Resin molding apparatus and method for manufacturing resin molded products

Abstract

To provide a resin molding device and a manufacturing method of a resin molded article, which are capable of suppressing occurrence of a defect that may be caused by continuing compression molding when an electronic component falls from a substrate.SOLUTION: A resin molding device performs compression molding. The resin molding device includes: a mold; a mold clamping mechanism; and a sensor. The mold includes: an upper mold and a lower mold opposed to the upper mold. The mold clamping mechanism clamps the mold. The mold clamping is performed in a state where a molding object is disposed on the lower surface of the upper mold and the resin is disposed on the upper surface of a lower mold. The molded object includes a substrate and a plurality of electronic components disposed on the substrate. In a state in which the molded object is disposed on the lower surface of the upper mold, each of the plurality of electronic components is located below the substrate. The sensor detects that at least a part of the plurality of electronic components falls downward from the substrate in a state in which the molded object is disposed on the lower surface of the upper mold.SELECTED DRAWING: Figure 1

Description

Technical Field

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[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

Background Art

[0002] Japanese Unexamined Patent Application Publication No. 2023-3677 (Patent Document 1) discloses a compression molding apparatus. This compression molding apparatus performs resin encapsulation molding of a workpiece by using a sealing mold including an upper mold and a lower mold. The workpiece includes a base material and an electronic component disposed on the base material. In this compression molding apparatus, the workpiece is held on the lower surface of the upper mold. With the workpiece held on the lower surface of the upper mold, the electronic component is positioned below the base material (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the compression molding apparatus disclosed in Patent Document 1 above, for example, there is a possibility that the electronic component may fall from the base material. For example, if compression molding is performed with the electronic component in a state of having fallen onto the lower mold, problems such as damage to the lower mold or the base material may occur.

[0005] The present invention has been made to solve such problems, and an object thereof is to provide a resin molding apparatus provided with a configuration for preventing the occurrence of problems that may occur when compression molding continues when an electronic component falls from a substrate, and a method for manufacturing a resin molded product using the resin molding apparatus.

Means for Solving the Problems

[0006] A resin molding apparatus according to a certain aspect of the present invention performs compression molding. This resin molding apparatus comprises a mold, a clamping mechanism, and a sensor. The mold includes an upper mold and a lower mold facing the upper mold. The clamping mechanism clamps the mold. Clamping is performed with the object to be molded placed on the lower surface of the upper mold and resin placed on the upper surface of the lower mold. The object to be molded includes a substrate and a plurality of electronic components placed on the substrate. With the object to be molded placed on the lower surface of the upper mold, each of the plurality of electronic components is located below the substrate. The sensor detects that at least a portion of the plurality of electronic components has fallen downward from the substrate with the object to be molded placed on the lower surface of the upper mold.

[0007] A method for manufacturing a resin molded product according to another aspect of the present invention uses the resin molding apparatus described above. This method for manufacturing a resin molded product includes placing the object to be molded on the lower surface of the upper mold, placing resin on the upper surface of the lower mold, and clamping the mold. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a resin molding apparatus equipped with a configuration for preventing defects that may occur when compression molding continues when an electronic component falls from the substrate, and a method for manufacturing a resin molded product using the resin molding apparatus. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic diagram showing the plan view of a resin molding apparatus. [Figure 2] This diagram schematically shows a portion of the surface of the resin molded part. [Figure 3] This figure schematically shows a portion of the III-III section in Figure 2. [Figure 4] This figure schematically shows a portion of the IV-IV section in Figure 2. [Figure 5] This figure schematically shows a portion of the VV cross-section in Figure 2. [Figure 6] This figure schematically shows a portion of the VI-VI section in Figure 4. [Figure 7]This diagram schematically shows an example of an optical path extending in the left-right direction. [Figure 8] This figure schematically shows the VIII-VIII section of Figure 2. [Figure 9] This flowchart shows the basic operating procedure of a resin molding machine. [Figure 10] This flowchart shows the procedure for starting and stopping the detection of electronic component drops. [Figure 11] This is a flowchart showing the procedure for detecting when an electronic component has fallen. [Modes for carrying out the invention]

[0010] Hereinafter, an embodiment relating to one aspect of the present invention (hereinafter also referred to as "this embodiment") will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated. Furthermore, each drawing is schematically depicted with parts omitted or exaggerated as appropriate for ease of understanding. In addition, the directions indicated by arrows U, D, F, B, L, and R in each drawing will be defined as the upward direction, downward direction, forward direction, backward direction, left direction, and right direction, respectively, and will be described accordingly.

[0011] [1. Configuration of the resin molding apparatus] <1-1. Overall configuration of the resin molding apparatus> Figure 1 is a schematic diagram showing the plan view of a resin molding apparatus 1 according to this embodiment. The resin molding apparatus 1 is configured to manufacture a resin molded product (a molded object O1 after resin molding) by applying resin encapsulation to a substrate (a molded object O1 before resin molding) on ​​which electronic components such as semiconductor chips are mounted. In the resin molding apparatus 1, a compression molding method is employed as the resin molding method. In the resin molding apparatus 1, the component mounting surface of the substrate on which the electronic components are mounted is resin-encapsulated.

[0012] Examples of the substrate include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, and ceramic substrates. The substrate may be a carrier used for FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). In the substrate, wiring may already be provided or may not be provided.

[0013] As shown in FIG. 1, the resin molding apparatus 1 includes a substrate loading / unloading module 10, a substrate transfer module 20, two molding modules 30, a resin supply module 40, and a control unit 50. The control unit 50 includes, for example, a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory). The control unit 50 is configured to control each of the substrate loading / unloading module 10, the substrate transfer module 20, the two molding modules 30, and the resin supply module 40 according to, for example, a control program.

