heat sink

Abstract

To provide a heat sink with excellent thermal connectivity between a base and heat dissipating fins, and also with excellent flexibility in the arrangement of heat-conductive members.SOLUTION: A heat sink has a base portion having a first surface and a second surface opposite the first surface, and to which a heating element is thermally connected to the second surface, and a heat radiation fin erected on said first surface of the base portion, and the base portion and the heat radiation fin are integrally molded into the heat sink, and at least a portion of a heat conductive member is embedded in the heat sink.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a heat sink having a base portion to which a heating element is thermally connected and heat radiation fins, and particularly to a heat sink in which a heat conductive member is embedded.

Background Art

[0002] As a means for cooling a heating element such as an electronic component installed in a predetermined space, a heat sink in which heat radiation fins are provided on a base portion to which the heating element is thermally connected may be used. Further, with the high functionality of various devices, the amount of heat generated by heating elements such as electronic components mounted on the devices has been increasing, and it has become increasingly important to improve the cooling performance of the heat sink.

[0003] In order to improve the cooling performance of the heat sink, it is necessary to improve the fin efficiency of the heat radiation fins provided on the heat sink. Therefore, a heat pipe is provided along the planar direction on the base portion of the heat sink, and by the heat transport function of the heat pipe, the heat from the heating element is transported to the entire region of the base portion where the heat radiation fins are provided. By transporting the heat from the heating element to the entire region of the base portion where the heat radiation fins are provided using the heat pipe, the base portion is made isothermal and the thermal load of the entire heat radiation fins is made uniform, improving the fin efficiency of the heat radiation fins.

[0004] When providing a heat pipe on the base portion of the heat sink, it is necessary to improve the thermal connectivity between the heat pipe and the heat radiation fins. Therefore, at least a part of the container for the heat pipe and one end portion of a plurality of heat radiation fins are held inside the cavity so that the heat radiation fins stand with respect to the container, and then molten metal is injected into the cavity and the molten metal is solidified to integrally cast and connect the one end portion of the heat radiation fins and the container, and a heat sink has been proposed (Patent Document 1).

[0005] In Patent Document 1, the heat pipe container and one end of the heat dissipation fins are integrally cast together by a cover, which is a base formed by solidifying molten metal, and the heat dissipation fins are connected to the container in an upright position, thereby improving the thermal connectivity between the heat dissipation fins and the heat pipe container.

[0006] On the other hand, in Patent Document 1, the heat dissipation fins, cover, and heat pipe container, which are separate components, are cast together to form a single unit. As a result, there is contact resistance between the heat dissipation fins and the cover, and there was a need to improve the thermal connectivity between the heat dissipation fins and the cover, i.e., the heat transfer from the cover to the heat dissipation fins. Furthermore, in Patent Document 1, due to the contact resistance between the heat dissipation fins and the cover, there was also a problem in terms of equalizing the thermal load across the entire heat dissipation fin and improving the fin efficiency of the heat dissipation fin.

[0007] Furthermore, for example, in recent years, mobile phone base stations have seen a significant increase in wireless communication traffic, leading to the use of circuit boards with a complex arrangement of numerous electronic components, including relatively low-heat-generating components such as antennas and amplifiers, and high-heat-generating components such as FPGAs (Field Programmable Gate Arrays). When a large number of electronic components with diverse heat-generating properties mounted on the aforementioned circuit board are thermally connected to a heat sink, it becomes difficult to maintain uniform heat distribution at the base of the heat sink. This can result in uneven heat transfer to the heat dissipation fins, potentially reducing the efficiency of the heat dissipation fins.

[0008] Furthermore, in order to prevent interference between electronic components, a shield portion, which is a recess corresponding to the position and shape of the electronic components, may be formed on the heat-receiving surface of the base portion of the heat sink, and the electronic components mounted on the substrate may be shielded by housing the electronic components in the shield portion. When a shield portion is provided on the heat-receiving surface of the base portion of the heat sink, when heat conduction members such as heat pipes are provided on the base member, it is necessary to position the heat conduction members so as to avoid the shield portion. Therefore, when a shield portion is provided on the heat-receiving surface of the base portion, the degree of freedom in positioning heat conduction members such as heat pipes is reduced, which poses a problem in terms of equalizing the thermal load on the entire heat dissipation fin and improving the fin efficiency of the heat dissipation fin. [Prior art documents] [Patent Documents]

[0009] [Patent Document 1] Japanese Patent Application Publication No. 11-083361 [Overview of the Initiative] [Problems that the invention aims to solve]

[0010] In view of the above circumstances, the present invention aims to provide a heat sink that has excellent thermal connectivity between the base and the heat dissipation fins, and excellent freedom in the arrangement of the heat conductive members. [Means for solving the problem]

[0011] The gist of the present invention is as follows: [1] A base portion having a first surface and a second surface facing the first surface, wherein a heating element is thermally connected to the second surface, The base portion comprises heat dissipation fins erected on the first surface of the base portion, This is a heat sink in which the base portion and the heat dissipation fins are integrally molded. A heat sink in which at least a portion of a heat conductive member is embedded. [2] The heat sink according to [1], having a block portion extending in the direction of extension of the base portion, wherein the heat conductive member is embedded in the block portion. [3] The heat sink according to [1], wherein the heat conductive member is embedded in the base portion. [4] The heat sink according to [2], wherein the block portion is a convex portion of the first surface of the base portion that protrudes from the first surface of the base portion in the thickness direction of the base portion. [5] The heat sink according to [2], wherein the block portion is a convex portion of the second surface of the base portion that protrudes from the second surface of the base portion in the thickness direction of the base portion. [6] The heat sink according to [2], wherein the heat dissipation fin has a tip portion in the height direction of the heat dissipation fin and a base portion which is the starting portion of the rise from the base portion, and the block portion is provided in the intermediate portion between the tip portion and the base portion of the heat dissipation fin. [7] The heat sink according to any one of [1] to [6], wherein the heat conductive member has a heat receiving portion that is thermally connected to the heat generating element. [8] The heat sink according to any one of [1] to [6], wherein the entire heat conductive member is embedded in the heat sink. [9] The heat sink according to [1], wherein at least a portion of the heat conductive member has an exposed portion that is exposed from the second surface of the base portion, and the exposed portion is in direct contact with the heating element.

[10] The heat sink according to [5], wherein at least a portion of the heat conductive member has an exposed portion that is exposed from a protrusion on the second surface, and the exposed portion is in direct contact with the heat generating element.

[11] The heat sink according to any one of [1] to [6], wherein the heat conductive member extends along the extending direction of the base portion.

[12] The heat sink according to [9] or

[10] , wherein the heat conductive member has a stepped portion bent in the thickness direction of the base portion, and the exposed portion is formed by the stepped portion.

[13] The heat sink according to [9] or

[10] , wherein the heat conductive member has a projection that protrudes in the thickness direction of the base portion, and the exposed portion is formed by the projection.

[14] The heat sink according to any one of [1] to [6], wherein the heat conducting member is a heat pipe or a vapor chamber.

[15] The heat sink according to any one of [1] to [6], wherein the heat sink is a cast member and the heat conductive member is embedded in the heat sink by casting.

[16] The heat sink according to

[14] , wherein a sealed injection tube used for injecting a working fluid into the heat pipe or the vapor chamber is provided inward from the periphery of the heat sink.

[17] The heat sink according to

[14] , wherein the heat pipe is a flattened, flattened heat pipe.

[0012] In an embodiment of the heat sink of the present invention, the heat sink comprises a base portion to which a heat-generating element is thermally connected, heat dissipation fins which are heat exchange means, and a heat conductive member. Furthermore, in an embodiment of the heat sink of the present invention, the base portion and the heat dissipation fins are integrally molded, so the base portion and the heat dissipation fins are a single component, and no boundary portion is formed between the base portion and the heat dissipation fins.

[0013] Furthermore, in the embodiment of the heat sink of the present invention, since at least a portion of the heat conductive member is embedded in the heat sink, the outer surface of at least a portion of the heat conductive member is not exposed from the surface of the base portion. [Effects of the Invention]

[0014] According to an embodiment of the heat sink of the present invention, the heat sink comprises a base portion having a first surface and a second surface facing the first surface, to which a heating element is thermally connected, and heat dissipation fins erected on the first surface of the base portion, and the base portion and the heat dissipation fins are integrally molded, so that the contact resistance between the base portion and the heat dissipation fins is suppressed and the thermal connectivity between the base portion and the heat dissipation fins is improved. Furthermore, according to an embodiment of the heat sink of the present invention, at least a portion of the heat conductive member is embedded in the heat sink, so that there is excellent freedom in the arrangement of the heat conductive member in the heat sink, and the thermal connectivity of the heat conductive member in the heat sink is excellent. Accordingly, according to an embodiment of the heat sink of the present invention, even if a large number of electronic components with various heat generation amounts are thermally connected to the heat sink, the uniformity of the heat of the base portion of the heat sink can be maintained, and the heat transfer from the base portion to the entire heat dissipation fins is equalized, so that the heat transfer from the base portion to the heat dissipation fins is smoothed, and the thermal load on the entire heat dissipation fins is made uniform. Therefore, the heat sink of the present invention improves the fin efficiency of the heat dissipation fins, thereby improving the heat dissipation characteristics of the heat sink.

[0015] According to an embodiment of the heat sink of the present invention, the base portion has a block portion that extends in the extending direction, and the heat conductive member is embedded in the block portion, thereby ensuring that the embedded portion of the heat conductive member is securely located.

[0016] According to an embodiment of the heat sink of the present invention, since the heat conductive member is embedded in the base portion, the entire base portion is smoothly heated uniformly by the heat conductive function of the heat conductive member, and the heat transfer from the base portion to the entire heat dissipation fin is made uniform. This further uniformizes the thermal load on the entire heat dissipation fin and further improves the fin efficiency of the heat dissipation fin.

[0017] According to the aspect of the heat sink of the present invention, since the block portion is a convex portion of the first surface protruding from the first surface of the base portion in the thickness direction of the base portion, the entire base portion is surely equalized in temperature by the heat conduction function of the heat conduction member, and heat transfer from the base portion is surely equalized throughout the entire radiation fin. Therefore, the heat load throughout the entire radiation fin can be further uniformized, the fin efficiency of the radiation fin can be further improved, and the heat exchange function of the radiation fin can be surely improved.

[0018] According to the aspect of the heat sink of the present invention, since the block portion is provided in the middle portion between the tip portion and the base portion of the radiation fin, the entire radiation fin is surely equalized in temperature by the heat conduction function of the heat conduction member, so that the fin efficiency of the radiation fin can be surely improved.

