Substrate heating device

Abstract

The objective of the present invention is to make the temperature of a substrate uniform in-plane in a substrate heating device in which both a cooling plate and a heating plate are provided in a common enclosure.　This substrate heating device (1) is for heating a substrate inside an enclosure (10), wherein a heating plate (30), on which a substrate (W) is placed and which heats said substrate (W), and a cooling plate (20), on which the substrate (W) is placed and which cools said substrate (W), are juxtaposed inside the enclosure (10), the substrate heating device (1) has a lid body that is configured to be liftable, is provided above the heating plate (30), and covers said heating plate (30), and the lid body is provided with a partition member (80) that partitions a conveyance space for the substrate between the heating plate (30) and the cooling plate (20).

Description

Substrate heating device

[0001] The present disclosure relates to a substrate heating device.

[0002] In Patent Document 1, there is disclosed a substrate heating device including a heating plate on which a substrate is placed and heated, a cooling plate provided adjacent to the heating plate in the front-rear direction, on which a substrate before heat treatment carried in from the outside is placed and which cools the substrate after heat treatment by the heating plate, and a substrate transfer mechanism for transferring the substrate between the cooling plate and the heating plate. This substrate heating device further includes a heat insulation plate provided from the lower side of the heating plate to the lower side of the cooling plate, a cooling mechanism for cooling the heat insulation plate, and a low oxygen atmosphere forming unit for making the atmosphere for heat-treating the substrate a low oxygen atmosphere. Further, in this substrate heating device, the substrate transfer mechanism includes a substrate holding unit for holding the substrate and a moving mechanism provided below the heat insulation plate for moving the substrate holding unit in the front-rear direction.

[0003] Japanese Patent Application Laid-Open No. 2018-182263

[0004] The technology according to the present disclosure makes the temperature of the substrate uniform in the plane in a substrate heating device in which both the cooling plate and the heating plate are provided in a common housing.

[0005] One aspect of the present disclosure is a substrate heating device for heating a substrate in a housing, wherein in the housing, a heating plate on which the substrate is placed and which heats the substrate and a cooling plate on which the substrate is placed and which cools the substrate are juxtaposed, and a lid body which is configured to be able to move up and down and is provided above the heating plate and covers the heating plate are provided, and a partition member for partitioning the transfer space of the substrate between the heating plate and the cooling plate is provided on the lid body.

[0006] According to the present disclosure, in a substrate heating device in which both the cooling plate and the heating plate are provided in a common housing, the temperature of the substrate can be made uniform in the plane.

[0007] This is a cross-sectional view showing the general configuration of the heat treatment apparatus as a substrate heating device according to the first embodiment. This is a longitudinal cross-sectional view showing the general configuration of the heat treatment apparatus as a substrate heating device according to the first embodiment. This is a partially enlarged view of Figure 2. This is a diagram showing the state of the heat treatment apparatus during temperature control processing. This is a diagram showing the state of the heat treatment apparatus during temperature control processing. This is a cross-sectional view showing the general configuration of the heat treatment apparatus as a substrate heating device according to the second embodiment. This is a longitudinal cross-sectional view showing the general configuration of the heat treatment apparatus as a substrate heating device according to the second embodiment. This is a partially enlarged view of Figure 7. This is a side view of another partition member. This is a cross-sectional view showing the general configuration of the heat treatment apparatus as a substrate heating device according to the third embodiment. This is a longitudinal cross-sectional view showing the general configuration of the heat treatment apparatus as a substrate heating device according to the third embodiment. This is a diagram showing another example of the gas supply section. This is a diagram showing another example of the cooling plate. This is a partially enlarged cross-sectional view of the cooling plate in Figure 13.

[0008] The configuration of the substrate heating device according to this embodiment will be described below with reference to the drawings. In this specification, elements having substantially the same functional configuration are denoted by the same reference numerals, and redundant explanations will be omitted.

[0009] (First Embodiment) <Heat Treatment Apparatus> Figures 1 and 2 are a schematic cross-sectional view and a longitudinal cross-sectional view showing the configuration of a heat treatment apparatus as a substrate heating apparatus according to the first embodiment, respectively. Figure 3 is a partially enlarged view of Figure 2.

[0010] As shown in Figures 1 and 2, the heat treatment apparatus 1 has a housing 10 that can be sealed inside. The housing 10 has, for example, a rectangular parallelepiped shape, and its interior is divided into an upper first region R1 and a lower second region R2 by a partition wall 11. On the upper side of the side wall on one side in the longitudinal direction of the housing 10 in plan view (the negative side in the Y direction in the figure), there is an entrance / exit 10a for the substrate W that opens into the first region R1. An opening / closing shutter 10b is provided for the entrance / exit 10a.

[0011] The substrate W is, for example, a glass substrate used for a photomask, and is formed in a square shape when viewed from above.

[0012] Furthermore, a cooling plate 20 and a heating plate 30 are arranged side by side inside the housing 10. Specifically, the cooling plate 20 and the heating plate 30 are arranged in this order from the loading / unloading port 10a side along the longitudinal direction of the housing 10 in a plan view (the Y direction in the figure; hereinafter sometimes referred to as the "device width direction").

[0013] The heating plate 30 has a substrate W on which it is placed and heats the substrate W. The heating plate 30 has, for example, a thick, substantially disc shape. The heating plate 30 has a horizontal upper surface, and a suction port (not shown) is provided on this upper surface for, for example, attracting the substrate W, and the substrate W can be adsorbed and held on the heating plate 30 by suction from this suction port. Furthermore, the heating plate 30 is provided such that the horizontal upper surface is exposed to the first region R1.

[0014] As shown in Figure 2, a heating mechanism 31 for heating the heating plate 30 is provided inside the heating plate 30. For example, a resistance heater is used as the heating mechanism 31, and the amount of power supplied to the heating mechanism 31 is controlled by the control unit 100, which will be described later, so that the heating plate 30 can be controlled to a predetermined set temperature.

