Mounting device and bending detection method

JP7833485B2Active Publication Date: 2026-03-19FUJI CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-12-27
Publication Date
2026-03-19

AI Technical Summary

Technical Problem

Existing component mounting devices fail to accurately determine syringe bending, leading to increased sliding resistance and reduced mounting accuracy due to collisions, with defects only detected during inspection, not preventing ongoing issues.

Method used

A mounting device with a camera imaging from below, a movable syringe, and a control unit to attach a jig nozzle for determining syringe bending by comparing its position to a predetermined reference, eliminating bending influence and enabling pre-inspection detection.

Benefits of technology

Accurate syringe bending detection without waiting for component inspection results, preventing defects by skipping bent syringes and maintaining mounting accuracy.

✦ Generated by Eureka AI based on patent content.

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Abstract

Provided is a mounting device that suctions a component with a suction nozzle attached to a syringe, and mounts the component on a substrate. The mounting device comprises: a camera that captures an image of an object from below; a head that is fitted with the syringe in a liftable / lowerable manner, and that can be moved horizontally; a control unit that causes a jig nozzle to be attached to the syringe at a predetermined determination timing, and controls the head and the camera so that an image of the jig nozzle is captured from below with the syringe lowered in a predetermined position horizontally; and a determination unit that processes the captured image to determine bending of the syringe on the basis of the position of the jig nozzle with respect to the predetermined position.
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Citation Information

Patent Citations

  • Coating apparatus and mounting device for electronic parts

    JP2000005679A

  • Suction nozzle, method for detecting holding position of electric component, method for detecting curvature of suction tube, method for specifying rotational position of suction nozzle, and electric component handling unit

    JP2002094296A

  • Method and apparatus for packaging component

    JP2008205424A