Antenna module and communication device equipped with same

Abstract

An antenna module (100) comprises a dielectric substrate (105), a radiation element (121B), and ground electrodes (GND1, GND2). The dielectric substrate (105) includes flat portions (130A, 130B) that have normal directions different from each other, and a bent portion (135) that connects between the respective flat portions (130A, 130B). The radiation element (121B) has a flat plate shape and is disposed on the flat portion (130B). The ground electrode (GND1) is disposed on the flat portion (130B) so as to face the radiation element (121B). The ground electrode (GND2) is disposed on the flat portion (130A). Each of the flat portions (130A, 130B) has a first main surface and a second main surface that face each other. The flat portion (130B) includes a region (RG1) to which the bent portion (135) is connected, and a region (RG2) disposed on the flat portion (130A) side of the region (RG1). When the normal direction of the flat portion (130B) is defined as a first direction and the normal direction of the flat portion (130A) is defined as a second direction, the dimension of the flat portion (130A) in the second direction is larger than the dimension of the region (RG1) in the first direction and smaller than the sum of the dimensions of the region (RG1) and the region (RG2) in the first direction.

Description

[Technical Field]

[0001] The present disclosure relates to an antenna module and a communication device equipped with the same, and more particularly to a technique for improving the antenna characteristics of the antenna module. [Background technology]

[0002] WO 2020 / 170722 (Patent Document 1) discloses an antenna module that uses a bent dielectric substrate to emit radio waves in two directions. In the antenna module described in WO 2020 / 170722 (Patent Document 1), the dielectric substrate has a first flat portion mounted on a mounting substrate and a second flat portion connected to the first flat portion via a bent portion, and a radiating element is disposed on each flat portion. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2020 / 170722 Summary of the Invention [Problem to be solved by the invention]

[0004] Antenna modules having the configuration described in International Publication No. 2020 / 170722 (Patent Document 1) are sometimes used in small portable communication devices such as mobile phones and smartphones. There remains a strong need for further miniaturization and thinning of such communication devices, and as functionality becomes more sophisticated, the density of equipment inside the devices tends to increase, which may limit the area occupied by the antenna module inside the device. Therefore, further miniaturization of the antenna module itself is desired.

[0005] On the other hand, when miniaturizing the antenna module, changing the shape or dimensions of the dielectric substrate may actually degrade the antenna characteristics.

[0006] The present disclosure has been made to solve such problems, and its purpose is to achieve miniaturization while suppressing degradation of antenna characteristics in an antenna module having a dielectric substrate with two flat portions connected via a bent portion. [Means for solving the problem]

[0007] The antenna module according to the present disclosure includes a dielectric substrate, a first radiating element, a first ground electrode, and a second ground electrode. The dielectric substrate includes a first flat portion and a second flat portion having different normal directions, and a bent portion connecting the first flat portion and the second flat portion. The first radiating element has a flat plate shape and is disposed on the first flat portion. The first ground electrode is disposed on the first flat portion so as to face the first radiating element. The second ground electrode is disposed on the second flat portion. The first flat portion and the second flat portion each have a first main surface and a second main surface that face each other. The first flat portion includes a first region to which the bent portion is connected and a second region disposed on the second flat portion side of the first region. When the normal direction of the first flat portion is defined as a first direction and the normal direction of the second flat portion is defined as a second direction, the dimension of the second flat portion in the second direction is larger than the dimension of the first region in the first direction and smaller than the sum of the dimensions of the first region and the second region in the first direction. [Effects of the Invention]

[0008] In the antenna module according to the present disclosure, the thickness of the first region of the first flat portion connected to the second flat portion via the bent portion is thinner than the thickness of the second flat portion, and the sum of the thicknesses of the first and second regions of the first flat portion is thicker than the thickness of the second flat portion. This allows the dimension of the antenna module in the normal direction of the first flat portion to be reduced while ensuring the distance between the radiating element and the ground electrode in the first flat portion. Therefore, in an antenna module including a dielectric substrate having two flat portions connected via a bent portion, it is possible to achieve miniaturization while suppressing degradation of antenna characteristics. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic overall view of a communication device to which an antenna module according to a first embodiment is applied. [Figure 2] FIG. 1 is a perspective view of an antenna module according to a first embodiment. [Figure 3] FIG. 3 is a side perspective view of the antenna module of FIG. 2. [Figure 4] FIG. 10 is a side perspective view of the antenna module according to the second embodiment. [Figure 5] 1A and 1B are diagrams illustrating a first configuration example of a dielectric body attached to a dielectric substrate. [Figure 6] FIG. 10 is a diagram showing a second configuration example of a dielectric body attached to a dielectric substrate. [Figure 7] FIG. 11 is a side perspective view of an antenna module according to a third embodiment. [Figure 8] FIG. 8 is a plan view of the antenna module of FIG. 7. [Figure 9] FIG. 11 is a side perspective view of an antenna module according to a fourth embodiment. [Figure 10] FIG. 13 is a side perspective view of the antenna module according to the fifth embodiment. [Figure 11] 11 is a plan view of a flat portion 130B in the antenna module of FIG. 10. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated.

