ring

Abstract

Offering rings with unprecedented and innovative designs. [Solution] Multiple layers 1a, 1b, 1c of different color tones are stacked in three or more layers in the width direction, the boundaries 2, 3 between the layers 1a, 1b, 1c of the precious metals are irregular wave-shaped curves 5a, 5b, and the width w of the intermediate precious metal layer 1b changes in the circumferential direction.

Description

Technical Field

[0001] The present invention relates to fingers In the circle and is related thereto.

Background Art

[0002] Conventionally, there has been known a multi-layered ring formed by superposing a plurality of rings made of precious metals having different color tones and integrally fixing them by brazing (for example, see Patent Document 1). In such a conventional multi-layered ring, the boundaries between the precious metal layers are straight lines, and the widths of each layer are constant, lacking in interest.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In view of the above-described circumstances, the present invention aims to provide a finger ring with a novel design never seen before. Ring and aims to provide it.

Means for Solving the Problems

[0005] In order to achieve the above object, the ring according to the invention described in claim 1 is characterized in that a plurality of precious metal layers having different color tones are laminated in three or more layers in the width direction, the boundaries between the precious metal layers are irregular wavy curves, and the width of the middle precious metal layer varies in the circumferential direction.

Effects of the Invention

[0006] The ring according to claim 1 has three or more layers of precious metals of different colors stacked in the width direction, the boundaries between the precious metal layers are irregular wave-shaped curves, and the width of the intermediate precious metal layers changes in the circumferential direction, thus providing a novel ring design unlike anything before. [Brief explanation of the drawing]

[0007] [Figure 1] This is a perspective view showing one embodiment of the ring of the present invention. [Figure 2-1] This is a perspective view showing the manufacturing process of the ring in sequence. [Figure 2-2] This is a perspective view showing the manufacturing process of the ring (continuation of Figure 2-1) in order. [Figure 3] This is an unfolded diagram of the wave-shaped curve that forms the boundary between the first and second layers. [Figure 4] This figure shows a magnified view of a portion of the unfolded diagram in Figure 3. [Figure 5] This is a diagram showing the process of processing the side surface of the first layer of ring material into a wave-shaped curved surface. [Figure 6] This is a front view showing the state when the side surface of the ring material is machined to form a wave-shaped curved surface. [Figure 7] This is a plan view showing the state when the side surface of a ring material is machined to form a wave-shaped curved surface. [Figure 8] This is a perspective view showing the first layer of ring material after the side surface has been machined into a wave-shaped curved surface. [Figure 9] This is a front view showing another example of a machining method used when cutting the side surface of a ring material into a wave-shaped curved surface. [Figure 10] Figure 9 is a perspective view showing the state after the side surface of the first layer of ring material has been processed into a wave-shaped curved surface according to the procedure. [Figure 11] (a) shows the machining curve of the side surface of the second layer of the first layer ring material, (b) is the same inverted with respect to the AB axis, and (c) is the same inverted again with respect to the CD axis, showing the machining curve of the side surface of the first layer of the second layer ring material. [Modes for carrying out the invention]

[0008] The embodiments of the present invention will be described below with reference to the drawings. Figure 1 shows one embodiment of the ring of the present invention. This ring has three layers 1a, 1b, and 1c stacked in the width direction. The bottom layer (hereinafter referred to as the first layer) 1a and the top layer (hereinafter referred to as the third layer) 1c are made of platinum, while the middle layer (hereinafter referred to as the second layer) 1b is made of gold, with the adjacent layers having different color tones. Furthermore, the boundary 2 between the first layer 1a and the second layer 1b, and the boundary 3 between the second layer 1b and the third layer 1c, are irregular, wave-like curves 5a and 5b. As a result, the width w of the second layer 1b changes in the circumferential direction. It should be noted that "irregular wave-like curves" differ from sine waves, which have a constant waveform that repeats periodically. Instead, they are wave-like curves with no regularity, where the curvature and period (length in the circumferential direction) of the wave portion change from time to time. Designers are free to decide what shape they want to create.

