Resin molding apparatus and method for manufacturing resin molded products

Abstract

To provide a resin molding apparatus capable of shortening a molding time while preventing a product defect.SOLUTION: The resin molding apparatus includes an ejector pin that protrudes from the lower mold and pushes up the resin molded product disposed in the lower mold, and a conveying mechanism that holds the resin molded product and carries out the resin molded product from the lower mold, wherein the ejector pin pushes up the resin molded product from the lower mold in a state where the conveying mechanism holds the resin molded product.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to the technology of a resin molding apparatus and a method for manufacturing a resin molded product.

Background Art

[0002] Patent Document 1 discloses a resin molding apparatus that manufactures a resin molded product by resin-sealing a molding object sandwiched between an upper mold and a lower mold. In the technology described in Patent Document 1, after resin molding, with the upper mold and the lower mold in an open mold state, the resin molded product is pushed upward using an ejector pin. Thereby, the resin molded product can be released from the lower mold. The resin molded product released from the lower mold is carried out by a transfer mechanism.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Here, in the resin molding apparatus described in Patent Document 1, for example, if the resin molded product is pushed up with an ejector pin before the resin is sufficiently cured, a part of the resin adheres closely to the lower mold and deformation occurs, and there is a possibility of product defects such as cracks. Therefore, in the resin molding apparatus described in Patent Document 1, it is necessary to lengthen the cure time (curing time), wait until the resin is sufficiently cured, and then release the resin molded product with an ejector pin. However, when the cure time is lengthened, there is a problem that the molding time becomes long and the production efficiency decreases.

[0005] The present invention has been made in view of the above circumstances, and the problem to be solved is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can shorten the molding time while preventing product defects. [Means for solving the problem]

[0006] The problems that the present invention aims to solve are as described above, and in order to solve these problems, the present invention provides a resin molding apparatus that clamps an upper mold and a lower mold and manufactures a resin molded product by resin sealing an object to be molded by transfer molding, comprising: an ejector pin that protrudes from the lower mold and pushes up the resin molded product placed in the lower mold; and a transport mechanism that holds the resin molded product and transports it out of the lower mold, wherein the ejector pin pushes up the resin molded product from the lower mold while the transport mechanism is holding the resin molded product. Furthermore, the upper mold has an upper mold cavity formed for resin sealing the upper surface of the object to be molded, the resin molded product has an elongated upper resin sealing portion formed by resin sealing the upper surface of the object to be molded, and the transport mechanism adsorbs the resin molded product by adsorption portion having adsorption grooves extending in the longitudinal direction of the upper resin sealing portion. It is.

[0007] Furthermore, the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, and includes the steps of: opening the upper mold and the lower mold; holding the resin molded product with the transport mechanism; and pushing the resin molded product held by the transport mechanism out of the lower mold with the ejector pin. [Effects of the Invention]

[0008] According to the present invention, it is possible to shorten the molding time while preventing product defects. [Brief explanation of the drawing]

[0009] [Figure 1] A schematic plan view showing the overall configuration of a resin molding apparatus according to one embodiment. [Figure 2] (a) A plan view and a front view showing the resin-sealed lead frame. (b) A front cross-sectional view and a bottom view showing the first suction pad. [Figure 3] A front cross-sectional view showing a molding unit according to the first embodiment. [Figure 4] A front cross-sectional view showing the molding unit in its opened state. [Figure 5] A front cross-sectional view showing the molding unit with the unloader adsorbing and holding the resin molded product. [Figure 6] A front cross-sectional view showing a molding unit in which a resin molded product is held in place by suction while the ejector pin is pushed upward. [Figure 7] A front cross-sectional view showing a molding unit according to the second embodiment. [Figure 8] A front cross-sectional view showing a molding unit according to the third embodiment. [Figure 9] A front cross-sectional view showing a molding unit according to the fourth embodiment. [Figure 10] (a) Front cross-sectional view and bottom view showing the first suction pad according to the fifth embodiment. (b) Front cross-sectional view showing the unloader according to the sixth embodiment. [Modes for carrying out the invention]

[0010] In the following explanation, the directions indicated by arrows U, D, L, R, F, and B in the diagram will be defined as the upward, downward, left, right, forward, and backward directions, respectively.

[0011] <Overall configuration of resin molding apparatus 1> First, the configuration of the resin molding apparatus 1 according to the first embodiment will be described using Figure 1. The resin molding apparatus 1 performs resin molding by the transfer molding method. The resin molding apparatus 1 can encapsulate electronic elements such as semiconductor chips fixed to the lead frame LF, which is the object to be molded, with resin to manufacture a resin molded product.

[0012] The resin molding apparatus 1 mainly comprises a lead frame supply unit 2, a lead frame alignment unit 3, a resin tablet supply unit 4, a resin tablet discharge unit 5, a molding unit 100, a loader unit 7, an unloader unit 200, a cleaner unit 9, a transfer unit 10, a decating unit 11, a pickup unit 12, a lead frame storage unit 13, and a controller unit 14, etc.

[0013] The lead frame supply unit 2 supplies the lead frame LF before resin encapsulation with the electronic element fixed thereon. The lead frame supply unit 2 is provided with a set portion 16 for setting an in-magazine 15 containing the lead frame LF before resin encapsulation, and a pusher mechanism 17 for transferring the lead frame LF in the in-magazine 15 to the lead frame alignment unit 3.

[0014] The lead frame alignment unit 3 aligns the lead frame LF before resin encapsulation. The lead frame alignment unit 3 is provided with an alignment mechanism 18 for aligning the lead frame LF transferred from the lead frame supply unit 2. The alignment mechanism 18 aligns the lead frame LF so as to correspond to the shape of the mold (fixed upper mold 110 and movable lower mold 120) provided in the molding unit 100. In the illustrated example, the alignment mechanism 18 aligns two lead frames LF in parallel.

