Conveying method, conveying device, and analysis system

Abstract

The present invention improves the transfer accuracy of a mesh on which a sample analyzed by using a charged particle beam device is mounted. This conveyance method includes: (a) a step for using a first conveyance unit to pick up and hold the mesh that has been placed on a first placement table; (b) a step, after step (a), for using a first imaging unit to image the mesh held by the first conveyance unit; (c) a step for correcting the position or angle of the mesh from the first image acquired in step (b), and (d) a step, after step (c), for using the first conveyance unit to mount the mesh on a mesh holder.

Description

Technical Field

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[0001] The present invention relates to a conveying method, a conveying device, and an analysis system, and particularly relates to a conveying method and a conveying device for conveying a mesh on which a sample to be analyzed using a charged particle beam device is mounted.

Background Art

[0002] In recent years, miniaturization has been accelerating in semiconductor leading-edge devices. In order to observe the structure of semiconductor leading-edge devices, for example, a technique is known in which a sample is taken out from a wafer by a focused ion beam (FIB) device, the taken-out sample is transferred (adhered) to a mesh, and the sample is observed by a scanning electron microscope (SEM).

[0003] Patent Document 1 (International Publication No. 2021 / 210087) describes that a mesh on a stage is conveyed by a manipulator and mounted on a holder, and then observation is performed by a TEM (transmission electron microscope).

Prior Art Documents

Patent Documents

[0004] <00000l9>

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Conventionally, the mesh, which is the transfer destination of the above sample piece, has been fixed to the holder by hand. Therefore, it has caused failures such as poor position accuracy of the mesh, poor attachment angle during transfer of the sample piece, and not being within the field of view for mesh recognition. [[ID=4I]]

[0006] This invention was conceived to solve these problems, and its objective is to improve the accuracy of mesh transfer. [Means for solving the problem]

[0007] A brief overview of some of the representative embodiments disclosed in this application is as follows:

[0008] One embodiment of the transport method is a transport method for transporting a mesh on which a sample to be analyzed using a charged particle beam apparatus is mounted, and comprises: (a) a step of picking up and holding the mesh placed on a first mounting stage with a first transport unit; (b) a step of imaging the mesh held by the first transport unit after step (a) using a first imaging unit; (c) a step of correcting the position or angle of the mesh from the first image acquired in step (b); and (d) a step of mounting the mesh on a mesh holder with the first transport unit after step (c). [Effects of the Invention]

[0009] According to the present invention, the accuracy of mesh transfer can be improved. [Brief explanation of the drawing]

[0010] [Figure 1] This is a schematic diagram showing a transport device according to an embodiment. [Figure 2] Figure 1 is a plan view showing the conveying device. [Figure 3] This is a plan view showing the mesh according to the embodiment. [Figure 4] This is a perspective view showing a mesh holder according to an embodiment. [Figure 5] This is a flowchart showing the transport method according to the embodiment. [Figure 6] This is a flowchart showing the transport method according to the embodiment. [Figure 7] This is a flowchart showing the transport method according to the embodiment. [Figure 8] It is a flowchart showing a conveyance method according to an embodiment. [Figure 9] It is a flowchart showing a conveyance method according to an embodiment. [Figure 10] It is a flowchart showing a conveyance method according to an embodiment. [Figure 11] It is a flowchart showing a conveyance method according to an embodiment. [Figure 12] It is an image diagram showing an imaging result by an upper camera according to an embodiment. [Figure 13] It is a perspective view showing a conveyance unit according to an embodiment. [Figure 14] It is a bottom view showing a conveyance unit according to an embodiment. [Figure 15] It is a bottom view showing a corrected conveyance unit according to an embodiment. [Figure 16] It is a bottom view showing a conveyance unit and a mesh according to an embodiment. [Figure 17] It is an image diagram showing an imaging result by a lower camera according to an embodiment. [Figure 18] It is a plan view showing the positional relationship between a mesh holder and a conveyance unit when a mesh is mounted according to an embodiment. [Figure 19] It is a side view showing the positional relationship between a mesh holder and a mesh when a mesh is mounted according to an embodiment. [Figure 20] It is an enlarged plan view explaining the transfer of a sample piece to a mesh. [Figure 21] It is an image diagram showing an imaging result of a mounting table by an upper camera according to an embodiment. [Figure 22] It is a plan view explaining the transfer of a mesh from one mounting table to another mounting table according to Modification 1 of an embodiment. [Figure 23] It is a schematic diagram showing an analysis system according to an embodiment. [Figure 24] It is a schematic diagram showing an analysis system according to Modification 2 of an embodiment. [Figure 25] It is a schematic diagram showing an analysis system according to Modification 2 of an embodiment. [Figure 26] This is a plan view showing the mesh and mesh holder related to the comparative example. [Figure 27] This is an enlarged plan view illustrating the transfer of a sample piece to the mesh related to the comparative example. [Modes for carrying out the invention]

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings used to describe the embodiments, the same reference numerals are used for members having the same function, and repeated descriptions of them will be omitted. In addition, in the embodiments, descriptions of the same or similar parts will not be repeated unless particularly necessary.

[0012] Here, the X direction (X-axis) and Y direction (Y-axis) are mutually orthogonal and both lie along the horizontal plane. Here, the direction perpendicular to the X and Y directions is called the Z direction (Z-axis) or the vertical direction.

[0013] Both FIB (Focused Ion Beam) and SEM (Scanning Electron Microscope) are devices capable of observing fine shapes. FIB is a device that scans the surface of a sample with a narrowly focused ion beam, detecting generated secondary electrons and other elements to observe a microscopic image. SEM is a device that uses an electron beam to observe a microscopic image of the sample's surface. Since ions have greater mass than electrons, the ion beam irradiation of FIB causes a phenomenon where the sample is scraped away. This property is utilized in the microfabrication of samples. FIB-SEMs, equipped with an FIB, SEM, and a tiltable stage, are widely used as devices for preparing and observing sample pieces for TEM observation. For example, the preparation of sample pieces by irradiating them with an ion beam using FIB is described in Japanese Patent Publication No. 2016-50853.

[0014] In FIB-SEM observation, a semicircular plate called a mesh is mounted on a mesh holder. The mesh and mesh holder are then brought into the FIB-SEM apparatus, and the sample piece is transferred to the mesh. One of the main applications of FIB-SEM is automated microsampling. Microsampling is the preparation of sample pieces for TEM observation, and automated microsampling refers to the technology that automates this preparation process.

[0015] The embodiments described below relate to a method for transporting mesh from a mounting stage to a mesh holder before it is placed inside a FIB-SEM device, a method for transporting mesh removed from the FIB-SEM device from the mesh holder to the mounting stage, and a transport apparatus for the same. Furthermore, the embodiments described below relate to a method for transporting mesh from a mounting stage to a mesh holder before it is placed inside an optical sample transfer device or TEM device, a method for transporting mesh removed from the optical sample transfer device or TEM device from the mesh holder to the mounting stage, and a transport apparatus for the same (see Modification 2).

