Multilayer ceramic capacitor and combination thereof
By setting multiple sub-capacitors in a multilayer ceramic capacitor and connecting them to electronic components via external electrodes, the problem of a single capacitance value in the prior art is solved, enabling multiple capacitance value selections, reducing cost and space occupation, and improving the flexibility and compactness of circuit design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHIZHOU GYZ ELECTRONIC TECH CO LTD
- Filing Date
- 2025-03-19
- Publication Date
- 2026-06-19
AI Technical Summary
Existing multilayer ceramic capacitors can only provide a single capacitance value, which leads to the need to use multiple capacitors with different capacitance values, increasing manufacturing costs and space requirements, and limiting the flexibility and compactness of circuit design.
Design a multilayer ceramic capacitor comprising multiple sub-capacitors, each having an independent internal electrode group and connected to electronic components via external electrodes, allowing selective series or parallel connection to form various capacitance values and reducing the number of capacitors.
This enables a variety of capacitance values for multilayer ceramic capacitors, reducing manufacturing costs and production time, minimizing space requirements, and improving the flexibility and compactness of circuit design.
Smart Images
Figure CN224384095U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of capacitor technology, and in particular to a multilayer ceramic capacitor and its combination. Background Technology
[0002] Multilayer ceramic capacitors (MLCCs) are common electronic components widely used in various electronic products and circuits, and are prevalent in consumer electronics, new energy, and communication equipment. With the increasing performance requirements of electronic devices, higher demands are being placed on the performance, size, and versatility of multilayer ceramic capacitors.
[0003] In existing technologies, a single multilayer ceramic capacitor typically provides only a single capacitance value. Furthermore, the design process often requires the use of multiple multilayer ceramic capacitors with different capacitance values to meet circuit requirements, or multiple multilayer ceramic capacitors connected in series or parallel to form different capacitance values. This increases the number of multilayer ceramic capacitors, which not only increases manufacturing costs and production time but also occupies more electronic component space, increases design complexity, and limits the flexibility and compactness of circuit design.
[0004] Therefore, existing multilayer ceramic capacitors need to be improved. Summary of the Invention
[0005] The purpose of this invention is to provide a multilayer ceramic capacitor and its combination, which can greatly reduce the number of multilayer ceramic capacitors used, thereby reducing manufacturing costs and production time, and also reducing the space occupied by electronic components. This is beneficial to the flexibility and compactness of electronic component design, and thus promotes the miniaturization of electronic components.
[0006] The objective of this utility model is achieved through the following technical solution:
[0007] A multilayer ceramic capacitor for mounting to an electronic component, comprising:
[0008] A ceramic body comprising a plurality of stacked dielectric layers and alternately stacked internal electrodes, the dielectric layers being located between the internal electrodes, the ceramic body being used to form at least two sub-capacitors with different capacitance values, each sub-capacitor comprising an independent set of internal electrodes;
[0009] Multiple external electrodes are disposed on the end face and / or side face of the ceramic body. The multiple external electrodes are electrically connected to the corresponding internal electrodes. The external electrodes and the electronic components are connected and coupled in different ways to enable the multilayer ceramic capacitor to selectively form a variety of different capacitance values.
[0010] Preferably, at least one sub-capacitor is energized and independently electrically connected to the electronic component, or at least two sub-capacitors are energized and electrically connected to the electronic component in series and / or parallel.
[0011] Preferably, the spacing between the inner electrodes and / or the number of dielectric layers are different for at least some of the sub-capacitors; each of the sub-capacitors has a pair of independently disposed outer electrodes, one pair of outer electrodes of each sub-capacitor is disposed on the end face and / or side face of the ceramic body, and the inner electrode of each sub-capacitor is exposed from the end face and / or side face of the ceramic body to be electrically connected to the corresponding outer electrode.
[0012] Preferably, at least two of the sub-capacitors have a common external electrode, so that at least two of the sub-capacitors have the same input or output terminal;
[0013] The common external electrode is located on the end face or side of the ceramic body. One end of the internal electrode corresponding to at least two of the sub-capacitors is exposed from the ceramic body to be electrically connected to the common external electrode, and the other end of the internal electrode corresponding to at least two of the sub-capacitors is exposed from the ceramic body to be electrically connected to other external electrodes.
