Magnetic sensor

Abstract

To realize a magnetic sensor capable of preventing corrosion of a metal layer disposed on a slope.SOLUTION: A magnetic sensor 1 includes: an insulation layer 310; a coil element 82 disposed on the insulation layer 310; and a first insulation film 311. The insulation layer 310 includes a first slope 310a and a second slope 310b. The coil element 82 includes a first side face 82a and a second side face 82b. The first side face 82a includes: a first part 82a1; and a second part 82a2 disposed farther from an upper surface 301a of a board 301 than the first part 82a1. The first part 82a1 is inclined so as to cross the first and second slopes 310a, 310b, and is inclined so as to approach the second side face 82b as it approaches the upper surface 301a of the board 301. The first insulation film 311 covers the first part 82a1.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a magnetic sensor including a metal layer disposed on an inclined surface.

Background Art

[0002] In recent years, magnetic sensors using magnetoresistive effect elements have been used in various applications. In a system including a magnetic sensor, there are cases where it is desired to detect a magnetic field including a component in a direction perpendicular to the surface of a substrate by a magnetoresistive effect element provided on the substrate. In this case, by providing a soft magnetic material that converts a magnetic field perpendicular to the surface of the substrate into a magnetic field parallel to the surface of the substrate, or by disposing the magnetoresistive effect element on an inclined surface formed on the substrate, a magnetic field including a component in a direction perpendicular to the surface of the substrate can be detected.

[0003] Patent Document 1 discloses a magnetic sensor including a magnetoresistive effect element formed on an inclined surface. In this magnetic sensor, the surface of the substrate on which the magnetoresistive effect element is provided is covered with a protective film made of an insulating material.

[0004] By the way, in a magnetic sensor, a coil may be provided in various applications. For example, Patent Document 2 discloses a magnetic sensor provided with a coil through which a measured current flows, and a magnetic balance type current sensor including the magnetic sensor and a feedback coil. In the magnetic sensor disclosed in Patent Document 2, the coil is formed on a plane above the magnetic measurement element.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] Here, we consider a magnetic sensor equipped with a magnetoresistive element formed on an inclined surface, as disclosed in Patent Document 1, where a coil is provided in a position close to and above the magnetoresistive element, as disclosed in Patent Document 2. In this case, an insulating layer having a substantially constant thickness is provided between the magnetoresistive element and the coil. The insulating layer has an inclined surface with a shape corresponding to the inclined surface on which the magnetoresistive element is arranged. The coil is also formed on the inclined surface of the insulating layer. Generally, the coil is formed so that its cross-sectional shape is rectangular. However, at least a portion of the coil may not have a rectangular cross-sectional shape due to the influence of the inclined surface of the insulating layer. For example, at least a portion of the cross-sectional shape of the coil may be an inverted trapezoidal shape, where the width decreases as it approaches the bottom surface of the coil.

[0007] Generally, the surface of a coil is covered with a protective film made of insulating material. As mentioned above, if the cross-sectional shape of the coil is an inverted trapezoid, the protective film is less likely to adhere near the lower surface of the coil than near the upper surface. As a result, the seam (joint) formed during the deposition of the protective film is formed closer to the coil. If the seam is located near the coil, a problem arises in which the coil corrodes due to resist stripping liquid or other substances that penetrate through the seam.

[0008] The above problem applies not only to coils, but also to wiring and other structures formed on inclined surfaces.

[0009] This invention has been made in view of the above problems, and its objective is to provide a magnetic sensor that can prevent corrosion of a metal layer placed on an inclined surface. [Means for solving the problem]

[0010] The magnetic sensor of the present invention comprises a substrate having a reference plane, a magnetic detection element and an insulating layer provided on the substrate, and at least one metal layer and a plurality of first insulating films disposed on the insulating layer. The insulating layer has at least one inclined surface inclined with respect to the reference plane. The at least one metal layer has a shape that is elongated in a predetermined direction and has a first side and a second side located on both sides of the short side of the at least one metal layer. Each of the first side and the second side includes a first portion and a second portion located further from the reference plane than the first portion. The first portion is inclined to intersect with at least one inclined surface. The first portion of the first side is further inclined to approach the second side as it approaches the reference plane. The first portion of the second side is further inclined to approach the first side as it approaches the reference plane. The plurality of first insulating films include portions that cover a first portion of a first side surface and extend in a direction intersecting at least one inclined surface, and portions that cover a first portion of a second side surface and extend in a direction intersecting at least one inclined surface. [Effects of the Invention]

[0011] In the magnetic sensor of the present invention, multiple first insulating films cover a first portion of a first side surface and a first portion of a second side surface. This provides the effect of preventing corrosion of the metal layer placed on the inclined surface, according to the present invention. [Brief explanation of the drawing]

[0012] [Figure 1] This is a perspective view showing a magnetic sensor according to the first embodiment of the present invention. [Figure 2] This is a functional block diagram showing the configuration of a magnetic sensor device including a magnetic sensor according to the first embodiment of the present invention. [Figure 3] This is a circuit diagram showing the circuit configuration of the first detection circuit in the first embodiment of the present invention. [Figure 4] This is a circuit diagram showing the circuit configuration of the second detection circuit in the first embodiment of the present invention. [Figure 5] It is a plan view showing a part of a magnetic sensor according to the first embodiment of the present invention. [Figure 6] It is a cross-sectional view showing a part of a magnetic sensor according to the first embodiment of the present invention. [Figure 7] It is a side view showing a magnetoresistive element in the first embodiment of the present invention. [Figure 8] It is a cross-sectional view showing a main part of a magnetic sensor according to the first embodiment of the present invention. [Figure 9] It is a cross-sectional view showing a part near the first side of the coil element shown in FIG. 8. [Figure 10] It is a cross-sectional view showing a part near the second side of the coil element shown in FIG. 8. [Figure 11] It is a cross-sectional view showing a step in a method of manufacturing a magnetic sensor according to the first embodiment of the present invention. [Figure 12] It is a cross-sectional view showing a step following the step shown in FIG. 11. [Figure 13] It is a cross-sectional view showing a step following the step shown in FIG. 12. [Figure 14] It is a cross-sectional view showing a step following the step shown in FIG. 13. [Figure 15] It is a cross-sectional view showing a part of a magnetic sensor according to the second embodiment of the present invention.

Embodiments for Carrying Out the Invention

[0013] [First Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, referring to FIGS. 1 and 2, the configuration of a magnetic sensor according to the first embodiment of the present invention will be described. FIG. 1 is a perspective view showing the magnetic sensor according to the present embodiment. FIG. 2 is a functional block diagram showing the configuration of a magnetic sensor device including the magnetic sensor according to the present embodiment.

[0014] As shown in FIG. 1, the magnetic sensor 1 has the form of a rectangular parallelepiped chip. The magnetic sensor 1 has an upper surface 1a and a lower surface located on opposite sides of each other, and four side surfaces connecting the upper surface 1a and the lower surface. Further, the magnetic sensor 1 has a plurality of electrode pads provided on the upper surface 1a.

[0015] Here, referring to FIG. 1, the reference coordinate system in the present embodiment will be described. The reference coordinate system is a coordinate system based on the magnetic sensor 1 and is an orthogonal coordinate system defined by three axes. In the reference coordinate system, the X direction, the Y direction, and the Z direction are defined. The X direction, the Y direction, and the Z direction are orthogonal to each other. In particular, in the present embodiment, the direction perpendicular to the upper surface 1a of the magnetic sensor 1 and from the lower surface of the magnetic sensor 1 toward the upper surface 1a is defined as the Z direction. Also, the direction opposite to the X direction is defined as the -X direction, the direction opposite to the Y direction is defined as the -Y direction, and the direction opposite to the Z direction is defined as the -Z direction. The three axes defining the reference coordinate system are an axis parallel to the X direction, an axis parallel to the Y direction, and an axis parallel to the Z direction.

[0016] Hereinafter, a position ahead in the Z direction with respect to the reference position is referred to as "above", and a position on the opposite side to "above" with respect to the reference position is referred to as "below". Also, regarding the components of the magnetic sensor 1, the surface located at the end in the Z direction is referred to as the "upper surface", and the surface located at the end in the -Z direction is referred to as the "lower surface". Also, the expression "when viewed from the Z direction" means viewing the object from a position away in the Z direction.

