Processing unit

Abstract

To adjust air having extremely high humidity to appropriate humidity, and discharge the adjusted air.SOLUTION: A processing device includes an electric part, an air-cooling unit for sending first gas to the electric part and cooling the electric part, a first exhaust pipe as an exhaust route of the first gas from the electric part, a processing chamber for storing a holding table and a processing unit, a gas-liquid separation unit for exhausting second gas containing liquid mist from the processing chamber, and performing gas-liquid separation, a second exhaust pipe as an exhaust route of the second gas from the gas-liquid separation unit, and an exhaust unit to which the first gas passing through the first exhaust pipe and the second gas passing through the second exhaust pipe are supplied, and that exhausts third gas formed by mixing the first gas and the second gas, wherein the exhaust unit includes a front chamber where the third gas reaches, and a high efficiency particulate air (HEPA) filter passing the third gas reaching the front chamber, and exhausts the third gas purified by the HEPA filter.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a processing apparatus for subjecting an object to be processed to processes such as processing and cleaning.

Background Art

[0002] When processing workpieces such as semiconductor wafers, resin package substrates, ceramic substrates, and glass substrates, various processing apparatuses are used. The processing apparatus includes a chuck table for holding the workpiece and a processing unit for processing the workpiece held by the chuck table.

[0003] For example, when dividing a workpiece into a plurality of chips, a cutting apparatus having a processing unit (cutting unit) to which an annular cutting blade for cutting the workpiece is attached is used. In addition, for the processing of thinning the workpiece, a grinding apparatus having a processing unit (grinding unit) including a plurality of grinding wheels for grinding the workpiece, or a polishing apparatus having a processing unit (polishing unit) to which a polishing pad for polishing the workpiece is attached is used. Then, the workpiece is processed by the processing unit in the processing chamber of the processing apparatus while being held by the chuck table.

[0004] When processing a workpiece with a processing apparatus, a liquid (processing liquid) such as pure water is supplied to the processing unit and the workpiece. The processing liquid cools the processing unit and the workpiece, and flushes away chips (processing chips) generated by the processing.

[0005] During the processing of a workpiece, the processing fluid comes into contact with the processing unit and the workpiece, causing it to scatter. As a result, the processing chamber becomes filled with a mist-like processing fluid containing processing debris. If processing of a workpiece continues in such a state, the processing fluid containing processing debris may adhere to the workpiece, contaminating it and potentially degrading the quality of the product (device chip, etc.) manufactured by the processing of the workpiece. In addition, the mist-like processing fluid may leak from the processing chamber and adhere to components of the processing equipment (actuators, electrical wiring, etc.), potentially causing deterioration or malfunction of these components.

[0006] Furthermore, the processing equipment incorporates a cleaning device for cleaning the processed workpieces. In the cleaning device, a spinner table that holds the workpiece is rotated at high speed while high-pressure cleaning water is sprayed onto the workpiece to clean it. As a result, the cleaning chamber in which the spinner table is housed is filled with a mist of cleaning water.

[0007] Therefore, ducts for exhausting mist-like liquids are connected to processing chambers such as the processing chamber of a processing device or the cleaning chamber of a cleaning device. For example, Patent Documents 1 and 2 disclose exhaust devices connected to a cutting device via ducts. This exhaust device discharges the mist-like processing fluid (liquid) remaining in the processing chamber (processing chamber) along with the air inside the processing chamber through the duct. The air discharged through the duct is separated into gas and liquid to remove the mist-like processing fluid (liquid), and then discharged to the outside of the processing device. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Application Publication No. 11-188568 [Patent Document 2] Japanese Patent Publication No. 2020-32477 [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] However, in processing equipment such as processing machines and spinner cleaning machines, the air discharged from processing chambers such as processing rooms and cleaning rooms still has a humidity of around 80-90% even after the mist-like liquid has been removed. This extremely high humidity air discharged from the processing equipment has been problematic because it adversely affects the processing equipment itself, as well as other adjacent equipment, facilities, and electrical equipment.

[0010] Therefore, one might consider connecting exhaust routes, such as piping, to each processing unit installed in a factory, and exhausting the air outside the factory. However, connecting an exhaust route to each of the numerous processing units would occupy a large portion of the factory's area. Furthermore, it would incur costs for operating the exhaust system.

[0011] This invention has been made in view of the above problems, and aims to provide a processing device that can adjust extremely humid air to an appropriate humidity level and discharge it. [Means for solving the problem]

[0012] According to one aspect of the present invention, a holding table for holding an object to be processed, a processing unit for processing or washing the object held on the holding table while supplying a liquid to it, an electrical unit equipped with equipment for controlling the holding table or the processing unit, an air-cooling unit for supplying a first gas to the electrical unit to cool it, a first exhaust pipe which serves as an exhaust path for the first gas from the electrical unit, a processing chamber housing the holding table and the processing unit, a processing chamber drain for discharging the liquid used in the processing chamber, a gas-liquid separation unit for discharging a second gas containing mist of the liquid from the processing chamber to separate the gas and liquid, a second exhaust pipe which serves as an exhaust path for the second gas from the gas-liquid separation unit, and the first gas that has passed through the first exhaust pipe and the second gas that has passed through the second exhaust pipe are supplied and mixed to form a gas. A gas-liquid separation unit is provided, comprising: an exhaust unit for exhausting a third gas; a suction duct for drawing in and exhausting the second gas from the processing chamber; a liquid tank for storing the liquid supplied from the processing chamber drain at a predetermined water level; a duct connection for connecting the suction duct to the liquid tank so as to inject the second gas containing mist of the liquid toward the liquid surface of the liquid stored in the liquid tank; and an exhaust opening provided in the liquid tank through which the second gas, separated into gas-liquid and liquid phases by the liquid mist contained in the second gas injected from the suction duct being captured by the liquid stored in the liquid tank, is exhausted; the exhaust unit comprises: a pre-chamber to which the third gas reaches; and a HEPA filter through which the third gas that has reached the pre-chamber passes; and the exhaust unit is characterized by discharging the third gas purified by the HEPA filter.

