Holding device

Abstract

To enhance a design freedom of an internal resistance arranged in an internal part of a plate-like member in a holding device.SOLUTION: An elastic chuck 100 as a holding device, comprises: a plate-like member 10 having a first front surface and a second front surface; a resistance temperature detector (an internal resistance) 60; a first driver 71 that is connected to the first front surface side of the resistance thermometer sensor; and a second driver 72 connected to a second front surface S2 side. The resistance temperature detector comprises a plurality of resistance bodies 61 that is arranged so as to be parallel to a first direction, and is serially connected. A pad part 61B is provided to each of the resistance bodies 61. The resistance temperature detector contains: a first resistance body 62; and a second resistance body 63. The first driver 71 extends in a second direction and comprises a first driver end part 71B. The second driver 72 extends in a second direction and comprises a second driver end part 72B. The resistance temperature detector is arranged between the first driver end part 71B and the second driver end part 72B in a first direction Z.SELECTED DRAWING: Figure 4

Description

Technical Field

[0004] , , , , , ,

[0003] , ,

[0001] The present disclosure relates to a holding device.

Background Art

[0002] As a holding device for holding a wafer when manufacturing a semiconductor, an electrostatic chuck described in Japanese Patent No. 6571880 (Patent Document 1 below) is known. This electrostatic chuck includes a ceramic plate, a temperature measuring resistor provided inside the ceramic plate, and a temperature measuring resistor driver that constitutes a power supply path for the temperature measuring resistor. The upper surface of the ceramic plate is an adsorption surface for adsorbing a wafer. The ceramic plate is partitioned into a plurality of segments in a direction parallel to the adsorption surface. A temperature measuring resistor is arranged in each segment.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An electrostatic chuck 1 configured in the same manner as the electrostatic chuck of Patent Document 1 will be described while referring to FIGS. 7 and 8. In the configuration of the electrostatic chuck 1, one temperature measuring resistor 2 is provided in each segment SE. The temperature measuring resistor 2 includes three resistors (designated as 2A, 2B, and 2C from the top) arranged in a direction orthogonal to the adsorption surface (vertical direction). The three resistors 2A, 2B, and 2C are connected in series via vias 3A and 3B extending in the vertical direction. Each of the three resistors 2A, 2B, and 2C includes a resistance wire portion 4 extending parallel to the adsorption surface and a pad portion 5 disposed at an end of the resistance wire portion 4. The vias 3A and 3B connecting the three resistors 2A, 2B, and 2C are connected to the pad portion 5. The pad portion 5 is substantially circular in plan view, and the width of the pad portion 5 is larger than the width of the resistance wire portion 4.

[0005] The temperature sensor driver 6 is equipped with conductive lines 6A and 6B that extend parallel to the suction surface. The conductive lines 6A and 6B are located below the temperature sensor 2. Therefore, a conductive path 7 extending vertically is provided in each segment SE to connect the pad portion 5 of the uppermost resistor 2A to the conductive line 6B. Although not described in detail in Patent Document 1, this conductive path 7 is thought to typically comprise a driver-side pad portion 7A provided on the same layer as each resistor 2A, 2B, 2C, and a driver-side via 7B connected to the driver-side pad portion 7A. The driver-side pad portion 7A is formed to the same size as the pad portion 5 of the temperature sensor 2. In such a case, the area (area in plan view) in each segment SE where the resistance wire portion 4 of the resistors 2B and 2C can be wired becomes smaller due to the provision of the driver-side pad portion 7A. Therefore, the design freedom of the resistors 2B and 2C may be limited. For example, if the area of ​​segment SE in a plan view becomes smaller, it may become difficult to increase the resistance value by lengthening the conductive path of the temperature-sensing resistor 2.

[0006] This disclosure was completed based on the circumstances described above, and aims to increase the design flexibility of the internal resistance arranged inside the plate-shaped member. [Means for solving the problem]

[0007] The holding device of this disclosure comprises a plate-shaped member having a first surface perpendicular to a first direction and a second surface located opposite to the first surface; an internal resistor formed inside the plate-shaped member; a first driver connected to the end of the internal resistor on the first surface side; and a second driver connected to the end of the internal resistor on the second surface side, wherein the internal resistor comprises a plurality of resistors arranged in a line in the first direction and connected in series, each end of the plurality of resistors having a pad portion, the plurality of resistors including a first resistor positioned closest to the first surface in the first direction and a second resistor positioned closest to the second surface in the first direction, the first driver having a first driver end extending in a second direction parallel to the first surface and electrically connected to the pad portion of the first resistor, the second driver having a second driver end extending in the second direction and electrically connected to the pad portion of the second resistor, and the internal resistor being positioned between the first driver end and the second driver end in the first direction. [Effects of the Invention]

