Substrate pressing device and film deposition device

Abstract

To provide a substrate pressing device capable of reducing dispersion of pressing force of a press member and a film deposition apparatus.SOLUTION: A substrate pressing device 600 for pressing a substrate 200 downward in the vertical direction is equipped with a press member 610 for pressing the substrate 200 and a support member 620 that supports the press member 610 while allowing free movement of the press member 610 in the vertical direction when the substrate 200 and the press member 610 are separated from each other. The supporting force of the support member 620 among the total supporting force for supporting the press member 610 is reduced or lost by bringing the press member 610 into contact with the substrate 200. The substrate 200 supports the press member 610 with the force corresponding to a part or all of the reduced supporting force.SELECTED DRAWING: Figure 9

Description

Technical Field

[0004] , ,

[0005] ,

[0001] The present invention relates to a substrate pressing device and a film forming device.

Background Art

[0002] In a film forming device such as a vacuum evaporation device, the substrate is moved while being held by a substrate carrier, and various processes such as a film forming process are performed on the substrate. As disclosed in Patent Document 1, a technique is known in which a plurality of suction members are provided on a substrate carrier, and the substrate is sucked by these plurality of suction members. Further, Patent Document 1 discloses a technique for more reliably performing suction by a plurality of suction members by pressing the substrate toward the substrate carrier after placing the substrate on the substrate carrier. Specifically, Patent Document 1 discloses that the substrate is pressed by a pressing unit including an elastic body.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The inventor of the present application has found a technical problem that it is desirable to equalize the pressing forces when pressing a plurality of locations on the substrate. In the method using an elastic body as in the prior art, the pressing force may vary due to variations in the elastic modulus of the elastic body. Alternatively, due to misalignment of the installation position of the pressing unit, or unevenness or deflection of the substrate carrier or the substrate, the amount of deformation of the elastic body during pressing may vary, and as a result, the pressing force may vary.

[0005] An object of the present invention is to provide a substrate pressing device and a film forming device capable of reducing variations in the pressing force by a pressing member.

Means for Solving the Problems

[0006] A substrate pressing device according to one aspect of the present invention is: A substrate pressing device that presses a substrate vertically downward, A pressing member for pressing the substrate, With the substrate and the pressing member separated, a support member is provided to support the pressing member while allowing the pressing member to move freely in the vertical direction. Equipped with, By bringing the substrate and the pressing member into contact, the component of the supporting force that supports the pressing member due to the supporting member is reduced or made zero, and the substrate is made to support the pressing member with a force equivalent to part or all of the reduced amount. 、 The pressing member is supported by the support member, allowing it to move freely within a certain range in the vertical direction. With the substrate placed on the substrate mounting member, the pressing member rests on the substrate, and the pressing The substrate mounting member and the support member are configured to be brought closer together until the pressure member remains in the middle of the aforementioned certain range. The substrate mounting member is provided with a plurality of adsorption members for adsorbing the substrate, Multiple pressing members are provided so as to correspond to the respective positions of the multiple suction members. It is characterized by the following: [Effects of the Invention]

[0007] According to the present invention, variations in the pressing force applied by the pressing member can be reduced. [Brief explanation of the drawing]

[0008] [Figure 1] A schematic diagram of a film deposition apparatus according to the first embodiment of the present invention. [Figure 2] A schematic diagram of a substrate lifting device and a substrate pressing device according to the first embodiment of the present invention. [Figure 3] A schematic diagram of a substrate lifting device and a substrate pressing device according to the first embodiment of the present invention. [Figure 4] A schematic diagram of a substrate lifting device and a substrate pressing device according to the first embodiment of the present invention. [Figure 5] A schematic diagram of a substrate lifting device and a substrate pressing device according to the first embodiment of the present invention. [Figure 6]Schematic configuration diagram of a substrate lifting device and a substrate pressing device according to the first embodiment of the present invention. [Figure 7] Schematic configuration diagram of a substrate lifting device and a substrate pressing device according to the first embodiment of the present invention. [Figure 8] Schematic cross-sectional view of a substrate pressing device according to Example 1 of the present invention. [Figure 9] Schematic cross-sectional view of a substrate pressing device according to Example 1 of the present invention. [Figure 10] Schematic configuration diagram of a film forming chamber according to the first embodiment of the present invention. [Figure 11] Explanatory diagram of an organic EL display device according to the first embodiment of the present invention. [Figure 12] Schematic cross-sectional view of a substrate pressing device according to a reference example. [Figure 13] Schematic cross-sectional view of a substrate pressing device according to Example 2 of the present invention. [Figure 14] Schematic configuration diagram of a substrate holding device and a substrate pressing device according to the second embodiment of the present invention. [Figure 15] Schematic cross-sectional view of a substrate pressing device according to the second embodiment of the present invention.

Mode for Carrying Out the Invention

[0009] Hereinafter, with reference to the drawings, the mode for carrying out this invention will be illustratively and specifically described based on examples. However, the dimensions, materials, shapes, relative arrangements, etc. of the component parts described in this example are not intended to limit the scope of this invention only to those, unless otherwise specifically described. In the following description, the upper vertical direction may be simply referred to as "upward", and the lower vertical direction may be simply referred to as "downward" as appropriate.

[0010] (First Embodiment) <Film Forming Apparatus> Referring to Figure 1, the overall configuration of the film deposition apparatus according to the first embodiment will be described. Figure 1 is a schematic diagram of the film deposition apparatus according to the first embodiment of the present invention. In this embodiment, a film deposition apparatus called an in-line type will be used as an example. In an in-line type film deposition apparatus, multiple chambers are arranged in a row, and the substrate, substrate carrier, and mask are sequentially transported into each chamber, where various processes are performed. Transport rollers and linear motors are used for transport. Each chamber is configured to be either a vacuum atmosphere or an inert gas atmosphere, either individually or between adjacent chambers.

