Apparatus for transporting components placed in a substrate processing chamber, substrate processing system, and method for transporting said components.

Abstract

To provide a technique for transporting members to be placed in a substrate processing chamber to a predetermined placement position.SOLUTION: A valve body is provided for plugging openings removably against the openings connecting a substrate transporting chamber and a substrate processing chamber provided adjacent to each other, and when the openings are plugged by the valve body, a member holding portion is provided to extend from the valve body toward the inside of the substrate processing chamber. The member holding portion is configured to transport the members to a predetermined placement position in the substrate processing chamber when the openings are plugged by the valve body. Furthermore, a moving mechanism is provided to move the valve body removed from the openings in the substrate transporting chamber.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to an apparatus for transporting a member disposed in a substrate processing chamber, a substrate processing system, and a method for transporting the member.

Background Art

[0002] In an apparatus for performing a process on a semiconductor wafer (hereinafter also referred to as a "wafer") as a substrate, the wafer is transported by a transport mechanism to a processing chamber where the process on the wafer is executed. Inside the processing chamber, members of various configurations corresponding to the processing of the wafer are provided, and these members are periodically maintained and cleaned.

[0003] For example, Patent Document 1 describes a technique in which an edge ring and a cover ring are configured to be transportable by a support portion of a wafer transport apparatus in a plasma processing apparatus including a substrate placement surface on which a substrate is placed, an edge ring, and a cover ring. The edge ring is a member that surrounds the substrate held on the substrate placement surface, and the cover ring is a member that is disposed so as to cover the outer surface of the edge ring.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present disclosure provides a technique for transporting a member disposed in a substrate processing chamber to a preset arrangement position between a substrate transport chamber and a substrate processing chamber provided adjacent to each other.

Means for Solving the Problems

[0006] The present disclosure is The substrate transport chambers are located adjacent to each other. multiple A device for transporting components to and from a substrate processing chamber, the device being used to transport components placed inside the substrate processing chamber. A valve body is detachably configured to connect the substrate transport chamber and the substrate processing chamber, and is used to close the opening. When the opening is closed by the valve body, a member holding part is provided extending from the valve body toward the substrate processing chamber and for transporting the member to a predetermined position within the substrate processing chamber, The system includes a moving mechanism for moving the valve body, which has been removed from the opening, within the substrate transport chamber. 、 The aforementioned moving mechanism is The floor surface of the substrate transport chamber where the first magnet is provided, A movable body is provided to which the valve body is attached and to which a second magnet acts in a repulsive force with the first magnet, and is configured to be movable within the substrate transport chamber by magnetic levitation using the repulsive force, The movable body is configured to be detachably attached to the valve body and can be removed from the valve body when the opening is closed. Multiple valve bodies, movable bodies, and member holders are provided, the movable bodies move independently of each other, and the valve bodies are attached to and detached from each of the openings individually. It is a device. This disclosure is, A device for transporting components to be placed in a substrate processing chamber between a substrate transport chamber and a substrate processing chamber, which are provided adjacent to each other, A valve body is detachably configured to connect the substrate transport chamber and the substrate processing chamber, and is used to close the opening. When the opening is closed by the valve body, a member holding part is provided extending from the valve body toward the substrate processing chamber and for transporting the member to a predetermined position within the substrate processing chamber, The system includes a moving mechanism for moving the valve body, which has been removed from the opening, within the substrate transport chamber. The apparatus includes at least one component selected from a group of components comprising: a focus ring positioned around a substrate when plasma processing is performed on the substrate being processed in the substrate processing chamber; a shielding member for preventing products resulting from the processing of the substrate from adhering to the main body of the substrate processing chamber; a rectifying member for rectifying the airflow within the substrate processing chamber; and a shutter that covers non-target surfaces when pre-coating or cleaning is performed inside the substrate processing chamber. This disclosure is, A device for transporting components to be placed in a substrate processing chamber between a substrate transport chamber and a substrate processing chamber, which are provided adjacent to each other, A valve body is detachably configured to connect the substrate transport chamber and the substrate processing chamber, and is used to close the opening. When the opening is closed by the valve body, a member holding part is provided extending from the valve body toward the substrate processing chamber and for transporting the member to a predetermined position within the substrate processing chamber, The system includes a moving mechanism for moving the valve body, which has been removed from the opening, within the substrate transport chamber. The device includes a valve body that moves within the substrate transport chamber by the aforementioned moving mechanism, referred to as the first valve body, and a second valve body that closes the opening during the period when the first valve body is removed. [Effects of the Invention]

[0007] According to this disclosure, components to be placed in a substrate processing chamber can be transported to a predetermined position between a substrate transport chamber and a substrate processing chamber that are located adjacent to each other. [Brief explanation of the drawing]

[0008] [Figure 1]It is a plan view showing a configuration example of a substrate processing system. [Figure 2] It is a plan view showing a substrate processing chamber according to the first embodiment. [Figure 3] It is a longitudinal sectional side view showing a substrate transfer chamber and a substrate processing chamber according to the first embodiment. [Figure 4] It is a longitudinal sectional side view showing an enlarged part of the first embodiment. [Figure 5] It is a perspective view showing a configuration example of a moving mechanism according to the first embodiment. [Figure 6A] It is a first longitudinal sectional side view showing the operation of the first embodiment. [Figure 6B] It is a second longitudinal sectional side view showing the operation of the first embodiment. [Figure 6C] It is a third longitudinal sectional side view showing the operation of the first embodiment. [Figure 6D] It is a fourth longitudinal sectional side view showing the operation of the first embodiment. [Figure 7] It is a longitudinal sectional side view showing a configuration example of an opening of a substrate processing chamber. [Figure 8A] It is a first longitudinal sectional side view showing a substrate transfer chamber and a substrate processing chamber according to the second embodiment. [Figure 8B] It is a second longitudinal sectional side view showing the second embodiment. [Figure 9] It is a longitudinal sectional side view showing a substrate transfer chamber and a substrate processing chamber according to the third embodiment.

Mode for Carrying Out the Invention

[0009] <Substrate Processing System> Hereinafter, with reference to FIG. 1, the configuration of an apparatus for transporting members disposed in a substrate processing chamber according to an embodiment of the present disclosure will be described. The apparatus for transporting the members is provided in a substrate processing system 1. Figure 1 shows a multi-chamber type substrate processing system 1 equipped with multiple substrate processing chambers 11 for processing wafers W. As shown in Figure 1, the substrate processing system 1 comprises an atmospheric transport chamber 12, a load lock chamber 13, a substrate transport chamber 14, and multiple substrate processing chambers 11, which are arranged in this order horizontally from the atmospheric transport chamber 12 side. In the substrate processing system 1, the installation position of the atmospheric transport chamber 12 is considered to be the front side, and the front-to-back direction is described as the Y direction and the left-to-right direction as the X direction when viewed from the front side.

