Precision positioning device and optical device

Abstract

[Problem] To provide a precise positioning device that makes it possible to control light with very low intensity such as a photon, and an optical apparatus using the same. [Solution] A precise positioning device 1 comprises an optical element 2 and a support part 3 that supports the optical element 2. The support part 3 has a first structure 51 and a second structure 52, a plurality of first piezoelectric actuators 61 are provided between the first structure 51 and the optical element 2, and a plurality of second piezoelectric actuators 62 are provided between the first structure 51 and the second structure 52. Consequently, the support part 3 is configured to make it possible for the optical element 2 to rotate around an X-axis, a Y-axis, and a Z-axis as rotation axes, and move in a Y-axis direction and a Z-axis direction.

Description

Technical Field

[0001] The present invention relates to a precision positioning device and an optical device that can three-dimensionally impart mobility to an optical element.

Background Art

[0002] Since the invention of the laser in the 1960s, optical measurement technology has developed significantly. Since the invention of the semiconductor laser in the 1970s, research and development of small-sized measurement devices have become active, and in the 1980s, measurement devices incorporating semiconductor lasers were put into practical use. In recent years, development of measurement devices that can be made portable while maintaining the same functions and performance as those that have been expensive and large-sized has become active. The methods are roughly classified into those using microfabrication technology and those using optical waveguides.

[0003] The former is by MEMS (Micro Electro Mechanical Systems). For example, as in Non-Patent Document 1, optical elements at the wafer level, particularly those with mobility, are the mainstream. However, due to fabrication at the wafer level, there are many two-dimensional structures, and when a spring mechanism is provided, although large displacements can be obtained by utilizing resonance characteristics, there is a problem that static movement is difficult.

[0004] The latter has optical waveguides formed in a wafer shape. Where light passes through, materials such as SiN have losses compared to passing through air, and there are also large losses when introducing light. For example, in the case of using a sensor as in Non-Patent Document 2, it can be solved by increasing the intensity of light, but in the case of controlling weak light such as photons, there is a problem that the influence of losses has a great impact on measurement.

Prior Art Documents

Non-Patent Documents

[0005]

Non-Patent Document 1

[0006] Thus, precise control of weak light like photons is difficult using only MEMS technology or only optical waveguides, and the challenge lies in miniaturizing and automatically controlling large optical systems.

[0007] The present invention is based on these problems and aims to provide a precision positioning device and an optical device using the same that can also control light of very low intensity, such as photons. [Means for solving the problem]

[0008] The precision positioning device of the present invention comprises an optical element and a support portion that supports the optical element, wherein the support portion is configured to allow the optical element to rotate about a plurality of rotation axes and to move in at least one direction of the rotation axes by joining a plurality of structures on which electrical wiring is arranged three-dimensionally and a plurality of piezoelectric actuators electrically connected to the electrical wiring.

[0009] The optical device of the present invention comprises a laser oscillator, a photodiode for receiving laser light from the laser oscillator, a circuit board on which the laser oscillator and the photodiode are arranged, and at least one precision positioning device of the present invention, which is arranged on the circuit board and positioned on the optical path from the laser oscillator to the photodiode. [Effects of the Invention]

[0010] According to the present invention, by joining multiple structures in which electrical wiring is arranged three-dimensionally with multiple piezoelectric actuators electrically connected to the electrical wiring, the optical element is made rotatable around multiple rotation axes and movable in at least one direction of the rotation axes. Therefore, by utilizing microfabrication technology, particularly mounting technology, it is possible to create three-dimensional electrical wiring and structures, enabling the control of light of weak intensity, such as photons. Furthermore, it is possible to control not only weak light but also high-intensity light, thus providing broad versatility. Moreover, since it can be integrated on a circuit board, an electromechanical optical control system can be realized, and miniaturization of the entire system can be achieved. [Brief explanation of the drawing]

