Fluid handling systems, methods, and lithography apparatus

Abstract

A fluid handling system for a lithographic apparatus is disclosed. The fluid handling system is configured to confine immersion liquid to a liquid confinement space between a part of a projection system in the lithographic apparatus and a surface of a substrate such that a radiation beam projected from the projection system can pass through the immersion liquid to irradiate the surface of the substrate. The fluid handling system comprises an exchangeable plate having a coated outer surface with a plurality of fluid openings configured for supply and / or removal of immersion liquid and / or gas in channels between the fluid handling system and the substrate.

Description

Technical Field

[0001] [Cross - reference to related applications] This application claims the priority of European application 20216868.8 filed on December 23, 2020, the entire content of which is incorporated herein by reference.

[0002] [Technical Field] The present invention relates to fluid handling systems and device manufacturing methods. The present invention also relates to lithographic apparatuses.

Background Art

[0003] A lithographic apparatus is an apparatus configured to apply a desired pattern onto a substrate. A lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). A lithographic apparatus may project a pattern of a patterning device (e.g., a mask) (often also referred to as a "design layout" or "design") onto a layer of radiation - sensitive material (resist) provided on a substrate (e.g., a wafer). Known lithographic apparatuses include so - called steppers in which each target portion is irradiated by exposing the entire pattern once onto the target portion, and so - called scanners in which each target portion is irradiated by simultaneously scanning the substrate parallel or non - parallel to this direction while scanning the pattern in a predetermined direction ("scan" direction) through a radiation beam.

[0004] As semiconductor manufacturing processes continue to advance, the size of circuit elements has steadily decreased over the past few decades, while the quantity of functional elements such as transistors per device has steadily increased, following a trend commonly referred to as "Moore's Law." The semiconductor industry is pursuing technologies that enable the generation of increasingly smaller features to keep pace with Moore's Law. To project patterns onto a substrate, lithography equipment may use electromagnetic radiation. The wavelength of this radiation determines the minimum size of the features that can be patterned on the substrate. Typical wavelengths currently in use are 365 nm (i-line), 248 nm, 193 nm, and 13.5 nm.

[0005] Further improvements in the resolution of smaller features may be achieved by providing an immersion fluid, such as water, with a relatively high refractive index on the substrate during exposure. The effect of the immersion fluid is that the exposure radiation in the fluid has shorter wavelengths than in a gas, enabling imaging of smaller features. The effect of the immersion fluid also increases the effective numerical aperture (NA) of the system and increases the depth of focus.

[0006] The immersion fluid may be restricted by a fluid handling structure to a localized area between the projection system and the substrate of the lithography apparatus. The use of such an immersion fluid can lead to the presence of droplets on the substrate surface. These droplets can be problematic because they create drying spots on the substrate and, when they hit the meniscus of the immersion fluid, can lead to the formation of bubbles due to trapped gases in the immersion fluid. Bubbles in the immersion fluid can lead to defects printed on the substrate. The likelihood of such bubbles being introduced can be reduced by reducing the relative velocity of the substrate. [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] Fluid handling structures have openings to provide flow for immersion fluids and gases. Maintenance of fluid handling structures includes operations to clear blockages in the openings. Maintenance of fluid handling structures may reduce the availability of lithography equipment.

[0008] The objective of the present invention is to provide a fluid handling system that reduces downtime for maintenance. [Means for solving the problem]

[0009] According to a first aspect of the present invention, a fluid handling system is provided for a lithography apparatus. The fluid handling system is configured to restrict the immersion liquid to a liquid-restricted space between a portion of the projection system and the surface of the substrate in the lithography apparatus, so that a radiation beam projected from the projection system can irradiate the surface of the substrate by passing through the immersion liquid. The fluid handling system comprises a replaceable plate having a coated outer surface, which includes a plurality of fluid openings configured for supplying and / or withdrawing immersion liquid and / or gas in a channel between the fluid handling system and the substrate.

[0010] According to a second aspect of the present invention, a fluid handling system is provided for a lithography apparatus. The fluid handling system is configured to restrict the immersion liquid to a liquid-restricted space between a portion of the projection system and the surface of the substrate in the lithography apparatus, so that a radiation beam projected from the projection system can irradiate the surface of the substrate by passing through the immersion liquid. The fluid handling system comprises a plurality of interchangeable plates, each having an outer surface with a plurality of fluid openings configured for supplying and / or withdrawing immersion liquid and / or gas in a channel between the fluid handling system and the substrate.

[0011] According to a third aspect of the present invention, a fluid handling system is provided for a lithography apparatus. The fluid handling system is configured to restrict the immersion liquid to a liquid-restricted space between a portion of the projection system and the surface of the substrate in the lithography apparatus, so that a radiation beam projected from the projection system can irradiate the surface of the substrate by passing through the immersion liquid. The fluid handling system comprises a replaceable plate for supplying and / or removing the immersion liquid and / or gas in a channel between the fluid handling system and the substrate, the plate comprising a porous member.

[0012] According to a fourth aspect of the present invention, a fluid handling system is provided for a lithography apparatus. The fluid handling system is configured to restrict the immersion liquid to a liquid-restricted space between a portion of the projection system and the surface of the substrate in the lithography apparatus, so that a radiation beam projected from the projection system can irradiate the surface of the substrate by passing through the immersion liquid. The fluid handling system comprises one or more bumper plates, the outer surface of which provides a boundary surface between the fluid handling system and the channel between the fluid handling system and the substrate, and the surface of the bumper plate provides a minimum gap across the channel between the fluid handling system and the substrate.

[0013] According to a fifth aspect of the present invention, a lithography apparatus according to any of the first to fourth aspects is provided.

[0014] Further embodiments, features, and advantages of the present invention, as well as the structure and operation of various embodiments, features, and advantages of the present invention, are described in detail below with reference to the accompanying drawings. [Brief explanation of the drawing]

[0015] Hereafter, embodiments of the invention will be described for illustrative purposes only, with reference to the following accompanying schematic diagrams in which the corresponding reference numerals represent the corresponding parts.

[0016] Figure 1 shows a schematic overview of a lithographic apparatus.

[0017] Figures 2A, 2B, 2C and 2D show in cross - section two different versions of a fluid handling system having different features exemplified on the left - hand and right - hand sides of each version, which may extend over the full circumference.

[0018] Figures 3A, 3B and 3C show a fluid handling system and a part of a substrate in a lithographic apparatus.

[0019] Figures 4A and 4B show a part of a fluid handling structure according to the first embodiment.

[0020] Figures 5A, 5B and 5C show a part of a fluid handling structure according to the second embodiment.

[0021] Figure 6 shows a damper surface according to the third embodiment.

[0022] Figure 7 shows a damper surface according to the fourth embodiment.

[0023] The features shown are not necessarily to scale and are not limited to the sizes and / or arrangements shown. The figures are understood to include optional features that are not essential to the invention. Further, not all features of the apparatus are shown in each of the figures and the figures may show only some of the relevant components for describing a particular feature.

BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In this document, the terms “radiation” and “beam” are used to encompass all types of electromagnetic radiation including ultraviolet radiation (e.g., having a wavelength of 365, 248, 193, 157 or 126 nm).

[0025] The terms “reticle,” “mask,” or “patterning device” as used in this text may be broadly interpreted to refer to any general patterning device that can be used to impart a patterned cross-section to an incident radiation beam, corresponding to a pattern to be generated on a target portion of a substrate. The term “light bulb” may also be used in this context. In addition to classic masks (transmissive or reflective, binary, phase-shifted, hybrid, etc.), other examples of such patterning devices include programmable mirror arrays and programmable LCD arrays.

[0026] Figure 1 schematically shows a lithography apparatus. The lithography apparatus includes an illumination system (also referred to as an illuminator) IL configured to adjust a radiation beam B (e.g., UV radiation or DUV radiation), a mask support (e.g., a mask table) MT configured to support a patterning device (e.g., a mask) MA and connected to a first positioner PM configured to precisely position the patterning device MA according to specific parameters, a substrate support (e.g., a substrate table) WT configured to hold a substrate (e.g., a wafer coated with resist) W and connected to a second positioner PW configured to precisely position a substrate support WT according to specific parameters, and a projection system (e.g., a refractive projection lens system) PS configured to project the pattern formed by the patterning device MA onto the radiation beam B onto a target portion C of the substrate W (e.g., including one or more dies). A controller 500 controls the overall operation of the apparatus. The controller 500 may be a central control system or a system of multiple separate subcontrollers within various subsystems of the lithography apparatus.

[0027] During operation, the illumination system IL receives the radiation beam B from the radiation source SO, for example via the beam delivery system BD. The illumination system IL may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic and / or other types of optical components, for example for directing, shaping and / or controlling the radiation, or any combination thereof. The illuminator IL may be used to condition the radiation beam B such that it has a desired spatial and angular intensity distribution in a plane of the patterning device MA and in its cross-section.

[0028] As used herein, the term "projection system" PS is to be construed broadly to include various types of projection systems, including refractive, reflective, catadioptric, anamorphic, magnetic, electromagnetic and / or electrostatic optical systems, or any combination thereof, suitable for the exposure radiation in use and / or other elements such as the use of a liquid immersion liquid or a vacuum. The use of the term "projection lens" herein may be construed synonymously with the more general term "projection system" PS.

[0029] The lithographic apparatus may be of a type in which at least part of the substrate W is covered by a liquid immersion liquid, such as water, having a relatively high refractive index, to fill the liquid immersion space 11 between the projection system PS and the substrate W (also referred to as liquid immersion lithography). More information on liquid immersion techniques is given in US 6,952,253, which is incorporated herein by reference.

