Antenna core sheet and IC card

Abstract

To provide an antenna core sheet capable of ensuring connection reliability between a winding of a winding antenna and a copper pad without surface treatment such as a plating layer on the surface of the copper pad of the antenna core sheet.SOLUTION: An antenna core sheet 1 which is used for an IC card having a wireless communication function using a winding antenna composed of a coiled winding 8, includes a resin sheet 13, at least a pair of copper pads 7 provided in through holes of the resin sheet and conducting the front and back sides, and a winding antenna which is electrically connected to these copper pads and in which at least a part in the thickness direction of the winding in a region other than the copper pads is recessed into the sheet. The composition of the copper pad is a copper alloy containing 1.0 to 11.0 wt% of tin.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an antenna core sheet using a winding antenna used in a dual IC card or a non-contact IC card. More specifically, it relates to an antenna core sheet with improved connection reliability between the winding antenna and the electrode on the core sheet side.

Background Art

[0002] In IC cards equipped with a winding antenna such as a dual IC card or a non-contact IC card, an antenna core sheet of a type in which the winding antenna is embedded in a resin sheet is mainstream.

[0003] Dual IC cards and non-contact IC cards are composed of a laminate as exemplified in FIGS. 2 and 6, and antenna core sheets 1 and 1-1 are used at the center of the laminate.

[0004] As shown in FIGS. 1(e) and 2, the antenna core sheet 1 is provided with copper pads 7 penetrating through the sheet. On one surface of the antenna core sheet 1, a winding 8 is provided, which constitutes a winding antenna, and at the same time, the windings 8 at both terminal portions of the winding antenna are connected to the copper pads 7. A plating layer such as tin may be formed on the surface of the copper pad 7 for the purpose of ensuring connection reliability. Similarly, as shown in FIGS. 5(e) and 6, in the antenna core sheet 1-1, a plating layer such as tin may be formed on the surface of the pad electrode 19-2 of the non-contact IC module 9-2 for the purpose of ensuring connection reliability.

[0005] However, in order to form a plating layer on the surface of copper pads or pad electrodes of IC modules, a plating process is required, so equipment therefor is indispensable. In addition, the manufacturing process becomes longer and the necessary materials also increase, so cost increase cannot be avoided. Therefore, a technology that does not require plating treatment has been long awaited.

[0006] Prior art related to ensuring connection reliability between windings and pad electrodes without surface treatment such as plating on the surface of pad electrodes such as copper pads that connect windings includes, for example, Patent Document 1, which discloses a technology aimed at providing an enameled wire that allows for quick and easy soldering work, high connection reliability, and thereby significantly improves the quality and productivity of antenna coils, even though the soldering of the enameled wire terminals can be omitted. Specifically, the disclosed enameled wire has a solder plating layer on the surface of the copper wire, and an enamel layer is provided on top of the solder plating layer.

[0007] However, this technology eliminates the need for soldering the ends of the enamel wires by providing a solder plating layer on the copper wires of the antenna coil windings (enamel wires). This is different from the technology that ensures connection reliability between the windings and copper pads by not applying a surface treatment such as a plating layer to the surface of the copper pads of the antenna core sheet. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2000-133053 [Overview of the Initiative] [Problems that the invention aims to solve]

[0009] In view of the above circumstances, the object of the present invention is to provide an antenna core sheet that can ensure the reliability of the connection between the windings of a wound antenna and the copper pads without applying a surface treatment such as a plating layer to the surface of the copper pads of the antenna core sheet. [Means for solving the problem]

[0010] As a means of solving the above problems, the invention described in claim 1 of the present invention is an antenna core sheet for use in an IC card having a wireless communication function using a wound antenna consisting of a coil-shaped winding, A sheet made of an insulating material, The sheet has through holes and comprises at least one pair of copper pads that are electrically conductive on both sides, The device comprises a wound antenna electrically connected to these copper pads, wherein at least a portion of the winding in the thickness direction is embedded in the sheet in the portion other than the copper pads, The composition of the copper pad is tin 5.5~9.0 This antenna core sheet is characterized by containing wt% phosphor bronze.