[0011] [Figure 1] This figure shows the configuration of a precision positioning device according to one embodiment of the present invention. [Figure 2] Figure 1 shows the wiring configuration of the precision positioning device. [Figure 3] These are the coordinates representing the position of the precision positioning device shown in Figure 1. [Figure 4]This is a diagram showing the manufacturing process of the mirror of the precision positioning device shown in FIG. 1. [Figure 5] This is a diagram showing the manufacturing process of the first structure on the element side of the precision positioning device shown in FIG. 1. [Figure 6] This is a diagram showing the manufacturing process of the first structure on the support side of the precision positioning device shown in FIG. 1. [Figure 7] This is a diagram showing the manufacturing process of the second structure of the precision positioning device shown in FIG. 1. [Figure 8] This is a diagram showing the manufacturing process of joining each structure of the precision positioning device shown in FIG. 1. [Figure 9] This is a diagram showing the configuration of the optical device using the precision positioning device shown in FIG. 1. [Figure 10] This is a diagram for explaining the usage example of the precision positioning device shown in FIG. 1. [Figure 11] This is a diagram showing the configuration of Modification Example 1 of the present invention. [Figure 12] This is a diagram showing another configuration of Modification Example 1 of the present invention. [Figure 13] This is a diagram for explaining the usage example of Modification Example 1 of the present invention. [Figure 14] This is a diagram showing the configuration of Modification Example 2 of the present invention.

Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0013] (First Embodiment) FIG. 1 shows the overall configuration of a precision positioning device 1 according to a first embodiment of the present invention. FIG. 1(A) shows the configuration of the precision positioning device 1 as viewed from above, FIG. 1(B) shows the configuration as viewed from the I direction shown in FIG. 1(A), and FIG. 1(C) shows the configuration as viewed from the II direction shown in FIG. 1(A). FIG. 2 shows the wiring configuration of the precision positioning device 1. FIG. 2(A) shows the configuration of the element-side first structure 53 as viewed from the side of the optical element 2, FIG. 2(B) shows the configuration of the optical element 2 as viewed from the side of the element-side first structure 53, FIG. 2(C) shows the configuration of the element-side first structure 53 as viewed from the side of the support-side first structure 54, FIG. 2(D) shows the configuration of the support-side first structure 54 as viewed from the side of the element-side first structure 53, FIG. 2(E) shows the configuration of the second structure 52 as viewed from the side of the support-side first structure 54, FIG. 2(F) shows the configuration of the support-side first structure 54 as viewed from the side of the second structure 52, and FIG. 2(G) shows the configuration of the second structure 52 as viewed from the opposite side of the second structure 52.

[0014] This precision positioning device 1 includes an optical element 2 and a support portion 3 that supports the optical element 2, and can provide the optical element 2 with three-dimensional mobility. The optical element 2 is, for example, each element that constitutes an optical device, and examples include a mirror, a lens, a prism, a filter, or a diffraction grating. The size of the optical element 2 is preferably, for example, 20 mm or less, more preferably 10 mm or less, and even more preferably 100 μm or more and 10 mm or less because it can be miniaturized. The size of the optical element 2 is, for example, the maximum length of the optical element 2. In this embodiment, the case where a mirror is used as the optical element 2 will be specifically described as an example. The mirror is formed, for example, with a reflective film 22 made of a dielectric multilayer film such as SiO2 or Ta2O3 on one surface of an element substrate 21 made of a dielectric such as ceramics such as silica glass, borosilicate glass, or low thermal expansion crystallized glass or silicon, and an element-side electrode portion 23 is formed on the other surface.

[0015] The support section 3 comprises multiple structures on which electrical wiring is arranged three-dimensionally, and multiple piezoelectric actuators electrically connected to the electrical wiring. The support section 3 is configured to allow the optical element 2 to rotate around multiple rotation axes and to move in at least one direction of the rotation axes by combining and joining the multiple structures and the multiple piezoelectric actuators.

[0016] Specifically, for example, the support section 3 has a first structure 51 and a second structure 52 as structural components, and a plurality of first piezoelectric actuators 61 and a plurality of second piezoelectric actuators 62 as piezoelectric actuators. The first piezoelectric actuators 61 are disposed between the first structure 51 and the optical element 2. There are, for example, three or more first piezoelectric actuators 61, and they are arranged to allow rotation around the X and Z axes with respect to the optical element 2, as well as movement in the Y axis direction. The second piezoelectric actuators 62 are disposed between the first structure 51 and the second structure 52. There are, for example, three or more second piezoelectric actuators 62, and they are arranged to allow rotation around the X and Y axes with respect to the optical element 2, as well as movement in the Z axis direction.

