Server Cooling System

Abstract

To provide a server cooling system that can efficiently cool a heating element while achieving compactness.SOLUTION: A server cooling system includes a rack, a plurality of servers arranged vertically in the rack, each having a heating element, and a cooling device that can cool each of the heating elements, and the cooling device includes a plurality of cold plates that are provided to correspond to the heating elements of each server and in contact with the corresponding heating elements, a refrigerant supply path that supplies refrigerant to each of the cold plates, a refrigerant discharge path that discharges the refrigerant that has passed through the cold plate, and a cooling unit that cools the refrigerant that has passed through each refrigerant discharge path and introduces it into the refrigerant supply path.SELECTED DRAWING: Figure 1

Description

Technical Field

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[0001] The present disclosure relates to a server cooling system.

Background Art

[0002] A server has heat generating components such as memories, GPUs, and CPU chips. As a method for cooling the heat generating components in the server, for example, there are a rear door method in which a cooling coil is installed in a rack and air is blown through it for cooling (see, for example, Patent Document 1), and a chip cooling method in which a heat receiving device is installed on a chip (heat generating component) and a refrigerant is supplied to this heat receiving device to cool the chip (see, for example, Patent Document 2), etc.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the rear door method, for example, when cooling a high-load heat generating component exceeding 100 W per chip, it is necessary to flow a large amount of air. For this reason, power consumption increases and cooling efficiency deteriorates. On the other hand, in the chip cooling method, it is necessary to install a cooling device for each heat generating component. For this reason, when the number of heat generating components is large, the number of parts increases and the cooling system cannot be designed compactly.

[0005] The present disclosure has been made to solve the above problems, and an object thereof is to provide a server cooling system that can efficiently cool heat generating components while achieving compactification.

Means for Solving the Problems

[0006] To solve the above problems, the server cooling system according to this disclosure comprises a rack and a plurality of servers arranged vertically within the rack, each having a heat-generating element. Each of the aforementioned heat-generating elements is provided with a cooling device capable of cooling it, Multiple racks are provided, and the multiple racks are arranged to form multiple rows. The cooling device comprises a plurality of cold plates corresponding to the heat-generating elements of each server, a cold plate in contact with the corresponding heat-generating element, a refrigerant supply passage for supplying refrigerant to each cold plate, a refrigerant discharge passage for discharging the refrigerant that has passed through each cold plate, and a cooling unit that cools the refrigerant that has passed through each refrigerant discharge passage and introduces it into the refrigerant supply passage. A distribution channel that connects each of the refrigerant supply paths provided in each of the servers in the multiple racks to a single cooling unit and distributes the refrigerant cooled by the cooling unit to each of the refrigerant supply paths, and a collection channel that connects each of the refrigerant discharge paths provided in each of the servers in the multiple racks to a single cooling unit and collects the refrigerant from each of the refrigerant discharge paths and guides the refrigerant to the single cooling unit, to have Furthermore, the system comprises a duct located above the racks, through which air flows, the duct being located between the rows of racks and extending in the direction of the rows of racks when viewed from above, and the cooling unit being provided within the duct. . Furthermore, the server cooling system according to this disclosure comprises a rack, a plurality of servers arranged vertically within the rack and each having a heating element, and a cooling device capable of cooling each of the heating elements, wherein a plurality of heating elements are provided on each server, the plurality of heating elements form a row extending in the left-right direction perpendicular to the vertical direction, each row of the plurality of heating elements is arranged in the front-back direction perpendicular to the vertical and left-right directions, and the cooling device is provided in a plurality corresponding to the heating elements of each server, and includes a cold plate that contacts the corresponding heating element, and a refrigerant supply that supplies refrigerant to each of the cold plates. The cooling device comprises a path, a refrigerant discharge path for discharging the refrigerant that has passed through each of the cold plates, and a cooling section for cooling the refrigerant that has passed through each of the refrigerant discharge paths and introducing it into the refrigerant supply path, wherein each of the cold plates is in contact with a plurality of heating elements and is arranged along a row of heating elements, the refrigerant supply path is connected only to the longitudinal center of the cold plate on one side in the front-rear direction, the refrigerant discharge path is connected only to the longitudinal center of the cold plate on the other side in the front-rear direction, and the cooling device further comprises a refrigerant connection path connecting the longitudinal centers of adjacent cold plates in the front-rear direction. Furthermore, the server cooling system according to this disclosure comprises a rack, a plurality of servers arranged vertically within the rack and each having a heat-generating element, and a cooling device capable of cooling each of the heat-generating elements, wherein the cooling device is provided in a plurality corresponding to the heat-generating elements of each server and includes a cold plate in contact with the corresponding heat-generating element, a refrigerant supply passage for supplying refrigerant to each of the cold plates, a refrigerant discharge passage for discharging the refrigerant that has passed through each of the cold plates, a cooling unit for cooling the refrigerant that has passed through each of the refrigerant discharge passages and introducing it into the refrigerant supply passage, and the rack The rack is fitted with a fan that draws in air so that it passes through the heating element, and a second cooling unit is provided between the rack and the fan to cool the air that has passed through the heating element, the second cooling unit has a cooling coil through which a second refrigerant that exchanges heat with the air surrounding the second cooling unit flows, the cooling unit is provided above all the servers, the heating elements are provided in multiples on each server, the multiple heating elements include a low-temperature heating element and a high-temperature heating element that generates a relatively larger amount of heat than the low-temperature heating element, and the cold plate is provided only on the high-temperature heating element. [Effects of the Invention]

[0007] The server cooling system described herein can efficiently cool heat-generating elements while achieving a compact design. [Brief explanation of the drawing]

[0008] [Figure 1] This is a diagram illustrating the configuration of a server cooling system according to the first embodiment of this disclosure. [Figure 2] This figure shows the internal structure of a server according to the first embodiment of this disclosure. [Figure 3] This figure shows the internal structure of a server according to a modified example of the first embodiment of the present disclosure. [Figure 4] This is a diagram showing the server cooling system according to the second embodiment of this disclosure, viewed from an oblique angle. [Figure 5] This is a side view of the server cooling system according to the second embodiment of this disclosure. [Figure 6] This is a diagram showing the configuration of a server cooling system according to a first modified example of the second embodiment of the present disclosure. [Figure 7] This is a diagram showing the configuration of a server cooling system according to a second modified example of the second embodiment of the present disclosure. [Figure 8] It is a configuration diagram of a server cooling system according to a third modification of the second embodiment of the present disclosure. [Figure 9] It is an arrangement diagram of a server cooling system according to the third embodiment of the present disclosure. [Figure 10] It is a configuration diagram of a server cooling system according to the third embodiment of the present disclosure. [Figure 11] It is an arrangement diagram of a server cooling system according to a first modification of the third embodiment of the present disclosure. [Figure 12] It is an arrangement diagram of a server cooling system according to a second modification of the third embodiment of the present disclosure.

Mode for Carrying Out the Invention

[0009] <First Embodiment> Hereinafter, the server cooling system 1 according to the embodiment of the present disclosure will be described with reference to FIGS. 1 and 2. The server cooling system 1 is used for, for example, the server 20 in a data center. As shown in FIG. 1, the server cooling system 1 includes a rack 10, a plurality of servers 20, and a cooling device 2.

[0010] (Rack) The rack 10 has a shape extending in the vertical direction D1. The rack 10 can accommodate a plurality of servers 20 arranged in the vertical direction D1. The rack 10 includes a frame 11, a bottom plate 12, side plates 13, and a top plate 14.

[0011] The frame 11 has a rectangular parallelepiped shape. The bottom plate 12 is provided at the bottom of the frame 11 and forms the bottom of the rack 10. The side plates 13 are provided on the side portions of the frame 11. The side plates 13 are provided so as to face each other in a direction perpendicular to the vertical direction D1. The lower ends of the pair of side plates 13 are connected by the bottom plate 12. The top plate 14 is provided at the upper part of the frame 11. The top plate 14 connects the upper ends of the pair of side plates 13.

[0012] Hereinafter, the direction in which a pair of side plates 13 face each other will be referred to as the "left-right direction D2," and the direction perpendicular to the up-down direction D1 and the left-right direction D2 will be referred to as the "front-back direction D3."