[0017] As shown in FIG. 2, the magnetic sensor 1 includes a first detection circuit 20 and a second detection circuit 30. Each of the first and second detection circuits 20, 30 includes a plurality of magnetic detection elements and is configured to detect a target magnetic field and generate at least one detection signal. In particular, in the present embodiment, the plurality of magnetic detection elements are a plurality of magnetoresistive effect elements. Hereinafter, the magnetoresistive effect element will be referred to as a MR element.

[0018] Multiple detection signals generated by the first and second detection circuits 20 and 30 are processed by the processor 40. The magnetic sensor 1 and the processor 40 constitute the magnetic sensor device 100. The processor 40 is configured to generate a first detection value and a second detection value that correspond to the components of the magnetic field at a predetermined reference position in two different directions by processing the multiple detection signals generated by the first and second detection circuits 20 and 30. In particular, in this embodiment, the two different directions are one direction parallel to the XY plane and one direction parallel to the Z direction. The processor 40 is configured, for example, by an application-specific integrated circuit (ASIC).

[0019] The processor 40 may be included, for example, in a support that supports the magnetic sensor 1. This support has a plurality of electrode pads. The first and second detection circuits 20, 30 and the processor 40 are connected, for example, via a plurality of electrode pads of the magnetic sensor 1, a plurality of electrode pads of the support, and a plurality of bonding wires. If the plurality of electrode pads of the magnetic sensor 1 are provided on the upper surface 1a of the magnetic sensor 1, the magnetic sensor 1 may be mounted on the upper surface of the support in a orientation where the lower surface of the magnetic sensor 1 faces the upper surface of the support.

[0020] Next, the first and second detection circuits 20 and 30 will be described with reference to Figures 3 to 6. Figure 3 is a circuit diagram showing the circuit configuration of the first detection circuit 20. Figure 4 is a circuit diagram showing the circuit configuration of the second detection circuit 30. Figure 5 is a plan view showing a part of the magnetic sensor 1. Figure 6 is a cross-sectional view showing a part of the magnetic sensor 1.

[0021] Here, as shown in Figure 5, the U and V directions are defined as follows: The U direction is the direction of rotation from the X direction toward the -Y direction. The V direction is the direction of rotation from the Y direction toward the X direction. In this embodiment, the U direction is specifically defined as the direction of rotation by α from the X direction toward the -Y direction, and the V direction is defined as the direction of rotation by α from the Y direction toward the X direction. Note that α is an angle greater than 0° and less than 90°. In one example, α is 45°. Furthermore, the direction opposite to the U direction is defined as the -U direction, and the direction opposite to the V direction is defined as the -V direction.

[0022] Furthermore, as shown in Figure 6, the W1 and W2 directions are defined as follows: The W1 direction is the direction of rotation from the V direction toward the -Z direction. The W2 direction is the direction of rotation from the V direction toward the Z direction. In this embodiment, the W1 direction is specifically defined as the direction of rotation by β from the V direction toward the -Z direction, and the W2 direction is defined as the direction of rotation by β from the V direction toward the Z direction. Note that β is an angle greater than 0° and less than 90°. The direction opposite to the W1 direction is defined as the -W1 direction, and the direction opposite to the W2 direction is defined as the -W2 direction. The W1 and W2 directions are orthogonal to the U direction, respectively.

[0023] The first detection circuit 20 is configured to detect a component of the target magnetic field parallel to the W1 direction and to generate at least one first detection signal corresponding to this component. The second detection circuit 30 is configured to detect a component of the target magnetic field parallel to the W2 direction and to generate at least one second detection signal corresponding to this component.

[0024] As shown in Figure 3, the first detection circuit 20 includes a power supply terminal V2, a ground terminal G2, signal output terminals E21 and E22, a first resistor R21, a second resistor R22, a third resistor R23, and a fourth resistor R24. The multiple MR elements of the first detection circuit 20 constitute the first to fourth resistors R21, R22, R23, and R24.

[0025] The first resistor R21 is located between the power supply terminal V2 and the signal output terminal E21. The second resistor R22 is located between the signal output terminal E21 and the ground terminal G2. The third resistor R23 is located between the signal output terminal E22 and the ground terminal G2. The fourth resistor R24 ​​is located between the power supply terminal V2 and the signal output terminal E22.

[0026] As shown in Figure 4, the second detection circuit 30 includes a power supply terminal V3, a ground terminal G3, signal output terminals E31 and E32, a first resistor R31, a second resistor R32, a third resistor R33, and a fourth resistor R34. The multiple MR elements of the second detection circuit 30 constitute the first to fourth resistors R31, R32, R33, and R34.

[0027] The first resistor R31 is located between the power supply terminal V3 and the signal output terminal E31. The second resistor R32 is located between the signal output terminal E31 and the ground terminal G3. The third resistor R33 is located between the signal output terminal E32 and the ground terminal G3. The fourth resistor R34 is located between the power supply terminal V3 and the signal output terminal E32.

[0028] A predetermined voltage or current is applied to each of the power supply terminals V2 and V3. Each of the ground terminals G2 and G3 is connected to ground.

[0029] Hereinafter, the multiple MR elements of the first detection circuit 20 will be referred to as multiple first MR elements 50B, and the multiple MR elements of the second detection circuit 30 will be referred to as multiple second MR elements 50C. Since the first and second detection circuits 20 and 30 are components of the magnetic sensor 1, it can also be said that the magnetic sensor 1 includes multiple first MR elements 50B and multiple second MR elements 50C. Furthermore, any MR element will be denoted by the reference numeral 50.

[0030] Figure 7 is a side view of the MR element 50. The MR element 50 is a spin valve type MR element. The MR element 50 has a magnetization fixed layer 52 having magnetization with a fixed direction, a free layer 54 having magnetization whose direction can change according to the direction of the target magnetic field, and a gap layer 53 disposed between the magnetization fixed layer 52 and the free layer 54. The MR element 50 may be a TMR (tunnel magnetoresistance) element or a GMR (giant magnetoresistance) element. In a TMR element, the gap layer 53 is a tunnel barrier layer. In a GMR element, the gap layer 53 is a non-magnetic conductive layer. In the MR element 50, the resistance value changes according to the angle that the direction of magnetization of the free layer 54 makes with respect to the direction of magnetization of the magnetization fixed layer 52. The resistance value is at its minimum when this angle is 0° and at its maximum when the angle is 180°. In each MR element 50, the free layer 54 has shape anisotropy such that its easy magnetization axis direction is perpendicular to the magnetization direction of the fixed magnetization layer 52. As a means of setting the easy magnetization axis in a predetermined direction for the free layer 54, a magnet can be used to apply a bias magnetic field to the free layer 54.

[0031] The MR element 50 further includes an antiferromagnetic layer 51. The antiferromagnetic layer 51, magnetization fixed layer 52, gap layer 53, and free layer 54 are stacked in this order. The antiferromagnetic layer 51 is made of an antiferromagnetic material and creates exchange coupling with the magnetization fixed layer 52 to fix the magnetization direction of the magnetization fixed layer 52. The magnetization fixed layer 52 may be a so-called self-pinned fixed layer (Synthetic Ferri Pinned layer, SFP layer). The self-pinned fixed layer has a stacked ferri structure in which a ferromagnetic layer, a non-magnetic intermediate layer, and a ferromagnetic layer are stacked, and the two ferromagnetic layers are antiferromagnetically coupled. If the magnetization fixed layer 52 is a self-pinned fixed layer, the antiferromagnetic layer 51 may be omitted.

[0032] Note that the arrangement of layers 51-54 in the MR element 50 may be reversed vertically from the arrangement shown in Figure 7.

[0033] In Figures 3 and 4, the filled arrows represent the direction of magnetization of the magnetization fixed layer 52 of the MR element 50. The open arrows represent the direction of magnetization of the free layer 54 of the MR element 50 when no target magnetic field is applied to the MR element 50.