[0011] In Figure 1, only the chamber where representative processing is performed is indicated with the symbol R, while the other chambers are omitted with black dots. Also in Figure 1, thin solid arrows indicate the transport order of the substrate carrier 100, dotted arrows indicate the transport order of the substrate 200, and thick solid arrows indicate the transport order of the mask M. The operation of the devices in each chamber is controlled by a control unit C, such as a computer. A control unit C can be provided individually for each device, or a common control unit C can be provided for multiple devices. Generally, the fact that various operations are controlled by a control unit is well known technology, so the specific configuration of the control unit C will not be explained.

[0012] First, the substrate carrier 100 and the substrate 200 are sent to the substrate placement chamber R1, where the substrate 200 is held on top of the substrate carrier 100. The substrate carrier 100 and the substrate 200 held by the substrate carrier 100 are then transported to the inversion chamber R2. In the inversion chamber R2, the substrate carrier 100 rotates 180° together with the substrate 200 so that the substrate 200 is held on the underside of the substrate carrier 100. The mask M is transported to the inversion chamber R2 via a different path than the transport path of the substrate carrier 100. In the inversion chamber R2, the substrate carrier 100, with the substrate 200 held on its underside, is placed on top of the mask M. Then, the substrate 200 held by the substrate carrier 100, along with the mask M that has been sent to the inversion chamber R2, is transported to the deposition chamber R3. Note that the rotation of the substrate carrier 100, the merging with the mask M, and the placement on the mask M may each be performed in separate chambers. Next, in the deposition chamber R3, a thin film is formed on the surface of the substrate 200 via a mask M having an opening at the desired deposition position. After this, the substrate carrier 100 and the like are transported to the mask discharge chamber R4. Generally, thin films can be formed using different materials. To enable this, multiple deposition chambers R3 are provided as shown in the figure. Therefore, normally, with the transport of one substrate 200, the deposition process is carried out in a specific deposition chamber R3.

[0013] After film deposition, the substrate 200 and mask M held in the substrate carrier 100 are transported to the mask discharge chamber R4, and the mask M is discharged from the mask discharge chamber R4. Then, the substrate 200 held in the substrate carrier 100 is transported to the substrate peeling chamber R5, where the substrate 200 is peeled off from the substrate carrier 100. After that, the substrate carrier 100 is either discharged to the outside of the film deposition apparatus or transported again to the substrate placement chamber R1. The substrate 200 peeled off from the substrate carrier 100 may be transported to the substrate placement chamber R1 again to undergo film deposition using another mask M and other materials, or it may undergo other post-processing.

[0014] <Substrate lifting device> The configuration of the substrate lifting device located in the substrate placement chamber R1, and the operation of placing the substrate 200 on the substrate carrier 100, will be explained with reference to Figures 2 to 7. The substrate lifting device comprises a carrier transfer chamber 300, a substrate lifting mechanism 400, a substrate carrier lifting mechanism 500, and a substrate pressing device 600. In this embodiment, the substrate carrier lifting mechanism 500 can also be considered a part of the substrate pressing device 600.

[0015] The substrate lifting mechanism 400 comprises a plurality of support pins 411, a plate 410 that supports the plurality of support pins 411, a support column 420 for the plate 410, and a lifting mechanism 430 that raises and lowers the plate 410 together with the support column 420. Various known technologies such as a ball screw mechanism or a rack and pinion system can be applied as the lifting mechanism 430 that raises and lowers the plate 410.

[0016] The substrate carrier lifting mechanism 500 includes a carrier support member 510 that supports the substrate carrier 100, a support column 520 that supports the carrier support member 510, and a first lifting means 530 that raises and lowers the carrier support member 510 together with the support column 520. Various known technologies such as a ball screw mechanism or a rack and pinion system can be applied as the first lifting means 530 that raises and lowers the support column 520. In addition, a mounting member 350 for placing the substrate carrier 100 is also provided in the carrier transfer chamber 300. The mounting member 350 and the carrier support member 510 have openings in the area through which the support pin 411 passes so as not to interfere with the operation of the support pin 411 provided in the substrate lifting mechanism 400. The mounting member 350 also has openings in the area through which the carrier support member 510 passes so as not to interfere with the lifting and lowering operation of the carrier support member 510. The carrier support member 510 is a member that supports the substrate carrier 100 from below when the substrate carrier 100 is raised or lowered. For example, the carrier support member 510 can be composed of a frame-shaped member that supports the periphery of the substrate carrier 100, or it can be composed of a plurality of pins that support the periphery of the substrate carrier 100 and a member that supports these plurality of pins.

[0017] In the carrier transfer chamber 300, only the support pins 411 of the substrate lifting mechanism 400 are inserted, and in the substrate carrier lifting mechanism 500, only the carrier support members 510 and a portion of the support columns 520 are provided. This prevents lubricants, wear particles, etc. from entering the carrier transfer chamber 300. Alternatively, the entire substrate lifting device may be placed in the substrate mounting chamber R1, or the carrier transfer chamber 300 may be configured to correspond to the substrate mounting chamber R1. In the latter case, most of the components of the substrate lifting mechanism 400 (components other than the support pins 411) and most of the components of the substrate carrier lifting mechanism 500 (components other than the carrier support members 510 and support columns 520) will be located outside the substrate mounting chamber R1.

[0018] Using the substrate lifting device configured as described above, the substrate 200 is held on the substrate carrier 100. The operation of holding the substrate carrier will now be explained. Figure 2 shows a ready state in which multiple support pins 411 and the carrier support member 510 are positioned in a lower standby position. First, the substrate carrier 100 is brought into the carrier transfer chamber 300. The substrate carrier 100 brought into the carrier transfer chamber 300 is placed on the mounting member 350 (see Figure 3). In a configuration in which the substrate carrier 100 is brought in by a transport roller, the transport roller may also perform the function of holding the substrate carrier 100 instead of the mounting member 350.