[0015] The resin tablet supply unit 4 supplies the resin tablet T. The resin tablet supply unit 4 is provided with a resin tablet cassette 20 having a plurality of resin tablet supply members 19 capable of accommodating the resin tablet T. The resin tablet supply members 19 are aligned so as to correspond to the number and the interval of the pots 122a in the molding unit 100.

[0016] The resin tablet unloading unit 5 unloads the resin tablet T. The resin tablet unloading unit 5 is provided with a pusher mechanism (not shown) for transferring the resin tablet T accommodated in the resin tablet supply member 19 of the resin tablet supply unit 4 to the resin tablet unloading unit 5.

[0017] The molding unit 100 resin-seals an electronic component fixed to a lead frame LF. The molding unit 100 includes a fixed plate (not shown) fixed to the main body 1a of the resin molding apparatus 1 via a tie bar 24, a fixed upper mold 110 (see FIG. 3) attached to the lower surface of the fixed plate, a movable plate 25 disposed to face downward of the fixed plate and driven in the vertical direction by a mold opening and closing mechanism 27, and a movable lower mold 120 attached to the upper surface of the movable plate 25. The movable lower mold 120 is provided with a plurality (seven in the illustrated example) of pots 122a capable of accommodating resin tablets T. The fixed upper mold 110 and the movable lower mold 120 are each provided with a heating mechanism (not shown). The specific configuration of the molding unit 100 will be described later.

[0018] The loader unit 7 transfers the lead frame LF and the resin tablet T to the molding unit lOO. The loader unit 7 is provided with a loader 30 that transfers the lead frame LF aligned by the lead frame alignment unit 3 and the resin tablet T unloaded by the resin tablet unloading unit 5. The loader 30 can hold the lead frame LF and the resin tablet T and transfer them to the molding unit 100.

[0019] The unloader unit 200 unloads the resin-sealed lead frame LF from the mold. The unloader unit 200 is provided with an unloader 210 that unloads the resin-sealed lead frame LF resin-molded by the molding unit 100 to the outside. The unloader 210 can hold and unload the resin-sealed lead frame LF and the unnecessary resin portion UR formed between two lead frames LF. The specific configuration of the unloader unit 200 (unloader 210) will be described later.

[0020] The cleaner unit 9 is used to clean the mold. The cleaner unit 9 is equipped with an air blow mechanism (not shown) for blowing air onto the mold of the molding unit 100, and a suction mechanism (not shown) for sucking up and removing dust from the mold. The cleaner unit 9 is attached to the unloader 210 and can move integrally with the unloader 210. The cleaner unit 9 can clean the mold when the unloader 210 is unloading the resin-sealed lead frame LF from the mold.

[0021] The transfer unit 10 is used to transfer resin-encapsulated lead frames LF. The transfer unit 10 is equipped with a pallet (not shown) for transferring resin-encapsulated lead frames LF, which have been unloaded from the mold by the unloader unit 200, to the decating unit 11 and the lead frame storage unit 13.

[0022] The decating unit 11 removes unwanted resin portion UR from the resin-sealed lead frame LF. The decating unit 11 is provided with a gate break mechanism (not shown) for removing unwanted resin portion UR from the resin-sealed lead frame LF. The gate break mechanism can cut and remove the unwanted resin portion UR from the lead frame LF by applying pressure to the unwanted resin portion UR formed between the two lead frame LF.

[0023] The pickup unit 12 holds each of the two lead frames LF from which the unnecessary resin portion UR has been removed. The pickup unit 12 is provided with a holding mechanism (not shown) that holds the two resin-sealed lead frames LF that have been transferred from the decating unit 11 by the transfer unit 10.

[0024] The lead frame housing unit 13 houses the resin-sealed lead frame LF. The lead frame housing unit 13 is provided with a stock magazine 37 that houses each of the two resin-sealed lead frame LF held by the pickup unit 12.

[0025] The controller unit 14 controls the operation of each of the above-mentioned units.

[0026] <Method for manufacturing resin molded products> The following describes a method for manufacturing resin molded products using the resin molding apparatus 1 configured as described above. The controller unit 14 can manufacture resin molded products by controlling the operation of each unit of the resin molding apparatus 1.

[0027] First, two un-resin-sealed lead frames LF, housed in the in-magazine 15 of the lead frame supply unit 2, are transferred to the lead frame alignment unit 3 by the pusher mechanism 17. Next, the two lead frames LF are aligned parallel to each other by the alignment mechanism 18 of the lead frame alignment unit 3. Finally, the seven resin tablets T housed in the resin tablet cassette 20 of the resin tablet supply unit 4 are discharged in an aligned state by the resin tablet discharge unit 5.

[0028] Next, the loader 30 of the loader unit 7 holds the two lead frames LF of the lead frame alignment unit 3 and the seven resin tablets T of the resin tablet discharge unit 5. The loader unit 7 transports the held lead frames LF and resin tablets T to the movable lower mold 28 of the molding unit 100. The loader unit 7 places the lead frames LF on the movable lower mold 120 and places the resin tablets T in the pot 122a. The resin tablets T are thermosetting resins. When the resin tablets T are heated, their temperature rises. If the temperature of the resin tablets T continues to rise, they become molten resin material and then harden.

[0029] Next, the movable lower mold 120 is raised by the mold opening / closing mechanism 27, and the mold is clamped. In this state, the resin tablet T contained in the pot 122a is heated, and the molten resin material fills the cavity of the mold. After a certain period of time (curing time), the resin material hardens, and the electronic elements fixed to the lead frame LF are resin-encapsulated, and a resin molded product (resin-encapsulated lead frame LF) can be obtained. At this time, the two resin molded products are connected by excess resin UR.

[0030] Next, the movable lower mold 120 is lowered by the mold opening / closing mechanism 27, and the mold is opened. After that, the resin-sealed lead frame LF is unloaded from the molding unit 100 by the unloader 210. At this time, the mold is cleaned by the cleaner unit 9. Details of how the resin molded product (resin-sealed lead frame LF) is unloaded by the unloader 210 will be described later.

