Liquid immersion cooling device
The liquid immersion cooling device with a refrigerant inlet and outlet on one lid and a thermal control system addresses inefficiencies in existing methods by ensuring efficient cooling and environmental resistance for electronic components in harsh environments.
JP7838326B2Active Publication Date: 2026-04-01NEC CORP
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-03-10
- Publication Date
- 2026-04-01
Abstract
To provide a liquid immersion cooling device with a reinforced resistance to environments which can present a high cooling efficiency and can be designed and manufactured easily.SOLUTION: The present invention relates to a liquid immersion cooling device (10) for a circuit board (141) at least having an electronic circuit part which generates heat, the liquid immersion cooling device including: a pressure container (100) made of a container body (101) and at least one lid (110, 120) joined to the container body removably and filled with a liquid refrigerant (130); and an attachment member (103, 104) provided in the pressure container, the attachment member arranging the circuit board in the container to surround the periphery of the circuit board with a refrigerant. A refrigerant exit (111) and a refrigerant entrance (112) are provided in one lid (110). The refrigerant in one side of the circuit board is forced to flow out of the pressure container through the refrigerant exit and is forced to enter the other side of the circuit board through the refrigerant entrance.SELECTED DRAWING: Figure 1
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Citation Information
Patent Citations
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