[0011] This invention is based on the discovery that, instead of forming a surface treatment layer such as a tin plating layer on the surface of a copper pad made of 99.9 wt% or more copper, such as oxygen-free copper, the same level of connection reliability as when a tin plating layer is formed can be ensured by using a copper alloy containing at least tin as the material of the copper pad.

[0013] Also, Claim 2 The invention described is Antenna core sheet according to claim 1 This IC card is characterized by the use of [a specific technology / feature]. [Effects of the Invention]

[0014] In the antenna core sheet of the present invention, the copper pad provided in the antenna core sheet contains 1.0 to 11.0 wt% tin. Phosphor bronze This is the result. Therefore, even though the copper pad surface is not treated with tin plating or other surface treatments, the bonding strength is equivalent to that of a copper pad with tin plating on the surface of rolled copper. Specifically, it is possible to obtain an antenna core sheet that has the same bonding strength as a tin-plated copper pad, and in which the failure state of the joint is winding breakage without interfacial delamination.

[0015] Furthermore, the IC card of the present invention is manufactured using the antenna core sheet of the present invention. Therefore, even though the surface of the copper pad is not treated with tin plating or other surface treatments, it is possible to ensure the reliability of the connection between the winding of the wound antenna and the copper pad. [Brief explanation of the drawing]

[0016] [Figure 1] Cross-sectional explanatory view illustrating the manufacturing process of the antenna core sheet of a dual IC card. [Figure 2] Cross-sectional explanatory view illustrating the laminated structure of the laminate for a dual IC card. [Figure 3] Cross-sectional explanatory view illustrating the laminated structure of a dual IC card. [Figure 4] Cross-sectional explanatory view illustrating the laminated structure of a dual IC card. [Figure 5] Cross-sectional explanatory view illustrating the manufacturing process of the antenna core sheet of a contactless IC card. [Figure 6] Cross-sectional explanatory view illustrating the laminated structure of a contactless IC card. [Figure 7] Explanatory view explaining the tensile test method for measuring the peel strength of the winding connected on the copper pad.

Mode for Carrying Out the Invention

[0017] The IC card of the present invention is manufactured using the antenna core sheet of the present invention. <Antenna core sheet> First, the antenna core sheet of the present invention will be described. The antenna core sheet 1 of the present invention is equivalent in form to a conventional antenna core sheet, and is an antenna core sheet used for an IC card having a wireless communication function using a coil-shaped winding antenna (see Fig. 1(e)).

[0018] The antenna core sheet 1 of the present invention includes a resin sheet 13 made of an insulating material, at least a pair of copper pads 7 provided in the through holes (holes 14) of the sheet 13 and conducting through the front and back, and a winding antenna (not shown) composed of a winding 8 electrically connected to the copper pads 7 and at least a part of the winding 8 in the thickness direction other than the copper pads 7 being recessed into the resin sheet 13 (see Fig. 1).

[0019] The distinguishing features of the antenna core sheet 1 of the present invention lie in the composition of the copper pad 7 and its thermal conductivity. Specifically, the copper pad 7 is a copper alloy containing 1.0 to 11.0 wt% tin, and the thermal conductivity of this copper alloy is 25 to 115 (W / m·K). This is because if the thermal conductivity exceeds 115 (W / m·K), the amount of heat required for crimping the winding and the copper pad portion will easily escape.

[0020] By making the copper pad from a copper alloy containing 1.0 to 9.0 wt% tin, tin is present on the surface of the copper pad, and its thermal conductivity is half or less than that of oxygen-free copper. Therefore, when the heated press head 17 presses the winding 8 on the copper pad 7 (see Figure 1(d)), the heat from the press head 17 is less likely to escape through the copper pad 7, thus preventing a significant drop in temperature. Furthermore, the presence of tin improves the bonding between the copper wire of the winding 8 and the copper alloy constituting the copper pad 7. This is thought to be because the tin in the copper pad 7 and the copper in the winding 8 react to form an alloy, promoting structural integration and resulting in both a good mechanical and electrical bond.