[0010] A load port 121 is provided on the front side of the atmospheric transport chamber 12. The load port 121 is configured as a platform on which carriers C containing wafers W to be processed are placed, and for example, four of them are installed side by side in the left-right direction. For the carrier C, for example, a FOUP (Front Opening Unified Pod) can be used. The atmospheric transport chamber 12 maintains an atmospheric pressure (normal pressure) atmosphere, creating, for example, a downflow of clean air. Inside the atmospheric transport chamber 12, an atmospheric transport mechanism 122, for example consisting of a multi-joint arm, is provided and configured to transport wafers W between carrier C and load lock chamber 13.

[0011] Between the atmospheric transport chamber 12 and the substrate transport chamber 14, for example, two load lock chambers 13 are installed side by side. The load lock chambers 13 are configured to switch between an atmospheric pressure atmosphere and a vacuum atmosphere, and include a transfer stage 130 on which the wafer W is placed, and lifting pins 131 that push up and hold the wafer W from below. For example, three lifting pins 131 are provided at equal intervals along the circumferential direction and are configured to move up and down freely.

[0012] Openings for transporting wafers W are formed between the load lock chamber 13 and the atmospheric transport chamber 14, and between the load lock chamber 13 and the substrate transport chamber 14. These openings are configured to be openable and closable by gate valves GV1 and GV2, respectively. Furthermore, the opening 132 provided between the load lock chamber 13 and the substrate transport chamber 14 can also be opened and closed by a valve body 22, similar to the substrate processing chamber 11, as will be described later.

[0013] As shown in Figure 1, the substrate transport chamber 14 is constructed of a rectangular housing that is long in the front-to-back direction and has a plan view, and is depressurized into a vacuum atmosphere by a vacuum evacuation mechanism (not shown). Furthermore, an inert gas supply unit (not shown) for supplying an inert gas (e.g., nitrogen gas) may be connected to the substrate transport chamber 14, and the system may be configured to continuously supply inert gas into the depressurized substrate transport chamber 14.

[0014] In the example substrate processing system 1 shown in Figure 1, eight substrate processing chambers 11 are provided, four on each side of the substrate transport chamber 14. Each substrate processing chamber 11 is configured to perform vacuum processing on the wafer W. Examples of processing performed on the wafer W include etching, film deposition, cleaning, and ashing.

[0015] <First Embodiment> This disclosure relates to a device for transporting components to be placed in a substrate processing chamber 11 between two adjacent substrate processing chambers 11 and a substrate transport chamber 14. A first embodiment of the substrate processing chamber 11 and the substrate transport chamber 14 will be described below. In Figures 1, 2, etc., a secondary coordinate axis set on the base end of the Y' axis is shown to indicate the direction in which the substrate transport chamber 14 is located as viewed from each substrate processing chamber 11. In the description of each substrate processing chamber 11, the connection position with the substrate transport chamber 14 will be described as the front side.

[0016] As shown in Figures 2 to 4, the substrate processing chamber 11 in this example comprises a processing container 2 and a connecting passage 21 that connects the processing container 2 and the substrate transport chamber 14. The wafer W is transported between the processing container 2 and the substrate transport chamber 14 via the connecting passage 21. The connecting passage 21 is configured as a transport path that has a smaller vertical dimension than, for example, the processing container 2 or the substrate transport chamber 14, and has a width that allows components including the wafer W to pass through. The substrate transport chamber 14 is in communication with the substrate processing chamber 11 through an opening 20 at one end of the connecting passage 21.

[0017] The opening 20 is configured to be opened and closed by a valve body (first valve body) 22. This valve body 22 is configured to be detachably attached to the opening 20 and can move within the substrate transport chamber 14 by being connected to a moving mechanism 3, which will be described later. The valve body 22 is equipped with a component holding part 23 for transporting components to be placed inside the substrate processing chamber 11. The component holding part 23 is inserted into the substrate processing chamber 11 when the opening 20 is closed by the valve body 22, and is configured to transport the components to be transported to a predetermined position within the substrate processing chamber 11. The valve body 22 is also equipped with an O-ring 221 for airtight sealing of the opening 20. Furthermore, the opening 20 is configured to be opened and closed by a second valve body 26. The second valve body 26 is a valve body that closes the opening 20 when the first valve body is removed, and its configuration will be described later (Figure 7).

[0018] The components that are transported by the component holding unit 23 and placed in the substrate processing chamber 11 will be described in detail later, but in this example, these components are the "wafer," "focus ring," "part of the shielding component," and "part of the rectifying component." Hereafter, these components will also be referred to as "placement components." Furthermore, the pre-set placement positions within the substrate processing chamber 11 refer to the positions where the components are placed when the wafer W is processed within the substrate processing chamber 11. Hereinafter, "pre-set placement positions" may also be referred to as "component placement positions."

[0019] Next, an example of the configuration of the substrate processing chamber 11 will be described, using the case where the processing performed on the wafer W is plasma etching as an example. The processing container 2 in this substrate processing chamber 11 is grounded and connected to the vacuum exhaust mechanism 25 via the exhaust passage 24. A mounting table 41 is provided inside the processing container 2, and in this example, the mounting table 41 has a convex portion 42 on its upper surface. For example, the convex portion 42 has a trapezoidal cross-sectional shape, and its upper surface constitutes a mounting surface that supports the wafer W from the back side. The peripheral edge of the mounting surface is configured to be located inward from the outer edge of the wafer W. The wafer W is placed on this mounting surface (upper surface of the convex portion 42) and a predetermined vacuum processing is performed. Hereafter, the wafer W placed on the mounting surface may also be referred to as the wafer W placed on the mounting table 41. In addition, a heating section (not shown) is embedded in the mounting table 41.

[0020] A shower head 43 is provided on the ceiling of the processing container 2, via an insulating member 44, so as to face the wafer W placed on the mounting table 41. A high-frequency power supply 45 for plasma generation is connected to the shower head 43 and is configured to function as an upper electrode. On the other hand, the mounting table 41 is grounded via the processing container 2 and functions as a lower electrode, and a parallel plate type plasma formation mechanism is formed between the shower head 43 and the mounting table 41. In the substrate processing chamber 11 where processing without plasma is performed, a plasma formation mechanism such as the high-frequency power supply 45 does not need to be provided.

[0021] Furthermore, the shower head 43 is equipped with a plurality of gas discharge holes (not shown) on its lower surface, and is configured to supply etching gas (processing gas) from the etching gas (processing gas) supply source 46 to the processing container 2 via the shower head 43. Then, when etching gas is supplied from the shower head 43 and high-frequency power is applied to the shower head 43 from the high-frequency power supply 45, a capacitively coupled plasma is formed between the shower head 43 and the mounting base 41.

[0022] A shield member 5 is provided inside the processing container 2. The shield member 5 is a member that prevents products resulting from the processing of the wafer W from adhering to the inner wall of the processing container 2, which is the main body of the substrate processing chamber 11. In this example, it is provided to prevent by-products generated during the etching process from adhering to the processing container 2. The shield member 5 is composed of a first shield member 51 attached to the processing container 2 and a second shield member 52, which is a placement member that is carried in by the member holding unit 23.