[0014] Preferably, a spacer layer is provided between the ceramic bodies corresponding to adjacent sub-capacitors, and the thickness of the spacer layer is greater than the thickness of the dielectric layer corresponding to the adjacent sub-capacitor.
[0015] Preferably, the height of the outer electrode along the stacking direction is greater than or equal to the height of the ceramic body along the stacking direction, so as to increase the contact area between the outer electrode and the ceramic body.
[0016] Preferably, the ceramic body has a mounting surface for mounting the electronic component, the mounting surface being one of two opposing sides of the ceramic body in the stacking direction, and the external electrodes of the sub-capacitors all extending to the mounting surface; or,
[0017] The external electrode of the sub-capacitor is positioned close to the mounting surface and can be soldered to the electronic component using solder material.
[0018] Preferably, the ceramic body has a first side surface and a second side surface opposite to each other in the stacking direction, a first end surface and a second end surface opposite to each other in the length direction, and a third side surface and a fourth side surface opposite to each other in the width direction;
[0019] The inner electrode is exposed from at least one of the first end face, the second end face, the third side face, and the fourth side face, and the outer electrode is electrically connected to the corresponding inner electrode.
[0020] Preferably, a plurality of external electrodes located on the same side of the ceramic body are spaced apart along the length of the ceramic body; and / or,
[0021] Multiple external electrodes located on the same end face of the ceramic body are spaced apart along the width direction of the ceramic body.
[0022] Preferably, the plurality of sub-capacitors include a first sub-capacitor, a second sub-capacitor, and a third sub-capacitor stacked along the stacking direction;
[0023] The first sub-capacitor has two opposing first external electrodes, the second sub-capacitor has two opposing second external electrodes, and the third sub-capacitor has two opposing third external electrodes. The inner electrodes of the first sub-capacitor are exposed from the third side and the fourth side, respectively, and are electrically connected to the two first external electrodes. The inner electrodes of the second sub-capacitor are exposed from the third side and the fourth side, respectively, and are electrically connected to the two second external electrodes. The inner electrodes of the third sub-capacitor are exposed from the first end face and the second end face, respectively, and are electrically connected to the two third external electrodes. Alternatively,
[0024] The first sub-capacitor has a first external electrode, the second sub-capacitor has a second external electrode, and the third sub-capacitor has a third external electrode. The first, second, and third sub-capacitors share a common fourth external electrode. A portion of the internal electrodes of the first, second, and third sub-capacitors are exposed from one of the first and second end faces and electrically connected to the fourth external electrode. The remaining internal electrodes of the first sub-capacitor are exposed from one of the third and fourth side faces and electrically connected to the first external electrode. The remaining internal electrodes of the second sub-capacitor are exposed from one of the third and fourth side faces and electrically connected to the second external electrode. The remaining internal electrodes of the third sub-capacitor are exposed from one of the first and second end faces and electrically connected to the third external electrode.
[0025] A multilayer ceramic capacitor assembly includes an electronic component and the multilayer ceramic capacitor described in any one of the preceding claims, wherein the electronic component has a plurality of pads corresponding to a plurality of external electrodes of the multilayer ceramic capacitor, and the plurality of external electrodes are connected one-to-one to the plurality of pads.
[0026] Compared with the prior art, the beneficial effects of this utility model include at least the following:
[0027] This invention relates to a multilayer ceramic capacitor and its combination. By setting multiple sub-capacitors, the external electrodes of these sub-capacitors are connected to electronic components in different ways to selectively activate one or more sub-capacitors. This allows the multilayer ceramic capacitor to selectively form a variety of different capacitance values. Such a multilayer ceramic capacitor can meet the needs of various different capacitance values required by the circuit, greatly reducing the number of multilayer ceramic capacitors used. This not only reduces manufacturing costs and production time to improve production efficiency, but also reduces the space occupied by electronic components, which is beneficial to the flexibility and compactness of electronic component design, thus promoting the miniaturization of electronic components. Attached Figure Description
[0028] Figure 1 This is a three-dimensional structural schematic diagram of a multilayer ceramic capacitor according to an embodiment of the present invention.