[0011] [Embodiment 1] (Basic configuration of communication equipment) 1 is a block diagram of a communication device 10 to which an antenna module 100 according to a first embodiment is applied. The communication device 10 is, for example, a mobile terminal such as a mobile phone, a smartphone, or a tablet, or a personal computer with a communication function. An example of the frequency band of radio waves used in the antenna module 100 according to the first embodiment is millimeter-wave radio waves with center frequencies of 28 GHz, 39 GHz, and 60 GHz, but radio waves in other frequency bands are also applicable.

[0012] 1, a communication device 10 includes an antenna module 100 and a BBIC 200 that constitutes a baseband signal processing circuit. The antenna module 100 includes an RFIC 110 that supplies a high-frequency signal, and an antenna device 120. The communication device 10 up-converts a signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and radiates the signal from the antenna device 120, and also down-converts a high-frequency signal received by the antenna device 120 and processes the signal in the BBIC 200.

[0013] Antenna device 120 includes dielectric substrate 105 having two flat portions 130A and 130B. At least one radiating element is arranged on each substrate of dielectric substrate 105. FIG. 1 shows an example in which four radiating elements 121A are arranged on flat portion 130A and four radiating elements 121B are arranged on flat portion 130B, but the number of radiating elements arranged on each substrate is not limited to this. Also, FIG. 1 shows an example in which radiating elements are arranged in a one-dimensional array on each substrate of the dielectric substrate, but radiating elements may be arranged in a two-dimensional array on each substrate. Alternatively, a single radiating element may be arranged on each substrate. In the first embodiment, radiating elements 121A and 121B are patch antennas having a substantially square flat plate shape.

[0014] The RFIC 110 includes switches 111A to 111H, 113A to 113H, 117A, and 117B, power amplifiers 112AT to 112HT, low-noise amplifiers 112AR to 112HR, attenuators 114A to 114H, phase shifters 115A to 115H, signal combiners / dividers 116A and 116B, mixers 118A and 118B, and amplifier circuits 119A and 119B. Of these, the configuration of switches 111A to 111D, 113A to 113D, 117A, power amplifiers 112AT to 112DT, low-noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, signal combiner / divider 116A, mixer 118A, and amplifier circuit 119A constitutes a circuit for the high-frequency signal radiated from radiating element 121A of flat portion 130A. Furthermore, the configuration of the switches 111E to 111H, 113E to 113H, and 117B, the power amplifiers 112ET to 112HT, the low-noise amplifiers 112ER to 112HR, the attenuators 114E to 114H, the phase shifters 115E to 115H, the signal combiner / divider 116B, the mixer 118B, and the amplifier circuit 119B constitutes a circuit for the high-frequency signal radiated from the radiating element 121B of the flat portion 130B.

[0015] When transmitting a high frequency signal, the switches 111A to 111H and 113A to 113H are switched to the power amplifiers 112AT to 112HT side, and the switches 117A and 117B are connected to the transmission amplifiers of the amplifier circuits 119A and 119B. When receiving a high frequency signal, the switches 111A to 111H and 113A to 113H are switched to the low noise amplifiers 112AR to 112HR side, and the switches 117A and 117B are connected to the reception amplifiers of the amplifier circuits 119A and 119B.

[0016] The signal transmitted from the BBIC 200 is amplified by amplifier circuits 119A and 119B and up-converted by mixers 118A and 118B. The up-converted high-frequency transmission signal is divided into four by signal combiners / dividers 116A and 116B, passes through the corresponding signal paths, and is fed to different radiating elements 121A and 121B. By individually adjusting the phase shift of phase shifters 115A to 115H arranged on each signal path, it is possible to adjust the directivity of the radio waves output from the radiating elements of each board. In addition, attenuators 114A to 114D adjust the strength of the transmission signal.

[0017] The received signals, which are high-frequency signals received by the radiating elements 121A and 121B, are transmitted to the RFIC 110 and then combined in the signal combiners / dividers 116A and 116B via four different signal paths. The combined received signals are down-converted in the mixers 118A and 118B, and further amplified in the amplifier circuits 119A and 119B before being transmitted to the BBIC 200.

[0018] The RFIC 110 is formed, for example, as a one-chip integrated circuit component including the above circuit configuration. Alternatively, the devices (switches, power amplifiers, low-noise amplifiers, attenuators, phase shifters) corresponding to the radiating elements 121A and 121B in the RFIC 110 may be formed as one-chip integrated circuit components for each corresponding radiating element.

[0019] (Antenna module configuration) Next, the configuration of the antenna module 100 according to this embodiment will be described in detail with reference to Fig. 2 and Fig. 3. Fig. 2 is a perspective view of the antenna module 100. Fig. 3 is a side see-through view of the antenna module 100 mounted on a mounting substrate 20.

[0020] 2 and 3, antenna module 100 includes, in addition to dielectric substrate 105, radiating elements 121A and 121B, and RFIC 110, connector 180, feed lines 171 and 172, and ground electrodes GND1 and GND2. In the following description, the normal direction to flat portion 130A is defined as the Z-axis direction, the normal direction to flat portion 130B is defined as the X-axis direction, and the arrangement direction of the radiating elements on each substrate is defined as the Y-axis direction. In each figure, the positive direction of the Z-axis may be referred to as the upper surface side, and the negative direction may be referred to as the lower surface side.

