Switching device

Abstract

To provide a changeover device capable of efficiently changing over a distribution passage for heat medium.SOLUTION: A changeover device includes a six-way valve 180, the six-way valve 180 including a lower side body 183 (a first valve element), an upper side body 181 (a second valve element), and a driving plate 182 (a third valve element). The changeover device rotates each of the upper side body 181 and the driving plate 182 relative to the lower side body 183 to change over an overlapping state of respective openings 187a (first openings) of a plurality of groove parts 187 (first groove parts) of the lower side body 183, groove parts 181a-181e (second groove parts) of the upper side body 181, and through-holes 182a-182i of the driving plate 182 in a Z-direction (the axial direction).SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] This disclosure relates to a switching device.

Background Art

[0002] Japanese Unexamined Patent Application Publication No. 2021-154767 (Patent Document 1) discloses a heat management system provided with a switching valve that switches the flow path of a heat medium.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above Patent Document 1, as described above, the flow path of the heat medium is switched by a switching valve. What is desired is a switching device capable of efficiently switching the flow path of the heat medium (heat transfer medium).

[0005] This disclosure has been made to solve the above problems, and an object thereof is to provide a switching device capable of efficiently switching the flow path of a heat transfer medium.

Means for Solving the Problems

[0006] A switching device according to the first aspect of the present disclosure is a switching device provided in a thermal management circuit through which a heat transfer medium flows, and comprises at least one valve body unit and a plurality of flow pipes connected to the at least one valve body unit. The plurality of flow pipes include a plurality of first flow pipes and a plurality of second flow pipes. The at least one valve body unit includes a disc-shaped first valve body, a disc-shaped second valve body provided so as to be rotatable relative to the first valve body about a rotational centerline and positioned on one side of the first valve body in the axial direction from which the rotational centerline extends, and a disc-shaped third valve body provided so as to be sandwiched in the axial direction by the first valve body and the second valve body and provided so as to be rotatable relative to the first valve body about a rotational centerline. The first valve body includes an outer peripheral wall extending in an annular shape about a rotational centerline, an inner peripheral wall extending in an annular shape about a rotational centerline and formed on the side of the rotational centerline that is closer to the rotational centerline than the outer peripheral wall, and a plurality of partition walls formed to connect the inner peripheral wall and the outer peripheral wall. The first valve body is provided with a plurality of fan-shaped first grooves formed by a plurality of partition walls between the outer and inner circumferential walls. Each of the plurality of first grooves has a first opening that opens toward the second valve body and a second opening formed in the outer circumferential wall. Some of the second openings of the plurality of first grooves allow a heat transfer medium to flow into the first valve body through a plurality of first flow pipes, while the remaining second openings of the plurality of first grooves allow the heat transfer medium to flow out from the first valve body through a plurality of second flow pipes. The second valve body is provided with a plurality of fan-shaped second grooves that are formed to extend circumferentially around the rotation centerline and open toward the first valve body. The third valve body is provided with a plurality of through holes that penetrate the third valve body in the axial direction and are arranged circumferentially around the rotation centerline. By the rotation of each of the second and third valve bodies relative to the first valve body, the axial overlap state of the first openings of each of the plurality of first grooves, the plurality of second grooves, and the plurality of through holes is switched.

[0007] In the switching device relating to the first aspect of this disclosure, as described above, the axial overlap state of the first openings of each of the multiple first grooves, the multiple second grooves, and the multiple through holes is switched. As a result, the flow path of the heat transfer medium can be easily switched simply by switching the above overlap state. Consequently, the flow path of the heat transfer medium can be switched efficiently.

[0008] A switching device according to a second aspect of the present disclosure is a switching device provided in a thermal management circuit through which a heat transfer medium flows, and comprises at least one valve body unit and a plurality of flow pipes connected to the at least one valve body unit. The plurality of flow pipes include a plurality of first flow pipes and a plurality of second flow pipes. The at least one valve body unit includes a cylindrical inner circumferential unit integrally formed by stacking a disc-shaped first portion and a disc-shaped second portion, and an annular outer circumferential unit provided so as to be rotatable relative to the inner circumferential unit about a rotational centerline and arranged to surround the inner circumferential unit from the outer circumferential side. The inner circumferential unit includes a first outer circumferential wall extending in an annular manner about the rotational centerline and an inner circumferential wall extending in an annular manner about the rotational centerline and formed on the rotational centerline side of the first outer circumferential wall. The inner circumferential unit is formed with a plurality of fan-shaped first inner circumferential grooves, each having a first opening formed at a position corresponding to a first portion of the first outer circumferential wall, and a plurality of second inner circumferential grooves, each having a second opening formed at a position corresponding to a second portion of the first outer circumferential wall. The outer circumferential unit includes a second outer circumferential wall extending in an annular shape around a rotational centerline, and a plurality of partition walls provided between the second outer circumferential wall and the first outer circumferential wall so as to extend radially from the outer circumferential unit. Between the second outer circumferential wall and the first outer circumferential wall, a plurality of fan-shaped outer circumferential grooves are formed by the plurality of partition walls. Each of the plurality of outer circumferential grooves has a third opening formed in the second outer circumferential wall. Some of the third openings of the plurality of outer circumferential grooves allow a heat transfer medium to flow into the outer circumferential unit through a plurality of first flow pipes, while the remaining third openings of the plurality of outer circumferential grooves allow the heat transfer medium to flow out of the outer circumferential unit through a plurality of second flow pipes. By rotating the outer peripheral unit relative to the inner peripheral unit, the radial overlap state between the multiple outer peripheral grooves and the first and second openings can be switched.

[0009] In the switching device relating to the second aspect of this disclosure, as described above, the radial overlap state of the multiple outer peripheral grooves and the first and second openings is switched. This makes it possible to easily switch the flow path of the heat transfer medium simply by switching the overlap state. As a result, the flow path of the heat transfer medium can be switched efficiently.