[0031] Next, the resin-sealed lead frame LF is transferred to the decating unit 11 by the transfer unit 10. Unnecessary resin parts UR formed on the resin-sealed lead frame LF are removed by the decating unit 11. After that, the lead frame LF from which the unnecessary resin parts UR have been removed is transferred to the lead frame housing unit 13 by the transfer unit 10. The pickup unit 12 holds the lead frame LF transferred by the transfer unit 10 and houses it in the stock magazine 37 of the lead frame housing unit 13.

[0032] <Resin molded products> Next, using Figure 2(a), a resin molded product (resin-sealed lead frame LF) manufactured by the resin molding apparatus 1 according to the first embodiment will be described.

[0033] The lead frame LF is formed in the shape of a rectangular plate. Resin-sealed portions R are formed on both sides of the resin-sealed lead frame LF by resin-sealing electronic elements. The resin-sealed portion R formed on the upper surface of the lead frame LF is formed in an elongated shape. Specifically, the resin-sealed portion R is formed in a rectangular shape in plan view with its longitudinal direction oriented left to right. Multiple resin-sealed portions R are formed in the front-to-back direction. In addition, resin-sealed portions R are formed on the lower surface of the lead frame LF at a position corresponding to that on the upper surface. The resin-sealed portions R are formed to have an appropriate thickness. The resin-sealed portions R formed on the lower and upper surfaces of the lead frame LF are embodiments of the lower resin-sealed portion and upper resin-sealed portion according to the present invention, respectively.

[0034] <Configuration of Molding Unit 100 and Unloader 210> Next, the configuration of the molding unit 100 and the unloader 210 will be explained in more detail using Figures 2, 3, and 5.

[0035] The molding unit 100 shown in Figure 3 mainly comprises a fixed upper mold 110 and a movable lower mold 120, etc. The fixed upper mold 110 and the movable lower mold 120 are, respectively, embodiments of the upper mold and lower mold according to the present invention.

[0036] The fixed upper die 110 forms the upper part of the mold. The fixed upper die 110 is fixed to the lower surface of a fixed plate (not shown) which is fixed to the tie bar 24 (see Figure 1). This supports the fixed upper die 110 in an immovable state. Note that the member that fixes the fixed plate is not limited to the tie bar 24, but may be a plate-shaped hold frame. In this case, in Figure 1, one hold frame is positioned to the left of the movable lower die 120, and another hold frame is positioned to the right of the movable lower die 120. The fixed upper die 110 mainly comprises an upper die block 111, etc.

[0037] The upper mold block 111 forms a cavity between itself and the movable lower mold 120 (lower mold block 121, described later). The upper mold block 111 is formed in a roughly rectangular parallelepiped shape. A concave upper mold cavity portion 111a and a resin supply portion 111b are formed on the lower surface of the upper mold block 111.

[0038] The upper mold cavity portion 111a is formed in a shape corresponding to the resin sealing portion R of the resin molded product (see Figure 2(a)). In the first embodiment, in order to perform resin molding of two lead frames LF arranged side by side, the upper mold cavity portions 111a are formed on the right and left sides of the upper mold block 111, respectively.

[0039] The resin supply section 111b is the part that guides the molten resin material to the upper mold cavity section 111a, and is composed of a cal section and a runner section. The resin supply section 111b is formed between the left and right upper mold cavity sections 111a. The resin supply section 111b is formed to be located above the pot 122a, which will be described later.

[0040] Although the explanation will be omitted here, the fixed upper mold 110 may also be equipped with an ejector mechanism or the like for releasing the resin-sealed lead frame LF from the upper mold block 111 when the mold is opened.

[0041] The movable lower die 120 forms the lower part of the molding die. The movable lower die 120 is fixed to the upper surface of the movable platen 25 (see Figure 1). This allows the movable lower die 120 to move up and down in conjunction with the vertical movement of the movable platen 25. The movable lower die 120 mainly comprises a lower die block 121, a pot block 122, a lower block 123, a plunger 124, an ejector pin 125, an ejector plate 126, a movable shaft 127, a spring 128, and an ejector rod 129, etc.

[0042] The lower mold block 121 forms a cavity between itself and the fixed upper mold 110. The lower mold block 121 is formed in a roughly rectangular parallelepiped shape. Two lower mold blocks 121 are provided side by side, flanking the pot block 122. A concave lower mold cavity portion 121a is formed on the upper surface of the lower mold block 121.

[0043] The lower mold cavity portion 121a is formed in a shape corresponding to the resin sealing portion R of the resin molded product (see Figure 2(a)). In the first embodiment, the lower mold cavity portion 121a is formed in a position that is vertically opposite to the upper mold cavity portion 111a. When the mold (fixed upper mold 110 and movable lower mold 120) is clamped, the upper mold cavity portion 111a and the lower mold cavity portion 121a form a cavity for resin molding.

[0044] The pot block 122 is the part that can accommodate the resin tablet T. The pot block 122 is formed in a substantially rectangular parallelepiped shape. The pot block 122 is positioned between the left and right lower mold blocks 121. A pot 122a is formed in the pot block 122 so as to penetrate the pot block 122 vertically. The diameter of the pot 122a is formed to a size that can accommodate a substantially cylindrical resin tablet T.

[0045] The lower block 123 holds the lower mold block 121 and the pot block 122. The lower parts of the lower mold block 121 and the pot block 122 are fixed to the upper part of the lower block 123. The lower block 123 has a first housing section 123a and a second housing section 123b formed therein.

[0046] The first housing section 123a is a section for housing the ejector plate 126 and the like. The first housing section 123a is formed below the lower mold block 121 and the pot block 122.

[0047] The second housing section 123b is a section for housing the spring 128 and the like. The second housing section 123b is formed below the first housing section 123a. The second housing section 123b is formed near both the left and right ends of the lower block 123.