[0021] Dielectric substrate 105 is, for example, a low temperature co-fired ceramics (LTCC) multilayer substrate, a multilayer resin substrate formed by laminating multiple resin layers made of resin such as epoxy or polyimide, a multilayer resin substrate formed by laminating multiple resin layers made of liquid crystal polymer (LCP) having a lower dielectric constant, a multilayer resin substrate formed by laminating multiple resin layers made of fluorine-based resin, or a ceramic multilayer substrate other than LTCC. Note that dielectric substrate 105 does not necessarily have a multilayer structure and may be a single-layer substrate.

[0022] In antenna device 120 of antenna module 100, dielectric substrate 105 has a substantially L-shaped cross section and includes flat portion 130A having a plate-like shape whose normal direction is the Z-axis direction in Figures 2 and 3, flat portion 130B having a plate-like shape whose normal direction is the X-axis direction in Figures 2 and 3, and bent portion 135 connecting the two flat portions 130A and 130B. Note that in the first embodiment, flat portion 130B corresponds to the "first flat portion" of the present disclosure, and flat portion 130A corresponds to the "second flat portion" of the present disclosure.

[0023] In the antenna module 100, four radiating elements are arranged in a row in the Y-axis direction on each of the two flat portions 130A, 130B. In the following description, for ease of understanding, an example will be described in which the radiating elements 121A, 121B are arranged so as to be exposed on the surfaces of the flat portions 130A, 130B, but the radiating elements 121A, 121B may also be arranged inside the flat portions 130A, 130B.

[0024] The flat portion 130A has a substantially rectangular shape, and four radiating elements 121A are arranged in a row in the Y-axis direction on its upper main surface 131. A SiP (System In Package) module 125 incorporating an RFIC 110 and a power module IC (not shown), and a connector 180 are connected to a lower main surface 132 side of the flat portion 130A (the surface in the negative direction of the Z-axis). The flat portion 130A is mounted on the mounting board 20 by connecting the connector 180 to a connector 185 arranged on the surface 21 of the mounting board 20. The flat portion 130A may also be mounted on the mounting board 20 by soldering.

[0025] A ground electrode GND2 is arranged over the entire surface of the flat portion 130A on the inner layer of the flat portion 130A on the side of the main surface 132 facing the mounting substrate 20. The ground electrode GND2 extends from the flat portion 130A to the bent portion 135.

[0026] A high-frequency signal is transmitted from RFIC 110 in SiP module 125 to radiating element 121A of flat portion 130A via feeder wiring 171. Feeder wiring 171 is connected to feed point SP1 that is offset in the negative direction of the X-axis from the center of radiating element 121A. By supplying a high-frequency signal to radiating element 121A via feeder wiring 171, a radio wave polarized in the X-axis direction is radiated in the positive direction of the Z-axis.

[0027] The flat portion 130B is connected to a bent portion 135 bent from the flat portion 130A, and is disposed so that its inner main surface 138 (the surface in the negative direction of the X-axis) faces the side surface 22 of the mounting substrate 20. The flat portion 130B is configured such that a plurality of notches 136 are formed in a substantially rectangular dielectric substrate, and the bent portion 135 is connected to the notches 136. In other words, in a portion of the flat portion 130B where the notches 136 are not formed, a protruding portion 133 is formed. The protruding portion 133 protrudes from a boundary portion 134 where the bent portion 135 and the flat portion 130B are connected, along the flat portion 130B, in a direction toward the flat portion 130A (i.e., in the positive direction of the Z-axis). The protruding end of the protruding portion 133 is positioned in the positive direction of the Z-axis relative to the main surface 132 of the flat portion 130A.

[0028] Radiating element 121B is arranged on main surface 137 of flat portion 130B in correspondence with radiating element 121A arranged on flat portion 130A. In antenna module 100, radiating element 121B is not arranged on protruding portion 133. When viewed from a plane normal to flat portion 130A, multiple radiating elements 121B are arranged side by side in the X-axis direction relative to radiating element 121A.

[0029] The flat portion 130B of the antenna module 100 has two regions in the normal direction (i.e., the X-axis direction). More specifically, it has a region RG1 (first region) to which the bent portion 135 is connected, and a region RG2 (second region) on the main surface 138 side of the region RG1. In the antenna module 100, the regions RG1 and RG2 are integrally formed of the same material.

[0030] The thickness (dimension in the Z-axis direction) of flat portion 130A is thicker than the thickness (dimension in the X-axis direction) of region RG1 in flat portion 130B. On the other hand, the thickness of flat portion 130A is thinner than the thickness of flat portion 130B, that is, the sum of the thicknesses of region RG1 and region RG2.

[0031] In the flat portion 130B, a ground electrode GND1 is arranged on an inner layer on the side of the main surface 138. The ground electrode GND1 is connected to a ground electrode GND2 arranged in the bent portion 135 by a via VG1 that extends in the X-axis direction in the flat portion 130B.