[0017] As a result, the support portion 3 is configured to allow the optical element 2 to rotate around the X, Y, and Z axes, and to move in the Y and Z directions. Figures 1 and 2 show the case where four first piezoelectric actuators 61 and four second piezoelectric actuators 62 are arranged. Also, in Figures 1 and 2, the first piezoelectric actuators 61 and second piezoelectric actuators 62 are shown with a textured finish for clarity.

[0018] The first structure 51 is made of ceramics such as silica glass, borosilicate glass, or low thermal expansion crystallized glass, or a dielectric material such as silicon. The first structure 51 includes, for example, an element-side first structure 53 to which the first piezoelectric actuator 61 is bonded, and a support-side first structure 54 to which the second piezoelectric actuator 62 is bonded and which supports the element-side first structure 53. The element-side first structure 53 has, for example, a surface perpendicular to the Y-axis, to which the first piezoelectric actuator 61 is bonded. The support-side first structure 54 has, for example, a surface perpendicular to the Z-axis, to which the second piezoelectric actuator 62 is bonded. The second structure 52 is made of ceramics such as silica glass, borosilicate glass, or low thermal expansion crystallized glass, or a dielectric material such as silicon, and supports the first structure 51. The second structure 52 has, for example, a surface perpendicular to the Z-axis, and the second piezoelectric actuator 62 is joined to this surface perpendicular to the Z-axis.

[0019] The element-side first structure 53, the support-side first structure 54, and the second structure 52 are, for example, plate-shaped and have a pair of planes and four sides. The thickness of the element-side first structure 53, the support-side first structure 54, and the second structure 52 is preferably, for example, 0.1 mm or more and 5 mm or less. The size of these planes is preferably, for example, 0.1 mm × 0.1 mm or more and 20 mm × 20 mm or less, and more preferably 0.1 mm × 0.1 mm or more and 10 mm × 10 mm or less.

[0020] The element-side first structure 53 is arranged, for example, with one side facing the support-side first structure 54, and the first piezoelectric actuator 61 is joined to one of its planes. The element-side first structure 53 is provided with a plurality of first electrical wirings 41 as electrical wiring, extending from the plane to which the first piezoelectric actuator 61 is joined to the side facing the support-side first structure 54. The corner between the plane and the side on which the first electrical wirings 41 are provided is preferably chamfered in at least the region where the first electrical wirings 41 are provided, because this makes it easier to form the first electrical wirings 41.

[0021] First electrode portions 42 are provided at both ends of the first electrical wiring 41. One of the first electrical wirings 41 is electrically connected to the optical element 2 side of the first piezoelectric actuator 61. For example, at one of the first electrode portions 42, it is electrically connected to the element-side electrode portion 23 of the optical element 2 by a connection portion 63 made of a conductive polymer or the like. The other first electrical wiring 41 is individually electrically connected at one of its first electrode portions 42 to the element-side first structure 54 side of the first piezoelectric actuator 61. As a result, the first electrical wirings 41 can apply voltage to the first piezoelectric actuator 61.

[0022] The support-side first structure 54 has, for example, an element-side first structure 53 disposed on one plane and a second piezoelectric actuator 62 joined to the other plane. The support-side first structure 54 is provided with a plurality of second electrical wirings 43 as electrical wiring, extending from the plane on which the element-side first structure 53 is disposed to the other plane on which the second piezoelectric actuator 62 is joined, via the side surface. It is preferable that the corners between the plane on which the second electrical wirings 43 are provided and the side surface, and the corners between the side surface and the other plane, are chamfered in at least the region where the second electrical wirings 43 are provided. This is because the second electrical wirings 43 can be easily formed. The second electrical wirings 43 electrically connect the first electrical wirings 41 to a power source, and second electrode portions 44 are provided at both ends of the second electrical wirings 43. One second electrode portion 44 is individually electrically connected to the other first electrode portion 42 of the first electrical wiring 41. Furthermore, on the other plane of the support-side first structure 54, there is a first structure-side electrode portion 55 which is electrically connected to each second piezoelectric actuator 62.