[0021] Furthermore, if the tin content is less than 1.0 wt%, the connection reliability between the winding and the copper pad becomes insufficient. Also, if the tin content exceeds 9.0 wt%, the connection reliability becomes insufficient.

[0022] <Manufacturing method for antenna core sheets> The antenna core sheet 1 is manufactured through the process illustrated in Figure 1. Figure 1(a) is a cross-sectional view illustrating the sheet hole punching process, where holes 14 are formed at the positions where the copper pads are to be formed on the resin sheet 13. Methods for forming the holes 14 include, for example, punching using a punching blade or cutting using a laser beam.

[0023] Figure 1(b) is a cross-sectional view illustrating the process of forming the copper pad 7 in the hole 14. Specifically, the copper pad 7 is formed from copper foil through a process such as cutting or punching.

[0024] Figure 1(c) is a cross-sectional view illustrating the winding drawing process. A winding 8, made of insulated copper wire such as enameled wire, is pressed into a resin sheet 13. For example, a wire drawing winding coil. Using a winding drawing device such as an antenna manufacturing device, the resin sheet 13 is heated and softened, and the winding 8 is pressed in while drawing a desired pattern, thereby forming a winding antenna in which about half or more of the thickness of the winding 16 is embedded in the resin sheet 13. However, the winding 8 that connects to the copper pad 7 is positioned straddling the copper pad 7.

[0025] Figure 1(d) shows that by pressing a heated press head 17 onto the winding 8, which is positioned across the copper pad 7, the insulating coating of the winding 8 is melted, and the copper wire core and the copper pad 7 are joined together, resulting in a mechanically and electrically connected antenna core sheet with high connection reliability. To ensure connection reliability in this process, a plating layer made of tin or the like is formed on the surface of the copper pad 7.

[0026] Figure 1(e) shows that the antenna sheet 1 of the present invention is obtained when the pressing process by the press head 17 is completed on the winding 8 which is arranged across the copper pad 7.

[0027] <ICカード> Next, the IC card of the present invention will be described. The IC card of the present invention is an IC card equipped with a wound antenna and wireless communication functionality. Specifically, it includes contactless IC cards, dual IC cards and hybrid IC cards that combine the functions of both contact and contactless IC cards. A dual IC card is a form in which one IC module performs the functions of both a contact and contactless IC card, while a hybrid IC card is a form in which the functions of a contact and contactless IC card are performed by separate IC chips or IC modules. Since hybrid IC cards are similar to contactless IC cards in terms of the connection between the wound antenna and copper pads, dual IC cards and contactless IC cards will be described here.

[0028] (Dual IC card) The dual IC cards 10 and 10-1 of the present invention (see Figures 3 and 4) are manufactured using the antenna core sheet 1 of the present invention (see Figures 1 and 2).

[0029] First, a laminate with a layered structure as illustrated in Figure 2 is formed, including the antenna core sheet 1 of the present invention. In this laminate, the core sheet 2, the front intermediate sheet 3, and the front oversheet 4 are laminated in this order on the side of the antenna core sheet 1 where the windings 8 are not arranged. On the other hand, the back intermediate sheet 5 and the back oversheet 6 are laminated in this order on the side of the antenna core sheet 1 where the windings 8 are arranged. Furthermore, the winding 8 is connected to the copper pad 7 of the antenna core sheet 1, and by connecting an external circuit to the copper pad 7, it can be connected to an antenna consisting of the winding 8.

[0030] By countersinking a position in the laminated antenna core sheet 1 shown in Figure 2 where the copper pad 7 can be exposed, a recess is formed into which the dual IC module 9 illustrated in Figure 3 can be inserted. By inserting the dual IC module 9 into this recess and electrically connecting the copper pad 7 and the pad electrodes 19 of the dual IC module 9 with AgP (Ag Paste, silver paste) 12, a dual IC card 10 can be obtained.

