Flexible circuit board and foldable electronic device including the same

Abstract

A flexible circuit board and a foldable electronic device including the same are provided. The electronic device of the present invention includes a hinge structure, a flexible display (e.g., display module 160 in FIG. 1 and display 200 in FIG. 2) that is folded and unfolded by the hinge structure, a first portion and a second portion that are opposed to each other and close to each other when folded by the hinge structure and spaced apart from each other when unfolded, a first circuit board disposed in the first portion, a second circuit board disposed in the second portion, and a flexible circuit board that electrically connects the first circuit board and the second circuit board. The flexible circuit board includes a first region that bends according to deformation of the shape of the electronic device and a second region located around the first region. The first region includes a single main signal wiring layer. The second region includes a plurality of signal wiring layers. The first region and the second region are formed to have different thicknesses.

Description

Technical Field

[0001] The present invention relates to a flexible circuit board and a foldable electronic device including the same.

Background Art

[0002] Electronic devices The manufacturer is, are pursuing thin thickness, weight reduction, miniaturization, and multifunctionality. For this purpose, printed circuit boards on which various components are mounted are included (for example, PCB (printed circuit board), PBA (printed board assembly), RFPCB (rigid - flexible PCB), FPCB (flexible printed circuit board), and / or FRC (flexible RF cable)).

[0003] In recent years, expandable foldable or slidable electronic devices for displays have been developed. A foldable electronic device is configured such that a flexible display (for example, the display module 160 in FIG. 1, Figure 2A the display 200) can be folded or unfolded, and a slidable electronic device is configured such that a flexible display (for example, the display module 160 in FIG. 1, Figure 2A the display 200) can move in a sliding manner to expand and contract the screen. ru.

Summary of the Invention

Problems to be Solved by the Invention

[0004] In foldable electronic devices, the flexible circuit board (e.g., FRC) folds and unfolds in the folding region where the display is folded during folding. However, repeated folding and unfolding can damage the flexible circuit board. In a slideable electronic device, the screen expands when the slide is opened and shrinks when the slide is closed. When the screen of a slidable electronic device is enlarged or reduced, the flexible circuit board (e.g., FRC) folds and unfolds in the hinge structure area. However, repeated folding and unfolding can damage the flexible circuit board. In a foldable electronic device, a flexible circuit board (for example, FRC) is folded and unfolded in a folding area where the display is folded when the device is folded. The technical objective of embodiments of the present invention is to provide a flexible circuit board and a foldable electronic device that are not damaged by repeated folding and unfolding. Furthermore, an embodiment of the present invention aims to provide a flexible circuit board and a foldable electronic device that can prevent interference from metal components of an electronic device during repeated folding and unfolding (e.g., opening and closing) of the flexible circuit board, and prevent impedance mismatch of RF signals transmitted through the flexible circuit board.

[0005] The technical problems that this invention aims to solve are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by a person with ordinary skill in the art to which this invention pertains from the following description. Additional aspects may be partially described in the following description, partially clarified from the description, or understood through the execution of the presented embodiments. [Means for solving the problem]

[0006] An electronic device according to one aspect of the present invention includes a hinge structure, a flexible display that is folded or unfolded by the hinge structure, and the hinge structure Joined Part 1 and Part 2, The first and second parts are positioned close to each other when folded by the hinge structure, and the first and second parts are separated from each other when unfolded by the hinge structure. The device comprises a first circuit board located in the first portion, a second circuit board located in the second portion, and a flexible circuit board that electrically connects the first circuit board and the second circuit board.

[0007] The aforementioned flexible circuit board is used in electronic devices It bends in response to folding or unfolding (e.g., deformation of form). First area and Not flexible This includes the second region located around the first region. The first region includes a single main signal wiring layer. The second region includes multiple signal wiring layers. The first and second regions are formed with different thicknesses.

[0008] The flexible circuit board of the present invention is a flexible circuit board for a foldable electronic device. It bends in response to folding or unfolding. Part 1 and, Not flexedIt includes a second part located around the first part. The first portion includes a single main signal wiring layer. The second portion includes multiple signal wiring layers. The first and second parts are formed to different thicknesses. [Effects of the Invention]

[0009] According to the flexible circuit board of the embodiment of the present invention, the folding region in which the display is folded during folding is not damaged even when repeatedly folded and unfolded (e.g., opened and closed). In the flexible circuit board according to an embodiment of the present invention, protective layers are placed above and below the main signal wiring layer of the first portion (e.g., the bent portion), which can prevent interference of electric fields by metal parts of the electronic device during repeated folding and unfolding (e.g., opening and closing). This prevents impedance mismatch in RF signals transmitted through flexible circuit boards, resulting in improved signal transmission performance.

[0010] According to the foldable electronic device of the present invention, the flexible circuit board is not damaged even when repeatedly folded and unfolded in the folding region where the display is folded during folding, thereby extending the lifespan of the electronic device and improving the reliability of its operation. In addition, this document can provide various effects that can be directly or indirectly identified. Other aspects, advantages, and notable features of this disclosure will become apparent to those skilled in the art from the following detailed description, which discloses various embodiments of this disclosure with reference to the accompanying drawings. [Brief explanation of the drawing]

[0011] [Figure 1] This is a block diagram of an electronic device in a network environment according to an embodiment of the present invention. [Figure 2A] This is a front view showing the deployed (e.g., open) state of an electronic device according to an embodiment of the present invention. [Figure 2B] This is a plan view showing the flat (e.g., open) state of an electronic device according to an embodiment of the present invention. [Figure 2C] A perspective view showing a flat (e.g., open) state of an electronic device according to an embodiment of the present invention. [Figure 2D] A left side view showing a flat (e.g., open) state of an electronic device according to an embodiment of the present invention. [Figure 2E] A right side view showing a flat (e.g., open) state of an electronic device according to an embodiment of the present invention. [Figure 2F] A rear view showing a flat (e.g., open) state of an electronic device according to an embodiment of the present invention. [Figure 3A] A front view showing a folded (e.g., closed) state of an electronic device according to an embodiment of the present invention. [Figure 3B] A perspective view showing a folded (e.g., closed) state of an electronic device according to an embodiment of the present invention. [Figure 3C] A perspective view showing a folded (e.g., closed) state of an electronic device according to an embodiment of the present invention. [Figure 3D] A left side view showing a folded (e.g., closed) state of an electronic device according to an embodiment of the present invention. [Figure 3E] A right side view showing a folded (e.g., closed) state of an electronic device according to an embodiment of the present invention. [Figure 3F] A rear view showing a folded (e.g., closed) state of an electronic device according to an embodiment of the present invention. [Figure 4] A view showing an electronic device according to an embodiment of the present invention. [Figure 5] A view showing a flexible circuit board (e.g., a foldable FRC (flexible RF cable)) according to an embodiment of the present invention. [Figure 6A] A view showing a region where a hinge structure of an electronic device is disposed. [Figure 6B] A view showing an example of a portion where a flexible circuit board (e.g., a foldable FRC (flexible RF cable)) is bent by deployment of a hinge structure of a foldable electronic device. [Figure 6C]This figure shows an example of how a flexible circuit board (e.g., a foldable FRC (flexible RF cable)) is bent by folding and unfolding the hinge structure of a foldable electronic device. [Figure 7] This figure shows a cross-sectional structure of a flexible circuit board according to an embodiment of the present invention. [Figure 8A] This diagram shows the arrangement structure of ground wiring and RF signal wiring in the first part (e.g., the bent portion) of a flexible circuit board. [Figure 8B] This diagram shows the arrangement structure of ground wiring and RF signal wiring in the second part (e.g., the non-bending part) of a flexible circuit board. [Figure 9] This figure shows the arrangement structure of ground wiring and RF signal wiring in the second portion (e.g., non-bending portion) of a flexible circuit board according to an embodiment of the present invention. [Figure 10] This figure shows the arrangement structure of ground wiring and RF signal wiring in the second portion (e.g., non-bending portion) of a flexible circuit board according to an embodiment of the present invention. [Figure 11] This figure shows the arrangement structure of ground wiring and RF signal wiring in the second portion (e.g., non-bending portion) of a flexible circuit board according to an embodiment of the present invention. [Figure 12] This figure shows the arrangement structure of ground wiring and RF signal wiring in the second portion (e.g., non-bending portion) of a flexible circuit board according to an embodiment of the present invention. [Figure 13A] This figure shows the configuration of the flexible circuit board when the foldable electronic device according to an embodiment of the present invention is in a folded state. [Figure 13B] This figure shows the configuration of the flexible circuit board when the foldable electronic device according to an embodiment of the present invention is in a folded state. [Figure 13C] This figure shows the shape of the flexible circuit board when the foldable electronic device according to an embodiment of the present invention is in a folded state. [Figure 13D] This figure shows the shape of the flexible circuit board when the foldable electronic device according to an embodiment of the present invention is in a folded state. [Figure 14A] This figure shows the configuration of the flexible circuit board when the foldable electronic device according to an embodiment of the present invention is in an unfolded state. [Figure 14B] This figure shows the configuration of the flexible circuit board when the foldable electronic device according to an embodiment of the present invention is in an unfolded state. [Figure 14C] This figure shows the configuration of the flexible circuit board when the foldable electronic device according to an embodiment of the present invention is in an unfolded state. [Figure 15] This graph shows that signal interference is improved across the entire frequency range via a flexible circuit board according to an embodiment of the present invention. [Modes for carrying out the invention]

[0012] The following description, with reference to the attached drawings, is provided to aid in a comprehensive understanding of the various embodiments of the disclosed content and their corresponding embodiments, as defined in the claims. This section includes various specific details to aid understanding, but these should be considered merely illustrative. It should be noted that throughout the drawings, the same reference numerals are used to depict identical or similar elements, features, and structures. Therefore, a person with ordinary skill in the art to which this disclosure pertains will recognize that various modifications and changes can be made to the various embodiments disclosed herein, without deviating from the scope and spirit of the disclosed content. Furthermore, for the sake of clarity and conciseness, explanations of well-known functions and structures will be omitted. Terms and words used herein and in the claims are not limited to their meanings as defined in the literature, but are used to enable the inventors to understand the invention clearly and consistently. Therefore, it should be obvious to those skilled in the art that the following descriptions relating to various embodiments of the Disclosure are provided for illustrative purposes only and are not intended to limit the Disclosure as defined by the attached claims and equivalent claims. Unless otherwise explicitly stated, the context should indicate that the singular form may include the plural form of the object being referred to. Therefore, for example, a reference to “the surface of a component” includes a reference to any of such surfaces. Figure 1 is a block diagram of an electronic device 101 in a network environment 100 according to an embodiment of the present invention. Referring to Figure 1, in the network environment 100, the electronic device 101 communicates with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or with at least one of the electronic devices 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 101 communicates with the electronic device 104 via the server 108. According to one embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an acoustic output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a coupling terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module 196, or an antenna module 197. In one embodiment, the electronic device 101 may omit at least one of these components (for example, the connecting terminal 178) or may have one or more other components added. In one embodiment, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (e.g., display module 160).

[0013] The processor 120, for example, executes software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120, and performs various data processing or calculations. According to one embodiment, as part of data processing or calculation, the processor 120 stores instructions or data received from other components (e.g., a sensor module 176 or a communication module 190) in a volatile memory 132, processes the instructions or data stored in the volatile memory 132, and stores the resulting data in a non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., a central processing unit or application processor) or an auxiliary processor 123 (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with it. For example, if the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a specified function. The auxiliary processor 123 may be implemented separately from or as part of the main processor 121.

[0014] The auxiliary processor 123 controls, for example, at least a portion of the functions or states related to at least one component of the electronic device 101 (for example, the display module 160, the sensor module 176, or the communication module 190) on behalf of the main processor 121 when the main processor 121 is inactive (e.g., in sleep mode), or together with the main processor 121 when the main processor 121 is active (e.g., running an application). According to one embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) is embodied as part of other functionally related components (e.g., a camera module 180 or a communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., a neural network processing unit) includes a hardware structure specialized for processing artificial intelligence models.