[0010] In the switching device relating to the first and second aspects described above, preferably, the at least one valve unit is composed of two valve units. With this configuration, the flow path of the heat transfer medium can be switched in a more diverse manner compared to the case where only one valve unit is provided.

[0011] In the switching device relating to the first and second aspects described above, preferably, the multiple partition walls are composed of six partition walls. With this configuration, the flow path of the heat transfer medium can be easily and diversely switched by switching the communication state between the six partition walls and the multiple flow pipes. [Effects of the Invention]

[0012] According to this disclosure, the flow path of the heat transfer medium can be efficiently switched using a switching device. [Brief explanation of the drawing]

[0013] [Figure 1] This figure shows the configuration of the thermal management system according to the first embodiment. [Figure 2] This figure shows the configuration of the hexagonal valve according to the first embodiment. [Figure 3] This figure shows the valve phase of a hexagonal valve according to the first embodiment. [Figure 4] This figure shows the circuit patterns A to F of the thermal management circuit according to the first embodiment. [Figure 5] This figure shows the circuit patterns G to M of the thermal management circuit according to the first embodiment. [Figure 6] This is a cross-sectional view of the hexagonal valve corresponding to the position of the upper portion according to the second embodiment. [Figure 7] It is a cross-sectional view of a hexagonal valve corresponding to the position of the lower part according to the second embodiment. [Figure 8] It is a perspective view showing the configuration of the inner peripheral side unit of the hexagonal valve according to the second embodiment. [Figure 9] It is a view after the inner peripheral side unit rotates 30 degrees from the state of FIG. 6. [Figure 10] It is a view after the inner peripheral side unit rotates 30 degrees from the state of FIG. 7.

Mode for Carrying Out the Invention

[0014] Hereinafter, the heat management system according to the present disclosure will be described. The heat management system is mounted on, for example, an electric vehicle (not shown). The electric vehicle on which the heat management system is mounted is preferably a vehicle equipped with a driving battery, for example, a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), and a fuel cell electric vehicle (FCEV). However, the application of the heat management system according to the present disclosure is not limited to vehicles.

[0015] [First Embodiment] <Overall Configuration> FIG. 1 is a diagram showing an example of the overall configuration of a heat management system 1 according to the first embodiment of the present disclosure. The heat management system 1 includes a heat management circuit 100, an electronic control unit (ECU) 500, and a human machine interface (HMI) 600.

[0016] The heat management circuit 100 is configured such that a heat medium circulates. The heat management circuit 100 includes, for example, a high-temperature circuit 110, a radiator 120, a unit circuit 130, a capacitor 140, a refrigeration cycle 150, a chiller 160, a battery circuit 170, and a switching device 200. The switching device 200 includes a hexagonal valve 180 and a hexagonal valve 190. The switching device 200 includes a single case 200a that houses the hexagonal valve 180 and the hexagonal valve 190. Note that the hexagonal valve 180 and the hexagonal valve 190 may be provided separately from each other instead of being housed in a single case. Each of the hexagonal valve 180 and the hexagonal valve 190 is an example of the "valve body unit" of the present disclosure.

[0017] The high-temperature circuit 110 includes, for example, a water pump (W / P) 111, an electric heater 112, a three-way valve 113, a heater core 114, and a reservoir tank (R / T) 115.

[0018] The radiator 120 includes a high-temperature (HT: High Temperature) radiator 121 and a low-temperature (LT: Low Temperature) radiator 122. In the low-temperature radiator 122, heat exchange occurs between the heat medium and the outside air.

[0019] The unit circuit 130 includes, for example, a water pump 131, a smart power unit (SPU: Smart Power Unit) 132, a power control unit (PCU: Power Control Unit) 133, an oil cooler (O / C) 134, a buck-boost converter 135, and a reservoir tank 136.

[0020] The capacitor 140 is connected to both the high-temperature circuit 110 and the refrigeration cycle 150. The refrigeration cycle 150 includes, for example, a compressor 151, an expansion valve 152, an evaporator 153, an evaporative pressure regulator (EPR: Evaporative Pressure Regulator) 154, and an expansion valve 155.

[0021] The chiller 160 is connected to both the refrigeration cycle 150 and the flow path 161a. In the chiller 160, heat exchange occurs between the heat transfer medium flowing through the flow path 161a and the medium circulating in the refrigeration cycle 150. The flow path 161a is a flow path connecting port P1 of the hexagonal valve 180 (described later) and port P13 of the hexagonal valve 190 (described later). A water pump (W / P) 161 is provided in the flow path 161a.

[0022] The battery circuit 170 includes, for example, an electric heater 171 and a battery 172. The electric heater 171 raises the temperature of the heat transfer medium in the battery circuit 170.

[0023] The ECU 500 controls the thermal management circuit 100. The ECU 500 includes a processor 501, memory 502, storage 503, and interface 504.

[0024] The ECU 500 generates control commands based on sensor values ​​obtained from various sensors included in the thermal management circuit 100, user operations received by the HMI 600, and outputs the generated control commands to the thermal management circuit 100. This allows, for example, the states of the three-way valve 113, the six-way valve 180, and the six-way valve 190 to be switched.

[0025] The HMI600 consists of a touchscreen display, control panel, console, etc. The HMI600 receives user input to control the thermal management system 1. The HMI600 outputs signals indicating user input to the ECU500.

[0026] The hexagonal valve 180 is provided with six ports P1 to P6. Port P1 is an inlet port through which the heat transfer medium flows in from the chiller 160 (flow path 161a). Port P2 is an outlet port through which the heat transfer medium flows out toward the low-temperature radiator 122. Port P3 is an inlet port through which the heat transfer medium flows in from the low-temperature radiator 122. Port P4 is an outlet port through which the heat transfer medium flows out toward the unit circuit 130 (PCU 133, etc.). Port P5 is an inlet port through which the heat transfer medium flows in from the hexagonal valve 190 via flow path 6. Port P6 is an outlet port through which the heat transfer medium flows out toward the hexagonal valve 190 via flow path 5. Flow paths 5 and 6 are flow paths formed within the case 200a (by internal lids, grooves, etc.).