[0023] As previously described, the valve body 22 can move within the substrate transport chamber 14 by the movement mechanism 3. Therefore, each of the arrangement members, including the second shield member 52 described above, is configured to move within the substrate transport chamber 14 together with the valve body 22. In this regard, Figures 2 and 3 show the state in which the placement members are located inside the substrate transport chamber 14. Figure 4 shows the state in which the opening 20 is closed by the valve body (first valve body) 22 and each placement member is placed in its designated position within the processing container 2. Note that the second valve body 26 is not shown in Figures 2 to 4.

[0024] In this example, the shield member 5 is formed in a substantially cylindrical shape and is provided to surround the periphery of the side wall of the shower head 43 and the periphery of the upper part of the side wall of the mounting base 41 with gaps in between. The second shield member 52 is constructed by cutting out the side wall portion of the cylindrical shield member 5 in the region facing the opening of the communication passage 21 on the substrate processing chamber 11 side. The remaining portion of the shield member 5 constitutes the first shield member 51. Hereinafter, the region of the first shield member 51 from which the second shield member 52 was cut out will be referred to as the "notched region".

[0025] At the position where the second shield member 52 is cut off, the lower end of the first shield member 51 is positioned at a height that does not interfere with the loading and unloading path of the wafer W, which is loaded and unloaded while being held by the member holding portion 23. Furthermore, as shown in Figures 3 and 4, a stepped portion 511 is formed at the lower end so as to interlock with the upper end of the second shield member 52.

[0026] A flow straightening member 6 is provided around the mounting base 41. The flow straightening member 6 is for straightening the airflow inside the processing container 2 and is constructed, for example, by forming multiple holes 60 in an annular plate member. In the example shown in Figures 2 to 4, the flow straightening member 6 is fitted into the area sandwiched between the side wall of the mounting base 41 and the shield member 5, and is positioned facing the floor surface of the processing container 2. The second flow straightening member 62 is constructed by cutting out the area sandwiched between the aforementioned second shield member 52 and the side wall surface of the mounting base 41 when viewed from above, as seen from the annular flow straightening member 6. The remaining part of the flow straightening member 6 constitutes the first flow straightening member 61. The area from which the second flow straightening member 62 was cut out of the first flow straightening member 61 is also called the "cutout area".

[0027] <Components placed inside the substrate processing chamber> Next, the components (placement components) arranged in the substrate processing chamber 11 will be described. In this example, the placement components include the second shielding component 52 and the second rectifying component 62 described above, as well as the wafer W to be processed in the substrate processing chamber 11 and the focus ring 47. These arrangement members are held by a member holding portion 23 connected to the valve body 22. As shown in Figure 4, the member holding portion 23 is configured to extend from the valve body 22 into the substrate processing chamber 11 when the opening 20 is closed by the valve body 22.

[0028] As shown in Figures 2 to 4, the member holding portion 23 is attached to the front surface of the valve body 22 so as to extend substantially horizontally. In this example, the member holding portion 23 includes plate-shaped members 231 arranged parallel to each other vertically, and as shown in Figure 4, a truss member 232 is provided between the upper and lower plate-shaped members 231 to increase strength.

[0029] The tip of the member holding portion 23 is connected to the back surface of the second shield member 52. When the second shield member 52, held from the back surface by the member holding portion 23, is transported to the member arrangement position shown in Figure 4, it fits into the notched area of ​​the first shield member 51 attached to the processing container 2 side. The shield member 5 is formed by these first shield member 51 and second shield member 52. In addition, a stepped portion 521 is formed at the upper end of the second shield member 52 so as to combine with the stepped portion 511 on the first shield member 51 side described above.

[0030] A second rectifier member 62 is connected to the lower end of the front surface of the second shield member 52. When the second rectifier member 62 is transported to the member arrangement position shown in Figure 4, it fits into the notched area of ​​the first rectifier member 61 attached to the processing container 2 side. Together with the first rectifier member 61 and the second rectifier member 62, an annular rectifier member 6 is formed.

[0031] Furthermore, a focus ring 47 is connected to the tip of the second rectifier member 6. The focus ring 47 is positioned around the wafer W to improve the in-plane uniformity of the plasma etching process on the wafer W. As shown in Figure 2, the focus ring 47 is an annular member that is positioned around the convex portion 42 of the mounting table 41 when it is transported to the member arrangement position shown in Figure 4. The focus ring 47 also has a stepped portion 471 that holds the peripheral edge of the wafer W. The focus ring 47 is inserted into the substrate processing chamber 11 with the wafer W held on this stepped portion 471.

[0032] For example, when the focus ring 47 is positioned at the component placement location, the height of the upper surface of the stepped portion 471 is set lower than the height of the upper surface (mounting surface) of the convex portion 42. With this configuration, when the focus ring 47 holding the wafer W is lowered, the wafer W is transferred onto the convex portion 42. During the processing of the wafer W, the stepped portion 471 is retracted to a position below the wafer W.

[0033] In addition, in all figures except Figure 4, for illustrative purposes, the height positions of the convex portion 42 and the stepped portion 471 of the focus ring 47 are shown to be aligned. Alternatively, the height positions of the convex portion 42 and the stepped portion 471 may be aligned, or the upper surface of the stepped portion 471 may be positioned above the upper surface of the convex portion 42, and the wafer W may be held by the focus ring 47 during processing.

[0034] As shown in Figure 4, a support member 48 is provided at the tip of the second rectifier plate 62 to support the focus ring 47 from below. On the other hand, the mounting base 41 has a stepped portion 411 formed therein to avoid interference with the support member 48 when the second rectifier plate 62 and the focus ring 47 are placed in their respective positions. Note that the stepped portion 411 of the mounting base 41 is omitted from the illustration in all figures except Figure 4.

[0035] <Movement mechanism> In the substrate transport chamber 14 described above, the valve body 22 is moved using a magnetic levitation type moving mechanism 3 to transport each component (wafer W, second shield member 52, second rectifier member 62, focus ring 47) that is placed at the component placement position. For example, as shown in Figures 3 and 5, the moving mechanism 3 comprises a floor portion 141 of the substrate transport chamber 14 on which the first magnet is provided, and a movable body 31 configured to be movable within the substrate transport chamber 14. The movable body 31 is formed in a rectangular shape in plan view and is provided with a second magnet that exerts a repulsive force between it and the first magnet, and is configured to be movable by magnetic levitation using the repulsive force.

[0036] As schematically shown in Figure 5, multiple tiles (movable tiles) 30 are provided on the floor surface 141 of the substrate transport chamber 14. These tiles 30 are provided in the movement area of ​​the mobile body 31, from the wafer W transfer position between the load lock chamber 13 to just before the substrate processing chamber 11. Each tile 30 has multiple moving surface-side coils 32 arranged inside it. The moving surface-side coils 32 correspond to the first magnet of this disclosure and generate a magnetic field when power is supplied from a power supply unit (not shown).

