Control methods, exposure apparatus, exposure system, and article manufacturing methods

Abstract

To provide technology advantageous in a point of man-hours regarding adjustment of parameters when a copied job is reused.SOLUTION: A management method for managing an exposure job in an exposure device for exposing a substrate comprises: receiving, from other exposure device, an exposure job containing a first parameter that depends on device characteristics of the other exposure device, and a second parameter that does not depend on the device characteristics but depends on a process; calculating a third parameter that depends on the device characteristics of the exposure device, based on distortion data of an entire region of an exposable region by the predetermined exposure device; and obtaining an exposure job that is used in the exposure device by substituting the first parameter in the received exposure job with the third parameter.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a management method, an exposure apparatus, an exposure system, and an article manufacturing method.

Background Art

[0002] In a lithography process, which is a manufacturing process for semiconductor devices, flat panel displays, etc., an exposure apparatus that transfers a pattern of a reticle onto a substrate is used. When producing one product, the exposure apparatus exposes a plurality of patterns of reticles in multiple layers. Alignment marks used when exposing patterns in layers are arranged on the reticle. Before exposure, the alignment marks are measured to measure the amount of misalignment in the overlay, and exposure is performed after aligning the positions. When performing exposure, the lithography process is carried out according to a job, which is data including a number of parameters necessary for exposure. When using an exposure apparatus, overlay-related parameters used in overlay exposure for each device or layer to be manufactured are adjusted. In the adjustment of parameters, the amount of misalignment of the alignment marks formed on the exposed mask pattern is measured with a length measuring instrument, and correction amounts such as shift, magnification, and rotation are calculated based on the result, and reflected in the parameters of the job.

[0003] A job created for one exposure apparatus can be copied and used in other exposure apparatuses. However, since the adjustment offsets are different due to differences in device characteristics, even for a job adjusted as described above, in other exposure apparatuses, it is necessary to readjust the overlay-related parameters again, which takes time until production starts.

[0004] Patent Document 1 discloses a method that eliminates the need for readjustment by obtaining in advance the offset of common parameters between apparatuses and correcting the common parameters using the offset obtained in advance in other exposure apparatuses that execute the copied job.

Prior Art Documents

Patent Documents

[0005] [Patent Document 1] Japanese Patent Publication No. 2016-157877 [Overview of the Initiative] [Problems that the invention aims to solve]

[0006] However, the method disclosed in Patent Document 1 requires obtaining offsets for all exposure equipment each time the number of devices to be manufactured increases, and the effort required to obtain the offsets increases accordingly as the number of device types and exposure equipment increases.

[0007] The present invention provides a technique that is advantageous in terms of man-hours for adjusting parameters when reusing copied jobs. [Means for solving the problem]

[0008] According to one aspect of the present invention, a management method for managing exposure jobs in an exposure apparatus for exposing a substrate is provided, comprising the steps of: receiving an exposure job from another exposure apparatus, which includes a first parameter that depends on the apparatus characteristics of the other exposure apparatus and a second parameter that does not depend on the apparatus characteristics but depends on the process; calculating a third parameter that depends on the apparatus characteristics of the exposure apparatus based on distortion data of the entire area that can be exposed by the exposure apparatus obtained in advance; and obtaining an exposure job to be used in the exposure apparatus by replacing the first parameter in the received exposure job with the third parameter. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a technique that is advantageous in terms of man-hours for adjusting parameters when reusing a copied job. [Brief explanation of the drawing]

[0010] [Figure 1] A diagram showing the configuration of an exposure apparatus. [Figure 2] A diagram showing the configuration of the exposure system. [Figure 3] A diagram showing an example of the structure of parameters that make up a job. [Figure 4] A flowchart illustrating the steps involved in the management process. [Figure 5] A diagram illustrating the process of acquiring distortion data. [Figure 6] A diagram showing an example of the structure of distortion data. [Figure 7] A diagram illustrating alignment measurement marks and distortion measurement marks in the exposure area. [Modes for carrying out the invention]

[0011] The embodiments will be described in detail below with reference to the attached drawings. Note that the following embodiments do not limit the invention as defined in the claims. While the embodiments describe multiple features, not all of these features are essential to the invention, and the features may be combined in any way. Furthermore, in the attached drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0012] <First Embodiment> The configuration of the exposure apparatus in this embodiment will now be described. The exposure apparatus in this embodiment is a lithography apparatus used in the photolithography process, which is a manufacturing process for devices such as semiconductor devices and flat panel displays. The exposure apparatus in this embodiment projects a pattern formed on a master plate onto a substrate via a projection optical system and performs an exposure process to transfer the pattern onto the substrate.