[0048] The plunger 124 injects the resin tablet T contained in the pot 122a and supplies it to the aforementioned cavity. The plunger 124 is positioned to be movable up and down within the pot 122a. The plunger 124 can move up and down by the driving force of the plunger drive unit 124a located at its lower part. The plunger drive unit 124a can be formed by, for example, a servo motor or an air cylinder.

[0049] The ejector pins 125 are used to release the resin-sealed lead frame LF from the movable lower mold 120. The ejector pins 125 are formed in a substantially cylindrical shape. The ejector pins 125 are positioned with their longitudinal direction facing up and down. The ejector pins 125 penetrate the lower mold block 121 vertically and are positioned to be movable vertically relative to the lower mold block 121. The upper end of the ejector pins 125 is positioned to be exposed in the lower mold cavity 121a. The ejector pins 125 are positioned at both the left and right ends of each lower mold cavity 121a. In other words, two ejector pins 125 are provided for each lower mold cavity 121a.

[0050] The ejector plate 126 connects multiple ejector pins 125. The ejector plate 126 is formed in a flat shape. The ejector plate 126 is housed in the first housing portion 123a of the lower block 123. The ejector plate 126 connects the lower parts of multiple ejector pins 125 provided on the lower mold block 121. One ejector plate 126 is provided on each side, corresponding to the left and right lower mold blocks 121. The ejector plate 126 is supported by appropriate guide members (not shown) so that it can move up and down.

[0051] The movable shaft 127 is for raising and lowering the ejector plate 126. The movable shaft 127 penetrates vertically through the lower part of the lower block 123 (the partition wall between the first housing section 123a and the second housing section 123b) and is positioned to be movable vertically relative to the lower block 123. The upper part of the movable shaft 127 is connected to the ejector plate 126 via a connecting section 127a.

[0052] The spring 128 applies a downward force to the movable shaft 127. The spring 128 is housed in the second housing portion 123b. The spring 128 can apply a downward force to the flange portion formed at the lower end of the movable shaft 127.

[0053] The ejector rod 129 is used to move the movable shaft 127 upward relative to the lower block 123. The ejector rod 129 is located below the lower block 123. More specifically, the ejector rod 129 is located below the second housing portion 123b formed in the lower block 123. The ejector rod 129 is appropriately fixed so that it cannot move up or down. When the lower block 123 is lowered, the ejector rod 129 enters the second housing portion 123b and can push the movable shaft 127 upward from below. When the movable shaft 127 is pushed upward by the ejector rod 129, the ejector pin 125 rises relative to the movable lower mold 120.

[0054] The unloader 210 shown in Figure 5 mainly comprises a base member 220, a first suction pad 230, a spacer 240, and a second suction pad 250, etc. The unloader 210 is one embodiment of the transport mechanism according to the present invention.

[0055] The base member 220 forms the main body portion of the unloader 210. The base member 220 is formed, for example, in a roughly rectangular parallelepiped shape. The base member 220 can be moved vertically and horizontally by an appropriate moving mechanism. A suction path 221 is formed on the base member 220.

[0056] The suction path 221 is a flow path for air that is drawn in via the first suction pad 230 and the second suction pad 250. The suction path 221 is formed inside the base member 220. One end (upper end) of the suction path 221 is connected to an air-drawing suction mechanism (not shown) via a suitable hose or the like. The other end (lower end) of the suction path 221 is branched as appropriate and then connected to the first suction pad 230 and the second suction pad 250.

[0057] The first suction pad 230 is a part that adsorbs and holds the resin molded product (resin-sealed lead frame LF). The first suction pad 230 is one embodiment of the suction part according to the present invention. The first suction pad 230 adsorbs the resin-sealed portion R formed on the upper surface of the resin-sealed lead frame LF. The first suction pad 230 is made of an elastic material such as rubber. As a result, the first suction pad 230 can absorb minute irregularities in the resin-sealed portion R and adsorb the resin-sealed portion R appropriately. The first suction pad 230 is provided on the left and right sides of the base member 220 so as to correspond to the two lead frame LF that will be molded. Adsorption holes 231 and adsorption grooves 232 are formed in the first suction pad 230.

[0058] The suction holes 231 and suction grooves 232 shown in Figures 2(b) and 5 form a flow path for air drawn in through the first suction pad 230. The suction holes 231 are formed to penetrate the first suction pad 230 vertically. The suction grooves 232 are formed in a concave shape on the lower surface of the first suction pad 230. The suction holes 231 are formed to open in the left and right center of the suction grooves 232.

[0059] The suction holes 231 and suction grooves 232 are formed in positions corresponding to the resin-sealed portion R formed on the resin-sealed lead frame LF. The suction grooves 232 are formed to have a shape corresponding to the shape of the resin-sealed portion R. Specifically, in a bottom view (see Figure 2(b)), the suction grooves 232 are formed in a rectangular shape with their longitudinal direction oriented left to right (the same direction as the longitudinal direction of the resin-sealed portion R). In a bottom view, the suction grooves 232 are formed to be slightly smaller than the resin-sealed portion R.

[0060] The spacer 240 shown in Figure 5 is used to adjust the vertical position of the first suction pad 230. The spacer 240 is placed between the first suction pad 230 and the base member 220. The spacer 240 has through holes that correspond to the suction holes 231 of the first suction pad 230. This allows the air drawn in from the first suction pad 230 to flow through the spacer 240 to the suction path 221 of the base member 220. The vertical position of the first suction pad 230 can be adjusted by replacing the spacer 240 with another spacer 240 of a different thickness (vertical width).

[0061] The second suction pad 250 is a part that adsorbs and holds the unwanted resin portion UR that is formed between the two resin-sealed lead frames LF. The second suction pad 250 is made of an elastic material such as rubber. The second suction pad 250 is provided between the left and right first suction pads 230. Adsorption holes (not shown) are formed in the second suction pad 250. By drawing air through these adsorption holes, the unwanted resin portion UR can be adsorbed by the second suction pad 250.