[0037] On the other hand, multiple module-side magnets 33, for example, made of permanent magnets, are arranged inside the mobile body 31. These module-side magnets 33 correspond to the second magnets of this disclosure, and a repulsive force (magnetic force) acts between the module-side magnets 33 and the magnetic field generated by the moving surface-side coils 31. This action allows the mobile body 31 to be magnetically levitated relative to the moving surface on the upper side of the tile 30. The module-side magnets 33 may be powered by a battery provided inside the mobile body 31 and consist of coils that function as electromagnets. Alternatively, the module-side magnets 33 may be composed of both permanent magnets and coils.

[0038] The tile 30 is configured to allow the magnetic field state to be changed by adjusting the position and strength of the magnetic field generated by multiple moving surface-side coils 32. This control of the magnetic field allows the moving body 31 to be moved in a desired direction on the moving surface, the levitation distance from the moving surface to be adjusted, and the orientation of the moving body 31 to be adjusted. Control of the magnetic field on the tile 30 side is performed by selecting the moving surface-side coils 32 to which power is supplied and adjusting the amount of power supplied to the moving surface-side coils 32.

[0039] As shown in Figures 3 and 4, the lower end of the valve body 22 is attached to the upper surface of the tip of the movable body 31. In this example, as shown in Figure 4, the valve body 22 and the movable body 31 are detachably connected by a first screw mechanism 34. For example, the valve body 22 is provided with a screw 341 that can protrude downward from its lower surface, and a drive mechanism 342 for this screw. On the other hand, a screw hole 343 into which the screw 341 is screwed is formed on the upper surface of the movable body 31. By rotating the screw 341 in the tightening direction using the drive mechanism 342, the screw 341 is inserted into the screw hole 34, and the valve body 22 is fixed to the movable body 31. Conversely, by rotating the screw 341 in the loosening direction, its lower end is raised from the upper surface of the movable body 31, thereby detaching the valve body 22 from the movable body 31.

[0040] Furthermore, the valve body 22 is configured to be detachably attached to, for example, the wall portion surrounding the opening 20 of the processing container 2 by a second screw mechanism 35. For example, the valve body 22 is provided with a mounting screw 351 that can protrude forward from its front surface, and a drive mechanism 352 for this screw 351. On the other hand, a screw hole 353 into which the screw 351 is screwed is formed in the wall portion of the processing container 2 to which the valve body 22 is attached. In this way, by rotating the screw 351 in the tightening direction using the drive mechanism 352, the valve body 22 is fixed to the wall portion of the processing container 2, and by rotating the screw 351 in the loosening direction and separating it from the wall portion, the valve body 22 is removed from the processing container 2. Furthermore, the valve body 22 and the movable body 31 or the wall of the processing container 2 are not limited to a screw mechanism, as long as there is a mechanism for mechanically attaching and detaching them. The valve body 22 may also be gripped by a manipulator provided on the movable body 31 or the wall of the processing container 2.

[0041] The component transport apparatus of this disclosure is arranged such that when the opening 20 is closed by the valve body 22, the component holding portion 23 extends from the opening 20 into the substrate processing chamber 11. The component held by the component holding portion 23, in this example, the second shielding member 52, the second rectifying member 62, the focus ring 47, and the wafer W, is then transported to a predetermined position within the substrate processing chamber 11. Thus, the component holding portion 23 has the function of transporting the wafer W to a position where processing is performed within the vacuum processing chamber 11, and corresponds to the substrate holding portion of this disclosure.

[0042] Next, the configuration of the load lock chamber 13 in the example shown in Figure 1 will be further explained. As previously described, the opening 132 for transporting the wafer W, formed between the load lock chamber 13 and the substrate transport chamber 14, can be opened and closed by either the gate valve GV2 or the valve body 22. In addition, the transfer stage 130 on which the wafer W is placed has a convex portion formed thereon, for example, similar in shape to the mounting table 41.

[0043] Then, when the valve body 22 closes the opening 132 of the load lock chamber 13, the member holding portion 23 is positioned to extend from the valve body 22 toward the stage 130. With this configuration, the wafer W can be transferred from the focus ring 47 to the stage 130, similar to the wafer transfer operation between the mounting table 41 on the substrate processing chamber 11 side and the focus ring 47 as described using Figure 4.

[0044] Alternatively, the stage 130 may not be provided in the load lock chamber 13, and the focus ring 47 may be kept in a waiting position at a predetermined height within the load lock chamber 13. In this case, the lifting pin 131 can be made to protrude above the wafer W holding height of the focus ring 47, thereby enabling the transfer of the wafer W between the load lock chamber 13 and the atmospheric transport mechanism 122.

[0045] Furthermore, screw holes (not shown) are formed in the wall of the load lock chamber 13 surrounding the opening 132, into which the valve body 22 is screwed in by the second screw mechanism 35 described above. The gate valve GV2 is configured to retract to a position that does not interfere with the opening and closing operation of the opening 132 by the valve body 22 (see also Figure 7 described later).

[0046] In the example shown in Figure 1, the length of the shorter side of the rectangular substrate transport chamber 14 in plan view is such that two mobile bodies 31, each holding a valve body 22, can pass each other side by side. In this example, the valve body 22 and components are transported using multiple mobile bodies 31 provided inside the substrate transport chamber 14. The apparatus described above, which includes the valve body 22, the member holding part 23 for holding the member, and the moving mechanism 3, corresponds to an apparatus for transporting members placed in the substrate processing chamber 11 of this disclosure.

[0047] <Department Head> The circuit board processing system 1 includes a control unit 100. The control unit 100 is composed of a computer with a CPU and a memory unit, and controls each part of the circuit board processing system 1. The memory unit stores a program containing a set of steps (instructions) for controlling the movement of the mobile body 31 and the operation of the circuit board processing chamber 11. This program is stored on a storage medium such as a hard disk, compact disk, magnetic optical disk, memory card, or non-volatile memory, and installed from there onto the computer.

[0048] <Transportation Operation> Next, an example of wafer W transport operation in the substrate processing system 1 having the above configuration will be described. First, a carrier C containing the wafer W to be processed is placed on the load port 121, and the wafer W is removed from the carrier C by the atmospheric transport mechanism 122 in the atmospheric transport chamber 12. Meanwhile, in the load lock chamber 13, as shown in Figure 1, before the wafer W is transported, the valve body 22 closes the opening 132, the member holding part 23 enters the load lock chamber 13, and the focus ring 47 is positioned on the stage 130.

[0049] Next, the atmospheric transport mechanism 122 carries the wafer W into the load lock chamber 13, and the lifting pin 131 pushes up and receives the wafer W. Then, the lifting pin 131 is lowered, and the wafer W is handed over to the stage 130. Subsequently, when the atmospheric transport mechanism 122 retracts from the load lock chamber 13, the gate valve GV1 is closed, switching the atmosphere inside the load lock chamber 13 from atmospheric pressure to a vacuum atmosphere.

