Electronic devices

Abstract

To obtain an electronic device that reduces the amount of sealing resin used, reduces weight, and meets the requirements for vibration-proofing and waterproofing of a substrate.SOLUTION: A case member 10 of an electronic device 1 includes a partition wall 12 that partitions an internal space of the case member 10 into a first housing space S1 and a second housing space S2. A first substrate 30 is accommodated in a first housing space S1 with an annular first seal portion 40 sandwiched between the first substrate and one surface of the partition wall 12, a second substrate 32 is accommodated in a second housing space S2 with the annular second seal portion 42 sandwiched between the second substrate and the other surface of the partition wall 12, a first sealed space SX1 in which the sealing resin 50 does not enter is formed in the space between the partition wall 12 and the first substrate 30 surrounded by the first seal portion 40, and a second sealed space SX2 in which the sealing resin 50 does not enter is formed in a space between the partition wall 12 and the second substrate 32, which is surrounded by the second seal portion 42.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to electronic devices. [Background technology]

[0002] Patent Document 1 discloses a control box in which a first substrate is placed on one side of the bottom of the case and a second substrate is placed on the other side. In this control box, only the first substrate is embedded in potting material inside the case, and the second substrate is attached and fixed to the case, thereby reducing the amount of potting material used. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 7-321472 Summary of the Invention [Problem to be solved by the invention]

[0004] A structure in which the substrate is attached to the case without being embedded in a potting material (sealing resin), as in the case of the second substrate, may not be able to meet the requirements for vibration isolation and waterproofing of the substrate. On the other hand, if the second substrate is also embedded in a potting material and fixed to the case, the amount of potting material used increases, which creates the problem of making the device heavier.

[0005] The present invention has been made to solve the above problems, and aims to provide an electronic device that reduces the amount of sealing resin used, making it lighter, and also meeting the requirements for vibration resistance and waterproofing of the board. [Means for solving the problem]

[0006] An electronic device according to a first aspect of the present invention is an electronic device comprising a first substrate, a second substrate electrically connected to the first substrate, and a case member accommodating the first substrate and the second substrate, wherein the case member has a partition wall portion that divides an internal space of the case member into a first accommodating space in which the first substrate is accommodated and a second accommodating space in which the second substrate is accommodated, and a first annular seal portion disposed on one side surface of the partition wall portion, a second annular seal portion disposed on the other side surface of the partition wall portion, and an injector for injecting an injectant into the first accommodating space and the second accommodating space. and a sealing resin that is sandwiched between the first substrate and one surface of the partition wall portion, wherein the first substrate is accommodated in the first accommodation space with the first seal portion sandwiched between the first substrate and one surface of the partition wall portion, and the second substrate is accommodated in the second accommodation space with the second seal portion sandwiched between the second substrate and the other surface of the partition wall portion, a first sealed space into which the sealing resin does not enter is formed in the space between the partition wall portion and the first substrate, which is surrounded by the first seal portion, and a second sealed space into which the sealing resin does not enter is formed in the space between the partition wall portion and the second substrate, which is surrounded by the second seal portion. [Effects of the Invention]

[0007] The electronic device according to the present invention includes a case member that houses a first substrate and a second substrate electrically connected to the first substrate. The first and second substrates are sealed with sealing resin in the internal space of the case member, thereby protecting them from vibration and water droplets. The case member also has a partition wall that divides the internal space of the case member into a first housing space that houses the first substrate and a second housing space that houses the second substrate. Thus, an optimized amount of sealing resin is poured into each of the first and second housing spaces depending on the circuit element configuration of the housed substrate. Furthermore, the first substrate is housed with a first seal sandwiched between the partition wall and the first substrate, forming a first sealed space between the partition wall and the first substrate, where the sealing resin cannot enter. Similarly, the second substrate is housed with a second seal sandwiched between the partition wall and the second substrate, where the sealing resin cannot enter, forming a second sealed space between the partition wall and the second substrate. With this configuration, the spaces between the partition walls and the respective boards are waterproof without the need for sealing resin, reducing the amount of resin required. In this way, the amount of sealing resin injected into the case members is optimized, making it possible to reduce the weight of the electronic device while also meeting the requirements for vibration resistance and waterproofing of the boards. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is an exploded perspective view of an electronic device according to an embodiment. [Figure 2] 1 is a cross-sectional view of an electronic device according to an embodiment. [Figure 3] FIG. 2 is a partially enlarged cross-sectional view of the electronic device according to the embodiment. [Figure 4] 4 is an exploded perspective view showing the positional relationship between a first housing space and a first seal portion of the case member according to the embodiment. FIG. [Figure 5] 3 is a plan view of a first housing space of the electronic device according to the embodiment, seen from above. FIG. [Figure 6] FIG. 1 is a block diagram illustrating an electronic device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] A first embodiment of the present invention will be described with reference to Figures 1 to 6. In this embodiment, for convenience of explanation, the directions indicated by the up / down, left / right, and front / rear arrows appropriately shown in each figure will be defined as the up / down direction, left / right direction, and front / rear direction of the electronic device 1, respectively.