[0015] Artificial intelligence models are generated through machine learning. Such learning may be performed, for example, on the electronic device 101 on which the artificial intelligence model is run, or it may be performed via a separate server (for example, server 108). Learning algorithms include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model includes multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or any combination of two or more of the above, but is not limited to the examples mentioned above. Artificial intelligence models may include, in addition to or extensively, software structures, in addition to hardware structures.

[0016] The memory 130 stores various data used by at least one component of the electronic device 101 (for example, the processor 120 or the sensor module 176). The data includes, for example, software (e.g., program 140) and input or output data for related instructions. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0017] The program 140 is stored as software in memory 130 and includes, for example, OS 142, middleware 144, or application 146.

[0018] The input module 150 receives instructions or data used by the components of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0019] The acoustic output module 155 outputs an acoustic signal to the outside of the electronic device 101. The audio output module 155 includes, for example, a speaker or a receiver. Speakers are used for general purposes such as multimedia playback or recording and playback. A receiver is used to receive incoming phone calls. According to one embodiment, the receiver may be embodied separately from or as part of the speaker.

[0020] The display module 160 provides information visually to an external party (e.g., a user) outside of the electronic device 101. The display module 160 includes, for example, a display, a hologram device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module 160 includes a touch sensor configured to detect touches, or a pressure sensor configured to measure the intensity of the force generated by a touch.

[0021] Audio module 170 converts sound into electrical signals, or vice versa, converts electrical signals into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150 or outputs sound through the acoustic output module 155 or an external electronic device (e.g., electronic device 102) (e.g., speaker or headphones) directly or wirelessly connected to the electronic device 101.

[0022] The sensor module 176 detects the operating state of the electronic device 101 (e.g., power or temperature) or the external environmental state (e.g., user state), and generates an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyroscope, a barometric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0023] Interface 177 supports one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly to an external electronic device (e.g., electronic device 102). According to one embodiment, the interface 177 may include, for example, an HDMI® (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, or an audio interface.

[0024] The connecting terminal 178 includes a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to one embodiment, the connecting terminal 178 may include, for example, an HDMI® connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0025] The haptic module 179 converts electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that the user can perceive through touch or kinesthetic sense. According to one embodiment, the haptic module 179 includes, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0026] The camera module 180 captures both still images and videos. According to one embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0027] The power management module 188 manages the power supplied to the electronic device 101. According to one embodiment, the power management module 188 is embodied, for example, as at least part of a PMIC (power management integrated circuit).

[0028] The battery 189 supplies power to at least one component of the electronic device 101. According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0029] The communication module 190 supports the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and the execution of communication through the established communication channel. The communication module 190 operates independently of the processor 120 (e.g., the application processor) and includes one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module 190 includes a wireless communication module 192 (for example, a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module 194 (for example, a LAN (local area network) communication module, or a power line communication module).

[0030] The relevant communication module among these communication modules communicates with an external electronic device 104 via a first network 198 (for example, a short-range communication network such as Bluetooth®, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (for example, a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (for example, a LAN or WAN)). These many types of communication modules can be integrated into a single component (e.g., a single chip) or embodied in multiple separate components (e.g., multiple chips). The wireless communication module 192 verifies or authenticates the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196.

[0031] The wireless communication module 192 supports 5G networks and next-generation communication technologies, such as NR connectivity technology (new radio access technology), following 4G networks. NR connection technology supports high-speed transmission of large data volumes (eMBB (enhanced mobile broadband)), minimizing terminal power consumption and connecting a large number of terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 supports high-frequency bands (e.g., mmWave bands) to achieve high data transmission rates, for example. The wireless communication module 192 can support a variety of technologies to ensure performance in the high-frequency band, such as beamforming, massive array multiplexing (massive MIMO / multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or large-scale antennas.

[0032] The wireless communication module 192 supports various requirements specified in the electronic device 101, external electronic devices (e.g., electronic device 104), or network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports a "peak data rate" (e.g., 20 Gbps or more) for realizing eMBB, a loss coverage (e.g., 164 dB or less) for realizing mMTC, or a "U-plane latency" (e.g., 0.5 ms or less for both downlink (DL) and uplink (UL), or 1 ms or less for round trip) for realizing URLLC.

[0033] The antenna module 197 transmits or receives signals or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module 197 includes an antenna that includes a radiator consisting of a conductor or conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 197 includes a plurality of antennas (for example, an array antenna). In such cases, at least one antenna suitable for the communication scheme used in the communication network, such as the first network 198 or the second network 199, is selected from among multiple antennas, for example, by the communication module 190. Signals or power are transmitted to or received between the communication module 190 and an external electronic device through at least one selected antenna. According to one embodiment, in addition to the radiator, other components (for example, an RFIC (radio frequency integrated circuit)) may be further formed as part of the antenna module 197.

[0034] According to various embodiments, the antenna module 197 forms an mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., the bottom surface) of the printed circuit board and capable of supporting a specified high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., the top or side surface) of the printed circuit board and capable of transmitting or receiving signals in the specified high-frequency band. At least some of the above components are connected to each other through a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) to exchange signals (e.g., instructions or data) with each other.

[0035] According to one embodiment, commands or data are transmitted or received between the electronic device 101 and an external electronic device 104 via a server 108 connected to a second network 199. Each of the external electronic devices (102 or 104) may be of the same or different type as electronic device 101. According to one embodiment, all or part of the operations performed by the electronic device 101 are performed by one or more external electronic devices (102, 104, or 108). For example, if an electronic device 101 must perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may, instead of performing the function or service itself, or additionally, request one or more external electronic devices to perform at least a part of that function or service.

[0036] One or more external electronic devices that receive the above request perform at least a portion of the requested function or service, or additional functions or services related to the above request, and transmit the results of the execution to the electronic device 101. The electronic device 101 processes the above results either as is or additionally, and provides them as at least part of the response to the above request. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing are used. The electronic device 101 provides, for example, an ultra-low latency service using distributed computing or mobile edge computing. In other embodiments, the external electronic device 104 includes an IoT (Internet of Things) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to one embodiment, an external electronic device 104 or server 108 is included within the second network 199. The electronic device 101 is applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0037] The electronic device according to the embodiment of the present invention can take on a variety of forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. The electronic devices according to embodiments of the present invention are not limited to the devices described above.

[0038] The embodiments of the present invention and the terminology used herein should be understood not to be intended to limit the technical features described herein to specific embodiments, but rather to include a variety of modifications, equivalents, or substitutions of such embodiments. In relation to the description of the drawings, similar or related reference numerals are used for similar or related components. The singular form of a noun corresponding to an item can refer to one or more items unless the context clearly indicates otherwise. In this specification, each phrase such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” includes any one of the items listed together with the applicable phrase, or any possible combination thereof. Terms such as “first,” “second,” or “first-in-command” or “second-in-command” are used simply to distinguish one component from others and do not limit it in any other respect (e.g., importance or procedure). When one component (e.g., the first) is referred to as "coupled" or "connected" with or without the terms "functionally" or "communically" to another component (e.g., the second), it means that one component may be connected to the other component directly (e.g., by wire), wirelessly, or through the third component.

[0039] As used in the embodiments herein, the term “module” may include units embodied in hardware, software, or firmware, and is used interchangeably with terms such as logic, logic block, component, or circuit. A module is a single component or the smallest unit or part thereof of the above-mentioned component, performing one or more functions. For example, according to one embodiment, the module is embodied in the form of an ASIC (application-specific integrated circuit).

[0040] Embodiments of this specification may be embodied as software (e.g., program 140) containing one or more instruction words stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, the processor (e.g., processor 120) of a device (e.g., electronic device 101) calls at least one instruction word from one or more instruction words stored in a storage medium and executes it. This makes it possible to operate the device to perform at least one function in accordance with at least one command word called above. The one or more of the above instructions include code generated by a compiler or code executed by an interpreter. The device-readable storage medium is provided in the form of a non-transitory storage medium. Here, "non-temporary" simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves). This term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0041] According to one embodiment, the method according to the embodiments disclosed herein may be provided in a computer program product. Computer program products are traded as goods between sellers and buyers. Computer program products are distributed in the form of device-readable storage media (e.g., compace disc read-only memory) (CD-ROM), or online via application stores (e.g., Play Store®) or directly between two user devices (e.g., smartphones) (e.g., download or upload). In the case of online distribution, at least a portion of a computer program product may be temporarily stored or temporarily generated on a storage medium that can be read by devices such as the manufacturer's server, the application store's server, or the memory of an intermediary server.

[0042] According to one embodiment, each of the aforementioned components (for example, a module or a program) includes one or more individuals, and some of the individuals are separated and arranged in other components. According to one embodiment, one or more of the aforementioned components or operations can be omitted, or one or more other components or operations can be added. Alternatively or additionally, multiple components (e.g., modules or programs) can be integrated into a single component. In this case, the integrated component performs one or more functions of each component of the multiple components in the same or similar manner as they were performed by that component of the multiple components prior to the integration. According to one embodiment, the operations performed by the module, program, or other components may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the above operations may be performed in a different order, or omitted, or one or more other operations may be added.

[0043] According to one embodiment, the display module 160 shown in Figure 1 includes a display configured to be foldable or unfoldable. In foldable electronic devices including a display, a flexible circuit board (e.g., FRC) is folded or unfolded within the folding region where the display is folded during folding. According to one embodiment, the display module 160 shown in Figure 1 includes a display that is slidably positioned to provide a screen (e.g., a display screen).

[0044] For example, the display area of ​​the electronic device 101 is an area that is visually exposed and capable of outputting an image. The electronic device 101 adjusts the display area in accordance with the movement of a slide plate (not shown) or the movement of the display. An example of such a display module 160 is a rollable electronic device configured such that at least a part of the electronic device 101 (e.g., the housing) operates at least partially in a slidable manner to selectively expand the display area. For example, the display module 160 may be referred to as a slide-out display or an expandable display.

[0045] Figures 2A to 2F are This is a diagram showing the deployed (e.g., open) state of the electronic device 101 according to an embodiment of the present invention. Figures 3A to 3F This figure shows the folded (e.g., closed) state of the electronic device 101 according to an embodiment of the present invention. Figures 2A to 3F Referring to the above, the electronic device 101 includes a foldable housing 300, a hinge cover 330 that covers the foldable portion of the foldable housing 300, and a flexible or foldable display 200 (hereinafter simply referred to as "display" 200) positioned within the space formed by the foldable housing 300. In this specification, the surface on which the display 200 is placed is referred to as the first surface or the electronic device 101 (See Figure 2A) Defined as the front of. Then, the opposite side of the front is the second surface or electronic device 101 (See Figure 2F) This is defined as the rear surface. Furthermore, the surface surrounding the space between the front and rear surfaces is the third surface or the electronic device 101 (See Figures 2D and 2E) Defined as an aspect of. For example, the electronic device 101 can be folded or unfolded in the X-axis direction with respect to the folding region 203.

[0046] In one embodiment, the foldable housing 300 includes a first housing structure 310, a second housing structure 320 including a sensor area 324, and a first rear cover 380 and, Includes a second rear cover 390. The foldable housing 300 of the electronic device 101 is Figures 2A to 3F The forms and combinations shown are not limited to those shown, but may be embodied by other shapes or combinations and / or combinations of parts. For example, in other embodiments, the first housing structure 310 and the first rear cover 380 can be formed integrally, and the second housing structure 320 and the second rear cover 390 can be formed integrally. In the embodiment shown in the figure, the first housing structure 310 and the second housing structure 320 are arranged on both sides of the folding axis A and have an overall symmetrical shape with respect to the folding axis A. As will be described later, the first housing structure 310 and the second housing structure 320 have different angles or distances from each other depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state. In the embodiment shown in the figure, the second housing structure 320 differs from the first housing structure 310 in that it further includes a sensor area 324 where various sensors are arranged, but has a mutually symmetrical shape in the other areas.

[0047] In one embodiment, the first housing structure 310 and the second housing structure 320 together form a recess for receiving the display 200. In the embodiment shown in the figure, for the sensor area 324, the recess has two or more different widths in a direction perpendicular to the folding axis A. For example, the recess has a first width W1 between the first portion 310a of the first housing structure 310 and the first portion 320a of the second housing structure 320, which is formed at the edge of the sensor area 324 within the second housing structure 320. The recess has a second width W2 formed by a second portion 310b of the first housing structure 310 that is parallel to the folding axis A of the first housing structure 310 and a second portion 320b of the second housing structure 320 that is parallel to the folding axis A but does not correspond to the sensor area 324 of the second housing structure 320.