[0019] According to the aspect of the heat sink of the present invention, since the entire heat conduction member is embedded in the heat sink, the thermal connectivity of the heat conduction member in the heat sink is further improved.

[0020] According to the aspect of the heat sink of the present invention, at least a partial region of the heat conduction member has an exposed portion exposed from the second surface of the base portion, and since the exposed portion is in direct contact with the heat generating body, the thermal connectivity between the heat generating body and the heat conduction member is further improved, so that the heat radiation characteristics of the heat sink are further improved.

[0021] According to the aspect of the heat sink of the present invention, since the heat conduction member is a heat pipe or a vapor chamber, the heat conduction member has heat transport characteristics, so that the heat load throughout the entire radiation fin can be further uniformized and the fin efficiency of the radiation fin can be further improved.

[0022] According to the aspect of the heat sink of the present invention, since the heat sink is a casting member and the heat conduction member is embedded in the heat sink by casting, the thermal connectivity of the heat conduction member in the heat sink is further improved. <

[0023] According to an embodiment of the heat sink of the present invention, since the sealed injection tube of the heat pipe or the vapor chamber is provided inward from the peripheral edge of the heat sink, corrosion of the heat pipe or vapor chamber is prevented even when the heat sink is installed in an external environment exposed to wind and rain, etc., thereby improving the durability of the heat sink.

[0024] According to an embodiment of the heat sink of the present invention, the fact that the heat pipe is a flattened heat pipe contributes to miniaturization of the heat sink. [Brief explanation of the drawing]

[0025] [Figure 1] This is a perspective view illustrating a heat sink according to a first embodiment of the present invention. [Figure 2] This is an explanatory diagram illustrating the structure of a heat sink according to a first embodiment of the present invention. [Figure 3] This is an explanatory diagram illustrating the arrangement of the heat conduction members of a heat sink according to a first embodiment of the present invention, viewed from a planar direction. [Figure 4] This is a side cross-sectional view of a heat sink according to a first embodiment of the present invention, shown along line AA in Figure 3. [Figure 5] This is an explanatory diagram of an injection pipe used in a heat pipe provided in a heat sink according to a first embodiment of the present invention. [Figure 6] This is a side cross-sectional view illustrating an injection pipe used in a heat pipe provided in a heat sink according to a first embodiment of the present invention. [Figure 7] This is an explanatory diagram showing an example of how to use a heat sink according to the first embodiment of the present invention. [Figure 8] This is a side cross-sectional view of a heat sink according to a second embodiment of the present invention. [Figure 9] This is a side cross-sectional view of a heat sink according to a third embodiment of the present invention. [Figure 10] This is a side cross-sectional view of a heat sink according to a fourth embodiment of the present invention. [Figure 11] This is a perspective view from the bottom direction illustrating a heat sink according to a fourth embodiment of the present invention. [Figure 12] This is a side cross-sectional view of a heat sink according to a fifth embodiment of the present invention. [Figure 13] This is an explanatory diagram of a heat pipe used in a heat sink according to a fifth embodiment of the present invention. [Figure 14] This is a side cross-sectional view of a heat sink according to a sixth embodiment of the present invention. [Figure 15] This is a side cross-sectional view of a heat sink according to a seventh embodiment of the present invention. [Figure 16] This is a perspective view from the bottom direction illustrating a heat sink according to a seventh embodiment of the present invention. [Figure 17] This is an explanatory diagram of an injection pipe used in a heat pipe provided in a heat sink according to the eighth embodiment of the present invention. [Figure 18] This is an explanatory diagram of an injection pipe used in a heat pipe provided in a heat sink according to the ninth embodiment of the present invention. [Figure 19] This is a side cross-sectional view illustrating an injection pipe used in a heat pipe provided in a heat sink according to the ninth embodiment of the present invention. [Figure 20] This is an explanatory diagram of an injection pipe used in a heat pipe provided in a heat sink according to a tenth embodiment of the present invention. [Figure 21] This is a side view illustrating an injection pipe used in a heat pipe provided in a heat sink according to a 10th embodiment of the present invention. [Figure 22] This is an explanatory diagram illustrating the arrangement of the heat conduction members of a heat sink according to an 11th embodiment of the present invention, viewed from a planar direction. [Figure 23] This is an explanatory diagram illustrating the arrangement of the heat conduction members of a heat sink according to a twelfth embodiment of the present invention, viewed from a planar direction. [Figure 24] This is an explanatory diagram illustrating the arrangement of heat dissipation fins of a heat sink according to the 13th embodiment of the present invention, viewed from a planar direction. [Figure 25]This is an explanatory diagram illustrating the arrangement of heat dissipation fins of a heat sink according to the 14th embodiment of the present invention, viewed from a planar direction. [Figure 26] This is an explanatory diagram illustrating the arrangement of heat dissipation fins of a heat sink according to the 15th embodiment of the present invention, viewed from a planar direction. [Figure 27] This is a side cross-sectional view of a heat sink according to the 16th embodiment of the present invention. [Figure 28] This is a side cross-sectional view of a heat sink according to another embodiment of the present invention. [Figure 29] This is a side cross-sectional view of a heat sink according to another embodiment of the present invention. [Modes for carrying out the invention]

[0026] The heat sink according to the first embodiment of the present invention will be described below with reference to the drawings. Figure 1 is a perspective view illustrating the heat sink according to the first embodiment of the present invention. Figure 2 is an explanatory diagram illustrating the structure of the heat sink according to the first embodiment of the present invention. Figure 3 is an explanatory diagram illustrating the arrangement of the heat conductive members of the heat sink according to the first embodiment of the present invention from a planar direction. Figure 4 is a side cross-sectional view of the heat sink according to the first embodiment of the present invention, taken along line AA in Figure 3.

[0027] As shown in Figures 1 and 2, the heat sink 1 according to the first embodiment comprises a flat base portion 20 and a plurality of heat dissipation fins 10, 10, 10... provided on the surface of the base portion 20. The base portion 20 has a first surface 21 and a second surface 22 facing the first surface 21. The heat generating element 100 is thermally connected to the second surface 22 of the base portion 20. The plurality of heat dissipation fins 10, 10, 10... are erected on the first surface 21 of the base portion 20.

[0028] The base portion 20 is a plate-shaped portion having a first direction L1 and a second direction L2 perpendicular to the first direction L1. The shape of the base portion 20 is not particularly limited, but in the heat sink 1, for the sake of explanation, it is given a rectangular shape in plan view (viewed from a position opposite the heat dissipation fins 10). The heat-generating element 100 comes into contact with the second surface 22 of the base portion 20, thereby thermally connecting the base portion 20 with the heat-generating element 100. Therefore, the second surface 22 of the base portion 20 functions as a heat-receiving surface.

[0029] Multiple plate-shaped heat dissipation fins 10, 10, 10... are erected on the base portion 20. The heat dissipation fins 10 are erected on the first surface 21 of the base portion 20 at a predetermined angle with respect to the extending direction of the first surface 21. In the heat sink 1, the heat dissipation fins 10 are erected in a direction substantially perpendicular to the extending direction of the first surface 21. Each heat dissipation fin 10 extends from one end to the other in the second direction L2 of the base portion 20. In the heat sink 1, for the sake of explanation, the heat dissipation fins 10 extend in a substantially straight line from one end to the other in the second direction L2 of the base portion 20. Each heat dissipation fin 10 extends in a direction substantially parallel to the second direction L2 of the base portion 20 and in a direction substantially perpendicular to the first direction L1. Also, the heat dissipation fins 10 are at substantially the same height from one end to the other in the second direction L2 of the base portion 20.

[0030] Multiple heat dissipation fins 10, 10, 10... are arranged in parallel at predetermined intervals on the first surface 21 of the base portion 20 to form a heat dissipation fin group 11. In the heat sink 1, multiple heat dissipation fins 10, 10, 10... are arranged in parallel from one end to the other in the first direction L1 of the base portion 20 to form a heat dissipation fin group 11. The fin pitch of the multiple heat dissipation fins 10, 10, 10... is not particularly limited, and in the heat sink 1, the multiple heat dissipation fins 10, 10, 10... are arranged in parallel at approximately equal intervals throughout the entire heat dissipation fin group 11.

[0031] In the heat sink 1, the base portion 20 and the multiple heat dissipation fins 10, 10, 10... are integrally molded. That is, the base portion 20 and the multiple heat dissipation fins 10, 10, 10... are combined, and the multiple heat dissipation fins 10, 10, 10... are not erected on the base portion 20. Therefore, the base portion 20 and the multiple heat dissipation fins 10, 10, 10... are a single component, and no boundary portions such as joints, adhesive portions, or seams are formed between the base portion 20 and the multiple heat dissipation fins 10, 10, 10...

[0032] The heat dissipation fin 10 is not provided on the second surface 22 of the base portion 20. Therefore, the heat dissipation fin 10 is provided on one side of the base portion 20. The heat dissipation fin 10 is a thin, flat plate-like portion and has a main surface 12 and side surfaces 13. The main surface 12 mainly contributes to the heat dissipation of the heat dissipation fin 10. The width of the side surfaces 13 constitutes the thickness of the heat dissipation fin 10.

[0033] Since the base portion 20 and the multiple heat dissipation fins 10, 10, 10... are integrally molded, the material of the heat dissipation fins 10 and the material of the base portion 20 are the same. The materials of the heat dissipation fins 10 and the base portion 20 are not particularly limited and can be, for example, copper, copper alloy, aluminum, aluminum alloy, etc.

[0034] As shown in Figures 2, 3, and 4, at least a portion of the heat conductive member 31 is embedded in the heat sink 1. The heat sink 1 has a block portion 40, which is a block-shaped part that extends in the direction of extension of the base portion 20, and the heat conductive member 31 is embedded in the block portion 40. In the heat sink 1, the block portion 40 extends from one end to the other in the second direction L2 of the base portion 20. Also, for the sake of explanation, the block portion 40 extends in a substantially straight line from one end to the other in the second direction L2 of the base portion 20. Therefore, the block portion 40 extends along the direction of extension of the heat dissipation fins 10.

[0035] In the heat sink 1, the block portion 40 is a convex portion of the first surface 21 of the base portion 20 that protrudes in the thickness direction of the base portion 20. The heat dissipation fins 10 that constitute the heat dissipation fin group 11 are also erected on the block portion 40. The block portion 40 is integrally molded with the base portion 20 and the multiple heat dissipation fins 10, 10, 10... Therefore, the block portion 40 is formed continuously with the first surface 21, and no boundary portion such as a joint, adhesive portion, or seam is formed between the block portion 40 and the first surface 21.

[0036] Since multiple heating elements 100, 100, 100... are thermally connected to the second surface 22 of the base portion 20, multiple block portions 40, which are convex portions of the first surface 21, are provided extending from one end to the other in the first direction L1 of the base portion 20. The multiple block portions 40, 40, 40... are positioned in parallel at predetermined intervals.

