Antenna Module

Abstract

A second positive main surface is in contact with a first negative main surface. One or more first ground conductor layers are positioned toward the positive side of the Z-axis from a signal conductor layer. The one or more first ground conductor layers are not positioned on the second positive main surface. When viewed in the negative direction of the Z-axis, a ground conductor layer non-formation region in which the one or more first ground conductor layers are not provided is present in a first substrate region in which a first substrate is provided. When viewed in the negative direction of the Z-axis, the signal conductor layer overlaps with the ground conductor layer non-formation region. In the ground conductor layer non-formation region, there is no conductor that covers the entire ground conductor layer non-formation region on the positive side of the Z-axis from the signal conductor layer other than a radiating conductor layer.

Description

[Technical Field]

[0001] The present invention relates to an antenna module. [Background technology]

[0002] A known example of a conventional invention relating to an antenna module is the built-in antenna described in Patent Document 1. This built-in antenna includes a dielectric substrate and a printed circuit board. An antenna pattern is provided on the upper main surface of the printed circuit board. The dielectric substrate is fixed to the upper main surface of the printed circuit board so as to cover the antenna pattern. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-179427 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in the built-in antenna described in Patent Document 1, there is a demand for suppressing the formation of a gap between the dielectric substrate and the printed circuit board.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an antenna module that can prevent a gap from being formed between a first substrate and a second substrate. [Means for solving the problem]

[0006] An antenna module according to one aspect of the present invention includes: An antenna module comprising a first substrate and a second substrate, The first substrate is a first substrate body including a first insulating material; a radiation conductor layer provided on the first substrate body; It contains The second substrate is a second substrate body having a structure in which a plurality of second insulator layers containing a second insulating material are stacked in a direction along the Z axis; a signal conductor layer provided on the second substrate body; one or more first ground conductor layers provided on the second substrate body; It contains At least one of the first insulating material and the second insulating material is a thermoplastic resin; the first substrate body has a first positive main surface and a first negative main surface located on the negative side of the Z axis from the first positive main surface, the second substrate body has a second positive main surface and a second negative main surface located on the negative side of the Z axis from the second positive main surface, the second positive principal surface is in contact with the first negative principal surface; the one or more first ground conductor layers are located on the positive side of the Z axis relative to the signal conductor layer; the one or more first ground conductor layers are not located on the second main surface, a portion of each of the one or more first ground conductor layers overlaps with the radiation conductor layer when viewed in the negative direction of the Z axis; When viewed in the negative direction of the Z axis, a first substrate region in which the first substrate is provided has a ground conductor layer-free region in which the one or more first ground conductor layers are not provided, When viewed in the negative direction of the Z axis, the signal conductor layer overlaps the area where the ground conductor layer is not formed, In the ground conductor layer-free area, there is no conductor covering the entire ground conductor layer-free area other than the radiation conductor layer on the positive side of the signal conductor layer along the Z axis. [Effects of the Invention]

[0007] According to the antenna module of the present invention, it is possible to prevent a gap from being formed between the first substrate and the second substrate. [Brief explanation of the drawings]

[0008] [Figure 1]FIG. 1 is an exploded perspective view of the antenna module 10. FIG. [Figure 2] FIG. 2 is a top view of the antenna module 10. As shown in FIG. [Figure 3] FIG. 3 is a cross-sectional view of the antenna module 10. As shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view of the antenna module 10a. [Figure 5] FIG. 5 is a cross-sectional view of the antenna module 10b. [Figure 6] FIG. 6 is a cross-sectional view of the antenna module 10c. [Figure 7] FIG. 7 is a cross-sectional view of the antenna module 10d. [Figure 8] FIG. 8 is a cross-sectional view of the antenna module 10e. [Figure 9] FIG. 9 is a cross-sectional view of the antenna module 10f. [Figure 10] FIG. 10 is a cross-sectional view of the antenna module 10g. [Figure 11] FIG. 11 is a cross-sectional view of the antenna module 10h. [Figure 12] FIG. 12 is an exploded perspective view of the antenna module 10i. [Figure 13] FIG. 13 is a cross-sectional view of the antenna module 10j. [Figure 14] FIG. 14 is a top view of the first substrate 12. As shown in FIG. [Figure 15] FIG. 15 is a top view of the antenna module 10l. DETAILED DESCRIPTION OF THE INVENTION

[0009] (Embodiment) [Antenna module structure] The structure of an antenna module 10 according to an embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is an exploded perspective view of the antenna module 10. Fig. 2 is a top view of the antenna module 10. Fig. 3 is a cross-sectional view of the antenna module 10. Fig. 3 is a cross-sectional view taken along line AA in Fig. 2.

[0010] In this specification, directions are defined as follows: The direction in which the second insulating layers 16a to 16d are arranged in this order is defined as the downward direction. The downward direction coincides with the negative direction of the Z axis. When viewed from below, two sides of the first substrate 12 extend along the front-rear axis. The front-rear axis coincides with the Y axis. The remaining two sides of the first substrate 12 extend along the left-right axis. The left-right axis coincides with the X axis. The up-down axis (Z axis), the front-rear axis (Y axis), and the left-right axis (X axis) are perpendicular to one another. Note that the up-down axis, the front-rear axis, and the left-right axis in this embodiment are shaft The vertical axis, the front-rear axis, and the horizontal axis do not have to coincide with the vertical axis, the front-rear axis, and the horizontal axis when the antenna module 10 is in use.

[0011] First, the structure of the antenna module 10 will be described with reference to Figures 1 to 3. The antenna module 10 is built into an electronic device such as a wireless communication terminal. As shown in Figure 1, the antenna module 10 includes a first substrate 12 and a second substrate 14.

[0012] The first substrate 12 includes a first substrate body 40 and a radiation conductor layer 42. The first substrate body 40 has a plate shape. Therefore, the first substrate body 40 has a first positive principal surface S1 and a first negative principal surface S2. The first negative principal surface S2 is located below the first positive principal surface S1 (on the negative side of the Z axis). The first substrate body 40 has a rectangular shape when viewed from below. When viewed from below, two sides of the first substrate body 40 extend along the front-to-back axis. The remaining two sides of the first substrate body 40 extend along the left-to-right axis. The first substrate body 40 includes a first insulating material. The first insulating material is not a thermoplastic resin. The first insulating material is, for example, LTCC (Low Temperature Co-fired Ceramics).

