Dielectric-containing intake structure and electronic device containing the same

Incorporating a dielectric layer with precise edge spacing in the display structure addresses antenna performance degradation and structural integrity issues in foldable devices, enhancing both radiation and rigidity.

JP7850729B2Active Publication Date: 2026-04-23SAMSUNG ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
SAMSUNG ELECTRONICS CO LTD
Filing Date
2022-02-04
Publication Date
2026-04-23

AI Technical Summary

Technical Problem

The use of lightweight materials with high dielectric constants in electronic device housings reduces the radiation performance of antennas, and there is a need to enhance the rigidity and design of foldable devices while minimizing weight.

Method used

A dielectric layer is incorporated into the display structure, with specific edge spacing configurations to minimize interference with antenna performance and provide structural support.

Benefits of technology

Improves antenna radiation performance and reduces damage or deformation in foldable devices by using lightweight materials effectively.

✦ Generated by Eureka AI based on patent content.

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Abstract

A display structure including a dielectric and an electronic device including the same are provided. [Solution] The electronic device of the present invention comprises a housing, a wireless communication circuit disposed inside the housing for transmitting and receiving signals of a predetermined frequency by powering at least a portion of the housing, and a display structure coupled to the housing, wherein the display structure includes a cover glass coupled to the housing and forming at least a portion of a front surface of the electronic device, a display panel disposed adjacent to one surface of the cover glass, a dielectric, a first layer disposed below the display panel and having a first edge spaced a first distance from a first side, and a second layer disposed below the first layer, wherein a second edge of the second layer corresponding to the first edge of the first layer is spaced a second distance from the first side that is smaller than the first distance, and an edge of the display panel corresponding to the first edge of the first layer is spaced from the first side by a third distance greater than the second distance and smaller than the first distance.
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Description

Technical Field

[0001] The present invention relates to a display structure including a dielectric and an electronic device including the same.

Background Art

[0002] As the processing performance of an electronic device such as a smartphone has increased by leaps and bounds, a large-area display is preferred to effectively provide various functions. At the same time, there is still a demand for miniaturization of electronic devices for improved portability. To meet such demands, foldable electronic devices are commercially available. A foldable electronic device that folds around a connection part provides portability and convenience to users.

[0003] On the other hand, due to the development of mobile communication technology, electronic devices including an antenna have become widely popular. An electronic device transmits and / or receives an RF (radio frequency) signal including a voice signal or data (e.g., a message, a photo, a video, a music file, or a game) using the antenna.

[0004] In addition, efforts are being made to increase the rigidity of electronic devices to meet consumers' purchasing desires, enhance the design aspect, and slim down. As part of such efforts, an electronic device is utilized as at least one antenna device for communication of the electronic device by supplying power to at least a part of the housing of the electronic device.

[0005] In one embodiment, a foldable electronic device that utilizes at least a part of a frame or housing as an antenna radiator includes a metal layer for securing the rigidity of a flexible display and protecting the display structure. However, since such a metal layer occupies more than 50% of the specific gravity of the display structure, it is necessary to change the material of the metal layer to a lightweight material to reduce the weight of the electronic device.

[0006] However, when a metal layer is formed using such lightweight materials, these lightweight materials have a high dielectric constant. Because a layer formed from a material with a high dielectric constant forms the outermost edge of the display structure, the radiation performance of antennas adjacent to such a layer may be reduced. [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] The present invention has been made in view of the above-mentioned conventional problems, and the object of the present invention is to provide a display structure including a dielectric and an electronic device including the same that reduces the deterioration of the radiation performance of an antenna. [Means for solving the problem]

[0008] An electronic device according to one aspect of the present invention, made to achieve the above objective, comprises a first housing forming a first side surface of the electronic device, a second housing forming a second side surface corresponding to the first side surface, and a hinge connecting the first housing and the second housing, the housing being switchable between a folding and unfolding state relative to the hinge, a wireless communication circuit disposed inside the housing and transmitting and receiving signals of a predetermined frequency by supplying power to at least a part of the housing, and a display structure coupled to the housing, wherein the display structure is coupled to the housing and forms at least a part of the front surface of the electronic device (cover glass). The display panel comprises a glass, a display panel positioned adjacent to one surface of the cover glass, a first layer comprising a dielectric and positioned below the display panel and having a first edge spaced a first distance from the first side surface, and a second layer positioned below the first layer, wherein the second edge of the second layer corresponding to the first edge of the first layer is positioned a second distance smaller than the first distance from the first side surface, and the edge of the display panel corresponding to the first edge of the first layer is positioned a third distance greater than the second distance and smaller than the first distance from the first side surface.

[0009] An electronic device according to one embodiment includes a first housing forming a first side surface of the electronic device, a second housing forming a second side surface corresponding to the first side surface, and a hinge connecting the first housing and the second housing, the housing being switchable between a folded and unfolded state relative to the hinge, and a display structure coupled to the housing, the display structure including a cover glass coupled to the housing and forming at least a portion of the front surface of the electronic device, a display panel disposed adjacent to one surface of the cover glass, a first layer including a dielectric and disposed below the display panel and having a first edge spaced a first distance from the first side surface, and a second layer disposed below the first layer, wherein the second edge of the second layer corresponding to the first edge of the first layer is spaced a second distance smaller than the first distance from the first side surface, and the edge of the display panel corresponding to the first edge of the first layer is spaced a third distance greater than the second distance and smaller than the first distance from the first side surface.

[0010] To achieve the above objective, a display structure according to one aspect of the present invention comprises: a cover glass forming a first outer surface of the display structure; a flexible display panel disposed beneath the cover glass; a first layer containing a dielectric and disposed beneath the flexible display panel, having a first edge portion formed on the inside of the edge of the flexible display panel, and a second layer disposed beneath the first layer, having a second edge portion formed on the outside of the edge of the flexible display panel, with at least a portion of it being. [Effects of the Invention]

[0011] According to the present invention, the degradation of antenna performance due to the application of lightweight materials to the metal layer can be improved, and damage or deformation inflicted on the display structure can be reduced by applying lightweight materials to the metal layer and modifying its structure.

[0012] The above or other aspects, configurations, and effects of specific embodiments of the present invention will become more apparent from the following detailed description provided in conjunction with the drawings. In addition, various other effects are provided, directly or indirectly as described herein. [Brief explanation of the drawing]

[0013] [Figure 1] This is a block diagram of an electronic device in a network environment according to one embodiment. [Figure 2A] This figure shows an electronic device in an unfolded state according to one embodiment. [Figure 2B] This figure shows an electronic device in a folded state according to one embodiment. [Figure 3] This is a cross-sectional view of a display cut along the B-axis in Figure 2A, according to one embodiment. [Figure 4] This figure shows the first edge of the first layer, reduced by a predetermined distance from the side of an electronic device according to one embodiment. [Figure 5A] This is a cross-sectional view of a display structure cut along the C-axis according to one embodiment of Figure 4. [Figure 5B] Figure 5A is a cross-sectional view of a display structure including a wireless communication circuit according to one embodiment. [Figure 6] This is a cross-sectional view of a display structure cut along the C-axis according to another embodiment, as shown in Figure 4. [Figure 7A] This figure shows the first edge of a first layer formed in a region corresponding to at least a portion of the housing according to one embodiment. [Figure 7B] This figure shows a display structure of an electronic device according to one embodiment, viewed from a direction perpendicular to the front. [Modes for carrying out the invention]

[0014] Hereinafter, specific examples of embodiments for carrying out the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same or similar reference numerals will be used for the same or similar components.