[0014] Each of the substrate loading / unloading module 10, the substrate transfer module 20, the molding module 30, and the resin supply module 40 is detachable and replaceable with respect to other modules. Also, in the resin molding apparatus 1, each of the substrate loading / unloading module 10, the substrate transfer module 20, the molding module 30, and the resin supply module 40 can be increased or decreased.

[0015] The substrate loading / unloading module 10 is configured to load a substrate (the object O1 to be molded before resin molding) on which electronic components are mounted and to unload a resin molded product (the object O1 after resin molding). As an example, the shape of the substrate is rectangular, and one side of the substrate is 600 mm. The substrate loading / unloading module 10 includes a loading unit 11, an unloading unit 12, an inspection unit 13, and an arm mechanism 14.

[0016] The loading section 11 accommodates the object to be molded O1 before resin molding. The unloading section 12 accommodates the object to be molded O1 (resin molded product) after resin molding. Each of the loading section 11 and the unloading section 12 can accommodate a plurality of objects to be molded O1. The inspection section 13 inspects the resin molded product. In the inspection section 13, the resin molded product is placed and inspected.

[0017] The arm mechanism 14 moves the object to be molded O1 to a predetermined position. The arm mechanism 14 includes a suction hand section 14a, an arm section 14b, and a drive section 14c. The suction hand section 14a can hold the object to be molded O1 by sucking the object to be molded O1. The suction hand section 14a is attached to the arm section 14b. The drive section 14c drives the arm section 14b. The drive section 14c realizes, for example, the rotation and movement of the arm section 14b.

[0018] The substrate delivery module 20 is configured to deliver the object to be molded O1 between the substrate loading / unloading module 10 and the molding module 30. The substrate delivery module 20 includes a loader 21 and an unloader 22.

[0019] The loader 21 receives the object to be molded O1 before resin molding from the arm mechanism 14 and conveys the object to be molded O1 to the resin molding section 300 (described later) of the molding module 30. The unloader 22 receives the resin molded product from the resin molding section 300 and conveys the resin molded product to the substrate loading / unloading module 10. Each of the loader 21 and the unloader 22 is movable along a rail L1 extending in the left-right direction. In the present embodiment, the loader 21 and the unloader 22 are connected to each other, and the loader 21 and the unloader 22 move integrally.

[0020] The molding module 30 is configured to perform resin molding of the object to be molded O1 using resin material supplied from the resin supply module 40. In this embodiment, two molding modules 30 are arranged adjacent to each other. By performing resin molding in parallel in the two molding modules 30, the manufacturing efficiency of the resin molded product is improved. Each molding module 30 includes a resin molding section 300. The resin molding section 300 will be described in detail later.

[0021] The resin supply module 40 is configured to supply resin material to the resin molding section 300 of the molding module 30. The resin supply module 40 includes two resin material storage devices 100, two small trays 41, two small tray transport mechanisms 42, a large tray 43, and a large tray transport mechanism 44.

[0022] Each resin material storage device 100 stores resin material. Each resin material storage device 100 is associated with a small tray 41. The small tray 41 is capable of holding resin material on its upper surface. In plan view, the size of the small tray 41 is, for example, about one-quarter the size of the large tray 43. Each resin material storage device 100 supplies resin material to its associated small tray 41. Two resin material storage devices 100 supply resin material to their respective associated small trays 41 in parallel, for example.

[0023] Each small tray 41 is associated with a small tray transport mechanism 42. Each small tray transport mechanism 42 moves the associated small tray 41 between the resin material storage device 100 and the large tray 43. After the small tray 41 moves above the large tray 43, resin material is supplied from the small tray 41 to the large tray 43. The large tray 43 is capable of holding resin material on its upper surface. The planar shape of the large tray 43 is substantially the same as, for example, the planar shape (e.g., rectangular) of the cavity (described later) in the resin molding section 300.

[0024] The small tray 41 supplies resin material to the large tray 43 multiple times, thereby supplying the amount of resin material necessary for one resin molding cycle to the top surface of the large tray 43. By controlling the supply position of the resin material from the small tray 41 to the large tray 43 each time, uneven distribution of the resin material on the large tray 43 is suppressed.

[0025] The large tray transport mechanism 44 moves the large tray 43. The large tray transport mechanism 44 moves along the rail L1. After the large tray 43 has moved to a predetermined position in the resin molding section 300, resin material is supplied from the large tray 43 into the cavity in the resin molding section 300.

[0026] <1-2. Structure of the resin molded section> Figure 2 is a schematic diagram showing a portion of the plan view of the resin molding section 300. As shown in Figure 2, the resin molding section 300 includes a mold 305 and optical sensors 352, 354, 356, and 358. In plan view, the mold 305 has a rectangular shape. The mold 305 has two opposing sides SD1 and SD2, and two opposing sides SD3 and SD4. Optical sensor 352 is positioned along side SD1, and optical sensor 354 is positioned along side SD2. Optical sensor 356 is positioned along side SD3, and optical sensor 358 is positioned along side SD4. The mold 305 is surrounded by optical sensors 352, 354, 356, and 358. Optical sensors 352, 354, 356, and 358 will be described in detail later.

[0027] Figure 3 is a schematic diagram showing a portion of the III-III cross-section in Figure 2. As shown in Figure 3, the resin molding section 300 includes a fixed platen 310, a mold 305, a movable platen 340, a mold clamping mechanism 350, and a base 360.

[0028] The fixed platen 310, the movable platen 340, and the base 360 ​​are each rectangular plate-shaped members in plan view. Tie bars (not shown) extend downward from each of the four corners of the fixed platen 310. The movable platen 340 is located below the fixed platen 310. Tie bars pass through each of the four corners of the movable platen 340, and the movable platen 340 is movable vertically relative to the tie bars. The clamping mechanism 350 is fixed on the base 360 ​​and moves the movable platen 340 vertically. The clamping mechanism 350 can be implemented, for example, by a combination of a servo motor and a ball screw, or a combination of a hydraulic cylinder and a linkage mechanism.

