Film deposition apparatus, film deposition method, and method for manufacturing electronic devices

Abstract

To suppress variation in transportation height of a substrate carrier due to variation in weight on a film deposition apparatus that transports a substrate carrier while floating the substrate carrier with magnetic force and deposits a film.SOLUTION: An in-line type film deposition apparatus that deposits a film while transporting a substrate includes: a substrate carrier for holding the substrate; magnetic force generation means for generating magnetic force to magnetically float the substrate carrier; and position change means for changing a vertical position of the magnetic force generation means.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a film forming apparatus, a film forming method, and a method for manufacturing an electronic device.

Background Art

[0002] In the manufacture of an organic EL display device (organic EL display) or the like, an in-line type film forming apparatus that forms an organic film or a metal film while transporting a substrate has been put into practical use. In an in-line type film forming apparatus, a transport device for transporting a substrate or a mask between a plurality of processing chambers such as an alignment chamber and a film forming chamber is used. In a conventional transport device, substances generated from the contact portion between a substrate, a mask, etc. and the transport device may adhere to the substrate, reducing the film forming accuracy. Therefore, a magnetic levitation transport device has been developed that levitates a substrate carrier holding a substrate using a magnet and transports it in a non-contact manner. For example, in Patent Document 1, a levitation electromagnet is arranged above the chamber along the transport direction of a transport tray, and a stator coil for generating a horizontal propulsive force is arranged on the side surface of the chamber, and a magnetic levitation transport device for transporting the transport tray in a non-contact manner is described.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In an in-line film deposition system, after mask alignment is performed with the substrate carrier holding the substrate, the mask is then placed on the substrate carrier, and the substrate and mask are transported to the deposition chamber. Because the mask is heavy, the weight of the object being transported by the substrate carrier changes significantly before and after the mask is placed on the substrate carrier. Therefore, if a magnetic levitation transport system is used to transport the substrate carrier in an in-line film deposition system, the transport height of the substrate carrier changes significantly before and after the mask is placed on it.

[0005] Patent Document 2 describes a magnetic levitation transport device that provides a magnetic force generating means for applying an upward attractive force to a movable element and a magnetic force generating means for applying a downward attractive force, and in particular, the magnetic force generating means for applying a downward attractive force is a levitation control electromagnet placed on the stator, thereby controlling the levitation direction, pitching direction and rolling direction of the movable element.

[0006] Therefore, in a film deposition apparatus that uses a magnetic levitation transport device for transporting substrate carriers, it is conceivable to suppress changes in the transport height of the substrate carrier due to changes in the weight of the transported object by controlling the levitation using electromagnets. However, when the weight change is large, it is necessary to change the output of the electromagnets significantly, which presents the challenge of increased heat generation and power consumption.

[0007] This invention has been made in view of the above problems, and aims to suppress changes in the transport height of the substrate carrier due to changes in weight in a film deposition apparatus that performs film deposition while transporting the substrate carrier in a state where the substrate carrier is levitated by magnetic force. [Means for solving the problem]

[0008] The present invention is an in-line film deposition apparatus that deposits a film while transporting a substrate, A substrate carrier that holds the aforementioned substrate, A magnetic force generating means for generating a magnetic force to magnetically levitate the substrate carrier, A position changing means for changing the vertical position of the magnetic force generating means, It is characterized by being equipped with [the following features].

[0009] The present invention is a film deposition method for depositing a film onto a substrate via a mask while levitating and transporting a substrate carrier capable of holding a substrate and a mask using a magnetic force generated by a magnetic force generating means, A mask holding step in which the mask is held on the substrate carrier, After the mask holding step, a position changing step is performed to change the vertical position of the magnetic force generating means, It is characterized by having the following features. [Effects of the Invention]

[0010] According to the present invention, in a film deposition apparatus that performs film deposition while transporting a substrate carrier levitated by magnetic force, it is possible to suppress changes in the transport height of the substrate carrier due to changes in weight. [Brief explanation of the drawing]

[0011] [Figure 1] A schematic diagram showing the overall configuration of the film deposition apparatus. [Figure 2] A schematic diagram showing a substrate carrier and a magnetic levitation transport system. [Figure 3] A schematic diagram showing a cross-section of the substrate carrier and transport device. [Figure 4] A schematic diagram showing the control device of the transport system. [Figure 5] A schematic diagram illustrating the operation of the positional movement mechanism in the alignment process of a film deposition apparatus. [Figure 6] Diagram showing the configuration of an organic EL display device. [Modes for carrying out the invention]

[0012] Preferred embodiments of the present invention will be described below with reference to the figures. However, the following embodiments are illustrative examples of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations.

[0013] This document describes a film deposition apparatus, a film deposition method, and a method for manufacturing an electronic device according to an embodiment of the present invention. The film deposition apparatus of this embodiment is an apparatus for depositing a film deposition material onto the surface of a substrate via a mask to form a thin film. Examples of film deposition methods include vacuum deposition and sputtering. By aligning the substrate and the mask and performing film deposition, a thin film with a pattern corresponding to the opening pattern of the mask is formed on the substrate. When multiple layers are formed on the substrate, the layer already formed in the previous step may also be referred to as the "substrate." In order to perform thin film formation via a mask with high precision, the film deposition apparatus according to this embodiment performs alignment to adjust the relative position of the substrate and the mask.

[0014] Examples of substrate materials include glass, semiconductors such as silicon, polymer films, and metals. Examples of substrates include silicon wafers and substrates on which films such as polyimide are laminated. Examples of film-forming materials include organic materials and inorganic materials (metals, metal oxides). Examples of masks include metal masks having aperture patterns corresponding to the thin film pattern formed on the substrate. Examples of electronic devices manufactured by the manufacturing method of this embodiment include various electronic devices such as semiconductor devices, magnetic devices, and electronic components, optical components, light-emitting elements, photoelectric conversion elements, touch panels, display devices equipped with light-emitting elements (e.g., organic EL display devices), lighting devices (e.g., organic EL lighting devices), and sensors equipped with photoelectric conversion elements (e.g., organic CMOS image sensors). It is particularly suitable for manufacturing organic light-emitting elements such as OLEDs and organic photoelectric conversion elements such as organic thin-film solar cells.