[0013] (server) Multiple servers 20 are housed in a rack 10 arranged vertically in a direction D1. In this embodiment, for example, five servers 20 are housed in the rack 10. The number of servers 20 housed in the rack 10 can be changed as appropriate. As shown in Figure 2, each server 20 comprises a casing 21, a substrate 22, and a heating element 23.

[0014] (Casing) The casing 21 is formed in the shape of a rectangular parallelepiped extending horizontally. The casing 21 is fixed to the side plate 13. Multiple ventilation holes 24 are provided on the front and rear surfaces of the casing 21, penetrating the casing 21 (see Figure 1). The substrate 22 and the heating element 23 are housed inside the casing 21.

[0015] (substrate) The substrate 22 is a printed circuit board on which multiple electronic components are mounted. The substrate 22 extends horizontally.

[0016] (heating element) The heating element 23 is an electronic component installed on the substrate 22. Multiple heating elements 23 are provided on the substrate 22. The multiple heating elements 23 include low-temperature heating elements 23a that generate relatively little heat and high-temperature heating elements 23b that generate relatively much heat.

[0017] The low-temperature heating element 23a is, for example, a low-load heating element 23 with a power of 100W or less. Examples of low-temperature heating elements 23a include memory modules and the like. Multiple low-temperature heating elements 23a are provided, for example, on the rear side in the front-to-back direction D3. The multiple low-temperature heating elements 23a are arranged to form a row extending in the left-to-right direction D2. The row of low-temperature heating elements 23a is formed in two rows side by side in the front-to-back direction D3.

[0018] The high-temperature heat-generating element 23b is, for example, a high-load heat-generating element 23 with a power output exceeding 100W. Examples of high-temperature heat-generating elements 23b include chips such as CPUs and GPUs. Multiple high-temperature heat-generating elements 23b are provided, for example, on the front side in the front-to-back direction D3. The multiple high-temperature heat-generating elements 23b are arranged to form a row extending in the left-to-right direction D2. The row of high-temperature heat-generating elements 23b is formed in two rows side by side in the front-to-back direction D3.

[0019] (cooling device) The cooling device 2 is capable of cooling each heat-generating element 23 within the server 20. The cooling device 2 includes a cold plate 30, a refrigerant supply passage 40, a refrigerant connection passage 50, a refrigerant discharge passage 60, and a cooling unit 70.

[0020] (Cold plate) Multiple cold plates 30 are provided to correspond to the heat-generating elements 23 of each server 20. The cold plates 30 make contact with the corresponding heat-generating elements 23.

[0021] Each cold plate 30 is provided so as to be in contact with multiple heating elements 23. The cold plate 30 is formed in the shape of a rectangular plate extending horizontally. The cold plate 30 extends in the left-right direction D2. The cold plate 30 is manufactured, for example, by AM (Additive Manufacturing) technology. A groove (not shown) is formed on the surface of the cold plate 30 that faces the heating elements 23, and the heating elements 23 are fitted into this groove. A refrigerant R1 for cooling the heating elements 23 is sealed inside the cold plate 30.

[0022] Examples of refrigerant R1 include water and fluorinate. Refrigerant R1 is supplied to the cold plate 30 from the refrigerant supply passage 40, and is discharged from the cold plate 30 through the refrigerant discharge passage 60.

[0023] The multiple cold plates 30 include a single-phase cold plate 30a and a boiling cold plate 30b.

[0024] In the single-phase cold plate 30a, the refrigerant R1 flows in a single-phase state. In this embodiment, the single-phase cold plate 30a is located on the refrigerant supply path 40 side of the boiling cold plate 30b in the flow direction of the refrigerant R1. The single-phase cold plates 30a are provided in each row of the low-temperature heating elements 23a. The single-phase cold plates 30a are arranged along the corresponding row of low-temperature heating elements 23a. Within the single-phase cold plate 30a, the refrigerant R1 receives heat from the low-temperature heating elements 23a and flows in a liquid phase state without boiling.

[0025] The boiling cold plate 30b is connected in series with the single-phase cold plate 30a in the direction of flow of the refrigerant R1. The boiling cold plate 30b is provided in each row of the high-temperature heating elements 23b. The boiling cold plate 30b is positioned along the corresponding row of high-temperature heating elements 23b. In the boiling cold plate 30b, the refrigerant R1 boils due to the heat from the high-temperature heating elements 23b. Therefore, in the boiling cold plate 30b, the refrigerant R1 flows in a two-phase state, liquid and gas.

[0026] (Refrigerant supply path) The refrigerant supply passage 40 supplies refrigerant R1 to each cold plate 30. Multiple refrigerant supply passages 40 are provided, arranged in the vertical direction D1. A refrigerant supply passage 40 is provided for each server 20. The refrigerant supply passage 40 comprises a refrigerant supply header 41 and a refrigerant supply branch pipe 42.

[0027] The refrigerant supply header 41 is connected to the cooling unit 70. Refrigerant R1 is supplied to the refrigerant supply header 41 from the cooling unit 70. The refrigerant supply header 41 penetrates the casing 21 of the server 20.

[0028] Multiple refrigerant supply branch pipes 42 are provided in each refrigerant supply header 41. The refrigerant supply branch pipes 42 are connected to multiple cold plates 30 inside the casing 21. The refrigerant supply branch pipes 42 supply refrigerant R1 from the refrigerant supply header 41 to each connected cold plate 30. In this embodiment, the refrigerant supply branch pipes 42 are connected to single-phase cold plates 30a among the multiple cold plates 30. One refrigerant supply branch pipe 42 is provided for each single-phase cold plate 30a. The refrigerant supply branch pipe 42 is connected to the longitudinal center of the corresponding single-phase cold plate 30a.

[0029] (Refrigerant connection path) The refrigerant connection passage 50 connects the longitudinal center of the single-phase cold plate 30a and the longitudinal center of the boiling cold plate 30b. In this embodiment, the refrigerant connection passage 50 guides the refrigerant R1 from the single-phase cold plate 30a to the boiling cold plate 30b.

[0030] (refrigerant discharge path) The refrigerant discharge passage 60 discharges the refrigerant R1 that has passed through each cold plate 30. Multiple refrigerant discharge passages 60 are provided in a row in the vertical direction D1. A refrigerant discharge passage 60 is provided for each server 20. The refrigerant discharge passage 60 comprises a refrigerant discharge header 61 and a refrigerant discharge branch pipe 62.

[0031] The refrigerant discharge header 61 is connected to the cooling unit 70. The refrigerant discharge header 61 penetrates the casing 21 of the server 20.

[0032] Multiple refrigerant discharge branch pipes 62 are provided in each refrigerant discharge header 61. The refrigerant discharge branch pipes 62 are connected to multiple cold plates 30 in the casing 21. The refrigerant discharge branch pipes 62 discharge refrigerant R1 from each connected cold plate 30 to the refrigerant discharge header 61. The refrigerant R1 discharged to the refrigerant discharge header 61 is guided to the cooling unit 70. In this embodiment, the refrigerant discharge branch pipes 62 are connected to the boiling cold plates 30b among the multiple cold plates 30. One refrigerant discharge branch pipe 62 is provided for each boiling cold plate 30b. The refrigerant discharge branch pipe 62 is connected to the longitudinal center of the corresponding boiling cold plate 30b. For one server 20, it is desirable that the connection port between the refrigerant discharge branch pipe 62 and the cold plate 30 be located above the connection port between the refrigerant supply branch pipe 42 and the cold plate 30.

[0033] (cooling section) The cooling unit 70 cools the refrigerant R1 that has passed through each refrigerant discharge passage 60 and introduces the cooled refrigerant R1 into each refrigerant supply passage 40. The cooling unit 70 is, for example, a vertically mounted cooling water circulation device (CDU: Coolant Distribution Unit). From the viewpoint of reducing the pressure loss of the refrigerant R1 in the cooling cycle of the cooling device 2, it is desirable to position the cooling unit 70 close to the rack 10. The cooling unit 70 includes a cooling unit casing 71, a heat exchanger 72, a first main header 73, a first connecting pipe 74, a second main header 75, a second connecting pipe 76, and a pump 77.

[0034] The cooling section casing 71 houses a heat exchanger 72, a first main header 73, a first connecting pipe 74, a second main header 75, a second connecting pipe 76, and a pump 77. In this embodiment, the cooling section casing 71 is formed in the shape of a rectangular parallelepiped extending in the vertical direction D1.