[0019] After the substrate carrier 100 is placed on the mounting member 350, the substrate 200 is transported into the carrier transfer chamber 300. The substrate 200 is transported into the carrier transfer chamber 300 by a transport robot. In Figure 4, only a portion of the hand portion 250 that supports the substrate 200 in the transport robot is shown. This hand portion 250 is generally provided in a comb-like shape so as not to interfere with the operation of the support pins 411.

[0020] Furthermore, the substrate lifting mechanism 400 raises the plate 410 and the multiple support pins 411 to a predetermined position. The multiple support pins 411 are provided so as to be able to pass through multiple through holes provided in the substrate carrier 100, and the tips of the multiple support pins 411 move to a position above the upper surface of the substrate carrier 100 and below the lower surface of the substrate 200 being transported (see Figure 4). The order of the transport operation of the substrate 200 into the carrier transfer chamber 300 and the raising operation of the plate 410 by the substrate lifting mechanism 400 is not particularly limited and may be performed simultaneously.

[0021] After the substrate 200 is placed on the tips of the multiple support pins 411, the plate 410 is lowered to a predetermined position by the substrate lifting mechanism 400. This brings the substrate 200 close enough to the substrate carrier 100 (see Figure 5). Generally, in this state, the horizontal movement of the substrate 200 is adjusted by an alignment mechanism (not shown), and the position of the substrate 200 relative to the substrate carrier 100 is adjusted. Subsequently, the plate 410 is lowered further by the substrate lifting mechanism 400, and the tips of the multiple support pins 411 move below the lower surface of the substrate carrier 100. In this process, the substrate 200 is placed on top of the substrate carrier 100 (see Figure 6).

[0022] Subsequently, the carrier support member 510 is raised by the substrate carrier lifting mechanism 500, the substrate carrier 100 is supported by the carrier support member 510, and the substrate 200 rises together with the carrier support member 510. Then, the substrate 200 is pressed downward against the substrate carrier 100, which acts as a substrate mounting member, by the substrate pressing device 600 (see Figure 7). In this process, it is preferable to control the control unit C as follows: The substrate carrier lifting mechanism 500 raises the carrier support member 510 and stops the upward movement just before reaching the substrate carrier 100. Then, the substrate carrier lifting mechanism 500 raises the carrier support member 510 at a slower speed than before, bringing it into contact with the substrate carrier 100 and gradually raising the substrate carrier 100. Then, the upward movement of the substrate carrier 100 is stopped just before reaching the substrate pressing device 600. After that, the substrate carrier 100 is gradually raised again, and the pressing operation by the substrate pressing device 600 is started.

[0023] As described above, the suction pad 130 (see Figure 8), which is an adsorption member provided on the substrate carrier 100, is more reliably adsorbed onto the substrate 200.

[0024] In this manner, after the substrate 200 is held in the substrate carrier 100, the carrier support member 510 is lowered to a predetermined position by the substrate carrier lifting mechanism 500. Then, the substrate 200 held in the substrate carrier 100 is unloaded from the carrier transfer chamber 300 and transported to the inversion chamber R2.

[0025] <Substrate peeling operation> In the substrate peeling chamber R5, a substrate lifting device configured as described above is also provided. The operation of peeling the substrate 200 from the substrate carrier 100 using the substrate lifting device configured as described above will be explained below. First, with the plate 410 waiting in the downward position, the substrate carrier 100 holding the substrate 200 is brought into the carrier transfer chamber 300, and these are placed on the mounting member 350.

[0026] Subsequently, the substrate lifting mechanism 400 raises the plate 410 along with the multiple support pins 411, which pass through multiple through holes provided in the substrate carrier 100 and rise to a predetermined position. In this process, the substrate 200 is pushed in by the multiple support pins 411, detached from the substrate carrier 100, and rises to a predetermined position.

[0027] Then, the substrate 200 is unloaded from the carrier transfer chamber 300 by a transport robot. After the substrate lifting mechanism 400 lowers the plate 410 along with the multiple support pins 411, the substrate carrier 100 is unloaded from the carrier transfer chamber 300 and either unloaded outside the film deposition apparatus or transported back to the substrate placement chamber R1.

[0028] <Circuit board> The substrate 200 can be made of any material other than glass, such as semiconductors (e.g., silicon), polymer films, or metals. Alternatively, a substrate can be used in which a film such as polyimide is laminated onto a silicon wafer or a glass substrate.

[0029] In the case of a large substrate 200, it is cut along one or more cutting lines in a post-processing step after film deposition. The multiple support pins 411 are configured to abut against the outer circumference of the substrate 200 and along the cutting lines. In addition, the multiple suction pads 130 provided on the substrate carrier 100 are also configured to adhere to the outer circumference of the substrate 200 and along the cutting lines. This prevents the support pins 411 and suction pads 130 from abutting against the image display area (display element area) when the substrate 200 is used as a display.

[0030] <Substrate carrier> The substrate carrier 100 will be described in more detail with reference to Figures 8 and 9. The substrate carrier 100 is provided with a plurality of through holes 120. These multiple through holes 120 are used for the support pins 411 to pass through and for the suction pads 130, which serve as suction members, to be attached. The arrangement of the through holes 120 used for the support pins 411 to pass through and the through holes 120 used for the suction pads 130 to be attached can be set as appropriate, such as by alternating them. The diameter of the through holes 120 used for the support pins 411 to pass through and the diameter of the through holes 120 used for the suction pads 130 to be attached may be set to be the same or to be different.

[0031] The diameter of the through-hole 120 used for the support pin 411 to pass through is set to be larger than the outer diameter of the support pin 411. This allows the support pin 411 to pass through the through-hole 120 and to move horizontally relative to the substrate carrier 100 during alignment. In addition, a displacement prevention member 411a made of an elastic material such as rubber is provided at the tip of the support pin 411 to suppress displacement of the substrate 200.