[0009] Next, the manufacturing method of this ring will be described. First, platinum and gold plates are punched out to form washer-shaped ring materials 4a, 4b, and 4c for the first, second, and third layers, as shown in Figure 2-1(a).

[0010] Next, as shown in Figure 2-1(b), the side surface of the ring material 4a for the first layer 1a that faces the second layer 1b is machined into a wave-shaped curved surface 6a. A machining program is created in advance for this process, following the procedure outlined below. Figure 3 shows a 360° unfolded view of the wave-shaped curve 5a that forms the boundary 2 between the first layer 1a and the second layer 1b, based on the ring design drawing created by the designer. In this unfolded view, as shown in the enlarged view of Figure 4, the processing program for the wave-shaped curve 5a is created by measuring the vertical displacement ΔY at 1° intervals. At the same time, as shown in Figure 3, the height difference Y between the highest point a and the lowest point b of the curve 5a is measured.

[0011] Figs. 6 and 7 show the state when the side surface of the ring material 4a for the first layer 1a is machined into a wavy curved surface 6a on the side of the second layer 1b. The processing machine for this machining has a spindle 7 provided in the front-rear direction and a work mounting shaft 8 provided in the vertical direction. The spindle 7 is one to which a tool 9 is attached and rotates at high speed, and it can be moved numerically controlled (NC) in the vertical direction, the left-right direction, and the front-rear direction. The tool 9 has a diamond cutting tip 10 attached to its tip, and the tip of the cutting tip 10 has a minute spherical shape. The ring material 4a is mounted on the work mounting shaft 8 with the surface to be machined facing upward, and rotates slowly around the central axis 11.

[0012] To explain the procedure during machining, first, the ring material 4a is mounted on the work mounting shaft 8. Next, the spindle 7 is positioned. As shown in Figs. 6 and 7, the positioning of the spindle 7 is such that when the tip of the cutting tip 10 comes to the lowest position, it is positioned so as to pass through the center between the inner circumference and the outer circumference on the left-right line passing through the center of the ring material 4a. After that, by moving the spindle 7 vertically in conjunction with slowly rotating the work mounting shaft 8 according to the previously created machining program, the side surface (upper surface) of the ring material 4a is machined into a desired wavy curved surface 6a. The maximum depth that can be cut in one cutting operation is limited to 0.1 mm. Assuming that the height difference Y between the highest point a and the lowest point b of the wavy curve 5a (see Fig. 3) is, for example, 1.7 mm, the cutting operation performed by moving the spindle 7 vertically while slowly rotating the work mounting shaft 8 is repeated 17 times with a cutting depth of 0.1 mm each, as shown in Fig. 5.

[0013] Next, as shown in Fig. 2-1(c), the side surface of the ring material 4b of the second layer 1b on the side of the first layer 1a is machined into a wavy curved surface 6a that matches the side surface of the first layer 1a on the side of the second layer 1b. This processing is carried out in the same way as when processing the ring material 4a of the first layer 1a described above. The ring material 4b is mounted on the work mounting shaft 8 of the processing machine with the surface to be cut facing upward, and based on the processing program, while slowly rotating the work mounting shaft 8, the main shaft 7 is moved up and down. As shown in Fig. 11, when processing the side surface of the second layer 1b on the first layer 1a side, the processing curve (wavy curve, Fig. 11(c)) needs to be in a form where the processing curve of the side surface of the first layer 1a on the second layer 1b side (Fig. 11(a)) is inverted with respect to the AB axis (Fig. 11(b)) and further inverted with respect to the CD axis. Therefore, the processing program at this time is obtained by reversing the ± of the ΔY value of the processing program for processing the side surface of the first layer 1a on the second layer 1b side made previously, and then reversing the arrangement of the ΔY values from 1 to 360°.

[0014] Next, as shown in Fig. 2-1(d), the ring material 4a of the first layer 1a and the ring material 4b of the second layer 1b are overlapped with the side surfaces cut into the wavy curved surface 6a being aligned. By marking the position of 0° on the outer peripheral surface of each ring material 4a, 4b during the cutting process, it becomes easier to align the side surfaces cut into the wavy curved surface 6a. By applying high temperature and high pressure to the overlapped ring materials 4a, 4b (so-called hot press), the side surfaces cut into the wavy curved surface 6a of each ring material 4a, 4b are firmly joined and integrated by diffusion bonding.