[0029] The molding die 305 includes an upper die 320 and a lower die 330. The molding die 305 is positioned between a fixed platen 310 and a movable platen 340. More specifically, the upper die 320 is fixed to the lower surface of the fixed platen 310, and the lower die 330 is fixed to the upper surface of the movable platen 340. As the movable platen 340 moves vertically, the lower die 330 also moves vertically along with the movable platen 340. The molding die 305 is clamped when the movable platen 340 rises, and the molding die 305 is opened when the movable platen 340 descends.

[0030] The lower mold 330 includes a base plate 334, a bottom member 331, a spring 333, and a side member 332. The base plate 334 is a rectangular plate-shaped member in plan view. The base plate 334 is fixed to the upper surface of the movable platen 340. The bottom member 331 is a rectangular block-shaped member in plan view. The bottom member 331 is fixed to the upper surface of the base plate 334 and is located approximately in the center of the base plate 334. The side member 332 is a frame-shaped member that surrounds the bottom member 331. The side member 332 is fixed to the base plate 334 via a plurality of springs 333.

[0031] The upper surface of the side member 332 is located above the upper surface of the bottom member 331, and a cavity (recess) is formed on the upper surface of the lower mold 330. A release film F1 is placed in this cavity, and a resin material R1 is placed on the release film F1. The object to be molded O1 is placed on the lower surface of the upper mold 320. The object to be molded O1 includes a substrate P1 and a plurality of electronic components C1 mounted on the substrate P1. With the object to be molded O1 placed on the lower surface of the upper mold 320, each of the plurality of electronic components C1 is located below the substrate P1. When the mold 305 is clamped with the release film F1 on which the resin material R1 is placed in the cavity of the lower mold 330 and the object to be molded O1 placed on the lower surface of the upper mold 320, the component mounting surface of the object to be molded O1 is resin-sealed.

[0032] In this configuration, with the object to be molded O1 positioned on the lower surface of the upper mold 320, each of the multiple electronic components C1 is located below the substrate P1. For example, if foreign matter is caught between the substrate P1 and the electronic component C1, the electronic component C1 may fall off the substrate P1. If compression molding is performed with the electronic component C1 having fallen onto the lower mold 330, defects such as damage to the lower mold 330 or the substrate P1 may occur.

[0033] To suppress the occurrence of such malfunctions, optical sensors 352, 354, 356, and 358 are arranged around the mold 305 in the resin molding section 300. As will be described in detail later, the optical sensors 352, 354, 356, and 358 detect when at least some of the multiple electronic components C1 have fallen downward from the substrate P1. For example, optical sensors 352 and 356 have the same configuration as each other, and optical sensors 354 and 358 have the same configuration as each other.

[0034] Figure 4 is a schematic diagram showing a portion of the IV-IV cross section of Figure 2. As shown in Figure 4, the light sensor 352 includes a plurality of light emitters 362 and a plurality of light receivers 364. Each of the plurality of light emitters 362 includes a plurality of light-emitting elements arranged in the front-to-back direction, and each light-emitting element irradiates light into the space between the upper mold 320 and the lower mold 330. Each of the plurality of light emitters 362 is associated with one of the plurality of light receivers 364 (described later) included in the light sensor 354, and irradiates light onto the associated light receiver 364. Each of the plurality of light receivers 364 includes a plurality of light-receiving elements arranged in the front-to-back direction, and each light-receiving element receives light. Each of the plurality of light receivers 364 is associated with one of the plurality of light emitters 362 (described later) included in the light sensor 354, and receives light irradiated by the associated light emitter 362. The fall of the electronic component C1 is detected when the amount of light received per unit time in at least one of the multiple light receivers 364 falls below a predetermined amount. The multiple light emitters 362 are arranged in a line in the front-to-back direction. The multiple light receivers 364 are arranged in a line in the front-to-back direction. In the light sensor 352, the multiple light emitters 362 are located above the multiple light receivers 364.

[0035] Furthermore, the multiple light emitters 362 and multiple light receivers 364 are arranged in a staggered pattern. That is, in the front-to-back direction, the multiple light emitters 362 and multiple light receivers 364 are arranged such that a light receiver 364 is positioned between two adjacent light emitters 362, and a light emitter 362 is positioned between two adjacent light receivers 364. The light-emitting element may be made up of a light-emitting diode or a laser diode, etc. The light-receiving element may be made up of a photodiode or a phototransistor, etc.

[0036] Figure 5 is a schematic diagram showing a portion of the VV cross-section of Figure 2. As shown in Figure 5, the light sensor 354 includes a plurality of light emitters 362 and a plurality of light receivers 364. Each of the plurality of light emitters 362 irradiates light into the space between the upper mold 320 and the lower mold 330. More specifically, each of the plurality of light emitters 362 is associated with one of the plurality of light receivers 364 included in the light sensor 352 and irradiates light onto the associated light receiver 364. Each of the plurality of light receivers 364 is associated with one of the plurality of light emitters 362 included in the light sensor 352 and receives light irradiated by the associated light emitter 362. The fall of the electronic component C1 is detected when the amount of light received by each light receiver 364 falls below a predetermined amount. The plurality of light emitters 362 are arranged in a line in the front-to-back direction. The plurality of light receivers 364 are arranged in a line in the front-to-back direction. In the light sensor 354, the multiple light emitters 362 are located below the multiple light receivers 364.

[0037] For example, the light emitters 362A and 362B (see Figure 4) in the light sensor 352 correspond to the light receivers 364C and 364D in the light sensor 354, respectively, and the light receivers 364A and 364B (see Figure 4) in the light sensor 352 correspond to the light emitters 362C and 362D in the light sensor 354, respectively. That is, an optical path is formed between light emitter 362A and light receiver 364C, and between light emitter 362B and light receiver 364D, with an optical path being formed between light emitter 362C and light receiver 364A, and between light emitter 362D and light receiver 364B, with an optical path being formed between light sensor 354 and light sensor 352.