[0034] In the example shown in Figure 3, the magnetization direction of the magnetization fixed layer 52 in each of the first and third resistive sections R21 and R23 is in the W1 direction. The magnetization direction of the magnetization fixed layer 52 in each of the second and fourth resistive sections R22 and R24 is in the -W1 direction. Furthermore, each free layer 54 of the multiple first MR elements 50B has shape anisotropy such that the easy magnetization axis direction is parallel to the U direction. The magnetization direction of the free layer 54 in each of the first and second resistive sections R21 and R22 is in the U direction when no target magnetic field is applied to the first MR element 50B. In the above case, the magnetization direction of the free layer 54 in each of the third and fourth resistive sections R23 and R24 is in the -U direction.

[0035] In the example shown in Figure 4, the magnetization direction of the magnetization fixed layer 52 in each of the first and third resistive sections R31 and R33 is in the W2 direction. The magnetization direction of the magnetization fixed layer 52 in each of the second and fourth resistive sections R32 and R34 is in the -W2 direction. Furthermore, each free layer 54 of the multiple second MR elements 50C has shape anisotropy such that the easy magnetization axis direction is parallel to the U direction. The magnetization direction of the free layer 54 in each of the first and second resistive sections R31 and R32 is in the U direction when no target magnetic field is applied to the second MR element 50C. In the above case, the magnetization direction of the free layer 54 in each of the third and fourth resistive sections R33 and R34 is in the -U direction.

[0036] The magnetic sensor 1 includes a magnetic field generator configured to apply a magnetic field in a predetermined direction to the free layer 54 of each of the multiple first MR elements 50B and multiple second MR elements 50C. In this embodiment, the magnetic field generator includes a coil 80 that applies a magnetic field in a predetermined direction to the free layer 54 of each of the multiple first MR elements 50B and multiple second MR elements 50C. The coil 80 is made of a conductive material such as Cu.

[0037] Furthermore, the direction of magnetization of the fixed magnetization layer 52 and the direction of the easy magnetization axis of the free layer 54 may be slightly deviated from the above-mentioned direction from the viewpoint of the accuracy of fabrication of the MR element 50. Also, the magnetization of the fixed magnetization layer 52 may be configured to include a magnetization component whose main component is the direction described above. In this case, the direction of magnetization of the fixed magnetization layer 52 will be the direction described above or approximately the direction described above.

[0038] The specific structure of the magnetic sensor 1 will be described in detail below with reference to Figures 5 and 6. Figure 6 shows a portion of the cross-section at the position indicated by line 6-6 in Figure 5.

[0039] The magnetic sensor 1 includes a substrate 301 having an upper surface 301a, insulating layers 302, 303, 304, 305, 307, 308, 309, 310, a plurality of lower electrodes 61B, a plurality of lower electrodes 61C, a plurality of upper electrodes 62B, a plurality of upper electrodes 62C, a plurality of lower coil elements 81, and a plurality of upper coil elements 82. The upper surface 301a of the substrate 301 is assumed to be parallel to the XY plane. The Z direction is also a direction perpendicular to the upper surface 301a of the substrate 301. Note that a coil element is a part of the winding of a coil.

[0040] The insulating layer 302 is placed on the substrate 301. Multiple lower coil elements 81 are placed on the insulating layer 302. The insulating layer 303 is placed on the insulating layer 302 around the multiple lower coil elements 81. Insulating layers 304 and 305 are laminated in this order on the multiple lower coil elements 81 and insulating layer 303.

[0041] Multiple lower electrodes 61B and multiple lower electrodes 61C are arranged on an insulating layer 305. An insulating layer 307 is arranged on the insulating layer 305 around the multiple lower electrodes 61B and multiple lower electrodes 61C. Multiple first MR elements 50B are arranged on the multiple lower electrodes 61B. Multiple second MR elements 50C are arranged on the multiple lower electrodes 61C. An insulating layer 308 is arranged on the multiple lower electrodes 61B, multiple lower electrodes 61C and insulating layer 307 around the multiple first MR elements 50B and multiple second MR elements 50C. Multiple upper electrodes 62B are arranged on the multiple first MR elements 50B and insulating layer 308. Multiple upper electrodes 62C are arranged on the multiple second MR elements 50C and insulating layer 308. An insulating layer 309 is arranged on the insulating layer 308 around the multiple upper electrodes 62B and multiple upper electrodes 62C.

[0042] The insulating layer 310 is placed on top of the multiple upper electrodes 62B, multiple upper electrodes 62C, and the insulating layer 309. Multiple upper coil elements 82 are placed on top of the insulating layer 310.

[0043] The magnetic sensor 1 further includes a plurality of first insulating films 311 and a second insulating film 312. The plurality of first insulating films 311 and the second insulating films 312 cover a plurality of upper coil elements 82 and an insulating layer 310. The plurality of first insulating films 311 and the second insulating films 312 will be described in detail later.

[0044] The magnetic sensor 1 includes a support member that supports a plurality of first MR elements 50B and a plurality of second MR elements 50C. The support member has at least one inclined surface that is inclined with respect to the upper surface 301a of the substrate 301. In this embodiment in particular, the support member is composed of an insulating layer 305. Figure 5 shows the insulating layer 305, the plurality of first MR elements 50B, the plurality of second MR elements 50C, and the plurality of upper coil elements 82 among the components of the magnetic sensor 1.

[0045] The insulating layer 305 has a plurality of convex surfaces 305c that protrude in the direction away from the upper surface 301a of the substrate 301 (Z direction). Each of the plurality of convex surfaces 305c extends in a direction parallel to the U direction. The overall shape of the convex surface 305c is a semi-cylindrical curved surface formed by moving the curved shape (arch shape) of the convex surface 305c shown in Figure 6 along a direction parallel to the U direction. Furthermore, the plurality of convex surfaces 305c are arranged at predetermined intervals in a direction parallel to the V direction.

[0046] Each of the multiple convex surfaces 305c has an upper end that is furthest from the upper surface 301a of the substrate 301. In this embodiment, the upper end of each of the multiple convex surfaces 305c is assumed to extend in a direction parallel to the U direction. Now, let us focus on any one of the multiple convex surfaces 305c. The convex surface 305c includes a first inclined surface 305a and a second inclined surface 305b. The first inclined surface 305a is the surface of the convex surface 305c that is on the V direction side of the upper end of the convex surface 305c. The second inclined surface 305b is the surface of the convex surface 305c that is on the -V direction side of the upper end of the convex surface 305c. In Figure 5, the boundary between the first inclined surface 305a and the second inclined surface 305b is shown by a dotted line.

[0047] The upper end of the convex surface 305c may be the boundary between the first inclined surface 305a and the second inclined surface 305b. In this case, the dotted line shown in Figure 5 indicates the upper end of the convex surface 305c.

[0048] The upper surface 301a of the substrate 301 is parallel to the XY plane. The first inclined surface 305a and the second inclined surface 305b are each inclined with respect to the upper surface 301a of the substrate 301, i.e., the XY plane. In a cross section perpendicular to the upper surface 301a of the substrate 301, the distance between the first inclined surface 305a and the second inclined surface 305b decreases as the distance from the upper surface 301a of the substrate 301 increases.

[0049] In this embodiment, since there are multiple convex surfaces 305c, there are also multiple first inclined surfaces 305a and multiple second inclined surfaces 305b. The insulating layer 305 has multiple first inclined surfaces 305a and multiple second inclined surfaces 305b.

[0050] The insulating layer 305 further has flat surfaces 305d surrounding the plurality of convex surfaces 305c. The flat surfaces 305d are parallel to the upper surface 301a of the substrate 301. Each of the plurality of convex surfaces 305c protrudes from the flat surfaces 305d in the Z direction. In this embodiment, the plurality of convex surfaces 305c are arranged with a predetermined interval between them. Therefore, a flat surface 305d exists between two adjacent convex surfaces 305c in the V direction.