[0032] Furthermore, the suction pad 130 is attached to the substrate carrier 100 with the pad inserted through the through hole 120 for the suction pad. The suction pad 130 consists of a metal pad body 131 having a flange portion 131a and an adhesive layer (not shown) provided at the tip of the pad body 131. The device comprises an adhesive member 132 and a fixing member 133 for fixing the pad body 131 to the through hole 120. The flange portion 131a and the fixing member 133 are integrated using a known method. The fixing member 133 and the substrate carrier 100 can be fixed together using known techniques such as bolts. As the material for the adhesive member 132, it is preferable to use fluororubber that does not contain siloxane bonds in order to suppress the generation of outgassing that would adversely affect the manufacturing process under vacuum. Similarly, it is desirable to use known adhesives or double-sided tapes that do not release outgassing components for the materials constituting the adhesive layer. The adhesive member 132 is configured to be adjustable in the vertical direction in the figure within a certain range using a spacer or the like (not shown) so that the amount of protrusion from the surface of the substrate carrier 100 can be controlled. The above amount of protrusion depends on the size of the components constituting the suction pad 130 and the compression characteristics of the adhesive member 132, but it is less than the thickness of the substrate 200. The diameter of the through-hole 120 for the suction pad is larger than the outer diameter of the portion of the pad body 131 that is inserted into the through-hole, allowing the pad body 131 to move vertically as well as to some extent.

[0033] (Substrate pressing device according to Example 1) A substrate pressing device 600 according to Embodiment 1 of the present invention will be described with reference to Figures 8 and 9. The substrate pressing device 600 comprises a pressing member 610 that presses the substrate 200 by its own weight, and a support member 620 that supports the pressing member 610. The pressing member 610 comprises a shaft portion 611, a tip member 612 provided at the tip of the shaft portion 611, and a weight 613 that adjusts the weight of the pressing member 610. Note that the weight 613 is unnecessary if the desired weight can be obtained from the shaft portion 611 or tip member 612 of the pressing member 610. The support member 620 is provided with a bearing 621 through which the shaft portion 611 of the pressing member 610 is inserted.

[0034] Multiple pressing members 610 are provided so as to correspond to the positions of each of the multiple suction pads 130 provided on the substrate carrier 100. That is, the multiple pressing members 610 and the multiple suction pads 130 are arranged so that the tip surface of the tip member 612 of each pressing member 610 faces the adhesive member 132 of each suction pad 130. In other words, each pressing member 610 is positioned directly above each suction pad 130.

[0035] Furthermore, a slide bush 622 is provided between the outer circumferential surface of the shaft portion 611 of the pressing member 610 and the inner circumferential surface of the shaft hole of the bearing 621, such that the frictional force is sufficiently small to allow the pressing member 610 to move freely in the vertical direction. It is preferable that the outer circumferential surface of the shaft portion 611 of the pressing member 610 and the inner circumferential surface of the shaft hole of the bearing 621 (shaft hole of the slide bush 622) are in contact, as this allows for more accurate pressing. As a modified example, a gap may be provided between the outer circumferential surface of the shaft portion 611 of the pressing member 610 and the inner circumferential surface of the shaft hole of the bearing 621. The shaft portion 611 of the pressing member 610 is provided with stoppers above and below the support member 620 in the vertical direction, respectively, to restrict the range of vertical movement of the pressing member 610. In this embodiment, the weight 613 also functions as a stopper positioned vertically above the support member 620. Furthermore, the tip member 612 also functions as a stopper positioned vertically below the support member 620.

[0036] As described above, the substrate pressing device 600 allows the pressing member 610 to move freely within a certain range in the vertical direction while being supported by the support member 620. In this embodiment, the "certain range" is the range from the upper surface of the tip member 612 to the lower surface of the bearing 621 when the weight 613 is in contact with the support member 620. The "certain range" can be appropriately set according to the position of the stopper mentioned above. In this embodiment, the support member 620 is fixed vertically above the substrate carrier 100, which serves as the substrate mounting member (it is fixed to the carrier transfer chamber 300). Then, as described above, after the substrate 200 is placed on the substrate carrier 100, the substrate carrier 100 is raised by the first lifting means 530, bringing the substrate carrier 100 and the support member 620 closer together. More specifically, see Figure As shown in 9, the pressing member 610 rests on the substrate 200, and the substrate carrier 100 on which the substrate 200 is placed and the support member 620 are brought closer together until the pressing member 610 is positioned in the middle of the aforementioned certain range. As a result, the pressing member 610 is lifted away from the support member 620 by the substrate 200. This causes the substrate 200 to be pressed vertically downward against the substrate carrier 100. At this time, the substrate 200 is primarily subjected to the weight of each of the multiple pressing members 610. More precisely, when the substrate 200 and the pressing members 610 are separated, a counterforce against gravity acting on the pressing members 610 is applied from the support member 620 to the pressing members 610. In other words, the supporting force that supports the pressing members 610 is generated by the support member 620. After the substrate 200 and the pressing member 610 come into contact, part or all of the force resisting gravity acting on the pressing member 610 (the supporting force that supports the pressing member 610) is applied from the substrate 200. On the other hand, the component of the supporting force provided by the support member 620 decreases or becomes completely zero. In other words, the component of the supporting force provided by the support member 620 decreases, and the substrate 200 supports the pressing member 610 with a force equivalent to that decrease. In this way, the substrate 200 is pressed with a force equivalent to the weight of the pressing member 610. If the pressing member 610 is lifted vertically, only the weight of the pressing member 610 acts on it. Due to the inclination of the pressing member 610, etc., the substrate 200 is actually pressed with a force slightly smaller than the weight of the pressing member 610. The pressing force from each individual pressing member 610 can be, for example, 10N and applied for about 5 seconds.

[0037] <Film forming chamber> Referring to Figure 10, the film deposition process in the deposition chamber R3 will be explained in more detail. An evaporation source 700, which serves as the film deposition source, is provided inside the deposition chamber R3. The substrate 200, held by the substrate carrier 100, is positioned and supported within the deposition chamber R3 so that it faces downwards. A mask M is also positioned below the substrate 200, relative to the substrate 200. The mask M has openings at positions corresponding to the locations where the thin film is to be formed on the substrate 200. As a result, film deposition is performed on the substrate 200 held by the substrate carrier 100, via the mask M.

