Wiring bending jig and wiring bending method using this jig

Abstract

To impart a desired bending habit to a wire while protecting a connection between a substrate and the wire from breaking.SOLUTION: A substrate 7 is arranged in an insertion recess 5 provided on a base plate 2, and a wire 6 continuous from the substrate 7 within the insertion recess 5 is inserted and arranged in a guide groove 8 for wiring bend treatment continuously arranged from the insertion recess 5 to an edge 4 on the base plate 2, and after the tip side of the wire 6 is arranged on the outside of the base plate 2 from the guide groove 8, in a state where an engaged part 14 provided on a cover plate 3 is engaged with an engaging part 11 provided on the base plate 2, after covering the cover plate 3 capable of covering the surface of the base plate 2, the tip side of the wire 6 is bent along the outside surface 18 of an edge 4 side of the base plate 2, thereby giving a bending habit to the wire 6.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a jig for imparting a bending tendency in the guiding direction to a wiring connected to a substrate when guiding the wiring to a desired position at a short distance from the connection portion with the substrate, and a wiring bending method using this jig.

Background Art

[0002] When guiding a wiring connected to a substrate to a position at a short distance from the connection portion between the substrate and the wiring, it is necessary to bend and guide the wiring in a desired direction. Conventionally, this wiring bending work has generally been performed manually. However, when performing the wiring bending work manually, large variations occur in the bending angle and bending radius. Particularly when the bending radius is large, when the start of bending of the wiring is located near the connection portion between the substrate and the wiring, a large load is applied to the connection portion between the substrate and the wiring, and there is a risk of problems such as disconnection occurring at the connection portion.

[0003] Therefore, as shown in Patent Document 1, a processing method for imparting a bending tendency to the wiring in advance is already known.

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, when adopting the conventional method as described above, it is possible to impart a bending tendency to the wiring, but it is difficult to prevent damage to the connection portion between the wiring and the substrate. Therefore, this problem has still not been solved.

[0005] Therefore, the first and second inventions of the present application aim to solve the above problems, and aim to be able to impart a desired bending tendency to the wiring while preventing damage to the connection portion between the substrate and the wiring.

Means for Solving the Problems

[0006] The first invention of the present application solves the above-mentioned problems and comprises a base plate and a covering plate that covers the surface of the base plate. The base plate is provided with an engaging portion for fixing the position of the covering plate on the upper surface of the base plate, an insertion recess into which a substrate can be inserted, and a guide groove for wiring bending that extends from the insertion recess to the edge of the base plate. The covering plate is provided with an engaged portion that can engage with the engaging portion.

[0007] Furthermore, the second invention of this application is a wiring bending method using the jig of the first invention, wherein a substrate is placed in an insertion recess provided in a base plate, and wiring continuous from the substrate in the insertion recess is inserted into a guide groove for wiring bending provided on the base plate continuously from the insertion recess to the edge, and the tip of this wiring side After being positioned outside the base plate from the above guide groove, A coating that can cover the surface of the base plate. With the engaging portion provided on the cover plate engaged with the engaging portion provided on the base plate, the surface of the base plate The above After covering the cover plate, the end of the above wiring is placed at the edge of the base plate. veranda By bending it along the outer surface, the above wiring is given a curved shape.

[0008] Furthermore, in the first invention of this application described above, the covering plate may be transparent or translucent.

[0009] Furthermore, in the first invention of the present application, the engaging portion may be a pin member, and a through hole is provided at the corresponding position of the pin member on the covering plate, allowing the pin member to be inserted, with the insertion hole being the engaged portion.

[0010] Furthermore, in the first invention of the present application, the guide groove may be provided perpendicular to the edge of the base plate. As a result, the corner formed by the guide groove and the edge of the base plate becomes a right angle, and when the wiring is bent along this corner, it becomes possible to create a bend in the wiring at an angle close to a right angle at a position away from the connection point between the wiring and the substrate. [Effects of the Invention]

[0011] As described above, the first and second inventions of this application provide a base plate with an insertion recess into which a substrate can be inserted, and a guide groove for bending wiring that extends from this insertion recess to the edge of the base plate. Therefore, the connection between the substrate and the wiring extending from the substrate can be fixed by the base plate, making it possible to maintain a good condition.