[0048] In this case, the second width W2 is formed to be longer than the first width W1. In other words, the first portion 310a of the first housing structure 310 and the first portion 320a of the second housing structure 320, which have mutually asymmetric shapes, form a first width W1 of the recess. The second portion 310b of the first housing structure 310 and the second portion 320b of the second housing structure 320, which have mutually symmetrical shapes, form the second width W2 of the recess. In one embodiment, the first portion 320a and the second portion 320b of the second housing structure 320 are at different distances from the folding axis A. The width of the recess is not limited to the example shown in the figure. In various embodiments, the recess may have multiple widths depending on the form of the sensor area 324 or the asymmetrical shape of the first housing structure 310 and the second housing structure 320. In one embodiment, at least a portion of the first housing structure 310 and the second housing structure 320 is formed of a metallic or non-metallic material having a rigidity of a size selected to support the display 200.

[0049] In one embodiment, the sensor area 324 is formed to have a predetermined area adjacent to one corner of the second housing structure 320. However, the arrangement, shape, and size of the sensor region 324 are not limited to the example shown in the figure. For example, in another embodiment, the sensor area 324 may be provided in the other corner of the second housing structure 320, or in any area between the upper corner and the lower corner. In one embodiment, components for performing various functions incorporated into the electronic device 101 are exposed to the front of the electronic device 101 via the sensor area 324 or via one or more openings provided in the sensor area 324. In various embodiments, the above components may include various types of sensors. The sensor includes, for example, at least one of a front camera, a receiver, or a proximity sensor.

[0050] The first rear cover 380 is positioned on one side of the folding axis A at the rear of the electronic device and has, for example, a substantially rectangular periphery, which is enclosed by the first housing structure 310. Similarly, the second rear cover 390 is positioned on the other side of the folding axis A on the rear of the electronic device, and its edges are enclosed by the second housing structure 320.

[0051] In the embodiment shown in the figure, the first rear cover 380 and the second rear cover 390 have substantially symmetrical shapes with respect to the folding axis A. However, the first rear cover 380 and the second rear cover 390 do not necessarily have symmetrical shapes, and in other embodiments, the electronic device 101 may include the first rear cover 380 and the second rear cover 390 of various shapes. In further embodiments, the first rear cover 380 may be formed integrally with the first housing structure 310, and the second rear cover 390 may be formed integrally with the second housing structure 320. In one embodiment, the first rear cover 380, the second rear cover 390, the first housing structure 310, and the second housing structure 320 form a space in which various components of the electronic device 101 (for example, a printed circuit board or a battery) are arranged. In one embodiment, one or more components are arranged on the rear surface of the electronic device 101 or are visually exposed. For example, at least a portion of the sub-display 290 is visually exposed through the first rear area 382 of the first rear cover 380. In other embodiments, one or more components or sensors may be visually exposed through the second rear region 392 of the second rear cover 390. In various embodiments, the sensor may include a proximity sensor and / or a rear camera.

[0052] The hinge cover 330 is positioned between the first housing structure 310 and the second housing structure 320 and is configured to cover the internal components (e.g., the hinge structure). In one embodiment, the hinge cover 330 is covered by a portion of the first housing structure 310 and the second housing structure 320, or exposed to the outside, depending on the state of the electronic device 101 (flat state or folded state). For example, Figure 2A As shown, when the electronic device 101 is in the deployed state, the hinge cover 330 may not be exposed as it is covered by the first housing structure 310 and the second housing structure 320. For example, Figure 3A As shown, when the electronic device 101 is in a folded state (for example, a fully folded state), the hinge cover 330 is exposed to the outside between the first housing structure 310 and the second housing structure 320. For example, when the first housing structure 310 and the second housing structure 320 are in an intermediate state where they are folded at a certain angle, the hinge cover 330 is partially exposed to the outside between the first housing structure 310 and the second housing structure 320. However, in this case, the exposed area is less than when it is fully folded. In one embodiment, the hinge cover 330 includes a curved surface.

[0053] The display 200 is positioned in the space formed by the foldable housing 300. For example, the display 200 is mounted on a recess formed by the foldable housing 300 and constitutes most of the front surface of the electronic device 101. Therefore, the front surface of the electronic device 101 includes the display 200, a portion of the first housing structure 310 adjacent to the display 200, and a portion of the second housing structure 320. The rear surface of the electronic device 101 includes the first rear cover 380, a portion of the first housing structure 310 adjacent to the first rear cover 380, the second rear cover 390, and a portion of the second housing structure 320 adjacent to the second rear cover 390.

[0054] Display 200 means a display in which at least a portion of the area can be deformed into a flat or curved surface. In one embodiment, the display 200 has a folding area 203, and one side with respect to the folding area 203 ( Figure 2A The first region 201 is located on the left side of the folding region 203 shown, and the other side ( Figure 2A It includes a second region 202 located to the right of the folding region 203 shown. The display 200 may include a polarizing film (or polarizing layer), window glass (e.g., ultra-thin tempered glass (UTG) or polymer window), and an optical compensation film (e.g., Optical Compensation Film: OCF).

[0055] The regional divisions of the display 200 are illustrative, and the display 200 may be divided into multiple regions (e.g., four or more, or two) depending on its structure or function. For example, Figure 2A In the embodiment shown, the area of ​​the display 200 can be distinguished by a folding region 203 or folding axis A that extends parallel to the y-axis, but in other embodiments, the display 200 may be distinguished based on other folding regions (e.g., folding regions parallel to the x-axis) or other folding axes (e.g., folding axes parallel to the x-axis).

[0056] The first region 201 and the second region 202 have an overall symmetrical shape with respect to the folding region 203. However, unlike the first region 201, the second region 202 includes a notch that is cut in response to the presence of the sensor region 324, but the rest of the region has a shape symmetrical to that of the first region 201. In other words, the first region 201 and the second region 202 include a portion having a symmetrical shape and a portion having an asymmetrical shape.

[0057] The following describes the operation of the first housing structure 310 and the second housing structure 320, and the respective areas of the display 200, according to the state of the electronic device 101 (for example, the unfolded state and the folded state). In one embodiment, the electronic device 101 is in a flat state (for example, Figure 2A In this case, the first housing structure 310 and the second housing structure 320 are arranged to face the same direction at a 180-degree angle. The surfaces of the first region 201 and the second region 202 of the display 200 form a 180-degree angle with each other and face in the same direction (for example, towards the front of the electronic device). The folding region 203 forms the same plane as the first region 201 and the second region 202.

[0058] In one embodiment, the electronic device 101 is in a folded state (for example, Figure 3A In this case, the first housing structure 310 and the second housing structure 320 are arranged facing each other. The surfaces of the first region 201 and the second region 202 of the display 200 face each other, forming a narrow angle (for example, between 0 and 10 degrees). The folding region 203 consists of a curved surface having a predetermined curvature in at least a portion of it. In one embodiment, when the electronic device 101 is in an intermediate state (half folded state), the first housing structure 310 and the second housing structure 320 are arranged at a predetermined angle to each other. The surface of the first region 201 and the surface of the second region 202 of the display 200 form an angle that is larger than the angle in the folded state and smaller than the angle in the unfolded state. The folding region 203 consists of a curved surface having a predetermined curvature, at least in part, and this curvature is smaller than that in the folded state.

[0059] Figure 4 shows an electronic device 400 according to an embodiment of the present invention (for example, Figure 2A This is a diagram showing the electronic device 101). Referring to Figure 4, an electronic device 400 according to an embodiment of the present invention (for example, Figure 2A The electronic device 101) is a foldable device. The electronic device 400 includes a hinge structure 480 positioned in the fold position. For example, the electronic device 400 can be folded or unfolded in the y-axis direction based on the folded position using the hinge structure 480. Electronic device 400 (for example, Figure 2A The electronic device 101) uses the folded position when folded as a reference to the electronic device 400 (for example, Figure 2A The first part 401 and the second part 402 of the electronic device 101) are adjacent to each other and face each other.

[0060] According to one embodiment, the electronic device 400 includes a first part 401, a second part 402, a first circuit board 460 located in the first part 401, a second circuit board 470 located in the second part 402, a plurality of antenna modules, and a flexible circuit board 500 (e.g., a foldable FRC: flexible RF cable). The first circuit board 460 houses a modem 466, a transceiver 462, and multiple front and module 464. The second circuit board 470 is equipped with an antenna power supply unit 472, which is connected to at least one antenna module. The flexible circuit board 500 electrically connects the first circuit board 460 of the first part 401 and the second circuit board 470 of the second part 402.

[0061] The multiple antenna modules may include a first antenna module 410 (first main antenna module), a second antenna module 415 (second main antenna module), a third antenna module 420 (sub-1 antenna module), a fourth antenna module 425 (e.g., sub-2 antenna module), a fifth antenna module 430 (e.g., sub-3 antenna module), a sixth antenna module 435 (e.g., sub-4 antenna module), a seventh antenna module 440 (e.g., sub-5 antenna module), an eighth antenna module 445 (e.g., sub-6 antenna module), a first WiFi antenna module 450, and a second WiFi antenna module 455. In one embodiment, the Wi-Fi module is, for example, a Wi-Fi circuit that supports Wi-Fi communication, but is not limited to this. For example, it includes a Bluetooth® circuit that supports Bluetooth® communication.

[0062] Figure 5 shows a flexible circuit board 500 (for example, a foldable FRC (flexible RF cable)) according to an embodiment of the present invention. Referring to Figures 4 and 5, the flexible circuit board 500 (e.g., foldable FRC) includes a first connector 501, a second connector 502, and wiring sections 510 and 520. The wiring section (510, 520) is connected to an electronic device (for example, Figure 2A The first portion 510 (e.g., the bent portion) is bent by folding and unfolding the electronic device 101 (and the electronic device 400 in Figure 4) and By folding and unfolding the electronic device 400 Not flexed It is maintained in this state. It includes a second part 520 (for example, a non-bent section). For example, electronic devices (for instance, Figure 2A A first portion 510 (e.g., a bent portion) of the flexible circuit board 500 (e.g., a foldable FRC) is formed to correspond to the folded position of the electronic device 101 (Figure 4, electronic device 400).

[0063] As an example, the electronic device 400 is in a folded state (for example, Figures 13A to 13D When in the folded state (1310), the first part 401 and the second part 402 are close to or touching each other based on the folded position. The first portion 510 of the flexible circuit board 500 is positioned in the folded portion (e.g., the folded position) of the electronic device 400 so that the flexible circuit board 500 is not damaged or disconnected in the folded portion (e.g., the folded position) of the electronic device 400. In other words, the first portion 510 of the flexible circuit board 500 is positioned to at least overlap the hinge structure 480.

[0064] Furthermore, the electronic device 400 is in an unfolded state (for example, Figures 14A to 14C When in the unfolded state (1320), the first part 401 and the second part 402 are unfolded and separated from each other based on the folded position. To prevent damage or disconnection of the flexible circuit board 500 in the portion where the electronic device 400 is folded and then unfolded (e.g., the folded position), the first portion 510 of the flexible circuit board 500 is positioned in the portion where the electronic device 400 is unfolded (e.g., the folded position). In other words, the first portion 510 of the flexible circuit board 500 is positioned to at least overlap the hinge structure 480. It will be done .

[0065] Flexible circuit board 500 (for example, foldable FRC) 30 μm to 100 μm (for example, about 50 μm) It is formed to a certain thickness. Here, the first portion 510 (e.g., the bent portion) and the second portion 520 (e.g., the non-bent portion) are formed to have different thicknesses from each other. Figure 5 reference). For example, the first portion 510 (e.g., the bent portion) is formed to a thickness of approximately 50 to 60 μm. The first portion 510 (for example, the bent portion) is formed from one or more layers having a thickness of approximately 60 μm or less. For example, the second part 520 (e.g., the non-bent part) is approximately 60 μm to 70 μm It is formed to a certain thickness. The second portion 520 (for example, the non-bent portion) is laminated with one or more layers and has no constraints on its thickness.