[0023] The second structure 52 has, for example, a second piezoelectric actuator 62 joined to one of its planes. The second structure 52 is provided with a plurality of third electrical wires 45 and a plurality of fourth electrical wires 46 as electrical wiring, extending from one plane through the side to the other plane. It is preferable that the corners between the plane on which the third electrical wires 45 or fourth electrical wires 46 are provided and the side, and the corners between the side and the other plane, be chamfered in at least the area where the third electrical wires 45 or fourth electrical wires 46 are provided. This is because the third electrical wires 45 and fourth electrical wires 46 can be easily formed.

[0024] The third electrical wiring 45 electrically connects the first electrical wiring 41 to the power source via the second electrical wiring 43, and each end of the third electrical wiring 45 is provided with a third electrode portion 47. One of the third electrode portions 47 is individually electrically connected to the other second electrode portion 44 of the second electrical wiring 43 by a connection portion 64 made of a conductive polymer or the like. The other third electrode portion 47 is electrically connected, for example, to a circuit board (not shown) on which the precision positioning device 1 is installed.

[0025] Fourth electrode portions 48 are provided at both ends of the fourth electrical wiring 46. One of the fourth electrical wirings 46 is electrically connected to the support side first structure 54 of the second piezoelectric actuator 62, and one of the fourth electrode portions 48 is electrically connected to the first structure side electrode portion 55 by a connecting portion 64 made of a conductive polymer or the like. The other fourth electrical wiring 46 is individually electrically connected to the second structure 52 of the second piezoelectric actuator 62 at one of its fourth electrode portions 48. As a result, the fourth electrical wiring 46 can apply voltage to the second piezoelectric actuator 62. The other fourth electrode portion 48 is electrically connected to, for example, a circuit board (not shown) on which the precision positioning device 1 is installed.

[0026] The first electrical wiring 41, the first electrode portion 42, the second electrical wiring 43, the second electrode portion 44, the third electrical wiring 45, the fourth electrical wiring 46, the third electrode portion 47, the fourth electrode portion 48, the element-side electrode portion 23, and the first structure-side electrode portion 55 are made of a metal such as gold (Au) or aluminum (Al). Their thickness is, for example, about 100 nm to 1000 nm. A bonding layer made of a metal such as titanium (Ti) or chromium (Cr) may be provided between these and the element-side first structure 53, the support-side first structure 54, or the second structure. The thickness of the bonding layer is, for example, about 1 nm to 20 nm. The first electrode portion 42 and the second electrode portion 44 can be connected and made electrically conductive by, for example, soldering or welding glass to glass using a YAG laser, or by using a conductive polymer.

[0027] The first piezoelectric actuator 61, the first electrode portion 42 and the element-side electrode portion 23, and the second piezoelectric actuator 62, the fourth electrode portion 48 and the first structure-side electrode portion 55 are preferably joined together by, for example, a conductive polymer. This is to allow for mobility. The first piezoelectric actuator 61 and the second piezoelectric actuator 62 are configured to expand and contract in the thickness direction, i.e., in the direction in which the voltage is applied, by adjusting the voltage, for example. As a result, the thickness of the first piezoelectric actuator 61 and the second piezoelectric actuator 62 changes according to the voltage, making the optical element 2 rotatable around the X, Y, and Z axes, and movable in the Y and Z axis directions.

[0028] For example, as shown in Figure 3, if the position of the precision positioning device 1 is represented in two coordinate systems separated by a distance l, then the simultaneous transformation matrix with respect to coordinate system 0 (reference coordinates) is 0 T1 is represented by Equation 1, and is a simultaneous transformation matrix with respect to coordinate system 1. 1 T2 is expressed by Equation 2 and is a simultaneous transformation matrix relating to the rotation / translation of coordinate systems 0 and 1 as seen from the reference coordinate system. 0 T2 is expressed by Equation 3. By multiplying each simultaneous transformation matrix, the rotation of the optical element 2 around the X, Y, and Z axes, as well as its movement in the Y and Z directions, can be electrically controlled.