[0015] Next, as shown in Fig. 2-2(e), the side surface (upper surface) of the ring material 4b of the second layer 1b on the third layer 1c side is cut into the wavy curved surface 6b. This processing can be carried out in the same way as the processing of the side surface of the ring material 4a of the first layer 1a on the second layer 1b side described above. That is, by developing the wavy curve 5b (see Fig. 1) forming the boundary 3 between the second layer 1b and the third layer 1c to create a processing program (see Figs. 3 and 4), and then performing cutting processing on the processing machine based on that processing program.

[0016] Next, as shown in Figure 2-2(f), the side surface of the ring material 4c of the third layer 1c facing the second layer 1b is machined into a wave-shaped curved surface 6b that matches the side surface of the ring material 4b of the second layer 1b facing the third layer 1c. This machining can be performed in the same way as the machining of the side surface of the ring material 4b of the second layer 1b facing the first layer 1a, as described earlier.

[0017] Next, as shown in Figure 2-1(g), the ring materials 4a and 4b of the first and second layers 1a and 1b are joined together and the ring material 4c of the third layer 1c is superimposed with the sides that have been machined to form a wave-shaped curved surface 6b facing each other. By applying high temperature and pressure (so-called hot pressing) to the stacked ring materials 4a, 4b, and 4c, the sides of the wavy curved surfaces 6b of the ring materials 4b and 4c of the second layer 1b and third layer 1c are firmly joined together by diffusion bonding, becoming a single unit. While it is possible to perform diffusion bonding at the boundary 2 between the first layer 1a and the second layer 1b, and at the boundary 3 between the second layer 1b and the third layer 1c simultaneously, performing diffusion bonding each time a ring material 4b,4c is stacked, as described above, concentrates the pressure on one bonding surface, thus ensuring reliable bonding between the first layer 1a and the second layer 1b, and between the second layer 1b and the third layer 1c.

[0018] Subsequently, the ring materials 4a, 4b, and 4c of the first, second, and third layers are integrated and mounted on a lathe. The outer surface, inner surface, and both sides are then machined to create the ring shape shown in Figure 2-2(h).

[0019] Figure 9 shows another example of a machining method when cutting the side surface of the ring material 4a into a wave-shaped curved surface 6a. In the previously described example, when the tip of the cutting chip 10 was at its lowest point, the spindle 7 was positioned so that it passed through the center between the inner and outer circumferences on a left-right line passing through the center of the ring material 4a, and machining was performed. In this example, as shown in Figure 9(a), when the tip of the cutting chip 10 was at its lowest point, the spindle 7 was positioned closer to the inner circumference on a left-right line passing through the center of the ring material 4a, and machining was performed by slowly rotating the workpiece mounting axis 8 while moving the spindle 7 up and down according to the machining program. Next, as shown in Figure 9(b), when the tip of the cutting chip 10 was at its lowest point, the spindle 7 was positioned closer to the outer circumference on a left-right line passing through the center of the ring material 4a, and machining was performed by slowly rotating the workpiece mounting axis 8 while moving the spindle 7 up and down according to the machining program.

