White resin composition, shrinkable white substrate, and shrink label

A white resin composition with specific titanium dioxide and thermoplastic resin properties forms a shrinkable substrate with an overcoat and printing layer, addressing opacity and toughness issues in shrink labels, ensuring uniform shrinkage and adhesion.

JP7838330B2Active Publication Date: 2026-04-01TOYO INK MFG CO LTD +1
8 Cites 0 Cited by

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-03-14
Publication Date
2026-04-01
Patent Text Reader

Abstract

To provide a white resin composition which is excellent in concealment property, toughness and printing adhesion, and a shrinkable white substrate, and a shrink label which enable protection of a content and imparting of designability without coloration of a container.SOLUTION: A white resin composition is used for forming a shrinkable white substrate in a shrink label which has an overcoat layer, a printing layer and a shrinkable white substrate in this order, and has a direct printing layer in the shrinkable white substrate, and contains titanium dioxide (A) and a thermoplastic resin, wherein the titanium oxide (A) has an average primary particle diameter of 0.13-0.28 μm and purity of 95-99.9%, and the thermoplastic resin has a crystallization temperature higher than a glass transition temperature by 60°C or more and the glass transition temperature of 65-110°C.SELECTED DRAWING: None
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Pigmented amorphous sheet of crystalline thermoplastic resin

    JP1999505780A

  • White film for heat-shrinkable label, heat-shrinkable label made of the film and container whit label fitted by shrinking

    JP2002285020A

  • Copolyester and method for producing heat-shrinkable tube using the copolyester

    JP2006117872A

  • Thermally shrinkable polyester-based film and thermally shrinkable label

    JP2007186662A

  • Thermoplastic resin composition

    JP2009179670A