[0032] A high-frequency signal is transmitted from RFIC 110 to radiating element 121B on flat portion 130B via feed line 172. Feed line 172 runs from RFIC 110 through flat portion 130A, bent portion 135, and the inside of the dielectric of flat portion 130B, and is connected to radiating element 121B arranged on flat portion 130B. Feed line 172 is connected to feed point SP2, which is offset from the center of radiating element 121B in the negative direction of the Y-axis. By supplying a high-frequency signal to radiating element 121B via feed line 172, a radio wave polarized in the Y-axis direction is radiated in the positive direction of the X-axis.

[0033] When the antenna module 100 is installed in a substantially flat communication device such as a smartphone or tablet, the flat portion 130A faces the main surface on which the display is located, and the flat portion 130B faces the side surface of the housing. There is still a strong demand for smaller and thinner communication devices, and the increasing functionality of these devices is driving a trend toward higher device density. This may limit the area that the antenna module can occupy within the device.

[0034] The L-shaped dielectric substrate 105 of the antenna module 100 described above is formed by cutting out the boundary between two flat portions 130A and 130B in a single, flat substrate, and then bending the flat portion 130B relative to the flat portion 130A. In this case, as the mounting density within the device increases, the gap between the mounting substrate 20 and the housing narrows, limiting the dimension of the radio wave radiation direction from the flat portion 130B (i.e., the positive direction of the X axis in FIGS. 2 and 3 ). Therefore, it becomes necessary to shorten the dimension of the flat portion 130B from the bent portion 135 to the main surface 137 in the radiation direction by cutting or the like. This makes it impossible to ensure a sufficient distance between the radiating element 121B and the ground electrode GND1 in the flat portion 130B, potentially narrowing the bandwidth of the radio wave radiated from the radiating element 121B.

[0035] In antenna module 100 of the first embodiment, a gap between flat portion 130A and region RG1 of flat portion 130B, which is created by bent portion 135, is utilized to add region RG2 to flat portion 130B to increase the dimension on the main surface 138 side (i.e., the thickness in the negative direction of the X-axis in FIG. 3). This region RG2 makes it possible to ensure the distance between radiating element 121B and ground electrode GND1 in flat portion 130B while reducing the dimension of the entire antenna module in the X-axis direction. Therefore, by configuring antenna module 100 as described above, it is possible to achieve miniaturization while suppressing degradation of antenna characteristics.

[0036] More specifically, distance t2 between radiating element 121B and ground electrode GND1 in flat portion 130B is set to be equal to or greater than distance t1 between radiating element 121A and ground electrode GND2 in flat portion 130A (t1≦t2). Note that when no radiating element is arranged in flat portion 130A, the distance between main surface 131 in flat portion 130A and ground electrode GND2 is set to t1.

[0037] On the other hand, if the distance t2 between the radiating element 121B and the ground electrode GND1 is made too large, the overall dimensions of the antenna module may become larger, or the radio wave gain may decrease due to disturbances in the surface waves generated within the substrate. Therefore, the distance t2 between the radiating element 121B and the ground electrode GND1 in the flat portion 130B is set to be equal to or less than the distance t3 from the main surface 131 of the flat portion 130A to the bottom surface of the SiP module 125 (t2≦t3).

[0038] Dielectric substrate 105 may be formed, for example, by preparing a flat dielectric substrate of a predetermined thickness, and then removing the back side of the portion corresponding to flat portion 130A and the front side of the portion corresponding to flat portion 130B by cutting or the like, and then bending the substrate. Alternatively, a member may be prepared in which the number of laminated dielectric layers on the upper surface side is increased for the portion corresponding to flat portion 130A, and the number of laminated dielectric layers on the lower surface side is increased for the portion corresponding to flat portion 130B, and then bending the substrate.

[0039] In addition, when the ground electrodes GND1 and GND2 are exposed on the substrate surface, the ground electrodes GND1 and GND2 may be connected by a sputter shield formed on the side of the region RG2 instead of the via VG1 in the flat portion 130B.

[0040] "Radiating element 121B" and "radiating element 121A" in the first embodiment correspond to the "first radiating element" and "second radiating element," respectively, in the present disclosure. "Ground electrode GND1" and "Ground electrode GND2" in the first embodiment correspond to the "first ground electrode" and "second ground electrode," respectively, in the present disclosure. "Principal surface 131" and "principal surface 132" in the first embodiment correspond to the "first principal surface" and "second principal surface" of the first flat portion, respectively, in the present disclosure. "Principal surface 137" and "principal surface 138" in the first embodiment correspond to the "first principal surface" and "second principal surface" of the second flat portion, respectively, in the present disclosure. "Via VG1" in the first embodiment corresponds to the "first via" in the present disclosure. "SiP module 125" in the first embodiment corresponds to the "power supply circuit" in the present disclosure.

[0041] [Embodiment 2] In the first embodiment, a configuration has been described in which the region RG2 of the flat portion 130B is integrally formed with the region RG1 using the same member. In the second embodiment, a configuration will be described in which the region RG2 is formed as a member separate from the region RG1 and is attached to the region RG1.

