslinking agent (C), and a photopolymerization initiator (D) into a film and aging the film for a certain period of time. The (meth)acrylic resin (B) may be crosslinked with the crosslinking agent (C).

[0036] The second pressure-sensitive adhesive layer 3 can be formed, for example, by preparing a second pressure-sensitive adhesive varnish containing a (meth)acrylic resin (B), a crosslinking agent (C), a photopolymerization initiator (D), and an organic solvent, applying the second pressure-sensitive adhesive varnish to the surface 2A of the first pressure-sensitive adhesive layer 2, and then removing the volatile components. In this case, the surface 3A of the second pressure-sensitive adhesive layer 3 is not usually subjected to a corona treatment. Alternatively, the second pressure-sensitive adhesive layer 3 can also be formed by applying such a second pressure-sensitive adhesive varnish to a support film, removing the volatile components to form a pressure-sensitive adhesive layer, and then transferring the resulting pressure-sensitive adhesive layer onto the surface 2A of the first pressure-sensitive adhesive layer 2. In this case, the surface of the formed pressure-sensitive adhesive layer (the surface 3A of the second pressure-sensitive adhesive layer 3 facing the first pressure-sensitive adhesive layer 2) can be subjected to a corona treatment to form the second pressure-sensitive adhesive layer 3 having a corona-treated surface.

[0037] Examples of the support film include plastic films such as polytetrafluoroethylene film, polyethylene terephthalate film, polyethylene film, polypropylene film, polymethylpentene film, and polyimide film. Furthermore, the support film may be subjected to a surface treatment such as primer coating, UV treatment, corona discharge treatment, polishing treatment, and etching treatment, as needed. The thickness of the support film may be, for example, 10 to 150 μm or 20 to 130 μm.

[0038] (Meth)acrylic resin (A) The (meth)acrylic resin (A) for forming the pressure-sensitive adhesive layer is a polymer of a (meth)acrylic monomer, etc. The (meth)acrylic resin (A) preferably has at least one substituent selected from a carboxy group, a hydroxy group, an epoxy group (glycidyl group), an amino group, etc. (hereinafter, sometimes referred to as a "predetermined substituent") as a reactive site with a functional group-introducing compound or a crosslinking agent, which will be described later.

[0039] The (meth)acrylic resin (A) can be obtained by polymerizing (meth)acrylic monomers and the like using a known method. Examples of polymerization methods include solution polymerization, suspension polymerization, emulsion polymerization, bulk polymerization, precipitation polymerization, gas-phase polymerization, plasma polymerization, and supercritical polymerization. Examples of polymerization reaction types include radical polymerization, cationic polymerization, anionic polymerization, living radical polymerization, living cationic polymerization, living anionic polymerization, coordination polymerization, and immortal polymerization. Other examples include ATRP (atom transfer radical polymerization) and RAFT (reversible addition-fragmentation chain transfer polymerization). Among these, radical polymerization using a solution polymerization method is preferred from the viewpoints of economy, high reaction rate, ease of polymerization control, and the like, as well as the fact that the resin solution obtained by polymerization can be used for formulation as is.

[0040] The monomer for synthesizing the (meth)acrylic resin (A) is not particularly limited as long as it has one ethylenically unsaturated group (preferably a (meth)acryloyl group) in one molecule. Specific examples thereof include (meth)acrylic acid, methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, butoxyethyl (meth)acrylate, isoamyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, heptyl (meth)acrylate, octylheptyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, undecyl (meth)acrylate, lauryl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, stearyl (meth)acrylate, and behenyl (meth). aliphatic (meth)acrylates such as methyl acrylate, methoxy polyethylene glycol (meth)acrylate, ethoxy polyethylene glycol (meth)acrylate, methoxy polypropylene glycol (meth)acrylate, ethoxy polypropylene glycol (meth)acrylate, and mono(2-(meth)acryloyloxyethyl)succinate; alicyclic (meth)acrylates such as cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, cyclopentyl (meth)acrylate, dicyclopentanyl (meth)acrylate, dicyclopentenyl (meth)acrylate, isobornyl (meth)acrylate, mono(2-(meth)acryloyloxyethyl)tetrahydrophthalate, and mono(2-(meth)acryloyloxyethyl)hexahydrophthalate;Benzyl (meth)acrylate, phenyl (meth)acrylate, o-biphenyl (meth)acrylate, 1-naphthyl (meth)acrylate, 2-naphthyl (meth)acrylate, phenoxyethyl (meth)acrylate, p-cumylphenoxyethyl (meth)acrylate, o-phenylphenoxyethyl (meth)acrylate, 1-naphthoxyethyl (meth)acrylate, 2-naphthoxyethyl (meth)acrylate, phenoxypolyethylene glycol (meth)acrylate, nonylphenoxy Aromatic (meth)acrylates such as phenoxy polyethylene glycol (meth)acrylate, phenoxy polypropylene glycol (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, 2-hydroxy-3-(o-phenylphenoxy)propyl (meth)acrylate, 2-hydroxy-3-(1-naphthoxy)propyl (meth)acrylate, and 2-hydroxy-3-(2-naphthoxy)propyl (meth)acrylate; 2-tetrahydrofurfuryl (meth)acrylate Heterocyclic (meth)acrylates such as acrylate, N-(meth)acryloyloxyethylhexahydrophthalimide, 2-(meth)acryloyloxyethyl-N-carbazole, caprolactone-modified products thereof, ω-carboxy-polycaprolactone mono(meth)acrylate, glycidyl (meth)acrylate, α-ethylglycidyl (meth)acrylate, α-propylglycidyl (meth)acrylate, α-butylglycidyl (meth)acrylate, 2-methylglycidyl (meth)acrylate, 2-ethyl ... compounds having an ethylenically unsaturated group and an epoxy group, such as butylglycidyl (meth)acrylate, 2-propylglycidyl (meth)acrylate, 3,4-epoxybutyl (meth)acrylate, 3,4-epoxyheptyl (meth)acrylate, α-ethyl-6,7-epoxyheptyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, and p-vinylbenzyl glycidyl ether;Ethylenically unsaturated groups and oxetanyl such as (2-ethyl-2-oxetanyl)methyl (meth)acrylate, (2-methyl-2-oxetanyl)methyl (meth)acrylate, 2-(2-ethyl-2-oxetanyl)ethyl (meth)acrylate, 2-(2-methyl-2-oxetanyl)ethyl (meth)acrylate, 3-(2-ethyl-2-oxetanyl)propyl (meth)acrylate, and 3-(2-methyl-2-oxetanyl)propyl (meth)acrylate Examples of suitable (meth)acrylic resins include compounds having an ethylenically unsaturated group and an isocyanate group, such as 2-(meth)acryloyloxyethyl isocyanate, and compounds having an ethylenically unsaturated group and a hydroxy group, such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 3-chloro-2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl (meth)acrylate. By appropriately combining these monomers, desired (meth)acrylic resins can be obtained.

