Heat pipe with in-plane heat spreader and load mechanism

Abstract

To provide a device, a method, and a system related to enabling an in-plane heat spreader and a heat pipe with a load mechanism.SOLUTION: An electronic device according to an embodiment of the present specification includes a substrate, one or more heat sources on the substrate, one or more heat pipes that are thermally coupled to the one or more heat sources, a heat spreader that is coupled to the one or more heat pipes, and is in-plane with the heat pipes, and one or more load mechanisms coupled to at least a part of the one or more heat pipes and the substrate. The one or more load mechanisms are in-plane with the spreader and the one or more heat pipes.SELECTED DRAWING: Figure 4G

Description

Technical Field

[0001] The present disclosure generally relates to the field of computing and / or device cooling, and more particularly to heat pipes with in-plane heat spreaders and loading mechanisms.

Background Art

[0002] A new trend in electronic devices is changing the expected performance and form factor of devices, as devices and systems are expected to improve performance and functionality while having a relatively thin profile. However, improving performance and / or functionality causes an increase in the thermal challenges of the devices and systems, especially in the case of thin devices.

Brief Description of the Drawings

[0003] To provide a more complete understanding of the present disclosure and its features and advantages, reference is made to the following description in conjunction with the accompanying drawings. Here, like reference numerals represent like parts. [Figure 1] FIG. 1 is a simplified block diagram of a system for enabling a heat pipe with an in-plane heat spreader and a loading mechanism, according to one embodiment of the present disclosure. [Figure 2A] FIG. 2 is a simplified block diagram of a portion of a system for enabling a heat pipe with an in-plane heat spreader and a loading mechanism, according to one embodiment of the present disclosure. [Figure 2B] FIG. 3 is a simplified block diagram of a portion of a system for enabling a heat pipe with an in-plane heat spreader and a loading mechanism, according to one embodiment of the present disclosure. [Figure 3A] FIG. 4 is a simplified block diagram of a portion of a system for enabling a heat pipe with an in-plane heat spreader and a loading mechanism, according to one embodiment of the present disclosure. [Figure 3B] FIG. 5 is a simplified block diagram of a portion of a system for enabling a heat pipe with an in-plane heat spreader and a loading mechanism, according to one embodiment of the present disclosure. [Figure 4A]This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 4B] This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 4C] This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 4D] This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 4E] This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 4F] This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 4G] This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 5A] This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 5B] This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 6] This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 7A]This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 7B] This is a simplified block diagram of part of a system for enabling a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. [Figure 8] This is a simplified block diagram of a system including heat pipes embedded in a chassis, according to one embodiment of the present disclosure. The figures in the drawings are not necessarily drawn to a constant scale, as their dimensions may vary considerably without departing from the scope of the present disclosure. [Modes for carrying out the invention]

[0004] Exemplary Embodiments The following detailed description provides examples of equipment, methods, and systems related to enabling heat pipes with in-plane heat spreaders and load mechanisms. As used herein, the term “in-plane” and other derivatives include being substantially in the same plane, along substantially the same axis, and / or substantially parallel. For example, features such as structure, function, and / or properties are described with reference to one embodiment for convenience, and various embodiments may be implemented using any suitable one or more of the features described.

[0005] In the following description, various aspects of the exemplary embodiments are described using terminology commonly used by those skilled in the art to convey the substance of their work. However, it will be apparent to those skilled in the art that the embodiments disclosed herein can be carried out in only some of the aspects described. For illustrative purposes, certain numbers, materials, and configurations are given to give a complete understanding of the exemplary embodiments. However, it will be apparent to those skilled in the art that the embodiments disclosed herein can be carried out without certain details. In other examples, well-known features are omitted or simplified so as not to obscure the exemplary embodiments.

[0006] As used herein, the terms “above,” “below,” “below,” “between,” and “above” refer to the relative position of one layer or component to another layer or component. For example, a layer placed above or below another layer may be in direct contact with the other layer, or it may have a layer interposed between them. Furthermore, a layer placed between two layers may be in direct contact with both layers, or it may have a layer interposed between them. In contrast, a first layer “directly above” a second layer is in direct contact with that second layer. Similarly, unless otherwise specified, a feature placed between two features may be in direct contact with an adjacent feature, or it may have one or more intermediate layers. The term “about” indicates a tolerance of 10 percent. For example, about 1 millimeter includes 1 millimeter and ±0.1 millimeters from 1 millimeter.