[0066] According to one embodiment, the first side of the flexible circuit board 500 (for example, foldable FRC) has the first circuit board transceiver A first connector 501 is formed, which is connected to 462. A second connector 502 is formed on the second side of the flexible circuit board 500 (for example, a foldable FRC), and is connected to a connector 464 of the second circuit board. A flexible circuit board 500 (e.g., a foldable FRC) electrically connects the first circuit board of the first part 401 and the second circuit board of the second part 402. A flexible circuit board 500 (for example, a foldable FRC) is used to transmit and receive control signals and RF signals between the first part 401 and the second part 402.

[0067] Figure 6A This is a diagram showing the region where the hinge structure 600 of the electronic device is located. Figure 6B This is a diagram showing an example of a portion where a flexible circuit board 500 (for example, a foldable FRC (flexible RF cable)) bends due to the unfolding of the hinge structure 600 of a foldable electronic device. Figure 6C This figure shows an example of how a flexible circuit board 500 (e.g., a foldable FRC (flexible RF cable)) is bent by folding and unfolding the hinge structure 600 of a foldable electronic device.

[0068] Figures 6A to 6C Referring to the above, the electronic device (for example, the electronic device 400 in Figure 4) is a foldable electronic device that folds in the y-axis direction. The electronic device (for example, the electronic device 400 in Figure 4) includes a hinge structure 600 (for example, the hinge structure 480 in Figure 4) positioned in a folded position. For example, an electronic device (e.g., electronic device 400 in Figure 4) is folded or unfolded in a first direction (e.g., the y-axis direction in Figure 4) based on a folded position using a hinge structure 600, with a first part (e.g., the first part 401 in Figure 4) and a second part (e.g., the second part 402 in Figure 4).

[0069] According to one embodiment, a flexible circuit board 500 (e.g., a foldable FRC: flexible RF cable) placed in the electronic device 400 electrically connects a first circuit board 460 of a first part (e.g., first part 401 in Figure 4) and a second circuit board (e.g., second circuit board 470 in Figure 4) of a second part (e.g., second part 402 in Figure 4). As an example, the flexible circuit board 500 electrically connects the first circuit board 460 and the second circuit board 470, thereby receiving signals from a modem (e.g., modem 466 in Figure 4) located on the first circuit board (e.g., the first circuit board 460 in Figure 4). Placed on the second printed circuit board (for example, on the second printed circuit board 470 in Figure 4) Connect electrically to the antenna.

[0070] According to one embodiment, the electronic device 400, for example, Figure 2A The electronic device 101 is folded or unfolded via the hinge structure 480, but the electronic device 400 (for example, Figure 2A When folding and unfolding the electronic device 101), the first part 510 (e.g., the bent part) of the flexible circuit board 500 But To be bent (for example, folded or unfolded). Electronic device 400 (for example, Figure 2A When folding and unfolding the electronic device 101), several regions (512, 514) included in the first part 510 are bent. The first part 510 (for example, the bent part) The remaining The portion is formed from a second portion (for example, a non-bent portion) (for example, the second portion 520 (for example, a non-bent portion) in Figure 5). As an example, the first region 512 of the multiple regions (512, 514) of the first part 510 is positioned such that at least a portion of it overlaps with the center bar 610 and the metal structure 620 of the hinge structure 600. The second area 514 is positioned such that it at least partially overlaps with the fixtures 612 around the center bar 610 and the fixtures 622 around the metal structure 620.

[0071] For example, a second portion 520 (for example, the second region 702 in Figure 7) has multiple signal wiring layers (for example, the first signal wiring layer 720, the second signal wiring layer 740, and the third signal wiring layer 760 in Figure 7) formed thereon. A single main signal wiring layer (e.g., the main signal wiring layer 746 in Figure 7) is formed in the first portion 510 (for example, the first region 701 in Figure 7). The first region 701 shows the result with the first FCCL conductive layer 724 and the third FCCL conductive layer 764 omitted. Therefore, the first portion 510 (for example, the first region 701 in Figure 7) is formed to be thinner than the second portion 520 (for example, the second region 702 in Figure 7). Here, signals from an electronic device (e.g., electronic device 400 in Figure 4) are transmitted via the main signal wiring layer (e.g., the main signal wiring layer 746 in Figure 7). Here, the signals from the electronic device 400 may include 2G, 3G, 4G, and 5G RF analog signals.

[0072] For example, Figure 6B As shown, the electronic device 400 (for example, Figure 2A When the electronic device 101) is deployed via the hinge structure 600, the first portion 510 (e.g., the bent portion) is far from the center bar 610 of the hinge structure 600 and close to the metal structure 620. For example, Figure 6C As shown, the electronic device 400 (for example, Figure 2A When the electronic device 101) is folded via the hinge structure 600, it is far from the metal structure 620 of the hinge structure 600 and close to the center bar 610.

[0073] Thus, the electronic device 400 (for example, Figure 2AWhen the electronic device 101) is folded and unfolded, the first portion 510 (e.g., the bent portion) of the flexible circuit board 500 may come into close proximity to or be far from the center bar 610 or the metal structure 620, which may cause impedance mismatch of the RF signal in the first portion 510 (e.g., the bent portion) of the flexible circuit board 500. The flexible circuit board 500 according to an embodiment of the present invention is used in an electronic device 400 (for example, Figure 2A To prevent RF signal impedance mismatch from occurring in the first part 510 (e.g., the bent part) when the electronic device 101) is folded and unfolded, the first part 510 (e.g., the bent part) and the second part 520 (e.g., the non-bent part) are formed with different structures. Electronic device 400 (for example, Figure 2A To prevent cracks, disconnections, or fatigue failures from occurring in the first portion 510 (e.g., the bent portion) of the flexible circuit board 500 due to repeated folding and unfolding of the electronic device 101), the first portion 510 (e.g., the bent portion) and the second portion 520 (e.g., the non-bent portion) are formed to have different thicknesses.

[0074] For example, the first portion 510 (for example, the first portion 510 in Figure 5) is formed to have a first thickness (for example, about 50 to about 60 μm). The first portion 510 is formed from one or more layers having a first thickness (for example, about 60 μm or less). The second portion 520 (for example, the second portion 520 in Figure 5) is formed to have a second thickness (for example, about 70 μm) that is greater than the first thickness. It is formed to have a second thickness that is thicker than the sum of the thicknesses of all layers of the first portion 510, including the first thickness, and is not constrained by separate thicknesses. That is, electronic device 400 (for example, Figure 2A To prevent the flexible circuit board 500 from being damaged (e.g., cracks, disconnections, fatigue failure) by repeated folding of the electronic device 101), the first portion 510 (e.g., the first portion 510 in Figure 5) is made thinner than the second portion 520 (e.g., the second portion 520 in Figure 5).

[0075] Figure 7 shows a cross-sectional structure of a flexible circuit board 700 according to an embodiment of the present invention. Figure 8A This refers to the arrangement structure of ground wiring and RF signal wiring in the first part (e.g., the bent portion) of a flexible circuit board. Figure 8B shows a flexible circuit board 700 according to an embodiment of the present invention. This diagram shows the arrangement structure of ground wiring and RF signal wiring in the second section (for example, the non-bent section). Figure 7 , Figures 8A and 8B Referring to the above, the flexible circuit board 700 (for example, the flexible circuit board 500 in Figures 4 and 5) includes a first region 701 (for example, the first portion 510 in Figure 5 (for example, the bent portion)) and a second region 702 (for example, the second portion 520 in Figure 5 (for example, the non-bent portion)). The second region 702 is positioned on both sides of the first region 701.

[0076] The first region 701 and the second region 702 commonly include a first coverlay film 710, a first coverlay adhesive layer 715, a first FCCL (flexible copper clad laminate) protective layer 722, a second FCCL protective layer 742, a third FCCL protective layer 762, a second coverlay adhesive layer 780, and a second coverlay film 785. For example, the first coverlay film 710 is placed at the upper end of the flexible circuit board 700 (for example, the upper end in Figure 7), and the second coverlay film 785 is placed at the lower end of the flexible circuit board 700 (for example, the lower end in Figure 7), to protect the flexible circuit board 700.

[0077] Figure 8A illustrates Looking at the structure of the first region 701, a first coverlay adhesive layer 715 (e.g., prepreg (PPG)) (e.g., bonding sheet) is positioned below the first coverlay film 710 (e.g., polyimide (PI)). A first FCCL protective layer 722 is positioned below the first coverlay adhesive layer 715. The first FCCL protective layer 722 is bonded to the underside of the first coverlay film 710 by the first coverlay adhesive layer 715. A dielectric layer 735 is placed below the first FCCL protective layer 722. Here, a first air gap 730 of a predetermined height can be formed between the first FCCL protective layer 722 and the dielectric layer 735. The main signal wiring layer 746 is located below the dielectric layer 735. The dielectric layer 735, positioned above the main signal wiring layer 746, prevents the main signal wiring layer 746 from being exposed to air.

[0078] As an example, the dielectric layer 735 is composed of the same film as the first coverlay film 710 and the same adhesive layer as the first coverlay adhesive layer 715. A second FCCL protective layer 742 is positioned below the main signal wiring layer 746. A third FCCL protective layer 762 is placed below the second FCCL protective layer 742. Here, a second air gap 750 of a predetermined height can be formed between the second FCCL protective layer 742 and the third FCCL protective layer 762. A second coverlay adhesive layer 780 (e.g., prepreg (PPG)) (e.g., bonding sheet) is placed beneath the third FCCL protective layer 762. A second coverlay film 785 (for example, polyimide (PI)) is placed beneath the second coverlay adhesive layer 780. The second coverlay film 785 is bonded to the underside of the third FCCL protective layer 762 by the second coverlay adhesive layer 780.

[0079] As an example, the first FCCL protective layer 722, the second FCCL protective layer 742, and the third FCCL protective layer 762, which are located in the first region 701, are formed from an insulating dielectric material (e.g., PSR (photo-imageable solder resist)) (e.g., polyimide (PI)). As an example, the first coverlay film 710 and the second coverlay film 785 include an EMI (electromagnetic interference) film (or EMI layer) for electromagnetic shielding. The first region 701 of the flexible circuit board 700 including such a configuration comprises one or more layers having a first thickness (e.g., about 60 μm or less) combination It is formed.

[0080] Figure 8B is shown below. Looking at the structure of the second region 702 (for example, the second part 520 in Figure 5 (for example, the non-bent portion)), the second region 702 includes a first coverlay film 710, a first coverlay adhesive layer 715, a second coverlay adhesive layer 780, and a second coverlay film 785. Furthermore, the second region 702 includes a plurality of signal layers (for example, a first signal wiring layer 720, a second signal wiring layer 740, and a third signal wiring layer 760). The second signal wiring layer 740 is located on substantially the same plane as the main signal wiring layer 746 of the first region 701. A first coverlay adhesive layer 715 (e.g., prepreg (PPG)) (e.g., bonding sheet) is placed beneath the first coverlay film 710 (e.g., polyimide (PI)). The first signal wiring layer 720 is positioned below the first coverlay adhesive layer 715.

[0081] As an example, the first signal wiring layer 720 includes a first FCCL protective layer 722 and a first FCCL conductive layer 724. The first FCCL protective layer 722 is bonded to the underside of the first coverlay film 710 by the first coverlay adhesive layer 715. A first FCCL conductive layer 724 is placed below the first FCCL protective layer 722. A first FCCL protective layer 722 is placed below the first FCCL conductive layer 724. A first adhesive layer 725 (e.g., a prepreg (PPG)) is placed below the first FCCL protective layer 722. The second signal wiring layer 740 is positioned below the first adhesive layer 725.

[0082] As an example, the second signal wiring layer 740 includes a second FCCL conductive layer 744 and a second FCCL protective layer 742. The second signal wiring layer 740 is bonded to the underside of the first signal wiring layer 720 by the first adhesive layer 725. Specifically, the second FCCL conductive layer 744 is bonded to the lower part of the first adhesive layer 725. A second FCCL protective layer 742 is placed below the second FCCL conductive layer 744. A second adhesive layer 745 (e.g., a prepreg (PPG)) is placed below the second FCCL protective layer 742. A third signal wiring layer 760 is placed below the second adhesive layer 745.

