A high-power thick film heating device for new energy vehicles

Abstract

The utility model provides a kind of high-power thick film heating device for new energy vehicle, including thick film heating plate, the upper surface of thick film heating plate is equipped with ceramic dielectric surface layer, the lower surface of thick film heating plate is equipped with metal base plate face, the upper of thick film heating plate is equipped with upper flow channel cavity mechanism, and lower is equipped with lower flow channel cavity mechanism;The utility model is by using single-layer thick film heating plate, and cooperate upper flow channel cavity mechanism and lower flow channel cavity mechanism to carry out up and down parallel flow guiding to heat conducting medium, so as to utilize heat conducting medium to synchronously absorb the heat of the upper and lower two sides of thick film heating plate, so as to reach double-sided heat exchange effect, to improve thick film heating device heat exchange coefficient and heat exchange area, to break through the maximum power density limit that thick film heating plate can use on traditional design, make thick film heating device realize higher electric power output under the same area, and simultaneously due to the improvement of heat exchange capacity, the thermal conversion efficiency of its product is also improved.

Description

Technical Field

[0001] This utility model relates to a heating device, specifically a high-power thick-film heating device for new energy vehicles, belonging to the field of new energy vehicle coolant heating technology. Background Technology

[0002] With the increasing capacity of high-voltage batteries in vehicles, and the growing demands for cabin heating, defrosting, and defogging, the power requirements for electric heaters in vehicles are constantly increasing. This also places higher demands on the size, efficiency, and cost of the products. Due to the maximum power density limitation of thick-film heating plates, thick-film heaters need to increase the planar area of ​​the heating plate to achieve increased power. Currently known design solutions on the market are typically as follows:

[0003] Option 1: Achieve the arrangement of a large-area thick-film heating plate by increasing the size of the heater;

[0004] Option 2: By using a two-layer heating plate design, the area of ​​the thick-film heating plate can be increased, thereby increasing the power.

[0005] However, the product of Scheme 1 has a large planar size, and the flatness of the heating plate is difficult to meet the design requirements, and the cost is high. Scheme 2 has low heat conversion efficiency, complex structural design and low reliability. Moreover, the parts and overall manufacturing cost of this scheme are high. Therefore, a high-power thick film heating device for new energy vehicles is proposed. Summary of the Invention

[0006] In view of this, the present invention provides a high-power thick film heating device for new energy vehicles to solve or alleviate the technical problems existing in the prior art, or at least provide a beneficial option.

[0007] The technical solution of this utility model embodiment is implemented as follows: A high-power thick film heating device for new energy vehicles includes a thick film heating plate. The upper surface of the thick film heating plate is provided with a ceramic dielectric surface layer, and the lower surface of the thick film heating plate is provided with a metal substrate surface. An upper flow channel chamber mechanism is provided above the thick film heating plate, and a lower flow channel chamber mechanism is provided below the thick film heating plate. The upper flow channel chamber mechanism and the lower flow channel chamber mechanism are connected by bolts and threads. The inlet and outlet of the upper flow channel chamber mechanism and the lower flow channel chamber mechanism are interconnected. A thermally conductive silicone pad is applied between the ceramic dielectric surface layer and the upper flow channel chamber mechanism, and a thermally conductive silicone coating is applied between the metal substrate surface and the lower flow channel chamber mechanism.

[0008] The upper flow channel chamber mechanism and the lower flow channel chamber mechanism are used to guide the heat exchange medium entering the thick film heating device in parallel from top to bottom, and simultaneously absorb the heat from both sides of the thick film heating plate, so as to perform double-sided heat exchange on a single thick film heating plate.

[0009] More preferably, the upper flow channel chamber mechanism includes an upper flow channel frame, an upper flow channel chamber inlet, an upper flow channel chamber outlet, and an upper flow channel cover plate;

[0010] The upper flow channel chamber inlet is located on one side of the inner wall of the upper flow channel frame, and the upper flow channel chamber outlet is located on the other side of the inner wall of the upper flow channel frame. The upper flow channel cover is fixed and sealed to the middle of the inner wall of the upper flow channel frame by friction welding or sealing rubber strip. The thermally conductive silicone pad is applied between the upper surface of the ceramic medium surface layer and the lower surface of the upper flow channel frame.

