Electronic components

Abstract

To provide an electronic component capable of flexibly adjusting to a size change etc. of an internal ceramic element and ensuring suitable insulation properties.SOLUTION: An electronic component has: a case including an accommodation part having an opening; a ceramic element disposed in the accommodation part, having a first main surface and a second main surface facing each other, and having a first electrode part formed on the first main surface and a second electrode part formed on the second main surface; a first metal terminal having a first electrode connecting part connecting to the first electrode part, a first mounting part exposed from the accommodation part through the opening, and a first terminal arm part connecting the first electrode connecting part with the first mounting part; a second metal terminal having a second electrode connecting part connecting to the second electrode part, a second mounting part exposed from the accommodation part through the opening, and a second terminal arm part connecting the second electrode connecting part with the second mounting part; and an insulation member disposed between the first electrode part and the second terminal arm part.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to an electronic component used as a capacitor or the like.

Background Art

[0002] Conventionally, capacitors and the like configured by connecting metal terminals to a single-plate dielectric disk have been proposed. Also, electronic components in a form suitable for surface mounting, in which the periphery of such a dielectric disk is molded with an exterior material, have been proposed.

[0003] However, in conventional surface-mount electronic components, after fixing a dielectric disk and metal terminals in a cavity for resin molding, a process of molding with an exterior material is required, so there is a problem that the assembly process is complicated. Also, since it is necessary to change the molding die as the size of the dielectric disk changes, there is a problem that it is difficult to flexibly respond to changes in the size of the dielectric disk or the like.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the present disclosure, an electronic component that can flexibly respond to changes in the size of an internal ceramic element and can ensure suitable insulation characteristics is provided.

Means for Solving the Problems

[0006] An electronic component as one form for solving the above problems is a case having a housing portion with an opening, and A ceramic element disposed in the housing portion, having a first main surface and a second main surface facing each other, and having a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface, A first metal terminal having a first electrode connection portion connected to the first electrode portion, a first mounting portion exposed from the housing portion through the opening, and a first terminal arm portion connecting the first electrode connection portion and the first mounting portion, A second metal terminal having a second electrode connection portion connected to the second electrode portion, a second mounting portion exposed from the housing portion through the opening, and a second terminal arm portion connecting the second electrode connection portion and the second mounting portion, The housing portion includes an insulating member disposed between the first electrode portion and the second terminal arm portion.

[0007] Such electronic components house ceramic elements within a case with an opening, eliminating the need for a process of placing ceramic elements in a cavity for resin molding and then molding with an outer material. This allows for flexible adaptation to size changes and other modifications, while also providing good productivity. On the other hand, because the first and second mounting sections are exposed from the housing through the opening, a problem may arise where the distance between the first electrode section and the second terminal arm section becomes short. However, since an insulating material is placed in this section, such electronic components can ensure suitable insulation characteristics.

[0008] Furthermore, for example, the insulating member may block a virtual line that connects the first electrode portion and the second terminal arm portion along the extension surface of the first main surface at the shortest distance.

[0009] By blocking such imaginary lines with an insulating material, the insulation distance is increased, and more favorable insulation characteristics can be ensured. However, in the case of electronic components, there may be cases where the insulating material does not pass through the imaginary lines, such as when molded resin is filled into the housing.

[0010] Furthermore, for example, the first main surface may face the opening side, and the second main surface may face the opposite side of the opening.

[0011] Such electronic components offer advantages, for example, in terms of reducing their profile, because the length of the housing in the depth direction can be shortened.

[0012] Furthermore, for example, an electronic component may have a case cover that closes at least a portion of the opening.

[0013] With such electronic components, the case cover can adequately shield the housing, allowing for a larger opening area in the case and thus easier assembly.

[0014] Furthermore, for example, at least a portion of the insulating member may be connected to the case cover.

[0015] In such electronic components, the case cover seals the opening, ensuring that the insulating material is positioned correctly. This improves the accuracy of the insulating material's placement and facilitates the placement of each component in the housing during assembly.

[0016] Furthermore, for example, the second electrode connection portion may face the bottom surface of the housing portion, and the second terminal arm portion may have a rising portion extending from the bottom surface toward the opening.

[0017] The presence of a raised portion in the second terminal arm allows for a simple case shape that ensures sufficient depth in the housing while allowing both the first and second metal terminals to exit the housing through the same opening. Therefore, such electronic components offer superior productivity and greater flexibility in accommodating design changes to ceramic elements.

[0018] Furthermore, for example, the first main surface and the second main surface may be oriented in a direction substantially perpendicular to the opening.

[0019] Such electronic components have an advantage in terms of reducing mounting area, for example, because the width of the aperture can be shortened.

[0020] Further, in the housing portion, the insulating member may have a first portion disposed between the first electrode portion and the second terminal arm portion, and a second portion disposed between the second electrode portion and the first terminal arm portion in the housing portion.

[0021] In such an electronic component, even when the first main surface and the second main surface are oriented in a direction substantially perpendicular to the opening, the insulation between the electrode portion and the terminal arm portion can be suitably ensured.

[0022] Also, for example, at least a part of the insulating member may be connected to the case.

[0023] By connecting the insulating member to the case, the positional accuracy of the insulating member within the housing portion can be improved.

[0024] Also, for example, at least a part of the insulating member may be separate from the case.

[0025] Since the insulating member is separate from the case, for example, after arranging a ceramic element or a metal terminal in the housing portion, the insulating member can be arranged at a predetermined position in the housing portion. Therefore, such an electronic component has excellent assembly properties.

[0026] Also, for example, at least a part of the insulating member may be disposed in the opening.

[0027] In such an electronic component, since the insulating member can also serve as a lid that closes at least a part of the opening, for example, in the case where a molding resin or the like is arranged in the housing portion, the problem of the molding resin or the like flowing out from the housing portion to the outside can be prevented.

[0028] Also, for example, it may have a molding resin disposed in the housing portion.

