Component mounting equipment

Abstract

To provide a component mounting device capable of imaging a recognition mark of each of components having different external shapes.SOLUTION: A component mounting device according to the present disclosure includes: a detachable mounting head holding a component having a recognition mark for alignment; a first imaging element imaging a first recognition mark of the component in a first field of view based on a first imaging optical path passing through the mounting head; a second imaging element imaging a second recognition mark of the component in a second field of view based on a second imaging optical path passing through the mounting head; a first reflective optics reflecting the first imaging optical path through a first through hole provided in the mounting head; and a second reflective optics reflecting the second imaging optical path through a second through hole provided in the mounting head. A first mounting head or a second mounting head is attached as the mounting head. In the first mounting head and the second mounting head, the placements of the first through hole and the second through hole in plan view are different from each other, based on component information.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present disclosure relates to a component mounting device for mounting components on a substrate.

Background Art

[0002] As a component mounting device, for example, Patent Document 1 discloses a device for mounting components such as semiconductor elements on a substrate.

[0003] The component mounting device of Patent Document 1 includes a suction nozzle that holds a component and a recognition means such as a CCD camera provided on the side of the suction nozzle. The recognition means can read a recognition mark for alignment formed on the component.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, due to the miniaturization of semiconductor elements in recent years, the recognition marks on components have also become smaller. Therefore, in order to image small recognition marks, the magnification of the lens of an image pickup device such as a CCD camera is increased to enlarge and read the recognition marks. As a result, the field of view of the image pickup device has become smaller compared to the conventional configuration.

[0006] Therefore, there is still room for improvement in terms of imaging recognition marks of components having different outer shapes with a small field of view.

[0007] An object of the present disclosure is to provide a component mounting device that can image recognition marks of components having different outer shapes in order to solve the above problems.

Means for Solving the Problems

[0008] The component mounting apparatus according to this disclosure includes: a detachable mounting head for holding a component having a recognition mark for alignment; a first image sensor provided on the side of the mounted mounting head and capturing a first recognition mark of a component in a first field of view based on a first imaging optical path passing through the mounting head; a second image sensor provided on the side of the mounted mounting head and capturing a second recognition mark of a component in a second field of view based on a second imaging optical path passing through the mounting head; a first reflective optical system that reflects the first imaging optical path from the first field of view toward the first image sensor through a first through-hole provided in the mounting head; and a second reflective optical system that reflects the second imaging optical path from the second field of view toward the second image sensor through a second through-hole provided in the mounting head. The mounting head is either a first mounting head or a second mounting head, and the arrangement of the first and second through-holes in a plan view differs between the first and second mounting heads based on component information. [Effects of the Invention]

[0009] According to this disclosure, recognition marks on parts having different external shapes can be imaged. [Brief explanation of the drawing]

[0010] [Figure 1A] Cross-sectional view of a component mounting device according to Embodiment 1 of this disclosure [Figure 1B] Plan view of a part [Figure 2] Schematic plan view of the mounting head in Figure 1A [Figure 3] Enlarged cross-sectional view of the area near the first reflective optical system along line AA in Figure 2. [Figure 4] Enlarged cross-sectional view of the area near the second and third reflective optical systems along line BB in Figure 2. [Figure 5A] Plan view of a part [Figure 5B] Schematic cross-sectional view of a component mounting device equipped with different mounting heads. [Figure 6] Schematic plan view of the mounting head in Figure 5B [Figure 7]Enlarged cross-sectional view near the first reflection optical system along the C-C line in FIG. 6 [Figure 8] Enlarged cross-sectional view near the second and third reflection optical systems along the D-D line in FIG. 6 [Figure 9A] Plan view of the component [Figure 9B] Schematic cross-sectional view of a component mounting apparatus with different mounting heads attached [Figure 10] Schematic plan view of the mounting head in FIG. 9B [Figure 11] Enlarged cross-sectional view near the first reflection optical system along the E-E line in FIG. 10 [Figure 12] Enlarged cross-sectional view near the second and third reflection optical systems along the F-F line in FIG. 10 [Figure 13] Cross-sectional view of the component mounting apparatus according to Embodiment 2 of the present disclosure [Figure 14] Schematic plan view of the component mounting apparatus [Figure 15] Schematic plan view of the mounting head in FIG. 13 [Figure 16A] (a) Enlarged cross-sectional view near the first reflection optical system along the A-A line in FIG. 2, (b) Enlarged cross-sectional view near the first reflection optical system along the G-G line in FIG. 15 [Figure 16B] (a) Enlarged cross-sectional view near the second and third reflection optical systems along the B-B line in FIG. 2, (b) Enlarged cross-sectional view near the second and third reflection optical systems along the H-H line in FIG. 15 [Figure 17] Schematic plan view of the mounting head [Figure 18] Cross-sectional view of the component mounting apparatus according to Embodiment 3 of the present disclosure [Mode for Carrying Out the Invention]

[0011] <所定の場所> Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0012] [Embodiment 1] [Overall Configuration] FIG. 1A is a cross-sectional view of a component mounting apparatus 100 according to Embodiment 1 of the present disclosure. FIG. 1B is a plan view of the component 2. FIG. 2 is a schematic plan view of the mounting head 1 in FIG. 1A.

[0013] As shown in Figure 1A, the component mounting apparatus 100 in Embodiment 1 of the present disclosure comprises a mounting head 1, reflective optical systems 61, 62, and 63, a stage 12, a head lifting mechanism 40, a head moving mechanism 52, an imaging unit 11, and a control unit 51.

[0014] The mounting head 1 is a mechanism that holds component 2 and mounts the held component 2 onto the substrate 13 held by the stage 12.

[0015] Here, component 2 is a die, i.e., an IC chip, which is a thin, rectangular plate-like member made of an opaque material such as silicone, gallium nitride, or silicone carbide. Recognition marks 3a and 3b for alignment are formed on one surface 2a of component 2 (the top surface in Figure 1A). As shown in Figure 1B, the recognition marks 3a and 3b are, for example, small squares and are formed at at least one pair of diagonal positions on the rectangular component 2. An adhesive layer (not shown) for bonding to the substrate 13 is formed on the other surface 2b of component 2 (the bottom surface in Figure 1A). The adhesive layer is composed of, for example, a thermosetting adhesive such as epoxy resin, acrylic resin, or silicone resin, a thermoplastic adhesive, a conductive adhesive, or solder paste.

[0016] The substrate 13 on which component 2 is mounted is made of, for example, silicone, glass, stainless steel, or a resin substrate, and its planar shape is circular or rectangular.

[0017] The mounting head 1 is held in a replaceable head lifting mechanism 40. The component mounting apparatus 100 has a plurality of different mounting heads, including the mounting head 1. The different mounting heads have different configurations and can hold and image components 2 having different external shapes.

[0018] The mounting head 1 may be replaced manually by the user or by other equipment. Furthermore, the alignment of the mounting head 1 may be achieved, for example, by engaging a guide formed in the head lifting mechanism 40 with a groove formed in the mounting head 1.