[0035] The heat exchanger 72 is a condenser that cools and condenses the refrigerant R1 from each refrigerant discharge passage 60. Cooling water W is supplied to the heat exchanger 72 in this embodiment. The heat exchanger 72 cools the refrigerant R1 by performing heat exchange with the cooling water W. The heat exchanger 72 is located in the upper part of the cooling section casing 71.

[0036] The first main header 73 is connected to the heat exchanger 72. Multiple refrigerant supply lines 40 are connected to the first main header 73. The first main header 73 guides the refrigerant R1 cooled by the heat exchanger 72 to each refrigerant supply line 40. The first main header 73 extends in the vertical direction D1. In this embodiment, the lower end of the first main header 73 is connected to the heat exchanger 72 by a first connecting pipe 74.

[0037] The second main header 75 is connected to the heat exchanger 72. Multiple refrigerant discharge passages 60 are connected to the second main header 75. The second main header 75 guides the refrigerant R1, which is heated as it passes through each cold plate 30 and discharged through each refrigerant discharge passage 60, to the heat exchanger 72. The second main header 75 extends in the vertical direction D1. In this embodiment, the upper end of the second main header 75 is connected to the heat exchanger 72 by a second connecting pipe 76.

[0038] Pump 77 pumps the refrigerant R1, cooled by the heat exchanger 72, towards each refrigerant supply passage 40. Pump 77 is located in the lower part of the cooling section casing 71 and is installed on the first connecting pipe 74.

[0039] (Refrigerant circulation) Next, we will explain the circulation of refrigerant R1 within the server cooling system 1. First, the liquid phase refrigerant R1 in the cooling unit 70 is pumped by the pump 77 and distributed to each refrigerant supply passage 40 by the first main header 73. The refrigerant R1 is further distributed to each refrigerant supply branch pipe 42 by the refrigerant supply header 41 and then to the connected cold plate 30. At the cold plate 30, the refrigerant R1 exchanges heat with the heating element 23. As a result, the heating element 23 is cooled and the refrigerant R1 is heated.

[0040] In this embodiment, the refrigerant R1 from the refrigerant supply branch pipe 42 is first supplied to the single-phase cold plate 30a. At the single-phase cold plate 30a, the refrigerant R1, while still in the liquid phase, exchanges heat with the low-temperature heating element 23a. As a result, the low-temperature heating element 23a is cooled and the refrigerant R1 is heated.

[0041] Subsequently, the refrigerant R1 is supplied to the downstream boiling cold plate 30b through the refrigerant connection passage 50. In the boiling cold plate 30b, the refrigerant R1 exchanges heat with the high-temperature heating element 23b. As a result, the high-temperature heating element 23b is cooled and the refrigerant R1 is heated. At this time, some of the refrigerant R1 in the boiling cold plate 30b boils and evaporates due to the heat of the high-temperature heating element 23b. Therefore, in the boiling cold plate 30b, the refrigerant R1 exists in two phases: liquid and gas.

[0042] The refrigerant R1 that has passed through the cold plate 30 is returned to the cooling unit 70 through the refrigerant discharge passage 60. The refrigerant R1 discharged through each refrigerant discharge passage 60 is collected in the second main header 75. The refrigerant R1 in the second main header 75 is led to the heat exchanger 72 through the second connecting pipe 76.

[0043] In the heat exchanger 72, heat exchange takes place between the refrigerant R1 and the cooling water W. This cools the refrigerant R1 heated on the cold plate 30. As a result, the gaseous refrigerant R1 condenses into a liquid phase. The liquid phase refrigerant R1 in the heat exchanger 72 is then led back to the first main header 73 by the first connecting pipe 74 and distributed to each refrigerant supply path 40. In this way, the refrigerant R1 circulates within the server cooling system 1.

[0044] (Effects and Benefits) The server cooling system 1 of this embodiment provides the following effects. In this embodiment, the server cooling system 1 includes a cooling device 2 capable of cooling each heat-generating element 23. The cooling device 2 includes a cold plate 30, a refrigerant supply passage 40, a refrigerant discharge passage 60, and a cooling unit 70. Multiple cold plates 30 are provided to correspond to the heat-generating elements 23 of each server 20 and are in contact with the corresponding heat-generating elements 23. The refrigerant supply passage 40 supplies refrigerant R1 to each cold plate 30. The refrigerant discharge passage 60 discharges the refrigerant R1 that has passed through each cold plate 30. The cooling unit 70 cools the refrigerant R1 that has passed through each refrigerant discharge passage 60 and introduces it into the refrigerant supply passage 40.

[0045] The refrigerant R1 exchanges heat with the heating element 23 within each cold plate 30, absorbing heat from the heating element 23. As a result, the heating element 23 is cooled and the refrigerant R1 is heated. In this embodiment, the heated refrigerant R1 is guided to the cooling unit 70 through each refrigerant discharge passage 60. The refrigerant R1 is cooled by the cooling unit 70 and supplied back to each cold plate 30 through the refrigerant supply passage 40. In this way, the refrigerant R1 heated in each cold plate 30 is cooled collectively in the cooling unit 70. Thus, according to this embodiment, the heating element 23 can be cooled efficiently while achieving compactness.

[0046] In this embodiment, each cold plate 30 is provided so as to be in contact with a plurality of heating elements 23. The plurality of cold plates 30 include a single-phase cold plate 30a through which the refrigerant R1 flows in a single-phase state, and a boiling cold plate 30b through which the refrigerant R1 boils and flows in a two-phase state of liquid and gaseous phases. The boiling cold plate 30b is connected in series with the single-phase cold plate 30a in the direction of flow of the refrigerant R1.

[0047] With the above configuration, the cold plate 30 is in contact with multiple heat-generating elements 23. Therefore, the number of cold plates 30 can be reduced compared to the case where one cold plate 30 is provided for each heat-generating element 23. Thus, the number of parts in the server cooling system 1 can be reduced. Furthermore, the multiple cold plates 30 include a single-phase cold plate 30a and a boiling cold plate 30b connected in series. This allows the server cooling system 1 to perform heat exchange between the refrigerant R1 and the heat-generating elements 23 in stages. As a result, the server cooling system 1 can cascade the refrigerant R1 according to the arrangement of the heat-generating elements 23 to be cooled. Thus, the cooling efficiency of the server cooling system 1 can be further improved.

[0048] In this embodiment, the single-phase cold plate 30a is located on the refrigerant supply path 40 side of the boiling cold plate 30b, and the refrigerant R1 flows through it in a liquid phase state.

[0049] In the above configuration, within the single-phase cold plate 30a, the refrigerant R1 exchanges heat with the heating element 23 while in the liquid phase. Subsequently, the refrigerant R1 passes through the single-phase cold plate 30a and is supplied to the boiling cold plate 30b. Within the boiling cold plate 30b, the refrigerant R1 receives heat from the heating element 23, boils, and evaporates. As a result, the heating element 23 is strongly cooled in the boiling cold plate 30b because the heat of vaporization of the refrigerant R1 is removed from the heating element 23. In this embodiment, a single-phase cold plate 30a is provided on low-temperature heat-generating elements 23a such as memory modules, and a boiling cold plate 30b is provided on high-temperature heat-generating elements 23b such as CPU and GPU chips. Therefore, after cooling the low-temperature heat-generating elements 23a with a liquid-phase refrigerant R1, the high-temperature heat-generating elements 23b can be cooled by vaporization of the refrigerant R1. Thus, the server cooling system 1 can sufficiently and efficiently cool the heat-generating elements 23 with different heat output.

[0050] (Modification of the first embodiment) Next, a modified server cooling system 1A of the first embodiment will be described with reference to Figure 3. As shown in Figure 3, in the modified cooling device 2A, multiple low-temperature heating elements 23a are provided, for example, on the front side D3. Multiple high-temperature heating elements 23b are provided, for example, on the rear side D3. Therefore, of the multiple cold plates 30, the single-phase cold plate 30a is provided on the front side D3, and the boiling cold plate 30b is provided on the rear side D3.

[0051] A refrigerant supply passage 40 is connected to the boiling cold plate 30b. In the boiling cold plate 30b, the refrigerant R1 supplied from the refrigerant supply passage 40 boils due to the heat from the high-temperature heating element 23b. Therefore, in the boiling cold plate 30b, the refrigerant R1 flows in a two-phase state, liquid and gas. The liquid phase refrigerant R1 is completely converted to the gas phase in the boiling cold plate 30b.