[0013] The radiating conductor layer 42 is provided on the first substrate body 40. In this embodiment, the radiating conductor layer 42 is located on the first front main surface S1 of the first substrate body 40. The radiating conductor layer 42 has a rectangular shape when viewed from below. When viewed from below, two sides of the radiating conductor layer 42 extend along the front-rear axis. The remaining two sides of the radiating conductor layer 42 extend along the left-right axis. The material of such a radiating conductor layer 42 is a metal. The metal is, for example, copper.

[0014] The second substrate 14 is located below the first substrate 12. The second substrate 14 includes a second substrate main body 15, a signal conductor layer 18, a first ground conductor layer 20, a second ground conductor layer 22, and a first interlayer connection conductor v1. The second substrate main body 15 has a plate shape. Therefore, the second substrate main body 15 has a second positive principal surface S11 and a second negative principal surface S12. The second negative principal surface S12 is located below the second positive principal surface S11 (on the negative side of the Z axis). The thickness of the second substrate 14 along the vertical axis (Z axis) is smaller than the thickness of the first substrate 12 along the vertical axis (Z axis). Furthermore, when viewed from below, the area of ​​the second substrate main body 15 is larger than the area of ​​the first substrate main body 40. When viewed from below, the outer edge of the first substrate main body 40 is contained within the outer edge of the second substrate main body 15.

[0015] The second substrate main body 15 has a structure in which second insulator layers 16a-16d containing a second insulating material are stacked in a direction along the vertical axis (Z-axis). The second insulator layers 16a-16d are arranged in this order in the downward direction. Adjacent second insulator layers 16a-16d are fused together. The second insulating material is a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer. The dielectric constant of the second insulating material is lower than that of the first insulating material. Furthermore, the Young's modulus of the second insulating material is lower than that of the first insulating material.

[0016] Here, the first substrate body 40 is fixed to the second substrate body 15. More specifically, the second positive main surface S11 is in contact with the first negative main surface S2. The first substrate body 40 is fixed to the second substrate body 15 by heat treatment and pressure treatment. pressureDuring the processing, the molten second insulator layer 16a penetrates into the irregularities on the surface of the first substrate body 40. As a result, the first substrate body 40 is in close contact with the second substrate body 15 and is fixed to the second substrate body 15.

[0017] The signal conductor layer 18 is provided on the second substrate main body 15. In this embodiment, the signal conductor layer 18 is located on the upper main surface of the second insulator layer 16c. The signal conductor layer 18 has a linear shape extending along the left-right axis (X-axis). High-frequency signals are transmitted through the signal conductor layer 18 as described above.

[0018] The first ground conductor layer 20 is provided on the second substrate main body 15. In this embodiment, the first ground conductor layer 20 is located on the upper main surface of the second insulator layer 16b. As a result, the first ground conductor layer 20 is located above the signal conductor layer 18 (on the positive side of the Z axis). However, the first ground conductor layer 20 is not located on the second positive main surface S11. Therefore, the first ground conductor layer 20 is located inside the second substrate main body 15.

[0019] The first ground conductor layer 20 covers most of the upper main surface of the second insulator layer 16b. As a result, the first ground conductor layer 20 overlaps with the signal conductor layer 18 when viewed downward. However, the first ground conductor layer 20 is not electrically connected to the signal conductor layer 18. Furthermore, a portion of the first ground conductor layer 20 overlaps with the radiation conductor layer 42 when viewed downward (negative direction of the Z axis). The first ground conductor layer 20 has a portion that does not overlap with the radiation conductor layer 42 when viewed downward (negative direction of the Z axis). The first ground conductor layer 20 as described above is connected to the ground potential.

[0020] The second ground conductor layer 22 is provided on the second substrate body 15. In this embodiment, the second ground conductor layer 22 is located on the upper main surface of the second insulator layer 16d. As a result, the second ground conductor layer 22 is located below the signal conductor layer 18 (on the negative side of the Z axis).

[0021] The second ground conductor layer 22 covers most of the upper main surface of the second insulating layer 16d. As a result, the second ground conductor layer 22 overlaps with the signal conductor layer 18 when viewed downward. The second ground conductor layer 22 also overlaps with the radiation conductor layer 42 when viewed downward (in the negative direction of the Z axis). The second ground conductor layer 22 as described above is connected to the ground potential.

[0022] The signal conductor layer 18, the first ground conductor layer 20, and the second ground conductor layer 22 as described above have a stripline structure.

[0023] The signal conductor layer 18, the first ground conductor layer 20, and the second ground conductor layer 22 are formed by patterning metal foil attached to the upper main surfaces of the second insulating layers 16b to 16d. The metal foil is, for example, copper foil.

[0024] The first interlayer connection conductor v1 electrically connects the first ground conductor layer 20 and the second ground conductor layer 22. The first interlayer connection conductor v1 penetrates the second insulator layers 16b and 16c along the up-down axis. The upper end of the first interlayer connection conductor v1 contacts the first ground conductor layer 20. The lower end of the first interlayer connection conductor v1 contacts the second ground conductor layer 22.

[0025] The first interlayer connection conductor v1 is formed by filling a conductive paste into a through hole that penetrates the second insulating layers 16b, 16c along the vertical axis, and solidifying the conductive paste by heating and pressurizing.

[0026] As shown in FIG. 2 , the area where the first substrate 12 is provided is defined as the first substrate area A1 when viewed downward (negative direction of the Z axis). When viewed downward (negative direction of the Z axis), the first substrate area A1 includes ground conductor layer-free areas A0a, A0b, and A0c where the first ground conductor layer 20 is not provided. The ground conductor layer-free area A0a has a rectangular shape when viewed downward. Two long sides of the ground conductor layer-free area A0a extend in the front-rear direction. Two short sides of the ground conductor layer-free area A0a extend in the left-right direction. As a result, the signal conductor layer 18 overlaps with the ground conductor layer-free area A0a when viewed downward (negative direction of the Z axis). More specifically, the ground conductor layer-free area A0a intersects with the signal conductor layer 18 when viewed downward. In this embodiment, the ground conductor layer-free area A0a is perpendicular to the signal conductor layer 18 when viewed downward. When viewed downward (in the negative direction of the Z axis), the ground conductor layer-free area A0a is surrounded by the first ground conductor layer 20. The length of the ground conductor layer-free area A0a along the front-rear axis (Y axis) is equal to or less than half the wavelength of the high-frequency signal transmitted through the signal conductor layer 18.