[0083] As an example, the third signal wiring layer 760 includes a third FCCL protective layer 762 and a third FCCL conductive layer 764. The third signal wiring layer 760 is bonded to the lower part of the second signal wiring layer 740 by the second adhesive layer 745. Specifically, the third FCCL protective layer 762 is bonded to the lower part of the second FCCL protective layer 742 by the second adhesive layer 745. A third FCCL conductive layer 764 is placed below the third FCCL protective layer 762. A second coverlay adhesive layer 780 (e.g., prepreg (PPG)) is placed beneath the third FCCL protective layer 762. A second coverlay film 785 (for example, polyimide (PI)) is placed beneath the second coverlay adhesive layer 780. The second coverlay film 785 is bonded to the underside of the third FCCL protective layer 762 by the second coverlay adhesive layer 780. For example, the first FCCL protective layer 722, the second FCCL protective layer 742, and the third FCCL protective layer 762, which are located in the second region 702 (for example, the second portion 520 in Figure 5 (for example, the non-bent portion)), are formed of an insulating dielectric (for example, PSR (photo-imageable solder resist)). The first coverlay film 710 and the second coverlay film 785 may include an EMI (electromagnetic interference) film (or EMI layer) for electromagnetic shielding.

[0084] The second region 702 (for example, the second portion 520 in Figure 5) of the flexible circuit board 700, which includes such a configuration, is formed with a second thickness (for example, about 70 μm) that is thicker than the first thickness (for example, about 50 μm). The second region 702 (for example, the second portion 520 in Figure 5) is formed to have a second thickness that is thicker than the sum of the layer thicknesses of the entire first region 701, including the first thickness, and has no constraints on separate thicknesses. According to one embodiment, the main signal wiring layer 746 of the first region 701 includes main RF signal wiring (746a-1, 746a-2, 746a-3) for transmitting RF signals and main ground wiring (746b-1, 746b-2, 746b-3, 746b-4). The RF signal wiring (746a-1, 746a-2, 746a-3) and ground wiring (746b-1, 746b-2, 746b-3, 746b-4) are arranged alternately on the same plane.

[0085] As an example, ground wiring (746b-1, 746b-2, 746b-3, 746b-4) is placed on both sides of each RF signal wiring (746a-1, 746a-2, 746a-3). The first ground wiring (746b-1) is connected to the first side of the first RF signal wiring (746a-1), and the second ground wiring (746b-2) is connected to the second side. The second ground wiring (746b-2) is connected to the first side of the second RF signal wiring (746a-2), and the third ground wiring (746b-3) is connected to the second side. The third ground wire (746b-3) is connected to the first side of the third RF signal wire (746a-3), and the fourth ground wire (746b-4) is connected to the second side.

[0086] According to one embodiment, the main RF signal wiring (746a-1, 746a-2, 746a-3) and the main ground wiring (746b-1, 746b-2, 746b-3, 746b-4) have a first value line width d1. The main RF signal wiring (746a-1, 746a-2, 746a-3) and the main ground wiring (746b-1, 746b-2, 746b-3, 746b-4) are arranged with a second-value interval d2. The first value line width d1 of the main RF signal wiring (746a-1, 746a-2, 746a-3) and the main ground wiring (746b-1, 746b-2, 746b-3, 746b-4) is greater than the second value spacing d2. In one embodiment, the ratio of the line width d1 of the first value to the interval d2 of the second value may be 5:1 to 20:1. In other words, the line width d1 of the first value can be made 5 to 20 times larger than the interval d2 of the second value.

[0087] According to one embodiment, the first FCCL conductive layer 724 of the first signal wiring layer 720 formed in the second region 702 includes a first ground wiring 724b. According to one embodiment, the second FCCL conductive layer 744 of the second signal wiring layer 740 formed in the second region 702 includes RF signal wiring 744a and a second ground wiring 744b for transmitting RF signals. The second RF signal wiring 744a and the second ground wiring 744b are arranged alternately on the same layer. According to one embodiment, the third FCCL conductive layer 764 of the third signal wiring layer 760 formed in the second region 702 includes a third ground wiring 764b.

[0088] According to one embodiment, comparing the first region 701 and the second region 702, the second region 702 includes a first FCCL conductive layer 724, a second FCCL conductive layer 744, and a third FCCL conductive layer 764 on which copper foil is formed. On the other hand, the first region 701 includes a single main signal layer 746 on which copper foil is formed.

[0089] As an example, the copper foil layer (e.g., the first FCCL conductive layer 724) is removed from the upper (or lower) portion of the first FCCL protective layer 722 in the first region 701, and a first air gap 730 is formed between the first FCCL protective layer 722 and the dielectric layer 735 to ensure high flexibility. As an example, the copper foil layer (e.g., the third FCCL conductive layer 764) is removed from the lower part of the third FCCL protective layer 762 in the first region 701, and a second air gap 750 is formed between the second FCCL protective layer 742 and the third FCCL protective layer 762 to ensure high flexibility.

[0090] As an example, the first air gap 730 and the first adhesive layer 725 are arranged on the same plane, at least in part. As an example, the dielectric layer 735 and the first adhesive layer 725 are arranged on the same plane, at least in part. As an example, the second air gap 750 and the second adhesive layer 745 are positioned on the same plane, at least in part.

[0091] According to one embodiment, a single main signal wiring layer 746 is arranged in the first region 701, so that the first ground wiring 724b, which is arranged in the first FCCL conductive layer 724 of the second region 702, is connected to the main signal wiring layer 746. As an example, the first ground wiring 724b, located in the first FCCL conductive layer 724, is electrically connected to the main ground wiring 746b via the first via 770a and the second via 770b. According to one embodiment, the RF signal wiring 744a and the second ground wiring 744b, which are located in the second FCCL conductive layer 744 of the second region 702, are connected to the main signal wiring layer 746.

[0092] According to one embodiment, a single main signal wiring layer 746 is arranged in the first region 701, and the third ground wiring 764b, which is arranged in the third FCCL conductive layer 764 of the second region 702, must be connected to the main signal wiring layer 746. As an example, the third ground wiring 764b, located in the third FCCL conductive layer 764, is electrically connected to the main ground wiring 746b via the first via 770a and the second via 770b. Thus, each of the RF signal wirings 744a placed in the second FCCL conductive layer 744 has a first ground wiring 724b placed on top and a second ground wiring 764b placed on the bottom. In other words, two ground lines (724b, 764b) are placed above and below one RF signal line 744a. Figure 8B The arrangement of ground wiring and RF signal wiring in the second part (e.g., the non-bent section) is not limited to the arrangement shown, but can be changed in various ways.

[0093] Figure 9 shows the arrangement structure of ground wiring and RF signal wiring in the second portion (e.g., non-bending portion) of a flexible circuit board according to an embodiment of the present invention. In explaining Figure 9, Figure 8B A detailed explanation of the same structure will be omitted. Referring to Figure 9, the first signal wiring layer (for example, Figure 8B The first signal wiring layer 720 includes a first FCCL protective layer 922 and a first FCCL conductive layer 924.

[0094] A first FCCL protective layer 922 is placed below the first FCCL conductive layer 924. A first adhesive layer 925 is placed below the first FCCL protective layer 922. Below the first adhesive layer 925 is the second signal wiring layer 940 (for example, Figure 8B The second signal wiring layer (740) is placed there. The second signal wiring layer 940 includes a second FCCL protective layer 942 and a second FCCL conductive layer 944. A second FCCL conductive layer 944 is placed below the first adhesive layer 925. A second FCCL protective layer 942 is placed below the second FCCL conductive layer 944. A second adhesive layer 945 is placed below the second FCCL protective layer 942. Below the second adhesive layer 945 is a third signal wiring layer (for example, Figure 8B The third signal wiring layer (760) is located there. The third signal wiring layer includes a third FCCL protective layer 962 and a third FCCL conductive layer 964. A third FCCL protective layer 962 is placed below the second adhesive layer 945. A third FCCL conductive layer 964 is placed below the third FCCL protective layer 962.

[0095] According to one embodiment, the first FCCL conductive layer 924 formed in the second region 902 includes a first ground wiring 924b. According to one embodiment, the second FCCL conductive layer 944 of the second signal wiring layer 940 formed in the second region 902 includes RF signal wiring (944a, 944c, 944d) for transmitting RF signals and a second ground wiring 944b. The RF signal wiring (944a, 944c, 944d) and the second ground wiring 944b are arranged alternately on the same layer. In one embodiment, the RF signal wiring (944a, 944c, 944d) arranged in the second FCCL conductive layer 744 includes a first RF signal wiring 944a, a second RF signal wiring 944c, and a third RF signal wiring 944d.

[0096] In one embodiment, the first ground wiring 924b is arranged to at least overlap with the first RF signal wiring 944a, the second RF signal wiring 944c, and the third RF signal wiring 944d. According to one embodiment, a third signal wiring layer (for example, Figure 8B The third FCCL conductive layer 964 of the third signal wiring layer 760 includes a third ground wiring (964b-1) and a fourth ground wiring (964b-2). In one embodiment, the third ground wiring (964b-1) is arranged to at least overlap the first RF signal wiring 944a and the second RF signal wiring 944c. In one embodiment, the fourth ground wiring (964b-2) is arranged to at least overlap the second RF signal wiring 944c and the third RF signal wiring 944d.

[0097] In one embodiment, the first ground wire 924b, the second ground wire 944b, and the third ground wire (964b-1) are electrically connected via the first via 970a. In one embodiment, the first ground wire 924b, the second ground wire 944b, and the fourth ground wire (964b-2) are electrically connected via the second via 970a. In one embodiment, among the RF signal wirings (944a, 944c, 944d) arranged in the second FCCL conductive layer 944, the first ground wiring 924b is arranged above the first RF signal wiring 944a, and the third ground wiring (964b-1) is arranged below it. In other words, two ground lines (924b, 964b-1) are placed above and below one first RF signal line 944a.

[0098] In one embodiment, among the RF signal wirings (944a, 944c, 944d) arranged in the second FCCL conductive layer 944, the first ground wiring 924b may be placed above the second RF signal wiring 944c, while no ground wiring may be placed below it. In one embodiment, among the RF signal wirings (944a, 944c, 944d) arranged in the second FCCL conductive layer 944, the first ground wiring 924b is placed above the third RF signal wiring 944d, and the fourth ground wiring (964b-2) is placed below it. In other words, two ground lines (924b, 964b-1) are placed above and below one first RF signal line 944a. Thus, two ground wires (924b, 964b-1) are placed above and below the first RF signal wire 944a, one ground wire 924b is placed above (or below) the second RF signal wire 944c, and two ground wires (924b, 964b-2) are placed above and below the third RF signal wire 944d.

[0099] Figure 10 shows the arrangement structure of ground wiring and RF signal wiring in the second portion (e.g., non-bending portion) of a flexible circuit board according to an embodiment of the present invention. In explaining Figure 10, Figure 8B A detailed explanation of the same structure will be omitted. Referring to Figure 10, the first signal wiring layer (for example, Figure 8B The first signal wiring layer 720 includes a first FCCL protective layer 1022 and a first FCCL conductive layer 1024.

[0100] A first FCCL protective layer 1022 is placed below the first FCCL conductive layer 1024. A first adhesive layer 1025 is placed below the first FCCL protective layer 1022. Below the first adhesive layer 1025 is the second signal wiring layer 1040 (for example, Figure 8B The second signal wiring layer (740) is placed there. The second signal wiring layer 1040 includes a second FCCL protective layer 1042 and a second FCCL conductive layer 1044. A second FCCL conductive layer 1044 is placed below the first adhesive layer 1025. A second FCCL protective layer 1042 is placed below the second FCCL conductive layer 1044. A second adhesive layer 1045 is placed below the second FCCL protective layer 1042. A third signal wiring layer (for example, Figure 8B The third signal wiring layer (760) is located there. The third signal wiring layer includes a third FCCL protective layer 1062 and a third FCCL conductive layer 1064. A third FCCL protective layer 1062 is placed below the second adhesive layer 1045. A third FCCL conductive layer 1064 is placed below the third FCCL protective layer 1062.