[0037] Corresponding to the fact that the block portion 40 extends from one end to the other in the second direction L2 of the base portion 20, the heat conductive member 31 extends from one end to the other in the second direction L2 of the base portion 20. Furthermore, corresponding to the fact that the block portion 40 extends substantially linearly from one end to the other in the second direction L2 of the base portion 20, the heat conductive member 31 extends substantially linearly from one end to the other in the second direction L2 of the base portion 20. Therefore, the heat conductive member 31 extends along the extending direction of the base portion 20. In addition, the heat conductive member 31 extends along the extending direction of the heat dissipation fins 10. That is, the heat conductive member 31 extends in a direction substantially parallel to the extending direction of the heat dissipation fins 10. Furthermore, the heat conductive member 31 is provided on each of the multiple block portions 40, 40, 40... which are convex portions of the first surface 21. Accordingly, corresponding to the fact that multiple block sections 40, 40, 40... are positioned in parallel at predetermined intervals from one end to the other in the first direction L1 of the base section 20, multiple heat conductive members 31, 31, 31... are positioned in parallel at predetermined intervals from one end to the other in the first direction L1 of the base section 20. From the above, the multiple heat conductive members 31, 31, 31... are arranged in parallel along the first direction L1 of the base section 20 with their outer circumferential surfaces facing each other.

[0038] As shown in Figures 3 and 4, in the heat sink 1, the entire heat conductive member 31 is embedded in the heat sink 1. Specifically, the entire heat conductive member 31 is embedded in the block portion 40. Therefore, the outer surface of the heat conductive member 31 is not exposed from the block portion 40. In other words, the outer surface of the heat conductive member 31 is not exposed from the outer surface of the base portion 20, nor from the outer surface of the heat sink 1.

[0039] The heat conduction member 31 has a heat receiving portion 32 that is thermally connected to the heat-generating element 100. The heat conduction member 31 also has a portion 34 other than the heat receiving portion 32. When the heat conduction member 31 receives heat from the heat-generating element 100 at the heat receiving portion 32, it conducts the heat from the heat-generating element 100 from the heat receiving portion 32 to the portion 34 other than the heat receiving portion 32 along the extension direction of the heat conduction member 31. When the heat conduction member 31 is thermally connected to multiple heat-generating elements 100, 100, 100..., the portion of the heat conduction member 31 that is thermally connected to the heat-generating element 100 with the highest heat output functions as the heat receiving portion 32.

[0040] In the heat sink 1, a heat pipe 30, which is a heat transport member, is provided as a heat conductive member 31. The heat pipe 30 has a tubular container 33 with one end sealed at the other end, a wick structure (not shown) having capillary force housed in the container 33, and a working fluid (not shown) such as water sealed in the internal space of the container 33. The container 33 is a tubular material with its internal space sealed. Furthermore, the internal space of the container 33 is depressurized by a degassing process. In the heat pipe 30, the heat receiving section 32 functions as an evaporation section, and the parts 34 other than the heat receiving section 32 function as a condensation section.

[0041] The shape of the container 33 in the direction perpendicular to the longitudinal direction (radial direction) is not particularly limited and can be circular, elliptical, flattened, rectangular, etc., but the heat sink 1 is circular.

[0042] The heat sink 1 is a cast component, and the heat conductive member 31 (heat pipe 30) is embedded in the heat sink 1 by casting. The heat pipe 30 is integrally cast with the block portion 40 of the heat sink 1, and the heat pipe 30 is embedded and fixed in the block portion 40, which is a protrusion on the first surface 21. From the above, it is not necessary for the heat pipe 30 to be fixed to the base portion 20 by soldering. Therefore, it is not necessary to separately form a plating layer on the outer surface of the container 33 of the heat pipe 30 that is required for soldering.

[0043] The material of the heat pipe container 33 may be the same as or different from the material of the base portion 20. Examples of materials for the heat pipe container 33 include copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy, stainless steel, etc.

[0044] Next, we will describe the injection pipe used to inject the working fluid into the heat pipe 30. Figure 5 is an explanatory diagram of the injection pipe used in a heat pipe provided in a heat sink according to a first embodiment of the present invention. Figure 6 is a side cross-sectional view illustrating the injection pipe used in a heat pipe provided in a heat sink according to a first embodiment of the present invention.

[0045] The heat pipe 30 is manufactured by first depressurizing the internal space of the container 33, then injecting working fluid into the internal space of the container 33 through an injection pipe that communicates with and extends from the internal space of the container 33, and finally sealing a predetermined portion of the injection pipe after the working fluid has been injected, thereby sealing the working fluid into the internal space of the container 33. As shown in Figures 5 and 6, the sealed injection pipe 35 used to inject the working fluid into the heat pipe 30 is positioned inward from the peripheral edge 23 of the heat sink 1. Therefore, the sealed injection pipe 35 does not protrude outward from the peripheral edge 23 of the heat sink 1.

[0046] In the heat sink 1, the sealed injection tube 35 extends perpendicularly to the extension direction of the heat pipe 30, and is positioned inward from the peripheral edge 23 of the heat sink 1. In the heat sink 1, the sealed injection tube 35 extends from the container 33 of the heat pipe 30 toward the second surface 22. In the heat sink 1, the vertical dimension of the sealed injection tube 35 is smaller than the thickness of the base portion 20. Therefore, when the heat sink 1 is connected to a substrate on which the heat-generating element 100 to be cooled is mounted, the sealed injection tube 35 is located inside the structure to which the heat sink 1 and the substrate on which the heat-generating element 100 is mounted are connected, and is not exposed to the external environment of the structure. The mounting position of the injection tube 35 is not particularly limited, but in the heat sink 1, the sealed injection tube 35 is provided at one end of the container 33. The shape of the sealed injection tube 35 provided at one end of the container 33 is L-shaped.

[0047] Next, an example of how to use the heat sink 1 will be described. Figure 7 is an explanatory diagram showing an example of how to use the heat sink according to the first embodiment of the present invention.

[0048] As shown in Figure 7, the circuit board 101 is housed in the housing 102, and by thermally connecting the numerous heat-generating elements 100, 100, 100... mounted on the circuit board 101 to the base portion 20 of the heat sink 1, the heat sink 1 can cool the numerous heat-generating elements 100, 100, 100.... In Figure 7, corresponding to the circuit board 101 extending in the direction of gravity, the heat sink 1 is installed such that the base portion 20 of the heat sink 1 extends in the direction of gravity, and the heat dissipation fins 10 extend in the direction of gravity. The heat-receiving surface of the base portion 20 has a shield portion which is a recess corresponding to the position and shape of the numerous heat-generating elements 100, 100, 100.... By housing the heat-generating elements 100 in the shield portion, the heat-generating elements 100 mounted on the circuit board 101 are electromagnetically shielded, and the heat-generating elements 100 are thermally connected to the heat-receiving surface of the base portion 20.

[0049] When the numerous heating elements 100, 100, 100... are thermally connected to the heat receiving surface of the base portion 20, heat from the numerous heating elements 100, 100, 100... is transferred to the base portion 20. At this time, the numerous heating elements 100, 100, 100... have different amounts of heat generated depending on their function, and the numerous heating elements 100, 100, 100... are arranged in predetermined locations on the substrate 101 depending on their function, so when heat from the numerous heating elements 100, 100, 100... is transferred to the base portion 20, the amount of heat received differs depending on the location on the base portion 20. On the other hand, the heat pipe 30 embedded in the block portion 40, which is a protrusion on the first surface 21, has a heat receiving portion 32 that is thermally connected to the heating element 100 via the base portion 20. Therefore, the heat pipe 30, through its heat transport function, transports heat from the heat-generating element 100 from the evaporation section 32, which is the heat-receiving section, to the condensation section 34, which is the part other than the heat-receiving section 32. As a result, the heat transferred from the heat-generating element 100 to the base section 20 diffuses throughout the entire base section 20. The heat that diffuses through the base section 20 is transferred from the base section 20 to the heat dissipation fins 10, and the heat transferred to the heat dissipation fins 10 is released to the outside of the heat sink 1 by the heat exchange action of the heat dissipation fins 10. The cooling air that promotes the heat exchange action of the heat dissipation fins 10 is generated, for example, by natural convection, moving from bottom to top in the direction of gravity, without the use of forced cooling means such as a blower fan. Furthermore, if necessary, forced cooling means may be used to promote the heat exchange action of the heat dissipation fins 10.

[0050] A circuit board 101 equipped with numerous heating elements 100, 100, 100... having varying heat generation capacities can be, for example, a circuit board installed in a mobile phone base station. Another example of a mobile phone base station is one attached to the top of a transmission tower.

[0051] Next, an example of a manufacturing method for the heat sink 1 will be described. First, a mold corresponding to the shape of the heat sink 1 is prepared. Next, a container 33 having an injection pipe 35, which will become the heat pipe 30, is placed in a predetermined position in the mold. At this time, the internal space of the container 33 is degassed beforehand to create a reduced pressure state. Next, molten metal is injected into the mold under pressure to integrate the heat sink 1 and the container 33 having the injection pipe 35, and the container 33 having the injection pipe 35 is embedded in the heat sink 1 by casting. Next, after injecting a working fluid such as water into the internal space of the container 33 through the injection pipe 35, the injection pipe 35 is sealed to obtain the heat sink 1 with the heat pipe 30 embedded in it. After that, if necessary, a desired shield portion is formed on the second surface 22 of the base portion 20.

[0052] The heat sink 1 comprises a base portion 20 having a first surface 21 and a second surface 22 facing the first surface 21, to which the heat-generating elements 100 are thermally connected, and heat dissipation fins 10 erected on the first surface 21 of the base portion 20. Since the base portion 20 and the heat dissipation fins 10 are integrally molded, contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, improving thermal connectivity between the base portion 20 and the heat dissipation fins 10. Therefore, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 1, heat transfer from the base portion 20 to the heat dissipation fins 10 is facilitated. Furthermore, in the heat sink 1, at least a portion of the heat conductive member 31 (heat pipe 30 in the heat sink 1) is embedded in the block portion 40, which is a protrusion on the first surface 21. Therefore, even if a shield portion is formed on the second surface 22 of the base portion 20, the heat conductive member 31 (heat pipe 30) has excellent flexibility in arrangement, and the thermal connectivity of the heat conductive member 31 (heat pipe 30) in the heat sink 1 is excellent. Consequently, in the heat sink 1, even if a large number of heat-generating elements (e.g., electronic components) 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 1, the heat is diffused throughout the entire base portion 20 by the heat conductive member 31 (heat pipe 30), and the entire base portion 20 is uniformly heated. This maintains the uniformity of the heat sink 1's base portion 20, and the heat transfer from the base portion 20 is equalized across the entire heat dissipation fin 10. Consequently, the heat sink 1 equalizes the thermal load across the entire heat dissipation fin 10, improving the fin efficiency of the heat dissipation fin 10. From the above, the heat dissipation characteristics of heat sink 1 are improved even when a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected.