[0030] The lithographic apparatus may be of a type having two or more substrate supports WT (also referred to as "dual stage"). In such a "multi-stage" apparatus, the substrate supports WT may be used in parallel and / or preparatory steps for a subsequent exposure of the substrate W may be carried out on the substrate W located on one of the substrate supports WT while the other substrate W on the other substrate support WT is being used for exposing a pattern on the other substrate W. [[ID=1b4]]

[0031] In addition to the substrate support WT, the lithography apparatus may include a measurement stage (not shown). The measurement stage is provided to hold sensors and / or cleaning devices. The sensors may be provided to measure the characteristics of the projection system PS or the characteristics of the radiating beam B. The measurement stage may hold multiple sensors. The cleaning devices may be provided to clean parts of the lithography apparatus, such as parts of the projection system PS or parts of the system that provides the immersion fluid. The measurement stage may move under the projection system PS when the substrate support WT is separated from the projection system PS.

[0032] During operation, the radiant beam B is incident on a patterning device such as a mask MA held on a mask support MT, and a pattern is formed by the pattern (design layout) present on the patterning device MA. After passing through the mask MA, the radiant beam B passes through a projection system PS that focuses the beam onto a target portion C of the substrate W. A second positioner PW and a position measurement system IF can precisely drive the substrate support WT to position different target portions C at focusing and alignment positions along the path of the radiant beam B, for example. Similarly, a first positioner PM and other appropriate position sensors (not explicitly shown in Figure 1) may be used to precisely position the patterning device MA relative to the path of the radiant beam B. The patterning device MA and the substrate W may be aligned using mask alignment marks M1, M2 and substrate alignment marks P1, P2. The illustrated substrate alignment marks P1, P2 occupy dedicated target portions, but they may be located in the spaces between target portions. The substrate alignment marks P1 and P2, positioned between target portions C, are known as scribe line alignment marks.

[0033] To illustrate the invention, the Cartesian coordinate system is used. The Cartesian coordinate system has three axes: the x-axis, the y-axis, and the z-axis. Each of the three axes is orthogonal to the other two axes. A rotation around the x-axis is denoted as Rx rotation. A rotation around the y-axis is denoted as Ry rotation. A rotation around the z-axis is denoted as Rz rotation. The x-axis and y-axis define the horizontal plane, and the z-axis defines the vertical direction. The Cartesian coordinate system is not limiting to the invention and is used solely for illustrative purposes. Alternatively, other coordinate systems, such as the cylindrical coordinate system, may be used to illustrate the invention. For example, the orientation of the Cartesian coordinate system may be different, such that the z-axis has a component along the horizontal plane.

[0034] Immersion technology has been introduced into lithography systems to enable improved resolution of smaller features. In an immersion lithography apparatus, a liquid layer of immersion fluid with a relatively high refractive index is interposed in the immersion space 11 between the apparatus's projection system PS (through which a patterned beam is projected toward the substrate W) and the substrate W. The immersion fluid covers at least a portion of the substrate W below the final element of the projection system PS. Thus, at least a portion of the substrate W is immersed in the immersion fluid during exposure.

[0035] In commercially available immersion lithography, the immersion fluid is water. This water is typically high-purity distilled water, such as ultrapure water (UPW), commonly used in semiconductor manufacturing plants. In immersion systems, the UPW is frequently purified and may require additional processing steps before being supplied as the immersion fluid to the immersion space 11. Other liquids with high refractive indices, such as hydrocarbons (including fluorinated hydrocarbons) and / or aqueous solutions, can also be used as immersion fluids. Furthermore, other fluids besides liquids are also expected to be used in immersion lithography.

[0036] In this specification, references are made in descriptions of localized immersion in which the immersion fluid being used is confined to an immersion space 11 between the final element 100 and the surface facing the final element 100. The facing surface is the surface of the substrate W or the surface of the support stage (or substrate support WT) that is coplanar with the surface of the substrate W (in the following text, unless otherwise specified, references to the surface of the substrate W also refer to the surface of the substrate support WT, and vice versa). A fluid handling structure 12 located between the projection system PS and the substrate support WT is used to confine the immersion fluid to the immersion space 11. The immersion space 11, filled with the immersion fluid, is smaller than the outermost surface of the substrate W in plan view, and the immersion space 11 remains substantially stationary relative to the projection system PS while the substrate W and substrate support WT move below.

[0037] Other immersion systems are also anticipated, such as unrestricted immersion systems (so-called "all-wet" immersion systems) and bath-type immersion systems. In an unrestricted immersion system, the immersion liquid covers more than the surface below the final element 100. The liquid outside the immersion space 11 exists as a thin liquid film. The liquid may cover the entire surface of the substrate W or the substrate W and the substrate support WT coplanar with the substrate W. In a bath-type system, the substrate W is completely immersed in the bath of immersion liquid.

[0038] The fluid handling structure 12 is a structure that restricts the immersion fluid to the immersion space 11 by supplying the immersion fluid to the immersion space 11 and removing the immersion fluid from the immersion space 11. It includes features that are part of a fluid supply system. The arrangement disclosed in PCT Patent Application Publication No. WO99 / 49504 is an early fluid handling structure comprising a pipe that supplies or collects the immersion fluid from the immersion space 11 and operates in accordance with the relative movement of the stage under the projection system PS. In newer designs, the fluid handling structure extends along at least a portion of the boundary of the immersion space 11 between the final element 100 of the projection system PS and the substrate support WT or substrate W, and partially defines the immersion space 11.

[0039] The fluid handling structure 12 may have a selection of different functions. Each function may be derived from a corresponding feature that enables the fluid handling structure 12 to perform that function. The fluid handling structure 12 may be described by many different terms that represent its function, such as barrier member, seal member, fluid supply system, fluid removal system, liquid limiting structure, etc.

[0040] The fluid handling structure 12, as a barrier member, is a barrier against the flow of immersion fluid from the immersion space 11. As a liquid limiting structure, the structure restricts the immersion fluid to the immersion space 11. The sealing feature of the fluid handling structure 12, as a seal member, forms a seal for restricting the immersion fluid to the immersion space 11. The sealing feature may include an additional gas flow from an opening on the surface of the seal member, such as a gas knife.

[0041] In one embodiment, the fluid handling structure 12 may supply immersion fluid as a fluid supply system.

[0042] In one embodiment, the fluid handling structure 12 may, at least partially, restrict the immersion fluid as a fluid limiting system.

[0043] In one embodiment, the fluid handling structure 12 may provide a barrier to the immersed fluid as a barrier member such as a fluid limiting structure.

[0044] In one embodiment, the fluid handling structure 12 may generate or use a gas flow to assist, for example, in controlling the flow and / or position of an immersion fluid.

[0045] The gas flow may form a seal to restrict the immersed fluid, and the fluid handling structure 12 may be represented as a seal member. Such a seal member may also be a fluid restricting structure.

[0046] In one embodiment, an immersion liquid is used as the immersion fluid. In this case, the fluid handling structure 12 may be a liquid handling system. By reference to the above description, references to features defined in relation to fluids in these paragraphs are understood to include features defined in relation to liquids.

[0047] The lithography apparatus has a projection system PS. During exposure of a substrate W, the projection system PS projects a beam of patterned radiation onto the substrate W. To reach the substrate W, the path of the radiation beam B is from the projection system PS, through an immersion liquid restricted by a fluid handling structure 12 between the projection system PS and the substrate W. The projection system PS has a lens element that contacts the immersion liquid at the end of the beam path. This lens element that contacts the immersion liquid may be referred to as the "final lens element" or "final element". The final element 100 is at least partially surrounded by the fluid handling structure 12. The fluid handling structure 12 may restrict the immersion liquid below the final element 100 and above the opposing surface.

[0048] Figures 2a, 2b, 2c, and 2d illustrate different features that may be present in various fluid handling systems. Designs may share some of the same features as those in Figures 2a, 2b, 2c, and 2d, unless otherwise specified. The features described herein may be selected individually or in combination as shown or as necessary. The figures show different versions of a fluid handling system having different features illustrated on the left and right sides, which may extend around the entire circumference. Thus, for example, a fluid handling system may have the same features extending around the entire circumference. For example, a fluid handling system may have only the features on the left side of Figure 2a, or the right side of Figure 2a, or the left side of Figure 2b, or the right side of Figure 2b, or the left side of Figure 2c, or the right side of Figure 2c, or the left side of Figure 2d, or the right side of Figure 2d. Alternatively, a fluid handling system may have any combination of features from these figures provided at different positions in the circumferential direction. A fluid handling system may comprise various fluid handling structures 12 described below.

[0049] Figure 2a shows a fluid handling structure 12 around the base of the final element 100. The final element 100 has an inverted frustoconical shape. The frustoconical shape has a flat base and a conical surface. The frustoconical shape has a flat base protruding from the flat surface. The flat base is the optically active portion of the base of the final element 100 through which the radiation beam B may pass. The final element 100 may have a coating 30. The fluid handling structure 12 surrounds at least a portion of the frustoconical shape. The fluid handling structure 12 has an inner surface opposite to the conical surface of the frustoconical shape. The inner surface and the conical surface may have complementary shapes. The top surface of the fluid handling structure 12 may be substantially flat. The fluid handling structure 12 may fit around the frustoconical shape of the final element 100. The bottom surface of the fluid handling structure 12 may be substantially flat, and during use, the bottom surface may be parallel to the opposing surface of the substrate support WT and / or the substrate W. Thus, the bottom surface of the fluid handling structure 12 may be represented as the surface opposite to the surface of the substrate W. The distance between the bottom surface and the opposing surface may be in the range of 30 to 500 micrometers, preferably in the range of 80 to 200 micrometers.