[0101] According to one embodiment, the first FCCL conductive layer 1024 formed in the second region 1002 includes a first ground wiring 1024b. According to one embodiment, the second FCCL conductive layer 1044 of the second signal wiring layer 1040 formed in the second region 1002 includes RF signal wiring (1044a, 1044c, 1044d) for transmitting RF signals and a second ground wiring 1044b. The RF signal lines (1044a, 1044c, 1044d) and the second ground line 1044b are arranged alternately on the same layer. In one embodiment, the RF signal wiring (1044a, 1044c, 1044d) arranged in the second FCCL conductive layer 1044 includes a first RF signal wiring 1044a, a second RF signal wiring 1044c, and a third RF signal wiring 1044d.

[0102] In one embodiment, the first ground wiring 1024b is arranged to at least overlap the first RF signal wiring 1044a and the second RF signal wiring 1044c. The first ground wiring 1024b may not overlap with the third RF signal wiring 1044d. According to one embodiment, a third signal wiring layer (for example, Figure 8B The third FCCL conductive layer 1064 of the third signal wiring layer 760 includes the third ground wiring 1064b. In one embodiment, the third ground wiring 1064b is arranged to at least overlap the first RF signal wiring 1044a, the second RF signal wiring 1044c, and the third RF signal wiring 1044d.

[0103] In one embodiment, the first ground wire 1024b, the second ground wire 1044b, and the third ground wire 1064b are electrically connected via the first via 1070a and the second via 1070b. In one embodiment, among the RF signal wirings (1044a, 1044c, 1044d) arranged in the second FCCL conductive layer 1044, the first ground wiring 1024b is placed above the first RF signal wiring 1044a, and the third ground wiring 1064b is placed below it. In other words, two ground lines (1024b, 1064b) are placed above and below one first RF signal line 1044a.

[0104] In one embodiment, among the RF signal wirings (1044a, 1044c, 1044d) arranged in the second FCCL conductive layer 1044, the first ground wiring 1024b is placed above the second RF signal wiring 1044c, and the third ground wiring 1064b is placed below it. In other words, two ground lines (1024b, 1064b) are placed above and below one second RF signal line 1044c. In one embodiment, a ground wire is not placed above the third RF signal wire 1044d among the RF signal wires (1044a, 1044c, 1044d) arranged in the second FCCL conductive layer 1044. Below the third RF signal wiring 1044d, the third ground wiring 1064b is located. In other words, one ground wire 1064b is placed below (or above) one third RF signal wire 1044d.

[0105] Thus, two ground wires (1024b, 1064b) are placed above and below the first RF signal wire 1044a, one ground wire 924b is placed above (or below) the second RF signal wire 1044c, and two ground wires (1024b, 1064b) are placed above and below the third RF signal wire 1044d.

[0106] Figure 11 shows the arrangement structure of ground wiring and RF signal wiring in the second portion (e.g., non-bending portion) of a flexible circuit board according to an embodiment of the present invention. In explaining Figure 11, Figure 8B A detailed explanation of the same structure will be omitted. Referring to Figure 11, the first signal wiring layer (for example, Figure 8B The first signal wiring layer 720 includes a first FCCL protective layer 1122 and a first FCCL conductive layer 1124.

[0107] A first FCCL protective layer 1122 is placed below the first FCCL conductive layer 1124. A first adhesive layer 1125 is placed below the first FCCL protective layer 1122. Below the first adhesive layer 1125 is the second signal wiring layer 1140 (for example, Figure 8B The second signal wiring layer (740) is placed there. The second signal wiring layer 1140 includes a second FCCL protective layer 1142 and a second FCCL conductive layer 1144. A second FCCL conductive layer 1144 is placed below the first adhesive layer 1125. A second FCCL protective layer 1142 is placed below the second FCCL conductive layer 1144. A second adhesive layer 1145 is placed below the second FCCL protective layer 1142. A third signal wiring layer (for example,) is placed below the second adhesive layer 1145. Figure 8B The third signal wiring layer (760) is located there. The third signal wiring layer includes a third FCCL protective layer 1162 and a third FCCL conductive layer 1164. A third FCCL protective layer 1162 is placed below the second adhesive layer 1145. A third FCCL conductive layer 1164 is placed below the third FCCL protective layer 1162.

[0108] According to one embodiment, the first FCCL conductive layer 1124 formed in the second region 1102 is the first ground wiring 1124b and Includes a third RF signal wiring 1144d for transmitting RF signals. The first ground wiring 1124b and the third RF signal wiring 1144d are located on the same layer. According to one embodiment, the second FCCL conductive layer 1144 of the second signal wiring layer 1140 formed in the second region 1102 includes RF signal wiring (1144a, 1044c) for transmitting RF signals and a second ground wiring 1144b. The RF signal wiring (1144a, 1144c) and the second ground wiring 1144b are arranged alternately on the same layer. In one embodiment, the RF signal wiring (1144a, 1144c) arranged in the second FCCL conductive layer 1144 includes the first RF signal wiring 1144a and the second RF signal wiring 1144c.

[0109] In one embodiment, the first ground wiring 1124b is arranged to at least overlap the first RF signal wiring 1144a and the second RF signal wiring 1144c. The first ground wiring 1124b is located on the same plane as the third RF signal wiring 1044d. According to one embodiment, a third signal wiring layer (for example, Figure 8B The third FCCL conductive layer 1164 of the third signal wiring layer 760 includes the third ground wiring 1064b.

[0110] In one embodiment, the third ground wiring 1064b is arranged to at least overlap the first RF signal wiring 1144a, the second RF signal wiring 1144c, and the third RF signal wiring 1144d. In one embodiment, the first ground wire 1124b, the second ground wire 1144b, and the third ground wire 1164b are electrically connected via the first via 1170a and the second via 1170b.

[0111] In one embodiment, among the RF signal wirings (1144a, 1144c) arranged in the second FCCL conductive layer 1144, the first ground wiring 1124b is arranged above the first RF signal wiring 1144a, and the third ground wiring 1164b is arranged below it. In other words, two ground lines (1124b, 1164b) are placed above and below one first RF signal line 1144a.

[0112] In one embodiment, among the RF signal wirings (1144a, 1144c) arranged in the second FCCL conductive layer 1144, the first ground wiring 1124b is arranged above the second RF signal wiring 1144c, and the third ground wiring 1164b is arranged below it. In other words, two ground lines (1124b, 1164b) are placed above and below one second RF signal line 1144c.

[0113] In one embodiment, no ground wiring is provided above the third RF signal wiring 1144d, which is located on the first FCCL conductive layer 1124. Below the third RF signal wiring 1144d, the third ground wiring 1164b is located. In other words, one ground wire 1164b is placed below (or above) one third RF signal wire 1144d.

[0114] Thus, two ground wires (1124b, 1164b) are placed above and below the first RF signal wire 1144a, two ground wires (1124b, 1164b) are placed above and below the second RF signal wire 1144c, and one ground wire 1164b is placed below (or above) the third RF signal wire 1144d.

[0115] Figure 12 shows the arrangement structure of ground wiring and RF signal wiring in the second portion (e.g., non-bending portion) of a flexible circuit board according to an embodiment of the present invention. In explaining Figure 12, Figure 8B A detailed explanation of the same structure will be omitted. Referring to Figure 12, the first signal wiring layer (for example, Figure 8B The first signal wiring layer 720 includes a first FCCL protective layer 1222 and a first FCCL conductive layer 1224.

[0116] A first FCCL protective layer 1222 is placed below the first FCCL conductive layer 1224. A first adhesive layer 1225 is placed below the first FCCL protective layer 1222. Below the first adhesive layer 1225 is the second signal wiring layer 1240 (for example, Figure 8B The second signal wiring layer (740) is placed there. The second signal wiring layer 1240 includes a second FCCL protective layer 1242 and a second FCCL conductive layer 1244. A second FCCL conductive layer 1244 is placed below the first adhesive layer 1225. A second FCCL protective layer 1242 is placed below the second FCCL conductive layer 1244. A second adhesive layer 1245 is placed below the second FCCL protective layer 1242. Below the second adhesive layer 1245 is the third signal wiring layer (for example, Figure 8B The third signal wiring layer (760) is located there. The third signal wiring layer includes a third FCCL protective layer 1262 and a third FCCL conductive layer 1264. A third FCCL protective layer 1262 is placed below the second adhesive layer 1245. A third FCCL conductive layer 1264 is placed below the third FCCL protective layer 1262.

[0117] According to one embodiment, the first FCCL conductive layer 1224 formed in the second region 1202 includes a first ground wiring 1224b and a second RF signal wiring 1244c for transmitting an RF signal. The first ground wiring 1224b and the second RF signal wiring 1244c are located on the same layer. According to one embodiment, the second FCCL conductive layer 1244 of the second signal wiring layer 1240 formed in the second region 1202 includes a first RF signal wiring 1244a and a second ground wiring 1244b for transmitting RF signals. The first RF signal wiring 1244a and the second ground wiring 1244b are located on the same layer.

[0118] In one embodiment, the first ground wiring 1224b is arranged to at least overlap the first RF signal wiring 1244a and the third RF signal wiring 1244d. The first ground wiring 1224b is located on the same plane as the second RF signal wiring 1244c. According to one embodiment, a third signal wiring layer (for example, Figure 8B The third FCCL conductive layer 1264 of the third signal wiring layer 760 includes a third ground wiring (1264b-1) and a fourth ground wiring (1264b-2).

[0119] In one embodiment, the third ground wiring (1264b-1) is arranged to at least overlap with the first RF signal wiring 1244a. In one embodiment, the fourth ground wiring (1264b-2) is arranged to at least overlap with the second RF signal wiring 1244c. In one embodiment, the first ground wiring 1224b, the second ground wiring 1244b, and the third ground wiring (1264b-1) are electrically connected via the first via 1270a. In one embodiment, the first ground wiring 1224b, the second ground wiring 1244b, and the fourth ground wiring (1264b-2) are electrically connected via the second via 1270b.

[0120] In one embodiment, the first ground wiring 1224b is arranged above the first RF signal wiring 1244a disposed in the second FCCL conductive layer 1244, and the third ground wiring (1264b-1) is arranged below it. That is, two ground wirings (1224b, 1264b-1) are arranged above and below one first RF signal wiring 1244a. In one embodiment, no ground wiring is arranged above the second RF signal wiring 1244c disposed in the first FCCL conductive layer 1224. The fourth ground wiring (1264b-2) is arranged below the second RF signal wiring 1144c. That is, one ground wiring (1264b-2) is arranged below (or above) one second RF signal wiring 1244c.

[0121] In one embodiment, the first ground wiring 1224b is arranged above the third RF signal wiring 1244d disposed in the third FCCL conductive layer 1264. No ground wiring is arranged above (or below) the third RF signal wiring 1244d. In other words, one ground wire 1224b is placed above (or below) one third RF signal wire 1244d.

[0122] Thus, the first RF signal wiring 1244a, the second RF signal wiring 1244c, and the third RF signal wiring 1244d are arranged on different layers. Two ground wires (1224b, 1264b-1) are placed above and below the first RF signal wire 1244a, one ground wire 1224b is placed above (or below) the second RF signal wire 1244c, and one ground wire (1264b-2) is placed below (or above) the third RF signal wire 1244d.

[0123] Figures 13A to 13D This is a diagram showing the form of a flexible circuit board when a foldable electronic device according to an embodiment of the present invention is in a folded state. Figures 14A to 14C Figure 15 shows the configuration of the flexible circuit board when the foldable electronic device according to an embodiment of the present invention is in an unfolded state, and Figure 15 shows that signal interference is improved across the entire frequency range via the flexible circuit board according to an embodiment of the present invention. graph That is the case.

[0124] Figures 13A to 14C Referring to the above, the electronic device (e.g., the electronic device 400 in Figure 4) can be folded and unfolded via a hinge structure (e.g., the hinge structure 480 in Figure 4), and when the electronic device is folded and unfolded, the first portion 510 (e.g., the bend portion) of the flexible circuit board 500 is bent (e.g., folded or unfolded). Here, the first portion 510 (e.g., the bent portion) of the flexible circuit board 500 is formed to be thinner than the second portion (e.g., the second portion 520 in Figure 5) (e.g., the non-bent portion).