[0020] Figure 8 shows the state of the cut surface when the spindle 7 is positioned so that it passes through the center between the inner and outer circumferences on a line in the left-right direction passing through the center of the ring material 4a, as shown in Figures 6 and 7, when the tip of the cutting chip 10 is at its lowest point, and cutting is performed. Figure 10 shows the state of the cut surface when cutting is performed in two stages, one at a position closer to the inner circumference and the other closer to the outer circumference in the radial direction, as shown in Figure 9. As shown in Figures 6 and 7, when cutting is performed at the center position in the inner and outer circumference directions, a recess with the same radius R as the rotation radius R of the tool 9 (see Figure 6) is formed on the cutting surface, as shown in Figure 8. Note that in Figure 8, the size of R is shown smaller than it actually is for the sake of clarity, but in reality R is much larger, so the recess will be so small that it is not visible to the naked eye. As shown in Figure 9, by performing the cutting process in two stages—one closer to the inner circumference and the other closer to the outer circumference—the radial irregularities on the cut surface can be reduced, as shown in Figure 10. As the radial irregularities of the cut surface decrease, the gap at the joint surface becomes smaller when the cut sides of the wavy curved surfaces 6a and 6b of the ring materials 4a, 4b, and 4c are joined together, as shown in Figures 2-1(d) and 2-2(g). This makes diffusion bonding more likely to succeed and improves the yield.

[0021] As described above, this ring has three or more layers of precious metals 1a, 1b, and 1c with different color tones stacked in the width direction, and the boundaries 2 and 3 between the precious metal layers 1a, 1b, and 1c are irregular wave-like curves 5a and 5b, and the width w of the intermediate precious metal layer 1b changes in the circumferential direction (see Figure 1), so it is possible to offer a ring with an unprecedented and innovative design.

[0022] The manufacturing method for this ring involves preparing three or more washer-shaped ring materials 4a, 4b, and 4c made of precious metals of different colors, processing the sides of each ring material 4a, 4b, and 4c into interlocking irregular wave-shaped curved surfaces 6a and 6b, and then sequentially overlapping them and joining them together by diffusion bonding (see Figures 2-1 and 2-2), thereby providing a ring with an unprecedented and innovative design.

[0023] This ring manufacturing method involves performing diffusion bonding each time ring materials 4b and 4c are stacked, ensuring reliable bonding between the first layer 1a and the second layer 1b, and between the second layer 1b and the third layer 1c. This makes it easy to manufacture rings in which layers 1a, 1b, and 1c of precious metals with different color tones are laminated in the width direction in three or more layers.

[0024] The manufacturing method for this ring involves unfolding the desired irregular wave-shaped curves 5a and 5b that form the boundaries 2 and 3 between the precious metal layers 1a, 1b, and 1c in a 360° manner, and while rotating the washer-shaped ring materials 4a, 4b, and 4c around the center, moving the tool 9 in and out along the unfolded wave-shaped curves 5a and 5b on the sides of the ring materials 4a, 4b, and 4c, thereby cutting the sides of the ring materials 4a, 4b, and 4c into irregular wave-shaped curved surfaces 6a and 6b (see Figures 3, 4, 6, and 7). This makes it possible to create arbitrary irregular wave-shaped curves 5a and 5b at the boundaries 2 and 3 between the precious metal layers 1a, 1b, and 1c, and to provide a ring with a rich design. Furthermore, by shifting the tip of the cutting tool (cutting tip) 10 radially across the ring materials 4a, 4b, and 4c and performing the cutting process in multiple steps (see Figure 9), the radial irregularities of the cutting surface can be reduced (see Figure 10). This reduces the gap at the joint surface when the cut sides are joined together on the wave-shaped curved surfaces 6a and 6b of the ring materials 4a, 4b, and 4c, making diffusion bonding more likely to succeed and improving yield.

[0025] The present invention is not limited to the embodiments described above. The ring of the present invention may also be made of four or more layers of precious metal laminated in the width direction. The irregular, wave-like curved shape of the boundaries between layers can be arbitrarily set. The specific method for processing the side surface of the ring material into a wave-like curved surface is not particularly limited and can be done by any method. [Explanation of Symbols]

[0026] 1a. First layer (layer of precious metals) 1b. Second layer (layer of precious metals) 1c Third layer (layer of precious metals) 2. The boundary between the first and second layers 3. The boundary between the second and third layers 4a, 4b, 4c Ring material 5a, 5b Wavy curve 6a, 6b Wave-shaped curved surface

Claims

[Claim 1] A ring characterized by having three or more layers of precious metals of different colors stacked in the width direction, with irregular, wave-like curves at the boundaries between the precious metal layers, and the width of the intermediate precious metal layers changing in the circumferential direction.

Images