[0050] The fluid handling structure 12 extends from the final element 100 to near the opposing surfaces of the substrate W and the substrate support WT. The immersion space 11 is therefore defined between the inner surface of the fluid handling structure 12, the flat surface of the frustoconical portion, and the opposing surface. During use, the immersion space 11 is filled with immersion fluid. The immersion fluid fills at least a portion of the buffer space between the complementary surfaces of the final element 100 and the fluid handling structure 12 (in one embodiment, at least a portion of the space between the complementary inner surface and the conical surface).

[0051] The immersion fluid is supplied to the immersion space 11 through an opening formed on the surface of the fluid handling structure 12. The immersion fluid may also be supplied through a supply opening 20 on the inner surface of the fluid handling structure 12. Alternatively, or in addition, the immersion fluid may be supplied from a downward supply opening 23 formed on the bottom surface of the fluid handling structure 12. The downward supply opening 23 may surround the path of the radiation beam B and may be formed as a series of openings in an array or a single slit. The immersion fluid is supplied to fill the immersion space 11, and the flow through the immersion space 11 under the projection system PS becomes layered. The supply of immersion fluid from the downward supply opening 23 additionally prevents bubbles from entering the immersion space 11. This supply of immersion fluid may also function as a liquid seal.

[0052] The immersion liquid may be recovered through a recovery opening 21 formed on the inner surface. Recovery of the immersion liquid through the recovery opening 21 may be performed by applying a reduced pressure. Recovery through the recovery opening 21 may also be a result of the flow velocity of the immersion liquid through the immersion space 11. Alternatively, recovery may be a result of both. The recovery opening 21 may be located on the opposite side of the supply opening 20 in a plan view. In addition or alternatively, the immersion liquid may be recovered through an overflow recovery section 24 located on the top surface of the fluid handling structure 12. The functions of the supply opening 20 and the recovery opening 21 may be swapped (i.e., the direction of liquid flow is reversed). In this case, the direction of flow can be changed depending on the relative movement of the fluid handling structure 12 and the substrate W.

[0053] In addition or alternatively, the immersion liquid may be recovered from below the fluid handling structure 12 through a recovery opening 25 formed on its bottom surface. The recovery opening 25 may also serve to hold the immersion liquid meniscus 33 relative to the fluid handling structure 12. The meniscus 33 is formed between the fluid handling structure 12 and the opposing surface and functions as a boundary between the liquid space and the external gaseous environment. The recovery opening 25 may be a porous plate from which single-phase flow immersion liquid can be recovered. The recovery opening on the bottom surface may be a series of pinning openings 32 from which the immersion liquid can be recovered. The pinning openings 32 may recover two-phase flow immersion liquid.

[0054] Optionally, a gas knife opening 26 is provided radially outward from the inner surface of the fluid handling structure 12. Gas may be supplied through the gas knife opening 26 at an increased velocity to assist in liquid limiting of the immersion liquid in the immersion space 11. The supplied gas may be wet and may substantially contain carbon dioxide. A gas recovery opening 28 is provided radially outward from the gas knife opening 26 for recovering the gas supplied through the gas knife opening 26.

[0055] Further openings, for example, those open to the atmosphere, a gas source, or a vacuum, may be present on the bottom surface of the fluid handling structure 12, i.e., on the surface of the fluid handling structure 12 facing the substrate W. An example of such an optional further opening 50 is shown by a dotted line on the right side of Figure 2a. As shown, the further opening 50 may be a supply or a take-off section, as indicated by the bidirectional arrows. For example, when configured as a supply section, the further opening 50 may be connected to a liquid supply section, a gas supply section, or any other supply section. Alternatively, when configured as a take-off section, the further opening 50 may be used to take out fluid and may be connected to the atmosphere, a gas source, or a vacuum, for example. For example, at least one further opening 50 may be located between the gas knife opening 26 and the gas recovery opening 28, and / or between the pinning opening 32 and the gas knife opening 26.

[0056] Two different versions of the fluid handling structure 12, on the left and right sides of Figure 2a, retain the meniscus 33. The version of the fluid handling structure 12 on the right side of Figure 2a may retain the meniscus 33 in a position substantially fixed relative to the final element 100 due to the fixed position of the pinning opening 32. The version of the fluid handling structure 12 on the left side of Figure 2a may retain the meniscus 33 below the recovery opening 25, and the meniscus 33 may move along the length and / or width of the recovery opening 25. To direct the radiation beam B to both ends of the substrate W during exposure, the substrate support WT supporting the substrate W is driven relative to the projection system PS. To maximize the output of the substrate W exposed by the lithography apparatus, the substrate support WT (and the substrate W as well) is driven as fast as possible. However, there is a critical relative velocity (often expressed as the critical scan velocity) beyond which the meniscus 33 between the fluid handling structure 12 and the substrate W becomes unstable. An unstable meniscus 33 carries a greater risk, for example, of losing the immersion liquid in the form of one or more droplets. Furthermore, an unstable meniscus 33 carries a greater risk of introducing air bubbles into the immersion liquid, especially when the limited immersion liquid extends beyond the edge of the substrate W.

[0057] Droplets present on the surface of the substrate W can impose a thermal load and may cause defects. Droplets may evaporate and leave dry stains, migrate and carry contaminants such as particles, collide with larger immersion liquid clumps and introduce gas bubbles into larger clumps, and evaporate and impose a thermal load on the surface on which they are placed. Such thermal loads can cause distortion and / or be a source of positioning errors when the surface is related to the positioning of lithography equipment components relative to the substrate W during imaging. Thus, droplet formation on the surface is undesirable. To avoid such droplet formation, the speed of the substrate support WT is limited to the critical scan speed at which the meniscus 33 is stable. This limits the throughput of the lithography equipment.

[0058] The left side of the fluid handling system in Figure 2a may include a spring 60. The spring 60 may be an adjustable passive spring configured to exert a biasing force on the fluid handling structure 12 in the direction of the substrate W. Thus, the spring 60 may be used to control the height of the fluid handling structure 12 above the substrate W. Such an adjustable passive spring is described in US7, 199, 874, which is incorporated herein by reference in its entirety. Other biasing devices (e.g., those using electromagnetic force) are also appropriate. The spring 60 is optionally shown with the left side of Figure 2a, but does not need to be included with the other features of the left side of Figure 2a. The spring 60 may be included with various other fluid handling systems described with respect to Figures 2a, 2b, 2c, or 2d, although it is not shown in any other figure.

[0059] Figure 2b shows two different versions of the fluid handling structure 12, on the left and right, which allow the movement of the meniscus 33 relative to the final element 100. The meniscus 33 may move in the direction of the moving substrate W. This can reduce the relative velocity between the meniscus 33 and the moving substrate W, resulting in improved stability and a reduced risk of meniscus 33 collapse. By increasing the velocity of the substrate W at which the meniscus 33 collapses, the movement of the substrate W below the projection system PS can be increased. This thus increases throughput.

[0060] Features shown in Figure 2b, which are common to Figure 2a, share the same reference numerals. The fluid handling structure 12 has a conical surface of the frustoconical shape and an inner surface complementary to it. The bottom surface of the fluid handling structure 12 is closer to the opposing surface than the flat bottom surface of the frustoconical shape.

[0061] The immersion fluid is supplied to the immersion space 11 through a supply opening 34 formed on the inner surface of the fluid handling structure 12. The supply opening 34 is located on the bottom side of the inner surface (for example, below the base of a frustoconical shape). The supply opening 34 is located around the inner surface, away from the path of the radiation beam B.

[0062] The immersion fluid is recovered from the immersion space 11 through a recovery opening 25 at the bottom of the fluid handling structure 12. As the opposing surface moves below the fluid handling structure 12, the meniscus 33 may move on the surface of the recovery opening 25 in the same direction as the movement of the opposing surface. The recovery opening 25 may be formed of a porous material. The immersion fluid may be recovered in a single phase. The immersion fluid may be recovered in a two-phase flow. The two-phase flow is received in a chamber 35 within the fluid handling structure 12 and separated into liquid and gas. The liquid and gas are recovered from the chamber 35 through separate channels 36, 38.

[0063] The inner circumference 39 of the bottom surface of the fluid handling structure 12 extends from the inner surface into the immersion space 11 to form a plate 40. The inner circumference 39 forms a small opening sized to match the shape and size of the radiation beam B. The plate 40 may also serve to isolate the immersion liquid at either end. The supplied immersion liquid flows inward toward the opening, through the inner opening, and radially outward toward the recovery opening 25 that surrounds the plate 40 below.

[0064] The fluid handling structure 12 may consist of two parts (an inner part 12a and an outer part 12b), as shown on the right side of Figure 2b. The inner part 12a and the outer part 12b may move relative to each other, mainly in a plane parallel to the opposing surfaces. The inner part 12a may have a supply opening 34 or an overflow recovery section 24. The outer part 12b may have a plate 40 and a recovery opening 25. The inner part 12a may have an intermediate recovery section 42 for recovering the immersion fluid flowing between the inner part 12a and the outer part 12b.

[0065] Thus, the two different versions of the fluid handling structure in Figure 2b allow the meniscus 33 to move in the same direction as the substrate W, enabling faster scanning speeds and improved throughput of the lithography apparatus. However, the movement speed of the meniscus 33 on the surface of the recovery opening 25 may be slow in the fluid handling structure 12 on the left side of Figure 2b. The fluid handling structure 12 on the right side of Figure 2b allows for faster movement of the meniscus 33 by moving the outer portion 12b relative to the inner portion 12a and the final element 100. However, it may be difficult to control the intermediate recovery section 42 to ensure that sufficient immersion fluid is provided between the inner portion 12a and the outer portion 12b to prevent contact between them.