[0015] Figure 1 is a schematic plan view showing the configuration of the electronic device manufacturing apparatus according to this embodiment. Here, an in-line type organic EL display manufacturing apparatus including a film deposition apparatus will be explained as an example. The film deposition apparatus is a vacuum deposition apparatus that deposits a film deposition material onto a substrate using an evaporation source. The manufacturing of the L display is carried out by loading a substrate of a predetermined size into a manufacturing apparatus, forming an organic EL layer and a metal layer in a film forming apparatus, and then performing post - treatment processes such as cutting of the substrate. The configuration of the post - treatment process is not described in FIG. 1. Hereinafter, the direction parallel to the conveyance direction among the directions along the film - forming surface of the substrate is defined as the X direction, the direction perpendicular to the X direction is the Y direction, and the direction intersecting the film - forming surface of the substrate is the Z direction. In the present embodiment, it is assumed that the XY plane is parallel to the horizontal plane and the Z direction is parallel to the vertical direction. When the conveyance direction is not parallel to the horizontal direction, the X direction is not parallel to the horizontal direction and the Z direction is not parallel to the vertical direction.

[0016] The film forming apparatus 1 has a substrate loading chamber 401, a carrier merging chamber 402, a mask merging chamber 403, an alignment chamber 404, and a film forming chamber 405. The substrate 102 to be subjected to film forming treatment in the film forming apparatus 1 is loaded from the substrate loading chamber 401, and the substrate carrier 101 holds the substrate 102 in the carrier merging chamber 402. The substrate carrier 101 holds the substrate 102 using a clamp mechanism or an adsorption rubber. The method of holding the substrate 102 is not limited to this example. Next, the substrate carrier 101 holding the substrate 102 merges with the mask 103 in the mask merging chamber 403 and is conveyed to the downstream alignment chamber 404 respectively. In the alignment chamber 404, alignment of the substrate 102 and the mask 103 is performed. After the alignment is completed, the substrate 102 and the mask 103 are brought into close contact and conveyed to the downstream film forming chamber 405. In the film forming chamber 405, film forming treatment is performed on the film - forming surface of the substrate 102 through the mask 103 using an evaporation source that heats and evaporates the film - forming material. In the film forming chamber 405, by passing the substrate carrier 101 over the evaporation source at a predetermined speed to perform film forming, a thin film with a predetermined film thickness is formed on the substrate 102. When the film forming is completed and the substrate carrier 101 is unloaded from the film forming chamber 405, it is separated from the mask 103 and the substrate 102 in the mask separation chamber and the substrate separation chamber. The substrate 102 is conveyed to the next film forming process, and the substrate carrier 101 and the mask 103 are returned to the carrier merging chamber 402 and the mask merging chamber 403 respectively and reused.

[0017] The inline film forming apparatus 1 configured as described above has a magnetic levitation conveyance system that levitates and non - contact conveys a substrate carrier 101 capable of holding a substrate 102 and a mask 103 by magnetic force generated by magnetic force generating means. While conveying the substrate 102 and the mask 103 by this conveyance system, film formation is performed on the substrate 102 through the mask 103 in the film formation chamber 405. Hereinafter, the conveyance system of the film forming apparatus 1 of the present embodiment will be described.

[0018] FIG. 2 is a diagram schematically showing the conveyance system 2. FIG. 2 is a view of the conveyance system 2 seen in the Y direction. The conveyance system 2 is a magnetic levitation conveyance system using a moving magnet type linear motor, a moving permanent magnet type linear motor, or a moving field magnet type linear motor. The conveyance system 2 is composed of a plurality of conveyance devices 201 that function as stators with respect to the substrate carrier 101 which is a mover. The conveyance device 201 has no guiding device such as a linear guide and conveys the substrate carrier 101 non - contact. FIG. 2 shows, as an example, a conveyance system 2 composed of three conveyance devices 201c, 201a, and 201b in order from the upstream side of the conveyance path. FIG. 2(A) shows the conveyance device 201c, FIGS. 2(B), 2(C), and 2(D) show different states of the substrate 01 and a position changing means 208 described later in the conveyance device 201a, and FIG. 2(E) shows the conveyance device 201b. The number of conveyance devices 201 constituting the conveyance system 2 is not limited to this example. Also, FIG. 2 shows an example in which one substrate carrier 101 is conveyed in one conveyance device 201, but it is also possible to convey a plurality of substrate carriers 101 in one conveyance device 201.

[0019] The conveyance system 2 conveys the substrate carrier 101 by the conveyance device 201, and conveys the substrate 102 held by the substrate carrier 101 to a processing chamber for performing processing on the substrate 102. The substrate carrier 101 has mask holding means for holding the mask 103 and can hold and convey the mask 103.

[0020] The transport devices 201a, 201b, and 201c are arranged in the X direction, which is the transport direction of the substrate carrier 101, and constitute the transport path for the substrate carrier 101. In Figure 2, transport device 201c corresponds to the mask merging chamber 403, transport device 201a corresponds to the alignment chamber 404, and transport device 201b corresponds to the film deposition chamber 405. That is, in the transport device 201c in Figure 2(A), the substrate carrier 101 holds only the substrate 102 in the mask merging chamber 403, and the mask 103 is transported downstream to the alignment chamber 404 via a separate transport path. In the transport device 201a in Figure 2(B), the substrate carrier 101 holds only the substrate 102 in the alignment chamber 404, and alignment is performed between the substrate 102 and the mask 103 placed on a mask stand or the like. In Figures 2(C) and 2(D), the transport device 201a, after alignment is complete, has the substrate carrier 101 holding the substrate 102 and mask 103, with the substrate 102 and mask 103 in close contact. As the substrate carrier 101 holds the mask 103, the weight of the object being transported increases, and in Figure 2(C), the transport height of the substrate carrier 101 is lower than in Figure 2(B). In Figure 2(D), the position of the permanent magnet 211 of the transport device 201a is changed in the Z direction by the position changing means 208, which will be described later, so that the transport height of the substrate carrier 101 remains the same as in Figure 2(B) even if the weight of the object being transported increases. In Figure 2(E), the transport device 201b has the substrate carrier 101 holding the substrate 102 and mask 103 in close contact in the deposition chamber 405, and is performing film deposition on the substrate 102 via the mask 103.

