Inspection socket

Abstract

To provide a socket having a pressing member that does not wobble or can suppress wobbling when moving.SOLUTION: In a first section in which a cover member 120 moves upward from a close position by predetermined distance, a latch member 150 is restricted by a link mechanism from moving from an open position to above a placement surface 113a by pivoting about an axis along a depth direction. In a second section in which the cover member 120 moves further upward and reaches a separate position, the latch member is restricted by the link mechanism from moving up to a pressing position by moving only downward.SELECTED DRAWING: Figure 27

Description

Technical Field

[0001] The present invention relates to a socket for inspection.

Background Art

[0002] For example, in a socket for inspection used in a burn-in test of a semiconductor package, a member (pressing member) for pressing the package so that the package does not float up from the mounting surface on which the package is mounted is provided. Conventionally, this pressing member was configured to rotate to a position where it presses the upper surface of the package in conjunction with the raising of the cover of the inspection socket. However, if the pressing member is in contact with the upper surface of the package when it rotates, there is a possibility that the pressing member scratches and damages the upper surface of the package due to the horizontal movement component of the rotating pressing member.

[0003] Patent Document 1 describes a socket for a semiconductor device that moves a pressing member so as not to rub the upper surface of a package. In the socket of Patent Document 1, the pressing member is rotated by the legs of the pressing member abutting against a protruding piece or a guide wall surface.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the configuration of Patent Document 1, a state may occur in which the legs of the pressing member do not abut against either the protruding piece or the guide wall surface. In such a state, it is assumed that the pressing member wobbles / the movement of the pressing member becomes unstable.

[0006] Therefore, the present invention aims to provide an inspection socket equipped with a pressing member that does not wobble or can suppress wobbling when moving. [Means for solving the problem]

[0007] To solve the above problems, the inspection socket of the present invention employs the following means. A test socket according to a first aspect of the present invention includes: a base member having a mounting surface on which a semiconductor package is placed; a cover member attached to the base member and moving along a vertical direction perpendicular to the mounting surface between a proximity position closest to the base member and a distance position furthest from the base member; at least one pressing member that moves between an open position that opens the top of the mounting surface so that the semiconductor package can be placed on it and a pressing position that presses the upper surface of the semiconductor package placed on the mounting surface; and the movement of the cover member along the vertical direction. The device includes a link mechanism that moves the pressing member between the open position and the pressing position accordingly. In the first section, when the cover member moves upward by a predetermined distance from the proximity position, the movement of the pressing member is restricted by the link mechanism to move from the open position to above the aforementioned mounting surface by rotating around an axis along a first orthogonal direction perpendicular to the vertical direction. In the second section, when the cover member moves further upward to reach the separation position, the movement of the pressing member is restricted by the link mechanism to move only downward to reach the pressing position.

[0008] In the inspection socket according to this embodiment, in the first section in which the cover member moves upward by a predetermined distance from the approaching position, the movement of the pressing member is restricted by a link mechanism so that it moves upward from the open position to the mounting surface by rotating around an axis along a first orthogonal direction. In the second section in which the cover member moves further upward to reach the separation position, the movement of the pressing member is restricted by the link mechanism so that it moves only downward to reach the pressing position. Therefore, when the pressing member presses the semiconductor package or immediately before pressing it, the pressing member moves only downward and does not move horizontally, so the pressing member does not rub and scratch the upper surface of the semiconductor package placed on the mounting surface by moving horizontally. Furthermore, the movement of the pressing member is constantly restricted by a link mechanism while it moves from the open position to the pressed position. As a result, the pressing member does not wobble or its wobbling is suppressed, so it does not damage the semiconductor package due to the wobbling of the pressing member.

[0009] In the first embodiment, the inspection socket according to the second aspect of the present invention has a link mechanism comprising a transmission member, a first connecting shaft, a second connecting shaft, and a pivot shaft, wherein the first connecting shaft, the second connecting shaft, and the pivot shaft extend in the first orthogonal direction, the transmission member is connected to the cover member at the first connecting shaft and to the pressing member at the second connecting shaft, and when the direction perpendicular to the vertical direction and the first orthogonal direction is defined as the second orthogonal direction, the pivot shaft located between the first and second connecting shafts in the second orthogonal direction is connected to the base member, and by rotating around the pivot shaft, the upward movement of the cover member is converted into the downward movement of the pressing member, and the movement of the second connecting shaft is restricted to move only in the vertical direction.

[0010] According to the inspection socket of this embodiment, the transmission member rotates around the pivot shaft portion, converting the upward movement of the cover member into the downward movement of the pressing member, and the movement of the second connecting shaft portion is restricted to move only in the vertical direction, so that the transmission member can provide the pressing member with a component that moves only upward.

[0011] In the third aspect of the present invention, the inspection socket, in the second aspect, has the second connecting shaft portion located laterally in the second orthogonal direction to the region below the mounting surface described above.

[0012] According to the inspection socket of this embodiment, the second connecting shaft is located laterally in the second orthogonal direction of the lower region of the mounting surface, making it easier to position the pressing member, with the second connecting shaft as the pivot point, in the lateral region of the mounting surface. This reduces the rotation angle (opening / closing angle) of the pressing member required to open the top of the mounting surface. In other words, in inspection sockets with size constraints, the range of motion of the pressing member for opening the top of the mounting surface can be reduced, allowing for more efficient opening of the top of the mounting surface.

[0013] In the fourth aspect of the present invention, the inspection socket, in the second or third aspect, has a link mechanism having a contact portion, the contact portion being provided on the cover member, and in the first section, applying a force to the pressing member that rotates the pressing member around the second connecting shaft portion.

[0014] According to the inspection socket of this embodiment, the link mechanism has a contact portion, which is provided on the cover member, and in the first section, it applies a force to the pressing member that rotates the pressing member around the second connecting shaft, so that the pressing member can be reliably rotated by the contact portion.

[0015] In the fifth aspect of the present invention, the inspection socket, in the fourth aspect, has a link mechanism having a slide shaft and a slide groove, the slide shaft being provided on the cover member and located between the first connecting shaft and the second connecting shaft in the second orthogonal direction, and the slide groove being provided on the pressing member and configured to allow the slide shaft to slide.

[0016] According to the inspection socket of this embodiment, the slide shaft portion is provided on the cover member and is located between the first connecting shaft portion and the second connecting shaft portion in the second orthogonal direction, and the slide groove is provided on the pressing member and configured so that the slide shaft portion slides, thereby stabilizing the posture of the pressing member with the two shaft portions, the slide shaft portion and the second connecting shaft portion.

[0017] In the sixth aspect of the present invention, the inspection socket, in the fifth aspect, has the slide shaft portion as the contact portion, and the pressing member rotates around the second connecting shaft portion when the slide shaft portion contacts the slide groove.

[0018] According to the inspection socket of this embodiment, the slide shaft portion is the contact portion, and when the slide shaft portion contacts the slide groove, the pressing member rotates around the second connecting shaft portion. Therefore, the pressing member can be rotated by utilizing the slide shaft portion and slide groove, which stabilize the posture of the pressing member.

[0019] In the seventh aspect of the present invention, the inspection socket, in the second or third aspect, has a link mechanism having a contact portion, the contact portion being provided on the base member, and in the first section, applying a force to the pressing member that rotates the pressing member around the second connecting shaft portion.

[0020] According to the inspection socket of this embodiment, the link mechanism has a contact portion, which is provided on the base member, and in the first section, it applies a force to the pressing member that rotates the pressing member around the second connecting shaft, so that the pressing member can be reliably rotated.

[0021] In the seventh embodiment, the inspection socket according to the eighth aspect of the present invention has a link mechanism having a slide shaft and a slide groove, the slide shaft being provided on the pressing member and located above the second connecting shaft, and the slide groove being provided on the base member and configured such that the second connecting shaft and the slide shaft slide.

[0022] According to the inspection socket according to this aspect, the slide shaft portion is provided on the pressing member and is above the second connecting shaft portion, and the slide groove is provided on the base member and is configured such that the second connecting shaft portion and the slide shaft portion slide. Therefore, the posture of the pressing member is stabilized by the two shaft portions of the slide shaft portion and the second connecting shaft portion.

[0023] In the inspection socket according to the ninth aspect of the present invention, in the eighth aspect, the slide groove is the contact portion, and when the slide shaft portion contacts the slide groove, the pressing member rotates around the second connecting shaft portion.

[0024] According to the inspection socket according to this aspect, since the slide groove is the contact portion and the slide shaft portion contacts the slide groove, the pressing member rotates around the second connecting shaft portion. Therefore, the pressing member can be rotated by using the slide shaft portion and the slide groove that stabilize the posture of the pressing member.

[0025] In the inspection socket according to the tenth aspect of the present invention, in the ninth aspect, in the first section, the second connecting shaft portion slides in the slide groove in the vertical direction, and the slide shaft portion slides in the slide groove in the vertical direction and the second direction.