[0015] However, this should be understood not as limiting the present invention to any particular embodiment, but rather as including various modifications, equivalents, and / or alternatives to the embodiments of the present invention.

[0016] Figure 1 is a block diagram of an electronic device 101 in a network environment 100 according to one embodiment. Referring to Figure 1, in the network environment 100, the electronic device 101 communicates with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with at least one of an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 101 communicates with the electronic device 104 via the server 108. According to this embodiment, the electronic device 101 includes a processor 120, memory 130, input module 150, acoustic output module 155, display module 160, audio module 170, sensor module 176, interface 177, haptics module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, and antenna module 197. In one embodiment, the electronic device 101 may omit at least one of these components (e.g., connection terminal 178) or may have one or more other components added. In other embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0017] Processor 120 executes software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120, and performs various data processing or operations. According to one embodiment, as at least part of the data processing or operation, processor 120 stores instructions or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, processes the instructions or data stored in volatile memory 132, and stores the result data in non-volatile memory 134. According to this embodiment, processor 120 includes main processor 121 (e.g., central processing unit or application processor) or auxiliary processor 123 (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor) that can operate independently or together with it. For example, when the electronic device 101 includes main processor 121 and auxiliary processor 123, auxiliary processor 123 uses less power than main processor 121 or is set to specialize in a specified function. Auxiliary processor 123 is implemented separately from or as part of main processor 121.

[0018] The auxiliary processor 123 controls at least a portion of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), for example, on behalf of the main processor 121 when the main processor 121 is inactive (e.g., sleep), or together with the main processor 121 when the main processor 121 is active (e.g., application execution). According to one embodiment, the auxiliary processor 123 (e.g., image signal processor or communication processor) is implemented as part of another functionally related component (e.g., camera module 180 or communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., neural processing unit) includes a hardware structure dedicated to processing artificial intelligence models. The artificial intelligence models are generated by machine learning. Such learning is performed, for example, on the electronic device 101 itself where the artificial intelligence model is performed, or on a separate server (e.g., server 108). Learning algorithms include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. An artificial intelligence model includes multiple artificial neural network layers. These artificial neural networks are, but are not limited to, deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), deep Q-networks, or any combination of two or more of the above. In addition to hardware structures, artificial intelligence models may also include software structures.

[0019] Memory 130 stores various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The data includes, for example, software (e.g., the program 140) and input data or output data for the instructions associated therewith. Memory 130 includes a volatile memory 132 or a non-volatile memory 134.

[0020] Program 140 is stored as software in memory 130 and includes, for example, an operating system 142, middleware 144, or an application 146.

[0021] Input module 150 receives instructions or data used by a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). Input module 150 includes, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0022] The acoustic output module 155 outputs an acoustic signal to the outside of the electronic device 101. The acoustic output module 155 includes, for example, a speaker or a receiver. The speaker is used for general purposes such as multimedia playback or recording playback. The receiver is used to receive an incoming call. According to one embodiment, the receiver is implemented separately from or as part of the speaker.

[0023] Display module 160 visually provides information to the outside of the electronic device 101 (e.g., a user). Display module 160 includes, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to one embodiment, display module 160 includes a touch sensor set to sense touch or a pressure sensor set to measure the intensity of the force generated by touch.

[0024] The audio module 170 converts sound into electrical signals, or conversely, converts electrical signals into sound. In one embodiment, the audio module 170 obtains sound from the input module 150, or outputs sound via the sound output module 155, or via an external electronic device (e.g., electronic device 102) (e.g., speaker or headphones) directly or wirelessly connected to the electronic device 101.

[0025] The sensor module 176 senses the operating state of the electronic device 101 (e.g., power or temperature) or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the sensed state. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0026] Interface 177 supports one or more designated protocols used for the electronic device 101 to connect directly or wirelessly to an external electronic device (e.g., electronic device 102). According to one embodiment, interface 177 includes, for example, HDMI® (high definition multimedia interface), USB (universal serial bus) interface, SD card interface, or audio interface.

[0027] The connection terminal 178 includes a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to one embodiment, the connection terminal 178 includes, for example, an HDMI® connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0028] The haptics module 179 converts electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that the user perceives through touch or kinesthetic sense. According to one embodiment, the haptics module 179 includes, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0029] The camera module 180 captures still and moving images. According to one embodiment, the camera module 180 includes one or more lenses, an image sensor, an image signal processor, and a flash.

[0030] The power management module 188 manages the power supplied to the electronic device 101. According to one embodiment, the power management module 188 is implemented, for example, as at least part of a PMIC (power management integrated circuit).

[0031] The battery 189 supplies power to at least one component of the electronic device 101. According to one embodiment, the battery 189 includes, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0032] The communication module 190 supports the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and communication over the established communication channel. The communication module 190 operates independently of the processor 120 (e.g., application processor) and includes one or more communication processors that support direct (e.g., wired) or wireless communication. According to one embodiment, the communication module 190 includes a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module 194 (e.g., a LAN (local area network) communication module, or a power line communication module). The relevant communication module among these communication modules communicates with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth®, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented in multiple separate components (e.g., multiple chips). The wireless communication module 192 verifies or authenticates the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (e.g., International Mobile Subscriber Identification Number (IMSI)) stored in the subscriber identification module 196.

[0033] The wireless communication module 192 supports 5G networks and next-generation communication technologies beyond 4G networks, such as NR connection technology (new radio access technology). NR connection technology supports high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and mass terminal connectivity (mMTC (massive machine type communications)), or ultra-reliable and low-latency communications (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 supports high-frequency bands (e.g., mmWave bands) to achieve high data transmission rates, for example. The wireless communication module 192 supports various technologies to ensure performance in high-frequency bands, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, and large-scale antennas. The wireless communication module 192 supports various requirements specified in the electronic device 101, external electronic devices (e.g., electronic device 104), or network system (e.g., second network 199). According to one embodiment, the wireless communication module 192 supports a peak data rate for eMBB implementation (e.g., 20 Gbps or more), loss coverage for mMTC implementation (e.g., 164 dB or less), or U-plane latency for URLLC implementation (e.g., downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip of 1 ms or less).

[0034] The antenna module 197 transmits or receives signals or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module 197 includes an antenna comprising a radiator consisting of a conductor or conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 197 includes a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as a first network 198 or a second network 199 is selected from the plurality of antennas, for example, by a communication module 190. Signals or power are transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to another embodiment, other components (e.g., an RFIC (radio frequency integrated circuit)) are additionally formed as part of the antenna module 197 in addition to the radiator. According to one embodiment, the antenna module 197 forms a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board that supports a predetermined high-frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top or side surface) of the printed circuit board that transmit or receive signals in the predetermined high-frequency band.

[0035] At least some of the components are connected to each other by a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., instructions or data) with each other.

[0036] According to one embodiment, commands or data are transmitted or received between the electronic device 101 and an external electronic device 104 via a server 108 connected to a second network 199. Each of the electronic devices (102 or 104) is the same type of device as or different from the electronic device 101. According to one embodiment, all or part of the operation performed by the electronic device 101 is performed by one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 may, instead of performing the function or service itself, or additionally, request one or more external electronic devices to perform at least part of that function or service. One or more external electronic devices that receive the request perform at least part of the requested function or service, or additional functions or services associated with the request, and transmit the results of the execution to the electronic device 101. The electronic device 101 provides the results as they are or additionally processed as at least part of the response to the request. To achieve this, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing are used. The electronic device 101 provides ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device 104 includes IoT (Internet of Things) devices. The server 108 is an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 is included within the second network 199. The electronic device 101 is applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0037] The electronic devices disclosed herein in various embodiments are diverse in form. These electronic devices include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. The electronic devices disclosed herein are not limited to the devices described above.