[0019] The reflective optical systems 61, 62, and 63 are located inside the mounting head 1. The first reflective optical system 61 is an optical system for guiding light from the recognition mark 3a of the component 2 through the mounting head 1 to the imaging unit 11. The second reflective optical system 62 and the third reflective optical system 63 are optical systems for guiding light from the recognition mark 3b of the component 2 through the mounting head 1 to the imaging unit 11.

[0020] Stage 12 is a component that supports the substrate 13 so as to face the mounting head 1. Under the control of the control unit 51, Stage 12 is movable in the XY direction, which is orthogonal to the vertical direction (Z direction), and in the θ direction around the Z direction.

[0021] The head lifting mechanism 40 drives the mounting head 1 in a direction perpendicular to the plane of the stage 12 (for example, in the Z direction).

[0022] The head movement mechanism 52 drives the mounting head 1 in a lateral direction (e.g., XY direction) that is perpendicular to the vertical direction (e.g., up and down direction) of the mounting head 1 by the head lifting mechanism 40.

[0023] The imaging unit 11 is positioned to the side of the mounting head 1 and is a mechanism that images the recognition marks 3a and 3b of the component 2 via the reflective optical systems 61, 62, and 63.

[0024] The imaging unit 11 is configured by fixing two imaging units 11a and 11b to a single imaging stage 11c. The imaging units 11a and 11b are, for example, CCD cameras.

[0025] The first imaging unit 11a has a first image sensor 15a and captures the first recognition mark 3a in the first field of view 64a (Figure 2). The second imaging unit 11b has a second image sensor 15b and captures the second recognition mark 3b in the second field of view 64b (Figure 2).

[0026] The optical path extending from the first field of view 64a to the first image sensor 15a is designated as the first imaging optical path 65, and the optical path extending from the second field of view 64b to the second image sensor 15b is designated as the second imaging optical path 66.

[0027] The imaging stage 11c is detachably connected to the mounting head 1 by a connecting portion 14. The imaging stage 11c and the mounting head 1 may be fixedly connected to each other by the connecting portion 14, or they may be movably connected to each other.

[0028] The control unit 51 controls each part of the component mounting device 100. The control unit 51 drives and controls the mounting head 1, the head lifting mechanism 40, the head moving mechanism 52, the imaging unit 11, and the stage 12, respectively. The control unit 51 includes a general-purpose processor such as a CPU or MPU that realizes predetermined functions by executing a program. The control unit 51 is not limited to realizing predetermined functions through the cooperation of hardware and software, but may also be a hardware circuit specifically designed to realize predetermined functions.

[0029] The control unit 51 includes a storage unit 31, an image processing device 42, and a position calculation unit 50.

[0030] The storage unit 31 is a recording medium for recording various types of information. The storage unit 31 can be implemented as, for example, flash memory, an SSD (Solid State Device), a hard disk, other storage devices, or a combination thereof as appropriate. The storage unit 31 stores, for example, a production program executed by the control unit 51. The production program includes parts information.

[0031] Component information refers to information related to the mounting of component 2, and specifically includes the type of component 2 to be mounted, the mounting position of component 2, information related to the external shape of component 2, and information related to the mounting head 1 that holds component 2. Information related to the external shape of component 2 may include the external size of component 2, the aspect ratio of component 2, and the positions of recognition marks 3a and 3b predicted based on the external shape of component 2. In addition, component information may include the positions of recognition marks 3a and 3b instead of or in addition to the information related to the external shape of component 2. Information related to the mounting head 1 that holds component 2 is the designation of the mounting head to be notified to the user, and may include identification information such as the management number and model number of the mounting head. For example, the designation of the mounting head is based on the external size of component 2 or the positions of recognition marks 3a and 3b.

[0032] The image processing device 42 is connected to two imaging units 11a and 11b, and the image processing device 42 and the imaging units 11a and 11b function as an example of an image recognition device. The image processing device 42 can read the position information of the recognition marks 3a and 3b of the component 2 by performing known image processing, such as background subtraction, on the image information captured by the imaging units 11a and 11b.

[0033] The position calculation unit 50 is connected to the image processing device 42. The position calculation unit 50 calculates the relative coordinates of the component 2 with respect to the coordinates of the center of gravity of the mounting head 1 from the position information of the recognition marks 3a and 3b obtained by the image processing device 42. That is, the position calculation unit 50 calculates the amount of positional displacement of the component 2 with respect to the coordinates of the center of gravity of the mounting head 1. Based on the amount of positional displacement calculated by the position calculation unit 50, the control unit 51 can mount the component while aligning the position of the component 2 by controlling the head lifting mechanism 40 and the head moving mechanism 52.

[0034] (Configuration of the mounting head) Here, the configuration of the mounting head 1 will be described in more detail. The mounting head 1 has a head body portion 1a and a holding member 5.

[0035] The head body portion 1a is a component that forms the outer casing of the mounting head 1. The head body portion 1a has a rectangular parallelepiped-shaped heater block 67, a rectangular parallelepiped-shaped cooling block 68, and a rectangular parallelepiped-shaped prism block 71. The cooling block 68 is fixed to the upper surface of the heater block 67, and the prism block 71 is fixed to the upper surface of the cooling block 68. The retaining member 5 is fixed to the lower surface of the heater block 67.

[0036] The holding member 5 is a member that holds the part 2. The holding member 5 is, for example, a suction nozzle connected to a vacuum pump 41 that holds the part 2 by vacuum suction. The holding member 5 may hold the part 2 in other ways.

[0037] Since the holding member 5 is optically transmittable for imaging, light passes through the holding member 5, allowing the imaging units 11a and 11b to image the component 2. The holding member 5 is made of, for example, a transparent material. The holding member 5 is made of, for example, sapphire, quartz, glass, or heat-resistant plastic.

[0038] The retaining member 5 may have different shapes or sizes in different mounting heads.

[0039] The heater block 67 incorporates a heater 6 that can heat the component 2 via the holding member 5. Heating by the heater 6 can soften the adhesive layer on the lower surface 2b of the component 2, or melt the bonding material such as solder.

[0040] The cooling block 68 is equipped with cooling passages (not shown) through which cooling water or the like circulates. The prism block 71 is cooled by the circulation of the cooling water. This configuration can suppress the excessive temperature rise of the prism block 71 caused by heating from the heater block 67.

[0041] The prism block 71 houses the reflective optical systems 61, 62, and 63. In different mounting heads, the arrangement of the reflective optical systems 61, 62, and 63 in the prism block 71 differs.

[0042] As shown in Figure 1A, the cooling block 68 and heater block 67 form two through-holes 69a and 69b so that light can reach the reflective optical systems 61 and 62 from component 2. The first through-hole 69a communicates vertically from the holding member 5 to the first reflective optical system 61, and the second through-hole 69b communicates vertically from the holding member 5 to the second reflective optical system 62. The arrangement of the through-holes 69a and 69b differs in different mounting heads.

