Mounting device

Abstract

To provide a mounting tool and a mounting device that can reduce residual air bubbles and substrate damage when mounting electronic components on a substrate.SOLUTION: A mounting tool 31 of the embodiment is the mounting tool 31 that mounts electronic components 2 on a substrate W, and has a holding surface 311 raised so that the electronic components 2 are curved and in contact, a plurality of openings 312 on the holding surface 311, and vent holes 313, which are connected to the openings 312 and hold the electronic components 2 on the holding surface 311 by making the inside pressure negative, and release the electronic components 2 from the holding surface 311 by making the inside pressure positive in turn from a part.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to Mounting device .

Background Art

[0002] When mounting electronic components, which are semiconductor elements such as logic, memory, and image sensors, on a substrate, a wafer on which the semiconductor elements are formed is cut into individual chips. Then, each of these chips is picked up and transferred to the substrate for mounting.

[0003] In the mounting of such electronic components, bubbles may remain between the electronic component and the substrate. If there are bubbles between the electronic component and the substrate, it will lead to poor connection and insufficient strength, resulting in poor mounting. To address this, when mounting an electronic component, in a mounting tool that crimps the substrate, the electronic component is curved and held, and after a part of the electronic component is brought into contact with the substrate, it is pressed with an elastic body to extrude the gas between the electronic component and the substrate for mounting.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, with tools that deform and crush electronic components by pressing them, depending on the size of the electronic component, the area being pressed may not spread uniformly, or sufficient force may not be applied to the outer edges, making it impossible to push out the air bubbles. In addition, excessive pressure may be applied to the center, causing damage to the electronic component.

[0006] The present invention was made to solve the above-mentioned problems, and its objective is to provide a mounting tool and mounting apparatus that can reduce the retention of air bubbles and damage to the substrate when mounting electronic components onto a substrate. [Means for solving the problem]

[0007] This invention Implementation device This is a mounting tool for mounting electronic components onto a substrate, comprising: a raised holding surface that allows the electronic components to be curved and make contact with it; a plurality of openings provided on the holding surface; and ventilation holes communicating with the openings, which hold the electronic components on the holding surface by creating negative pressure inside them, and release the electronic components from the holding surface by gradually creating positive pressure from a portion of them. A mounting tool having a plurality of ventilation holes, which sequentially create negative pressure in adjacent ventilation holes starting from the ventilation hole closest to the most raised ridge of the holding surface; a tool movement mechanism that moves the mounting tool back and forth between a handover position and a mounting position, and raises and lowers it at the handover position and the mounting position; a detection unit that detects contact with the mounting tool; and a switching unit that switches between negative and positive pressure on the ventilation holes of the mounting tool when contact is detected by the detection unit. It holds. [Effects of the Invention]

[0009] According to the mounting tool and mounting apparatus of the present invention, it is possible to reduce the retention of air bubbles and damage to the substrate when mounting electronic components onto a substrate. [Brief explanation of the drawing]

[0010] [Figure 1] This is a front view showing the implementation device of the embodiment. [Figure 2] This is a plan view showing the implementation device of the embodiment. [Figure 3] These are side views (A), cross-sectional views (B), and bottom views (C) showing the implementation tool of the embodiment. [Figure 4] This is a functional block diagram of the control device of the embodiment. [Figure 5] This is a flowchart showing the procedure for mounting the electronic components of the embodiment. [Figure 6]This is an explanatory diagram showing the mounting configuration of electronic components in the embodiment. [Figure 7] This is a cross-sectional view showing a modified version of the implementation tool. [Figure 8] This is an explanatory diagram showing how electronic components are received by the implementation tool. [Modes for carrying out the invention]

[0011] The mounting apparatus of the embodiment will be described with reference to the drawings. Note that the drawings are schematic diagrams, and the size, proportions, etc. of each part include some exaggerations for ease of understanding. As shown in Figures 1 and 2, the mounting apparatus 1 comprises a supply device 10, a pickup device 20, a mounting device 30, and a control device 50. The electronic component 2 is transferred from the pickup device 20 to the mounting device 30, and mounted on the substrate W on the substrate stage 60 by the mounting device 30. The electronic component 2 is, for example, a chip-shaped component. In this embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces.

[0012] The supply device 10 is a device that supplies electronic components 2 to the pickup device 20. The supply device 10 moves the electronic components 2 to be picked up to the supply position P1. The supply position P1 is the position where the pickup device 20 picks up the electronic components 2. The supply device 10 includes a supply stage 12 that supports the sheet 11 to which the electronic components 2 are attached, and a stage moving mechanism 13 that moves the supply stage 12. The stage moving mechanism 13 is, for example, a ball screw mechanism driven by a servo motor.