[0011] More preferably, the downstream flow chamber mechanism includes a downstream flow chamber frame, a downstream flow chamber inlet, a downstream flow chamber outlet, a total flow channel inlet, a total flow channel outlet, and a downstream flow channel cover plate;

[0012] The thermally conductive silicone coating is applied between the upper surface of the lower flow channel frame and the lower surface of the metal substrate. The lower flow channel frame is connected to the bottom of the upper flow channel frame by bolts and threads. The lower flow channel chamber inlet is located on one side of the inner wall of the lower flow channel frame, and the lower flow channel chamber outlet is located on the other side of the inner wall of the lower flow channel frame. The lower flow channel chamber inlet and the upper flow channel chamber inlet are vertically corresponding and connected, and the lower flow channel chamber outlet and the upper flow channel chamber outlet are vertically corresponding and connected. The main flow channel inlet is located on one side of the lower flow channel frame, and the main flow channel outlet is located on the other side of the lower flow channel frame. The lower flow channel cover plate is fixed and sealed to the lower flow channel frame by friction welding or sealing rubber strips.

[0013] The main inlet of the flow channel is used to introduce the heat exchange medium into the thick film heating device. The heat exchange medium is split at the inlet of the lower flow channel chamber and the inlet of the upper flow channel chamber, and enters the upper flow channel frame and the lower flow channel frame respectively.

[0014] The total outlet of the flow channel is used to discharge the heat exchange medium from the thick film heating device. The heat exchange medium flowing out of the upper flow channel frame and the lower flow channel frame converges at the outlet of the lower flow channel chamber and the outlet of the upper flow channel chamber, and is discharged through the total outlet of the flow channel.

[0015] More preferably, the inner walls of the upper flow channel frame and the lower flow channel frame are fixedly connected with a plurality of heat exchange fins, the plurality of heat exchange fins form a heat exchange medium flow channel, and the plurality of heat exchange fins are integrally cast with the upper flow channel frame and the lower flow channel frame respectively.

[0016] More preferably, the bottom of the inner sidewall of the upper flow channel frame is fixedly connected with an inlet sealing element, an outlet sealing element, and a housing sealing element. The inlet sealing element is located between the inlet of the lower flow channel chamber and the inlet of the upper flow channel chamber to seal the inlet of the lower flow channel chamber and the inlet of the upper flow channel chamber. The outlet sealing element is located between the outlet of the lower flow channel chamber and the outlet of the upper flow channel chamber to seal the outlet of the lower flow channel chamber and the outlet of the upper flow channel chamber.

[0017] More preferably, a control chamber is provided at the top of the inner sidewall of the upper flow channel frame, a PCBA control board is installed on the inner sidewall of the control chamber, and an electrode tab is installed at one end of the thick film heating plate, the electrode tab passing through the upper flow channel frame and electrically connected to the PCBA control board.

[0018] More preferably, a sealing groove is formed on the upper surface of the upper flow channel frame, and an upper cover plate is bonded to the inner side wall of the sealing groove.

[0019] More preferably, the thermally conductive silicone coating has a thermal conductivity greater than 3 W / m℃ and a thickness of 0.15-0.3 mm, the thermally conductive silicone pad has a thermal conductivity greater than 3 W / m℃, an initial thickness of 0.7-0.8 mm, a Shore hardness of 60, and a residual thickness of 0.5 mm ± 0.05 mm after compression.

[0020] More preferably, the thick film heating plate is composed of a heating resistance layer and a ceramic dielectric insulating layer;

[0021] The ceramic dielectric insulating layer is printed on the surface of the metal substrate using screen printing technology, the heating resistor layer is printed on the surface of the ceramic dielectric insulating layer using screen printing technology, and the ceramic dielectric surface layer is printed on the surface of the heating resistor layer using screen printing technology.