[0027] The hexagonal valve 190 is provided with six ports P11 to P16. Port P11 is an inlet port through which the heat transfer medium flows in from the unit circuit 130 (PCU 133, etc.). Port P12 is an outlet port through which the heat transfer medium flows out toward the battery circuit 170. Port P13 is an inlet port through which the heat transfer medium flows in from the battery circuit 170. Port P14 is an outlet port through which the heat transfer medium flows out toward the chiller 160 (flow path 161a). Port P15 is an inlet port through which the heat transfer medium flows in from the hexagonal valve 180 via flow path 5. Port P16 is an outlet port through which the heat transfer medium flows out toward the hexagonal valve 180 via flow path 6.

[0028] The ECU 500 controls the state of the six-way valves 180 and 190. This switches the flow path of the heat transfer medium in each of the six-way valves 180 and 190. As a result, the flow path of the heat transfer medium in the thermal management circuit 100 is switched. The six-way valves 180 and 190 have identical configurations.

[0029] Figure 2 is an exploded perspective view showing the configurations of the hexagonal valve 180 and the hexagonal valve 190, respectively. The hexagonal valve 180 includes a disc-shaped upper body 181, a disc-shaped drive plate 182, and a disc-shaped lower body 183. The upper body 181, drive plate 182, and lower body 183 are stacked in that order from the Z1 side. That is, the drive plate 182 is sandwiched in the Z direction by the upper body 181 and the lower body 183. The Z direction is the direction in which the rotation center line α(β) extends. The Z direction is an example of the "axial direction" in this disclosure. The upper body 181 and the drive plate 182 are examples of the "second valve body" and "third valve body" in this disclosure, respectively. The lower body 183 is an example of the "first valve body" in this disclosure.

[0030] The lower body 183 is fixed and does not rotate. The upper body 181 and drive plate 182 rotate integrally on the Z1 side of the lower body 183 around the rotation centerline α. This changes the relative position (rotation angle in the circumferential direction) of the lower body 183 and each of the upper body 181 and drive plate 182. Alternatively, the upper body 181 and drive plate 182 may be fixed, and the lower body 183 may rotate.

[0031] The upper body 181 has an annular shape. The upper body 181 is provided with grooves 181a to 181e. Each of the grooves 181a to 181e is formed in a fan shape so as to extend circumferentially around the rotation center line α. Each of the grooves 181a to 181e is open on the side of the lower body 183 (Z2 side). Each of the grooves 181a to 181e is an example of the "second groove" of this disclosure.

[0032] The grooves 181a to 181c are arranged in a circumferential direction in the outer peripheral region of the upper body 181. The circumferential length of groove 181a is greater than the circumferential lengths of grooves 181b and 181c, respectively. Specifically, groove 181a has a sector shape with a central angle of approximately 120 degrees. Grooves 181b and 181c each have a sector shape with a central angle of approximately 90 degrees.

[0033] Each of the grooves 181d and 181e is positioned to face each other in the circumferential region of the upper body 181, in a region closer to the inner circumference than grooves 181a to 181c. The circumferential length of groove 181d is greater than the circumferential length of groove 181e. Specifically, groove 181d has a sector shape with a central angle of approximately 210 degrees. Groove 181e has a sector shape with a central angle of approximately 90 degrees.

[0034] The drive plate 182 is provided with through holes 182a to 182j. Each of the through holes 182a to 182j is formed to penetrate the drive plate 182 in the Z direction. Each of the through holes 182a to 182j is formed in a fan shape so as to extend circumferentially around the rotation center line α. The through holes 182a to 182j are provided so as to be offset from each other in the circumferential direction so as not to overlap with each other in the radial direction.

[0035] The through holes 182a to 182f are arranged circumferentially in the outer peripheral region of the drive plate 182. The circumferential lengths of through holes 182a and 182b are greater than the circumferential lengths of through holes 182c to 182j.

[0036] Each of the through holes 182a and 182b is located in a position that overlaps with the groove 181a in the Z direction. Each of the through holes 182c and 182d is located in a position that overlaps with the groove 181b in the Z direction. Each of the through holes 182e and 182f is located in a position that overlaps with the groove 181c in the Z direction.

[0037] The through holes 182g to 182j are arranged circumferentially in the region of the drive plate 182 that is on the inner side of the through holes 182a to 182f.

[0038] Each of the through holes 182g and 182j is positioned to overlap with the groove 181d in the Z direction. Each of the through holes 182h and 182i is positioned to overlap with the groove 181e in the Z direction.

[0039] The lower body 183 includes an outer peripheral wall 184, an inner peripheral wall 185, and six compartment walls 186. The outer peripheral wall 184 is provided to extend in an annular shape around the rotational centerline α. The inner peripheral wall 185 extends in an annular shape around the rotational centerline α and is formed closer to the rotational centerline α than the outer peripheral wall 184.

[0040] The six partition walls 186 are formed to connect the inner circumferential wall 185 and the outer circumferential wall 184. The six partition walls 186 are arranged at equal intervals in the circumferential direction around the rotational centerline α.

[0041] The lower body 183 is provided with six fan-shaped grooves 187 formed by six partition walls 186 between the outer peripheral wall 184 and the inner peripheral wall 185. The grooves 187 are an example of the "first groove" of this disclosure.

[0042] Each of the six grooves 187 has an opening 187a on the upper body 181 side (Z1 side) and an opening 187b formed in the outer peripheral wall 184. The openings 187b of the six grooves 187 correspond to ports P1 to P6 (communicating with ports P1 to P6). The openings 187a and 187b are examples of the "first opening" and "second opening" of this disclosure, respectively. The flow pipes (flow channels 161a and 6, etc.) connected to ports P1, P3, and P5 are examples of the "first flow pipe" of this disclosure. The flow pipes (flow channels 5, etc.) connected to ports P2, P4, and P6 are examples of the "second flow pipe" of this disclosure.