[0013] The sheet 11 to which the electronic components 2 are attached is, in this case, an adhesive wafer sheet attached to a wafer ring (not shown). The electronic components 2 are arranged in a matrix on the sheet 11. In this embodiment, the electronic components 2 are arranged in a face-up state with their functional surfaces exposed upwards.

[0014] The supply stage 12 is a stage that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the sheet 11 to which the electronic component 2 is attached is supported via the wafer ring. The supply stage 12 is provided by the stage movement mechanism 13 so as to be movable in the horizontal direction. Since the sheet 11 is horizontally supported together with the supply stage 12, the sheet 11 and the electronic component 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

[0015] As shown in FIGS. 1 and 2, in the horizontal direction, the direction in which the supply device 10 and the mounting device 30 are arranged is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. Also, the direction orthogonal to the plane of the sheet 11 is called the Z-axis direction or the vertical direction. The upward direction is the direction on the side where the electronic component 2 is placed with the plane of the sheet 11 as a boundary, and the downward direction is the direction on the side where the electronic component 2 is not placed with the plane of the sheet 11 as a boundary.

[0016] [Pick-up device] The pick-up device 20 is a relay device that picks up the electronic component 2 from the supply device 10 and delivers the picked-up electronic component 2 to the mounting device 30. This pick-up device 20 includes a pick-up nozzle 21, a nozzle movement mechanism 22, a direction conversion unit 23, and a push-up pin 24.

[0017] The pick-up nozzle 21 is a cylindrical suction nozzle that holds the electronic component 2 and releases the electronic component 2 by releasing the holding state. The pick-up nozzle 21 has a nozzle hole that opens on the suction surface at its tip. The nozzle hole communicates with a negative pressure generation circuit (not shown) such as a vacuum pump, and the electronic component 2 is suction-held by the nozzle hole by the circuit generating a negative pressure. Also, the electronic component 2 is released from the pick-up nozzle 21 by releasing the negative pressure.

[0018] The nozzle movement mechanism 22 is a mechanism that reciprocates the pickup nozzle 21 between the supply position P1 and the delivery position P2, and also raises and lowers it at the supply position P1 and the delivery position P2. Specifically, the nozzle movement mechanism 22 includes a slide mechanism 221 and a lifting mechanism 222. Here, the delivery position P2 is the position where the pickup device 20 delivers the electronic component 2 picked up at the supply position P1 to the mounting tool 31 that functions as a receiving part described later.

[0019] The supply position P1 and the delivery position P2 mainly refer to positions in the XY direction and do not necessarily refer to positions in the Z-axis direction. Also, even when referring to positions (heights) in the Z-axis direction, it is assumed that there is a predetermined width for such heights. The predetermined width includes the thickness of the electronic component 2, the distance to push up the electronic component 2, the distance at which the electronic component 2 can be adsorbed, etc. during the delivery of the electronic component 2. <00001​​​​​​​​

[0022] The push-up pin 24 is located below the seat 11 of the supply device 10. The push-up pin 24 is a needle-shaped member with a pointed tip. The push-up pin 24 is located inside the backup body 241 so that its length is parallel to the Z-axis direction.

[0023] The backup body 241 has a drive mechanism that moves the push-up pin 24 forward or backward from its interior. This forward or backward movement is performed in the vertical direction. This drive mechanism is driven, for example, by an air cylinder or a cam mechanism.

[0024] [Onboard equipment] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to the mounting position P3 and mounts it onto the substrate W. The mounting position P3 is the position on the substrate W where the electronic component 2 is mounted. The mounting device 30 has a mounting tool 31 and a tool moving mechanism 32.

[0025] The mounting tool 31 functions as a receiving unit that receives the electronic component 2 from the pickup nozzle 21 at the transfer position P2, and is a component that mounts the electronic component 2 onto the substrate W at the mounting position P3. The mounting tool 31 holds the electronic component 2 and releases the holding state after mounting to release the electronic component 2.