[0038] The various embodiments and the terminology used herein should be understood not to limit the technical features described herein to any particular embodiment, but to include various modifications, equivalents, or substitutes of the applicable embodiment. In the description of the drawings, similar or related components are referred to by similar reference numerals. The singular form of a noun corresponding to an item may include one or more items unless it is clearly indicated in the relevant context that they are different. In this specification, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include any one of the items listed together with the applicable phrase in that phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” are used merely to distinguish the applicable component from other components and do not limit the applicable component in any other respect (e.g., importance or order). When one component (e.g., component 1) is referred to as "coupled" or "connected" with or without the terms "functionally" or "communically" with another component (e.g., component 2), it means that component 1 can be connected to the other component directly (e.g., by wire), wirelessly, or via component 3.

[0039] As used in various embodiments of this specification, the term “module” may include units implemented in hardware, software, or firmware, and is used interchangeably with terms such as logic, logic block, component, or circuit. A module may be a component configured as a whole, or the smallest unit or part thereof of a component performing one or more functions. For example, according to one embodiment, a module is implemented in the form of an ASIC (application-specific integrated circuit).

[0040] Various embodiments of this specification may be implemented as software (e.g., program 140) containing one or more instructions stored in a machine (e.g., electronic device 101)-readable storage medium (e.g., internal memory 136 or external memory 138). For example, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) invokes and executes at least one of the one or more instructions stored from the storage medium. This allows the machine to be operated to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, “non-transitory” means only that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily on the storage medium.

[0041] According to one embodiment, the methods according to the various embodiments disclosed herein may be provided in a computer program product. A computer program product may be traded as a commodity between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or through an application store (e.g., Play Store). TM Computer programs can be delivered online (e.g., downloaded or uploaded) via a network or directly between two user devices (e.g., smartphones). In the case of online delivery, at least a portion of a computer program product may be temporarily stored or temporarily generated on a machine-readable storage medium, such as the memory of a manufacturer's server, an application store server, or an intermediary server.

[0042] According to various embodiments, each component of the above-described components (e.g., a module or a program) includes one or more individuals, and some of the individuals may be separated and arranged in other components. According to various embodiments, one or more components or operations of the relevant components may be omitted, or one or more other components or operations may be added. Additionally or alternatively, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the relevant components of the multiple components before the integration. According to various embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the above operations may be executed in a different order, omitted, or one or more other operations may be added.

[0043] Figure 2A shows an electronic device in its unfolded state according to one embodiment. Figure 2B shows an electronic device in its folded state according to one embodiment.

[0044] Referring to both Figures 2A and 2B, in this embodiment, the electronic device 101 includes a foldable housing 200 (hereinafter abbreviated as "housing" 200) and a flexible or foldable display 260 (hereinafter abbreviated as "display" 260) disposed within the space formed by the housing 200. In this specification, the surface on which the display 260 is disposed is referred to as the first surface or the front of the electronic device 101. The opposite surface from the front is referred to as the second surface or the rear of the electronic device 101. The surface enclosing the space between the front and rear surfaces is referred to as the third surface or the side of the electronic device 101.

[0045] In this embodiment, the housing 200 has a substantially rectangular shape in the unfolded state shown in Figure 2A. For example, the housing 200 has a predetermined width W1 and a predetermined length L1 that is longer than the predetermined width W1. As another example, the housing 200 has a predetermined width W1 and a predetermined length L1 that is substantially the same as or longer than the predetermined width W1. For example, the predetermined width W1 is the width of the display 260. In this embodiment, the housing 200 of the electronic device 101 is folded or unfolded with respect to a folding axis A that is substantially parallel to the long edge of the rectangle (e.g., the edge of the housing 200 of the electronic device 101 facing the y-axis in Figure 2A).

[0046] In this embodiment, the housing 200 includes a first housing 201, a second housing 202, and a connecting portion (hinge) 203. The connecting portion 203 is positioned between the first housing 201 and the second housing 202. The connecting portion 203 is coupled to the first housing 201 and the second housing 202, and the first housing 201 and / or the second housing 202 rotate around the connecting portion 203 (or folding axis A).

[0047] In this embodiment, the first housing 201 includes a first side member 2011 and a first rear cover 2013. In this embodiment, the second housing 202 includes a second side member 2021 and a second rear cover 2023.

[0048] In this embodiment, the first side member 2011 extends along the edge of the first housing 201 and forms at least a portion of the side of the electronic device 101. The first side member 2011 includes at least one conductive portion formed of a conductive material (e.g., metal). The conductive portion acts as an antenna radiator for transmitting and / or receiving RF signals. Similar to the first side member 2011, the second side member 2021 forms a portion of the side of the electronic device 101, and at least a portion of the second side member 2021 is formed of a conductive material and acts as an antenna radiator.

[0049] In this embodiment, the first side member 2011 and the second side member 2021 are arranged on both sides of the folding axis A and have substantially symmetrical shapes with respect to the folding axis A.

[0050] In this embodiment, the angle and distance between the first side member 2011 and the second side member 2021 differ depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state.

[0051] In this embodiment, the housing 200 has a recess formed therein for accommodating the display 260. The recess corresponds to the shape of the display 260.

[0052] In this embodiment, the sensor area 234 is formed to have a predetermined (e.g., a specified) area adjacent to one corner of the second housing 220. However, the arrangement, shape, and size of the sensor area 234 are not limited to the illustrated example. For example, in another embodiment, the sensor area 234 is provided in another corner of the housing 200 or in any area between the upper and lower corners. In another example, the sensor area 234 may be omitted. For example, components placed in the sensor area 234 are located below the display 260 or in other locations on the housing 200. In one embodiment, components for performing various functions built into the electronic device 101 are exposed to the front of the electronic device 101 via the sensor area 234 or via one or more openings provided in the sensor area 234. In one embodiment, the components include various types of sensors. The sensors include, for example, at least one of a front camera, a receiver, and a proximity sensor.

[0053] In this embodiment, the first rear cover 2013 is positioned on the first housing 201 at the rear of the electronic device 101. The first rear cover 2013 has a substantially rectangular edge. Similar to the first rear cover 2013, the second rear cover 2023 is positioned on the second housing 202 at the rear of the electronic device 101.

[0054] In this embodiment, the first rear cover 2013 and the second rear cover 2023 have substantially symmetrical shapes with respect to the folding axis A. However, the first rear cover 2013 and the second rear cover 2023 do not necessarily have symmetrical shapes with respect to each other, and in one embodiment, the electronic device 101 includes the first rear cover 2013 and / or the second rear cover 2023 of various shapes. In one embodiment, the first rear cover 2013 is formed integrally with the first side member 2011, and the second rear cover 2023 is formed integrally with the second side member 2021.

[0055] In this embodiment, the first rear cover 2013, the second rear cover 2023, the first side member 2011, and the second side member 2021 form a space on which various components of the electronic device 101 (e.g., a printed circuit board or a battery) can be arranged.

[0056] In this embodiment, one or more components are arranged on or visually exposed on the rear surface of the electronic device 101. For example, at least a portion of the sub-display 265 is visually exposed through at least one area of ​​the first rear cover 2013. For example, the sub-display 265 may be visually exposed through the entire area of ​​the first rear cover 2013, but the area in which the sub-display 265 is exposed is not limited to the examples given above. As another example, the rear camera 280 is visually exposed through at least one area of ​​the second rear cover 2023. As yet another example, the rear camera 280 is arranged on a portion of the rear surface of the electronic device 101.