[0022] The present invention has the following advantages due to the adoption of the above technical solution:

[0023] This invention employs a single-layer thick-film heating plate, combined with an upper and lower flow channel chamber mechanism to guide the heat transfer medium in parallel from top to bottom. This allows the heat transfer medium to simultaneously absorb heat from both sides of the thick-film heating plate, achieving a double-sided heat exchange effect. This improves the heat transfer coefficient and heat exchange area of ​​the thick-film heating device, thereby breaking through the maximum power density limitation of traditional thick-film heating plates. It enables the thick-film heating device to achieve higher electrical power output within the same area. At the same time, due to the improved heat exchange capacity, the product's thermal conversion efficiency is also improved.

[0024] This utility model features a compact overall structure, high power, and high heat conversion efficiency. It also uses relatively low-cost parts and has reliable quality, meeting the heating requirements of new energy vehicles.

[0025] The above overview is for illustrative purposes only and is not intended to limit the scope of the invention in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the forward explosion structure of this utility model.

[0028] Figure 2 This is a schematic diagram of the reverse explosion structure of this utility model.

[0029] Figure 3 This is a schematic diagram of the internal structure of the upper flow channel frame of this utility model.

[0030] Figure 4 This is a schematic diagram of the internal structure of the lower flow channel frame of this utility model.

[0031] Figure 5 This is a cross-sectional view of the present invention from a first perspective.

[0032] Figure 6 This is a cross-sectional view of the present invention from a second perspective.

[0033] Figure 7 This is a top view of the upper flow channel frame of this utility model.

[0034] Figure 8 This is an exploded structural diagram of the thick film heating plate of this utility model.

[0035] Reference numerals: 1. Thick film heating plate; 2. Ceramic dielectric surface layer; 3. Metal substrate surface; 4. Upper flow channel chamber mechanism; 5. Lower flow channel chamber mechanism; 6. Heat exchange fins; 7. Heat exchange medium flow channel; 8. Inlet sealing element; 9. Outlet sealing element; 10. Shell sealing element; 11. Thermally conductive silicone coating; 12. Thermally conductive silicone pad; 13. Electrode; 14. Control chamber; 15. PCBA control board; 16. Top cover plate; 17. Sealing groove; 401. Upper flow channel frame; 402. Upper flow channel chamber inlet; 403. Upper flow channel chamber outlet; 404. Upper flow channel cover plate; 501. Lower flow channel frame; 502. Lower flow channel chamber inlet; 503. Lower flow channel chamber outlet; 504. Flow channel main inlet; 505. Flow channel main outlet; 506. Lower flow channel cover plate; 101. Heating resistor layer; 102. Ceramic dielectric insulating layer. Detailed Implementation

[0036] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0037] It is important to note that terms such as "first," "second," "symmetric," and "array" are used only to distinguish between descriptive and positional descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified with terms such as "first" or "symmetric" may explicitly or implicitly include one or more of that feature; similarly, when the quantity of certain features is not limited by words such as "two" or "three," it should be noted that such features also explicitly or implicitly include one or more features.

[0038] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings. Example

[0039] like Figures 1-7 As shown, this utility model embodiment provides a high-power thick film heating device for new energy vehicles, including a thick film heating plate 1, a ceramic dielectric surface layer 2 on the upper surface of the thick film heating plate 1, a metal substrate surface 3 on the lower surface of the thick film heating plate 1, an upper flow channel chamber mechanism 4 above the thick film heating plate 1, a lower flow channel chamber mechanism 5 below the thick film heating plate 1, the upper flow channel chamber mechanism 4 and the lower flow channel chamber mechanism 5 are connected by bolts and threads, the inlet and outlet of the upper flow channel chamber mechanism 4 and the lower flow channel chamber mechanism 5 are interconnected, a thermally conductive silicone pad 12 is attached between the ceramic dielectric surface layer 2 and the upper flow channel chamber mechanism 4, and a thermally conductive silicone coating 11 is coated between the metal substrate surface 3 and the lower flow channel chamber mechanism 5.

[0040] Among them, the upper flow channel chamber mechanism 4 and the lower flow channel chamber mechanism 5 are used to guide the heat exchange medium entering the thick film heating device in parallel from top to bottom, and simultaneously absorb the heat from the upper and lower surfaces of the thick film heating plate 1, so as to perform double-sided heat exchange on a single thick film heating plate 1.