[0026] Specifically, as shown in Figures 3(A) and (B), the mounting tool 31 is a roughly rectangular block with a holding surface 311, an opening 312, and ventilation holes 313. The holding surface 311 is the bottom surface of the mounting tool 31 and is a raised surface that allows the electronic component 2 to contact it in a curved manner. Curvature means bending without creating corners, and includes so-called bending, such as when a curved surface is created between flat surfaces as shown in Figure 3(B). The holding surface 311 in this embodiment is mountain-shaped. A mountain shape here refers to a shape in which two flat surfaces with different angles are gently connected at the ridge portion containing the highest point in the center. In other words, the planar shape of the holding surface 311 is rectangular, with the center of both sides in the long-side direction being the ridge portion, and the ridge line connecting the ridge portions on both sides being in the short-side direction. It is preferable that the mounting tool 31 be made of a hard material so that the holding surface 311 does not elastically deform under the pressure when the electronic component 2 is mounted. The retaining surface 311 may have a rectangular or square shape depending on the electronic component 2 to be mounted. As mentioned above, Figure 3 and other drawings are schematic diagrams, and the degree of the retaining surface 311's protrusion and its proportions to other parts are exaggerated for ease of understanding.

[0027] As shown in Figure 3(C), multiple openings 312 are provided on the holding surface 311. The multiple openings 312 are arranged in multiple rows. The direction of each row is, in this case, parallel to the shorter side when the holding surface 311 is rectangular. However, it is not limited to this direction. In this embodiment, two rows of openings 312, row [2] and row [3], are provided on both short sides of the holding surface 311, flanking row [1], which is a single row provided on the ridge portion.

[0028] Each vent hole 313 has one end communicating with the opening 312. By creating negative pressure within the hole, it holds the electronic component 2 to the holding surface 311, and by creating positive pressure, it releases the electronic component 2. The other end of each vent hole 313 communicates with an air pressure circuit (not shown) that switches between negative and positive pressure. In this embodiment, each row of vent holes 313 is connected to piping and a valve so that negative and positive pressure can be switched for each row. Such a valve functions as a switching unit that switches between negative and positive pressure for the vent holes 313.

[0029] The tool movement mechanism 32 moves the mounting tool 31 back and forth between the handover position P2 and the mounting position P3, and raises and lowers it at both the handover position P2 and the mounting position P3. The tool movement mechanism 32 includes a sliding mechanism 321 and a lifting mechanism 322.

[0030] The slide mechanism 321 moves the mounting tool 31 back and forth between the handover position P2 and the mounting position P3. Here, the slide mechanism 321 has two rails 321b that extend parallel to the X-axis direction and are fixed to the support frame 321a, and a slider 321c that runs on the rails 321b. Although not shown in the figures, the slide mechanism 321 also has a slide mechanism that slides the mounting tool 31 in the Y-axis direction. This slide mechanism can also be constructed with rails in the Y-axis direction and a slider that runs on the rails.

[0031] The lifting mechanism 322 moves the mounting tool 31 vertically by driving an arm to which the mounting tool 31 is detachably attached. Specifically, the lifting mechanism 322 can use a ball screw mechanism driven by a servo motor. That is, the mounting tool 31 moves up and down along the Z-axis direction by the drive of the servo motor. Furthermore, the lifting mechanism 322 is provided with a detection unit 322a that detects contact with the mounting tool 31. A load sensor such as a strain gauge or a piezoelectric element can be used as the detection unit 322a.

[0032] The substrate stage 60 is a stand that supports the substrate W for mounting electronic components 2. The substrate stage 60 is provided on the stage moving mechanism 61. The stage moving mechanism 61 is a moving mechanism that slides the substrate stage 60 on the XY plane to align it with the mounting position P3 of the electronic components 2 on the substrate W. The stage moving mechanism 61 is, for example, a ball screw mechanism driven by a servo motor.

[0033] The control device 50 controls the start, stop, speed, and operating timing of the supply device 10, pickup device 20, mounting device 30, and substrate stage 60. In other words, the control device 50 is the control device for the mounting device 1. The control device 50 can be implemented, for example, by a dedicated electronic circuit or a computer operating with a predetermined program. The control device 50 is connected to an input device for the operator to input instructions and information necessary for control, and an output device for checking the status of the device. The input device can be a switch, touch panel, keyboard, mouse, etc. The output device can be a display unit such as a liquid crystal or organic EL.

[0034] Figure 4 is a functional block diagram of the control device 50. The control device 50 includes a supply device control unit 51, a push-up pin control unit 52, a pickup nozzle control unit 53, a mounting tool control unit 54, a substrate stage control unit 56, and a storage unit 57.

[0035] The supply device control unit 51 controls the movement of the supply stage 12. That is, it controls the movement of the electronic components 2 to be picked up, which are placed on the sheet 11. The push-up pin control unit 52 controls the movement of the push-up pins 24.