[0051] The insulating layer 305 includes a plurality of protrusions projecting in the Z direction and flat portions surrounding the plurality of protrusions. Each of the plurality of protrusions extends in a direction parallel to the U direction and has a convex surface 305c. The plurality of protrusions are arranged at predetermined intervals in a direction parallel to the V direction. The thickness (dimension in the Z direction) of the flat portions is substantially constant. The insulating layer 304 has a substantially constant thickness (dimension in the Z direction) and is formed along the lower surface of the insulating layer 305.

[0052] Multiple lower electrodes 61B are arranged on multiple first inclined surfaces 305a. Multiple lower electrodes 61C are arranged on multiple second inclined surfaces 305b. As described above, since each of the first inclined surface 305a and the second inclined surface 305b is inclined with respect to the upper surface 301a of the substrate 301, i.e., the XY plane, the upper surfaces of each of the multiple lower electrodes 61B and each of the multiple lower electrodes 61C are also inclined with respect to the XY plane. Therefore, it can be said that the multiple first MR elements 50B and the multiple second MR elements 50C are arranged on inclined surfaces that are inclined with respect to the XY plane. The insulating layer 305 is a member for supporting each of the multiple first MR elements 50B and the multiple second MR elements 50C so that they are inclined with respect to the XY plane.

[0053] In this embodiment, the first inclined surface 305a is a curved surface. Therefore, the first MR element 50B curves along the curved surface (first inclined surface 305a). In this embodiment, for convenience, the direction of magnetization of the magnetization fixed layer 52 of the first MR element 50B is defined as a linear direction as described above. The W1 direction and -W1 direction, which are the directions of magnetization of the magnetization fixed layer 52 of the first MR element 50B, are also the directions in which the tangents that are in contact with the portion of the first inclined surface 305a near the first MR element 50B extend.

[0054] Similarly, in this embodiment, the second inclined surface 305b is a curved surface. Therefore, the second MR element 50C curves along the curved surface (second inclined surface 305b). In this embodiment, for convenience, the direction of magnetization of the magnetization fixed layer 52 of the second MR element 50C is defined as a linear direction as described above. The W2 direction and -W2 direction, which are the directions of magnetization of the magnetization fixed layer 52 of the second MR element 50C, are also the directions in which the tangents that are in contact with the portion of the second inclined surface 305b near the second MR element 50C extend.

[0055] As shown in Figure 5, the multiple first MR elements 50B are arranged so that multiple elements are lined up in the U direction and multiple elements are lined up in the V direction. Multiple first MR elements 50B are lined up in a row on one first inclined surface 305a. Similarly, the multiple second MR elements 50C are arranged so that multiple elements are lined up in the U direction and multiple elements are lined up in the V direction. Multiple second MR elements 50C are lined up in a row on one second inclined surface 305b. In this embodiment, the rows of multiple first MR elements 50B and rows of multiple second MR elements 50C are arranged alternately in a direction parallel to the V direction.

[0056] Furthermore, an adjacent first MR element 50B and a second MR element 50C may or may not be offset in a direction parallel to the U direction when viewed from the Z direction. Also, two first MR elements 50B adjacent to each other with one second MR element 50C in between may or may not be offset in a direction parallel to the U direction when viewed from the Z direction. Also, two second MR elements 50C adjacent to each other with one first MR element 50B in between may or may not be offset in a direction parallel to the U direction when viewed from the Z direction.

[0057] Multiple first MR elements 50B are connected in series by multiple lower electrodes 61B and multiple upper electrodes 62B. The connection method of the multiple first MR elements 50B will now be described in detail with reference to Figure 7. In Figure 7, reference numeral 61 indicates a lower electrode corresponding to any MR element 50, and reference numeral 62 indicates an upper electrode corresponding to any MR element 50. As shown in Figure 7, each lower electrode 61 has an elongated shape. A gap is formed between two adjacent lower electrodes 61 in the longitudinal direction. On the upper surface of the lower electrode 61, MR elements 50 are positioned near both ends in the longitudinal direction. Each upper electrode 62 also has an elongated shape and is positioned on two adjacent lower electrodes 61 in the longitudinal direction to electrically connect two adjacent MR elements 50.

[0058] Although not shown, one MR element 50 located at the end of a row of multiple MR elements 50 arranged in a single line is connected to another MR element 50 located at the end of an adjacent row of multiple MR elements 50 in a direction intersecting the longitudinal direction of the lower electrode 61. These two MR elements 50 are connected to each other by electrodes (not shown). The electrodes (not shown) may be electrodes connecting the lower surfaces of the two MR elements 50 or the upper surfaces of the two MR elements 50.

[0059] If the MR element 50 shown in Figure 7 is the first MR element 50B, then the lower electrode 61 shown in Figure 7 corresponds to the lower electrode 61B, and the upper electrode 62 shown in Figure 7 corresponds to the upper electrode 62B. In this case, the longitudinal direction of the lower electrode 61 is parallel to the U direction.

[0060] Similarly, multiple second MR elements 50C are connected in series by multiple lower electrodes 61C and multiple upper electrodes 62C. The explanation of the connection method for multiple first MR elements 50B described above also applies to the connection method for multiple second MR elements 50C. When the MR element 50 shown in Figure 7 is a second MR element 50C, the lower electrode 61 shown in Figure 7 corresponds to the lower electrode 61C, and the upper electrode 62 shown in Figure 7 corresponds to the upper electrode 62C. In this case, the longitudinal direction of the lower electrode 61 is parallel to the U direction.

[0061] Each of the multiple upper coil elements 82 extends in a direction parallel to the Y direction. Furthermore, the multiple upper coil elements 82 are arranged so as to be aligned in the X direction. In this embodiment in particular, when viewed from the Z direction, two upper coil elements 82 overlap each of the multiple first MR elements 50B and the multiple second MR elements 50C.

[0062] Each of the multiple lower coil elements 81 extends in a direction parallel to the Y direction. Furthermore, the multiple lower coil elements 81 are arranged so as to be aligned in the X direction. The shape and arrangement of the multiple lower coil elements 81 may be the same as or different from the shape and arrangement of the multiple upper coil elements 82. In the examples shown in Figures 5 and 6, the X-direction dimension of each of the multiple lower coil elements 81 is smaller than the X-direction dimension of each of the multiple upper coil elements 82. Also, the distance between two adjacent lower coil elements 81 in the X direction is smaller than the distance between two adjacent upper coil elements 82 in the X direction.

[0063] In the examples shown in Figures 5 and 6, the multiple lower coil elements 81 and the multiple upper coil elements 82 are electrically connected to form a coil 80 that applies a magnetic field parallel to the X direction to the free layers 54 of each of the multiple first MR elements 50B and the multiple second MR elements 50C. The coil 80 may also be configured to apply a magnetic field in the X direction to the free layers 54 of the first and second resistors R21, R22 of the first detection circuit 20 and the first and second resistors R31, R32 of the second detection circuit 30, and to apply a magnetic field in the -X direction to the free layers 54 of the third and fourth resistors R23, R24 of the first detection circuit 20 and the third and fourth resistors R33, R34 of the second detection circuit 30. The coil 80 may also be controlled by the processor 40.

[0064] Next, the first and second detection signals will be described. First, the first detection signal will be described with reference to Figure 3. When the intensity of the component of the target magnetic field parallel to the W1 direction changes, the resistance values ​​of each of the resistors R21 to R24 of the first detection circuit 20 change such that the resistance values ​​of resistors R21 and R23 increase while the resistance values ​​of resistors R22 and R24 decrease, or the resistance values ​​of resistors R21 and R23 decrease while the resistance values ​​of resistors R22 and R24 increase. As a result, the potentials of the signal output terminals E21 and E22 change. The first detection circuit 20 is configured to generate a signal corresponding to the potential of the signal output terminal E21 as the first detection signal S21, and a signal corresponding to the potential of the signal output terminal E22 as the first detection signal S22.

[0065] Next, the second detection signal will be described with reference to Figure 4. When the intensity of the component of the target magnetic field parallel to the W2 direction changes, the resistance values ​​of the resistors R31 to R34 of the second detection circuit 30 change such that the resistance values ​​of resistors R31 and R33 increase while the resistance values ​​of resistors R32 and R34 decrease, or the resistance values ​​of resistors R31 and R33 decrease while the resistance values ​​of resistors R32 and R34 increase. As a result, the potentials of the signal output terminals E31 and E32 change. The second detection circuit 30 is configured to generate a signal corresponding to the potential of the signal output terminal E31 as the second detection signal S31, and a signal corresponding to the potential of the signal output terminal E32 as the second detection signal S32.