[0029]

number

[0030] The precision positioning device 1 can be manufactured, for example, as follows. Figures 4 to 8 show the manufacturing process of the precision positioning device 1. First, for example, each component of the precision positioning device 1, namely the optical element 2, namely the mirror, the element-side first structure 53, the support-side first structure 54, and the second structure 52, is manufactured. For the mirror, for example, first, as shown in Figure 4(A), a substrate made of glass or the like is cut to a predetermined size to form an element substrate 21. Next, as shown in Figure 4(B), a reflective film 22 made of a dielectric multilayer film is formed on one surface of the element substrate 21 by sputtering or the like. Subsequently, as shown in Figure 4(C), an element-side electrode portion 23 made of a metal film is formed on the other surface of the element substrate 21 by sputtering or the like.

[0031] The element-side first structure 53 is prepared, for example, first by preparing a substrate 71 made of glass or the like, as shown in Figure 5(A), and forming through holes 72 by drilling or the like, corresponding to the formation positions of the first electrical wiring 41 on the side, as shown in Figures 5(B) and 5(C). At this time, it is preferable to form countersunk holes in the through holes 72 and to chamfer the corners between the surface on which the first electrical wiring 41 is formed and the side surface. Note that Figure 5(C) is a view of Figure 5(B) from one side, and Figure 5(B) shows a cross-sectional configuration along line III-III in Figure 5(C). Next, for example, as shown in Figure 5(D), a stencil mask 73 is formed on one surface of the substrate 71, with openings for the formation areas of the first electrical wiring 41 and the first electrode portion 42. Subsequently, for example, as shown in Figure 5(E), the first electrical wiring 41 and the first electrode portion 42 are formed by sputtering or the like, and the stencil mask 73 is removed. After that, for example, as shown in Figure 5(F), the substrate 71 is cut to a predetermined size. In this process, one side is formed to cut through the through hole 72.

[0032] The support-side first structure 54 can be formed in the same manner as the element-side first structure 53. For example, first, as shown in Figure 6(A), a substrate 71 made of glass or the like is prepared, and through holes 72 are formed by drilling or the like in accordance with the formation positions of the second electrical wiring 43 on the side surface. In this case, it is preferable to form countersunk holes in the through holes 72 on both sides. Next, for example, as shown in Figure 6(B), a stencil mask with openings for the formation areas of the second electrical wiring 43 and the second electrode portion 44 is formed on one surface of the substrate 71, the second electrical wiring 43 and the second electrode portion 44 are formed by sputtering or the like, and the stencil mask is removed. Subsequently, for example, as shown in Figure 6(C), a stencil mask with openings for the formation areas of the second electrical wiring 43, the second electrode portion 44, and the first structure-side electrode portion 55 is formed on the other surface of the substrate 71, the second electrical wiring 43, the second electrode portion 44, and the first structure-side electrode portion 55 are formed by sputtering or the like, and the stencil mask is removed. Subsequently, the substrate 71 is cut to a predetermined size, for example, as shown in Figure 6(D). At this time, one side is formed to cut through a through hole 72.

[0033] The second structure 52 can also be formed in the same manner as the element-side first structure 53. For example, first, as shown in Figure 7(A), a substrate 71 made of glass or the like is prepared, and through holes 72 are formed by drilling or the like in accordance with the formation positions of the third electrical wiring 45 and the fourth electrical wiring 46 on the side. In this case, it is preferable to form countersunk holes in the through holes 72 on both sides. Next, for example, as shown in Figure 7(B), a stencil mask is formed on one surface of the substrate 71 with openings for the formation areas of the third electrical wiring 45, the fourth electrical wiring 46, the third electrode portion 47, and the fourth electrode portion 48, and the third electrical wiring 45, the fourth electrical wiring 46, the third electrode portion 47, and the fourth electrode portion 48 are formed by sputtering or the like, and the stencil mask is removed. Next, as shown in Figure 7(C), for example, a stencil mask is formed on the other side of the substrate 71, with openings for the formation areas of the third electrical wiring 45, the fourth electrical wiring 46, the third electrode portion 47, and the fourth electrode portion 48. The third electrical wiring 45, the fourth electrical wiring 46, the third electrode portion 47, and the fourth electrode portion 48 are then formed by sputtering or the like, and the stencil mask is removed. After that, as shown in Figure 7(D), for example, the substrate 71 is cut to a predetermined size. At this time, two sides are formed so as to cut through holes 72.