[0038] In this embodiment, film deposition (evaporation) is performed by vacuum deposition. Specifically, the film deposition material evaporates or sublimes from the evaporation source 700, which serves as the film deposition source, and the film deposition material is deposited onto the substrate 200 to form a thin film on the substrate 200. The evaporation source 700 is a known technology, so a detailed explanation thereof is omitted. For example, the evaporation source 700 can be composed of a container for containing the film deposition material, such as a crucible, and a heating device for heating the container. Note that the film deposition source is not limited to the evaporation source 700; the film deposition source may also be a sputtering cathode for film deposition by sputtering.

[0039] <Methods for manufacturing electronic devices> Next, an example of a method for manufacturing an electronic device using the film deposition apparatus according to this embodiment will be described. Below, the configuration of an organic EL display device is shown as an example of an electronic device, and a method for manufacturing the organic EL display device will be illustrated.

[0040] First, let me explain the organic EL display device that we manufacture. Figure 11(a) is an overall view of the organic EL display device 800, and Figure 11(b) shows the cross-sectional structure of a single pixel.

[0041] As shown in Figure 11(a), the display area 801 of the organic EL display device 800 has multiple pixels 802, each having multiple light-emitting elements, arranged in a matrix. As will be explained in detail later, each light-emitting element has a structure comprising an organic layer sandwiched between a pair of electrodes. Here, a pixel refers to the smallest unit that enables the display of a desired color in the display area 801. In the organic EL display device according to this embodiment, the combination of the first light-emitting element 802R, the second light-emitting element 802G, and the third light-emitting element 802B, each exhibiting different light emission, forms a pixel 8 Pixel 802 is composed of a combination of red, green, and blue light-emitting elements, but it may also be a combination of yellow, cyan, and white light-emitting elements; as long as there is at least one color, it is not particularly limited.

[0042] Figure 11(b) is a schematic partial cross-sectional view of the BB line in Figure 11(a). Pixel 802 consists of multiple light-emitting elements, each light-emitting element having a first electrode (anode) 804, a hole transport layer 805, one of the light-emitting layers 806R, 806G, or 806B, an electron transport layer 807, and a second electrode (cathode) 808 on the substrate 803. Of these, the hole transport layer 805, the light-emitting layers 806R, 806G, 806B, and the electron transport layer 807 are organic layers. In this embodiment, the light-emitting layer 806R is a red-emitting organic EL layer, the light-emitting layer 806G is a green-emitting organic EL layer, and the light-emitting layer 806B is a blue-emitting organic EL layer. The light-emitting layers 806R, 806G, and 806B are formed in patterns corresponding to the red, green, and blue-emitting light-emitting elements (sometimes described as organic EL elements), respectively.

[0043] Furthermore, the first electrode 804 is formed separately for each light-emitting element. The hole transport layer 805, the electron transport layer 807, and the second electrode 808 may be formed in common for multiple light-emitting elements 802R, 802G, and 802B, or they may be formed for each light-emitting element. In addition, an insulating layer 809 is provided between the first electrode 804 and the second electrode 808 to prevent short circuits caused by foreign matter. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 810 is provided to protect the organic EL element from moisture and oxygen.

[0044] In Figure 11(b), the hole transport layer 805 and the electron transport layer 807 are shown as a single layer, but depending on the structure of the organic EL display element, they may be formed as multiple layers including a hole blocking layer and an electron blocking layer. Furthermore, a hole injection layer having an energy band structure that allows for smooth injection of holes from the first electrode 804 to the hole transport layer 805 can be formed between the first electrode 804 and the hole transport layer 805. Similarly, an electron injection layer can be formed between the second electrode 808 and the electron transport layer 807.

[0045] Next, we will specifically describe an example of a manufacturing method for an organic EL display device.

[0046] First, a circuit (not shown) for driving the organic EL display device and a substrate (mother glass) 803 on which the first electrode 804 is formed are prepared.

[0047] An acrylic resin is formed on a substrate 803 on which the first electrode 804 is formed by spin coating. The acrylic resin is then patterned by lithography to form an insulating layer 809 in the area where the first electrode 804 is formed. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0048] A substrate 803 patterned with an insulating layer 809 is placed on a substrate carrier on which an adhesive member is arranged. The substrate 803 is held in place by the adhesive member. It is then transported to a first organic material deposition apparatus, inverted, and a hole transport layer 805 is deposited as a common layer on the first electrode 804 of the display area. The hole transport layer 805 is deposited by vacuum deposition. In practice, since the hole transport layer 805 is formed to a size larger than the display area 801, a high-resolution mask is not required.

[0049] Next, the substrate 803, on which the hole transport layer 805 has been formed, is brought into a second organic material deposition apparatus. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light-emitting layer 806R is deposited on the portion of the substrate 803 where the red light-emitting elements will be placed.

[0050] Similar to the deposition of the light-emitting layer 806R, a light-emitting layer 806G that emits green light is deposited using a third organic material deposition apparatus, and then a light-emitting layer 806B that emits blue light is deposited using a fourth organic material deposition apparatus. After the deposition of the light-emitting layers 806R, 806G, and 806B is completed, the electron transport layer 807 is deposited over the entire display area 801 using a fifth deposition apparatus. The electron transport layer 807 is formed as a common layer for the three color light-emitting layers 806R, 806G, and 806B.

[0051] The substrate, with the electron transport layer 807 formed on it, is moved using a metallic vapor deposition material deposition apparatus to deposit the second electrode 808.

[0052] The substrate 803 is then transferred to a plasma CVD apparatus to deposit a protective layer 810, completing the deposition process on the substrate 803. After inversion, the substrate 803 is separated from the substrate carrier by peeling off the adhesive member as described in the above embodiment. After cutting, the organic EL display device 800 is completed.