[0029] In such an electronic component, the molding resin can protect ceramic elements or the like disposed in the housing portion, and the insulation can also be suitably enhanced. [Brief explanation of the drawing]

[0030] [Figure 1] Figure 1 is a schematic perspective view of an electronic component according to the first embodiment, taken from an oblique angle above. [Figure 2] Figure 2 is a schematic perspective view showing the electronic component shown in Figure 1 before the case cover is attached. [Figure 3] Figure 3 is a schematic perspective view of the case cover of the electronic component shown in Figure 1, taken from a diagonal downward angle. [Figure 4] Figure 4 is a cross-sectional view of the electronic component shown in Figure 1. [Figure 5] Figure 5 is a partial perspective view showing the internal state of the case of the electronic component shown in Figure 1. [Figure 6] Figure 6 is a schematic perspective view of the electronic component according to the second embodiment, taken from an oblique angle above. [Figure 7] Figure 7 is a schematic perspective view of the electronic component shown in Figure 6, taken from a diagonal downward angle. [Figure 8] Figure 8 is a bottom view of the electronic component shown in Figure 6. [Figure 9] Figure 9 is a partial perspective view showing the internal state of the case of the electronic component shown in Figure 6. [Figure 10] Figure 10 is a schematic perspective view of the electronic component according to the third embodiment, taken from a diagonal downward angle. [Figure 11] Figure 11 is a schematic perspective view showing the insulating material included in the electronic component shown in Figure 10. [Figure 12] Figure 12 is a partial perspective view showing the internal state of the case of the electronic component shown in Figure 10. [Figure 13] Figure 13 is a schematic perspective view showing the electronic component according to the fourth embodiment before the case cover is attached. [Figure 14] Figure 14 is a schematic perspective view showing the insulating material included in the electronic component shown in Figure 13. [Figure 15] Figure 15 is a schematic perspective view showing the electronic component according to the fifth embodiment before the case cover is attached. [Figure 16] Figure 16 is a schematic perspective view showing the insulating material included in the electronic component shown in Figure 15. [Figure 17] Figure 17 is a plan view from below of a case cover and other components included in an electronic component according to a modified example. [Modes for carrying out the invention]

[0031] Each embodiment will be described below with reference to the drawings.

[0032] First Embodiment Figure 1 is a schematic perspective view of the electronic component 10 according to the first embodiment, taken from diagonally above. As shown in Figure 1, the electronic component 10 has a case 20 having a housing section 21 (see Figure 2) inside, and a case cover 60 that closes the opening 21a (see Figure 2) of the housing section 21. Also, as shown in Figure 2, which represents the electronic component 10 before the case cover 60 is attached, the electronic component 10 has a ceramic element 30 housed in the housing section 21 inside the case 20, a first metal terminal 40 connected to a first electrode section 33 of the ceramic element 30, and a second metal terminal 50 connected to a second electrode section 34 of the ceramic element 30.

[0033] As shown in Figure 1, the electronic component 10 has a roughly rectangular flat plate shape, but the electronic component 10 is not limited to this, and may have other polygonal flat plate shapes other than rectangles, or it may be disc-shaped. As shown in the cross-sectional view in Figure 4, the side of the electronic component 10 opposite to the side on which the case cover 60 is placed becomes the mounting surface side that faces the substrate or other surface on which the electronic component 10 is mounted.

[0034] As shown in Figure 2, in the explanation of the electronic component 10, the direction normal to the bottom surface 21c of the housing 21 is defined as the Z-axis direction, the direction perpendicular to the Z-axis direction and connecting the first mounting section 42 and the second mounting section 52 by the shortest distance is defined as the Y-axis direction, and the direction perpendicular to the Z-axis direction and the Y-axis direction is defined as the X-axis direction.

[0035] As shown in Figure 2, the case 20 has a concave housing portion 21, which houses a ceramic element 30 and the like. The housing portion 21 has a rectangular shape that is slightly smaller than the outer shape of the case 20 when viewed from the opening 21a side of the housing portion 21. The housing portion 21 includes a roughly rectangular parallelepiped space formed inside the case 20. The opening 21a of the housing portion 21 is formed in the case 20 so as to open in a direction that faces upward (opposite side from the mounting surface) of the electronic component 10.

[0036] In case 20, two stepped portions are formed around the periphery of the opening 21a, which are lower in height than the rest of the case. These stepped portions extend the opening 21a to a portion of the side surface of case 20. As shown in Figure 4, the stepped portions of case 20 form a first gap 27 and a second gap 28 through which the first metal terminal 40 or the second metal terminal 50 is inserted when the case cover 60 is attached to case 20.

[0037] Figure 3 is a schematic perspective view of the case cover 60 from below (towards the housing section 21). As shown in Figure 3, the case cover 60 is positioned on the opening 21a side, which is opposite to the mounting surface side of the case 20, and covers at least a portion of the opening 21a of the housing section 21, as shown in Figure 4. The case cover 60 has a cover body portion 63 on a rectangular plate. As can be seen from Figures 1 and 3, the cover body portion 63 has a rectangular shape that is substantially the same as the case 20 when viewed from above (towards the positive Z-axis).

[0038] The cover body portion 63 has projections 64 that protrude downward from the surface of the cover body portion 63 facing the housing portion 21. The projections 64 are formed to correspond to the multiple (two in the example shown in Figure 3) corners 21b of the housing portion 20. The projections 64 function as guides for alignment when assembling the case cover 60 onto the case 20.

[0039] As shown in Figure 3, an insulating member 70 is provided on the lower surface 63a of the cover body 63 that faces the housing portion 21. The insulating member 70 protrudes downward from the lower surface 63a of the cover, similar to the projection 64. The positional relationship between the insulating member 70 and other members will be described in detail later.

[0040] Figure 4 is a cross-sectional view of the electronic component 10. As shown in Figure 4, the case 20 has a case bottom surface 22 facing in the opposite direction to the opening 21a of the housing 21. The case bottom surface 22 is substantially parallel to the bottom surfaces of the first mounting portion 42 of the first metal terminal 40 and the second mounting portion 52 of the second metal terminal 50, and is positioned at the same height as, or slightly above, the bottom surfaces of the first mounting portion 42 of the first metal terminal 40 and the second mounting portion 52 of the second metal terminal 50. However, the case bottom surface 22 may be positioned at a different height from the bottom surfaces of the first mounting portion 42 and the second mounting portion 52 of the first metal terminal 40, and the positional relationship between the case bottom surface and the bottom surfaces of the first and second mounting portions 42 and 52 in the Z-axis direction is not particularly limited.