[0053] Furthermore, since the heat sink 1 has a base portion 20 and a heat dissipation fin 10 that are integrally molded, even if the heat sink 1 is installed outdoors, it is possible to prevent rainwater, dust, etc. from entering between the base portion 20 and the heat dissipation fin 10, thus providing excellent durability.

[0054] In particular, the heat sink 1 has a block portion 40 that extends in the direction of extension of the base portion 20, and a heat conductive member 31 (heat pipe 30) is embedded in the block portion 40, thereby ensuring that the embedded portion of the heat conductive member 31 (heat pipe 30) is securely located.

[0055] In particular, in the heat sink 1, the block portion 40 is a convex portion of the first surface 21 of the base portion 20 that protrudes in the thickness direction of the base portion 20. As a result, the entire base portion 20 is reliably heated uniformly by the heat conduction function of the heat conduction member 31 (heat transport function of the heat pipe 30), and the heat transfer from the base portion 20 to the entire heat dissipation fin 10 is reliably equalized. Therefore, in the heat sink 1, the thermal load on the entire heat dissipation fin 10 can be further equalized, further improving the fin efficiency of the heat dissipation fin 10, and the heat exchange function of the heat dissipation fin 10 can be reliably improved.

[0056] In particular, in the heat sink 1, the entire heat conductive member 31 (heat pipe 30) is embedded in the heat sink 1, which further improves the thermal connectivity of the heat conductive member 31 (heat pipe 30) in the heat sink 1.

[0057] In particular, in the heat sink 1, since the heat pipe 30 is used as the heat conductive member 31, the heat conductive member 31 has excellent heat transport characteristics, which further equalizes the thermal load across the entire heat dissipation fin 10 and further improves the fin efficiency of the heat dissipation fin 10.

[0058] In particular, in the heat sink 1, since the heat sink 1 is a cast material and the heat conductive member 31 (heat pipe 30) is embedded in the heat sink 1 by casting, the thermal connectivity of the heat conductive member 31 (heat pipe 30) in the heat sink 1 is further improved.

[0059] In particular, in the heat sink 1, the sealed injection tube 35 of the heat pipe 30 is positioned inward from the peripheral edge 23 of the heat sink 1. This prevents corrosion of the heat pipe 30 even when the heat sink 1 is installed in an external environment exposed to wind and rain, thus improving the durability of the heat sink 1.

[0060] In particular, the fact that the heat pipe 30 of heat sink 1 is a flat-type heat pipe contributes to the miniaturization of heat sink 1.

[0061] Next, a heat sink according to a second embodiment of the present invention will be described with reference to the drawings. The heat sink according to the second embodiment has the same main components as the heat sink according to the first embodiment, so the same components as the heat sink according to the first embodiment will be described using the same reference numerals. Figure 8 is a side cross-sectional view of the heat sink according to the second embodiment of the present invention.

[0062] In the heat sink 1 according to the first embodiment, the shape of the heat pipe 30 container 33 in the direction perpendicular to the longitudinal direction (radial direction) was circular. However, as shown in Figure 8, in the heat sink 2 according to the second embodiment, the shape of the heat pipe 30 container 33 in the direction perpendicular to the longitudinal direction (radial direction) is flattened. In the heat sink 2, the heat pipe 30 is a flattened heat pipe in which the container 33 has been flattened.

[0063] Thus, in the heat sink of the present invention, the radial shape of the container 33 of the heat pipe 30 is not particularly limited and can be appropriately selected according to the operating conditions of the heat sink.

[0064] In the heat sink 2, since the base portion 20 and the heat dissipation fins 10 are integrally molded, the contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, and the thermal connectivity between the base portion 20 and the heat dissipation fins 10 is improved. Therefore, even in the heat sink 2, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 2, heat transfer from the base portion 20 to the heat dissipation fins 10 is facilitated. Furthermore, in the heat sink 2, at least a portion of the heat pipe 30 is embedded in the block portion 40, which is a protrusion on the first surface 21, so even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent freedom in the arrangement of the heat pipe 30, and the thermal connectivity of the heat pipe 30 in the heat sink 2 is excellent. Therefore, even in the heat sink 2, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 2, the heat is diffused throughout the entire base portion 20 by the heat pipe 30, resulting in uniform heating of the entire base portion 20 and equal heat transfer from the base portion 20 to the entire heat dissipation fin 10. Consequently, even in the heat sink 2, the thermal load on the entire heat dissipation fin 10 is made uniform, improving the fin efficiency of the heat dissipation fin 10. From the above, even in the heat sink 2, the heat dissipation characteristics are improved even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected.

[0065] Next, a heat sink according to a third embodiment of the present invention will be described with reference to the drawings. The heat sink according to the third embodiment shares the same main components as the heat sinks according to the first and second embodiments, so the same components as those in the heat sinks according to the first and second embodiments will be described using the same reference numerals. Figure 9 is a side cross-sectional view of the heat sink according to the third embodiment of the present invention.

[0066] In the heat sinks 1 and 2 according to the first and second embodiments, the block portion 40 in which the heat pipe 30 is embedded was a protrusion on the first surface 21. However, as shown in Figure 9, in the heat sink 3 according to the third embodiment, the heat dissipation fin 10 has a tip portion 15 in the height direction of the heat dissipation fin 10 and a base portion 16 which is the starting point of the rise from the base portion 20, and the block portion 40 in which the heat pipe 30 is embedded is provided in the intermediate portion 17 between the tip portion 15 and the base portion 16 of the heat dissipation fin 10. In the heat sink 3, each block portion 40 is formed spanning multiple heat dissipation fins 10, 10, 10...

[0067] In the heat sink 3, a block section 40 in which the heat pipe 30 is embedded is provided in the intermediate section 17 between the tip 15 and base 16 of the heat dissipation fin 10, so that the entire heat dissipation fin 10 is reliably heated uniformly by the heat transport function of the heat pipe 30. In the heat sink 3, among the multiple heat dissipation fins 10, 10, 10..., there are heat dissipation fins 10 that have the block section 40 and heat dissipation fins 10 that do not have the block section 40. Among the multiple heat dissipation fins 10, 10, 10..., the block section 40 is provided in the heat dissipation fins 10 where it is difficult to heat uniformly across the entire heat dissipation fin 10, depending on the arrangement of the heat-generating elements 100 and the amount of heat generated by the heat-generating elements 100.

[0068] In the heat sink 3, since the base portion 20 and the heat dissipation fins 10 are integrally molded, the contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, improving the thermal connectivity between the base portion 20 and the heat dissipation fins 10. Furthermore, since the block portion 40 in which the heat pipes 30 are embedded is provided in the intermediate portion 17 of the heat dissipation fins 10, even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent freedom in the arrangement of the heat pipes 30, and the thermal connectivity of the heat pipes 30 in the heat sink 3 is excellent. Therefore, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 3, the entire heat dissipation fins 10 are reliably heated uniformly by the heat pipes 30, thus equalizing the thermal load on the entire heat dissipation fins 10 and improving the fin efficiency of the heat dissipation fins 10. From the above, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected, the heat dissipation characteristics of the heat sink 3 are improved.

[0069] Next, a heat sink according to a fourth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the fourth embodiment shares the same main components as the heat sinks according to the first to third embodiments, so the same components as those in the first to third embodiments will be described using the same reference numerals. Figure 10 is a side cross-sectional view of the heat sink according to the fourth embodiment of the present invention. Figure 11 is a perspective view from the bottom direction illustrating the heat sink according to the fourth embodiment of the present invention.

[0070] In the heat sinks 1, 2, and 3 according to the first to third embodiments, a heat pipe 30 was used as the heat conducting member. However, as shown in Figures 10 and 11, in the heat sink 4 according to the fourth embodiment, a vapor chamber 50, which is a heat transport member, is used as the heat conducting member.

[0071] The vapor chamber 50 comprises a flat container 53 in which the periphery of a laminate having one plate-shaped body and the other plate-shaped body is sealed, a wick structure (not shown) having capillary force housed in the container 53, and a working fluid (not shown) such as water sealed in the internal space of the container 53. The thin plate-shaped container 53 is a component whose internal space is sealed. Furthermore, the internal space of the container 53 is depressurized by a degassing process. In the vapor chamber 50, the heat-receiving section functions as an evaporation section, and the parts other than the heat-receiving section function as a condensation section.

[0072] The material of the container 53 of the vapor chamber 50 may be the same as or different from the material of the base portion 20. Examples of materials for the container 53 of the vapor chamber 50 include copper, copper alloy, aluminum, aluminum alloy, titanium, titanium alloy, stainless steel, etc.

[0073] Furthermore, in the heat sink 4, a sealed injection tube (not shown), used to inject working fluid into the vapor chamber 50, is positioned inward from the peripheral edge of the heat sink 4. Also, in the heat sink 4, the sealed injection tube extends perpendicularly to the extending direction of the vapor chamber 50, thus positioning it inward from the peripheral edge of the heat sink 4.

[0074] Furthermore, while the heat sinks 1, 2, and 3 according to the first to third embodiments were provided with a block portion 40 in which the heat pipe 30 was embedded, in place of this, as shown in Figures 10 and 11, the heat sink 4 according to the fourth embodiment has a vapor chamber 50, which is a heat conductive member, embedded in the base portion 20. Therefore, the heat sink 4 does not have a block portion for embedding the heat conductive member. The heat sink 4 is a cast material, and the vapor chamber 50 is embedded in the heat sink 4 by casting. The vapor chamber 50 is integrally cast with the base portion 20 of the heat sink 4, and the vapor chamber 50 is embedded and fixed in the base portion 20.

[0075] Furthermore, in the heat sinks 1, 2, and 3 according to the first to third embodiments, the entire heat pipe 30, which is a heat transport member, was embedded in the block portion 40. However, as shown in Figures 10 and 11, in the heat sink 4 according to the fourth embodiment, at least a portion of the vapor chamber 50 has an exposed portion 51 that is exposed from the second surface 22 of the base portion 20, and the exposed portion 51 is in direct contact with the heating element 100.