[0052] In this modified example, the single-phase cold plate 30a is located on the refrigerant discharge passage 60 side of the boiling cold plate 30b in the flow direction of the refrigerant R1. The refrigerant discharge passage 60 is connected to the single-phase cold plate 30a. The single-phase cold plate 30a is supplied with refrigerant R1 that has passed through the boiling cold plate 30b and completely vaporized. Within the single-phase cold plate 30a, the refrigerant R1 flows in the gaseous phase.

[0053] According to the modified server cooling system 1A, the following effects are achieved. In this modified configuration, the single-phase cold plate 30a is located on the refrigerant discharge path 60 side of the boiling cold plate 30b, and the refrigerant R1 flows through it in a gaseous state.

[0054] In the above configuration, within the boiling cold plate 30b, the refrigerant R1 receives heat from the heating element 23, boils, and evaporates. Subsequently, the gaseous refrigerant R1 is supplied to the single-phase cold plate 30a. As a result, the gaseous refrigerant R1 flows within the single-phase cold plate 30a. Consequently, the refrigerant R1 flows at a high velocity within the single-phase cold plate 30a. Therefore, the low-temperature heating element 23a connected to the single-phase cold plate 30a is cooled even more efficiently.

[0055] <Second Embodiment> Hereinafter, the server cooling system 201 according to the second embodiment of this disclosure will be described with reference to Figures 4 and 5. For configurations similar to those of the first embodiment described above, the same names and reference numerals will be used, and the explanation will be omitted as appropriate.

[0056] (Server cooling system) As shown in Figures 4 and 5, the server cooling system 201 of this embodiment comprises a rack 10, a plurality of servers 20, and a cooling device 202. In this embodiment, a plurality of servers 20 (for example, four) are provided in the upper part of the rack 10, leaving space between them. Each server 20 has a plurality of heating elements 23. The plurality of heating elements 23 include a low-temperature heating element 23a and a high-temperature heating element 23b. Note that some of the components of the cooling device 202 are omitted in Figure 4.

[0057] (cooling device) The cooling device 202 includes a cold plate 230, a refrigerant supply passage 240, a refrigerant discharge passage 260, a cooling unit 270, a fan casing 203, a fan 204, a second cooling unit 280, a first connection header 205, and a second connection header 206.

[0058] (Cold plate) Multiple cold plates 230 are provided to correspond to the heating elements 23 of each server 20. The cold plates 230 are in contact with the corresponding heating elements 23. In this embodiment, the cold plates 230 are provided on the high-temperature heating element 23b of the heating elements 23.

[0059] (Refrigerant supply path) A refrigerant supply passage 240 is provided for each server 20. The refrigerant supply passage 240 is connected to each corresponding cold plate 230, and the cooling unit 270 supplies refrigerant R1 to each cold plate 230. In this embodiment, the refrigerant supply passage 240 extends horizontally.

[0060] (refrigerant discharge path) A refrigerant discharge passage 260 is provided for each server 20. The refrigerant discharge passage 260 is connected to each corresponding cold plate 230 and discharges the refrigerant R1 that has passed through each cold plate 230 to the cooling unit 270. Furthermore, for one server 20, it is desirable that the connection port between the refrigerant discharge passage 260 and the cold plate 230 be located above the connection port between the refrigerant supply passage 240 and the cold plate 230.

[0061] (cooling section) The cooling unit 270 cools the refrigerant R1 that has passed through each refrigerant discharge passage 260 and introduces it into the refrigerant supply passage 240. The detailed configuration of the cooling unit 270 will be described later.

[0062] (Fan casing) The fan casing 203 is located behind the rack 10. The fan casing 203 is formed in a rectangular parallelepiped shape extending in the vertical direction D1 and has openings on both sides in the front-to-back direction D3.

[0063] (fan) Multiple fans 204 are arranged in a vertical direction D1 within the fan casing 203. The fans 204 are attached to the rack 10. At least one fan 204 is provided for each server 20, and is positioned to face the corresponding server 20 in the front-to-back direction D3. In this embodiment, the fans 204 are also positioned in a vertical direction D1 that overlaps with the space in the upper part of the rack 10 where no servers 20 are located, in the front-to-back direction D3. The fans 204 draw in air A so that it passes through the heat-generating element 23 inside the server 20.

[0064] (Second cooling section) The second cooling unit 280 is located between the rack 10 and the fan 204. The second cooling unit 280 cools the air A that has passed through the heat-generating element 23. The second cooling unit 280 has a cooling coil 281.

[0065] (Cooling coil) The cooling coil 281 is installed in the front opening of the fan casing 203. The cooling coil 281 extends in the vertical direction D1 and the horizontal direction D2. The cooling coil 281 is, for example, a fin-tube type cooling coil. A second refrigerant R2 flows through the cooling coil 281, which exchanges heat with the surrounding air A of the second cooling unit 280. Examples of the second refrigerant R2 include water.

[0066] (Cooling unit configuration) The cooling unit 270 is provided on the cooling coil 281 and cools the refrigerant R1 by exchanging heat between the refrigerant R1 and the second refrigerant R2 flowing through the cooling coil 281. The cooling unit 270 has a jacket 271.

[0067] (jacket) Jacket 271 is positioned at a vertical position D1 that overlaps with the space in the upper part of rack 10 where no servers 20 are located, in the front-to-back direction D3. Part of the cooling coil 281 is located inside jacket 271. Each refrigerant supply passage 240 and each refrigerant discharge passage 260 are connected to jacket 271 via the first connection header 205 and the second connection header 206, which will be described later. Refrigerant R1 discharged through the refrigerant discharge passage 260 is supplied into jacket 271. Heat exchange occurs between refrigerant R1 and the second refrigerant R2 in the cooling coil 281 inside jacket 271, cooling refrigerant R1. The refrigerant R1 cooled inside jacket 271 is supplied to each server 20 from each refrigerant supply passage 240.

[0068] (First connection header) The first connection header 205 connects the jacket 271 to the multiple refrigerant supply lines 240. The first connection header 205 guides the refrigerant R1 cooled within the jacket 271 to each refrigerant supply line 240. The first connection header 205 extends in the vertical direction D1.

[0069] (Second connection header) The second connection header 206 connects the jacket 271 to the multiple refrigerant discharge passages 260. The second connection header 206 guides the refrigerant R1, which is heated as it passes through each cold plate 30 and discharged through each refrigerant discharge passage 260, into the jacket 271. The second connection header 206 extends in the vertical direction D1.

[0070] (Refrigerant circulation) Next, we will explain the circulation of refrigerant R1 within the server cooling system 201. First, the refrigerant R1 in the jacket 271 is distributed to each refrigerant supply path 240 by the first connection header 205. The refrigerant R1 is supplied to the cold plate 230 to which each refrigerant supply path 240 is connected. At the cold plate 230, the refrigerant R1 exchanges heat with the heating element 23. As a result, the heating element 23 is cooled and the refrigerant R1 is heated.

[0071] The refrigerant R1 that has passed through each cold plate 230 is collected in the second connection header 206 via the refrigerant discharge passage 260. The refrigerant R1 is then returned to the jacket 271.

[0072] Within the jacket 271, heat exchange occurs between the refrigerant R1 and the secondary refrigerant R2. This cools the refrigerant R1 heated on the cold plate 230. The liquid phase refrigerant R1 within the jacket 271 is then distributed again to each refrigerant supply passage 240. In this way, the refrigerant R1 circulates within the server cooling system 201.

[0073] The refrigerant R1 may boil and vaporize in the cold plate 230, condense in the jacket 271, and circulate within the server cooling system 201 cycle in two phases: liquid and gas. In this case, the rising flow of the gaseous refrigerant R1 generated in the cold plate 230 causes the refrigerant R1 to circulate naturally within the server cooling system 201. Alternatively, the refrigerant R1 may circulate within the server cooling system 201 cycle in a single phase without boiling in the cold plate 230. In this case, a pump (not shown) for pressurizing the refrigerant R1 may be installed in the server cooling system 201, for example, in the first connection header 205, to forcibly circulate the refrigerant R1.

[0074] (Effects and Benefits) The server cooling system 201 of this embodiment provides the following effects. In this embodiment, the cooling device 202 includes a fan 204 and a second cooling unit 280. The fan 204 is attached to the rack 10 and draws in air A so that it passes through the heat-generating element 23. The second cooling unit 280 is provided between the rack 10 and the fan 204 and cools the air A that has passed through the heat-generating element 23. The second cooling unit 280 has a cooling coil 281 through which a second refrigerant R2, which exchanges heat with the surrounding air A, flows.