[0029] Figure 2 This is a three-dimensional structural diagram of a ceramic body according to an embodiment of this utility model.
[0030] Figure 3 This is a schematic diagram of the planar structure of a multilayer ceramic capacitor according to an embodiment of the present invention.
[0031] Figure 4 It is along Figure 3 A cross-sectional view of line AA in the middle.
[0032] Figure 5 It is along Figure 3 A cross-sectional view of the BB line.
[0033] Figure 6 It is along Figure 3 A cross-sectional view of the CC line.
[0034] Figure 7 This is a three-dimensional structural schematic diagram of another multilayer ceramic capacitor according to an embodiment of the present invention.
[0035] Figure 8 This is a three-dimensional structural schematic diagram of another ceramic body in an embodiment of this utility model.
[0036] Figure 9 This is a schematic diagram of the planar structure of another multilayer ceramic capacitor according to an embodiment of the present invention.
[0037] Figure 10 It is along Figure 9 A cross-sectional schematic diagram of the DD line.
[0038] Figure 11 It is along Figure 9 A cross-sectional schematic diagram of the EE line.
[0039] Figure 12 It is along Figure 9 A cross-sectional view of the FF line.
[0040] In the diagram: 100, Multilayer ceramic capacitor; 1, Ceramic body; 11, Dielectric layer; 12, Inner electrode; 121, First inner electrode; 122, Second inner electrode; 123, Third inner electrode; 13, Spacer layer; 14, First side surface; 15, Second side surface; 16, First end face; 17, Second end face; 18, Third side surface; 19, Fourth side surface; 2, Sub-capacitor; 21, First sub-capacitor; 22, Second sub-capacitor; 23, Third sub-capacitor; 3, Outer electrode; 31, First outer electrode; 32, Second outer electrode; 33, Third outer electrode; 34, Fourth outer electrode; 200, Electronic component; 210, Solder pad. Detailed Implementation
[0041] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.
[0042] The terms used to describe position and direction in this utility model are illustrated with the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this utility model.
[0043] Reference Figures 1 to 12 This invention provides a multilayer ceramic capacitor 100 for mounting to an electronic component 200. The multilayer ceramic capacitor 100 includes a ceramic body 1 and multiple external electrodes 3. The external electrodes 3 can be disposed on the surface of the ceramic body 1. The multilayer ceramic capacitor 100 can be electrically connected to the electronic component 200 through the external electrodes 3. The electronic component 200 can be a printed circuit board (PCB), a ceramic plate with circuits, a base with circuits, etc. When the electronic component 200 is a base with circuits, the circuits in the base can be metal terminals. The metal terminals have pads 210 for connecting to the multilayer ceramic capacitor 100, and the multilayer ceramic capacitor 100 can be directly connected to the pads 210 of the metal terminals.
[0044] Specifically, refer to Figure 1 , Figure 2 , Figure 7 , Figure 8The ceramic body 1 can be hexahedral or other shapes. In this embodiment, the ceramic body 1 can be cuboid. The ceramic body 1 has a first side surface 14 and a second side surface 15 opposite each other in the stacking direction, a first end surface 16 and a second end surface 17 opposite each other in the length direction, and a third side surface 18 and a fourth side surface 19 opposite each other in the width direction. The end surfaces mentioned below include the first end surface 16 and the second end surface 17, and the sides mentioned below include the first side surface 14, the second side surface 15, the third side surface 18, and the fourth side surface 19. Preferably, the first side surface 14 or the second side surface 15 serves as the mounting surface, that is, when the multilayer ceramic capacitor 100 is mounted on the electronic component 200, the mounting surface is the side facing the electronic component 200.