[0016] (Embodiment) <Configuration of the conveying device> Figures 1 and 2 show the conveying device of this embodiment. Figure 1, a side view, and Figure 2, a top view, correspond to each other and show the same conveying device. As shown in Figures 1 and 2, the conveying device of this embodiment comprises a stage ST for mesh MS, a conveying unit (manipulator) MP that suctions and conveys the mesh MS at the bottom, and a mesh holder MH on which the mesh MS can be mounted.

[0017] The Stage ST can be equipped with at least one Mounting Platform LCC. Here, the Stage ST is equipped with three Mounting Platform LCCs, but the number of Mounting Platform LCCs may be less than or more than three. The Stage ST is a circular rotary table that can rotate around a vertical axis, but it may also be a stage that can be driven in the X and Y directions. Rotary tables offer excellent space efficiency.

[0018] The mounting platform LCC has a circular top surface in plan view, and its shape is approximately cylindrical. Multiple mounting platforms LCCs can be mounted on the top surface of the stage ST, arranged in a circular orbit around the center of the stage ST in plan view. Each mounting platform LCC is rotatable around its cylindrical axis, and multiple mounting sections 3 are arranged on the top surface of the mounting platform LCC in a circle around this axis. The mounting sections 3 consist of recesses (holes) 4 on the top surface of the mounting platform LCC, and a mesh MS can be mounted on the bottom surface of the recess 4. The recesses 4 are circular in plan view, and their diameter is, for example, approximately 3 mm. Here, one mounting platform LCC has eight mounting sections 3. The mounting platform LCC is also called, for example, a mesh cartridge or an LC container. The mounting sections 3 (recesses 4) may be arranged in a matrix on the top surface of the mounting platform LCC, rather than in a circle.

[0019] The top surface 1A of the main body 5 of the mesh holder MH, the bottom surface of the recess 4, and the lowest surface of the conveying section MP are all surfaces that conform to the horizontal plane.

[0020] The transport unit MP picks up the mesh MS from the hole in the mounting stage LCC and transports it to the mesh holder MH. The transport unit MP also performs the reverse operation. The transport unit MP is driveable in the X, Y, and Z directions and moves between the stage ST and the mesh holder MH. The tip (bottom) of the transport unit MP that picks up the mesh MS is rotatable around the Z axis. The transport unit MP picks up and holds the mesh MS, for example, by vacuum suction. The vacuum may be generated by a vacuum pump or by using a vacuum generator that uses compressed air. Since the mesh MS is small and light, it can be sufficiently picked up by suction using a vacuum generator. Furthermore, the success of the mesh MS picking up can be managed by monitoring the suction pressure. In addition to vacuum suction, a suction method using electrostatics may be used, or a method of picking up the mesh MS by gripping it from above and below like tweezers may be used.

[0021] Here, we will describe the TEM mesh used to transfer sample pieces during automated microsampling. Figure 3 shows the planar shape of the mesh MS. The mesh MS consists of plate-like members with a planar shape that is approximately semicircular. That is, the mesh MS has an upper surface (front surface), a lower surface (bottom surface, back surface) parallel to the upper surface, and sides connecting the upper and lower surfaces. Although we describe a semicircular mesh here, the mesh may also be circular in shape.

[0022] TEM samples are sometimes called Lamella, and the mesh MS is also called TEM mesh, TEM grid, Lamella Carrier, or LC. The mesh MS is a metal piece with a diameter of 3 mm, and the one used here has a crescent-shaped comb-like form. Each of the multiple comb teeth protruding outward from the end of the mesh MS is a pillar (columnar part) PL. A TEM sample is attached to each of these pillar PLs in the FIB-SEM instrument.

[0023] The mesh MS is provided with alignment marks AM1, which consist of circular through-holes in a plan view, and alignment marks AM2, which consist of triangular through-holes. The size and position of alignment marks AM1 and AM2 are the same for all mesh MS. This explanation describes the cases where the alignment marks are circular and triangular, but the shape of the alignment marks is not limited to these shapes. In addition, a two-dimensional code (two-dimensional matrix code, identification code) CD1 is attached to the top surface of the mesh MS.

[0024] The mesh holder MH is mounted on a table HT that can be driven, for example, in the X and Z directions. Figure 4 shows a perspective view of the mesh holder MH. The mesh holder MH fixes the mesh MS that has been transported by the transport unit MP. One or more mesh MS can be fixed to the mesh holder MH. In this case, four mesh MS can be fixed. There are screw-type and spring-type methods for fixing the mesh MS, but the spring-type method is used here.

[0025] The mesh holder MH comprises a main body 5, a cylinder HC that penetrates the main body 5, and a mesh retainer H1 connected to the upper end of the cylinder HC on the main body 5. The mesh retainer H1 is a plate-shaped member parallel to the upper surface 1A of the main body 5. The cylinder HC and the mesh retainer H1 are biased downward in the Z direction of the main body 5 by a spring (coil spring) CS, which is a biasing part that wraps around the cylinder HC inside the main body 5. In other words, the mesh retainer H1 is biased toward the upper surface 1A of the main body 5 by the spring CS.

[0026] In the spring-type system, a cylinder pin CP inside the conveying system pushes up the spring CS of the mesh holder MH, creating a gap between the mesh retainer H1 and the holder. The conveying unit MP inserts the mesh MS into this gap, and as the cylinder pin CP is lowered, the mesh retainer H1 descends, fixing (mounting) the mesh MS on the upper surface 1A of the mesh holder MH. The cylinder pin CP is controlled by compressed air. There may be one or more cylinder pins CP, or even multiple cylinder pins.

[0027] As shown in Figure 1, one of the main features of this embodiment is that the conveying device is equipped with a camera (lower camera) C1 for confirming the orientation of the mesh MS, positioned directly below the conveying path of the mesh MS by the conveying unit MP. Another main feature of this embodiment is that the conveying device is equipped with a camera (upper camera) C2 positioned directly above the mounting section 3 on the upper surface of the mounting table LCC. Camera C2 is used to confirm the position of the mounting section 3 (center position of the recess 4) or the orientation of the mesh MS placed on the mounting section 3, or to read the two-dimensional code on the surface of the mesh MS. The mounting table LCC may be assigned a two-dimensional code (two-dimensional matrix code, identification code) CD2, for example, on its side surface. In that case, a camera C3 (see Figure 2), which is a code reader for reading the two-dimensional code on the mounting table LCC, is installed near the stage ST.

[0028] As shown in Figures 1 and 2, the stage ST, transport unit MP, table HT, and cameras C1, C2, and C3 are each connected to a control unit 1, which is, for example, a computer. More specifically, the power that drives the stage ST, transport unit MP, and table HT is connected to the control unit 1. The operation of the stage ST, transport unit MP, and table HT is controlled by the control unit 1. The control unit 1 is connected to a storage unit 2. Although not shown, the control unit 1 may also be connected to a display unit and an operation unit, etc.