[0007] Embodiments of the embodiments disclosed herein may be formed or implemented on or on substrates such as non-semiconductor substrates or semiconductor substrates. In one embodiment, the non-semiconductor substrate may be silicon dioxide, or an interlayer dielectric composed of silicon dioxide, silicon nitride, titanium oxide, and other transition metal oxides. While some examples of materials that can form non-semiconductor substrates are described herein, any material that can function as a basis for constructing a non-semiconductor device is within the spirit and scope of the embodiments disclosed herein.

[0008] In another embodiment, the semiconductor substrate may be a crystalline substrate formed using bulk silicon or a silicon-on-insulator substructure. In yet another embodiment, the semiconductor substrate may be formed using alternative materials, which may or may not be combined with silicon, and which include, but are not limited to, germanium, indium antimonide, lead telluride, indium arsenide, indium phosphide, gallium arsenide, indium gallium arsenide, gallium antimonide, or other combinations of Group III-V or Group IV materials. In yet another example, the substrate may be a flexible substrate containing transparent oxides such as 2D materials like graphene and molybdenum disulfide, organic materials like pentacene, indium gallium zinc oxide poly / amorphous (low temperature of dep) III-V semiconductors and germanium / silicon, and other non-silicon flexible substrates. While some examples of materials that can form a substrate are described herein, any material that can function as a basis for constructing a semiconductor device is within the spirit and scope of the embodiments disclosed herein.

[0009] In the following detailed description, reference is made to the accompanying drawings which form part of this specification, where similar figures indicate similar parts throughout, and examples illustrate embodiments in which the subject matter of this disclosure may be carried out. It should be understood that other embodiments may be utilized and structural or logical modifications may be made without departing from the scope of this disclosure. Accordingly, the following detailed description should not be construed as restrictive, and the scope of embodiments is defined by the accompanying claims and their equivalents. For the purposes of this disclosure, the phrase "A or B" means (A), (B), or (A and B). For the purposes of this disclosure, the phrase "A, B, or C" means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B, and C).

[0010] Detailed descriptions may use perspective-based descriptions such as top / bottom, inside / outside, above / below ~, etc. Such descriptions are used solely to facilitate discussion and are not intended to limit the application of the embodiments described herein to any particular orientation. Detailed descriptions may use the phrases “in one embodiment” or “in an embodiment,” which may refer to one or more of the same or different embodiments, respectively. Detailed descriptions may also use the phrases “in one example” or “in an example,” which may refer to one or more of the same or different examples, respectively. Furthermore, terms such as “comprising,” “including,” and “having” as used in reference to embodiments of this disclosure are synonyms.

[0011] The term “combined with” may be used herein, along with its derivatives. The term “combined” may mean one or more of the following: The term “combined” may mean that two or more elements are in direct physical, thermal, or electrical contact. However, the term “combined” may also mean that two or more elements are indirectly in contact with each other but still cooperate or interact with each other, and that one or more other elements are joined or connected between the elements said to be combined with each other. The term “directly combined” may mean that two or more elements are in direct contact.

[0012] Referring to Figure 1, Figure 1 is a simplified block diagram of an electronic device 100a comprising a heat pipe with an in-plane heat spreader and a load mechanism, according to one embodiment of the present disclosure. In one example, the electronic device 100a may include a first housing 102 and a second housing 104. The first housing 102 and the second housing 104 may be rotatably coupled to each other using a hinge 106. The first housing 102 may include a display 108. The second housing 104 may include one or more heat sources 110, a heat pipe with an in-plane heat spreader and a load mechanism 112, and one or more heat sinks 114.

[0013] Each of the one or more heat sources 110 may be a heat-generating device (e.g., a processor, logic unit, field-programmable gate array (FPGA), chipset, integrated circuit (IC), graphics processor, graphics card, battery, memory, or any other type of heat-generating device). The heat pipe with an in-plane heat spreader and load mechanism 112 is configured to help cool one or more heat sources 110 and transfer heat from the heat sources 110 to the heat sink 114. The heat sink 114 is configured to help transfer the heat collected by the heat pipe with the in-plane heat spreader and load mechanism 112 away from the electronic device 100a (e.g., to the environment surrounding the electronic device 100a). The heat sink 114 may be a passive or active cooling device that helps reduce the thermal energy or temperature of one or more heat sources 110. In one example, the heatsink 114 can draw air into the second housing 104 through one or more inlet vents in the housing or chassis of the electronic device 100a, and use the air to help dissipate the heat collected by the heat pipes, which are equipped with an in-plane heat spreader and a load mechanism 112.