[0027] When viewed downward (in the negative direction of the Z axis), the signal conductor layer 18 overlaps with the radiation conductor layer 42 in the ground conductor layer-free area A0a. As shown in FIG. 3 , in the ground conductor layer-free area A0a, the radiation conductor layer 42 is the only conductor covering the entire ground conductor layer-free area A0a above the signal conductor layer 18 (on the positive side of the Z axis). This results in electromagnetic field coupling between the signal conductor layer 18 and the radiation conductor layer 42. In this embodiment, the signal conductor layer 18 and the radiation conductor layer 42 are primarily magnetically coupled. As a result, a high-frequency signal transmitted through the signal conductor layer 18 is transmitted to the radiation conductor layer 42 by the electromagnetic field via the ground conductor layer-free area A0a. A standing wave of the high-frequency signal is then generated in the radiation conductor layer 42. The radiation conductor layer 42 radiates the electromagnetic wave of the high-frequency signal upward. Based on the same principle, the radiation conductor layer 42 receives the electromagnetic wave.

[0028] [effect] The antenna module 10 can prevent a gap from being formed between the first substrate 12 and the second substrate 14. More specifically, the first ground conductor layer 20 is not located on the second positive principal surface S11. That is, the first ground conductor layer 20 is located inside the second substrate main body 15. This increases the area of ​​contact between the second positive principal surface S11 and the first negative principal surface S2. The first ground conductor layer 20, which has a large area, does not interfere with the bonding between the first substrate 12 and the second substrate 14. As a result, the antenna module 10 can prevent a gap from being formed between the first substrate 12 and the second substrate 14.

[0029] Furthermore, at least one of the first insulating material and the second insulating material is a thermoplastic resin. In this embodiment, the second insulating material is a thermoplastic resin. As a result, when the first substrate body 40 and the second substrate body 15 are subjected to heat treatment and pressure treatment, the molten second insulator layer 16a penetrates into the irregularities on the surface of the first substrate body 40. As a result, the first substrate body 40 is closely attached to the second substrate body 15 and fixed to the second substrate body 15. As described above, the second positive principal surface S11 and the first negative principal surface S2 are in contact over a large area and are closely attached to each other. Therefore, the antenna module 10 can prevent a gap from being formed between the first substrate 12 and the second substrate 14.

[0030] Furthermore, the first ground conductor layer 20 overlaps with the radiation conductor layer 42 and the signal conductor layer 18. Therefore, the first ground conductor layer 20 exists in the first substrate area A1 and also outside the first substrate area A1. In this case, it is conceivable to provide the first ground conductor layer 20 on the first substrate 12 and also on the second substrate 14. However, the first ground conductor layer 20 is divided into multiple insulating layers and arranged.

[0031] Therefore, the first ground conductor layer 20 is located in the second substrate 14, not in the first substrate 12. Therefore, the first ground conductor layer 20 does not straddle the first substrate 12 and the second substrate 14. As a result, the first ground conductor layer 20 is located on the upper main surface of one second insulator layer 16b.

[0032] According to the antenna module 10, the radiating conductor layer 42 can be made smaller. More specifically, the dielectric constant of the second insulating material is lower than the dielectric constant of the first insulating material. In other words, the dielectric constant of the first insulating material is higher than the dielectric constant of the second insulating material. Therefore, a wavelength shortening effect occurs in the first substrate main body 40 on which the radiating conductor layer 42 is provided. As a result, the radiating conductor layer 42 can be made smaller.

[0033] The antenna module 10 improves the radiation efficiency of the antenna module 10. More specifically, the thickness of the second substrate 14 in the direction along the vertical axis is smaller than the thickness of the first substrate 12 in the direction along the vertical axis. In other words, the thickness of the first substrate 12 in the direction along the vertical axis is greater than the thickness of the second substrate 14 in the direction along the vertical axis. This increases the distance between the radiating conductor layer 42 and the first ground conductor layer 20. This makes it easier for the electromagnetic field near the radiating conductor layer 42 to leak from the first substrate 12. As a result, the radiation efficiency of the antenna module 10 improves.

[0034] In the antenna module 10, the radiating conductor layer 42 is located on the first main surface S1. This increases the distance between the radiating conductor layer 42 and the first ground conductor layer 20. As a result, the radiation efficiency of the antenna module 10 is improved.

[0035] The antenna module 10 can suppress variations in the distance between the radiating conductor layer 42 and the first ground conductor layer 20. More specifically, the Young's modulus of the second insulating material is lower than that of the first insulating material. In other words, the Young's modulus of the first insulating material is higher than that of the second insulating material. This makes it difficult for the first substrate body 40 to deform. As a result, variations in the distance between the radiating conductor layer 42 and the first ground conductor layer 20 can be suppressed.

[0036] According to the antenna module 10, the second substrate 14 is larger than the first substrate 12. This allows the second substrate 14 to be bent, so that the antenna module 10 can be placed in a gap having a curved shape.

[0037] In the antenna module 10, solder is not used to join the first substrate 12 and the second substrate 14. As a result, the thickness of the antenna module 10 in the direction along the vertical axis is determined by the thickness of the first substrate 12 in the vertical direction and the thickness of the second substrate 14 in the vertical direction. As a result, this suppresses variation in the distance between the radiating conductor layer 42 and the signal conductor layer 18, and reduces variation in the radiation characteristics of the antenna module 10.

[0038] In the antenna module 10, the first insulating material and the second insulating material are different. This allows an inexpensive material to be used for either the first insulating material or the second insulating material. As a result, the antenna module 10 can reduce its manufacturing costs.

[0039] (First Modification) An antenna module 10a according to a first modified example will be described below with reference to the drawings. Figure 4 is a cross-sectional view of the antenna module 10a.

[0040] The antenna module 10a differs from the antenna module 10 in that it further includes a third ground conductor layer 23 and a second interlayer connection conductor v2. The third ground conductor layer 23 is located on the upper main surface of the second insulator layer 16a. However, when viewed from below, the third ground conductor layer 23 is not provided in the first substrate region A1 where the first substrate main body 40 is provided.

[0041] The second interlayer connection conductor v2 electrically connects the first ground conductor layer 20 and the third ground conductor layer 23. The second interlayer connection conductor v2 penetrates the second insulator layer 16a along the up-down axis. The upper end of the second insulator layer 16a is in contact with the third ground conductor layer 23. The lower end of the second insulator layer 16a is in contact with the first ground conductor layer 20.

[0042] The first ground conductor layer 20 also has a third positive principal surface S31 and a third negative principal surface S32. The third negative principal surface S32 is located below (on the negative side of the Z axis) the third positive principal surface S31. The surface roughness of the third positive principal surface S31 is smaller than the surface roughness of the third negative principal surface S32.