[0043] Furthermore, as shown in Figure 2, when the mounting head 1 is viewed from above, the first through-hole 69a and the second through-hole 69b each have an elongated shape such as an oval, and are both elongated holes. The first through-hole 69a and the second through-hole 69b share a common longitudinal direction K and a short-width direction L. The first through-hole 69a and the second through-hole 69b may be arranged side by side in the longitudinal direction K with a gap between them, and they may share a common centerline J extending in the longitudinal direction K. In addition, in different mounting heads, one or both of the first through-hole 69a and the second through-hole 69b may be shifted from being arranged side by side in the longitudinal direction K to being shifted in the short-width direction L.

[0044] The longitudinal direction K may be aligned with the direction in which the diagonal of the retaining member 5 extends.

[0045] The aperture area of ​​the first through-hole 69a may be equal to the aperture area of ​​the second through-hole 69b. Also, in a plan view, the aperture area of ​​the first through-hole 69a may be smaller than the outer dimensions of the first reflective optical system 61, and the aperture area of ​​the second through-hole 69b may be smaller than the outer dimensions of the second reflective optical system 62.

[0046] (Configuration of the reflective optical system) Referring to Figures 1A and 2-4, the configurations of the reflective optical systems 61, 62, and 63 will be described in more detail. Figure 3 is an enlarged cross-sectional view of the area around the first reflective optical system 61 along line AA in Figure 2. Figure 4 is an enlarged cross-sectional view of the area around the second reflective optical system 62 and the third reflective optical system 63 along line BB in Figure 2.

[0047] As shown in Figures 1A and 2, the first reflective optical system 61 is positioned above the first through-hole 69a, and the second reflective optical system 62 is positioned above the second through-hole 69b. The third reflective optical system 63 is positioned at a distance from the second reflective optical system 62 in the short-side direction L.

[0048] The first reflective optical system 61 is, for example, a reflective prism or a reflective mirror. As shown in Figures 1A and 2, the first reflective optical system 61 receives the first imaging optical path 65 passing through the first through-hole 69a from the first field of view 64a on the component 2 and reflects it toward the first image sensor 15a. The first imaging optical path 65 reflected by the first reflective optical system 61 propagates in the short-side direction L.

[0049] The second reflective optical system 62 is, for example, a reflective prism or a reflective mirror, and may be similar to the first reflective optical system 61. As shown in Figures 1A and 2, the second reflective optical system 62 receives the second imaging optical path 66 passing through the second through-hole 69b from the second field of view 64b on component 2 and reflects it toward the third reflective optical system 63. The second imaging optical path 66 reflected by the second reflective optical system 62 propagates in the short-side direction L, in the opposite direction to the propagation direction of the first imaging optical path 65 reflected by the first reflective optical system 61.

[0050] As shown in Figure 3, the first reflective optical system 61 has a first reflective surface 61a extending in the longitudinal direction K. The first reflective surface 61a is inclined at a certain angle α with respect to the vertical direction (the vertical direction of the mounting head 1). The angle α is, for example, 45°. With this structure, the first imaging optical path 65 can be bent by 90° from the vertical direction to the horizontal direction by reflection in the first reflective optical system 61.

[0051] As shown in Figure 4, the second reflective optical system 62 has a second reflective surface 62a extending in the longitudinal direction K. The second reflective surface 62a is inclined at a certain angle β with respect to the vertical direction, in the opposite direction to the first reflective surface 61a (Figure 3). The angle β is, for example, 45°. With this structure, the reflection in the second reflective optical system 62 can bend the second imaging optical path 66 by 90° from the vertical direction to the lateral direction, in the opposite direction to the first imaging optical path 65.

[0052] As shown in Figure 2, the third reflective optical system 63 is, for example, a triangular plate-shaped prism. In this embodiment, the third reflective optical system 63 is a right-angled triangular plate-shaped prism, and is positioned such that the hypotenuse extends in the longitudinal direction K. The third reflective optical system 63 forms a third reflective surface 63a and a fourth reflective surface 63b by two sides that form a right angle. The second imaging optical path 66 reflected by the second reflective optical system 62 is reflected by the third reflective surface 63a and then directed toward the fourth reflective surface 63b, and then directed toward the second image sensor 15b. By reflecting the second imaging optical path 66 reflected by the second reflective optical system 62 twice by the third reflective surface 63a and the fourth reflective surface 63b, the propagation direction of the second imaging optical path 66 can be reversed compared to the propagation direction before it enters the third reflective optical system 63. As a result, the second imaging optical path 66 reflected by the third reflective optical system 63 propagates in the same direction as the first imaging optical path 65 reflected by the first reflective optical system 61.

[0053] (Movement of the mounting head) In the configuration described above, an example of the operation of the component mounting device 100 will now be explained.

[0054] The control unit 51 obtains part information for part 2. The control unit 51 obtains part information for part 2 by referring to the production program. The part information for part 2 includes the external dimensions of part 2, the aspect ratio of part 2, and the specification of the mounting head 1.

[0055] The control unit 51 compares the mounted mounting head with the designated mounting head 1 based on the component information to determine whether replacement is necessary. If replacement is necessary, the control unit 51 notifies the user of the need for replacement, and the user replaces the mounting head manually or by operating another device.

[0056] Based on the component information, the control unit 51 moves the mounting head 1 above the transfer stage (not shown) on which the component 2 is mounted. Specifically, the control unit 51 moves the mounting head 1 by controlling the head movement mechanism 52, which moves the mounting head 1 horizontally, and the head lifting mechanism 40, which moves the mounting head 1 vertically.

[0057] Next, the control unit 51 acquires the recognition marks 3a and 3b of the component 2 mounted on the transfer stage and the position information of the mounting head 1. Specifically, a camera for the transfer stage (not shown) mounted on the transfer stage reads the recognition marks 3a and 3b of the component 2 and the position information of the mounting head 1, and transmits it to the control unit 51.

[0058] Next, the control unit 51 aligns the mounting head 1 with respect to the component 2 mounted on the transfer stage, based on the recognition marks 3a and 3b of the component 2 and the position information of the mounting head 1. Specifically, the control unit 51 aligns the mounting head 1 with respect to the component 2 in the X, Y, and θ directions (rotational direction around the Z direction) by driving the head movement mechanism 52.

[0059] Next, the control unit 51 lowers the mounting head 1, which has been aligned with the component 2, using the head lifting mechanism 40 to hold the component 2. When the mounting head 1 is lowered, the holding member 5 of the mounting head 1 comes into contact with the component 2, and the component 2 is held by vacuum suction of the holding member 5. Here, in order to shorten the mounting time, the mounting head 1 may be preheated by the heater 6.

[0060] Next, the control unit 51 moves the mounting head 1, which is holding the component 2, to above the component mounting position on the substrate 13, based on the component information.

[0061] Next, the control unit 51 uses the imaging unit 11 to capture images of the component recognition marks 3a and 3b.