[0013] Figure 1 is a schematic diagram of the exposure apparatus 100 in this embodiment. In this specification and drawings, directions are indicated in an XYZ coordinate system where the horizontal plane is the XY plane. The substrate stage 5, described later, holds the substrate 6 so that its surface is parallel to the horizontal plane (XY plane). Therefore, below, the directions that are orthogonal to each other in the plane along the substrate holding surface of the substrate stage 5 are defined as the X axis and Y axis, and the direction perpendicular to the X axis and Y axis is defined as the Z axis. Also, below, the directions parallel to the X axis, Y axis and Z axis in the XYZ coordinate system are referred to as the X direction, Y direction and Z direction, respectively. The scanning direction of the master plate 3 and substrate 6 during exposure is the Y direction, and the non-scanning direction is the X direction. Furthermore, rotation around the X axis, rotation around the Y axis and rotation around the Z axis are expressed as θX, θY, and θZ, respectively.

[0014] The exposure apparatus 100 includes an illumination optical system 1, a master plate stage 2, a projection optical system 4, a substrate stage 5, an alignment detection system 7, a focus detection system 8, a control unit 10, an X-shade plate 14, a Y-shade plate 15, and an operation unit 16. The master plate stage 2 holds the master plate 3 and is driveable in the X, Y, and θZ directions. The substrate stage 5 holds the substrate 6 and is driveable in the X, Y, Z, θX, θY, and θZ directions.

[0015] The projection optical system 4 projects the pattern of the master plate 3, held by the master plate stage 2, onto the substrate 6, held by the substrate stage 5, using the illumination optical system 1. The master plate 3 is positioned at the object plane of the projection optical system 4, and the substrate 6 is positioned at the image plane of the projection optical system 4. The pattern of the master plate 3 to be projected is projected onto the substrate 6 through the light-passing regions formed by the X-shade plate 14 and the Y-shade plate 15. The pattern of the master plate 3, illuminated by the illumination optical system 1, is imaged onto the substrate 6 while being reflected in the order of the plane mirror 11, concave mirror 12, convex mirror 13, concave mirror 12, and plane mirror 11 of the projection optical system 4. In this embodiment, the projection optical system 4 may be a 1:1 projection optical system that projects the pattern of the master plate 3 onto the substrate 6 at 1:1 magnification, or it may be a magnification projection optical system or a reduction projection optical system.

[0016] The alignment detection system 7 is a microscope that measures marks for alignment purposes, and detects the position information of the alignment mark 3a on the original plate 3 and the alignment mark 6a on the substrate 6 within the XY plane. Also, since the arrangement relationship of the alignment marks varies depending on the pattern drawn on the original plate 3, the alignment detection system 7 can be driven in the X direction and the Y direction within the range of the exposure light irradiation area of the projection optical system 4.

[0017] The focus detection system 8 detects the position of the surface of the substrate 6 with respect to the projection optical system 4 in the optical axis direction of the projection optical system 4. The focus detection system 8 measures the position of the substrate in the Z direction by emitting a light beam onto the substrate 6 and detecting the reflected light.

[0018] The control unit 10 includes a CPU, a memory, and a storage unit (not shown), and performs control of the entire exposure apparatus 100 and arithmetic processing such as correction parameters. The operation unit 16 has a user interface for receiving instructions from an operator, receives instructions via an input device or the like, and performs setting of parameters used in the exposure apparatus and device operations. In setting the parameters, operations such as creating, copying, and editing a job in which a plurality of parameters are stored, parameters depending on the device characteristics, and parameters defining the operation of the exposure apparatus are performed.