[0026] According to the inspection socket according to this aspect, in the first section, the second connecting shaft portion slides in the slide groove in the vertical direction, and the slide shaft portion slides in the slide groove in the vertical direction and the second direction. Therefore, the pressing member can be rotated around the second connecting shaft portion by the slide shaft portion.

Effect of the Invention

[0027] According to the present invention, it is possible to provide a socket provided with a pressing member that does not wobble or can suppress wobbling when moving.

Brief Description of the Drawings

[0028] [Figure 1]A perspective view of an inspection socket according to the first embodiment of the present invention (semiconductor package: none, cover member: spaced apart). [Figure 2] A perspective view of an inspection socket according to the first embodiment of the present invention (semiconductor package: present, cover member: separated position). [Figure 3] A perspective view of an inspection socket according to the first embodiment of the present invention (semiconductor package: none, cover member: in close proximity). [Figure 4] A perspective view of an inspection socket according to the first embodiment of the present invention (semiconductor package: present, cover member: in close proximity). [Figure 5] This is an exploded perspective view of an inspection socket according to the first embodiment of the present invention. [Figure 6] This is a cross-sectional view along the cutting line VI-VI in Figure 2. [Figure 7] Figure 2 shows a cross-sectional view along the cutting line VI-VI (latch member omitted). [Figure 8] Figure 2 shows a cross-sectional view along the cutting line VI-VI (latch member and lever member omitted). [Figure 9] This is a perspective view of the installation area of ​​the base member. [Figure 10] This is a perspective view of the lever component. [Figure 11] This is a perspective view of the latch component. [Figure 12] This is a plan view of an inspection socket with the latching member in the open position. [Figure 13] This is a cross-sectional view along the cutting line AA in Figure 12. [Figure 14] This is a cross-sectional view along the cutting line BB in Figure 12. [Figure 15] Figure 12 shows a cross-sectional view along the cutting line AA (latch member omitted). [Figure 16] Figure 12 shows a cross-sectional view along the cutting line BB (latch member omitted). [Figure 17] Figure 12 shows a cross-sectional view along the cutting line AA (latch member and lever member are omitted). [Figure 18]Figure 12 shows a cross-sectional view along the cutting line BB (latch member and lever member are omitted). [Figure 19] This is a plan view of an inspection socket in which the latching member is positioned between the open position and the upper position. [Figure 20] This is a cross-sectional view along the cutting line AA in Figure 19. [Figure 21] Figure 19 shows a cross-sectional view along the cutting line BB. [Figure 22] Figure 19 shows a cross-sectional view along the cutting line AA (latch member omitted). [Figure 23] Figure 19 shows a cross-sectional view along the cutting line BB (latch member omitted). [Figure 24] This is a cross-sectional view along the cutting line AA in Figure 19 (latch member and lever member are omitted). [Figure 25] Figure 19 shows a cross-sectional view along the cutting line BB (latch member and lever member are omitted). [Figure 26] This is a plan view of the inspection socket when the latch member is positioned above the open position. [Figure 27] This is a cross-sectional view along the cutting line AA in Figure 26. [Figure 28] This is a cross-sectional view at the cutting line BB in Figure 26. [Figure 29] Figure 26 shows a cross-sectional view along the cutting line AA (latch member omitted). [Figure 30] Figure 26 shows a cross-sectional view along the cutting line BB (latch member omitted). [Figure 31] Figure 26 shows a cross-sectional view along the cutting line AA (latch member and lever member are omitted). [Figure 32] Figure 26 shows a cross-sectional view along the cutting line BB (latch member and lever member are omitted). [Figure 33] This is a plan view of the inspection socket when the latch member is in the pressed position. [Figure 34] This is a cross-sectional view along the cutting line AA in Figure 33. [Figure 35] This is a cross-sectional view along the cutting line BB in Figure 33. [Figure 36] Figure 33 shows a cross-sectional view along the cutting line AA (latch member omitted). [Figure 37] Figure 33 shows a cross-sectional view along the cutting line BB (latch member omitted). [Figure 38] Figure 33 shows a cross-sectional view along the cutting line AA (latch member and lever member are omitted). [Figure 39] Figure 33 shows a cross-sectional view along the cutting line BB (latch member and lever member are omitted). [Figure 40] A perspective view of an inspection socket according to a second embodiment of the present invention (semiconductor package: none, cover member: spaced apart). [Figure 41] A perspective view of an inspection socket according to a second embodiment of the present invention (semiconductor package: present, cover member: separated position). [Figure 42] A perspective view of an inspection socket according to a second embodiment of the present invention (semiconductor package: none, cover member: in close proximity). [Figure 43] A perspective view of an inspection socket according to a second embodiment of the present invention (semiconductor package: present, cover member: in close proximity). [Figure 44] Figure 41 shows a cross-sectional view along the cutting line XLIV-XLIV. [Figure 45] Figure 41 is a cross-sectional view along the cutting line XLV-XLV. [Figure 46] This is a perspective view of the lever member and the latch member. [Figure 47] This is a perspective view of the latch component. [Figure 48] This is a plan view of an inspection socket with the latching member in the open position. [Figure 49] This is a cross-sectional view along the cutting line AA in Figure 48. [Figure 50] Figure 48 is a cross-sectional view along the cutting line BB. [Figure 51] This is a plan view of an inspection socket in which the latching member is positioned between the open position and the upper position. [Figure 52] This is a cross-sectional view along the cutting line AA in Figure 51. [Figure 53] Figure 51 is a cross-sectional view along the cutting line BB. [Figure 54] This is a plan view of the inspection socket when the latch member is positioned above the open position. [Figure 55] This is a cross-sectional view along the cutting line AA in Figure 54. [Figure 56] This is a cross-sectional view at the cutting line BB in Figure 54. [Figure 57] This is a plan view of the inspection socket when the latch member is in the pressed position. [Figure 58] This is a cross-sectional view along the cutting line AA in Figure 57. [Figure 59] Figure 57 is a cross-sectional view along the cutting line BB. [Modes for carrying out the invention]

[0029] [First Embodiment] Hereinafter, an inspection socket according to the first embodiment of the present invention will be described with reference to Figures 1 to 39. Note that the "vertical direction," "width direction," and "depth direction" used in the following explanation are approximately orthogonal to each other. However, these terms are used for ease of understanding and do not limit the orientation of the inspection socket during the procedure.

[0030] <Configuration of the inspection socket> The configuration of the inspection socket 100 will be described below.

[0031] As shown in Figures 1 and 2, the test socket 100 is a device on which the semiconductor package 181 is placed when performing a burn-in test on the semiconductor package 181. The burn-in test is performed with the semiconductor package 181, which is placed on the mounting surface 113a of the base portion 113 of the base member 110, being held down by the latch member (pressing member) 150.

[0032] As shown in Figures 1 and 2 and Figures 3 and 4, the latch member 150 is configured to move and rotate in conjunction with the downward / upward movement of the cover member 120. Specifically, moving the cover member 120 from top to bottom causes the latch member 150 to move and rotate to the open position, allowing the semiconductor package 181 to be placed on the mounting surface 113a (the space above the mounting surface 113a is opened, allowing access to the mounting surface 113a). Conversely, moving the cover member 120 from bottom to top causes the latch member 150 to rotate and move to the pressed position, causing the latch member 150 to press down on the semiconductor package 181 placed on the mounting surface 113a.

[0033] The configuration of the inspection socket 100 will be described in detail below. As shown in Figure 5, the inspection socket 100 comprises a base member 110, a cover member 120, a plurality of lever members (transmission members) 140, and a plurality of latch members 150. The inspection socket 100 also includes a link mechanism connecting two or more of the base member 110, cover member 120, lever members 140, and latch members 150. However, the link mechanism may be included in the configuration of the base member 110, cover member 120, lever members 140, and latch members 150.

[0034] As shown in Figures 1 and 5, the base member 110 is a component that is fixed to a substrate (not shown), houses contact pins 171, and on which the semiconductor package 181 is mounted. The base member 110, for example, constitutes the lower part of the inspection socket 100. The base member 110 is formed from an insulating material (for example, resin).

[0035] As shown in Figures 6, 7, and 8, the base member 110 includes, for example, an installation portion 111, a pin housing portion 112, and a base portion 113.

[0036] The mounting portion 111 is a part that is fixed to a substrate (not shown) and constitutes the lower part of the base member 110. As shown in Figure 5, a space is formed in the center of the base member 110 in the depth direction (first orthogonal direction) and width direction (second orthogonal direction), and as shown in Figures 6, 7, and 8, the pin housing portion 112 and the base portion 113 are housed in this space.

[0037] The pin housing section 112 is a part that houses and holds multiple contact pins 171. The contact pin 171 is a pin-shaped component extending in the vertical direction and is made of a conductive material (e.g., metal). The upper end of the contact pin 171, which is housed and held in the pin housing 112, contacts the solder balls of the semiconductor package 181.

[0038] The base portion 113 is the part having a mounting surface 113a on which the semiconductor package 181 is placed. The mounting surface 113a corresponds to the upper surface of the base portion 113. The base portion 113 is attached to the upper part of the pin housing portion 112.