[0013] Preferably, the system further includes a recirculation path for supplying some or all of the third gas discharged from the exhaust unit. [Effects of the Invention]

[0014] In a processing device according to one aspect of the present invention, a first gas used for cooling an electrical component unit and a second gas exhausted from a processing chamber from which mist-like liquid has been removed are mixed to form a third gas. Here, the first gas used for cooling the electrical component unit is relatively high in temperature in order to take in the heat generated in the electrical component unit, while the humidity is relatively low. The third gas formed by mixing the first gas and the second gas has a humidity between the humidity of the first gas and the humidity of the second gas. Therefore, the humidity of the third gas is lower than the humidity of the second gas.

[0015] Here, the first gas used for cooling the electrical component unit may contain dust or the like. Therefore, if the first gas is released outside the processing device, there is a risk of contaminating the surroundings. However, since the third gas formed by mixing the first gas and the second gas passes through a HEPA filter, contaminants such as dust and scraps contained in each of the first gas and the second gas are removed and the third gas is purified. Finally, the third gas discharged from the processing device has an appropriate humidity and is clean, so it does not have an adverse impact on the surroundings.

[0016] Therefore, according to one aspect of the present invention, a processing device is provided that can adjust air with extremely high humidity to an appropriate humidity and discharge it.

Brief Description of the Drawings

[0017] [Figure 1] It is a perspective view showing a processing device. [Figure 2] It is a cross-sectional view schematically showing a processing chamber and a gas-liquid separation unit. [Figure 3] It is a perspective view schematically showing the connection relationship between an air-cooling unit for air-cooling an electrical component unit, a gas-liquid separation unit, and an exhaust unit. [Figure 4] FIG. 4(A) is a cross-sectional view schematically showing an exhaust unit, and FIG. 4(B) is a cross-sectional view schematically showing an exhaust unit according to a modified example.

Embodiments for Carrying Out the Invention

[0018] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. First, a configuration example of the processing apparatus according to the present embodiment will be described with reference to FIG. 1. FIG. 1 is a perspective view schematically showing a processing apparatus 2 that performs processing such as processing and cleaning of a workpiece. In FIG. 1, the X-axis direction (processing feed direction, front-rear direction, first horizontal direction), the Y-axis direction (indexing feed direction, left-right direction, second horizontal direction), and the Z-axis direction (vertical direction, up-down direction, height direction) are perpendicular to each other. The Z-axis direction (vertical direction, up-down direction, height direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0019] The processing apparatus 2 includes a base 4 that supports each component constituting the processing apparatus 2. An opening 4a is formed at the front corner of the base 4, and a cassette support base 6 that moves up and down by an elevating mechanism (not shown) is provided in the opening 4a. A cassette 8 that houses a plurality of workpieces 11 is mounted on the upper surface of the cassette support base 6. In FIG. 1, only the outline of the cassette 8 is shown for convenience of explanation.

[0020] Various processes such as processing and cleaning are performed on the workpiece 11 by the processing apparatus 2. When the processing apparatus 2 performs processing (such as cutting, grinding, polishing, etc.) on the workpiece 11, the workpiece 11 becomes a processing object (workpiece to be processed). When the processing apparatus 2 performs cleaning on the workpiece 11, the workpiece 11 becomes a cleaning object.

[0021] As the workpiece 11, for example, a disk-shaped semiconductor wafer made of a semiconductor material such as silicon is used. For example, the workpiece 11 is divided into a plurality of regions by a plurality of streets (lines to be divided) arranged in a grid pattern so as to intersect each other, and devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) formed on the surface side of the workpiece 11 are arranged in these regions.

[0022] A circular adhesive tape 13 with a larger diameter than the object to be processed 11 is attached to the back side of the object to be processed 11. By attaching an annular frame 15 along the outer circumference of the adhesive tape 13 and attaching the back side of the object to be processed 11 to the center of the adhesive tape 13, a frame unit 17 is formed consisting of the object to be processed 11, the adhesive tape 13, and the annular frame 15.

[0023] The workpiece 11 is housed in the cassette 8, supported by the annular frame 15 via the adhesive tape 13 as described above. Then, for example, the workpiece 11 is cut and divided along the planned division lines by the processing device 2, thereby obtaining multiple device chips, each containing a device.

[0024] There are no restrictions on the type, material, shape, structure, size, etc., of the workpiece 11. For example, the workpiece 11 can be a wafer made of semiconductors other than silicon (GaAs, InP, GaN, SiC, etc.), glass, sapphire, ceramics, resin, metal, or other materials. The workpiece 11 may also be a package substrate in which multiple device chips are sealed with resin.

[0025] A rectangular opening 4b is provided in the area of ​​the upper surface of the base 4 that is located to the side of the cassette support base 6. The opening 4b is formed so that its longitudinal direction is aligned with the X-axis direction (front-to-back direction, machining feed direction). A ball screw type X-axis movement mechanism 10, a table cover 12, and a bellows-shaped dustproof and dripproof cover 14 are provided inside the opening 4b.

[0026] The table cover 12 and the dustproof and waterproof cover 14 are positioned to cover the top of the X-axis movement mechanism 10. The X-axis movement mechanism 10 also includes an X-axis movement table (not shown) covered by the table cover 12, and moves this X-axis movement table along the X-axis direction.

[0027] A chuck table 16 for holding the workpiece 11 is provided on the upper surface of the X-axis moving table, exposed from the table cover 12. This chuck table 16 is connected to a rotational drive source (not shown), such as a motor, and rotates around a rotation axis that is roughly parallel to the Z-axis direction (vertical direction). The X-axis moving mechanism 10 moves the chuck table 16 along the X-axis direction together with the X-axis moving table and the table cover 12.

[0028] The upper surface of the chuck table 16 constitutes a holding surface 16a that suctions and holds the workpiece 11. The holding surface 16a is formed to be approximately parallel to the X-axis and Y-axis directions and is connected to a suction source (not shown), such as an ejector, via a suction passage (not shown) provided inside the chuck table 16.