[0015] Although not shown in the diagram, the heating plate 30 has multiple through holes that penetrate vertically, and each through hole is provided with a lifting pin configured to move up and down. The lifting pins protrude from the upper surface of the heating plate 30 through the through holes and can move up and down while supporting the substrate W. Furthermore, by using these lifting pins, the substrate W can be transferred between the cooling plate 20, which also transports the substrate W as described later, and the heating plate 30. When transporting the substrate W, the substrate W is supported by the cooling plate 20 such that its end protrudes from the cooling plate 20. The lifting pins are provided to support the end of the substrate W that protrudes from the cooling plate 20.

[0016] The heating plate 30 is supported within the housing 10 by a support member (not shown) via a holding member 32 that holds the outer periphery of the heating plate 30.

[0017] A cover 40 is provided above the heating plate 30. The cover 40 covers the space above the heating plate 30 and is formed, for example, as a covered cylindrical shape having approximately the same diameter as the circular holding member 32 in plan view.

[0018] A heating mechanism 41 is provided inside the lid 40 to heat the lid 40. For example, a resistance heater is used as the heating mechanism 41, and the amount of power supplied to the heating mechanism 41 is controlled by the control unit 100, which will be described later, so that the lid 40 can be controlled to a predetermined set temperature.

[0019] The lid 40 is configured to be able to move up and down by a lifting mechanism 50. The lifting mechanism 50 includes, for example, a pair of arms 51 that extend in the width direction of the device (Y direction in the figure) and support the lid 40, and an actuator 52 that generates a driving force to move the arms 51 up and down. The actuator 52 includes, for example, a cylinder.

[0020] The actuator 52 raises and lowers the arm 51, thereby raising and lowering the lid 40, which allows switching between an open state and a closed state of the lid 40. In the open state, the lid 40 is spaced a predetermined distance from the upper surface of the outer circumference of the holding member 32, and the substrate W is transported to the heating plate 30. In the closed state, the lower surface of the outer circumference of the lid 40 is in contact with or close to the upper surface of the outer circumference of the holding member 32, and the heat treatment space S1 is formed by the holding member 32, the heating plate 30, and the lid 40. The heat treatment space is the space that houses the substrate W when the substrate W is heated.

[0021] The lid 40 may have an exhaust port (not shown) for exhausting air from inside the heat treatment space S1, and an air inlet (not shown) for supplying a predetermined gas to the heat treatment space S1.

[0022] The cooling plate 20 has a main body portion 21 on which the substrate W is placed and cools the substrate W on which it is placed. The cooling plate 20 has, for example, a main body portion 21 on the end facing the heating plate 30 (positive side in the Y direction in the figure) on which the substrate W is placed, and an arm 22 extending in the width direction of the device (Y direction in the figure) from the side of the main body portion 21 opposite to the heating plate 30 (negative side in the Y direction in the figure).

[0023] The main body 21 is, for example, a plate-like member with thickness and a rectangular shape in plan view, with a longer width direction in the device (Y direction in the figure). The main body 21 has a horizontal top surface, and a suction port (not shown) is provided on this top surface for attracting, for example, the substrate W, and the substrate W can be held on the main body 21 by suction from this suction port. The main body 21 is longer in the width direction of the device than the substrate W, but its length in the depth direction of the device (X direction in the figure), which is perpendicular to the width direction of the device in plan view, is shorter than the substrate W. Therefore, both ends of the substrate W placed on the main body 21 in the depth direction of the device protrude from the main body 21 in the depth direction of the device.

[0024] Although not shown in the diagram, a cooling mechanism for cooling the main body 21 is provided inside the main body 21. The cooling mechanism includes, for example, a Peltier element. Alternatively, the cooling mechanism may also include a cooling water channel.

[0025] The cooling plate 20 is provided, for example, so that its entirety is located in the first region R1.

[0026] The cooling plate 20 is configured to be movable in the device width direction (Y direction in the figure) by the moving mechanism 60 with the substrate W placed on it. In other words, the cooling plate 20 also serves as part of the substrate W transport mechanism. The moving mechanism 60 includes, for example, a leg portion 61 that supports the cooling plate 20 (specifically the end on the root side (negative side in the Y direction in the figure) of the arm 22), a rail 62 that extends in the device width direction in the second region R2, and an actuator 63 attached to the leg portion 61 that generates a driving force to move the leg portion 61 along the rail 62. The actuator 63 is, for example, a motor. As the leg portion 61 moves along the rail 62 by the actuator 63, the cooling plate 20 (specifically the main body portion 21) can move between a cooling position separated from the heating plate 30 and a transfer position above the heating plate 30. Furthermore, in order to avoid interference with the leg portion 61, the partition wall 11 has a slit 11a that extends along the device width direction (Y direction in the figure), which is the direction in which the cooling plate 20 moves, and through which the leg portion 61 is inserted.

[0027] Furthermore, a gas supply unit 70 is provided in the housing 10 above the cooling plate 20 at the above-mentioned cooling position, which supplies an inert gas (for example, nitrogen gas) downwards, that is, toward the cooling plate 20. By supplying an inert gas from the gas supply unit 70, the cooling efficiency of the substrate W by the cooling plate 20 can be improved, and foreign matter on the substrate W can be removed.

[0028] The gas supply unit 70 is configured, for example, in the shape of a flat rectangular tube and has a horizontal bottom surface, on which holes 70a (see Figure 3) for discharging inert gas are formed. The gas supply unit 70 is made larger than the substrate W so that inert gas can be supplied to the entire surface of the substrate W. The bottom surface of the gas supply unit 70 has a plurality of holes 70a formed in an area that overlaps in plan view with the substrate W placed on the cooling plate 20 at the cooling position. Although not shown in the figures, the gas supply unit 70 is connected to the inert gas supply source via a group of supply equipment including a flow control valve. The gas supply unit 70 is also supported at one end of a hook-shaped support member 71 in the width direction of the device. The other end of this support member 71 is supported by a partition wall 11, so that the gas supply unit 70 is supported within the housing 10.