[0031] In the dual IC card 10 (see Figure 3), the core sheet 2, the back intermediate sheet 5, and the back oversheet 6 are sequentially stacked on the side of the antenna core sheet 1 that has the winding 8. On the other hand, on the side of the antenna core sheet 1 opposite to the side with the winding 8, the core sheet 2, the front intermediate sheet 3, and the front oversheet 4 are sequentially stacked.

[0032] Figure 4 shows a slightly different layer configuration from the dual IC card 10, where the material electrically connecting the copper pad 7 and the pad electrode 19-1 of the dual IC module 9-1 is ACF (An). This is a cross-sectional view showing a dual IC card 10-1, which is an isotropic conductive film. In the layer configuration shown in Figure 4, the dual IC module 9-1 side does not have a core sheet 2. Even in this configuration, in order to ensure the connection reliability between the winding 8 and the copper pad 7, a plating layer made of tin or the like is formed on the surface of the copper pad 7.

[0033] Furthermore, on the front oversheet 4 side, a recess is formed at a position where the surface of the copper pad 7 can be exposed in a plan view, and the dual IC module 9 is inserted into this recess. The depth of the recess is equal to the thickness of the dual IC module 9, and is just deep enough to accommodate the dual IC module 9.

[0034] Furthermore, the pad electrode 19, which is a connection electrode for external circuits provided on the dual IC module 9, and the copper pad 7 of the antenna core sheet 1 are electrically connected.

[0035] In the dual IC card 10-1 (see Figure 4), the core sheet 2, the back intermediate sheet 5, and the back oversheet 6 are sequentially stacked on the side of the antenna core sheet 1 that has the winding 8. On the other hand, the front intermediate sheet 3 and the front oversheet 4 are sequentially stacked on the side of the antenna core sheet 1 opposite to the side with the winding 8.

[0036] Furthermore, on the front oversheet 4 side, a recess is formed at a position where the surface of the copper pad 7 can be exposed in a plan view, and the dual IC module 9-1 is inserted into this recess. The depth of the recess is equal to the thickness of the dual IC module 9-1, and is just deep enough to accommodate the dual IC module 9-1.

[0037] Furthermore, the pad electrode 19-1, which is a connection electrode for external circuits provided on the dual IC module 9-1, and the copper pad 7 of the antenna core sheet 1 are electrically connected. Figure 4 illustrates the case where this connection is made by an ACF (anisotropic conductive film) 11.

[0038] (Contactless IC card) Next, we will explain contactless IC cards and their manufacturing process. First, an antenna core sheet for contactless IC cards is manufactured using the process illustrated in Figure 5.

[0039] Figure 5(a) is a cross-sectional view illustrating the sheet hole punching process for forming a hole 14' in the resin sheet 13 for installing the contactless IC module 9-2. Methods for forming the hole 14' include, for example, punching using a punching blade or cutting using a laser beam.

[0040] Figure 5(b) is a cross-sectional view illustrating the contactless IC installation process in which the contactless IC module 9-2 is installed in the hole 14'. The contactless IC module 9-2 is equipped with contactless IC module pad electrodes 19-2 and can be electrically connected to external circuits, etc.

[0041] Figure 5(c) is a cross-sectional view illustrating the winding drawing process, in which a winding 8, which will serve as a winding antenna, is embedded in the resin sheet 13 on the pad electrode 19-2 side of the non-contact IC module on the substrate obtained in the non-contact IC installation process shown in Figure 5(b), while drawing the shape of the winding antenna. In this process, the winding 8 is also placed on the pad electrode 19-2 of the non-contact IC module. The winding 8 is in a state where it is simply placed.

[0042] Figure 5(d) shows the winding 8 placed on the pad electrodes 19-2 of the non-contact IC module. This is a cross-sectional view illustrating the bonding process, in which heat is applied with the pressure head 17 and pressed against the pad electrode 19-2 side to create a bond and electrical connection.

[0043] Figure 5(e) shows the state after the pressing process by the press head 17 on the winding 8, which is positioned across the pad electrode 19-2, has been completed, and the antenna sheet 1-1 of the present invention has been obtained.