[0062] <Method for unloading resin molded products> Next, the method for unloading resin molded products using the unloader 210 will be explained with reference to Figures 3 to 6.

[0063] As shown in Figure 3, the fixed upper mold 110 and the movable lower mold 120 are clamped together, and the lead frame LF before resin encapsulation is placed between the fixed upper mold 110 and the movable lower mold 120. In this state, the resin tablet T contained in the pot 122a is melted, and the molten resin material is filled into the cavity by the plunger 124. After a certain period of time (curing time), the resin material hardens, and the electronic elements fixed to the lead frame LF are resin-encapsulated, and a resin molded product (resin-encapsulated lead frame LF) can be obtained (see Figure 4).

[0064] Next, as shown in Figure 4, the movable lower mold 120 descends and the mold opens. The resin-sealed lead frame LF is released from the fixed upper mold 110 and placed on the movable lower mold 120. The movable lower mold 120 stops just before the ejector rod 129 pushes up the movable shaft 127. Therefore, in this state, the ejector pin 125 does not rise relative to the lower mold block 121.

[0065] Next, as shown in Figure 5, the unloader 210 moves horizontally and enters the space between the fixed upper mold 110 and the movable lower mold 120 (above the resin-sealed lead frame LF). Furthermore, the unloader 210 descends. As a result, the first suction pad 230 comes into contact with the resin-sealed portion R, and the second suction pad 250 comes into contact with the unwanted resin portion UR.

[0066] Next, the suction mechanism (not shown) of the unloader 210 is activated, and air is drawn in from the first suction pad 230 and the second suction pad 250 via the suction path 221. As a result, the first suction pad 230 adsorbs the resin-sealed portion R, and the second suction pad 250 adsorbs the unwanted resin portion UR. In this way, the resin-sealed lead frame LF is held by the unloader 210 while placed on the movable lower mold 120.

[0067] Next, as shown in Figure 6, the movable lower mold 120 descends again. As the movable lower mold 120 descends, the ejector rod 129 pushes up the movable shaft 127. This causes the ejector plate 126 to rise, and the ejector pin 125 to rise relative to the lower mold block 121. As a result, the ejector pin 125 protrudes from the lower mold cavity portion 121a formed on the upper surface of the lower mold block 121. The ejector pin 125 protruding from the lower mold block 121 pushes both ends of the resin-sealed portion R formed on the lower surface of the lead frame LF upward in the longitudinal direction (left-right direction). As a result, the resin-sealed lead frame LF is released from the lower mold block 121.

[0068] In this manner, when the resin-sealed lead frame LF is pushed up by the ejector pins 125, the resin-sealed lead frame LF is held in place by the unloader 210 from above. Therefore, when the movable lower mold 120 is lowered, the ejector pins 125 push up both the left and right ends of the resin molded product, while the unloader 210 lifts the area near the center of the resin molded product. This prevents a portion of the resin molded product from deforming due to contact with the lower mold block 121. Furthermore, because deformation of the resin molded product can be suppressed in this way, it becomes unnecessary to extend the curing time until the resin is completely hardened, thus shortening the molding time.

[0069] Furthermore, since the resin-sealed lead frame LF is held in place by the unloader 210 from above, it is possible to prevent the lead frame LF from bouncing up when it is pushed up by the ejector pin 125. This prevents the lead frame LF from falling off in an unexpected location.

[0070] Next, the unloader 210 rises, and the resin molded product is lifted from the movable lower mold 120. Furthermore, the unloader 210 moves horizontally, and the resin molded product is discharged from the molding unit 100. After the unloader 210 has exited the mold, the movable lower mold 120 rises. As the movable lower mold 120 rises, the ejector rod 129 moves away from the movable shaft 127. The movable shaft 127 descends due to the force of the spring 128, and consequently the ejector pin 125 also descends relative to the lower mold block 121.

[0071] <Variation> Next, modified examples of the resin molding apparatus 1 (the second to sixth embodiments) will be described.

[0072] <Second Embodiment> The molding unit 100A according to the second embodiment shown in Figure 7 differs from the first embodiment (see Figure 5, etc.) in that the unloader 210 is equipped with a first blower mechanism 310. The following will mainly describe this difference, and components similar to those in the first embodiment will be given the same reference numerals and their descriptions will be omitted.

[0073] The first blower mechanism 310 is for supplying air between the movable lower mold 120 and the resin molded product placed on the movable lower mold 120. The first blower mechanism 310 mainly comprises a nozzle 311 and a blower mechanism (not shown), etc.

[0074] The nozzle 311 is for blowing air. The nozzle 311 is located on the lower surface of the base member 220 of the unloader 210. The direction of the air outlet of the nozzle 311 is adjusted so that air can be blown out towards the gap between the lower surface of the resin molded product (resin-sealed lead frame LF) placed on the lower mold block 121 and the upper surface of the lower mold block 121. The nozzle 311 is connected to an appropriate blowing mechanism (not shown). The nozzle 311 can blow out air supplied from the blowing mechanism.

[0075] In the molding unit 100A configured in this way, when a resin molded product is unloaded from the mold, the resin molded product is held by the unloader 210 by suction, and air is supplied between the resin molded product and the lower mold block 121 by the first blower mechanism 310, while the resin molded product is pushed up by the ejector pin 125.

[0076] In this way, in addition to the suction holding of the unloader 210, the airflow from the first blowing mechanism 310 assists in the release of the resin molded product, thereby more effectively suppressing deformation of the resin molded product. Furthermore, the blowing mechanism that supplies air to the nozzle 311 may be equipped with a pressure boosting mechanism to increase the airflow force. This allows for greater force (airflow) to assist in the release of the resin molded product.