[0012] Furthermore, since the angle between the guide groove and the edge of the base plate is constant, by bending the wiring extending from the guide groove along the edge of the base plate, it is possible to create a fixed angle of bend in the wiring at a position away from the connection point with the substrate. Therefore, it is possible to reduce the load on the connection point of the wiring with the substrate and to prevent variations in the bending angle of the wiring, as multiple wires can all be bent at a constant angle. [Brief explanation of the drawing]

[0013] [Figure 1] A plan view of a jig, substrate, and wiring illustrating Embodiment 1 of the first and second inventions of this application. [Figure 2] A plan view showing the base plate and covering plate of Example 1. [Figure 3] A perspective view showing the opposing state of the base plate and the covering plate in Example 1. [Figure 4] A plan view showing the base plate on which the circuit board and wiring are arranged in Example 1. [Figure 5] Plan view of the substrate and wiring that underwent bending in Example 1. [Example 1]

[0014] Embodiment 1 of the first and second inventions of this application will be described below. As shown in Figure 1, (1) is a jig for bending wiring. As shown in Figure 2, this jig (1) consists of a flat, rectangular base plate (2) and a transparent covering plate (3) of the same dimensions and shape as the base plate (2). The base plate (2) has a rectangular insertion recess (5) on the edge (4) side rather than the center. This insertion recess (5) is sized to allow insertion of a substrate (7) to which wiring (6) to be bent is connected. As shown in Figure 2, this insertion recess (5) is positioned parallel to the edge (4) of the base plate (2) at a certain distance from it.

[0015] Furthermore, a guide groove (8) is provided between the insertion recess (5) and the edge (4) of the base plate (2), perpendicular to the edge (4). As shown in Figure 2, this guide groove (8) is formed continuously from the insertion recess (5) to the edge (4), and its depth is shallower than that of the insertion recess (5). In addition, the base plate (2) has a corner (10) near the insertion recess (5) and pin members (12), which are the engaging parts (11) of this embodiment, protruding from the corner (10) and diagonally across the insertion recess (5).

[0016] Furthermore, the covering plate (3) is formed to have the same dimensions and shape as the base plate (2), and when the two are superimposed, they are formed to fit together perfectly as shown in Figure 1. In addition, the covering plate (3) has two insertion holes (13) of a size that allows the pin members (12) to be inserted, as shown in Figure 3, corresponding to the positions of the pin members (12) provided on the base plate (2), and these insertion holes (13) are the engaged portions (14) in this embodiment. In addition, the covering plate (3) has an insertion opening (16) that allows the protrusion (15) of the substrate (7) to be inserted into the insertion recess (5), as shown in Figure 1, and is provided at a position corresponding to the position where the protrusion (15) of the substrate (7) is placed.

[0017] A method for bending the wiring (6) using the jig (1) formed as described above will be described below. First, the substrate (7) is inserted and arranged in the insertion recess (5) formed as described above. At this time, since a plurality of wirings (6) are connected to the substrate (7), as shown in FIG. 4, these wirings (6) are inserted and arranged in parallel in the guide groove (8).

[0018] At this time, since the guide groove (8) is formed shallower than the insertion recess (5), the wiring (6) can be inserted and arranged in the guide groove (8) without applying a load to the connection portion (17) between the wiring (6) and the substrate (7). Therefore, the connection state between the substrate (7) and the wiring (6) can be kept good.

[0019] Then, the substrate (7) and all the wirings (6) are respectively arranged in the insertion recess (5) and the guide groove (8) as described above, and with the tip side (20) of the wiring (6) arranged outside the base plate (2) from the guide groove (8), the covering plate (3) is covered from above the base plate (2) as shown in FIG. 3.

[0020] At this time, since an insertion hole (13) having a size through which the pin member (12) can be inserted is provided at the corresponding position of the pin member (12) provided on the base plate (2), the two pin members (12) of the base plate (2) are inserted into the insertion holes (13), and the covering plate (3) is arranged on the base plate (2) in a state where the pin member (12) and the insertion hole (13) are engaged.