[0041] As a monomer for synthesizing the (meth)acrylic resin (A), a monomer copolymerizable with the above-mentioned monomers (e.g., styrene and its derivatives; maleimide compounds such as alkylmaleimide, cycloalkylmaleimide, and arylmaleimide) can be used, if necessary.

[0042] The (meth)acrylic resin (A) having a predetermined substituent can be obtained by polymerizing a monomer having a predetermined substituent (for example, (meth)acrylic acid, a compound having an ethylenically unsaturated group and a hydroxy group, a compound having an ethylenically unsaturated group and an epoxy group, etc.).

[0043] The (meth)acrylic resin (A) having a predetermined substituent may have at least one substituent selected from a carboxy group, a hydroxy group, an epoxy group (glycidyl group), an amino group, etc. of the (meth)acrylic resin (A) as a reactive site, and some of the reactive sites may be crosslinked with a crosslinking agent (C) described below.

[0044] (Meth)acrylic resin (B) The (meth)acrylic resin (B) for forming the UV-curable pressure-sensitive adhesive layer is a polymer of a (meth)acrylic monomer or the like. The (meth)acrylic resin (B) preferably has a chain-polymerizable functional group. The chain-polymerizable functional group may be, for example, at least one selected from an acryloyl group and a methacryloyl group. The (meth)acrylic resin (B) having a chain-polymerizable functional group can be obtained, for example, by using at least one substituent selected from a carboxy group, a hydroxy group, an epoxy group (glycidyl group), an amino group, etc. as a reactive site in the (meth)acrylic resin (A) having the predetermined substituent, and reacting some of the reactive sites with a functional group-introducing compound (a compound having a group reactive with the predetermined substituent and a chain-polymerizable functional group).

[0045] Specific examples of the functional group-introducing compound include 2-(meth)acryloyloxyethyl isocyanate, glycidyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, ethyl isocyanate (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, crotonic acid, 2-hexahydrophthaloylethyl (meth)acrylate, etc. The functional group-introducing compound may be 2-(meth)acryloyloxyethyl isocyanate.

[0046] The (meth)acrylic resin (B) having a chain-polymerizable functional group may have at least one substituent selected from a carboxy group, a hydroxy group, an epoxy group (glycidyl group), an amino group, etc. of the (meth)acrylic resin (B) as a reactive site, and some of the reactive sites may be crosslinked with a crosslinking agent (C) described below.

[0047] Crosslinking agent (C) The crosslinking agent (C) is used, for example, for the purpose of controlling the storage modulus and / or adhesiveness of the pressure-sensitive adhesive layer. The crosslinking agent (C) may be a compound having two or more reactive groups in one molecule that can react with a predetermined substituent possessed by the (meth)acrylic resin (A) or (meth)acrylic resin (B). Examples of bonds formed by the reaction between the (meth)acrylic resin (A) or (meth)acrylic resin (B) having a predetermined substituent and the crosslinking agent (C) include an ester bond, an ether bond, an amide bond, an imide bond, a urethane bond, and a urea bond.

[0048] The crosslinking agent (C) may be, for example, a polyfunctional isocyanate having two or more isocyanate groups in one molecule. By using such a polyfunctional isocyanate, it can easily react with a predetermined substituent of the (meth)acrylic resin (A) to form a strong crosslinked structure.

[0049] Examples of polyfunctional isocyanates having two or more isocyanate groups in one molecule include isocyanate compounds such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4'-diisocyanate, dicyclohexylmethane-2,4'-diisocyanate, and lysine isocyanate.

[0050] The crosslinking agent (C) may be a reaction product (isocyanate group-containing oligomer) of a polyfunctional isocyanate with a polyhydric alcohol having two or more hydroxy groups in one molecule. Examples of polyhydric alcohols having two or more hydroxy groups in one molecule include ethylene glycol, propylene glycol, butylene glycol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 1,10-decanediol, 1,11-undecanediol, 1,12-dodecanediol, glycerin, trimethylolpropane, pentaerythritol, dipentaerythritol, 1,4-cyclohexanediol, and 1,3-cyclohexanediol.

[0051] Among these, the crosslinking agent (C) may be a reaction product (isocyanate group-containing oligomer) of a polyfunctional isocyanate having two or more isocyanate groups in one molecule with a polyhydric alcohol having three or more hydroxy groups in one molecule. By using such an isocyanate group-containing oligomer as a crosslinking agent, the (second) pressure-sensitive adhesive layer forms a dense crosslinked structure, which tends to prevent the pressure-sensitive adhesive component from adhering to the die bonding film 5 (adhesive layer made of the die bonding film) during the pick-up step.

[0052] The content of the crosslinking agent (C) used when reacting the (meth)acrylic resin (A) or (meth)acrylic resin (B) with the crosslinking agent (C) can be appropriately set depending on the cohesive strength, elongation at break, adhesion to the adhesive layer, and type of UV-curable or pressure-sensitive adhesive required for the pressure-sensitive adhesive layer. When a pressure-sensitive pressure-sensitive adhesive layer is formed, the content of the crosslinking agent (C) may be, for example, 0.1 to 20 parts by mass, 1 to 15 parts by mass, or 3 to 12 parts by mass per 100 parts by mass of the total amount of the (meth)acrylic resin (A). When a UV-curable pressure-sensitive adhesive layer is formed, the content of the crosslinking agent (C) may be, for example, 0.1 to 10 parts by mass, 0.2 to 7 parts by mass, or 0.3 to 5 parts by mass. When the content of the crosslinking agent is within this range, it is possible to achieve a good balance between the properties required for the pressure-sensitive adhesive layer in the singulation process and the properties required for the pressure-sensitive adhesive layer in the die-bonding process, and also to achieve excellent pick-up properties.

[0053] Photopolymerization initiator (D) The photopolymerization initiator (D) is not particularly limited as long as it generates chain-polymerizable active species upon irradiation with ultraviolet light. Examples of the photopolymerization initiator (D) include photoradical polymerization initiators. Here, the chain-polymerizable active species refers to a species that initiates a polymerization reaction by reacting with a chain-polymerizable functional group.

[0054] Examples of photoradical polymerization initiators include benzoin ketals such as 2,2-dimethoxy-1,2-diphenylethan-1-one; α-hydroxyketones such as 1-hydroxycyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, and 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one; 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, and 1,2-methyl-1-[4-(methylthio)phenyl]-2- α-Aminoketones such as morpholinopropan-1-one; oxime esters such as 1-[4-(phenylthio)phenyl]-1,2-octadione-2-(benzoyl)oxime; phosphine oxides such as bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, and 2,4,6-trimethylbenzoyldiphenylphosphine oxide; 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, ... 2,4,5-triarylimidazole dimers such as 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, 2-(o-methoxyphenyl)-4,5-diphenylimidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer; benzophenone, N,N,N',N'-tetramethyl-4,4'-diaminobenzophenone, N,N,N',N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy- Benzophenone compounds such as 4'-dimethylaminobenzophenone; quinone compounds such as 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthraquinone, 2-methyl-1,4-naphthoquinone, and 2,3-dimethylanthraquinone;Benzoin ethers such as benzoin methyl ether, benzoin ethyl ether, and benzoin phenyl ether; benzoin compounds such as benzoin, methylbenzoin, and ethylbenzoin; benzyl compounds such as benzyl dimethyl ketal; acridine compounds such as 9-phenylacridine and 1,7-bis(9,9'-acridinylheptane); N-phenylglycine, coumarin, and the like.