[0125] According to one embodiment, when the electronic device (for example, the electronic device 400 in Figure 4) is in the folded state 1310, the first part 1301 and the second part 1032 are close to or in contact with each other with respect to the folded position (for example, the folded position in Figure 4). When the electronic device 400 is in the folded state 1310, the flexible circuit board 500 is positioned such that at least a portion of the first part 510 of the flexible circuit board 500 overlaps with the folded position (for example, the hinge structure 480 in Figure 4), which is the part in which the electronic device 400 is folded.

[0126] According to one embodiment, when the electronic device 400 is in the deployed state 1320, the first part 1301 and the second part 1302 are deployed and separated from each other with respect to the folded position. To prevent damage or disconnection of the flexible circuit board 500 in the folded and unfolded portion of the electronic device 400 (e.g., the folded position), the first portion 510 of the flexible circuit board 500 is positioned so that at least a portion of it overlaps with the folded position (e.g., the hinge structure 480 in Figure 4), which is the portion in which the electronic device 400 is unfolded.

[0127] In Figure 15, the reference numeral "1510" indicates the transmission loss rate 1510 when the flexible circuit board of the present invention (for example, the flexible circuit board 500 in Figures 4 and 5, and the flexible circuit board 700 in Figure 7) is applied to an electronic device (for example, a mobile electronic device). The code “1520” indicates a transmission loss rate of 1520 when a typical flexible circuit board is applied to an electronic device (e.g., a mobile electronic device). When a flexible circuit board according to an embodiment of the present invention is applied to an electronic device, it can be confirmed that the transmission loss is reduced compared to when a typical flexible circuit board is applied in the 600 MHz to 5.0 GHz frequency band.

[0128] When the flexible circuit board of the present invention is applied to an electronic device, the first signal wiring layer (for example, Figure 8B (1st signal wiring layer 720), 2nd signal wiring layer (for example, Figure 8B The second signal wiring layer 740), and the third signal wiring layer ( Figure 8B The RF signal wiring and ground wiring of the third signal wiring layer (760) can be made wider, thereby reducing signal transmission loss.

[0129] Comparing the transmission loss rate of the flexible circuit board of the present invention (1510) with that of a typical flexible circuit board (1520), it can be confirmed that the flexible circuit board of the present invention exhibits a reduced insertion loss of the FRC (flexible RF cable) compared to a typical flexible circuit board that requires a separate EMI film layer (or separate grounding layer). Furthermore, while typical flexible circuit boards require a separate EMI film layer (or separate grounding layer), resulting in a maximum layer thickness of approximately 70 μm, the flexible circuit board of the present invention has a thickness of approximately 50 μm or less, thereby reducing damage caused by opening and closing foldable electronic devices.

[0130] The flexible circuit board according to the embodiment of the present invention is not damaged by repeated folding and unfolding (e.g., opening and closing) in the folding region where the display is folded during folding. In the flexible circuit board according to the embodiment of the present invention, protective layers are arranged above and below the main signal wiring layer in the bent portion, which can prevent interference of electric fields by metal parts of the electronic device during repeated folding and unfolding (e.g., opening and closing). This prevents impedance mismatch in RF signals transmitted through flexible circuit boards, resulting in improved signal transmission performance. In the foldable electronic device according to an embodiment of the present invention, the flexible circuit board is located in the folding region where the display is folded during folding. Even after being repeatedly folded and unfolded Because it is not damaged, the lifespan of electronic devices can be extended and the reliability of operation can be improved.

[0131] Electronic device according to an embodiment of the present invention (for example, electronic device 101 in Figure 1, Figure 2A The electronic device (the electronic device in Figure 4) has a hinge structure (for example, the hinge structure 480 in Figure 4). Figure 6B (Hinge structure 600), hinge structure (for example, hinge structure 480 in Figure 4) Figure 6BA flexible display (e.g., display module 160 of FIG. 1, Figure 2A display 200) folded or unfolded by the hinge structure (e.g., hinge structure 480 of FIG. 4, Figure 6B hinge structure 600), and a first part (e.g., first part 401 of FIG. 4) and a second part (e.g., second part 402 of FIG. 4) that are close to each other and face each other when folded by the hinge structure (e.g., hinge structure 600) and are separated from each other when unfolded, a first circuit board (e.g., first circuit board 460 of FIG. 4) disposed on the first part (e.g., first part 401 of FIG. 4), a second circuit board (e.g., second circuit board 470 of FIG. 4) disposed on the second part (e.g., second part 402 of FIG. 4), and a flexible circuit board (e.g., flexible circuit board 500 of FIG. 5, Figure 7 flexible circuit board 700) that electrically connects the first circuit board (e.g., first circuit board 460 of FIG. 4) and the second circuit board (e.g., second circuit board 470 of FIG. 4), and the flexible circuit board (e.g., flexible circuit board 500 of FIG. 5, Figure 7 flexible circuit board 700) follows the deformation Figure 2A of the electronic device (e.g., electronic device 101 of FIG. 1, (For example, folding, bending) electronic device, electronic device of FIG. 4) bend to include a first region (e.g., first region 510 of FIG. 5, FIGS. 7 and Figure 8A first region 701), and a second region (e.g., second region 520 of FIG. 5, FIGS. 7 and Figure 8A located around the first region 701) (e.g., second region 702 of FIGS. 7 and Figure 8B ), and the first region (e.g., first region 510 of FIG. 5, FIGS. 7 and Figure 8A first region 701) includes a single main signal wiring layer (e.g., main signal wiring layer 746 of FIGS. 7 and Figure 8A ), and the above (e.g., second region 520 of FIG. 5, FIGS. 7 and Figure 8B second region 702) includes a plurality of signal wiring layers (e.g., first signal wiring layer 720 of FIG. 7), a second signal wiring layer (e.g., second signal wiring layer 740 of FIG. 7), and a third signal wiring layer (e.g., third signal wiring layer 760 of FIG. 7), and the first region (e.g., first region 510 of FIG. 5, FIGS. 7 and Figure 8A(the first region 701) and the above (for example, the second region 520 in Figure 5, and in Figure 7) Figure 8B The second region 702) is formed with a different thickness.

[0132] According to one embodiment, the main signal wiring layer (for example, Figure 7 and Figure 8A The main signal wiring layer 746) includes the main RF (radio frequency) signal wiring (e.g., RF signal wiring (746a-1, 746a-2, 746a-3)) and the main ground wiring (e.g., Figure 8A This includes ground wiring (746b-1, 746b-2, 746b-3, 746b-4)) and main RF signal wiring (for example, Figure 8A RF signal wiring ( 746a -1))(For example, RF signal wiring (746a-1, 746a-2, 746a-3)) and main ground wiring (for example, Figure 8A The ground wiring (746b-1, 746b-2, 746b-3, 746b-4) is located on the same layer.

[0133] According to one embodiment, a plurality of signal wiring layers (for example, the first signal wiring layer 720 in Figure 7), a second signal wiring layer (for example, the second signal wiring layer 740 in Figure 7), and a third signal wiring layer (for example, the third signal wiring layer 760 in Figure 7) are a plurality of first RF signal wirings (for example, Figure 8A RF signal wiring 746a -1) and a first signal wiring layer (e.g., the first signal wiring layer 720 in Figure 7) including a first FCCL (flexible copper clad laminate) conductive layer (e.g., the first FCCL conductive layer 724 in Figure 7) on which a plurality of first ground wires (e.g., the first ground wire 924b in Figure 9, the first ground wire 1024b in Figure 10, the first ground wire 1124b in Figure 11, the first ground wire 1224b in Figure 12) are formed, a plurality of second RF signal wires (e.g., Figure 8A RF signal wiring ( 746a-2)) and a second signal wiring layer (e.g., second signal wiring layer 740 in Figure 7) including a second FCCL conductive layer (e.g., second FCCL conductive layer 744 in Figure 7) on which a plurality of second ground wires (e.g., second ground wire 944b in Figure 9, second ground wire 1044b in Figure 10, second ground wire 1144b in Figure 11, second ground wire 1244b in Figure 12) are formed, and a plurality of third RF signal wires (e.g., Figure 8A RF signal wiring ( 746a-3 The third signal wiring layer (e.g., the third signal wiring layer 760 in Figure 7) includes a third FCCL conductive layer (e.g., the third FCCL conductive layer 764 in Figure 7) on which a plurality of third ground lines (e.g., the third ground line (964b-1) in Figure 9, the third ground line 1064b in Figure 10, the third ground line 1164b in Figure 11, and the third ground line 1164b line (1264b-1)) are formed.

[0134] According to one embodiment, a plurality of first RF signal wirings (for example, Figure 8A RF signal wiring 746a -1) and multiple first ground lines (e.g., first ground line 924b in Figure 9, first ground line 1024b in Figure 10, first ground line 1124b in Figure 11, first ground line 1224b in Figure 12) are arranged on the same layer, and multiple second RF signal lines (e.g., Figure 8A RF signal wiring ( 746a-2 )) and multiple second ground lines (for example, second ground line 944b in Figure 9, second ground line 1044b in Figure 10, second ground line 1144b in Figure 11, second ground line 1244b in Figure 12) are arranged on the same layer, and multiple third RF signal lines (for example, Figure 8A RF signal wiring ( 746a-3 )) and multiple third ground lines (for example, third ground line (964b-1) in Figure 9, third ground line 1064b in Figure 10, third ground line 1164b in Figure 11, third ground line (1264b-1) in Figure 12) are arranged on the same layer, and multiple first RF signal lines (for example, Figure 8A RF signal wiring ( 746a -1)) Multiple second RF signal wiring (for example, Figure 8ARF signal wiring ( 746a-2 )), and multiple third RF signal wiring (for example, Figure 8A RF signal wiring ( 746a-3 )) are placed on different layers from each other.

[0135] According to one embodiment, the system includes at least one via (e.g., the first via 770a and the second via 770b in Figure 7) which electrically connects a plurality of first ground wires (e.g., the first ground wire 924b in Figure 9, the first ground wire 1024b in Figure 10, the first ground wire 1124b in Figure 11, and the first ground wire 1224b in Figure 12), a plurality of second ground wires (e.g., the second ground wire 944b in Figure 9, the second ground wire 1044b in Figure 10, the second ground wire 1144b in Figure 11, and the second ground wire 1244b in Figure 12), and a plurality of third ground wires (e.g., the third ground wire (964b-1) in Figure 9, the third ground wire 1064b in Figure 10, the third ground wire 1164b in Figure 11, and the third ground wire (1264b-1) in Figure 12) to the main ground wire.

[0136] According to one embodiment, the main signal wiring layer (for example, Figure 7 and Figure 8A The main signal wiring layer (746) and the second signal wiring layer (for example, the second signal wiring layer 740 in Figure 7) are arranged on the same plane. According to one embodiment, the first part (for example, the first part 401 in Figure 4) is the main signal wiring layer (for example, Figure 7 and Figure 8A The circuit includes a dielectric layer (e.g., dielectric layer 735 in Figure 7) positioned on top of the main signal wiring layer 746), a first FCCL protective layer (e.g., first FCCL protective layer 722 in Figure 7) positioned on the dielectric layer (e.g., dielectric layer 735 in Figure 7), and a first air gap (e.g., first air gap 730 in Figure 7) formed between the dielectric layer (e.g., dielectric layer 735 in Figure 7) and the first FCCL protective layer (e.g., first FCCL protective layer 722 in Figure 7).