[0076] In the heatsink 4, the vapor chamber 50 has a projection 52 that protrudes in the thickness direction of the base portion 20, and the projection 52 forms an exposed portion 51. Specifically, the flat tip of the projection 52 is the exposed portion 51. In the heatsink 4, the projection 52, which is a convex portion, is formed in a part of the container 53, and a part of the container 53 is exposed from the second surface 22 of the base portion 20. The inside of the projection 52 is a space and communicates with the internal space of the container 53. The number of projections 52 formed in the vapor chamber 50 may be one or more, and in the heatsink 4, multiple (2) are provided.

[0077] In the heat sink 4, since the base portion 20 and the heat dissipation fins 10 are integrally molded, contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, and thermal connectivity between the base portion 20 and the heat dissipation fins 10 is improved. Therefore, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 4, heat transfer from the base portion 20 to the heat dissipation fins 10 is facilitated. Furthermore, in the heat sink 4, since a thin plate-shaped vapor chamber 50 is embedded in the base portion 20, even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent flexibility in the arrangement of the vapor chamber 50, and the thermal connectivity of the vapor chamber 50 in the heat sink 4 is excellent. Therefore, even in the heat sink 4, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 4, the heat is diffused throughout the entire base portion 20 by the heat transport characteristics of the vapor chamber 50, resulting in uniform heating of the entire base portion 20 and equal heat transfer from the base portion 20 to the entire heat dissipation fin 10. Therefore, even in the heat sink 4, the thermal load on the entire heat dissipation fin 10 is made uniform, improving the fin efficiency of the heat dissipation fin 10. From the above, even in the heat sink 4, the heat dissipation characteristics are improved even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected.

[0078] In particular, in the heat sink 4, since the vapor chamber 50, which is a heat conductive member, is embedded in the base portion 20, the entire base portion 20 is smoothly heated uniformly by the heat transport function of the vapor chamber 50, and the heat transfer from the base portion 20 to the entire heat dissipation fin 10 is made uniform. As a result, the thermal load on the entire heat dissipation fin 10 is made even more uniform, and the fin efficiency of the heat dissipation fin 10 can be further improved.

[0079] In particular, the heat sink 4 has an exposed portion 51 in which a part of the vapor chamber 50 is exposed from the second surface 22 of the base portion 20, and the exposed portion 51 can come into direct contact with the heat-generating element 100, which further improves the thermal connectivity between the heat-generating element 100 and the vapor chamber 50, thus further improving the heat dissipation characteristics of the heat sink 4.

[0080] Next, a heat sink according to the fifth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the fifth embodiment shares the same main components as the heat sinks according to the first to fourth embodiments, so the same components as those in the first to fourth embodiments will be described using the same reference numerals. Figure 12 is a side cross-sectional view of the heat sink according to the fifth embodiment of the present invention. Figure 13 is an explanatory diagram of the heat pipe used in the heat sink according to the fifth embodiment of the present invention.

[0081] In the heat sinks 1 and 2 according to the first and second embodiments described above, the block portion 40, which is a convex portion of the first surface 21, extends substantially linearly from one end to the other in the second direction L2 of the base portion 20. In contrast, as shown in Figures 12 and 13, in the heat sink 5 according to the fifth embodiment, the heat pipe 70, which is a heat conductive member, has a stepped portion 62 that is bent in the thickness direction of the base portion 20. The stepped portion 62 forms an exposed portion 61 of the heat pipe 70 that is exposed from the second surface 22 of the base portion 20. In the heat sink 5, the stepped portion 62 is formed in the central portion 73 in the longitudinal direction of the heat pipe 70. There is no step between one end 71 and the other end 72 of the heat pipe 70, and both ends 71 ​​and 72 of the heat pipe 70 extend in a substantially straight line.

[0082] Furthermore, in addition to the block portion 40 which is a protrusion of the first surface 21, the heat sink 5 is also provided with a block portion 60 which is a protrusion of the second surface 22 that protrudes from the second surface 22 of the base portion 20 in the thickness direction of the base portion 20. Of the heat pipe 70, one end 71 and the other end 72 of the heat pipe 70 are embedded in the block portion 40 which is a protrusion of the first surface 21, and the stepped portion 62 located in the longitudinal central portion 73 of the heat pipe 70 is embedded in the block portion 60 which is a protrusion of the second surface 22. As the heat pipe 70 moves from one end 71 toward the central portion 73, the heat pipe 70 extends from the block portion 40 which is a protrusion of the first surface 21 toward the block portion 60 which is a protrusion of the second surface 22. Furthermore, as the heat pipe 70 extends from the central portion 73 toward the other end 72, it extends from the block portion 60, which is a protrusion on the second surface 22, toward the block portion 40, which is a protrusion on the first surface 21. Consequently, the central portion 73 of the heat pipe 70 has an exposed portion 61 that is exposed from the protrusion (block portion 60) on the second surface 22, and this exposed portion 61 is in direct contact with the heating element 100.

[0083] The degree of the step in the stepped portion 62 can be appropriately selected according to the height of the portion where one end 71 and the other end 72 of the heat pipe 70 are embedded relative to the second surface 22. Therefore, without providing the block portion 60, the central portion 73 of the heat pipe 70 may have an exposed portion 61 that is exposed from the second surface 22, and the exposed portion 61 may be in direct contact with the heating element 100.

[0084] The heat sink 5 is provided with a heat pipe 70 whose exposed portion 61 is formed by a stepped portion 62, and a heat pipe 30 which is embedded in the block portion 40, which is a protrusion of the first surface 21, and has no exposed portion, and extends in a substantially straight line. In the heat sink 5, the shape of the heat pipe 70 in the direction perpendicular to the longitudinal direction (radial direction) is circular. Similarly, the shape of the heat pipe 30 in the direction perpendicular to the longitudinal direction (radial direction) is also circular.

[0085] In the heat sink 5, since the base portion 20 and the heat dissipation fins 10 are integrally molded, the contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, improving the thermal connectivity between the base portion 20 and the heat dissipation fins 10. Also in the heat sink 5, since one end 71 and the other end 72 of the heat pipe 70 are embedded in the block portion 40, which is a protrusion on the first surface 21, even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent freedom in the arrangement of the heat pipe 70, and the thermal connectivity of the heat pipes 30 and 70 in the heat sink 5 is excellent. Therefore, even if a large number of heat-generating elements 100 with various heat generation amounts are thermally connected to the base portion 20 of the heat sink 5, the heat is diffused throughout the entire base portion 20 by the heat pipes 30 and 70, the entire base portion 20 is heated uniformly, and the heat transfer from the base portion 20 to the heat dissipation fins 10 is equalized. Therefore, even with the heat sink 5, the thermal load across the entire heat dissipation fin 10 is made uniform, improving the fin efficiency of the heat dissipation fin 10.

[0086] In particular, the heat sink 5 has an exposed portion 61 in which a part of the heat pipe 70 is exposed from the second surface 22 of the base portion 20, and the exposed portion 61 can come into direct contact with the heat-generating element 100, which further improves the thermal connectivity between the heat-generating element 100 and the heat pipe 70, thus further improving the heat dissipation characteristics of the heat sink 5.

[0087] Next, a heat sink according to the sixth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the sixth embodiment shares the same main components as the heat sinks according to the first to fifth embodiments, so the same components as those in the first to fifth embodiments will be described using the same reference numerals. Figure 14 is a side cross-sectional view of the heat sink according to the sixth embodiment of the present invention.

[0088] In the heat sink 5 according to the fifth embodiment, the shape of the heat pipes 30 and 70 in the direction perpendicular to the longitudinal direction (radial direction) was circular. However, as shown in Figure 14, in the heat sink 6 according to the sixth embodiment, the radial shape of the heat pipe 70, which has a stepped portion 62 in the central part 73 in the longitudinal direction, is flattened, and the radial shape of the heat pipe 30, which does not have a stepped portion and extends in a substantially straight line, is also flattened. Therefore, both the heat pipes 30 and 70 are flattened heat pipes with flattened containers.

[0089] Thus, in the heat sink of the present invention, the radial shape of the heat pipe 70 having the stepped portion 62 is not particularly limited and can be appropriately selected depending on the operating conditions of the heat sink.

[0090] In the heat sink 6, since the base portion 20 and the heat dissipation fins 10 are integrally molded, the contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, improving the thermal connectivity between the base portion 20 and the heat dissipation fins 10. Also in the heat sink 6, since one end 71 and the other end 72 of the heat pipe 70 are embedded in the block portion 40, which is a protrusion on the first surface 21, even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent freedom in the arrangement of the heat pipe 70, and the thermal connectivity of the heat pipes 30 and 70 in the heat sink 6 is excellent. Therefore, even in the heat sink 6, even if a large number of heat-generating elements 100 with various heat generation amounts are thermally connected to the base portion 20 of the heat sink 6, the heat is diffused throughout the entire base portion 20 by the heat pipes 30 and 70, the entire base portion 20 is heated uniformly, and the heat transfer from the base portion 20 to the heat dissipation fins 10 is equalized. Therefore, even with the heat sink 6, the thermal load across the entire heat dissipation fin 10 is made uniform, improving the fin efficiency of the heat dissipation fin 10.

[0091] Next, a heat sink according to the seventh embodiment of the present invention will be described with reference to the drawings. The heat sink according to the seventh embodiment shares the same main components as the heat sinks according to the first to sixth embodiments, so the same components as those in the first to sixth embodiments will be described using the same reference numerals. Figure 15 is a side cross-sectional view of the heat sink according to the seventh embodiment of the present invention. Figure 16 is a perspective view from the bottom direction illustrating the heat sink according to the seventh embodiment of the present invention.

[0092] In the heat sink 4 according to the fourth embodiment, a portion of the vapor chamber 50 has a protrusion 52 that protrudes in the thickness direction of the base portion 20, and an exposed portion 51 is formed by the protrusion 52. However, as shown in Figures 15 and 16, in the heat sink 7 according to the seventh embodiment, the vapor chamber 50 does not have a protrusion, and the entire vapor chamber 50 has a flat shape. Therefore, in the heat sink 7, no exposed portion is formed in the vapor chamber 50.

[0093] In the heat sink 7, the entire vapor chamber 50 is embedded in the base portion 20. Therefore, the heat sink 7 does not have a block portion for embedding a heat conductive member. From the above, it can be seen that in the heat sink 7, the vapor chamber 50 is not in direct contact with the heat generating element 100.

[0094] In the heat sink 7, since the base portion 20 and the heat dissipation fins 10 are integrally molded, contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, improving thermal connectivity between the base portion 20 and the heat dissipation fins 10. Furthermore, in the heat sink 7, a thin plate-shaped vapor chamber 50 is embedded in the base portion 20, so even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent freedom in the placement of the vapor chamber 50, and the thermal connectivity of the vapor chamber 50 in the heat sink 7 is excellent. Therefore, even in the heat sink 7, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 7, the vapor chamber 50 diffuses heat throughout the entire base portion 20, homogenizing the heat of the entire base portion 20 and equalizing the heat transfer from the base portion 20 to the entire heat dissipation fins 10. Therefore, in the heat sink 7, the thermal load on the entire heat dissipation fins 10 is equalized, improving the fin efficiency of the heat dissipation fins 10.