[0041] In one embodiment, the upper flow channel chamber mechanism 4 includes an upper flow channel frame 401, an upper flow channel chamber inlet 402, an upper flow channel chamber outlet 403, and an upper flow channel cover plate 404.

[0042] The upper flow channel chamber inlet 402 is located on one side of the inner wall of the upper flow channel frame 401, and the upper flow channel chamber outlet 403 is located on the other side of the inner wall of the upper flow channel frame 401. The upper flow channel cover plate 404 is fixed and sealed to the middle of the inner wall of the upper flow channel frame 401 by friction welding or sealing rubber strip. The thermally conductive silicone pad 12 is applied between the upper surface of the ceramic medium surface layer 2 and the lower surface of the upper flow channel frame 401.

[0043] The downstream flow chamber mechanism 5 includes a downstream flow chamber frame 501, a downstream flow chamber inlet 502, a downstream flow chamber outlet 503, a flow channel main inlet 504, a flow channel main outlet 505, and a downstream flow chamber cover plate 506.

[0044] The thermally conductive silicone coating 11 is applied between the upper surface of the lower flow channel frame 501 and the lower surface of the metal substrate 3. The lower flow channel frame 501 is connected to the bottom of the upper flow channel frame 401 by bolts and threads. The lower flow channel chamber inlet 502 is opened on one side of the inner wall of the lower flow channel frame 501, and the lower flow channel chamber outlet 503 is opened on the other side of the inner wall of the lower flow channel frame 501. The lower flow channel chamber inlet 502 and the upper flow channel chamber inlet 402 are vertically corresponding and connected. The lower flow channel chamber outlet 503 and the upper flow channel chamber outlet 403 are vertically corresponding and connected. The flow channel total inlet 504 is located on one side of the lower flow channel frame 501, and the flow channel total outlet 505 is located on the other side of the lower flow channel frame 501. The lower flow channel cover plate 506 is fixed and sealed to the lower flow channel frame 501 by friction welding or sealing rubber strip.

[0045] The main inlet 504 of the flow channel is used to introduce the heat exchange medium into the thick film heating device. The heat exchange medium is split at the lower flow channel chamber inlet 502 and the upper flow channel chamber inlet 402 and enters the upper flow channel frame 401 and the lower flow channel frame 501 respectively.

[0046] The flow channel outlet 505 is used to discharge the heat exchange medium from the thick film heating device. The heat exchange medium flowing out of the upper flow channel frame 401 and the lower flow channel frame 501 converges at the lower flow channel chamber outlet 503 and the upper flow channel chamber outlet 403 and is discharged through the flow channel outlet 505.

[0047] The heat transfer medium is injected into the lower flow channel frame 501 through the main flow channel inlet 504. Then, the heat transfer medium is diverted into the upper flow channel frame 401 through the lower flow channel chamber inlet 502 and the upper flow channel chamber outlet 403. When the heat transfer medium in the upper flow channel frame 401 flows to the upper flow channel chamber outlet 403 and the heat transfer medium in the lower flow channel frame 501 flows to the lower flow channel chamber outlet 503, the heat-exchanged heat transfer medium merges and is then discharged through the main flow channel outlet 505.

[0048] In one embodiment, a plurality of heat exchange fins 6 are fixedly connected to the inner sidewalls of the upper flow channel frame 401 and the lower flow channel frame 501, and the plurality of heat exchange fins 6 form a heat exchange medium flow channel 7. The plurality of heat exchange fins 6 are integrally cast with the upper flow channel frame 401 and the lower flow channel frame 501 respectively.

[0049] The heat exchange fins 6, in conjunction with the heat transfer medium, absorb the heat from the upper flow channel frame 401 and the lower flow channel frame 501. The heat transfer medium flow channel 7 is used to guide the heat transfer medium within the upper flow channel frame 401 and the lower flow channel frame 501.