[0036] The pickup nozzle control unit 53 controls the movement of the pickup nozzle 21, that is, the operation of the nozzle movement mechanism 22 and the direction changing unit 23. The pickup nozzle control unit 53 also controls the negative pressure generation circuit that communicates with the nozzle hole 21b, and controls the holding and release of the electronic component 2.

[0037] The mounting tool control unit 54 controls the movement of the mounting tool 31, i.e., the operation of the tool movement mechanism 32. The mounting tool control unit 54 also controls the pneumatic circuit that communicates with the ventilation holes 313 of the mounting tool 31, and switches between negative and positive pressure in the openings 312 of each row to control the holding and release of the electronic components 2. The mounting tool control unit 54 also controls the switching between negative and positive pressure in the ventilation holes 313 in response to contact detection by the detection unit 322a. The substrate stage control unit 56 controls the movement of the substrate stage 60, i.e., the operation of the stage movement mechanism 61.

[0038] The storage unit 57 is a recording medium such as an HDD or SSD. The storage unit 57 pre-stores data and programs necessary for the operation of the mounting device 1, and also stores data necessary for the operation of the mounting device 1. This necessary data includes, for example, the position coordinates of the supply position P1, the handover position P2, the mounting position P3, and the position coordinates of each moving mechanism. The aforementioned moving mechanisms perform movement control of each component based on these coordinates. The storage unit 57 also stores the timing for switching which row of the ventilation holes 313 of the mounting tool 31 from negative pressure to positive pressure.

[0039] [Operation] The operation of the mounting device 1 described above will now be explained. First, the pickup device 20 picks up the electronic component 2 from the supply device 10 and transfers the electronic component 2 to the mounting device 30. In other words, the pickup device 20 moves the pickup nozzle 21 to the supply position P1 where the push-up pin 24 is located, and aligns the nozzle hole 21b of the pickup nozzle 21 with the push-up pin 24.

[0040] Meanwhile, the supply device 10 moves the supply stage 12 to position the electronic component 2 to be picked up at the supply position P1. After this, the pickup nozzle 21 is lowered so that its suction surface contacts the electronic component 2 at the supply position P1 and picks up the electronic component 2. Next, while holding the electronic component 2, the pickup nozzle 21 is raised and the electronic component 2 is pushed up by the push-up pin 24, thereby picking up the electronic component 2 while peeling it off the sheet 11.

[0041] The pickup device 20 reverses the pickup nozzle 21 using the direction changing unit 23. That is, it rotates the orientation of the pickup nozzle 21 by 180° in the vertical direction so that the suction surface of the pickup nozzle 21 faces upward. Note that the reversal operation may be performed at any point between the supply position P1 and the handover position P2.

[0042] The pickup device 20 moves the picked-up electronic component 2 to the transfer position P2 by the nozzle moving mechanism 22. The mounting tool 31 of the mounting device 30 moves to the transfer position P2 by the tool moving mechanism 32 and waits, so that the nozzle hole 21b of the pickup nozzle 21 and the holding surface 311 of the mounting tool 31 face each other via the electronic component 2.

[0043] Then, the mounting tool 31 is lowered toward the pickup nozzle 21 located at the transfer position P2, and negative pressure is applied to the ventilation holes 313 of the mounting tool 31 to hold the electronic component 2. After the pickup nozzle 21 releases the negative pressure, the electronic component 2 is transferred from the pickup nozzle 21 to the mounting tool 31. As a result, the electronic component 2 is held by suction, curving to conform to the ridges of the holding surface 311.

[0044] Next, the mounting tool 31 moves to the mounting position P3 and mounts the electronic component 2 onto the substrate W. This mounting operation will be explained with reference to the flowchart in Figure 5 and the operation diagram in Figure 6. First, the mounting tool 31 moves to the mounting position P3, and as shown in Figure 6(A), the electronic component 2 held by the mounting tool 31 faces the substrate W (step S01). Then, the mounting tool 31 descends, bringing the electronic component 2 closer to the substrate W (step S02).

[0045] When the detection unit 322a of the mounting tool 31 detects contact between the electronic component 2 and the substrate W (YES in step S03), the mounting tool 31 stops descending (step S04). Then, by sequentially stopping the negative pressure and switching to positive pressure from a portion of the ventilation hole 313, the electronic component 2 is detached and mounted onto the substrate W. In other words, the pressure is switched to positive pressure in the order of row [1], row [2], row [3] shown in Figure 3, and blowing is performed from the opening 312 (steps S05 to S07).