[0019] FIG. 2 shows an example of an exposure system constructed in a production factory of semiconductor devices or flat panel displays. The exposure system may include a plurality of exposure apparatuses EX1, EX2, EX3, EX4. There may be cases where different original plates are mounted on each exposure apparatus to produce different products, or cases where the same original plate is used to produce the same product. The exposure apparatuses are communicably connected via the LAN 20, and it is possible to transmit and receive data such as copying jobs between the apparatuses. Also, a host server (not shown) may be configured to perform operations such as information collection of the exposure apparatus, device status monitoring, and job input via the LAN 20.

[0020] The exposure process can be executed according to an exposure job (hereinafter simply referred to as "job"). A job is an execution command for exposure and can include various parameters. Assume that the data format of a job is predetermined so that jobs can be handled commonly by each exposure apparatus. FIG. 3(a) shows an example of the structure of parameters constituting an exposure job. The parameters constituting an exposure job can include a first parameter that depends on the apparatus characteristics of the exposure apparatus and a second parameter that does not depend on the apparatus characteristics, such as information on the device to be produced, exposure conditions, or adjustment offsets depending on the process. For example, the distortion generated by the projection optical system 4 depends on the apparatus because the curved shape generated for each apparatus is different. Measurement value offsets at alignment points calculated using distortion data to correct the distortion, and drive parameters of the substrate stage 5 and optical components are included in the first parameter as parameters that depend on the apparatus characteristics. On the other hand, information on the exposure area, information on the alignment measurement position, exposure conditions such as the exposure amount, and offsets for adjusting the overlay calculated from the result of exposure are parameters that depend on the process and do not depend on the apparatus characteristics, and thus are included in the second parameter.

[0021] Next, referring to the flowchart of FIG. 4, a management method for managing a job related to the exposure process in the present embodiment will be described. Here, a case where a job is copied and used between the exposure apparatus EX1 (first exposure apparatus) and the exposure apparatus EX2 (second exposure apparatus) of FIG. 2 will be described as an example.

[0022] In S400, in each of the exposure devices EX1 and EX2, the control unit 10 acquires distortion data for the entire exposure area that can be exposed by scanning exposure. As shown in Figure 5(a), distortion measurement marks M1-1 to M5-7 are arranged at regular intervals on the master plate 3. By projecting the pattern of this master plate 3 onto the substrate 6 and measuring the amount of displacement of each mark M1-1 to M5-7 using an optical microscope such as a length measuring instrument, distortion data can be obtained. As one specific example, the measurement of mark M1-1 will be explained with reference to Figure 5(b). In Figure 5(b), the dashed frame indicates the design position of mark M1-1. If no displacement due to distortion occurs, ideally mark M1-1 will be exposed at the position of the dashed line, but in reality, it is exposed at the position of the solid line and displacement occurs. In this case, if the XY position of the dashed line is (X, Y) and the XY position of the solid line is (X', Y'), the displacement amounts Dx and Dy of mark M1-1 are given by the following equations.

[0023] Dx = X - X' Dy = Y - Y' ... Equation 1

[0024] By measuring each of the exposed distortion measurement marks M1-1 to M5-7 with a length measuring instrument, the displacement amounts Dx and Dy for each mark are measured. Figure 6 shows an example of the structure of distortion data summarizing the measurement results for each mark measured with the length measuring instrument. The distortion data for each of the marks M1-1 to M5-7 includes the design position X300, position Y301, and the X component Dx302 and Y component Dy303 of the displacement amount.

[0025] In the S400, distortion is measured using both the exposure unit EX1 and the exposure unit EX2 to create distortion data, which is then stored in the memory of each exposure unit.

[0026] In S401, the control unit 10 of the exposure apparatus EX1 generates a new job. The control unit 10 sets parameters such as exposure area information, alignment measurement position information, and exposure conditions of the master plate 3 according to the device information to be produced, and this information is included in the job.