[0043] The signal conductor layer 18 also has a fourth positive principal surface S41 and a fourth negative principal surface S42. The fourth negative principal surface S42 is located below the fourth positive principal surface S41. The surface roughness of the fourth positive principal surface S41 is smaller than the surface roughness of the fourth negative principal surface S42.

[0044] The second ground conductor layer 22 is located on the lower main surface of the second insulating layer 16d. The second ground conductor layer 22 has a fifth positive main surface S51 and a fifth negative main surface S52. The fifth negative main surface S52 is located below the fifth positive main surface S51. The surface roughness of the fifth negative main surface S52 is smaller than the surface roughness of the fifth positive main surface S51.

[0045] The third ground conductor layer 23 has a sixth positive principal surface S61 and a sixth negative principal surface S62. The sixth negative principal surface S62 is located below the sixth positive principal surface S61. The surface roughness of the sixth positive principal surface S61 is smaller than the surface roughness of the sixth negative principal surface S62. The other structures of the antenna module 10a are the same as those of the antenna module 10, and therefore a description thereof will be omitted. The antenna module 10a can achieve the same effects as the antenna module 10.

[0046] According to the antenna module 10a, the surface roughness of the third positive principal surface S31 is smaller than the surface roughness of the third negative principal surface S32. As a result, the radiating conductor layer 42 faces the third positive principal surface S31, which has a smaller surface roughness. This reduces power loss in the radiating conductor layer 42. Furthermore, when resonance occurs in the radiating conductor layer 42, loss due to resonant current flowing near the third positive principal surface S31 is reduced.

[0047] (Second Modification) An antenna module 10b according to a second modified example will be described below with reference to the drawings. Figure 5 is a cross-sectional view of the antenna module 10b.

[0048] Antenna module 10b differs from antenna module 10 in that a recess G is formed in second substrate main body 15, and first substrate 12 is positioned within recess G. More specifically, when first substrate 12 is fixed to second substrate 14, heat treatment and pressure treatment are performed on first substrate 12 and second substrate 14. At this time, second substrate 14 is pressed downward by first substrate 12 and deformed. As a result, recess G is formed in second substrate main body 15, and first substrate 12 is positioned within recess G.

[0049] Here, the first substrate body 40 has a first side surface S3 connecting the first positive principal surface S1 and the first negative principal surface S2. Since the first substrate 12 is positioned in the recess G, the first side surface S3 is in contact with the second substrate body 15.

[0050] The second substrate body 15 has a first section A11 that overlaps with the first substrate 12 when viewed downward (negative direction of the Z axis), and second sections A12a and A12b that do not overlap with the first substrate 12 when viewed downward (negative direction of the Z axis). The first positive main surface S1 and the second positive main surface S11 in the second sections A12a and A12b are included in a single plane. That is, the position of the up-down axis of the first positive main surface S1 is the same as the position of the up-down axis of the second positive main surface S11 in the second sections A12a and A12b.

[0051] Furthermore, portions of the first ground conductor layer 20 in the second sections A12a and A12b are located above the first negative principal surface S2 (on the positive side of the Z axis). The other structures of the antenna module 10b are the same as those of the antenna module 10, and therefore, description thereof will be omitted. The antenna module 10b can achieve the same effects as the antenna module 10.

[0052] The antenna module 10b improves the gain of the antenna module 10b. More specifically, the first ground conductor layer 20 is present on the front, rear, left, and right sides of the space between the radiation conductor layer 42 and the first ground conductor layer 20. That is, the space between the radiation conductor layer 42 and the first ground conductor layer 20 is surrounded by the first ground conductor layer 20 when viewed from below. This prevents the electromagnetic field from leaking from the space between the radiation conductor layer 42 and the first ground conductor layer 20. As a result, the gain of the antenna module 10b improves.

[0053] In the antenna module 10b, portions of the first ground conductor layer 20 in the second sections A12a and A12b are located above the first negative principal surface S2 (on the positive side of the Z axis). As a result, the space between the radiating conductor layer 42 and the first ground conductor layer 20 is surrounded by the first ground conductor layer 20 when viewed from below. Therefore, when multiple radiating conductor layers 42 are present, electromagnetic field coupling between the multiple radiating conductor layers 42 is suppressed.

[0054] In the antenna module 10b, the portion of the first ground conductor layer 20 located below the radiation conductor layer 42 is continuously connected to the portions of the first ground conductor layer 20 located in front of, behind, to the left and right of the radiation conductor layer 42. This eliminates the need for interlayer connection conductors with inductance components. As a result, the antenna module 10b achieves a broader bandwidth. Furthermore, the first ground conductor layer 20 surrounds the first substrate 12 when viewed from below. This prevents electric field leakage from the first side surface S3 of the first substrate 12, thereby suppressing noise generation.

[0055] In the antenna module 10b, the first main surface S1 and the second main surface S11 in the second sections A12a and A12b are included in a single plane. This makes the upper main surface of the antenna module 10b nearly flat. As a result, it becomes possible to arrange other components near the upper main surface of the antenna module 10b.

[0056] (Third Modification) An antenna module 10c according to a third modified example will be described below with reference to the drawings. Fig. 6 is a cross-sectional view of the antenna module 10c.

[0057] The antenna module 10c differs from the antenna module 10b in that the thickness of the first substrate body 40 in the direction along the up-down axis is greater. As a result, the first substrate body 40 protrudes upward from the second front main surface S11 of the second substrate body 15. The other structures of the antenna module 10c are the same as those of the antenna module 10b, and therefore a description thereof will be omitted. The antenna module 10c can achieve the same effects as the antenna module 10b.

[0058] In the antenna module 10c, the thickness of the first substrate body 40 in the direction along the vertical axis is large. This increases the distance between the radiation conductor layer 42 and the first ground conductor layer 20. As a result, the antenna module 10 c The radiation efficiency of the antenna is improved.

[0059] (Fourth Modification) An antenna module 10d according to a fourth modification will be described below with reference to the drawings. Fig. 7 is a cross-sectional view of the antenna module 10d.

[0060] Antenna module 10d differs from antenna module 10b in that the corner between first side surface S3 and first negative principal surface S2 is chamfered. In this embodiment, the corner between first side surface S3 and first negative principal surface S2 is chamfered. The other structure of antenna module 10d is the same as that of antenna module 10b, so a description thereof will be omitted. Antenna module 10d can achieve the same effects as antenna module 10b.