[0050] In one embodiment, an inlet sealing element 8, an outlet sealing element 9, and a housing sealing element 10 are fixedly connected to the bottom of the inner sidewall of the upper flow channel frame 401. The inlet sealing element 8 is disposed between the lower flow channel chamber inlet 502 and the upper flow channel chamber inlet 402 to seal the space between the lower flow channel chamber inlet 502 and the upper flow channel chamber inlet 402. The outlet sealing element 9 is disposed between the lower flow channel chamber outlet 503 and the upper flow channel chamber outlet 403 to seal the space between the lower flow channel chamber outlet 503 and the upper flow channel chamber outlet 403.

[0051] The inlet sealing element 8 and outlet sealing element 9 are used to seal the inlet 502 of the lower flow channel chamber and the inlet 402 of the upper flow channel chamber, as well as the outlet 503 of the lower flow channel chamber and the outlet 403 of the upper flow channel chamber, respectively; the housing sealing element 10 is used to seal the upper flow channel frame 401 and the thermally conductive silicone pad 12.

[0052] In one embodiment, a control chamber 14 is provided on the top of the inner sidewall of the upper flow channel frame 401, and a PCBA control board 15 is installed on the inner sidewall of the control chamber 14. An electrode tab 13 is installed at one end of the thick film heating plate 1, and the electrode tab 13 passes through the upper flow channel frame 401 and is electrically connected to the PCBA control board 15.

[0053] The thick film heating plate 1 is controlled by the tab 13 via the PCBA control board 15.

[0054] In one embodiment, a sealing groove 17 is provided on the upper surface of the upper flow channel frame 401, and an upper cover plate 16 is bonded to the inner side wall of the sealing groove 17.

[0055] The upper cover plate 16 is used to seal the top of the upper flow channel frame 401, and the sealant groove 17 is provided to fix the upper cover plate 16 inside the upper flow channel frame 401 for use with sealant.

[0056] In one embodiment, the thermally conductive silicone coating 11 has a thermal conductivity greater than 3 W / m℃ and a thickness of 0.15-0.3 mm, the thermally conductive silicone pad 12 has a thermal conductivity greater than 3 W / m℃, an initial thickness of 0.7-0.8 mm, a Shore hardness of 60, and a residual thickness of 0.5 mm ± 0.05 mm after compression.

[0057] The thermally conductive silicone coating 11 and thermally conductive silicone pad 12 are used to conduct heat between the thick film heating plate 1 and the lower flow channel frame 501, and between the thick film heating plate 1 and the upper flow channel frame 401.

[0058] In one embodiment, the thick film heating plate 1 is composed of a heating resistance layer 101 and a ceramic dielectric insulating layer 102;

[0059] The ceramic dielectric insulating layer 102 is printed on the surface of the metal substrate 3 using screen printing technology, the heating resistor layer 101 is printed on the surface of the ceramic dielectric insulating layer 102 using screen printing technology, and the ceramic dielectric surface layer 2 is printed on the surface of the heating resistor layer 101 using screen printing technology.

[0060] Ceramic paste material is printed on the metal substrate surface 3 using screen printing, and then sintered at high temperature to form a ceramic dielectric insulating layer 102 on the metal substrate surface 3. Silver and palladium materials are then printed on the ceramic dielectric insulating layer 102 using screen printing again, and after high-temperature sintering, a heating resistor layer 101 is formed. Ceramic paste material is then printed on the heating resistor layer 101 again using screen printing, and after high-temperature sintering, a ceramic dielectric surface layer 2 is formed. The specific structure is as follows: Figure 8 As shown;

[0061] In operation, the present invention injects the heat transfer medium into the lower flow channel frame 501 through the flow channel inlet 504, and then diverts the heat transfer medium into the upper flow channel frame 401 through the lower flow channel chamber inlet 502 and the upper flow channel chamber outlet 403. Then, the heat exchange fins 6 guide the heat transfer medium entering the lower flow channel frame 501 and the upper flow channel frame 401, so that it flows in the heat exchange medium flow channel 7.