[0066] Next, the operation of the processor 40 will be described. The processor 40 is configured to generate a first detection value and a second detection value based on the first detection signals S21, S22 and the second detection signals S31, S32. The first detection value is the detection value corresponding to the component of the target magnetic field in the direction parallel to the V direction. The second detection value is the detection value corresponding to the component of the target magnetic field in the direction parallel to the Z direction. Hereafter, the first detection value will be denoted by the symbol Sv and the second detection value will be denoted by the symbol Sz.

[0067] The processor 40 generates the first and second detection values ​​Sv and Sz, for example, as follows: First, the processor 40 generates value S1 by an operation that includes calculating the difference S21-S22 between the first detection signal S21 and the first detection signal S22, and then generates value S2 by an operation that includes calculating the difference S31-S32 between the second detection signal S31 and the second detection signal S32. Next, the processor 40 calculates values ​​S3 and S4 using the following equations (1) and (2).

[0068] S3 = (S2 + S1) / (2cosα) …(1) S4 = (S2 - S1) / (2sinα) …(2)

[0069] The first detected value Sv may be the value S3 itself, or it may be the value S3 to which predetermined corrections such as gain adjustment and offset adjustment have been applied. Similarly, the second detected value Sz may be the value S4 itself, or it may be the value S4 to which predetermined corrections such as gain adjustment and offset adjustment have been applied.

[0070] Next, the structural features of the magnetic sensor 1 according to this embodiment will be described. The magnetic sensor 1 according to this embodiment comprises a substrate 301 having a reference plane, at least one magnetic detection element and an insulating layer 310 provided on the substrate 301, at least one metal layer and a plurality of first insulating films 311 disposed on the insulating layer 310, and a second insulating film 312 covering at least one metal layer and the plurality of first insulating films 311. In this embodiment, the upper surface 301a of the substrate 301 (see Figure 6) is used as the reference plane. The Z direction is a unidirectional direction perpendicular to the reference plane (upper surface 301a of the substrate 301).

[0071] In this embodiment, at least one magnetic detection element is a plurality of first MR elements 50B and a plurality of second MR elements 50C. Also in this embodiment, at least one metal layer is a plurality of upper coil elements 82. The plurality of upper coil elements 82 are arranged at predetermined intervals. Below, we will focus on one upper coil element 82 and describe in detail the structural features of the magnetic sensor 1. In the following description, the upper coil element 82 will be simply referred to as the coil element 82.

[0072] Figure 8 is a cross-sectional view showing the main part of the magnetic sensor 1. Figure 8 shows one first MR element 50B, one second MR element 50C, and one coil element 82. Figure 9 is a cross-sectional view showing the vicinity of the first side surface of the coil element 82 shown in Figure 8. Figure 10 is a cross-sectional view showing the vicinity of the second side surface of the coil element 82 shown in Figure 8.

[0073] The insulating layer 310 consists of a plurality of first MR elements 50B, a plurality of second MR elements 50C, a plurality of lower electrodes 61B, a plurality of lower electrodes 61C, a plurality of upper electrodes 62B, a plurality of upper electrodes 62C, and the insulating layer 305 It covers 307-309. The insulating layer 310 may have a nearly constant thickness.

[0074] The insulating layer 310 has at least one inclined surface that is inclined with respect to a reference plane, i.e., the upper surface 301a of the substrate 301 (see Figure 6). In particular, in this embodiment, the upper surface of the insulating layer 310 has a shape corresponding to the upper surface of the insulating layer 305. That is, the insulating layer 310 has at least one inclined surface, which consists of a plurality of first inclined surfaces 310a and a plurality of second inclined surfaces 310b. Each of the plurality of first inclined surfaces 310a is located above the plurality of first inclined surfaces 305a of the insulating layer 305. Each of the plurality of second inclined surfaces 310b is located above the plurality of second inclined surfaces 305b of the insulating layer 305. The shape and arrangement of the plurality of first inclined surfaces 310a and the plurality of second inclined surfaces 310b are the same as those of the plurality of first inclined surfaces 305a and the plurality of second inclined surfaces 305b. The description of the multiple first inclined surfaces 305a and the multiple second inclined surfaces 305b also applies to the multiple first inclined surfaces 310a and the multiple second inclined surfaces 310b.

[0075] The insulating layer 310 further has flat surfaces 310d that exist around the plurality of first inclined surfaces 310a and the plurality of second inclined surfaces 310b. The flat surfaces 310d are planes parallel or substantially parallel to the upper surface 301a of the substrate 301.

[0076] At least a portion of the coil element 82 has a shape that is elongated in a predetermined direction. In this embodiment in particular, the coil element 82 has a shape that is elongated in a direction parallel to the Y direction (see Figure 5). Also, each of the plurality of first inclined surfaces 310a and the plurality of second inclined surfaces 310b has a shape that is elongated in a direction parallel to the U direction, similar to each of the plurality of convex surfaces 305c of the insulating layer 305. Therefore, the longitudinal direction of the coil element 82 intersects with the longitudinal direction of each of the plurality of first inclined surfaces 310a and the plurality of second inclined surfaces 310b. The coil element 82 passes over the plurality of first inclined surfaces 310a and the plurality of second inclined surfaces 310b.

[0077] Furthermore, the longitudinal direction of the coil element 82 intersects with the longitudinal direction of each of the multiple convex surfaces 305c. The coil element 82 passes over the multiple convex surfaces 305c. The dimensions of the coil element 82 in its short direction, i.e., parallel to the X direction, may be larger or smaller than the dimensions of the convex surface 305c in its short direction, i.e., parallel to the V direction. Alternatively, the dimensions of the coil element 82 in the direction parallel to the X direction may be equal to or approximately equal to the dimensions of the convex surface 305c in the direction parallel to the V direction. The thickness of the coil element 82 (dimension in the Z direction) may be, for example, in the range of 2 to 3 μm.

[0078] The coil element 82 has two sides located at both ends in the direction parallel to its short side, i.e., the X direction. Hereinafter, the side on the -X direction side will be called the first side 82a, and the side on the X direction side will be called the second side 82b. Figure 8 shows a cross-section in which the first side 82a is located above the first inclined surface 310a and the second side 82b is located above the second inclined surface 310b. When the cross-section shown in Figure 8 is moved along the direction parallel to the Y direction, the first side 82a is also located above the second inclined surface 310b and above the flat surface 310d, and the second side 82b is also located above the first inclined surface 310a and above the flat surface 310d.

[0079] The coil element 82 further has a lower surface 82c and an upper surface 82d. The lower surface 82c faces a plurality of first inclined surfaces 310a and a plurality of second inclined surfaces 310b. The upper surface 82d is located ahead of the reference plane, i.e., in the direction away from the upper surface 301a of the substrate 301 (Z direction).

[0080] As shown in Figures 8 and 9, the first side surface 82a includes a first portion 82a1 and a second portion 82a2 positioned further away from the reference plane, i.e., the upper surface 301a of the substrate 301, than the first portion 82a1. The first portion 82a1 is inclined to intersect with the first and second inclined surfaces 310a and 310b. In the cross-sections shown in Figures 8 and 9, the first portion 82a1 is inclined to intersect with the first inclined surface 310a. Furthermore, the first portion 82a1 is inclined to approach the second side surface 82b as it approaches the upper surface 301a of the substrate 301.

[0081] The first portion 82a1 may be connected to the lower surface 82c. The second portion 82a2 may connect the first portion 82a1 to the upper surface 82d.

[0082] As shown in Figures 8 and 10, the second side surface 82b includes a first portion 82b1 and a second portion 82b2 positioned further away from the reference plane, i.e., the upper surface 301a of the substrate 301, than the first portion 82b1. The first portion 82b1 is inclined to intersect the first and second inclined surfaces 310a and 310b. In the cross-sections shown in Figures 8 and 10, the first portion 82b1 is inclined to intersect the second inclined surface 310b. Furthermore, the first portion 82b1 is inclined to approach the first side surface 82a as it approaches the upper surface 301a of the substrate 301.