[0029] Although not shown in the diagram, an exhaust vent is formed in the first region R1 within the housing 10 on the side of the cooling plate 20, towards the back (positive X direction in the diagram), to exhaust air from the first region R1 from the cooling plate 20 side. Furthermore, the first region R1 is wider on the side in front of the temperature control plate arrangement space (negative X direction in the diagram) than on the side behind the temperature control plate arrangement space (positive X direction in the diagram) where the cooling plate 20 and heating plate 30 are placed. Hereafter, the space in the first region R1 in front of the temperature control plate arrangement space will be referred to as the enlarged space S2.

[0030] The enlarged space S2 is, for example, a space through which the other end of a flat cable, one end of which is connected to the RTD board (a temperature-measuring substrate), or the hand of a worker holding the flat cable can pass when the RTD board is moved in the width direction of the device while it is placed on the cooling plate 20 during maintenance of the heat treatment device 1. As mentioned above, when using the RTD board, the side wall of the housing 10 on the side of the enlarged space S2 may be removed. Alternatively, the side of the partition wall 11 on the side of the enlarged space S2 may be made removable and removed when using the RTD board.

[0031] Furthermore, within the housing 10, a partition member 80 is provided on the lid 40 to divide the transport space S3 for the substrate W between the heating plate 30 and the cooling plate 20. The transport space S3 is the space through which the substrate W can pass when transporting the substrate W between the cooling plate 20 in the cooling position and the heating plate 30, and more specifically, it is the space through which the substrate W and the cooling plate 20 can pass during the above transport. The partition member 80 is a member that separates the lid 40 in the closed state from the cooling plate 20 in the cooling position within the transport space S3. This partition member 80 is intended to suppress the effect of the heat of the lid 40 on the substrate W on the cooling plate 20, and more specifically, it is intended to suppress the effect of the heat of the lid 40 on the substrate W on the cooling plate 20 in the cooling position. Since the partition member 80 is provided on the lid 40 as described above, the partition member 80 moves up and down in accordance with the movement of the lid 40.

[0032] As shown in Figure 3, the partition member 80 has a first plate-shaped member 81 and a second plate-shaped member 82, arranged in order from the heating plate 30 side (positive side in the Y direction) along the width direction of the device (Y direction in the figure). The first plate-shaped member 81 and the second plate-shaped member 82 are each formed in the shape of a rectangular plate when viewed in the width direction of the device and are arranged to extend vertically when viewed in the depth direction of the device (X direction in the figure).

[0033] A tongue-shaped piece 83 extending toward the lid 40 is connected to the upper end of the first plate-shaped member 81. The tongue-shaped piece 83 is formed to be shorter in length in the device depth direction (Y direction in the figure) than the first plate-shaped member 81. Multiple tongue-shaped pieces 83 may be provided along the device depth direction. For example, the first plate-shaped member 81 is attached to the lid 40 by fixing the tongue-shaped piece 83 to the upper surface of the lid 40 via the mounting portion 84.

[0034] The second plate-shaped member 82 is formed to be longer above the first plate-shaped member 81. For example, when the lid 40 is lowered and the second plate-shaped member 82 is lowered and the lid 40 is in a closed state, the upper end of the second plate-shaped member 82 is at approximately the same height as the lower end of the gas supply unit 70. Alternatively, when the lid 40 is in a closed state, the upper end of the second plate-shaped member 82 may be located above the gas supply unit 70.

[0035] The lower ends of the second plate-shaped member 82 and the first plate-shaped member 81 are approximately the same height. Furthermore, the lower ends of the second plate-shaped member 82 and the first plate-shaped member 81 may be positioned slightly above the lower end of the lid 40. This is to suppress the transfer of heat from the lid 40 to the cooling plate 20, while also preventing the first plate-shaped member 82 and the first plate-shaped member 81 from colliding with the partition wall 11 when the lid 40 descends.

[0036] For example, the second plate-shaped member 82 is fixed to the first plate-shaped member 81 and attached to the lid 40 via the first plate-shaped member 81 and the mounting portion 84.

[0037] For example, the length of the first plate-shaped member 81 and the second plate-shaped member 82 in the depth direction of the device (X direction in the figure) is longer than that of the gas supply unit 70. That is, the rear end (positive X direction) of the first plate-shaped member 81 and the second plate-shaped member 82 are located further back than the rear end of the gas supply unit 70, and the front end (negative X direction) of the first plate-shaped member 81 and the second plate-shaped member 82 are located in front of the front end of the gas supply unit 70. Furthermore, the length of the first plate-shaped member 81 and the second plate-shaped member 82 in the depth direction of the device (X direction in the figure) may be longer than that of the heating plate 30, and may also be longer than that of the lid 40.

[0038] Furthermore, the partition member 80 has gaps between the lid 40 and the first plate-shaped member 81, and between the first plate-shaped member 81 and the second plate-shaped member 82. For example, a spacer 85 is provided between the first plate-shaped member 81 and the first plate-shaped member 82 to define the size of the gap. In order to suppress heat transfer from the first plate-shaped member 81 to the second plate-shaped member 82 via the spacer 85, the spacer 85 is provided so that it is scattered only at the ends of the first plate-shaped member 81. Specifically, for example, only two spacer 85 are provided at the upper end, the rear end, and the front end of the first plate-shaped member 81.

[0039] For example, the first plate-shaped member 81, the second plate-shaped member 82, the tongue piece 83, the mounting portion 84, and the spacer 85 are all made of stainless steel.