[0010] In this embodiment, an electronic device 1 that converts power between DC and AC will be described as an example of an electronic device according to the present invention. As shown in FIG. 6 , the electronic device 1 includes a first substrate 30 having a power conversion circuit unit 2 and a second substrate 32 electrically connected to the first substrate 30. The second substrate 32 is provided with a control unit 3 electrically connected to the power conversion circuit unit 2 and that controls the power conversion between DC and AC. The second substrate 32 also includes a first power port 4 and a second power port 5 that constitute ports for power supplied (input) to the power conversion circuit unit 2 and power output from the power conversion circuit unit 2. The first power port 4 is a DC power port that allows input and output of DC current. DC power supplied from an external DC power source is input via the first power port 4, and power converted to DC by the power conversion circuit unit 2 is output via the second power port 5. The second power port 5 is an AC power port that allows input and output of AC power. The second power port 5 allows input and output of AC power. The second power port 5 receives AC power supplied from an external AC power source and outputs AC power converted by the power conversion circuit unit 2.

[0011] The power conversion circuit unit 2 includes an inverter circuit unit 2A and a converter circuit unit 2B. The inverter circuit unit 2A converts DC power supplied from the first power port 4 into AC power and includes multiple switching elements (semiconductor elements 52, described later) configured with MOSFETs, IGBTs, and the like. The inverter circuit unit 2A converts DC power into AC power by controlling the on / off states of the multiple switching elements based on a control signal output from the control unit 3. The power converted into AC by the inverter circuit unit 2A can be supplied to an external load via the second power port 5. The converter circuit unit 2B converts AC power supplied from the second power port 5 into DC power and includes multiple semiconductor elements (semiconductor elements 52, described later) configured with rectifying diodes and the like. The converter circuit unit 2B rectifies the power based on a control signal output from the control unit 3 to convert AC power into DC power. The power converted into DC by the converter circuit unit 2B can be supplied to a battery or an external load via the first power port 4.

[0012] As shown in FIGS. 1 to 3, a first substrate 30 and a second substrate 32 are housed inside a box-shaped case member 10. The case member 10 has a partition wall 12 that divides the internal space, a first side wall 14 that stands on one side (the upper side in FIG. 1) from the periphery of the partition wall 12, and a second side wall 16 that stands on the other side (the lower side in FIG. 1) from the periphery of the partition wall 12. The first substrate 30 is housed in a first housing space S1 formed by the partition wall 12 and the first side wall 14 inside the case member 10. The second substrate 32 is housed in a second housing space S2 formed by the partition wall 12 and the second side wall 16 inside the case member 10. Note that circuit elements mounted on the first substrate 30 and the second substrate 32 are not shown in FIG. 1.

[0013] The material from which the case member 10 is formed is not particularly limited, and the case member 10 can be formed using, for example, a metal material or a resin material. As an example, the case member 10 of this embodiment is formed by molding a resin material. By molding the case member 10 from a resin material, the first substrate 30 and the second substrate 32 are arranged in the internal space of the case member 10, separated by an insulating partition wall portion 12. This makes it possible to easily ensure insulation between the first substrate 30 and the second substrate 32, and shorten the distance between the substrates. Furthermore, the weight of the case member 10 can be reduced.