[0008] According to this disclosure, the degree of design freedom for the internal resistance arranged inside the plate-shaped member in the holding device can be increased. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic perspective view showing the external configuration of the electrostatic chuck according to Embodiment 1. [Figure 2] Figure 2 is a schematic plan view of an electrostatic chuck. [Figure 3] Figure 3 is a schematic cross-sectional view of an electrostatic chuck. [Figure 4] Figure 4 is an enlarged view of a portion of Figure 3, schematically showing the configuration of the resistance thermometer, the first driver, and the second driver. [Figure 5] Figure 5 is a schematic diagram showing the AA section of Figure 4. [Figure 6]Figure 6 is a schematic diagram illustrating the configuration of the resistance thermometer in the XY plane, the arrangement of various vias extending in the Z-axis direction, the first driver, and the second driver. [Figure 7] Figure 7 is a schematic cross-sectional view of the electrostatic chuck described in Patent Document 1, and corresponds to Figure 4. [Figure 8] Figure 8 is a schematic diagram illustrating the arrangement of the temperature-measuring resistor and the driver for the temperature-measuring resistor in the electrostatic chuck described in Patent Document 1, and corresponds to Figure 6. [Figure 9] Figure 9 is a schematic cross-sectional view of the electrostatic chuck according to Embodiment 2. [Figure 10] Figure 10 is a schematic cross-sectional view of an electrostatic chuck according to Embodiment 3. [Modes for carrying out the invention]

[0010] [Description of Embodiments in this Disclosure] First, embodiments of this disclosure will be listed and described. (1) The holding device of the present disclosure comprises a plate-shaped member having a first surface perpendicular to a first direction and a second surface located opposite to the first surface, an internal resistor formed inside the plate-shaped member, a first driver connected to the end of the internal resistor on the first surface side, and a second driver connected to the end of the internal resistor on the second surface side, wherein the internal resistor comprises a plurality of resistors arranged in a line in the first direction and connected in series, each end of the plurality of resistors is provided with a pad portion, the plurality of resistors includes a first resistor positioned furthest toward the first surface in the first direction and a second resistor positioned furthest toward the second surface in the first direction, the first driver comprises a first driver end extending in a second direction parallel to the first surface and electrically connected to the pad portion of the first resistor, the second driver comprises a second driver end extending in the second direction and electrically connected to the pad portion of the second resistor, and the internal resistor is positioned between the first driver end and the second driver end in the first direction.

[0011] Since the internal resistance is arranged between the first driver end and the second driver end, the design freedom of each resistor of the internal resistance can be increased.

[0012] (2) In the holding device according to (1), the plate-like member is partitioned in a direction orthogonal to the first direction into a plurality of first zones and a second zone different from the plurality of first zones, and each of the first zones includes the internal resistance, the first driver end, and the second driver end. The first driver is connected to the first driver end and includes a first wiring portion extending in the second direction. It is preferable that an end portion of the first wiring portion different from the first driver end is included in the second zone.

[0013] The end portion of the first wiring portion generally has a large area for connection to a via or a terminal and becomes a temperature singularity point. Therefore, by arranging the end portion of the first wiring portion different from the first driver end in the second zone instead of the first zone, the heat uniformity in the first zone can be improved.

[0014] (3) In the holding device according to (1) or (2), the second driver is connected to the second driver end and includes a second wiring portion extending in the second direction. It is preferable that an end portion of the second wiring portion different from the second driver end is included in the second zone.

[0015] The end portion of the second wiring portion generally has a large area for connection to a via or a terminal and becomes a temperature singularity point. Therefore, by arranging the end portion of the second wiring portion different from the second driver end in the second zone instead of the first zone, the heat uniformity in the first zone can be improved.

[0016] (4) In the holding device according to (1) to (3), the internal resistance is at least one of a temperature measuring resistor and a heater.

[0017] (5) In the holding device according to (4), the internal resistance is the temperature measuring resistor.

[0018] (6) In the holding device according to (5), it is preferable that the pad portions of the resistors of the temperature measuring resistor overlap when viewed from the first direction.

[0019] Since the patterns of the respective resistors can be made the same shape, the design of the temperature measuring resistor is easy.

[0020] (7) In the holding device according to (4), the internal resistance is both the temperature measuring resistor and the heater.