[0029] Four clamps 18 are provided around the chuck table 16 to secure the annular frame 15 that supports the workpiece 11 from all sides. A transport unit (not shown) is also positioned near the opening 4b to transport the workpiece 11 to the chuck table 16, etc.

[0030] Above the chuck table 16, two processing units (processing units) 20a and 20b are provided for processing the workpiece 11. Each of the processing units 20a and 20b is equipped with a tool (processing tool) for processing the workpiece 11.

[0031] In the following example, we will describe a case in which annular cutting blades for cutting the workpiece 11 are attached to the processing units 20a and 20b. In this case, the processing units 20a and 20b each function as cutting units for cutting the workpiece 11.

[0032] On the upper surface of the base 4, a gate-shaped support structure 22 for supporting the processing units 20a and 20b is positioned so as to straddle the opening 4b. On the upper front of the support structure 22, there is a moving unit (moving mechanism) 24a for moving the processing unit 20a in the Y-axis direction and the Z-axis direction, and a moving unit (moving mechanism) 24b for moving the processing unit 20b in the Y-axis direction and the Z-axis direction.

[0033] The mobile unit 24a is equipped with a Y-axis mobile plate 28a, and the mobile unit 24b is equipped with a Y-axis mobile plate 28b. The Y-axis mobile plate 28a and the Y-axis mobile plate 28b are each slidably mounted on a pair of Y-axis guide rails 26 arranged along the Y-axis direction on the front surface of the support structure 22.

[0034] A nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 28a, and a Y-axis ball screw 30a, which is positioned approximately parallel to the pair of Y-axis guide rails 26, is screwed into this nut portion. Similarly, a nut portion (not shown) is provided on the back side (rear side) of the Y-axis moving plate 28b, and a Y-axis ball screw 30b, which is positioned approximately parallel to the pair of Y-axis guide rails 26, is screwed into this nut portion.

[0035] A Y-axis pulse motor 32 is connected to one end of each of the Y-axis ball screws 30a and 30b. By rotating the Y-axis ball screw 30a with the Y-axis pulse motor 32 connected to the Y-axis ball screw 30a, the Y-axis moving plate 28a moves in the Y-axis direction along the Y-axis guide rail 26. Similarly, by rotating the Y-axis ball screw 30b with the Y-axis pulse motor 32 connected to the Y-axis ball screw 30b, the Y-axis moving plate 28b moves in the Y-axis direction along the Y-axis guide rail 26.

[0036] A pair of Z-axis guide rails 34a are provided on the front surface of the Y-axis moving plate 28a, along the Z-axis direction, and a pair of Z-axis guide rails 34b are provided on the front surface of the Y-axis moving plate 28b, along the Z-axis direction. A pair of Z-axis moving plates 36a are slidably attached to the pair of Z-axis guide rails 34a, and a pair of Z-axis moving plates 36b are slidably attached to the pair of Z-axis guide rails 34b.

[0037] A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 36a, and a Z-axis ball screw 38a, which is positioned roughly parallel to the Z-axis guide rail 34a, is screwed into this nut portion. A Z-axis pulse motor 40 is connected to one end of the Z-axis ball screw 38a, and by rotating the Z-axis ball screw 38a with this Z-axis pulse motor 40, the Z-axis moving plate 36a moves in the Z-axis direction along the Z-axis guide rail 34a.

[0038] A nut portion (not shown) is provided on the back side (rear side) of the Z-axis moving plate 36b, and a Z-axis ball screw 38b, which is positioned roughly parallel to the Z-axis guide rail 34b, is screwed into this nut portion. A Z-axis pulse motor 40 is connected to one end of the Z-axis ball screw 38b, and by rotating the Z-axis ball screw 38b with this Z-axis pulse motor 40, the Z-axis moving plate 36b moves in the Z-axis direction along the Z-axis guide rail 34b.

[0039] A machining unit 20a is provided at the bottom of the Z-axis moving plate 36a. The machining unit 20a includes a cylindrical housing 42a supported by the moving unit 24a. A machining unit 20b is also provided at the bottom of the Z-axis moving plate 36b. The machining unit 20b includes a cylindrical housing 42b supported by the moving unit 24b.

[0040] Adjacent to the processing unit 20a, an imaging unit (camera) 44 is provided for imaging the workpiece 11 held by the chuck table 16. The images acquired by the imaging unit 44 are used for aligning the workpiece 11 held by the chuck table 16 with the processing units 20a and 20b.

[0041] A circular opening 4c is provided in the upper surface of the base 4 in the area opposite to opening 4a relative to opening 4b, when viewed from above. Inside opening 4c are a spinner table (holding table) 46 that holds and rotates the workpiece 11, and a cleaning unit (processing unit) 48 that cleans the workpiece 11 held by the spinner table 46. The workpiece 11 processed by the processing units 20a and 20b is cleaned by the cleaning unit 48.

[0042] The spinner table 46 is surrounded by clamps (not shown) for fixing the annular frame 15 that supports the workpiece 11. The upper surface of the spinner table 46 forms a holding surface 46a that holds the workpiece 11 by suction.

[0043] The holding surface 46a is formed to be approximately parallel to the X-axis and Y-axis directions and is connected to a suction source (not shown) such as an ejector via a suction passage (not shown) provided inside the spinner table 46. The spinner table 46 is also connected to a rotational drive source (not shown) such as a motor and rotates around a rotation axis that is approximately parallel to the Z-axis direction (vertical direction).

[0044] The cleaning unit 48 is supported by an L-shaped cleaning arm and includes a spray nozzle 50 whose nozzle is positioned to face the spinner table 46. The spray nozzle 50 supplies a liquid (cleaning solution) such as pure water toward the holding surface 46a of the spinner table 46.