[0057] The housing 200 of the electronic device 101 is not limited to the configuration and configuration shown in Figures 2A and 2B, but may be implemented by other shapes, combinations of components, and / or configurations.

[0058] Referring to Figure 2B, the connecting portion 203 is mounted such that the first housing 201 and the second housing 202 are rotatably mounted relative to each other. For example, the connecting portion 203 includes a hinge structure coupled to the first housing 201 and the second housing 202. In this embodiment, the connecting portion 203 includes a hinge cover 230 positioned between the first side member 2011 and the second side member 2021 to conceal internal components (e.g., the hinge structure). In this embodiment, the hinge cover 130 is either concealed by parts of the first side member 2011 and the second side member 2021 or exposed to the outside, depending on the state of the electronic device 101 (flat state or folded state). For example, the size of the area of ​​the hinge cover 230 that is exposed to the outside changes depending on the state of the electronic device 101 (flat state or folded state).

[0059] For example, as shown in Figure 2A, when the electronic device 101 is in an unfolded state (e.g., fully unfolded), at least a portion of the hinge cover 230 is hidden and not exposed by the first side member 2011 and the second side member 2021. For example, as shown in Figure 2B, when the electronic device 101 is in a folded state, the hinge cover 230 is exposed to the outside between the first side member 2011 and the second side member 2021. For example, in an intermediate state where the first side member 2011 and the second side member 2021 are folded at a certain angle, a portion of the hinge cover 230 is partially exposed to the outside between the first side member 2011 and the second side member 2021. However, in this case, the area of ​​the hinge cover 230 that is exposed is less than in the fully folded state shown in Figure 2B.

[0060] In this embodiment, the display 260 is positioned in the space formed by the housing 200. For example, the display 260 is mounted on a recess formed by the housing 200 and forms most of the front surface of the electronic device 101. For example, the front surface of the electronic device 101 includes the display 260 and a portion of the first side member 2011 and a portion of the second side member 2021 adjacent to the display 260. In yet another example, the rear surface of the electronic device 101 includes the first rear cover 2013, a portion of the first side member 2011 adjacent to the first rear cover 2013, the second rear cover 2023, and a portion of the second side member 2021 adjacent to the second rear cover 2023.

[0061] In this embodiment, the display 260 includes a flexible display in which at least a portion of the area is deformable into a planar or curved surface. In this embodiment, the display 260 includes a folding area 263, a first area 261, and a second area 263. The folding area 263 extends along a folding axis A, with the first area 261 located on one side of the folding area 263 (e.g., the left side of the folding area 263 shown in Figure 2A) and the second area 262 located on the other side (e.g., the right side of the folding area 263 shown in Figure 2A). As another example, the first area 261 is located in the first housing 201, and the second area 262 is located in the second housing 202. The folding area 263 is located in the connecting portion 203.

[0062] The divisions of the display 260 regions shown in Figures 2A and 2B are non-restrictive examples, and the display 260 may be divided into multiple regions (e.g., four or more, or two) depending on its structure or function. For example, in the embodiment shown in Figure 2A, the display 260 is divided by a folding region 263 or folding axis A, but in other embodiments, the display 260 is divided based on other folding regions or other folding axes.

[0063] In this embodiment, the first region 261 and the second region 262 have an overall symmetrical shape with respect to the folding region 263. However, unlike the first region 261, the second region 262 includes a notch cut by the presence of the sensor region 234, but in other areas it has a shape symmetrical to the first region 261. For example, the first region 261 and the second region 262 include parts with symmetrical shapes and parts with asymmetrical shapes.

[0064] The operation of the first side member 2011 and the second side member 2021, as well as the areas of the display 260, depending on the state of the electronic device 101 (e.g., unfolded state and folded state), will be described in more detail below with reference numerals in the drawings.

[0065] In this embodiment, when the electronic device 101 is in the unfolded state (e.g., Figure 2A), the first side member 2011 and the second side member 2021 are arranged to face substantially the same direction at an angle of approximately 180 degrees. The surfaces of the first region 261 and the second region 262 of the display 260 form an angle of approximately 180 degrees to each other and face substantially the same direction (e.g., the front direction of the electronic device). For example, the folding region 263 forms the same plane as the first region 261 and the second region 262.

[0066] In this embodiment, when the electronic device 101 is in a folded state (e.g., Figure 2B), the first side member 2011 and the second side member 2021 are arranged to face each other. The surfaces of the first region 261 and the second region 262 of the display 260 face each other while forming a narrow angle (e.g., between 0 and 10 degrees). At least a portion of the folding region 263 consists of a curved surface having a predetermined curvature.

[0067] In this embodiment, when the electronic device 101 is in an intermediate state, the first side member 2011 and the second side member 2021 are positioned at a predetermined angle to each other. The surface of the first region 261 and the surface of the second region 262 of the display 260 form an angle that is larger than in the folded state and smaller than in the unfolded state. At least a portion of the folding region 263 consists of a curved surface having a predetermined curvature, and this curvature is smaller than in the folded state.

[0068] Figure 3 is a cross-sectional view of a display according to one embodiment, cut along the B-axis of Figure 2A.

[0069] Referring to Figure 3, the display 260 (or display structure) according to this embodiment includes multiple layers. According to this embodiment, the display 260 includes a cover glass 340, a display panel 330 positioned adjacent to one side of the cover glass 340, a first layer 311 positioned below the display panel 330, and a second layer 320 positioned below the first layer 311. According to one embodiment (not shown), some of the above-described configurations (e.g., thermoplastic member 390) are omitted, or other configurations are added.

[0070] According to this embodiment, the display 260 includes an adhesive (e.g., PSA (pressure sensitive adhesive)) for bonding the above-mentioned multiple layers. In one embodiment, the adhesive may include, but is not limited to, PSA, OCA (optically clear adhesive), a heat-reactive adhesive, or double-sided tape.

[0071] According to this embodiment, the cover glass 340 includes a film layer 342 and a transparent plate 341 (e.g., ultra-thin glass (UTG)) that are at least partially exposed through the front surface of the electronic device 101. The film layer 342 and the transparent plate 341 according to this embodiment are bonded together by an adhesive. The film layer 342 and the transparent plate 341 according to this embodiment are flexible and can be folded or bent. For example, the film layer 342 is referred to as a polarization film, but is not limited thereto.

[0072] According to this embodiment, the display panel 330 includes a panel 332, a plastic film 333 positioned beneath the panel 332, and a cover panel 331 positioned beneath the plastic film 333. According to one embodiment, the plastic film 333 contains an adhesive (e.g., PSA) to bond the panel 332 and the cover panel 331. According to one embodiment, the plastic film 333 is referred to as a polarization film.

[0073] According to one embodiment, the panel 332 is implemented as a touch panel on which electrodes for receiving touch input, fingerprint recognition, or pen input are arranged. According to one embodiment, the panel 332 includes, without limitation, an OLED (organic light-emitting diodes) panel, an LCD (liquid crystal display), or a QLED (quantum dot light-emitting diodes) panel. For example, the display panel 330 includes a plurality of pixels for displaying an image, and one pixel includes a plurality of subpixels. For example, one pixel includes three subpixels: red, green, and blue. As another example, one pixel is formed in an RGBG pentile configuration including one red subpixel, two green subpixels, and one blue subpixel.