[0040] Furthermore, the heat treatment apparatus 1 comprises at least one control unit 100. The control unit 100 processes computer-executable instructions causing the heat treatment apparatus 1 to perform various processes described herein. The control unit 100 may be configured to control each element of the heat treatment apparatus 1 to perform the various processes described herein. In one embodiment, some or all of the control unit 100 may be included in the heat treatment apparatus 1. The control unit 100 may include a processing unit, a storage unit, and a communication interface. The control unit 100 is implemented, for example, by a computer. The processing unit may be configured to read a program from the storage unit that provides logic or routines that enable various control operations, and to perform various control operations by executing the read program. This program may be stored in the storage unit in advance, or it may be retrieved via a medium when needed. The retrieved program is stored in the storage unit and read from the storage unit and executed by the processing unit. The medium may be various computer-readable storage media H, or it may be a communication line connected to a communication interface. The storage media H may be temporary or non-temporary. The processing unit may be a CPU (Central Processing Unit), or it may be one or more circuits. The storage unit may include RAM (Random Access Memory), ROM (Read Only Memory), HDD (Hard Disk Drive), SSD (Solid State Drive), or a combination thereof. The communication interface may communicate with the heat treatment apparatus 1 via a communication line such as a LAN (Local Area Network).

[0041] <Temperature Control Treatment> Next, an example of temperature control treatment of the substrate W by the heat treatment apparatus 1 will be explained.

[0042] First, a pre-heating cooling treatment is performed.

[0043] Specifically, the opening / closing shutter 10b opens the carry-in / outlet 10a, and the substrate W held by the transfer arm of a substrate transfer device (not shown) outside the heat treatment apparatus 1 is carried into the housing 10 through the carry-in / outlet 10a and moved above the cooling plate 20 at the cooling position. Then, the transfer arm descends, and the substrate W is placed on the cooling plate 20. Next, the transfer arm is withdrawn from the housing 10, and the opening / closing shutter 10b closes the carry-in / outlet 10a. Also, after the substrate W is placed on the cooling plate 20, the substrate W is cooled by the cooling plate 20 for a predetermined time. During this period, the lid 40 descends and is maintained in the closed state, and the space between the lid 40 and the cooling plate 20 is separated by the partition member 80.

[0044] When the pre-heating cooling process is completed, the heat treatment is performed.

[0045] Specifically, as shown in FIG. 4, the lid 40 is raised to the open state. At this time, the partition member 80 is also raised and retracted above the transfer space S3 of the substrate W together with the lid 40. Then, the cooling plate 20 on which the substrate W is placed is moved above the heating plate 30, that is, to the delivery position. Next, the lifting pins (not shown) provided for the heating plate 30 are raised, and after the substrate W is delivered to the lifting pins, the cooling plate 20 is retracted from above the heating plate 30 and returned to the cooling position.

[0046] Subsequently, as shown in FIG. 5, the lid 40 is lowered to the closed state to form the heat treatment space S1. At this time, the partition member 80 is also lowered in accordance with the lowering of the lid 40. Also, the lifting pins are lowered, and the substrate W is placed on the heating plate 30. After placement, the substrate W is heated by the heating plate 30 for a predetermined time.

[0047] When the heat treatment is completed, the post-heating cooling process is performed.

[0048] Specifically, first, the lid 40 is raised to the open state. At this time, the partition member 80 is also raised and retracted above the transfer space S3 of the substrate W. Also, the lifting pins provided for the heating plate are raised, and the substrate W is delivered to the lifting pins.

[0049] Next, the cooling plate 20 is moved to the transfer position and inserted between the substrate W, which is supported by the lifting pins, and the heating plate 30. Subsequently, the lifting pins are lowered, and the substrate W is transferred to the cooling plate 20. Then, the cooling plate 20 on which the substrate W is placed is returned to the cooling position. At the same time, the lid 40 is lowered to the closed position, and at that time, the partition member 80 is also lowered into the transport space S3. That is, the lid 40 and heating plate 30 are separated from the cooling plate 20 by the partition member 80.

[0050] After the cooling plate 20 is returned to the cooling position and the lid 40 is closed, the substrate W is cooled by the cooling plate 20 for a predetermined period of time.

[0051] Once cooling is complete, the loading / unloading port 10a is opened by the opening / closing shutter 10b, and the transport arm moves below the substrate W placed on the cooling plate 20 through the loading / unloading port 10a. Next, the transport arm is raised, and the substrate W is held by the transport arm. Then, the transport arm is withdrawn from inside the housing 10, and the loading / unloading port 10a is closed by the opening / closing shutter 10b. This completes the temperature control treatment of the substrate W by the heat treatment apparatus 1.

[0052] During the temperature control process, for example, when the substrate W is placed on the cooling plate 20 at the cooling position and the lid 40 is closed, inert gas is supplied from the gas supply unit 70. Inert gas may also be supplied from the gas supply unit 70 during other periods. The same applies to exhaust from the cooling plate 20 side of the first region R1 through the aforementioned exhaust hole (not shown).

[0053] <Main Effects of This Embodiment> In the heat treatment apparatus 1 according to this embodiment, as described above, a partition member 80 is provided on the lid 40 to partition the transport space of the substrate W between the heating plate 30 and the cooling plate 20. Therefore, it is possible to suppress the substrate W placed on the cooling plate 20 from being affected by the heat of the lid 40. Consequently, it is possible to suppress the non-uniformity of the cooling result of the substrate W by the cooling plate 20 due to the influence of the heat of the lid 40. Specifically, it is possible to suppress the non-uniformity of the pre-heating cooling treatment result and post-heating cooling treatment result within the surface of the substrate W due to the substrate W on the cooling plate 20 at the cooling position being affected by the heat of the closed lid 40. Specifically, it is possible to suppress the lid 40 side of the substrate W from becoming hot in the pre-heating cooling treatment result and post-heating cooling treatment result. In particular, it is possible to suppress the steady-state range, which shows temperature non-uniformity within the surface of the substrate W, from becoming large during the pre-heating cooling treatment. The steady-state range refers to the following temperature difference. After the substrate W is placed on the cooling plate 20, i.e., after cooling begins, the temperature difference across the surface of the substrate W becomes large, but gradually decreases and stabilizes. This stable temperature difference across the surface of the substrate W is called the steady-state range.