[0053] From the time the substrate 803, which has the insulating layer 809 patterned on it, is loaded into the film deposition apparatus until the deposition of the protective layer 810 is completed, exposure to an atmosphere containing moisture or oxygen may cause the light-emitting layer, which is made of organic EL material, to deteriorate due to moisture or oxygen. Therefore, in this embodiment, the loading and unloading of substrates between film deposition apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere.

[0054] <Advantages of the substrate pressing device and film deposition device according to this embodiment> In the substrate pressing device 600 according to this embodiment, when pressing the substrate 200 vertically downward against the substrate carrier 100, the primary force acting on the substrate 200 is the weight of each of the multiple pressing members 610. In other words, in this embodiment, the height of the pressing member 610 (length of the shaft portion 611) does not affect the pressing force on the substrate 200, so errors in this height do not affect the error in the pressing force. Similarly, the flatness of the surface of the substrate carrier 100 that holds the substrate 200 does not affect the pressing force on the substrate 200, so errors in this flatness do not affect the error in the pressing force. Thus, according to this embodiment, the cause of errors in the pressing force by the pressing members 610 can be reduced to almost solely the weight error of the pressing member 610. Therefore, it is easy to equalize the pressing force by multiple pressing members 610. Generally, weight control (weight equalization) is easy, so it is easy to equalize the pressing force.

[0055] (Reference example) Referring to Figure 12, a reference example of a substrate pressing device will be described. Figure 12 is a schematic cross-sectional view of a reference example of a substrate pressing device. The substrate pressing device 900 comprises a substrate pressing unit 910 and a support member 920 that supports the substrate pressing unit 910. The substrate pressing unit 910 comprises a pressing member 911, a bottomed cylindrical case 912 fixed to the support member 920 with a portion of the pressing member 911 inserted, and a spring 913 disposed inside the case 912. The spring 913 is configured such that one end contacts the bottom of the case 912 and the other end contacts the rear end of the pressing member 911.

[0056] As described above, the substrate pressing device 900 presses the substrate 200 placed on the substrate carrier 100 vertically downward, thereby allowing the substrate 200 to be more securely held in place by the multiple suction pads 130 provided on the substrate carrier 100. More specifically, with the substrate 200 placed on the substrate carrier 100, the substrate carrier 100 moves upward, or the support member 920 moves downward, bringing the distance between the substrate carrier 100 and the support member 920 closer to a predetermined position. As a result, the substrate 200 is pressed by the pressing member 911, and the substrate 200 is pressed against the substrate carrier 100. At this time, the spring force of the spring 913 acts on the pressing member 911.

[0057] In the substrate pressing device 900 configured as described above, stress concentration on the substrate 200 is reduced. To achieve uniformity, it is desirable to equalize the pressing force applied to the substrate 200 by the multiple pressing members 911. The causes of errors in the pressing force applied to the substrate 200 by the pressing members 911 include errors in the spring force of the spring 913, errors in the height (length) of the pressing members 911, and errors in the flatness of the surface of the substrate carrier 100 that holds the substrate 200. Thus, in this substrate pressing device 900, there are many causes of errors in the pressing force, making it difficult to equalize the pressing force applied by the multiple pressing members 911.

[0058] (Substrate pressing device according to Example 2) The substrate pressing device 600X according to Embodiment 2 of the present invention will be described with reference to Figure 13. In addition to a schematic cross-sectional view of the substrate pressing device 600X according to Embodiment 2, Figure 13 also shows schematic cross-sectional views of the substrate carrier 100 and the substrate 200. These substrate carrier 100 and substrate 200 are as described in the above embodiment.

[0059] The substrate pressing device 600X according to this embodiment includes a pressing member 610 that presses the substrate 200 by its own weight, and a support member 620 that supports the pressing member 610. The configuration of the support member 620 is as shown in the above embodiment and Example 1.

[0060] The pressing member 610 according to this embodiment comprises a shaft portion 611, a tip member 612 provided at the tip of the shaft portion 611, a weight 614 for adjusting the weight of the pressing member 610, and a stopper 615. In the above embodiment 1, the weight 613 was provided above the support member 620, whereas in this embodiment, the weight 614 is provided below the support member 620. This weight 614 also functions as a stopper provided vertically below the support member 620. Furthermore, in this embodiment, a dedicated stopper 615 is provided vertically above the support member 620, which is another difference from the above embodiment 1. By providing the weight 614 below the support member 620 as in this embodiment, the pressing member 610 can more easily apply a vertical load to the substrate 200, thus enabling stable pressing of the substrate 200.

[0061] The pressing members 610 are provided in multiple quantities, corresponding to the positions of the multiple suction pads 130 provided on the substrate carrier 100, as in Embodiment 1 above. The relationship between the outer circumferential surface of the shaft portion 611 of the pressing member 610 and the inner circumferential surface of the shaft hole of the bearing 621 is also the same as in Embodiment 1 above. Furthermore, the shaft portion 611 of the pressing member 610 is provided with stoppers (stopper 615 and weight 614) positioned vertically above and below the support member 620, respectively, to restrict the vertical movement range of the pressing member 610, as in Embodiment 1.

[0062] In the substrate pressing device 600X configured as described above, similar to Embodiment 1, the pressing member 610 is supported by the support member 620 while being free to move within a certain range in the vertical direction. In this embodiment, the "certain range" is the range from the upper surface of the weight 614 to the lower surface of the bearing 621 when the stopper 615 is in contact with the support member 620. In this embodiment as well, the support member 620 is fixed vertically above the substrate carrier 100, which serves as the substrate mounting member (it is fixed to the carrier transfer chamber 300). Then, as described above, after the substrate 200 is placed on the substrate carrier 100, the substrate carrier 100 is raised by the first lifting means 530, bringing the substrate carrier 100 and the support member 620 closer together. More specifically, as shown by the solid line in Figure 13, the pressing member 610 rests on the substrate 200, and the substrate carrier 100 on which the substrate 200 is placed and the support member 620 are brought closer together until the pressing member 610 remains in the middle of the aforementioned certain range. As a result, the pressing member 610 is lifted away from the support member 620 by the substrate 200. This causes the substrate 200 to be pressed vertically downward relative to the substrate carrier 100. Therefore, similar to the above embodiment, the substrate 200 is mainly subjected to the weight of each of the multiple pressing members 610. It operates. A more precise description of its operation is provided in the above embodiment. Figure 13 shows the pressing member 610 with a dotted line when the substrate 200 is located at a position below and away from the pressing member 610. In this case, the stopper 615 is in contact with the support member 620, and the pressing member 610 is supported by the support member 620.