[0066] Figure 2c shows two different versions of the fluid handling structure 12, on the left and right, which may be used to retain the immersion fluid meniscus 33 against the fluid handling structure 12 as described above with respect to Figures 2a and / or 2b. Features shown in Figure 2c that are common with Figures 2a and / or 2b share the same reference numerals.

[0067] The fluid handling structure 12 has an inner surface complementary to the conical surface of the frustoconical shape. The bottom surface of the fluid handling structure 12 is closer to the opposing surface than the flat bottom surface of the frustoconical shape. The immersion fluid is supplied to the immersion space 11 through openings formed on the surface of the fluid handling structure 12. The immersion fluid may also be supplied through a supply opening 34 on the inner surface of the fluid structure 12. Alternatively or in addition, the immersion fluid may be supplied through a supply opening 20 on the inner surface of the fluid structure 12. Alternatively or in addition, the immersion fluid may be supplied through a downward supply opening 23. The immersion fluid may be recovered through a recovery section (for example, a recovery opening 21 and / or an overflow recovery section 24 formed on the inner surface and / or one or more openings on the surface of the fluid handling structure 12 as described later).

[0068] Two different versions of the fluid handling structure 12, on the left and right sides of Figure 2c, retain the meniscus 33. In the version of the fluid handling structure 12 on the right side of Figure 2c, the meniscus 33 may be retained in a position substantially fixed relative to the final element 100 due to the fixed position of the recovery opening 32a. In the version of the fluid handling structure 12 on the left side of Figure 2c, the meniscus 33 may be retained below the recovery opening 25, and the meniscus 33 may move along the length and / or width of the recovery opening 25.

[0069] As previously described with respect to Figure 2b, the inner circumference of the bottom surface of the fluid handling structure 12 may extend from the inner surface into the immersion space 11 to form a plate 40 as shown on the left. As previously described, this may form a small opening, isolate the immersion fluid at either end, and / or allow the immersion fluid to flow inward toward the opening, through the inner opening, and radially outward toward a recovery opening 25 that surrounds the plate 40 below. This feature is shown on the left in Figure 2c, but may optionally be combined with other shown features. Preferably, as shown on the left, the immersion fluid is supplied to the immersion space 11 through a supply opening 34 formed on the inner surface of the fluid handling structure 12. The supply opening 34 is located on the bottom side of the inner surface (e.g., below the frustoconical bottom). The supply opening 34 is located around the inner surface, away from the path of the radiation beam B. Alternatively or in addition, the immersion fluid may be supplied through a supply opening 20 on the inner surface of the fluid structure 12. Alternatively, or in addition, the immersion liquid is supplied through the lower supply opening 23. The supply opening 34 is preferred as the liquid supply section, but any combination of the supply opening 34, the supply opening 20 and / or the lower supply opening 23 may be provided.

[0070] As shown on the left side of Figure 2c, the fluid handling system may comprise the fluid handling structure 12 and further devices 3000 as described above. The fluid handling structure 12 may have an outlet such as a recovery opening 25 and a liquid supply opening such as a downward supply opening 23. It is understood that the fluid handling structure 12, in combination with the further devices 3000, may have any configuration as disclosed with respect to the left side of Figure 2a, the right side of Figure 2a, the left side of Figure 2b, the right side of Figure 2b, or the right side of Figure 2c (described later).

[0071] The further device 3000 may be represented as a droplet catcher. The further device 3000 is provided to reduce the amount of liquid remaining on the surface of the substrate W after the fluid handling structure 12 has moved across the surface. The further device 3000 may comprise a liquid supply section 3010 and at least one take-out section 3020. The at least one take-out section 3020 may be formed in a shape that surrounds at least one supply section 3010 in a plan view. The at least one liquid supply section 3010 may be configured to supply additional liquid to the space 3110 between at least a portion of the further device 3000 and the surface of the substrate W. The further device 3000 may be configured to recover at least a portion of the liquid via at least one take-out section 3020. The further device 3000 may also be used to combine the liquid remaining on the surface of the substrate W with the liquid in the space 3110, and the further device 3000 is used to remove the liquid so that the amount of liquid remaining on the surface of the substrate W is reduced.

[0072] In Figure 2c, the additional device 3000 is shown as a separate device from the fluid handling structure 12. The additional device 3000 may be located near the fluid handling structure 12. Alternatively, the additional device 3000 may be part of the fluid handling structure 12 (i.e., integrally configured with the fluid handling structure 12) (see Figure 3d; however, either configuration is selectable).

[0073] Further devices 3000 may be configured to provide the space 3110 with a liquid provided by the fluid handling structure 12 and another liquid.

[0074] In addition or alternatively, the fluid handling structure 12 may have components as shown on the right side of Figure 2c. More specifically, the fluid handling structure 12 may comprise at least one liquid supply section, two outlet sections (e.g., recovery openings 32a and 32b), and two gas supply sections (e.g., gas supply openings 27a and 27b) formed on the surface of the fluid handling structure 12. The gas supply opening 27a is optional, i.e., can be omitted. At least one liquid supply section may be the same as the downward supply opening 23, supply opening 20 on the bottom surface of the fluid handling structure 12 described above, or the liquid supply opening 34 formed on the inner surface of the fluid handling structure 12 as described with respect to the left side of Figure 2b. The liquid supply section, outlet section, and gas supply section may be formed on the surface of the fluid handling structure 12. Specifically, these components may be formed on the surface of the fluid handling structure 12 facing the substrate W, i.e., on the bottom surface of the fluid handling structure 12.

[0075] At least one of the two outlets may have a porous material 37 inside. The porous material 37 may be provided in an opening (for example, a recovery opening 32a in which the fluid handling structure 12 may take fluid from the lower fluid handling structure 12 and recover the single-phase flow immersion fluid). The other of the two outlets, such as a recovery opening 32b, may recover the immersion fluid as a two-phase outlet. The porous material 37 does not have to be coplanar with the bottom surface of the fluid handling structure 12.

[0076] Specifically, the fluid handling structure 12 may include a liquid supply section (e.g., a downward supply opening 23). A first outlet (e.g., a recovery opening 32a) is located radially outward from the liquid supply section, a first gas supply section (e.g., a gas supply opening 27a) is located radially outward from the first outlet section, a second outlet (e.g., a recovery opening 32b) is located radially outward from the first gas supply section, and a second gas supply section (e.g., a gas supply opening 27b) is located radially outward from the second outlet section. Similar to Figure 2a, further openings, such as those open to the atmosphere, a gas source, or a vacuum, may be located on the bottom surface of the fluid handling structure 12, as previously described (with respect to the fluid handling structure 12).

[0077] For example, at least one further opening (not shown) may be provided on the bottom surface of the fluid handling structure 12. The further opening is optional. The further opening may be provided between the first outlet (e.g., recovery opening 32a) and the first gas supply (e.g., gas supply opening 27a), as described in the above arrangement. Alternatively or in addition, the further opening may be provided between the second outlet (e.g., recovery opening 32b) and the second gas supply (e.g., gas supply opening 27b), as described in the above arrangement. The further opening may be the same as the further opening 50 described above.

[0078] Optionally, the fluid handling structure 12 includes a recess 29. The recess 29 may be provided between the recovery openings 32a and 32b, or between the gas supply opening 27a and the recovery opening 32b. The shape of the recess 29 may be uniform around the fluid handling structure 12, and may optionally include an inclined surface. If the recess 29 is provided between the recovery openings 32a and 32b, the gas supply opening 27b may be provided on an inclined surface, as shown in Figure 2c. If the recess 29 is provided between the supply opening 27a and the recovery opening 32b, the gas supply opening 27b may be provided on an inclined surface or on a portion of the bottom surface of the fluid handling structure 12 parallel to the surface of the substrate W. Alternatively, the shape of the recess 29 may vary around the fluid handling structure 12. The shape of the recess 29 may vary to change the effect of the gas supplied from the gas supply unit on the fluid below the fluid handling structure 12.

[0079] Figure 2d shows two different versions of the fluid handling structure 12, one in the left half and the other in the right half. The fluid handling structure 12 in the left half of Figure 2d has a liquid injection buffer 41a that holds a buffer amount of immersion liquid and a liquid injection hole 41 that supplies immersion liquid from the liquid injection buffer to the space 11. Outside the liquid injection hole 41 is an inner liquid recovery opening 43 for guiding liquid to an inner recovery buffer 43a which is provided with a porous member. A recess 29 similar to that described with respect to Figure 2c is provided outside the inner liquid recovery opening 43. Outside the recess 29 on the lower surface of the fluid handling structure 12 is a gas guide groove 44 with an outer recovery hole 44a. The outer recovery hole 44a guides a two-phase recovery flow to an outer recovery buffer 44b which is provided with a porous member. On the outermost side, there is a gas sealing hole 45 that connects the gas sealing buffer capacity 45a and the space below the fluid handling structure 12, providing a gas flow to be incorporated into the immersion liquid.

[0080] The fluid handling structure 12 in the right half of Figure 2d has a liquid supply opening 20 on its inner inclined surface. Below the fluid handling structure 12 are an outlet opening 25 with a porous member 37 (from inside to outside), a first gas knife opening 26a, a second gas knife opening 26b, and a third gas knife opening 26c. Each of these openings opens into a groove below the fluid handling structure 12 that provides buffer capacity. The outermost portion of the fluid handling structure 12 is stepped to provide a larger gap between the fluid handling structure 12 and the substrate W.