[0046] At this time, as shown in Figures 6(B), (C), and (D), the portion of the electronic component 2 corresponding to the most raised peak of the holding surface 311 among the multiple rows of ventilation holes 313 first makes contact with the substrate W, and the pressure switches sequentially from negative pressure (white arrows in the figure) to positive pressure (black arrows in the figure) from this peak to the adjacent rows. As a result, the curved electronic component 2 gradually detaches from the peak outward, conforming to the flat surface of the substrate W, and is mounted on the substrate W while air bubbles are expelled to the outside. After mounting, as shown in Figure 6(E), the mounting tool 31 rises and retracts from the substrate W, leaving the electronic component 2 behind (step S08).

[0047] [effect] (1) This embodiment is a mounting tool 31 for mounting an electronic component 2 onto a substrate W, comprising: a raised holding surface 311 such that the electronic component 2 is curved and makes contact with it; a plurality of openings 312 provided on the holding surface 311; and ventilation holes 313 communicating with the openings 312, which hold the electronic component 2 on the holding surface 311 by negative pressure and release the electronic component 2 from the holding surface 311 as the pressure gradually becomes positive from a part of it.

[0048] Furthermore, the mounting device 1 of this embodiment includes a mounting tool 31, a tool moving mechanism 32 that moves the mounting tool 31 back and forth between a handover position and a mounting position and raises and lowers it at the handover position and the mounting position, a detection unit 322a that detects contact pressure with respect to the mounting tool 31, and a switching unit that switches between negative pressure and positive pressure with respect to the ventilation holes 313 of the mounting tool 31 when contact is detected by the detection unit 322a.

[0049] Therefore, as the electronic component 2 is held in a curved position on the holding surface 311 by negative pressure, and the vent holes are sequentially subjected to positive pressure, the electronic component 2 becomes flat as it conforms to the substrate W, and air bubbles are expelled during the mounting process. This suppresses the retention of air bubbles between the electronic component 2 and the substrate W, reducing mounting defects. Since mounting is performed by utilizing the restoration of the curvature of the electronic component 2 itself, the pressing force acts uniformly without bias, allowing air bubbles to be pushed out uniformly, and damage to the electronic component 2 is also reduced.

[0050] (2) Multiple openings 312 are formed in multiple rows. Therefore, by sequentially switching from negative pressure to positive pressure for each row, it is possible to mount the electronic component 2 while preventing excessive force from being applied to some of the components, and returning the curve to a flat state.

[0051] (3) Of the multiple ventilation holes 313, the ventilation holes 313 closest to the most raised peak of the holding surface 311 are sequentially subjected to positive pressure. This allows the electronic component 2 to gradually come into contact with the substrate W from the initial contact point towards the outer edge, thereby expelling air bubbles. Furthermore, by making each row parallel to the short side direction, a curvature can be created in the long side direction, which is prone to deformation of the rectangular electronic component 2.

[0052] (3) The retaining surface 311 is V-shaped. As a result, the substrate W gradually becomes flatter towards the outer edges on both sides of the central peak, so the distance over which the electronic component 2 makes contact with the substrate W while the curvature returns to flat from the center is shortened, thus reducing the risk of trapping air bubbles. Furthermore, by forming a V-shape on the long side of the retaining surface 311 and making the ridge connecting the peaks in the direction of the short side, a curve is created in the direction of the long side of the electronic component 2, making it easier for the electronic component 2 to conform to the retaining surface 311. The ridge connecting the peaks can also be provided on any side of the retaining surface 311. For example, if the ridge is provided on the short side of one end, by sequentially applying positive pressure from one end to the other end, the electronic component 2 will make contact with the substrate W from one end to the other end. Even in this case, the effect of reducing damage to the electronic component 2 while eliminating air bubbles can be obtained. The risk of damage is further reduced because no curvature is created in the electronic component 2. For example, if a row of openings 312 is provided as shown in Figure 3(C), the pressure is switched from negative to positive in the following order: row [3] on one end, row [2], row [1], row [2] on the other end, and row [3].

[0053] [Differentiation] This embodiment can also be modified as follows: (1) The holding surface 311 may be a curved surface. For example, as shown in Figure 7, the holding surface 311 may have a raised shape, such as a part of the side surface of a cylinder. Note that the part of the side surface of a cylinder referred to here also includes cases where the cross-section is circular, elliptical, rounded rectangular, or track-shaped. This makes the curvature of the electronic component 2 gentler and reduces the impact on the electronic component 2. In the above embodiment, openings 312 are provided on the ridges connecting the peaks. However, the openings 312 do not necessarily have to be on the ridges and may be provided in the vicinity. The same effect as above can be obtained by sequentially changing the pressure from negative to positive among the ventilation holes 313 of each opening 312, starting from those closest to the ridges. Furthermore, even in the case of such a curved surface, the ridges can be provided on any side of the holding surface 311.