[0041] As shown in Figure 2, the ceramic element 30 is placed in the housing section 21 of the case 20. The ceramic element 30 has a first main surface 31a and a second main surface 31b that face each other, and has a substantially disc-shaped outer form. However, the ceramic element 30 may have a shape other than a disc, such as an elliptical disc or a rectangular flat plate. The first main surface 31a and the second main surface 31b are the pair of surfaces (planes) with the largest area in the ceramic element 30. Also, as shown in Figure 4, in the ceramic element 30 relating to the electronic component 10, the first main surface 31a faces the opening 21a side (upwards), and the second main surface 31b faces the opposite side of the opening 21a (downwards, towards the bottom surface 21c). However, in other embodiments where the orientation of the opening 21a of the case 20 is different from that of the electronic component 10 according to the embodiment, the orientation of each main surface may differ from the state shown in the first embodiment.

[0042] As shown in Figure 4, the ceramic element 30 has a first electrode portion 33 formed on the first main surface 31a, a second electrode portion 34 formed on the second main surface 31b, and a dielectric portion 35 sandwiched between the first electrode portion 33 and the second electrode portion 34. The material of the dielectric portion 35 is not particularly limited and is composed of a dielectric material such as calcium titanate, strontium titanate, barium titanate, or a mixture thereof. The ceramic element 30 is not limited to capacitors and the like with a dielectric portion 35 sandwiched between the first electrode portion 33 and the second electrode portion 34. For example, the ceramic element may be a varistor or thermistor with a semiconductor ceramic sandwiched between the first electrode portion and the second electrode portion.

[0043] The material of the first electrode portion 33 and the second electrode portion 34 is not particularly limited, and copper, copper alloys, nickel, and nickel alloys are usually used, but silver and silver-palladium alloys can also be used. The thickness of the first electrode portion 33 and the second electrode portion 34 is not particularly limited, but is usually about 10 to 50 μm. At least one metal coating selected from Ni, Cu, Sn, etc. may be formed on the surfaces of the first and second electrode portions 33 and 34.

[0044] As shown in Figure 4, the housing depth W2, which is the distance from the opening 21a to the bottom surface 21c of the housing section 21 in the case 20, is greater than the element thickness W1, which is the distance from the first main surface 31a to the second main surface 31b of the ceramic element 30. As a result, the electronic component 10 can be housed in the housing section 21 without any part of the ceramic element 30 being exposed from the opening 21a of the housing section 21. Furthermore, such an electronic component 10 allows for a simplification of the case cover 60's shape. In addition, if the housing section 21 is filled with molded resin, the entire ceramic element 30 can be covered with the molded resin.

[0045] As shown in Figure 2, the electronic component 10 has a pair of metal terminals, a first metal terminal 40 and a second metal terminal 50. The first metal terminal 40 and the second metal terminal 50 are spaced apart from each other in the electronic component 10 and are electrically insulated. The first metal terminal 40 and the second metal terminal 50 are formed, for example, by machining a conductive metal plate, but the method of forming the metal terminals 40 and 50 is not particularly limited.

[0046] As shown in Figures 2 and 4, the first metal terminal 40 has a first electrode connection portion 44 connected to the first electrode portion 33, a first mounting portion 42 exposed from the housing portion 21 through an opening 21a (including a first gap 27 which is part of the opening 21a), and a first terminal arm portion 46 connecting the first electrode connection portion 44 and the first mounting portion 42. Of the first metal terminal 40, the first electrode connection portion 44 and the first terminal arm portion 46 (including the portion located in the first gap 27) are located in the housing portion 21 and the opening 21a, while the first mounting portion 42 is exposed from the housing portion 21 and the opening 21a.

[0047] As shown in Figure 4, the first mounting portion 42 has a substantially L-shape. The first mounting portion 42 bends vertically from the first terminal arm portion 46 and extends downward along the outer surface of the case 20, then bends substantially vertically from a position slightly below the lower surface 22 of the case. The tip of the first mounting portion 42 extends in a direction parallel to the lower surface 22 of the case and away from the case 20. However, the shape of the first mounting portion 42 is not limited to the shape shown in Figure 4, and the tip of the first mounting portion 42 may face the lower surface 22 of the case.

[0048] As shown in Figures 2 and 4, in the first metal terminal 40, the portions corresponding to the first electrode connection portion 44 and the first terminal arm portion 46 are substantially rectangular flat plates. Of the flat plate portions corresponding to the first electrode connection portion 44 and the first terminal arm portion 46, the portion facing the first main surface 31a of the ceramic element 30 is the first electrode connection portion 44. The first terminal arm portion 46 is the portion that extends from the first electrode connection portion 44 to the first gap 27 along the extension surface of the first main surface 31a.

[0049] Figure 5 is a partial perspective view showing the internal state of the case 20 of the electronic component 10, and is a view of the electronic component 10 from below by looking through the case 20. As shown in Figure 5, the second metal terminal 50 has a second electrode connection portion 54 that connects to the second electrode portion 34, a second mounting portion 52 that is exposed from the housing portion 21 through the opening 21a (a second gap 28 (see Figure 2), which is part of the opening 21a), and a second terminal arm portion 56 that connects the second electrode connection portion 54 and the second mounting portion 52. Of the second metal terminal 50, the second electrode connection portion 54 and the second terminal arm portion 56 (including the portion that is placed in the second gap 28) are located in the housing portion 21 and the opening 21a, while the second mounting portion 52 is exposed from the housing portion 21 and the opening 21a.

[0050] As shown in Figure 4, the second mounting portion 52 has a roughly L-shape and is arranged roughly symmetrically with respect to the first mounting portion 42. The second mounting portion 52 bends vertically from the second terminal arm portion 56 and extends downward along the outer surface of the case 20, then bends roughly vertically from a position slightly below the bottom surface 22 of the case. The tip of the second mounting portion 52 extends in a direction roughly parallel to the bottom surface 22 of the case and away from the case 20 (in the opposite direction to the first mounting portion 42). The shape of the second mounting portion 52 is not limited to the shape shown in Figure 4, just like the first mounting portion 42.

[0051] As shown in Figures 4 and 5, the portion of the second metal terminal 50 corresponding to the second electrode connection portion 54 is flat, but the portion corresponding to the second terminal arm portion 56 includes two bends. The second electrode connection portion 54 faces the second main surface 31b of the ceramic element 30. The second electrode connection portion 54 also faces the bottom surface 21c of the housing portion 21. Therefore, the second electrode connection portion 54 is positioned so as to be sandwiched from above and below by the bottom surface 21c of the housing portion 21 and the second main surface 31b of the ceramic element 30.