[0044] Figure 6 is a cross-sectional diagram illustrating a contactless IC card 10-2. On the side of the antenna core sheet 1-1 for the contactless IC card shown in Figure 5, where the winding 8 is located, the core sheet 2, the back intermediate sheet 5, and the back oversheet 6 are sequentially laminated. On the opposite side of the antenna core sheet 1-1 from where the winding 8 is located, the core sheet 2, the front intermediate sheet 3, and the front oversheet 4 are sequentially laminated. The antenna core sheet 1-1 has a contactless IC module installed in a hole 14' formed in the resin sheet 13, and the winding 8 of the wound antenna is connected to the pad electrode 19-2.

[0045] (Core sheet) Examples of resin materials for core sheet 2 include polyolefin resins such as polyethylene terephthalate, polybutylene terephthalate, polypolypropylene, and polymethylpentene; polyfluoroethylene resins such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, and ethylene-tetrafluoroethylene copolymer; polyamide resins such as nylon-6 and nylon-6-6; vinyl resins such as polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyvinyl alcohol, and vinylon; cellulose resins such as cellulose triacetate and cellophane; acrylic resins such as polymethyl methacrylate, polyethyl methacrylate, polyethyl acrylate, and polybutyl acrylate; polystyrene resins; polycarbonate; and polyimide resins. The resin material content is preferably 30% by mass or more and 80% by mass or less. The color and transmittance of each layer sheet can be selected to suit the respective purpose.

[0046] (Intermediate sheet) The resin material for the intermediate sheets 3 and 5 can be the same as the resin material for the core sheet 2.

[0047] (Oversheet) The resin material for the oversheets 4 and 6 can be the same as the resin material for the core sheet 2.

[0048] (Resin sheet) The resin material of the resin sheet 13 can be the same as the resin material of the core sheet 2.

[0049] (winding) The winding 8 is preferably made of a highly conductive metal such as copper or aluminum with an insulating coating, but it is not limited to these metal materials. For example, an enameled wire with a copper wire core can be used. [Examples]

[0050] Next, embodiments of the present invention will be described. <Example 1> The antenna core sheet 1 was manufactured using the manufacturing process illustrated in Figure 1. First, as the resin sheet 13, we have polyethylene terephthalate (PET) with a thickness of 100 μm. I prepared the film. Next, a 5.2 x 5.2 mm hole 14 was formed in the PET film at the desired location using a punching machine, aligned with the position of the pad electrode 19 of the dual IC module 9 to be used (see Figure 3). Next, copper pads measuring 5 x 5 mm were manufactured using a punching machine and placed to form copper pads 7 in the created holes 14. As the metal material for forming the copper pads 7, phosphor bronze (model number: C5210R-H) with the components and thermal conductivity described in the column for Example 1 of Table 1 was used. Next, the windings 8 placed on the formed copper pad 7 were connected by pressing them against the copper pad 7 with the heated press head 17 of the bonding machine.

[0051] <Example 2> The procedure was the same as in Example 1, except that the metal material used to form the copper pad 7 was phosphor bronze (model number: C5191P-H) having the components and thermal conductivity described in the column for Example 2 in Table 1.

[0052] <Example 3> The procedure was the same as in Example 1, except that the metal material used to form the copper pad 7 was phosphor bronze (model number: C5240) having the components and thermal conductivity described in the column for Example 3 of Table 1.

[0053] <Comparative Example 1> The procedure was the same as in Example 1, except that the metal material used to form the copper pad 7 was tin-plated rolled copper foil (model number: SnCu-O) as described in the Comparative Example 1 column of Table 1. This is a conventional technique in which a tin-plated layer is formed on a copper pad.

[0054] <Comparative Example 2> The procedure was the same as in Example 1, except that the metal material used to form the copper pad 7 was oxygen-free copper (model number: C1020R-H) having the components and thermal conductivity described in the Comparative Example 2 column of Table 1.

[0055] <Comparative Example 3> The procedure was the same as in Example 1, except that the metal material used to form the copper pad 7 was nickel silver (model number: 7701R-H) having the components and thermal conductivity described in the Comparative Example 3 column of Table 1.