[0034] Next, for example as shown in Figure 8(A), the first piezoelectric actuator 61 is joined to the first electrode portion 42 of the element-side first structure 53 using a conductive polymer, and a connecting portion 63 made of a conductive polymer is joined to it. Subsequently, for example as shown in Figure 8(B), the first piezoelectric actuator 61 and the element-side electrode portion 23 are joined using a conductive polymer, and the first electrode portion 42 and the element-side electrode portion 23 are joined to it using a connecting portion 63 made of a conductive polymer. Then, for example as shown in Figure 8(C), a connecting portion 64 made of a conductive polymer is joined to the third electrode portion 47 of the second structure 52, and furthermore, the second piezoelectric actuator 62 is joined to the fourth electrode portion 48 using a conductive polymer, and a connecting portion 65 made of a conductive polymer is joined to it. Next, for example as shown in Figure 8(D), the second piezoelectric actuator 62 and the first structure-side electrode portion 55 are joined together with a conductive polymer, the fourth electrode portion 48 and the first structure-side electrode portion 55 are joined together with a connecting portion 65 made of a conductive polymer, and the third electrode portion 47 and the second electrode portion 44 are joined together with a connecting portion 64 made of a conductive polymer. After that, for example, the second electrode portion 44 and the first electrode portion 42 are brought into contact and electrically connected by soldering or glass-to-glass welding using a YAG laser or the like. This results in the precision positioning device 1 shown in Figure 1.

[0035] This precision positioning device 1 can be used in optical devices. For example, if the optical element 2 is made up of mirrors, the optical path of the laser light can be adjusted by adjusting the reflection direction of the laser light using the mirrors. As an example of an optical device, a sample measurement system using a Mach-Zehnder interferometer will be given for explanation.

[0036] Figure 9 shows the configuration of a sample measurement system using a Mach-Zehnder interferometer. This measurement system includes, for example, a laser oscillator 81, a photodiode 82 that receives laser light from the laser oscillator 81, a circuit board 83 on which the laser oscillator 81 and photodiode 82 are arranged, and two precision positioning devices 1 arranged on the circuit board 83 and positioned on the optical path from the laser oscillator 81 to the photodiode 82. Each precision positioning device 1 has a mirror as an optical element 2. On the optical path between the laser oscillator 81 and one of the precision positioning devices 1, a lens 84, a 1 / 2λ wave plate 85, and a half mirror 86 are arranged on the circuit board 83 in order from the laser oscillator 81 side. On the optical path between the other precision positioning device 1 and the photodiode 82, a half mirror 87, a polarizing plate 88, and a lens 89 are arranged on the circuit board 83 in order from the other precision positioning device 1 side.

[0037] The position of the mirror on one precision positioning device 1 is adjusted by the support part 3 of the one precision positioning device 1 so that the laser light emitted from the laser oscillator 81 passes through the half mirror 86, is reflected by the mirror of the one precision positioning device 1, is reflected by the half mirror 87, and enters the photodiode 82. Similarly, the position of the mirror on the other precision positioning device 1 is adjusted by the support part 3 of the other precision positioning device 1 so that the laser light emitted from the laser oscillator 81 is reflected by the half mirror 86, is reflected by the mirror of the other precision positioning device 1, passes through the half mirror 87, and enters the photodiode 82. In this measurement system, a sample M is placed between the half mirror 86 and the mirror of one precision positioning device 1, and the refractive index of the sample M is measured from the optical path difference due to the difference between the refractive index of the sample M and the refractive index of air.