[0055] The content of the photopolymerization initiator (D) may be, for example, 0.1 to 30 parts by mass, 0.3 to 10 parts by mass, or 0.5 to 5 parts by mass, relative to 100 parts by mass of the total amount of the (meth)acrylic resin (B). When the content of the photopolymerization initiator (D) is 0.1 part by mass or more relative to 100 parts by mass of the total amount of the (meth)acrylic resin (B), the pressure-sensitive adhesive layer tends to be sufficiently cured after ultraviolet irradiation and pickup defects tend to be less likely to occur, and when the content is 30 parts by mass or less, contamination of the die-bonding film (transfer of the photopolymerization initiator to the die-bonding film) tends to be prevented.

[0056] The pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer or the pressure-sensitive adhesive composition constituting the ultraviolet-curable adhesive layer may contain other components, such as resins other than the above-mentioned (meth)acrylic resins, tackifiers (tackifiers, etc.), and the like.

[0057] Organic solvents The organic solvent used in the first pressure-sensitive adhesive varnish and the second pressure-sensitive adhesive varnish is not particularly limited as long as it can dissolve the (meth)acrylic resin, crosslinking agent, and photopolymerization initiator and volatilizes upon heating. Specific examples of the organic solvent include aromatic hydrocarbons such as toluene, xylene, mesitylene, cumene, and p-cymene; cyclic ethers such as tetrahydrofuran and 1,4-dioxane; alcohols such as methanol, ethanol, isopropanol, butanol, ethylene glycol, and propylene glycol; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, and 4-hydroxy-4-methyl-2-pentanone; esters such as methyl acetate, ethyl acetate, butyl acetate, methyl lactate, ethyl lactate, and γ-butyrolactone; carbonates such as ethylene carbonate and propylene carbonate; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, propylene glycol monomethyl ether, and propylene glycol monoethyl ether. Examples of suitable alkyl ethers include polyhydric alcohol alkyl ethers such as ethylene glycol monomethyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol dimethyl ether, and diethylene glycol diethyl ether; polyhydric alcohol alkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, and diethylene glycol monoethyl ether acetate; and amides such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methylpyrrolidone.

[0058] Among these, from the viewpoints of solubility and boiling point, the organic solvent may be, for example, one selected from the group consisting of toluene, methanol, ethanol, isopropanol, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methyl acetate, ethyl acetate, butyl acetate, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, N,N-dimethylacetamide, and acetylacetone. The solids concentration in the first and second pressure-sensitive adhesive varnishes may typically be 10 to 60 mass%.

[0059] The heating temperature and heating time when removing the volatile components can be set arbitrarily depending on the constituent components of the adhesive used, the type of organic solvent, etc. The heating temperature and heating time can be, for example, 70 to 110°C and 0.5 to 5 minutes.

[0060] 2 is a schematic cross-sectional view showing one embodiment of a method for producing a dicing film. Figures 2(a), (b), (c), and (d) are cross-sectional views showing each step. The method for producing a dicing film 4 includes the steps of preparing a first laminate 6 having a base layer 1 and a first pressure-sensitive adhesive layer 2 provided on the base layer 1, and a second laminate 8 having a support film 7 and a second pressure-sensitive adhesive layer 3 provided on the support film 7, performing a corona treatment on at least one of a surface 2A of the first pressure-sensitive adhesive layer 2 of the first laminate 6 opposite the base layer 1 and a surface 3A of the second pressure-sensitive adhesive layer 3 of the second laminate 8 opposite the support film 7, and laminating the first pressure-sensitive adhesive layer 2 of the first laminate 6 and the second pressure-sensitive adhesive layer 3 of the second laminate 8 together to obtain a dicing film 4.

[0061] The first laminate 6 can be obtained, for example, by preparing a first pressure-sensitive adhesive varnish containing a (meth)acrylic resin (A), a crosslinking agent (C), and an organic solvent, applying the first pressure-sensitive adhesive varnish to the base layer 1, and removing the volatile components. The first laminate 6 can also be obtained by applying such a first pressure-sensitive adhesive varnish to a support film to form a pressure-sensitive adhesive layer, and then transferring the obtained pressure-sensitive adhesive layer to the surface of the base layer 1.

[0062] The second laminate 8 can be obtained, for example, by preparing a second adhesive varnish containing a (meth)acrylic resin (B), a crosslinking agent (C), a photopolymerization initiator (D), and an organic solvent, applying the second adhesive varnish to a support film 7, and removing the volatile components.

[0063] Next, corona treatment is applied to at least one of the surface 2A of the first pressure-sensitive adhesive layer 2 in the first laminate 6 opposite the base layer 1, and the surface 3A of the second pressure-sensitive adhesive layer 3 in the second laminate 8 opposite the support film 7 (see FIGS. 2(a) and 2(b)). Corona treatment is preferably applied to surface 2A. In other words, corona treatment may or may not be applied to surface 3A as long as it is applied to surface 2A. For ease of implementation, corona treatment may be applied only to surface 2A.

[0064] The corona treatment can be carried out using a corona discharge device (e.g., a Corona Station manufactured by Kasuga Electric Co., Ltd.) and a known method known as a surface modification method using corona discharge. The corona treatment conditions (treatment speed, treatment voltage, etc.) can be set as desired according to the properties of the adhesive used. The corona treatment is preferably carried out so that the wetting tension of the surface (surface 2A or surface 3A) immediately after the corona treatment is 50 to 80 mN / m, preferably 60 mN / m or more.

[0065] Subsequently, the first laminate 6 and the second laminate 8 are bonded together so that the surface 2A of the first pressure-sensitive adhesive layer 2 and the surface 3A of the second pressure-sensitive adhesive layer 3 are in contact with each other, thereby obtaining a dicing film 4. The bonding conditions can be set arbitrarily, but can be, for example, 20 to 70° C. The first pressure-sensitive adhesive layer 2 of the first laminate 6 and the second pressure-sensitive adhesive layer 3 of the second laminate 8 can be bonded together by, for example, roll compression.

[0066] <Die bonding film> Known adhesive compositions constituting die bonding films can be applied to the die bonding film 5. Specifically, the adhesive composition constituting the die bonding film 5 may contain an epoxy resin, an epoxy resin curing agent, and a reactive group-containing (meth)acrylic copolymer. The adhesive composition constituting the die bonding film 5 may further contain a curing accelerator, a silane coupling agent, a filler, and the like. A die bonding film 5 containing these components tends to have characteristics such as excellent adhesion between a semiconductor chip and a support substrate and between semiconductor chips, ability to embed electrodes, ability to embed wires, and the like, and can be bonded at low temperatures in the die bonding process, excellent curing can be achieved in a short time, and excellent reliability after molding with a sealant.