[0074] According to this embodiment, the display 260 includes a first layer 311 positioned beneath the display panel 330. According to this embodiment, the first layer 311 is attached beneath the display panel 330 by placing an adhesive layer 381 between the display panel 330 and the first layer 311. According to this embodiment, the adhesive layer 381 is positioned such that the shape of the adhesive layer 381 corresponds to the shape of the first layer 311, or the edges of the adhesive layer 381 correspond to the edges of the first layer 311.

[0075] According to this embodiment, the first layer 311 has rigidity, thereby ensuring the rigidity of the flexible display 260. According to one embodiment, in order to reduce the weight of the display 260, the first layer 311 is formed of a lightweight material. According to one embodiment, the first layer 311 includes a dielectric having a dielectric constant of a predetermined value or higher. For example, the first layer 311 is formed of CRFP (carbon reinforced fiber plastic) having a dielectric constant of about 200, but is not limited to this.

[0076] According to this embodiment, the first layer 311 includes a lattice pattern 370 in at least a portion of its area. For example, the first layer 311 includes a lattice pattern 370 in an area adjacent to a folding axis (e.g., folding axis A in Figure 2A). According to this embodiment, by including a lattice pattern 370 in an area adjacent to a folding axis, when the electronic device 101 is switched between a folded state (e.g., Figure 2B) and an unfolded state (e.g., Figure 2A), the first layer 311 and any additional layers attached to the first layer 311 are also folded or unfolded according to the respective state.

[0077] According to this embodiment, the edge of the first layer 311 is formed inward compared to the edge of the display panel 330 or the second layer 320 when viewed from a direction perpendicular to the front of the electronic device 101. A more detailed explanation of this will be given later.

[0078] According to this embodiment, the display 260 further includes a thermoplastic member 390 (e.g., TPU (thermoplastic polyurethane)) disposed beneath the first layer 311. According to this embodiment, the inclusion of the thermoplastic member 390 in the display 260 can prevent and / or reduce damage to the display panel 330, the first layer 311, and / or the second layer 320. For example, the inclusion of the thermoplastic member 390 in the display 260 can prevent and / or reduce the formation of bubbles between the multiple layers arranged in the display 260. Furthermore, the inclusion of the thermoplastic member 390 in the display 260 can prevent and / or reduce the inflow of foreign matter between the multiple layers arranged in the display 260.

[0079] According to this embodiment, the display 260 includes a second layer 320 located below the first layer 311. According to this embodiment, the second layer 320 includes at least one of a digitizer 321 and a metal plate 322. For example, the second layer 320 includes a metal plate 322 located below the first layer 311.

[0080] According to this embodiment, the digitizer 321 and the metal plate 322 are bonded together by an adhesive. For example, the adhesive is applied to the underside of the digitizer 321, and the metal plate 322 is bonded to the underside of the digitizer 321 by the adhesive.

[0081] According to this embodiment, the second layer 320 is formed with a break in the region corresponding to the folding axis (e.g., folding axis A in Figure 2A). According to this embodiment, by forming the second layer 320 with a break in the region corresponding to the folding axis (e.g., folding axis A in Figure 2A), when the electronic device 101 is switched between a folded state (e.g., Figure 2B) and an unfolded state (e.g., Figure 2A), the second layer 320 is folded or unfolded according to each state. According to another embodiment (not shown), the second layer 320 is flexible and formed across the folding axis.

[0082] According to one embodiment, the digitizer 321 is referred to as a device that senses input to the x and / or y positions and detects an electromagnetic induction input device (e.g., an electronic pen). For example, at least one processor (e.g., processor 120 in Figure 1) supplies current to the digitizer 321, and the digitizer 321 generates an electromagnetic field. When the electronic pen approaches the electromagnetic field of the digitizer 321, an electromagnetic induction phenomenon occurs, and the resonant circuit of the electronic pen generates a current. The resonant circuit of the electronic pen uses the generated current to form a magnetic field. At least one processor scans the strength of the magnetic field applied from the electronic pen to the digitizer 321 over the entire range to detect the position. At least one processor performs an action based on the detected position.

[0083] In this embodiment, the metal plate 322 is referred to as a shielding layer. In one embodiment, the metal plate 322 is made by coating the bottom of the digitizer 321 with MMP (magnetic metal powder). In one embodiment, the metal plate 322 can reduce noise by shielding the magnetic force from surrounding electronic components in addition to the signal input from the electronic pen.

[0084] Figure 4 shows the first edge of the first layer, reduced by a predetermined distance from the side view of an electronic device according to one embodiment.

[0085] Referring to Figure 4, the electronic device 101 according to this embodiment includes a first layer (e.g., the first layer 311 in Figure 3) having first edges (401A, 401B) formed on the inside of the edge of the housing 200, and a wireless communication circuit 410 disposed inside the housing 200. According to one embodiment, the first edges of the first layer are formed at a predetermined distance (e.g., about 1 mm) inward from the side surface of the electronic device 101.

[0086] According to this embodiment, the wireless communication circuit 410 is electrically connected to at least a portion of the housing 200. According to this embodiment, the wireless communication circuit 410 transmits and receives signals in a predetermined frequency band by supplying power to at least a portion of the housing 200. For example, the wireless communication circuit 410 transmits and receives signals in a frequency band of approximately 6 GHz by supplying power to a portion of the first housing 201.

[0087] According to this embodiment, the first layer 311 includes first edges (401A, 401B) formed on the housing 200 and formed inward from the side surface of the electronic device. According to one embodiment, the first layer 311 includes a first-first edge 401A that is separated inward by a predetermined distance (e.g., 1 mm) from the side surface formed on the first housing 201 (or the first side surface member 2011 in Figure 2B). The first layer 311 includes a first-second edge 401B that is separated inward by a predetermined distance (e.g., 1 mm) from the side surface formed on the second housing 202 (or the second side surface member 2021 in Figure 2B). According to this embodiment, the first-first edge 401A and the first-second edge 401B are formed to correspond to the edges of the electronic device 101 formed on the housing 200. A specific explanation of this will be given later.

[0088] According to this embodiment, the first-first edge portion 401A and the first-second edge portion 401B are each formed at a predetermined distance d (e.g., 5.5 mm) or more away from the folding axis A.

[0089] According to this embodiment, the first layer 311 includes a lattice pattern 370 in at least a portion of its area. According to this embodiment, the first layer 311 includes a lattice pattern 370 in at least a portion of its area adjacent to the folding axis A.

[0090] According to this embodiment, the lattice pattern 370 includes a plurality of bars. According to this embodiment, the first layer 311 is folded or unfolded with respect to the folding axis A by including a lattice pattern 370 that includes a plurality of bars in at least a portion of the area.

[0091] According to this embodiment, the display 260 includes an alignment mark 490 that extends to a second layer (e.g., the second layer 320 in Figure 3). According to this embodiment, the alignment mark 490 that extends to the second layer is formed at a position corresponding to the folding axis A.

[0092] According to this embodiment, the first and second edges 401B of the first layer 311 have a shape corresponding to the edge of the display 260. According to one embodiment, the first and second edges 401B of the first layer 311 are formed at a predetermined distance (e.g., about 1 mm) or more inward from the edge of the display 260. The first and second edges 401B of the first layer 311 are formed at a predetermined distance (e.g., about 1 mm) or more inward from the outermost edge of the display 260.

[0093] Figure 5A is a cross-sectional view of a display structure cut along the C-axis of Figure 4 according to one embodiment. Figure 5B is a cross-sectional view of the display structure of Figure 5A including a wireless communication circuit according to one embodiment.