[0021] Figure 3(A) shows the main parts of the substrate carrier 101 and the transport device 201a. Figure 3(A) schematically shows a cross-section of the substrate carrier 101 and the transport device 201a with a plane perpendicular to the transport direction. The +Y side (left side in Figure 3(A)) of the substrate carrier 101 is referred to as the L side, and the -Y side (right side in Figure 3(A)) is referred to as the R side, with respect to the center in the Y direction.

[0022] The substrate carrier 101 has substrate holding means for holding the substrate 102 on the substrate carrier 101, and transports the substrate 102 with the substrate 102, which is the object to be transported, placed or mounted on the upper or lower surface.

[0023] Multiple permanent magnets 104a and 104b are attached to the left and right ends of the upper surface of the substrate carrier 101, at positions symmetrical with respect to the center of the substrate carrier 101 in the Y direction. In the following, when it is not necessary to distinguish between permanent magnets 104a and 104b, they will simply be referred to as permanent magnet 104. Permanent magnet 104 is constructed by arranging multiple permanent magnets along the Y direction on the upper part of the transport device 201 such that the polarity of the magnetic poles on the opposing sides alternates. In Figure 3(A), permanent magnet 104 consists of two permanent magnets, but the number is not limited to multiple permanent magnets. Furthermore, the direction in which the multiple permanent magnets constituting permanent magnet 104 are arranged is not limited to the Y direction shown in Figure 3(A), but can be any direction that intersects with the X direction (transport direction). In other words, permanent magnet 104 is a group of magnets consisting of multiple permanent magnets arranged along a direction that intersects with the X direction (transport direction) such that the polarity of the magnetic poles alternates. In Figure 3(A), the magnet groups are arranged in two rows along the X direction on both the L and R sides of the upper surface of the substrate carrier 101.

[0024] Yokes 108 are provided on the left and right sides of the upper surface of the substrate carrier 101, and the permanent magnets 104 are attached to the yokes 108. The yokes 108 are made of a material with high magnetic permeability, such as iron.

[0025] On the right and left sides of the upper part 2011a of the transport device 201a, a plurality of coils 202 are attached, arranged at predetermined intervals along the X direction, which is the transport direction of the substrate carrier 101, so as to face the permanent magnet 104 provided on the upper surface of the substrate carrier 101. Each coil 202 is attached so that its central axis faces the Y direction. Note that the coil 202 has a configuration in which a winding is wound around a core, and in this embodiment, the position of the coil 202 is relative to the position of the core. To indicate placement.

[0026] Multiple coils 202 are current-controlled in units of a predetermined number of coils 202. A predetermined number of coils 202 that constitutes a unit of current control is called a coil unit 203. One or more coil units 203 may be housed in a coil box, and the coil box may be placed on the upper part 2011a of the conveying device 201 along the X direction.

[0027] By energizing the coil 202, a magnetic force is generated between the coil 202 located on the transport device 201a and the permanent magnet 104 located on the substrate carrier 101. This magnetic force provides propulsion in the X direction while controlling the attitude of the substrate carrier 101.

[0028] A linear scale 105, a Y target 106, and a Z target 107 are provided on the underside of the substrate carrier 101 along the X direction. The Z target 107 is mounted on both sides (L side and R side) in the Y direction, flanking the linear scale 105 and the Y target 106.

[0029] The lower part 2012a of the transport device 201a is provided with multiple linear encoders 204, multiple Y sensors 205, and multiple Z sensors 206.

[0030] Multiple linear encoders 204 are mounted on the transport device 201a along the X direction so that each can face a linear scale 105 on the substrate carrier 101. Each linear encoder 204 can detect and output the relative position of the substrate carrier 101 with respect to the linear encoder 204 by reading the linear scale 105 attached to the substrate carrier 101.

[0031] Multiple Y sensors 205 are mounted on the transport device 201a along the X direction so that each can face the Y target 106 on the substrate carrier 101. Each Y sensor 205 can detect and output the relative distance in the Y direction between itself and the Y target 106 mounted on the substrate carrier 101.

[0032] Multiple Z sensors 206 are mounted in two rows along the X direction on the transport device 201a so that each can face the Z target 107 on the substrate carrier 101. Each Z sensor 206 can detect and output the relative distance in the Z direction between itself and the Z target 107 attached to the substrate carrier 101.

[0033] Multiple linear encoders 204 are mounted on the transport device 201a at intervals such that at least one of them can always measure the position of one substrate carrier 101 while the substrate carrier 101 is being transported. Similarly, multiple Y sensors 205 are mounted on the transport device 201a at intervals such that two of them can always measure the Y target 106 of one substrate carrier 101. Furthermore, multiple Z sensors 206 are mounted on the transport device 201a at intervals such that three of the two rows of sensors can always measure the Z target 107 of one substrate carrier 101.

[0034] Multiple permanent magnets 207, which are the first magnets, are provided on the lower surface of the substrate carrier 101, and multiple permanent magnets 211, which are the second magnets, are provided on the lower part 2012a of the transport device 201a, located below the first magnets. The arrangement direction of the multiple permanent magnets 207 and the arrangement direction of the multiple permanent magnets 211 are the same, and the permanent magnets 207 and 211 face each other in the Z direction. The substrate carrier 101 levitates and is supported vertically by the repulsive force caused by the magnetic force generated between the permanent magnets 207 and 211. The permanent magnets 211 provided on the transport device 201a constitute the magnetic force generating means. The means of generating the magnetic force does not have to be a permanent magnet; an electromagnet may also be used.

[0035] As described above, we will explain using an example where the weight of the object to be transported increases at the point where the transport device 201a is installed (alignment chamber 404) in the transport path of the substrate carrier 101 compared to the point where the transport device 201c is installed upstream of the transport device 201a (mask merging chamber 403). For example, the weight of the object to be transported increases when the substrate carrier 101 changes from a state in which it holds only the substrate 102 to a state in which it holds both the substrate 102 and the mask 103.