[0043] The hexagonal valve 190 has the same configuration as the hexagonal valve 180. The hexagonal valve 190 includes an upper body 191, a drive plate 192, and a lower body 193, each having the same configuration as the upper body 181, drive plate 182, and lower body 183, respectively. The upper body 191 and the drive plate 192 each rotate around the rotation centerline β. The upper body 191 and the drive plate 192 are examples of the "second valve body" and "third valve body" of this disclosure, respectively. The lower body 193 is an example of the "first valve body" of this disclosure.

[0044] The upper body 191 has grooves 191a to 191e formed thereon, corresponding to grooves 181a to 181e of the upper body 181. The drive plate 192 has through holes 192a to 192j formed thereon, corresponding to through holes 182a to 182j of the drive plate 182. The lower body 193 is provided with an outer periphery wall 194, an inner periphery wall 185, a partition wall 186, and a groove 187, corresponding to the outer periphery wall 184, an inner periphery wall 185, a partition wall 186, and a groove 187 of the lower body 183, respectively. Note that groove 197 is an example of the "first groove" of this disclosure.

[0045] Each of the six grooves 197 has an opening 197a on the upper body 191 side (Z1 side) and an opening 197b formed in the outer peripheral wall 194. The openings 197b of the six grooves 197 correspond to ports P11 to P16 (communicating with ports P11 to P16). The openings 197a and 197b are examples of the "first opening" and "second opening" of this disclosure, respectively. The flow pipes (flow path 5, etc.) connected to ports P11, P13, and P15 are examples of the "first flow pipe" of this disclosure. The flow pipes (flow path 161a and flow path 6, etc.) connected to ports P12, P14, and P16 are examples of the "second flow pipe" of this disclosure.

[0046] Figure 3 shows the multiple states (phase states) that the hexagonal valve 180 can take. Note that the configurations of the hexagonal valves 180 and 190 are identical, so only the hexagonal valve 180 will be explained in Figure 3.

[0047] As shown in Figure 3, in the first embodiment, the hexagonal valve 180 rotates the drive plate 182 and the upper body 181, thereby switching the overlap state in the Z direction (overlapping state when viewed along the Z direction) of each of the six grooves 187a of the lower body 183, the grooves 181a to 181e of the upper body 181, and the through holes 182a to 182j of the drive plate 182.

[0048] In phase No. 1, the groove 181a of the upper body 181, the through holes 182a and 182b of the drive plate 182, and the grooves 187(P2) and 187(P1) of the lower body 183 overlap in the Z direction. As a result, ports P1 and P2 are in communication.

[0049] In phase No. 1, the groove 181b of the upper body 181, the through holes 182c and 182d of the drive plate 182, and the grooves 187(P5) and 187(P6) of the lower body 183 overlap in the Z direction. As a result, ports P5 and P6 are in communication.

[0050] In phase No. 1, the groove 181c of the upper body 181, the through holes 182e and 182f of the drive plate 182, and the grooves 187(P3) and 187(P4) of the lower body 183 overlap in the Z direction. As a result, ports P3 and P4 are in communication.

[0051] Phase No. 2 is a state in which the drive plate 182 and the upper body 181 are rotated 30 degrees counterclockwise around the rotation center line α (see Figure 2) relative to Phase No. 1.

[0052] In phase No. 2, the groove 181a of the upper body 181, the through holes 182a and 182b of the drive plate 182, and the grooves 187(P2) and 187(P1) of the lower body 183 overlap in the Z direction. As a result, ports P1 and P2 are in communication.

[0053] In phase No. 2, the groove 181d of the upper body 181, the through holes 182g and 182j of the drive plate 182, and the grooves 187(P3) and 187(P6) of the lower body 183 overlap in the Z direction. As a result, ports P3 and P6 are in communication.

[0054] In phase No. 2, the groove 181e of the upper body 181, the through holes 182h and 182i of the drive plate 182, and the grooves 187(P4) and 187(P5) of the lower body 183 overlap in the Z direction. As a result, ports P4 and P5 are in communication.

[0055] Phase No. 3 is the state in which the drive plate 182 and the upper body 181 are rotated 30 degrees counterclockwise around the rotation center line α (see Figure 2) relative to Phase No. 2.

[0056] In phase No. 3, the groove 181a of the upper body 181, the through holes 182a and 182b of the drive plate 182, and the grooves 187(P2) and 187(P3) of the lower body 183 overlap in the Z direction. As a result, ports P2 and P3 are in communication.

[0057] In phase No. 3, the groove 181b of the upper body 181, the through holes 182c and 182d of the drive plate 182, and the grooves 187(P1) and 187(P6) of the lower body 183 overlap in the Z direction. As a result, ports P1 and P6 are in communication.

[0058] In phase No. 3, the groove 181c of the upper body 181, the through holes 182e and 182f of the drive plate 182, and the grooves 187(P4) and 187(P5) of the lower body 183 overlap in the Z direction. As a result, ports P4 and P5 are in communication.

[0059] Phase No. 4 is the state in which the drive plate 182 and the upper body 181 are rotated 30 degrees counterclockwise around the rotation center line α (see Figure 2) relative to Phase No. 3.

[0060] In phase No. 4, the groove 181a of the upper body 181, the through holes 182a and 182b of the drive plate 182, and the grooves 187(P2) and 187(P3) of the lower body 183 overlap in the Z direction. As a result, ports P2 and P3 are in communication.

[0061] In phase No. 4, the groove 181d of the upper body 181, the through holes 182g and 182j of the drive plate 182, and the grooves 187(P1) and 187(P4) of the lower body 183 overlap in the Z direction. As a result, ports P1 and P4 are in communication.