[0027] In S402, the control unit 10 of the exposure apparatus EX1 calculates a first parameter that depends on the apparatus characteristics based on the distortion data of the exposure apparatus EX1 acquired in S400. Since the effect of distortion on the exposed image varies depending on the exposure area of ​​the master plate 3 used in the job, the first parameter is calculated based on the distortion data acquired in S400, taking into account the exposure area set for the job.

[0028] Figure 7(a) shows the relationship between the exposure area EA of the master plate 3 and the alignment measurement mark placement information set for the job. The exposure area EA on the master plate 3 is an exposure area formed by placing a drivable X-shade plate 14 and a Y-shade plate 15 in the exposure area to block light from areas that are not to be exposed. The exposure area EA is defined with respect to the center of the master plate 3, with the left area width being L and the right area width being R in the X direction. Similarly, with respect to the Y direction, the front area width is defined as F and the back area width is defined as B. These defined areas are blocked by the X-shade plate 14 and the Y-shade plate 15 and exposed. The positions of the alignment measurement marks P1L / P1R, P2L / P2R, and P3L / P3R are also defined.

[0029] Figure 7(b) shows the distortion measurement marks included in the exposure region EA of Figure 7(a). The exposure region EA includes distortion measurement marks M2-3 to M4-7. The control unit 10 obtains the displacement amounts Dx and Dy of the distortion measurement marks from the distortion data shown in Figure 6 and calculates the first device-dependent parameter in the exposure apparatus EX1.

[0030] In one example, an objective function is defined to minimize the correction residual of distortion measurement marks M2-3 to M4-7 included in the exposure area EA, based on the correction characteristics of units used for distortion correction of substrate stage 5 and optical components mounted on the exposure apparatus. The control unit 10 can calculate the first parameter using this objective function. The correction component of the substrate stage 5 includes X-shift changes, Y-shift changes, rotational changes, etc., during scanning drive. The correction component of the optical component includes X-magnification changes, Y-magnification changes, etc., during scanning drive. Each correction component calculated by optimization using the objective function is converted into a measurement offset for each alignment point, or a drive parameter for each scanning area separated by alignment points, and stored as the first parameter of the generated job.

[0031] In S403, the control unit 10 of the exposure apparatus EX1 performs exposure processing according to the generated job. The exposure result is measured by a length measuring instrument, and the control unit 10 determines the displacement amounts Dx and Dy based on the measurement result. Using the determined displacement amounts Dx and Dy, the control unit 10 defines an objective function that minimizes the corrected residual, similar to S402. From each correction component calculated after optimizing this objective function, the control unit 10 calculates an offset for adjusting the overlay. Since this offset is classified as a process-dependent component, it is stored as the second parameter of the generated job.

[0032] In S404, the control unit 10 of the exposure apparatus EX1 transfers a copy of the job generated in S401 to S403 to the exposure apparatus EX2 via the LAN 20, as shown in Figures 3(a) and (b). If the exposure apparatus EX1 and exposure apparatus EX2 are not connected via the LAN 20, a recording medium or memory medium may be used to transfer the copy of the job.

[0033] In S405, the control unit 10 of the exposure device EX2 calculates a third parameter that depends on the device characteristics from the distortion data of the exposure device EX2 acquired in S400. Similar to S402, the control unit 10 of the exposure device EX2 determines distortion measurement marks based on the information of the exposure area EA set in the job. For example, the control unit 10 of the exposure device EX2 determines a distortion measurement mark of interest from among several distortion measurement marks based on the information of the exposure area set in the job received from the exposure device EX1 (another exposure device). The control unit 10 of the exposure device EX2 calculates a third parameter based on the amount of deviation relative to the determined distortion measurement mark obtained from the distortion data. Subsequently, the control unit 10 of the exposure device EX2 calculates the device-dependent third parameter in the exposure device EX2 by finding each correction component that minimizes the correction residual using the amount of deviation Dx and Dy for each determined distortion measurement mark.