[0083] The first portion 82b1 may be connected to the lower surface 82c. The second portion 82b2 may connect the first portion 82b1 to the upper surface 82d.

[0084] Note that in Figures 8 to 10, for convenience, the first parts 82a1 and 82b1 are drawn as straight lines. That is, in Figures 8 to 10, the first parts 82a1 and 82b1 are drawn as planes (planes inclined with respect to the YZ plane). However, each of the first parts 82a1 and 82b1 may be a curved surface. Even if each of the first parts 82a1 and 82b1 is a curved surface, each of the first parts 82a1 and 82b1 is inclined to intersect with the first and second inclined surfaces 310a and 310b.

[0085] Furthermore, in Figures 8 to 10, for convenience, the second portions 82a2 and 82b2 are drawn as straight lines parallel to the Z direction. That is, in Figures 8 to 10, the second portions 82a2 and 82b2 are drawn as planes (planes parallel to the YZ plane). However, each of the second portions 82a2 and 82b2 may also be a curved surface.

[0086] Each of the multiple first insulating films 311 covers either a first side surface 82a or a second side surface 82b. Hereinafter, among the multiple first insulating films 311, the first insulating film 311 covering the first side surface 82a will be denoted by reference numeral 311A, and the first insulating film 311 covering the second side surface 82b will be denoted by reference numeral 311B. Each of the first insulating films 311A ​​and 311B may have a substantially constant thickness.

[0087] The first insulating film 311A ​​includes a portion 311A1 that covers the first portion 82a1 of the first side surface 82a and extends in a direction intersecting the first and second inclined surfaces 310a, 310b. The portion 311A1 also extends in a direction parallel to the longitudinal direction, i.e., the Y direction, of the coil element 82. The first insulating film 311A ​​further includes a portion 311A2 that covers the second portion 82a2 of the first side surface 82a.

[0088] The first insulating film 311A ​​does not cover the upper surface 82d of the coil element 82. As shown in Figure 9, the first insulating film 311A ​​may further include a portion located further from the upper surface 301a of the substrate 301 than the corner located at the intersection of the first side surface 82a and the upper surface 82d. The corner may be a virtual line formed by the intersection of a curved surface approximating the overall shape of the upper surface 82d and the first side surface 82a. Alternatively, a curved surface approximating the shape of the portion of the upper surface 82d excluding the portion near the first side surface 82a may be extended to the first side surface 82a, and the corner may be a virtual line formed by the intersection of the extended curved surface and the first side surface 82a.

[0089] The first insulating film 311B includes a portion 311B1 that covers the first portion 82b1 of the second side surface 82b and extends in a direction intersecting the first and second inclined surfaces 310a, 310b. The portion 311B1 also extends in a direction parallel to the longitudinal direction, i.e., the Y direction, of the coil element 82. The first insulating film 311B further includes a portion 311B2 that covers the second portion 82b2 of the second side surface 82b.

[0090] The first insulating film 311B does not cover the upper surface 82d of the coil element 82. As shown in Figure 10, the first insulating film 311B may further include a portion located further from the upper surface 301a of the substrate 301 than the corner located at the intersection of the second side surface 82b and the upper surface 82d. The corner may be a virtual line formed by the intersection of a curved surface approximating the overall shape of the upper surface 82d and the second side surface 82b. Alternatively, a curved surface approximating the shape of the portion of the upper surface 82d excluding the portion near the second side surface 82b may be extended to the second side surface 82b, and the corner may be a virtual line formed by the intersection of the extended curved surface and the second side surface 82b.

[0091] As shown in Figures 8 to 10, the magnetic sensor 1 has a coil element 82 and first and second inclined surfaces 310a, 310b and flat surfaceIt includes a non-magnetic metal film 83 interposed between it and 310d. The coil element 82 may be formed by a plating method. In this case, the non-magnetic metal film 83 may be used as a seed and electrode in the process of forming the coil element 82.

[0092] The dimensions of the non-magnetic metal film 83 in the direction parallel to the short side of the coil element 82, i.e., the X direction, are greater than the minimum dimensions of the coil element 82 in the direction parallel to the X direction. In this embodiment in particular, the non-magnetic metal film 83 includes a portion extending in the -X direction from the first side surface 82a of the coil element 82 (see Figure 9) and a portion extending in the X direction from the second side surface 82b of the coil element 82 (see Figure 10).

[0093] The dimensions of the non-magnetic metal film 83 in the direction parallel to the X direction may be greater than or less than the maximum dimensions of the coil element 82 in the direction parallel to the X direction. Alternatively, the dimensions of the non-magnetic metal film 83 in the direction parallel to the X direction may be equal to or approximately equal to the maximum dimensions of the coil element 82 in the direction parallel to the X direction.

[0094] In this embodiment, since there are multiple coil elements 82, there are also multiple non-magnetic metal films 83.

[0095] As shown in Figures 9 and 10, the magnetic sensor 1 further includes a plurality of non-magnetic films 84 attached to the surface of each of the plurality of first insulating films 311. The plurality of non-magnetic films 84 may be re-adhered films formed when the non-magnetic metal film 83 is etched and scattered during the manufacturing process of the magnetic sensor 1, and the material attached to the surface of the plurality of first insulating films 311.

[0096] As shown in Figures 8 to 10, the second insulating film 312 covers a plurality of coil elements 82, a plurality of non-magnetic metal films 83, a plurality of non-magnetic films 84, an insulating layer 310, and a plurality of first insulating films 311.

[0097] Up to this point, we have focused on one coil element 82 and described the structural features of the magnetic sensor 1. Now, we focus on two adjacent coil elements 82 in a direction parallel to the X direction, a first side surface 82a of one of the two coil elements 82, and a second side surface 82b of the other coil element 82, the second side surface 82b facing the first side surface 82a of one of the two coil elements 82. The distance between the first portion 82a1 of the first side surface 82a and the first portion 82b1 of the second side surface 82b increases as it approaches the upper surface 301a of the substrate 301.

[0098] Each of the multiple first insulating films 311 and the second insulating film 312 is formed of an insulating material. For example, Al2O3 can be used as the insulating material forming each of the multiple first insulating films 311. For example, Si3N4 can be used as the insulating material for the second insulating film 312.

[0099] The non-magnetic metal film 83 may be formed of, for example, Ti, or Cu, or a multilayer film of Ti and Cu.

[0100] Next, a method for manufacturing the magnetic sensor 1 according to this embodiment will be described. The method for manufacturing the magnetic sensor 1 includes the steps of: forming components other than the substrate 301 of the multiple magnetic sensor 1 on a wafer that includes portions that will become the substrate 301 of the multiple magnetic sensor 1, thereby creating a base structure in which the sensor portions that will later become magnetic sensor 1 are arranged in multiple rows; and separating the multiple sensor portions from each other by cutting this base structure. In this way, multiple magnetic sensor 1 are manufactured.

[0101] The following describes in more detail the manufacturing method of a magnetic sensor 1 according to this embodiment, focusing on one magnetic sensor 1. First, the steps up to the step of forming the insulating layer 310 will be described with reference to Figures 5 and 6. In the manufacturing method of the magnetic sensor 1, first, an insulating layer 302 is formed on the substrate 301. Next, a plurality of lower coil elements 81 and an insulating layer 303 are formed on the insulating layer 302. Next, an insulating layer 304 is formed on the plurality of lower coil elements 81 and the insulating layer 303.

[0102] Next, an insulating layer 305 is formed on top of the insulating layer 304. The multiple convex surfaces 305c of the insulating layer 305 are formed, for example, by etching the insulating layer 305 and the multiple etching masks so that the multiple etching masks are removed after forming multiple etching masks on top of the insulating layer 305. The multiple etching masks have shapes corresponding to the multiple convex surfaces 305c. The portion of the insulating layer 305 not covered by the multiple etching masks becomes a flat surface 305d.

