Sensor device and method for manufacturing the sensor device

Abstract

To provide a sensor device capable of properly detecting a state of a measurement object, and a manufacturing method of the sensor device.SOLUTION: A state monitoring sensor 1 comprises an elastic part 20, and a sensor part 10. The elastic part 20 can be elastically deformed and generates or absorbs heat using elastic deformation. The sensor part 10 comprises a sensor body 11 including a sensor element capable of detecting heat flow generated by deformation of the elastic part, and a wiring part 13 connected to the sensor body 11 with the wiring connection part 14. The sensor body 11 and the wiring connection part 14 are directly sealed by the elastic part 20. One end side of the wiring part 13 is taken out from the elastic part 20. When a direction in which held between the measurement objects in measurement is defined as a thickness direction, in the elastic part 20, a projection 21 that protrudes in the thickness direction is formed within a projection area to the thickness direction of an element region DA which is a region where the sensor element is provided.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a sensor device and a method for manufacturing a sensor device. [Background technology]

[0002] Conventionally, there are known position detection devices capable of detecting a change in the position of a member relative to a reference. For example, in Patent Document 1, a change in the position of a detection object relative to a base is detected by detecting a change in heat flux due to heat generation or absorption by an elastic member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-124878 Summary of the Invention [Problem to be solved by the invention]

[0004] In position detection devices that use heat flux changes, resins with large thermoelastic coefficients are often used as the elastic body, and the elastic body and heat flow sensor are attached using adhesive materials such as double-sided tape or glue. When the elastic body and heat flow sensor are attached using adhesive materials, the adhesive materials impede the flow of heat, reducing responsiveness. In addition, because the adhesive materials are gradually compressed and their thickness changes, the sensor output does not stabilize until the change is complete.

[0005] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a sensor device that can appropriately detect the state of a measurement object, and a method for manufacturing the sensor device. [Means for solving the problem]

[0006] The sensor device of the present invention comprises an elastic portion (20, 30, 40, 50) and a sensor portion (10). The elastic portion is elastically deformable and generates or absorbs heat due to the elastic deformation. The sensor portion has a sensor body (11) having a sensor element capable of detecting heat flow generated by the elastic deformation of the elastic portion, and a wiring portion (13) connected to the sensor body by a wiring connection portion (14). The sensor body and the wiring connection portion are directly sealed by the elastic portion, and one end of the wiring portion is taken out from the elastic portion. The thickness direction is the direction in which the sensor is clamped by the measurement object (100) during measurement.

[0007] In the first mode, the elastic portion (20, 30, 50) is formed with a protrusion (21, 31, 51) that protrudes in the thickness direction within a projection area in the thickness direction of an element area, which is an area where a sensor element is provided.

[0008] In the second aspect, molding burrs extending outward are formed on both end surfaces in the thickness direction of the elastic portions (40, 50), thereby enabling the state of the measurement object to be detected appropriately.

[0009] The method for manufacturing a sensor device of the present invention includes a lower mold placement step (S1), an outer mold placement step (S10), a sensor placement step (S2 to S4), an upper mold placement step (S5), a heat pressing step (S6), and a sensor removal step (S7).

[0010] In the lower die placement process, lower die dies (86, 88) are placed in the die (85). In the outer periphery die placement process, an outer periphery die (90) formed of a material that melts during heat pressing but does not weld to the elastic portion is placed. In the sensor placement process, the sensor main body is placed on the inner periphery of the outer periphery die while being sandwiched between elastic material plates (201, 202). In the upper die placement process, upper die dies (87, 88) are placed on the upper elastic material plate (202) and the outer periphery die.