[0077] Furthermore, it is also possible to configure the system so that the resin molded product is pushed up by the ejector pin 125 while air is being blown from the first blowing mechanism 310, without the resin molded product being held by the unloader 210. This also helps to assist in the release of the resin molded product and suppresses deformation of the resin molded product.

[0078] <Third Embodiment> The molding unit 100B according to the third embodiment shown in Figure 8 differs from the first embodiment (see Figure 5, etc.) in that the movable lower mold 120 is equipped with a second blower mechanism 320. The following will mainly describe this difference, and components similar to those in the first embodiment will be denoted by the same reference numerals and their descriptions will be omitted.

[0079] The second blower mechanism 320 is for supplying air between the movable lower mold 120 and the resin molded product placed on the movable lower mold 120. The second blower mechanism 320 mainly comprises an air port 321, an opening / closing mechanism 322, and a blower mechanism 323, etc.

[0080] Airport 321 is a path for guiding air between the movable lower mold 120 and the resin molded product placed on the movable lower mold 120. Airport 321 is formed on the lower mold block 121. One end of airport 321 opens onto the upper surface of the lower mold block 121 (more specifically, at a position opposite the lead frame LF which is mounted on the lower mold block 121). The other end of airport 321 is connected to the blower mechanism 323.

[0081] The opening / closing mechanism 322 opens and closes the air port 321 to switch the flow of air between the two. The opening / closing mechanism 322 is positioned in the middle of the air port 321. The opening / closing mechanism 322 is formed by, for example, a solenoid actuator. The opening / closing mechanism 322 has a movable part 322a that can move in and out of the air port 321. By moving the movable part 322a into the air port 321, the air port 321 can be closed, and the flow of air through the air port 321 can be restricted.

[0082] The blower mechanism 323 is for supplying air. The blower mechanism 323 is connected to the other end of the air port 321 via an appropriate hose or the like.

[0083] When the opening / closing mechanism 322 opens the air port 321, air supplied from the blower mechanism 323 is blown out from one end of the air port 321 (the upper surface of the lower mold block 121). Conversely, when the opening / closing mechanism 322 closes the air port 321, no air from the blower mechanism 323 is blown out from one end of the air port 321.

[0084] In the molding unit 100B configured in this way, when a resin molded product is unloaded from the mold, the resin molded product is held by the unloader 210 by suction, and air is supplied between the resin molded product and the lower mold block 121 by the second blowing mechanism 320, while the resin molded product is pushed up by the ejector pin 125.

[0085] In this way, in addition to the suction and holding of the unloader 210, the airflow from the second blowing mechanism 320 assists in the release of the resin molded product, thereby more effectively suppressing deformation of the resin molded product.

[0086] Furthermore, it is also possible to configure the system so that the resin molded product is pushed up by the ejector pin 125 while air is being blown from the second blowing mechanism 320, without the resin molded product being held by the unloader 210. This also helps to assist in the release of the resin molded product and suppresses deformation of the resin molded product.

[0087] Furthermore, in the third embodiment, an example was shown in which one end of the air port 321 opens at a position facing the lead frame LF, but it may also be formed to open at a position facing, for example, the resin sealing portion R.

[0088] <Fourth Embodiment> The molding unit 100C according to the fourth embodiment shown in Figure 9 differs from the first embodiment (see Figure 5, etc.) in that the unloader 210 is equipped with a cooling mechanism 330. The following will mainly describe this difference, and components similar to those in the first embodiment will be denoted by the same reference numerals and their descriptions will be omitted.

[0089] The cooling mechanism 330 cools the resin molded product placed in the lower mold. The cooling mechanism 330 mainly comprises a cooling path 331, an air outlet 332, and an air blowing mechanism (not shown), etc.

[0090] The cooling path 331 is an airflow path for guiding air to the first suction pad 230. The cooling path 331 is formed inside the base member 220. One end (upper end) of the cooling path 331 is connected to a blowing mechanism (not shown) capable of blowing air via an appropriate hose or the like. The other end (lower end) of the cooling path 331 is branched as appropriate and then connected to an air outlet 332 formed in the first suction pad 230.

[0091] The air vent 332 is for blowing air supplied via the cooling path 331 towards the molded resin product. The air vent 332 is formed in a position opposite the lower end of the cooling path 331, both vertically and horizontally. It is also formed in a position opposite the molded resin product (resin-sealed lead frame LF) placed on the lower mold block 121, both vertically and horizontally. The air vent 332 is formed to penetrate the first suction pad 230 vertically. Through holes are also appropriately formed in the spacer 240 to connect the cooling path 331 and the air vent 332. This allows the air supplied via the cooling path 331 to be blown downwards from the air vent 332.

[0092] In the molding unit 100C configured in this way, when a resin molded product is unloaded from the mold, the resin molded product is held in place by the unloader 210, and air is blown onto the resin molded product by the cooling mechanism 330. This promotes the cooling of the resin molded product and accelerates the hardening of the resin sealing portion R. After the resin sealing portion R has hardened, the resin molded product is pushed up by the ejector pin 125, thereby suppressing deformation of the resin molded product.

[0093] <Fifth Embodiment> The first suction pad 230A according to the fifth embodiment shown in Figure 10(a) differs from the first embodiment (see Figure 2, etc.) in that it does not have a suction groove 232. The following will mainly explain this difference, and components similar to those in the first embodiment will be denoted by the same reference numerals and their descriptions will be omitted.

[0094] Adsorption holes 231A are formed in the first suction pad 230A. The adsorption holes 231A are formed to penetrate the first suction pad 230 vertically. The lower part of the adsorption holes 231A is branched into multiple parts and formed to open at multiple locations on the lower surface of the first suction pad 230A. In the illustrated example, an example is shown in which adsorption holes 231A open at multiple locations (3 locations) along the longitudinal direction (left-right direction) of the resin sealing portion R. Thus, it is not necessarily required to form adsorption grooves 232 in the first suction pad 230A as in the first embodiment.