[0067] Examples of epoxy resins include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, alicyclic epoxy resins, linear aliphatic epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, bisphenol A novolac epoxy resins, diglycidyl ethers of biphenols, diglycidyl ethers of naphthalenediols, diglycidyl ethers of phenols, diglycidyl ethers of alcohols, and alkyl-substituted, halide, and hydrogenated versions of these bifunctional epoxy resins and novolac epoxy resins. Other commonly known epoxy resins, such as multifunctional epoxy resins and heterocycle-containing epoxy resins, may also be used. Components other than the epoxy resin may be included as impurities as long as they do not impair the properties.

[0068] Examples of epoxy resin curing agents include phenolic resins that can be obtained by reacting a phenolic compound with a xylylene compound, which is a divalent linking group, in the absence or presence of an acid catalyst. Examples of phenolic compounds used in the production of phenolic resins include phenol, o-cresol, m-cresol, p-cresol, o-ethylphenol, p-ethylphenol, on-propylphenol, m-n-propylphenol, pn-propylphenol, o-isopropylphenol, m-isopropylphenol, p-isopropylphenol, on-butylphenol, m-n-butylphenol, pn-butylphenol, o-isobutylphenol, m-isobutylphenol, p-isobutylphenol, octylphenol, nonylphenol, 2,4-xylenol, 2,6 Examples of xylylene compounds that can be used as divalent linking groups in the production of phenolic resins include o-xylenol, 3,5-xylenol, 2,4,6-trimethylphenol, resorcinol, catechol, hydroquinone, 4-methoxyphenol, o-phenylphenol, m-phenylphenol, p-phenylphenol, p-cyclohexylphenol, o-allylphenol, p-allylphenol, o-benzylphenol, p-benzylphenol, o-chlorophenol, p-chlorophenol, o-bromophenol, p-bromophenol, o-iodophenol, p-iodophenol, o-fluorophenol, m-fluorophenol, and p-fluorophenol. Examples of xylylene compounds that serve as divalent linking groups in the production of phenolic resins include the following xylylene dihalides, xylylene diglycols, and derivatives thereof.That is, specific examples of xylylene compounds include α,α'-dichloro-p-xylene, α,α'-dichloro-m-xylene, α,α'-dichloro-o-xylene, α,α'-dibromo-p-xylene, α,α'-dibromo-m-xylene, α,α'-dibromo-o-xylene, α,α'-diiodo-p-xylene, α,α'-diiodo-m-xylene, and α,α'-diiodo- -o-xylene, α,α'-dihydroxy-p-xylene, α,α'-dihydroxy-m-xylene, α,α'-dihydroxy-o-xylene, α,α'-dimethoxy-p-xylene, α,α'-dimethoxy-m-xylene, α,α'-dimethoxy-o-xylene, α,α'-diethoxy-p-xylene, α,α'-diethoxy-m-xylene, α,α'-diethoxy-o- Xylene, α,α'-di-n-propoxy-p-xylene, α,α'-di-n-propoxy-m-xylene, α,α'-di-n-propoxy-o-xylene, α,α'-diisopropoxy-p-xylene, α,α'-diisopropoxy-m-xylene, α,α'-diisopropoxy-o-xylene, α,α'-di-n-butoxy-p-xylene, α,α'-di-n-butoxy Examples include α,α'-di-n-butoxy-o-xylene, α,α'-diisobutoxy-p-xylene, α,α'-diisobutoxy-m-xylene, α,α'-diisobutoxy-o-xylene, α,α'-di-tert-butoxy-p-xylene, α,α'-di-tert-butoxy-m-xylene, and α,α'-di-tert-butoxy-o-xylene.

[0069] The reaction of a phenolic compound with a xylylene compound can be carried out using an acidic catalyst such as mineral acids (e.g., hydrochloric acid, sulfuric acid, phosphoric acid, polyphosphoric acid); organic carboxylic acids (e.g., dimethyl sulfate, diethyl sulfate, p-toluenesulfonic acid, methanesulfonic acid, ethanesulfonic acid); superacids (e.g., trifluoromethanesulfonic acid); strong acid ion exchange resins (e.g., alkane sulfonic acid ion exchange resins); superstrong acid ion exchange resins (e.g., perfluoroalkane sulfonic acid ion exchange resins (trade name: Nafion, manufactured by DuPont; "Nafion" is a registered trademark); natural and synthetic zeolites; or activated clay (acid clay). The reaction is carried out at 50 to 250°C until the raw material xylylene compound is substantially consumed and the reaction composition remains constant, thereby obtaining a phenolic resin. The reaction time can be appropriately set depending on the raw materials and reaction temperature, and can be, for example, about 1 to 15 hours. The reaction time can be determined by monitoring the reaction composition using gel permeation chromatography (GPC) or other methods.

[0070] The reactive group-containing (meth)acrylic copolymer may be, for example, an epoxy group-containing (meth)acrylic copolymer. The epoxy group-containing (meth)acrylic copolymer may be a copolymer obtained by using glycidyl (meth)acrylate as a raw material in an amount of 0.5 to 6% by mass relative to the resulting copolymer. When the glycidyl (meth)acrylate content is 0.5% by mass or more, high adhesive strength is easily obtained, while when it is 6% by mass or less, gelation tends to be suppressed. The monomer constituting the remainder of the reactive group-containing (meth)acrylic copolymer may be, for example, an alkyl (meth)acrylate having an alkyl group having 1 to 8 carbon atoms, such as methyl (meth)acrylate, styrene, acrylonitrile, etc. Among these, the monomer constituting the remainder of the reactive group-containing (meth)acrylic copolymer may be ethyl (meth)acrylate and / or butyl (meth)acrylate. The mixing ratio can be adjusted taking into account the Tg of the reactive group-containing (meth)acrylic copolymer. When the Tg is -10°C or higher, the tackiness of the die bonding film 5 in the B-stage state tends to be prevented from becoming too great, and the handleability tends to be excellent. The glass transition point (Tg) of the epoxy group-containing (meth)acrylic copolymer may be, for example, 30°C or lower. The polymerization method is not particularly limited, and examples thereof include pearl polymerization and solution polymerization. An example of a commercially available epoxy group-containing (meth)acrylic copolymer is HTR-860P-3 (trade name, manufactured by Nagase ChemteX Corporation).

[0071] From the viewpoint of adhesiveness and heat resistance, the weight-average molecular weight of the epoxy group-containing (meth)acrylic copolymer may be 100,000 or more, or may be 300,000 to 3,000,000, or 500,000 to 2,000,000. When the weight-average molecular weight is 3,000,000 or less, it is possible to prevent a decrease in the packing between the chip and the substrate supporting it. The weight-average molecular weight is a polystyrene-equivalent value obtained by gel permeation chromatography (GPC) using a calibration curve based on standard polystyrene.