[0045] Reference Figure 4 , Figure 10 The ceramic body 1 may include multiple stacked dielectric layers 11 and alternately stacked inner electrodes 12. The stacking direction refers to the direction in which the dielectric layers 11 or inner electrodes 12 are stacked. The dielectric layers 11 are located between the inner electrodes 12, that is, between adjacent inner electrodes 12. The dielectric layers 11 can isolate adjacent inner electrodes 12 to achieve electrical separation, thereby forming a capacitor. The inner electrodes 12 can be formed by printing conductive paste on the ceramic green sheet. The conductive paste contains one or more alloys of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), and titanium (Ti). The raw materials of the dielectric layers 11 are not particularly limited, as long as sufficient capacitance can be obtained. Barium titanate-based materials, lead-composite perovskite-based materials, strontium titanate-based materials, etc., can be used.
[0046] Reference Figure 4 , Figure 10 The ceramic body 1 is used to form at least two sub-capacitors 2 with different capacitance values. That is, a multilayer ceramic capacitor 100 may include two or more sub-capacitors 2, each sub-capacitor 2 containing an independent internal electrode group. When the number of sub-capacitors 2 is two, the two sub-capacitors 2 have different capacitance values. When the number of sub-capacitors 2 is two or more, at least two sub-capacitors 2 with different capacitance values are included. That is, some sub-capacitors 2 may have the same capacitance value, or all sub-capacitors 2 may have different capacitance values. The multiple sub-capacitors 2 are preferably stacked, that is, the multiple sub-capacitors 2 are stacked in the stacking direction.
[0047] As an example, the capacitance of sub-capacitor 2 can be changed by altering the spacing or overlapping area of the inner electrodes 12, the number of dielectric layers 11 stacked in sub-capacitor 2, or the material of the dielectric layers 11. In other words, the spacing, overlapping area, number of dielectric layers 11, and material of the dielectric layers 11 all affect the capacitance of sub-capacitor 2. Of course, other methods can also be used to change the capacitance of sub-capacitor 2, which will not be listed here.
[0048] Reference Figure 4 , Figure 10 A spacer layer 13 is provided between the ceramic bodies 1 corresponding to adjacent sub-capacitors 2. The thickness of the spacer layer 13 is greater than the thickness of the dielectric layer 11 corresponding to the adjacent sub-capacitor 2. The spacer layer 13 can separate adjacent sub-capacitors 2 from each other, preventing them from affecting each other and making them independent. There can be multiple spacer layers 13, and multiple spacer layers 13 can enable the multilayer ceramic capacitor 100 to form more sub-capacitors 2.
[0049] The spacer layer 13 can be sintered simultaneously with the ceramic body 1 portion corresponding to the sub-capacitor 2. That is, the spacer layer 13, the dielectric layer 11 of the sub-capacitor 2, and the inner electrode 12 are preferably sintered integrally. The spacer layer 13 and the ceramic body 1 portion corresponding to each sub-capacitor 2 together form a complete ceramic body 1. The spacer layer 13 and the dielectric layer 11 of the sub-capacitor 2 may be made of the same or different materials. Specifically, compared to the dielectric layer 11 of the sub-capacitor 2, the spacer layer 13 does not have an inner electrode 12. The spacer layer 13 and the dielectric layer 11 of the sub-capacitor 2 can be formed of the same material, or they can be formed of different materials.
[0050] Multiple external electrodes 3 can be disposed on the end face and / or side face of the ceramic body 1, and the multiple external electrodes 3 can be electrically connected to the corresponding internal electrodes 12 respectively. In this embodiment, the internal electrode 12 can be exposed from at least one of the first end face 16, the second end face 17, the third side face 18, and the fourth side face 19, and the external electrodes 3 can be electrically connected to the corresponding internal electrodes 12. That is, the internal electrode 12 can be exposed from any one or more of the first end face 16, the second end face 17, the third side face 18, and the fourth side face 19, and the external electrodes 3 can be disposed on any one or more of the first end face 16, the second end face 17, the third side face 18, and the fourth side face 19 to be electrically connected to the corresponding internal electrode 12. In other embodiments, the inner electrode 12 may be exposed only from the end face, such as from the first end face 16 and the second end face 17, and the outer electrode 3 may be disposed on the first end face 16 and the second end face 17 and connected to the inner electrode 12. Alternatively, the inner electrode 12 may be exposed only from the side, such as from the third side face 18 and the fourth side face 19, and the outer electrode 3 may be disposed on the third side face 18 and the fourth side face 19 and connected to the inner electrode 12.