[0095] <Sixth Embodiment> The unloader 210A according to the sixth embodiment shown in Figure 10(b) differs from the first embodiment (see Figure 5, etc.) in that it is equipped with a spring 270 instead of a spacer 240. The following will mainly describe this difference, and components similar to those in the first embodiment will be given the same reference numerals and their descriptions will be omitted.

[0096] The spring 270 is for allowing the first suction pad 230 to move up and down. The spring 270 is formed to expand and contract vertically. Multiple springs 270 are arranged between the first suction pad 230 and the base member 220. In addition, a connecting portion 271 is provided between the first suction pad 230 and the base member 220 to connect the suction path 221 of the base member 220 and the suction hole 231 of the first suction pad 230. The connecting portion 271 is formed of a material that can expand and contract vertically (such as an elastic member).

[0097] With this configuration, when an external force is applied to the first suction pad 230, the spring 270 expands and contracts, allowing the first suction pad 230 to move up and down. As a result, even if the thickness of the resin molded product is slightly changed, for example, the first suction pad 230 will move up and down according to the thickness of the resin molded product, allowing the resin molded product to be properly adsorbed.

[0098] Although each embodiment has been described above, the present invention is not limited to the embodiments described above, and appropriate modifications can be made within the scope of the technical idea of ​​the invention as described in the claims.

[0099] For example, the components (each unit) of the resin molding apparatus 1 in the above embodiment are just examples, and can be added, modified, or replaced as appropriate. For example, it is possible to add multiple molding units 100 to the resin molding apparatus 1 shown in Figure 1. Also, the configuration and operation of the components (each unit) used in the resin molding apparatus 1 in the above embodiment are just examples, and can be modified as appropriate.

[0100] Furthermore, although the above embodiment described using a rectangular lead frame LF and a rectangularly formed resin sealing portion R as examples, the shape of the lead frame LF and the like are not particularly limited.

[0101] Furthermore, in the above embodiment, an example was shown in which the ejector pin 125 pushes upward the resin sealing portion R of the resin molded product to release the resin molded product from the movable lower mold 120. However, it is also possible to configure it so that, for example, the lead frame LF portion (the portion other than the resin sealing portion R) of the resin molded product is also pushed upward.

[0102] Furthermore, although the above embodiment shows an example in which the ejector pins 125 push up both the left and right ends (two locations) of the resin sealing portion R, the arrangement and number of ejector pins 125 are not limited to this. For example, it is also possible to configure the system so that three or more locations on the resin sealing portion R are pushed up by the ejector pins 125.

[0103] Furthermore, the configurations of each of the above embodiments (the first to sixth embodiments) can be combined with each other. For example, the first blower mechanism 310 of the second embodiment (see Figure 7) can be combined with the second blower mechanism 320 of the third embodiment (see Figure 8).

[0104] <Note> The resin molding apparatus 1 in the first aspect of this disclosure is A resin molding apparatus 1 that clamps an upper mold (fixed upper mold 110) and a lower mold (movable lower mold 120), and resin-encapsulates the object to be molded (lead frame LF before resin encapsulation) by transfer molding to produce a resin molded product (lead frame LF after resin encapsulation), An ejector pin 125 protrudes from the lower mold and pushes up the resin molded product positioned in the lower mold, A transport mechanism (unloader 210) that holds the resin molded product and unloads it from the lower mold, It is equipped with, The ejector pin 125 pushes the resin molded product out of the lower mold while the transport mechanism is holding the resin molded product. According to the resin molding apparatus 1 of the first aspect of this disclosure, it is possible to shorten the molding time while preventing product defects. Specifically, when the resin molded product is pushed up by the ejector pin 125, the resin molded product is held by the conveying mechanism, so deformation of the resin molded product can be suppressed. As a result, the waiting time until the resin molded product hardens can be shortened, thus shortening the molding time. In addition, by holding the resin molded product with the conveying mechanism, it is also possible to prevent the resin molded product from bouncing up when it is pushed up by the ejector pin 125.

[0105] In a resin molding apparatus 1 with a second side conforming to the first side, The lower mold has a lower mold cavity portion 121a formed therein for resin sealing the lower surface of the object to be molded. The resin molding apparatus 1 of the second aspect of this disclosure can shorten the molding time while preventing product defects in resin molded products having a resin sealing portion R formed on the lower surface. In particular, since resin molded products with a resin sealing portion R formed on the lower surface tend to adhere well to the lower mold, the resin molding apparatus 1 of this disclosure is useful.

[0106] In a resin molding apparatus 1 having a third side corresponding to the first or second side, The ejector pin 125 protrudes relatively from the lower mold as the lower mold moves downward. According to the resin molding apparatus 1 of the third aspect of this disclosure, the ejector pin 125 can be made to protrude from the lower mold without using an independent drive source.

[0107] In the resin molding apparatus 1, the fourth side follows the first to third sides, The resin molded product has a long lower resin sealing portion (the lower resin sealing portion R of the lead frame LF) formed by resin sealing the lower surface of the object to be molded, The ejector pin 125 pushes up both longitudinal ends of the lower resin sealing portion. According to the resin molding apparatus 1 of the fourth aspect of this disclosure, the marks left by the ejector pins 125 on the resin molded product can be minimized. In particular, when both ends of the resin sealing portion R are cut off and discarded, the marks left by the ejector pins 125 do not remain on the product, thus preventing any differences in appearance from occurring in the product.

[0108] In a resin molding apparatus 1 with a fifth side corresponding to the first to fourth sides, The upper mold has an upper mold cavity portion 111a formed therein for resin sealing the upper surface of the object to be molded. The resin molded product has an elongated upper resin sealing portion (the resin sealing portion R above the lead frame LF) formed by resin sealing the upper surface of the object to be molded, The transport mechanism uses an adsorption section (first adsorption pad 230) having an adsorption groove 232 extending in the longitudinal direction of the upper resin sealing section to adsorb the resin molded product. According to the resin molding apparatus 1 of the fifth aspect of this disclosure, a wide area of ​​the resin sealing portion R can be adsorbed and held. This effectively suppresses deformation of the resin molded product.