[0081] Figures 2a-2d show examples of different configurations that may be used as part of a fluid handling system. While the examples provided above refer to specific take-off and recovery units, it is understood that it is not necessary to use exactly the same type of take-off and / or recovery unit. In some cases, different terminology is used to indicate the location of components, but the same functional characteristics may be provided. The aforementioned example of a take-off unit includes a recovery opening 21, an overflow recovery unit 24, a recovery opening 25 (preferably comprising a porous plate and / or chamber 35), a gas recovery opening 28, a pinning opening 32, a recovery opening 32a, a recovery opening 32b, and / or an intermediate recovery unit 42. The aforementioned example of a supply unit includes a supply opening 20, a downward supply opening 23, a gas knife opening 26, a gas supply opening 27a, a gas supply opening 27b, and / or a supply opening 34. Generally, each take-off unit used to take off / recover a fluid, liquid, or gas is interchangeable with at least one of the other use cases for taking off / recovering a fluid, liquid, or gas. Similarly, each supply unit used to supply a fluid, liquid, or gas is interchangeable with at least one of the other use cases for supplying a fluid, liquid, or gas. The take-out unit may be connected to a depressurization system that draws the fluid, liquid, or gas into the take-out unit, thereby withdrawing / recovering a fluid, liquid, or gas from a space. The supply unit may be connected to a corresponding supply unit, thereby supplying a fluid, liquid, or gas to a space.

[0082] As mentioned above, the use of immersion fluids / liquids is useful for increasing the resolution of smaller features on the substrate, but there are challenges in using immersion fluids / liquids regarding defects introduced on the substrate.

[0083] Generally, when an immersion solution is used, droplets of the immersion solution may remain on the surface of the substrate W. The meniscus 33 at the edge of the immersion solution may collide with droplets on the surface of the substrate W. When droplets hit the meniscus 33, gas may be trapped in the immersion solution. This results in bubbles in the immersion solution. The formation of bubbles in the immersion solution can lead to defects on the substrate W. Droplets remaining on the surface of the substrate W can lead to drying spots and / or affect the chemical properties of the resist, thus leading to defects.

[0084] The droplet formation rate is known to increase with the movement speed of the substrate W relative to the fluid handling system. In some cases, droplet formation is absent or negligible below the critical scan speed, but not negligible above the critical scan speed. The critical scan speed is related to the static recess contact angle between the immersion liquid and the resist applied to the substrate W. As the static recess contact angle increases, the critical scan speed also increases. Since the critical scan speed can be a limiting factor in the throughput of the lithography apparatus, it is desirable to increase the critical scan speed. Efforts to increase the critical scan speed include increasing the static recess contact angle by changing the composition of the resist or by applying a topcoat to the resist.

[0085] Figures 3A to 3C show a fluid handling system and a portion of the substrate W in a lithography apparatus. As shown in Figure 3A, there is a channel 306 between the fluid handling system and the substrate W. The channel 306 may contain an immersion fluid 309 and / or gas 310. The portion of the fluid handling system in contact with the channel 306 may be represented as a fluid handling structure 307. Figure 3B shows the surface of the fluid handling structure 307 that provides the surface of the channel 306. This surface may be represented as a damper surface 308.

[0086] The fluid handling structure 307 includes a first fluid supply member 301. The first fluid supply member 301 includes a first fluid supply conduit 301b and a first fluid supply opening 301a on the damper surface 308. The first fluid supply member 301 may also be a downward supply opening 23 as described above with reference to at least Figures 2A and 2C.

[0087] The fluid handling structure 307 also includes a first fluid extraction member 302. The first fluid extraction member 302 includes a first fluid extraction conduit 302b and a first fluid extraction opening 302a on the damper surface 308. The first fluid extraction member 302 may also be a pinning opening 32 or a recovery opening 32a as described above, with reference to at least Figures 2A and 2C.

[0088] The fluid handling structure 307 may include a second fluid supply member 303. The second fluid supply member 303 includes a second fluid supply conduit 303b and a second fluid supply opening 303a on the damper surface 308. The second fluid supply member 303 may also be a gas knife opening 26 or a gas supply opening 27a as described above with reference to at least Figures 2A and 2C.

[0089] The fluid handling structure 307 may include a second fluid outlet member 305. The second fluid outlet member 305 includes a second fluid outlet conduit 305b and a second fluid outlet opening 305a on the damper surface 308. The second fluid outlet member 305 may also be a gas recovery opening 28 or recovery opening 32b as described above, with reference to at least Figures 2A and 2C.

[0090] Although not shown in Figures 3A to 3C, the fluid handling structure 307 may have any number of further openings. For example, the fluid handling structure 307 may include a third fluid supply member. The third fluid supply member may be located between the second fluid supply member 303 and the second fluid extraction member 305. The third fluid supply member may include a third fluid supply conduit and a third fluid supply opening on the damper surface 308.

[0091] In Figure 3A, the damper surface 308 is substantially planar and substantially parallel to the surface of the substrate W. Alternatively, portions of the damper surface 308 may be inclined or protruding so that the distance between the fluid handling structure 307 and the substrate W varies.

[0092] Figure 3B is a schematic plan view of the damper surface 308 of the fluid handling structure 307. Multiple fluid openings 301a, 302a, 303a, and 305a are provided on the damper surface 308. The multiple fluid openings 301a, 302a, 303a, and 305a are provided in sets of multiple different openings.

[0093] Figure 3C is a schematic plan view of the damper surface 308 of the fluid handling structure 307 and the first fluid outlet conduits 302b passing through the fluid handling structure 307. For each first fluid outlet opening 302a, there is a first fluid outlet conduit 302b. Each first fluid outlet conduit 302b may extend through the fluid handling structure 307 with a substantially constant cross-section. Although not shown for all fluid openings 301a, 302a, 303a, and 305a, for each fluid opening 301a, 302a, 303a, and 305a and each fluid conduit 301b, 302b, 303b, and 305b, there are fluid conduits 301b, 302b, 303b, and 305b, respectively, which may extend through the fluid handling structure 307 with a substantially constant cross-section.

[0094] The manufacturing of the fluid handling structure 307 as described above is time-consuming, difficult, and expensive. In particular, manufacturing the damper surface 308 and fluid openings 301a, 302a, 303a, and 305a to the required level of flatness and roughness and meeting dimensional tolerances is time-consuming. Repairing or reprocessing damaged surfaces in the event of collision or scratching between the fluid handling structure 307 and the substrate W is also expensive and time-consuming. In some applications, the damper surface 308 may be coated. The coating has a limited lifespan due to scratching, aging, and / or contamination, and the process of replacing the coating is difficult and expensive. The lack of availability of lithography equipment during maintenance of the fluid handling structure 307 also increases costs.

[0095] There is a general need to increase the availability of lithography equipment and reduce the maintenance costs of fluid handling structures.

[0096] Embodiments of the present invention can enhance the usability of lithography apparatus and reduce the maintenance costs of fluid handling structures. Disclosed herein are various embodiments of fluid handling structures that may be used in all types of local immersion lithography apparatus.

[0097] As described in detail below, embodiments provide a fluid handling system having a fluid handling structure comprising one or more interchangeable plates. Each plate comprises at least several fluid openings. The outer surface of each plate provides at least several damper surfaces 308. Advantageously, maintenance of the fluid handling structure requires only relatively simple operations: removing a plate and installing a new or readjusted plate in the fluid handling structure. This reduces the time and cost associated with servicing the fluid handling structure and increases the availability of lithography equipment. Advantages of the embodiments may include higher manufacturability of the fluid handling structure, better protection of the body of the fluid handling structure, and shorter, less expensive turnaround times in manufacturing and repair / reprocessing.

[0098] Figures 4A and 4B show a part of the fluid handling structure 403 according to the first embodiment. The fluid handling structure 403 comprises a plate support member 403a and a replaceable plate 400. The plate support member 403a is part of the main body of the fluid handling structure 403, and the plate 400 is attached to the plate support member 403a.

[0099] As previously mentioned, there is a channel 306 between the fluid handling structure 403 and the substrate W. The channel 306 may contain an immersion liquid 309 and / or a gas 310.

[0100] The fluid handling structure 403 includes a first fluid supply member 401. The first fluid supply member 401 includes a first fluid supply conduit 401b that opens through the body of the fluid handling structure 403. The first fluid supply member 401 also includes a first fluid supply opening 401a that opens through the plate 400.

[0101] The fluid handling structure 403 includes a first fluid outlet member 402. The first fluid outlet member 402 includes a first fluid outlet conduit 402b that opens through the body of the fluid handling structure 403. The first fluid outlet member 402 also includes a first fluid outlet opening 402a that opens through the plate 400.

[0102] The fluid handling structure 403 may optionally include a second fluid supply member 303 and a second fluid extraction member 305. These may substantially be those described above with reference to Figures 3A to 3C.

[0103] The plate 400 may have a substantially planar structure. The outer surface 400a of the plate 400, which is the main surface of the plate 400, may also be the surface of the channel 306. The outer surface 400a of the plate 400 may provide at least a portion of the damper surface 308 of the fluid handling structure 403.