[0137] According to one embodiment, the first part (for example, the first part 401 in Figure 4) is the main signal wiring layer (for example, Figure 7 and Figure 8AThe system includes a second FCCL protective layer (e.g., the second FCCL protective layer 742 in Figure 7) located below the main signal wiring layer 746, a third FCCL protective layer located below the second FCCL protective layer (e.g., the second FCCL protective layer 742 in Figure 7), and a second air gap (e.g., the second air gap 750 in Figure 7) formed between the second FCCL protective layer (e.g., the second FCCL protective layer 742 in Figure 7) and the third FCCL protective layer. According to one embodiment, the second part (for example, the second part 402 in Figure 4) includes a first adhesive layer (for example, the first adhesive layer 725 in Figure 7) for bonding a first signal wiring layer (for example, the first signal wiring layer 720 in Figure 7) to a second signal wiring layer (for example, the second signal wiring layer 740 in Figure 7), and a second adhesive layer (for example, the second adhesive layer 745 in Figure 7) for bonding a second signal wiring layer (for example, the second signal wiring layer 740 in Figure 7) to a third signal wiring layer (for example, the third signal wiring layer 760 in Figure 7).

[0138] According to one embodiment, the first signal wiring layer (e.g., the first signal wiring layer 720 in Figure 7) includes a first FCCL protective layer (e.g., the first FCCL protective layer 722 in Figure 7) located below the first FCCL conductive layer (e.g., the first FCCL conductive layer 744 in Figure 7), the second signal wiring layer (e.g., the second signal wiring layer 740 in Figure 7) includes a second FCCL protective layer (e.g., the second FCCL protective layer 742 in Figure 7) located below the second FCCL conductive layer (e.g., the second FCCL conductive layer 744 in Figure 7), and the third signal wiring layer (e.g., the third signal wiring layer 760 in Figure 7) includes a third FCCL protective layer (e.g., the third FCCL protective layer 762 in Figure 7) located above the third FCCL conductive layer (e.g., the third FCCL conductive layer 764 in Figure 7).

[0139] According to one embodiment, the first air gap (for example, the first air gap 730 in Figure 7) and the first adhesive layer (for example, the first adhesive layer 725 in Figure 7) are located on the same plane, at least in part. According to one embodiment, the dielectric layer (for example, the dielectric layer 735 in Figure 7) and the first adhesive layer (for example, the first adhesive layer 725 in Figure 7) are arranged on the same plane, at least in part. According to one embodiment, the second air gap (e.g., the second air gap 750 in Figure 7) and the second adhesive layer (e.g., the second adhesive layer 745 in Figure 7) are located on the same plane, at least in part.

[0140] According to one embodiment, the first portion (for example, the first portion 401 in Figure 4) comprises at least one layer having a first thickness. By combining The second portion (for example, the second portion 402 in Figure 4) is formed to a second thickness that is greater than the first thickness. According to one embodiment, the first part (for example, the first part 401 in Figure 4) is a hinge structure (for example, the hinge structure 480 in Figure 4) Figure 6A The hinge structure (600) overlaps with at least a portion of it.

[0141] A flexible circuit board for a foldable electronic device according to an embodiment of the present invention (for example, the flexible circuit board 500 in Figure 5) Figure 7 The flexible circuit board (700) can be modified by changing the form of the electronic device. bend It includes a first part (e.g., first part 401 in Figure 4) and a second part (e.g., second part 402 in Figure 4) located around the first part (e.g., first part 401 in Figure 4), the first part (e.g., first part 401 in Figure 4) being a single main signal wiring layer (e.g., Figure 7 and Figure 8A The first part (e.g., the second part 402 in Figure 4) includes a main signal wiring layer (746), and the second part (e.g., the second part 402 in Figure 4) includes a plurality of signal wiring layers (e.g., the first signal wiring layer 720 in Figure 7), a second signal wiring layer (e.g., the second signal wiring layer 740 in Figure 7), and a third signal wiring layer (e.g., the third signal wiring layer 760 in Figure 7), and is formed to a different thickness from the first part (e.g., the first part 401 in Figure 4) and the second part (e.g., the second part 402 in Figure 4).

[0142] According to one embodiment, the main signal wiring layer (for example, Figure 7 and Figure 8A The main signal wiring layer 746) includes the main RF (radio frequency) signal wiring and the main ground wiring, and the main RF signal wiring (for example, Figure 8A RF signal wiring ( 746a-1)) and the main ground wiring are placed on the same layer.

[0143] According to one embodiment, a plurality of signal wiring layers (for example, the first signal wiring layer 720 in Figure 7), a second signal wiring layer (for example, the second signal wiring layer 740 in Figure 7), and a third signal wiring layer (for example, the third signal wiring layer 760 in Figure 7) are a plurality of first RF signal wirings (for example, Figure 8A RF signal wiring ( 746a -1)) and a first signal wiring layer (e.g., the first signal wiring layer 720 in Figure 7) including a first FCCL (flexible copper clad laminate) conductive layer (e.g., the first FCCL conductive layer 724 in Figure 7) on which a plurality of first ground wires (e.g., the first ground wire 924b in Figure 9, the first ground wire 1024b in Figure 10, the first ground wire 1124b in Figure 11, the first ground wire 1224b in Figure 12) are formed, a plurality of second RF signal wires (e.g., Figure 8A RF signal wiring ( 746a-2 )) and a second signal wiring layer (e.g., second signal wiring layer 740 in Figure 7) including a second FCCL conductive layer (e.g., second FCCL conductive layer 744 in Figure 7) on which a plurality of second ground wires (e.g., second ground wire 944b in Figure 9, second ground wire 1044b in Figure 10, second ground wire 1144b in Figure 11, second ground wire 1244b in Figure 12) are formed, and a plurality of third RF signal wires (e.g., Figure 8A RF signal wiring ( 746a-3 The third signal wiring layer (e.g., the third signal wiring layer 760 in Figure 7) includes a third FCCL conductive layer (e.g., the third FCCL conductive layer 764 in Figure 7) on which a plurality of third ground lines (e.g., the third ground line (964b-1) in Figure 9, the third ground line 1064b in Figure 10, the third ground line 1164b in Figure 11, and the third ground line 1164b line (1264b-1)) are formed.

[0144] According to one embodiment, the first part (for example, the first part 401 in Figure 4) is at least one layer having a first thickness By combining The second portion (for example, the second portion 402 in Figure 4) is formed to a second thickness that is greater than the first thickness. According to one embodiment, the first portion (for example, the first portion 401 in Figure 4) overlaps, at least in part, with the folded position of the foldable electronic device. Although the content of the present invention has been shown and described with reference to various embodiments, those skilled in the art will understand that the shape and details can be modified in various ways without departing from the spirit and scope of the present invention. These are defined by the attached claims and their equivalent claims. [Explanation of Symbols]

[0145] 100 Network Environment 101, 102, 104 Electronic equipment 108 servers 120 processors 121 Main Processor 123 Auxiliary processors 130 memory 132 Volatile memory 134 Non-volatile memory 136 internal memory 138 External memory 140 programs 142 OS 144 Middleware 146 applications 150 Input Modules 155 Audio Output Module 160 Display Modules 170 Audio Modules 176 Sensor Modules 177 Interface 178 Connecting terminals 179 Haptic Modules 180 Camera Module 188 Power Management Modules 189 Battery 190 Communication Module 192 Wireless Communication Module 194 Wired communication module 196 Subscriber Identification Module 197 Antenna Module 198 First Network 200 displays 201 1st area 202 Second area 203 Folding Area 290 Sub-display 300 Foldable Housing 310 First Housing Structure 320 Second Housing Structure 330 Hinge Cover 324 Sensor Area 380 First rear cover 382 1st posterior area 390 Second rear cover 392 2nd posterior area 500 Flexible Circuit Boards 501 First Connector 502 Second connector 510, 520 wiring section 600 hinge structure 610 Center Bar 612, 622 Equipment 620 Metal Structures 700 Flexible Circuit Boards 710 First coverlay film 715 First Coverlay Adhesion Layer 720 First signal wiring layer 722 1st FCCL protection layer 724 First FCCL conductive layer 725 1st adhesive layer 730 First Air Gap 735 Dielectric layer 740 Second signal wiring layer 742 2nd FCCL protection layer 744 2nd FCCL conductive layer 745 Second adhesive layer 746 Main signal wiring layer 750 Second air gap 760 Third signal wiring layer 762 3rd FCCL protection layer 764 3rd FCCL conductive layer 770a Via 1 770b Second Via 780 Second coverlay adhesive layer 785 Second coverlay film

Claims

1. An electronic device, A hinge structure, A flexible display that is folded or unfolded by the aforementioned hinge structure, A first part and a second part are connected to the hinge structure, and when folded, they face each other and come into close proximity, and when unfolded, they are separated from each other, A first circuit board arranged in the first part, A second circuit board is arranged in the second part, The circuit board comprises a flexible circuit board that electrically connects the first circuit board and the second circuit board, The aforementioned flexible circuit board is A first region that bends in response to the folding or unfolding of an electronic device, A second region located around the first region, The second region does not bend in response to the folding or unfolding of the electronic device. The first region and the second region are formed with different thicknesses. The first region includes a single signal wiring layer, The electronic device is characterized in that the second region includes a plurality of signal wiring layers.

2. The single signal wiring layer is This includes the main RF (radio frequency) signal wiring and the main ground wiring. The electronic device according to claim 1, characterized in that the main RF signal wiring and the main ground wiring are arranged on the same layer.

3. The aforementioned plurality of signal wiring layers are A first signal wiring layer including a first FCCL (flexible copper clad laminate) conductive layer on which a plurality of first RF signal wirings and a plurality of first ground wirings are formed, A second signal wiring layer including a second FCCL conductive layer on which multiple second RF signal wirings and multiple second ground wirings are formed, The electronic device according to claim 2, further comprising a third signal wiring layer including a third FCCL conductive layer on which a plurality of third RF signal wirings and a plurality of third ground wirings are formed.

4. The plurality of first RF signal lines and the plurality of first ground lines are arranged on the same layer. The plurality of second RF signal lines and the plurality of second ground lines are arranged on the same layer. The plurality of third RF signal lines and the plurality of third ground lines are arranged on the same layer. The electronic device according to claim 3, characterized in that the plurality of first RF signal lines, the plurality of second RF signal lines, and the plurality of third RF signal lines are arranged in different layers from each other.

5. The electronic device according to claim 4, characterized in that it includes at least one via that electrically connects the plurality of first ground wires, the plurality of second ground wires, and the plurality of third ground wires to the main ground wire.

6. The electronic device according to claim 4, characterized in that the single signal wiring layer and the second signal wiring layer are arranged on the same plane.

7. The first part is, A dielectric layer disposed on the single signal wiring layer, A first FCCL protective layer disposed on the dielectric layer, The electronic device according to claim 4, further comprising a first air gap formed between the dielectric layer and the first FCCL protective layer.

8. The first part is, A second FCCL protective layer is disposed below the single signal wiring layer, A third FCCL protective layer is positioned below the second FCCL protective layer, The electronic device according to claim 7, further comprising a second air gap formed between the second FCCL protective layer and the third FCCL protective layer.

9. The second part is, A first adhesive layer that bonds the first signal wiring layer and the second signal wiring layer, The electronic device according to claim 8, further comprising a second adhesive layer for bonding the second signal wiring layer and the third signal wiring layer.

10. The first signal wiring layer includes the first FCCL protective layer, which is located below the first FCCL conductive layer. The second signal wiring layer includes the second FCCL protective layer, which is located below the second FCCL conductive layer. The electronic device according to claim 9, characterized in that the third signal wiring layer includes the third FCCL protective layer disposed on the third FCCL conductive layer.

11. The electronic device according to claim 9, characterized in that at least a portion of the first air gap and the first adhesive layer are located on the same plane.

12. The electronic device according to claim 9, characterized in that at least a portion of the dielectric layer and the first adhesive layer are located on the same plane.

13. The electronic device according to claim 9, characterized in that at least a portion of the second air gap and the second adhesive layer are located on the same plane.

14. The first portion is formed by bonding one or more layers having a first thickness, The electronic device according to claim 1, characterized in that the second portion is formed having a second thickness greater than the first thickness.

15. The electronic device according to claim 14, characterized in that the first part overlaps with the hinge structure in at least a portion thereof.

16. The electronic device according to claim 1, wherein in a cross section along a first direction corresponding to the folding axis defined by the hinge structure, the first region includes the single signal wiring layer.

17. The electronic device according to claim 1, wherein in a cross section along a second direction perpendicular to the folding axis defined by the hinge structure, the single signal wiring layer includes a plurality of signal wires and at least one ground wire.

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