[0072] Examples of the curing accelerator include tertiary amines, imidazoles, quaternary ammonium salts, etc. Specific examples of the curing accelerator include 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-phenylimidazolium trimellitate.

[0073] The filler may be an inorganic filler. Specific examples of the inorganic filler include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whisker, boron nitride, crystalline silica, and amorphous silica.

[0074] Examples of the silane coupling agent include silane coupling agents having an organic functional group such as a (meth)acryloyl group, a mercapto group, an amino group, an imidazole group, or an epoxy group.

[0075] The thickness of the die bonding film 5 may be, for example, 1 to 300 μm, 5 to 150 μm, or 10 to 100 μm. When the thickness of the die bonding film 5 is 1 μm or more, the adhesiveness tends to be better, while when it is 300 μm or less, the pickup property tends to be better.

[0076] The die bonding film 5 may be in an embodiment that does not contain a thermosetting resin (epoxy resin and epoxy resin curing agent). For example, when the die bonding film 5 contains a reactive group-containing (meth)acrylic copolymer, the die bonding film 5 may contain the reactive group-containing (meth)acrylic copolymer, a curing accelerator, and a filler.

[0077] [Manufacturing method for integrated dicing and die bonding film] The method for producing a dicing and die bonding integrated film includes the steps of preparing a first laminate 6 having a base layer 1 and a first pressure-sensitive adhesive layer 2 provided on the base layer 1, and a second laminate 8 having a support film 7 and a second pressure-sensitive adhesive layer 3 provided on the support film 7, performing a corona treatment on at least one of surface 2A of the first pressure-sensitive adhesive layer 2 in the first laminate 6 opposite to the base layer 1 and surface 3A of the second pressure-sensitive adhesive layer 3 in the second laminate 8 opposite to the support film 7, bonding the first pressure-sensitive adhesive layer 2 of the first laminate 6 to the second pressure-sensitive adhesive layer 3 of the second laminate 8 to obtain a dicing film 4, and arranging a die bonding film 5 on the second pressure-sensitive adhesive layer 3 of the obtained dicing film 4 to obtain a dicing and die bonding integrated film 10. The steps up to the step of obtaining the dicing film 4 are as described above, so repeated explanations will be omitted here.

[0078] Methods for placing the die bonding film 5 on the second adhesive layer 3 of the dicing film 4 include, for example, a method in which a varnish of the adhesive composition that constitutes the die bonding film 5 (varnish for forming an adhesive layer) is prepared and applied to the surface of the second adhesive layer 3, and a method in which the varnish of the adhesive composition is applied to a carrier film, the volatile components are removed to produce the die bonding film 5, and then the obtained die bonding film 5 is transferred onto the surface 3A of the second adhesive layer 3.

[0079] The varnish for forming the adhesive layer may be an organic solvent that can dissolve each component other than the filler and that volatilizes when heated. Specific examples of the organic solvent include the same organic solvents as those used in the first and second pressure-sensitive adhesive varnishes.

[0080] Examples of the carrier film include plastic films such as polytetrafluoroethylene film, polyethylene terephthalate film, polyethylene film, polypropylene film, polymethylpentene film, and polyimide film. Furthermore, the carrier film may be subjected to surface treatment such as primer coating, UV treatment, corona discharge treatment, polishing treatment, and etching treatment, as needed. The thickness of the carrier film may be, for example, 10 to 150 μm or 20 to 130 μm.

[0081] [Method of manufacturing a semiconductor device] 3A, 3B, 3C, 3D, 3E, and 3F are schematic cross-sectional views showing one embodiment of a method for manufacturing a semiconductor device, in which (a), (b), (c), (d), (e), and (f) are cross-sectional views showing each step. The method for manufacturing a semiconductor device includes a step of attaching the die bonding film 5 (adhesive layer) of the above-mentioned dicing-die bonding integrated film 10 to a semiconductor wafer W (wafer lamination step, see Figures 3(a) and (b)), a step of singulating the semiconductor wafer W and the die bonding film 5 (singulation step, see Figure 3(c)), and, if necessary, if the second adhesive layer 3 is an ultraviolet-curing adhesive layer, a step of irradiating the second adhesive layer 3 with ultraviolet light via the base layer 1 and the first adhesive layer 2 (ultraviolet irradiation step, see Figure 3(d)), a step of picking up the semiconductor chip 20 with the die bonding film piece from the second adhesive layer 3 of the dicing film 4 (pickup step, see Figure 3(e)), and a step of adhering the semiconductor chip 20 with the die bonding film piece to a support substrate 40 via the die bonding film piece 5a (die bonding step, see Figure 3(f)).

[0082] <Wafer lamination process> First, the dicing and die bonding integrated film 10 is placed in a predetermined device. Next, the surface 5A of the die bonding film 5 (adhesive layer) of the dicing and die bonding integrated film 10 is attached to the surface Ws of the semiconductor wafer W (see FIGS. 3(a) and 3(b)). The circuit surface of the semiconductor wafer W is preferably provided on the surface opposite to the surface Ws.

[0083] <Singulation process> Next, the semiconductor wafer W and the die bonding film 5 (adhesive layer) are singulated (see FIG. 3(c)). Examples of singulation methods include blade dicing and stealth dicing. When the singulation method is blade dicing, a portion of the first pressure-sensitive adhesive layer 2 and the second pressure-sensitive adhesive layer 3, or the entire first pressure-sensitive adhesive layer 2 and the second pressure-sensitive adhesive layer 3 and a portion of the base layer 1 may be diced with a blade. In this way, the dicing-die bonding integrated film 10 also functions as a dicing film. When the singulation method is stealth dicing, for example, separation lines may be formed on the semiconductor wafer W before the wafer lamination step, and the base layer 1 may be cooled and expanded and then heat-shrunk after the wafer lamination step, thereby singulating the semiconductor wafer W and the die bonding film 5 (adhesive layer).

[0084] <Ultraviolet irradiation process> When the second pressure-sensitive adhesive layer 3 is an ultraviolet-curable pressure-sensitive adhesive layer, the second pressure-sensitive adhesive layer 3 may be irradiated with ultraviolet light via the base layer 1 and the first pressure-sensitive adhesive layer 2, as necessary (see FIG. 3(d)). When the second pressure-sensitive adhesive layer is an ultraviolet-curable pressure-sensitive adhesive layer, the second pressure-sensitive adhesive layer 3 is cured, reducing its adhesiveness and the adhesive strength between the second pressure-sensitive adhesive layer 3 and the die-bonding film 5 (adhesive layer). For ultraviolet irradiation, it is preferable to use ultraviolet light with a wavelength of 200 to 400 nm. The ultraviolet irradiation conditions are an illuminance and an irradiation amount of 30 to 240 mW / cm, respectively. 2 and 50-500mJ / cm 2 It is preferable to adjust the temperature to within the range of

[0085] <Pickup process> Next, while expanding the base layer 1, the diced semiconductor chips 20 with die bonding film pieces are separated from each other, and the semiconductor chips 20 with die bonding film pieces pushed up from the base layer 1 side by the needles 32 are sucked with a suction collet 34 and picked up from the second adhesive layer 3a (see FIG. 3(e)). The semiconductor chips 20 with die bonding film pieces have semiconductor chips Wa and die bonding film pieces 5a. The semiconductor chips Wa are obtained by dicing the semiconductor wafer W, and the die bonding film pieces 5a are obtained by dicing the die bonding film 5. The first adhesive layer 2a is obtained by dicing the first adhesive layer 2, and the second adhesive layer 3a is obtained by dicing the second adhesive layer 3. The first adhesive layer 2a and the second adhesive layer 3a may remain on the base layer 1 when the semiconductor chips 20 with die bonding film pieces are picked up. In the pick-up step, it is not always necessary to expand the base material layer 1, but expanding the base material layer 1 can further improve the pick-up properties.