[0036] Since the magnetic force of the permanent magnets 207 and 211 that generate the repulsive force to levitate the substrate carrier 101 is constant, if the weight of the object being transported held by the substrate carrier 101 changes, the transport height of the substrate carrier 101 changes. This changes the distance between the coil unit 203 of the transport device 201 and the permanent magnet 104 of the substrate carrier 101, making the attitude control of the substrate carrier 101 unstable and potentially causing the substrate carrier 101 to deviate from its target position. One possible measure to stabilize the attitude control of the substrate carrier 101 is to increase the current applied to the coil 202 to increase the magnetic force generated between the coil 202 and the permanent magnet 104. However, this method increases the amount of heat generated by the coil 202, which can cause temperature fluctuations inside the vacuum chamber. It also has the problem of increasing power consumption.

[0037] Therefore, in the film deposition apparatus 1 of this embodiment, a position changing means 208 is provided to change the vertical (Z-direction) position of the permanent magnet 211, which is a magnetic force generating means that generates a magnetic force to magnetically levitate the substrate carrier 101. This configuration allows the position of the permanent magnet 211 to be changed so that when the weight of the object to be transported held by the substrate carrier 101 increases, the second magnet, the permanent magnet 211, moves closer to the substrate carrier 101. As a result, the distance in the Z-direction between the permanent magnet 207 of the substrate carrier 101 and the permanent magnet 211 of the transport device 201a becomes shorter, increasing the repulsive force due to the magnetic force generated between the permanent magnet 207 and the permanent magnet 211, making it possible to support the substrate carrier 101 at the same transport height as before the weight of the object to be transported increased. Therefore, it is possible to suppress changes in the transport height of the substrate carrier 101 due to changes in the weight of the object to be transported held by the substrate carrier 101 without increasing the current applied to the coil 202. Furthermore, compared to controlling the transport height of the substrate carrier 101 with the current applied to the coil 202, there is the advantage that the settling time until the transport height matches the target value is shorter. Even when an electromagnet is used instead of a permanent magnet as a means of generating magnetic force to generate the magnetic force for magnetically levitating the substrate carrier 101, the position of the electromagnet in the Z direction can be changed. By modifying the means 208, it is possible to suppress changes in the transport height of the substrate carrier 101 without changing the applied current to the electromagnet.

[0038] Furthermore, the position-changing means 208 of this embodiment can suppress changes in the transport height of the substrate carrier 101 not only when the weight of the object to be transported held by the substrate carrier 101 increases, but also when the weight decreases. Specifically, when the weight of the object to be transported held by the substrate carrier 101 decreases, the position of the permanent magnet 211 in the vertical direction (Z direction) can be changed so that the permanent magnet 211 moves away from the substrate carrier 101. As a result, the distance between the permanent magnet 207 of the substrate carrier 101 and the permanent magnet 211 of the transport device 201a increases, so the repulsive force due to the magnetic force between the permanent magnet 207 and the permanent magnet 211 decreases, making it possible to support the substrate carrier 101 at the same transport height as before the weight of the object to be transported decreased.

[0039] The position changing means 208 is configured, for example, as follows: In the area where the permanent magnet 211 is located in the lower part 2012a of the conveying device 201a, a through hole 213 is provided that penetrates the lower part 2012a in the Z direction, and a rod 212 is inserted through the through hole 213. The lower end of the rod 212 is connected to a drive source 214 such as a motor, and the rod 212 is driven to move back and forth in the Z direction. The drive source 214 can drive the rod 212 forward and backward using known methods such as gears or hydraulics. When the conveying device 201a is installed inside a vacuum container, airtightness is maintained by covering the rod 212 with the bellows 210.

[0040] The upper end of the rod 212 is connected to the bracket 209. The bracket 209 extends in the X direction to cover the area in the lower part 2012a of the conveying device 201a where the permanent magnet 211 is located. The bracket 209 is configured to be able to contact and separate from the lower part 2012a of the conveying device 201a, and when the upper end of the rod 212 is in its lowest position in the Z direction, the bracket 209 is in contact with the lower part 2012a of the conveying device 201a. When the rod 212 is driven upward in the Z direction by the drive source 214 from that state, the bracket 209 connected to the rod 212 separates from the lower part 2012a of the conveying device 201a. Note that the relationship between the bracket 209 and the lower part 2012a of the conveying device 201a is not limited to this example. It is sufficient that the position of the bracket 209 in the Z direction is variable relative to the lower part 2012a of the conveying device 201a, whose position in the Z direction is fixed.

[0041] The permanent magnet 211, located below the permanent magnet 207 of the substrate carrier 101, is mounted on the upper surface of the bracket 209. Therefore, when the position of the bracket 209 in the Z direction changes, the position of the second magnet, the permanent magnet 211, in the Z direction also changes. The transport device 201a is a stator for the movable substrate carrier 101, and the permanent magnet 211, which is a component of this stator, is movable in the Z direction by the position changing means 208 configured as described above.

[0042] The variable range of the position of the bracket 209 in the Z direction, and therefore the movable range of the permanent magnet 211 in the Z direction, can be determined based on the magnetic force of the permanent magnets 211 and 207 and the weight of the object being transported, etc., so as to ensure that the transport height of the substrate carrier 101 can be kept constant in both the state where the substrate carrier 101 is holding the lightest object and the state where it is holding the heaviest object among the objects that the substrate carrier 101 may hold in the film deposition apparatus 1.

[0043] In Figure 2, a configuration is shown in which all of the multiple permanent magnets 211 of the conveying device 201a are attached to a single bracket 209, and the position of the bracket 209 in the Z direction is changed by a single position-changing means 208. However, it is also possible to provide multiple brackets and multiple position-changing means, and configure the system so that the position of each bracket in the Z direction is changed by each position-changing means, and so that some of the multiple permanent magnets 211 of the conveying device 201a are attached to each bracket.

[0044] In Figure 3(A), a configuration is shown as an example in which a permanent magnet 211 (second magnet) is provided in the lower part 2012a of the transport device 201a so as to be located below the permanent magnet 207 (first magnet) provided on the substrate carrier 101, as a means for generating magnetic force to magnetically levitate the substrate carrier 101. However, the configuration of the magnetic force generating means is not limited to this example.

[0045] Figure 3(B) shows a configuration in which a permanent magnet 211X (third magnet) is provided on the upper part 2011X of the transport device 201X so as to be above the permanent magnet 207X (first magnet) provided on the substrate carrier 101X, and the substrate carrier 101X is supported vertically by the attractive force generated between the permanent magnet 207X and the permanent magnet 211X, as a means for generating a magnetic force to magnetically levitate the substrate carrier 101X.