[0062] Next, the control unit 51 performs image processing on the image processing device 42 based on the captured image, and recognizes the recognition marks 3a and 3b of the component 2 held by the mounting head 1 based on the image processing. Based on the image recognition results, the position calculation unit 50 calculates the coordinates of the component 2.

[0063] Next, the control unit 51 corrects the misalignment of the component 2, i.e., the mounting head 1, based on the calculation results from the position calculation unit 50. More specifically, the control unit 51 moves the mounting head 1 or the stage 12 in the X, Y, and θ directions using the head moving mechanism 52.

[0064] Next, the control unit 51 lowers the mounting head 1, which has corrected for misalignment, using the head lifting mechanism 40, and mounts the component 2 onto the substrate 13 while applying pressure to it. More specifically, the heat from the heater 6 is transferred to the adhesive layer on the back of the component 2 via the holding member 5 of the mounting head 1, and the adhesive layer, softened by the heat, is pressed against the substrate 13 and bonded.

[0065] After performing the above operations, the operation when mounting a component with a different external shape will be described next. If the external shape of component 2 is different, the positions of the first recognition mark 3a and the second recognition mark 3b in the short-side direction L will also be different. For example, the case of mounting a vertically elongated component 102 that is longer vertically and smaller horizontally than component 2 will be described.

[0066] The operation for mounting the elongated component 102 will be explained in more detail with reference to Figures 5A-8. Figure 5A is a plan view of component 102. Figure 5B is a schematic cross-sectional view of the component mounting apparatus 100 with the mounting head 101 attached. Figure 6 is a schematic plan view of the mounting head 101 in Figure 5B. Figure 7 is an enlarged cross-sectional view of the vicinity of the first reflective optical system 161 along the CC line in Figure 6. Figure 8 is an enlarged cross-sectional view of the vicinity of the second reflective optical system 162 and the third reflective optical system 63 along the DD line in Figure 6.

[0067] As shown in Figure 5A, part 102 has a vertically elongated shape relative to a square, and the recognition marks 103a and 103b are offset from the center line J. A vertically elongated shape means that the vertical dimension H1 is longer than the horizontal dimension W1.

[0068] First, the control unit 51 acquires component information for the elongated component 102. The component information may include the specification of the mounting head 101 that holds the component 102. As shown in Figures 5B and 6, the mounting head 101 has a different structure from the mounting head 1. Specifically, the mounting head 101 differs from the mounting head 1 in the arrangement of the reflective optical systems 161 and 162 in the lateral direction and the arrangement of the through holes 169a and 169b.

[0069] Next, the control unit 51 may notify the user of the designation of the mounting head 101, and the user who receives the notification may replace the mounting head 1 with the mounting head 101. Alternatively, the user may replace the mounting head 1 with the mounting head 101 at a predetermined timing. In the replacement, the user removes the mounted mounting head 1 and installs the mounting head 101.

[0070] As shown in Figure 6, when mounted, the mounting head 101 forms through holes 169a and 169b in a position offset in the short-side direction L from the through holes 69a and 69b of the mounting head 1 (Figure 2) in a plan view. On the other hand, the short-side direction L of the through holes 69a and 69b is the same as the short-side direction L of the through holes 169a and 169b. Also, the through holes 169a and 169b are spaced apart and positioned at different locations in the longitudinal direction K. The first reflective optical system 161 and the first through hole 169a are positioned offset in the first short-side direction L1 (arrow A1) with respect to the center line J, and the second reflective optical system 162 and the second through hole 169b are positioned offset in the second short-side direction L2 (arrow A2) with respect to the center line J. Here, the first short-side direction L1 and the second short-side direction L2, that is, arrows A1 and A2, are parallel to the short-side direction L and are opposite to each other. In other words, the first reflective optical system 161 and the first through-hole 169a are positioned offset in the short-side direction L relative to the second through-hole 169b, so as to be closer to the first image sensor 15a.

[0071] Furthermore, the amount by which through-holes 169a and 169b are offset from the center line J of through-holes 69a and 69b is equal. That is, the first reflective optical system 161 and the first through-hole 169a and the second reflective optical system 162 and the second through-hole 169b are arranged in a point-symmetrical manner with respect to the midpoint P. The midpoint P is the midpoint of the center line J between through-holes 69a and 69b.

[0072] Next, the mounting head 101 holds the component 102 in a position aligned with the component 102 mounted on the transfer stage. With the component 102 still in place, the mounting head 101 moves above the component mounting position on the substrate 13, and the imaging units 11a and 11b capture images of the recognition marks 103a and 103b.

[0073] As shown in Figures 6 and 7, when the mounting head is replaced, the first through-hole 169a and the first reflective optical system 161 move closer to the first image sensor 15a (arrows A11 and A1). As a result, the reflection position of the first imaging optical path 165 on the first reflective surface 161a shifts laterally (in the short-side direction L) relative to the reflection position of the first imaging optical path 65 (arrow A1). Consequently, the first imaging optical path 165, which extends in the vertical direction, shifts laterally (in the short-side direction L) relative to the first imaging optical path 65 (arrow A1).

[0074] Furthermore, as shown in Figures 6 and 8, the replacement of the mounting head 101 causes the second through-hole 169b and the second reflective optical system 162 to move away from the first image sensor 15a (arrows A12 and A2). As a result, the reflection position of the second imaging optical path 166 on the second reflective surface 162a shifts laterally (in the short-side direction L) relative to the reflection position of the second imaging optical path 66 (arrow A2). Consequently, the second imaging optical path 166, which extends in the vertical direction, shifts laterally (in the short-side direction L) relative to the second imaging optical path 66 (arrow A2).

[0075] Comparing Figure 7 and Figure 8, the direction in which the first imaging optical path 165 shifts (arrow A1) and the direction in which the second imaging optical path 166 shifts (arrow A2) are opposite. As a result, as shown in Figure 6, the first field of view 64a and the second field of view 64b move symmetrically with respect to the midpoint P.

[0076] Next, the control unit 51 corrects the position of the mounting head 101 and mounts the component 102 onto the circuit board 13.

[0077] Through the above operation, the component mounting device 100 is able to handle components having a vertically elongated shape, such as component 102.

[0078] Furthermore, the component mounting device 100 can also handle components with a horizontally elongated shape, such as component 202.

[0079] The operation for mounting the elongated component 202 will be explained in more detail with reference to Figures 9A-12. Figure 9A is a plan view of component 202. Figure 9B is a schematic cross-sectional view of the component mounting apparatus 100 with the mounting head 201 attached. Figure 10 is a schematic plan view of the mounting head 201 in Figure 9B. Figure 11 is an enlarged cross-sectional view of the vicinity of the first reflective optical system 261 along the EE line in Figure 10. Figure 12 is an enlarged cross-sectional view of the vicinity of the second reflective optical system 262 and the third reflective optical system 63 along the FF line in Figure 10.

[0080] As shown in Figure 9A, part 202 has a horizontally elongated shape relative to a square, and the recognition marks 203a and 203b are offset from the center line J. A horizontally elongated shape means that the horizontal dimension W2 is longer than the vertical dimension H2.