[0062] In phase No. 4, the groove 181e of the upper body 181, the through holes 182h and 182i of the drive plate 182, and the grooves 187(P5) and 187(P6) of the lower body 183 overlap in the Z direction. As a result, ports P5 and P6 are in communication.

[0063] Phase No. 5 is the state in which the drive plate 182 and the upper body 181 are rotated 60 degrees counterclockwise around the rotation center line α (see Figure 2) relative to Phase No. 4.

[0064] In phase No. 5, the groove 181a of the upper body 181, the through holes 182a and 182b of the drive plate 182, and the grooves 187(P3) and 187(P4) of the lower body 183 overlap in the Z direction. As a result, ports P3 and P4 are in communication.

[0065] In phase No. 5, the groove 181d of the upper body 181, the through holes 182g and 182j of the drive plate 182, and the grooves 187(P2) and 187(P5) of the lower body 183 overlap in the Z direction. As a result, ports P2 and P5 are in communication.

[0066] In phase No. 5, the groove 181e of the upper body 181, the through holes 182h and 182i of the drive plate 182, and the grooves 187(P1) and 187(P6) of the lower body 183 overlap in the Z direction. As a result, ports P1 and P6 are in communication.

[0067] Although it is possible to form phase patterns other than those described above by adjusting the rotation angles of the drive plate 182 and the upper body 181, the communication state of the flow channels formed by these other phase patterns will be the same as the communication state of the flow channels in any of the above phase patterns (No. 1 to 5). Therefore, the explanation of phase patterns other than No. 1 to 5 will be omitted.

[0068] By setting the phase patterns of the hexagonal valves 180 and 190 to one of phases No. 1 to 5 shown in Figure 3, one of circuit patterns A to M (see Figures 4 and 5) is formed in the thermal management circuit 100.

[0069] As shown in Figure 4, circuit pattern A is the circuit when each of the six-way valves 180 and 190 is in phase No. 1. A closed circuit is formed through which the heat transfer medium and other fluids flow to the PCU 133, battery 172, chiller 160, and low-temperature radiator 122. In circuit pattern A, the PCU 133 and battery 172 can be cooled by the low-temperature radiator 122 and chiller 160. Furthermore, heat pump heating is possible using the heat from the PCU 133 and battery 172. Note that circuit pattern A is also formed when the combination of six-way valves 180 / 190 is No. 1 / No. 2, No. 1 / No. 5, No. 2 / No. 1, or No. 5 / No. 1.

[0070] Circuit pattern B is the circuit when each of the six-way valves 180 and 190 is in phase No. 5. In this case, a first closed circuit is formed through which the heat transfer medium flows between the PCU 133 and the low-temperature radiator 122, and a second closed circuit is formed through which the heat transfer medium flows between the battery 172 and the chiller 160. In circuit pattern B, the PCU 133 can be cooled by the low-temperature radiator 122, and the battery 172 can be cooled by the chiller 160.

[0071] Circuit pattern C is the circuit when each of the six-way valves 180 and 190 is in phase No. 2. In this case, a first closed circuit is formed through which the heat transfer medium flows between the PCU 133 and the battery 172, and a second closed circuit is formed through which the heat transfer medium flows between the low-temperature radiator 122 and the chiller 160. In circuit pattern C, the battery 172 can be heated by the heat from the PCU 133, and heat pump heating using outside air is possible.

[0072] Circuit pattern D is the circuit when the hexagonal valves 180 and 190 are in phase No. 4 and phase No. 1 states, respectively. In this case, a first closed circuit is formed through which the heat transfer medium flows through the PCU 133, battery 172, and chiller 160, and a second closed circuit is formed in which the low-temperature radiator 122 is independent (disconnected). In circuit pattern D, the heat from the PCU 133 enables the battery 172 to be heated and heated, and the heat from the PCU 133 and battery 172 enables heat pump heating. In addition, heat dissipation from the low-temperature radiator 122 is suppressed. Note that circuit pattern D can also be formed if the combination of hexagonal valves 180 / 190 is No. 3 / No. 1, No. 4 / No. 2, or No. 4 / No. 5, in addition to the above combination of phase patterns.

[0073] Circuit pattern E is the circuit when the hexagonal valves 180 and 190 are in phase No. 1 and phase No. 4 states, respectively. In this case, a first closed circuit is formed through which the heat transfer medium flows to the PCU 133, chiller 160, and low-temperature radiator 122, and a second closed circuit is formed with the battery 172 independent (disconnected). In circuit pattern E, heating is possible using the heat from the PCU 133, and excess heat can be dissipated from the low-temperature radiator 122. In addition, the temperature drop of the battery 172 is suppressed. Note that circuit pattern E can also be formed if the combination of hexagonal valves 180 / 190 is No. 1 / No. 3, No. 2 / No. 4, or No. 5 / No. 4, in addition to the above combination of phase patterns.

[0074] Circuit pattern F is the circuit when each of the six-way valves 180 and 190 is in phase No. 4. In this case, a first closed circuit is formed through which the heat transfer medium flows to the PCU 133 and chiller 160, a second closed circuit is formed with the battery 172 isolated (disconnected), and a third closed circuit is formed with the low-temperature radiator 122 isolated (disconnected). In circuit pattern F, the PCU 133 can be cooled by the chiller 160, and heat pump heating using the heat from the PCU 133 is possible. In addition, the temperature drop of the battery 172 and heat dissipation from the low-temperature radiator 122 are suppressed. Note that in addition to the above combination of phase patterns, circuit pattern F is also formed when the combination of six-way valves 180 / 190 is No. 3 / No. 4 or No. 4 / No. 3.