[0021] Further, since an insertion opening (16) through which the protrusion (15) of the substrate (7) arranged in the insertion recess (5) can be inserted is arranged at the corresponding position of the protrusion (15) on the covering plate (3), by covering the covering plate (3) on the base plate (2), the protrusion (15) of the substrate (7) protrudes from the insertion opening (16) and is arranged. As described above, the base plate (2) and the covering plate (3) are joined in a state where they fit exactly on the outer periphery and the opposing surface as shown in FIG. 1, and the substrate (7) and the wiring (6) on the base plate (2) are position-fixed by the covering plate (3).

[0022] Therefore, the connection portion (17) between the substrate (7) disposed on the base plate (2) and the wiring (6) continuous from the substrate (7) is fixed by the insertion recess (5), the guide groove (8), and the cover plate (3) of the base plate (2). Thereafter, by bending the wiring (6) in a desired direction in such a state, the load on the connection portion (17) between the substrate (7) and the wiring (6) is reduced, so that it is possible to prevent the situation where the wiring (6) or the connection portion (17) is damaged or cut, and while maintaining a good connection state between the substrate (7) and the plurality of wirings (6) connected to the substrate (7), the bending process of the plurality of wirings (6) can be performed.

[0023] In such a state, a bending process is performed to bend the wirings (6) located outside the base plate (2) one by one. That is, the tip side (20) of each wiring (6) is bent along the outer surface (18) on the edge (4) side of the base plate (2). As a result, since the wiring (6) can be bent in a desired direction at a position away from the connection portion (17) between the wiring (6) and the substrate (7) and the angle formed by the guide groove (8) and the edge (4) of the base plate (2) is constant, by bending the wiring (6) extending from the guide groove (8) along the edge (4) of the base plate (2) as described above, a bending habit can be given to the wiring (6) at a constant angle.

[0024] After the bending process of all the wirings (6) is completed, the substrate (7) and the wirings (6) are taken out from the base plate (2). At this time, as shown in FIG. 5, since all the plurality of wirings (6) are in a state where they are bent at a constant angle, it is possible to prevent the variation in the bending angles of the plurality of wirings (6). Further, since the bending process of the wiring (6) is performed in a state where the cover plate (3) is covered on the base plate (2) as described above, it is possible to prevent the situation where the operator's hand directly contacts the substrate. Therefore, it also leads to the suppression of fiber adhesion by the work gloves worn during the work.

Explanation of Reference Numerals

[0025] 1. Jig 2 Base plate 3 Covering plate 4 Edge 5 Insertion recess 6 Wiring 7 circuit boards 8 Guide groove 11 Engagement part 12 Pin members 13 Through hole 14 Engaged part 18 External surface 20 Tip side

Claims

1. A wiring bending jig comprising a base plate and a covering plate covering the surface of the base plate, wherein the base plate is provided with an engaging portion for fixing the position of the covering plate on the upper surface of the base plate, an insertion recess into which a substrate can be inserted, and a guide groove for wiring bending processing that extends from the insertion recess to the edge of the base plate, and the covering plate is provided with an engaged portion that can engage with the engaging portion.

2. The wiring bending jig according to claim 1, characterized in that the covering plate is transparent or translucent.

3. The jig for bending wiring according to claim 1, characterized in that the engaging portion is a pin member, and an insertion hole is provided at a corresponding position of the pin member on the covering plate, through which the pin member can be inserted, and the insertion hole is the engaged portion.

4. The wiring bending jig according to claim 1, characterized in that the guide groove is provided in a direction perpendicular to the edge of the base plate.

5. A wiring bending method using a wiring bending jig, characterized by placing a substrate in an insertion recess provided in a base plate, inserting wiring continuous from the substrate in the insertion recess into a guide groove for wiring bending processing provided on the base plate from the insertion recess to the edge, positioning the leading end of the wiring outward from the guide groove to the base plate, then covering the surface of the base plate with the cover plate while engaging the engaging portion provided on the cover plate, and finally bending the leading end of the wiring along the outer surface of the base plate's edge to create a bend in the wiring.

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