[0054] Furthermore, since the partition member 80 is provided on the lid 40, the partition member 80 moves up and down when the lid 40 moves up and down. In other words, the lifting mechanism 50 of the lid 40 also serves as the lifting mechanism for the partition member 80. Therefore, compared to the case where a separate lifting mechanism for the partition member 80 is provided in addition to the lifting mechanism 50 of the lid 40, costs can be reduced.

[0055] Furthermore, since the heat treatment apparatus 1 is provided with a partition member 80, it is possible to suppress the temperature rising on the side of the lid 40 of the gas supply unit 70. Therefore, it is possible to suppress the non-uniformity of the cooling result of the substrate W by the cooling plate 20 within the plane of the substrate W due to the influence of the high temperature on the side of the lid 40 of the gas supply unit 70.

[0056] Furthermore, in the heat treatment apparatus 1, the partition member 80 has a first plate-shaped member 81 and a second plate-shaped member 82, arranged in the width direction of the apparatus from the heating plate 30 side. Gaps are provided between the lid 40 and the first plate-shaped member 81, and between the first plate-shaped member 81 and the second plate-shaped member 82. Since these gaps function as heat insulating parts consisting of an air layer, the substrate W placed on the cooling plate 20 can be further protected from being affected by the heat of the lid 40.

[0057] Furthermore, in the heat treatment apparatus 1, the second plate-shaped member 82 of the partition member 80 is longer above the first plate-shaped member 81. Therefore, even when the gas heated by the lid 40 moves from the lid 40 side toward the cooling plate 20 at the cooling position, this heated gas can be guided along the second plate-shaped member 82. Thus, it is possible to suppress the influence of the gas heated by the lid 40 on the substrate W placed on the cooling plate 20 at the cooling position.

[0058] Furthermore, in the heat treatment apparatus 1, when the lid 40 is closed, the upper end of the second plate-shaped member 82 is at approximately the same height as the lower end of the gas supply unit 70, or is located above the gas supply unit 70. Therefore, it is possible to further suppress the lid 40 side of the gas supply unit 70 from becoming hot. Consequently, it is possible to further suppress the non-uniformity of the cooling result of the substrate W by the cooling plate 20 within the plane of the substrate W due to the influence of the lid 40 side of the gas supply unit 70 becoming hot.

[0059] Furthermore, in the heat treatment apparatus 1, the length of the first plate-shaped member 81 and the second plate-shaped member 82 in the depth direction of the apparatus (X direction in the figure) is longer than that of the gas supply unit 70. Therefore, it is possible to further suppress the temperature of the lid 40 side of the gas supply unit 70 from becoming too high.

[0060] (Second Embodiment) <Heat Treatment Apparatus> Figures 6 and 7 are a cross-sectional view and a longitudinal cross-sectional view, respectively, showing the schematic configuration of a heat treatment apparatus as a substrate heating apparatus according to the second embodiment. Figure 8 is a partially enlarged view of Figure 7. Figure 9 is a side view of the partition member 200, which will be described later.

[0061] The heat treatment apparatus 1A according to this embodiment has, in addition to the configuration of the heat treatment apparatus 1 shown in Figure 1, etc., an additional partition member 200 as shown in Figures 6 and 7. The partition member 200 is a member that divides the upper space of the first region R1 inside the housing 10 into the heating plate 30 side and the cooling plate 20 side. The partition member 200 is provided on the cooling plate 20 side (negative side in the Y direction in the figure) from the partition member 80.

[0062] As shown in Figure 8, the partition member 200 has a first plate-shaped member 201 and a second plate-shaped member 202, arranged in order from the heating plate 30 side (positive side in the Y direction) along the width direction of the device (Y direction in the figure). The first plate-shaped member 201 and the second plate-shaped member 202 are each formed in a hook-shaped plate when viewed in the width direction of the device and are arranged to extend vertically when viewed in the depth direction of the device (X direction in the figure). The first plate-shaped member 201 and the second plate-shaped member 202 have the same shape as each other.

[0063] The first plate-shaped member 201 and the second plate-shaped member 202 are connected to each other such that a gap is provided between them. The first plate-shaped member 201 and the second plate-shaped member 202 are connected, for example, at their upper ends, lower ends, rear ends (positive X direction in the figure), and front ends (negative X direction in the figure) via connecting members 203 that extend in the width direction of the device (X direction in the figure).

[0064] For example, as shown in Figure 9, the partition member 200 is formed so that its inner side (the positive side in the X direction in the figure) extends to the partition wall 11, while the remaining portion is formed to have a gap K between it and the partition wall 11. The cooling plate 20 on which the substrate W is placed passes through this gap K, as do the flat cables of the RTD substrate mentioned above.

[0065] The back side of the gap K below the partition member 200 (positive side in the X direction in the figure) is closed by the partition member 80 (specifically, the second plate-shaped member 82) in the device width direction (view in the Y direction in the figure). However, the front side of the gap K below the partition member 200 that is in front of the partition member 80 (negative side in the X direction in the figure) is open and not closed by the partition member 80 (specifically, the second plate-shaped member 82) in the device width direction (view in the Y direction in the figure).

[0066] Furthermore, the front and lower portion 204 of the partition member 200 may be configured to be detachable. By removing portion 204 when using the aforementioned RTD board, it is possible to prevent the flat cable of the RTD board or the worker's hand from colliding with the partition member 200.