[0038] In this embodiment, we have described a case where the measurement system for a sample using a Mach-Zehnder interferometer is equipped with two precision positioning devices 1. However, the optical device only needs to be equipped with at least one precision positioning device 1.

[0039] Furthermore, this precision positioning device 1 can be used for precise positioning of the optical element 2 in BBM92 quantum cryptography communication via the first satellite 93 between the first earth station 91 and the second earth station 92, or in BB84 quantum cryptography communication between the third earth station 94 and the second satellite 95, as shown in Figure 10. In BBM92 quantum cryptography communication, two entangled photons are split from the first satellite 93 and sent to the first earth station 91 and the second earth station 92, respectively. In BB84 quantum cryptography communication, a photon is sent from the third earth station 94 to the second satellite 95.

[0040] Thus, according to the precision positioning device 1 of this embodiment, by joining multiple structures on which electrical wiring is arranged three-dimensionally with multiple piezoelectric actuators electrically connected to the electrical wiring, the optical element 2 is made rotatable around multiple rotation axes and movable in at least one direction of the rotation axes. Therefore, by applying microfabrication technology, particularly mounting technology, it is possible to create a three-dimensional electrical wiring 4 and structure, enabling the control of light of weak intensity, such as photons. Furthermore, it is also possible to control high-intensity light in addition to weak light, thus providing broad versatility. Moreover, since it can be integrated on a circuit board, an electromechanical optical control system can be realized, and miniaturization of the entire system can be achieved.

[0041] In the first embodiment, the case was shown in which the element-side first structure 53 is positioned relative to the support-side first structure 54 with the side surface of the support-side first structure 54 and the surface of the mirror's reflective film 22 parallel. However, for example, as shown in Figure 11, the element-side first structure 53 may be positioned relative to the support-side first structure 54 by rotating the surface of the mirror's reflective film 22 by 45° around the Z-axis as the axis of rotation, with respect to the side surface of the support-side first structure 54. Figure 11(A) shows the configuration of the precision positioning device 1 viewed from above, and Figure 11(B) shows the wiring configuration of the element-side surface of the support-side first structure 54.

[0042] Furthermore, as shown in Figure 12, for example, two placement positions for the element-side first structure 53 may be provided on the element-side surface of the support-side first structure 54, allowing for the selection of either a case where the surface of the mirror's reflective film 22 is rotated 45° with respect to the side surface of the support-side first structure around the Z-axis, or a case where the surface of the mirror's reflective film 22 is parallel to the side surface of the support-side first structure 54. Figure 12(A) shows the configuration when the surface of the mirror's reflective film 22 is rotated 45° with respect to the side surface of the support-side first structure, Figure 12(B) shows the configuration when the surface of the mirror's reflective film 22 is parallel to the side surface of the support-side first structure 54, and Figure 12(C) shows the wiring configuration on the element-side surface of the support-side first structure 54.

[0043] In this modified example, as shown in Figure 12(C), two second electrode portions 44 are provided on each second electrical wiring 43 on the element-side surface of the support-side first structure 54, corresponding to the orientation of the element-side first structure 53. The first placement position of the element-side first structure 53 is a position where the surface of the mirror's reflective film 22 and the side surface of the support-side first structure are rotated by 45° around the Z-axis as the axis of rotation, and the second placement position of the element-side first structure 53 is a position where the surface of the mirror's reflective film 22 and the side surface of the support-side first structure 54 are parallel. When the element-side first structure 53 is placed, it is preferable that the center position in the longitudinal direction along the reflective film 22 on the side surface where the first electrode portions 42 are provided coincides with the center position of the element-side surface of the support-side first structure 54.

[0044] Figure 13 shows the optical path when the precision positioning device 1 is used to reflect laser light, indicated by arrows. When the element-side first structure 53 is positioned at the first placement position, the laser light is reflected as shown in Figure 13(A), for example. When the element-side first structure 53 is positioned at the second placement position, the laser light is reflected as shown in Figure 13(B), for example. In this way, the placement position of the element-side first structure 53 can be arbitrarily selected between the first and second placement positions depending on where the precision positioning device 1 is to be installed.