[0039] The base member 110 has multiple horizontal grooves 111a (link mechanism) and multiple vertical grooves 114 (link mechanism) formed therein.

[0040] As shown in Figure 9, the transverse groove 111a is a groove that extends in the width direction and is formed, for example, in the installation portion 111. As shown in Figures 7, 8, and 9, the transverse grooves 111a are formed in pairs on both sides in the width direction. As shown in Figure 9, the two horizontal grooves 111a that make up one pair face each other in the depth direction. As shown in Figure 7, the projections (rotating shaft portions) 143 that protrude in the depth direction of the lever member 140 (link mechanism) are inserted into these lateral grooves 111a. The movement of the projections 143 inserted into the lateral grooves 111a is restricted so that they slide only in the width direction.

[0041] As shown in Figure 8, the vertical grooves 114 are grooves that extend in the vertical direction, and are formed in pairs on both sides (hereinafter referred to as the "lateral region") in the width direction of the mounting surface 113a of the base portion 113, rather than in the lower region of the said lower region. In this embodiment, the vertical groove 114 is defined as, for example, a gap between the mounting portion 111 and the pin housing portion 112. The two vertical grooves 114 that make up one pair face each other in the depth direction. The ends of the second connecting shaft portion 162 (link mechanism), which extends in the depth direction, are inserted into these vertical grooves 114. Therefore, the second connecting shaft portion 162 is located in the lateral region of the mounting surface 113a, rather than the lower region. The movement of the second connecting shaft portion 162 inserted into the vertical grooves 114 is restricted to sliding only in the vertical direction. Note that although Figure 8 only shows the two vertical grooves 114 located at the back in the depth direction, in reality there are also two vertical grooves 114 at the front in the depth direction.

[0042] The base member 110 configured as described above may include parts other than the installation part 111, the pin housing part 112, and the base part 113, or at least one of the installation part 111, the pin housing part 112, and the base part 113 may be divided into multiple parts, or multiple parts constituting the base member 110 may be integrated as appropriate.

[0043] As shown in Figures 1 and 5, and Figures 6, 7 and 8, the cover member 120 is a component that covers the base member 110 from above. The cover member 120, for example, constitutes the upper part of the inspection socket 100. The cover member 120 is formed from an insulating material (for example, resin). A through-opening 121 is formed in the center of the cover member 120 in the depth and width directions, and the base member 110 (specifically the mounting surface 113a of the base portion 113) can be accessed from the through-opening 121.

[0044] As shown in Figures 6, 7, and 8, the cover member 120 has a plurality of shaft holding portions 123 formed thereon. The shaft holding portion 123 is a portion that protrudes downward from the lower ends on both sides in the width direction of the cover member 120, and two are formed on each side (four in total). The two shaft holding parts 123 on the same side are spaced apart and facing each other in the depth direction. The lever member 140 fits into the gap between the two shaft holding parts 123 that are facing each other in the depth direction. A single first connecting shaft portion 161 (link mechanism), which extends in the depth direction, is inserted along the depth direction into two shaft holding portions 123 that face each other in the depth direction. At this time, both ends of the first connecting shaft portion 161 are held by each shaft holding portion 123. In addition, the lever member 140 that fits into the gap between the two shaft holding portions 123 that face each other in the depth direction is pivotally supported by the first connecting shaft portion 161 inserted into the shaft holding portion 123.

[0045] As shown in Figures 5, 6, 7, and 8, the cover member 120 has a plurality of arm portions 122 formed on it. The arm portion 122 is a part that protrudes diagonally downward inward from the inner circumferential walls of the cover member 120 that face each other in the width direction, and one is formed approximately in the center of the depth direction of each of the opposing inner circumferential walls (two in total). A through hole 122a is formed in the arm portion 122. The through hole 122a is a circular hole formed at the tip of the arm portion 122. A slide shaft portion 163 (link mechanism) extending in the depth direction is inserted into this through hole 122a along the depth direction. The through hole 122a is located inward in the width direction compared to the shaft holding portion 123.

[0046] As shown in Figure 5, a plurality of springs 130 that expand and contract in the vertical direction are provided between the cover member 120 and the base member 110. These springs 130 bias the cover member 120 in a direction that separates it from the base member 110 (upward) along the vertical direction. However, the inspection socket 100 is equipped with a mechanism to restrict the range of motion of the cover member 120 so that the cover member 120 does not come off the base member 110 due to the upward force applied by the spring 130.

[0047] When no external force is applied (when it is not being pressed in), the cover member 120 will be in a position (hereinafter referred to as the "separated position") that is as far apart from the base member 110 as possible in the vertical direction, due to the force exerted by the spring 130. On the other hand, by pushing the cover member 120 toward the base member 110 against the force of the spring 130, the cover member 120 moves to a position as close as possible to the base member 110 in the vertical direction (hereinafter referred to as the "proximity position"). It goes without saying that the separation position changes depending on the presence or absence of the semiconductor package 181 and the thickness of the semiconductor package 181.

[0048] Furthermore, if the cover member 120 can be biased upward, other parts besides the spring 130 may be used.

[0049] As shown in Figures 6, 7, and 10, the lever member 140 is a component provided in the lateral region of the base member 110. The lever member 140 is formed from an insulating material (for example, resin). The lever member 140 converts the upward movement (hereinafter also referred to as "upward movement") / downward movement (hereinafter also referred to as "downward movement") of the cover member 120 into downward movement / upward movement of the second connecting shaft portion 162 / latch member 150 and transmits it.

[0050] Each lever member 140 has a through hole 141, a through elongated hole 142, and a plurality of protrusions (rotating shaft portions) 143 formed therein.

[0051] The through hole 141 is a circular hole formed on the outer portion of the lever member 140 in the width direction. The first connecting shaft portion 161, which is inserted into the shaft holding portion 123 of the cover member 120, is inserted into this through hole 141 along the depth direction. As a result, the lever member 140 is connected to the cover member 120 via the first connecting shaft portion 161.

[0052] The through-hole 142 is an elongated hole formed in the inner portion of the lever member 140 in the width direction. The second connecting shaft portion 162 is inserted into this through-hole 142 along the depth direction.

[0053] The projection 143 is a convex portion formed in the width direction between the through hole 141 and the through elongated hole 142. The projections 143 protrude outward from both sides in the depth direction. In other words, there are two projections 143, one at the front and one at the back. These protrusions 143 are inserted into the lateral grooves 111a of the base member 110. This connects the lever member 140 to the base member 110.

[0054] The lever member 140, configured as described above, functions like a lever / seesaw, with the projection 143 as the fulcrum (rotational fulcrum), the first connecting shaft portion 161 as the point of effort, and the second connecting shaft portion 162 as the point of application. In other words, by moving the cover member 120 connected to the first connecting shaft portion 161 upward or downward, the lever member 140 rotates around the projection 143, causing the second connecting shaft portion 162, which is located opposite the first connecting shaft portion 161 relative to the projection 143, to move downward or upward. In this case, the movement of the second connecting shaft portion 162 is restricted by the vertical groove 114, so it slides only in the vertical direction. Also, the movement of the projection 143 is restricted by the horizontal groove 111a, so it slides only in the width direction (moves while rotating).

[0055] As shown in Figures 6, 7, and 11, the latch member 150 is a component, for example, a hook-shaped component, provided in the lateral region of the base member 110. The latch member 150 is formed from an insulating material (for example, resin). The latch member 150 is a component that presses against the upper surface of the semiconductor package 181 placed on the mounting surface 113a, and also opens the top of the mounting surface 113a so that the semiconductor package 181 can be placed on it.

[0056] Each latch member 150 has a through hole 151, at least one slide groove 152 (link mechanism), and a pressing surface 153.

[0057] The pressing surface 153 is the surface (approximately parallel surface) that faces the mounting surface 113a and / or the upper surface of the semiconductor package 181 when the cover member 120 is in a separated position, and is located inward in the width direction from the second connecting shaft portion 162. Hereinafter, the position of the latch member 150 where the pressing surface 153 presses against (contacts with) the upper surface of the semiconductor package 181 is referred to as the "pressing position". The position of the latch member 150 where the upper part of the mounting surface 113a is open so that the semiconductor package 181 can be placed on it, that is, the position of the latch member 150 where the pressing surface 153 is outside the upper region of the mounting surface 113a is referred to as the "open position". Furthermore, the position of the latch member 150 where the pressing surface 153 faces the upper surface of the semiconductor package 181, but the pressing surface 153 is above the semiconductor package 181 and is not pressing against (not in contact with) the semiconductor package 181 is referred to as the "upper position".

[0058] The through hole 151 is a circular hole formed on the inside in the width direction. The second connecting shaft portion 162, which is inserted into the elongated through hole 142 of the lever member 140 and into the vertical groove 114 of the base member 110, is inserted into this through hole 151 along the depth direction. As a result, the latch member 150 is connected to the lever member 140 via the second connecting shaft portion 162, whose movement is restricted by the vertical groove 114.