[0095] Next, a heat sink according to the eighth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the eighth embodiment shares the same main components as the heat sinks according to the first to seventh embodiments, so the same components as those in the first to seventh embodiments will be described using the same reference numerals. Figure 17 is an explanatory diagram of the injection pipe used in the heat pipe provided in the heat sink according to the eighth embodiment of the present invention.

[0096] In the heat sink 1 according to the first embodiment, the sealed injection tube 35 used to inject working fluid into the heat pipe 30 was provided inward from the peripheral edge 23 of the heat sink 1. However, as shown in Figure 17, in the heat sink 8 according to the eighth embodiment, the sealed injection tube 35 extends outward from the peripheral edge 23 of the heat sink 1. Therefore, the sealed injection tube 35 protrudes outward from the peripheral edge 23 of the heat sink 1.

[0097] Furthermore, in the heat sink 1 according to the first embodiment, the vertical dimension of the sealed injection pipe 35 was smaller than the thickness of the base portion 20. However, as shown in Figure 17, in the heat sink 8 according to the eighth embodiment, the vertical dimension of the sealed injection pipe 35 is larger than the thickness of the base portion 20. In the heat sink 8, the sealed injection pipe 35 extends from the container 33 of the heat pipe 30 toward the second surface 22 of the base portion 20 and protrudes from the position of the second surface 22 toward the thickness of the base portion 20.

[0098] In the heat sink 8, the tip of the sealed injection tube 35 may be exposed to the external environment, so corrosion resistance is provided to the outer surface of the injection tube 35 as needed. A means of providing corrosion resistance to the outer surface of the injection tube 35 is, for example, to apply a corrosion-resistant organic solvent or the like to the outer surface of the injection tube 35. Thus, the sealed injection tube 35 may be configured to be exposed to the external environment from the heat sink, or not exposed to the external environment.

[0099] Next, a heat sink according to the ninth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the ninth embodiment shares the same main components as the heat sinks according to the first to eighth embodiments, so the same components as those in the first to eighth embodiments will be described using the same reference numerals. Figure 18 is an explanatory diagram of the injection pipe used in the heat pipe provided in the heat sink according to the ninth embodiment of the present invention. Figure 19 is a side cross-sectional view illustrating the injection pipe used in the heat pipe provided in the heat sink according to the ninth embodiment of the present invention.

[0100] In the heat sink 1 according to the first embodiment, the sealed injection tube 35 extended in the direction of the second surface 22 from one end of the container 33 of the heat pipe 30 which extends in a substantially straight line. Instead, as shown in Figures 18 and 19, in the heat sink 9 according to the ninth embodiment, the container 33 of the heat pipe 30 has a central part and the other end that extend in a substantially straight line along the extending direction of the base part 20, and one end that extends in the thickness direction of the base part 20, and the end face of one end of the container 33 is exposed from the second surface 22. The sealed injection tube 35 extends perpendicular to the extending direction of the second surface 22 from the end face of one end of the container 33, and the entire sealed injection tube 35 protrudes from the second surface 22.

[0101] Thus, the sealed injection tube 35 may be positioned inward from the peripheral edge 23 of the heat sink 9, and the entire sealed injection tube 35 may be located outside the base portion 20.

[0102] In the heat sink 9, since the base portion 20 and the heat dissipation fins 10 are integrally molded, contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, and thermal connectivity between the base portion 20 and the heat dissipation fins 10 is improved. Therefore, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 9, heat transfer from the base portion 20 to the heat dissipation fins 10 is facilitated. Furthermore, in the heat sink 9, since at least a portion of the heat pipes 30 is embedded, even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent freedom in the arrangement of the heat pipes 30, and the thermal connectivity of the heat pipes 30 in the heat sink 9 is excellent. Therefore, even in the heat sink 9, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 9, the heat is diffused throughout the entire base portion 20 by the heat pipe 30, resulting in uniform heating of the entire base portion 20 and equal heat transfer from the base portion 20 to the entire heat dissipation fin 10. Consequently, even in the heat sink 9, the thermal load on the entire heat dissipation fin 10 is made uniform, improving the fin efficiency of the heat dissipation fin 10. From the above, even in the heat sink 9, the heat dissipation characteristics are improved even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected.

[0103] Furthermore, in the heat sink 9, the sealed injection tube 35 of the heat pipe 30 is positioned inward from the peripheral edge 23 of the heat sink 9, so that the sealed injection tube 35 is located inside the structure to which the substrate on which the heat-generating element 100 is mounted is connected to the heat sink 9. Therefore, the sealed injection tube 35 is not exposed to the external environment of the structure. As a result, even if the heat sink 9 is installed in an external environment exposed to wind and rain, corrosion of the container 33 of the heat pipe 30 and the sealed injection tube 35 is prevented, thereby improving the durability of the heat sink 9.

[0104] Next, a heat sink according to the 10th embodiment of the present invention will be described with reference to the drawings. The heat sink according to the 10th embodiment shares the same main components as the heat sinks according to the 1st to 9th embodiments, so the same components as those in the 1st to 9th embodiments will be described using the same reference numerals. Figure 20 is an explanatory diagram of the injection pipe used in the heat pipe provided in the heat sink according to the 10th embodiment of the present invention. Figure 21 is a side view illustrating the injection pipe used in the heat pipe provided in the heat sink according to the 10th embodiment of the present invention.

[0105] In the heat sink 9 according to the ninth embodiment, the container 33 of the heat pipe 30 has one end that extends in the thickness direction of the base portion 20, and the end face of one end of the container 33 is exposed from the second surface 22. Instead, as shown in Figures 20 and 21, in the heat sink 80 according to the tenth embodiment, the container 33 of the heat pipe 30 extends substantially linearly along the extending direction of the base portion 20, and the end face of one end of the container 33 is exposed from the peripheral edge 23 of the heat sink 80. The sealed injection tube 35 extends from the end face of one end of the container 33 in a direction parallel to the extending direction of the second surface 22, and the entire sealed injection tube 35 protrudes from the peripheral edge 23 of the heat sink 80.

[0106] Thus, the sealed injection tube 35 may be positioned outward from the peripheral edge 23 of the heat sink 80, so that the entire sealed injection tube 35 is located outside the peripheral edge 23. In the heat sink 80, the sealed injection tube 35 may be exposed to the external environment, so corrosion resistance may be provided to the outer surface of the injection tube 35 as needed. A means of providing corrosion resistance to the outer surface of the injection tube 35 may be, for example, by applying a corrosion-resistant organic solvent or the like to the outer surface of the injection tube 35.

[0107] Even with the heat sink 80, since the base portion 20 and the heat dissipation fins 10 are integrally molded, the contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, and the thermal connectivity between the base portion 20 and the heat dissipation fins 10 is improved. Therefore, even with the heat sink 80, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 80, heat transfer from the base portion 20 to the heat dissipation fins 10 is facilitated. Furthermore, even with the heat sink 80, since at least a portion of the heat pipes 30 is embedded, even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent freedom in the arrangement of the heat pipes 30, and the thermal connectivity of the heat pipes 30 in the heat sink 80 is excellent. Therefore, even with the heat sink 80, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 80, the heat is diffused throughout the entire base portion 20 by the heat pipe 30, resulting in uniform heating of the entire base portion 20 and equal heat transfer from the base portion 20 to the entire heat dissipation fin 10. Consequently, even with the heat sink 80, the thermal load on the entire heat dissipation fin 10 is made uniform, improving the fin efficiency of the heat dissipation fin 10. From the above, even with the heat sink 80, the heat dissipation characteristics are improved even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected.

[0108] Next, a heat sink according to the 11th embodiment of the present invention will be described with reference to the drawings. The heat sink according to the 11th embodiment shares the same main components as the heat sinks according to the 1st to 10th embodiments, so the same components as those in the 1st to 10th embodiments will be described using the same reference numerals. Figure 22 is an explanatory diagram illustrating the arrangement of the heat conductive members of the heat sink according to the 11th embodiment of the present invention from a planar perspective.

[0109] In the heat sink 1 according to the first embodiment, the heat conductive member 31 extended along the extending direction of the heat dissipation fins 10. However, as shown in Figure 22, in the heat sink 81 according to the eleventh embodiment, the heat conductive member 31, which has a substantially straight longitudinal shape, extends at a predetermined angle with respect to the extending direction of the heat dissipation fins 10. Therefore, in the heat sink 81, the heat conductive member 31 does not extend in a direction parallel to the extending direction of the heat dissipation fins 10.

[0110] The angle of the heat conduction member 31 with respect to the extending direction of the heat dissipation fins 10 is not particularly limited, but in the heat sink 81, the heat conduction member 31 extends along a direction substantially perpendicular to the extending direction of the heat dissipation fins 10. In the heat sink 81, for example, a heat pipe 30 can be used as the heat conduction member 31. In the heat sink 81, a plurality of heat pipes 30, 30, 30... are arranged in parallel along the extending direction of the heat dissipation fins 10.

[0111] Thus, in the heat sink of the present invention, the arrangement of the heat conductive members 31 for uniformly heating the entire base portion 20 can be appropriately selected depending on the position of the heat-generating element 100, etc.

[0112] In the heat sink 81, since the base portion 20 and the heat dissipation fins 10 are integrally molded, the contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, and the thermal connectivity between the base portion 20 and the heat dissipation fins 10 is improved. Therefore, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 81, heat transfer from the base portion 20 to the heat dissipation fins 10 is facilitated. Furthermore, even in the heat sink 81, since at least a portion of the heat pipes 30 is embedded, even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent freedom in the arrangement of the heat pipes 30, and the thermal connectivity of the heat pipes 30 in the heat sink 81 is excellent. Therefore, even with the heat sink 81, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 81, the heat is diffused throughout the entire base portion 20 by the heat pipe 30, resulting in uniform heating of the entire base portion 20 and equal heat transfer from the base portion 20 to the entire heat dissipation fin 10. Consequently, even with the heat sink 81, the thermal load on the entire heat dissipation fin 10 is made uniform, improving the fin efficiency of the heat dissipation fin 10. From the above, even with the heat sink 81, the heat dissipation characteristics are improved even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected.