[0081] First, the control unit 51 acquires component information for the horizontally elongated component 202. The component information may include the specification of the mounting head 201 that holds the component 202. As shown in Figures 9B and 10, the mounting head 201 has a different structure from the mounting heads 1 and 101. Specifically, the mounting head 201 differs from the mounting heads 1 and 101 in the arrangement of the reflective optical systems 261 and 262 in the lateral direction and the arrangement of the through holes 269a and 269b.

[0082] Next, the control unit 51 may notify the user of the designation of the mounting head 201, and the user who receives the notification may replace the mounting head 101 with the mounting head 201. Alternatively, the user may replace the mounting head 1 with the mounting head 101 at a predetermined timing. In the replacement, the user removes the mounted mounting head 101 and installs the mounting head 201.

[0083] As shown in Figure 10, when mounted, the mounting head 201 forms through holes 269a and 269b in a position offset in the short direction L relative to the through holes 69a and 69b of the mounting head 1 (Figure 2) in a plan view. On the other hand, the short direction L of the through holes 69a and 69b is the same as the short direction L of the through holes 269a and 269b. Also, the through holes 269a and 269b are spaced apart and positioned at different locations in the longitudinal direction K. The first reflective optical system 261 and the first through hole 269a are positioned offset in the second short direction L2 (arrow B1) relative to the center line J, and the second reflective optical system 262 and the second through hole 269b are positioned offset in the first short direction L1 (arrow B2) relative to the center line J. Arrows B1 and B2 are in opposite directions. In other words, the first reflective optical system 261 and the first through-hole 269a are positioned so as to be offset in the short-side direction L relative to the second through-hole 269b, away from the first image sensor 15a.

[0084] Furthermore, the amount by which through-holes 269a and 269b are offset from the center line J of through-holes 69a and 69b is equal. That is, the first reflective optical system 261 and the first through-hole 269a and the second reflective optical system 262 and the second through-hole 269b are arranged in a point-symmetrical manner with respect to the midpoint P.

[0085] Next, the mounting head 201 holds the component 202 while it is aligned with the component 202 mounted on the transfer stage. With the mounting head 201 holding the component 202, it moves above the component mounting position on the substrate 13, and the imaging units 11a and 11b capture images of the recognition marks 203a and 203b.

[0086] As shown in Figures 10 and 11, the replacement of the mounting head causes the first through-hole 269a and the first reflective optical system 261 to move away from the first image sensor 15a (arrows B11 and B1). As a result, the reflection position of the first imaging optical path 265 on the first reflective surface 261a shifts laterally (in the short-side direction L) relative to the reflection position of the first imaging optical path 65 (arrow B1). Consequently, the first imaging optical path 265, which extends in the vertical direction, shifts laterally (in the short-side direction L) relative to the first imaging optical path 65 (arrow B1).

[0087] Furthermore, as shown in Figures 10 and 12, replacing the mounting head 201 brings the second through-hole 269b and the second reflective optical system 262 closer to the first image sensor 15a (arrows B12 and B2). As a result, the reflection position of the second imaging optical path 266 on the second reflective surface 262a shifts laterally (in the short-side direction L) relative to the reflection position of the second imaging optical path 66 (arrow B2). Consequently, the second imaging optical path 266, which extends in the vertical direction, shifts laterally (in the short-side direction L) relative to the second imaging optical path 66 (arrow B2).

[0088] Comparing Figure 11 and Figure 12, the direction in which the first imaging optical path 265 shifts (arrow B1) and the direction in which the second imaging optical path 266 shifts (arrow B2) are opposite. As a result, as shown in Figure 10, the first field of view 64a and the second field of view 64b move symmetrically with respect to the midpoint P.

[0089] Next, the control unit 51 corrects the position of the mounting head 101 and mounts the component 102 onto the circuit board 13.

[0090] In this way, by exchanging the mounting heads 101 and 201, the positions of the fields of view 64a and 64b can be changed in the opposite direction in the short-side direction L, using the same two imaging units 11a and 11b. Furthermore, since the mounting heads 101 and 201 form through-holes at positions different from the through-holes 69a and 69b of the mounting head 1, the change in the position of the fields of view 64a and 64b can be achieved over a wider area than the aperture area of ​​the through-holes 69a and 69b. Therefore, the recognition marks of parts 102 and 202, which have different external shapes, can be imaged.

[0091] Furthermore, the through holes 69a, 69b, 169a, 169b, 269a, and 269b may have the same aperture area in a plan view. In the mounting heads 1, 101, and 201, the arrangement of the third reflective optical system 63 may be fixed, or the arrangement of the third reflective optical system 63 may be adjusted according to the arrangement of the second reflective optical systems 62, 162, and 262.

[0092] To summarize the above explanation, the features of this disclosure are described below.

[0093] In the component mounting apparatus 100 according to Embodiment 1, the arrangement of through holes (for example, through holes 69a, 69b, 169a, 169b, 269a, 269b) can be changed by replacing the mounting head. Compared to the case where the arrangement of through holes is constant, the range in which the fields of view 64a and 64b move can be designed more freely. Also, compared to the case where the through holes are made larger to secure the range in which the fields of view 64a and 64b move, in this disclosure, by increasing the contact area between the component and the heater block 67, more uniform heating can be achieved in the heater block 67. Furthermore, by replacing the entire mounting head, it becomes possible to move the fields of view 64a and 64b in a simple procedure without having to adjust the optical axis of the reflective optical systems 61 and 62 inside the mounting head.

[0094] (effect) The component mounting apparatus 100 according to Embodiment 1 can achieve the following effects.

[0095] As described above, the component mounting apparatus 100 of Embodiment 1 comprises a mounting head 101, a first image sensor 15a, a second image sensor 15b, a first reflective optical system 161, and a second reflective optical system 162. The mounting head 101 holds and is detachable from a component 102 having alignment recognition marks 103a and 103b. The first image sensor 15a is provided to the side of the mounted mounting head 101 and captures the first recognition mark 103a of the component 102 in a first field of view 64a based on a first imaging optical path 165 passing through the mounting head 101. The second image sensor 15b is provided to the side of the mounted mounting head 101 and captures the second recognition mark 103b of the component 102 in a second field of view 64b based on a second imaging optical path 166 passing through the mounting head 101. The first reflective optical system 161 reflects the first imaging optical path 165 from the first field of view 64a toward the first image sensor 15a through the first through-hole 169a provided in the mounting head 101. The second reflective optical system 162 reflects the second imaging optical path 166 from the second field of view 64b toward the second image sensor 15b through the second through-hole 169b provided in the mounting head 101. In addition, a mounting head 201 (second mounting head) is mounted in place of the mounting head 101 (first mounting head). In the mounting head 101 and the mounting head 201, the arrangement of the first through-holes 169a, 269a and the second through-holes 169b, 269b in a plan view differs based on component information.