[0061] In the antenna module 10d, the corner between the first side surface S3 and the first negative principal surface S2 is chamfered, which reduces the amount of deformation of the second substrate body 15. Also, the first substrate body 40 and the second substrate body 15 are more closely attached to each other.

[0062] (Fifth Modification) An antenna module 10e according to a fifth modified example will be described below with reference to the drawings. Fig. 8 is a cross-sectional view of the antenna module 10e.

[0063] Antenna module 10e differs from antenna module 10b in that a step is provided at the corner between first side surface S3 and first negative principal surface S2. The other structure of antenna module 10e is the same as that of antenna module 10b, so a description thereof will be omitted. Antenna module 10e can achieve the same effects as antenna module 10b.

[0064] In the antenna module 10e, a step is provided at the corner between the first side surface S3 and the first negative principal surface S2. This reduces the amount of deformation of the second substrate body 15. Also, the first substrate body 40 and the second substrate body 15 are more closely attached to each other.

[0065] (Sixth Modification) An antenna module 10f according to a sixth modified example will be described below with reference to the drawings. Fig. 9 is a cross-sectional view of the antenna module 10f.

[0066] The antenna module 10f differs from the antenna module 10b in that the corner between the first side surface S3 and the first negative principal surface S2 is chamfered. In this embodiment, the corner between the first side surface S3 and the first negative principal surface S2 is rounded. The other structures of the antenna module 10f are the same as those of the antenna module 10b, so a description thereof will be omitted. The antenna module 10f can achieve the same effects as the antenna module 10b.

[0067] In the antenna module 10f, the corner between the first side surface S3 and the first negative principal surface S2 is chamfered, which reduces the amount of deformation of the second substrate body 15. Also, the first substrate body 40 and the second substrate body 15 are more closely attached to each other.

[0068] (Seventh Modification) An antenna module 10g according to the seventh modification will be described below with reference to the drawings. Fig. 10 is a cross-sectional view of the antenna module 10g.

[0069] Antenna module 10g differs from antenna module 10f in that the first insulating material is a thermoplastic resin. When the first insulating material is a thermoplastic resin, the corner between first side surface S3 and first negative principal surface S2 is deformed when first substrate 12 and second substrate 14 are subjected to pressure treatment and heat treatment. As a result, the corner between first side surface S3 and first negative principal surface S2 is rounded. The other structure of antenna module 10g is the same as that of antenna module 10f, so a description thereof will be omitted. Antenna module 10g can achieve the same effects as antenna module 10f.

[0070] In the antenna module 10g, the first insulating material is a thermoplastic resin. As a result, when the first substrate 12 and the second substrate 14 are subjected to pressure treatment and heat treatment, the angle between the first side surface S3 and the first negative principal surface S2 is deformed. This reduces the amount of deformation of the second substrate main body 15. Furthermore, the first substrate main body 40 and the second substrate main body 15 are more closely attached to each other.

[0071] (Eighth Modification) An antenna module 10h according to an eighth modification will be described below with reference to the drawings. Fig. 11 is a cross-sectional view of the antenna module 10h.

[0072] Antenna module 10h differs from antenna module 10b in that second section A12b of second substrate 14 is curved when viewed forward (in a direction perpendicular to the Z axis). The other structures of antenna module 10h are the same as those of antenna module 10b, and therefore will not be described. Antenna module 10h can achieve the same effects as antenna module 10b.

[0073] (Ninth Modification) An antenna module 10i according to a ninth modified example will be described below with reference to the drawings. Fig. 12 is an exploded perspective view of the antenna module 10i.

[0074] The antenna module 10i differs from the antenna module 10 in the following points. Instead of the radiating conductor layer 42, radiating conductor layers 42a and 42b are provided. The first substrate 12 further includes external electrodes 43a and 43b and interlayer connection conductors v11 and v12. The second substrate 14 further includes interlayer connection conductors v7 and v8.

[0075] The radiating conductor layers 42a and 42b are located on the first front main surface S1 of the first substrate body 40. The radiating conductor layers 42a and 42b have a rectangular shape when viewed from below. The radiating conductor layer 42a is located to the left of the ground conductor layer-free area A0a when viewed from below. The radiating conductor layer 42b is located to the right of the ground conductor layer-free area A0a when viewed from below.

[0076] The external electrodes 43a and 43b are located on the first negative principal surface S2 of the first substrate body 40. The external electrodes 43a and 43b have a rectangular shape when viewed downward. The external electrode 43a overlaps the radiating conductor layer 42a when viewed downward. The external electrode 43b overlaps the radiating conductor layer 42b when viewed downward. The entire external electrodes 43a and 43b overlap the first ground conductor layer 20 when viewed downward.

[0077] The interlayer connection conductor v11 electrically connects the radiation conductor layer 42a and the external electrode 43a. The interlayer connection conductor v11 penetrates the first substrate body 40 along the up-down axis. The upper end of the interlayer connection conductor v11 is in contact with the radiation conductor layer 42a. The lower end of the interlayer connection conductor v11 is in contact with the external electrode 43a.

[0078] The interlayer connection conductor v12 electrically connects the radiation conductor layer 42b and the external electrode 43b. The interlayer connection conductor v12 penetrates the first substrate body 40 along the up-down axis. The upper end of the interlayer connection conductor v12 is in contact with the radiation conductor layer 42b. The lower end of the interlayer connection conductor v12 is in contact with the external electrode 43b.

[0079] The interlayer connection conductor v7 electrically connects the first ground conductor layer 20 and the external electrode 43a. The interlayer connection conductor v7 penetrates the second insulator layer 16a along the up-down axis. The upper end of the interlayer connection conductor v7 is exposed on the upper main surface of the second insulator layer 16a. The upper end of the interlayer connection conductor v7 is in contact with the external electrode 43a. The lower end of the interlayer connection conductor v7 is in contact with the first ground conductor layer 20.

[0080] The interlayer connection conductor v8 electrically connects the first ground conductor layer 20 and the external electrode 43b. a The interlayer connection conductor v8 penetrates the first ground conductor layer 20 along the vertical axis. The upper end of the interlayer connection conductor v8 is exposed on the upper main surface of the second insulating layer 16a. The upper end of the interlayer connection conductor v8 is in contact with the external electrode 43b. The lower end of the interlayer connection conductor v8 is in contact with the first ground conductor layer 20.

[0081] The other structures of the antenna module 10i are the same as those of the antenna module 10b, and therefore a description thereof will be omitted. The antenna module 10i can achieve the same effects as the antenna module 10b.