[0014] In the first housing space S1 of the case member 10, a rising portion 18 is formed on the upper surface of the partition wall portion 12, and is one step higher than the upper surface. The rising portion 18 is formed in an annular shape along the inner surface of the first side wall portion 14. A first substrate 30 is fixed to this annular rising portion 18. The rising portion 18 has a plurality of mounting portions 20 provided at predetermined intervals in the circumferential direction of the rising portion 18, and a seal groove 22 formed in a concave shape on the upper surface of the rising portion 18. The seal groove 22 is formed in an annular shape around the entire circumference of the rising portion 18. The mounting portion 20 is provided on the upper surface of the rising portion 18, outside the seal groove 22. Each mounting portion 20 has a through-hole formed therethrough toward the second housing space S2. The first substrate 30 is fixed to the case member 10 by inserting a bolt 24 through an attachment hole (reference numeral omitted) formed on the end of the substrate and through a through hole in the mount portion 20, and by screwing a nut 26 onto the tip of the bolt 24 protruding into the accommodation space on the opposite side. A female thread may be formed on the inner circumferential surface of the through hole in the mount portion 20.

[0015] Here, the bolts 24 and nuts 26 that are used as fastening members for the first substrate 30 are also used in the second housing space S2 as fastening members for the second substrate 32. The bolts 24 inserted into the through holes of the mount section 20 are also inserted into attachment holes (reference numerals omitted) that are formed in the second housing space S2 on the substrate end side of the second substrate 32. As a result, the first substrate 30 and the second substrate 32 are fastened together using the common bolts 24 and nuts 26, which makes it possible to reduce the number of parts of the fastening members and the number of mount sections provided in the case member 10.

[0016] Furthermore, when the first substrate 30 and the second substrate 32 are configured as printed wiring boards, measures are required to suppress noise intrusion from outside the substrates and noise emission from within the substrates. To address these noise issues, a GND pattern is typically provided at the edge of the substrate. The GND pattern includes a copper pattern formed to surround the edge of the substrate and vias provided at equal intervals in the copper pattern. Furthermore, by arranging control signal lines (wiring patterns) inside the GND pattern, noise intrusion from outside the substrate and noise emission from within the substrate are suppressed. In this embodiment, when the first substrate 30 and the second substrate 32 are configured as printed wiring boards, metal fastening members are arranged along the edges of the substrates where the GND patterns are provided. This strengthens the GND of the substrates, thereby improving noise resistance.

[0017] As shown in FIG. 4 , the first seal portion 40 is inserted into an annular seal groove 22 formed in the rising portion 18 on one surface (top surface) of the partition wall portion 12. The first seal portion 40 is formed of an elastic material such as rubber and includes an annular portion 46 inserted into the seal groove 22 and multiple protruding pieces 48 arranged along the extension direction of the annular portion 46. The annular portion 46 is formed in an O-ring shape and has a circular cross section. The outer diameter of this circular cross section is set to be larger than the depth of the seal groove 22. Therefore, when the annular portion 46 is inserted into the seal groove 22, its tip protrudes from the seal groove 22. Each of the multiple protruding pieces 48 is formed as a small plate-like piece integrally formed with the annular portion 46. Each protruding piece 48 protrudes outward from the annular portion 46 and is configured to fit into a positioning recess 23 formed integrally with the seal groove 22. In this state, a plurality of mounts 20 are arranged outside the first seal portion 40 so as to surround the first seal portion 40 .

[0018] The first substrate 30 is accommodated in the first accommodation space S1 with the first seal portion 40 sandwiched between it and the upper surface of the partition wall portion 12. As shown in FIG. 5 , when accommodated in this manner, the multiple protruding pieces 48 formed on the first seal portion 40 protrude outward from the outer peripheral edge of the first substrate 30 and can be visually observed from above the first substrate 30. The position of the protruding pieces 48 allows the worker performing the assembly to understand how the first seal portion 40 fits into the case member 10. Therefore, when the protruding pieces 48 are in the specified position, it can be determined that the first seal portion 40 provides a sufficient seal between the partition wall portion 12 and the first substrate 30. Therefore, it can be detected that the seal is impaired if the first seal portion 40 falls out of the seal groove 22, for example.

[0019] 2, when the end of the first substrate 30 is fixed to the mount portion 20, the first seal portion 40 inserted into the seal groove 22 is crushed and comes into close contact with the opposing surface of the first substrate 30. As a result, a first sealed space SX1 is formed between the partition wall portion 12 surrounded by the first seal portion 40 and the first substrate 30. The first substrate 30 is partially or entirely embedded and sealed in the sealing resin 50 injected into the first housing space S1, thereby protecting it from vibrations during use of the electronic device 1 and water droplets that may get inside.