[0052] As shown in Figure 4, the second terminal arm 56 of the second metal terminal 50 has the following three parts. The first part 56b of the second terminal arm 56 extends from the second electrode connection part 54 to the inner wall of the case 20 along the extended surface and bottom surface 21c of the second main surface 31b. The second part of the second terminal arm 56 is a rising part 56a that bends approximately perpendicularly from the first part along the extended surface of the second main surface 31b and extends from the bottom surface 21c toward the upper opening 21a. As shown in Figures 4 and 5, the third part 56c of the second terminal arm 56 bends approximately perpendicularly from the rising part 56a and is positioned in the second gap 28. The tip of the third part 56c is connected to the second mounting part 52.

[0053] The material of the first metal terminal 40 and the second metal terminal 50 is not particularly limited as long as it is a conductive metallic material, for example, iron, nickel, copper, silver, or alloys containing these materials can be used. In addition, a metal coating of Ni, Sn, Cu, etc. may be formed on the surface of the first metal terminal 40 and the second metal terminal 50.

[0054] As shown in Figure 1, the case cover 60 is positioned on the opposite side of the case bottom surface 22 of the case 20 and closes the opening 21a (see Figure 2) of the housing section 21. Figure 5 is a perspective view of the case cover 60 from below. As shown in Figures 5 and 2, the case cover 60 has a rectangular flat cover body portion 63 which is substantially the same shape as the case 20 when viewed from above, and a plurality (two in the embodiment) of protrusions 64 that project downward from the corners of the cover bottom surface 63a of the cover body portion 63 that face the opening 21a of the case 20.

[0055] The electronic component 10 can suitably protect components placed in the housing 21, such as the ceramic element 30, by sealing the housing 21 with the case cover 60. The frame-shaped opening edge surrounding the opening 21a shown in Figure 2 connects to the lower surface 63a of the cover body 63 shown in Figure 3, and the case cover 60 closes the opening 21a of the housing 21. However, a first gap 27 through which the first metal terminal 40 is inserted and a second gap 28 through which the second metal terminal 50 is inserted are formed between the case cover 60 and the case 20.

[0056] The multiple protrusions 64 of the case cover 60 shown in Figure 3 are provided corresponding to the multiple corners 21b of the opening 21a shown in Figure 2 (see Figure 2), and as shown in Figure 5, the case cover 60 is inserted into the housing 21 in a state where it closes the opening 21a. The case cover 60 having the protrusions 64 can be easily and accurately aligned with the case 20 and can be firmly fixed to the case 20.

[0057] As shown in Figure 3, an insulating member 70 is provided on the lower surface 63a of the case cover 60. Because the case cover 60 is integrated with the insulating member 70, such electronic components 10 can easily position the insulating member 70 in an appropriate location within the housing 21. However, the insulating member 70 is not limited to being integrated with the case cover 60; for example, it can be composed of a member connected to the case 20 or a member independent of other members.

[0058] As shown in Figure 3, at least a portion of the insulating member 70 of the electronic component 10 (in the example shown in Figure 3, the entire insulating member 70) is connected to the case cover 60. As shown in Figure 4, the insulating member 70 protrudes downward (towards the bottom surface 21c) from the lower surface 63a of the case cover 60 and is positioned within the housing section 21. As shown in Figures 4 and 5, the insulating member 70 is positioned in the housing section 21 between the first electrode portion 33 of the ceramic element 30 and the second terminal arm portion 56 of the second metal terminal 50.

[0059] As shown in Figure 4, it is preferable that the insulating member 70 be positioned in the housing portion of the case 20 so as to intersect with the extended surface 31aa of the first main surface 31a of the ceramic element 30. Furthermore, it is also preferable that the insulating member 70 obstructs the imaginary line VL (which coincides with the extended surface 31aa in Figure 4) that connects the first electrode portion 33 and the second terminal arm portion 56 (especially the rising portion 56a) along the extended surface 31aa of the first main surface 31a by the shortest distance. By arranging it in this way, the insulation between the first electrode portion 33 and the second terminal arm portion 56 which is electrically connected to the second electrode portion 34 can be effectively improved.

[0060] As shown in Figure 5, the second metal terminal 50, which is electrically connected to the second electrode portion 34, is exposed from the housing portion 21 through the opening 21a (including the second gap 28). Therefore, in the electronic component 10, the rising portion 56a or the third portion 56c of the second terminal arm portion 56 is positioned near the first electrode portion 33 facing the opening 21a side in the ceramic element 30. However, in the electronic component 10, by positioning the insulating member 70 between the first electrode portion 33 and the second terminal arm portion 56 (especially the rising portion 56a), the insulation distance between the first electrode portion 33 and the second terminal arm portion 56 can be appropriately secured even within the narrow housing portion 21. Furthermore, by having the rising portion 56a, it becomes unnecessary to form a through hole or the like at the bottom of the case 22 to allow the second metal terminal 50 to exit the case 22, and the electronic component 10 can prevent the problem of resin leaking from the bottom of the case 22, such as when it is resin-molded.

[0061] Furthermore, as shown in Figure 5, it is preferable from the viewpoint of improving insulation performance if the insulating member 70 is connected to the lower surface 63a of the cover, or, as shown in Figure 4, if one side of the insulating member 70 faces the rising portion 56a and the other side faces the side surface of the ceramic element 30 where the first electrode portion 33 is located at the end. However, the shape and arrangement of the insulating member 70 are not limited to those shown in Figures 4 and 5.

[0062] The housing section 21 of the case 20 shown in Figures 2 and 4 may be filled with molded resin to fill the gap between the inner wall of the housing section 21 (including the bottom surface 21c) and the ceramic element 30 and metal terminals 40 and 50. This can improve the strength and insulation of the electronic component 10. However, the housing section 21 does not necessarily have to be filled with resin, and as shown in Figure 2, a gap may be formed between the inner wall of the housing section 21 and the ceramic element 30 and metal terminals 40 and 50.

[0063] The case 20, case cover 60, and insulating member 70 can be manufactured, for example, by injection molding of resin. However, the material of the case 20, case cover 60, and insulating member is not limited to resin. The insulating member 70 can be made of an insulating material such as resin, but it can also be made by covering a conductive material with an insulating material such as resin.

[0064] The electronic component 10 shown in Figures 1 to 5 can be manufactured by, for example, the following process. First, a ceramic element 30 and a first metal terminal 40 and a second metal terminal 50 are prepared, and the first metal terminal 40 and the second metal terminal 50 are connected to the ceramic element 30. The connection between the ceramic element 30 and the first metal terminal 40 and the second metal terminal 50 can be made using solder, conductive adhesive, or the like.