[0054] (2) When the mounting tool 31 receives the electronic component 2 from the pickup nozzle 21, the mounting tool 31 may sequentially apply negative pressure to adjacent vents 313 from some of the vents 313 of the holding surface 311. In other words, when the mounting tool 31 receives the electronic component 2, even if it tries to curve the electronic component 2 to conform to the holding surface 311, if a part of it floats or is off-center, problems such as the inability to recognize the position of the electronic component 2 may occur. Also, if mounting is attempted with the electronic component 2 still floating or off-center, a timing discrepancy may occur when it separates from the ridge along the outer edge, potentially trapping air bubbles.

[0055] For example, among the multiple ventilation holes 313, it is preferable to sequentially create negative pressure in adjacent ventilation holes 313, starting from the ventilation hole 313 closest to the most raised ridge of the holding surface 311. More specifically, as shown in Figure 8(A), when the holding surface 311 of the mounting tool 31 approaches the electronic component 2 and the detection unit 322a detects contact, negative pressure is sequentially created in the row [1], row [2], and row [3] (see Figure 3(B)) of the opening 312, as shown in Figures 8(B) to (D). This allows the mounting tool 31 to receive the electronic component 2 from the pickup nozzle 21 while gradually curving the electronic component 2 to conform to the holding surface 311, thereby suppressing floating and misalignment and preventing loss of position recognition. Furthermore, since floating and misalignment are reduced, it is less likely that there will be a timing discrepancy in the release of the electronic component 2 when mounting it, and the possibility of trapping air bubbles can be reduced.

[0056] [Other embodiments] The present invention is not limited to the embodiments described above, but also includes other embodiments shown below. Furthermore, the present invention also includes forms that combine all or any of the embodiments described above and the other embodiments shown below. Moreover, these embodiments can be modified in various ways without departing from the scope of the invention, and such variations are also included in the present invention. [Explanation of Symbols]

[0057] 1. Mounting device 2 Electronic components 10 Feeding device 11 sheets 12 Supply Stages 13 Stage Movement Mechanism 20 Pickup device 21 Pickup Nozzle 21b Nozzle hole 22 Nozzle movement mechanism 23 Direction change section 24 Push-up pin 30 Onboard equipment 31 Implementation Tools 32 Tool Movement Mechanism 50 Control device 51 Supply device control unit 52 Push-up pin control unit 53 Pickup nozzle control unit 54 Implementation Tool Control Unit 56 Substrate Stage Control Unit 57 Memory section 60 PCB stage 61 Stage Movement Mechanism 221 Slide mechanism 221a Support frame 221b Rail 221c Slider 222 Lifting mechanism 241 backup bodies 311 Holding surface 312 Aperture 313 Ventilation holes 321 Slide mechanism 321a Support frame 321b Rail 321c Slider 322 Lifting mechanism 322a Detection unit

Claims

1. It is a mounting tool for mounting electronic components onto a circuit board. The aforementioned electronic component has a raised holding surface that is curved and makes contact with it, Multiple openings provided on the retaining surface, A ventilation hole that communicates with the opening and holds the electronic component on the holding surface by creating a negative internal pressure, and releases the electronic component from the holding surface by gradually creating a positive pressure from a part of it, It has, A mounting tool that sequentially creates negative pressure in adjacent vents, starting from the vent closest to the most raised peak of the holding surface, among the multiple vents mentioned above. The aforementioned implementation tool is moved back and forth between the handover position and the implementation position, and raised and lowered at both the handover position and the implementation position by a tool movement mechanism, A detection unit that detects contact with the aforementioned implementation tool, When the detection unit detects contact, a switching unit switches between negative and positive pressure on the ventilation holes of the mounting tool, An implementation device characterized by having the following features.

2. The mounting apparatus according to claim 1, characterized in that the plurality of openings of the mounting tool are formed in a plurality of rows.

3. The mounting apparatus according to claim 1 or 2, characterized in that the holding surface of the mounting tool is V-shaped.

4. The mounting apparatus according to claim 1 or 2, characterized in that the holding surface of the mounting tool is a curved surface.

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