[0020] The first sealed space SX1 between the partition wall 12 and the first substrate 30 is sealed by the first seal 40, making it a space that is not susceptible to sealing resin. Furthermore, in the first sealed space SX1, the mounting surface of the first substrate 30 facing the partition wall 12 can be protected from water droplets and the like that may have entered the inside of the electronic device 1. In this way, the first housing space S1 does not require sealing resin to seal one side of the first substrate 30, and therefore the amount of resin injected into the first housing space S1 can be reduced.

[0021] The internal space of the case member 10 has a second housing space S2 on the opposite side across the partition wall 12, which has the same configuration as the first housing space S1. That is, in the second housing space S2, a second seal member 42 having the same configuration as the first seal member 40 is disposed on the other surface (lower surface) of the partition wall 12. The second substrate 32 is housed with the second seal member 42 sandwiched between it and the lower surface of the partition wall 12, and a second sealed space SX2, into which the sealing resin 50 does not enter, is formed between the partition wall 12 surrounded by the second seal member 42 and the second substrate 32. The second substrate 32 is also partially or completely sealed with the sealing resin 50 injected into the second housing space S2, thereby protecting it from vibrations during use of the electronic device 1 and water droplets that may enter the interior.

[0022] The power conversion circuit unit 2 is provided on the mounting surface (top surface in FIG. 2 ) of the first substrate 30 opposite the surface facing the partition wall 12. The semiconductor elements 52 constituting the power conversion circuit unit 2 are mounted on the first substrate 30 while being fixed to a block-shaped heat sink 54 to efficiently dissipate heat generated by current flow during operation. A plurality of smoothing capacitors 56 are also mounted on the mounting surface. This configuration allows relatively tall components to be concentrated on the mounting surface of the first substrate 30. Meanwhile, the control unit 3, the first power port 4, and the second power port 5 are mounted on the mounting surface (bottom surface in FIG. 2 ) of the second substrate 32 opposite the surface facing the partition wall 12. The control unit 3 is configured by a small control IC including a CPU (Central Processing Unit). This configuration allows relatively short components to be concentrated on the mounting surface of the first substrate 30.

[0023] Since a larger current flows through the power conversion circuit unit 2 than through the control IC of the second substrate 32, it is necessary to provide a sufficient thickness for the sealing resin 50 to ensure insulation between, for example, the lead portion of the semiconductor element 52 and the mounting surface of the first substrate 30. Therefore, as shown in Fig. 3, the thickness T1 of the sealing resin 50 injected into the first housing space S1 is set to be larger than the thickness T2 of the sealing resin 50 injected into the second housing space S2.

[0024] The partition wall 12 has a through-hole 60 formed inside the first and second seal portions 40, 42, which connects the first housing space S1 and the second housing space S2. A terminal member 62 is inserted into this through-hole 60, electrically connecting the signal lines of the power conversion circuit unit 2 of the first substrate 30 and the control unit 3 of the second substrate 32. The type of terminal member 62 is not limited, but in this embodiment, the terminal member 62 is configured as a floating connector that easily absorbs tolerances due to assembly. For example, the terminal member 62 has a male connector 64 having a plurality of conductor pins connected to the first substrate 30 side, and the tips of the conductor pins of the male connector 64 are connected to a female connector 66 arranged on the opposing surface of the second substrate 32.

[0025] (Action and effect) As described above, the electronic device 1 of this embodiment includes the case member 10 that houses the first substrate 30 and the second substrate 32 that is electrically connected to the first substrate 30. The first substrate 30 and the second substrate 32 are sealed with the sealing resin 50 in the internal space of the case member 10, and are thereby protected from vibrations and the adhesion of water droplets.