[0109] In the resin molding apparatus 1 of the sixth side following the fifth side, The aforementioned adsorption portion is formed from an elastic material. According to the resin molding apparatus 1 of the sixth aspect of this disclosure, minute irregularities in the resin sealing portion R can be absorbed, and the resin sealing portion R can be properly adsorbed. Furthermore, the force applied to the resin sealing portion R when the adsorption portion comes into contact with the resin sealing portion R can be appropriately adjusted.

[0110] In the resin molding apparatus 1 of the seventh side following the first to sixth sides, The transport mechanism comprises a first air blowing mechanism 310 that blows air between the lower mold and the resin molded product placed in the lower mold. The ejector pin 125 pushes the resin molded product out of the lower mold while the first blower mechanism 310 is supplying air between the lower mold and the resin molded product placed in the lower mold. According to the resin molding apparatus 1 of the seventh aspect of this disclosure, the first blower mechanism 310 can assist in demolding the resin molded product, thereby more effectively suppressing deformation of the resin molded product.

[0111] In the resin molding apparatus 1 of the eighth side corresponding to the first to seventh sides, The lower mold is equipped with a second air blowing mechanism 320 that blows air between the lower mold and the resin molded product placed in the lower mold, The ejector pin 125 pushes the resin molded product out of the lower mold while the second blowing mechanism 320 is supplying air between the lower mold and the resin molded product placed in the lower mold. According to the resin molding apparatus 1 of the eighth aspect of this disclosure, the second blowing mechanism 320 can assist in demolding the resin molded product, thereby more effectively suppressing deformation of the resin molded product.

[0112] In a resin molding apparatus 1 with a ninth side corresponding to the first to eighth sides, The transport mechanism includes a cooling mechanism 330 for cooling the resin molded product placed in the lower mold. According to the resin molding apparatus 1 of the eighth aspect of this disclosure, the curing of the resin sealing portion R of the resin molded product can be accelerated, and deformation of the resin molded product can be suppressed. [Explanation of Symbols]

[0113] 1 Resin molding equipment 110 Fixed upper mold 111a Upper mold cavity 120 Movable lower mold 121 Lower mold block 121a Lower mold cavity 125 ejector pins 210 Unloader 230 First suction pad 232 Suction groove 310 1st ventilation mechanism 320 2nd ventilation mechanism 330 Cooling mechanism

Claims

1. A resin molding apparatus that clamps the upper and lower molds and manufactures a resin molded product by resin sealing the object to be molded through transfer molding, An ejector pin that protrudes from the lower mold and pushes up the resin molded product placed in the lower mold, A conveying mechanism that holds the resin molded product and discharges it from the lower mold, It is equipped with, The ejector pin pushes the resin molded product out of the lower mold while the transport mechanism is holding the resin molded product. The upper mold has an upper mold cavity formed therein for resin sealing the upper surface of the object to be molded. The resin molded product has an elongated upper resin sealing portion formed by resin sealing the upper surface of the object to be molded, The transport mechanism uses an adsorption section having an adsorption groove extending in the longitudinal direction of the upper resin sealing section to adsorb the resin molded product. Resin molding equipment.

2. The lower mold has a lower mold cavity formed therein for resin sealing the lower surface of the object to be molded. The resin molding apparatus according to claim 1.

3. The ejector pin protrudes relatively from the lower mold as the lower mold moves downward. The resin molding apparatus according to claim 1.

4. The resin molded product has an elongated lower resin-sealed portion formed by resin-sealing the lower surface of the object to be molded, The ejector pin pushes up both longitudinal ends of the lower resin sealing portion. The resin molding apparatus according to claim 1.

5. The adsorption portion is formed by an elastic member. The resin molding apparatus according to claim 1.

6. The lower mold is equipped with a second air supply mechanism that supplies air between the lower mold and the resin molded product placed in the lower mold. The ejector pin pushes the resin molded product out of the lower mold while the second blowing mechanism is supplying air between the lower mold and the resin molded product positioned in the lower mold. The resin molding apparatus according to claim 1.

7. A resin molding apparatus for manufacturing a resin molded product by clamping an upper mold and a lower mold and resin-encapsulating an object to be molded by transfer molding, An ejector pin that protrudes from the lower mold and pushes up the resin molded product placed in the lower mold, A conveying mechanism that holds the resin molded product and discharges it from the lower mold, It is equipped with, The ejector pin pushes the resin molded product out of the lower mold while the transport mechanism is holding the resin molded product. The transport mechanism includes a first air supply mechanism that supplies air between the lower mold and the resin molded product placed in the lower mold. The ejector pin pushes the resin molded product out of the lower mold while the first blowing mechanism is supplying air between the lower mold and the resin molded product positioned in the lower mold. Resin molding equipment.

8. A resin molding apparatus for manufacturing a resin molded product by clamping an upper mold and a lower mold and resin-encapsulating an object to be molded by transfer molding, An ejector pin that protrudes from the lower mold and pushes up the resin molded product placed in the lower mold, A conveying mechanism that holds the resin molded product and discharges it from the lower mold, It is equipped with, The ejector pin pushes the resin molded product out of the lower mold while the transport mechanism is holding the resin molded product. The transport mechanism includes a cooling mechanism for cooling the resin molded product placed in the lower mold. Resin molding equipment.

9. A method for manufacturing a resin molded product using a resin molding apparatus according to any one of claims 1 to 8, The process of opening the upper mold and the lower mold, A step of holding the resin molded product by the transport mechanism, The process of using the ejector pin to push up the resin molded product held by the transport mechanism from the lower mold, A method for manufacturing resin molded products containing [a specific component].

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