[0034] In S406, the control unit 10 of the exposure apparatus EX2 replaces the first parameter included in the copy of the job received in S404 with the calculated third parameter, as shown in Figures 3(b) and (c). Therefore, at this point, the job includes a third parameter that depends on the apparatus characteristics calculated based on the distortion data of the exposure apparatus EX2, and a second parameter that includes an offset for adjusting the overlay (see Figure 3(c)). The step S405 for calculating the third parameter may be performed in response to the receipt of a job, an instruction to change the job settings, or an instruction to execute the exposure process according to the job.

[0035] In S407, the control unit 10 of the exposure device EX2 performs the exposure process according to the job adjusted (rewritten) in S406. As described above, the job received from the exposure device EX1 in S404 is adjusted to include a third parameter that depends on the device characteristics of the exposure device EX2, which was calculated in S405, and a second parameter that depends on the process and does not depend on the device characteristics. Therefore, in the exposure process in S407, the third parameter that depends on the device characteristics of the exposure device EX2, which was calculated in S405, is used. On the other hand, the second parameter, which includes the offset adjusted in the exposure device EX1, can be used as is in the exposure device EX2. Therefore, the exposure device EX2 can perform exposure without readjusting the offset for overlay.

[0036] According to this embodiment, since the offset, which depends on the characteristics of each device, is calculated from the distortion data acquired in S400, it is not necessary to acquire offsets between devices even if the number of devices manufactured or the number of exposure devices increases.

[0037] While the above explanation focused on distortion, it is also possible to adjust parameters such as focus and exposure conditions in a similar manner.

[0038] <Embodiment for manufacturing an article> A method for manufacturing an article according to an embodiment of the present invention is suitable, for example, for manufacturing a flat panel display (FPD). The method for manufacturing an article according to this embodiment includes the steps of forming a latent image pattern on a photosensitive agent coated on a substrate using the above-described exposure apparatus (a step of exposing the substrate), and developing the substrate on which the latent image pattern was formed in the above step. Furthermore, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to this embodiment is advantageous over conventional methods in at least one of the performance, quality, productivity, and production cost of the article.