[0011] In the heat pressing process, heat pressing is performed to integrate the elastic material plate to form an elastic portion, and the sensor body and wiring connection portion are molded with the elastic portion. In the sensor removal process, the upper pressing die, lower pressing die, and outer peripheral die are removed, and the sensor device is removed. This makes it possible to manufacture a sensor device that can appropriately detect the state of the measurement object. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 1 is a plan view showing a condition monitoring sensor according to a first embodiment. [Figure 2] FIG. 2 is a view taken in the direction of the arrow II in FIG. [Figure 3] FIG. 3 is a view taken in the direction of the arrow III in FIG. [Figure 4] FIG. 2 is a plan view showing a sensor unit according to the first embodiment. [Figure 5] FIG. 5 is a view taken in the direction of the arrow V in FIG. 4. [Figure 6] 6 is a view taken in the direction of the arrow VI in FIG. 4. [Figure 7] FIG. 2 is a plan view showing a mold according to the first embodiment. [Figure 8] FIG. 8 is a cross-sectional view taken along line XIII-XIII in FIG. 7. [Figure 9] FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. [Figure 10] FIG. 1 is a plan view showing a stamping die according to a first embodiment. [Figure 11] FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. [Figure 12] FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. [Figure 13] 5 is a flowchart illustrating a method for manufacturing the condition monitoring sensor according to the first embodiment. [Figure 14] FIG. 2 is a plan view showing a state in which a lower pressing die is arranged in a die in the first embodiment. [Figure 15] FIG. 15 is a cross-sectional view taken along line XV-XV in FIG. 14. [Figure 16] 16 is a cross-sectional view taken along line XVI-XVI in FIG. 14. [Figure 17]FIG. 2 is a plan view showing a state in which an elastic material plate is arranged in a lower pressing die in the first embodiment. [Figure 18] 18 is a cross-sectional view taken along line XVIII-XVIII in FIG. 17. [Figure 19] 19 is a cross-sectional view taken along line XIX-XIX in FIG. 18. [Figure 20] FIG. 2 is a plan view showing a state in which a sensor unit is arranged in the first embodiment. [Figure 21] 21 is a cross-sectional view taken along line XXI-XXI in FIG. 20. [Figure 22] 22 is a cross-sectional view taken along line XXII-XXII in FIG. 20. [Figure 23] FIG. 2 is a plan view showing a state in which an elastic material plate is placed on a sensor unit in the first embodiment. [Figure 24] 24 is a cross-sectional view taken along line XXIV-XXIV in FIG. 23. [Figure 25] 24 is a cross-sectional view taken along line XXV-XXV of FIG. 23. [Figure 26] FIG. 2 is a plan view showing a state before heat pressing in the first embodiment. [Figure 27] 27 is a cross-sectional view taken along line XXVII-XXVII in FIG. 26. [Figure 28] 27 is a cross-sectional view taken along line XXVIII-XXVIII in FIG. 26. [Figure 29] FIG. 2 is a plan view showing a state after heat pressing in the first embodiment. [Figure 30] 30 is a cross-sectional view taken along the line XXX-XXX in FIG. 29. [Figure 31] 30 is a cross-sectional view taken along line XXXI-XXXI in FIG. 29. [Figure 32] FIG. 10 is a schematic diagram illustrating a case where a shim plate is used. [Figure 33] FIG. 10 is a schematic diagram illustrating a case where a shim plate is used. [Figure 34] FIG. 10 is a plan view showing a stamping die according to a second embodiment. [Figure 35] 35 is a view seen in the direction of the arrow XXXV in FIG. 34. [Figure 36] 36 is a view taken in the direction of arrow XXXVI in FIG. 34. [Figure 37] FIG. 10 is a plan view showing a state before heat pressing in the second embodiment. [Figure 38] 38 is a cross-sectional view taken along line XXXVIII-XXXVIII in FIG. 37. [Figure 39] 38 is a cross-sectional view taken along line XXXIX-XXXIX in FIG. 37. [Figure 40] FIG. 10 is a plan view showing a state after heat pressing in the second embodiment. [Figure 41] FIG. 41 is a cross-sectional view taken along line XLI-XLI in FIG. 40. [Figure 42] FIG. 41 is a cross-sectional view taken along line XLII-XLII of FIG. 40. [Figure 43] FIG. 10 is a plan view showing a condition monitoring sensor according to a second embodiment. [Figure 44] FIG. 44 is a view seen in the direction of arrow XLIV in FIG. [Figure 45] FIG. 44 is a view taken in the direction of arrow XLV in FIG. 43. [Figure 46] FIG. 10 is a plan view showing a mold according to a third embodiment. [Figure 47] 47 is a cross-sectional view taken along line XLVII-XLVII in FIG. 46. [Figure 48] 47 is a cross-sectional view taken along line XLVIII-XLVIII in FIG. 46. [Figure 49] FIG. 10 is a plan view showing a stamping die according to a third embodiment. [Figure 50] FIG. 50 is a view seen in the direction of the arrow L in FIG. 49. [Figure 51] FIG. 50 is a view seen in the direction of the arrow LI in FIG. 49. [Figure 52] FIG. 10 is a plan view showing a resin mold according to a third embodiment. [Figure 53] 53 is a cross-sectional view taken along line LIII-LIII in FIG. 52. [Figure 54] 53 is a cross-sectional view taken along the line LIV-LIV in FIG. 52. [Figure 55] 10 is a flowchart illustrating a method for manufacturing a condition monitoring sensor according to a third embodiment. [Figure 56] FIG. 11 is a plan view showing a state in which a lower pressing die is arranged in a die in the third embodiment. [Figure 57]57 is a cross-sectional view taken along line LVII-LVII in FIG. 56. [Figure 58] 57 is a cross-sectional view taken along line LVIII-LVIII in FIG. 56. [Figure 59] FIG. 11 is a plan view showing a state in which a resin mold is arranged in the third embodiment. [Figure 60] 59 along line LX-LX. [Figure 61] 59 along the line LXI-LXI. [Figure 62] FIG. 11 is a plan view showing a state in which an elastic material plate is placed in a resin mold in the third embodiment. [Figure 63] 63 is a cross-sectional view taken along line LXIII-LXIII in FIG. 62. [Figure 64] This is a cross-sectional view taken along line LXIV-LXIV in Figure 62. [Figure 65] FIG. 11 is a plan view showing a state in which a sensor unit is arranged in the third embodiment. [Figure 66] This is a cross-sectional view taken along line LXVI-LXVI in Figure 65. [Figure 67] This is a cross-sectional view taken along line LXVII-LXVII in Figure 65. [Figure 68] FIG. 11 is a plan view showing a state in which an elastic material plate is placed on a sensor unit in the third embodiment. [Figure 69] This is a cross-sectional view taken along line LXIX-LXIX in Figure 68. [Figure 70] This is a cross-sectional view taken along line LXX-LXX in Figure 68. [Figure 71] FIG. 11 is a plan view showing a state before heat pressing in a third embodiment. [Figure 72] 72 is a cross-sectional view taken along line LXXII-LXXII in FIG. 71. [Figure 73] 73 is a cross-sectional view taken along line LXXIII-LXXIII in FIG. 71. [Figure 74] FIG. 11 is a plan view showing a state after heat pressing in the third embodiment. [Figure 75] This is a cross-sectional view taken along line LXXV-LXXV in Figure 74. [Figure 76] This is a cross-sectional view taken along line LXXVI-LXXVI in Figure 74. [Figure 77] FIG. 10 is a plan view showing a condition monitoring sensor according to a third embodiment. [Figure 78] FIG. 78 is a view taken in the direction of arrow LXXVIII in FIG. 77. [Figure 79] FIG. 78 is a view taken in the direction of arrow LXXIX in FIG. 77. [Figure 80] FIG. 10 is a schematic diagram showing a state monitoring sensor and a resin mold according to a third embodiment. [Figure 81] FIG. 11 is a schematic view showing a state in which the resin mold has been removed in the third embodiment. [Figure 82] FIG. 10 is a plan view showing a state before heat pressing in a fourth embodiment. [Figure 83] This is a cross-sectional view taken along line LXXXIII-LXXXIII in Figure 82. [Figure 84] This is a cross-sectional view taken along line LXXXIV-LXXXIV in Figure 82. [Figure 85] FIG. 10 is a plan view showing a state after heat pressing in the fourth embodiment. [Figure 86] This is a cross-sectional view taken along line LXXXVI-LXXXVI in Figure 85. [Figure 87] This is a cross-sectional view taken along line LXXXVII-LXXXVII in Figure 85. [Figure 88] FIG. 10 is a plan view showing a condition monitoring sensor according to a fourth embodiment. [Figure 89] FIG. 89 is a view taken in the direction of arrow LXXXIX in FIG. 88. [Figure 90] 89 is a view taken in the direction of the arrow XC in FIG. 88. [Figure 91] FIG. 1 is a plan view showing a condition monitoring sensor according to a first reference example. [Figure 92] FIG. 1 is a side view showing a condition monitoring sensor according to a first reference example. [Figure 93] 1 is a schematic diagram showing a state in which a condition monitoring sensor according to Reference Example 1 is arranged in equipment. [Figure 94] 10 is a plan view showing a state in which the position of the sensor unit is shifted in Reference Example 2. FIG. [Figure 95] FIG. 10 is a plan view showing a stamping die of Reference Example 3. [Figure 96]96 is a view taken in the direction of arrow XCVI in FIG. 95. [Figure 97] 96 is a view seen in the direction of arrow XCVII in FIG. 95. [Figure 98] FIG. 10 is a plan view showing a state before heat pressing in Reference Example 3. [Figure 99] 99 is a cross-sectional view taken along line XCIX-XCIX in FIG. 98. [Figure 100] 99 is a cross-sectional view taken along line CC in FIG. 98. [Figure 101] FIG. 10 is a plan view showing the state after heat pressing in Reference Example 3. [Figure 102] 102 is a cross-sectional view taken along line CII-CII in FIG. 101. [Figure 103] 102 is a cross-sectional view taken along line CIII-CIII in FIG. 101. [Figure 104] FIG. 11 is a plan view showing a condition monitoring sensor of Reference Example 3. [Figure 105] FIG. 105 is a view taken in the direction of the arrow CV in FIG. [Figure 106] FIG. 105 is a view taken in the direction of the arrow CVI in FIG. [Figure 107] FIG. 10 is a schematic diagram showing a state monitoring sensor of Reference Example 3. [Figure 108] FIG. 10 is a schematic view showing a state after deburring in Reference Example 3. [Figure 109] FIG. 109 is an enlarged view of part CIX in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A sensor device and a method for manufacturing the sensor device according to the present invention will be described below with reference to the accompanying drawings. In the following, substantially identical components in a plurality of embodiments will be designated by the same reference numerals, and descriptions thereof will be omitted.