[0050] Figure 1 shows the load lock chamber 13 on the right, illustrating how the pressure inside the load lock chamber 13 is adjusted with the wafer W placed on the stage 130. In this example, the valve body 22 that closes the opening 132 is removed from the movable body 31. Once the load lock chamber 13 is in a vacuum, the movable body 31 is attached to the valve body 22. The attachment and detachment of the movable body 31 and the valve body 22 will be described later. Furthermore, the coupling of the valve body 22 to the wall surrounding the opening 132 by the second screw mechanism 35 is released. Next, inside the substrate transport chamber 14, the movable body 31 rises by magnetic levitation using the magnetic field generated by the moving surface-side coil 32 provided on the tile 30.

[0051] Next, the movable body 31 is retracted to remove the valve body 22 from the opening 132. As the movable body 31 rises, the focus ring 47 rises, and the wafer W is transferred to the stage 130 focus ring 47. Then, the movable body 31 is moved backward to the substrate processing chamber 11 where the wafer W will be processed, and the movable body 31 is rotated so that the front end of the member holding part 23 holding the wafer W faces the opening 20. Subsequently, the direction of movement of the movable body 31 is switched to forward in order to load the wafer W into the substrate processing chamber 11.

[0052] Thus, as shown in Figure 6A, the member holding section 23 holding the wafer W is positioned to face the opening 20 of the substrate processing chamber 11. Then, as shown in Figure 6B, the moving body 31 is advanced to a position above the mounting table 41 where the center of the wafer W is slightly in front of the center of the mounting table 41. Note that in Figures 6A to 6D and 7, the first shielding member 51 and the second shielding member 52 near the opening of the communication passage 21 on the substrate processing chamber 11 side are shown in a simplified manner. Also, the first shielding member 51 and the first rectifier member 61 in other areas are omitted from the description.

[0053] Next, the moving body 31 is lowered while moving in a straight line, moving the wafer W diagonally downward. This action causes the wafer W to first come into contact with the upper surface of the convex portion 42 of the mounting table 41. Further movement of the moving body 31 is continued, transferring the wafer W from the focus ring 47 to the convex portion 42 (see Figure 6C). Then, the moving body 31 is lowered to a position where the focus ring 47 contacts the mounting table 41. As previously described, for illustrative purposes, in Figure 6C, the height positions of the stepped portion 471 of the focus ring 47 and the convex portion 42 are depicted as being the same.

[0054] The length of the component holding section 23 is adjusted so that when the focus ring 47 comes into contact with the mounting base 41, the opening 20 is closed by the valve body 22. In addition, along with the wafer loading operation described above, each component held in the component holding section 23 (focus ring 47, second shielding member 52, second rectifying member 62) is also transported to its respective component placement position. As described above, when the wafer W is placed on the mounting table 41, the movable body 31 moves diagonally downward. The shapes of the connecting passage 21 and the first shield member 51 are set to enable this movement, and the height position of the movable body 31 is controlled within the substrate transport chamber 14.

[0055] In this example, the wafer W is moved diagonally downward to transfer it from the focus ring 47 to the mounting table 41. In this transfer operation, the focus ring 47 continues to descend diagonally even after transferring the wafer W to the mounting table 41, so there is a risk that the center of the wafer W placed on the mounting table 41 and the center of the focus ring 47 may be slightly misaligned. In such cases, the direction and amount of the misalignment of the centers of the two should be known in advance. Then, in the load lock chamber 13, the wafer W may be transferred to the focus ring 47 after being pre-shifted by the amount of misalignment in the opposite direction to the misalignment.

[0056] The above-described transport operation, which moves the wafer W diagonally downward, is just one example, and the wafer W may be transferred via other transport paths. For example, the moving body 31 may be moved in a straight line to transport the wafer W to a position above the mounting table 41 so that their centers are aligned. Then, the moving body 31 may be lowered to transfer the wafer W to the convex portion 42, and the moving body 31 may be lowered again to position the focus ring 47 at the component placement position. Next, as shown in Figure 6D, the valve body 22 is attached to the wall of the processing container 2 using the second screw mechanism 35 to close the opening 20. After this, the first screw mechanism 34 is driven to detach the movable body 31 from the valve body 22. The movable body 31 that has been detached from the valve body 22 is used to move the other valve bodies 22.

[0057] Thus, the wafer W is brought into the substrate processing chamber 11, and the opening 20 is closed by the valve body 22. In the substrate processing chamber 11, the wafer W is heated by the heating unit as needed to raise its temperature to a preset level. At the same time, etching gas, which is the processing gas, is supplied into the processing container 2 from the shower head 43, and high-frequency power is applied from the high-frequency power supply 45. As a result, capacitively coupled plasma is generated in the processing container 2, and plasma etching is performed on the wafer W by the active species of the etching gas.

[0058] At this time, the focus ring 47, the second shield member 52, and the second rectifier member 62 are positioned in a predetermined configuration. As a result, the flow of etching gas is controlled by the rectifier member 6, the focus ring 47 is used to carry out an etching process with good in-plane uniformity, and the shield member 5 prevents the product from adhering to the inner wall of the processing container 2.

[0059] Once the plasma etching process is complete, the movable body 31 is attached to the valve body 22. Next, the second screw mechanism 35 is driven to remove the valve body 22 from the wall of the processing container 2. After this, the movable body 31 is raised and moved to unload the wafer W from the substrate processing chamber 11 in the reverse order of loading. If other processing is to be performed after the plasma etching process, the wafer W is transported to the substrate processing chamber 11 where that processing will be performed. When transporting the wafer W to another substrate processing chamber 11, the loading operation is repeated in the same manner as described in the examples using Figures 6A to 6D. In the above configuration, during the period when the valve body (first valve body) 22 is removed from the opening 20, the opening 20 is closed by the second valve body 26, as will be described later.

[0060] Furthermore, when all processing is complete and the wafer W is to be transported to the load lock chamber 13, the gate valve GV2 of the load lock chamber 13 is opened. Then, the movable body 31 moves the valve body 22, and the processed wafer W is loaded into the load lock chamber 13. Next, the valve body 22 closes the opening 132 of the load lock chamber 13, and the wafer W is placed on the stage 130. The movable body 31 is then removed from the valve body 22 and used to move other valve bodies 22. After this, the atmosphere inside the load lock chamber 13 is adjusted to atmospheric pressure, the gate valve GV1 is opened, and the wafer W is transferred to the atmospheric transport mechanism 122 via the lifting pin 131. Once the atmospheric transport mechanism 122 has unloaded the wafer W, the gate valve GV1 of the load lock chamber 13 is closed, and the wafer W is stored in the carrier C.