[0042] FIG. 4 is a side perspective view of antenna module 100A according to the second embodiment. In antenna module 100A, flat portion 130B of dielectric substrate 105 includes only the above-mentioned region RG1. Dielectric substrate 190 formed of an independent member is attached as region RG2 to the principal surface of region RG1 in the negative direction of the X axis. Flat portion 130B is attached to dielectric substrate 190 using solder, a conductive adhesive, or the like. Note that the other configurations in FIG. 4 are basically the same as those of antenna module 100 shown in FIG. 3, and therefore description of elements that overlap with those in FIG. 3 will not be repeated.

[0043] 4, dielectric substrate 190 is a single-layer or multi-layer substrate made of ceramic or resin, similar to dielectric substrate 105. Dielectric substrate 190 has a flat plate shape, and a ground electrode GND1 is disposed over the entire surface of a specific dielectric layer therein. As with antenna module 100 of the first embodiment, ground electrode GND1 is connected to ground electrode GND2, which extends from flat portion 130A to bent portion 135, by via VG1.

[0044] 5, and is disposed in correspondence with each of the protrusions 133 of the flat portion 130B. That is, the dielectric substrate 190 is disposed in the portion between the two bent portions 135, and is not disposed in the portion corresponding to the notched portion 136 of the flat portion 130B. The end of the dielectric substrate 190 in the positive direction of the Z axis extends to a position where it overlaps with the flat portion 130A.

[0045] Furthermore, in antenna module 100A, radiating element 121B is arranged so that at least a portion thereof overlaps with protrusion 133 on flat portion 130B. That is, compared to antenna module 100 of the first embodiment, radiating element 121B is arranged at a position offset in the positive direction of the Z axis on flat portion 130B. Accordingly, the dimension of flat portion 130B in the Z axis direction is shorter than that of antenna module 100. By arranging radiating element 121B in this manner, the dimension of the entire antenna module in the Z axis direction can be reduced, resulting in a lower profile.

[0046] The substrate arranged as region RG2 may be formed as an integrated structure like the dielectric substrate 190A in the antenna module 100B of Fig. 6. When viewed from above in the X-axis direction, the dielectric substrate 190A has a shape generally similar to that of the flat portion 130B, and has a configuration in which multiple protrusions are formed in a rectangular shape. The dielectric substrate 190A is arranged so that the protrusions of the dielectric substrate 190A overlap the protrusions 133 of the flat portion 130B, respectively.

[0047] When an integrated structure such as dielectric substrate 190A is used, the shape precision required when forming dielectric substrate 190A becomes somewhat stricter, but on the other hand, the size of ground electrode GND1 can be made larger compared to the case of dielectric substrate 190, thereby improving the antenna characteristics. Conversely, in a configuration in which multiple dielectric substrates 190 are arranged corresponding to protruding portion 133 of flat portion 130B as shown in Fig. 5, the ground electrode GND1 is smaller compared to the case of dielectric substrate 190A, and the improvement in antenna characteristics is somewhat reduced, but the shape precision of each substrate is somewhat relaxed.

[0048] As described above, even in the configuration in which region RG2 is formed as a separate member, even if the thickness of region RG1 is reduced, the distance between radiating element 121B and ground electrode GND1 in flat portion 130B can be secured, thereby suppressing a decrease in bandwidth. Therefore, it is possible to achieve miniaturization while suppressing a decrease in antenna characteristics.

[0049] In the case of embodiment 2, the dielectric substrate 105 does not have to be an integral structure, and for example, the dielectric substrate 105 may be formed by attaching a flat dielectric substrate corresponding to the flat portions 130A and 130B to a flexible substrate.

[0050] [Embodiment 3] In the third embodiment, a configuration will be described in which a ground electrode for radiating element 121A of flat portion 130A is disposed in region RG2 of flat portion 130B.

[0051] Fig. 7 is a side see-through view of antenna module 100C according to Embodiment 3. Fig. 8 is a plan view of antenna module 100C of Fig. 7.

[0052] 7 and 8, antenna module 100C has a configuration in which dielectric substrate 190B, which is formed as a separate member from flat portion 130B, is disposed on the back surface side of flat portion 130B, similar to antenna module 100A of the second embodiment. Dielectric substrate 190B may have a separate structure like dielectric substrate 190, or may have an integrated structure like dielectric substrate 190A. Note that FIG. 7 shows a cross section of a portion without bent portion 135 connecting flat portion 130A and flat portion 130B.

[0053] In the dielectric substrate 190B, a ground electrode GND1 is arranged over the entire surface of a specific dielectric layer inside the substrate. Furthermore, in the dielectric substrate 190B, a ground electrode GND3 is arranged extending from the ground electrode GND1 in a direction toward the flat portion 130A (i.e., in the negative direction of the X-axis). As shown in FIG. 8, when viewed in a plan view from the Z-axis direction, the ground electrode GND3 is composed of a plurality of vias VG2. The vias VG2 are arranged at positions facing at least each of the radiating elements 121A.

[0054] 7, via VG2 is disposed at approximately the same position in the Z-axis direction as ground electrode GND2, and is not directly connected to ground electrode GND2. Distance D2 in the X-axis direction between radiating element 121A and via VG2 is shorter than distance D1 in the X-axis direction between radiating element 121B and the end of ground electrode GND2 in the negative X-axis direction. In other words, radiating element 121B is disposed on flat portion 130A, offset toward flat portion 130B, i.e., in the positive X-axis direction.