[0014] (First embodiment) The first embodiment is shown in Figures 1 to 33. As shown in Figures 1 to 3, a condition monitoring sensor 1 serving as a sensor device includes a sensor section 10 and an elastic section 20. As shown in Figures 4 to 6, the sensor section 10 is a heat flow sensor having a sensor main body 11 and a wiring section 13, and converts the flow of heat into a voltage signal for output.

[0015] The sensor body 11 has a heat flow sensor element and is formed in the shape of a roughly rectangular flat plate in a plan view. In Figure 4 and other figures, the element area DA, which is the area where the heat flow sensor element is mounted, is shown with a matte finish as appropriate. The element area DA is formed to be smaller than the outer shape of the sensor body 11. The sensor body 11 used is manufactured through a hot press processing process.

[0016] The wiring section 13 is, for example, a two-core shielded wire, and has a signal line 131 and a shielded line 135 (see FIG. 91), each of which is covered with a coating, and the middle section is covered with a wiring outer coating 137. The coating of the signal line 131 is stripped off at the tip on the sensor section 10 side, and the signal line 131 is connected to the sensor main body 11 at a wiring connection section 14 made of solder or the like.

[0017] The shield wire 135 is formed in a mesh shape inside the wiring sheath 137. The shield wire 135 is taken out from the wiring sheath 137 on the sensor unit 10 side, twisted into a wire, and connected at its tip to the equipment 100 (see Figure 93). Due to its characteristics, heat flow sensors are susceptible to radio wave noise from the device to which they are attached. Therefore, the end of the shield wire 135 on the sensor unit 10 side is brought into contact with the sensor unit 10 as close as possible, and the end on the opposite side from the sensor unit 10 is connected to the ground of the amplifier or the like to which the signal line 131 is connected, thereby canceling out the radio wave noise.

[0018] 1 to 3, the elastic portion 20 is integrally formed from a resin with a large thermoelastic coefficient, such as UPE (ultra-high molecular weight polyethylene), and seals the sensor main body 11 and the wiring connection portion 14. The elastic portion 20 has a protruding portion 21 and a peripheral portion 23. In this embodiment, if the vertical direction of the paper in FIG. 2 is the thickness direction, the protruding portion 21 is formed in the shape of a quadrangular pyramid protruding on both sides in the thickness direction inside the peripheral portion 23. For example, if the thickness HA of the protruding portion 21 is 3 mm and the thickness HB of the peripheral portion 23 is 2 mm, the protruding height HC of the protruding portion 21 from one side in the thickness direction of the peripheral portion 23 is 0.5 mm.