[0061] <Maintenance and cleaning of components> As described above, the valve body 22 of this disclosure is provided with a focus ring 47, a second shield member 52, and a second rectifier member 62 via a member holding portion 23. On the other hand, members placed in the substrate processing chamber 11 may be subject to periodic maintenance and cleaning. In such cases, the members in question may be removed from the substrate processing chamber 11 for maintenance and cleaning. In this regard, since each of the above-mentioned members (focus ring 47, second shield member 52, and second rectifier member 62) can be removed from the substrate processing chamber 11 using a movable body 31, these members can be removed without opening the substrate processing chamber 11, which is under a vacuum atmosphere.

[0062] For example, when performing maintenance, the movable body 31 is connected to the valve body 22 that holds the component to be worked, and the component held by the component holding part 23 is transported to the load lock chamber 13. Then, the opening 132 of the load lock chamber 13 is closed by the valve body 22, and the load lock chamber 13 is returned to an atmospheric pressure environment. Next, for example, the top plate of the load lock chamber 13 is opened, and an operator removes at least one of the components, such as the focus ring 47, the second shielding member 52, and the second rectifying member 62. Then, maintenance, cleaning, or parts replacement is performed on these components. Once the maintenance of the component is complete, the component is returned to the state in which it is held in the component holding section 23. Next, the top plate of the load lock chamber 13, which had been open, is closed, and the transport of the wafer W using the valve body 22 is resumed.

[0063] <Effects> In this embodiment, the valve body 22 is connected to a component that is to be placed inside the substrate processing chamber 11 via a component holding portion 23. When the valve body 22 closes the opening 20 that connects the substrate transport chamber 14 and the substrate processing chamber 11, the component is transported to a predetermined position inside the substrate processing chamber 11. In this way, by integrating the valve body 22 that closes the opening 20 and the component that is placed inside the substrate processing chamber 11, these components can be transported out of the substrate processing chamber 11 together with the valve body 22.

[0064] Furthermore, since the valve body 22 is movable by a movable body 31 provided outside the substrate processing chamber 11, there is no need to individually provide lifting pins and their drive mechanisms for transferring these components inside the substrate processing chamber 11. Therefore, the number of components to be placed inside the substrate processing chamber 11 can be reduced, which can lead to miniaturization of the substrate processing chamber 11 and a reduction in manufacturing costs. Furthermore, by simultaneously opening and closing the opening 20 with the valve body 22 and transporting the material, the number of processes is reduced compared to when these are performed individually. This simplifies the control of the drive mechanism in substrate processing and reduces operating costs.

[0065] Furthermore, when performing periodic maintenance or cleaning on components placed in the substrate processing chamber 11, the components are transported to the load lock chamber 13, the opening 132 of the load lock chamber 13 is closed by the valve body 22, and the necessary processing is carried out. In this way, maintenance and other work are performed in a state where the atmosphere is separated from that of the vacuum transport chamber 11, and the substrate processing chamber 11 and the substrate transport chamber 13 can be maintained in a vacuum atmosphere. Therefore, when performing maintenance on the aforementioned components, it is not necessary to open the vacuum atmosphere of the substrate processing chamber 11 or the substrate transport chamber 14 to the atmosphere, thus reducing the number of maintenance steps, processing time, and downtime of the substrate processing system.

[0066] Furthermore, in a configuration where components requiring periodic maintenance are transported together with the valve body 22, the components are transported as a single unit, allowing maintenance of these components to be performed collectively. Therefore, the effort and time required for maintenance can be significantly reduced compared to performing maintenance on components individually. In addition, since the components are integrally configured in the component holding section 23, the assembly and operation checks of these components can be performed collectively, reducing the number of steps required for quality checks during maintenance.

[0067] Furthermore, in the above-described embodiment, the valve body 22 and the movable body 31 are configured to be detachable. This allows the movable body 31 to be removed from the valve body 22 when the opening 20 is closed, and the movable body 31 can be shared by multiple valve bodies 22. Therefore, fewer movable bodies 31 are needed compared to the number of valve bodies 22, thus reducing the number of components. Also, compared to the case where the movable body 31 is fixedly provided on all valve bodies 22, the area occupied by the movable body 31 is smaller, allowing for a smaller substrate transport chamber 14. On the other hand, it is not a mandatory requirement to configure the movable body 31 to be detachable from the valve body 22; the movable body 31 may be fixed to all or some of the valve bodies 22 as needed.

[0068] <Example of the configuration of the opening and closing mechanism for an opening> Here, an example of the configuration of the opening and closing mechanism will be explained with reference to Figure 7. In the following explanation, common components are denoted by the same reference numerals as those in Figures 1 to 6D, and further explanation will be omitted. In this example, the second valve body 26 will be explained. In the example shown in Figure 7, the second valve body 26 is configured to move up and down between a position that closes the opening 20 and a retracted position above the closing position, and a valve casing 142 that is in the retracted position is formed in the substrate transport chamber 14. However, the retracted position of the second valve body 26 is not limited to the example shown in Figure 7, and may be provided, for example, below or to the side of the position that closes the opening 20.

[0069] Then, when the wafer W is brought into the substrate processing chamber 11, the opening 20 is closed with the valve body (first valve body) 22, as described in the first embodiment, and processing is performed on the wafer W. Also, as shown in Figure 7, when the wafer W has not been processed and the member holding section 23 and each arrangement member are on the substrate transport chamber 14 side, the opening 20 is closed with the second valve body 26.

[0070] With this configuration, when the wafer W is in the substrate transport chamber 14, the opening 20 is closed by the second valve body 26. Therefore, the risk of reaction products generated in the substrate processing chamber 11 flowing out to the substrate transport chamber 14 during the period when the valve body 22 is removed can be suppressed. In addition, the risk of temperature and pressure conditions in the substrate processing chamber 11 affecting the substrate transport chamber 14 is reduced.

[0071] <Second Embodiment> A second embodiment of the present disclosure will be described with reference to Figures 8A and 8B. In this embodiment, the focus ring 47 and its support member 48 are configured to be separable. In the example shown in these figures, a connecting pin 491 is provided at the upper end of the support member 48, and a recess 492 corresponding to the shape of the connecting pin 491 is formed on the lower surface of the focus ring 47.

[0072] In this example, when transporting the placement member together with the valve body 22, the support member 48 supports the focus ring 47 from below, thereby fitting the connecting pin 491 into the recess 492. With the two connected in this way, the wafer W is transported to the mounting table 41 in the same manner as in the first embodiment, as shown in Figure 8A. After the wafer W is placed on the mounting table 41, the moving body 31 is further lowered to pull the connecting pin 491 of the support member 48 out of the recess 492 of the focus ring 47, thereby separating the two (see Figure 8B).

[0073] On the other hand, once processing of the wafer W is completed in the substrate processing chamber 11, the moving body 31 is raised again to insert the connecting pin 491 of the support member 48 into the recess 492 of the focus ring 47, thereby holding the focus ring 47 and the wafer W in the member holding part 23. After this, the wafer W is transported from the substrate processing chamber 11 to the substrate transport chamber 14 using the same method as in the first embodiment. Note that a connecting pin may be provided on the focus ring 47 side and a recess on the support member 48 side between the support member 48 and the focus ring 47. In this example, the configuration is the same as in the first embodiment, except that the focus ring 47 and the support member 48 are configured to be detachable.