[0038] Referring again to Figure 2, in the space between the upper mold 320 and the lower mold 330, in a plan view, multiple optical paths LP1 between optical sensors 352 and 354 and multiple optical paths LP1 between optical sensors 356 and 358 intersect with each other. As a result, multiple optical paths LP1 are formed in a mesh-like pattern in the space between the upper mold 320 and the lower mold 330. Based on the light reception results from each light receiver 364, it is detected that at least a portion of the multiple electronic components C1 have fallen downward from the substrate P1. Therefore, with the resin molding apparatus 1, even if the electronic component C1 falls with its long side parallel to one optical path LP1 (for example, the optical path LP1 between optical sensors 352 and 354), the electronic component C1 can block the other optical path LP1 (for example, the optical path LP1 between optical sensors 356 and 358), thus suppressing detection failures caused by the falling posture of the electronic component C1.

[0039] Furthermore, as described above, in the resin molding apparatus 1, the multiple light emitters 362 and multiple light receivers 364 included in the light sensor 352 are arranged in a staggered pattern, and the multiple light emitters 362 and multiple light receivers 364 included in the light sensor 354 are also arranged in a staggered pattern. Therefore, with the resin molding apparatus 1, the width between adjacent optical paths LP1 is relatively narrow, so the fall of the electronic component C1 can be detected with relatively high accuracy. In addition, with the resin molding apparatus 1, there is a certain amount of space between adjacent light emitters 362 and between adjacent light receivers 364, so that each light receiver 364 is less likely to receive light irradiated by light emitters other than the corresponding light emitter 362, thus suppressing the occurrence of false detections regarding the fall of the electronic component C1.

[0040] Figure 6 is a schematic diagram showing a portion of the VI-VI cross section of Figure 4. As shown in Figure 6, in the light sensor 352, a portion of the light emitter 362 is covered by cover 382, ​​and a portion of the light receiver 364 is covered by cover 384. Covers 382 and 384 each have an L-shape. In cover 382, ​​a slit S1 is formed on the surface facing the light-emitting element of the light emitter 362. Light emitted by the light emitter 362 enters the space between the upper mold 320 and the lower mold 330 through the slit S1. Also, in cover 384, a slit S2 is formed on the surface facing the light-receiving element of the light receiver 364. The light receiver 364 receives light that has passed through the slit S2. In light sensor 354, the light emitter 362 and light receiver 364 are also covered by covers 382 and 384, respectively.

[0041] Figure 7 schematically shows an example of an optical path LP1 extending in the left-right direction. As shown in Figure 7, for example, the spread of light emitted by the light emitter 362 included in the light sensor 352 is suppressed by the slit S1 in the cover 382. If the cover 382 is not provided, the light emitted by the light emitter 362 may be reflected from the lower surface of the upper mold 320 or the upper surface of the lower mold 330.

[0042] When such reflection occurs, light from a light emitter 362 other than the one associated with the light receiver 364 in the light sensor 354 can easily enter. As a result, false detection of the electronic component C1 falling becomes more likely. In the resin molding apparatus 1, the spread of light emitted by the light emitter 362 is suppressed by the slit S1 formed in the cover 382, ​​thereby suppressing light reflection in both the upper mold 320 and the lower mold 330.

[0043] Furthermore, in the resin molding apparatus 1, light emitted by the light emitter 362 included in the light sensor 352 passes through the slit S2 and is received by the light receiver 364 included in the light sensor 354. Therefore, with the resin molding apparatus 1, the angle of light entry into each light receiver 364 is limited, so that the entry of light reflected from the upper mold 320 and the lower mold 330 into each light receiver 364 can be suppressed.

[0044] Figure 8 is a schematic diagram showing the VIII-VIII cross-section of Figure 2. As shown in Figure 8, between the optical sensors 356 and 358, a portion of each optical path LP1 is inclined with respect to the lower surface of the upper mold 320 and the upper surface of the lower mold 330, respectively. Optical sensor 356 is positioned such that the light emitter 362 and light receiver 364 included in optical sensor 356 each face diagonally upward and rearward, and optical sensor 358 is positioned such that the light emitter 362 and light receiver 364 included in optical sensor 358 each face downward. Optical sensor 358 is positioned, for example, along the side surface of the upper mold 320. A mirror 370 is positioned in the optical path between light sensors 356 and 358, which reflects the light emitted by the light emitter 362 included in light sensor 356 toward the light receiver 364 included in light sensor 358, and also reflects the light emitted by the light emitter 362 included in light sensor 358 toward the light receiver 364 included in light sensor 356.

[0045] By moving the optical sensor 358 and mirror 370 upward, entry and exit paths for the loader 21 and large tray transport mechanism 44, etc., are secured in the space between the upper mold 320 and the lower mold 330. Thus, with the resin molding apparatus 1, even if there are constraints on the size of the space between the upper mold 320 and the lower mold 330, entry and exit paths for various mechanisms (for example, the loader 21, unloader 22, and large tray transport mechanism 44, etc.) into the space can be easily secured compared to the case where the entire optical path LP1 between the optical sensors 356 and 358 is parallel to the lower surface of the upper mold 320 and the upper surface of the lower mold 330, respectively.

[0046] [2. Operation] <2-1.Basic operation> Figure 9 is a flowchart showing the basic operating procedure of the resin molding apparatus 1. The processes shown in this flowchart are repeatedly executed at predetermined intervals by the control unit 50, for example.

[0047] Referring to Figure 9, the control unit 50 controls the arm mechanism 14 to transport the object to be molded O1 housed in the loading unit 11 to the loader 21 (step S100). The control unit 50 controls the loader 21 to position the object to be molded O1 on the upper surface of the upper mold 320 (step S110). Specifically, the control unit 50 controls the loader 21 to enter the space between the upper mold 320 and the lower mold 330, controls the loader 21 to position the object to be molded O1 on the upper surface of the upper mold 320, and controls the loader 21 to exit the space between the upper mold 320 and the lower mold 330.