[0075] According to the above configuration, the server cooling system 201 can draw in air A with the fan 204 and pass the air A through to the heat-generating element 23. As a result, the server cooling system 201 can cool the heat-generating element 23 with both the refrigerant R1 in the cold plate 230 and the air A drawn in by the fan 204.

[0076] For example, as in this embodiment, by installing the cold plate 230 on the high-temperature heating element 23b of the heating element 23, the server cooling system 201 can cool the high-temperature heating element 23b with both the refrigerant R1 and the air A drawn in by the fan 204. Therefore, the server cooling system 201 can cool both the low-temperature heating element 23a and the high-temperature heating element 23b with an airflow setting that is sufficient to cool only the low-temperature heating element 23a of the heating element 23. Thus, the server cooling system 201 can reduce the power consumption required to drive the fan 204. Furthermore, the noise of the fan 204 is also reduced, improving the working environment.

[0077] In this embodiment, the cooling unit 270 is provided on the cooling coil 281 and performs heat exchange between the refrigerant R1 and the second refrigerant R2.

[0078] According to the above configuration, the refrigerant R1, which is heated by heat exchange with the heating element 23, is cooled by the second refrigerant R2 in the cooling coil 281. Therefore, there is no need to provide a separate device for cooling the heated refrigerant R1. Thus, the server cooling system 201 can be miniaturized and space saved.

[0079] In this embodiment, the case in which the refrigerant supply passage 240 extends horizontally has been described, but it is not limited to this. However, in the case in this embodiment, where the refrigerant R1 circulates naturally within the cycle of the server cooling system 201 by convection, the refrigerant supply passage 240 must be formed in a shape that extends horizontally, or in a downward sloping shape that extends downward as it approaches the front side in the front-rear direction D3. However, this does not apply if the refrigerant R1 is forcibly circulated by, for example, a pump (not shown), and even if the refrigerant supply passage 240 is formed in an upward sloping shape that extends, for example, toward the front side D3 in the front-rear direction and therefore located upward, the refrigerant R1 can circulate within the cycle of the server cooling system 201.

[0080] (First modified example of the second embodiment) Next, a server cooling system 201A according to the first modified example of the second embodiment will be described with reference to Figure 6. As shown in Figure 6, in this modified example, similar to the first embodiment, multiple servers 20 are arranged in the rack 10 at approximately equal intervals in the vertical direction D1. For example, five servers 20 are arranged. In each of the modified examples described later, the multiple servers 20 are arranged in the same manner as in the first embodiment. In the cooling device 202A of this modified example, the cooling unit 270 is located above the fan 204. The cooling unit 270 has a jacket 271 and a cooling coil (not shown) provided inside the jacket 271. Refrigerant R1 is supplied into the jacket 271 from each refrigerant discharge passage 260 via a second connection header 206. Inside the jacket 271, the supplied refrigerant R1 is cooled by an internal cooling coil (not shown) and the air A outside the jacket 271.

[0081] According to the modified server cooling system 201A, the following effects are achieved. In this modified example, the cooling unit 270 is located above the fan 204.

[0082] With the above configuration, the cooling unit 270 does not obstruct the airflow A from the fan 204. Therefore, the server cooling system 201A can more efficiently air-cool the heat-generating element 23. Furthermore, the noise generated by the operation of the fan 204 is reduced, further improving the working environment.

[0083] (Second modified example of the second embodiment) Next, a server cooling system 201B according to a second modified example of the second embodiment will be described with reference to Figure 7. As shown in Figure 7, in this modified example, the cooling device 202B further includes a second fan 207.

[0084] The second fan 207 is located on the top plate 14 of the rack 10. The second fan 207 expels the air A inside the rack 10 upwards.

[0085] The cooling unit 270 is located within the rack 10 and is positioned above all the servers 20 within the rack 10. Furthermore, the cooling unit 270 is positioned below the second fan 207.

[0086] According to the modified server cooling system 201B, the following effects are achieved. In this modified example, the cooling device 202B has a second fan 207. The second fan 207 is mounted on the top plate 14 of the rack 10 and expels the air A inside the rack 10 upwards. The cooling unit 270 is located above all the servers 20 inside the rack 10 and below the second fan 207.

[0087] According to the above configuration, the server cooling system 201B can send air A to the jacket 271 of the cooling unit 270 by the second fan 207. The refrigerant R1 inside the jacket 271 is cooled by the air A blown by the second fan 207. Furthermore, since the cooling unit 270 and the second fan 207 are mounted on the rack 10, the cooling device 202B can be made more compact. Thus, the server cooling system 201B can be made smaller and more space-saving.

[0088] (Third modified example of the second embodiment) Next, a server cooling system 201C according to a third modified example of the second embodiment will be described with reference to Figure 8. As shown in Figure 8, in this modified example, the cooling unit 270 is located within the rack 10 and above all the servers 20 within the rack 10. The cooling unit 270 is arranged to extend in the front-rear direction D3. The cooling unit 270 is positioned at an angle. Therefore, the front end of the cooling unit 270 is located above the rear end of the cooling unit 270. A first connection header 205 is connected to the rear end of the cooling unit 270, and each second connection header 206 is connected to the front end of the cooling unit 270. The cooling unit 270 is, for example, a plate-type heat exchanger.

[0089] The cooling device 202C further comprises a supply communication pipe 208 and a discharge communication pipe 209. The supply communication pipe 208 connects the cooling unit 270 to the cooling coil 281 of the second cooling unit 280. The supply communication pipe 208 communicates with the cooling coil 281 of the second cooling unit 280 and guides the second refrigerant R2 to the cooling unit 270. The discharge communication pipe 209 is provided in the cooling section 270. The discharge communication pipe 209 communicates with the cooling section 270 and discharges the second refrigerant R2 from the cooling section 270 to the outside of the cooling section 270.

[0090] According to the modified server cooling system 201C, the following effects are achieved. In this modified example, the cooling unit 270 is located above all the servers 20 in the rack 10. The cooling device 202C has a supply communication pipe 208 and a discharge communication pipe 209. The supply communication pipe 208 communicates with the second cooling unit 280 and guides the second refrigerant R2 to the cooling unit 270. The discharge communication pipe 209 communicates with the cooling unit 270 and discharges the second refrigerant R2 from the cooling unit 270.

[0091] According to the above configuration, the cooling unit 270 is located above all servers 20. Therefore, the dead space above the servers 20 can be utilized, and the cooling device 202C can be made more compact. Furthermore, the server cooling system 201C can guide the second refrigerant R2 from the cooling coil 281 to the cooling unit 270. This allows the refrigerant R1 to be cooled by heat exchange with the second refrigerant R2. Therefore, the configuration of the cooling unit 270 can be simplified. Consequently, the cooling device 202C can be designed to be even more compact. Thus, this modified version makes it possible to miniaturize the server cooling system 201C and save space.

[0092] In this modified example, the cooling unit 270 is provided inside the rack 10, but this is not limited to that configuration. The cooling unit 270 may be provided outside the rack 10.

[0093] <Third Embodiment> Hereinafter, the server cooling system 301 according to the third embodiment of this disclosure will be described with reference to Figures 9 and 10. For configurations similar to those of the first embodiment described above, the same names and reference numerals will be used, and descriptions will be omitted as appropriate.

[0094] As shown in Figures 9 and 10, the server cooling system 301 of this embodiment comprises a rack 10, a duct 303, a plurality of servers 20, and a cooling device 302.

[0095] (rack) Multiple racks 10 are installed in the room, forming multiple rows.

[0096] (duct) Duct 303 is located above rack 10. Duct 303 is located between rows of rack 10 and extends in a single line along the horizontal plane. Air A flows inside duct 303.

[0097] (cooling device) The cooling device 302 includes a cold plate 330, a refrigerant supply passage 340, a refrigerant discharge passage 360, a cooling section 370, a distribution passage 380, a collection passage 390, a third refrigerant supply passage 304, and a third refrigerant discharge passage 305.

[0098] (Cold plate) Multiple cold plates 330 are provided to correspond to the heat-generating elements 23 of each server 20. The cold plates 330 are in contact with the corresponding heat-generating elements 23.