[0039] The disclosures herein include at least the following control methods, exposure apparatus, exposure systems, and methods for manufacturing articles. (Item 1) A management method for managing exposure jobs in an exposure apparatus that exposes substrates, A step of receiving an exposure job from another exposure apparatus, which includes a first parameter that depends on the apparatus characteristics of the other exposure apparatus and a second parameter that does not depend on the apparatus characteristics but depends on the process, A step of calculating a third parameter that depends on the device characteristics of the exposure apparatus, based on distortion data of the entire area that can be exposed by the exposure apparatus obtained in advance, A step of obtaining an exposure job to be used in the exposure apparatus by replacing the first parameter in the received exposure job with the third parameter, A management method characterized by having the following. (Item 2) The control method according to item 1, further comprising the step of measuring distortion over the entire area of ​​the region that can be exposed by the exposure apparatus and acquiring the distortion data. (Item 3) The process of measuring the aforementioned distortion is as follows: The process involves projecting a pattern of a master plate, in which multiple distortion measurement marks are arranged across the entire area of ​​the exposureable region, onto a substrate via a projection optical system, and measuring the position of each of the multiple distortion measurement marks projected onto the substrate. A step of including information on the amount of deviation of the measured position from the design position for each of the plurality of distortion measurement marks in the distortion data, The management method described in item 2, characterized by including the following: (Item 4) The process for calculating the third parameter is as follows: A step of determining a distortion measurement mark of interest from among the plurality of distortion measurement marks based on the exposure area information set in the received exposure job, A step of calculating the third parameter based on the amount of deviation relative to the determined distortion measurement mark obtained from the distortion data, The management method described in item 3, characterized by including the following: (Item 5) The control method according to any one of items 1 to 4, characterized in that the first parameter and the third parameter, which depend on the characteristics of the apparatus, include at least one of the following: a measurement value offset calculated using the distortion data, a drive parameter for the substrate stage, and a drive parameter for the optical components constituting the projection optical system. (Item 6) The control method according to any one of items 1 to 5, characterized in that the second parameter dependent on the process includes at least one of the following: information on the exposure area, information on the alignment measurement position, exposure conditions, and an offset for adjusting the overlay. (Item 7) The management method according to any one of items 1 to 6, characterized in that the step of calculating the third parameter is performed in response to receiving the exposure job, an instruction to change the settings of the exposure job, or an instruction to execute an exposure process according to the exposure job. (Item 8) A management method for managing exposure jobs in an exposure system including a first exposure apparatus and a second exposure apparatus, In the above exposure apparatus, A step of calculating a first parameter that depends on the device characteristics of the first exposure apparatus based on distortion data of the entire area that can be exposed by the first exposure apparatus obtained in advance, A step of generating an exposure job including the first parameter, A step of exposing a substrate according to the generated exposure job, A step of calculating a second parameter that is process-dependent and independent of the apparatus characteristics based on the exposure results, and including the second parameter in the exposure job, A step of transferring the exposure job to the second exposure apparatus, In the previous exposure apparatus, A step of calculating a third parameter that depends on the device characteristics of the second exposure apparatus based on distortion data of the entire area that can be exposed by the second exposure apparatus obtained in advance, A step of obtaining an exposure job to be used in the second exposure apparatus by replacing the first parameter in the exposure job received from the first exposure apparatus with the third parameter, A management method characterized by having the following. (Item 9) An exposure apparatus for exposing a substrate, Receiving an exposure job from another exposure apparatus, which includes a first parameter that depends on the apparatus characteristics of the other exposure apparatus and a second parameter that does not depend on the apparatus characteristics but depends on the process, Based on the distortion data of the entire area that can be exposed by the exposure apparatus obtained in advance, a third parameter that depends on the apparatus characteristics of the exposure apparatus is calculated. By replacing the first parameter in the received exposure job with the third parameter, an exposure job to be used in the exposure apparatus is obtained. An exposure apparatus characterized by the following features. (Item 10) An exposure system including a first exposure apparatus and a second exposure apparatus, The first exposure apparatus, Based on distortion data obtained in advance for the entire area that can be exposed by the first exposure apparatus, a first parameter dependent on the apparatus characteristics of the first exposure apparatus is calculated. An exposure job including the first parameter is generated, The substrate is exposed according to the generated exposure job, Based on the exposure results, a second parameter that is process-dependent and independent of the apparatus characteristics is calculated, and this second parameter is included in the exposure job. The exposure job is transferred to the second exposure apparatus. The second exposure apparatus, Based on the distortion data obtained in advance for the entire area that can be exposed by the second exposure apparatus, a third parameter that depends on the apparatus characteristics of the second exposure apparatus is calculated. By replacing the first parameter in the exposure job received from the first exposure apparatus with the third parameter, an exposure job for use in the second exposure apparatus is obtained. An exposure system characterized by the following: (Item 11) A step of exposing a substrate according to an exposure job obtained by any one of the control methods described in item 1 to 8, The process of developing the exposed substrate, A method for manufacturing an article, characterized by including a developed substrate and manufacturing an article from the developed substrate.

[0040] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention. [Explanation of Symbols]

[0041] 1: Illumination optical system, 2: Master plate stage, 3: Master plate, 4: Projection optical system, 5: Substrate stage, 6: Substrate, 7: Alignment detection system, 8: Focus detection system, 10: Control unit, 100: Exposure apparatus

Claims

1. A management method for managing exposure jobs in an exposure apparatus that exposes a substrate, A step of receiving an exposure job from another exposure apparatus, which includes a first parameter that depends on the apparatus characteristics of the other exposure apparatus and a second parameter that does not depend on the apparatus characteristics but depends on the process, A step of calculating a third parameter that depends on the device characteristics of the exposure apparatus, based on distortion data of the entire area that can be exposed by the exposure apparatus obtained in advance, A step of obtaining an exposure job to be used in the exposure apparatus by replacing the first parameter in the received exposure job with the third parameter, A management method characterized by having the following features.

2. The control method according to claim 1, further comprising the step of measuring distortion over the entire area of ​​the region that can be exposed by the exposure apparatus and acquiring the distortion data.