[0019] The protrusion 21 has a contact surface 22 that is rectangular in plan view. The contact surface 22 is formed so as to be within a projected area of ​​the element region DA in the thickness direction. In this embodiment, the contact surface 22 is formed so as to be equal to the projected area of ​​the element region DA. Note that "equal" here means that manufacturing errors and the like that do not affect detection are allowed.

[0020] The condition monitoring sensor 1 of this embodiment is arranged in a gap between equipment or a jig with the sensor body 11 sealed by the elastic part 20 by heat pressing, and the elastic part 20 slightly compressed in the thickness direction. For example, if the thickness of the condition monitoring sensor 1, i.e., the thickness HA of the protruding part 21, is 3 mm, it is compressed by 0.5 mm and arranged in a gap of 2.5 mm.

[0021] When the structure of the equipment or jig on which the condition monitoring sensor 1 is installed is distorted, the elastic part 20 compresses or expands, generating or absorbing heat due to the thermoelastic effect. The heat flow generated at this time is detected by the sensor part 10, which is a heat flow sensor, and converted into a voltage signal. The condition monitoring sensor 1 outputs a voltage signal of several μV in response to a distortion of, for example, 0.1 μm or less. This makes it possible to detect abnormalities in the equipment condition or long-term changes such as the end of machine life by capturing the condition of the equipment during operation from slight deformations in the structure.

[0022] In the condition monitoring sensor 7 of Reference Example 1 shown in Figures 91 to 93, the sensor unit 10 and the elastic unit 92 are fixed together with an adhesive member 93, such as double-sided tape or adhesive. If the adhesive member 93 is used to attach the sensor main body 11 to the elastic unit 92, the adhesive member 93 may impede the flow of heat, resulting in a decrease in responsiveness. Furthermore, as indicated by the block arrow and dashed line, when the structure of the equipment 100 is distorted, the adhesive member 93 gradually compresses and its thickness changes, and the output of the sensor will not stabilize for a period of time (for example, several hours to a day) until the change in the adhesive member 93 is complete.

[0023] Furthermore, if the wiring connection part 14 connecting the sensor part 10 and the wiring part 13 is, for example, solder, and is exposed from the elastic part 92, noise will be generated if the sensor part 10 or the wiring connection part 14 comes into contact with the metal parts of the equipment 100, and therefore insulation processing will be necessary.

[0024] Therefore, in this embodiment, as shown in Figure 1, etc., the sensor part 10 is molded with an elastic part 20, so that the sensor main body 11 is adhered to the elastic part 20 without using an adhesive material, and the connection point between the sensor main body 11 and the signal line 131 is also molded with the elastic part 20, thereby ensuring insulation.

[0025] 7 to 9, a mold 80 used in manufacturing the condition monitoring sensor 1 of this embodiment is formed with a through hole 801 and a wiring outlet groove 805. The wiring outlet groove 805 is provided so as to be able to position the wiring portion 13 of the sensor unit 10 arranged in the mold 80, and one end side of the wiring portion 13 is taken out to the outside of the mold 80.

[0026] 10 to 12, the lower pressing die 81 is formed in a shape that fits into the through-hole 801. The lower pressing die 81 also has a recess 811 formed therein for forming the protrusion 21. The depth of the recess 811 is formed in accordance with the protrusion height HC of the protrusion 21 from one side of the peripheral edge 23. The bottom surface of the recess 811 has a shape that corresponds to the abutment surface 22, and is formed below the element region DA.

[0027] A recess 821 is formed in the upper pressing die 82 (see Figs. 26 to 28, etc.). In this embodiment, the upper pressing die 82 has the same shape as the lower pressing die 81. The pressing dies 81 and 82 are used according to the size of the sensor main body 11 to be formed, such as using a pressing die with a large height when forming a sensor main body 11 with a small thickness.

[0028] A method for manufacturing the condition monitoring sensor 1 will be described with reference to the flowchart of Fig. 13 and Figs. 14 to 31. In the description of the flowchart, the "step" such as step S1 will be omitted and simply denoted by the symbol "S".

[0029] 14 to 16, in S1, a lower pressing die 81 is placed in a through hole 801 of a die 80. In S2, an elastic material plate 201 is placed on the lower pressing die 81, as shown in FIGS.

[0030] 20 to 22, in S3, the sensor unit 10 is placed on the elastic material plate 201. At this time, one end of the wiring unit 13 extends outward from the wiring outlet groove 805. In S4, as shown in FIGS. 23 to 25, the elastic material plate 202 is placed on the sensor unit 10.

[0031] 26 to 28, in S5, the upper pressing die 82 is placed on the elastic material plate 202. Before pressing, the upper pressing die 82 protrudes from the die 80. When this protruding portion is pressed in by pressing, the resin fills the gap.

[0032] In S6, vacuum hot pressing is performed. As shown in Figs. 29 to 31, pressing is performed using a press device (not shown) until the lower pressing die 81 and the upper pressing die 82 enter the die 80. The state in which hot pressing is performed using the press device is indicated by block arrows in Fig. 27. This also applies to the drawings related to the embodiments described below. In S7, the condition monitoring sensor 1 (see Figs. 1 to 3) formed by hot pressing is removed from the die 80.

[0033] The lower die 81 and the upper die 82 are preferably made of a material that is minimally deformed by hot pressing (for example, a metal such as stainless steel). If the dimensions need to be changed depending on the gap dimensions of the equipment 100 in which the condition monitoring sensor 1 is installed, a shim plate 99 or the like may be used as appropriate. For example, if the thickness of the condition monitoring sensor 1 needs to be increased, a shim plate 99 is placed above the die 80 as shown in FIG. 32. Alternatively, if the thickness of the condition monitoring sensor 1 needs to be reduced, a shim plate 99 is placed below the lower die 81 as shown in FIG. 33.