[0046] In this transport device 201X, a coil 202X and a coil unit 203X are arranged in the lower part 2012X, and a yoke 108X and permanent magnets 104Xa and 104Xb are provided on the underside of the substrate carrier 101X opposite to these. When current is applied to the coil 202X, the magnetic force generated between the coil 202X and the permanent magnets 104Xa and 104Xb controls the attitude of the substrate carrier 101X and provides thrust in the horizontal direction (transport direction). The configuration of the sensors described in Figure 3(A) is the same as the configuration in Figure 3(B), so the explanation is omitted.

[0047] In the configuration shown in Figure 3(B), a position changing means 208X is provided to change the position of the permanent magnet 211X, which is a magnetic force generating means, in the Z direction. The position changing means 208X includes a bracket 209X to which the permanent magnet 211X is attached, a rod 212X whose lower end in the Z direction is connected to the bracket 209X, and a drive source 214X that drives the rod 212X to move back and forth in the Z direction. The rod 212X is inserted through a through hole 213X in the Z direction provided in the upper part 2011X of the conveying device 201X, and the rod 212X is covered by a bellows 210X.

[0048] When the weight of the object being transported held by the substrate carrier 101X increases, the position changing means 208X changes the position of the permanent magnet 211X in the Z direction so that the permanent magnet 211X, which is a magnetic force generating means, moves closer to the substrate carrier 101X. As a result, the attractive force generated between the permanent magnet 211X and the permanent magnet 207X increases, and the substrate carrier 101X is pulled vertically upward, thereby preventing the transport height of the substrate carrier 101X from decreasing due to the increase in the weight of the object being transported.

[0049] Furthermore, when the weight of the object to be transported held by the substrate carrier 101X decreases, the position changing means 208X changes the position of the permanent magnet 211X in the Z direction so that the permanent magnet 211X, which is a magnetic force generating means, moves away from the substrate carrier 101X. This reduces the attractive force generated between the permanent magnet 211X and the permanent magnet 207X, weakening the force that pulls the substrate carrier 101X vertically upward, thereby suppressing the increase in the transport height of the substrate carrier 101X due to the decrease in the weight of the object to be transported.

[0050] One case in which the weight of the object being transported held by the substrate carrier 101 increases is when the substrate 102 held by the substrate carrier 101 and the mask 103 are aligned, and then the mask 103 is held by the substrate carrier 101. Because the mask 103 is heavy, the weight of the substrate carrier 101 differs significantly depending on whether the mask 103 is being held or not. In the film deposition apparatus 1 of this embodiment, the position changing means 208 operates to change the position of the permanent magnet 211 of the transport device 201a in the Z direction depending on whether the substrate carrier 101 is holding the mask 103 or not.

[0051] For example, the position changing means 208 operates to change the position of the permanent magnet 211 of the transport device 201a in the Z direction depending on whether alignment is performed when the substrate carrier 101 is not holding the mask 103 or when the substrate carrier 101 is holding the mask 103 after alignment. Specifically, the position changing means 208 operates so that the permanent magnet 211 of the transport device 201a is closer to the substrate carrier 101 when the substrate carrier 101 is holding the mask 103 after alignment than when alignment is performed (when the substrate carrier 101 is not holding the mask 103). This makes it possible to maintain a constant transport height of the substrate carrier 101 both when alignment is performed and when the substrate carrier 101 is holding the mask 103 after alignment.

[0052] In the transport system 2 of the film deposition apparatus 1 of this embodiment, the Z-direction position of the permanent magnet 211 in the transport device 201c in Figure 2(A) may be the same as the Z-direction position of the permanent magnet 211 in the transport device 201a in Figure 2(B) before the position changing means 208 changes its position. Alternatively, the Z-direction position of the permanent magnet 211 in the transport device 201a in Figure 2(D) after the position changing means 208 changes its position may be the same as the Z-direction position of the permanent magnet 211 in the transport device 201b in Figure 2(E). By doing so, the transport height of the substrate carrier 101 becomes constant in all of the transport devices 201a, 201b, and 201c. This makes it possible to maintain a constant distance in the Z direction between the coils 202 provided on the upper parts 2011a, 2011b, and 2011c of each transport device 201 and the permanent magnets 104 provided on the upper surface of the substrate carrier 101. As a result, the attitude control and propulsion control of the substrate carrier 101 by the magnetic force between the coils 202 and the permanent magnets 104 can be stabilized.

[0053] Figure 4 is a schematic diagram showing the control device of the transport system 2 of this embodiment. The control device 3 has an integrated controller 301, a coil controller 302, a sensor controller 304, and a lifting controller 305, and controls the transport system 2, which includes the substrate carrier 101 and the transport device 201. Figure 4 shows the control block of the transport device 201a, but the control blocks of the other transport devices 201b and 201c are the same as the transport device 201a, except that they do not have a position changing means 208. The integrated controller 301 is communicatively connected to the coil controller 302, the sensor controller 304, and the lifting controller 305. The lifting controller 305 controls the operation of the position changing means 208 of the transport device 201a.

[0054] Multiple current controllers 303 are communicated to the coil controller 302. The coil controller 302 and the multiple current controllers 303 connected to it are provided corresponding to each row of coils 202. A coil unit 203 is connected to each current controller 303. The current controller 303 controls the current applied to each coil 202 of the connected coil unit 203.

[0055] The coil controller 302 commands each connected current controller 303 to a target current value. The current controller 303 controls the current applied to the connected coil 202 based on the target current value. The coil 202 and the current controller 303 are mounted on both sides (L side and R side) in the Y direction of the upper part 2011a of the transport device 201a, along the X direction in which the substrate carrier 101 is transported.

[0056] Multiple linear encoders 204, multiple Y sensors 205, and multiple Z sensors 206 are communicated to the sensor controller 304. The integrated controller 301 determines the current value to be applied to the multiple coils 202 based on the outputs from the linear encoders 204, Y sensors 205, and Z sensors 206, and transmits it to the coil controller 302. The coil controller 302 commands the current value to the current controller 303 based on the target current value obtained from the integrated controller 301.