[0021] [Details of Embodiment 1 of the Present Disclosure] Embodiment 1 of the present disclosure will be described with reference to FIGS. 1 to 6. Note that the present disclosure is not limited to these examples, and is shown by the claims, and is intended to include all modifications within the meaning and scope equivalent to the claims. In the following description, for a plurality of identical members, only some members may be assigned reference numerals, and the reference numerals of other members may be omitted. In this specification, the positive direction of the X-axis is the upward direction, the negative direction of the X-axis is the downward direction, and the XY plane direction is the horizontal direction, and the configuration of the holding device will be described. However, in the actual usage mode of the holding device, it may be arranged differently. Also, in this specification, "orthogonal" includes arrangements in a mode recognized as substantially orthogonal, and "parallel" includes arrangements in a mode recognized as substantially parallel.

[0022] <Electrostatic Chuck> The holding device of the present disclosure is an electrostatic chuck 100 that can adsorb and hold an object such as a semiconductor wafer or a glass substrate (hereinafter referred to as "wafer W"). The electrostatic chuck 100 is attached to, for example, a processing chamber of a semiconductor manufacturing apparatus (not shown) and is used to perform various processes (film formation, etching, etc.) on the wafer W using plasma.

[0023] As shown in Figure 1, the electrostatic chuck 100 comprises a plate-shaped member 10 and a base member 20. The plate-shaped member 10 and the base member 20 are joined by a joint 30. The joint 30 is made of an adhesive such as a silicone resin, acrylic resin, or epoxy resin. The electrostatic chuck 100 is capable of holding a wafer W by electrostatic attraction.

[0024] The base member 20 is a disc-shaped member, and can be formed into a shape with, for example, a diameter of about 340 mm and a thickness of about 35 mm. The base member 20 is mainly composed of conductive materials such as aluminum and aluminum alloy. Here, "main component" refers to the component with the highest content (weight percentage) (the same applies hereinafter). As shown in Figure 3, the base member 20 has a third surface S3 located on the plate-shaped member 10 side and a fourth surface S4 located on the opposite side of the third surface S3. The third surface S3 is located on the upper side of the base member 20, and the fourth surface S4 is located on the lower side of the base member 20. The third surface S3 of the base member 20 is joined to the second surface S2 of the plate-shaped member 10, which will be described later, by a joint 30.

[0025] A refrigerant channel 21 is provided inside the base member 20. The refrigerant channel 21 is connected to a refrigerant circulation device (not shown). The refrigerant circulation device is configured to circulate a refrigerant such as a fluorine-based inert liquid or water through the refrigerant channel 21. When refrigerant flows through the refrigerant channel 21, the base member 20 is cooled, and the plate-shaped member 10 is cooled by heat transfer (heat dissipation) between the base member 20 and the plate-shaped member 10 via the joint 30, thereby cooling the wafer W held on the first surface S1 of the plate-shaped member 10, which will be described later. This allows the temperature of the wafer W to be controlled.

[0026] <Plate-shaped member> The plate-shaped member 10 is generally disc-shaped and can be formed into a shape with, for example, a diameter of about 300 mm and a thickness of about 5 mm. The plate-shaped member 10 is an insulating substrate and is formed from, for example, ceramics mainly composed of aluminum nitride (AlN) or alumina (Al2O3).

[0027] As shown in Figure 1, a step is provided on the outer circumference of the upper portion of the plate-shaped member 10, and the upper surface of the inner portion 10A of the plate-shaped member 10 is higher than the upper surface of the outer portion 10B of the plate-shaped member 10. The upper surface of the inner portion 10A is a first surface S1 perpendicular to the Z-axis direction (an example of a first direction). The first surface S1 is a circular plane and functions as an adsorption surface for holding the wafer W. The upper surface of the outer portion 10B of the plate-shaped member 10 is configured to engage with a jig (not shown) for fixing, for example, a focus ring or an electrostatic chuck 100.

[0028] As shown in Figure 3, in the plate-shaped member 10, the surface opposite to the first surface S1 (i.e., the bottom surface) is designated as the second surface S2. The second surface S2 is joined to the base member 20 via a joint 30.

[0029] A chuck electrode 40 made of a conductive material (e.g., tungsten, molybdenum, platinum, etc.) is positioned inside the inner portion 10A of the plate-shaped member 10. The shape of the chuck electrode 40 in the Z-axis direction is, for example, approximately circular. When a voltage is applied to the chuck electrode 40 from a power source (not shown), an electrostatic attraction force is generated, and the wafer W is attracted and fixed to the first surface S1 of the plate-shaped member 10 by this electrostatic attraction force.

[0030] Inside the plate-shaped member 10 are a heater 50, a resistance thermometer 60 (an example of internal resistance), a driver 70 for the resistance thermometer, and various vias, all of which are made of conductive material (e.g., tungsten, molybdenum, platinum, etc.). In this embodiment, the resistance thermometer 60 is positioned below the chuck electrode 40, and the heater 50 is positioned below the resistance thermometer 60.