[0065] Next, the intermediate product, which integrates the first metal terminal 40, the second metal terminal 50, and the ceramic element 30, is placed in the housing section 21 of the case 20, and then the opening 21a is closed with the case cover 60. At this time, molding resin is injected into the housing section 21 before closing the opening 21a with the case cover 60, and the molding resin is hardened after the case cover 60 is attached, thereby firmly fixing the case cover 60 and the case 20 via the molding resin. In this way, an electronic component 10 as shown in Figure 1 can be manufactured.

[0066] The step of connecting the first metal terminal 40 and the second metal terminal 50 to the ceramic element 30 may be performed with the mounting portions 42 and 52 of the first metal terminal 40 and the second metal terminal 50 not bent.

[0067] As described above, the electronic component 10 shown in Figures 1 to 5 houses the ceramic element 30 in the housing section 21 within the case 20, eliminating the need for a process of placing the ceramic element 30 and other components in a cavity for resin molding and then molding it with an exterior material, resulting in good productivity.

[0068] Since the electronic component 10 can house the ceramic element 30 and the like within the case 20, it can flexibly accommodate changes in the size of the ceramic element 30 as long as it fits within the case 20. Furthermore, because the first mounting section 42 and the second mounting section 52 are parallel to the first main surface 31a and the second main surface 31b of the ceramic element 30, the electronic component 10 is advantageous in terms of low profile and is suitable for surface mounting.

[0069] Furthermore, by arranging the insulating member 70 in the electronic component 10, suitable insulation can be ensured while maintaining good productivity and compactness. If the electronic component 10 has a molded resin placed in the housing 21, the insulating member 70 can also be arranged to increase the insulation distance between a specific part (for example, the third part 56c) that is not easily covered by the molded resin and the first electrode part 33.

[0070] Second Embodiment Figure 6 is a schematic perspective view of the electronic component 210 according to the second embodiment, taken from diagonally above, and Figure 7 is a schematic perspective view of the electronic component 210 taken from diagonally below. As shown in Figures 6 and 7, the electronic component 210 differs from the electronic component 10 shown in Figure 1 in the shape of the case 220, the first metal terminal 240 and the second metal terminal 250, etc., but the ceramic element 30 etc. are the same as those of the electronic component 10. The electronic component 210 will be explained focusing on the differences from the electronic component 10, and the commonalities with the electronic component 10 will be given the same reference numerals and will not be explained.

[0071] As shown in Figures 6 and 7, the case 220 of the electronic component 210 has an external shape that is roughly hexagonal prism-shaped, with a pair of substantially parallel bottom surfaces and six sides that are substantially perpendicular to the bottom surfaces. As shown in Figure 7, a housing section 221 with an opening 221a is formed inside the case 220. That is, as shown in Figure 6, the upper bottom 223 side of the case 220 is bottomed, but the lower bottom side of the case 220 has an opening 221a.

[0072] Figure 8 is a bottom view of the electronic component 210 shown in Figures 6 and 7. As shown in Figure 8, a ceramic element 30 is arranged in the housing 221. The ceramic element 30 is the same as the ceramic element 30 provided in the electronic component 10 shown in Figure 2. That is, the ceramic element 30 has a first electrode portion 33 formed on the first main surface 31a, a second electrode portion 34 formed on the second main surface 31b, and a dielectric portion 35 sandwiched between the first electrode portion 33 and the second electrode portion 34.

[0073] As shown in Figures 7 and 9, the first main surface 31a and the second main surface 31b of the ceramic element 30 are oriented in a direction substantially perpendicular to the opening 221a of the case 220. The case 220 also has an opening edge 222 that surrounds the opening 221a of the housing 221, and the first mounting portion 242 of the first metal terminal 240 and the second mounting portion 252 of the second metal terminal 250 are arranged on the opening edge 222.

[0074] The electronic component 210 has a first main surface 31a and a second main surface 31b of the ceramic element 30 that are oriented in a direction substantially perpendicular to the opening 221a, and by arranging the mounting parts 242 and 252 on the opening edge 222, the mounting area can be reduced.

[0075] Furthermore, the electronic component 210 has six outer surfaces of the case 220 that are all polygonal prisms that are not parallel to the first main surface 31a and the second main surface 31b, and even with a small mounting area, it has good installation stability. However, the shape of the case 220 is not limited to a hexagonal prism, and may have shapes other than those shown in Figures 6 to 9, such as a quadrangular prism or an octagonal prism.

[0076] Figure 9 is a perspective view of the case 220 of the electronic component 210, showing the internal state of the housing 221 within the electronic component 210. As shown in Figure 9, the distance from the opening 221a of the case 220 to the upper bottom 223 of the housing 221 is greater than the diameter of the ceramic element 30. This allows the electronic component 210 to house the entire ceramic element 30 in the housing 221 without any part of the ceramic element 30 being exposed from the opening 221a of the housing 221. In addition, the housing 221 of the electronic component 210 may be filled with molding resin, in which case the entire ceramic element 30 can be covered with molding resin.

[0077] As shown in Figures 7 and 8, the case 220 does not have a case cover (see Figure 1) that closes the opening 221a. Therefore, as shown in Figure 7, in the electronic component 210, at least a portion of the opening edge 222 in the case 220, that is, the remaining portion of the opening edge 222 excluding the portion where the first mounting portion 242 and the second mounting portion 252 are located, is visible from below. In this way, because the case 20 has a simple shape without a lid or case cover, the electronic component 210 has good productivity.

[0078] As shown in Figure 9, in the description of the electronic component 210, the normal direction of the opening 221a and the opening edge 222 of the housing portion 221 is described as the Z-axis direction, the direction perpendicular to the Z-axis direction and connecting the first mounting portion 242 and the second mounting portion 252 by the shortest distance is described as the Y-axis direction, and the direction perpendicular to the Z-axis direction and the Y-axis direction is described as the X-axis direction.

[0079] As shown in Figures 8 and 9, the electronic component 210 has a pair of metal terminals consisting of a first metal terminal 240 and a second metal terminal 250. The first metal terminal 240 and the second metal terminal 250 are spaced apart from each other in the electronic component 210 and are electrically insulated. The first metal terminal 240 and the second metal terminal 250 can be formed by machining conductive metal sheet material, similar to the metal terminals 40 and 50 shown in Figure 2. However, the method for forming the metal terminals 240 and 250 may be other than machining metal sheet material.