[0029] Camera C2 images the surface (top surface) of the mesh MS directly below it from above. In other words, camera C2 is positioned above the mounting stage LCC. At this time, the stage ST moves its coordinates so that the mesh MS is directly below camera C2. In Figure 2, imaging by camera C2 is performed, for example, in the area SH2 enclosed by the dashed line. When imaging with camera C2, the mesh MS is illuminated by the camera's light source. Due to the illumination, the metal mesh MS shines white when imaged, and the surface of the mounting stage LCC, including the surface of the recess 4, appears black as a background. The intensity of the camera's light source and the exposure time of camera C2 are adjusted to ensure contrast between the mesh MS and the recess 4 of the mounting stage LCC. When imaging the recess 4 in which the mesh MS is not mounted, the imaging conditions are set to be brighter than when imaging the mesh MS. The image captured by camera C2 is sent to the control unit 1 for image processing.

[0030] Camera C1 captures the back side of the mesh MS picked up by the transport unit MP from below, looking upwards. After the mesh MS is picked up by the transport unit MP, the top surface of the mesh MS is hidden by the transport unit MP, so it is necessary to capture the image from the back side in order to recognize the orientation at the time of pickup. When imaging with camera C1, the coordinates of the transport unit MP are moved so that it is directly above camera C1. In other words, camera C1 is positioned below the bottom of the transport unit MP. In Figure 2, imaging by camera C1 is performed, for example, in the area SH1 enclosed by the dashed line. Here too, the brightness and exposure time of the camera light source are adjusted so that there is contrast between the mesh MS and the background. The image captured by camera C1 is sent to the control unit 1 for image processing.

[0031] <Transportation Operation> The mesh transport operation using the transport device described above will be explained below with reference to the flows in Figures 5 to 11. The flows in Figures 5 to 7 describe the transport operation before the mesh is introduced into the FIB-SEM device. The flows in Figures 8 and 9 describe the transport operation after the mesh has been retrieved (removed) from the FIB-SEM device. The flow in Figure 10 provides a more detailed explanation of a part of the flow in Figure 6. The flow in Figure 11 provides a more detailed explanation of a part of the flow in Figure 9.

[0032] First, as shown in Figure 5, pre-transport operations are performed. That is, before transport, the LCC mounting platform is set on the Carrier Transfer System (CTS), which is the transport device of this embodiment (step S100 in Figure 5). If the mesh MS is not already mounted on the LCC mounting platform, the mounting operation is also performed.

[0033] The movable axes of the transport system are initialized (step S110 in Figure 5). The X, Y, Z, and R axes (rotation axes, see Figure 2) of the transport unit MP correspond to the movable axes. Initialization is necessary for high-precision transport.

[0034] The stage ST is moved (step S120 in Figure 5), and the presence or absence of the cap is checked using the height sensor (step S130 in Figure 5). The height sensor is located on the mounting platform LCC. The cap refers to the lid of the mounting platform LCC, which is attached to prevent dirt or scattering. If the cap remains attached to the mounting platform LCC, the transport unit MP cannot pick it up, so it is checked before transport.

[0035] The stage ST is then moved to read the ID of the mounting platform LCC (step S140 in Figure 5). Some mounting platforms LCCs are assigned an ID (two-dimensional code CD2), which is read by a code reader (camera C3) inside the transport device, and the information of the mounting platform LCC is linked to the information of the mesh MS inside it. Here, the control unit 1 stores the information of the two-dimensional code CD2 in the storage unit 2.

[0036] Next, the stage ST is moved (rotated) so that the mounting section 3 of the mounting platform LCC is directly below the camera C2. The camera C2 captures an image of the mesh MS placed on the mounting section 3 to confirm the presence or absence of the mesh MS (step S150 in Figure 5). If the image of the mesh MS matches the pre-registered external shape model, the control unit determines that it is present. If there is no mesh MS, the control unit 1 stores the information that the mesh MS is absent in the storage unit 2.

[0037] In parallel with confirming the presence of the mesh MS, the two-dimensional code CD1 engraved on the surface of the mesh MS is also read (step S160 in Figure 5). Since the engraving position of the two-dimensional code CD1 on the surface of the mesh MS is fixed, the two-dimensional code CD1 is detected by searching a specific area of ​​the mesh MS after the orientation of the mesh MS is recognized. The read ID information is transmitted to the control unit 1. The control unit 1 stores this information in the storage unit 2 and links the ID of the mounting table LCC (information from the two-dimensional code CD2) with the ID of the mesh MS (information from the two-dimensional code CD1). In other words, the control unit 1 associates this information and stores it in the storage unit 2.

[0038] The ID reading of the loading platform LCC, the confirmation of the presence of the mesh MS, and the ID reading of the mesh MS are performed for all loading platform LCCs if multiple loading platform LCCs are installed. In other words, steps S140 to S160 are repeated. Loading platform LCCs for which information has already been read are skipped. The operator can also choose not to read specific loading platform LCCs. Next, the mesh transport operation shown in Figure 6 is performed.

[0039] In other words, in order to transport the mesh MS, the stage ST is moved so that the mesh MS is directly below camera C2 (upper camera) (step S170 in Figure 6).

[0040] Next, the mesh MS is imaged with camera C2 (step S180 in Figure 6). An example of the resulting image is shown in Figure 12. In Figure 12, a horizontal line and a vertical line intersect at the center of the image, and ideally, the center point of the mesh MS should be located at the intersection of these horizontal and vertical lines (center of the camera's field of view). The center point of the mesh MS is the center of the circle if the semicircular mesh MS were assumed to be a circle rather than a semicircle, and is the intersection of the two dashed lines shown in Figure 12. In the example shown in Figure 12, the center of the image (reference point, center of the camera's field of view) and the center point of the mesh MS are misaligned in the X and Y directions.

[0041] Ideally, the arc of the semicircular mesh MS should point upwards in Figure 12. Here, the mesh MS is rotated (angled) by an angle θ between the vertical line and the dashed line extending perpendicularly to the direction in which the pillar PL is aligned. The amount of rotational displacement in Figure 12, i.e., the angle θ, is, for example, 45 degrees. Ideally, the angle θ should be 0 degrees.

[0042] Next, the image obtained by camera C2 in step S180 is transmitted to the control unit 1, which then performs image processing (step S190 in Figure 6).

[0043] Next, the transport unit MP is moved to correct the positional displacement in the X and Y directions and the rotational displacement in the rotational direction of the mesh MS obtained by the image processing (step S200 in Figure 6). Note that if the center of the image (reference point) and the center point of the mesh MS overlap and no positional displacement occurs, and the angle θ is 0 degrees and no rotational displacement occurs, it is not necessary to perform the position and angle corrections in steps S190 and S200 described later. Even in such cases, the control unit 1 performs the image processing in step S190 and determines whether correction is necessary.

[0044] Next, the transport unit MP picks up the mesh MS (step S210 in Figure 6). At this time, the transport unit MP picks up the center of the mesh MS using camera image processing (it can also be any position other than the center).

[0045] Here, Figures 13 and 14 show the transport section MP. Figure 14 is a view of the tip (lower end) of the transport section MP from below. In Figure 14, hatching is applied to the bottom surface of the transport section MP, which is the surface that can come into contact with the mesh MS. Two holes 6 are provided on the bottom surface of the transport section MP. The mesh MS is attracted to this bottom surface by suction through the holes 6. The shape of the tip of the transport section MP is approximately circular in plan view, but the upper left and right parts (shoulder parts) in Figure 14 are indented.