[0031] The plate-shaped member 10 with the above configuration can be manufactured, for example, by creating multiple ceramic green sheets, processing a predetermined ceramic green sheet by forming via holes, filling it with metallizing paste, printing, etc., heat-pressing these ceramic green sheets together, cutting or other processing, and then firing them.

[0032] <Zone 1, Zone 2> As shown in Figure 2, in the electrostatic chuck 100 of this embodiment, the inner portion 10A of the plate-shaped member 10 is virtually divided into a plurality of first zones 11 arranged horizontally (in a direction perpendicular to the Z-axis direction). In detail, in view along the Z-axis, the inner portion 10A of the plate-shaped member 10 is divided into a plurality of virtual annular regions (however, only the region including the center point P1 is a circular region) by a plurality of concentric first boundary lines BL1 centered on the center point P1 of the first surface S1, and each annular region is further divided into a plurality of first zones 11 arranged circumferentially on the first surface S1 by a plurality of second boundary lines BL2 extending radially on the first surface S1. The outer portion 10B of the plate-shaped member 10 is a second zone 12 that forms an annular shape in view along the Z-axis.

[0033] Multiple first zones 11 are formed to demarcate the portion of the plate-shaped member 10 on which the wafer W is placed. On the other hand, the second zone 12 is provided on the outer periphery of the wafer W, where the wafer W is not placed.

[0034] As shown in Figures 3 and 4, each of the multiple first zones 11 is equipped with a heater 50 and a resistance thermometer 60. The second zone 12 is not equipped with a heater 50 or a resistance thermometer 60. With this configuration, the temperature of the wafer W placed in the inner part 10A can be controlled.

[0035] Unlike this embodiment, a dedicated heater or resistance thermometer may be provided in the second zone 12 to control the temperature of a component (e.g., a focus ring) placed on the outer part 10B. Alternatively, an electrode component such as a chuck electrode may be provided in the second zone 12.

[0036] <Resistance thermometer> Each first zone 11 has one resistance thermometer 60. The resistance thermometer 60 comprises a plurality (three in this embodiment) of resistors 61 arranged in series along the Z-axis. As shown in Figure 6, each resistor 61 comprises a thin wire-shaped resistance portion 61A and pad portions 61B located at both ends of the resistance portion 61A, and extends horizontally. The pad portions 61B are approximately circular in shape when viewed in the Z-axis direction, and their width is larger than that of the resistance portion 61A. In this embodiment, the configuration (shape, dimensions, position in the XY plane, etc.) of each resistor 61 is the same. Therefore, as shown in Figure 5, each resistor 61 is arranged superimposed in the Z-axis direction.

[0037] As shown in Figure 3, among the multiple resistors 61, the resistor 61 positioned closest to the first surface S1 in the Z-axis direction is designated as the first resistor 62. Among the multiple resistors 61, the resistor 61 positioned closest to the second surface S2 in the Z-axis direction is designated as the second resistor 63. In this embodiment, the multiple resistors 61 include one intermediate resistor 64 positioned between the first resistor 62 and the second resistor 63 in the Z-axis direction. The multiple first resistors 62, second resistors 63, and intermediate resistor 64 positioned in the multiple first zones 11 are all positioned at the same location in the Z-axis direction.

[0038] As shown in Figure 4, the multiple resistors 61 are connected in series by vias 65A and 65B for resistance thermometers that extend in the Z-axis direction. In detail, the pad portions 61B at both ends of the intermediate resistor 64 are connected to the pad portions 61B of the first resistor 62 and the second resistor 63, respectively, via vias 65A and 65B for resistance thermometers. Of the two pad portions 61B of the first resistor 62, the pad portion 61B that is not connected to the via 65A for resistance thermometers is electrically connected to the first driver 71 of the resistance thermometer driver 70, which will be described below. Of the two pad portions 61B of the second resistor 63, the pad portion 61B that is not connected to the via 65B for resistance thermometers is electrically connected to the second driver 72 of the resistance thermometer driver 70, which will be described below.

[0039] <Driver for resistance thermometer> As shown in Figure 3, the resistance thermometer driver 70 is part of a configuration for connecting the resistance thermometer 60 to the power supply terminal 13, and comprises a first driver 71 electrically connected to the first resistor 62 and a second driver 72 electrically connected to the second resistor 63. As shown in Figure 4, the first driver 71 comprises a first wiring section 71A extending horizontally and a first driver end 71B provided at the end of the first wiring section 71A. The first driver end 71B is substantially circular in a view along the Z-axis, and its width is larger than the line width of the first wiring section 71A. The first driver end 71B is located in the area of ​​the first zone 11 that is on the first surface S1 side of the first resistor 62. The second driver 72 comprises a second wiring section 72A extending horizontally and a second driver end 72B provided at the end of the second wiring section 72A. The second driver end 72B is approximately circular in shape when viewed in the Z-axis direction, and its width is larger than that of the second wiring section 72A. The second driver end 72B is located in the region of the first zone 11 that is on the second surface S2 side of the second resistor 63. That is, the resistance thermometer 60 is positioned between the first driver end 71B and the second driver end 72B in the Z-axis direction.