[0045] The workpiece 11 is held by the spinner table 46, and when the spinner table 46 is rotated while spraying cleaning fluid from the spray nozzle 50 toward the surface of the workpiece 11, foreign matter such as processing debris attached to the workpiece 11 is washed away. The cleaning unit 48 may also be further equipped with an air nozzle (not shown) for spraying air to dry the workpiece 11 after cleaning.

[0046] The processing apparatus 2 includes a control unit (not shown), which is a device that controls each component such as the chuck table (holding table) 16, processing units 20a and 20b, spinner table (holding table) 46, and cleaning unit (processing unit) 48. The control unit also controls the cassette support base 6, the X-axis movement mechanism 10, the movement units 24a and 24b, the imaging unit 44, and the transport unit.

[0047] The control unit is connected to each component. The control unit is composed of a computer, for example, a processing unit such as a CPU (Central Processing Unit), a main memory such as DRAM (Dynamic Random Access Memory), and an auxiliary memory such as flash memory. The control unit's functions are realized by operating the processing unit and other components according to the software stored in the auxiliary memory.

[0048] Figure 1 schematically shows an electrical unit 98 equipped with a control unit (device) by a dashed line. Figure 3 includes a schematic perspective view of the electrical unit 98. The housing of the electrical unit 98 is provided with an air cooling unit 99 that cools the electrical unit 98 by supplying gas (first gas) to the electrical unit 98 from the outside. The air cooling unit 99 is composed of, for example, an opening provided in the housing of the electrical unit 98 and a fan (blower) 99a provided in the opening.

[0049] The gas supplied to the electrical unit 98 (hereinafter referred to as the first gas) comes into contact with electronic components such as the CPU and DRAM, absorbs heat from each electronic component, and is exhausted from the electrical unit 98. Conventionally, this first gas, which was used to cool the electronic components and whose temperature rose, was discharged to the outside of the processing unit 2.

[0050] However, the temperature of the used first gas tends to be higher than the recommended air temperature in semiconductor device manufacturing plants where the processing unit 2 is installed. In addition, dust and other debris tend to accumulate in the electrical unit 98, which has a very complex internal structure. As a result, dust and other debris may be mixed in with the first gas discharged from the electrical unit 98. Thus, there were problems with the first gas discharged from the electrical unit 98.

[0051] In the processing apparatus 2 according to this embodiment, a first exhaust pipe 100, which serves as the exhaust path for the first gas from the electrical unit 98, is connected to the housing of the electrical unit 98. Therefore, the first gas is not directly discharged from the electrical unit 98 to the outside of the processing apparatus 2, but is rendered harmless. The destination of the first gas through the first exhaust pipe 100, that is, the connection destination of the first exhaust pipe 100, will be described in detail later.

[0052] In the processing apparatus 2, the chuck table 16 and processing units 20a and 20b are housed in a processing chamber 70 (see Figure 2) that is provided to cover the chuck table 16 and processing units 20a and 20b. The processing of the workpiece 11 is carried out in this processing chamber 70.

[0053] When the workpiece 11 is processed by the processing units 20a and 20b, a liquid such as pure water (processing fluid) is supplied to the workpiece 11 and the processing tool (cutting blade 56) attached to the processing units 20a and 20b. This liquid cools the workpiece 11 and the processing tool, and washes away the debris (processing waste) generated by the processing.

[0054] The liquid supplied during processing comes into contact with the processing tool and scatters, becoming a mist. As a result, when the workpiece 11 is processed, a large amount of mist-like liquid is generated in the processing chamber 70. If this mist-like liquid adheres to the components of the processing apparatus 2, it may cause rust on the processing apparatus 2 or malfunction of the electronic equipment contained in the processing apparatus 2. Therefore, it is preferable to remove the mist-like liquid generated in the processing chamber 70.

[0055] The processing apparatus 2 according to this embodiment includes a gas-liquid separation unit 52 that discharges a gas (hereinafter referred to as the second gas) and a mist-like liquid from the processing chamber 70 and separates them into gas and liquid. The mist-like liquid generated in the processing chamber 70 is removed by this gas-liquid separation unit 52. This prevents rust formation and malfunction of electronic equipment caused by the mist-like liquid adhering to the components of the processing apparatus 2.

[0056] Furthermore, the gas-liquid separation unit 52 is housed inside the base 4, as shown in Figure 1, for example, and is built into the processing device 2. Therefore, the mist-like liquid generated in the processing chamber 70 can be removed without having to perform tasks such as connecting the exhaust duct and the processing chamber 70, which are installed in the factory where the processing device 2 is installed. This simplifies the work involved in installing the processing device 2 in the factory. In addition, it is possible to remove the mist-like liquid even if the factory is not equipped with exhaust equipment such as exhaust ducts.

[0057] Figure 2 is a schematic partial cross-sectional side view showing a gas-liquid separation unit 52 connected to the processing chamber (machining chamber) 70. The processing chamber 70 is formed in a roughly rectangular parallelepiped shape so as to cover the chuck table 16, processing unit 20a, and processing unit 20b (not shown in Figure 2), and the space inside the processing chamber 70 becomes the processing space 72 where the workpiece 11 is processed. In other words, the chuck table 16, processing unit 20a, and processing unit 20b are housed in the processing space 72 inside the processing chamber 70.

[0058] The processing chamber 70 comprises a roughly rectangular upper wall 70a in plan view and a side wall 70b connected to the upper wall 70a and arranged along the Z-axis direction. The upper wall 70a has an opening 70c formed therein that is large enough to insert the Z-axis moving plates 36a, 36b and the imaging unit 44.

[0059] The machining unit 20a is rotatably housed in a housing 42a (see Figure 1) and includes a spindle whose axis is approximately parallel to the holding surface 16a of the chuck table 16. The tip of the spindle is exposed to the outside of the housing 42a, and an annular cutting blade 56, which is a machining tool for cutting the workpiece 11, is mounted on this tip. The spindle is connected to a rotational drive source such as a motor, and the cutting blade 56 mounted on the spindle rotates due to the force transmitted from this rotational drive source.