[0075] Circuit pattern G is the circuit when the hexagonal valves 180 and 190 are in phase No. 5 and phase No. 2 states, respectively. In this case, a first closed circuit is formed through which a heat transfer medium flows to the PCU 133, battery 172, and low-temperature radiator 122, and a second closed circuit is formed with an independent flow path 161a (see Figure 1) through which the chiller 160 is provided. In circuit pattern G, the PCU 133 can be cooled by the low-temperature radiator 122, and the heat from the PCU 133 can be used to raise the temperature of the battery 172.

[0076] Circuit pattern H is the circuit when the hexagonal valves 180 and 190 are in phase No. 2 and phase No. 5 states, respectively. In this case, a first closed circuit is formed through which a heat transfer medium flows through the battery 172, the low-temperature radiator 122, and the chiller 160, and a second closed circuit is formed in which the unit circuit 130, including the PCU 133, is independent. In circuit pattern H, heat storage is possible in the unit circuit 130 (PCU 133), and the battery 172 is cooled by the low-temperature radiator 122 and the chiller 160. Furthermore, heat pump heating using the heat from the battery 172 is possible.

[0077] Circuit pattern I is the circuit when the hexagonal valves 180 and 190 are in phase No. 5 and phase No. 3 states, respectively. In this case, a first closed circuit is formed through which the heat transfer medium flows to the low-temperature radiator 122 and PCU 133, a second closed circuit is formed with the flow path 161a (see Figure 1) where the chiller 160 is located being independent, and a third closed circuit is formed with the battery 172 being independent (disconnected). Circuit pattern I makes it possible to defrost the low-temperature radiator 122 and suppress the temperature drop of the battery 172.

[0078] Circuit pattern J is the circuit when the hexagonal valves 180 and 190 are in phase No. 3 and phase No. 5 states, respectively. In this case, a first closed circuit is formed through which the heat transfer medium flows through the battery 172 and chiller 160, a second closed circuit is formed with the unit circuit 130 including the PCU 133 etc. being independent, and a third closed circuit is formed with the low-temperature radiator 122 being independent (disconnected). Circuit pattern J enables heat storage in the unit circuit 130 (PCU 133), cooling of the battery 172 by the chiller 160, and heat pump heating using the heat from the battery 172. In addition, heat dissipation from the low-temperature radiator 122 is suppressed.

[0079] Circuit pattern K is the circuit when the hexagonal valves 180 and 190 are in phase No. 2 and phase No. 3 states, respectively. In this case, a first closed circuit is formed in which the unit circuit 130, including the PCU 133, is independent; a second closed circuit is formed in which the heat transfer medium flows through the low-temperature radiator 122 and chiller 160; and a third closed circuit is formed in which the battery 172 is independent (disconnected). Circuit pattern K enables heat storage in the unit circuit 130 (PCU 133) and heat pump heating using outside air. In addition, the temperature drop in the battery 172 is suppressed.

[0080] Circuit pattern L is the circuit when the hexagonal valves 180 and 190 are in phase No. 3 and phase No. 2 states, respectively. In this case, a first closed circuit is formed through which the heat transfer medium flows between the PCU 133 and the battery 172, a second closed circuit is formed with an independent flow path 161a (see Figure 1) where the chiller 160 is provided, and a third closed circuit is formed with an independent (disconnected) low-temperature radiator 122. In circuit pattern L, it is possible to raise the temperature of the battery 172 using the heat generated in the PCU 133.

[0081] Circuit pattern M is the circuit when each of the hexagonal valves 180 and 190 is in phase No. 3. In this case, a first closed circuit is formed with the unit circuit 130 including the PCU 133, etc., as an independent circuit, a second closed circuit is formed with the flow path 161a (see Figure 1) where the chiller 160 is provided as an independent circuit, a third closed circuit is formed with the low-temperature radiator 122 as an independent (disconnected) circuit, and a fourth closed circuit is formed with the battery 172 as an independent (disconnected) circuit. In circuit pattern M, heat storage is possible in the unit circuit 130 (PCU 133).

[0082] As described above, in the first embodiment, the hexagonal valves 180 and 190 make it possible to switch the state of the thermal management circuit 100 to one of circuit patterns A to M.

[0083] [Second Embodiment] In the second embodiment, unlike the first embodiment in which a six-way valve 180 (190) is used, a six-way valve 280 is used. Components identical to those in the first embodiment are denoted by the same reference numerals as in the first embodiment, and repeated explanations will not be provided.

[0084] Figures 6 and 7 are cross-sectional views showing a hexagonal valve 280 provided in the switching device 300 in the second embodiment. In the second embodiment, as in the first embodiment, a further hexagonal valve having the same configuration as the hexagonal valve 280 is provided, but for the sake of simplicity, only the hexagonal valve 280 will be described. Note that the hexagonal valve 280 is an example of a "valve body unit" in this disclosure.

[0085] The hexagonal valve 280 includes a cylindrical inner circumferential unit 210 and an annular outer circumferential unit 220. The outer circumferential unit 220 is provided so as to surround the inner circumferential unit 210 from the outer circumferential side. Figure 6 is a cross-sectional view (a cross-sectional view extending in a direction perpendicular to the Z direction) of the disc-shaped upper portion 211, which is the Z1 side portion of the inner circumferential unit 210. Figure 7 is a cross-sectional view (a cross-sectional view extending in a direction perpendicular to the Z direction) of the disc-shaped lower portion 212, which is the Z2 side portion of the inner circumferential unit 210. The upper portion 211 is integrally formed with the lower portion 212. The upper portion 211 and the lower portion 212 are examples of the "first portion" and "second portion" of this disclosure, respectively.

[0086] The outer circumferential unit 220 is fixed and does not rotate. The inner circumferential unit 210 rotates around the rotation centerline γ (see Figure 8). This changes the relative position (rotation angle in the circumferential direction) between the inner circumferential unit 210 and the outer circumferential unit 220. Alternatively, the outer circumferential unit 220 may rotate while the inner circumferential unit 210 remains fixed.