[0057] The integrated controller 301 determines a command value for the amount of movement of the rod 212 of the position change means 208 in the Z direction when the weight of the object to be transported held by the substrate carrier 101 changes, and transmits it to the lifting controller 305. Based on the command value for the amount of movement, the lifting controller 305 controls the operation of the drive source 214 of the position change means 208, thereby driving the rod 212 forward and backward in the Z direction. As a result, the bracket 209 moves in the Z direction, and the position of the permanent magnet 211 in the Z direction is changed.

[0058] The integrated controller 301 can determine a command value for the amount of movement to transmit to the lifting controller 305, using a value calculated in advance based on the weights of the mask 103, substrate 102, and substrate carrier 101, the magnetic flux density of the permanent magnets 211 and 207, etc., so that the transport height of the substrate carrier 101 does not change before and after holding the mask 103. The pre-calculated value is stored in a non-volatile memory 306, and the integrated controller 301 can retrieve the value from the memory 306.

[0059] Furthermore, the integrated controller 301 transmits the movement to the lifting controller 305 based on the value from the Z sensor 206, which is a detection means for detecting the vertical position of the substrate carrier 101. The command value for the quantity may be determined. For example, the amount of movement of the permanent magnet 211 by the position changing means 208 can be feedback-controlled so that the vertical position of the substrate carrier 101 is at the target position.

[0060] Furthermore, the integrated controller 301 may perform control to suppress changes in the transport height of the substrate carrier 101 due to changes in the weight of the transport object held by the substrate carrier 101 by combining the control of the position change means 208 by the lifting controller 305 and the current control of the coil 202 by the coil controller 302. In this case as well, the change in the transport height of the substrate carrier 101 is partially compensated by the change in magnetic force generated between the permanent magnet 211 and the permanent magnet 207 due to the position control of the permanent magnet 211 by the position change means 208, so that the amount of change in the current applied to the coil 202 can be reduced, and the increase in heat generation and power consumption can be suppressed.

[0061] Furthermore, if the film deposition apparatus 1 is configured to perform film deposition by switching between different types of masks 103, the weight of the object to be transported held by the substrate carrier 101 will change depending on the type of mask 103. In that case, the amount by which the substrate carrier 101 sinks from the state in Figure 2(B) in Figure 2(C) will differ depending on the type of mask 103. Therefore, in such a film deposition apparatus 1, the integrated controller 301 may control the position of the permanent magnet 211 by the position changing means 208 according to the type of mask 103 used for film deposition. For example, the film deposition apparatus 1 may be configured to write information about the type of mask 103 to the memory 306 at the timing when a new mask 103 is taken out from a mask stocker (not shown) to be fed into the mask path, and the integrated controller 301 may acquire information about the type of mask 103 currently in use from the memory 306. The method by which the integrated controller 301 acquires information about the mask 103 is not limited to this example; for example, an identification symbol can be provided on the mask 103, and the type of mask 103 can be acquired by reading the identification symbol with a sensor or camera.

[0062] As described above, the integrated controller 301 controls the transport and attitude of the substrate carrier 101 by the transport device 201a.

[0063] Figure 5 illustrates the alignment of the substrate 102 and the mask 103 performed in the alignment chamber 404 of the film deposition apparatus 1 of this embodiment.

[0064] Figure 5(A) schematically shows the alignment performed with the mask 103 placed on a mask stand 215 located at the lower part 2012a of the transport device 201a. In the alignment shown in Figure 5(A), the substrate 102 is held by the substrate carrier 101, and the alignment is performed with the substrate 102 and the mask 103 separated in the Z direction. First, the substrate mark 505, which is an alignment mark provided on the substrate 102, and the mask mark 506, which is an alignment mark provided on the mask 103, are imaged by the alignment camera 501, which is an imaging means. Based on the images of the substrate mark 505 and mask mark 506 captured by the alignment camera 501, the relative positional relationship between the substrate 102 and the mask 103 is measured. Based on the measured relative positional relationship, the substrate 102 and the mask 103 are precisely aligned by moving at least one of them, the substrate 102 or the mask 103, in the horizontal plane in the X, Y, and rotational directions around the Z axis using a horizontal movement mechanism (not shown).

[0065] Note that the alignment method is not limited to this example. High-precision alignment can also be achieved by performing rough alignment using a low-resolution alignment camera and fine alignment using a high-resolution alignment camera. If the depth of field of the rough alignment camera and the fine alignment camera are different, a lifting mechanism is provided to raise and lower the mask table 215 in the Z direction, so that the mask table 215 is different during rough alignment and fine alignment. The position in the Z-direction where the screw 103 is held may be varied.

[0066] After alignment is complete, the mask 103 is raised toward the substrate carrier 101 by a lifting mechanism (not shown), and the mask 103 is held by the substrate carrier 101 using the clamp 109, which is a mask holding means of the substrate carrier 101. In this state, the substrate mark 505 and mask mark 506 are imaged again using the alignment camera 501 to check whether any misalignment has occurred due to the operation of the mask 103 after alignment. If misalignment has occurred, alignment is performed again with the mask 103 placed on the mask stand 215. If no misalignment has occurred, the substrate carrier 101 holding the mask 103 and substrate 102 is transported to the downstream deposition chamber 405 by the transport device 201a.

[0067] Figure 5(B) shows the state in which the mask 103 is held by the substrate carrier 101 and the substrate 102 and mask 103 are in close contact. When the mask 103 is held by the substrate carrier 101, the weight of the object being transported held by the substrate carrier 101 increases by the amount of the mask 103, so the transport height of the substrate carrier 101 changes. As a result, as shown in Figure 5(B), the substrate mark 505 and mask mark 506 may fall outside the imageable range determined by the upper depth of field limit 502 and the lower depth of field limit 503 of the alignment camera 501. Therefore, it is not possible to image the substrate mark 505 and mask mark 506 in order to check whether or not there is a positional shift between the substrate 102 and the mask 103 after alignment, and as a result the alignment accuracy decreases.