[0055] In this way, when radiating element 121B is positioned offset in the polarization direction relative to flat portion 130A, the area of ​​ground electrode GND2 in the positive direction of the X-axis may be insufficient compared to radiating element 121A, resulting in degradation of antenna characteristics. However, because via VG2 is connected to ground electrode GND2 via ground electrode GND1 and via VG1, it also functions as a ground electrode for radiating element 121A on flat portion 130A. This ensures sufficient area for the ground electrode in the polarization direction even when radiating element 121A is positioned offset toward flat portion 130B on flat portion 130A, thereby suppressing degradation of antenna characteristics. Furthermore, by offsetting radiating element 121A toward flat portion 130B and shortening the distance D1 in the X-axis direction between ground electrode GND2 and radiating element 121A, the overall dimension of the antenna module in the X-axis direction can be shortened, enabling further miniaturization.

[0056] In the antenna module 100C, the ground electrode GND3 is configured by a plurality of vias VG2, but a flat electrode may be used as the ground electrode GND3.

[0057] The "ground electrode GND3" in the third embodiment corresponds to the "third ground electrode" in this disclosure. The "via VG2" in the third embodiment corresponds to the "second via" in this disclosure.

[0058] [Embodiment 4] In the fourth embodiment, a configuration will be described in which a heat dissipation member is disposed on the rear surface side of the region RG2 of the flat portion 130B.

[0059] 9 is a side see-through view of an antenna module 100D according to Embodiment 4. Antenna module 100D has a configuration in which a heat dissipation member 195 is added to the configuration of antenna module 100 in FIG.

[0060] 9, in the antenna module 100D, the thickness (dimension in the X-axis direction) of the region RG2 of the flat portion 130B is made thicker than that in FIG.

[0061] Heat dissipation member 195 is made of a material with a relatively high thermal conductivity, such as metal. A part of heat dissipation member 195 is in contact with the outer periphery of SiP module 125. If SiP module 125 is provided with a conductive shield electrode 126 that covers the outer periphery, heat dissipation member 195 is arranged to be in contact with shield electrode 126.

[0062] It is known that circuits such as the RFIC 110 included in the SiP module 125 generate heat as the circuit operates. If the temperature of electronic elements in the circuit rises due to this heat generation, this can cause a deterioration in antenna characteristics. By bringing the heat dissipation member 195, which is made of a material with high thermal conductivity, into contact with the SiP module 125, the heat generated within the SiP module 125 can be efficiently dissipated using the heat dissipation member 195. Therefore, failure of the SiP module 125 due to heat generation can be suppressed.

[0063] [Embodiment 5] In the fifth embodiment, a configuration for correcting non-uniformity in the shape of the flat portion 130B will be described.

[0064] Fig. 10 is a side perspective view of antenna module 100E according to embodiment 5. Fig. 11 is a plan view of flat portion 130B in antenna module 100E of Fig. 11. In antenna module 100E, notch 136 (recess) formed in flat portion 130B at the connection portion with bent portion 135 is filled with dielectric member 130C.

[0065] The dielectric member 130C is a substantially flat plate-shaped member made of ceramic or resin, similar to the dielectric substrate 105. The surface of the dielectric member 130C in the positive direction of the X axis is flat and has no step with the main surface 137 of the flat portion 130B. The surface of the dielectric member 130C in the negative direction of the X axis has a shape corresponding to the bent portion 135.

[0066] A ground electrode GND4 is disposed over the entire surface of a specific dielectric layer inside the dielectric member 130C. The ground electrode GND4 is electrically connected to the ground electrode GND2 in the bent portion 135 and / or the ground electrode GND1 in the flat portion 130B by a connecting member (not shown).

[0067] Flat portion 130B has partial cutout 136 formed at the connection portion with bent portion 135, and this portion is in a state where there is no ground electrode. As a result, the arrangement of the ground electrode relative to radiating element 121B is non-uniform, and this non-uniformity can deteriorate the antenna characteristics.

[0068] In the antenna module 100E, the cutout 136 is filled with a dielectric member 130C including a ground electrode GND4. The position of the ground electrode GND4 in the X-axis direction does not coincide with the position of the ground electrode GND1 in the X-axis direction, but by providing the ground electrode GND4, the area of ​​the ground electrode relative to the radiating element 121B is increased, and non-uniformity of the ground electrode is alleviated. Therefore, in the antenna module 100E, the antenna characteristics can be improved compared to when the dielectric member 130C is not provided.

[0069] The "ground electrode GND4" in the fifth embodiment corresponds to the "fourth ground electrode" in the present disclosure.

[0070] [Aspect] It will be appreciated by those skilled in the art that the exemplary embodiments described above are examples of the following aspects.