[0048] The control unit 50 performs a process to place the release film F1 on the upper surface of the lower mold 330 (step S120). The control unit 50 controls the large tray transport mechanism 44 and the large tray 43 to place the resin material R1 on the upper surface of the lower mold 330 (on the release film F1) (step S130). Specifically, the control unit 50 controls the large tray transport mechanism 44 to enter the space between the upper mold 320 and the lower mold 330, controls the large tray transport mechanism 44 and the large tray 43 to place the resin material R1 on the upper surface of the lower mold 330, and controls the large tray transport mechanism 44 to exit the space between the upper mold 320 and the lower mold 330. Prior to step 130, the supply of resin material R1 from the resin material storage device 100 to the small tray 41 and the supply of resin material R1 from the small tray 41 to the large tray 43 are performed in parallel.

[0049] The control unit 50 controls a heating unit (not shown) to melt the resin material R1 placed on the upper surface (inside the cavity) of the lower mold 330 (step S140). Once the resin material R1 has melted, the control unit 50 controls the mold clamping mechanism 350 to clamp the mold 305 (step S150). Once compression molding is complete, the control unit 50 controls the mold clamping mechanism 350 to open the mold (step S160).

[0050] The control unit 50 controls the unloader 22 to hold the manufactured resin molded product and controls the arm mechanism 14 to receive the resin molded product from the unloader 22 (step S170). The control unit 50 controls the arm mechanism 14 to transport the resin molded product to the inspection unit 13 and controls the inspection unit 13 to inspect the transported resin molded product (step S180). The control unit 50 controls the arm mechanism 14 to transport the inspected resin molded product to the discharge unit 12 (step S190). A resin molded product is manufactured through this procedure.

[0051] <2-2. Drop detection operation> Figure 10 is a flowchart showing the procedure for starting and stopping the detection of electronic component C1 falling. The process shown in this flowchart is repeatedly executed at a predetermined cycle by, for example, the control unit 50.

[0052] Referring to Figure 10, the control unit 50 determines whether the loader 21 has finished exiting the space between the upper mold 320 and the lower mold 330 after the object to be molded O1 has been placed on the lower surface of the upper mold 320 (step S200). If it is determined that the loader 21 has not finished exiting (NO in step S200), the control unit 50 executes the process in step S200 again.

[0053] On the other hand, when it is determined that the loader 21 has finished exiting (YES in step S200), the control unit 50 executes a process to start detecting the fall of the electronic component C1 (step S210). Specifically, the control unit 50 controls each of the light sensors 352, 354, 356, and 358 so that the illumination of light by each light emitter 362 begins, and starts acquiring the light reception results from each of the light sensors 352, 354, 356, and 358 by each light receiver 364.

[0054] The control unit 50 determines whether or not the timing for the large tray transport mechanism 44 to enter the space between the upper mold 320 and the lower mold 330 has arrived (step S220). If it is determined that the timing for the large tray transport mechanism 44 to enter has not arrived (NO in step S220), the control unit 50 continues the fall detection process and executes the process in step S220.

[0055] On the other hand, when it is determined that the timing for the large tray transport mechanism 44 to enter has arrived (YES in step S220), the control unit 50 executes a process to stop the detection of the electronic component C1 falling (step S230). Specifically, the control unit 50 controls each of the light sensors 352, 354, 356, and 358 so that the illumination of light by each of the light emitters 362 stops.

[0056] Thus, in the resin molding apparatus 1, the detection of the electronic component C1 falling is not performed while the loader 21 or the like is entering the space between the upper mold 320 and the lower mold 330. Therefore, the resin molding apparatus 1 can suppress the occurrence of false detection of the electronic component C1 falling due to the blocking of light caused by the entry of the loader 21 or the like.

[0057] Figure 11 is a flowchart showing the procedure for detecting the fall of electronic component C1. The process shown in this flowchart is executed, for example, by the control unit 50 during the execution of the fall detection process for electronic component C1.

[0058] Referring to Figure 11, the control unit 50 determines whether the amount of light received per unit time in any of the multiple photodetectors 364 included in the light sensors 352, 354, 356, and 358 has decreased to a predetermined amount or less (step S300). The predetermined amount is determined in advance through experiments, and information regarding the predetermined amount is stored in the memory (not shown) of the control unit 50. If it is determined that the amount of light received per unit time in each photodetector 364 is greater than the predetermined amount (NO in step S300), the control unit 50 executes the process in step S300 again.

[0059] On the other hand, if it is determined that the amount of light received per unit time in any of the multiple light receivers 364 is less than or equal to a predetermined amount (YES in step S300), the control unit 50 executes a process to stop the compression molding in the resin molding unit 300 (step S310).

[0060] Thus, in the resin molding apparatus 1, compression molding is stopped when it is detected that at least a portion of the multiple electronic components C1 have fallen downward from the substrate P1. Therefore, with the resin molding apparatus 1, since compression molding is stopped when electronic components C1 fall from the substrate P1, it is possible to suppress damage to the substrate P1 and the lower mold 330 caused by the continuation of compression molding when electronic components C1 fall from the substrate P1.

[0061] [3. Features] As described above, in the resin molding apparatus 1 according to this embodiment, with the object to be molded O1 placed on the lower surface of the upper mold 320, at least a portion of the multiple electronic components C1 have fallen downward from the substrate P1, as detected by the optical sensors 352, 354, 356, and 358. Therefore, with the resin molding apparatus 1, appropriate action can be taken when electronic components C1 fall from the substrate P1, thus suppressing the occurrence of problems that may arise if compression molding continues when electronic components C1 fall from the substrate P1.