[0045] (Modification 2) In the first embodiment, when forming the first electrical wiring 41, second electrical wiring 43, third electrical wiring 45, or fourth electrical wiring 46 on the side surfaces of the element-side first structure 53, the support-side first structure 54, and the second structure 52, a through hole 72 is provided in the substrate 71, a metal film is formed on its inner wall, and it is cut so as to pass through the through hole 72. However, the substrate 71 may be cut to a predetermined size, and then the first electrical wiring 41, second electrical wiring 43, third electrical wiring 45, and fourth electrical wiring 46 may be provided on the side surface of the second structure 52. Figure 14 shows an example of the configuration of Modified Example 2. In Modified Example 2, for example, it is preferable that the corner between one plane and the side surface on which the first electrical wiring 41 of the element-side first structure 53 is formed is chamfered. Also, it is preferable that the corner between one plane and the side surface on which the second electrical wiring 43 of the support-side first structure 54 is formed, and the corner between the side surface and the other plane are chamfered. Furthermore, it is preferable that the corners of the second structure 52 where one plane forming the third electrical wiring 45 or the fourth electrical wiring 46 meets the side surface, and where the side surface meets the other plane surface, be chamfered. This is because the first electrical wiring 41, the second electrical wiring, the third electrical wiring 45, and the fourth electrical wiring 46 can be easily formed.

[0046] The present invention has been described above with reference to embodiments, but the present invention is not limited to the above embodiments and can be modified in various ways. For example, although each component was described in detail in the above embodiments, other components may also be included. Furthermore, the descriptions of each component are merely examples and may differ. [Explanation of Symbols]

[0047] 1...Precision positioning device, 2...Optical element, 3...Support part, 21...Element substrate, 22...Reflective film, 23...Element-side electrode part, 41...First electrical wiring, 42...First electrode part, 43...Second electrical wiring, 44...Second electrode part, 45...Third electrical wiring, 46...Fourth electrical wiring, 47...Third electrode part, 48...Fourth electrode part, 51...First structure, 52...Second structure, 53...Element-side first structure, 54...Support-side first structure, 55...First structure-side electrode part, 61... 1st piezoelectric actuator, 62…2nd piezoelectric actuator, 63, 64, 65…connection part, 71…substrate, 72…through hole, 73…stencil mask, 81…laser oscillator, 82…photodiode, 83…circuit board, 84, 89…lens, 85…1 / 2λ wave plate, 86, 87…half mirror, 88…polarizer, 91…1st earth station, 92…2nd earth station, 93…1st artificial satellite, 94…3rd earth station, 95…2nd artificial satellite

Claims

1. It comprises an optical element and a support portion that supports the optical element, The support portion is configured to allow the optical element to rotate around multiple rotation axes and to move in at least one direction of the rotation axes by joining a plurality of structures on which electrical wiring is arranged three-dimensionally with a plurality of piezoelectric actuators electrically connected to the electrical wiring. The support portion has a first structure and a second structure as the structure, and has a plurality of first piezoelectric actuators and a plurality of second piezoelectric actuators as the piezoelectric actuator. The first piezoelectric actuator is disposed between the first structure and the optical element, and is arranged so as to be rotatable with respect to the optical element with respect to the X and Z axes as rotation axes, and movable in the Y axis direction. The second piezoelectric actuator is disposed between the first structure and the second structure, and is arranged so that the optical element can rotate around the X and Y axes as rotation axes and move in the Z axis direction. A precision positioning device characterized by the following features.

2. The precision positioning device according to claim 1, characterized in that the optical element is a mirror.

3. The precision positioning device according to claim 2, characterized in that the optical path of the laser beam is adjusted by adjusting the reflection direction of the laser beam with the aforementioned mirror.

4. Laser oscillator and, A photodiode that receives laser light from the aforementioned laser oscillator, A circuit board on which the laser oscillator and the photodiode are arranged, At least one precision positioning device according to claim 1, disposed on the circuit board and positioned on the optical path from the laser oscillator to the photodiode, An optical device characterized by having the following features.

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