[0046] As shown in Figure 13, the transport unit MP comprises a vertically extending support column 15, a hole 17 provided on the bottom surface of the support column 15, and a suction nozzle 16 provided within the vertically extending hole 17 and movable in the vertical direction (up and down direction). Two holes 6 are provided at the tip (bottom surface) of the suction nozzle 16.

[0047] In step S200, the transport unit MP moves according to the amount of positional displacement in the X and Y directions of the mesh MS obtained by the image processing in step S190. Also in step S200, the transport unit MP rotates (for example, by 45 degrees) according to the amount of rotational displacement of the mesh MS obtained by the image processing in step S190 (see Figure 15). In other words, the positional displacement or rotational displacement of the mesh MS is corrected by the movement or rotation of the transport unit MP.

[0048] Figure 16 shows the mesh MS being adsorbed onto the tip of the transport unit MP in step S210. Figure 16 shows a view of the transport unit MP holding the mesh MS from below, with the adsorption nozzle 16 hidden by the mesh MS indicated by a dashed line. When the mesh MS is viewed from the back side, the two-dimensional code CD1 on the top surface of the mesh MS is not visible.

[0049] The pillar section of the mesh MS is where the sample piece is placed. Therefore, to prevent the transport section MP from coming into contact with the pillar section when adsorbing the mesh MS, the bottom surface of the transport section MP and the pillar section are spaced apart during adsorption. Specifically, an adsorption nozzle 16 is used that has a shape that scoops out the pillar section so that the pillar section can be avoided even when adsorbing near the center of the mesh MS after rotational correction. In other words, the bottom surface of the transport section MP that can come into contact with the mesh MS is, in a plan view, the region surrounding the center of the adsorbed mesh MS, and is located near the circumference of the semicircular mesh MS. The tip of the transport section MP that adsorbs the mesh MS (adsorption nozzle 16) is preferably made of a conductive material to prevent sticking due to static electricity.

[0050] Next, once the mesh MS is attracted, the transport unit MP is moved to directly above the camera (lower camera) C1 (region SH1) (step S220 in Figure 6). In this way, the transport unit MP picks up the mesh MS.

[0051] Next, the back surface of the mesh MS is imaged using camera C1 (step S230 in Figure 6). Figure 17 shows an example of an image obtained from this imaging. The positional and rotational displacements of the mesh MS are almost eliminated by the corrections performed in steps S180 to S200, but positional and rotational displacements may occur again when suction is performed in step S210. In this case, as shown in Figure 17, a rotational displacement of angle θ occurs.

[0052] Next, the image is transmitted to the control unit 1, which performs image processing (step S240 in Figure 6).

[0053] Next, the cylinder HC of the mesh holder MH is raised to create a gap between the mesh retainer H1 and the upper surface 1A of the main body 5 of the mesh holder MH (step S250 in Figure 6).

[0054] The transport unit MP is moved so that the mesh MS fits into the gap 1A (step S260 in Figure 6). Here, as shown in Figure 18, the transport unit MP and the mesh retainer H1 are separated from each other, and the transport unit MP is moved to a position where it overlaps with the mesh MS and the mesh retainer H1 in a plan view. In Figure 18, the part of the transport unit MP that comes into contact with the mesh MS is shown with hatching. Also, a part of the outer shape near the tip of the transport unit MP is shown with a dashed line.

[0055] Furthermore, as shown in Figure 19, in step S260, the transport unit MP is moved to the mesh holder MH, and before the mesh retainer H1 is lowered (step S270 in Figure 6), the back surface of the mesh MS is in contact with the upper surface 1A of the mesh holder MH, which is the surface on which the mesh MS is mounted. In other words, the distance between the back surface of the mesh MS and the upper surface 1A of the mesh holder MH is 0 mm.

[0056] Next, with the back surface of the mesh MS in contact with the upper surface 1A of the mesh holder MH, the cylinder of the mesh holder MH is lowered, and the mesh MS is held in place by the mesh retainer H1 (step S270 in Figure 6). This fixes (mounts) the mesh MS on the mesh holder MH. A spring CS1 is built into the hole 17 at the bottom of the support column 15 that constitutes the transport unit MP. When the back surface of the mesh MS is pressed against the upper surface 1A of the mesh holder MH, the mesh MS and the suction nozzle 16 in the hole 17 are biased downward by the spring CS1. This prevents a gap from forming between the upper surface 1A and the mesh MS even if the support column 15 of the transport unit MP moves up and down slightly. In other words, the mesh MS can be fixed by the mesh retainer H1 while pressing the back surface of the mesh MS against the upper surface 1A of the mesh holder MH without putting any load on the mesh holder MH. The spring CS1 may be made of another elastic material.

[0057] Steps S170 to S270, as shown in Figure 6 described above, are repeated the same number of times as the number of meshes MS mounted on the mesh holder MH. In other words, the process returns from step S270 to step S170.

[0058] Next, the mesh holder transport operation shown in Figure 7, that is, the operation of transporting the mesh holder MH into the FIB-SEM device, is performed. When transporting the mesh MS into the FIB-SEM device, the mesh MS is transported with the mesh MS mounted on the mesh holder MH.

[0059] First, the table HT equipped with the mesh holder (see Figure 2) is raised (step S280 in Figure 7).

[0060] Next, the mesh holder MH and the table HT are released from their fixed positions (step S290 in Figure 7).

[0061] Next, the mesh holder MH is fixed to the CTS-ARM (not shown), which is an arm (transport unit) for transporting the mesh holder MH into the FIB-SEM device (step S300 in Figure 7).

[0062] Next, the table HT is lowered, thereby transferring the mesh holder MH from the table HT to the CTS-ARM (step S310 in Figure 7).

[0063] Next, the CTS-ARM is inserted into the FIB-SEM device (step S320 in Figure 7).

[0064] Next, after the mesh holder MH is received by the mesh holder MH receiving mechanism (not shown) within the FIB-SEM device, the CTS-ARM releases the fixation of the mesh holder MH (step S330 in Figure 7).

[0065] Next, the CTS-ARM is moved from inside the FIB-SEM device to outside the FIB-SEM device (step S340 in Figure 7).

[0066] Subsequently, the sample piece processed and removed within the FIB-SEM device is transferred to the pillar PL of the mesh MS mounted on the mesh holder MH within the FIB-SEM device, and the sample piece is observed (analyzed) using SEM. In other words, automated microsampling is performed.

[0067] Although this section describes transporting the mesh holder MH into the FIB-SEM device using a transport arm or the like, the operator may also manually remove the mesh holder MH from the table HT and transport it into the FIB-SEM device.

[0068] The general flow of automated microsampling is as follows: First, a deposition gas is blown onto a bulk sample, such as a semiconductor substrate, to perform film formation (creation of a protective film). Next, etching is performed to extract sample pieces from the bulk sample to create sample pieces. Then, a needle for extracting the sample pieces is brought close to the sample pieces, and the needle and sample pieces are bonded together by deposition.