[0051] As a preferred method, refer to Figure 4 , Figure 10 The external electrodes 3 of the sub-capacitors 2 can all extend to the mounting surface, that is, the external electrodes 3 of the sub-capacitors 2 can all extend to the first side 14 and / or the second side 15. This not only facilitates the soldering of the multilayer ceramic capacitor 100 to the pads 210 on the electronic component 200, but also increases the contact area between the multilayer ceramic capacitor 100 and the pads 210 of the electronic component 200, thereby improving the bonding force between the multilayer ceramic capacitor 100 and the pads 210 of the electronic component 200. In some embodiments, the external electrodes 3 of the sub-capacitors 2 can be disposed close to the mounting surface and can be soldered to the pads 210 of the electronic component 200 by soldering material. That is, the external electrodes 3 of the sub-capacitors 2 do not need to extend to the mounting surface; the external electrodes 3 only need to be close to the mounting surface. The external electrodes 3 can also be connected and fixed to the pads 210 of the electronic component 200 by soldering material.
[0052] The height of the outer electrode 3 along the stacking direction is greater than or equal to the height of the ceramic body 1 along the stacking direction, thereby increasing the contact area between the outer electrode 3 and the ceramic body 1. This enhances the bonding force between the outer electrode 3 and the ceramic body 1, and prevents the outer electrode 3 from detaching from the ceramic body 1. In this embodiment, when the outer electrode 3 is disposed on the first end face 16 and the second end face 17, the four sides of the outer electrode 3 can extend to the first side face 14, the second side face 15, the third side face 18, and the fourth side face 19, respectively. When the outer electrode 3 is disposed on the third side face 18 and the fourth side face 19, the outer electrode 3 can extend to the first side face 14 and the second side face 15, respectively.
[0053] The multiple external electrodes 3 are spaced apart from each other, meaning that the multiple external electrodes 3 are independent of each other. (Refer to...) Figure 1 , Figure 7 Multiple external electrodes 3 can be set on the same side. Multiple external electrodes 3 located on the same side of the ceramic body 1 are spaced apart along the length direction of the ceramic body 1. That is, when multiple external electrodes 3 are set on the third side 18, or when multiple external electrodes 3 are set on the fourth side 19, multiple external electrodes 3 are spaced apart along the length direction of the ceramic body 1 to avoid mutual interference between adjacent external electrodes 3.
[0054] Multiple external electrodes 3 can also be provided on the same end face. Multiple external electrodes 3 located on the same end face of the ceramic body 1 are spaced apart along the width direction of the ceramic body 1. That is, when multiple external electrodes 3 are provided on the first end face 16, or when multiple external electrodes 3 are provided on the second end face 17, multiple external electrodes 3 are spaced apart along the width direction of the ceramic body 1 to avoid mutual interference between adjacent external electrodes 3.
[0055] The external electrode 3 and the electronic component 200 are connected in different ways to allow the multilayer ceramic capacitor 100 to selectively form multiple different capacitance values. For example, by controlling the circuit on the electronic component 200 or by controlling the circuit in which the electronic component 200 is located, at least one sub-capacitor 2 can be energized and independently electrically connected to the electronic component 200. That is, multiple sub-capacitors 2 can be energized and independently electrically connected to the electronic component 200, and one multilayer ceramic capacitor 100 can be used as multiple capacitors, with the multiple sub-capacitors 2 being independent of each other. Alternatively, by controlling the circuit on or in which the electronic component 200 is located, at least two sub-capacitors 2 can also be energized and electrically connected to the electronic component 200 in series and / or parallel. That is, multiple sub-capacitors 2 can be combined to achieve multiple different capacitance values, thereby meeting the requirements of the circuit for multiple different capacitance values, and thus achieving the purpose of one multilayer ceramic capacitor 100 forming multiple capacitance values. Therefore, one or more sub-capacitors 2 can be selectively activated by different connection and cooperation methods between the external electrode 3 and the electronic component 200. When multiple sub-capacitors 2 are activated, each sub-capacitor 2 can be used independently as a capacitor, or they can be used in series and / or in parallel.