[0068] Therefore, in the transport device 201a of this embodiment, as shown in Figure 5(C), the position changing means 208 changes the position of the permanent magnet 211 in the Z direction to bring it closer to the substrate carrier 101. As a result, the transport height of the substrate carrier 101 becomes the same as the transport height when the mask 103 is not held, as shown in Figure 5(A), and the substrate mark 505 and mask mark 506 fall within the imageable range determined by the upper depth of field limit 502 and the lower depth of field limit 503 of the alignment camera 501. Thus, it becomes possible to properly image the substrate mark 505 and mask mark 506 to confirm whether or not there is any positional misalignment between the substrate 102 and the mask 103 after alignment.

[0069] This invention describes a method for manufacturing an electronic device by forming an organic film on a substrate using the film deposition apparatus of this embodiment. Here, the method for manufacturing an organic EL element used in an organic EL display is described as an example of an electronic device. However, the electronic device is not limited to this. For example, the present invention can also be applied to the manufacture of thin-film solar cells and organic CMOS image sensors. The manufacturing method of the electronic device of this embodiment includes a step of forming an organic film on a substrate using the film deposition apparatus of the above embodiment. It also includes a step of forming a metal film or a metal oxide film after forming the organic film on the substrate. The structure of an organic EL display device 600 using an organic EL element manufactured by such a process will be described below.

[0070] Figure 6(A) shows an overall view of the organic EL display device 600, and Figure 6(B) shows the cross-sectional structure of a single pixel of the organic EL display device 600. As shown in Figure 6(A), the display area 61 of the organic EL display device 600 has multiple pixels 62, each having multiple light-emitting elements, arranged in a matrix. Each light-emitting element has a structure comprising an organic layer sandwiched between a pair of electrodes. Here, a pixel refers to the smallest unit capable of displaying a desired color in the display area 61. The pixels 62 of the organic EL display device 600 are composed of a combination of a first light-emitting element 62R, a second light-emitting element 62G, and a third light-emitting element 62B, each emitting light in a different color. The first light-emitting element 62R, the second light-emitting element 62G, and the third light-emitting element 62B are a red light-emitting element, a green light-emitting element, and a blue light-emitting element, respectively. Note that the number of light-emitting elements per pixel and the combination of emitted colors are not limited to this example. For example, a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element is possible, or at least one color is sufficient. Also, each light-emitting element is multiple It may be composed of multiple light-emitting layers stacked on top of each other.

[0071] A pixel 62 may be composed of multiple light-emitting elements that emit light of the same color, and a color filter may be used in which different color conversion elements are arranged to correspond to each light-emitting element, thereby enabling a single pixel 62 to display a desired color. For example, a pixel 62 may be composed of three white light-emitting elements, and a color filter may be used in which red, green, and blue color conversion elements are arranged to correspond to each light-emitting element. Alternatively, a pixel 62 may be composed of three blue light-emitting elements, and a color filter may be used in which red, green, and colorless color conversion elements are arranged to correspond to each light-emitting element. Note that the number of light-emitting elements per pixel and the combination of emitted colors are not limited to these examples. In the latter case, by using a quantum dot color filter (QD-CF) made of quantum dot (QD) material as the material constituting the color filter, the display color gamut can be widened compared to an organic EL display device that does not use a quantum dot color filter.

[0072] Figure 6(B) is a schematic partial cross-sectional view of the line A and B in Figure 6(A). Pixel 62 has an organic EL element formed on a substrate 5, comprising a first electrode (anode) 64, a hole transport layer 65, an emissive layer 66R, 66G, or 66B, an electron transport layer 67, and a second electrode (cathode) 68. The hole transport layer 65, emissive layers 66R, 66G, 66B, and electron transport layer 67 are organic layers. The emissive layer 66R is an organic EL layer that emits red light, the emissive layer 66G is an organic EL layer that emits green light, and the emissive layer 66B is an organic EL layer that emits blue light. When a color filter or quantum dot color filter is used, the color filter or quantum dot color filter is placed on the light-emitting side of each emissive layer, i.e., at the top or bottom of Figure 6(B).

[0073] The light-emitting layers 66R, 66G, and 66B are organic EL elements, which are light-emitting elements that emit red, green, and blue light, respectively. The light-emitting layers 66R, 66G, and 66B are formed according to the arrangement pattern of the light-emitting elements 62R, 62G, and 62B. The first electrode 64 is formed for each light-emitting element and is separated from each other. The hole transport layer 65, electron transport layer 67, and second electrode 68 may be formed to be shared by multiple light-emitting elements 62R, 62G, and 62B, or they may be formed separately for each light-emitting element. An insulating layer 69 is provided between the first electrode 64 and the second electrode 68 to prevent short circuits caused by foreign matter. Since organic EL layers degrade due to moisture and oxygen, a protective layer P is provided to protect the organic EL elements from moisture and oxygen.

[0074] This paper describes a method for manufacturing an organic EL display device as an electronic device.

[0075] First, a substrate 5 is prepared on which a circuit (not shown) for driving the organic EL display device and the first electrode 64 are formed.

[0076] Next, a resin layer such as acrylic resin or polyimide is formed on the substrate 5 on which the first electrode 64 is formed by spin coating. The resin layer is then patterned by lithography so that an opening is formed in the area where the first electrode 64 is formed, thereby forming an insulating layer 69. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0077] Next, the substrate 5 with the insulating layer 69 patterned is brought into the first film deposition apparatus, the substrate is held in a substrate holding unit, and the hole transport layer 65 is deposited as a common layer on the first electrode 64 of the display area. The hole transport layer 65 is deposited by vacuum deposition. In practice, the hole transport layer 65 is formed to a size larger than the display area 61, so a high-resolution mask is not required. Here, the film deposition apparatus used in this step and in the deposition of each of the following layers is a film deposition apparatus using the deposition apparatus described in any of the embodiments above.

[0078] Next, the substrate 5, on which the hole transport layer 65 has been formed, is loaded into the second film deposition apparatus and held in the substrate holding unit. The substrate 5 and the mask 6 are aligned, the substrate 5 is placed on the mask 6, and a red light-emitting layer 66R is deposited on the portion of the substrate 5 where the red light-emitting elements are to be placed. By using the film deposition apparatus of Embodiment 2, the alignment of the mask 6 and the substrate 5 can be performed with high precision, and the mask 6 and the substrate 5 can be brought into good contact, thus enabling high-precision film deposition.