[0060] The cutting blade 56 is formed by fixing abrasive grains, such as diamond, with a bonding agent. Examples of bonding agents include metal bonds, resin bonds, and vitrified bonds.

[0061] Furthermore, the processing unit 20a includes a blade cover 58 that covers the cutting blade 56. The blade cover 58 includes a nozzle block 60a that supplies a liquid (cutting fluid) such as pure water to the cutting blade 56. The nozzle block 60a includes a pair of nozzles 64a that are connected to a tube 62a to which the cutting fluid is supplied.

[0062] The pair of nozzles 64a are positioned to sandwich the cutting blade 56 from the front and back sides (both sides). Each of the pair of nozzles 64a is also provided with an opening (not shown) facing the cutting blade 56 for spraying cutting fluid toward the cutting blade 56. The cutting fluid supplied from the tube 62a to the pair of nozzles 64a is sprayed from these openings toward the front and back sides of the cutting blade 56.

[0063] Furthermore, the blade cover 58 includes a nozzle block 60b that supplies a liquid (cutting fluid) such as pure water to the cutting blade 56 and the workpiece 11 held in the chuck table 16. The nozzle block 60b includes a nozzle 64b connected to a tube 62b to which the cutting fluid is supplied.

[0064] The tip of the nozzle 64b opens toward the outer circumference of the cutting blade 56. The cutting fluid supplied from the tube 62b to the nozzle 64b is sprayed from the tip of the nozzle 64b toward the outer circumference of the cutting blade 56. The cutting fluid is then supplied to the contact area between the cutting blade 56 and the workpiece 11 by the rotation of the cutting blade 56.

[0065] When cutting the workpiece 11, cutting fluid is supplied to the cutting blade 56 and the workpiece 11 from nozzles 64a, 64b, etc., while the cutting blade 56 is made to cut into the workpiece 11. The supply of cutting fluid cools the area in contact between the cutting blade 56 and the workpiece 11, and washes away the debris (cutting chips) generated by the cutting.

[0066] Although the above description specifically focuses on the configuration example of the processing unit 20a, the processing unit 20b (see Figure 1) can be configured in a similar manner.

[0067] A protective cover 74 is provided in the vicinity of the opening 70c, at a position overlapping with the opening 70c. The protective cover 74 prevents the liquid used in processing by the processing unit 20a from splashing out of the processing chamber 70 through the opening 70c.

[0068] Furthermore, a partition member 76 is provided on the front side (right side in Figure 2) of the processing unit 20a, dividing the processing space 72 into a processing area 72a and a transport area 72b. Processing of the workpiece 11 is performed in the processing area 72a, while the transport of the workpiece 11 onto the chuck table 16 and the removal of the workpiece 11 from the chuck table 16 are performed in the transport area 72b. In addition, the partition member 76 prevents the liquid used in processing by the processing unit 20a from splashing into the transport area 72b.

[0069] An opening 76a is provided at the lower end of the partition member 76. The chuck table 16 moves along the X-axis direction between the processing area 72a and the transport area 72b through this opening 76a.

[0070] When the workpiece 11 is processed by the processing unit 20a within the processing area 72a, the liquid 78 used for processing is scattered to the rear (left side in Figure 2) by the rotation of the cutting blade 56. A portion of this scattered liquid 78 is discharged by the processing chamber drain 80 located on the rear side of the dustproof and waterproof cover 14.

[0071] The processing chamber drain 80 is a discharge mechanism that discharges the liquid 78 used in the processing chamber 70 to the outside of the processing chamber 70. The processing chamber drain 80 comprises a storage section 80a that temporarily stores the liquid in the processing space 72, and a pipe 80b that has one end connected to the bottom of the storage section 80a and the other end connected to the liquid tank 82. A portion of the liquid 78 that has been scattered in the processing space 72 is temporarily stored in the storage section 80a, and then supplied to the liquid tank 82 via the pipe 80b and stored in the liquid tank 82.

[0072] Furthermore, some of the liquid 78 scattered by the rotation of the cutting blade 56 becomes a mist and floats inside the processing chamber 70. As a result, the processing chamber 70 is filled with a gas (second gas) corresponding to the atmosphere of the processing chamber 70 and the mist-like liquid 78. This second gas and the mist-like liquid 78 are discharged by the gas-liquid separation unit 52 connected to the processing chamber 70.

[0073] Specifically, an opening 70d is formed in the rear side wall 70b of the processing chamber 70, and the processing chamber 70 is connected to the gas-liquid separation unit 52 through this opening 70d. The gas-liquid separation unit 52 discharges a second gas (the atmosphere of the processing chamber 70) and a mist-like liquid 78 from the processing space 72 of the processing chamber 70, and separates them into gas and liquid (gas-liquid separation). In this way, by discharging the second gas and the mist-like liquid 78 generated by processing, it is possible to prevent the mist-like liquid 78 from adhering to the components of the processing apparatus 2.

[0074] The gas-liquid separation unit 52 includes a suction duct 84 that sucks in a second gas and a mist-like liquid 78 from the processing chamber 70 and discharges them. One end of the suction duct 84 is connected to an opening 70d provided in the side wall 70b of the processing chamber 70, and the other end is connected to the liquid tank 82 via a duct connection part 86.

[0075] The suction duct 84 is equipped with a connection part 84a that is connected to the opening 70d. This connection part 84a is equipped with a fan 84b that sends a second gas (atmosphere of the processing chamber 70) 88 containing a mist-like liquid 78 from the processing space 72 to the liquid tank 82 via the suction duct 84. By rotating the fan 84b, an airflow of the second gas 88 containing the mist-like liquid 78 is generated, and the second gas 88 and the mist-like liquid 78 are sucked in and exhausted.

[0076] The liquid tank 82 stores the liquid 90 used in the processing apparatus 2 at a predetermined level. The liquid 90 includes, for example, the processing fluid (cutting fluid, etc.) used to process the workpiece 11 by the processing units 20a and 20b, the cleaning fluid used to clean the workpiece 11 by the cleaning unit 48 (see Figure 1), and the cooling fluid used to cool the processing units 20a and 20b.