[0103] Next, multiple lower electrodes 61B, multiple lower electrodes 61C, multiple first MR elements 50B, multiple second MR elements 50C, multiple upper electrodes 62B, multiple upper electrodes 62C, and insulating layers 307-310 are formed on the insulating layer 305.

[0104] Next, the process after the formation of the insulating layer 310 will be described with reference to Figures 11 to 14. Figures 11 to 14 show the laminated structure during the manufacturing process of the magnetic sensor 1. Note that in Figures 11 to 14, the portion on the substrate 301 side of the insulating layer 305 is omitted.

[0105] Figure 11 shows the process after the insulating layer 310 has been formed. In this process, first, a non-magnetic metal film 83 is formed on the insulating layer 310. Next, a photoresist layer (not shown) is formed on the non-magnetic metal film 83, which is used to form multiple coil elements 82.

[0106] Figure 12 shows the following steps. In this step, first, multiple coil elements 82 are formed on a non-magnetic metal film 83. The multiple coil elements 82 are formed, for example, by a plating method. Next, a photoresist layer (not shown) is removed.

[0107] Figure 13 shows the following step. In this step, insulating films 311P, which will later become multiple first insulating films 311, are formed to cover multiple coil elements 82 and a non-magnetic metal film 83. The insulating films 311P may be formed, for example, by atomic layer deposition (ALD). The insulating films 311P cover the first side surface 82a, the second side surface 82b, and the top surface 82d of each of the multiple coil elements 82, and the portion of the top surface of the non-magnetic metal film 83 that is not covered by the multiple coil elements 82.

[0108] Figure 14 shows the following step. In this step, the non-magnetic metal film 83 and the insulating film 311P are etched so that the portions of the non-magnetic metal film 83 that are not covered by the multiple coil elements 82 are removed. For etching the non-magnetic metal film 83 and the insulating film 311P, for example, ion milling is used. This etching removes the portions of the insulating film 311P that cover the upper surfaces 82d of each of the multiple coil elements 82 and the portions that cover the non-magnetic metal film 83 (excluding the portions near the coil elements 82). The portions of the insulating film 311P that remain unetched become multiple first insulating films 311.

[0109] Furthermore, this etching process forms multiple non-magnetic films 84 (see Figures 9 and 10). These multiple non-magnetic films 84 are re-adhered films formed when material scattered after etching the non-magnetic metal film 83 adheres to the surfaces of multiple first insulating films 311.

[0110] Furthermore, in this etching process, the portion of the insulating film 311P covering the upper surface 82d of each of the multiple coil elements 82 may be over-etched until each of the multiple coil elements 82 is slightly etched, so as to ensure that the portion covering the upper surface 82d of each of the multiple coil elements 82 is reliably removed.

[0111] Next, with reference to Figure 6, the process of forming the second insulating film 312 will be described. In the manufacturing method of the magnetic sensor 1, after etching the non-magnetic metal film 83 and the insulating film 311P, the second insulating film 312 is formed to cover the plurality of coil elements 82 and the plurality of first insulating films 311. The second insulating film 312 may be formed, for example, by chemical vapor deposition (CVD).

[0112] In the manufacturing method of the magnetic sensor 1, after forming the second insulating film 312, a sensor portion that will later become the magnetic sensor 1 is completed by forming multiple electrode pads, etc. Then, the magnetic sensor 1 is completed by cutting around the sensor portion.

[0113] Next, the operation and effects of the magnetic sensor 1 according to this embodiment will be described. First, the manufacturing method of the comparative example magnetic sensor will be described. The manufacturing method of the comparative example magnetic sensor is the same as the manufacturing method of the magnetic sensor 1 according to this embodiment up to the step of removing the photoresist layer (not shown) used to form the plurality of coil elements 82. In the manufacturing method of the comparative example magnetic sensor, the non-magnetic metal film 83 is then etched so that the portion of the non-magnetic metal film 83 not covered by the plurality of coil elements 82 is removed. Next, a second insulating film 312 is formed to cover the plurality of coil elements 82. The subsequent steps are the same as the manufacturing method of the magnetic sensor 1 according to this embodiment.

[0114] In the comparative example magnetic sensor, the multiple first insulating films 311 in this embodiment are not formed. Therefore, in the comparative example magnetic sensor, the second insulating film 312 is in direct contact with the first and second sides 82a and 82b of the coil element 82. As shown in Figures 8 to 10, the first portion 82a1 of the first side 82a and the first portion 82b1 of the second side 82b of the coil element 82 are inclined as described above. The second insulating film 312 is less likely to adhere to the first portion 82a1 of the first side 82a and the first portion 82b1 of the second side 82b of the coil element 82 compared to the second portion 82a2 of the first side 82a and the second portion 82b2 of the second side 82b of the coil element 82. As a result, the seam (joint) formed during the deposition of the second insulating film 312 is formed closer to the coil element 82. If a seam is present near the coil element 82, a problem arises in which the coil element 82 corrodes due to etching during the process of forming electrode pads, or due to resist stripping solutions used in the process of separating multiple sensor parts from each other.

[0115] In contrast, in this embodiment, the first portion 82a1 of the first side surface 82a and the first portion 82b1 of the second side surface 82b of the coil element 82 are covered by the first insulating film 311A ​​and 311B, respectively. That is, in this embodiment, the second insulating film 312 is not in direct contact with the first portion 82a1 of the first side surface 82a and the first portion 82b1 of the second side surface 82b of the coil element 82. As a result, according to this embodiment, it is possible to prevent the resist stripping liquid that has penetrated through the seam of the second insulating film 312 from corroding the coil element 82.

[0116] [Second Embodiment] Next, with reference to Figure 15, a magnetic sensor 1 according to a second embodiment of the present invention will be described. Figure 15 is a cross-sectional view showing a part of the magnetic sensor 1 according to this embodiment.

[0117] In this embodiment, the overall shape of each of the multiple convex surfaces 305c of the insulating layer 305 is a triangular roof shape formed by moving the triangular shape of the convex surface 305c shown in Figure 15 along a direction parallel to the U direction. Furthermore, each of the multiple first inclined surfaces 305a and the multiple second inclined surfaces 305b of the insulating layer 305 is a plane. Each of the multiple first inclined surfaces 305a is a plane parallel to the U direction and the W1 direction. Each of the multiple second inclined surfaces 305b is a plane parallel to the U direction and the W2 direction.

[0118] The insulating layer 305 may include a plurality of protrusions that form a plurality of convex surfaces 305c, similar to the example shown in Figure 6. Alternatively, the insulating layer 305 may include a plurality of grooves arranged in a direction parallel to the V direction. Each of the plurality of grooves has a first wall surface corresponding to the first inclined surface 305a and a second wall surface corresponding to the second inclined surface 305b. A single convex surface 305c is formed by the first wall surface of one groove and the second wall surface of another groove adjacent to this groove on the -V direction side.

[0119] In the example shown in Figure 15, each of the multiple grooves further has a bottom surface corresponding to the flat surface 305d. However, each of the multiple grooves does not necessarily have to have a bottom surface.

[0120] The insulating layer 310 has a plurality of first inclined surfaces and a plurality of second inclined surfaces. Each of the plurality of first inclined surfaces of the insulating layer 310 is located above the plurality of first inclined surfaces 305a of the insulating layer 305. Each of the plurality of second inclined surfaces of the insulating layer 310 is located above the plurality of second inclined surfaces 305b of the insulating layer 305. The shape and arrangement of the plurality of first and plurality of second inclined surfaces of the insulating layer 310 are the same as those of the plurality of first inclined surfaces 305a and plurality of second inclined surfaces 305b of the insulating layer 305. The description of the plurality of first inclined surfaces 305a and plurality of second inclined surfaces 305b also applies to the plurality of first and plurality of second inclined surfaces of the insulating layer 310.

[0121] The insulating layer 310 further has flat surfaces surrounding the plurality of first inclined surfaces and the plurality of second inclined surfaces. The flat surfaces are planes parallel or substantially parallel to the upper surface 301a of the substrate 301.

[0122] Other configurations, operations, and effects in this embodiment are the same as those in the first embodiment.