[0026] In the electronic device 1, the case member 10 has a partition wall 12 that divides the interior space of the case member 10 into a first housing space S1 that houses the first substrate 30 and a second housing space S2 that houses the second substrate 32. Therefore, an optimized amount of sealing resin is poured into each of the first housing space S1 and the second housing space S2 depending on the circuit element configuration of the boards to be housed. Furthermore, the first substrate 30 is housed with the first seal 40 sandwiched between the partition wall 12 and the first substrate 30, forming a first sealed space SX1 between the partition wall 12 and the first substrate 30, where the sealing resin is not allowed. Similarly, the second substrate 32 is housed with the second seal 42 sandwiched between the partition wall 12 and the second substrate 32, where the sealing resin is not allowed, forming a second sealed space SX2 between the partition wall 12 and the second substrate 32. With this configuration, the amount of resin can be reduced because the waterproof performance is ensured in the spaces between the partition wall portion 12 and each board without injecting the sealing resin 50. In this way, the amount of sealing resin 50 injected into the case member 10 is optimized, which makes it possible to reduce the weight of the electronic device 1 and also meet the requirements for vibration resistance and waterproofness of the board.

[0027] The protruding pieces 48 on the first seal portion 40 and the second seal portion 42 are configured to protrude outward from the outer peripheral edges of the substrates when the first seal portion 40 and the second seal portion 42 are arranged along the edges of the corresponding substrates. This allows the fit of the first seal portion 40 and the second seal portion 42 to be ascertained based on the position of the protruding pieces 48, even when the substrates are placed on top of the first seal portion 40 and the second seal portion 42, and allows visual confirmation of whether the first sealed space SX1 and the second sealed space SX2 satisfy the desired sealing performance. Furthermore, some of the protruding pieces 48, which serve as a reference for positioning during installation, may be shaped differently from the other protruding pieces 48, thereby intuitively informing the operator of the orientation of the first seal portion 40 and the second seal portion 42 when installed in the case member 10.

[0028] The first substrate 30 and the second substrate 32, which are separated by the partition wall portion 12, are electrically connected via a terminal member 62 inserted into the through hole 60 of the partition wall portion 12, thereby shortening the connection line between the substrates and improving wiring efficiency.

[0029] The power conversion circuit section 2 including a plurality of switching elements (semiconductor elements 52) is provided on the first substrate 30, and the control section 3 that controls the on and off states of the switching elements is provided on the second substrate 32. As a result, heat generated by the switching elements is blocked by the partition wall section 12, and the control section 3 can be protected from heat generated by the switching elements.

[0030] Since the first power port 4, which enables input and output of DC power together with the control unit 3, and the second power port 5, which enables input and output of AC power, are provided on the second board 32, connections to the power source and external load (power supply target) can be made all at once from one side of the case member 10. This results in excellent assembly workability and maintainability.

[0031] By molding the case member 10 from resin, it is possible to easily ensure an insulating distance between the boards separated by the partition wall portion 12.

[0032] The first substrate 30 and the second substrate 32 are fixed to the case member 10 by common fastening members (bolts 24 and nuts 26) via mount portions 20 formed on the partition wall portion 12. This makes it possible to reduce the number of fastening members and the number of mount portions provided on the case member 10, thereby reducing manufacturing costs and shortening the work time required for assembly.

[0033] The first substrate 30 and the second substrate 32 are fixed at their edges by a plurality of fastening members made of molded metal material. Therefore, when the first substrate 30 and the second substrate 32 are configured as printed wiring boards, the metal fastening members are arranged along the outer periphery of the substrates where the GND pattern is provided, strengthening the GND of the substrates and improving noise resistance. Furthermore, noise resistance can be further improved by arranging the plurality of fastening members at closer intervals.

[0034] [supplementary explanation] In the above embodiment, the first seal portion 40 is formed from an elastic material such as rubber, but the present invention is not limited to this. The first seal portion 40 can also be formed by arranging a metal gasket, a foam adhesive, a silicone liquid adhesive (CIPG), or the like in an annular shape. [Explanation of symbols]

[0035] 1 Electronic equipment 2 Power conversion circuit section 3. Control Unit 4 First power port 5 Second power port 10 Case material 12 Partition wall 20 Mounting section 24 Bolts (fastening members) 26 Nut (fastening member) 30 First board 32 Second board 40 First seal part 42 Second seal part 50 Sealing resin 60 through holes 62 Terminal material S1 First Storage Space S2 Second storage space SX1 1st enclosed space SX2 2nd closed space