[0059] The slide groove 152 is a groove formed outside the through hole 151 in the width direction. The slide groove 152 extends vertically when the latch member 150 is in the pressed position or the upper position. The width dimension of the slide groove 152 is approximately equal to, or slightly larger than, the diameter of the slide shaft portion 163. The slide shaft portion 163, which is inserted into the arm portion 122 of the cover member 120, is inserted into this slide groove 152 along the depth direction. As a result, the latch member 150 is connected to the cover member 120 via the slide shaft portion 163. The slide shaft portion 163 slides while constantly contacting one of the parts of the inner circumferential surface of the slide groove 152.

[0060] In this embodiment, two slide grooves 152 are provided for each latch member 150. The two slide grooves 152 (more specifically, the areas where the slide grooves 152 are formed) are spaced apart and facing each other in the depth direction. The arm portion 122 of the cover member 120 fits into the gap between the two opposing slide grooves 152 in the depth direction.

[0061] As shown in Figure 6, a connecting portion 154 is formed at the end of the latch member 150 (the end opposite the pressing surface 153, which is the lower end in Figure 6). The connecting portion 154 is located between the two portions where the slide groove 152 is formed, and is connected to those two portions. In other words, the connecting portion 154 connects the two portions where the slide groove 152 is formed. An arm-facing surface 154a is formed at the connection portion 154. The arm-facing surface 154a is the surface of the cover member 120 that faces the arm portion 122. The arm-facing surface 154a faces upward, for example, when the latch member 150 is in the pressed position or the upper position.

[0062] The latch member 150, configured as described above, moves between the open position, the upper position, and the pressed position. In this configuration, the latch member 150 is pivotally supported by the second connecting shaft portion 162 inserted into the through hole 151, and the slide shaft portion 163 inserted into the arm portion 122 of the cover member 120 is always in contact with the slide groove 152. Therefore, the movement of the latch member 150 is restricted, and instability in the posture is suppressed.

[0063] <Regarding the movement of the inspection socket> The movement of the latch member 150 from the open position to the pressed position after the semiconductor package 181 has been placed on the base portion 113 will be described below.

[0064] Figure 12 shows a plan view from above of the inspection socket 100 with the latch member 150 in the open position. Furthermore, cross-sectional views along cutting lines AA and BB in Figure 12 are shown in Figures 13 and 14. Also, cross-sectional views along cutting lines AA and BB in Figure 12 are shown in Figures 15 and 16 (latch member 150 omitted). Furthermore, cross-sectional views along cutting lines AA and BB in Figure 12 are shown in Figures 17 and 18 (lever member 140 and latch member 150 omitted).

[0065] As shown in Figures 13 to 18, when the cover member 120 is in the proximity position, the latch member 150 is in the open position. The first connecting shaft portion 161 is located at the lowest point within its range of motion. The second connecting shaft portion 162 is located at the highest point within its range of motion. Furthermore, the slide groove 152 of the latch member 150 is inclined in accordance with the inclination of the latch member 150.

[0066] Figure 19 shows a plan view from above of the inspection socket 100, in which the latch member 150 is positioned between the open position and the upper position. Furthermore, cross-sectional views along cutting lines AA and BB in Figure 19 are shown in Figures 20 and 21. Also, cross-sectional views along cutting lines AA and BB in Figure 19 are shown in Figures 22 and 23 (latch member 150 omitted). Furthermore, cross-sectional views along cutting lines AA and BB in Figure 19 are shown in Figures 24 and 25 (lever member 140 and latch member 150 omitted).

[0067] As shown in Figures 20 to 25, when the cover member 120 moves upward from the proximity position (but does not reach the separation position), the latch member 150 is positioned between the open position and the upward position. Specifically, as the latch member 150 rotates around the second connecting shaft portion 162, the pressing surface 153 moves inward in the width direction (the latch member 150 closes). However, the pressing surface 153 does not face the upper surface of the semiconductor package 181. The following explains the movements in detail. In other words, when the cover member 120 moves upward from a close position, the first connecting shaft portion 161 provided on the cover member 120 moves upward. When the first connecting shaft portion 161 moves upward, the lever member 140, which rotates around the projection 143, causes the second connecting shaft portion 162 to move downward. When the second connecting shaft portion 162 moves downward, the latch member 150 connected to the second connecting shaft portion 162 also moves downward. At this time, the slide shaft portion 163, which is a contact portion provided on the cover member 120, comes into contact with the inner circumferential surface of the slide groove 152 formed in the latch member 150, and applies a force to the latch member 150 (slide groove 152) that causes the latch member 150 to rotate around the second connecting shaft portion 162. As a result, the latch member 150 rotates around the second connecting shaft portion 162. In Figure 21, the contact point between the slide shaft portion 163 and the slide groove 152 is indicated by a black circle, and the force that rotates the latch member 150 around the second connecting shaft portion 162 is indicated by a black arrow.

[0068] Figure 26 shows a plan view of the inspection socket 100 as seen from above, when the latch member 150 is positioned above the open position. Furthermore, cross-sectional views along cutting lines AA and BB in Figure 26 are shown in Figures 27 and 28. Also, cross-sectional views along cutting lines AA and BB in Figure 26 are shown in Figures 29 and 30 (latch member 150 omitted). Furthermore, cross-sectional views along cutting lines AA and BB in Figure 26 are shown in Figures 31 and 32 (lever member 140 and latch member 150 omitted).

[0069] As shown in Figures 27 to 32, when the cover member 120 moves further upward (but does not reach the separated position), the latch member 150 is positioned above the open position. Specifically, as the latch member 150 rotates further around the second connecting shaft 162, the pressing surface 153 moves further inward in the width direction, so that the pressing surface 153 faces the upper surface of the semiconductor package 181 (but does not make contact). The following explains the movements in detail. In other words, as the cover member 120 moves further upward, the first connecting shaft portion 161 provided on the cover member 120 moves further upward. As the first connecting shaft portion 161 moves further upward, the lever member 140, which rotates around the projection 143, causes the second connecting shaft portion 162 to move further downward. As the second connecting shaft portion 162 moves further downward, the latch member 150 connected to the second connecting shaft portion 162 also moves further downward. At this time, the slide shaft portion 163, which is a contact portion provided on the cover member 120, comes into contact with the inner circumferential surface of the slide groove 152 formed in the latch member 150, and applies a force to the latch member 150 (slide groove 152) that causes the latch member 150 to rotate around the second connecting shaft portion 162. When the latch member 150 moves downward and rotates around the second connecting shaft portion 162, and the extending direction of the slide groove 152 substantially coincides with the vertical direction, the slide shaft portion 163, which moves only in the vertical direction, simply slides up and down along the slide groove 152, and no force is applied to the latch member 150 (slide groove 152) that would cause the latch member 150 to rotate around the second connecting shaft portion 162. This completes the rotation of the latch member 150. That is, the latch member 150 is positioned above the open position, and the pressing surface 153 faces the upper surface of the semiconductor package 181 (but does not make contact).

[0070] The section in which the cover member 120 moves upward by a predetermined distance from the proximity position while the latch member 150 moves from the open position to the upward position is referred to as the "first section".

[0071] Figure 33 shows a plan view of the inspection socket 100 as seen from above when the latch member 150 is in the pressed position. Furthermore, cross-sectional views along cutting lines AA and BB in Figure 33 are shown in Figures 34 and 35. Also, cross-sectional views along cutting lines AA and BB in Figure 33 are shown in Figures 36 and 37 (latch member 150 omitted). Furthermore, cross-sectional views along cutting lines AA and BB in Figure 33 are shown in Figures 38 and 39 (lever member 140 and latch member 150 omitted).

[0072] As shown in Figures 34 to 39, when the cover member 120 moves further upward and reaches the separation position, the latch member 150 moves from the upper position to the pressing position. Specifically, as the latch member 150 moves downward, the pressing surface 153 comes into contact with the upper surface of the semiconductor package 181 and presses the semiconductor package 181. The following explains the movements in detail. In other words, as the cover member 120 moves further upward, the first connecting shaft portion 161 provided on the cover member 120 moves further upward. As the first connecting shaft portion 161 moves further upward, the lever member 140, which rotates around the projection 143, causes the second connecting shaft portion 162 to move further downward. As the second connecting shaft portion 162 moves further downward, the latch member 150 connected to the second connecting shaft portion 162 also moves further downward. As described above, the slide shaft portion 163 provided on the cover member 120 is already in a state where it does not apply a force to the latch member 150 (slide groove 152) that would cause the latch member 150 to rotate. Therefore, the latch member 150 simply moves downward. However, the slide shaft portion 163 is in contact with the slide groove 152, which suppresses wobbling of the latch member 150. As the latch member 150 moves further downward, the pressing surface 153 eventually comes into contact with the upper surface of the semiconductor package 181 and presses against the semiconductor package 181. In other words, the latch member 150 is positioned in the pressing position.

[0073] The section from when the latch member 150 moves from the upper position to the pressing position until the cover member 120 moves further upward to reach the release position is called the "second section." In other words, the section from the end of the first section to the release position is called the "second section."