[0063] The substrate pressing device 600X configured as described above can also achieve the same effects as in the first embodiment.

[0064] (others) In the substrate lifting device shown in the above embodiment, a configuration can be adopted that includes multiple types of substrate lifting mechanisms 400, each with a different arrangement of support pins 411, depending on the type of substrate carrier 100 and substrate 200. In this case, since the arrangement of the suction pads 130 provided on the substrate carrier 100 will also differ, it is advisable to prepare multiple types of substrate pressing devices 600, each with a different arrangement of pressing members 610. In this case, it is preferable to configure the device so that the substrate pressing device 600 can be automatically replaced to correspond to the substrate lifting mechanism 400 being used.

[0065] Furthermore, in the case of a large substrate 200, if the substrate 200 is supported from below in the vertical direction, the substrate 200 will bend due to its own weight, with the central part being downward. Therefore, when supporting the substrate 200 with multiple support pins 411, it is desirable to position the support pins 411 so as to conform to the bending shape of the substrate 200 in order to equalize the load on each support pin 411. For example, as shown by the thick dotted line in Figure 2, it is preferable to arrange multiple support pins 411X of different heights so that the height gradually increases from the center to the edges (periphery).

[0066] Furthermore, if the substrate 200 is large, the substrate carrier 100 also needs to be large. Generally, the substrate carrier 100 is composed of a frame (outer part) made of a high-strength material (such as SUS) and a plate-shaped member made of a flexible material such as aluminum, which is provided inside the frame and is lightweight. Therefore, when a configuration is adopted in which the periphery of the substrate carrier 100 is supported by a carrier support member 510, the substrate carrier 100 will also be in a state where the central part is downward. Therefore, if the pressing members 610 provided in the substrate pressing device 600 are set so that the lower tip positions of the pressing members 610 are in the same position before contact with the substrate 200, then when the pressing operation is performed, the pressing operation by the pressing members 610 will be performed sequentially from the periphery toward the center. Therefore, the stroke required to raise the substrate carrier 100 becomes long before the pressing operation is performed by all of the pressing members 610. Therefore, when the pressing member 610 and the substrate 200 are separated, it is preferable to provide multiple pressing members 610 such that the lower tip position of the pressing member 610 is low when it is facing the center of the substrate 200 and gradually rises towards the periphery of the substrate 200. This makes it possible to shorten the stroke required to raise the substrate carrier 100 until all pressing members 610 perform the pressing action.

[0067] Furthermore, the above embodiment describes a configuration in which the substrate carrier 100 is raised by the first lifting means 530 to bring the substrate carrier 100 closer to the support member 620. However, it is also possible to adopt a configuration in which a second lifting means is provided to raise and lower the support member 620, and the support member 620 is lowered by the second lifting means to bring the substrate carrier 100 closer to the support member 620.

[0068] In other words, in the above embodiment, the support member 620 is fixed vertically above the substrate carrier 100. In this case, the support member 620 is attached to the ceiling of the chamber or the like. In contrast, although not specifically shown in the figures, the support member 620 is attached to the substrate carrier A configuration can also be adopted that includes a second lifting mechanism for raising and lowering the unit vertically above 100. Various known technologies, such as ball screw mechanisms and rack-and-pinion systems, can be applied to this second lifting mechanism.

[0069] By adopting this configuration, after the substrate 200 is placed on the substrate carrier 100, the support member 620 can be lowered by the second lifting means to bring the substrate carrier 100 and the support member 620 closer together. This allows the substrate carrier 100 on which the substrate 200 is placed and the support member 620 to be brought closer together to a position where the pressing member 610 rests on the substrate 200 and the pressing member 610 remains in a certain range. Therefore, the same effects as in the above embodiment can be obtained. In this case, either the configuration of Embodiment 1 or Embodiment 2 can be adopted for the substrate pressing device. Furthermore, when adopting this configuration, it is not necessary to provide the substrate carrier lifting mechanism 500, and the pressing operation can be performed by lowering the support member 620 by the second lifting means while the substrate carrier 100 and the substrate 200 are placed on the mounting member 350.

[0070] (Second Embodiment) In the first embodiment described above, a substrate pressing device was shown that presses a substrate 200 onto a substrate carrier 100, which serves as a substrate mounting member. However, the substrate pressing device can be applied to various devices that require pressing the substrate 200. For example, the substrate pressing device can be applied to a substrate holding device in a film deposition chamber equipped with a film deposition source. In this embodiment, a substrate pressing device used in a device that holds a substrate by clamping its periphery in order to hold the substrate or to move the substrate while holding it will be described with reference to Figures 14 and 15. Figure 14 is a schematic configuration diagram of a substrate holding device and a substrate pressing device according to the second embodiment of the present invention, where Figure 14(a) is a schematic external view of a substrate holding device equipped with a substrate pressing device, and Figure 14(b) is a schematic view in the direction of the arrow in Figure 14(a). Figure 15 is a schematic cross-sectional view of the substrate pressing device according to the second embodiment of the present invention, and is a partially enlarged cross-sectional view of a part of Figure 14(b).

[0071] The substrate holding device comprises a frame containing four members 650a, 650b, 650c, and 650d, and a plurality of claw members 670 fixed to the frame as substrate mounting members. The substrate holding device also comprises a plurality of substrate pressing devices 600Y and a second lifting means 661 for raising and lowering these plurality of substrate pressing devices 600Y. The plurality of substrate pressing devices 600Y are supported by a support body 663 fixed to a support column 662 that is raised and lowered by the second lifting means 661. The support body 663 is configured to reciprocate vertically along a plurality of guide axes 664. Various known technologies such as a ball screw mechanism and a rack and pinion system can be applied as the second lifting means 661.