[0040] The first driver end 71B is connected to the pad portion 61B of the first resistor 62 via a resistor-side via 73A extending in the Z-axis direction. The second driver end 72B is connected to the pad portion 61B of the second resistor 63 via a resistor-side via 73B extending in the Z-axis direction.

[0041] In this embodiment, the resistance thermometer 60 is positioned between the first driver end 71B and the second driver end 72B in the Z-axis direction. The first resistor 62 is electrically connected to the first driver end 71B, and the second resistor 63 is electrically connected to the second driver end 72B. Therefore, within the first zone 11, it is not necessary to provide a conductive path connecting the resistance thermometer driver 70 and the resistance thermometer 60 within the Z-axis range where the multiple resistors 61 of the resistance thermometer 60 are arranged. Thus, compared to the configuration of Patent Document 1, the design freedom of each resistor 61 arranged within the first zone 11 can be improved.

[0042] Specifically, in the configuration of Patent Document 1, as shown in Figures 7 and 8, it is necessary to provide the driver-side pad portion 7A on the same layer as the resistors 2B and 2C in segment SE (corresponding to the first zone 11 in this embodiment), which restricts the design of the resistance wire portion 4. On the other hand, in this embodiment, as shown in Figures 4 and 6, it is not necessary to provide the driver-side pad portion on the same layer as each resistor 61 in the first zone 11, so the design of the resistance wire portion 61A is not restricted.

[0043] For example, in this embodiment, compared to the configuration of Patent Document 1, the absence of a driver-side pad makes it easier to form a longer resistance wire portion 61A. This allows for a larger resistance value of the resistance thermometer 60, thereby improving the accuracy of temperature measurement by the resistance thermometer 60. Furthermore, unlike the configuration of Patent Document 1, in this embodiment, each resistor 61 can be provided with the same shape. Having the same shape for each resistor 61 has the advantage of eliminating the need to prepare multiple types of screen patterns for forming the resistors 61.

[0044] As shown in Figure 4, the first driver 71 includes a first driver other end 71C located at a different end of the first wiring section 71A from the first driver end 71B. The first driver other end 71C is substantially circular in shape when viewed in the Z-axis direction, and its width is larger than the line width of the first wiring section 71A. The first driver other end 71C is located within the second zone 12. The first driver other end 71C is connected to the power supply side via 74A. The second driver 72 includes a second driver other end 72C located at a different end of the second wiring section 72A from the second driver end 72B. The second driver other end 72C is substantially circular, and its width is larger than the line width of the second wiring section 72A. The second driver other end 72C is located within the second zone 12. The second driver other end 72C is connected to the power supply side via 74B.

[0045] The other end 71C of the first driver and the other end 72C of the second driver have a large surface area due to their connection with the power supply vias 74A and 74B, and thus become temperature singularities. However, in this embodiment, since the other end 71C of the first driver and the other end 72C of the second driver are located within the second zone 12, the uniformity of heat within the first zone 11 can be improved.

[0046] As shown in Figure 3, the power supply vias 74A and 74B are connected to a different pair of power supply terminals 13 via electrode pads 75A and 75B, respectively. The power supply terminals 13 are housed in terminal holes 22 provided in the electrostatic chuck 100. The terminal holes 22 are formed extending in the Z-axis direction from the fourth surface S4 of the base member 20 to the interior of the plate-shaped member 10. The power supply terminals 13 are connected to a power source (not shown).

[0047] Unlike this embodiment, the terminal holes may extend vertically from the fourth surface S4 of the base member 20 into the interior of the inner portion 10A, and the power supply terminals and electrode pads may be arranged in the first zone 11. In this case, it is preferable that the conductive path connecting the other end 71C of the first driver and the other end 72C of the second driver, which are arranged in the second zone 12, to the electrode pads extends horizontally from the second zone 12 to the first zone 11, on the second surface S2 side (lower side) of the second driver 72. With such a configuration, the design freedom of the resistance thermometer 60 can be improved, similar to this embodiment.

[0048] When a voltage is applied to the resistance thermometer 60 from a power source (not shown), a current flows through the resistance thermometer 60. The resistance thermometer 60 is made of a conductive material (for example, tungsten, molybdenum, platinum, etc.) whose resistance changes with temperature. Specifically, the resistance of the resistance thermometer 60 increases as the temperature rises. The electrostatic chuck 100 also has a configuration (for example, a voltmeter and an ammeter (neither shown)) for measuring the voltage applied to the resistance thermometer 60 and the current flowing through the resistance thermometer 60. Therefore, in the electrostatic chuck 100 of this embodiment, the resistance value of the resistance thermometer 60 can be determined based on the measured voltage and current values ​​of the resistance thermometer 60, and the temperature of the resistance thermometer 60 can be measured (specified).