[0069] Next, the connection between the bulk sample and the sample piece is cut, separating the sample piece. Then, the pillar PL of the mesh MS, which is the destination for the sample piece, is automatically image-recognized. Next, as shown on the left side of Figure 20, the positions of the pillar PL and the sample piece 7 are automatically recognized, and the needle 8 is brought close to the pillar PL. Next, as shown on the right side of Figure 20, the pillar PL and the sample piece 7 are deposited, and then the needle 8 and the sample piece 7 are separated.

[0070] The above is a general overview of the automated microsampling process using FIB-SEM. Next, as shown in Figure 8, the mesh holder MH is retrieved. This operation is performed in the reverse order of the operation described using Figure 7.

[0071] In other words, the CTS-ARM is inserted into the FIB-SEM device (step S400 in Figure 8).

[0072] Next, the mesh holder MH inside the FIB-SEM device is fixed to the CTS-ARM (step S410 in Figure 8).

[0073] Next, the CTS-ARM is moved from inside the FIB-SEM device to outside the FIB-SEM device (step S420 in Figure 8).

[0074] Next, the table HT is raised (step S430 in Figure 8).

[0075] Next, the mesh holder MH and the CTS-ARM are released from their fixed positions (step S440 in Figure 8).

[0076] Next, the mesh holder MH is fixed to the table HT (step S450 in Figure 8).

[0077] Next, the table HT is lowered, thereby retrieving the mesh holder MH (step S460 in Figure 8). Next, the mesh retrieval operation shown in Figure 9 is performed.

[0078] In other words, the transport unit MP is moved to the mesh holder MH (step S470 in Figure 9).

[0079] Next, the transport unit MP adsorbs the mesh MS to be recovered (step S480 in Figure 9).

[0080] Next, with the mesh MS in place, the cylinder HC and mesh retainer H1 of the mesh holder MH are raised (step S490 in Figure 9).

[0081] Next, the transport unit MP is moved to remove the mesh MS from the mesh holder MH, and the transport unit MP, which has the mesh MS attached, is moved to directly above the camera (lower camera) C1 (region SH1) (step S500 in Figure 9). In this way, the transport unit MP picks up the mesh MS.

[0082] Next, after removing the mesh MS from the mesh holder MH in step S500, the cylinder HC and mesh retainer H1 are lowered (step S510 in Figure 9).

[0083] Next, the back of the mesh MS is imaged using camera (lower camera) C1 (step S520 in Figure 9).

[0084] Next, the image obtained by camera C1 in step S520 is transmitted to the control unit 1, which then performs image processing (step S530 in Figure 9).

[0085] Next, the stage ST is moved so that the recovery platform LCC is directly below the camera (upper camera) C2 (step S540 in Figure 9).

[0086] Next, the camera (upper camera) C2 images the mounting section 3 (recess 4) of the mounting platform LCC (step S550 in Figure 9). This image is sent to the computer to calculate the hole center. Correction calculations are performed on the transport section MP so that the hole center coincides with the center of the mesh MS to be recovered.

[0087] Next, the transport unit MP is moved based on the above correction calculation (step S560 in Figure 9). This corrects the positional displacement of the mesh MS held by the transport unit MP.

[0088] Next, the suction of the mesh MS is released, and the mesh MS is collected on the mounting table LCC (step S570 in Figure 9). If the mesh MS were to stick to the suction nozzle of the transport unit MP at this point, the process of releasing the mesh MS suction would be repeated.

[0089] The above steps S470 to S570 are repeated until all the mesh MS to be recovered have been recovered.

[0090] Next, we will specifically explain the image processing flow during mesh MS transport using Figure 10.

[0091] In step S180 of Figure 5, the image of the mesh MS captured by the camera (upper camera) C2 is transmitted to the control unit 1.

[0092] Next, the control unit 1 performs a binarization process to distinguish the mesh MS from the background (step S191 in Figure 10). That is, as shown in Figure 17, it performs a process to distinguish the white mesh MS from the other black parts (hatched areas in Figure 17).

[0093] After the binarization process in step S191, the outline of the captured mesh MS is matched with a pre-registered mesh MS outline model to roughly calculate the center of the mesh MS (step S192 in Figure 10). The outline model is created from a mesh with the same specifications as the mesh MS to be transported. When creating the model, the mesh image can be used as is, or shapes that are likely to cause noise can be masked and excluded from the matching target. Since the mesh MS is crescent-shaped, if the matching is successful, the center of the semicircle can be roughly calculated. Furthermore, successful matching indicates confirmation that the mesh MS is in stock.

[0094] Next, the circular alignment mark AM1 (see Figure 3) is searched for in the image of the acquired mesh MS (step S193 in Figure 10). Here, the alignment mark AM1, which is easier to find than the triangular alignment mark AM2 (see Figure 3), is first searched for in the entire acquired image. The position of the alignment mark AM1 on the mesh MS is predetermined. If the alignment marks AM1 and AM2 are not circular and triangular, the mark that is easier to find among AM1 and AM2 is searched for first.

[0095] Upon successful detection of alignment mark AM1, two coordinate pieces of information are obtained: the approximate center of the mesh MS determined from the matching process and the position of alignment mark AM1. Based on this, the position of alignment mark AM2 is detected (step S194 in Figure 10). The position of alignment mark AM2 on the mesh MS is also predetermined. However, since detecting alignment mark AM2 from the entire image would be time-consuming, only the area around the estimated position of alignment mark AM2, based on the position of alignment mark AM1 and the center position of the mesh MS, is detected. This reduces the time required to detect the two alignment marks AM1 and AM2.

[0096] Next, the control unit 1 calculates the center and rotational misalignment of the mesh MS from the positions of alignment marks AM1 and AM2 (step S195 in Figure 10). The center position calculated from alignment marks AM1 and AM2 is more accurate than the center position calculated by outline matching, and high-precision transport can be expected. Steps S191 to S195 above correspond to the image processing in step S190 in Figure 6.

[0097] The displacement of the center position of the mesh MS is calculated as one to more pixels in the image captured by camera C2. From the distance per pixel, the distance to be fed back to the transport unit MP can be calculated. Based on this calculation result, the transport unit MP is moved to an offset position from the camera's field of view center, which is the reference pickup position (step S201 in Figure 10). At the same time, if the mesh MS is rotating (has rotational displacement), the suction nozzle at the tip of the transport unit MP is rotated according to the amount of rotation (step S202 in Figure 10). Steps S201 and S202 correspond to the movement of the transport unit MP in step S200 in Figure 6, i.e., the correction of positional and rotational displacement.

[0098] Next, adsorption of the mesh MS is performed (step S210 in Figure 10).

[0099] Next, to image the back of the mesh MS, move up to above the lower camera (step S220 in Figure 10).

[0100] Next, using the same procedure as described above, imaging is performed using the lower camera, binarization of the back surface of the mesh MS is performed, the outline is matched, and each alignment mark is detected, and the mesh MS is then transported to the mesh holder MH.

[0101] Specifically, the back surface of the mesh MS is imaged by camera C1 (step S230 in Figure 10). The image of the mesh MS captured by camera (lower camera) C1 in step S230 is transmitted to the control unit 1.

[0102] Next, the control unit 1 performs the binarization process (step S241 in Figure 10).

[0103] Next, the outline of the captured mesh MS is matched with a pre-registered mesh MS outline model to roughly calculate the center of the mesh MS (step S242 in Figure 10).