[0082] The antenna module 10i is provided with interlayer connection conductors v11 and v12, which increases the degree of freedom in designing the antenna including the radiation conductor layer 42. As a result, the degree of freedom in designing the directivity of the antenna module 10i increases.

[0083] (Tenth Modification) An antenna module 10j according to a tenth modification will be described below with reference to the drawings. Fig. 13 is a cross-sectional view of the antenna module 10j.

[0084] The antenna module 10j differs from the antenna module 10b in that it includes three first substrates 12. In this manner, the antenna module 10j may include a plurality of radiation conductor layers .

[0085] (Eleventh Modification) An antenna module 10k according to an eleventh modification will be described below with reference to the drawings. FIG. 14 is a top view of the first substrate 12. As shown in FIG.

[0086] The antenna module 10k differs from the antenna module 10b in the shape of the first substrate body 40. When viewed from below, the four corners of the first substrate body 40 are chamfered. More specifically, when viewed from below, the four corners of the first substrate body 40 are rounded. The other structures of the antenna module 10k are the same as those of the antenna module 10b, and therefore a description thereof will be omitted. The antenna module 10k can achieve the same effects as the antenna module 10b.

[0087] In the antenna module 10k, the four corners of the first substrate body 40 are chamfered when viewed from below. This reduces the amount of deformation of the second substrate body 15. Also, the first substrate body 40 and the second substrate body 15 are more closely attached to each other.

[0088] (Twelfth Modification) An antenna module 101 according to a twelfth modification will be described below with reference to the drawings. Fig. 15 is a top view of the antenna module 101. Fig. 15 shows the state before the first substrate 12 is fixed to the second substrate 14.

[0089] The antenna module 10l differs from the antenna module 10b in that the first ground conductor layer 20 has cutouts C1 to C4. The cutout C1 is provided near the left front corner of the first substrate main body 40. The cutout C2 is provided near the right front corner of the first substrate main body 40. The cutout C3 is provided near the left rear corner of the first substrate main body 40. The cutout C4 is provided near the right rear corner of the first substrate main body 40. The other structures of the antenna module 10l are the same as those of the antenna module 10b, so a description thereof will be omitted. The antenna module 10l can achieve the same effects as the antenna module 10b.

[0090] In the antenna module 10l, notches C1 to C4 are provided in the first ground conductor layer 20. This prevents wrinkles from occurring in the first ground conductor layer 20 near the four corners of the first substrate main body 40 when the first substrate 12 is fixed to the second substrate 14.

[0091] (Other embodiments) The antenna module according to the present invention is not limited to the antenna modules 10, 10a to 10l and can be modified within the scope of the invention. The structures of the antenna modules 10, 10a to 10l may be combined arbitrarily.

[0092] It is sufficient that at least one of the first insulating material and the second insulating material is a thermoplastic resin. Therefore, the second insulating material may not be a thermoplastic resin, and the first insulating material may be a thermoplastic resin.

[0093] The first insulating material and the second insulating material may be the same material, in which case warping of the first substrate 12 and the second substrate 14 is suppressed.

[0094] The number of first ground conductor layers is not limited to one. The number of first ground conductor layers may be one or more. When the number of first ground conductor layers is two, a ground conductor layer-free area A0a is formed between the two first ground conductor layers. In this case, the ground conductor layer-free area A0a is not surrounded by the first ground conductor layers. For example, when viewed from below, no first ground conductor layers exist in front of or behind the ground conductor layer-free area A0a. Furthermore, when viewed from below, each of the two first ground conductor layers partially overlaps with the radiation conductor layer 42.

[0095] The dielectric constant of the second insulating material may be equal to or greater than the dielectric constant of the first insulating material, which reduces the capacitance between the radiation conductor layer 42 and the first ground conductor layer 20. As a result, the radiation efficiency of the antenna module is improved.

[0096] The surface roughness of the third positive principal surface S31 may be equal to or greater than the surface roughness of the third negative principal surface S32.

[0097] The thickness of the second substrate 14 in the direction along the vertical axis may be equal to or greater than the thickness of the first substrate 12 in the direction along the vertical axis.

[0098] The Young's modulus of the second insulating material may be equal to or greater than the Young's modulus of the first insulating material.

[0099] The radiating conductor layer 42 may be located inside the first substrate body 40. In this case, the radiating conductor layer 42 is protected by the first substrate body 40.

[0100] The radiating conductor layer 42 may be located on the first negative principal surface S2 of the first substrate body 40. In this case, the electromagnetic field coupling between the radiating conductor layer 42 and the signal conductor layer 18 becomes stronger.

[0101] The thickness of the first substrate body 40 in the direction along the vertical axis is greater than the thickness of the second substrate body 15 in the direction along the vertical axis. Therefore, when the first substrate body 40 has a structure in which a plurality of first insulator layers are stacked, the number of sheets can be reduced by making the thickness of the first insulator layers greater than the thickness of the second insulator layers 16a to 16d.

[0102] The second ground conductor layer 22 is not an essential component.

[0103] In addition, a plurality of first interlayer connecting conductors v1 may be provided in the antenna modules 10, 10a to 10l.

[0104] The present invention has the following structure.

[0105] (1) An antenna module comprising a first substrate and a second substrate, The first substrate is a first substrate body including a first insulating material; a radiation conductor layer provided on the first substrate body; It contains The second substrate is a second substrate body having a structure in which a plurality of second insulator layers containing a second insulating material are stacked in a direction along the Z axis; a signal conductor layer provided on the second substrate body; one or more first ground conductor layers provided on the second substrate body; It contains At least one of the first insulating material and the second insulating material is a thermoplastic resin; the first substrate body has a first positive main surface and a first negative main surface located on the negative side of the Z axis from the first positive main surface, the second substrate body has a second positive main surface and a second negative main surface located on the negative side of the Z axis from the second positive main surface, the second positive principal surface is in contact with the first negative principal surface; the one or more first ground conductor layers are located on the positive side of the Z axis relative to the signal conductor layer; the one or more first ground conductor layers are not located on the second main surface; a portion of each of the one or more first ground conductor layers overlaps with the radiation conductor layer when viewed in the negative direction of the Z axis; a first substrate region in which the first substrate is provided includes a ground conductor layer-free region in which the one or more first ground conductor layers are not provided, when viewed in the negative direction of the Z axis; When viewed in the negative direction of the Z axis, the signal conductor layer overlaps the area where the ground conductor layer is not formed, In the ground conductor layer-free region, there is no conductor covering the entire ground conductor layer-free region other than the radiation conductor layer on the positive side of the signal conductor layer along the Z axis. Antenna module.