[0034] The elastic material plates 201, 202 and the through-hole 801 are larger than the sensor body 11. The through-hole 801 is formed to be larger than the outer edge of the sensor body 11, for example, by 1 mm both vertically and horizontally. As a result, by performing heat pressing, the elastic material plates 201, 202 wrap around the sensor body 11, filling in the gaps and welding, thereby forming an integrated elastic part 20, and the entire surface of the sensor body 11 is sealed by the elastic part 20. The elastic part 20 is not welded to the sensor part 10, but can maintain a tight contact state by covering the outside of the sensor body 11.

[0035] In this embodiment, the sensor section 10 itself is manufactured by heat pressing, and the heat pressing conditions for molding the condition monitoring sensor 1 are set to be milder than the manufacturing conditions for the sensor section 10. Furthermore, if the melting point of the elastic material plates 201, 202 is exceeded, resin will leak out from the gaps in the wiring outlet groove 805 and the mold 80, so the conditions are set to be just enough to soften the elastic material plates 201, 202 (for example, 150°, 1 kN for 150 seconds). Furthermore, the heat pressing is performed under vacuum conditions to prevent air from getting between the sensor section 10 and the elastic section 20.

[0036] Furthermore, excess portions of the softened elastic material plates 201, 202 blow away toward the wiring outlet groove 805. As a result, the wiring connection portion 14 and the portions where the conductors are exposed from the coating are covered with the elastic portion 20, ensuring insulation. Also, the wiring strength can be increased. The elastic material plates 201, 202 only need to cover the sensor body 11 and the wiring connection portion 14, and for example, a separate plate covering the side surface may be provided.

[0037] Condition monitoring sensor 8 of Reference Example 2 is shown in Figure 94. When the sensor main body 11 and the through-hole of the mold (not shown) are both rectangular, as in condition monitoring sensor 8, there is a risk that the position of sensor part 10 will shift during pressing. If the position of sensor part 10 shifts inside the through-hole and a portion (below the page in Figure 94) is created on the outside of sensor main body 11 where elastic part 28 does not wrap around, elastic part 28 will be prone to curling up from this portion.

[0038] Therefore, as shown in FIG. 7 and other figures, inclined surfaces 802 are formed at the corners of the through-hole 801 of the mold 80, and as shown in FIGS. 10 and 26 and other figures, inclined surfaces 812 and 822 are formed at the corners of the pressing molds 81 and 82, resulting in an octagonal shape in a plan view. The four corners of the sensor body 11 may abut against the inclined surfaces 802. By pressing the four corners of the sensor body 11 with the inclined surfaces 802 of the mold 80, it is possible to prevent the sensor body 11 from shifting position inside the through-hole 801. This makes it possible to maintain gaps around the four sides of the sensor body 11 so that the elastic material plates 201 and 202 can wrap around them. Note that the four corners of the sensor body 11 are separated from the element region DA, and even if they are slightly exposed from the elastic portion 20, the impact is limited.

[0039] Next, Reference Example 3 is shown in Figures 95 to 106. As shown in Figures 95 to 97, the pressing die 89 of the Reference Example has no recesses and is formed in a flat plate shape. Figures 98 to 100 show the state before pressing, and Figures 101 to 103 show the state after pressing. The condition monitoring sensor 9 formed by hot pressing using the flat pressing die 89 has no protrusions formed on the elastic part 29 (see Figures 104 to 107).

[0040] When hot pressing is performed, the press die 89 slides within the die 80, so a gap is always present between the die 80 and the press die 89, and the softened elastic material plates 201, 202 enter this gap, leaving a molding burr B1 on the sensor part 10 (see Figures 105 to 107). For the sake of explanation, the molding burr B1 is highlighted in Figure 107. Also, as shown in Figures 108 and 109, even when the molding burr B1 is cut with a knife or file, a burr B2 is generated by the cutting.

[0041] If burrs B1 and B2 exist in the thickness direction of the sensor unit 10, when the sensor unit 10 is installed in the equipment 100, gaps will be created between the equipment 100 and the sensor unit 10 due to the burrs B1 and B2, reducing the sensor sensitivity.

[0042] As shown in FIGS. 1 to 3 , the condition monitoring sensor 1 of this embodiment is manufactured by hot pressing using presses 81 and 82 in which recesses 811 and 821 are formed, thereby forming the protrusion 21 on the elastic portion 20. For example, if the depth of the recess 811 is 0.5 mm, the thickness HB of the peripheral portion 23 is 2 mm, and the thickness of the protrusion 21 is 3 mm, the protrusion 21 protrudes 0.5 mm on both sides from the peripheral portion 23. If the height of the molding burr B1 is, for example, 0.2 to 0.3 mm, the protrusion height HC of the protrusion 21 is formed higher than the molding burr B1. By forming the elastic portion 20 so that the protrusion 21 is higher than the molding burr B1, when the condition monitoring sensor 1 is placed on the equipment 100, the abutment surface 22 abuts against the equipment 100. In other words, the molding burr B1 does not interfere with the abutment state between the abutment surface 22 and the equipment 100. This prevents the molding burr B1 from impairing the sensor sensitivity. The dimensions described in the specification are merely examples and can be changed as appropriate.

[0043] When using press molds 81 and 82 in which recesses 811 and 821 are formed, the softened elastic material plates 201 and 202 tend to flow out during heat pressing, concentrating on the four sides and increasing density, making the peripheral edge 23 harder than the protruding portion 21. Therefore, the peripheral edge 23 is less susceptible to elastic deformation than the protruding portion 21. Therefore, in this embodiment, the protruding portion 21 is set to be equal to or smaller than the element region CA, and the heat flow is detected by the elastic deformation of the protruding portion 21, thereby suppressing the effect of the hardening of the peripheral edge 23 on the sensor sensitivity.