[0113] Next, a heat sink according to the twelfth embodiment of the present invention will be described with reference to the drawings. The heat sink according to the twelfth embodiment shares the same main components as the heat sinks according to the first to eleventh embodiments, so the same components as those in the first to eleventh embodiments will be described using the same reference numerals. Figure 23 is an explanatory diagram illustrating the arrangement of the heat conductive members of the heat sink according to the twelfth embodiment of the present invention from a planar perspective.

[0114] In the heat sink 1 according to the first embodiment, the heat conductive member 31 had a substantially straight shape in the longitudinal direction and extended along the direction of the heat dissipation fins 10. However, as shown in Figure 23, in the heat sink 82 according to the twelfth embodiment, the longitudinal shape of the heat conductive member 31 has a bent portion. The shape with the bent portion is not particularly limited and can be a U-shape, L-shape, U-shape, etc. in plan view, but in the heat sink 82, for the sake of explanation, it is shown as a U-shape.

[0115] In the heat sink 82, the heat conductive member 31 has a central portion 93 that extends substantially linearly along the extending direction of the heat dissipation fins 10, and one end 91 and the other end 92 that extend substantially linearly at a predetermined angle with respect to the extending direction of the heat dissipation fins 10. In the heat sink 82, one end 91 and the other end 92 of the heat conductive member 31 extend in a direction substantially perpendicular to the extending direction of the heat dissipation fins 10. In the heat sink 82, the heat conductive member 31 can also be, for example, a heat pipe 30. In the heat sink 82, a plurality of heat pipes 30, 30, 30... are arranged so that their central portions 93 face each other.

[0116] Thus, in the heat sink of the present invention, the shape of the heat conductive member 31 for uniformly heating the entire base portion 20 can be appropriately selected depending on the position of the heat-generating element 100, etc.

[0117] In the heat sink 82, since the base portion 20 and the heat dissipation fins 10 are integrally molded, contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, and thermal connectivity between the base portion 20 and the heat dissipation fins 10 is improved. Therefore, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 82, heat transfer from the base portion 20 to the heat dissipation fins 10 is facilitated. Furthermore, even in the heat sink 82, since at least a portion of the heat pipes 30 is embedded, even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent freedom in the arrangement of the heat pipes 30, and the thermal connectivity of the heat pipes 30 in the heat sink 82 is excellent. Therefore, even with the heat sink 82, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 82, the heat is diffused throughout the entire base portion 20 by the heat pipe 30, resulting in uniform heating of the entire base portion 20 and equal heat transfer from the base portion 20 to the entire heat dissipation fin 10. Consequently, even with the heat sink 82, the thermal load on the entire heat dissipation fin 10 is made uniform, improving the fin efficiency of the heat dissipation fin 10. From the above, even with the heat sink 82, the heat dissipation characteristics are improved even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected.

[0118] Next, a heat sink according to the 13th embodiment of the present invention will be described with reference to the drawings. The heat sink according to the 13th embodiment shares the same main components as the heat sinks according to the 1st to 12th embodiments, so the same components as those in the 1st to 12th embodiments will be described using the same reference numerals. Figure 24 is an explanatory diagram illustrating the arrangement of the heat dissipation fins of the heat sink according to the 13th embodiment of the present invention from a planar perspective. Also, in Figure 24, for the convenience of explaining the arrangement of the heat dissipation fins, the heat conductive members are omitted from the description.

[0119] In the heat sink 1 according to the first embodiment, each heat dissipation fin 10 extended in a direction substantially parallel to the second direction L2 of the base portion 20 and in a direction substantially perpendicular to the first direction L1. Instead, as shown in Figure 24, in the heat sink 83 according to the thirteenth embodiment, each heat dissipation fin 10 extends in a direction oblique to the second direction L2 of the base portion 20 and in a direction oblique to the first direction L1. In the heat sink 83, each heat dissipation fin 10 extends in a substantially linear manner. In the heat sink 83, a plurality of heat dissipation fins 10, 10, 10... are arranged in parallel at predetermined intervals on the first surface 21 of the base portion 20. Furthermore, a plurality of heat dissipation fins 10, 10, 10... are arranged in parallel at substantially equal intervals along the second direction L2. Furthermore, a plurality of heat dissipation fins 10, 10, 10... are arranged in parallel along the first direction L1.

[0120] As shown in Figure 24, in the heat sink 83, each heat dissipation fin 10 is arranged to extend upward in the figure as it moves outward from the base portion 20 (for example, extending upward from the bottom in the direction of gravity). Specifically, in Figure 24, the heat dissipation fin 10 located on the left side of the base portion 20 is arranged to extend upward in the figure as it moves outward from the base portion 20 (to the left in Figure 24) (for example, extending upward from the bottom in the direction of gravity). Similarly, the heat dissipation fin 10 located on the right side of the base portion 20 is arranged to extend upward in the figure as it moves outward from the base portion 20 (to the right in Figure 24) (for example, extending upward from the bottom in the direction of gravity).

[0121] The angle between the extension direction of the heat dissipation fins 10 and the first direction L1 of the base portion 20 is not particularly limited, but for example, it is in the range of 40° to 70°.

[0122] In the heatsink 83, for example, when cooling air is supplied from below in the direction of gravity towards the top along the second direction L2, it flows outward along the first surface 21 of the base portion 20 in the first direction L1 of the base portion 20.

[0123] Thus, in the heat sink of the present invention, the direction in which the heat dissipation fins 10 erected on the first surface 21 of the base portion 20 extend can be appropriately selected in order to adjust the direction of airflow of the cooling air on the first surface 21 of the base portion 20.

[0124] Next, a heat sink according to the 14th embodiment of the present invention will be described with reference to the drawings. The heat sink according to the 14th embodiment shares the same main components as the heat sinks according to the 1st to 13th embodiments, so the same components as those in the 1st to 13th embodiments will be described using the same reference numerals. Figure 25 is an explanatory diagram illustrating the arrangement of the heat dissipation fins of the heat sink according to the 14th embodiment of the present invention from a planar perspective. In addition, for the sake of convenience in explaining the arrangement of the heat dissipation fins, the heat conductive members are omitted from Figure 25.

[0125] In the heat sink 83 according to the 13th embodiment, each heat dissipation fin 10 is arranged to extend upward in the figure as it moves outward from the base portion 20 (for example, extending from below in the direction of gravity to above). However, as shown in Figure 25, in the heat sink 84 according to the 14th embodiment of the present invention, each heat dissipation fin 10 is arranged to extend downward in the figure as it moves outward from the base portion 20 (for example, extending from above in the direction of gravity to below). Thus, in the heat sink 84, similar to the heat sink 83 according to the 13th embodiment described above, each heat dissipation fin 10 extends diagonally with respect to the second direction L2 of the base portion 20 and diagonally with respect to the first direction L1.

[0126] Specifically, in Figure 25, the heat dissipation fin 10 located on the left side of the base portion 20 extends downwards in the figure as it is directed outwards from the base portion 20 (to the left in Figure 25) (for example, extending downwards from the top in the direction of gravity). Similarly, the heat dissipation fin 10 located on the right side of the base portion 20 extends downwards in the figure as it is directed outwards from the base portion 20 (to the right in Figure 25) (for example, extending downwards from the top in the direction of gravity).

[0127] The angle between the extension direction of the heat dissipation fins 10 and the first direction L1 of the base portion 20 is not particularly limited, but for example, it is in the range of 40° to 70°.

[0128] In the heatsink 84, for example, when cooling air is supplied from below in the direction of gravity towards the top along the second direction L2, it flows inward along the first surface 21 of the base portion 20 in the first direction L1 of the base portion 20.

[0129] Next, a heat sink according to the 15th embodiment of the present invention will be described with reference to the drawings. The heat sink according to the 15th embodiment shares the same main components as the heat sinks according to the 1st to 14th embodiments, so the same components as those in the 1st to 14th embodiments will be described using the same reference numerals. Figure 26 is an explanatory diagram illustrating the arrangement of the heat dissipation fins of the heat sink according to the 15th embodiment of the present invention from a planar perspective. Also, in Figure 26, for the convenience of explaining the arrangement of the heat dissipation fins, the heat conductive members are omitted from the description.

[0130] In the heat sink 1 according to the first embodiment, each heat dissipation fin 10 extended in a direction substantially parallel to the second direction L2 of the base portion 20 and in a direction substantially perpendicular to the first direction L1. Instead, as shown in Figure 26, the heat sink 85 according to the 15th embodiment has an oblique heat dissipation fin 10 that extends obliquely to the second direction L2 of the base portion 20, and a parallel heat dissipation fin 10 that extends in a direction substantially parallel to the second direction L2 of the base portion 20. Furthermore, the heat sink 85 has a composite type heat dissipation fin 10 having a parallel portion that extends in a direction substantially parallel to the second direction L2 of the base portion 20 and an oblique portion that extends obliquely to the second direction L2 of the base portion 20.

[0131] In the heat sink 85, as shown in Figure 26, the heat dissipation fins 10 positioned on the upper side of the base portion 20 (for example, upward in the direction of gravity) are parallel heat dissipation fins 10, while the heat dissipation fins 10 positioned on the lower side of the base portion 20 (for example, downward in the direction of gravity) are angled heat dissipation fins 10. Furthermore, the composite heat dissipation fins 10 have a parallel portion positioned on the upper side of the base portion 20 (for example, upward in the direction of gravity) and an angled portion positioned on the lower side of the base portion 20 (for example, downward in the direction of gravity). The parallel portions of multiple parallel heat dissipation fins 10, 10, 10... and multiple composite heat dissipation fins 10, 10, 10... are arranged in parallel at predetermined intervals. Similarly, the angled portions of multiple angled heat dissipation fins 10, 10, 10... and multiple composite heat dissipation fins 10, 10, 10... are arranged in parallel at predetermined intervals.

[0132] In the heat sink 85, the angled portion of the angled heat dissipation fin 10 and the angled portion of the composite heat dissipation fin 10 located on the left side of the base portion 20 are arranged to extend downward in the figure as they are directed outward from the base portion 20 (to the left in Figure 26) (for example, extending from above in the direction of gravity to below). Similarly, the angled portion of the angled heat dissipation fin 10 and the angled portion of the composite heat dissipation fin 10 located on the right side of the base portion 20 are arranged to extend downward in the figure as they are directed outward from the base portion 20 (to the right in Figure 26) (for example, extending from above in the direction of gravity to below).

[0133] The angle between the oblique heat dissipation fin 10 and the oblique portion of the composite heat dissipation fin 10 relative to the first direction L1 of the base portion 20 is not particularly limited, but for example, it is in the range of 40° to 70°.

[0134] In the heatsink 85, for example, when cooling air is supplied from below in the direction of gravity to above along the second direction L2, the air flows inward along the first surface 21 of the base portion 20 in the first direction L1 on the lower side of the base portion 20 (downward in the direction of gravity), and flows along the second direction L2 along the first surface 21 of the base portion 20 on the upper side of the base portion 20 (upward in the direction of gravity).