[0062] Resin molding apparatus 1 is an example of a "resin molding apparatus" in the present invention. Upper mold 320 is an example of an "upper mold" in the present invention, and lower mold 330 is an example of a "lower mold" in the present invention. Molding die 305 is an example of a "molding die" in the present invention. Clamping mechanism 350 is an example of a "clamping mechanism" in the present invention. Light sensors 352, 354, 356, and 358 are examples of "sensors" in the present invention. Control unit 50 is an example of a "control unit" in the present invention. The configuration consisting of a plurality of light emitters 362 included in light sensors 352, 354, 356, and 358 is an example of a "light emitting unit" in the present invention. The configuration consisting of a plurality of light receivers 364 included in light sensors 352, 354, 356, and 358 is an example of a "light receiving unit" in the present invention.

[0063] [4. Other Embodiments] The concept of the above embodiments is not limited to those described above. Examples of other embodiments to which the concept of the above embodiments can be applied will be described below.

[0064] <4-1> In the above embodiment, the fall of the electronic component C1 was detected by optical sensors 352, 354, 356, and 358. However, the fall of the electronic component C1 does not necessarily have to be detected by optical sensors. For example, the space between the upper mold 320 and the lower mold 330 may be continuously imaged from the side by an image sensor, and the fall of the electronic component C1 may be detected based on the moving image data.

[0065] <4-2> In the above embodiment, a mirror 370 is placed in the optical path between light sensors 356 and 358. However, a mirror 370 is not necessarily required to be placed in the optical path between light sensors 356 and 358. For example, by arranging the light sensor 358 to face diagonally downwards and forward, entry and exit paths for the loader 21 and the large tray transport mechanism 44 may be secured. Also, in the light sensor 356, the light emitter 362 and light receiver 364 do not necessarily have to be covered by covers 382 and 384, respectively. In the light sensor 358, the light emitter 362 and light receiver 364 do not necessarily have to be covered by covers 382 and 384, respectively.

[0066] <4-3> In the above embodiment, when the fall of electronic component C1 was detected, the compression molding in the resin molding apparatus 1 was stopped. However, when the fall of electronic component C1 is detected, the compression molding in the resin molding apparatus 1 does not necessarily have to be stopped immediately. For example, when the fall of electronic component C1 is detected, a buzzer may sound, or a screen may be displayed on the display asking the operator whether it is okay to stop the compression molding.

[0067] <4-4> In the above embodiment, the light emitted by each light emitter 362 may be continuous light or pulsed light.

[0068] <4-5> In the above embodiment, no intermediate plate was provided between the upper mold 320 and the lower mold 330 in the molding die 305. However, an intermediate plate may be provided between the upper mold 320 and the lower mold 330. The intermediate plate is a frame-shaped member with a rectangular hole formed in the center, and is configured to sandwich the release film F1 together with the lower mold 330. For example, by sandwiching the release film F1 between the intermediate plate and the lower mold 330, the tension on the release film F1 increases.

[0069] <4-6> In the above embodiment, each light emitter 362 included a plurality of light-emitting elements. However, the configuration of each light emitter 362 is not limited thereto. For example, the number of light-emitting elements included in the light emitter 362 may be one. In this case, the light emitter 362 may further include a branching member that branches the path of light emitted by one light-emitting element into a plurality of paths, and the branched light may be guided to a plurality of light-emitting ports. In this case, the light-emitting element and the branching member may be connected by a single optical fiber, and the branching member and the plurality of light-emitting ports may be connected by a plurality of optical fibers.

[0070] Furthermore, in the above embodiment, each light receiver 364 included multiple light-receiving elements. However, the configuration of each light receiver 364 is not limited to this. For example, the number of light-receiving elements included in the light receiver 364 may be one. In this case, the light receiver 364 may further include a converging member that concentrates the light guided through multiple light-receiving ports, and the concentrated light may be received by a single light-receiving element. In this case, the multiple light-receiving ports and the converging member may be connected by multiple optical fibers, and the converging member and the light-receiving element may be connected by a single optical fiber.

[0071] Embodiments of the present invention have been described illustratively above. That is, a detailed description and accompanying drawings have been disclosed for illustrative purposes. Therefore, some of the components described in the detailed description and accompanying drawings may not be essential for solving the problem. Consequently, the mere fact that these non-essential components are described in the detailed description and accompanying drawings does not mean that they should be immediately assumed to be essential.

[0072] Furthermore, the above embodiments are merely illustrative in every respect of the present invention. The above embodiments can be improved or modified in various ways within the scope of the present invention. For example, at least a part of the configuration of one embodiment may be combined with at least a part of the configuration of any other embodiment. In other words, in carrying out the present invention, specific configurations can be appropriately adopted depending on the embodiment.

[0073] [5. Addendum] <Technology 1> (composition) A resin molding apparatus for compression molding, A molding die including an upper mold and a lower mold facing the upper mold, The system includes a mold clamping mechanism for clamping the aforementioned molding die, The mold clamping is performed with the object to be molded placed on the lower surface of the upper mold and the resin placed on the upper surface of the lower mold. The object to be molded includes a substrate and a plurality of electronic components arranged on the substrate. With the object to be molded positioned on the lower surface, each of the plurality of electronic components is located below the substrate. A resin molding apparatus further comprising a sensor that detects whether at least some of the plurality of electronic components have fallen downward from the substrate while the object to be molded is placed on the lower surface. (Effects, etc.) In this resin molding apparatus, a sensor detects that at least some of the electronic components have fallen downward from the substrate while the object to be molded is positioned on the lower surface of the upper mold. Therefore, this resin molding apparatus allows for appropriate action to be taken when electronic components fall from the substrate, thus suppressing the occurrence of defects that may occur if compression molding continues when electronic components fall from the substrate.