[0077] The duct connection section 86 connects the end of the suction duct 84 to the liquid tank 82 so that the second gas 88 and the mist-like liquid 78 are sprayed toward the liquid surface 90a of the liquid 90 stored in the liquid tank 82. Specifically, the suction duct 84 is positioned by the duct connection section 86 so that its end opens toward the liquid surface 90a. In Figure 2, the mist-like liquid 78 toward the liquid surface 90a of the liquid 90 is represented by a dashed line.

[0078] The second gas 88 and the mist-like liquid 78 discharged by the suction duct 84 are sprayed onto the liquid surface 90a of the liquid 90. As a result, the mist-like liquid 78 is captured by the liquid 90 stored in the liquid tank 82. Consequently, the second gas (atmosphere of the processing chamber 70) 88 and the mist-like liquid are separated into gas and liquid (gas-liquid separation).

[0079] Furthermore, a drain section 94 is connected to the liquid tank 82 to discharge the liquid 90 stored in the liquid tank 82. One end of the drain section 94 is connected to the liquid tank 82, and the other end is exposed to the outside of the base 4. When the liquid level of the liquid 90 stored in the liquid tank 82 reaches a predetermined value, the liquid 90 is discharged from the liquid tank 82 to the outside of the processing device 2 by the drain section 94.

[0080] An exhaust opening 92a is formed in the ceiling of the liquid tank 82, and a second exhaust pipe 96 is connected to the exhaust opening 92a, which is the destination for the discharge of the second gas 88a that has been separated into gas and liquid. It is preferable that a filter 92 be provided in the exhaust opening 92a to remove debris and other particles contained in the second gas 88a. As the filter 92, for example, a wire mesh or a louver made of metal can be used.

[0081] However, in the processing device 2, the second gas 88a discharged from the processing chamber 70 and passing through the liquid tank 82 still has a humidity of about 80-90% even after the mist-like liquid 78 has been removed. Conventionally, in the processing device 2, this extremely humid second gas 88a was discharged to the outside from the processing device 2. When this extremely humid second gas is discharged, it adversely affects the processing device 2 itself, as well as other adjacent devices, equipment, electrical equipment, etc., which has been a problem.

[0082] Therefore, one might consider connecting exhaust routes, such as piping, to each processing unit installed in a factory, and exhausting the air outside the factory. However, connecting an exhaust route to each of the numerous processing units would occupy a large portion of the factory's area. Furthermore, it would incur costs for operating the exhaust system.

[0083] Therefore, the processing apparatus 2 according to this embodiment includes an exhaust unit 104 (see Figure 3, etc.) that appropriately adjusts the humidity of the second gas, which has extremely high humidity, and discharges it to the outside of the processing apparatus 2. Figure 3 includes a schematic perspective view showing the exhaust unit 104. Figure 4(A) is a schematic cross-sectional view showing the exhaust unit 104.

[0084] The exhaust unit 104 is connected, for example, to a first exhaust pipe 100 and a second exhaust pipe 96. The exhaust unit 104 is supplied with a first gas 102 discharged from the electrical unit 98 and passing through the first exhaust pipe 100, and a second gas 88a discharged from the liquid tank 82 and passing through the second exhaust pipe 96. The exhaust unit 104 then exhausts a third gas 116 formed by mixing the first gas 102 and the second gas 88a.

[0085] For example, the exhaust unit 104 has a box-shaped housing 106 into which a first gas 102 and a second gas 88a are supplied. In the internal space, the first gas 102 and the second gas 88a become a third gas 116, and the third gas 116 is discharged from the housing 106.

[0086] More specifically, the exhaust unit 104 comprises a pre-chamber 108 through which the third gas 116 reaches, a HEPA filter 112 through which the third gas 116 passes once it reaches the pre-chamber 108, and a blower 110 that sends the third gas 116 from the pre-chamber 108 to the HEPA filter 112. The exhaust unit 104 then discharges the third gas 116 that has been purified by the HEPA filter 112. The exhaust unit 104 will be described in detail below.

[0087] The first exhaust pipe 100 through which the first gas 102 flows may be connected to the second exhaust pipe 96 instead of the exhaust unit 104. Alternatively, the second exhaust pipe 96 through which the second gas 88a flows may be connected to the first exhaust pipe 100 instead of the exhaust unit 104. In this case, the first gas 102 and the second gas 88a are mixed before reaching the exhaust unit 104 to form a third gas 116, and the third gas 116 reaches the pre-chamber 108 of the exhaust unit 104.

[0088] Furthermore, when the first exhaust pipe 100 and the second exhaust pipe 96 are connected to the exhaust unit 104, the first gas 102 and the second gas 88a are supplied separately to the front chamber 108 of the exhaust unit 104. In the front chamber 108, the first gas 102 and the second gas 88a are mixed to form a third gas 116. Thus, the third gas 116, formed by mixing the first gas 102 and the second gas 88a inside or outside the exhaust unit 104, reaches the front chamber 108.

[0089] The blower 110 of the exhaust unit 104 is a fan that includes, for example, a blade body in which multiple blades are joined together, and a rotating mechanism (not shown) for rotating the blade body. When the blower 110 is operated, the third gas 116 that has reached the front chamber 108 can be blown to the HEPA filter 112.

[0090] The HEPA filter (High Efficiency Particulate Air Filter) 112 is installed near the outlet 114, which is the outlet for the gas passing through the internal space of the housing 106. All gas supplied to the housing 106 passes through the HEPA filter 112 and is discharged from the outlet 114. The HEPA filter 112 is formed, for example, from glass wool folded into a pleated shape. The HEPA filter 112 captures fine particles contained in the gas passing through it with an extremely high collection efficiency. Therefore, the gas is purified by passing through the HEPA filter 112.

[0091] From the exhaust unit 104, a third gas 116 is ultimately discharged, which is formed by mixing the first gas 102 and the second gas 88a. The properties of the first gas 102, the second gas 88a, and the third gas 116 will now be described.