[0080] As shown in Figures 8 and 9, the first metal terminal 240 has a first electrode connection portion 244 connected to the first electrode portion 33, a first mounting portion 242 exposed from the housing portion 221 through the opening 221a, and a first terminal arm portion 246 connecting the first electrode connection portion 244 and the first mounting portion 242. Of the first metal terminal 240, the first electrode connection portion 244 and the first terminal arm portion 246 are located in the housing portion 221 and the opening 221a, while the first mounting portion 242 is exposed from the housing portion 221 and the opening 221a.

[0081] As shown in Figure 9, the first mounting portion 242 has a substantially L-shaped form. That is, the first mounting portion 242 has a first mounting bottom portion 242a positioned on the opening edge portion 222, and a first folded portion 242b that bends substantially vertically upward from the tip of the first mounting bottom portion 242a. The first folded portion 242b extends upward along the outer surface of the case 220.

[0082] As shown in Figures 8 and 9, the portion of the first metal terminal 240 corresponding to the first electrode connection portion 244 is flat, while the portion corresponding to the second terminal arm portion 245 includes one bend. As shown in Figure 8, the first electrode connection portion 244 faces the first main surface 31a of the ceramic element 30.

[0083] The first terminal arm 246 of the first metal terminal 240 has a first portion 246b and a second portion 246a that extend substantially perpendicularly to each other. As shown in Figure 8, the first portion 246b of the first terminal arm 246 extends along the extended plane of the first main surface 31a so as to approach the inner wall (first inner wall 221b) of the housing portion 221 from the first electrode connection portion 244. As shown in Figure 9, the second portion 246a of the first terminal arm 246 bends substantially perpendicularly from the first portion 246b along the extended plane of the first main surface 31a, extends from inside the housing portion 221 toward the lower opening 221a, and its tip connects to the first mounting portion 242.

[0084] As shown in Figures 8 and 9, the second metal terminal 250 has a similar shape to the first metal terminal 240 and is arranged substantially symmetrically with respect to the first metal terminal 240. That is, the second metal terminal 250 has a second electrode connection portion 254 that connects to the second electrode portion 34, a second mounting portion 252 that is exposed from the housing portion 221 through the opening 221a, and a second terminal arm portion 256 that connects the second electrode connection portion 254 and the second mounting portion 252. Of the second metal terminal 250, the second electrode connection portion 254 and the second terminal arm portion 256 are located in the housing portion 221 and the opening 221a, while the second mounting portion 252 is exposed from the housing portion 221 and the opening 221a.

[0085] As shown in Figure 9, the second mounting portion 252 has a substantially L-shape and, similar to the first mounting portion 242, has a second mounting bottom portion 252a positioned on the opening edge portion 222 and a second folded portion 252b positioned on the outer surface of the case 220.

[0086] The second terminal arm 256 of the second metal terminal 250, like the first terminal arm 246 of the first metal terminal 240, has a first portion 256b and a second portion 256a that extend substantially perpendicularly to each other. As shown in Figure 8, the first portion 256b of the second terminal arm 256 extends along the extension plane of the second main surface 31b so as to approach the inner wall (second inner wall 221c) of the housing portion 221 from the second electrode connection portion 254. As shown in Figure 9, the second portion 256a of the second terminal arm 256 bends substantially perpendicularly from the first portion 256b along the extension plane of the second main surface 31b, extends from inside the housing portion 221 toward the lower opening 221a, and its tip connects to the second mounting portion 252.

[0087] As shown in Figures 8 and 9, the electronic component 210 has an insulating member 270 which is connected to the case 220 in at least part (in the second embodiment, all of it). As shown in Figure 9, the insulating member 270 has a first portion 271 which is positioned between the first electrode portion 33 and the second terminal arm portion 256, and a second portion 272 which is positioned between the second electrode portion 34 and the first terminal arm portion 246.

[0088] As shown in Figure 8, the first portion 271 of the insulating member 270 protrudes from the inner wall of the housing portion 221 facing the first main surface 31a toward the interior of the housing portion 221 (particularly the first portion 246b of the first terminal arm portion 246). The second portion 272 of the insulating member 270 protrudes from the inner wall of the housing portion 221 facing the second main surface 31b toward the interior of the housing portion 221 (particularly the first portion 256b of the second terminal arm portion 256).

[0089] In the electronic component 210, where the opening 221a is perpendicular to the first main surface 31a and the second main surface 31b, there may be portions of either the first terminal arm 246 or the second terminal arm 256 that are located near the opposite electrode portion, the second electrode portion 34 or the first electrode portion 33, within the housing portion 221. However, in the electronic component 210, the insulating member 270 has two parts, a first portion 271 and a second portion 272, which improves both the insulation between the first terminal arm 246 and the second electrode portion 34, and the insulation between the second terminal arm 256 and the first electrode portion 33.

[0090] Furthermore, as shown in Figure 8, it is preferable that the first portion 271 of the insulating member 270 is positioned to intersect the extended surface of the first main surface 31a of the ceramic element 30, and that the second portion 272 of the insulating member 270 is positioned to intersect the extended surface of the second main surface 31b of the ceramic element 30. Moreover, as shown in Figure 9, it is also preferable that the second portion 272 of the insulating member 270 blocks the imaginary line VL that connects the second electrode portion 34 and the second portion 246a along the extended surface of the second main surface 31b by the shortest distance. The same applies to the first portion 271 of the insulating member 270 as to the second portion 272.

[0091] Thus, in the electronic component 210, by positioning the insulating member 270 in a predetermined location, the insulating distance between the first electrode portion 33 and the second terminal arm portion 256, and between the second electrode portion 34 and the first terminal arm portion 246 can be appropriately secured even within the narrow housing portion 221. The case 220 and the insulating member 270 can be manufactured, for example, by injection molding of resin, similar to the case 20 and the case cover 60 (see Figure 1). In addition, the electronic component 210 exhibits the same effects as the electronic component 10 in terms of its common features.

[0092] Third Embodiment Figure 10 is a schematic perspective view of the electronic component 310 according to the third embodiment, taken from a diagonal downward angle, and Figure 11 is a perspective view of the insulating member 370 included in the electronic component 310. Figure 12 is a perspective view of the case 320 of the electronic component 310, showing the internal state of the housing section 321 in the electronic component 310.