[0056] <Rating> Table 1 summarizes the evaluation results for bonding strength from Example 1 to Comparative Example 3, and the overall evaluation based on these results. For bonding strength in connection reliability evaluation, ○ (good) was used when peel strength was measurable and the winding fractured, △ (caution required) when peel strength was measurable and delamination occurred at the bonding interface, and × (poor) when peel strength was not measurable (almost 0) and delamination occurred at the bonding interface. Regarding the failure state, ○ (good) was used when the winding fractured, and × (poor) was used when interfacial delamination occurred at the joint point 18 between the copper pad 7 and the winding 8.

[0057] To measure the bonding strength, samples were prepared by bonding windings 8 to the copper pads 7 of the antenna core sheet 1 samples fabricated in Examples 1 to Comparative Example 3, as shown in Figure 7. For these samples, the windings 8 were folded back at the joint point 18 as illustrated in the tensile direction in Figure 7, and a load was applied in the 180-degree direction. The load at which the windings 8 broke or delamination occurred at the joint point 18 was measured.

[0058] [Table 1]

[0059] In Example 1, the copper pad 7 was made of phosphor bronze (model number: C5191P-H) with a tin concentration of 7.0 wt% to 9.0 wt%, and had a thermal conductivity of 67 (W / m·K), good bonding strength (〇), and fracture state (good). Since both connection reliability was good, the overall evaluation was 〇 (good).

[0060] In Example 2, the copper pad 7 was made of phosphor bronze (model number: C5210R-H) with a tin concentration of 5.5 wt% to 7.0 wt%, and had a thermal conductivity of 63 (W / m·K), good bonding strength (〇), and fracture state (good). Since both connection reliability was good, the overall evaluation was 〇 (good).

[0061] In Example 3, the copper pad 7 was made of phosphor bronze (model number: C5240) with a tin concentration of 9.0 wt% to 11.0 wt%. The bonding strength was good (〇), the failure state was fracture (good), and the connection reliability was good, so the overall evaluation was 〇 (good).

[0062] Comparative Example 1 is a copper pad with a tin plating layer formed on its surface, which has been used conventionally. The sample used was tin-plated rolled copper foil (model number: SnCu-O). The bonding strength was good (〇), the failure state was fracture (good), and the connection reliability was good, so the overall evaluation was 〇 (good).

[0063] In Comparative Example 2, the copper pad 7 was made of oxygen-free copper (model number: C1020R-H), with a thermal conductivity of 349 (W / m·K), a bonding strength of "caution required" (△), and a failure state of interfacial delamination (poor). As a result of poor connection reliability, the overall evaluation was × (poor).

[0064] In Comparative Example 3, the copper pad 7 was made of nickel silver (model number: C7701R-H), with a thermal conductivity of 23 (W / m·K), a bonding strength of caution (△), and a failure state of interfacial delamination (poor). As a result of poor connection reliability, the overall evaluation was × (poor). [Explanation of Symbols]

[0065] 1. 1-1... Antenna core sheet 2. Core Sheet 3...Table Intermediate Sheet 4. Overlay sheet 5...Back intermediate sheet 6. Back oversheet 7. Copper pad 8. Winding 9, 9-1... Dual IC Module 9-2...Contactless IC Module 10, 10-1... Dual IC card 10-2...Contactless IC card 11···AFC 12···AgP 13. Resin sheet 14, 14'...hole 17. Press Head 18... Junction point 19, 19-1... (Pad electrodes of dual IC module)

Claims

1. An antenna core sheet for use in an IC card having wireless communication functionality using a wound antenna consisting of a coil-shaped winding, A sheet made of an insulating material, The sheet has through holes and comprises at least one pair of copper pads that are electrically conductive on both sides, The device comprises a wound antenna electrically connected to these copper pads, wherein at least a portion of the winding in the thickness direction is embedded in the sheet in the portion other than the copper pads, The antenna core sheet is characterized in that the composition of the copper pad is phosphor bronze containing 5.5 to 9.0 wt% tin.

2. An IC card characterized by using the antenna core sheet described in Claim 1.

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