[0104] Next, the circular alignment mark AM1 is detected from the image of the acquired mesh MS (step S243 in Figure 10). Here, the alignment mark AM1 is first detected from the entire image acquired from the back side of the mesh MS.

[0105] Next, the position of alignment mark AM2 is detected based on two coordinate pieces of information obtained from the matching: the center of the rough mesh MS and the position of alignment mark AM1 (step S244 in Figure 10). Alignment mark AM1, which requires a relatively short detection time, is detected before alignment mark AM2. This reduces the time required to detect the two alignment marks AM1 and AM2.

[0106] Next, the control unit 1 calculates the rotational misalignment from the center of the mesh MS based on the positions of the alignment marks AM1 and AM2 (step S245 in Figure 10). Steps S241 to S245 above correspond to the image processing in step S240 in Figure 6.

[0107] Next, the cylinder HC of the mesh holder MH is raised to create a gap between the mesh retainer H1 and the upper surface 1A of the main body 5 of the mesh holder MH (step S250 in Figure 10).

[0108] The displacement of the center position of the mesh MS is calculated as one to more pixels in the image captured by camera C1. From the distance per pixel, the distance to be fed back to the transport unit MP can be calculated. Based on this calculation result, the transport unit MP is moved to an offset position from the camera's field of view center, which is the reference pickup position (step S261 in Figure 10). At the same time, if the mesh MS is rotating (has rotational displacement), the suction nozzle at the tip of the transport unit MP is rotated according to the amount of rotation (step S262 in Figure 10). Steps S261 and S262 correspond to the movement of the transport unit MP in step S260 in Figure 6, i.e., the correction of positional and rotational displacement.

[0109] Next, with the back surface of the mesh MS and the upper surface 1A of the mesh holder MH in contact, the cylinder of the mesh holder MH is lowered, and the mesh MS is held in place by the mesh retainer H1 (step S270 in Figure 10). This fixes (mounts) the mesh MS on the mesh holder MH.

[0110] Next, the adsorption of the mesh MS is released (step S271 in Figure 10).

[0111] Next, the transport unit MP is moved to the standby position (step S272 in Figure 10).

[0112] Next, using Figure 11, we will specifically explain the flow of the mesh MS retrieval operation performed after automated microsampling by FIB-SEM. In this retrieval operation, either the flow using the upper camera or the flow using the lower camera may be performed first, or the flows may be performed simultaneously.

[0113] First, steps S480 to S520, as explained using Figure 9, are performed (steps S480 to S520 in Figure 11). Next, steps S531 to S535, which are the image processing steps for images captured by the lower camera, are performed in the same procedure as steps S241 to S245, as explained using Figure 10.

[0114] Furthermore, using the camera (upper camera) C2, the recessed area 4, which is the mounting section 3 of the mounting stage LCC where the mesh MS is retrieved, is imaged (step S550 in Figure 11). The imaging conditions at this time are different from those when the mesh MS is inside the recessed area 4, and conditions are applied to obtain a brighter image.

[0115] Next, the image captured in step S550 is transmitted to the control unit 1, which performs a binarization process (step S551 in Figure 11). This makes it easy to distinguish between the flat portion, which is the uppermost surface of the mounting stage LCC, and the recessed portion, which is the recess 4. That is, as shown in Figure 21, in the image captured in step S550, the inside of the recess 4 is displayed in black, and the flat portion, which is the uppermost surface of the mounting stage LCC outside the recess 4, is displayed in white.

[0116] Once the recessed portion 4 is recognized, the center of the circular hole is calculated (step S552 in Figure 11). These coordinates become the target coordinates for retrieving the mesh MS. In Figure 21, the center position of the circular recessed portion 4 is offset from the camera's field of view center, which is the reference mounting position (the reference position of the transport unit MP before correction).

[0117] Steps S550 to S552 described above may be performed before or after steps S490 to S535, or in the middle of steps S490 to S535. Steps S550 to S552 may be performed at any point after the stage ST and mounting platform LCC have been moved (rotated) for the last time, before performing step S535 described below. For example, if the stage ST and mounting platform LCC have not been moved (rotated) at all after picking up the mesh MS from the mounting platform LCC in step S220 in Figure 6, then steps S550 to S552 may be performed at any point after step S220.

[0118] Next, by performing both steps S535 and S552, the center position of the mesh MS is calculated using the lower camera, and the center position of the recess 4 is calculated using the upper camera. Then, the transport unit MP is moved so that these center positions coincide, thereby correcting the positional misalignment between the mesh MS and the recess 4 (step S553 in Figure 11). At this time, the rotational misalignment of the mesh MS may also be corrected.

[0119] Next, with the mesh MS placed in the center of the recess 4, the adsorption of the mesh MS by the transport unit MP is released (step S570 in Figure 11). This completes the retrieval of the mesh MS.

[0120] Next, the transport unit MP is moved to the standby position (step S571 in Figure 11).

[0121] <Effects of this embodiment> The effects of this embodiment will be explained below using the comparative examples Figures 26 and 27.

[0122] One method for mounting (fixing) the mesh onto the mesh holder is to manually transfer and fix the mesh onto the mesh holder. In this case, a jig to hold the mesh during transfer and a guide to move the mesh to the mounting position on the mesh holder can be used. However, because the transfer is done manually, there is a problem in that the transfer accuracy is not stable. That is, as shown in Figure 26, the mesh MS1 may not be fixed straight to the mesh holder MH1, and there is a risk of misalignment and rotational misalignment. In the comparative example shown in Figure 26, the meshes MS1 to MS3 are fixed by the mesh retainer H1 by tightening the screw S1 by a person.

[0123] Other potential issues include dirt adhering to the mesh (as seen in mesh MS2), deformation or damage (as seen in mesh MS3), and scratches. Furthermore, there is a risk of dropping or losing the mesh. However, here we will focus primarily on the issues related to positional accuracy.

[0124] In automated microsampling using FIB-SEM, the LC pillar position is automatically recognized, and the sample piece at the tip of the needle, whose position is also automatically recognized, is brought close to the pillar for adhesion. However, if the transfer position accuracy of the mesh to the mesh holder is poor, the sample piece may not come into the observation field of view of the charged particle beam (FIB or SEM), and adhesion may fail.

[0125] Furthermore, if there is a misalignment in the rotational direction of the mesh transfer position accuracy, when attempting to bring the sample piece close to the corner of the pillar tip (the target), the middle of the pillar PL and the corner of the sample piece 7 may collide before the sample piece approaches the target, as shown in Figure 27, resulting in adhesion failure. When the middle of the pillar PL and the corner of the sample piece 7 collide, the sample piece 7 may detach from the needle 8, potentially leading to the loss of the sample piece 7. To avoid such errors, it is necessary to accurately mount the mesh onto the mesh holder.

[0126] Therefore, in this embodiment of the conveying device, the conveying unit MP is used to automatically convey the mesh MS from the mounting table LCC to the mesh holder MH. By performing the conveying automatically instead of manually, the conveying can be done efficiently. Here, the mesh MS held by the conveying unit MP is imaged by a camera (lower camera) C1, and the positional and rotational displacement amounts of the mesh MS are calculated from the acquired image. Based on the calculation results, the conveying unit MP is moved and rotated to perform correction. This improves the transfer accuracy of the mesh MS and prevents positional and rotational displacement from occurring when the mesh MS is mounted on the mesh holder MH.