[0074] While the latch member 150 moves from the upper position to the pressing position, the latch member 150 moves only downward along the vertical direction and does not move in the width direction or depth direction. Therefore, the pressing surface 153 that contacts the upper surface of the semiconductor package 181 does not move in the width direction or depth direction, so the pressing surface 153 does not rub against and scratch the upper surface of the semiconductor package 181. Furthermore, by ensuring an appropriate distance for the latch member 150 to move from the upper position to the pressing position (i.e., the distance it moves only in the vertical direction), the inspection socket 100 can be adapted to the specifications of semiconductor packages 181 having various thicknesses.

[0075] Furthermore, when moving the latch member 150 from the pressed position to the released position, the cover member 120, which is in the separated position, is pushed toward the base member 110. At this time, the cover member 120 moves from the separated position through the second section and the first section to reach the adjacent position. When the cover member 120 is moving toward the proximity position in the first section, the slide shaft portion 163, which is a contact portion provided on the cover member 120, contacts the lower part of the inner circumferential surface of the slide groove 152 formed in the latch member 150, and applies a force to the latch member 150 (slide groove 152) that causes the latch member 150 to rotate around the second connecting shaft portion 162. As the latch member 150 rotates around the second connecting shaft portion 162, the pressing surface 153 moves outward in the width direction (the latch member 150 opens). As shown in Figure 11, an inclined surface 152a may be formed on the lower part of the inner circumferential surface of the slide groove 152 that contacts the slide shaft portion 163 when the latch member 150 opens. The inclined surface 152a is a plane that is inclined diagonally downward from the outside in the width direction toward the inside. When the slide shaft portion 163 contacts this inclined surface 152a, a downward and outward force (a force that rotates the latch member 150 around the second connecting shaft portion 162) is applied to the slide groove 152, and as a result, the latch member 150 can be reliably rotated. However, the lower part of the inner circumferential surface of the slide groove 152 does not have to be the inclined surface 152a, and may be a simple circumferential surface, for example, as shown by the dashed line in Figure 11. Even in this case, the slide shaft portion 163 as the contact part contacts the lower end of the inner circumferential surface of the slide groove 152, and a downward force (a force that rotates the latch member 150 around the second connecting shaft portion 162) can be applied to the slide groove 152. Furthermore, when the cover member 120 is moving toward the proximity position in the first section, the lower end of the arm portion 122, which serves as a contact portion on the cover member 120, may be brought into contact with the arm-facing surface 154a (see Figure 6) formed on the latch member 150, thereby applying a force to the latch member 150 (arm-facing surface 154a) that causes the latch member 150 to rotate around the second connecting shaft portion 162.

[0076] <Example 1> Although the first connecting shaft portion 161 was originally a separate part from the cover member 120 and the lever member 140, it may be formed integrally with the cover member 120 or the lever member 140. Furthermore, although the second connecting shaft portion 162 was a separate part from the latch member 150, it may be formed integrally with the latch member 150. Furthermore, although the slide shaft portion 163 was previously a separate part from the cover member 120, it may be formed integrally with the cover member 120. Furthermore, although the projection 143 was formed integrally with the lever member 140, the projection 143 may be replaced by inserting a separate shaft-shaped component into the lever member 140.

[0077] <Modification 2> The latch member 150 was rotated by bringing the slide shaft portion 163 into contact with the slide groove 152, but the mechanism for applying a force to rotate the latch member 150 is not limited to combinations of these parts. For example, the arm portion 122 of the cover member 120 may be brought into contact with any part of the latch member 150 to apply a force to rotate the latch member 150. Alternatively, the center of gravity of the latch member 150 may be appropriately set to apply a force to rotate the latch member 150.

[0078] <Variation 3> The inspection socket 100 described so far has two latch members 150 facing each other in the width direction. However, if the size of the semiconductor package 181 is large, for example, the inspection socket 100 may have two other latch members 150 facing each other in the depth direction. In this case, the total number of shaft holding portions 123 formed on the cover member 120 will be eight.

[0079] <Effects of this embodiment> When the cover member 120 is in the first section, the latch member 150 is restricted by the link mechanism to move from the open position to the upper position by rotating around the second connecting shaft portion 162 along the depth direction. When the cover member 120 is in the second section, the latch member 150 is restricted by the link mechanism to move only downwards to move from the upper position to the pressed position. Therefore, when the latch member 150 presses against the semiconductor package 181 or just before it presses against it, the latch member 150 moves only downwards and does not move horizontally (in the depth direction and width direction). As a result, the latch member 150 does not move horizontally on the upper surface of the semiconductor package 181 placed on the mounting surface 113a and rub against and scratch the upper surface of the semiconductor package 181. Furthermore, the movement of the latch member 150 is constantly restricted by the link mechanism while it moves from the open position to the pressed position. As a result, the latch member 150 does not wobble or its wobbling is suppressed, so the semiconductor package 181 is not damaged due to the wobbling of the latch member 150.

[0080] Since the second connecting shaft portion 162 is located laterally (in the lateral region) in the width direction of the lower region of the mounting surface 113a, it becomes easier to position the latch member 150, which has the second connecting shaft portion 162 as its pivot point, in the lateral region. This allows the rotation angle (opening / closing angle) of the latch member 150 required to open the upper part of the mounting surface 113a to be reduced compared to the case where the pivot center (second connecting shaft portion 162) of the latch member 150 is located in the lower region of the mounting surface 113a. In other words, in an inspection socket 100 with size constraints, the range of motion of the latch member 150 for opening the upper part of the mounting surface 113a can be reduced, thus enabling efficient opening of the upper part of the mounting surface 113a.

[0081] The link mechanism has a slide shaft portion 163 as a contact portion, and the slide shaft portion 163 is provided on the cover member 120. When the cover member 120 is in the first section, a force is applied to the latch member 150 that rotates it around the second connecting shaft portion 162, so that the latch member 150 can be reliably rotated.

[0082] [Second Embodiment] Hereinafter, an inspection socket according to a second embodiment of the present invention will be described with reference to Figures 40 to 59. Note that the "vertical direction," "width direction," and "depth direction" used in the following explanation are approximately orthogonal to each other. However, these terms are used for ease of understanding and do not limit the orientation of the inspection socket during the procedure.

[0083] <Configuration of the inspection socket> The configuration of the inspection socket 200 will be described below.

[0084] As shown in Figures 40 and 41, the test socket 200 is the device on which the semiconductor package 281 is placed when performing a burn-in test on the semiconductor package 281. The burn-in test is performed with the semiconductor package 281, which is placed on the mounting surface 213a of the base portion 213 of the base member 210, being held down by the latch member (pressing member) 250.

[0085] As shown in Figures 40 and 41 and Figures 42 and 43, the latch member 250 is configured to move and rotate in conjunction with the downward / upward movement of the cover member 220. Specifically, moving the cover member 220 from top to bottom causes the latch member 250 to move and rotate to the open position, allowing the semiconductor package 281 to be placed on the mounting surface 213a (the space above the mounting surface 213a is opened, allowing access to the mounting surface 213a). Conversely, moving the cover member 220 from bottom to top causes the latch member 250 to rotate and move to the pressed position, causing the latch member 250 to press down on the semiconductor package 281 placed on the mounting surface 213a.

[0086] The configuration of the inspection socket 200 will be described in detail below. As shown in Figures 40, 41, and 44, the inspection socket 200 comprises a base member 210, a cover member 220, a plurality of lever members (transmission members) 240, and a plurality of latch members 250. The inspection socket 200 also includes a link mechanism connecting two or more of the base member 210, cover member 220, lever members 240, and latch members 250. However, the link mechanism may be included in the configuration of the base member 210, cover member 220, lever members 240, and latch members 250.

[0087] The base member 210 is a component that is fixed to a substrate (not shown), houses contact pins 271, and on which the semiconductor package 281 is mounted. The base member 210, for example, constitutes the lower part of the inspection socket 200. The base member 210 is formed from an insulating material (for example, resin).

[0088] As shown in Figures 44 and 45, the base member 210 includes, for example, a pin housing portion 212 and a base portion 213.

[0089] The pin housing section 212 is fixed to a substrate (not shown) and houses and holds a plurality of contact pins 271, and constitutes the lower part of the base member 210. The contact pin 271 is a pin-shaped component extending in the vertical direction and is made of a conductive material (e.g., metal). The upper end of the contact pin 271, which is housed and held in the pin housing 212, contacts the solder balls of the semiconductor package 281.

[0090] The base portion 213 is the part having a mounting surface 213a on which the semiconductor package 281 is placed. The mounting surface 213a corresponds to the upper surface of the base portion 213. The base portion 213 is attached to the upper part of the pin housing portion 212.

[0091] The base member 210 has multiple slide grooves 212a (link mechanism) and through holes 212b formed therein.