[0087] The inner circumferential unit 210 includes an outer circumferential wall 213 and an inner circumferential wall 214. Each of the outer circumferential wall 213 and the inner circumferential wall 214 is formed to extend in an annular shape around the rotational centerline γ. The inner circumferential wall 214 is located closer to the rotational centerline γ than the outer circumferential wall 213. Each of the outer circumferential wall 213 and the inner circumferential wall 214 extends in the Z direction across the upper portion 211 and the lower portion 212. The outer circumferential wall 213 is an example of the "first outer circumferential wall" of this disclosure.

[0088] As shown in Figure 6, the upper portion 211 of the inner circumferential unit 210 has a plurality of fan-shaped grooves 215. The plurality of grooves 215 include groove 215a, groove 215b, and groove 215c. Grooves 215a, 215b, and 215c each include openings 215d, 215e, and 215f, respectively. Each of the openings 215d to 215f is formed in the region of the outer circumferential wall 213 corresponding to the upper portion 211. The grooves 215 (215a to 215c) are examples of the "first inner circumferential groove" of this disclosure. Also, each of the openings 215d to 215f is an example of the "first opening" of this disclosure.

[0089] Groove 215a has a sector shape with a central angle of approximately 120 degrees. Grooves 215b and 215c each have a sector shape with a central angle of approximately 90 degrees.

[0090] Multiple partition walls 216 are provided between the grooves 215. The multiple partition walls 216 include partition wall 216a, partition wall 216b, and partition wall 216c. Each of partition walls 216a and 216b has a sector shape with a central angle of approximately 30 degrees. Partition wall 216c has a plate-like shape with a circumferential thickness smaller than each of partition walls 216a and 216b.

[0091] As shown in Figure 7, a plurality of grooves 217 are formed in the lower portion 212 of the inner circumferential unit 210. The plurality of grooves 217 include groove 217a and groove 217b. Note that groove 217 (217a, 217b) is an example of the "second inner circumferential groove" of this disclosure.

[0092] The groove 217a has a fan-shaped form. The groove 217a has an opening 217c formed in the region of the outer peripheral wall 213 corresponding to the lower portion 212. The opening 217c is an example of the "second opening" of this disclosure.

[0093] As shown in Figure 7, the groove 217b extends across the inner circumferential unit 210. Specifically, the groove 217b has a V-shape when viewed from the Z1 side. The groove 217b has openings 217d and 217e, which are provided on opposite sides of the rotation centerline γ. Each of the openings 217d and 217e is formed in a region corresponding to the lower portion 212 of the outer circumferential wall 213. Note that each of the openings 217d and 217e is an example of the "second opening" of this disclosure.

[0094] As shown in Figures 6 and 7, the outer peripheral unit 220 includes an outer peripheral wall 221. The outer peripheral wall 221 is formed to extend in an annular shape around the rotational center line γ. Note that the outer peripheral wall 221 is an example of the "second outer peripheral wall" of this disclosure.

[0095] The outer peripheral unit 220 includes six partition walls 222 provided between the outer peripheral wall 221 and the outer peripheral wall 213 of the inner peripheral unit 210. The six partition walls 222 are arranged circumferentially at equal intervals around the rotational centerline γ. Each of the six partition walls 222 is formed to extend radially in the outer peripheral unit 220.

[0096] The outer peripheral unit 220 includes an inner peripheral wall 223. The inner peripheral wall 223 is formed to extend in an annular shape around the rotational centerline γ. The inner peripheral wall 223 is positioned closer to the rotational centerline γ than the outer peripheral wall 221. Each of the six partition walls 222 is provided to connect the outer peripheral wall 221 and the inner peripheral wall 223. Between the outer peripheral wall 221 and the outer peripheral wall 213 (inner peripheral wall 222), the six partition walls 222 form six fan-shaped grooves 224.

[0097] The inner surface of the inner circumferential wall 223 is covered by a sealing member 225. The sealing member 225 is positioned radially so as to be in close contact with the outer circumferential wall 213 of the inner circumferential unit 210. This makes it possible for the sealing member 225 to prevent the movement (leakage) of the heat transfer medium between adjacent grooves 224 in the circumferential direction, with the partition wall 222 in between.

[0098] The outer peripheral wall 221 of the outer peripheral unit 220 is provided with six openings 221a. Each of the six grooves 224 has an opening 221a (communicating with the opening 221a). In other words, the six openings 221a communicate with each other's different grooves 224. The inner peripheral wall 223 of the outer peripheral unit 220 is provided with six openings 223a. Each of the six grooves 224 has an opening 223a (communicating with the opening 223a). In other words, the six openings 223a communicate with each other's different grooves 224. Note that opening 221a is an example of the "third opening" of this disclosure.

[0099] The six openings 221a of the outer peripheral unit 220 each correspond to ports P1 to P6 (and are in communication with ports P1 to P6). A hexagonal valve (not shown) having the same configuration as the hexagonal valve 280 has six openings corresponding to ports P11 to P16.

[0100] In the example shown in Figure 6, ports P1 and P2 are connected through grooves 215c and 224. Ports P3 and P4 are connected through grooves 215b and 224. Ports P5 and P6 are connected through grooves 215a and 224. In the example shown in Figure 7, the ports are not connected to each other.

[0101] Figures 9 and 10 show the state after rotating the inner circumferential unit 210 30 degrees counterclockwise around the rotation centerline γ, respectively, from the state shown in Figures 6 and 7. In the example shown in Figure 9, ports P5 and P6 are in communication through grooves 215a and 224.

[0102] In the example shown in Figure 10, ports P2 and P3 are connected through grooves 217a and 224. Ports P1 and P4 are connected through grooves 217b and 224.

[0103] As described above, the combination of communicating ports can be adjusted by changing the relative rotation angle between the outer peripheral unit 220 and the inner peripheral unit 210. Note that the circuit patterns that can be realized using the hexagonal valve 280 are the same as those in the first embodiment described above, so a repeated explanation will not be provided.