[0099] (Refrigerant supply path) A refrigerant supply line 340 is provided for each server 20. The refrigerant supply line 340 is connected to each corresponding cold plate 330, and the cooling unit 370 supplies refrigerant R1 to each cold plate 330.

[0100] (refrigerant discharge path) A refrigerant discharge passage 360 ​​is provided for each server 20. The refrigerant discharge passage 360 ​​is connected to each corresponding cold plate 330 and discharges the refrigerant R1 that has passed through each cold plate 330 to the cooling unit 370. Furthermore, for one server 20, it is desirable that the connection port between the refrigerant discharge passage 360 ​​and the cold plate 330 be located above the connection port between the refrigerant supply passage 340 and the cold plate 330.

[0101] (cooling section) Multiple cooling units 370 are provided within the duct 303. The number of cooling units 370 is less than the number of racks 10. The cooling units 370 cool the heat generated by the servers 20 in the multiple racks 10.

[0102] (Distribution channel) The distribution channel 380 connects each refrigerant supply channel 340, provided in each of the servers 20 within the multiple racks 10, to a single cooling unit 370. The distribution channel 380 distributes the refrigerant R1 cooled in the cooling unit 370 to each refrigerant supply channel 340. The distribution channel 380 has a first distribution line 381, a second distribution line 382, ​​and a third distribution line 383.

[0103] A first distribution line 381 is provided for each rack 10. Each refrigerant supply path 340 extending from each server 20 in the corresponding rack 10 is connected to the first distribution line 381. In this embodiment, the first distribution line 381 extends in the vertical direction D1.

[0104] The second distribution line 382 connects multiple first distribution lines 381. The third distribution line 383 connects the second distribution line 382 and the cooling unit 370.

[0105] (collection channel) The collective flow path 390 connects each refrigerant discharge path 360 provided in each of the servers 20 in the multiple racks 10 to a single cooling unit 370. The collective flow path 390 collects refrigerant R1 from each refrigerant discharge path 360 and guides the refrigerant R1 to the single cooling unit 370. The collective flow path 390 has a first collective line 391, a second collective line 392, and a third collective line 393.

[0106] A first aggregation line 391 is provided for each rack 10. Each refrigerant discharge path 360 extending from each server 20 in the corresponding rack 10 is connected to the first aggregation line 391. In this embodiment, the first aggregation line 391 extends in the vertical direction D1.

[0107] The second junction line 392 connects multiple first junction lines 391. The third manifold line 393 connects the second manifold line 392 and the cooling unit 370.

[0108] (Third refrigerant supply path) The third refrigerant supply passage 304 supplies a third refrigerant R3 to each cooling unit 370 to cool the refrigerant R1. The third refrigerant supply passage 304 is located inside the duct 303. The third refrigerant supply passage 304 extends in the direction of the extension of the duct 303.

[0109] (Third refrigerant supply path) The third refrigerant discharge passage 305 discharges the third refrigerant R3 from each cooling unit 370. The third refrigerant discharge passage 305 is located inside the duct 303. The third refrigerant discharge passage 305 extends in the direction of the extension of the duct 303.

[0110] (Refrigerant circulation) Next, we will explain the circulation of the refrigerant R1 within the server cooling system 301. First, the refrigerant R1 from the cooling unit 370 is distributed to each refrigerant supply passage 340 by the distribution channel 380. The refrigerant R1 is supplied to the cold plate 330 to which each refrigerant supply passage 340 is connected. At the cold plate 330, the refrigerant R1 exchanges heat with the heating element 23. As a result, the heating element 23 is cooled and the refrigerant R1 is heated.

[0111] The refrigerant R1 that has passed through each cold plate 330 is collected in the refrigerant discharge passage 260 and then in the collection passage 390. The refrigerant R1 is then returned to the cooling section 370.

[0112] In the cooling unit 370, heat exchange occurs between the refrigerant R1 and the third refrigerant R3. This cools the refrigerant R1 heated on the cold plate 230. The liquid phase refrigerant R1 in the cooling unit 370 is then distributed again to each refrigerant supply path 340 through the distribution channel 380. In this way, the refrigerant R1 circulates within the server cooling system 301.

[0113] (Effects and Benefits) The server cooling system 301 of this embodiment provides the following effects. In this embodiment, multiple racks 10 are provided. The cooling device 302 has a distribution channel 380 and a collection channel 390. The distribution channel 380 connects each refrigerant supply channel 340 provided in each of the servers 20 in the multiple racks 10 to a single cooling unit 370. The distribution channel 380 distributes the refrigerant R1 cooled in the cooling unit 370 to each refrigerant supply channel 340. The collection channel 390 connects each refrigerant discharge channel 360 provided in each of the servers 20 in the multiple racks 10 to the single cooling unit 370. The collection channel 390 collects the refrigerant R1 from each refrigerant discharge channel 360 and guides the refrigerant R1 to the single cooling unit 370.

[0114] According to the above configuration, the server cooling system 301 can cool the heat generated by servers 20 housed in multiple racks 10 together using a single cooling unit 370. Therefore, the cooling efficiency of the server cooling system 301 can be improved.

[0115] In this embodiment, the server cooling system 301 further includes a duct 303. The duct 303 is located above the rack 10, and air A flows through it. The cooling unit 370 is provided inside the duct 303.

[0116] With the above configuration, even if refrigerant R1 leaks from the cooling unit 370, refrigerant R1 will not flow into the server 20. Therefore, the server cooling system 301 can protect the server 20 from refrigerant R1 leakage.

[0117] In this embodiment, the cooling device 302 has a third refrigerant supply passage 304 and a third refrigerant discharge passage 305. The third refrigerant supply passage 304 supplies a third refrigerant R3 to the cooling unit 370 to cool the refrigerant R1. The third refrigerant discharge passage 305 discharges the third refrigerant R3 from the cooling unit 370.

[0118] According to the above configuration, the cooling unit 370 can cool the refrigerant R1 not only by the air A flowing through the duct 303, but also by heat exchange between the third refrigerant R3 and the refrigerant R1. Therefore, the server cooling system 301 can effectively cool the refrigerant R1. Furthermore, according to this embodiment, the cooling unit 370 does not obstruct the passage of people, thus improving the working environment.

[0119] (First modified example of the third embodiment) Next, a server cooling system 301A according to the first modified example of the third embodiment will be described with reference to Figure 11. As shown in Figure 11, in the cooling device 302A of this modified example, the cooling unit 370 cools the refrigerant R1 with air A flowing through the duct 303. The cooling unit 370 in this modified example is, for example, a fin-tube type heat exchanger.

[0120] As a result, the refrigerant R1 is cooled only by the air A flowing through the duct 303. This allows for a simplification of the cooling unit 370. Furthermore, compared to the rear-door type cooling system in which a cooling fan is installed horizontally on the rack 10, the noise during airflow is reduced, improving the working environment.

[0121] (Second modified example of the third embodiment) Next, a server cooling system 301B according to a second modified example of the third embodiment will be described with reference to Figure 12. As shown in Figure 12, in this modified cooling device 302B, the cooling unit 370 is provided between the racks 10. An example of the cooling unit 370 is a vertically mounted CDU.

[0122] This allows for efficient placement of the rack 10 and the cooling unit 370. As a result, the layout of the server cooling system 301B is improved, and the working environment is enhanced.

[0123] (Other embodiments) Although embodiments of this disclosure have been described in detail above with reference to the drawings, the specific configuration is not limited to these embodiments and may include design changes and the like that do not depart from the gist of this disclosure.

[0124] <Note> The server cooling systems 1, 1A, 201, 201A, 201B, 201C, 301, 301A, and 301B described in each embodiment can be understood, for example, as follows.

[0125] (1) The server cooling system 1, 1A, 201, 201A, 201B, 201C, 301, 301A, 301B according to the first embodiment comprises a rack 10, a plurality of servers 20 housed in the rack 10 arranged in the vertical direction D1 and each having a heat-generating element 23, and a cooling device 2, 2A, 202, 202A, 202B, 202C, 302, 302A, 302B capable of cooling each of the heat-generating elements 23, wherein the cooling device 2, 2A, 202, 202A, 202B, 202C, 302, 302A, 302B cools each of the heat-generating elements 23 of the server 20 The system includes a plurality of cold plates 30, 230, and 330 provided to correspond to the body 23 and in contact with the corresponding heating element 23; refrigerant supply passages 40, 240, and 340 that supply refrigerant R1 to each of the cold plates 30, 230, and 330, respectively; refrigerant discharge passages 60, 260, and 360 that discharge the refrigerant R1 that has passed through each of the cold plates 30, 230, and 330; and cooling sections 70, 270, and 370 that cool the refrigerant R1 that has passed through each of the refrigerant discharge passages 60, 260, and 360 and introduce it into the refrigerant supply passages 40, 240, and 340.