[0127] Furthermore, the mesh MS placed on the mounting platform is imaged by a camera (upper camera) C2, and the positional and rotational displacements of the mesh MS are calculated from the acquired images. Based on these calculations, the transport unit MP is moved and rotated to perform corrections. This prevents positional and rotational displacements from occurring when the mesh MS is picked up by the transport unit MP. In other words, it improves the transfer accuracy of the mesh MS and prevents positional and rotational displacements from occurring when the mesh MS is mounted onto the mesh holder MH.

[0128] Even with correction using camera (upper camera) C2, positional or rotational misalignment may occur due to the suction action of the transport unit MP. However, subsequent correction using camera (lower camera) C1 can further improve the transfer accuracy of the mesh MS.

[0129] Furthermore, in this embodiment, positional misalignment is corrected using cameras C1 and C2 during the retrieval operation of the mesh holder MH after automatic microsampling by FIB-SEM. If the mesh is transferred manually from the mesh holder to the mounting table during the retrieval operation, or if the transfer is performed by the transport unit without such correction, there is a risk that the position of the mesh returned to the recess of the mounting table may be misaligned. In this case, there is a risk of damage, dropping, and loss of the mesh. In this embodiment, by correcting the positional misalignment using cameras C1 and C2, damage, dropping, and loss of the mesh can be prevented, and the mesh MS can be transferred to the center of the recess 4.

[0130] Furthermore, in steps S260 and S270 of Figure 6, when the mesh MS is mounted onto the mesh holder MH, the transport unit MP fixes the mesh MS with the mesh retainer H1 while the mesh MS is in contact with the upper surface 1A of the mesh holder MH. By lowering the mesh retainer H1 while the mesh MS is in contact with the mesh holder MH and the transport unit MP is holding it in place, it is possible to prevent misalignment between the mesh MS and the mesh holder MH when the mesh MS separates from the transport unit MP. To perform this operation, the transport unit MP and the mesh retainer H1 are configured in a shape that does not interfere with each other (see Figure 18).

[0131] As described above, the conveying method and conveying device of this embodiment can improve the accuracy of mesh transfer.

[0132] <Example 1> It is conceivable that the replenishment of mesh onto the transfer table would be done manually. However, this replenishment process can be automated using a conveying unit. However, when the mesh is transferred to the table manually, or when the transfer is performed by the conveying unit without correction, there is a risk that the position of the mesh returned to the recess on the table may be misaligned. In this case, there is a risk of damage, dropping, and loss of the mesh.

[0133] In the following section, we will explain, using Figure 22, how to perform correction using a camera when supplementing (transferring) a mesh MS from, for example, a larger mounting table LLCC to the mounting table LCC shown in Figure 1. Figure 22 is a plan view showing a part of a transport device that is a modified example of this embodiment.

[0134] The mounting stage LLCC shown in Figure 22 is a cartridge that is larger than the mounting stage LCC and can hold a larger number of mesh MS. Here, a transport unit (not shown) connected to the control unit 1 automatically transfers the mesh MS from the mounting stage LLCC to the mounting stage LCC. That is, a mesh MS is placed in each of the multiple recesses 14 provided on the upper surface of the mounting stage LLCC, which serve as the mounting section 13. The transport unit picks up the mesh MS from the recesses 14 by suction, transports the mesh MS while holding it, and then transfers the mesh MS into the recesses 4, which are the mounting section 3 of the mounting stage LCC.

[0135] At this time, the mesh MS being transported by the transport unit is imaged in region SH3 by a camera (lower camera) not shown, and the amount of positional displacement of the mesh MS relative to the transport unit can be calculated by processing the acquired image. By moving (correcting) the transport unit based on this calculation result, the accuracy of transferring the mesh MS to the recess 4 can be improved. This lower camera is different from camera C1 shown in Figure 1, but the same camera as camera C1 may be used.

[0136] Furthermore, before transfer, the recess 4 at the transfer destination is imaged in region SH2 using a camera (upper camera) not shown, and by processing the acquired image, the amount of positional displacement between the mesh MS held in the transport unit and the recess 4 can be calculated. By moving (correcting) the transport unit based on this calculation result, the accuracy of the transfer of the mesh MS to the recess 4 can be improved. This upper camera may be the same as camera C2 shown in Figure 1, or it may be a different camera.

[0137] Furthermore, before the mesh MS is picked up by the transport unit, the mesh MS within the recess 14 of region SH4 may be imaged using an upper camera (not shown) on the mounting table LLC, similar to steps S180 to S200 in Figure 5. By processing the acquired image to calculate the positional displacement between the mesh MS and the transport unit, and moving (correcting) the transport unit based on this calculation result, the accuracy of transferring the mesh MS to the recess 4 can be improved. This upper camera is different from camera C2 shown in Figure 1.

[0138] After transferring the mesh MS to the LCC mounting platform as described above and replenishing it, the transport or retrieval operation described in Figures 5 to 11 is performed.

[0139] In this modified version, the mesh MS can be transported with high accuracy by performing imaging, image processing, and correction using the lower camera in region SH3. Furthermore, the transfer accuracy of the mesh MS can be further improved by performing imaging, image processing, and correction in region SH2 or SH4.

[0140] <Modification 2> The embodiment described using Figures 1 to 19 and Figure 21 relates to an analysis system 201 that combines a mesh transport device 100 and a FIB-SEM device 200, as shown in Figure 23. In other words, the analysis system 201 comprises a transport device 100 and a FIB-SEM device 200. The transport device 100 corresponds to the configuration shown in Figure 1.

[0141] The object to which the transport device 100 transports the mesh is not limited to a FIB-SEM device, but may also be the optical sample transfer device 300 shown in Figure 24 or the TEM device 400 shown in Figure 25. The analysis system 301 shown in Figure 24 comprises the transport device 100 and the optical sample transfer device 300. The analysis system 401 shown in Figure 25 comprises the transport device 100 and the optical sample transfer device 300.

[0142] In other words, the transport method and transport apparatus described with reference to Figures 1 to 19 and Figure 21 are used for transporting the mesh from the mounting stage to the mesh holder before it is placed inside the optical sample transfer device 300 or the TEM device 400, and for transporting the mesh removed from the optical sample transfer device 300 or the TEM device 400 from the mesh holder to the mounting stage. Furthermore, the analysis system 301 shown in Figure 24 may also include a charged particle beam device such as a FIB-SEM device or a TEM device in addition to the optical sample transfer device 300.