[0074] <Technology 2> (composition) The resin molding apparatus of Technology 1 further comprises a control unit that performs a process to stop the compression molding when the sensor detects that at least some of the plurality of electronic components have fallen downward from the substrate. (Effects, etc.) In this resin molding apparatus, compression molding is stopped when a sensor detects that at least some of the electronic components have fallen downward from the substrate. Therefore, with this resin molding apparatus, since compression molding is stopped when electronic components fall from the substrate, it is possible to suppress damage to the substrate and the lower mold that would occur if compression molding continued when electronic components fall from the substrate.

[0075] <Technology 3> (composition) The aforementioned sensor, A light-emitting unit that illuminates the space between the upper mold and the lower mold while the mold clamping is not performed, It includes a light receiving unit that receives light emitted by the light emitting unit, A resin molding apparatus according to Technology 1 or Technology 2, wherein the sensor detects, based on the light reception result by the light receiving unit, that at least a portion of the plurality of electronic components have fallen downward from the substrate. (Effects, etc.) In this resin molding apparatus, it is detected that at least some of the electronic components have fallen downward from the substrate based on the light-receiving results from the light-receiving unit. Therefore, with this resin molding apparatus, appropriate measures can be taken when electronic components fall from the substrate, thus suppressing the occurrence of defects that may occur if compression molding continues when electronic components fall from the substrate.

[0076] <Technology 4> (composition) The resin molding apparatus of Technology 3, wherein at least a portion of the optical path between the light-emitting unit and the light-receiving unit is inclined with respect to the lower surface and the upper surface, respectively. (Effects, etc.) In this resin molding apparatus, at least a portion of the optical path between the light-emitting unit and the light-receiving unit is inclined with respect to the lower surface of the upper mold and the upper surface of the lower mold, respectively. Therefore, with this resin molding apparatus, even if there are constraints on the size of the space between the upper mold and the lower mold, it is possible to easily secure entry and exit routes for various mechanisms (e.g., transport mechanisms for the object to be molded or resin) into and out of the space, compared to the case where the entire optical path between the light-emitting unit and the light-receiving unit is parallel to the lower surface of the upper mold and the upper surface of the lower mold, respectively.

[0077] <Technology 5> (composition) The light-emitting unit includes a first light-emitting unit and a second light-emitting unit. The light-receiving unit includes a first light-receiving unit and a second light-receiving unit, In a plan view, the shape of the mold is rectangular. The rectangle includes a first and second side facing each other, and a third and fourth side facing each other, The first light-emitting section is formed along the first side, The first light-receiving portion is formed along the second side, The second light-emitting section is formed along the third side, A resin molding apparatus according to technology 3 or technology 4, wherein the second light-receiving portion is formed along the fourth side. (Effects, etc.) In this resin molding apparatus, the optical path between the first light-emitting unit and the first light-receiving unit intersects with the optical path between the second light-emitting unit and the second light-receiving unit. Therefore, with this resin molding apparatus, even if an electronic component falls with its long side parallel to one optical path, the electronic component can block the other optical path, thus suppressing detection failures caused by the orientation of the falling electronic component.

[0078] <Technology 6> (composition) The light-emitting unit includes a first light-emitting unit and a second light-emitting unit. Each of the first light-emitting unit and the second light-emitting unit includes a plurality of light emitters, The light-receiving unit includes a first light-receiving unit and a second light-receiving unit, Each of the first light-receiving unit and the second light-receiving unit includes a plurality of light-receiving devices. In a plan view, the shape of the mold is rectangular. The rectangle includes a first side and a second side that are opposite to each other, Along the first side, a plurality of light projectors included in the first light projector are arranged in a line, Multiple photodetectors included in the first light-receiving unit are arranged in a line along the first side, The plurality of light emitters included in the first light emitting unit are located above the plurality of light receivers included in the first light receiving unit, The multiple light emitters included in the first light emitting unit and the multiple light receivers included in the first light receiving unit are arranged in a staggered pattern. Multiple light emitters included in the second light-emitting unit are arranged in a line along the second side, Multiple photodetectors included in the second photodetector are arranged in a line along the second side, The plurality of light emitters included in the second light emitting unit are located below the plurality of light receivers included in the second light receiving unit, A resin molding apparatus according to Technology 3 or Technology 4, wherein a plurality of light emitters included in the second light emitting unit and a plurality of light receivers included in the second light receiving unit are arranged in a staggered pattern. (Effects, etc.) In this resin molding apparatus, multiple light emitters in the first light-emitting section and multiple light receivers in the first light-receiving section are arranged in a staggered pattern, and multiple light emitters in the second light-emitting section and multiple light receivers in the second light-receiving section are also arranged in a staggered pattern. Therefore, with this resin molding apparatus, the width between each optical path is relatively narrow, so the dropping of electronic components can be detected with relatively high accuracy. In addition, with this resin molding apparatus, there is a certain amount of space between adjacent light emitters and between adjacent light receivers, so that each light receiver is less likely to receive light emitted by light emitters other than the corresponding light emitter, thus suppressing the occurrence of false detections regarding the dropping of electronic components.

[0079] <Technology 7> (composition) At least a portion of each of the plurality of floodlights is covered by a first cover in which a first slit is formed. Each of the plurality of light emitters irradiates light into the space through the first slit, in the resin molding apparatus of technology 6. (Effects, etc.) In this resin molding apparatus, light irradiated by each of the multiple projectors enters the space between the upper and lower molds through the first slit. Therefore, with this resin molding apparatus, the spread of light is suppressed by the first slit, and thus the reflection of light from both the upper and lower molds can be suppressed.

[0080] <Technology 8> (composition) At least a portion of each of the plurality of photodetectors is covered by a second cover in which a second slit is formed. A resin molding apparatus according to Technology 6 or Technology 7, wherein each of the plurality of light receiving units receives light irradiated by the light emitting unit through the second slit. (Effects, etc.) In this resin molding apparatus, light emitted by the light-emitting unit enters each of the multiple light-receiving units through the second slit. Therefore, with this resin molding apparatus, the angle of light entry into each light-receiving unit is limited, and thus the entry of light reflected from the upper and lower molds into each light-receiving unit can be suppressed.