[0074] In this second embodiment, the same effects as in the first embodiment can be obtained. Furthermore, since the focus ring 47 is disconnected from the valve body 22 during wafer W processing, there is no risk of the position of the focus ring 47 changing due to changes in the connection position of the valve body 22. This is because the valve body 22 is connected to the processing container 2 via an O-ring 221, and changes in shape such as deterioration of the O-ring 221 may slightly change the position in which the valve body 22 closes the opening 20, which could affect the arrangement of the focus ring 47. Therefore, by configuring the system to disconnect the focus ring 47 from the valve body 22 during wafer W processing, as in this example, an improvement in the accuracy of the position of the focus ring 47 can be expected.

[0075] <Third Embodiment> A third embodiment of this disclosure will be described with reference to Figure 9. This embodiment shows another example of an arrangement member placed in a substrate processing chamber, wherein the arrangement member is a shutter that covers the non-applicable surfaces when pre-coating is performed in the substrate processing chamber. Non-applicable surfaces are surfaces in the substrate processing chamber where pre-coating is not performed. The substrate processing chamber shown in Figure 9 is configured to perform film deposition on a wafer W by, for example, PVD (Physical Vapor Deposition). Referring to Figure 9, an example in which the placement member is a shutter for pre-coating will be explained.

[0076] First, to briefly explain the film deposition process, the substrate processing chamber 11a is equipped with a processing container 7 that is connected to the substrate transport chamber 14 via an opening 20. In this example, a valve body 22 is provided, which is equipped with a member holding part 23 capable of transporting wafers W, and a valve body 220 is equipped with a member holding part 230 that holds the shutter 8, which is a placement member. Furthermore, when processing the wafer W, the movement of the movable body 31 moves the valve body 22, and the material holding unit 23 transports the wafer W, similar to the example of the substrate processing chamber 11 described with reference to Figures 6A to 6D.

[0077] After the wafer W is loaded into the processing container 7, gas is supplied from the gas supply port 73, and the pressure inside the processing container 7 is reduced by the exhaust mechanism 74. Meanwhile, a voltage is applied to the target 75 placed inside the processing container 7 via the holder 76, and a cathode magnet 76, which is positioned outside the processing container 7 facing the target 75, is driven. As a result, the plasma is concentrated near the target 75, and positive ions in the plasma collide with the target 75. In this way, constituent material is released from the target 75 and deposited on the wafer W, thus the film deposition process of the wafer W proceeds.

[0078] In the substrate processing chamber 11a described above, a shutter 8 is placed before the film deposition process is carried out, and a pre-coat process is performed inside the processing container 7. As shown in Figure 9, the shutter 8 is formed to cover the top and sides of the mounting table 71 when it is transported to a predetermined position.

[0079] The valve body 220 and the member support portion 230 are configured in the same manner as the valve body 22 and member support portion 23 described in Figures 1 to 6D, respectively. That is, when the opening 20 is closed by the valve body 220, the member holding portion 230 is positioned to extend toward the substrate processing chamber 11a, and the shutter 8 is transported to the member placement position. In the example of Figure 9, a shutter member 81 is provided on the member holding portion 23 as a placement member, and is configured to close part or all of the opening 70 between the processing container 7 and the communication passage 21.

[0080] When performing the pre-coat treatment, the valve body 220 closes the opening 20, the shutter 8 is transported to the member placement position, and the top and side surfaces of the mounting table 71, which are not the surfaces to be pre-coated, are covered. Then, for example, the inside of the processing container 7 is exhausted by the exhaust mechanism 74, while pre-coat gas is supplied from the gas supply port 73, and high-frequency power is applied to the pre-coat gas from a plasma forming unit (not shown). This converts the pre-coat gas into plasma and performs a pre-coat treatment to form a pre-coat film inside the processing container 7.

[0081] The pre-coat film is formed on all surfaces within the processing container 7 except for the non-symmetrical surface covered by the shutter 8. This pre-coat treatment provides protection for the material from the plasma used during sputtering. After the pre-coating process is completed, for example, the supply of pre-coating gas and plasma generation are stopped, and the supply of inert gas is started to replace the atmosphere inside the processing container 7 with inert gas. After this, the valve body 220 is removed from the opening 20, the opening 20 is opened, and the shutter 8 is removed from the substrate processing chamber 11a.

[0082] Furthermore, the components placed in the substrate processing chamber may be shutters that cover surfaces not subject to cleaning during gas cleaning or plasma cleaning of the substrate processing chamber. The cleaning process is performed, for example, after the film deposition process has been performed a predetermined number of times, when the substrate processing chamber is configured to perform film deposition on the wafer W. For example, the shutter for the cleaning process is configured similarly to the shutter 8 for the pre-coat process described with reference to Figure 7. In this configuration, the opening is closed by a valve body, and when the wafer is transported to a predetermined position, the shutter is formed to cover the upper and side surfaces of the mounting table, which are surfaces not subject to cleaning.

[0083] When performing the cleaning process, the opening is sealed with a valve, the shutter is moved to the component placement position, and the top and sides of the mounting table are covered. Then, cleaning gas is supplied, and if necessary, plasma is formed to clean the inside of the processing container. During the cleaning process, the top and sides of the mounting table are covered by the shutter, protecting them from the cleaning gas and plasma and minimizing damage.

[0084] In the above, the placement member only needs to include at least one member selected from the group of members consisting of a wafer, a focus ring, a shielding member, a rectifying member, and a shutter. Therefore, the member transported together with the valve body by the member holding part (substrate holding part) may be only a wafer. Furthermore, the placement member can consist not only of the aforementioned group of members, but also of any member that is placed in the substrate processing chamber and, when the opening is closed by the valve body, is transported to a predetermined placement position in the substrate processing chamber by the member holding part extending from the valve body. Moreover, the shape of the member holding part is not limited to the above example, and may be any shape that extends from the valve body toward the substrate processing chamber when the opening is closed by the valve body, and transports the member to the member placement position.

[0085] Furthermore, the moving mechanism is not limited to the magnetic levitation type moving mechanism described above. The valve body and the member held by the member holder can be positioned so that the valve body closes the opening, and the member is transported to the load lock chamber via the substrate transport chamber. Therefore, the moving body to which the valve body is attached may move along rails, or the moving body may be equipped with wheels. Alternatively, the member held by the valve body and the member holder may be moved by a transport mechanism equipped with a multi-joint arm. Furthermore, the valve body may be fixed to the moving body and not detachable.