[0094] Referring to both Figures 5A and 5B, the display 260 according to this embodiment includes multiple layers, each of which is arranged at a predetermined distance from the first side surface 501 of the electronic device 101 (e.g., the side surface of the electronic device 101 in Figure 2A).

[0095] According to this embodiment, the display 260 includes a cover glass 340 that forms at least a portion of the front surface of the electronic device, a display panel 330 positioned adjacent to one surface of the cover glass 340, a first layer 311 positioned below the display panel 330, and a second layer 320 positioned below the first layer 311. Components identical or substantially identical to those described above are denoted by the same reference numerals, and redundant descriptions will not be repeated.

[0096] In this embodiment, the first side surface 501 is referred to as the side surface of an electronic device formed on the first housing (e.g., the first housing 201 in Figure 2A). In this embodiment, the first layer 311 includes a first edge portion 511 (e.g., the first edges (401A, 401B) in Figure 4) that is separated from the first side surface 501 by a first distance D1. For example, the first edge portion 511 of the first layer 311 is separated from the first side surface 501 by a predetermined distance (e.g., about 1 mm). In this embodiment, the first edge portion 511 is separated from the first side surface 501 by a first distance D1, thereby being separated from at least a portion of the first housing 201 by a predetermined distance or more.

[0097] According to this embodiment, the second layer 320 includes a second edge 512 that is separated from the first side surface 501 by a second distance D2 which is smaller than the first distance D1. For example, the second edge 512 of the second layer 320 is separated from the first side surface 501 by a predetermined distance (e.g., about 0.2 mm), but is not limited thereto.

[0098] According to this embodiment, the display panel 330 includes an edge 513 that is separated from the first side surface 501 by a third distance D3 that is less than a first distance D1 and greater than a second distance D2. For example, the edge 513 of the display panel 330 is separated from the first side surface 501 by about 0.4 mm, but is not limited thereto. According to one embodiment, the edge of the cover panel 331 is formed to be separated from the first side surface 501 by a distance greater than the third distance D3, but is not limited thereto.

[0099] According to this embodiment, at least a portion of the first edge 511 of the first layer 311 is formed on the inner side of the edge 513 of the display panel 330. According to this embodiment, at least a portion of the second edge 512 of the second layer 320 is formed on the outer side of the edge 513 of the display panel 330.

[0100] According to this embodiment, the second edge 512 of the second layer 320 forms the outermost edge of the display 260. According to this embodiment, the first edge 511 of the first layer 311 forms the innermost edge of the display 260.

[0101] Referring to Figure 5B, the wireless communication circuit 410 according to this embodiment transmits and / or receives a signal in a predetermined frequency band by supplying power to one point 570 of the first housing 201.

[0102] According to one embodiment, the first edge 511 of the first layer 311 is formed in a region of the first housing 201 that corresponds to the region supplied with power from the wireless communication circuit 410.

[0103] According to this embodiment, the first edge 511 of the first layer 311 is formed at a distance D1 from the area of ​​the first housing 201 that is powered by the wireless communication circuit 410. According to this embodiment, by forming the first edge 511 at a distance of a predetermined distance (e.g., 1 mm) or more from the area of ​​the first housing 201 that is powered by the wireless communication circuit 410, the radiation performance of signals transmitted and received through the first housing 201 can be improved. For example, by forming the first edge 511 of the first layer 311 having a dielectric constant of 150 or more at a distance of approximately 1 mm or more from the area of ​​the first housing 201 that is powered by the wireless communication circuit 410, the degradation of the radiation performance of signals transmitted and received through the first housing 201 can be improved.

[0104] In other embodiments (not shown), the first housing 201 and the first side surface 501 in Figure 5B are referred to as the second housing 202 corresponding to the first housing 201 and the second side surface formed by the second housing 202.

[0105] Figure 6 is a cross-sectional view of a display structure cut along the C-axis of Figure 4 according to another embodiment.

[0106] Referring to Figure 6, the display 260 according to this embodiment includes a cover glass 340 that forms at least a portion of the front surface of the electronic device 101, a display panel 330 positioned adjacent to one side of the cover glass 340, a first layer 311 positioned below the display panel 330, and a second layer 320 positioned below the first layer 311. Components identical or substantially identical to those described above are denoted by the same reference numerals, and redundant explanations are omitted.

[0107] According to this embodiment, the display 260 includes a dielectric layer 620 extending from the first edge 511 of the first layer 311. According to this embodiment, the display 260 includes a dielectric layer 620 that extends from the first edge 511 of the first layer 311 and includes an edge 614 that is separated from the first side surface 501 by a first distance D1.

[0108] According to one embodiment, the dielectric layer 620 includes a dielectric having a dielectric constant of a predetermined value or less. According to one embodiment, the dielectric layer 620 is formed of a dielectric having a dielectric constant of about 6 or less, but is not limited thereto. For example, the dielectric layer 620 includes a resin having a dielectric constant of 2.54.

[0109] According to this embodiment, at least a portion of the edge 614 of the dielectric layer 620 is separated from the first surface 501 by a first distance D1. According to other embodiments (not shown), at least a portion of the edge 614 of the dielectric layer 620 is formed to be separated from the first surface 501 by a distance smaller than the first distance D1 (e.g., a third distance D3).

[0110] According to this embodiment, the edge 614 of the dielectric layer 620 is formed inside the edge 513 of the display panel 330. According to another embodiment (not shown), the edge 614 of the dielectric layer 620 is formed outside the edge 513 of the display panel 330 and inside the second edge 512 of the second layer 320.

[0111] According to this embodiment, the second edge 512 of the second layer 320 forms the outermost edge of the display 260. According to this embodiment, the edge 614 of the dielectric layer 620 forms the innermost edge of the display 260.

[0112] Figure 7A shows the first edge of the first layer formed in a region corresponding to at least a portion of the housing according to one embodiment. Figure 7B shows the display structure of an electronic device according to one embodiment, viewed from a direction perpendicular to the front.

[0113] Referring to both Figures 7A and 7B, the first layer according to this embodiment (e.g., the first layer 311 in Figure 5A) includes a first edge portion 511 formed in a region corresponding to at least a portion of the edge of the housing 200.

[0114] Referring to Figure 7A, the first housing 201 according to this embodiment includes a first portion 201A, a second portion 201B extending substantially vertically from the first portion 201A, and a third portion 201C extending substantially vertically from the second portion 201B and substantially parallel to the first portion 201A.

[0115] According to this embodiment, the second housing 202 includes a fourth portion 202A, a fifth portion 202B extending substantially vertically from the fourth portion 202A, and a sixth portion 202C extending substantially vertically from the fifth portion 202B and substantially parallel to the fourth portion 202A.

[0116] According to this embodiment, the first edge 511 is formed in an area corresponding to at least a portion of the first portion 201A and / or third portion 201C of the first housing 201. According to this embodiment, the first edge 511 is formed on the first portion 201A of the first housing 201 from a first point 711, which is separated by a predetermined distance d from the folding axis A, to a second point 712 on the first portion 201A. According to this embodiment, the first edge 511 is formed on the third portion 201C of the first housing 201 from a third point 713, which is separated by a predetermined distance d from the folding axis A, to a fourth point 714 on the third portion 201C.