[0044] As described above, the condition monitoring sensor 1 of this embodiment includes the elastic portion 20 and the sensor portion 10. The elastic portion 20 is elastically deformable, and generates or absorbs heat due to the elastic deformation. The sensor portion 10 includes the sensor main body 11 having a sensor element that can detect heat flow generated by deformation of the elastic portion, and the wiring portion 13 connected to the sensor main body 11 by the wiring connection portion 14. The sensor main body 11 and the wiring connection portion 14 are directly sealed by the elastic portion 20, and one end of the wiring portion 13 is taken out from the elastic portion 20.

[0045] Here, "directly sealed" means sealed by the elastic portion 20 without using an adhesive or other adhesive material. In this embodiment, the sensor body 11 and the wiring connection portion 14 are directly sealed by the elastic portion 20 without using an adhesive or other adhesive material, which improves responsiveness and detection accuracy compared to when an adhesive or other adhesive material is used. Furthermore, by molding the wiring connection portion 14, insulation can be ensured.

[0046] If the direction in which the elastic part 20 is held by the measurement target during measurement is defined as the thickness direction, the elastic part 20 has protruding parts 21 that protrude in the thickness direction within a projection area in the thickness direction of the element area DA, which is the area where the sensor element is provided. More specifically, in the condition monitoring sensor 1, the protruding parts 21 are formed on both sides in the thickness direction so that the height of the protruding parts 21 is greatest.

[0047] By forming the protrusion 21 to protrude so as to be greater than the height of the molding burr B1, the equipment 100 to be measured can be brought into contact with the protrusion 21 without being affected by the molding burr B1. This ensures detection accuracy and allows the state of the device 100 to be detected appropriately.

[0048] The protrusion 21 has a contact surface 22 that can come into contact with the measurement object. As a result, the condition monitoring sensor 1 comes into contact with the measurement object at the contact surface 22, and therefore can detect movement of the measurement object in the thickness direction and in the direction along the contact surface 22.

[0049] (Second embodiment) The second embodiment will be described with reference to Figs. 34 to 45. As shown in Figs. 34 to 36, the pressing die 83 used in manufacturing the condition monitoring sensor 2 of this embodiment (see Fig. 43, etc.) has a recess 831 formed in a spherical shape. Specifically, the recess 831 is formed in a spherical crown shape with a radius R of 10 mm and a height HD of 0.5 mm, for example. Figs. 37 to 39 show the state before heat pressing, and Figs. 40 to 42 show the state after heat pressing. The manufacturing method of the condition monitoring sensor 2 is the same as that of the first embodiment, except that the shape of the recess 831 of the pressing die 83 is different. In this embodiment, there is no distinction between an upper die and a lower die, and the pressing die 83 is used.

[0050] As shown in FIGS. 43 to 45, the condition monitoring sensor 2 includes a sensor unit 10 and an elastic unit 30. The elastic unit 30 has a protruding portion 31 and a peripheral portion 33. The protruding portion 31 is formed in a spherical convex shape so that the apex 315 is within the projection of the element region DA in the thickness direction. In this embodiment, the protruding portion 31 is formed so that the apex 315 is at the center of the projection region of the element region DA.

[0051] When the condition monitoring sensor 2 is placed on the equipment 100, it abuts against the equipment 100 at the apex 315. In reality, the elastic portion 30 of the condition monitoring sensor 2 is slightly compressed when installed, so contact occurs over a relatively small surface area. However, for the sake of convenience, it is assumed that contact occurs at the apex 315. By forming the protruding portion 31 so that the height of the apex 315 from the peripheral portion 33 (e.g., 0.5 mm) is greater than the height of the molding burr B1 (e.g., 0.2 to 0.3 mm), the apex 315 can abut against the equipment 100 without being affected by the molding burr B1. This prevents a decrease in sensor sensitivity due to the molding burr B1. Furthermore, by forming the protruding portion 31 into a spherical crown shape, force is received at the apex 315, further reducing the impact on sensor sensitivity caused by the hardening of the peripheral portion 33.

[0052] The protrusion 31 in this embodiment is formed in a spherical crown shape. As a result, the condition monitoring sensor 2 abuts against the measurement target at the apex 315, making it possible to properly detect movement of the measurement target in the thickness direction. For example, if it is desired to detect only the component in the direction perpendicular to the sensor surface (i.e., the thickness direction), the condition monitoring sensor 2 of this embodiment is used, and if it is desired to detect the component in the direction perpendicular to the sensor surface and in the sensor surface direction, the condition monitoring sensor 1 of the first embodiment is used. In this way, it is possible to use the condition monitoring sensor 2 according to the application. Furthermore, the same effects as those of the above embodiments are achieved.

[0053] (Third embodiment) The third embodiment will be described with reference to Figures 46 to 81. As shown in Figures 46 to 48, a die 85 used in manufacturing a condition monitoring sensor 3 of this embodiment (see Figures 77 to 79, etc.) is formed with a through-hole 851 and a wiring outlet groove 855. The through-hole 851 is formed in a rectangular shape in a plan view. As shown in Figures 49 to 51, pressing dies 86 and 87 are formed in a rectangular parallelepiped shape that fits into the through-hole 851.

[0054] As shown in FIGS. 52 to 54, in this embodiment, a resin mold 90 is used to manufacture the condition monitoring sensor 3 in addition to upper and lower press molds 86 and 87. The resin mold 90 is made of a material (e.g., ABS resin) that melts under the heat press conditions used to manufacture the condition monitoring sensor 3 and that does not weld to the elastic material plates 201 and 202. A through hole 901 and a wiring outlet groove 905 are formed in the resin mold 90. The through hole 901 and the wiring outlet groove 905 are formed in the same shapes as the through hole 801 and the wiring outlet groove 805 of the mold 80 of the first embodiment, for example. The resin mold 90 is formed to fit into the through hole 851 of the mold 85.