[0067] <Main Effects of This Embodiment> In the heat treatment apparatus 1A according to this embodiment, as described above, a partition member 200 is further provided that divides the upper space in the first region R1 within the housing 10 into a heating plate 30 side and a cooling plate 20 side. Therefore, it is possible to suppress the flow of gas that is heated by the lid 40 and tends to accumulate in the upper space into the cooling plate 20 side. Consequently, it is possible to suppress the non-uniformity of the cooling result of the substrate W by the cooling plate 20 across the surface of the substrate W due to the gas heated by the lid 40. In addition, it is possible to suppress the prolonged cooling time of the substrate W to the target temperature by the cooling plate 20 due to the gas heated by the lid 40.

[0068] Furthermore, since the heat treatment apparatus 1A is provided with a partition member 200, the gas flowing into the cooling plate 20 side through the upper space heated by the lid 40 can prevent the lid 40 side of the gas supply unit 70 from becoming hot. Therefore, it is possible to prevent the cooling result of the substrate W by the cooling plate 20 from becoming uneven across the surface of the substrate W due to the influence of the hot lid 40 side of the gas supply unit 70.

[0069] Furthermore, in the heat treatment apparatus 1A, the partition member 200 has a first plate-shaped member 201 and a second plate-shaped member 202, arranged in the width direction of the apparatus, starting from the heating plate 30 side. A gap is provided between the first plate-shaped member 201 and the second plate-shaped member 202. This gap functions as an insulating part, so that heat transfer from the gas heated by the lid 40 on the heating plate 30 side of the upper space to the gas on the cooling plate 20 side of the upper space can be suppressed. Therefore, the gas on the cooling plate 20 side of the first region R1 can be suppressed from becoming hot, and thus, the non-uniformity of the cooling result of the substrate W by the cooling plate 20 across the surface of the substrate W due to the gas heated by the lid 40 can be further suppressed.

[0070] Furthermore, in the heat treatment apparatus 1A, the gap K below the partition member 200 is blocked by the partition member 80 (specifically, the second plate-shaped member 82) in the width direction of the apparatus (viewed in the Y direction in the figure), except for the front side (negative side in the X direction in the figure). Therefore, it is possible to suppress the gas heated by the lid 40 from flowing into the cooling plate 20 side through the gap K necessary for transporting the substrate W. Consequently, it is possible to further suppress the non-uniformity of the cooling result of the substrate W by the cooling plate 20 within the plane of the substrate W due to the gas heated by the lid 40.

[0071] (Third Embodiment) <Heat Treatment Apparatus> Figures 10 and 11 are a cross-sectional view and a longitudinal cross-sectional view, respectively, showing the schematic configuration of a heat treatment apparatus as a substrate heating apparatus according to the third embodiment.

[0072] The heat treatment apparatus 1B according to this embodiment has an exhaust unit 210 in addition to the configuration of the heat treatment apparatus 1A shown in Figure 6, etc., as shown in Figures 10 and 11. The exhaust unit 210 exhausts the inside of the housing 10 from the heating plate 30 side within the housing 10. Specifically, the exhaust unit 210 exhausts the first region R1 from the heating plate 30 side within the housing 10.

[0073] The exhaust section 210 has exhaust holes 211. The exhaust holes 211 are arranged in a row, for example, along the width direction of the device (Y direction in the figure). The exhaust section 210 is located to the side of the heating plate 30 when viewed in the width direction of the device (Y direction in the figure). Specifically, the exhaust section 210 is located on the rear side of the heating plate 30 (positive side in the X direction in the figure).

[0074] <Main Effects of This Embodiment> In the heat treatment apparatus 1B according to this embodiment, an exhaust section 210 is further provided to exhaust gas from the heating plate 30 side of the housing 10. Therefore, the gas heated by the lid above the heating plate 30 can be collected by the exhaust section 210 without being directed toward the cooling plate 20 side. Thus, it is possible to suppress the non-uniformity of the cooling result of the substrate W by the cooling plate 20 across the surface of the substrate W due to the gas heated by the lid 40. In addition, it is possible to suppress the prolonged cooling time of the substrate W to the target temperature by the cooling plate 20 due to the gas heated by the lid 40. Furthermore, in the heat treatment apparatus 1B, the warm gas accumulated in the enlarged space S2 can also be collected by the exhaust section 210.

[0075] Furthermore, since the heat treatment apparatus 1B is provided with an exhaust section 210, the gas heated by the lid 40 and flowing into the cooling plate 20 side can be prevented from becoming hot on the lid 40 side of the gas supply section 70. Therefore, it is possible to prevent the cooling result of the substrate W by the cooling plate 20 from becoming non-uniform across the surface of the substrate W due to the influence of the hot lid 40 side of the gas supply section 70.

[0076] Furthermore, in the heat treatment apparatus 1B, the exhaust section 210 is located at the rear (positive X-direction in the figure), and the front side (negative X-direction in the figure) of the gap K below the partition member 200 is open and not blocked by the partition member 80 when viewed in the width direction of the apparatus (Y-direction in the figure). As a result, an airflow is formed as shown by the thick arrow in Figure 10, that is, an airflow is formed from above the cooling plate 20, through the front side of the gap K below the partition member 200, and above the cover 40, toward the exhaust section 210. The gas heated by the cover 40 can be prevented from moving toward the cooling plate 20 by the aforementioned airflow. Therefore, it is possible to further prevent the cooling result of the substrate W by the cooling plate 20 from becoming uneven within the plane of the substrate W due to the gas heated by the cover 40. In addition, since the aforementioned airflow passes above the cover 40, the heated gas above the cover 40 can be efficiently removed.

[0077] <Modification of the Third Embodiment> The partition member 200 may be configured to be able to move up and down. When replacing the substrate W inside the housing 10 after the heating and cooling process, the partition member 200 may be lowered while the opening / closing shutter 10b is in the open position, and exhaust may be performed by the exhaust unit 210. This allows the stagnant airflow above the cooling plate 20 to be collected by the exhaust unit 210, or the gas above the heating plate 30 to be directed towards the exhaust unit 210 with a stronger airflow. In addition, not only when replacing substrates, but also at the end of a lot, the partition member 200 may be lowered while the opening / closing shutter 10b is in the open position, and exhaust may be performed by the exhaust unit 210.