[0117] According to this embodiment, the first edge portion 511 is formed in a region corresponding to at least a portion of the second portion 201B. According to this embodiment, the first edge portion 511 is formed in a region A1 corresponding to the region of the first housing 201 excluding the corner where the first portion 201A and the second portion 201B meet and the corner where the second portion 201B and the third portion 201C meet, at a predetermined distance D1 (e.g., about 1 mm) from the side surface of the electronic device 101.

[0118] According to this embodiment, the first edge 511 is formed in an area corresponding to a portion of the fourth portion 202A and / or the sixth portion 202C of the second housing 202. According to this embodiment, the first edge 511 is formed on the fourth portion 202A of the second housing 202 from a fifth point 715, which is separated from the folding axis A by a predetermined distance d, to a sixth point 716 on the fourth portion 202A. According to this embodiment, the first edge 511 is formed on the sixth portion 202C of the second housing 202 from a seventh point 717, which is separated from the folding axis A by a predetermined distance d, to an eighth point 718 on the sixth portion 202C. According to this embodiment, the first edge 511 is formed in an area corresponding to at least a portion of the fifth portion 202B. According to this embodiment, the first edge portion 511 is formed in region A2, which corresponds to the region excluding the corner where the fourth portion 202A and the fifth portion 202B of the second housing 202 meet, and the corner where the fifth portion 202B and the sixth portion 202C meet, and is separated from the side surface of the electronic device 101 by a predetermined distance.

[0119] According to this embodiment, the first edge portion 511 is formed in the region of the first housing 201 and / or the second housing 202 that corresponds to the region supplied with power by the wireless communication circuit (e.g., the wireless communication circuit 410 in Figure 4). According to this embodiment, the first edge portion 511 is formed in the region of the housing 200 that corresponds to the region supplied with power by the wireless communication circuit, separated from the side surface of the electronic device 101 by a predetermined distance D1 (e.g., 1 mm).

[0120] Referring to Figure 7B, when viewed from a direction perpendicular to the front of the electronic device 101 according to this embodiment, the second edge 512 of the second layer 320 and the edge 513 of the display panel 330 are positioned between the first edge 511 of the first layer 311 and the side surface of the electronic device 101.

[0121] According to this embodiment, the first edge 511 of the first layer 311, the second edge 512 of the second layer 320, and the edge 513 of the display panel 330 are formed in a shape corresponding to the edge of the display 260.

[0122] According to this embodiment, the first layer 311 includes a lattice pattern 370 in at least a portion of its area. According to this embodiment, the first layer 311 includes a lattice pattern 370 in a portion of its area adjacent to the folding axis A. According to this embodiment, by including a lattice pattern 370 in a portion of the first layer 311 adjacent to the folding axis A, the display 260 is folded or unfolded when the electronic device 101 is switched to a folded state (e.g., Figure 2B) or an unfolded state (e.g., Figure 2A).

[0123] According to this embodiment, at least a portion of the first layer 311 and the display panel 330 has a shape corresponding to the front surface of the electronic device 101 and is formed across the folding axis A. According to this embodiment, the second layer 320 is formed segmented with respect to the folding axis A. According to other embodiments (not shown), at least a portion of the second layer 320 is formed across the folding axis A, but is not limited thereto.

[0124] An electronic device according to one embodiment (e.g., electronic device 101 in Figure 1) includes a first housing forming a first side surface of the electronic device (e.g., first housing 201 in Figure 2A), a second housing forming a second side surface corresponding to the first side surface (e.g., second housing 202 in Figure 2A), and a hinge connecting the first housing and the second housing (e.g., connecting part 203 in Figure 2A), and a housing (e.g., housing 200 in Figure 2A) that can be switched between a folded (e.g., Figure 2B) or unfolded (e.g., Figure 2A) state relative to the hinge, a wireless communication circuit (e.g., wireless communication circuit 410 in Figure 4) disposed inside the housing and transmitting and receiving signals of a predetermined frequency by supplying power to at least a part of the housing, and a display structure (e.g., display 260 in Figure 2A) coupled to the housing, and the display structure according to one embodiment is coupled to the housing and the electronic device The device includes a cover glass forming at least a portion of the front surface (e.g., cover glass 340 in Figure 3), a display panel positioned adjacent to one surface of the cover glass (e.g., display panel 330 in Figure 3), a first layer (e.g., first layer 311 in Figure 3) containing a dielectric and positioned below the display panel, having a first edge (e.g., first edge 511 in Figure 5A) separated from a first side surface by a first distance (e.g., D1), and a second layer (e.g., second layer 320 in Figure 3) positioned below the first layer, wherein the second edge of the second layer (e.g., second edge 512 in Figure 5A) corresponding to the first edge of the first layer is separated from the first side surface by a second distance (e.g., D2) smaller than the first distance, and the edge of the display panel (e.g., edge 513 in Figure 5A) corresponding to the first edge of the first layer is separated from the first side surface by a third distance (e.g., D3) greater than the second distance and less than the first distance.

[0125] According to one embodiment, when viewed from a direction perpendicular to the front of the electronic device, the second edge and the edge of the display panel may be positioned between the first edge and the first side surface.

[0126] According to one embodiment, the second layer may include at least one of a digitizer or a metal plate.

[0127] According to one embodiment, the first layer may include carbon fiber reinforced plastic (CFRP).

[0128] According to one embodiment, the first layer further includes a dielectric layer extending from the first edge, the dielectric layer may have a dielectric constant of 6 or less.

[0129] According to one embodiment, the dielectric material may have a dielectric constant of 150 or more.

[0130] According to one embodiment, the first edge of the first layer, the second edge of the second layer, and the edge of the display panel may be formed in regions corresponding to areas that operate as antenna radiators by being powered from a wireless communication circuit inside the housing.

[0131] According to one embodiment, the first edge of the first layer, the second edge of the second layer, and the edge of the display panel may be formed in a region separated by a predetermined distance from the hinge.

[0132] According to one embodiment, the display structure further includes an adhesive layer disposed between the display panel and the first layer, the adhesive layer may have an edge corresponding to the first edge of the first layer.

[0133] According to one embodiment, the first layer may include a lattice pattern in at least part of it.

[0134] An electronic device according to one embodiment (e.g., electronic device 101 in Figure 1) comprises a first housing forming a first side surface of the electronic device (e.g., first housing 201 in Figure 2A), a second housing forming a second side surface corresponding to the first side surface (e.g., second housing 202 in Figure 2A), and a housing (e.g., housing 200 in Figure 2A) that can be switched between a folding and unfolding state relative to the hinge (e.g., connecting part 203 in Figure 2A) connecting the first housing and the second housing, and a display structure (e.g., display 260 in Figure 2A) coupled to the housing, wherein the display structure comprises a cover glass (e.g., cover glass 340 in Figure 3) coupled to the housing and forming at least a part of the front surface of the electronic device, and adjacent to one side of the cover glass The device includes a display panel (e.g., display panel 330 in Figure 3) positioned in contact with the display panel, a first layer (e.g., first layer 311 in Figure 3) containing a dielectric and positioned below the display panel with a first edge (e.g., first edge 511 in Figure 5A) separated by a first distance (e.g., D1) from the first side surface, and a second layer (e.g., second layer 320 in Figure 3) positioned below the first layer, wherein the second edge of the second layer (e.g., second edge 512 in Figure 5A) corresponding to the first edge of the first layer is separated by a second distance (e.g., D2) smaller than the first distance from the first side surface, and the edge of the display panel (e.g., edge 513 of the display panel in Figure 5A) corresponding to the first edge of the first layer is separated by a third distance (e.g., D3) greater than the second distance and smaller than the first distance from the first side surface.