[0071] (Item 1) An antenna module according to one aspect includes a dielectric substrate, a first radiating element, a first ground electrode, and a second ground electrode. The dielectric substrate includes a first flat portion and a second flat portion having different normal directions, and a bent portion connecting the first flat portion and the second flat portion. The first radiating element has a flat plate shape and is disposed on the first flat portion. The first ground electrode is disposed on the first flat portion so as to face the first radiating element. The second ground electrode is disposed on the second flat portion. The first flat portion and the second flat portion each have a first main surface and a second main surface that face each other. The first flat portion includes a first region to which the bent portion is connected and a second region disposed on the second flat portion side of the first region. When the normal direction of the first flat portion is defined as the first direction and the normal direction of the second flat portion is defined as the second direction, the dimension of the second flat portion in the second direction is larger than the dimension of the first region in the first direction and smaller than the sum of the dimensions of the first region and the second region in the first direction.

[0072] (Item 2) In the antenna module described in item 1, the distance between the first radiating element and the first ground electrode on the first flat portion is greater than the distance between the first main surface of the second flat portion and the second ground electrode.

[0073] (Item 3) In the antenna module described in items 1 or 2, the second ground electrode extends from the second flat portion via the bent portion to the first flat portion. The antenna module further includes a first via in the second flat portion that connects the first ground electrode and the second ground electrode.

[0074] (4) In the antenna module according to any one of the first to third paragraphs, the first ground electrode is disposed in the second region.

[0075] (Item 5) In the antenna module described in item 4, the first area and the second area are integrally formed from the same member.

[0076] (Item 6) In the antenna module described in item 4, the second region is made of a member separate from the first region.

[0077] (Item 7) In the antenna module described in item 6, the first region has a protruding portion that protrudes partially along the first flat portion toward the second flat portion beyond the boundary between the bent portion and the first flat portion. The bent portion is connected to the first region at a position in the first region where there is no protruding portion. At least a portion of the first radiating element is disposed in the protruding portion. The second region is also disposed in the protruding portion.

[0078] (Item 8) In the antenna module described in item 7, the first ground electrode is also disposed on the protruding portion.

[0079] (Item 9) In the antenna module according to item 7 or 8, the second region is arranged so that the position of the end of the second region in the second direction overlaps with the second flat portion.

[0080] (Item 10) The antenna module described in item 9 further includes a second radiating element and a third ground electrode. The second radiating element faces the second ground electrode in the second flat portion and is disposed closer to the first main surface of the second flat portion than the second ground electrode. The third ground electrode is disposed in the second region from the second ground electrode toward the second flat portion.

[0081] (Item 11) In the antenna module described in item 10, the third ground electrode is disposed at the position of the second ground electrode in the second direction.

[0082] (Item 12) In the antenna module described in item 11, the third ground electrode includes at least one second via facing the second radiating element when viewed in a plan view from the second direction.

[0083] (Item 13) In the antenna module described in any one of items 10 to 12, the first direction and the second direction are orthogonal to each other. In the second radiating element, a feeding point is disposed at a position offset in the first direction from the center of the second radiating element.

[0084] (Item 14) In the antenna module described in item 13, when viewed in a plane from the second direction, the distance in the first direction between the third ground electrode and the second radiating element is shorter than the distance in the first direction between the end of the second ground electrode in the opposite direction from the third ground electrode relative to the second radiating element and the second radiating element.

[0085] (Item 15) In the antenna module according to any one of items 6 to 12, the second region is made up of a plurality of members.

[0086] (Item 16) The antenna module described in any one of items 1 to 15 further includes a power feed circuit mounted on the second main surface of the second flat portion, and a heat dissipation member disposed on the second main surface of the first flat portion, wherein the heat dissipation member is in contact with the power feed circuit.

[0087] (Item 17) In the antenna module described in item 16, the feed circuit includes a shield electrode that covers the outer periphery of the feed circuit, and the heat dissipation member is in contact with the shield electrode.

[0088] (Item 18) The antenna module described in any one of items 1 to 17 further includes a dielectric member arranged in a recess formed in the connection portion of the first flat portion with the bent portion, and a fourth ground electrode arranged in the dielectric member and connected to the second ground electrode.

[0089] (Clause 19) An antenna module according to another aspect includes a dielectric substrate, a first radiating element, a first ground electrode, a second ground electrode, a dielectric member, and a fourth ground electrode. The dielectric substrate includes a first flat portion and a second flat portion having different normal directions, and a bent portion connecting the first flat portion and the second flat portion. The first radiating element has a flat plate shape and is disposed on the first flat portion. The first ground electrode is disposed on the first flat portion so as to face the first radiating element. The second ground electrode is disposed on the second flat portion. The dielectric member is disposed in a recess formed at the connection portion of the first flat portion with the bent portion. The fourth ground electrode is disposed on the dielectric member and connected to the second ground electrode.

[0090] (Item 20) A communication device according to another aspect includes the antenna module according to any one of items 1 to 19.