[0049] <Heater> As shown in Figure 4, one heater 50 is provided in each first zone 11. Although a detailed explanation is omitted, the heater 50, like each resistor 61 of the resistance thermometer 60, comprises a resistance wire portion 51 and pad portions 52 provided at both ends of the resistance wire portion 51. The resistance wire portion 51 of the heater 50 is shaped so that it passes through each position in the first zone 11 as evenly as possible when viewed in the Z-axis direction.

[0050] The electrostatic chuck 100 is equipped with a configuration for supplying power to each heater 50. Specifically, the electrostatic chuck 100 has heater terminal holes (not shown), and each heater terminal hole houses a heater power supply terminal (not shown). The heater power supply terminals are connected to the pad portion 52 of the heater 50 via heater vias 53, electrode pads (not shown), etc.

[0051] When a voltage is applied to the heater 50 from a power source (not shown), the heater 50 generates heat. This heats the first zone 11 where the heater 50 is located. By individually controlling the voltage applied to the heaters 50 located in each first zone 11 of the plate-shaped member 10, the temperature of each first zone 11 can be controlled individually.

[0052] <Effects of Embodiment 1> As described above, the holding device (electrostatic chuck 100) of Embodiment 1 comprises a plate-shaped member 10 having a first surface S1 perpendicular to a first direction (Z-axis direction) and a second surface S2 located on the opposite side of the first surface S1, an internal resistor (resistance thermometer 60) formed inside the plate-shaped member 10, a first driver 71 connected to the end of the internal resistor on the first surface S1 side, and a second driver 72 connected to the end of the internal resistor on the second surface S2 side, wherein the internal resistor comprises a plurality of resistors 61 arranged in a line in the first direction and connected in series, and each end of the plurality of resistors 61 is provided with a pad portion 61B, The resistor 61 includes a first resistor 62 positioned furthest toward the first surface S1 in the first direction, and a second resistor 63 positioned furthest toward the second surface S2 in the first direction. The first driver 71 extends in a second direction (in the XY plane) parallel to the first surface S1 and includes a first driver end 71B electrically connected to the pad portion 61B of the first resistor 62. The second driver 72 extends in the second direction and includes a second driver end 72B electrically connected to the pad portion 61B of the second resistor 63. The internal resistance is positioned between the first driver end 71B and the second driver end 72B in the first direction.

[0053] Since the internal resistor is located between the first driver terminal 71B and the second driver terminal 72B, the design flexibility of each internal resistor 61 can be increased.

[0054] In the holding device of Embodiment 1, the plate-shaped member 10 is divided into a plurality of first zones 11 and a second zone 12 different from the plurality of first zones 11 in a direction perpendicular to the first direction. Each first zone 11 includes an internal resistor, a first driver end 71B, and a second driver end 72B. The first driver 71 is connected to the first driver end 71B and includes a first wiring section 71A extending in the second direction. The end of the first wiring section 71A different from the first driver end 71B (the other end of the first driver 71C) is included in the second zone 12.

[0055] The end of the first wiring section 71A generally has a large surface area due to connections with vias and terminals, and thus becomes a temperature singularity. Therefore, by placing an end of the first wiring section 71A that is different from the first driver end 71B in the second zone 12 instead of the first zone 11, the uniformity of heat within the first zone 11 can be improved.

[0056] In the holding device of Embodiment 1, the second driver 72 is connected to the second driver end 72B and includes a second wiring section 72A extending in a second direction, and the end of the second wiring section 72A that is different from the second driver end 72B (the other end of the second driver 72C) is included in the second zone 12.

[0057] The end of the second wiring section 72A generally has a large surface area due to connections with vias and terminals, and thus becomes a temperature singularity. Therefore, by placing an end of the second wiring section 72A that is different from the second driver end 72B in the second zone 12 instead of the first zone 11, the uniformity of heat within the first zone 11 can be improved.

[0058] In the holding device of Embodiment 1, the internal resistance is at least one of the resistance thermometer 60 and the heater 50.

[0059] In the holding device of Embodiment 1, the internal resistance is the resistance thermometer 60.

[0060] In the holding device of Embodiment 1, the pad portions 61B of each resistor 61 of the temperature-sensing resistance element 60 are superimposed when viewed from the first direction.

[0061] Since the patterns of each resistor 61 can be made the same shape, the design of the resistance thermometer 60 is simplified.