[0056] In summary, in this application, by setting multiple sub-capacitors 2, which can be independently and electrically connected to the electronic component 200, and can also be electrically connected to the electronic component 200 in series or parallel, the multilayer ceramic capacitor 100 can have different capacitance values. This allows the multilayer ceramic capacitor 100 to meet the needs of various different capacitance values required by the circuit, which can greatly reduce the number of multilayer ceramic capacitors 100 used. This not only reduces manufacturing costs and production time to improve production efficiency, but also reduces the space occupied by the electronic component 200, which is beneficial to the flexibility and compactness of the electronic component 200 design, and thus promotes the miniaturization of the electronic component 200.
[0057] In one specific implementation, refer to Figure 1 , Figure 4 , Figure 5 , Figure 6 Each of the multiple sub-capacitors 2 can have a pair of independently configured external electrodes 3. The pair of external electrodes 3 of each sub-capacitor 2 can be disposed on the end face and / or side face of the ceramic body 1. The internal electrode 12 of each sub-capacitor 2 can be exposed from the end face and / or side face of the ceramic body 1 to be electrically connected to the corresponding external electrode 3. The two external electrodes 3 of the same sub-capacitor 2 can be disposed on the first end face 16 and the second end face 17 respectively, or the two external electrodes 3 of the same sub-capacitor 2 can be disposed on the first end face 16 or the second end face 17 simultaneously. The two external electrodes 3 of the same sub-capacitor 2 can also be disposed on one of the first end face 16 and the second end face 17, and one of the third side face 18 and the fourth side face 19 respectively.
[0058] As an example, refer to Figure 1 , Figure 4 , Figure 5 , Figure 6 The multiple sub-capacitors 2 may include a first sub-capacitor 21, a second sub-capacitor 22, and a third sub-capacitor 23, which can be stacked along the stacking direction. The first sub-capacitor 21 may be positioned close to the first side 14, the third sub-capacitor 23 may be positioned close to the second side 15, and the second sub-capacitor 22 may be positioned between the first sub-capacitor 21 and the third sub-capacitor 23. A spacer layer 13 is provided between each pair of the first sub-capacitor 21, the second sub-capacitor 22, and the third sub-capacitor 23. The spacing of the internal electrodes 12 and / or the number of dielectric layers 11 stacked among the first sub-capacitor 21, the second sub-capacitor 22, and the third sub-capacitor 23 are different, thus achieving different capacitance values for the first sub-capacitor 21, the second sub-capacitor 22, and the third sub-capacitor 23.
[0059] The first sub-capacitor 21 has alternating stacked first inner electrodes 121, the second sub-capacitor 22 has alternating stacked second inner electrodes 122, and the third sub-capacitor 23 has alternating stacked third inner electrodes 123. The first sub-capacitor 21 may have two opposing first outer electrodes 31, which may be respectively disposed on the third side 18 and the fourth side 19. The first inner electrodes 121 of the first sub-capacitor 21 may be exposed from the third side 18 and the fourth side 19 and electrically connected to the two first outer electrodes 31 respectively. The second sub-capacitor 22 may have two opposing second outer electrodes 32, which may be respectively disposed on the third side 18 and the fourth side 19. The second inner electrodes 122 of the second sub-capacitor 22 may be exposed from the third side 18 and the fourth side 19 and electrically connected to the two second outer electrodes 32 respectively. The third sub-capacitor 23 may have two opposing third outer electrodes 33, which may be respectively disposed on the first end face 16 and the second end face 17. The third inner electrode 123 of the third sub-capacitor 23 can be exposed from the first end face 16 and the second end face 17 respectively and electrically connected to the two third outer electrodes 33 respectively.