[0078] <Examples> The temperature of the lid 40 was set to 150°C, the exhaust pressure through the exhaust hole (not shown) on the cooling plate 20 side was set to 42 Pa, and the nitrogen gas supply flow rate from the gas supply unit 70 was set to 4 L / min. The aforementioned pre-heating cooling treatment was then performed on the substrate W, and the temperatures of 17 points on the substrate W after cooling were measured. At that time, the cooling plate 20 was provided with a cooling water flow path as a cooling mechanism, and the flow rate of the cooling water was set to 4 L / min. In Example 1, the heat treatment apparatus 1 of the first embodiment was used. In Example 2, the heat treatment apparatus 1A of the second embodiment was used. In Example 3, the heat treatment apparatus 1B of the third embodiment was used, and the exhaust pressure of the exhaust unit 210 was set to 55 Pa. In the comparative example, a heat treatment apparatus was used in which the partition member 80 was omitted from the heat treatment apparatus 1.

[0079] In the comparative example, the temperature of the outer periphery of the substrate W was high, particularly the temperature of the outer periphery on the lid 40 side, with a steady-state range of 2.05°C. On the other hand, in Test Example 1, the steady-state range was narrower than in the comparative example, at 1.85°C. In Test Example 2, the steady-state range was even narrower, at 1.53°C. And in Test Example 3, it was 1.04°C.

[0080] <Other Examples of Gas Supply Units> Figure 12 shows another example of a gas supply unit. The gas supply unit 70A in Figure 12 has downward-extending wall portions 70b and 70c at one lateral end and the other lateral end of the cooling plate 20, respectively, when viewed in the width direction of the device. Specifically, the gas supply unit 70A has a downward-extending wall portion 70b at the rear end (positive X direction in the figure) and a downward-extending wall portion 70c at the front end (negative X direction in the figure). In addition, in the gas supply unit 70A, the rear wall portion 70b is longer than the front wall portion 70c. The lower end of the rear wall portion 70b may be located below, for example, the substrate W on the cooling plate 20 and below the cooling plate 20.

[0081] By using the gas supply unit 70A, cold gas from the gas supply unit 70A can be supplied to the substrate W on the cooling plate 20 while suppressing the influence of warm gas outside the rear wall 70b and the front wall 70c. Furthermore, because the rear wall 70b is long, the influence of warm gas outside the rear wall 70b can be further suppressed. In addition, because the front wall 70c is short, collision between the flat cables of the RTD substrate and the wall 70c can be suppressed, for example, when using an RTD substrate. Moreover, when an exhaust unit 210 is provided in addition to the partition member 200, as in the heat treatment apparatus 1B according to the third embodiment, using the gas supply unit 70A has the following effect. That is, because the front wall 70c is short, an airflow is formed from between the wall 70c and the substrate W toward the front, making it easier to form an airflow as shown by the thick arrow in Figure 10.

[0082] (Other examples of cooling plates) Figure 13 shows another example of a cooling plate. Figure 14 is a partially enlarged cross-sectional view of the cooling plate in Figure 13. The cooling plates 20A in Figures 13 and 14 have a horizontal top surface 23. The cooling plate 20A also has anti-slip projections 24 at each of its four corners to prevent the substrate W from shifting position on the cooling plate 20A. Furthermore, the cooling plate 20A has support projections 25 at each of its four corners that protrude upward from the top surface 23 and support the bottom surface of the substrate W.

[0083] Furthermore, the cooling plate 20A is formed so that the outer side, which extends in the depth direction of the device (X direction in the figure), is higher than the central side. Specifically, the cooling plate 20A has protrusions 26 that project upward in a ridge-like manner from the upper surface 23, at both the rear end (positive X direction) and the front end (negative X direction). The protrusions 26 are formed so that they extend, for example, in the width direction of the device (Y direction in the figure) when viewed from above.

[0084] Furthermore, each of the protrusions 26 is located outward in the depth direction of the device (X direction in the figure) from the support projection 25 located nearby. Also, the height of each of the protrusions 26 is lower than that of the support projection 25. Specifically, the height of the support projection 25 (from the upper surface 23) is 100 μm, while the height of the protrusions 26 is, for example, 50 μm.

[0085] This allows for more active cooling of the outer periphery of the substrate W, which is more susceptible to the influence of the surrounding atmosphere during cooling, compared to other parts, and in particular, the front and back edges of the substrate W can be actively cooled. Therefore, it is possible to suppress unevenness in the cooling process across the surface of the substrate.

[0086] According to tests conducted by the present inventors, when the cooling plate 20 was used in the heat treatment apparatus 1B of the third embodiment, the transient temperature drop range during the pre-heating cooling process was 9.87°C. However, when the cooling plate 20A was used in the heat treatment apparatus 1B, the transient temperature drop range could be narrowed to 4.42°C. The transient temperature drop range refers to the following temperature difference: When the substrate W is placed on the cooling plate, that is, when cooling begins, the temperature difference within the plane of the substrate W increases and then gradually decreases. The largest temperature difference within the plane of the substrate W at each point in time during this cooling process is called the transient temperature drop range.

[0087] <Modification> In the above example, the lower end of the partition member 80 is located above the lower end of the lid 40, that is, above the upper end of the holding member 32 of the heating plate 30. Depending on the height of the holding member 32 of the heating plate 30 (for example, if it is located above the partition wall 11), the lower end of the partition member 80 may be located below the upper end of the holding member 32 of the heating plate 30. This allows the cooling plate 20 at the cooling position to be separated from the holding member 32 and the partition member 80. Therefore, it is possible to suppress the effect of the heat from the holding member 32 on the substrate W on the cooling plate 20 at the cooling position, which can result in uneven cooling within the plane of the substrate W. Specifically, it is possible to suppress the side of the substrate W on the cooling plate 20 at the cooling position that is on the side of the holding member 32 from becoming hot due to the effect of the heat from the holding member 32.