[0092] As shown in Figure 45, the slide groove 212a is a groove that includes a lower groove portion 212a1 extending in the vertical direction and an upper groove portion 212a2 that connects to the upper end of the lower groove portion 212a1 and extends diagonally upward toward the outside in the width direction, and is formed, for example, in the pin housing portion 212. The width dimension of the slide groove 212a is approximately equal to, or slightly larger than, the diameter of the second connecting shaft portion 262 and the slide shaft portion 263. The slide grooves 212a are formed in pairs on both sides in the width direction of the mounting surface 213a of the base portion 213 (hereinafter referred to as the "lateral region"), rather than in the lower region of the said lower region. The two sliding grooves 212a that make up one pair are facing each other in the depth direction. The ends of the second connecting shaft portion 262 (link mechanism), which extends in the depth direction, and the ends of the slide shaft portion 263 (link mechanism), which also extends in the depth direction, are inserted into these slide grooves 212a. Therefore, the second connecting shaft portion 262 and the slide shaft portion 263 are located in the lateral region of the mounting surface 213a, rather than the lower region. The movement of the second connecting shaft portion 262 and the slide shaft portion 263, inserted into the slide grooves 212a, is restricted so that they slide along the slide grooves 212a.

[0093] The through hole 212b is a circular hole formed outside the lower groove portion 212a1 of the slide groove 212a in the width direction. A pivot shaft portion 264 (link mechanism) extending in the depth direction is inserted into this through hole 212b along the depth direction.

[0094] The base member 210 configured as described above may include parts other than the pin housing portion 212 and the base portion 213, or at least one of the pin housing portion 212 and the base portion 213 may be divided into multiple parts, or multiple parts constituting the base member 210 may be integrated as appropriate.

[0095] As shown in Figures 40 and 41 and Figures 44 and 45, the cover member 220 is a component that covers the base member 210 from above. The cover member 220, for example, constitutes the upper part of the inspection socket 200. The cover member 220 is formed from an insulating material (for example, resin). A through-opening 221 is formed in the center of the cover member 220 in the depth and width directions, and the base member 210 (specifically the mounting surface 213a of the base portion 213) can be accessed from the through-opening 221.

[0096] Multiple shaft holding portions 223 are formed on the cover member 220. The shaft holding portion 223 is a portion that protrudes downward from the lower ends on both sides in the width direction of the cover member 220, and two are formed on each side (four in total). The two shaft holders 223 on the same side are spaced apart and facing each other in the depth direction. A single first connecting shaft portion 261 (link mechanism), which extends in the depth direction, is inserted along the depth direction into the two opposing shaft holding portions 223. At this time, both ends of the first connecting shaft portion 261 are held by each shaft holding portion 223.

[0097] As shown in Figures 40 and 41, a slit 223a is formed in each shaft holding portion 223. Slit 223a is a slit (a long, narrow gap) that extends upward from the lower end of the shaft holding portion 223. The lever member 240 fits into this slit 223a. At this time, the lever member 240 that has entered the slit 223a is pivotally supported by the first connecting shaft portion 261 which is inserted into the shaft holding portion 223.

[0098] A spring 230 that expands and contracts in the vertical direction is provided between the cover member 220 and the base member 210. These springs 230 bias the cover member 220 in an upward direction, moving it away from the base member 210 along the vertical direction. However, the inspection socket 200 is equipped with a mechanism to restrict the range of motion of the cover member 220 so that the cover member 220 does not come off the base member 210 due to the upward force applied by the spring 230.

[0099] When no external force is applied (when it is not being pressed in), the cover member 220 will remain in a position (hereinafter referred to as the "separated position") that is as far apart from the base member 210 as possible in the vertical direction, due to the force exerted by the spring 230. On the other hand, by pushing the cover member 220 toward the base member 210 in opposition to the force of the spring 230, the cover member 220 moves to a position as close as possible to the base member 210 in the vertical direction (hereinafter referred to as the "proximity position"). It goes without saying that the separation position changes depending on the presence or absence of the semiconductor package 281 and the thickness of the semiconductor package 281.

[0100] Furthermore, if the cover member 220 can be biased upward, other parts besides the spring 230 may be used.

[0101] As shown in Figures 44, 45, and 46, the lever member 240 is a component provided in the lateral region of the base member 210. The lever member 240 is formed from, for example, metal or resin. The lever member 240 converts the upward movement (hereinafter also referred to as "upward movement") / downward movement (hereinafter also referred to as "downward movement") of the cover member 220 into downward movement / upward movement of the second connecting shaft portion 262 / latch member 250 and transmits it.

[0102] Each lever member 240 has a through-hole 241, a tip groove 242, and a through-hole 243 formed therein.

[0103] The through-hole 241 is an elongated hole formed on the outer portion of the lever member 240 in the width direction. The first connecting shaft portion 261, which is inserted into the shaft holding portion 223 of the cover member 220, is inserted into this through-hole 241 along the depth direction. As a result, the lever member 240 is connected to the cover member 220 via the first connecting shaft portion 261.

[0104] The tip groove 242 is a groove formed in the inner portion of the lever member 240 in the width direction. The tip groove 242 is formed, for example, by the tip of the lever member 240 being split into two. The second connecting shaft portion 262 is inserted into this tip groove 242.

[0105] The through hole 243 is a circular hole formed in the width direction between the through elongated hole 241 and the tip groove 242. The pivot shaft portion 264, which is inserted into the through hole 212b of the base member 210, is inserted into the through hole 243 along the depth direction. As a result, the lever member 240 is connected to the base member 210 via the pivot shaft portion 264.

[0106] The lever member 240, configured as described above, functions like a lever / seesaw, with the pivot shaft portion 264 as the fulcrum (rotation fulcrum), the first connecting shaft portion 261 as the point of effort, and the second connecting shaft portion 262 as the point of application. In other words, by moving the cover member 220 connected to the first connecting shaft portion 261 upward or downward, the lever member 240 rotates around the pivot shaft portion 264, causing the second connecting shaft portion 262, which is located opposite the first connecting shaft portion 261 relative to the pivot shaft portion 264, to move downward or upward. In this state, the movement of the second connecting shaft portion 262 is restricted by the lower groove portion 212a1 of the slide groove 212a, so it slides only in the vertical direction. The second connecting shaft portion 262 does not reach the upper groove portion 212a2 of the slide groove 212a.

[0107] As shown in Figures 44 and 45 and Figures 46 and 47, the latch member 250 is a component provided in the lateral region of the base member 210. The latch member 250 is a component that presses against the upper surface of the semiconductor package 281 placed on the mounting surface 213a, and also opens up the top of the mounting surface 213a so that the semiconductor package 281 can be placed on it.

[0108] The latch member 250 has a main body portion 251 and a pressing portion 252.

[0109] The main body portion 251 is a component, for example, a hook-shaped component, provided in the lateral region of the base member 210. The main body 251 is formed from an insulating material (for example, resin).

[0110] The pressing portion 252 is a member pivotally supported at the tip of the main body portion 251. The pressing portion 252 is formed from an insulating material (for example, resin). As shown in Figure 47, each pressing portion 252 has a pressing surface 252a and a projection 252b formed thereon.

[0111] The pressing surface 252a is the surface (approximately parallel) that faces the mounting surface 213a and / or the upper surface of the semiconductor package 281 when the cover member 220 is in a separated position, and is located inward in the width direction from the second connecting shaft portion 262. Hereinafter, the position of the latch member 250 where the pressing surface 252a presses against (contacts with) the upper surface of the semiconductor package 281 is referred to as the "pressing position". The position of the latch member 250 where the upper part of the mounting surface 213a is open so that the semiconductor package 281 can be placed on it, that is, the position of the latch member 250 where the pressing surface 252a is outside the upper region of the mounting surface 213a is referred to as the "open position". Furthermore, the position of the latch member 250 where the pressing surface 252a faces the upper surface of the semiconductor package 281, but the pressing surface 252a is above the semiconductor package 281 and is not pressing against (not in contact with) the semiconductor package 281 is referred to as the "upper position".

[0112] The projection 252b is a convex portion formed above the pressing surface 252a. The projections 252b protrude inward from both sides in the depth direction. In other words, there are two projections 252b, one at the front and one at the back. These protrusions 252b are fitted into recesses 251c formed at the tip of the main body portion 251. Further details will be provided later.

[0113] As shown in Figures 46 and 47, each main body portion 251 has a lower through hole 251a, an upper through hole 251b, and a recess 251c formed therein.

[0114] The recess 251c is a concave portion formed at the tip of the main body 251. Recess 251c is recessed inward from both sides in the depth direction. The projections 252b of the pressing portion 252 are fitted into these recesses 251c from the outside. This allows the pressing portion 252 to be rotatably connected to the main body portion 251. There is a gap between the outer surface of the projection 252b and the inner surface of the recess 251c, allowing the pressing portion 252 to swing like a pendulum relative to the main body portion 251. This makes it easier for the pressing surface 252a to make surface contact with the upper surface of the semiconductor package 281. However, a mechanism to restrict the rotational range of the pressing portion 252 so that the pressing portion 252 does not swing excessively relative to the main body portion 251 may be provided in the main body portion 251 and / or the pressing portion 252.