[0060] In another specific implementation, refer to Figure 7 , Figure 10 , Figure 11 , Figure 12 At least two sub-capacitors 2 may have a shared external electrode 3, so that at least two sub-capacitors 2 have the same input or output terminal. The shared external electrode 3 may be located on the end face or side face of the ceramic body 1. One end of the internal electrode 12 corresponding to at least two sub-capacitors 2 protrudes from the ceramic body 1 to be electrically connected to the shared external electrode 3, and the other end of the internal electrode 12 corresponding to at least two sub-capacitors 2 protrudes from the ceramic body 1 to be electrically connected to other external electrodes 3.
[0061] As an example, refer to Figure 7 , Figure 10 , Figure 11 , Figure 12The first sub-capacitor 21, the second sub-capacitor 22, and the third sub-capacitor 23 may share a common fourth external electrode 34. The fourth external electrode 34 may be located on one of the first end face 16 and the second end face 17. A portion of the first internal electrode 121 of the first sub-capacitor 21, a portion of the second internal electrode 122 of the second sub-capacitor 22, and a portion of the third internal electrode 123 of the third sub-capacitor 23 are exposed from one of the first end face 16 and the second end face 17 and are all electrically connected to the fourth external electrode 34. The first sub-capacitor 21 may have a first external electrode 31, which may be located on one of the third side face 18 and the fourth side face 19. The remaining first internal electrodes 121 of the first sub-capacitor 21 may be exposed from one of the third side face 18 and the fourth side face 19 and are electrically connected to the first external electrode 31. The second sub-capacitor 22 may have a second external electrode 32, which may be disposed on one of the third side surface 18 and the fourth side surface 19. The remaining second internal electrodes 122 of the second sub-capacitor 22 may be exposed from one of the third side surface 18 and the fourth side surface 19 and electrically connected to the second external electrode 32. The third sub-capacitor 23 may have a third external electrode 33, which may be disposed on one of the first end surface 16 and the second end surface 17. The remaining third internal electrodes 123 of the third sub-capacitor 23 may be exposed from one of the first end surface 16 and the second end surface 17 and electrically connected to the third external electrode 33.
[0062] The first external electrode 31, the second external electrode 32, the third external electrode 33, and the fourth external electrode 34 can have the same structure and material. The first external electrode 31, the second external electrode 32, the third external electrode 33, and the fourth external electrode 34 can be a single-layer or multi-layer structure. The material of the first external electrode 31, the second external electrode 32, the third external electrode 33, and the fourth external electrode 34 can be copper, nickel, tin, etc. When a multi-layer structure is adopted, from the inside to the outside, the first external electrode 31, the second external electrode 32, the third external electrode 33, and the fourth external electrode 34 can respectively include a copper layer, a nickel layer, and a tin layer.
[0063] This utility model also provides a multilayer ceramic capacitor assembly, including an electronic component 200 and a multilayer ceramic capacitor 100. The electronic component 200 has multiple pads 210 corresponding to multiple external electrodes 3 of the multilayer ceramic capacitor 100. The multiple external electrodes 3 are connected one-to-one to the multiple pads 210. One or more sub-capacitors 2 can be selected for use by means of circuit control. That is, one or more sub-capacitors 2 can be selected to be energized by means of circuit control to enable the capacitance value of one or more sub-capacitors 2, or two or more sub-capacitors 2 can be selected to be energized at the same time by means of circuit control and used in series or parallel to form different capacitance values.
[0064] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention without departing from the principles and spirit of the present invention, and all such changes should fall within the protection scope of the claims of the present invention.