[0135] In the heat sinks 83, 84, and 85, the base portion 20 and the heat dissipation fins 10 are integrally molded, so the contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, and the thermal connectivity between the base portion 20 and the heat dissipation fins 10 is improved. Therefore, even if a large number of heat-generating elements 100 with various heat generation amounts are thermally connected to the base portion 20 of the heat sinks 83, 84, and 85, heat transfer from the base portion 20 to the heat dissipation fins 10 is facilitated. Furthermore, in the heat sinks 83, 84, and 85, at least a portion of the heat conductive member (not shown) is embedded, so even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent freedom in the arrangement of the heat conductive member, and the thermal connectivity of the heat conductive member in the heat sinks 83, 84, and 85 is excellent. Therefore, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sinks 83, 84, and 85, the heat is diffused throughout the entire base portion 20 by the heat conductive member, resulting in uniform heating of the entire base portion 20 and equal heat transfer from the base portion 20 across the entire heat dissipation fins 10. Consequently, even with the heat sinks 83, 84, and 85, the thermal load across the entire heat dissipation fins 10 is made uniform, improving the fin efficiency of the heat dissipation fins 10. From the above, even with the heat sinks 83, 84, and 85, the heat dissipation characteristics are improved even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected.

[0136] Next, a heat sink according to the 16th embodiment of the present invention will be described with reference to the drawings. The heat sink according to the 16th embodiment shares the same main components as the heat sinks according to the 1st to 15th embodiments, so the same components as those in the 1st to 15th embodiments will be described using the same reference numerals. Figure 27 is a side cross-sectional view of the heat sink according to the 16th embodiment of the present invention.

[0137] In the heat sink 1 according to the first embodiment, the entire heat conductive member 31 is embedded in the heat sink 1, and the heat conductive member 31 is thermally connected to the heat-generating element 100 via the base portion 20. Instead, as shown in Figure 27, in the heat sink 86 according to the sixteenth embodiment, the heat conductive member 31 is thermally connected to the heat-generating element 100 via a block-shaped member 95 that is separate from the base portion 20. In the heat sink 86, the block-shaped member 95 is connected to the portion of the heat conductive member 31 that faces the heat-generating element 100, and furthermore, the block-shaped member 95 is thermally connected to the heat-generating element 100. From the above, in the heat sink 86, heat from the heat-generating element 100 is transferred from the heat-generating element 100 to the block-shaped member 95, and the heat transferred from the heat-generating element 100 to the block-shaped member 95 is transferred from the block-shaped member 95 to the heat conductive member 31.

[0138] In the heat sink 86, the portion of the heat conductive member 31 to which the block-shaped member 95 is not connected is embedded in the heat sink 86 by casting. Therefore, the portion of the heat conductive member 31 to which the block-shaped member 95 is not connected is embedded in the heat sink 86 by casting. Furthermore, the entire outer surface of the heat conductive member 31 is embedded in the heat sink 86 because the block-shaped member 95 is connected to the portion of the heat conductive member 31 facing the heating element 100. The block-shaped member 95 is thermally connected to the heat conductive member 31 by fitting into a recess 96 provided on the second surface 22 of the base portion 20. In addition, if necessary, the block-shaped member 95 may be joined to the heat conductive member 31. Examples of joining means include brazing and soldering.

[0139] The portion of the block-shaped member 95 facing the heating element 100 is located on the same plane as the second surface 22 of the base portion 20. Therefore, the portion of the block-shaped member 95 that faces the heating element 100, the exposed portion 97 from the base portion 20, is a flat portion located on the same plane as the second surface 22. The exposed portion 97 of the block-shaped member 95 contacts the heating element 100, and the block-shaped member 95 is thermally connected to the heating element 100. The block-shaped member 95 may also have a protrusion that extends from the second surface 22 of the base portion 20 along the thickness direction of the base portion 20. That is, the portion of the block-shaped member 95 facing the heating element 100 may protrude from the second surface 22 of the base portion 20, and the protrusion of the block-shaped member 95 may contact the heating element 100, and the block-shaped member 95 may be thermally connected to the heating element 100.

[0140] The block-shaped member 95 can be a solid member having thermal conductivity. The material of the block-shaped member 95 can be, for example, a metal such as copper or a copper alloy. In the heat sink 86, the thermal conductive member 31 can be a heat pipe 30, as in the above embodiments.

[0141] In the heat sink 86, since the base portion 20 and the heat dissipation fins 10 are integrally molded, the contact resistance between the base portion 20 and the heat dissipation fins 10 is suppressed, and the thermal connectivity between the base portion 20 and the heat dissipation fins 10 is improved. Therefore, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 86, heat transfer from the base portion 20 to the heat dissipation fins 10 is facilitated. Furthermore, even in the heat sink 86, since at least a portion of the heat conductive member 31 is embedded, even if a shield portion is formed on the second surface 22 of the base portion 20, there is excellent freedom in the arrangement of the heat conductive member 31, and the thermal connectivity of the heat conductive member 31 in the heat sink 86 is excellent. Therefore, even with the heat sink 86, even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected to the base portion 20 of the heat sink 86, the heat is diffused throughout the entire base portion 20 by the heat conductive member 31, resulting in uniform heating of the entire base portion 20 and equal heat transfer from the base portion 20 to the entire heat dissipation fin 10. Consequently, even with the heat sink 86, the thermal load on the entire heat dissipation fin 10 is made uniform, improving the fin efficiency of the heat dissipation fin 10. From the above, even with the heat sink 86, the heat dissipation characteristics are improved even if a large number of heat-generating elements 100 with varying heat generation amounts are thermally connected.

[0142] Next, other embodiments of the heat sink of the present invention will be described. In the heat sinks of the above embodiments, a heat pipe or vapor chamber, which is a heat transport member, was used as a heat conducting member. However, there are no particular limitations as long as the member has thermal conductivity, and instead of a heat transport member, a solid metal (for example, copper) rod-shaped or plate-shaped member, or a solid graphite rod-shaped or plate-shaped member may be used. Also, in the heat sinks of the above embodiments, the heat pipe was embedded in the block portion, but instead, the entire heat pipe may be embedded in the base portion. Specifically, as shown in Figure 28, there may be no block portion, and the entire heat pipe 30 may be embedded in the base portion 20 of the heat sink 87. In the heat sink 87, the diameter of the heat pipe 30 is smaller than the thickness of the base portion 20. Furthermore, as shown in Figure 29, a heat sink 88 may be provided in which a block portion 60, which is a convex portion of the second surface 22 of the base portion 20 that protrudes in the thickness direction of the base portion 20, is provided on the second surface 22 and in a recess 90 formed on the second surface 22, and the block portion 60 provided in the recess 90 does not protrude from the second surface 22. In the heat sink 88 as well, the heat pipe 30 is embedded in the block portion 60. The recess 90 is a region in which the thickness of the base portion 20 is reduced. The block portion 60 provided on the second surface 22, which is a region other than the recess 90, protrudes more in the thickness direction of the base portion 20 than the block portion 60 provided in the recess 90. Therefore, even if multiple heat-generating elements 100 of different heights are to be cooled by the heat sink 88, it has excellent thermal connectivity to the multiple heat-generating elements 100.

[0143] Furthermore, in the heat sinks of the above embodiments, the shape of the base portion was rectangular in plan view (viewed from a position opposite the heat dissipation fins). However, the shape of the base portion can be appropriately selected depending on the usage conditions of the heat sink, and may have a curved portion, a notched portion, etc., in plan view. Also, in the heat sinks of the above embodiments, the heat dissipation fins extended in a substantially straight line from one end to the other in the second direction of the base portion. However, the shape of the heat dissipation fins in the second direction of the base portion is not particularly limited, and may instead have a curved portion.

[0144] Furthermore, in the heat sink of the first embodiment, the vertical dimension of the sealed injection tube was smaller than the thickness of the base. However, instead, the dimension may be made larger than the thickness of the base, so that the tip of the sealed injection tube protrudes from the second surface of the base. [Industrial applicability]

[0145] The heat sink of the present invention offers excellent thermal connectivity between the base and the heat dissipation fins, as well as excellent flexibility in the arrangement of the heat conductive material. Furthermore, it prevents rainwater, dust, and other contaminants from entering between the base and the heat dissipation fins, and has excellent durability. Therefore, it is particularly valuable for use in cooling heat-generating components mounted on communication equipment installed outdoors, such as mobile phone base stations. [Explanation of Symbols]

[0146] 1, 2, 3, 4, 5, 6, 7, 8, 9 Heatsink 80, 81, 82, 83, 84, 85, 86 Heatsink 10 heat dissipation fins 20 Base section 21 First side 22 Second side 30, 70 heat pipes 50 vapor chambers

Claims

1. A base portion having a first surface and a second surface facing the first surface, to which a heating element is thermally connected, The base portion comprises heat dissipation fins erected on the first surface, This is a heat sink in which the base portion and the heat dissipation fins are integrally molded. At least a portion of the heat conductive member is embedded in the heat sink, The base portion has a block portion that extends in the direction of extension of the base portion, and the heat conductive member is embedded in the block portion. A heat sink in which the block portion is a convex portion of the second surface of the base portion that protrudes from the second surface of the base portion in the thickness direction of the base portion.

2. The heat sink according to claim 1, wherein the heat conductive member has a heat receiving portion that is thermally connected to the heat generating element.

3. The heat sink according to claim 1 or 2, wherein the entire heat conductive member is embedded in the heat sink.

4. The heat sink according to claim 1, wherein at least a portion of the heat conductive member has an exposed portion that is exposed from the protrusion of the second surface, and the exposed portion is in direct contact with the heat generating element.

5. The heat sink according to claim 1 or 2, wherein the heat conductive member extends along the extending direction of the base portion.

6. The heat sink according to claim 4, wherein the heat conductive member has a stepped portion bent in the thickness direction of the base portion, and the exposed portion is formed by the stepped portion.

7. The heat sink according to claim 4, wherein the heat conductive member has a protruding portion that protrudes in the thickness direction of the base portion, and the exposed portion is formed by the protruding portion.

8. The heat sink according to claim 1 or 2, wherein the heat conducting member is a heat pipe or a vapor chamber.

9. The heat sink according to claim 1 or 2, wherein the heat sink is a cast member and the heat conductive member is embedded in the heat sink by casting.

10. The heat sink according to claim 8, wherein a sealed injection tube used for injecting a working fluid into the heat pipe or the vapor chamber is provided inward from the periphery of the heat sink.

11. The heat sink according to claim 8, wherein the heat pipe is a flattened, flattened heat pipe.

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