[0079] Similar to the deposition of the light-emitting layer 66R, a light-emitting layer 66G that emits green light is deposited using a third deposition apparatus, and then a light-emitting layer 66B that emits blue light is deposited using a fourth deposition apparatus. After the deposition of the light-emitting layers 66R, 66G, and 66B is completed, an electron transport layer 67 is deposited over the entire display area 61 using a fifth deposition apparatus. Each of the light-emitting layers 66R, 66G, and 66B may be a single layer or a layer made up of multiple different layers stacked together. The electron transport layer 67 is formed as a common layer for the three colored light-emitting layers 66R, 66G, and 66B. In Embodiment 2, the electron transport layer 67 and the light-emitting layers 66R, 66G, and 66B are deposited by vacuum deposition.

[0080] Next, a second electrode 68 is formed on the electron transport layer 67. The second electrode may be formed by vacuum deposition or by sputtering. After that, the substrate 5 on which the second electrode 68 has been formed is moved to a sealing apparatus and a sealing process is performed in which a protective layer P is formed by plasma CVD, completing the organic EL display device 600. In this example, the protective layer P is formed by the CVD method, but it is not limited to this and may also be formed by the ALD method or the inkjet method.

[0081] Between the time the substrate 5, which has the insulating layer 69 patterned on it, is brought into the film deposition apparatus and the time the protective layer P is deposited, the substrate 5 is exposed to an atmosphere containing moisture and oxygen, and the light-emitting layer may deteriorate due to moisture and oxygen. In Embodiment 2, the loading and unloading of the substrate 5 between the film deposition apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere. [Explanation of Symbols]

[0082] 1: Film deposition apparatus, 101: Substrate carrier, 102: Substrate, 211: Permanent magnet, 208: Positioning means

Claims

1. An in-line film deposition apparatus that deposits films while transporting substrates, A substrate carrier that holds the aforementioned substrate, A magnetic force generating means for generating a magnetic force to magnetically levitate the substrate carrier, A position changing means for changing the vertical position of the magnetic force generating means, A film deposition apparatus characterized by comprising the following features.

2. The substrate carrier has a mask holding means for holding the mask, The film deposition apparatus according to claim 1, wherein the position changing means changes the position of the magnetic force generating means so that when the substrate carrier is holding the mask, the magnetic force generating means is closer to the substrate carrier than when the substrate carrier is not holding the mask.

3. The system has alignment means for aligning the substrate held on the substrate carrier with the mask, The film deposition apparatus according to claim 1 or 2, wherein when the alignment is performed while the substrate carrier is not holding the mask, the position of the magnetic force generating means is changed so that after the alignment is performed the magnetic force generating means is closer to the substrate carrier than when the substrate carrier is holding the mask.

4. The alignment means includes imaging means for imaging alignment marks provided on the substrate and the mask. The film deposition apparatus according to claim 3, wherein the position changing means changes the position of the magnetic force generating means so that the transport height of the substrate carrier falls within the depth of field range of the imaging means.

5. The aforementioned position changing means is If the weight of the object to be transported held by the substrate carrier increases, the position of the magnetic force generating means is changed so that it moves closer to the substrate carrier. Claims 1 to 1: When the weight of the object to be transported held by the substrate carrier decreases, the position of the magnetic force generating means is changed so that it moves away from the substrate carrier. A film deposition apparatus as described in any one of item 4.

6. A first magnet is provided on the substrate carrier. The magnetic force generating means has a second magnet located below the first magnet, The substrate carrier is supported vertically by the repulsive force generated between the first magnet and the second magnet. The film deposition apparatus according to any one of claims 1 to 5, wherein the position changing means changes the vertical position of the second magnet.

7. A first magnet is provided on the substrate carrier. The magnetic force generating means has a third magnet located above the first magnet, The substrate carrier is supported vertically by the attractive force generated between the first magnet and the third magnet. The film deposition apparatus according to any one of claims 1 to 5, wherein the position changing means changes the vertical position of the third magnet.

8. The system includes a detection means for detecting the vertical position of the substrate carrier, The film deposition apparatus according to any one of claims 1 to 7, wherein the position changing means changes the position of the magnetic force generating means based on the vertical position of the substrate carrier.

9. The aforementioned film deposition apparatus is capable of performing film deposition using different types of masks. The film deposition apparatus according to any one of claims 1 to 8, wherein the position changing means changes the position of the magnetic force generating means according to the type of mask used for film deposition.

10. A film deposition method in which a substrate carrier capable of holding a substrate and a mask is levitated and transported by a magnetic force generated by a magnetic force generating means, while a film is deposited on the substrate via a mask, A mask holding step in which the mask is held on the substrate carrier, After the mask holding step, a position changing step is performed to change the vertical position of the magnetic force generating means, A method for forming a film, characterized by having the following features.

11. The film formation method according to claim 10, further comprising an alignment step of aligning the substrate held on the substrate carrier with the mask before the mask holding step.

12. The film formation method according to claim 11, further comprising the step of changing the position of the magnetic force generating means so that the transport height of the substrate carrier falls within the depth of field range of an imaging means for imaging alignment marks provided on the substrate and the mask.

13. The film formation method according to any one of claims 10 to 12, further comprising the step of changing the position of the magnetic force generating means so that when the substrate carrier is holding the mask, the magnetic force generating means is closer to the substrate carrier than when the substrate carrier is not holding the mask.

14. When the weight of the object to be transported held by the substrate carrier increases, the position of the magnetic force generating means is changed so that it moves closer to the substrate carrier. When the weight of the object to be transported held by the substrate carrier decreases, the position of the magnetic force generating means is changed so that it moves away from the substrate carrier. A film formation method according to any one of claims 10 to 13, comprising:

15. A detection step for detecting the vertical position of the substrate carrier, A step of changing the position of the magnetic force generating means based on the vertical position of the substrate carrier. 、 A film formation method according to any one of claims 10 to 14.

16. A method for forming a film according to any one of claims 10 to 15, further comprising the step of changing the position of the magnetic force generating means according to the type of mask used for film formation.

17. A method for manufacturing an electronic device, characterized by comprising the step of forming an organic film on a substrate using the film formation method described in any one of claims 10 to 16.

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