[0088] Furthermore, while the above examples used a glass substrate, which is a mask substrate, as the substrate, the substrate is not limited to this. For example, the substrate could be a semiconductor wafer.

[0089] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The embodiments described above may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the constituent elements of the embodiments described above can be combined in any way. Such any combination will naturally yield the functions and effects of each constituent element in the combination, as well as other functions and effects that will be apparent to those skilled in the art from the description herein.

[0090] Furthermore, the effects described herein are merely descriptive or illustrative and not limiting. In other words, the technology relating to this disclosure may produce other effects that are obvious to those skilled in the art from the description herein, in addition to or instead of the effects described herein.

[0091] The following configurations also fall within the technical scope of this disclosure: (1) A substrate heating device for heating a substrate within a housing, wherein a heating plate on which a substrate is placed and which heats the substrate and a cooling plate on which a substrate is placed and which heats the substrate are arranged side by side within the housing, and a lid that is configured to be vertically movable and is provided above the heating plate to cover the heating plate, and a partition member that partitions the substrate transport space between the heating plate and the cooling plate is provided on the lid. (2) The substrate heating device according to (1), wherein the partition member has, in order from the heating plate side along the direction in which the heating plate and the cooling plate are arranged side by side, a first plate-shaped member and a second plate-shaped member, and gaps are provided between the lid and the first plate-shaped member and between the first plate-shaped member and the second plate-shaped member. (3) The substrate heating device according to (2), wherein the second plate-shaped member is longer above the first plate-shaped member. (4) The substrate heating device according to any one of (1) to (3), further comprising another partition member that divides the upper space within the housing into a heating plate side and a cooling plate side. (5) The substrate heating device according to any one of (1) to (3), further comprising an exhaust section that exhausts the inside of the housing from the heating plate side within the housing. (6) The substrate heating device according to (5), wherein the exhaust section is provided on the side of the heating plate in a view in which the heating plate and the cooling plate are placed side by side. (7) The substrate heating device according to (4), further comprising an exhaust section that exhausts the inside of the housing from the heating plate side within the housing, wherein the exhaust section is provided on the side of the heating plate in a view in which the heating plate and the cooling plate are placed side by side, and the lower part of the other partition member is open on the side opposite to the exhaust section side, and is not blocked by the partition member in the view in which they are placed side by side. (8) The substrate heating device according to any one of (1) to (7), further comprising an inert gas supply unit that supplies an inert gas from above the cooling plate within the housing, wherein the inert gas supply unit has a wall portion extending downward at one lateral end and the other lateral end of the cooling plate in a view in the direction in which the heating plate and the cooling plate are placed side by side, and the wall portion at the one lateral end is longer than the wall portion at the other lateral end.(9) The substrate heating device according to any one of (1) to (8), wherein the substrate is a substrate for a mask, the cooling plate is formed in a rectangular shape in plan view, and the outer side in the direction in which the heating plate and the cooling plate are placed side by side is higher than the central side. (10) The substrate heating device according to any one of (1) to (9), wherein the partition member is lowered when the lid is lowered to heat the substrate with the heating plate, and the partition member is raised when the lid is raised to load and unload the substrate above the heating plate.

[0092] 1, 1A, 1B Heat treatment apparatus 10 Housing 20, 20A Cooling plate 30 Heating plate 40 Cover 80 Partition member W Substrate

Claims

1. A substrate heating device for heating a substrate within a housing, wherein a heating plate on which a substrate is placed and which heats the substrate and a cooling plate on which a substrate is placed and which heats the substrate are arranged side by side within the housing, and a lid is provided above the heating plate and covers the heating plate, and a partition member is provided on the lid to partition the transport space for the substrate between the heating plate and the cooling plate.

2. The substrate heating apparatus according to claim 1, wherein the partition member has a first plate-shaped member and a second plate-shaped member in order from the heating plate side along the direction in which the heating plate and the cooling plate are placed side by side, and gaps are provided between the lid and the first plate-shaped member, and between the first plate-shaped member and the second plate-shaped member.

3. The substrate heating device according to claim 2, wherein the second plate-shaped member is longer above the first plate-shaped member.

4. The substrate heating apparatus according to any one of claims 1 to 3, further comprising another partitioning member that divides the upper space within the housing into a heating plate side and a cooling plate side.

5. The substrate heating apparatus according to any one of claims 1 to 3, further comprising an exhaust section for exhausting the contents of the housing from the heating plate side within the housing.

6. The substrate heating apparatus according to claim 5, wherein the exhaust section is provided to the side of the heating plate in a view in which the heating plate and the cooling plate are arranged side by side.

7. The substrate heating device according to claim 4, further comprising an exhaust section for exhausting the contents of the housing from the heating plate side within the housing, wherein the exhaust section is provided on the side of the heating plate in a view in which the heating plate and the cooling plate are placed side by side, and the side below the other partition member, opposite to the exhaust section side, is open and not blocked by the partition member in the view in which they are placed side by side.

8. A substrate heating device according to any one of claims 1 to 3, further comprising an inert gas supply unit that supplies an inert gas from above the cooling plate within the housing, wherein the inert gas supply unit has downwardly extending wall portions at one lateral end and the other lateral end of the cooling plate in a view in the direction in which the heating plate and the cooling plate are placed side by side, and the wall portion at the one lateral end is longer than the wall portion at the other lateral end.

9. The substrate heating device according to any one of claims 1 to 3, wherein the substrate is a substrate for a mask, the cooling plate is formed in a rectangular shape in plan view, and the outer side in the direction in which the heating plate and the cooling plate are placed side by side is higher than the central side.

10. A substrate heating device according to any one of claims 1 to 3, wherein when the lid is lowered to heat the substrate with the heating plate, the partition member is also lowered, and when the lid is raised to load or unload the substrate above the heating plate, the partition member is also raised.

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