[0081] <Technology 9> (composition) A method for manufacturing a resin molded product using a resin molding apparatus according to any of the technologies 1 to 8, The object to be molded is placed on the lower surface, The resin is placed on the aforementioned upper surface, A method for manufacturing a resin molded product, comprising clamping the mold of the aforementioned molding die. (Effects, etc.) In this method for manufacturing resin molded products, a sensor detects that at least some of the electronic components have fallen downward from the substrate while the object to be molded is positioned on the lower surface of the upper mold. Therefore, this method for manufacturing resin molded products allows for appropriate action to be taken when electronic components fall from the substrate, thus suppressing the occurrence of defects that may occur if compression molding continues when electronic components fall from the substrate. [Explanation of Symbols]

[0082] 1 Resin molding apparatus, 10 Substrate loading / unloading module, 11 Loading section, 12 Unloading section, 13 Inspection section, 14 Arm mechanism, 14a Suction hand section, 14b Arm section, 14c Drive section, 20 Substrate transfer module, 21 Loader, 22 Unloader, 30 Molding module, 40 Resin supply module, 41 Small tray, 42 Small tray transport mechanism, 43 Large tray, 44 Large tray transport mechanism, 50 Control unit, 100 Resin material storage device, 300 Resin molding section, 305 Molding die, 310 Fixed platen, 320 Upper die, 330 Lower die, 331 Bottom member, 332 Side member, 333 Spring, 334 Base plate, 340 Movable platen, 350 Clamping mechanism, 352, 354, 356, 358 Optical sensor, 360 Substrate, 362 364 Floodlight, 370 Receiver, 382, ​​384 Cover, C1 Electronic component, F1 Release film, L1 Rail, LP1 Optical path, O1 Molding object, P1 Substrate, R1 Resin material, S1, S2 Slits, SD1, SD2, SD3, SD4 Sides.

Claims

1. A resin molding apparatus for compression molding, A molding die including an upper mold and a lower mold facing the upper mold, The system includes a mold clamping mechanism for clamping the aforementioned molding die, The mold clamping is performed with the object to be molded placed on the lower surface of the upper mold and the resin placed on the upper surface of the lower mold. The object to be molded includes a substrate and a plurality of electronic components arranged on the substrate. With the object to be molded positioned on the lower surface, each of the plurality of electronic components is located below the substrate. A resin molding apparatus further comprising a sensor that detects the occurrence of the electronic component falling downward from the substrate after the object to be molded is placed on the lower surface.

2. The resin molding apparatus according to claim 1, wherein the sensor detects the occurrence of the fall according to whether or not the detection conditions are met.

3. The resin molding apparatus according to claim 1, further comprising a control unit that performs a process to stop the compression molding when the occurrence of the fall is detected by the sensor.

4. The aforementioned sensor, A light-emitting unit that illuminates the space between the upper mold and the lower mold while the mold clamping is not performed, It includes a light receiving unit that receives light emitted by the light emitting unit, The resin molding apparatus according to claim 1, wherein the sensor detects the occurrence of the fall based on the light reception result by the light receiving unit.

5. The resin molding apparatus according to claim 4, wherein at least a portion of the optical path between the light-emitting unit and the light-receiving unit is inclined with respect to the lower surface and the upper surface, respectively.

6. The light-emitting unit includes a first light-emitting unit and a second light-emitting unit. The light-receiving unit includes a first light-receiving unit and a second light-receiving unit. In a plan view, the shape of the mold is rectangular. The rectangle includes a first and second side facing each other, and a third and fourth side facing each other, The first light-emitting section is formed along the first side, The first light-receiving portion is formed along the second side, The second light-emitting section is formed along the third side, The resin molding apparatus according to claim 4, wherein the second light-receiving portion is formed along the fourth side.

7. The light-emitting unit includes a first light-emitting unit and a second light-emitting unit. Each of the first light-emitting unit and the second light-emitting unit includes a plurality of light emitters, The light-receiving unit includes a first light-receiving unit and a second light-receiving unit. Each of the first light-receiving unit and the second light-receiving unit includes a plurality of light-receiving devices, In a plan view, the shape of the mold is rectangular. The rectangle includes a first side and a second side that are opposite to each other, Multiple light emitters included in the first light-emitting unit are arranged in a line along the first side, Multiple light receivers included in the first light receiving unit are arranged in a line along the first side, The plurality of light emitters included in the first light emitting unit are located above the plurality of light receivers included in the first light receiving unit, The multiple light emitters included in the first light-emitting unit and the multiple light receivers included in the first light-receiving unit are arranged in a staggered pattern. Multiple light emitters included in the second light-emitting unit are arranged in a line along the second side, Multiple photodetectors included in the second photodetector are arranged in a line along the second side, The plurality of light emitters included in the second light emitting unit are located below the plurality of light receivers included in the second light receiving unit, The resin molding apparatus according to claim 4, wherein a plurality of light emitters included in the second light emitting unit and a plurality of light receivers included in the second light receiving unit are arranged in a staggered pattern.

8. At least a portion of each of the plurality of floodlights is covered by a first cover having a first slit formed therein. The resin molding apparatus according to claim 7, wherein each of the plurality of light emitters irradiates light into the space through the first slit.

9. At least a portion of each of the plurality of photodetectors is covered by a second cover having a second slit formed therein. The resin molding apparatus according to claim 7, wherein each of the plurality of light receiving units receives light irradiated by the light emitting unit through the second slit.

10. A method for manufacturing a resin molded product using a resin molding apparatus according to any one of claims 1 to 9, The object to be molded is placed on the lower surface, The above upper surface is to be covered with resin, A method for manufacturing a resin molded product, comprising clamping the mold of the aforementioned molding die.

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