[0092] The first gas 102 used to cool the electrical unit 98 is a gas that has absorbed heat generated in the electrical unit 98, and therefore its temperature becomes high. And because the temperature is high, the humidity becomes low. For example, 1.0 m³ of the first gas 102 with a temperature of 30°C to 35°C and a humidity of 30% to 40% is supplied from the electrical unit 98 to the exhaust unit 104. 3 / min~2.0m 3 It is supplied at a flow rate of approximately [number] minutes. This first gas 102 contains debris and other materials originating from the electrical equipment 98.

[0093] The second gas 88a, which reaches the exhaust unit 104 via the liquid tank 82, has had the mist-like liquid 78 removed, but its humidity is very high, at 80% to 90%. The temperature of the second gas 88a is approximately 20°C to 25°C. The exhaust unit 104 receives 3.5 m³ of the second gas 88a. 3 / min~6.0m 3 It is supplied at a flow rate of approximately [number] minutes.

[0094] The third gas 116 is formed by mixing the first gas 102 and the second gas 88a. The temperature of the third gas 116 is approximately 23°C to 27°C, and the humidity is approximately 40% to 70%. This third gas 116 is purified as it passes through the HEPA filter 112 and is discharged 4.5m from the outlet 114 of the exhaust unit 104. 3 / min~8.0m 3 It is ejected at a flow rate of approximately [number] minutes.

[0095] The exhaust unit 104's outlet 114 is connected to the external space of the treatment device 2, and the third gas 116 is released into the environment of the factory or other facility where the treatment device 2 is installed. Here, the third gas 116 is at approximately room temperature and has a humidity that does not adversely affect the treatment device 2 or other equipment installed in the factory or other facility. Furthermore, the amount of debris contained in the third gas 116 is extremely small. Therefore, even if the third gas 116 is ejected outside the treatment device 2, it does not pose a problem.

[0096] Thus, in the processing apparatus 2 according to this embodiment, a third gas 116 is formed by mixing the first gas 102 and the second gas 88a, which are not to be released outside the processing apparatus 2 as they are, thereby preventing any problems even if they are released outside the processing apparatus 2. Therefore, there is no need to provide exhaust paths or processing equipment for recovering the first gas 102 and the second gas 88a separately in the factory or other facility where the processing apparatus 2 is located. Furthermore, there is no need to perform any complex processing on the first gas 102 and the second gas 88a beyond simply mixing them together.

[0097] In other words, the treatment device 2 can very easily process and neutralize the first gas 102 and the second gas 88a. Furthermore, the treatment device 2 can adjust the extremely high humidity air to an appropriate humidity level before discharging it.

[0098] Furthermore, the third gas 116 discharged from the exhaust unit 104 has favorable temperature and humidity, and contains very little debris. Therefore, some or all of the third gas 116 discharged from the exhaust unit 104 may be reused as is, both inside and outside the treatment device 2.

[0099] Next, we will describe the exhaust unit 104a that can recirculate a portion of the third gas 116 into the interior of the processing device 2. Figure 4(B) is a schematic cross-sectional view showing the exhaust unit 104a having a path for recirculating a portion of the third gas 116 into the interior of the processing device 2.

[0100] Unlike the exhaust unit 104 described in Figure 4(A), the exhaust unit 104a shown in Figure 4(B) does not have an outlet 114 on the housing 106. The third gas 116, which has passed from the front chamber 108 through the HEPA filter 112, reaches the rear chamber 118. An exhaust pipe 120, which serves as the path for the third gas 116, is connected to the rear chamber 118.

[0101] The exhaust pipe 120 branches into a third pipe 120a and a fourth pipe 120b. A portion of the third gas 116 passes through the third pipe 120a, and the remainder passes through the fourth pipe 120b. For example, the third pipe 120a is connected to the outside of the processing device 2, and the third gas 116 passing through the third pipe 120a is released to the outside of the processing device 2.

[0102] On the other hand, for example, the fourth pipe 120b is connected to the inside of the processing device 2, and the third gas 116 passing through the fourth pipe 120b is recirculated into some area inside the processing device 2. In other words, the fourth pipe 120b serves as a recirculation path that supplies a portion of the third gas 116 discharged from the exhaust unit 104a into the inside of the processing device 2.

[0103] The fourth pipe 120b is preferably connected to a high position inside the processing apparatus 2, and it is preferable that the third gas 116 is ejected from a high position inside the processing apparatus 2. In this case, an airflow from top to bottom is generated inside the processing apparatus 2, so a so-called downflow can be created inside the processing apparatus 2. Therefore, the accumulation of dust and other debris on the various conveying units used to transport the material to be processed 11 can be prevented.

[0104] Furthermore, the fourth pipe 120b may be connected to the processing chamber 70, and some or all of the third gas 116 discharged from the exhaust unit 104a may be supplied to the processing chamber 70. In this case as well, the third gas 116 will generate an airflow in the processing chamber 70. This airflow will suppress the widespread scattering of the mist-like liquid 78 and promote the passage of the mist-like liquid 78 into the suction duct 84. As a result, the materials to be processed 11 etc. in the processing chamber 70 will be less likely to be contaminated.

[0105] The exhaust pipe 120 does not need to be branched, and the entire amount of the third gas 116 that has passed through the HEPA filter 112 may be recirculated into the treatment device 2. Alternatively, the entire amount of the third gas 116 that has passed through the HEPA filter 112 may be exhausted to the outside of the treatment device 2 through the exhaust pipe 120.

[0106] As described above, according to the processing apparatus 2 of this embodiment, the first gas 102 used to cool the electrical equipment unit 98 and the second gas 88a, which has been exhausted from the processing chamber 70 and from which the mist-like liquid 78 has been removed, are mixed to form a third gas 116. The humidity of this third gas 116 is lower than the humidity of the second gas 88a, which has extremely high humidity. Furthermore, the temperature of the third gas 116 is lower than the temperature of the first gas 102, which has a higher temperature.