[0135] According to one embodiment, when viewed from a direction perpendicular to the front of the electronic device, the second edge of the second layer and the edge of the display can be formed between the first edge of the first layer and the first side surface.

[0136] According to one embodiment, the electronic device includes a wireless communication circuit electrically connected to at least a portion of the housing, and the wireless communication circuit can transmit and / or receive signals in a predetermined frequency band by supplying power to at least a portion of the housing.

[0137] According to one embodiment, the first housing includes a first portion, a second portion extending perpendicularly from the first portion, and a third portion extending perpendicularly from the second portion and parallel to the first portion, wherein the first edge of the first layer, the second edge of the second layer, and the edge of the display panel may be formed in a region of the first portion corresponding to a region separated by a predetermined distance from the hinge.

[0138] According to one embodiment, the electronic device may further include an alignment mark extended by a second layer and formed in a region corresponding to the first portion.

[0139] A display structure according to one embodiment (e.g., the display 260 in Figure 2A) comprises a cover glass (e.g., the cover glass 340 in Figure 3) forming a first outer surface of the display structure, a flexible display panel (e.g., the display panel 330 in Figure 3) disposed below the cover glass, a first layer (e.g., the first layer 311 in Figure 3) disposed below the flexible display panel and containing a dielectric, with at least a portion of which is formed inside the edge of the flexible display panel (e.g., the edge 513 of the display panel in Figure 5A) and having a first edge (e.g., the first edge 511 in Figure 5A), and a second layer (e.g., the second layer 320 in Figure 3) disposed below the first layer and having at least a portion of which is formed outside the edge of the flexible display panel (e.g., the second edge 512 in Figure 5A).

[0140] According to one embodiment, the second layer may include at least one of a digitizer or a metal plate.

[0141] According to one embodiment, the first layer further includes a dielectric layer extending from the first edge, the dielectric layer may have an edge corresponding to the edge of the flexible display panel.

[0142] According to one embodiment, the display structure further includes an adhesive layer disposed between a flexible display panel and a first layer, the adhesive layer may have an edge corresponding to a first edge of the first layer.

[0143] According to one embodiment, the first layer may include carbon fiber reinforced plastic (CFRP).

[0144] Although the present invention has been described with reference to various exemplary embodiments, it will be understood that these exemplary embodiments are intended to be illustrative and not restrictive. It will be further understood by those skilled in the art that various modifications to the embodiments and details can be made without departing from the true spirit and overall scope of the invention, including the claims and their equivalents. It will also be understood that any embodiment described herein can be used in conjunction with any other embodiment described herein. [Explanation of Symbols]

[0145] 100 Network Environment 101, 102, 104 Electronic equipment 108 servers 120 processors 121 Main Processor 123 Auxiliary processors 130 memory 132 Volatile memory 136 Non-volatile memory, internal memory 138 External memory 140 programs 142 Operating Systems 144 Middleware 146 applications 150 Input Modules 155 Audio Output Module 160 display modules 170 Audio Modules 176 Sensor Modules 177 Interfaces 178 Connection terminals 179 Haptics Module 180 Camera Module 188 Power Management Modules 189 batteries 190 Communication Module 192 Wireless Communication Module 194 Wired communication module 196 Subscriber Identification Module 197 Antenna Module 198, 199 First and Second Networks 200 (Foldable) Housing 201, 202: Housing 1 and 2 201A~201C, 202A~202C Parts 1~6 203 Connecting part (hinge) 230 Hinge Cover 234 Sensor area 260 Display (Structure) 261, 262 1st and 2nd area 263 Folding Area 265 Sub-display 280 Rear camera 311, 320 First and Second Layers 321 Digitizer 322 Metal Plate 330 Display Panels 331 Cover Panel 332 panels 333 Plastic film 340 Cover Glass 341 Transparent plate 342 film layers 370 Lattice Patterns 381 Adhesive layer 390 Thermoplastic material 401A, 401B 1st-1, 1st-2nd edges 410 Wireless communication circuit 490 Alignment Mark 501 1st aspect 511, 512 First and second edges 513 Edge of the display panel 570 One of the locations in Housing 1 614 Edge of the dielectric layer 620 Dielectric layer 711-718 Locations 1-8 2011, 2021 First and second side members 2013, 2023 First and second rear covers D1, D2, D3 1st to 3rd distance

Claims

1. An electronic device, A housing comprising a first housing forming a first side surface of the electronic device, a second housing forming a second side surface corresponding to the first side surface, and a hinge connecting the first housing and the second housing, the housing being switchable between a folding and unfolding state relative to the hinge, A wireless communication circuit is disposed inside the housing and transmits and receives signals of a predetermined frequency by supplying power to at least a part of the housing. The housing comprises a display structure coupled to the housing, The aforementioned display structure is A cover glass coupled to the housing and forming at least a portion of the front surface of the electronic device, A display panel is positioned adjacent to one surface of the cover glass, A first layer comprising a dielectric, having a first edge portion disposed below the display panel and separated by a first distance from the first side surface, A second layer is disposed below the first layer, The second edge of the second layer, which corresponds to the first edge of the first layer, is separated from the first side surface by a second distance that is smaller than the first distance. The electronic device is characterized in that the edge of the display panel corresponding to the first edge of the first layer is separated from the first side surface by a third distance greater than the second distance and less than the first distance.

2. The electronic device according to claim 1, characterized in that, when viewed from a direction perpendicular to the front of the electronic device, the second edge and the edge of the display panel are arranged between the first edge and the first side surface.

3. The electronic device according to claim 1, characterized in that the second layer includes at least one of a digitizer or a metal plate.

4. The electronic device according to claim 1, characterized in that the first layer includes carbon fiber reinforced plastic (CFRP).

5. The first layer further includes a dielectric layer extending from the first edge, The electronic device according to claim 1, characterized in that the dielectric layer has a dielectric constant of 6 or less.

6. The electronic device according to claim 1, characterized in that the dielectric material has a dielectric constant of 150 or more.

7. The electronic device according to claim 1, characterized in that the first edge of the first layer, the second edge of the second layer, and the edge of the display panel are formed in regions corresponding to areas that operate as antenna radiators by being powered from the wireless communication circuit inside the housing.

8. The electronic device according to claim 1, characterized in that the first edge of the first layer, the second edge of the second layer, and the edge of the display panel are formed in a region separated by a predetermined distance from the hinge.

9. The display structure further includes an adhesive layer disposed between the display panel and the first layer, The electronic device according to claim 1, characterized in that the adhesive layer has an edge corresponding to the first edge of the first layer.

10. The electronic device according to claim 1, characterized in that the first layer includes at least a portion of a lattice pattern.

11. A display structure, A cover glass forming the first outer surface of the display structure, A flexible display panel is positioned beneath the cover glass, A first layer comprising a dielectric and having a first edge portion formed at least partly on the inside of the edge of the flexible display panel, disposed beneath the flexible display panel, A second layer is disposed below the first layer and has a second edge portion, at least a portion of which is formed outside the edge portion of the flexible display panel, The first layer further includes a dielectric layer extending from the first edge, The dielectric layer is characterized by having an edge that corresponds to the edge of the flexible display panel.

12. The display structure according to claim 11, characterized in that the second layer includes at least one of a digitizer or a metal plate.

13. The display structure further includes an adhesive layer disposed between the flexible display panel and the first layer, The display structure according to claim 11, characterized in that the adhesive layer has an edge corresponding to the first edge of the first layer.

14. The display structure according to claim 11, characterized in that the first layer includes carbon fiber reinforced plastic (CFRP).

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