[0062] When the thick film heating plate 1 is working, the heat from the upper and lower surfaces of the thick film heating plate 1 is conducted to the surfaces of the upper flow channel frame 401 and the lower flow channel frame 501 by the thermally conductive silicone coating 11 and thermally conductive silicone pad 12 respectively. Then, the heat is absorbed by the heat exchange fins 6 in conjunction with the thermally conductive medium. Thus, the heat on both sides of the thick film heating plate 1 can be exchanged simultaneously by the thermally conductive medium.

[0063] When the heat transfer medium in the upper flow channel frame 401 flows to the upper flow channel chamber outlet 403 and the heat transfer medium in the lower flow channel frame 501 flows to the lower flow channel chamber outlet 503, the heat-exchanged heat transfer medium merges and is then discharged through the flow channel total outlet 505, thereby completing the heating operation of the heat transfer medium.

[0064] The inlet sealing element 8 and the outlet sealing element 9 are used to seal the inlet 502 of the lower flow channel chamber and the inlet 402 of the upper flow channel chamber, as well as the outlet 503 of the lower flow channel chamber and the outlet 403 of the upper flow channel chamber. Example

[0065] In Embodiment 1, the upper flow channel chamber mechanism 4 and the lower flow channel chamber mechanism 5 are connected in parallel to guide the heat exchange medium. In order to prolong the residence time of the heat exchange medium in the chamber or to make the heat exchange medium absorb the heat of the thick film heating plate 1 more evenly, the upper flow channel chamber mechanism 4 and the lower flow channel chamber mechanism 5 can also be connected in series. That is, the heat exchange medium flows into the upper flow channel chamber mechanism 4 after passing through the lower flow channel chamber mechanism 5, and finally flows out through the outlet of the lower flow channel chamber mechanism 5; or it flows into the upper flow channel chamber mechanism 4 through the inlet of the lower flow channel chamber mechanism 5, and then flows back into the lower flow channel chamber mechanism 5, and finally flows out through the outlet of the lower flow channel chamber mechanism 5.

[0066] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A high-power thick-film heating device for new energy vehicles, comprising a thick-film heating plate (1), characterized in that, The upper surface of the thick film heating plate (1) is provided with a ceramic dielectric surface layer (2), the lower surface of the thick film heating plate (1) is provided with a metal substrate surface (3), an upper flow channel chamber mechanism (4) is provided above the thick film heating plate (1), and a lower flow channel chamber mechanism (5) is provided below the thick film heating plate (1). The upper flow channel chamber mechanism (4) and the lower flow channel chamber mechanism (5) are connected by bolts and threads. The inlet and outlet of the upper flow channel chamber mechanism (4) and the lower flow channel chamber mechanism (5) are interconnected. A thermally conductive silicone pad (12) is applied between the ceramic dielectric surface layer (2) and the upper flow channel chamber mechanism (4). A thermally conductive silicone coating (11) is applied between the metal substrate surface (3) and the lower flow channel chamber mechanism (5). The upper flow channel chamber mechanism (4) and the lower flow channel chamber mechanism (5) are used to guide the heat exchange medium entering the thick film heating device in parallel from top to bottom, and simultaneously absorb the heat from the upper and lower sides of the thick film heating plate (1) to perform double-sided heat exchange on a single thick film heating plate (1).

2. The high-power thick-film heating device for new energy vehicles according to claim 1, characterized in that: The upper flow channel chamber mechanism (4) includes an upper flow channel frame (401), an upper flow channel chamber inlet (402), an upper flow channel chamber outlet (403), and an upper flow channel cover plate (404). The upper flow channel chamber inlet (402) is located on one side of the inner wall of the upper flow channel frame (401), and the upper flow channel chamber outlet (403) is located on the other side of the inner wall of the upper flow channel frame (401). The upper flow channel cover plate (404) is fixed and sealed to the middle of the inner wall of the upper flow channel frame (401) by friction welding or sealing rubber strip. The thermally conductive silicone pad (12) is applied between the upper surface of the ceramic medium surface layer (2) and the lower surface of the upper flow channel frame (401).