[0104] The plate support member 403a may have a cavity in the body of the fluid handling structure 403 to receive the plate 400. The entire plate 400 may be supported within the cavity such that its outer surface 400a is flush with the damper surface 308 not formed by the plate 400. Preferably, the plate 400 may be partially supported by the cavity such that a portion of the plate 400 protrudes from the damper surface 308 not formed by the plate 400. In this way, the outer surface 400a of the plate 400 may be closer to the substrate W than the damper surface 308 surrounding the plate 400. For example, the damper surface 308 surrounding the plate 400 may be about 10 μm to 200 μm away from the substrate W than the outer surface 400a of the plate 400. Advantageously, if the width of the channel 306 is reduced by the plate 400, the plate 400 becomes the only part of the fluid handling structure 403 that is damaged in the event of a collision with the substrate W or any other surface close to the fluid handling structure 403. Repair of the fluid handling structure 403 after such a collision only requires replacing the plate 400.

[0105] Figure 4B is a plan view of plate 400 attached to a fluid handling system. There may be multiple fluid openings 401a, 402a, 303a, and 305a in an arrangement similar to that shown in Figures 3A to 3C. The multiple fluid openings 401a, 402a, 303a, and 305a may be provided in multiple different sets of openings.

[0106] Each set comprising the multiple fluid openings 401a, 402a, 303a, and 305a may include a fluid opening provided around the midpoint of the liquid-restricted space. The multiple fluid openings 401a, 402a, 303a, and 305a may be provided in a circular, square, rectangular, or star-shaped configuration, or any combination thereof. The fluid handling system may have two sides facing each other on either side of the projection lens. The midpoint of the liquid-restricted space may also be the space directly below the projection lens.

[0107] The first set of fluid openings in plate 400 may comprise a plurality of first fluid supply openings 401a. The second set of fluid openings in plate 400 may comprise a plurality of first fluid outlet openings 402a. The second set of fluid openings may be located further away from the beam path of the radiation beam B than the first set of fluid openings.

[0108] As shown in Figure 4A (and later described with reference to Figure 5C), the first fluid supply conduit 401b may have a cross-sectional area of ​​a different size and / or shape than the first fluid supply opening 401a. In particular, the cross-sectional dimensions, such as the width, of the first fluid supply conduit 401b may be substantially larger than the maximum cross-sectional dimensions, such as the diameter, of the first fluid supply opening 401a. In addition, a single first fluid supply conduit 401b may supply fluid through multiple fluid supply openings 401a. The first fluid supply conduit 401b may be slotted / slit-shaped. For example, the first fluid supply conduit 401b may have a substantially rectangular cross-section in a plane parallel to the damper surface 308. Therefore, any fluid blockage is expected to occur in the first fluid supply opening 401a rather than in the first fluid supply conduit 401b.

[0109] Similarly, the first fluid outlet conduit 402b may have a cross-section of a different size and / or shape than the first fluid outlet opening 402a. In particular, the width of the first fluid outlet conduit 402b may be substantially larger than the diameter of the first fluid outlet opening 402a. In addition, a single first fluid outlet conduit 402b may extract fluid through multiple fluid outlet openings 402a. The first fluid outlet conduit 402b may be slotted / slit-shaped. For example, the first fluid outlet conduit 402b may have a substantially rectangular cross-section in a plane parallel to the damper surface 308. Thus, any fluid blockage is expected to occur at the first fluid outlet opening 402a rather than at the first fluid outlet conduit 402b.

[0110] As previously mentioned, the use of lithography equipment can lead to contamination and / or damage in the fluid handling structure 403. For example, contaminating particles such as resist flakes may block some of the fluid openings 401a, 402a, 303a, and 305a, so these openings need to be opened. Scratches can also occur on the damper surface 308.

[0111] Service of the fluid handling structure 403 may include removing plate 400 from the fluid handling structure 403 and replacing plate 400 with a new plate 400. The replacement plate 400 may be a completely new plate 400 or a plate 400 that has been properly readjusted after previous use. The fluid handling structure 403 may be removed from the lithography apparatus so that plate 400 can be removed and a new plate 400 can be installed in the fluid handling structure 403. Alternatively, the fluid handling structure 403 may remain in the lithography apparatus when plate 400 is replaced.

[0112] Some of the fluid openings 401a, 402a, 303a, and 305a may be more susceptible to blockage by contaminants than others. In particular, the fluid openings 401a and 402a through which the immersion liquid 309 flows in the plate 400 may be the most susceptible to blockage by contaminants. The outer surface 400a of the plate 400 may be the surface closest to the substrate W of the fluid handling structure 403. In this case, the outer surface 400a of the plate 400 is more susceptible to damage from scratches, etc., than any other part of the damper surface 308. Thus, the only part of the fluid handling structure 403 that requires maintenance may be within the plate 400. Maintenance required for other parts of the fluid handling structure 403 is significantly reduced. Advantageously, maintenance of the fluid handling structure 403 only requires replacement of the plate 400. Maintenance of other parts of the fluid handling structure 403 can be performed relatively easily, quickly, and inexpensively. For example, other parts of the fluid handling structure 403 only require cleaning, and the entire fluid handling structure 403 does not need to be removed for reprocessing and recertification. In this way, the use of replaceable plates 400 can substantially reduce the time and cost associated with servicing the fluid handling structure 403.

[0113] Another advantage of using interchangeable plates is that the same fluid handling structure 403 may be used with plates 400 having different arrangements of fluid openings. Thus, the fluid handling structure 403 may be reconfigurable.

[0114] The plate 400 may be attached to the plate support member 403a by many arbitrary techniques. For example, the plate 400 may be attached to the plate support member 403a by screws, bolts, adhesive, magnetism, capillary force, electrostatic force, or van der Waals force, at least one of these. In particular, to ensure that the edges of the plate 400 are liquid-tight, a liquid-repellent adhesive / gel or other liquid-repellent material may be used in addition to screws.

[0115] The technique used to attach the plate 400 to the plate support member 403a should not damage or substantially alter any part of the fluid handling structure 403, either when the plate 400 is attached to the plate support member 403a or when the plate 400 is removed from the plate support member 403a. Thus, techniques such as welding the plate 400 to the plate support member 403a are unsuitable because the plate cannot achieve its intended purpose. A welded plate 400 is difficult to attach and detach, and the removal process may damage both the fluid handling structure 403 and the plate 400.

[0116] The manufacturing of plate 400 is easier than the manufacturing of the known fluid handling structure 307. For example, creating small fluid openings is easier with the thinner plate 400 than with the fluid handling structure 307.

[0117] Plate 400 may be made of a metal such as iron. In particular, plate 400 may be metal foil. Plate 400 may be made using laser ablation, laser cutting, or electron or ion beam machining. Plate 400 may be made from low-cost materials such as foil so that unsuitable plates do not incur significant costs. If glossy metal foil is used as the starting material, surface finishing such as lapping is not required. Some of the manufacturing steps in known techniques for manufacturing fluid handling structures are unnecessary.

[0118] Plate 400 may be made of plastic material.

[0119] The thickness of plate 400 may be between 5 μm and 5 mm, preferably between 10 μm and 2 mm, and more preferably between 10 μm and 100 μm.

[0120] The outer surface 400a of the plate 400, which is part of the damper surface 308, may be coated. For example, the outer surface 400a of the plate 400 may be coated with a hydrophobic coating. Alternatively, the outer surface 400a of the plate 400 may be coated with a hydrophilic or other type of coating. An advantage of using a replaceable plate 400 is that the coating can also be changed by replacing the plate 400, for example, as needed at the end of the coating's lifespan.

[0121] The embodiment includes the use of plate 400, which is a microsieve.

[0122] The embodiment includes the use of a plate 400 which is a porous member.

[0123] Figures 5A, 5B, and 5C show a portion of the fluid handling structure 502 according to the second embodiment. The second embodiment differs from the first embodiment in that the plate 500 is provided only with a fluid outlet opening.

[0124] In the second embodiment, the fluid handling structure 502 comprises a plate support member 502a and a replaceable plate 500. The plate support member 502a is part of the main body of the fluid handling structure 502, and the plate 500 is attached to the plate support member 502a.

[0125] As previously mentioned, there is a channel 306 between the fluid handling structure 502 and the substrate W. The channel 306 may contain an immersion liquid 309 and / or a gas 310.

[0126] The fluid handling structure 502 may include a first fluid supply member 301, a second fluid supply member 303, and a second fluid extraction member 305. These may be substantially those described above with reference to Figures 3A to 3C.

[0127] The fluid handling structure 502 also includes a first fluid outlet member 501. The first fluid outlet member 501 includes a first fluid outlet conduit 501b that opens through the main body of the fluid handling structure 502. The first fluid outlet member 501 also includes a first fluid outlet opening 501a that opens through the plate 500.

[0128] As described in the first embodiment, the outer surface 500a of the plate 500 is the surface of the channel 306. The outer surface 500a of the plate 500 may provide at least a portion of the damper surface 308 of the fluid handling structure 502. The plate support member 502a may have a cavity in the body of the fluid handling structure 502 for receiving the plate 500. The entire plate 500 may be supported within the cavity such that the outer surface 500a of the plate 500 is coplane with the damper surface 308 not formed by the plate 500. Preferably, the plate 500 may be partially supported by the plate support member 502a such that a portion of the plate 500 protrudes from the damper surface 308 not formed by the plate support member 502a. Thus, the outer surface 500a of the plate 500 may be closer to the substrate W than the damper surface 308 surrounding the plate 500. Advantageously, if the width of the channel 306 is reduced by the plate 500, the plate 500 becomes the only part of the fluid handling structure 502 that is damaged in the event of a collision with the substrate W or any other surface close to the fluid handling structure 502. Repair of the fluid handling structure 502 after such a collision only requires replacing the plate 500.