[0096] With this configuration, by changing the mounting head, the arrangement of the first reflective optical systems 161, 261 and the second reflective optical systems 162, 262 can be changed in accordance with the change in the arrangement of the first through holes 169a, 269a and the second through holes 169b, 269b. The positions of the first field of view 64a and the second field of view 64b can be adjusted. Therefore, even with a small field of view, recognition marks 103a, 103b, 203a, and 203b of parts 102 and 202 with different external shapes can be imaged.

[0097] Furthermore, in the component mounting apparatus 100 of Embodiment 1, the arrangement of the first reflective optical systems 161, 261 and the second reflective optical systems 162, 262 in a plan view differs between the mounting head 101 and the mounting head 201, based on component information.

[0098] With this configuration, by changing the mounting heads 101 and 201, the positional relationship between the first field of view 64a and the second field of view 64b can be changed by altering the arrangement of the first reflective optical systems 161 and 261 and the second reflective optical systems 162 and 262. Therefore, even with a small field of view, recognition marks 103a, 103b, 203a, and 203b of parts 102 and 202 with different external shapes can be imaged.

[0099] Furthermore, in the component mounting apparatus 100 of Embodiment 1, in a plan view, the first through holes 169a, 269a and the second through holes 169b, 269b have a horizontally elongated shape and are arranged at different positions in the longitudinal direction. In the mounting head 101 and the mounting head 201, the arrangement of the first through holes 169a, 269a and the second through holes 169b, 269b differs in the short-side direction L.

[0100] With this configuration, the positions of the first field of view 64a and the second field of view 64b can be changed along the short-side direction L by shifting the arrangement of the first reflective optical systems 161, 261 and the second reflective optical systems 162, 262 along the short-side direction L. Therefore, even with a small field of view, recognition marks 103a, 103b, 203a, and 203b of components 102 and 202 having different aspect ratios and external dimensions can be imaged.

[0101] Furthermore, in the component mounting apparatus 100 of Embodiment 1, the mounting head 101 corresponds to the vertically elongated component 102, and the mounting head 201 corresponds to the horizontally elongated component 202.

[0102] With this configuration, the different mounting heads 101 and 201 can accommodate components 102 and 202 having different aspect ratios, and recognition marks 103a, 103b, 203a, and 203b on components 102 and 202 can be captured even with a small field of view.

[0103] Furthermore, in the component mounting apparatus 100 of Embodiment 1, in the mounting head 101, the first through hole 169a is formed offset from the second through hole 169b in the first short-side direction L1. In the mounting head 201, the first through hole 269a is formed offset from the second through hole 69b in the second short-side direction L2, which is opposite to the first short-side direction L1.

[0104] With this configuration, the different mounting heads 101 and 201 can accommodate parts 102 and 202 having different aspect ratios by shifting the through holes 169a, 169b, 269a, and 269b in opposite directions. Therefore, even with a small field of view, the recognition marks 103a, 103b, 203a, and 203b of parts 102 and 202 can be captured.

[0105] Furthermore, in the component mounting apparatus 100 of Embodiment 1, the component information includes information related to the external shape of the component.

[0106] With this configuration, by acquiring component information, mounting heads 101 and 201 corresponding to the external shape of the component can be selected. When the positions of recognition marks 103a, 103b, 203a, and 203b are defined by the external shape of the component, by acquiring component information, mounting heads 101 and 201 corresponding to the positions of recognition marks 103a, 103b, 203a, and 203b can be selected.

[0107] Furthermore, the component mounting apparatus 100 of Embodiment 1 further includes a heater block 67 having a heater 6 for heating the held component 102, and a first through hole 169a and a second through hole 169b.

[0108] This configuration allows for uniform heating of the entire component 102 using the heater 6. Therefore, the occurrence of mounting defects in component 102 can be suppressed.

[0109] In Embodiment 1, an example was described in which the opening areas of the first through-hole 69a and the second through-hole 69b are equal in the mounting head 1, but the invention is not limited to this. The mounting head 1 may have through-holes 69a and 69b having different opening areas in a plan view.

[0110] In Embodiment 1, an example was described in which the opening areas of the through holes 69a, 69b, 169a, 169b, 269a, and 269b in the mounting heads 1, 101, and 201 are equal, but the invention is not limited to this. For example, the opening areas of the through holes 169a and 169b in the mounting head 101 may be smaller than the opening areas of the through holes 269a and 269b in the mounting head 201. If the through holes 169a and 169b are small, when heating the component held by the mounting head 101 with the heater 6, uneven heating can be suppressed and heating can be performed more stably. Therefore, the mounting head 101 can hold and mount components that have functions or materials that are sensitive to temperature changes.

[0111] In Embodiment 1, an example was described in which the arrangement of through holes 69a and 69b differs in the short direction L by replacing the mounting heads 1, 101, and 201, but the invention is not limited to this. By replacing the mounting heads 1, 101, and 201, the arrangement of through holes 69a and 69b may differ in the long direction K in addition to or instead of the short direction L.

[0112] [Embodiment 2] A component mounting apparatus 300 according to Embodiment 2 of this disclosure will now be described. In Embodiment 2, components that are the same as or equivalent to those in Embodiment 1 will be denoted by the same reference numerals. In addition, in Embodiment 2, descriptions that overlap with those in Embodiment 1 will be omitted.

[0113] Figure 13 is a cross-sectional view of a component mounting apparatus 300 according to Embodiment 2 of the present disclosure. Figure 14 is a schematic plan view of the component mounting apparatus 300.

[0114] Embodiment 2 differs from Embodiment 1 in two subsequent respects. First, the component mounting apparatus 300 has a mounting head 301 that is movable up and down relative to the imaging unit 311, instead of mounting heads 1, 101, and 201, in order to make fine adjustments to the fields of view 64a and 64b. Second, the component mounting apparatus 300 has an imaging unit 311 that is movable in the longitudinal direction K relative to the mounting head 301, instead of the imaging unit 11. In Embodiment 2, the component mounting apparatus 300 is the same as the component mounting apparatus 100 of Embodiment 1 unless otherwise specified.

[0115] As shown in Figure 13, the mounting head 301 changes the imaging height H of the mounting head 301 relative to the imaging unit 311 in order to adjust the fields of view 64a and 64b. For example, the mounting head 301 rises to change the imaging height H from imaging height H0 to imaging height H1. Conversely, the mounting head 301 lowers to change the imaging height H from imaging height H1 to imaging height H0. The raising and lowering of the mounting head 301 is performed by the operation of the head lifting mechanism 40 (Figure 1).

[0116] As shown in Figure 14, the imaging unit 311 further includes a movement adjustment device 70. The movement adjustment device 70 can move the imaging stage 11c, to which the imaging units 11a and 11b are fixed, along the longitudinal direction K. An example of the movement adjustment device 70 is a linear actuator such as an air cylinder, or a linear motion device composed of a motor, a linear guide, and a ball screw that can move back and forth in a straight line.