[0106] (2) The dielectric constant of the second insulating material is lower than the dielectric constant of the first insulating material. The antenna module according to (1).

[0107] (3) the first ground conductor layer has a third positive principal surface and a third negative principal surface located on the negative side of the Z axis from the third positive principal surface, The surface roughness of the third positive principal surface is smaller than the surface roughness of the third negative principal surface. An antenna module according to either (1) or (2).

[0108] (4) The thickness of the second substrate in the direction along the Z axis is smaller than the thickness of the first substrate in the direction along the Z axis. An antenna module according to any one of (1) to (3).

[0109] (5) The Young's modulus of the second insulating material is lower than the Young's modulus of the first insulating material. An antenna module according to any one of (1) to (4).

[0110] (6) the first substrate body has a first side surface connecting the first positive main surface and the first negative main surface, the first side surface is in contact with the second substrate body; An antenna module according to any one of (1) to (5).

[0111] (7) the second substrate body has a first section that overlaps with the first substrate when viewed in the negative direction of the Z axis, and a second section that does not overlap with the first substrate when viewed in the negative direction of the Z axis, a portion of the first ground conductor layer in the second section is located on the positive side of the Z axis from the first negative principal surface; (6) The antenna module according to (6).

[0112] (8) the second substrate body has a first section that overlaps with the first substrate when viewed in the negative direction of the Z axis, and a second section that does not overlap with the first substrate when viewed in the negative direction of the Z axis, The first main surface and the second main surface in the second section are included in one plane. The antenna module according to (6) or (7).

[0113] (9) A corner between the first side surface and the first negative principal surface is chamfered. An antenna module according to any one of (6) to (8).

[0114] (10) A step is provided at a corner between the first side surface and the first negative principal surface. An antenna module according to any one of (6) to (8).

[0115] (11) The first insulating material is a thermoplastic resin. An antenna module according to any one of (1) to (10).

[0116] (12) The second insulating material is a thermoplastic resin. An antenna module according to any one of (1) to (10).

[0117] (13) the second substrate has a first section that overlaps with the first substrate when viewed in the negative direction of the Z axis, and a second section that does not overlap with the first substrate when viewed in the negative direction of the Z axis, the second section of the second substrate is curved when viewed in a direction perpendicular to the Z axis; An antenna module according to any one of (1) to (12).

[0118] (14) the signal conductor layer extends along the X-axis; the Y axis is perpendicular to the X axis and the Z axis; the length of the ground conductor layer-free area in the direction along the Y axis is equal to or less than half the wavelength of a high-frequency signal transmitted through the signal conductor layer; An antenna module according to any one of (1) to (13).

[0119] (15) the signal conductor layer extends along the X-axis; the Y axis is perpendicular to the X axis and the Z axis; the ground conductor layer-free region is surrounded by the first ground conductor layer when viewed in the negative direction of the Z axis. An antenna module according to any one of (1) to (14).

[0120] (16) The second substrate is a second ground conductor layer provided on the second substrate body, It also has the second ground conductor layer is located on the negative side of the Z axis relative to the signal conductor layer, the second ground conductor layer overlaps with the radiation conductor layer when viewed in the negative direction of the Z axis. An antenna module according to any one of (1) to (15). [Explanation of symbols]

[0121] 10, 10a to 10l: Antenna module 12: First board 14: Second board 15: Second board body 16a to 16d: second insulating layer 18: Signal conductor layer 20: First ground conductor layer 22: Second ground conductor layer 23: Third ground conductor layer 40: First substrate body 42, 42a, 42b: Radiating conductor layer 43a, 43b: External electrode A0a: Area without ground conductor layer A1: 1st board area A11: First section A12a, A12b: Section 2 G: Depression S1: First main surface S11: 2nd main surface S12: 2nd negative principal surface S2: 1st negative principal surface S3: 1st side S31: 3rd main surface S32: 3rd negative principal surface S41: Fourth main surface S42: 4th negative principal plane S51: 5th main surface S52: 5th negative principal surface S61: 6th main surface S62: 6th negative principal surface

Claims

1. An antenna module comprising a first substrate and a second substrate, The first substrate is a first substrate body including a first insulating material; a radiation conductor layer provided on the first substrate body; It contains The second substrate is a second substrate body having a structure in which a plurality of second insulator layers containing a second insulating material are stacked in a direction along the Z axis; a signal conductor layer provided on the second substrate body; one or more first ground conductor layers provided on the second substrate body; It contains At least one of the first insulating material and the second insulating material is a thermoplastic resin; the first substrate body has a first positive main surface and a first negative main surface located on the negative side of the Z axis from the first positive main surface, the second substrate body has a second positive main surface and a second negative main surface located on the negative side of the Z axis from the second positive main surface, the second positive major surface is in contact with the first negative major surface; the one or more first ground conductor layers are located on the positive side of the Z axis relative to the signal conductor layer; the one or more first ground conductor layers are not located on the second main surface, a portion of each of the one or more first ground conductor layers overlaps with the radiation conductor layer when viewed in the negative direction of the Z axis; a ground conductor layer-free region in which the one or more first ground conductor layers are not provided exists in the first substrate region in which the first substrate is provided, as viewed in the negative direction of the Z axis; When viewed in the negative direction of the Z axis, the signal conductor layer overlaps the area where the ground conductor layer is not formed, in the ground conductor layer-free region, there is no conductor covering the entire ground conductor layer-free region other than the radiation conductor layer on the positive side of the signal conductor layer along the Z axis, The dielectric constant of the second insulating material is lower than the dielectric constant of the first insulating material. Antenna module.

2. An antenna module comprising a first substrate and a second substrate, The first substrate is a first substrate body including a first insulating material; a radiation conductor layer provided on the first substrate body; It contains The second substrate is a second substrate body having a structure in which a plurality of second insulator layers containing a second insulating material are stacked in a direction along the Z axis; a signal conductor layer provided on the second substrate body; one or more first ground conductor layers provided on the second substrate body; It contains At least one of the first insulating material and the second insulating material is a thermoplastic resin; the first substrate body has a first positive main surface and a first negative main surface located on the negative side of the Z axis from the first positive main surface, the second substrate body has a second positive main surface and a second negative main surface located on the negative side of the Z axis from the second positive main surface, the second positive major surface is in contact with the first negative major surface; the one or more first ground conductor layers are located on the positive side of the Z axis relative to the signal conductor layer; the one or more first ground conductor layers are not located on the second main surface, a portion of each of the one or more first ground conductor layers overlaps with the radiation conductor layer when viewed in the negative direction of the Z axis; a ground conductor layer-free region in which the one or more first ground conductor layers are not provided exists in the first substrate region in which the first substrate is provided, as viewed in the negative direction of the Z axis; When viewed in the negative direction of the Z axis, the signal conductor layer overlaps the area where the ground conductor layer is not formed, in the ground conductor layer-free region, there is no conductor covering the entire ground conductor layer-free region other than the radiation conductor layer on the positive side of the signal conductor layer along the Z axis, the first ground conductor layer has a third positive principal surface and a third negative principal surface located on the negative side of the Z axis relative to the third positive principal surface, the surface roughness of the third positive principal surface is smaller than the surface roughness of the third negative principal surface; Antenna module.