[0129] Figure 5B is a plan view of plate 500 attached to a fluid handling system. There may be multiple fluid openings 301a, 501a, 303a, and 305a in an arrangement similar to that shown in Figures 3A, 3B, 3C, 4A, and 4B. The multiple fluid openings 301a, 501a, 303a, and 305a may be provided in multiple different sets of openings.

[0130] As shown in Figure 5C, the first fluid outlet conduit 501b may have a cross-section of a different size and / or shape than the first fluid outlet opening 501a. In particular, a single first fluid outlet conduit 501b may extract fluid through multiple fluid outlet openings 501a. The first fluid outlet conduit 501b may have a substantially rectangular cross-section in a plane parallel to the damper surface 308. In addition, the width of the first fluid outlet conduit 501b may be substantially larger than the diameter of the first fluid outlet opening 501a.

[0131] The second embodiment offers similar advantages to the first embodiment. In particular, servicing the fluid handling structure 502 requires only the replacement of the plate 500. Thus, the plate 500 of the second embodiment offers the advantage of reducing the time required for servicing the fluid handling structure 502. Blockage of openings by contaminants is most likely to occur at liquid outlet openings, all of which are composed of the plate 500.

[0132] A damper surface according to the third embodiment is shown in Figure 6. The third embodiment is shown as a technique applicable to the first embodiment, but the technique of the third embodiment may be applied to either the first or second embodiment.

[0133] In the third embodiment, all fluid openings may be located within the same plate. The plate 400 may have any hollow shape, such as a hollow square, in plan view. The plate 400 includes an opening provided such that the beam path of the radiation beam B passes through the opening when the plate 400 is attached to the fluid handling structure 403. The fluid opening may extend around the opening.

[0134] A damper surface according to the fourth embodiment is shown in Figure 7. The fourth embodiment is shown as a technique applicable to the first embodiment, but the technique of the fourth embodiment may be applied to either the first or second embodiment.

[0135] In the fourth embodiment, there are multiple interchangeable plates 400. Each plate 400 may be a plate 400 according to the first or second embodiment described above. Thus, each plate 400 may have multiple fluid openings. The outer surface 500a of each plate 400 may also be a boundary surface between the fluid handling system and the channel 306 (i.e., part of the damper surface 308).

[0136] All of the multiple plates 400 may be attached to the same plate support member 403a.

[0137] As shown in Figure 7, the multiple plates 400 may be configured to surround the beam path of the radiation beam B. Each of the multiple plates 400 may be positioned on top of a portion of a hollow shape arrangement, such as a hollow square or circular arrangement, in a plan view, to surround the beam path. In particular, at least one of the multiple interchangeable plates 400 may be substantially pointed, such as in an L-shape or V-shape. At least one of the multiple interchangeable plates 400 may be C-shaped, crescent-shaped, full-moon-shaped, or rectangular. Each plate may have corners that align with the scanning or stepping direction of the lithography apparatus. As shown in Figure 7, four L-shaped plates may provide the four corners of the square configuration of plate 400.

[0138] An advantage is that by using multiple plates 400, when servicing the fluid handling structure 403, only the plates 400 that need replacing need to be replaced.

[0139] The embodiment may be incorporated into any of the fluid handling systems shown in Figures 2a to 2d.

[0140] Embodiments include the presence and use of further features from those specifically described above. In particular, the fluid handling system of an embodiment may include one or more pumps for controlling the fluid flow through any fluid supply or take-off member. One of the pumps for controlling the fluid flow may be located outside the fluid handling system, in addition or alternatively.

[0141] The embodiments also include many modifications and variations of the techniques described above.

[0142] For example, in the second implementation of the second embodiment, the plate 500 may be provided with only a fluid supply opening and no fluid outlet opening. The fluid supply opening provided in the plate 500 may be part of one or more fluid supply members, and may be similar to the first fluid supply member 401 as described in the first embodiment.

[0143] In a third implementation of the second embodiment, the fluid handling structure may include one or more plates 500 having only fluid extraction openings as shown in Figures 5A to 5C, and one or more plates 500 having only fluid supply openings as in the second implementation of the second embodiment. Advantageously, when servicing the fluid handling structure, only the plates 500 that need replacing need to be replaced.

[0144] The embodiment includes the use of one or more plates 400, each plate 400 having any number of sets of fluid outlet openings and any number of sets of fluid supply openings.

[0145] In the figure, all fluid openings on each plate and damper surface are circular. The embodiment more generally includes any fluid openings having any shape. For example, some of the fluid openings may have a square or irregular shape.

[0146] Embodiments also include fluid handling structures 307, 403, 502 comprising one or more bumper plates (not shown). Each bumper plate, as well as each plate having a fluid opening, may be provided on a channel 306 facing the surface of the fluid handling structures 307, 403, 502. The outer surface of each bumper plate may provide a boundary surface between the fluid handling system and the channel 306.

[0147] Each outer surface may be part of the damper surface 308. The bumper plate may not have any fluid openings or be connected to any conduits. Each bumper plate is made of metal, rubber and / or plastic material. The internal structure of each bumper plate may be substantially honeycomb-like.

[0148] The outer surface of the bumper plate may be provided to provide a minimum gap across the channel 306 between the fluid handling structures 307, 403, 502 and the substrate W. The purpose of the bumper plate is to provide a first portion of the fluid handling structures 307, 403, 502 that will strike the substrate W in the event of a collision if the gap between the fluid handling structures 307, 403, 502 and the substrate W is reduced to an unacceptable level during use. Thus, the damage caused by the collision will be limited to one or more bumper plates and / or the substrate W, and not to other parts of the fluid handling structures 307, 403, 502.

[0149] In the embodiments described above, plates 400, 500 were shown as providing the upper surface of the channel 306. In a typical configuration of a horizontally mounted substrate W, plates 400, 500 provide the upper surface of the channel 306. However, embodiments more generally include plates 400, 500 that provide a surface of the fluid handling system substantially parallel to the surface of the substrate W. The surface of the substrate W is not limited to being horizontally mounted.

[0150] The present invention may also provide a lithography apparatus. The lithography apparatus may have other features or components of some or all of the lithography apparatus described above. For example, the lithography apparatus may optionally include at least one or more, such as a source SO, an illumination system IL, a projection system PS, and a substrate support WT.

[0151] Specifically, the lithography apparatus may include a projection system PS configured to project a radiation beam B onto a region of the surface of the substrate W. The lithography apparatus may further include a fluid handling system as described in any of the above embodiments and modifications.

[0152] The lithography apparatus may include an actuator configured to drive the substrate W relative to a fluid handling system. Thus, the actuator may be used to control the position of the substrate W (or the position of the fluid handling system). The actuator may also include a substrate holder configured to hold a substrate support (e.g., a substrate table) WT and / or the substrate W, and / or a second positioner PW configured to precisely position the substrate support WT.

[0153] While this text may have provided specific references to the use of lithography equipment in IC manufacturing, it should be understood that the lithography equipment described herein may have other applications. Possible other applications include the manufacture of integrated optical systems, guidance and detection patterns for magnetic domain memory, flat panel displays, liquid crystal displays (LCDs), thin-film magnetic heads, and the like.

[0154] To the extent permitted by context, embodiments of the invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the invention may also be implemented by instructions stored on a machine-readable medium which may be read and executed by one or more processors. The machine-readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing device). For example, the machine-readable medium may include read-only memory (ROM), random access memory (RAM), magnetic storage media, optical storage media, flash memory devices, electrical, optical, acoustic or other forms of transmitted signals (e.g., carrier waves, infrared signals, digital signals, etc.), and others. Furthermore, firmware, software, routines, and instructions may be described as performing specific actions. However, such descriptions are merely for convenience, and it should be understood that such actions are actually brought about by computing devices, processors, controllers, or other devices that execute firmware, software, routines, instructions, etc., causing actuators or other devices to interact with the physical world.

[0155] While specific references to embodiments of the invention in the context of lithography apparatus may be made in this text, embodiments of the invention may be used in other apparatuses. Embodiments of the invention may constitute part of a mask inspection apparatus, a measuring apparatus, or any apparatus for measuring or processing objects such as wafers (or other substrates) or masks (or other patterning devices). These apparatuses may generally be referred to as lithography tools. Such lithography tools may operate under atmospheric (non-vacuum) conditions.

[0156] While specific references to the use of embodiments of the invention in the context of optical lithography may have been made above, the invention is understood to be not limited to optical lithography, to the extent that the context permits.