Claims
1. A multilayer ceramic capacitor for mounting to electronic components, characterized in that, include: A ceramic body comprising a plurality of stacked dielectric layers and alternately stacked internal electrodes, the dielectric layers being located between the internal electrodes, the ceramic body being used to form at least two sub-capacitors with different capacitance values, each sub-capacitor comprising an independent set of internal electrodes; Multiple external electrodes are disposed on the end face and side face of the ceramic body, and each external electrode is electrically connected to a corresponding internal electrode. At least two sub-capacitors have a common external electrode so that the at least two sub-capacitors have the same input or output terminal. The common external electrode is located on the end face or side face of the ceramic body. One end of the internal electrode corresponding to at least two sub-capacitors protrudes from the ceramic body to be electrically connected to the common external electrode, and the other end of the internal electrode corresponding to at least two sub-capacitors protrudes from the ceramic body to be electrically connected to other external electrodes. The external electrodes and the electronic components are connected and coupled in different ways to allow the multilayer ceramic capacitor to selectively form a variety of different capacitance values.
2. The multilayer ceramic capacitor of claim 1, wherein, At least one sub-capacitor is energized and independently electrically connected to the electronic component, or at least two sub-capacitors are energized and electrically connected to the electronic component in series and / or parallel.
3. The multilayer ceramic capacitor of claim 1, wherein, The spacing between the internal electrodes and / or the number of dielectric layers are different for at least some of the sub-capacitors.
4. The multilayer ceramic capacitor of claim 1, wherein, At least two of the inner electrodes of the sub-capacitors are exposed from the same side of the ceramic body, and the inner electrodes of the different sub-capacitors are staggered along both the stacking direction and the length direction of the ceramic body on the same side.
5. The multilayer ceramic capacitor of claim 1, wherein, A spacer layer is provided between the ceramic bodies corresponding to adjacent sub-capacitors, and the thickness of the spacer layer is greater than the thickness of the dielectric layer corresponding to the adjacent sub-capacitor.
6. The multilayer ceramic capacitor of claim 1, wherein, The height of the outer electrode along the stacking direction is greater than or equal to the height of the ceramic body along the stacking direction, so as to increase the contact area between the outer electrode and the ceramic body.
7. The multilayer ceramic capacitor of claim 1, wherein The ceramic body has a mounting surface for mounting the electronic component. This mounting surface is one of two opposing sides of the ceramic body in the stacking direction, and the external electrodes of the sub-capacitors all extend to this mounting surface; or... The external electrode of the sub-capacitor is positioned close to the mounting surface and can be soldered to the electronic component using solder material.
8. The multilayer ceramic capacitor of claim 1, wherein, The ceramic body has a first side surface and a second side surface opposite to each other in the stacking direction, a first end surface and a second end surface opposite to each other in the length direction, and a third side surface and a fourth side surface opposite to each other in the width direction. The inner electrode is exposed from at least one of the first end face, the second end face, the third side face, and the fourth side face, and the outer electrode is electrically connected to the corresponding inner electrode.
9. The multilayer ceramic capacitor of claim 8, wherein, Multiple external electrodes located on the same side of the ceramic body are spaced apart along the length of the ceramic body; and / or, Multiple external electrodes located on the same end face of the ceramic body are spaced apart along the width direction of the ceramic body.
10. The multilayer ceramic capacitor according to claim 8, characterized in that, The plurality of said sub-capacitors include a first sub-capacitor, a second sub-capacitor, and a third sub-capacitor stacked along the stacking direction; The first sub-capacitor has a first external electrode, the second sub-capacitor has a second external electrode, and the third sub-capacitor has a third external electrode. The first, second, and third sub-capacitors share a common fourth external electrode. A portion of the internal electrodes of the first, second, and third sub-capacitors are exposed from one of the first and second end faces and electrically connected to the fourth external electrode. The remaining internal electrodes of the first sub-capacitor are exposed from one of the third and fourth side faces and electrically connected to the first external electrode. The remaining internal electrodes of the second sub-capacitor are exposed from one of the third and fourth side faces and electrically connected to the second external electrode. The remaining internal electrodes of the third sub-capacitor are exposed from one of the first and second end faces and electrically connected to the third external electrode.
11. A multilayer ceramic capacitor assembly, characterized by, The invention includes an electronic component and a multilayer ceramic capacitor according to any one of claims 1 to 10, wherein the electronic component has a plurality of pads corresponding to a plurality of external electrodes of the multilayer ceramic capacitor, and the plurality of external electrodes are connected one-to-one to the plurality of pads.