[0115] The lower through-hole 251a is a circular hole. The second connecting shaft portion 262, which is inserted into the tip groove 242 of the lever member 240 and into the lower groove portion 212a1 of the slide groove 212a of the base member 210, is inserted into this lower through hole 251a along the depth direction. As a result, the latch member 250 is connected to the lever member 240 via the second connecting shaft portion 262.

[0116] The upper through-hole 251b is a circular hole formed directly above the lower through-hole 251a when the latch member 250 is in the pressed position or the upper position. The slide shaft portion 263, which is inserted into the slide groove 212a of the base member 210, is inserted into this upper through hole 251b along the depth direction. As a result, the latch member 250 is connected to the base member 210 via the slide shaft portion 263. The slide shaft portion 263 slides while constantly contacting one of the inner surfaces of the slide groove 212a.

[0117] The latch member 250, configured as described above, moves between the open position, the upper position, and the pressed position. In this case, the latch member 250 has two shafts, the second connecting shaft portion 262 inserted into the lower through hole 251a and the slide shaft portion 263 inserted into the upper through hole 251b, which are always in contact with the slide groove 212a of the base member 210. This restricts the movement of the latch member 250 and suppresses instability in its posture.

[0118] <Regarding the movement of the inspection socket> The movement of the latch member 250 from the open position to the pressed position after the semiconductor package 281 has been placed on the base portion 213 will be described below.

[0119] Figure 48 shows a plan view from above of the inspection socket 200 with the latch member 250 in the open position. Furthermore, cross-sectional views at cutting lines AA and BB in Figure 48 are shown in Figures 49 and 50.

[0120] As shown in Figures 49 and 50, when the cover member 220 is in the proximity position, the latch member 250 is in the open position. The first connecting shaft portion 261 is located at the lowest point within its range of motion. The second connecting shaft portion 262 is located at the highest point within its range of motion (for example, near the upper end of the lower groove portion 212a1 of the slide groove 212a formed in the base member 210). The slide shaft portion 263 is located at the highest and outermost point within its range of motion (for example, near the upper end of the upper groove portion 212a2 of the slide groove 212a formed in the base member 210).

[0121] Figure 51 shows a plan view from above of the inspection socket 200, in which the latch member 250 is positioned between the open position and the upper position. Furthermore, cross-sectional views at cutting lines AA and BB in Figure 51 are shown in Figures 52 and 53.

[0122] As shown in Figures 52 and 53, when the cover member 220 moves upward from the proximity position (but does not reach the separation position), the latch member 250 is positioned between the open position and the upward position. Specifically, the latch member 250 rotates around the second connecting shaft portion 262, causing the pressing portion 252 to move inward in the width direction (the latch member 250 closes). However, the pressing surface 252a of the pressing portion 252 does not face the upper surface of the semiconductor package 281. The following explains the movements in detail. In other words, when the cover member 220 moves upward from a close position, the first connecting shaft portion 261 provided on the cover member 220 moves upward. When the first connecting shaft portion 261 moves upward, the lever member 240, which rotates around the pivot shaft portion 264, causes the second connecting shaft portion 262 to move downward. When the second connecting shaft portion 262 moves downward, the latch member 250 connected to the second connecting shaft portion 262 also moves downward. At this time, the slide shaft portion 263 provided on the latch member 250 slides vertically and horizontally along the upper groove portion 212a2 of the slide groove 212a, which is a contact portion formed in the base member 210, while in contact with the inner surface of the upper groove portion 212a2. As the slide shaft portion 263 slides, the upper groove portion 212a2 of the slide groove 212a, which is a contact portion, applies a force to the latch member 250 (slide shaft portion 263) that causes the latch member 250 to rotate around the second connecting shaft portion 262. As a result, the latch member 250 rotates around the second connecting shaft portion 262. In Figure 53, the contact point between the slide shaft portion 263 and the slide groove 212a is indicated by a black circle, and the force that rotates the latch member 250 around the second connecting shaft portion 262 is indicated by a black arrow.

[0123] Figure 54 shows a plan view of the inspection socket 200 as seen from above, when the latch member 250 is positioned above the open position. Furthermore, cross-sectional views at cutting lines AA and BB in Figure 54 are shown in Figures 55 and 56.

[0124] As shown in Figures 55 and 56, when the cover member 220 moves further upward (but does not reach the separated position), the latch member 250 is positioned above the open position. Specifically, as the latch member 250 rotates further around the second connecting shaft 262, the pressing portion 252 moves further inward in the width direction, and the pressing surface 252a faces (but does not make contact with) the upper surface of the semiconductor package 281. The following explains the movements in detail. In other words, as the cover member 220 moves further upward, the first connecting shaft portion 261 provided on the cover member 220 moves further upward. As the first connecting shaft portion 261 moves further upward, the lever member 240, which rotates around the pivot shaft portion 264, causes the second connecting shaft portion 262 to move further downward. As the second connecting shaft portion 262 moves further downward, the latch member 250 connected to the second connecting shaft portion 262 also moves further downward. At this time, the slide shaft portion 263 provided on the latch member 250 slides vertically and horizontally along the upper groove portion 212a2 of the slide groove 212a, which is a contact portion formed in the base member 210, while in contact with the inner surface of the upper groove portion 212a2. As the slide shaft portion 263 slides, the upper groove portion 212a2 of the slide groove 212a, which is a contact portion, applies a force to the latch member 250 (slide shaft portion 263) that causes the latch member 250 to rotate around the second connecting shaft portion 262. When the latch member 250 moves downward and rotates around the second connecting shaft 262, causing the slide shaft 263 to reach the lower groove 212a1 of the slide groove 212a, the slide shaft 263 simply slides vertically along the lower groove 212a1 of the slide groove 212a, and no force is applied to rotate the latch member 250 around the second connecting shaft 262. At this time, the slide shaft 263 is positioned directly above the second connecting shaft 262. This completes the rotation of the latch member 250. That is, the latch member 250 is positioned above the open position, and the pressing surface 252a of the pressing portion 252 faces the upper surface of the semiconductor package 281 (but they are not in contact).

[0125] The section in which the cover member 220 moves upward by a predetermined distance from the proximity position while the latch member 250 moves from the open position to the upward position is referred to as the "first section."

[0126] Figure 57 shows a plan view of the inspection socket 200 as seen from above when the latch member 250 is in the pressed position. Furthermore, cross-sectional views at cutting lines AA and BB in Figure 57 are shown in Figures 58 and 59.

[0127] As shown in Figures 58 and 59, when the cover member 220 moves further upward and reaches the separation position, the latch member 250 moves from the upper position to the pressing position. Specifically, as the latch member 250 moves downward, the pressing surface 252a of the pressing portion 252 comes into contact with the upper surface of the semiconductor package 281 and presses the semiconductor package 281. The following explains the movements in detail. In other words, as the cover member 220 moves further upward, the first connecting shaft portion 261 provided on the cover member 220 moves further upward. As the first connecting shaft portion 261 moves further upward, the lever member 240, which rotates around the pivot shaft portion 264, causes the second connecting shaft portion 262 to move further downward. As the second connecting shaft portion 262 moves further downward, the latch member 250 connected to the second connecting shaft portion 262 also moves further downward. As described above, the slide groove 212a of the base member 210 is already in a state where it does not impart any force to the latch member 250 (slide shaft portion 263) that would cause the latch member 250 to rotate. Therefore, the latch member 250 simply moves downward. However, the slide shaft portion 263 is in contact with the slide groove 212a (lower groove portion 212a1), which suppresses wobbling of the latch member 250. As the latch member 250 moves further downward, the pressing surface 252a of the pressing portion 252 eventually comes into contact with the upper surface of the semiconductor package 281 and presses against the semiconductor package 281. In other words, the latch member 250 is positioned in the pressing position.

[0128] The section from when the latch member 250 moves from the upper position to the pressing position until the cover member 220 moves further upward to reach the release position is called the "second section." In other words, the section from the end of the first section to the release position is called the "second section."

[0129] While the latch member 250 moves from the upper position to the pressing position, the latch member 250 moves only downward along the vertical direction and does not move in the width direction or depth direction. Therefore, the pressing surface 252a of the pressing portion 252 that contacts the upper surface of the semiconductor package 281 does not move in the width direction or depth direction, so the pressing surface 252a does not rub against and scratch the upper surface of the semiconductor package 281. Furthermore, by ensuring an appropriate distance for the latch member 250 to move from the upper position to the pressing position (i.e., the distance it moves only in the vertical direction), the inspection socket 200 can be adapted to the specifications of semiconductor packages 281 having various thicknesses.