3. The high-power thick-film heating device for new energy vehicles according to claim 2, characterized in that: The downstream flow chamber mechanism (5) includes a downstream flow chamber frame (501), a downstream flow chamber inlet (502), a downstream flow chamber outlet (503), a flow channel main inlet (504), a flow channel main outlet (505), and a downstream flow channel cover plate (506). The thermally conductive silicone coating (11) is applied between the upper surface of the lower flow channel frame (501) and the lower surface of the metal substrate (3). The lower flow channel frame (501) is connected to the bottom of the upper flow channel frame (401) by bolts. The lower flow channel chamber inlet (502) is located on one side of the inner wall of the lower flow channel frame (501), and the lower flow channel chamber outlet (503) is located on the other side of the inner wall of the lower flow channel frame (501). 502) is vertically and horizontally connected to the upper flow channel chamber inlet (402), the lower flow channel chamber outlet (503) is vertically and horizontally connected to the upper flow channel chamber outlet (403), the flow channel total inlet (504) is located on one side of the lower flow channel frame (501), the flow channel total outlet (505) is located on the other side of the lower flow channel frame (501), and the lower flow channel cover plate (506) is fixed and sealed to the lower flow channel frame (501) by friction welding or sealing rubber strip. The main inlet (504) of the flow channel is used to introduce the heat exchange medium into the thick film heating device. The heat exchange medium is split at the inlet (502) of the lower flow channel chamber and the inlet (402) of the upper flow channel chamber, and enters the upper flow channel frame (401) and the lower flow channel frame (501) respectively. The total outlet of the flow channel (505) is used to discharge the heat exchange medium from the thick film heating device. The heat exchange medium flowing out of the upper flow channel frame (401) and the lower flow channel frame (501) converges at the lower flow channel chamber outlet (503) and the upper flow channel chamber outlet (403) and is discharged through the total outlet of the flow channel (505).

4. The high-power thick-film heating device for new energy vehicles according to claim 3, characterized in that: The inner walls of the upper flow channel frame (401) and the lower flow channel frame (501) are fixedly connected with a number of heat exchange fins (6), and the heat exchange fins (6) form a heat exchange medium flow channel (7). The heat exchange fins (6) are integrally cast with the upper flow channel frame (401) and the lower flow channel frame (501).

5. The high-power thick-film heating device for new energy vehicles according to claim 3, characterized in that: The bottom of the inner wall of the upper flow channel frame (401) is fixedly connected with an inlet sealing element (8), an outlet sealing element (9) and a housing sealing element (10). The inlet sealing element (8) is located between the inlet of the lower flow channel chamber (502) and the inlet of the upper flow channel chamber (402) to seal between the inlet of the lower flow channel chamber (502) and the inlet of the upper flow channel chamber (402). The outlet sealing element (9) is located between the outlet of the lower flow channel chamber (503) and the outlet of the upper flow channel chamber (403) to seal between the outlet of the lower flow channel chamber (503) and the outlet of the upper flow channel chamber (403).

6. The high-power thick-film heating device for new energy vehicles according to claim 2, characterized in that: The upper flow channel frame (401) has a control chamber (14) at the top of its inner wall. A PCBA control board (15) is installed on the inner wall of the control chamber (14). An electrode (13) is installed at one end of the thick film heating plate (1). The electrode (13) passes through the upper flow channel frame (401) and is electrically connected to the PCBA control board (15).

7. The high-power thick-film heating device for new energy vehicles according to claim 2, characterized in that: The upper surface of the upper flow channel frame (401) is provided with a sealing groove (17), and the inner side wall of the sealing groove (17) is bonded with an upper cover plate (16).

8. The high-power thick-film heating device for new energy vehicles according to claim 1, characterized in that: The thick film heating plate (1) is composed of a heating resistance layer (101) and a ceramic dielectric insulating layer (102); The ceramic dielectric insulating layer (102) is printed on the surface of the metal substrate (3) using a screen printing process and formed by high-temperature sintering. The heating resistor layer (101) is printed on the surface of the ceramic dielectric insulating layer (102) using a screen printing process and formed by high-temperature sintering. The ceramic dielectric surface layer (2) is printed on the surface of the heating resistor layer (101) using a screen printing process and formed by high-temperature sintering.

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