[0086] The amount of push-up by the needle 32 can be set as appropriate. Furthermore, from the viewpoint of ensuring sufficient pick-up capability even for ultra-thin wafers, for example, two- or three-stage push-up may be performed. Furthermore, the semiconductor chip 20 with the die bonding film piece attached may be picked up by a method other than the method using the suction collet 34.

[0087] <Die bonding process> After picking up the semiconductor chip 20 with the die bonding film piece, the semiconductor chip 20 with the die bonding film piece is bonded to the support substrate 40 via the die bonding film piece 5a by thermocompression bonding (see FIG. 3(f)). A plurality of semiconductor chips 20 with die bonding film pieces may be bonded to the support substrate 40.

[0088] The method for manufacturing a semiconductor device may further include, as necessary, a step of hardening the die bonding film piece 5a in the semiconductor chip 20 with the die bonding film piece on the support substrate 40, a step of electrically connecting the semiconductor chip Wa and the support substrate 40 by wire bonding, and a step of resin-sealing the semiconductor chip Wa on the surface 40A of the support substrate 40 using a resin sealing material.

[0089] FIG. 4 is a schematic cross-sectional view showing one embodiment of a semiconductor device. The semiconductor device 100 shown in FIG. 4 can be manufactured through the above-described steps. The semiconductor device 100 includes a support substrate 40, a semiconductor chip Wa disposed on the support substrate 40, and a cured product 5ac of a die-bonding film piece provided between the support substrate 40 and the semiconductor chip Wa. In the semiconductor device 100, the semiconductor chip Wa and the support substrate 40 may be electrically connected by wire bonds 30. In the semiconductor device 100, the semiconductor chip Wa may be resin-encapsulated on the surface 40A of the support substrate 40 using a resin encapsulant 52. Solder balls 54 may be formed on the surface of the support substrate 40 opposite the surface 80A for electrical connection to an external substrate (motherboard). [Example]

[0090] The present disclosure will be specifically described below based on examples, but the present disclosure is not limited to these examples.

[0091] [Synthesis of (meth)acrylic resin (A)] (Production Example 1: Synthesis of (meth)acrylic resin (A-1)) The following components were placed in a flask equipped with a three-one motor, a stirring blade, and a nitrogen inlet tube. Ethyl acetate (solvent): 635 parts by weight 2-Ethylhexyl acrylate: 425 parts by mass 2-Hydroxyethyl methacrylate: 65 parts by mass Methacrylic acid: 10 parts by mass

[0092] Azobisisobutyronitrile was added as a polymerization initiator, and the contents were stirred to be sufficiently uniform, and then the temperature was raised to 78°C to polymerize, thereby obtaining a solution containing a (meth)acrylic resin (A-1).

[0093] The theoretical glass transition temperature of the (meth)acrylic resin (A-1) was −38° C. Furthermore, GPC measurement was performed using SD-8022 / DP-8020 / RI-8020 manufactured by Tosoh Corporation, Gelpack GL-A150-S / GL-A160-S manufactured by Hitachi Chemical Co., Ltd. as columns, and tetrahydrofuran as an eluent. As a result, the polystyrene-equivalent weight average molecular weight of the (meth)acrylic resin (A-1) was 400,000.

[0094] [Synthesis of (meth)acrylic resin (B)] (Production Example 2: Synthesis of (meth)acrylic resin (B-1)) The following components were placed in a flask equipped with a three-one motor, a stirring blade, and a nitrogen inlet tube. Ethyl acetate (solvent): 635 parts by weight 2-Ethylhexyl acrylate: 395 parts by mass 2-Hydroxyethyl acrylate: 100 parts by mass Methacrylic acid: 5 parts by mass

[0095] Azobisisobutyronitrile was added as a polymerization initiator, and the contents were stirred to be sufficiently uniform, and then the temperature was raised to 78° C. to polymerize, thereby obtaining a solution containing a (meth)acrylic copolymer.

[0096] Ethyl acetate was then added and the mixture was stirred to dilute the contents, and dioctyltin dilaurate was added as a urethanization catalyst, followed by the addition of 105.3 parts by mass of 2-methacryloyloxyethyl isocyanate (Karends MOI (trade name), manufactured by Showa Denko K.K.) and the mixture was allowed to react at 70°C to obtain a solution containing a (meth)acrylic resin (B-1) having a chain-polymerizable functional group.

[0097] The theoretical glass transition temperature of the (meth)acrylic copolymer was −60° C. GPC measurement was performed using SD-8022 / DP-8020 / RI-8020 manufactured by Tosoh Corporation, Gelpack GL-A150-S / GL-A160-S manufactured by Hitachi Chemical Co., Ltd. as columns, and tetrahydrofuran as an eluent. The polystyrene-equivalent weight average molecular weight of the (meth)acrylic copolymer was 300,000.

[0098] [Production of integrated dicing and die bonding film] Example 1 <Creating dicing film> (1) Preparation of the first laminate A first pressure-sensitive adhesive varnish was prepared by mixing the following components: The amounts of toluene and methyl ethyl ketone as organic solvents were adjusted so that the total solid content of the varnish was 25% by mass. (Meth)acrylic resin (A) (A-1) Solution containing (meth)acrylic resin: 100 parts by mass (solid content) Crosslinking agent (C) (C-1) Polyfunctional isocyanate (trade name: Toronate HDT, manufactured by Vencorex, solid content: 75% by mass): 5 parts by mass (solid content) Organic solvents Toluene (80% by mass) and methyl ethyl ketone (20% by mass)

[0099] A first adhesive varnish was applied to a polyethylene terephthalate film (thickness: 25 μm) with one surface subjected to a release treatment as a support film at a speed of 3 m / min, and then the volatile components were removed at 80°C. A coating machine equipped with a 3 m drying oven was used to remove the volatile components. This produced a laminate having a support film and a 10 μm-thick first adhesive layer provided on the support film. The first adhesive layer was a pressure-sensitive adhesive layer.