[0104] The other components are the same as those of the first embodiment described above, so no further explanation will be given.

[0105] In the above embodiment, an example is shown in which a high-temperature circuit 110 is provided in the thermal management circuit, but the disclosure is not limited thereto. The thermal management circuit does not need to be provided with a high-temperature circuit 110.

[0106] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of this disclosure is indicated by the claims rather than by the description of the embodiments above, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Explanation of symbols]

[0107] 5, 6, 161a Flow path (flow pipe), 180, 190, 280 Hexagonal valve (valve body unit), 181, 191 Upper body (second valve body), 181a~181e, 191a~191e Groove (second groove), 182, 192 Drive plate (third valve body), 182a~182j, 192a~192j Through hole, 183, 193 Lower body (first valve body), 184, 194 Outer peripheral wall, 185, 195 Inner peripheral wall, 186, 196 Compartment wall, 187, 197 Groove (first groove), 187a, 197a Opening (first opening), 187b, 197b Opening (second opening), 200, 300 Switching device, 210 Inner peripheral unit, 211 Upper part (first part), 212 Lower part (second part), 213 Outer wall (first outer wall), 214 Inner wall, 215, 215a~215c Groove (first inner groove), 215d~215f Opening (first opening), 217, 217a, 217b Groove (second inner groove), 217c~217e opening (second opening), 220 outer unit, 221 outer wall (second outer wall), 221a opening (third opening), 222 partition wall, 224 outer groove, Z direction (axial direction), α, β, γ rotation center line.

Claims

1. A switching device installed in a thermal management circuit through which a heat transfer medium flows, At least one valve body unit, The system comprises a plurality of flow pipes connected to at least one valve unit, The aforementioned plurality of supply pipes include a plurality of first supply pipes and a plurality of second supply pipes, The at least one valve unit is A disc-shaped first valve body, A disc-shaped second valve body is provided so as to be rotatable relative to the first valve body about a rotational centerline, and is positioned on one side of the first valve body in the axial direction from which the rotational centerline extends. The valve body includes a disc-shaped third valve body that is sandwiched in the axial direction by the first valve body and the second valve body, and is rotatable relative to the first valve body about the rotation centerline, The first valve body is An outer peripheral wall extending in a ring shape with respect to the aforementioned rotational center line, An inner circumferential wall extending in an annular shape with respect to the rotational centerline and formed on the side of the rotational centerline that is closer to the rotational centerline than the outer circumferential wall, It includes a plurality of partition walls formed to connect the inner circumferential wall and the outer circumferential wall, The first valve body is provided with a plurality of fan-shaped first grooves formed by the plurality of partition walls between the outer peripheral wall and the inner peripheral wall, Each of the plurality of first grooves has a first opening on the side of the second valve body and a second opening formed in the outer peripheral wall. A portion of the plurality of first grooves, the second openings, allow the heat transfer medium to flow into the first valve body through the plurality of first flow pipes, and the remaining portion of the plurality of first grooves, the second openings, allow the heat transfer medium to flow out from the first valve body through the plurality of second flow pipes. The second valve body is provided with a plurality of fan-shaped second grooves that are formed to extend circumferentially around the rotational centerline and open toward the first valve body. The third valve body is provided with a plurality of through holes that penetrate the third valve body in the axial direction and are arranged circumferentially around the rotational centerline. As each of the second valve body and the third valve body rotates relative to the first valve body, the overlapping state in the axial direction of the first opening of each of the plurality of first grooves, the plurality of second grooves, and the plurality of through holes is switched. The aforementioned multiple partition walls are composed of six partition walls, and the switching device is made up of these six partition walls.

2. A switching device installed in a thermal management circuit through which a heat transfer medium flows, At least one valve body unit, The system comprises a plurality of flow pipes connected to at least one valve unit, The aforementioned plurality of supply pipes include a plurality of first supply pipes and a plurality of second supply pipes, The at least one valve unit is A cylindrical inner circumferential unit is integrally formed by stacking a disc-shaped first part and a disc-shaped second part, It includes an annular outer peripheral unit that is provided so as to be rotatable relative to the inner peripheral unit about a rotational centerline and is arranged to surround the inner peripheral unit from the outer peripheral side, The inner circumference unit is, A first outer peripheral wall extending in a ring shape with respect to the aforementioned rotational center line, It includes an inner circumferential wall that extends in an annular shape with respect to the rotational centerline and is formed on the side of the rotational centerline that is closer to the first outer circumferential wall, The inner circumferential unit includes: A plurality of fan-shaped first inner circumferential grooves, each having a first opening formed at a position corresponding to the first portion of the first outer circumferential wall, A plurality of second inner circumferential groove portions are formed, each of which is provided with a second opening formed at a position corresponding to the second portion of the first outer circumferential wall, The outer peripheral unit is, A second outer peripheral wall extending in a ring shape around the aforementioned rotational centerline, The system includes a plurality of partition walls provided between the second outer peripheral wall and the first outer peripheral wall so as to extend radially in the outer peripheral unit, Between the second outer peripheral wall and the first outer peripheral wall, a plurality of fan-shaped outer peripheral side grooves are formed by the plurality of partition walls. Each of the aforementioned plurality of outer peripheral grooves has a third opening formed in the second outer peripheral wall, A portion of the plurality of outer peripheral grooves, the third opening, allows the heat transfer medium to flow into the outer peripheral unit through the plurality of first flow pipes, and the remaining portion of the plurality of outer peripheral grooves, the third opening, allows the heat transfer medium to flow out of the outer peripheral unit through the plurality of second flow pipes. As the outer peripheral unit rotates relative to the inner peripheral unit, the overlapping state in the radial direction between the plurality of outer peripheral grooves and each of the first and second openings is switched. The aforementioned multiple partition walls are composed of six partition walls, and the switching device is made up of these six partition walls.

3. The switching device according to claim 1 or 2, wherein the at least one valve unit is composed of two valve units.

Images