[0055] A method for manufacturing the condition monitoring sensor 3 will be described with reference to the flowchart of Fig. 55 and Figs. 56 to 76. The flowchart shown in Fig. 55 differs from Fig. 13 in that S10 is added, in which a resin mold is placed between S1 and S2.

[0056] 56 to 58, in S1, a lower pressing die 86 is placed on a die 85. As shown in Figs. 59 to 61, in S10, a resin die 90 is placed on the lower pressing die 86. At this time, the resin die 90 is placed so that the wiring extraction groove 855 of the die 85 and the wiring extraction groove 905 of the resin die 90 are aligned.

[0057] As shown in Figures 62 to 64, in S2, an elastic material plate 201 is placed in the through-hole 901 of the resin mold 90. As shown in Figures 65 to 67, in S3, the sensor main body 11 is placed on the elastic material plate 201. As shown in Figures 68 to 70, in S4, the elastic material plate 202 is placed on the sensor main body 11.

[0058] As shown in Figures 71 to 73, in S5, the upper pressing die 87 is placed on the elastic material plate 202. In S6, vacuum hot pressing is performed, and as shown in Figures 74 to 76, pressing is performed with a press device until the pressing dies 86 and 87 enter the die 85. In S7, the condition monitoring sensor 3 formed by hot pressing is removed from the die 85.

[0059] 77 to 79, the condition monitoring sensor 3 includes a sensor section 10 and an elastic section 40. In this embodiment, the condition monitoring sensor 3 is manufactured using a double mold, using a resin mold 90 in addition to pressing molds 86 and 87, and the elastic section 40 has molding burrs B4 formed at both ends in the thickness direction, extending flange-like outward in a plane perpendicular to the thickness direction.

[0060] As shown in Figures 80 and 81, when the outer periphery of the sensor main body 11 is covered with a resin mold 90 and subjected to heat pressing, molding burrs B3 in the thickness direction are generated on the resin mold 90, and molding burrs B4 are generated on the elastic portion 40 in a direction in which both end faces in the thickness direction spread outward (left-right direction on the paper surface of Figures 80 and 81). In other words, no molding burrs are formed in the thickness direction on the elastic portion 40. When the condition monitoring sensor 3 is installed in the equipment 100, it is clamped in the thickness direction to perform measurements, so molding burrs B4 in the outer periphery direction are unlikely to affect sensitivity. Therefore, the condition monitoring sensor 3 can be prevented from suffering a decrease in sensor sensitivity due to the influence of molding burrs B4. Note that hatching of the condition monitoring sensor 3 has been omitted in Figures 80 and 81 to avoid complexity.

[0061] The condition monitoring sensor 3 of this embodiment includes an elastic portion 40 and a sensor portion 10. If the thickness direction is the direction in which the sensor is held by the object to be measured, the elastic portion 40 has molding burrs B4 extending outward from both ends of the elastic portion 40 in the thickness direction. In this embodiment, a resin mold 90 is used to cover the outer periphery of the sensor body 11, and molding burrs B3 are formed in the resin mold 90 in the thickness direction, thereby preventing the elastic portion 40 from having burrs in the thickness direction. Furthermore, since the molding burrs B4 extending outward are not in the direction of compression when the condition monitoring sensor 3 is attached to the object to be measured, they have little effect on sensor sensitivity. Even with this configuration, detection accuracy can be ensured.

[0062] The manufacturing method of the condition monitoring sensor 3 of this embodiment includes a lower die arranging step, a peripheral die arranging step, a sensor arranging step, an upper die arranging step, a heat pressing step, and a sensor extraction step.

[0063] In the lower die placement process, a lower die 86 is placed in the mold 85. In the outer periphery die placement process, a resin die 90 is placed, which is an outer periphery die formed of a material that melts during heat pressing but does not weld to the elastic part 40. Here, "melts during heat pressing" includes a state in which the material is softened enough to be press molded.

[0064] In the sensor placement step, the sensor main body 11 is placed on the inner periphery of the resin mold 90 while being sandwiched between the elastic material plates 201 and 202. In the upper pressing mold placement step, the upper pressing mold 87 is placed on the upper elastic material plate 202 and the resin mold 90.

[0065] In the heat pressing process, heat pressing is performed in a vacuum environment to integrate the elastic material plates 201 and 202 to form the elastic portion 40, and mold the sensor body 11 and the wiring connection portion 14. In the sensor removal process, the upper pressing die 87, the lower pressing die 86, and the resin die 90 are removed, and the condition monitoring sensor 3 is removed.

[0066] In the manufacturing method of the condition monitoring sensor 3 of this embodiment, molding burrs B3 in the thickness direction can be formed in the resin mold 90, and molding burrs B4 in the outer circumferential direction can be formed in the elastic portion 40. This makes it possible to manufacture a condition monitoring sensor 3 that is free of molding burrs B3 in the thickness direction. In addition, the same effects as those of the above embodiment can be achieved.

[0067] (Fourth embodiment) The fourth embodiment is shown in Figures 82 to 90. The condition monitoring sensor 4 of this embodiment (see Figures 88 to 90) uses a resin mold 90 similar to that of the third embodiment. Also, the pressing mold 88 has a recess 881 formed therein, similar to that of the first embodiment. The recess of the pressing mold 88 may be spherical like that of the second embodiment. In this embodiment, there is no distinction between an upper pressing mold and a lower pressing mold, and the pressing mold 88 is used.

[0068] Figures 82 to 84 show the state before pressing, and Figures 85 to 87 show the state after pressing. The manufacturing method of the condition monitoring sensor 4 is the same as that of the third embodiment, except that the pressing die 88 is different.