Claims

1. An electronic device comprising: a first substrate; a second substrate electrically connected to the first substrate; and a case member accommodating the first substrate and the second substrate, the case member has a partition wall portion that divides an internal space of the case member into a first accommodating space in which the first board is accommodated and a second accommodating space in which the second board is accommodated, a first annular seal portion disposed on one side surface of the partition wall portion; a second annular seal portion disposed on the other side surface of the partition wall portion; a sealing resin injected into the first accommodating space and the second accommodating space, the first substrate is accommodated in the first accommodation space with the first seal portion sandwiched between the first substrate and one surface of the partition wall portion, the second substrate is accommodated in the second accommodation space with the second seal portion sandwiched between the second substrate and the other surface of the partition wall portion, a first sealed space into which the sealing resin does not enter is formed in a space between the partition wall portion and the first substrate, the space being surrounded by the first seal portion; a second sealed space, into which the sealing resin does not enter, is formed in a space between the partition wall portion and the second substrate, the space being surrounded by the second seal portion; The first and second seal portions are formed of annular seal members and have a plurality of protruding pieces provided at predetermined intervals in an extension direction, An electronic device, wherein the multiple protruding pieces are configured to protrude outward from the outer peripheral ends of each substrate when the first and second sealing portions are positioned between the first and second substrates and the partition wall portion, respectively.

2. An electronic device comprising a first substrate, a second substrate electrically connected to the first substrate, and a case member that houses the first substrate and the second substrate, the case member has a partition wall portion that divides an internal space of the case member into a first accommodating space in which the first board is accommodated and a second accommodating space in which the second board is accommodated, a first annular seal portion disposed on one side surface of the partition wall portion; a second annular seal portion disposed on the other side surface of the partition wall portion; a sealing resin injected into the first accommodating space and the second accommodating space, the first substrate is accommodated in the first accommodation space with the first seal portion sandwiched between the first substrate and one surface of the partition wall portion, the second substrate is accommodated in the second accommodation space with the second seal portion sandwiched between the second substrate and the other surface of the partition wall portion, a first sealed space into which the sealing resin does not enter is formed in a space between the partition wall portion and the first substrate, the space being surrounded by the first seal portion; a second sealed space, into which the sealing resin does not enter, is formed in a space between the partition wall portion and the second substrate, the space being surrounded by the second seal portion; the partition wall portion has a through hole formed inside the first and second seal portions, the through hole communicating the first accommodating space with the second accommodating space, A terminal member that electrically connects the first substrate and the second substrate is inserted into the through hole.

3. a power conversion circuit unit including a plurality of switching elements and performing mutual conversion of power between direct current and alternating current; a control unit that controls the on and off states of the switching element; a first power port that allows input and output of DC power; a second power port that allows input and output of AC power, the power conversion circuit unit is provided on the first substrate, The electronic device according to claim 2 , wherein the control unit, the first power port, and the second power port are provided on the second substrate and electrically connected to the power conversion circuit unit via the terminal members.

4. An electronic device comprising a first substrate, a second substrate electrically connected to the first substrate, and a case member accommodating the first substrate and the second substrate, the case member has a partition wall portion that divides an internal space of the case member into a first accommodating space in which the first board is accommodated and a second accommodating space in which the second board is accommodated, a first annular seal portion disposed on one side surface of the partition wall portion; a second annular seal portion disposed on the other side surface of the partition wall portion; a sealing resin injected into the first accommodating space and the second accommodating space, the first substrate is accommodated in the first accommodation space with the first seal portion sandwiched between the first substrate and one surface of the partition wall portion, the second substrate is accommodated in the second accommodation space with the second seal portion sandwiched between the second substrate and the other surface of the partition wall portion, a first sealed space into which the sealing resin does not enter is formed in a space between the partition wall portion and the first substrate, the space being surrounded by the first seal portion; a second sealed space, into which the sealing resin does not enter, is formed in a space between the partition wall portion and the second substrate, the space being surrounded by the second seal portion; the case member is formed by molding a resin material, a plurality of mount portions formed on the partition wall portion outside the first and second seal portions and penetrating the partition wall portion; a plurality of fastening members that fasten the first and second circuit boards to the case member via the mount portions, The fastening member is made of a molded metal material, is inserted into an attachment hole of the first substrate from the first accommodating space side, protrudes into the second accommodating space side via the mount portion, and is inserted into an attachment hole of the second substrate.

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