[0143] Although the present inventors have described the invention in detail based on its embodiments, the present invention is not limited to the above embodiments and can be modified in various ways without departing from its essence. [Industrial applicability]

[0144] This invention can be widely used in transport methods, transport devices, and analysis systems. [Explanation of symbols]

[0145] 1 Control Unit 2 Storage section 3.13 Mounting section 4, 14 recesses 5 Main unit 15 Posts 16 Suction nozzles 17 holes AM1, AM2 alignment marks C1, C2, C3 Cameras CD1, CD2 QR code CP Cylinder Pin CS, CS1 spring HC Cylinder HT Table LCC, LLCC mounting table MH, MH1 Mesh Holder MP Conveyor Unit MS, MS1, MS2, MS3 Mesh PL Pillar SH1 area SH2 area SH3 area SH4 area ST Stage 100 Conveying device Analysis Systems 201, 301, 401 200 FIB-SEM equipment 300 Optical sample transfer device 400 TEM equipment

Claims

1. A transport method for transporting a mesh on which a sample to be analyzed using a charged particle beam apparatus is mounted, (a) A step of picking up and holding the mesh placed on the first mounting platform using the first conveying unit, (b) After step (a), a step of imaging the mesh held in the first transport unit using the first imaging unit, (c) A step of correcting the position or angle of the mesh from the first image obtained in step (b), (d) After step (c), a step of loading the mesh onto the mesh holder by the first transport unit, It has, In step (d) above, the conveying method is to fix the mesh held in the first conveying unit to the mesh holder while in contact with the mounting surface of the mesh holder, which is the surface on which the mesh is mounted.

2. In the conveying method described in claim 1, A conveying method comprising: step (c) above, correcting the position of the mesh by moving the first conveying unit; and step (d) above, correcting the angle of the mesh by axially rotating the first conveying unit about an axis perpendicular to the mounting surface of the mesh holder on which the mesh is mounted.

3. In the conveying method described in claim 1, (a1) The process further includes, prior to step (a), imaging the mesh placed on the first mounting stage using the second imaging unit, In step (a) above, a conveying method is used to pick up the mesh by correcting the position or angle of the first conveying unit relative to the mesh based on the second image acquired in step (a1).

4. In the transport method described in claim 3, A conveying method comprising: step (a) above, correcting the position of the first conveying unit with respect to the mesh by moving the first conveying unit; and step (d) above, correcting the angle of the first conveying unit with respect to the mesh by axially rotating the first conveying unit about an axis perpendicular to the mounting surface of the mesh holder, which is the surface on which the mesh is mounted.

5. In the conveying method described in claim 1, (e) After step (d), the step of loading the sample onto the mesh mounted on the mesh holder and analyzing the sample using the charged particle beam apparatus, (f) After step (e), the first conveying unit picks up and holds the mesh, (g) After step (f), a step of imaging the mesh held in the first transport unit using the first imaging unit, (h) A step of correcting the position of the mesh from the third image obtained in step (g) above. (i) After step (a), a step of imaging the mesh mounting portion on the upper surface of the first mounting table using the second imaging unit, (j) A step of correcting the position of the first transport unit based on the third image and the fourth image acquired in step (i), (k) After step (j) above, the step of placing the mesh on the mesh placement unit by the first transport unit, A transport method further comprising the following.

6. (delete)

7. In the conveying method described in claim 1, (a1) The process further includes, prior to step (a), transporting the mesh placed on the second mounting table to the first mounting table, The above step (a1) is, (a2) A step of picking up and holding the mesh placed on the second mounting platform using the second transport unit, (a3) After step (a2), a step of imaging the mesh held in the second transport unit using the third imaging unit, (a4) A step of imaging the mesh mounting portion on the upper surface of the first mounting platform using the second imaging unit, (a5) A step of correcting the position of the second transport unit based on the fifth image obtained in step (a3) ​​and the sixth image obtained in step (a4), (a6) After step (a5), the step of placing the mesh on the mesh placement section by the second transport section, A transport method further comprising the following.

8. In the conveying method described in claim 1, The mesh comprises a first alignment mark and a second alignment mark. A transport method comprising step (c) above, in which a first alignment mark is detected from the first image, a second alignment mark is detected, the center position of the mesh is calculated from the positions of the first alignment mark and the second alignment mark, and the position or angle of the mesh is corrected from the information of the positions of the first alignment mark, the second alignment mark and the center position.

9. A mounting platform on which a mesh containing a sample to be analyzed using a charged particle beam instrument can be placed, A mesh holder capable of mounting the aforementioned mesh, A first conveying unit that conveys the mesh between the mounting table and the mesh holder, A first imaging unit for imaging the mesh held by the first transport unit, A control unit that corrects the position or angle of the mesh from the first image acquired by the first imaging unit, It has, The mesh holder comprises a main body and a mesh retainer that is movable in a direction perpendicular to the mounting surface of the main body, which is the surface on which the mesh is mounted. The mesh holder is a conveying device that, while the mesh held by the first conveying unit is in contact with the mounting surface, moves the mesh retainer toward the mounting surface to clamp the mesh, thereby fixing the mesh to the mesh holder.

10. In the conveying device according to claim 9, The control unit corrects the position of the mesh by moving the first transport unit, and corrects the angle of the mesh by axially rotating the first transport unit about an axis perpendicular to the mounting surface of the mesh holder on which the mesh is mounted.

11. In the conveying device according to claim 9, The system further includes a second imaging unit that images the mesh placed on the aforementioned mounting platform, The control unit corrects the position or angle at which the first transport unit picks up the mesh placed on the aforementioned stand based on the second image acquired by the second imaging unit, and corrects the position or angle of the mesh based on the first image acquired by the first imaging unit. The first transport unit is a transport device that transports the mesh, whose position or angle has been corrected from the first image, and mounts it on the mesh holder.

12. In the conveying device according to claim 9, The system further includes a second imaging unit for imaging the mesh mounting portion on the upper surface of the mounting table, The control unit corrects the position of the mesh so that the center of the mesh coincides with the center of the mesh mounting unit, based on the third image acquired by the second imaging unit and the first image acquired by the first imaging unit by imaging the mesh picked up by the first transport unit from the mesh holder. The first transport unit is a transport device that transports the mesh, whose position has been corrected from the third image and the first image, and places it on the aforementioned stand.

13. In the conveying device according to claim 9, A second imaging unit for imaging a first identification code provided on the surface of the mesh, A storage unit connected to the control unit, It further possesses, The control unit is a transport device that causes the storage unit to store information of the first identification code obtained from the third image acquired by the second imaging unit.

14. In the conveying device according to claim 13, The system further includes a third imaging unit that images a second identification code provided on the aforementioned mounting platform, The control unit stores the information of the first identification code and the information of the second identification code obtained from the fourth image acquired by the third imaging unit in the storage unit, in association with each other.

15. In the conveying device according to claim 9, The mesh holder comprises a main body and a mesh retainer that is movable in a direction perpendicular to the mounting surface of the main body, which is the surface on which the mesh is mounted. The mesh can be fixed by sandwiching it between the mesh retainer and the mounting surface. A conveying device in which the mesh retainer and the first conveying unit do not interfere with each other.

16. (delete)

17. In the conveying device according to claim 9, The first conveying unit is a conveying device that includes an elastic body that biases the mesh toward the upper surface of the mesh holder when the back surface of the held mesh is pressed against the upper surface of the mesh holder.

18. The conveying device according to claim 9, Charged particle beam apparatus and / or optical sample transfer apparatus, An analysis system equipped with the following features.

Images