[0117] The control unit 51 controls the operation of the head lifting mechanism 40 and the movement adjustment device 70 according to the part information of the part 2, specifically the external shape of the part 2.

[0118] The raising and lowering of the mounting head 301 and the movement of the imaging unit 311 in the longitudinal direction K will be described in more detail with reference to Figures 15 to 17. Figure 15 is a schematic plan view of the mounting head 1 in Figure 13. Figure 16A(a) is an enlarged cross-sectional view of the vicinity of the first reflective optical system along line AA in Figure 2, similar to Figure 3. Figure 16A(b) is an enlarged cross-sectional view of the vicinity of the first reflective optical system 61 along line GG in Figure 15. Figure 16B(a) is an enlarged cross-sectional view of the vicinity of the second and third reflective optical systems along line BB in Figure 2, similar to Figure 4. Figure 16B(b) is an enlarged cross-sectional view of the vicinity of the second reflective optical system 62 and the third reflective optical system 63 along line HH in Figure 15. Figure 17 is a schematic plan view of the mounting head 1 in Figure 13.

[0119] First, the control unit 51 acquires component information. If the aspect ratio of the mounted component 2 and the next component to be mounted 302 are different, the control unit 51 raises or lowers the mounting head 301 by operating the head lifting mechanism 40. Also, if the external dimensions of the mounted component 2 and the next component to be mounted 302 are different, the control unit 51 moves the imaging unit 311 by operating the movement adjustment device 70.

[0120] For example, the mounting head 301 rises from imaging height H0 to imaging height H1 (Figure 13), and the imaging unit 311, i.e., the imaging sections 11a and 11b, move parallel to the longitudinal direction K with respect to the mounting head 301 toward the second through-hole side K2.

[0121] As shown in Figures 15 and 16A(b), the rise of the mounting head 301 (arrow C3) causes the first imaging unit 11a to descend relative to the mounting head 1. Therefore, at the first reflective surface 61a, the reflection position of the first imaging optical path 365 toward the first image sensor 15a becomes lower than the reflection position of the first imaging optical path 65 (arrow C4). Consequently, the first imaging optical path 365 extending in the vertical direction, i.e., the first field of view 64a, shifts laterally (short side direction L) (arrow C1). Note that in Figure 16A(b), to clarify that the first imaging unit 11a is descending relative to the mounting head 1, the height Z1 of the first imaging unit 11a is shown to be the same in both Figure 16A(a) and Figure 16A(b).

[0122] As shown in Figures 15 and 16B(b), at the second reflective surface 62a, the reflection position of the second imaging optical path 366 toward the third reflective optical system 63 is lower than the reflection position of the second imaging optical path 66 (arrow C4). Therefore, the second imaging optical path 366 extending in the vertical direction, i.e., the second field of view 64b, is shifted in the horizontal direction (short side L) (arrow C2). Note that in Figure 16B(b), the height Z2 of the second imaging unit 11b (not shown) is shown as the same in Figure 16B(a) and Figure 16B(b) to clarify that the second imaging unit 11b is lower relative to the mounting head 1.

[0123] As shown in Figure 15, the movement of the imaging unit 11a, i.e., the image sensor 15a, causes the reflection position in the first reflective optical system 61 to move to the second through-hole side K2, and therefore the first field of view 64a moves to the second through-hole side K2 (arrow D1). The movement of the imaging unit 11b, i.e., the image sensor 15b, causes the reflection position on the fourth reflective surface 63b to move to the second through-hole side K2, and the reflection position on the third reflective surface 63a to move to the first through-hole side K1. Therefore, the second imaging optical path 66 and the second field of view 64b reflected from the second reflective optical system 62 move to the first through-hole side K1 (arrow D2).

[0124] Therefore, the first field of view 64a and the second field of view 64b move symmetrically with respect to the midpoint P. This movement of fields of view 64a and 64b allows for imaging of the recognition marks 303a and 303b of the component 302.

[0125] Furthermore, the mounting head 301 and mounting head 401 can be swapped in the imaging unit 311 which has a movement adjustment device 70. The mounting head 401 changes the imaging height H of the mounting head 401 relative to the imaging unit 311 in order to adjust the fields of view 64a and 64b.

[0126] The control unit 51 acquires part information for part 402, which is different from part 2. The control unit 51 notifies the user of the designation of the mounting head 401 included in the part information, and the user replaces the mounting head 101 with the mounting head 401. The control unit 51 also moves the imaging unit 311 and the mounting head 401 based on the part information of part 402. As shown in Figure 17, the replacement of the mounting head 401 and the movement of the mounting head 1 and the imaging unit 311 cause the first field of view 64a to move by combining movement in the short-side direction L (arrows B1, C1) and movement toward the first through-hole side K1 (arrow D1). The second field of view 64b also moves by combining movement in the short-side direction L (arrows B2, C2) and movement toward the second through-hole side K2 (arrow D2).

[0127] Therefore, after roughly adjusting the fields of view 64a and 64b to match the positions of the reflective optical systems 461 and 462 (arrows B1 and B2), they can be finely adjusted within the range of the through holes 469a and 469b (arrows C1, D1, C2, and D2).

[0128] (effect) The component mounting apparatus 300 according to Embodiment 2 can achieve the following effects.

[0129] As described above, the component mounting apparatus 300 of the second embodiment further comprises a first reflective optical system 461 and a second reflective optical system 462, and a control unit 51 that controls the change in the relative height between the first image sensor 15a and the second image sensor 15b.

[0130] This configuration allows for adjustment of the positions of the fields of view 64a and 64b in the short direction L within the range of the reflective optical systems 461 and 462 in a plan view, i.e., within the range of the through holes 469a and 469b. Therefore, the variety of components 402 that can be imaged using the component mounting device 300 can be increased.

[0131] Furthermore, the component mounting apparatus 300 of the second embodiment is further equipped with a movement adjustment device 70 that moves the first image sensor 15a and the second image sensor 15b laterally relative to the mounting head 301.

[0132] This configuration allows for adjustment of the positions of the fields of view 64a and 64b in the longitudinal direction K within the range of the through holes 469a and 469b in a plan view. Therefore, the number of types of components 2 that can be imaged can be further increased.

[0133] In Embodiment 2, an example was described in which the component mounting apparatus 300 has both mounting heads 301 and 401 and an imaging unit 311, but it is not limited to this. The component mounting apparatus 300 may have an imaging unit 311 without the mounting heads 301 and 401. Also, the component mounting apparatus 300 may have mounting heads 301 and 401 without the imaging unit 311.

[0134] In Embodiment 2, an example was described in which the mounting heads 301 and 401 move up and down relative to the imaging unit 311, but the invention is not limited to this. Only the relative height between the mounting heads 301 and 401 and the imaging unit 311 needs to be changed. For example, the imaging unit 311 may move up and down relative to the mounting heads 301 and 401. Specifically, in addition to moving in the longitudinal direction K, the movement adjustment device 70 may also move the imaging stage 11c up and down. With this configuration, the height of the imaging unit 311 relative to the mounting heads 301 and 401 can be changed by the operation of the movement adjustment device 70 while keeping the height of the mounting heads 301 and 401 fixed.