[0126] The refrigerant R1 exchanges heat with the heating element 23 within each cold plate 30, 230, and 330, absorbing heat from the heating element 23. As a result, the heating element 23 is cooled and the refrigerant R1 is heated. In this embodiment, the heated refrigerant R1 is guided to the cooling sections 70, 270, and 370 through the refrigerant discharge passages 60, 260, and 360. The refrigerant R1 is cooled by the cooling sections 70, 270, and 370 and supplied back to each cold plate 30, 230, and 330 through the refrigerant supply passages 40, 240, and 340. In this way, the refrigerant R1 heated in each cold plate 30, 230, and 330 is cooled together in the cooling sections 70, 270, and 370.

[0127] (2) The server cooling system 1,1A of the second embodiment is the server cooling system 1,1A of (1), wherein each of the cold plates 30 is provided in contact with a plurality of the heating elements 23, and the plurality of cold plates 30 may include a single-phase cold plate 30a through which the refrigerant R1 flows in a single-phase state, and a boiling cold plate 30b connected in series with the single-phase cold plate 30a in the direction of flow of the refrigerant R1, through which the refrigerant R1 boils and flows in a two-phase state of liquid and gaseous phases.

[0128] With the above configuration, the cold plate 30 is in contact with multiple heating elements 23. Therefore, the number of cold plates 30 can be reduced compared to the case where one cold plate 30 is provided for each heating element 23. Furthermore, the multiple cold plates 30 include single-phase cold plates 30a and boiling cold plates 30b connected in series. As a result, the server cooling system 1,1A can perform heat exchange between the refrigerant R1 and the heating elements 23 in stages.

[0129] (3) The server cooling system 1 of the third embodiment is the server cooling system 1 of (2), wherein the single-phase cold plate 30a is provided on the side of the refrigerant supply passage 40 that is closer to the boiling cold plate 30b, and the refrigerant R1 may flow in a liquid phase state.

[0130] In the above configuration, within the single-phase cold plate 30a, the refrigerant R1 exchanges heat with the heating element 23 while in the liquid phase. Subsequently, the refrigerant R1 passes through the single-phase cold plate 30a and is supplied to the boiling cold plate 30b. Within the boiling cold plate 30b, the refrigerant R1 receives heat from the heating element 23, boils, and evaporates. As a result, the heating element 23 is strongly cooled in the boiling cold plate 30b because the heat of vaporization of the refrigerant R1 is removed from the heating element 23.

[0131] (4) The server cooling system 1A of the fourth embodiment is the server cooling system 1A of (2), wherein the single-phase cold plate 30a is provided on the refrigerant discharge passage 60 side of the boiling cold plate 30b, and the refrigerant R1 may flow in a gaseous state.

[0132] In the above configuration, within the boiling cold plate 30b, the refrigerant R1 receives heat from the heating element 23, boils, and evaporates. Subsequently, the gaseous refrigerant R1 is supplied to the single-phase cold plate 30a. As a result, the gaseous refrigerant R1 flows within the single-phase cold plate 30a. Consequently, the refrigerant R1 flows at a high velocity within the single-phase cold plate 30a.

[0133] (5) The server cooling systems 201, 201A, 201B, 201C of the fifth embodiment are the server cooling systems 201, 201A, 201B, 201C of (1), wherein the cooling devices 202, 202A, 202B, 202C are attached to the rack 10 and include a fan 204 that draws in air A so as to pass through the heat-generating element 23, and a second cooling unit 280 provided between the rack 10 and the fan 204 and cools the air A that has passed through the heat-generating element 23, and the second cooling unit 280 may include a cooling coil 281 through which a second refrigerant R2 that exchanges heat with the air A surrounding the second cooling unit 280 flows.

[0134] According to the above configuration, the server cooling systems 201, 201A, 201B, and 201C can draw in air A with the fan 204 and pass air A through to the heat-generating element 23. As a result, the server cooling systems 201, 201A, 201B, and 201C can cool the heat-generating element 23 with both the refrigerant R1 in the cold plate 230 and the air A drawn in by the fan 204.

[0135] (6) The server cooling system 201 of the sixth embodiment is the server cooling system 201 of (5), wherein the cooling unit 270 is provided on the cooling coil 281 and performs heat exchange between the refrigerant R1 and the second refrigerant R2.

[0136] According to the above configuration, the refrigerant R1, which is heated by heat exchange with the heating element 23, is cooled by the second refrigerant R2 in the cooling coil 281. Therefore, there is no need to provide a separate device for cooling the heated refrigerant R1.

[0137] (7) The server cooling system 201A of the seventh embodiment is the server cooling system 201A of (5), wherein the cooling unit 270 may be located above the fan 204.

[0138] With the above configuration, the cooling unit 270 does not obstruct the airflow A from the fan 204.

[0139] (8) The server cooling system 201B of the eighth embodiment is the server cooling system 201B of (5), wherein the cooling device 202B is provided on the top plate 14 of the rack 10 and has a second fan 207 that discharges air A from inside the rack 10 upward, and the cooling unit 270 may be provided above all the servers 20 inside the rack 10 and below the second fan 207.

[0140] According to the above configuration, the server cooling system 201B can supply air A to the cooling unit 270 by the second fan 207. The refrigerant R1 in the cooling unit 270 is cooled by the air A blown by the second fan 207. Furthermore, since the cooling unit 270 and the second fan 207 are mounted on the rack 10, the cooling device 202B can be made more compact.

[0141] (9) A server cooling system 201C of the ninth embodiment is the server cooling system 201C of (5), wherein the cooling unit 270 is provided above all of the servers 20, and the cooling device 2 may have a supply communication pipe 208 that communicates with the second cooling unit 280 and guides the second refrigerant R2 to the cooling unit 270, and a discharge communication pipe 209 that communicates with the cooling unit 270 and discharges the second refrigerant R2 from the cooling unit 270.

[0142] According to the above configuration, the cooling unit 270 is located above all servers 20. Therefore, the dead space above the servers 20 can be utilized, and the cooling device 202C can be made more compact. Furthermore, the server cooling system 201C can guide the second refrigerant R2 from the cooling coil 281 to the cooling unit 270. As a result, refrigerant R1 is cooled by heat exchange with the second refrigerant R2.

[0143] (10) The server cooling systems 301, 301A, 301B of the tenth embodiment are the server cooling systems 301, 301A, 301B of (1), wherein a plurality of racks 10 are provided, and the cooling devices 302, 302A, 302B have a distribution channel 380 that connects each of the refrigerant supply channels 340 provided in each of the servers 20 in the plurality of racks 10 to one of the cooling units 370 and distributes the refrigerant R1 cooled in the cooling unit 370 to each of the refrigerant supply channels 340, and a collection channel 390 that connects each of the refrigerant discharge channels 360 provided in each of the servers 20 in the plurality of racks 10 to one of the cooling units 370 and collects the refrigerant R1 from each of the refrigerant discharge channels 360 and guides the refrigerant R1 to one of the cooling units 370.

[0144] According to the above configuration, the server cooling systems 301, 301A, and 301B can cool the heat generated by servers 20 housed in multiple racks 10 together using a single cooling unit 370.

[0145] (11) The eleventh server cooling system 301, 301A is the server cooling system 301, 301A of (10), further comprising a duct 303 located above the rack 10 and through which air A flows, wherein the cooling unit 370 may be provided within the duct 303.

[0146] According to the above configuration, even if refrigerant R1 leaks from the cooling unit 370, refrigerant R1 will not flow into the server 20. Furthermore, according to this embodiment, the cooling unit 370 does not obstruct the passage of people.

[0147] (12) The server cooling system 301 of the twelfth embodiment is the server cooling system 301 of (11), wherein the cooling device 302 may have a third refrigerant supply passage 304 for supplying a third refrigerant R3 to cool the refrigerant R1 to the cooling unit 370, and a third refrigerant discharge passage 305 for discharging the third refrigerant R3 from the cooling unit 370.