[0093] As shown in Figures 10 to 12, the electronic component 310 differs from the electronic component 210 shown in Figures 7 to 9 in the shape of the housing portion 321 and its opening 321a in the case 320, and the shape of the insulating member 370. However, the shape of the outer surface of the case 320, the shape of the first metal terminal 240, the second metal terminal 250, and the ceramic element 30 are the same as those of the electronic component 210 according to the second embodiment. The electronic component 310 will be described focusing on the differences from the electronic component 210, and commonalities with the electronic component 210 will be given the same reference numerals and their descriptions will be omitted.

[0094] As shown in Figure 10, the case 320 of the electronic component 310 has a roughly hexagonal prism-like external shape, similar to the case 220 shown in Figure 7. However, the housing portion 321 formed in the case 320 is rectangular in shape, unlike the case 220, and the shape of the opening 321a of the housing portion 321 is rectangular. The shape of the housing portion 321 can be appropriately selected according to the size of the ceramic element 30 to be housed.

[0095] As shown in Figure 12, which provides a transparent view of case 320, the housing section 321 within case 320 houses the entire ceramic element 30, the first and second terminal arms 246, 256 of the first metal terminal 240 and the second metal terminal 250, and the first and second electrode connection sections 244, 254. The first mounting section 242 of the first metal terminal 240 and the second mounting section 252 of the second metal terminal 250 are exposed from the housing section 321 through the opening 321a. The mounting bottoms 242a, 252a of the first mounting section 242 and the second mounting section 252 are provided on the opening edge 322 surrounding the opening 321a.

[0096] As shown in Figures 7 and 9, in the electronic component 210 according to the second embodiment, the insulating member 270 was integrated with the case 220. However, as shown in Figure 12, in the electronic component 310 according to the third embodiment, at least a part of the insulating member 370 (the entire insulating member 370 in the example shown in Figure 12) is separate from the case 320.

[0097] As shown in Figure 11, the insulating member 370 has a substantially U-shaped outer form. The insulating member 370 has a first portion 371 and a second portion 372 that extend substantially parallel to each other, and a connecting portion 375 that connects the first portion 371 and the second portion 372. The connecting portion 375 extends substantially perpendicular to the first portion 371 and the second portion 372 and connects the end of the first portion 371 and the end of the second portion 372.

[0098] As shown in Figures 10 and 12, the insulating member 370 is placed in the housing 321 with the tips of the first portion 371 and the second portion 372 facing the upper bottom side. For example, the insulating member 370 is inserted into the housing 321 through the opening 321a after the ceramic element 30 to which the first metal terminal 240 and the second metal terminal 250 are connected is placed in the housing 321 and assembled.

[0099] As shown in Figures 10 and 12, in the electronic component 310, the connecting portion 375, which is part of the insulating member 370, is positioned in the opening 321a. By positioning at least a portion of the insulating member 380 in the opening 321a, the internal ceramic element 30 can be protected, and the outflow of the mold resin filling the housing portion 321 can be prevented. The insulating member 370 is fixed to the case 320, for example, via the mold resin filling the housing portion 321 or an adhesive.

[0100] As shown in Figure 12, the first portion 371 of the insulating member 370 is positioned between the first electrode portion 33 and the second terminal arm portion 256 (particularly the second portion 256a), and the second portion 372 of the insulating member 370 is positioned between the second electrode portion 34 and the first terminal arm portion 246 (particularly the second portion 246a). The insulating member 370 of the electronic component 310, like the insulating member 370 of the electronic component 210, can improve both the insulation between the first terminal arm portion 246 and the second electrode portion 34, and the insulation between the second terminal arm portion 256 and the first electrode portion 33.

[0101] Furthermore, the electronic component 310 according to the third embodiment has the same effects as the electronic component 210 according to the second embodiment in terms of its common features with the electronic component 210.

[0102] Fourth Embodiment Figure 13 is a schematic perspective view of the electronic component 410 according to the fourth embodiment, showing the state before the case cover is attached, and Figure 14 is a perspective view of the insulating member 470 of the electronic component 410. The electronic component 410 is the same as the electronic component 10 according to the first embodiment, except that the insulating member 470 is separate from the case cover 60, and is different from the insulating member 70 (see Figure 3), which is integrated with the case cover 60. In describing the electronic component 410, the differences from the electronic component 10 will be the main focus of the explanation, and commonalities with the electronic component 10 will be given the same reference numerals and their explanation will be omitted.

[0103] As shown in Figures 13 and 14, the insulating member 470 of the electronic component 410 is separate from the case cover and case, and is placed in the housing section 21 before the opening 21a of the case 20 is closed by the case cover. As shown in Figure 13, the insulating member 470 is a rectangular flat plate, and, similar to the insulating member 70 shown in Figure 5, is placed in the housing section 21 between the first electrode portion 33 of the ceramic element 30 and the second terminal arm portion 56 of the second metal terminal 50. Although not shown in Figure 13, the case cover used for the electronic component 410 is the same as the case cover 60 shown in Figure 3, except that the insulating member is not provided on the lower surface 63a of the cover.

[0104] As shown in Figures 13 and 14, in the electronic component 410, by making the insulating member 470 separate from the case 20 and case cover, it can be made into a common part that can be used in other electronic components of different shapes, for example. Furthermore, the electronic component 410 according to the fourth embodiment has the same effects as the electronic component 10 according to the first embodiment in terms of commonalities with the electronic component 10.

[0105] Fifth Embodiment Figure 15 is a schematic perspective view of the electronic component 510 according to the fifth embodiment, showing the state before the case cover is attached, and Figure 16 is a perspective view of the insulating member 570 of the electronic component 510. The electronic component 510 is the same as the electronic component 410 according to the fourth embodiment, except that the shape of the insulating member 570 is different. In describing the electronic component 510, the differences from the electronic component 410 will be the main focus of the explanation, and commonalities with the electronic component 410 will be given the same reference numerals as the electronic component 410 and will not be explained.

[0106] As shown in Figures 15 and 16, the insulating member 570 of the electronic component 510 is separate from the case cover and case, similar to the insulating member 470 of the electronic component 410. As shown in Figure 16, the insulating member 570 has an arc-shaped portion 570a that runs along the outer circumference of the ceramic element 30. The insulating member 470 has an arc-shaped portion 570a that faces the side surface of the ceramic element 30, and a straight portion 570b that faces in the opposite direction from the arc-shaped portion 570a that faces the rising portion 56a of the second terminal arm 56.