[0086] Furthermore, the substrate processing chamber and the substrate transport chamber only need to be adjacent to each other, and are not limited to the embodiments described above. In the embodiments described above, a connecting passage was provided between the substrate processing chamber and the substrate transport chamber, but the length of this connecting passage (size in the Y' direction in Figure 3) can be set as appropriate, and it may be configured without substantially any passage. Furthermore, the configuration of the mounting platform is not limited to the examples described above. It may also be configured such that the wafer is transferred to the mounting platform by a lifting pin for transfer, without providing the convex portion for wafer placement described above.

[0087] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. [Explanation of Symbols]

[0088] W wafer 14. Circuit board transport room 11. Substrate Processing Room 20 openings 22 Valve body 23 Member holding part 3 Moving mechanism

Claims

1. A device for transporting components placed in a substrate processing chamber between a substrate transport chamber and a plurality of substrate processing chambers, which are provided adjacent to each other, A valve body is detachably configured to connect the substrate transport chamber and the substrate processing chamber, and is used to close the opening. When the opening is closed by the valve body, a member holding part is provided extending from the valve body toward the substrate processing chamber and for transporting the member to a predetermined position within the substrate processing chamber, The system includes a moving mechanism for moving the valve body, which has been removed from the opening, within the substrate transport chamber. The aforementioned moving mechanism is The floor surface of the substrate transport chamber where the first magnet is provided, A movable body is provided to which the valve body is attached and to which a second magnet acts in a repulsive force with the first magnet, and is configured to be movable within the substrate transport chamber by magnetic levitation using the repulsive force, The movable body is configured to be detachably attached to the valve body and can be removed from the valve body when the opening is closed. A device comprising a plurality of the valve body, the movable body, and the member holding part, wherein the movable bodies move independently of each other, and the valve body is attached to and detached from each of the openings individually.

2. In order to mechanically attach and detach the movable body and the valve body, The apparatus according to claim 1, wherein the valve body is provided with a drive mechanism that enables switching between a state in which the movable body and the valve body are fixed and a state in which they are not fixed.

3. A device for transporting components to be placed in a substrate processing chamber between a substrate transport chamber and a substrate processing chamber, which are provided adjacent to each other, A valve body is detachably configured to connect the substrate transport chamber and the substrate processing chamber, and is used to close the opening. When the opening is closed by the valve body, a member holding part is provided extending from the valve body toward the substrate processing chamber and for transporting the member to a predetermined position within the substrate processing chamber, The system includes a moving mechanism for moving the valve body, which has been removed from the opening, within the substrate transport chamber. The apparatus includes at least one component selected from a group of components comprising: a focus ring positioned around a substrate when plasma processing is performed on the substrate being processed in the substrate processing chamber; a shielding member for preventing products resulting from the processing of the substrate from adhering to the main body of the substrate processing chamber; a rectifying member for rectifying the airflow within the substrate processing chamber; and a shutter that covers non-target surfaces when pre-coating or cleaning is performed inside the substrate processing chamber.

4. A device for transporting components to be placed in a substrate processing chamber between a substrate transport chamber and a substrate processing chamber, which are provided adjacent to each other, A valve body is detachably configured to connect the substrate transport chamber and the substrate processing chamber, and is used to close the opening. When the opening is closed by the valve body, a member holding part is provided extending from the valve body toward the substrate processing chamber and for transporting the member to a predetermined position within the substrate processing chamber, The system includes a moving mechanism for moving the valve body, which has been removed from the opening, within the substrate transport chamber. The device includes a second valve body that closes the opening when the first valve body is removed, and the valve body that moves within the substrate transport chamber by the aforementioned moving mechanism is referred to as the first valve body.

5. The aforementioned member includes a substrate that is processed in the substrate processing chamber, The apparatus according to any one of claims 1 to 4, wherein the member holding portion is configured to hold the substrate and has the function of a substrate holding portion for transporting the substrate to a position where processing is performed.

6. A system for processing substrates, A substrate processing system comprising the substrate transport chamber, the substrate processing chamber, and a device for transporting the components, as described in any one of claims 1 to 5.

7. A method for transporting components placed in a substrate processing chamber between a substrate transport chamber and a plurality of substrate processing chambers that are provided adjacent to each other, A valve body is detachably configured to connect the substrate transport chamber and the substrate processing chamber, and is used to close the opening; a member holding portion is provided on the valve body so as to extend from the valve body toward the substrate processing chamber when the opening is closed by the valve body; and a moving mechanism is used to move the valve body within the substrate transport chamber. The process involves closing the opening with the valve body and transporting the member to a predetermined position within the substrate processing chamber, The process includes removing the valve body from the aforementioned opening and moving it within the substrate transport chamber, The aforementioned moving mechanism is The floor surface of the substrate transport chamber where the first magnet is provided, A movable body is provided to which the valve body is attached and to which a second magnet acts in a repulsive force with the first magnet, and is configured to be movable within the substrate transport chamber by magnetic levitation using the repulsive force, The process includes attaching and detaching the movable body to and from the valve body, The attachment / detachment step includes the step of removing the movable body from the valve body while the opening is closed, Multiple valve bodies, movable bodies, and member holding parts are provided. A step of moving the aforementioned moving bodies independently of each other, A method comprising the step of individually attaching and detaching the valve body to each of the openings.

8. A method for transporting a component to be placed in a substrate processing chamber between a substrate transport chamber and a substrate processing chamber, which are provided adjacent to each other, A valve body is detachably configured to connect the substrate transport chamber and the substrate processing chamber, and is used to close the opening; a member holding portion is provided on the valve body so as to extend from the valve body toward the substrate processing chamber when the opening is closed by the valve body; and a moving mechanism is used to move the valve body within the substrate transport chamber. The process involves closing the opening with the valve body and transporting the member to a predetermined position within the substrate processing chamber, The process includes removing the valve body from the aforementioned opening and moving it within the substrate transport chamber, The method comprises at least one member selected from a group of members comprising: a focus ring positioned around a substrate when plasma processing is performed on the substrate being processed in the substrate processing chamber; a shielding member for preventing products resulting from the processing of the substrate from adhering to the main body of the substrate processing chamber; a rectifying member for rectifying the airflow within the substrate processing chamber; and a shutter that covers non-target surfaces when pre-coating or cleaning is performed inside the substrate processing chamber.

9. A method for transporting a component to be placed in a substrate processing chamber between a substrate transport chamber and a substrate processing chamber, which are provided adjacent to each other, A valve body is detachably configured to connect the substrate transport chamber and the substrate processing chamber, and is used to close the opening; a member holding portion is provided on the valve body so as to extend from the valve body toward the substrate processing chamber when the opening is closed by the valve body; and a moving mechanism is used to move the valve body within the substrate transport chamber. The process involves closing the opening with the valve body and transporting the member to a predetermined position within the substrate processing chamber, The process includes removing the valve body from the aforementioned opening and moving it within the substrate transport chamber, A method comprising the step of closing the opening with a second valve body while the first valve body is removed, wherein the valve body that moves within the substrate transport chamber by the moving mechanism is referred to as the first valve body.

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