[0062] [Details of Embodiment 2 of this Disclosure] Embodiment 2 of this disclosure will be described with reference to Figure 9. The electrostatic chuck 200 of Embodiment 2 is configured similarly to the electrostatic chuck 100 of Embodiment 1, except that the configuration of the second driver 172 of the resistance thermometer driver 170 differs from that of the second driver 72. Hereinafter, the same reference numerals are used for components that are the same as in Embodiment 1, and their descriptions are omitted.

[0063] The second driver 172 includes a second wiring section 172A extending horizontally, a second driver end 172B located at one end of the second wiring section 172A, and a second driver other end 172C located at the other end of the second wiring section 172A. In Embodiment 1, the second driver other end 72C was located within the second zone 12, but in Embodiment 2, the second driver other end 172C is located within the first zone 11.

[0064] The other end 172C of the second driver is connected to a power supply via 174B that extends downward. The lower end of the power supply via 174B is connected to a power supply terminal (not shown in Figure 9). When the power supply terminal is provided on the opposite side of the first surface S1 (the second surface S2 side), even if the other end 172C of the second driver is located within the first zone 11, the conductive path connecting the other end 172C of the second driver and the power supply terminal is not formed through the layers of each resistor 61 of the resistance thermometer 60. Therefore, the design freedom of the resistance thermometer 60 can be improved, similar to Embodiment 1. However, it is possible that the uniformity of the heat distribution of the first surface S1 may be impaired because the other end 172C of the second driver, which has a large area and becomes a temperature singularity, is included in the first zone 11. It should be noted that when considering the arrangement of the power supply terminal and the routing of the second driver 172, the configuration of Embodiment 2 may be preferable to Embodiment 1.

[0065] [Details of Embodiment 3 of this Disclosure] Embodiment 3 of this disclosure will be described with reference to Figure 10. The electrostatic chuck 300 of Embodiment 3 is configured in the same way as the electrostatic chuck 100 of Embodiment 1, except for the configuration of the heater 250. Hereinafter, the same reference numerals are used for components that are the same as in Embodiment 1, and their descriptions are omitted.

[0066] In this embodiment, the heater 250 is an example of an internal resistance, similar to the resistance thermometer 60. More specifically, the heater 250 comprises a plurality (three in this embodiment) of resistors 251. Each resistor 251 comprises a resistance wire portion 251A and pad portions 251B disposed at both ends of the resistance wire portion 251A. The plurality of resistors 251 comprises a first resistor 252 disposed closest to the first surface S1, a second resistor 253 disposed closest to the second surface S2, and an intermediate resistor 254 disposed between the first resistor 252 and the second resistor 253 in the Z-axis direction. The first resistor 252 and the intermediate resistor 254 are connected by a heater via 255A. The second resistor 253 and the intermediate resistor 254 are connected by a heater via 255B.

[0067] <Driver for heater> The heater 250 is connected to a power supply terminal (not shown) via a heater driver 80 and electrode pads (not shown). The heater driver 80 includes a first driver 81 electrically connected to the first resistor 252 and a second driver 82 electrically connected to the second resistor 253. The first driver 81 includes a first wiring section 81A, a first driver end 81B located at one end of the first wiring section 81A, and a first driver other end 81C located at the other end of the first wiring section 81A. The second driver 82 includes a second wiring section 82A, a second driver end 82B located at one end of the second wiring section 82A, and a second driver other end 82C located at the other end of the second wiring section 82A.

[0068] The first driver end 81B is located within the first zone 11 and connected to the pad portion 251B of the first resistor 252 via the resistor-side via 83A. The other end 81C of the first driver is located within the second zone 12 and connected to the power supply-side via 84A. The second driver end 82B is located within the first zone 11 and connected to the pad portion 251B of the second resistor 253 via the resistor-side via 83B. The other end 82C of the second driver is located within the second zone 12 and connected to the power supply-side via 84B.

[0069] According to the configuration of this embodiment, since the heater 250 is equipped with multiple resistors 251, it is easy to increase the resistance value of the heater 250. In addition, the design flexibility of each resistor 251 of the heater 250 can be improved.

[0070] Although not shown in the figures, it is preferable that the shapes of each resistor 251 of the heater 250 are different from each other. By changing the shape of each resistor 251, uneven heating on the first surface S1 can be suppressed.

[0071] <Other Embodiments> (1) Unlike embodiments 1 to 3, the other end of the second driver may be located within the second zone, and the other end of the first driver may be located within the first zone.

[0072] (2) Unlike embodiments 1 to 3, both the other end of the first driver and the other end of the second driver may be included in the first zone. Furthermore, the power supply terminal may also be located on the first zone side.