[0130] When moving the latch member 250 from the pressed position to the released position, the cover member 220, which is in the separated position, is pushed toward the base member 210. At this time, the cover member 220 moves from the separated position through the second section and the first section to reach the adjacent position. As the cover member 220 moves toward the proximity position in the first section, the slide shaft portion 263, which serves as a contact portion on the latch member 250, slides vertically and in the widthwise direction along the upper groove portion 212a2 of the slide groove 212a formed in the base member 210, while in contact with the inner surface of the upper groove portion 212a2 of the slide groove 212a, which serves as a contact portion. As the slide shaft portion 263 slides, the upper groove portion 212a2 of the slide groove 212a, which serves as a contact portion, applies a force to the latch member 250 (slide shaft portion 263) that causes the latch member 250 to rotate around the second connecting shaft portion 262. As the latch member 250 rotates around the second connecting shaft portion 262, the pressing portion 252 moves outward in the widthwise direction (the latch member 150 opens). For example, as shown in Figure 56, the inner surface of the upper groove 212a2 includes an upper surface and a lower surface that face each other. When opening the latch member 250, the surface that applies force to the slide shaft 263 is the upper surface of the upper groove 212a2 (the surface facing downwards, i.e., the surface that applies downward force). Conversely, when closing the latch member 250, the surface that applies force to the slide shaft 263 is the lower surface of the upper groove 212a2 (the surface facing upwards, i.e., the surface that applies upward force).

[0131] <Modification 4> Although the first connecting shaft portion 261 was a separate part from the cover member 220, it may be formed integrally with the cover member 220. Furthermore, although the second connecting shaft portion 262 was previously a separate part from the latch member 250, it may be formed integrally with the latch member 250. Furthermore, although the slide shaft portion 263 was previously a separate part from the latch member 250, it may be formed integrally with the latch member 250. Furthermore, although the pivot shaft portion 264 was previously a separate part from the base member 210 and the lever member 240, it may be formed integrally with the base member 210 or the lever member 240.

[0132] <Modification 5> Although the projection 252b of the pressing portion 252 of the latch member 250 was formed integrally with the pressing portion 252, the projection 252b may be replaced by inserting a separate shaft-shaped component into the pressing portion 252 and the main body portion 251.

[0133] <Variation 6> The inspection socket 200 described so far has two latch members 250 facing each other in the width direction. However, if the size of the semiconductor package 281 is large, for example, the inspection socket 200 may have two other latch members 250 facing each other in the depth direction. In this case, the total number of shaft holding portions 223 formed on the cover member 220 will be eight.

[0134] <Effects of this embodiment> When the cover member 220 is in the first section, the latch member 250 is restricted by the link mechanism to move from the open position to the upper position by rotating around the second connecting shaft portion 262 along the depth direction. When the cover member 220 is in the second section, the latch member 250 is restricted by the link mechanism to move only downwards to move from the upper position to the pressed position. Therefore, when the latch member 250 presses against the semiconductor package 281 or just before it presses against it, the latch member 250 moves only downwards and does not move horizontally (in the depth direction and width direction). As a result, the latch member 250 does not move horizontally on the upper surface of the semiconductor package 281 placed on the mounting surface 213a and rub against and scratch the upper surface of the semiconductor package 281. Furthermore, the movement of the latch member 250 is constantly restricted by the link mechanism while it moves from the open position to the pressed position. Therefore, the latch member 250 does not wobble or its wobbling is suppressed, and thus the semiconductor package 281 is not damaged due to the wobbling of the latch member 250.

[0135] Since the second connecting shaft portion 262 is located laterally (lateral region) in the width direction of the lower region of the mounting surface 213a, it becomes easier to position the latch member 250, which has the second connecting shaft portion 262 as its pivot point, in the lateral region. This allows the rotation angle (opening / closing angle) of the latch member 250 required to open the upper part of the mounting surface 213a to be reduced compared to the case where the pivot center (second connecting shaft portion 262) of the latch member 250 is located in the lower region of the mounting surface 213a. In other words, in an inspection socket 200 with size constraints, the range of motion of the latch member 250 for opening the upper part of the mounting surface 213a can be reduced, thus enabling efficient opening of the upper part of the mounting surface 213a.

[0136] The link mechanism has a slide groove 212a as a contact portion, and the slide groove 212a is provided on the base member 210, and when the cover member 220 is in the first section, it applies a force to the latch member 250 that rotates the latch member 250 around the second connecting shaft portion 262, so that the latch member 250 can be reliably rotated. [Explanation of symbols]

[0137] 100 Inspection Sockets 110 Base member 111 Installation section 111a Transverse groove (link mechanism) 112 Pin housing 113 Base 113a Mounting surface 114. Longitudinal groove (link mechanism) 120 Cover component 121 Through-opening 122 Arm section 122a Through hole 123 Shaft holding part 130 Spring 140 Lever members (transmission members, linkage mechanisms) 141 Through hole 142 Through-hole elongated hole 143 Protrusion 150 Latch member (pressing member) 151 Through hole 152 Slide groove (link mechanism) 152a Slope 153 Pressing surface 154 Connection part 154a Arm opposing surface 161 First connecting shaft section (link mechanism) 162 Second connecting shaft section (link mechanism) 163 Slide shaft section (link mechanism, contact section) 171 Contact pins 181 Semiconductor Packages 200 Inspection Sockets 210 Base member 212 Pin housing 212a Slide groove (link mechanism) 212a1 Bottom groove 212a2 Upper groove 212b Through hole 213 Base 213a Mounting surface 220 Cover component 221 Through-opening 223 Shaft holding part 223a Slit 230 Spring 240 Lever members (transmission members, linkage mechanisms) 241 Through-hole 242 Tip groove 243 Through hole 250 Latch member (pressing member) 251 Main body 251a Lower through hole 251b Upper through hole 251c depression 252 Pressing part 252a Pressing surface 252b Protrusion 261 First connecting shaft section (link mechanism) 262 Second connecting shaft section (link mechanism) 263 Slide shaft section (link mechanism) 264. Rotating shaft section (link mechanism) 271 Contact pin 281 Semiconductor Packages

Claims

1. A base member having a mounting surface on which a semiconductor package is placed, A cover member is attached to the base member and moves along a vertical direction perpendicular to the aforementioned mounting surface between a close position close to the base member and a separate position away from the base member, At least one pressing member moves between an open position that leaves the top of the mounting surface open so that the semiconductor package can be placed on it, and a pressing position that presses the top surface of the semiconductor package placed on the mounting surface, A link mechanism that moves the pressing member between the open position and the pressing position in accordance with the vertical movement of the cover member, Equipped with, The pressing member is, In the first section in which the cover member moves upward by a predetermined distance from the proximity position, the movement is restricted by the link mechanism so that it moves upward from the open position to the aforementioned mounting surface by rotating around an axis along a first orthogonal direction perpendicular to the vertical direction. In the second section, until the cover member moves further upward to reach the separation position, the link mechanism restricts its movement so that it moves only downward to reach the pressing position. The link mechanism comprises a transmission member, a first connecting shaft, a second connecting shaft, and a pivot shaft. The first connecting shaft portion, the second connecting shaft portion, and the pivot shaft portion extend in the first orthogonal direction, The aforementioned transmission member is The first connecting shaft portion is connected to the cover member, The second connecting shaft portion is connected to the pressing member, When the direction perpendicular to the vertical direction and the first orthogonal direction is defined as the second orthogonal direction, the pivot shaft portion located between the first connecting shaft portion and the second connecting shaft portion in the second orthogonal direction is connected to the base member. By rotating around the pivot shaft, the upward movement of the cover member is converted into the downward movement of the pressing member. The movement of the second connecting shaft is restricted to moving only in the vertical direction. Inspection socket.

2. The second connecting shaft portion is located laterally in the second orthogonal direction in the region below the aforementioned mounting surface. The inspection socket according to claim 1.

3. The link mechanism has a contact portion, The aforementioned contact portion is The cover member is provided with In the first section, a force is applied to the pressing member that causes it to rotate around the second connecting shaft. The inspection socket according to claim 1.

4. The link mechanism has a slide shaft and a slide groove, The aforementioned slide shaft portion is The cover member is provided with In the second orthogonal direction, it is located between the first connecting shaft portion and the second connecting shaft portion, The aforementioned slide groove is The pressing member is provided with, The slide shaft portion is configured to slide. The inspection socket according to claim 3.

5. The slide shaft portion is the contact portion, When the slide shaft comes into contact with the slide groove, the pressing member rotates around the second connecting shaft. The inspection socket according to claim 4.

6. The link mechanism has a contact portion, The aforementioned contact portion is Provided on the base member, In the first section, a force is applied to the pressing member that causes it to rotate around the second connecting shaft. The inspection socket according to claim 1.

7. The link mechanism has a slide shaft and a slide groove, The aforementioned slide shaft portion is The pressing member is provided with, Located above the second connecting shaft portion, The aforementioned slide groove is Provided on the base member, The second connecting shaft portion and the slide shaft portion are configured to slide. The inspection socket according to claim 6.

8. The slide groove is the contact portion, When the slide shaft comes into contact with the slide groove, the pressing member rotates around the second connecting shaft. The inspection socket according to claim 7.

9. In the aforementioned first section, The second connecting shaft slides in the vertical direction along the slide groove, The slide shaft portion slides in the slide groove in the vertical direction and the second orthogonal direction. The inspection socket according to claim 8.

Images