3. An antenna module comprising a first substrate and a second substrate, The first substrate is a first substrate body including a first insulating material; a radiation conductor layer provided on the first substrate body; It contains The second substrate is a second substrate body having a structure in which a plurality of second insulator layers containing a second insulating material are stacked in a direction along the Z axis; a signal conductor layer provided on the second substrate body; one or more first ground conductor layers provided on the second substrate body; It contains At least one of the first insulating material and the second insulating material is a thermoplastic resin; the first substrate body has a first positive main surface and a first negative main surface located on the negative side of the Z axis from the first positive main surface, the second substrate body has a second positive main surface and a second negative main surface located on the negative side of the Z axis from the second positive main surface, the second positive major surface is in contact with the first negative major surface; the one or more first ground conductor layers are located on the positive side of the Z axis relative to the signal conductor layer; the one or more first ground conductor layers are not located on the second main surface, a portion of each of the one or more first ground conductor layers overlaps with the radiation conductor layer when viewed in the negative direction of the Z axis; a ground conductor layer-free region in which the one or more first ground conductor layers are not provided exists in the first substrate region in which the first substrate is provided, as viewed in the negative direction of the Z axis; When viewed in the negative direction of the Z axis, the signal conductor layer overlaps the area where the ground conductor layer is not formed, in the ground conductor layer-free region, there is no conductor covering the entire ground conductor layer-free region other than the radiation conductor layer on the positive side of the signal conductor layer along the Z axis, The Young's modulus of the second insulating material is lower than the Young's modulus of the first insulating material. Antenna module.

4. An antenna module comprising a first substrate and a second substrate, The first substrate is a first substrate body including a first insulating material; a radiation conductor layer provided on the first substrate body; It contains The second substrate is a second substrate body having a structure in which a plurality of second insulator layers containing a second insulating material are stacked in a direction along the Z axis; a signal conductor layer provided on the second substrate body; one or more first ground conductor layers provided on the second substrate body; It contains At least one of the first insulating material and the second insulating material is a thermoplastic resin; the first substrate body has a first positive main surface and a first negative main surface located on the negative side of the Z axis from the first positive main surface, the second substrate body has a second positive main surface and a second negative main surface located on the negative side of the Z axis from the second positive main surface, the second positive major surface is in contact with the first negative major surface; the one or more first ground conductor layers are located on the positive side of the Z axis relative to the signal conductor layer; the one or more first ground conductor layers are not located on the second main surface, a portion of each of the one or more first ground conductor layers overlaps with the radiation conductor layer when viewed in the negative direction of the Z axis; a ground conductor layer-free region in which the one or more first ground conductor layers are not provided exists in the first substrate region in which the first substrate is provided, as viewed in the negative direction of the Z axis; When viewed in the negative direction of the Z axis, the signal conductor layer overlaps the area where the ground conductor layer is not formed, in the ground conductor layer-free region, there is no conductor covering the entire ground conductor layer-free region other than the radiation conductor layer on the positive side of the signal conductor layer along the Z axis, the first substrate body has a first side surface connecting the first positive main surface and the first negative main surface, the first side surface is in contact with the second substrate body; Antenna module.

5. a thickness of the second substrate in a direction along the Z axis is smaller than a thickness of the first substrate in a direction along the Z axis; 5. The antenna module according to claim 1.

6. the second substrate body has a first section that overlaps with the first substrate when viewed in the negative direction of the Z axis, and a second section that does not overlap with the first substrate when viewed in the negative direction of the Z axis, a portion of the first ground conductor layer in the second section is located on the positive side of the Z axis from the first negative principal surface; The antenna module according to claim 4 .

7. the second substrate body has a first section that overlaps with the first substrate when viewed in the negative direction of the Z axis, and a second section that does not overlap with the first substrate when viewed in the negative direction of the Z axis, The first main surface and the second main surface in the second section are included in one plane. The antenna module according to claim 4 or 6.

8. A corner between the first side surface and the first negative principal surface is chamfered. The antenna module according to claim 4 or 6.

9. a step is provided at a corner between the first side surface and the first negative principal surface; The antenna module according to claim 4 or 6.

10. the first insulating material is a thermoplastic resin; 7. The antenna module according to claim 1, wherein the antenna module is a semiconductor integrated circuit.

11. the second insulating material is a thermoplastic resin; 7. The antenna module according to claim 1, wherein the antenna module is a semiconductor integrated circuit.

12. the second substrate has a first section that overlaps with the first substrate when viewed in the negative direction of the Z axis, and a second section that does not overlap with the first substrate when viewed in the negative direction of the Z axis, the second section of the second substrate is curved when viewed in a direction perpendicular to the Z axis; 7. The antenna module according to claim 1, wherein the antenna module is a semiconductor integrated circuit.

13. the signal conductor layer extends along the X-axis, The Y axis is perpendicular to the X axis and the Z axis, the length of the ground conductor layer-free area in the direction along the Y axis is equal to or less than half the wavelength of a high-frequency signal transmitted through the signal conductor layer; 7. The antenna module according to claim 1, wherein the antenna module is a semiconductor integrated circuit.

14. the signal conductor layer extends along the X-axis, The Y axis is perpendicular to the X axis and the Z axis, the ground conductor layer-free region is surrounded by the first ground conductor layer when viewed in the negative direction of the Z axis.

7. The antenna module according to claim 1, wherein the antenna module is a semiconductor integrated circuit.

15. The second substrate is a second ground conductor layer provided on the second substrate body, It also has the second ground conductor layer is located on the negative side of the Z axis relative to the signal conductor layer, the second ground conductor layer overlaps the radiation conductor layer when viewed in the negative direction of the Z axis.

7. The antenna module according to claim 1, wherein the antenna module is a semiconductor integrated circuit.

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