[0073] (3) In embodiments 1 to 3, the temperature sensor 60 and the heater 250 each had three resistors 61 and 251 arranged in the Z-axis direction, but the number of resistors in the internal resistor may be two or four or more.

[0074] (4) In embodiments 1 to 3, the resistance thermometer 60 was positioned closer to the adsorption surface of the plate-shaped member 10 than the heaters 50 and 250, but the resistance thermometer may be positioned further away from the adsorption surface of the plate-shaped member than the heaters. [Explanation of Symbols]

[0075] 100... Electrostatic chuck 10…Plate-shaped member 10A…Inner part 10B…Outer part 11…First zone 12…Second zone 13…Power supply terminal S1…First surface S2…Second surface 20...Base component 21...Refrigerant flow path 22...Terminal hole S3...Third surface S4...Fourth surface 30…Joint part 40... Chuck electrode 50...Heater 51...Resistance wire section 52...Pad section 53...Via for heater 60...Resistance thermometer 61...Resistor 61A...Resistance wire section 61B...Pad section 62...First resistor 63...Second resistor 64...Intermediate resistor 65A,65B...Via for resistance thermometer 70…Driver for resistance thermometer 71…First driver 71A…First wiring section 71B…End of first driver 71C…Other end of first driver 72…Second driver 72A…Second wiring section 72B…End of second driver 72C…Other end of second driver 73A,73B…Via on the resistor side 74A,74B…Via on the power supply side 75A,75B…Electrode pads BL1...First boundary line BL2...Second boundary line P1...Center point W...Wafer 200... Electrostatic chuck 170... Driver for resistance thermometer 172... Second driver 172A... Second wiring section 172B... End of second driver 172C... Other end of second driver 173B... Via on the resistor side 174B... Via on the power supply side 300... Electrostatic chuck 80…Heater driver 81…First driver 81A…First wiring section 81B…First driver end 81C…Other end of first driver 82…Second driver 82A…Second wiring section 82B…Second driver end 82C…Other end of second driver 83A,83B…Resistor-side via 84A,84B…Power supply-side via 250...Heater 251...Resistor 251A...Resistor wire section 251B...Pad section 252...First resistor 253...Second resistor 254...Intermediate resistor 255A,255B...Via for heater 1…Electrostatic chuck 2…Temperature sensor resistor 2A, 2B, 2C…Resistor 3A, 3B…Via 4…Resistance wire section 5…Pad section 6…Temperature sensor driver 6A, 6B…Conductive line 7…Conductive path 7A…Driver side pad section 7B…Driver side via SE…Segment

Claims

1. A plate-shaped member having a first surface perpendicular to a first direction and a second surface located on the opposite side of the first surface, The internal resistance formed inside the plate-shaped member, A first driver connected to the first surface-side end of the internal resistor, A second driver connected to the end of the second surface side of the internal resistor, The plate-shaped member comprises a resistor-side via extending in the first direction within the interior of the plate-shaped member and electrically connected to the first driver, The internal resistance comprises a plurality of resistors arranged in the first direction and connected in series. Each end of the plurality of resistors is provided with a pad portion. The plurality of resistors include a first resistor positioned furthest to the first surface in the first direction, and a second resistor positioned furthest to the second surface in the first direction. The first driver extends in a second direction parallel to the first surface and includes a first driver end that is electrically connected to the pad portion of the first resistor, the first driver end being connected to the pad portion of the first resistor via the resistor-side via, The second driver includes a second driver end that extends in the second direction and is electrically connected to the pad portion of the second resistor, A retaining device wherein the internal resistor is disposed between the first driver end and the second driver end in the first direction, and the first driver is disposed between the first resistor and the first surface of the internal resistor in the first direction.

2. The plate-like member is divided into a plurality of first zones and a second zone different from the plurality of first zones in a direction perpendicular to the first direction. Each of the first zones includes the internal resistor, the first driver terminal, and the second driver terminal. The first driver includes a first wiring section connected to the end of the first driver and extending in the second direction, The holding device according to claim 1, wherein the end of the first wiring section that is different from the first driver end is included in the second zone.

3. The second driver includes a second wiring section connected to the end of the second driver and extending in the second direction, The holding device according to claim 2, wherein the end of the second wiring section that is different from the second driver end is included in the second zone.

4. The holding device according to any one of claims 1 to 3, wherein the internal resistance is at least one of a resistance thermometer and a heater.

5. The holding device according to claim 4, wherein the internal resistance is the temperature-measuring resistance element.

6. The holding device according to claim 5, wherein the pad portions of each of the resistors of the temperature-measuring resistance body are superimposed when viewed from the first direction.

7. The holding device according to claim 4, wherein the internal resistance is both the temperature sensor and the heater.

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