[0157] The embodiments include the following numbered items: 1. A fluid handling system for a lithography apparatus, comprising a replaceable plate having a coated outer surface, configured to restrict the immersion liquid to a liquid-restricting space between a portion of the projection system and the surface of the substrate in the lithography apparatus, so that a radiation beam projected from the projection system can irradiate the surface of a substrate by passing through the immersion liquid, and comprising a plurality of fluid openings configured for supplying and / or withdrawing immersion liquid and / or gas in a channel between the fluid handling system and the substrate. 2. A fluid handling system for a lithography apparatus, comprising a plurality of interchangeable plates, each having an outer surface having a plurality of fluid openings configured for supplying and / or withdrawing immersion fluid and / or gas in a channel between the fluid handling system and the substrate, such that a radiation beam projected from a projection system can irradiate the surface of a substrate by passing through an immersion fluid. 3. The fluid handling system according to item 1 or 2, further comprising plate support members configured to allow each plate to be attached and removed. 4. The fluid handling system according to item 3, wherein each plate is attached to the plate support member by at least one of screws, adhesive, magnetism, capillary force, or electrostatic force. 5. The fluid handling system according to item 3 or 4, wherein the plate support member comprises one or more conduits configured to supply fluid to one or more fluid openings in each plate, or to extract fluid from one or more fluid openings in each plate. 6. The fluid handling system according to item 5, wherein the conduits of the plate support member are configured to supply fluid to a plurality of fluid openings in the plate, or to extract fluid from a plurality of fluid openings in the plate. 7. The fluid handling system according to item 5 or 6, wherein each conduit has a substantially rectangular cross-section in a plane perpendicular to the fluid flow path through one or more fluid openings. 8. The fluid handling system according to any one of items 3 to 7, wherein the plate support member comprises a cavity configured to receive at least a portion of at least one plate. 9. The fluid handling system according to item 8, wherein at least a portion of the plate protrudes from the cavity to locally reduce the distance across the channel between the fluid handling system and the substrate when at least one plate is attached to the fluid handling system. 10. A fluid handling system according to any one of items 1 to 9, wherein each plate has a substantially planar structure, and the outer surface of each plate is the main surface of the plate. 11. A fluid handling system according to any one of items 1 to 10, wherein the plurality of fluid openings are configured to extract immersion liquid and / or gas from the channel. 12. A fluid handling system according to any one of items 1 to 11, wherein the plurality of fluid openings are configured to supply immersion liquid and / or gas to the channel. 13. A fluid handling system according to any one of items 1 to 12, wherein each plate comprises a first set of fluid openings which are fluid supply openings and a second set of fluid openings which are fluid outlet openings, wherein the second set of fluid openings is located further away from the beam path of the radiation beam than the first set of fluid openings. 14. The fluid handling system according to any one of items 1 to 13, wherein the fluid opening is provided around the midpoint of the liquid-restricted space, and the fluid opening is optionally provided in any of the following configurations: circular, square, rectangular or star-shaped, or any combination thereof. 15. A fluid handling system according to any one of items 1 to 14, wherein one or more plates are made of a metal such as iron. 16. A fluid handling system according to any one of items 1 to 15, wherein one or more plates are provided with metal foil. 17. A fluid handling system according to any one of items 1 to 16, wherein one or more plates are made of plastic material. 18. A fluid handling system according to any one of items 1 to 17, wherein one or more plates have a thickness between 5 μm and 5 mm, preferably between 10 μm and 100 μm. 19. A fluid handling system according to item 2 or any of the items thereof, wherein the outer surfaces of one or more plates are coated. 20. The fluid handling system according to any one of items 1 to 19, wherein the outer surfaces of one or more plates are coated with a hydrophobic coating. 21. The fluid handling system according to any one of items 1 to 20, wherein the outer surfaces of one or more plates are coated with a hydrophilic coating. 22. A fluid handling system according to any one of items 1 to 21, comprising one or more plates with microsieves. 23. A fluid handling system according to any one of items 1 to 22, wherein one or more plates comprise a porous member. 24. The fluid handling system according to item 1 or any of the items thereof, wherein the plate has an opening configured for the beam path of the radiation beam to pass through. 25. The fluid handling system according to item 1 or any of items 3 to 23 thereof, wherein the fluid handling system comprises a plurality of interchangeable plates, all of which have an outer surface having a plurality of fluid openings, and each outer surface is a boundary surface between the fluid handling system and the channel. 26. A fluid handling system according to item 2, 25, or any item subordinate to item 2, wherein the multiple plates are mountable to the same plate support member. 27. A fluid handling system according to item 2, 25, 26, or any item dependent on item 2, wherein at least one of the plurality of plates is substantially pointed in an L-shape, V-shape, or the like. 28. The fluid handling system according to item 27, wherein each plate has corners provided to align with the scanning or stepping direction of the lithography apparatus. 29. A fluid handling system according to item 2, any of items 25 to 28, or any item dependent on item 2, wherein the plurality of plates are configured to surround the beam path of the radiation beam. 30. The fluid handling system according to item 29, wherein the plurality of plates are configured to surround the beam path in a substantially square arrangement. 31. A fluid handling system according to any one of items 1 to 30, further comprising one or more bumper plates, the outer surface of each bumper plate providing a boundary surface between the fluid handling system and the channel, and the surface of the bumper plate providing a minimum distance across the channel between the fluid handling system and the substrate. 32. Each bumper plate comprises a fluid handling system as described in item 31, comprising metal, rubber, and / or plastic material. 33. A fluid handling system for a lithography apparatus, configured to restrict the immersion liquid to a liquid-restricting space between a portion of the projection system and the surface of the substrate in the lithography apparatus, such that a radiation beam projected from a projection system can irradiate the surface of a substrate by passing through the immersion liquid, and comprising a replaceable plate for supplying and / or withdrawing the immersion liquid and / or gas in a channel between the fluid handling system and the substrate, the plate comprising a porous member. 34. A fluid handling system for a lithography apparatus, comprising one or more bumper plates, wherein the outer surface of each bumper plate provides a boundary surface between the fluid handling system and the channel between the fluid handling system and the substrate, and the surface of the bumper plate provides a minimum gap across the channel between the fluid handling system and the substrate. 35. A lithography apparatus comprising a fluid handling system as described in any of items 1 to 34. 36. The apparatus according to item 35, further comprising a positioning system configured to drive a substrate holder configured to support the substrate with respect to the projection system in a plane substantially parallel to the surface of the substrate.

[0158] Although specific embodiments of the invention have been described above, it is understood that the invention may be implemented in ways different from those described. The above description is for illustrative purposes only and is not intended to limit the invention. Accordingly, it will be apparent to those skilled in the art that the described invention may be modified without departing from the scope of the following claims.

Claims

1. A fluid handling system for a lithography apparatus, The lithography apparatus is configured to restrict the immersion liquid to a liquid-restricting space between a part of the projection system and the surface of the substrate, so that the radiation beam projected from the projection system can irradiate the surface of the substrate by passing through the immersion liquid. A replaceable plate having a coated outer surface, comprising a plurality of fluid openings configured for supplying and / or removing immersion fluid and / or gas in a channel between the fluid handling system and the substrate, or a plurality of replaceable plates, each having an outer surface comprising a plurality of fluid openings configured for supplying and / or removing immersion fluid and / or gas in a channel between the fluid handling system and the substrate, The system further comprises a plate support member configured to allow and allow at least one plate to be attached and removed, The plate support member comprises a cavity configured to receive at least a portion of at least one plate, When at least one plate is attached to the fluid handling system, a portion of at least one plate protrudes from the cavity to locally reduce the gap across the channel between the fluid handling system and the substrate. The at least one plate comprises a first set of fluid openings which are fluid supply openings, and a second set of fluid openings which are fluid outlet openings, The first set of fluid openings and the second set of fluid openings face the surface of the substrate, Fluid handling system.

2. The fluid handling system according to claim 1, further comprising a plate support member having one or more conduits configured to supply fluid to one or more fluid openings in each plate, or to extract fluid from one or more fluid openings in each plate.

3. The conduit of the plate support member is configured to supply fluid to a plurality of fluid openings in the plate, or to extract fluid from a plurality of fluid openings in the plate. and / or, Each plate is attached to the plate support member by at least one of the following: screws, adhesive, magnetism, capillary force, or electrostatic force. and / or, In a plane perpendicular to the fluid flow path through one or more fluid openings, each conduit has a substantially rectangular cross-section. The fluid handling system according to claim 2.

4. Each plate has a substantially planar structure, and the outer surface of each plate is the main surface of the plate. The second set of fluid openings is positioned further away from the beam path of the radiation beam than the first set of fluid openings. A fluid handling system according to any one of claims 1 to 3.

5. The multiple fluid openings are configured to extract immersion liquid and / or gas from the channel. and / or, The multiple fluid openings are configured to supply immersion liquid and / or gas to the channel. and / or, The fluid opening is provided around the midpoint of the liquid-restricting space, and the fluid opening may optionally be provided in a circular, square, rectangular, or star shape, or any combination thereof. A fluid handling system according to any one of claims 1 to 4.

6. One or more plates comprise metal and / or metal foil and / or plastic material. and / or, One or more plates have a thickness between 5 μm and 5 mm. A fluid handling system according to any one of claims 1 to 5.

7. The outer surface of one or more plates is coated. and / or, Multiple plates can be attached to the same plate support member. and / or, At least one of the aforementioned plates is substantially pointed. and / or, The plurality of plates are configured to surround the beam path of the radiation beam. A fluid handling system according to any one of claims 1 to 6.

8. The outer surface of one or more plates is coated with a hydrophobic coating and / or a hydrophilic coating. and / or, One or more plates comprising microsieves and / or porous members, A fluid handling system according to any one of claims 1 to 7.

9. The plate has an opening through which the beam path of the radiation beam passes. and / or, The fluid handling system comprises a plurality of interchangeable plates, all of which have an outer surface having a plurality of fluid openings, and each outer surface is a boundary surface between the fluid handling system and the channel. A fluid handling system according to any one of claims 1 to 8.

10. Each plate has corners that are positioned to align with the scanning or stepping direction of the lithography apparatus. and / or, The plurality of plates are configured to surround the beam path in a substantially square arrangement. The fluid handling system according to claim 7.

11. Further comprising one or more bumper plates, The outer surface of each bumper plate provides a boundary surface between the fluid handling system and the channel. The surface of the bumper plate provides the minimum distance across the channel between the fluid handling system and the substrate. A fluid handling system according to any one of claims 1 to 10.

12. The fluid handling system according to claim 11, wherein each bumper plate comprises a metal, rubber, and / or plastic material.

13. A lithography apparatus comprising a fluid handling system according to any one of claims 1 to 12.

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