[0072] The substrate pressing device 600Y comprises a pressing member 610Y that presses the substrate 200 by its own weight, and a support member 620Y that supports the pressing member 610Y. This support member 620Y is fixed to a support body 663. The pressing member 610Y comprises a shaft portion 611Y, a plate-shaped tip member 612Y provided at the tip of the shaft portion 611Y, and a weight 613Y that adjusts the weight of the pressing member 610Y. Note that if the desired weight can be obtained from the shaft portion 611Y and tip member 612Y of the pressing member 610Y, the weight 613Y is unnecessary. The support member 620Y is provided with a bearing 621Y and a slide bush 622Y through which the shaft portion 611Y of the pressing member 610Y is inserted.

[0073] The relationship between the outer circumferential surface of the shaft portion 611Y of the pressing member 610Y and the inner circumferential surface of the shaft hole of the bearing 621Y is the same as in Embodiment 1 above. In addition, the shaft portion 611Y of the pressing member 610Y is provided with stoppers (weight 613Y and tip member 612Y) positioned vertically above and below the support member 620Y, respectively, which restrict the vertical movement range of the pressing member 610Y. Therefore, the same applies as in Example 1.

[0074] In the substrate pressing device 600Y configured as described above, similar to Embodiment 1, the pressing member 610Y is supported by the support member 620Y while being free to move within a certain range in the vertical direction. In this embodiment, the "certain range" is, similar to Embodiment 1, the range from the upper surface of the tip member 612Y to the lower surface of the bearing 621Y when the weight 613Y is in contact with the support member 620Y.

[0075] Then, after the substrate 200 is placed on the multiple claw members 670, the support member 620Y is lowered by the second lifting means 661 together with the support body 663, bringing the claw members 670 and the support member 620Y closer together. More specifically, as shown in Figure 15, the pressing member 610Y is placed on the substrate 200, and the claw members 670 and the support member 620Y are brought closer together until the pressing member 610Y remains in the middle of the aforementioned certain range. As a result, the pressing member 610Y is lifted away from the support member 620Y by the substrate 200. This causes the substrate 200 to be pressed vertically downward against the claw members 670. Consequently, the substrate 200 is sandwiched between the claw members 670 and the tip member 621Y of the support member 620Y.

[0076] As described above, in this embodiment as well, similar to Embodiment 1, the substrate 200 is primarily subjected to the weight of each of the multiple pressing members 610Y. A more precise explanation of the action is provided in Embodiment 1. In this embodiment, the configuration of the pressing members 610Y is the same as in Embodiment 1. However, in this embodiment as well, similar to Embodiment 2, it is also possible to adopt a configuration in which the weight is provided vertically below the support member 620Y and a dedicated stopper is provided vertically above the support member 620Y. The substrate holding device and substrate pressing device configured as described above can be installed, for example, inside a chamber in which a film deposition source for forming a thin film on the substrate is provided. [Explanation of symbols]

[0077] 100...Substrate carrier 130...Suction pad 500...Substrate carrier lifting mechanism 600,600X...Substrate pressing device 611...Shaft 612...Tip member 613,614 Weight 615...Stopper 620...Support member 621...Bearing

Claims

1. A substrate pressing device that presses a substrate vertically downward, A pressing member for pressing the substrate, With the substrate and the pressing member separated, a support member is provided to support the pressing member while allowing the pressing member to move freely in the vertical direction. Equipped with, By bringing the substrate and the pressing member into contact, the component of the supporting force that supports the pressing member due to the supporting member is reduced or made zero, and the substrate is made to support the pressing member with a force equivalent to part or all of the reduced amount. The pressing member is supported by the support member, allowing it to move freely within a certain range in the vertical direction. With the substrate placed on the substrate mounting member, the pressing member rests on the substrate, and the substrate mounting member and the support member are brought closer together until the pressing member remains in the middle of the specified range. The substrate mounting member is provided with a plurality of adsorption members for adsorbing the substrate, A substrate pressing device characterized in that the pressing members are provided in multiple quantities so as to correspond to the respective positions of the multiple suction members.

2. The support member is fixed vertically above the substrate mounting member, The substrate mounting member is provided with a first lifting means for raising and lowering the substrate mounting member, The substrate pressing device according to claim 1, characterized in that the substrate mounting member is raised by the first lifting means to bring the substrate mounting member and the support member closer together.

3. The support member is provided vertically above the substrate mounting member, The system includes a second lifting means for raising and lowering the support member, The substrate pressing device according to claim 1, characterized in that the support member is lowered by the second lifting means to bring the substrate mounting member and the support member closer together.

4. When the pressing member and the substrate are separated, the vertical downward direction of the pressing member The substrate pressing device according to claim 1, characterized in that a plurality of pressing members are provided such that the tip of each member is lower at a position opposite the center of the substrate and gradually rises towards the periphery of the substrate.

5. The substrate pressing device according to any one of claims 1 to 4, characterized in that the pressing member has a shaft portion inserted into a shaft hole provided in the support member, and the shaft portion is provided with stoppers above and below the support member in the vertical direction, respectively, which restrict the vertical movement range of the pressing member.

6. The substrate pressing device according to claim 5, characterized in that the shaft portion is provided with a weight for adjusting the weight of the pressing member.

7. The substrate pressing device according to claim 6, characterized in that the weight is provided vertically below the support member.

8. The substrate pressing device according to claim 6 or 7, characterized in that the weight also functions as a stopper that restricts the vertical movement range of the pressing member.

9. The substrate pressing device according to any one of claims 1 to 8, characterized in that the support member is attached to the ceiling of the chamber.

10. A film deposition source for forming a thin film on the substrate, A substrate pressing device according to any one of claims 1 to 9, A film deposition apparatus characterized by comprising the following features.

Images