[0107] Furthermore, since the third gas 116 passes through the HEPA filter 112, contaminants such as dust and debris contained in the first gas 102 and the second gas 88a are removed, and the third gas 116 is purified. Finally, the third gas 116 discharged from the processing device 2 is clean and has an appropriate humidity, so it does not adversely affect the surroundings. Therefore, this embodiment provides a processing device 2 that can adjust extremely humid air to an appropriate humidity and discharge it.

[0108] In the above embodiment, the case described was when the second gas 88a, from which the mist-like liquid 78 has been removed after being discharged from the processing chamber 70, reaches the exhaust unit 104. That is, the case described was when processing units 20a and 20b are housed in this processing chamber 70 and the processing of the workpiece 11 is carried out in this processing chamber 70. However, the processing chamber 70 is not limited to this.

[0109] For example, as shown in Figure 1, the space containing the spinner table (holding table) 46 and the cleaning unit (processing unit) 48, which are located within the opening 4c on the upper surface of the base 4 of the processing apparatus 2, may be used as the processing chamber that serves as the second gas supply source. When the workpiece 11 held by the spinner table 46 is cleaned by the cleaning unit 48, a gas containing a mist-like liquid (cleaning solution) is generated. It would be problematic if this liquid containing the mist-like liquid were released directly to the outside of the processing apparatus 2.

[0110] Therefore, this gas may be recovered from the processing chamber containing the spinner table 46, etc., and the mist-like liquid may be removed from this gas in the gas-liquid separation unit 52. The gas may then be sent to the exhaust unit 104 as a second gas through the second exhaust pipe 96. This second gas, after the mist-like liquid has been removed, has extremely high humidity. When this second gas is mixed with the first gas 102 in the exhaust unit 104 to become a third gas 116 and discharged, the disadvantage of discharging a highly humid gas from the processing device 2 does not occur.

[0111] Thus, the exhaust unit 104 may be supplied with a second gas originating from the space (processing chamber) housing the spinner table 46 and the cleaning unit 48. Furthermore, the processing apparatus 2 according to one aspect of the present invention may be a cleaning apparatus having a spinner table 46 and a cleaning unit 48, without having processing units 20a, 20b, etc.

[0112] Furthermore, the structures, methods, etc., according to the above embodiments can be modified as appropriate without departing from the scope of the objectives of the present invention. [Explanation of Symbols]

[0113] 11. Items to be processed 13 Adhesive tape 15 ring frame 17 Frame Unit 2 Processing Unit 4 bases 4a,4b,4c opening 6 Cassette Support Stands 8 cassettes 10 X-axis movement mechanism 12 Table Covers 14 Dustproof and splashproof cover 16 Chuck Table 16a Holding surface 18 clamps 20a, 20b Processing Unit 22 Support structure 24a, 24b Mobile Unit 26 Y-axis guide rail 28a, 28b Y-axis moving plate 30a, 30b Y-axis ball screw 32 Y-axis pulse motor 34a, 34b Z-axis guide rail 36a, 36b Z-axis moving plate 38a, 38b Z-axis ball screw 40 Z-axis pulse motor 42a, 42b Housing 44 Imaging Units 46 Spinner Table 46a Holding surface 48 Washing Unit 50 spray nozzles 52 Gas-Liquid Separation Unit 56 cutting blades 58 Blade Cover 60a, 60b Nozzle Block 62a, 62b tubing 64a, 64b Nozzles 70 Processing Rooms 70a Upper wall 70b side wall 70c,70d opening 72 Processing space 72a Processing area 72b Transport area 74 Protective Cover 76 Partition Members 76a aperture 78 liquid 80 Processing Room Drain 80a Storage section 80b Piping 82 liquid tanks 84 Suction duct 84a Connection 84b Fan 86 Duct connection 88,88a Second gas 90 liquid 90a liquid level 92 filters 92a Exhaust opening 94 Drain section 96 Second exhaust pipe 98 Electrical System 99 Air-cooled unit 100 First exhaust pipe 102 First gas 104,104a Exhaust unit 106 cabinets 108 Vestibule 110 Blower 112 HEPA filter 114 spout 116 The third gas 118 Posterior chamber 120 Exhaust pipe 120a Third pipe 120b Fourth pipe

Claims

1. A holding table for holding the object to be processed, A processing unit that processes or washes the workpiece held on the holding table while supplying liquid to it, An electrical unit equipped with a holding table or equipment for controlling the processing unit, An air cooling unit that supplies a first gas to the electrical component to cool the electrical component, A first exhaust pipe which serves as the exhaust path for the first gas from the electrical component, A processing chamber housing the holding table and the processing unit, A treatment chamber drain for discharging the liquid used in the treatment chamber, A gas-liquid separation unit that discharges a second gas containing the mist of the liquid from the processing chamber to separate the gas and liquid, A second exhaust pipe which serves as the exhaust path for the second gas from the gas-liquid separation unit, The system comprises an exhaust unit that receives the first gas that has passed through the first exhaust pipe and the second gas that has passed through the second exhaust pipe, and exhausts a third gas formed by mixing the first gas and the second gas, The gas-liquid separation unit is A suction duct for drawing in and exhausting the second gas from the processing chamber, A liquid tank that stores the liquid supplied from the drain of the processing chamber at a predetermined water level, A duct connection part that connects the suction duct to the liquid tank so as to spray the second gas containing a mist of the liquid toward the liquid surface of the liquid stored in the liquid tank, The liquid tank is provided with an exhaust opening through which the mist of the liquid contained in the second gas sprayed from the suction duct is captured by the liquid stored in the liquid tank and the second gas, which has been separated into gas and liquid form, is exhausted. The exhaust unit is, The pre-chamber to which the third gas reaches, The system comprises a HEPA filter through which the third gas that has reached the pre-chamber passes, The third gas, purified by the HEPA filter, is discharged. A processing apparatus characterized by the following:

2. The apparatus according to claim 1, further comprising a recirculation path for supplying part or all of the third gas discharged from the exhaust unit.

Images