[0107] The insulating member 570, like the insulating member 470 shown in Figure 16, is positioned in the housing section 21 between the first electrode portion 33 of the ceramic element 30 and the second terminal arm portion 56 (particularly the rising portion 56a) of the second metal terminal 50. Since the insulating member 570 has an arc-shaped portion 570a and a straight portion 570b, it prevents misalignment during assembly and can be accurately positioned in the predetermined location in the housing section 21.

[0108] Furthermore, the electronic component 510 according to the fifth embodiment has the same effects as the electronic component 410 according to the fourth embodiment in terms of its common features with the electronic component 410.

[0109] Other Embodiments Although several embodiments have been described above, it goes without saying that the scope of the disclosed technology includes many other embodiments and modifications. For example, the insulating member included in the electronic component may be separated into several independent members, some of which may be integrated with other members such as the case cover 60, while other parts may be separate from other members.

[0110] Furthermore, the shapes of each component included in the electronic components shown in the embodiments are merely examples, and various modifications can be made without departing from the technical concept. For example, in the embodiments described above, an example in which one ceramic element 30 is housed in the housings 21 and 221 was used, but the housings 21 and 221 may also include multiple ceramic elements 30 and other metal terminals. Note that the electronic components 10, 210, 310, 410, and 510 may or may not contain molded resin. However, when the electronic components 10, 210, 310, 410, and 510 contain molded resin, it is preferable from the viewpoint of accurately arranging the insulating members 70, 270, 370, and 470 to be provided separately from the molded resin.

[0111] Furthermore, for example, Figure 17 is a view from below showing a modified case cover 660 and insulating member 670 that can be applied in place of the case cover 60 and insulating member 70 shown in Figure 3 in the electronic component 10 according to the first embodiment.

[0112] As shown in Figure 17, an insulating member 670 is provided on the lower surface 63a of the case cover 660, similar to the case cover 60 shown in Figure 3. The insulating member 670 shown in Figure 17 has a shorter length in the X-axis direction compared to the insulating member 70 shown in Figure 3. However, like the insulating member 70 shown in Figure 3, the insulating member 670 is also positioned between the first electrode portion 33 of the ceramic element 30 and the second terminal arm portion 56 of the second metal terminal 50, thereby improving the insulation of the electronic components. [Explanation of Symbols]

[0113] 10, 210, 310, 410, 510… Electronic components 20, 220, 320... cases 21, 221, 321… Storage Units 21a, 221a, 321a...opening 21b…Corner 21c…Bottom surface 221b…First inner wall 221c…Second inner wall 22...Bottom of the case 222, 322... Opening edge 223...Top bottom 27…The first gap 28... The second gap 30…Ceramic element 31a...first principal surface 31aa…extension surface 33...First electrode part 31b…Second main surface 34…Second electrode part 35…Dielectric part 40, 240...1st metal terminal 42, 242...First Implementation Section 242a...First mounting bottom 242b...First fold section 44, 244... First electrode connection section 46, 246...1st terminal arm 246a...Second part 246b... Part 1 50, 250…Second metal terminal 52…Second Implementation Section 252a...Second mounting bottom 252b...Second fold section 54, 254...Second electrode connection section 56, 256...2nd terminal arm 56a...Rising section 256a...Second part 56b, 256b... Part 1 56c... Part 3 60, 660... Case cover 63...Cover body 63a...Underside of cover 64...Protrusion 70, 270, 370, 470, 570, 670… Insulating material 570a... Arc-shaped portion 570b…Straight section 271, 371...Part 1 272, 372…Second part 375...Connection part VL…Virtual Line

Claims

1. A case having a housing section with an opening, A ceramic element disposed in the housing portion, having a first main surface and a second main surface facing each other, and having a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface, A first metal terminal having a first electrode connection portion connected to the first electrode portion, a first mounting portion exposed from the housing portion through the opening, and a first terminal arm portion connecting the first electrode connection portion and the first mounting portion, A second metal terminal having a second electrode connection portion connected to the second electrode portion, a second mounting portion exposed from the housing portion through the opening, and a second terminal arm portion connecting the second electrode connection portion and the second mounting portion, The housing portion includes an insulating member disposed between the first electrode portion and the second terminal arm portion, The first main surface and the second main surface are oriented in a direction substantially perpendicular to the opening.

2. A case having a housing section with an opening, A ceramic element disposed in the housing portion, having a first main surface and a second main surface facing each other, and having a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface, A first metal terminal having a first electrode connection portion connected to the first electrode portion, a first mounting portion exposed from the housing portion through the opening, and a first terminal arm portion connecting the first electrode connection portion and the first mounting portion, A second metal terminal having a second electrode connection portion connected to the second electrode portion, a second mounting portion exposed from the housing portion through the opening, and a second terminal arm portion connecting the second electrode connection portion and the second mounting portion, The housing portion includes an insulating member disposed between the first electrode portion and the second terminal arm portion, An electronic component in which the insulating member blocks a virtual line connecting the first electrode portion and the second terminal arm portion along the extension surface of the first main surface at the shortest distance, such that the virtual line does not come into contact with the first electrode portion and the second terminal arm portion.

3. The electronic component according to claim 2, wherein the first main surface faces the opening side, and the second main surface faces the opposite side from the opening.

4. The electronic component according to claim 3, having a case cover that closes at least a portion of the opening.

5. The electronic component according to claim 4, wherein at least a portion of the insulating member is connected to the case cover.

6. The electronic component according to any one of claims 3 to 5, wherein the second electrode connection portion faces the bottom surface of the housing portion, and the second terminal arm portion has a rising portion extending from the bottom surface toward the opening.

7. The electronic component according to claim 1, wherein the insulating member has a first portion disposed between the first electrode portion and the second terminal arm portion in the housing portion, and a second portion disposed between the second electrode portion and the first terminal arm portion in the housing portion.

8. The electronic component according to any one of claims 1 to 7, wherein at least a portion of the insulating member is connected to the case.

9. The electronic component according to any one of claims 1 to 8, wherein at least a portion of the insulating member is separate from the case.

10. The electronic component according to claim 9, wherein at least a portion of the insulating member is disposed in the opening.

11. The electronic component according to any one of claims 1 to 10, having a molded resin disposed in the housing portion.

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