[0123] It should be noted that the present invention is not limited to the embodiments described above, and various modifications are possible. For example, the shape of the coil element 82 is not limited to the examples shown in each embodiment, but is arbitrary, as long as the requirements of the claims are met. Also, the metal layer of the present invention is not limited to the coil element, but may be any wiring. Furthermore, the magnetic detection element of the present invention is not limited to the MR element, but may be an element that detects a magnetic field other than the MR element, such as a Hall element.

[0124] Furthermore, the magnetic sensor 1 may also include a third detection circuit configured to detect a component of the target magnetic field in a direction parallel to the XY plane and to generate at least one third detection signal corresponding to this component. In this case, the processor 40 may be configured to generate a detection value corresponding to the component of the target magnetic field in a direction parallel to the U direction based on at least one third detection signal. The third detection circuit may be integrated with the first and second detection circuits 20, 30, or it may be included in a separate chip from the first and second detection circuits 20, 30.

[0125] As described above, the magnetic sensor of the present invention comprises a substrate having a reference plane, a magnetic detection element and an insulating layer provided on the substrate, and at least one metal layer and a plurality of first insulating films disposed on the insulating layer. The insulating layer has at least one inclined surface inclined with respect to the reference plane. The at least one metal layer has a shape that is elongated in a predetermined direction and has a first side surface and a second side surface located on both sides of the short side of the at least one metal layer. Each of the first side surface and the second side surface includes a first portion and a second portion located further from the reference plane than the first portion. The first portion is inclined to intersect with at least one inclined surface. The first portion of the first side surface is further inclined to approach the second side surface as it approaches the reference plane. The first portion of the second side surface is further inclined to approach the first side surface as it approaches the reference plane. The plurality of first insulating films include portions that cover a first portion of a first side surface and extend in a direction intersecting at least one inclined surface, and portions that cover a first portion of a second side surface and extend in a direction intersecting at least one inclined surface.

[0126] The magnetic sensor of the present invention may further include a second insulating film covering at least one metal layer and a plurality of first insulating films.

[0127] Furthermore, in the magnetic sensor of the present invention, the plurality of first insulating films may further include portions that cover a second portion of the first side surface and portions that cover a second portion of the second side surface.

[0128] Furthermore, in the magnetic sensor of the present invention, at least one metal layer may further have an upper surface located further away from the reference plane. Each of the plurality of first insulating films does not have to cover the upper surface of at least one metal layer. The plurality of first insulating films may further include portions located further away from the reference plane than the corners located at the intersection of the first side surface and the upper surface of at least one metal layer, and portions located further away from the reference plane than the corners located at the intersection of the second side surface and the upper surface of at least one metal layer.

[0129] Furthermore, in the magnetic sensor of the present invention, at least one inclined surface may have a shape that is elongated in one direction parallel to the reference plane. The longitudinal direction of at least one metal layer and the longitudinal direction of at least one inclined surface may intersect each other.

[0130] Furthermore, in the magnetic sensor of the present invention, at least one inclined surface may include a plurality of inclined surfaces. At least one metal layer may pass over the plurality of inclined surfaces.

[0131] Furthermore, in the magnetic sensor of the present invention, at least one metal layer may include two metal layers adjacent to each other in the short direction of the at least one metal layer. The distance between a first portion of one of the two metal layers and a first portion of the other of the two metal layers may increase as it approaches the reference plane. The two metal layers may be arranged with a predetermined distance between them.

[0132] Furthermore, the magnetic sensor of the present invention may further include a non-magnetic metal film interposed between at least one metal layer and at least one inclined surface. The dimensions of the non-magnetic metal film in the short direction of at least one metal layer may be greater than the minimum dimensions of at least one metal layer in the short direction of at least one metal layer.

[0133] Furthermore, the magnetic sensor of the present invention may further comprise a plurality of non-magnetic films attached to the respective surfaces of a plurality of first insulating films.

[0134] Furthermore, in the magnetic sensor of the present invention, at least one metal layer may be part of the coil winding. [Explanation of Symbols]

[0135] 1…Magnetic sensor, 20…First detection circuit, 30…Second detection circuit, 40…Processor, 50…MR element, 50B…First MR element, 50C…Second MR element, 51…Magnetic fixed layer, 52…Gap layer, 53…Free layer, 61,61B,61C…Lower electrode, 62,62B,62C…Upper electrode, 80…Coil, 81…Lower coil element, 82…Upper coil element, 83… Non-magnetic metal film, 84... Non-magnetic film, 100... Magnetic sensor device, 301... Substrate, 301a... Top surface, 302~305... Insulating layer, 305a... First inclined surface, 305b... Second inclined surface, 305c... Convex surface, 305d... Flat surface, 307~310... Insulating layer, 310a... First inclined surface, 310b... Second inclined surface, 310... Flat surface, 311... First insulating film, 312... Second insulating film.

Claims

1. A substrate having a reference plane, A magnetic detection element and an insulating layer are provided on the substrate, A magnetic sensor comprising at least one metal layer and a plurality of first insulating films disposed on the insulating layer, The insulating layer has at least one inclined surface that is inclined with respect to the reference plane, The at least one metal layer has an elongated shape in a predetermined direction and has a first side surface and a second side surface located on both sides of the short side of the at least one metal layer. Each of the first and second sides includes a first portion and a second portion positioned further from the reference plane than the first portion. The first portion is inclined to intersect with the at least one inclined surface, The first portion of the first side surface is further inclined to approach the second side surface as it approaches the reference plane, The first portion of the second side surface is further inclined to approach the first side surface as it approaches the reference plane, A magnetic sensor characterized in that the plurality of first insulating films include portions that cover the first portion of the first side surface and extend in a direction intersecting the at least one inclined surface, and portions that cover the first portion of the second side surface and extend in a direction intersecting the at least one inclined surface.

2. Furthermore, the magnetic sensor according to claim 1 is characterized by comprising a second insulating film covering the at least one metal layer and the plurality of first insulating films.

3. The magnetic sensor according to claim 1, characterized in that the plurality of first insulating films further include portions that cover the second portion of the first side surface and portions that cover the second portion of the second side surface.

4. The at least one metal layer further has an upper surface located in the direction away from the reference plane, The magnetic sensor according to claim 1, characterized in that each of the plurality of first insulating films does not cover the upper surface of the at least one metal layer.

5. The magnetic sensor according to claim 4, characterized in that the plurality of first insulating films further include portions located further from the reference plane than the corners located at the intersection of the first side surface and the upper surface of the at least one metal layer, and portions located further from the reference plane than the corners located at the intersection of the second side surface and the upper surface of the at least one metal layer.

6. The at least one inclined surface has a shape that is elongated in one direction parallel to the reference plane, The magnetic sensor according to claim 1, characterized in that the longitudinal direction of the at least one metal layer and the longitudinal direction of the at least one inclined surface intersect each other.

7. The magnetic sensor according to claim 1, characterized in that the at least one inclined surface includes a plurality of inclined surfaces.

8. The magnetic sensor according to claim 7, characterized in that the at least one metal layer passes over the plurality of inclined surfaces.

9. The at least one metal layer includes two adjacent metal layers in the short direction of the at least one metal layer, The magnetic sensor according to claim 1, characterized in that the distance between the first portion of one of the two metal layers and the first portion of the other of the two metal layers increases as it approaches the reference plane.

10. The at least one metal layer includes two adjacent metal layers in the short direction of the at least one metal layer, The magnetic sensor according to claim 1, characterized in that the two metal layers are arranged with a predetermined distance between them.

11. Furthermore, the at least one metal layer and the at least one inclined surface are interposed by a non-magnetic metal film, The magnetic sensor according to claim 1, characterized in that the dimensions of the non-magnetic metal film in the short direction of the at least one metal layer are greater than the minimum dimensions of the at least one metal layer in the short direction of the at least one metal layer.

12. Furthermore, the magnetic sensor according to claim 1 is characterized by comprising a plurality of non-magnetic films attached to each of the surfaces of the plurality of first insulating films.

13. The magnetic sensor according to any one of claims 1 to 12, characterized in that the at least one metal layer is part of the winding of a coil.

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