[0069] As shown in Figures 88 to 90, the condition monitoring sensor 4 includes a sensor main body 11 and an elastic part 50. The elastic part 50 has a protruding part 51 and a peripheral part 53. The protruding part 51 is similar to the protruding part 21 of the first embodiment and has a contact surface 52 that is rectangular in plan view, and when the condition monitoring sensor 4 is installed in the equipment 100, the contact surface 52 comes into contact with the equipment 100. A molding burr B4 extending in the outer circumferential direction is formed on the peripheral part 53.

[0070] In this embodiment, the elastic portion 50 has a peripheral portion 53 formed on the outer periphery of the protruding portion 51. Molding burrs B4 extending outward are formed on both thickness-wise end surfaces of the peripheral portion 53. Even with this configuration, the condition monitoring sensor 4 can be prevented from being affected by the molding burrs B4, thereby achieving the same effects as the above-described embodiment.

[0071] In the embodiment, the condition monitoring sensors 1 to 4 correspond to the “sensor device”, and the resin mold 90 corresponds to the “periphery mold”. Furthermore, S1 corresponds to the “lower mold placement step”, S10 corresponds to the “periphery mold placement step”, S2 to S4 correspond to the “sensor placement step”, S5 corresponds to the “upper mold placement step”, S6 corresponds to the “heat pressing step”, and S7 corresponds to the “sensor removal step”.

[0072] (Other embodiments) The protrusion of the elastic portion is formed in a quadrangular pyramid shape in the first and fourth embodiments, and in a spherical crown shape in the second embodiment. In other embodiments, the protrusion may have a shape different from that of the above embodiments, as long as it is formed so as to be higher than a molding burr formed in the thickness direction within the range of the element region projected in the thickness direction.

[0073] In the above embodiment, the sensor body is formed in a flat plate shape that is generally rectangular in plan view. In other embodiments, the shape of the sensor body may be different from that of the above embodiment, such as circular in plan view, and the same applies to the elastic portion. In the above embodiment, the sensor body and the signal line are connected by solder. In other embodiments, the sensor body and the signal line may be connected by a method other than soldering as long as electrical continuity is established between them. As described above, the present invention is not limited to the above embodiment and can be embodied in various forms without departing from the spirit of the invention. [Explanation of symbols]

[0074] 1 to 4: Condition monitoring sensor (sensor device) 10: Sensor section 11: Sensor body 13 Wiring section 14 Wiring connection section 20, 30, 40, 50... Elastic part 21, 31, 51...Protrusion 80, 85... type 81~83, 86~88... Press mold 90···Resin mold (periphery type) 100···Equipment (measurement target) 201, 202 Elastic material plates

Claims

1. an elastic portion (20, 30, 50) that is elastically deformable and generates or absorbs heat due to elastic deformation; a sensor unit (10) having a sensor body (11) having a sensor element capable of detecting a heat flow generated by deformation of the elastic part, and a wiring part (13) connected to the sensor body by a wiring connection part (14), the sensor body and the wiring connection part being directly sealed by the elastic part, and one end side of the wiring part being taken out from the elastic part; Equipped with When the direction in which the object to be measured (100) is clamped during measurement is defined as the thickness direction, the elastic portion has a protrusion (21, 31, 51) formed therein that protrudes in the thickness direction within a projection area in the thickness direction of the element area, which is the area in which the sensor element is provided.

2. The sensor device according to claim 1, wherein the protrusion (21, 51) has a contact surface (22, 52) that can come into contact with the measurement object.

3. 2. The sensor device according to claim 1, wherein the protrusion (31) is formed in a spherical crown shape.

4. The elastic portion (50) has a peripheral portion (53) formed on the outer periphery of the protrusion, 4. The sensor device according to claim 1, wherein molding burrs extending outward are formed on both end surfaces of the peripheral portion in the thickness direction.

5. an elastic portion (40, 50) that is elastically deformable and generates or absorbs heat due to elastic deformation; a sensor unit (10) having a sensor body (11) having a sensor element capable of detecting a heat flow generated by deformation of the elastic part, and a wiring part (13) connected to the sensor body by a wiring connection part (14), the sensor body and the wiring connection part being directly sealed by the elastic part, and one end side of the wiring part being taken out from the elastic part; Equipped with When the direction in which the elastic part is clamped by the measurement object (100) during measurement is defined as the thickness direction, a molding burr extending outward is formed on both end surfaces of the elastic part in the thickness direction.

6. an elastic portion (40, 50) that is elastically deformable and generates or absorbs heat due to elastic deformation; a sensor unit (10) having a sensor body (11) having a sensor element capable of detecting a heat flow generated by deformation of the elastic part, and a wiring part (13) connected to the sensor body by a wiring connection part (14), the sensor body and the wiring connection part being directly sealed by the elastic part, and one end side of the wiring part being taken out from the elastic part; A method for manufacturing a sensor device comprising: a lower mold placement step (S1) of placing lower molds (86, 88) in a mold (85); a peripheral mold placement step (S10) of placing a peripheral mold (90) formed of a material that melts during heat pressing and does not weld to the elastic portion; a sensor placement step (S2 to S4) of placing the sensor body on the inner periphery of the outer periphery mold while sandwiched between elastic material plates (201, 202); an upper pressing die arrangement step (S5) of arranging upper pressing dies (87, 88) on the upper elastic material plate (202) and the outer peripheral die; a heat pressing step (S6) of forming the elastic portion by integrating the elastic material plate through heat pressing, and molding the sensor body and the wiring connection portion with the elastic portion; a sensor removal step (S7) of removing the upper pressing die, the lower pressing die, and the outer peripheral die, and removing the sensor device; A method for manufacturing a sensor device comprising:

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