[0091] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the description of the above embodiments, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0092] 10 Communication device, 20 Mounting board, 21 Surface, 22 Side, 100, 100A to 100E Antenna module, 105, 190, 190A, 190B Dielectric substrate, 110 RFIC, 111A to 111H, 113A to 113H, 117A, 117B Switch, 112AR to 112HR Low noise amplifier, 112AT to 112HT Power amplifier, 114A to 114H Attenuator, 115A to 115H Phase shifter, 116A, 116B Signal combiner / divider, 118A, 118B Mixer, 119A, 119B Amplifier circuit, 120 Antenna device, 121A, 121B Radiating element, 125 SiP module, 126 Shield electrode, 130A, 130B Flat portion, 130C Dielectric member, 131, 132, 137, 138 main surface, 133 protrusion, 134 boundary portion, 135 bend portion, 136 notch portion, 171, 172 power supply wiring, 180, 185 connector, 195 heat dissipation member, 200 BBIC, GND1 to GND4 ground electrodes, RG1, RG2 regions, SP1, SP2 power supply points, VG1, VG2 vias.

Claims

1. 1. An antenna module, comprising: a dielectric substrate including a first flat portion and a second flat portion having normal directions different from each other, and a bent portion connecting the first flat portion and the second flat portion; a first radiating element having a flat plate shape and disposed on the first flat portion; a first ground electrode disposed in the first flat portion so as to face the first radiating element; a second ground electrode disposed on the second flat portion, each of the first flat portion and the second flat portion has a first main surface and a second main surface facing each other; a first main surface of the first flat portion is a main surface closer to the first radiating element than the first ground electrode, When a normal direction of the first flat portion is defined as a first direction, the first flat portion has a first region including a first main surface of the first flat portion in the first direction; a second region located closer to the second flat portion than the first region in the first direction, An antenna module, wherein, when the normal direction of the second flat portion is defined as a second direction, the dimension of the second flat portion in the second direction is larger than the dimension of the first region in the first direction and smaller than the sum of the dimensions of the first region and the second region in the first direction.

2. 2 . The antenna module according to claim 1 , wherein a distance between the first radiating element and the first ground electrode in the first flat portion is greater than a distance between a first main surface of the second flat portion and the second ground electrode.

3. the second ground electrode extends from the second flat portion to the first flat portion via the bent portion, The antenna module includes: The antenna module according to claim 1 , further comprising a first via in the first flat portion, connecting the first ground electrode and the second ground electrode.

4. The antenna module according to claim 1 , wherein the first ground electrode is disposed in the second region.

5. The antenna module according to claim 4 , wherein the first region and the second region are integrally formed from the same member.

6. The antenna module according to claim 4 , wherein the second region is formed of a member separate from the first region.

7. the first region has a protruding portion that partially protrudes along the first flat portion toward the second flat portion beyond a boundary between the bent portion and the first flat portion, the bent portion is connected to the first region at a position in the first region where the protrusion is not present, At least a portion of the first radiating element is disposed on the protrusion, The antenna module according to claim 6 , wherein the second region is also disposed on the protrusion.

8. The antenna module according to claim 7 , wherein the first ground electrode is also disposed on the protrusion.

9. The antenna module according to claim 7 , wherein the second region is disposed such that an end of the second region in the second direction is positioned to overlap the second flat portion.

10. a second radiating element disposed in the second flat portion, facing the second ground electrode and closer to the first main surface of the second flat portion than the second ground electrode; The antenna module according to claim 9 , further comprising: a third ground electrode disposed in the second region from the second ground electrode toward the second flat portion.

11. The antenna module according to claim 10 , wherein the third ground electrode is disposed at a position of the second ground electrode in the second direction.

12. The antenna module according to claim 11 , wherein the third ground electrode includes at least one second via facing the second radiating element when viewed in a plan view from the second direction.

13. the first direction and the second direction are perpendicular to each other, The antenna module according to claim 10 , wherein the second radiating element has a feed point disposed at a position offset in the first direction from a center of the second radiating element.

14. 14. The antenna module according to claim 13, wherein, when viewed in a plane from the second direction, a distance in the first direction between the third ground electrode and the second radiating element is shorter than a distance in the first direction between an end of the second ground electrode in a direction opposite to the third ground electrode with respect to the second radiating element and the second radiating element.

15. The antenna module according to any one of claims 6 to 12, wherein the second region is made up of a plurality of members.

16. a power supply circuit mounted on a second main surface of the second flat portion; a heat dissipation member disposed on a second main surface of the first flat portion, The antenna module according to claim 1 , wherein the heat dissipation member is in contact with the power supply circuit.

17. the power supply circuit includes a shield electrode that covers an outer periphery of the power supply circuit, The antenna module according to claim 16, wherein the heat dissipation member is in contact with the shield electrode.

18. a dielectric member disposed in a recess formed at a connection portion of the first flat portion with the bent portion; The antenna module according to claim 1 , further comprising: a fourth ground electrode disposed on the dielectric member and connected to the second ground electrode.

19. 1. An antenna module, comprising: a dielectric substrate including a first flat portion and a second flat portion having normal directions different from each other, and a bent portion connecting the first flat portion and the second flat portion; a first radiating element having a flat plate shape and disposed on the first flat portion; a first ground electrode disposed in the first flat portion so as to face the first radiating element; a second ground electrode disposed on the second flat portion; a dielectric member disposed in a recess formed at a connection portion of the first flat portion with the bent portion; a fourth ground electrode disposed on the dielectric member and connected to the second ground electrode.

20. A communication device equipped with the antenna module according to claim 1 or 19.

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