[0100] A polyolefin film (width: 600 mm, thickness: 90 μm) with one side subjected to corona treatment was prepared as the base layer. The corona-treated side of the polyolefin film was bonded to the first pressure-sensitive adhesive layer of the laminate at room temperature (25°C), and the first pressure-sensitive adhesive layer was transferred onto the base layer. The laminate was then aged at room temperature (25°C) for 14 days to obtain a first laminate having a base layer and a first pressure-sensitive adhesive layer provided on the base layer. The first laminate had a support film on the side of the first pressure-sensitive adhesive layer opposite the base layer.

[0101] (2) Corona treatment Corona treatment was carried out using a corona treatment device (KG0602W-65, manufactured by Kasuga Electric Co., Ltd.). The support film of the first laminate was peeled off, and the surface of the first pressure-sensitive adhesive layer was subjected to corona treatment. The treatment speed was 25 m / min, and the treatment voltage was 2 kW, and the wetting tension of the surface immediately after the corona treatment was adjusted to 60 mN / m or more.

[0102] (3) Preparation of the second laminate and the dicing film A second adhesive varnish was prepared by mixing the following components: The amount of ethyl acetate as an organic solvent was adjusted so that the total solid content of the varnish was 25% by mass. (Meth)acrylic resin (B) (B-1) Solution containing (meth)acrylic resin (B-1): 100 parts by mass (solid content) Crosslinking agent (C) (C-2) Polyfunctional isocyanate (product name: Coronate L, manufactured by Nippon Polyurethane Industry Co., Ltd., solid content: 75% by mass): 2.0 parts by mass (solid content) Photopolymerization initiator (D) (D-1) 1-hydroxycyclohexyl phenyl ketone (trade name: Omnirad 184 ("Omnirad" is a registered trademark), manufactured by IGM RESINS BV): 2.0 parts by mass (D-2) Phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide (trade name: Omnirad 819 ("Omnirad" is a registered trademark), manufactured by IGM RESINS BV): 0.4 parts by mass Organic solvents Ethyl acetate

[0103] In the same manner as in the preparation of the first laminate, the second adhesive varnish was applied to a release-treated polyethylene terephthalate film serving as a support film to obtain a second laminate having a support film and a 10 μm-thick second adhesive layer disposed on the support film. The second adhesive layer was an ultraviolet-curable adhesive layer. Next, the corona-treated surface of the first adhesive layer in the first laminate was bonded to the second adhesive layer in the second laminate. After that, the resulting product was aged at room temperature (25°C) for four days to obtain a dicing film having a base layer, a first adhesive layer, and a second adhesive layer in this order. The dicing film had a support film on the side of the second adhesive layer opposite the first adhesive layer.

[0104] <Production of die bonding film> A varnish for forming an adhesive layer was prepared by mixing the following components: First, cyclohexanone (solvent) was added to a mixture containing the following components and the mixture was stirred and mixed, and then the mixture was further kneaded for 90 minutes using a bead mill. Epoxy resin (cresol novolac epoxy resin, product name: N-500P-10, manufactured by DIC Corporation, epoxy equivalent: 200, softening point: 85°C): 11.0 parts by mass Epoxy resin (bisphenol F type epoxy resin, product name: EXA-830CRP, manufactured by DIC Corporation, epoxy equivalent: 160, molecular weight: 1800, softening point: 85°C): 13.0 parts by mass Phenolic resin (product name: Milex XLC-LL, manufactured by Mitsui Chemicals, Inc., hydroxyl equivalent: 175, water absorption: 1.8%, weight loss at 350°C: 4%): 19.0 parts by mass Silane coupling agent (γ-mercaptopropyltrimethoxysilane, product name: NUC A-189, manufactured by ENEOS NUC Corporation): 0.1 parts by mass Silane coupling agent (γ-ureidopropyltriethoxysilane, product name: NUC A-1160, manufactured by ENEOS NUC Corporation): 0.2 parts by mass Filler (silica, product name: SC2050-HLG, manufactured by Admatechs Co., Ltd., average particle size: 0.500 μm): 39 parts by mass

[0105] The following components were further added to the mixture obtained above, and the mixture was then subjected to stirring, mixing and vacuum deaeration to obtain a varnish for forming an adhesive layer. Epoxy group-containing acrylic copolymer (product name: HTR-860P-3, manufactured by Nagase ChemteX Corporation, weight-average molecular weight: 800,000): 18 parts by mass Curing accelerator (1-cyanoethyl-2-phenylimidazole, trade name: Curesol 2PZ-CN ("Curesol" is a registered trademark), manufactured by Shikoku Chemicals Corporation): 0.1 parts by mass

[0106] A polyethylene terephthalate film (thickness: 35 μm) with a release treatment on one side was prepared as a carrier film. An applicator was used to apply a varnish for forming an adhesive layer to the release-treated surface, which was then heated and dried at 140°C for 5 minutes. This resulted in a laminate having a carrier film and a 50 μm-thick die-bonding film in a B-stage state provided on the carrier film.

[0107] <Production of integrated dicing and die bonding film> The laminate with the die bonding film was cut into a circle with a diameter of 335 mm together with the carrier film. The second adhesive layer of the dicing film from which the support film had been peeled was attached to the cut die bonding film at room temperature (25°C), and then left at room temperature (25°C) for one day. The dicing film was then cut into a circle with a diameter of 370 mm. In this way, multiple dicing and die bonding integrated films of Example 1 were obtained for use in the evaluation tests described below.

[0108] Example 2 The dicing and die bonding integrated film of Example 2 was obtained in the same manner as Example 1, except that the amount of crosslinking agent (C-1) in (1) Preparation of the first laminate in <Preparation of dicing film> was changed from 5 parts by mass to 10 parts by mass.

[0109] Example 3 The dicing and die bonding integrated film of Example 3 was obtained in the same manner as Example 1, except that the amount of crosslinking agent (C-1) in (1) Preparation of the first laminate in <Preparation of dicing film> was changed from 5 parts by mass to 15 parts by mass.

[0110] (Comparative Example 1) A dicing and die bonding integrated film of Comparative Example 1 was obtained in the same manner as in Example 1, except that (2) corona treatment in <Preparation of dicing film> was not performed.

[0111] [Evaluation test] (1) Measurement of adhesive strength of adhesive layer to die bonding film before UV irradiation (30° peel strength before UV) Using the dicing-die bonding integrated films of Examples 1 to 3 and Comparative Example 1, the adhesive strength of the pressure-sensitive adhesive layer to the die bonding film before UV irradiation (adhesion strength at the interface between the die bonding film and the second pressure-sensitive adhesive layer before UV irradiation) was evaluated by measuring the 30° peel strength. Measurement samples were obtained by cutting the dicing-die bonding integrated film into a width of 25 mm and a length of 180 mm. The 30° peel strength before UV irradiation was measured using a tensile tester (Kyowa Interface Science Co., Ltd., "VPA-2"). The measurement conditions were a peel angle of 30° and a tensile speed of 600 mm / min. The sample storage and peel strength measurements were performed in an environment of 23°C and 60% relative humidity. The results are shown in Table 1.