3. The process of measuring the aforementioned distortion is as follows: The process involves projecting a pattern of a master plate, in which multiple distortion measurement marks are arranged across the entire area of ​​the exposureable region, onto a substrate via a projection optical system, and measuring the position of each of the multiple distortion measurement marks projected onto the substrate. A step of including information on the amount of deviation of the measured position from the design position for each of the plurality of distortion measurement marks in the distortion data, The management method according to claim 2, characterized by including the following:

4. The process for calculating the third parameter is as follows: A step of determining a distortion measurement mark of interest from among the plurality of distortion measurement marks based on the exposure area information set in the received exposure job, A step of calculating the third parameter based on the amount of deviation relative to the determined distortion measurement mark obtained from the distortion data, The management method according to claim 3, which includes the following:

5. The control method according to claim 1, characterized in that the first parameter and the third parameter, which depend on the characteristics of the apparatus, include at least one of the following: a measurement value offset calculated using the distortion data, a drive parameter for the substrate stage, and a drive parameter for the optical components constituting the projection optical system.

6. The control method according to claim 1, characterized in that the second parameter, which depends on the process, includes at least one of the following: information on the exposure area, information on the alignment measurement position, exposure conditions, and an offset for adjusting the overlay.

7. The management method according to claim 1, characterized in that the step of calculating the third parameter is performed in response to any of the following: receiving the exposure job, an instruction to change the settings of the exposure job, or an instruction to execute an exposure process according to the exposure job.

8. A management method for managing exposure jobs in an exposure system including a first exposure apparatus and a second exposure apparatus, In the first exposure apparatus, A step of calculating a first parameter that depends on the device characteristics of the first exposure apparatus based on distortion data of the entire area that can be exposed by the first exposure apparatus obtained in advance, A step of generating an exposure job including the first parameter, A step of exposing a substrate according to the generated exposure job, A step of calculating a second parameter that is process-dependent and independent of the apparatus characteristics based on the exposure results, and including the second parameter in the exposure job, A step of transferring the exposure job to the second exposure apparatus, In the above-mentioned second exposure apparatus, A step of calculating a third parameter that depends on the device characteristics of the second exposure apparatus based on distortion data of the entire area that can be exposed by the second exposure apparatus obtained in advance, A step of obtaining an exposure job to be used in the second exposure apparatus by replacing the first parameter in the exposure job received from the first exposure apparatus with the third parameter, A management method characterized by having the following features.

9. An exposure apparatus for exposing a substrate, Receiving an exposure job from another exposure apparatus, which includes a first parameter that depends on the apparatus characteristics of the other exposure apparatus and a second parameter that does not depend on the apparatus characteristics but depends on the process, Based on distortion data obtained in advance for the entire area that can be exposed by the exposure apparatus, a third parameter dependent on the apparatus characteristics of the exposure apparatus is calculated. By replacing the first parameter in the received exposure job with the third parameter, an exposure job for use in the exposure apparatus is obtained. An exposure apparatus characterized by the following features.

10. An exposure system including a first exposure apparatus and a second exposure apparatus, The first exposure apparatus, Based on distortion data obtained in advance for the entire area that can be exposed by the first exposure apparatus, a first parameter that depends on the apparatus characteristics of the first exposure apparatus is calculated. An exposure job including the first parameter is generated, The substrate is exposed according to the generated exposure job, Based on the exposure results, a second parameter that is process-dependent and independent of the apparatus characteristics is calculated, and this second parameter is included in the exposure job. The exposure job is transferred to the second exposure apparatus. The second exposure apparatus, Based on the distortion data of the entire area that can be exposed by the second exposure apparatus obtained in advance, a third parameter that depends on the apparatus characteristics of the second exposure apparatus is calculated. By replacing the first parameter in the exposure job received from the first exposure apparatus with the third parameter, an exposure job for use in the second exposure apparatus is obtained. An exposure system characterized by the following:

11. A step of exposing a substrate according to an exposure job obtained by the control method described in any one of claims 1 to 8, The process of developing the exposed substrate, A method for manufacturing an article, characterized by including a developed substrate and manufacturing an article from the developed substrate.

Images