[0135] Although an example has been described in which the imaging unit 11a and imaging unit 11b are fixed to the imaging stage 11c and move as a single unit, the system is not limited to this. For example, the imaging unit 11a and imaging unit 11b may move independently. With such a configuration, the fields of view 64a and 64b can be positioned at any location in the through holes 469a and 469b, respectively.

[0136] [Embodiment 3] A component mounting apparatus 600 according to Embodiment 3 of this disclosure will now be described. In Embodiment 3, components that are the same as or equivalent to those in Embodiment 1 will be denoted by the same reference numerals. In addition, in Embodiment 3, explanations that overlap with those in Embodiment 1 will be omitted.

[0137] Figure 18 is a cross-sectional view of a component mounting apparatus 600 according to Embodiment 3 of the present disclosure.

[0138] Embodiment 3 differs from Embodiment 1 in that the component mounting device 600 is a device for mounting components 2 onto a substrate 613 having recognition marks. In Embodiment 3, the component mounting device 600 is the same as the component mounting device 100 of Embodiment 1 unless otherwise specified.

[0139] The component mounting device 600 can capture images of the recognition marks 3a and 3b on the component 2, as well as the substrate recognition marks 16a and 16b on the substrate 613, and perform alignment between the component 2 and the substrate 613.

[0140] Here, the alignment operation between component 2 and substrate 613 will be described. After the imaging unit 11 captures the recognition marks 3a and 3b of component 2, the control unit 51 changes the imaging height of the mounting head 1 based on the component information. The component information includes position information of the recognition marks on substrate 613 corresponding to component 2. The imaging height is the height required to move the field of view 64a and 64b to the position where the substrate recognition marks 16a and 16b on substrate 613 are assumed to be located.

[0141] Next, the control unit 51 uses the imaging unit 11 to image the substrate recognition marks 16a and 16b on the substrate 613. Because the holding member 5 is transparent, the imaging unit 11 can image the substrate recognition marks 16a and 16b through the holding member 5.

[0142] Next, the control unit 51 performs image processing on the image processing device 42 based on the captured image to recognize the recognition marks 3a and 3b on the component 2 held by the mounting head 1, and the substrate recognition marks 16a and 16b on the substrate 613. Based on the image recognition results, the position calculation unit 50 calculates the coordinates of the component 2 and the substrate 613.

[0143] Next, the control unit 51 corrects the misalignment of the component 2, i.e., the mounting head 1, relative to the substrate 613 based on the calculation results from the position calculation unit 50.

[0144] Next, the control unit 51 mounts the component 2 onto the circuit board 613. With this configuration, the component 2 can be mounted at the appropriate position on the circuit board 613 as specified by the circuit board recognition marks 16a and 16b.

[0145] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be obvious to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the invention as defined by the appended claims. [Industrial applicability]

[0146] The component mounting apparatus of this disclosure has the effect of mounting components to any specified position on a substrate, and is particularly useful in component mounting apparatus used when mounting components such as high-speed, high-capacity memory, application processors, and CPUs. [Explanation of Symbols]

[0147] 1. Mounting head 1a Head body 3a First Recognition Mark 3b Second Recognition Mark 5. Retaining member 6 Heaters 11 Imaging Unit 11a First imaging section 11b Second imaging section 15a First image sensor 15b Second imaging element 13 circuit boards 40 Head lifting mechanism 42 Image Processing Devices 50 Position calculation section 51 Control Unit 52 Head movement mechanism 61 1st reflection optical system 61a 1st reflective surface 62 Second reflective optical system 62a 2nd reflective surface 63 Third reflective optical system 63a Third reflective surface 63b 4th reflective surface 65 First imaging optical path 66 Second imaging optical path 67 Heater Block 68 Cooling Block 69a 1st through hole 69b 2nd through hole 71 Prism Blocks

Claims

1. A removable mounting head that holds a component having a recognition mark for alignment, A first image sensor is provided on the side of the mounted mounting head and captures a first recognition mark of the component in a first field of view based on a first imaging optical path passing through the mounting head. A second image sensor is provided on the side of the mounted mounting head and captures a second recognition mark of the component in a second field of view based on a second imaging optical path passing through the mounting head. A first reflective optical system that reflects the first imaging optical path from the first field of view toward the first image sensor through a first through-hole provided in the mounting head, A second reflective optical system that reflects the second imaging optical path from the second field of view toward the second image sensor through a second through-hole provided in the mounting head, Equipped with, The mounting head is either a first mounting head or a second mounting head. A component mounting apparatus in which, based on component information, the arrangement of the first through-hole and the second through-hole in a plan view is different, and the arrangement of the first reflective optical system and the second reflective optical system in a plan view is also different.

2. In a plan view, the first through-hole and the second through-hole have a horizontally elongated shape and are arranged at different positions in the longitudinal direction. The component mounting apparatus according to claim 1, wherein the arrangement of the first through-hole and the second through-hole differs in the short-side direction in the first mounting head and the second mounting head.

3. The first mounting head has a first through hole and a second through hole arranged to correspond to a vertically elongated component, The component mounting apparatus according to claim 1 or 2, wherein the second mounting head has the first through hole and the second through hole arranged to correspond to a horizontally elongated component.

4. A removable mounting head for holding a component having an alignment recognition mark, A first image sensor is provided on the side of the mounted mounting head and captures a first recognition mark of the component in a first field of view based on a first imaging optical path passing through the mounting head. A second image sensor is provided on the side of the mounted mounting head and captures a second recognition mark of the component in a second field of view based on a second imaging optical path passing through the mounting head. A first reflective optical system that reflects the first imaging optical path from the first field of view toward the first image sensor through a first through-hole provided in the mounting head, A second reflective optical system that reflects the second imaging optical path from the second field of view toward the second image sensor through a second through-hole provided in the mounting head, Equipped with, The mounting head is either a first mounting head or a second mounting head. In the first mounting head and the second mounting head, the arrangement of the first through-hole and the second through-hole in a plan view differs based on the component information. In the first mounting head, the first through hole is formed offset from the second through hole in the first short direction, A component mounting device in which, in the second mounting head, the first through hole is formed offset from the second through hole in a second short direction opposite to the first short direction.

5. The component mounting apparatus according to any one of claims 1 to 4, wherein the component information includes information relating to the external shape of the component.

6. A component mounting apparatus according to any one of claims 1 to 5, further comprising a heater for heating the held component, and a heater block having the first through hole and the second through hole.

7. The component mounting apparatus according to any one of claims 1 to 6, further comprising the first reflective optical system and the second reflective optical system, and a control unit for controlling the change in the relative height between the first image sensor and the second image sensor.

8. The component mounting apparatus according to any one of claims 1 to 7, further comprising a movement adjustment device for moving the first image sensor and the second image sensor laterally relative to the mounting head.

Images