[0112] (2) Measurement of adhesive strength of adhesive layer after UV irradiation to die bonding film (30° peel strength after UV) Using the dicing-die bonding integrated films of Examples 1 to 3 and Comparative Example 1, the adhesive strength of the pressure-sensitive adhesive layer after UV irradiation to the die bonding film (adhesion strength at the interface between the die bonding film and the second pressure-sensitive adhesive layer after UV irradiation) was evaluated by measuring the 30° peel strength. Measurement samples were prepared by cutting the dicing-die bonding integrated films to a width of 25 mm and a length of 180 mm, and applying an ultraviolet irradiation device (GS Yuasa Corporation, Conveyor UV Irradiation Device CS60) to these films at an illuminance of 70 mW / cm. 2 and irradiation dose 150 mJ / cm 2 The film was obtained by irradiating the film with ultraviolet light (dominant wavelength: 365 nm). The 30° peel strength after UV irradiation was measured using a tensile tester ("VPA-2" manufactured by Kyowa Interface Science Co., Ltd.). The measurement conditions were a peel angle of 30° and a tensile speed of 600 mm / min. The sample was stored and the peel strength was measured in an environment with a temperature of 23°C and a relative humidity of 60%. The results are shown in Table 1.

[0113] (3) Pick-up evaluation A 12-inch semiconductor wafer and a dicing / die bonding integrated film were prepared. Stealth dicing was performed on the 12-inch semiconductor wafer to form separation lines on the semiconductor wafer in 7 mm x 5 mm rectangles. The semiconductor wafer was then back-grinded to adjust its thickness to 30 μm. In the wafer lamination process, the wafer was attached to the adhesive layer of each of the dicing / die bonding integrated films prepared above at 70°C. The subsequent singulation process involved cooling expansion and subsequent heat shrinking using a die separator (Disco Corporation, model number DDS-2300) under the following conditions. The die separator's built-in cleaning mechanism then performed cleaning and drying under the following conditions.

[0114] (Cooling and expanding conditions) Cooling temperature: -15°C, Cooling time: 80 seconds, Expansion amount: 11 mm, Expansion speed: 300 mm / s (Heat shrink conditions) Heater temperature: 220℃, heater rotation speed: 7° / sec (Washing conditions) Washing time: 120 seconds, Rotation speed: 600 rpm (Drying conditions) Drying time: 60 seconds, Rotation speed: 1500 rpm

[0115] In the ultraviolet irradiation process, the illuminance is 70mW / cm 2 and irradiation dose 150 mJ / cm 2 In the pick-up step, 20 semiconductor chips with die bonding film pieces attached were picked up under the following conditions:

[0116] (Pickup conditions) Die bonder: DB800-HSD (Hitachi High-Technologies Corporation) Ejector pin: EJECTOR NEEDLE SEN2-83-05 (diameter: 0.7 mm, tip shape: hemispherical with a radius of 350 μm, manufactured by Micromechanics) Push-up height: 200μm Thrust speed: 1mm / min

[0117] The dicing-die bonding integrated film after the pickup evaluation was observed to check for the occurrence of peeling (at the interface) between the first and second pressure-sensitive adhesive layers. The results are shown in Table 1. Note that in the dicing-die bonding integrated film of Comparative Example 1, peeling between the first and second pressure-sensitive adhesive layers was observed when measuring the adhesive strength of the pressure-sensitive adhesive layer on the die-bonding film before UV irradiation, so the pickup evaluation was not performed.

[0118] [Table 1]

[0119] As shown in Table 1, in the dicing-die bonding integrated films of Examples 1 to 3, in which the first pressure-sensitive adhesive layer was subjected to a corona treatment, no peeling was observed between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer when measuring the adhesive strength of the pressure-sensitive adhesive layer to the die bonding film before UV irradiation (pre-UV 30° peel strength), and no peeling was observed between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer when evaluating the pickup. On the other hand, in the dicing-die bonding integrated film of Comparative Example 1, in which the first pressure-sensitive adhesive layer was not subjected to a corona treatment, peeling was observed between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer when measuring the adhesive strength of the pressure-sensitive adhesive layer to the die bonding film before UV irradiation (pre-UV 30° peel strength). These results confirm that the dicing-die bonding integrated film of the present disclosure has improved adhesion between the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer, making it possible to suppress defects during the pickup process. [Explanation of symbols]

[0120] 1...base material layer, 2...first adhesive layer, 3...second adhesive layer, 4...dicing film, 5...die bonding film, 5a...die bonding film piece, 6...first laminate, 7...support film, 8...second laminate, 10...dicing and die bonding integrated film, 20...semiconductor chip with die bonding film piece, 40...support substrate, 100...semiconductor device, W...semiconductor wafer, Wa...semiconductor chip.

Claims

1. a dicing film having a base layer, a first pressure-sensitive adhesive layer, and a second pressure-sensitive adhesive layer in this order; a die bonding film disposed on the second adhesive layer of the dicing film; Equipped with at least one of a surface of the first pressure-sensitive adhesive layer facing the second pressure-sensitive adhesive layer and a surface of the second pressure-sensitive adhesive layer facing the first pressure-sensitive adhesive layer is subjected to a corona treatment; Integrated dicing and die bonding film.

2. a surface of the first pressure-sensitive adhesive layer facing the second pressure-sensitive adhesive layer being subjected to a corona treatment; The dicing and die bonding integrated film according to claim 1 .

3. The second pressure-sensitive adhesive layer is an ultraviolet-curable pressure-sensitive adhesive layer.

3. The dicing and die bonding integrated film according to claim 1 or 2.

4. A method for producing the dicing and die bonding integrated film according to any one of claims 1 to 3, preparing a first laminate having the base layer and the first pressure-sensitive adhesive layer provided on the base layer, and a second laminate having a support film and the second pressure-sensitive adhesive layer provided on the support film; a step of subjecting at least one of a surface of the first pressure-sensitive adhesive layer in the first laminate opposite to the base layer and a surface of the second pressure-sensitive adhesive layer in the second laminate opposite to the support film to a corona treatment; a step of obtaining a dicing film by bonding the first pressure-sensitive adhesive layer of the first laminate and the second pressure-sensitive adhesive layer of the second laminate; a step of obtaining a dicing / die bonding integrated film by disposing the die bonding film on the second pressure-sensitive adhesive layer of the obtained dicing film; Equipped with A manufacturing method for integrated dicing and die bonding film.

5. A step of attaching the die bonding film of the dicing and die bonding integrated film according to any one of claims 1 to 3 to a semiconductor wafer; singulating the semiconductor wafer and the die bonding film; picking up the semiconductor chip with the die bonding film piece from the second adhesive layer of the dicing film; a step of adhering the semiconductor chip with the die bonding film piece to a support substrate via the die bonding film piece; Equipped with A method for manufacturing a semiconductor device.

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