[0148] According to the above configuration, the cooling unit 370 can cool the refrigerant R1 by heat exchange between the third refrigerant R3 and the refrigerant R1.

[0149] (13) The server cooling system 301A of the 13th embodiment is the server cooling system 301A of (11), wherein the cooling unit 370 may cool the refrigerant R1 with air A flowing through the duct 303.

[0150] As a result, the refrigerant R1 is cooled solely by the air A flowing through the duct 303. Furthermore, compared to rear door cooling, where a cooling fan is installed horizontally on rack 10, the noise during airflow is reduced. (14) The server cooling system 301B of the 14th embodiment is the server cooling system 301B of (10), wherein the cooling unit 370 may be provided between the racks 10.

[0151] This allows for efficient placement of the rack 10 and the cooling unit 370. [Explanation of Symbols]

[0152] 1…Server cooling system 2…Cooling device 10…Rack 11…Frame 12…Bottom plate 13…Side plate 14…Top plate 20…Server 21…Casing 22…Circuit board 23…Heating element 23a…Low-temperature heating element 23b…High-temperature heating element 24…Ventilation hole 30…Cold plate 30a…Single-phase cold plate 30b…Boiling cold plate 40…Refrigerant supply path 41…Refrigerant supply header 42…Refrigerant supply branch pipe 50…Refrigerant connection path 60…Refrigerant discharge path 61…Refrigerant discharge header 62…Refrigerant discharge branch pipe 70…Cooling section 71…Cooling section casing 72…Heat exchanger 73…First main header 74…First connecting pipe 75…Second main header 76…Second connecting pipe 77…Pump 1A…Server cooling system 2A…Cooling device 201…Server cooling system 202…Cooling device 203...Fan casing 204...Fan 205...First connection header 206...Second connection header 230...Cold plate 240...Refrigerant supply path 260...Refrigerant discharge path 270...Cooling section 271...Jacket 280...Second cooling section 281...Cooling coil 201A...Server cooling system 202A...Cooling device 201B...Server cooling system 202B...Cooling device 207...Second fan 201C...Server cooling system 202C...Cooling device 208...Supply connection pipe 209...Discharge connection pipe 301...Server cooling system 302...Cooling device 303...Duct 304...Third refrigerant supply path 305...Third refrigerant discharge path 330...Cold plate 340...Refrigerant supply path 360...Refrigerant discharge path 370...Cooling section 380...Distribution path 381...First distribution line 382...Second distribution line 383...Third distribution line 390...Collection channel 391...First collection line 392...Second collection line 393...Third collection line 301A...Server cooling system 302A...Cooling device 301B...Server cooling system 302B...Cooling device A...Air D1...Up and down direction D2...Left and right direction D3...Front and back direction R1...Refrigerant R2...Second refrigerant R3...Third refrigerant W...Cooling water

Claims

1. Rack and, Multiple servers, each having a heat-generating element, are housed in the rack so as to be arranged vertically within the rack. A cooling device capable of cooling each of the aforementioned heat-generating elements, Equipped with, Multiple racks are provided, Multiple racks are arranged to form multiple rows. The cooling device, Multiple cold plates are provided to correspond to the heating elements of each server, and each cold plate contacts the corresponding heating element. A refrigerant supply path for supplying refrigerant to each of the aforementioned cold plates, A refrigerant discharge passage for discharging the refrigerant that has passed through each of the cold plates, A cooling unit that cools the refrigerant that has passed through each of the aforementioned refrigerant discharge passages and introduces it into the aforementioned refrigerant supply passage, A distribution channel connects each of the refrigerant supply paths provided in each of the servers in the multiple racks to a single cooling unit, and distributes the refrigerant cooled by the cooling unit to each of the refrigerant supply paths, A collection channel is provided to connect each of the refrigerant discharge channels provided in each of the servers in the multiple racks to a single cooling unit, and to collect the refrigerant from each of the refrigerant discharge channels and guide the refrigerant to the single cooling unit, It has, Located above the aforementioned rack, and further equipped with a duct through which air flows, The duct, when viewed from above, is located between the rows of racks and extends in the direction of the rows of racks. The cooling unit is provided inside the duct. Server cooling system.

2. The cooling device, A third refrigerant supply path supplies a third refrigerant to the cooling unit for cooling the refrigerant, A third refrigerant discharge passage for discharging the third refrigerant from the cooling section, A server cooling system according to claim 1, comprising:

3. The server cooling system according to claim 1, wherein the cooling unit cools the refrigerant with air flowing through the duct.

4. Rack and, Multiple servers, each having a heat-generating element, are housed in the rack so as to be arranged vertically within the rack. A cooling device capable of cooling each of the aforementioned heat-generating elements, Equipped with, Multiple heating elements are provided in each server. Multiple heating elements form rows that extend in the left-right direction perpendicular to the vertical direction. Each row of the multiple heating elements is arranged in a front-to-back direction perpendicular to the vertical and left-to-right directions. The cooling device, Multiple cold plates are provided to correspond to the heating elements of each server, and each cold plate contacts the corresponding heating element. A refrigerant supply path for supplying refrigerant to each of the aforementioned cold plates, A refrigerant discharge passage for discharging the refrigerant that has passed through each of the cold plates, A cooling unit that cools the refrigerant that has passed through each of the aforementioned refrigerant discharge passages and introduces it into the aforementioned refrigerant supply passage, It has, Each of the cold plates is in contact with the plurality of heating elements and is arranged along the row of heating elements. The refrigerant supply passage is connected only to the longitudinal center of the cold plate on one side in the front-rear direction. The refrigerant discharge passage is connected only to the longitudinal center of the cold plate on the other side in the front-rear direction. The cooling device further comprises a refrigerant connection path connecting the longitudinal centers of adjacent cold plates in the front-to-back direction, thus forming a server cooling system.

5. The plurality of cold plates are A single-phase cold plate through which the refrigerant flows in a single-phase state, A boiling cold plate is connected in series with the single-phase cold plate in the direction of the flow of the refrigerant, such that the refrigerant boils and flows in a two-phase state of liquid and gaseous phases. A server cooling system according to claim 4, including the following:

6. The server cooling system according to claim 5, wherein the single-phase cold plate is provided on the refrigerant supply path side of the boiling cold plate, and the refrigerant flows in a liquid phase state.

7. The server cooling system according to claim 5, wherein the single-phase cold plate is provided on the refrigerant discharge path side of the boiling cold plate, and the refrigerant flows in a gaseous state.

8. Rack and, Multiple servers, each having a heat-generating element, are housed in the rack so as to be arranged vertically within the rack. A cooling device capable of cooling each of the aforementioned heat-generating elements, Equipped with, The cooling device, Multiple cold plates are provided to correspond to the heating elements of each server, and each cold plate contacts the corresponding heating element. A refrigerant supply path for supplying refrigerant to each of the aforementioned cold plates, A refrigerant discharge passage for discharging the refrigerant that has passed through each of the cold plates, A cooling unit that cools the refrigerant that has passed through each of the aforementioned refrigerant discharge passages and introduces it into the aforementioned refrigerant supply passage, A fan is installed adjacent to the rack to draw in air so as to pass through the heat-generating element, A second cooling unit is provided between the rack and the fan and cools the air that has passed through the heat-generating element, It has, The second cooling unit has a cooling coil through which a second refrigerant that exchanges heat with the surrounding air flows, The cooling unit is provided above all of the servers. Multiple heating elements are provided in each server. The plurality of heating elements include a low-temperature heating element and a high-temperature heating element that generates a relatively large amount of heat compared to the low-temperature heating element. The cold plate is provided only on the high-temperature heating element among the heating elements. Server cooling system.

9. The server cooling system according to claim 8, wherein the cooling unit is provided on the cooling coil and performs heat exchange between the refrigerant and the second refrigerant.

10. The server cooling system according to claim 8, wherein the cooling unit is located above the fan.

11. The cooling device is provided on the top plate of the rack and has a second fan that expels air from inside the rack upwards. The server cooling system according to claim 8, wherein the cooling unit is located above all the servers in the rack and below the second fan.

12. The cooling device is A supply communication pipe that communicates with the second cooling section and guides the second refrigerant to the cooling section, A discharge communication pipe that communicates with the cooling unit and discharges the second refrigerant from the cooling unit, A server cooling system according to claim 8, comprising:

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