[0014] A heat pipe with an in-plane heat spreader and a loading mechanism 112 is configured to occupy a low Z-height while still applying a load to the heat source 110. In a particular example, a heat pipe with an in-plane heat spreader and a loading mechanism 112 can include a heat pipe, a heat spreader, and a bimetal loading mechanism. The bimetal loading mechanism can be a composite loading mechanism or a composite spring element. The heat spreader and the bimetal loading mechanism are in the same plane as or in-plane with the heat pipe to reduce the overall system stack and keep the Z-height relatively low. Terms such as "Z-height", "Z-stack height", "Z-position", etc. refer to the height along the "Z" axis of the (x, y, z) coordinate axes or the Cartesian coordinate system.

[0015] The bimetal loading mechanism within the heat pipe with an in-plane heat spreader and a loading mechanism 112 can be configured to generate a load applied to the heat source 110. In one example, the bimetal loading mechanism can be a composite spring element. The combination of metals (e.g., steel and copper) in the bimetal loading mechanism can be configured to utilize the heat generated during system operation to generate an additional load on the heat source 110, which helps for better thermal interface material (TIM) compression during system operation. In one example, the bimetal loading mechanism can include a relatively high-expansion material (e.g., copper) and a relatively low-expansion material (e.g., steel) to provide stiffness for the load. In another example, one or both of the metals within the bimetal loading mechanism can be thermally conductive to allow for additional dissipation of heat from the heat source. The in-plane heat spreader and the loading mechanism 112 are configured to enable a thin form factor system that can provide a thermal solution for a high-power microprocessor, including both steady-state continuous power and short-term high power used to enable increased computational performance during opportunistic overclocking.

[0016] It should be understood that other embodiments can be utilized and structural changes can be made without departing from the scope of the present disclosure. Substantial flexibility is provided in that any suitable arrangement and configuration can be provided without departing from the teachings of the present disclosure.

[0017] As used herein, the term "when" can be used to indicate the temporal nature of an event. For example, the phrase "event 'A' occurs when event 'B' occurs" is interpreted to mean that event A may occur before, during, or after the occurrence of event B, but is still associated with the occurrence of event B. For example, event A occurs, is occurring, or will occur in response to the occurrence of event B, or in response to a signal indicating that event B has occurred. In this case, event A occurs when event B occurs. References to "one embodiment" or "an embodiment" in the present disclosure mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. The appearances of the phrases "in one embodiment" or "in an embodiment" do not necessarily refer to the same embodiment. The appearances of the phrases "for example," "in one example," or "in some examples" do not necessarily refer to the same example.

[0018] To explain certain exemplary techniques, the following basic information can be considered as a basis on which the present disclosure can be properly described. End users have more media and communication options than ever before. Currently, many significant technological trends are underway (e.g., increasing computing elements, increasing online video services, increasing Internet traffic, increasing complexity of processing, etc.). These trends are changing the expected performance and form factor of devices because devices and systems are expected to have improved performance and functionality while having a relatively thin profile. However, the increase in performance and / or functionality causes an increase in the thermal challenges of devices and systems, especially in the case of form factor devices with a thin profile.

[0019] The requirements for improved performance in thin-film systems involve relatively thin thicknesses or low Z-heights, yet still present the challenge of designing thermal solutions that generate the necessary load to achieve thin, uniform layers of thermal imager (TIM). Furthermore, insufficient load on the heat source limits the choice of TIMs used in system-on-a-chip (SoCs). TIMs used in low-load applications generally have higher thermal resistance compared to TIMs used in high-load applications. This degrades device performance and slows down data throughput.

[0020] One current method typically achieving thermal performance targets is by reducing the thermal resistance between the SoC and the thermal solution. This is typically reduced by increasing the thermal solution load on the SoC (which may increase the risk of BGA solder joint failure) or by switching to a different TIM that reduces thermal resistance at the same pressure (which may be approaching the point where the returns of state-of-the-art grease TIMs decrease, and / or by the cost of mass-producing a fundamentally new class of TIM (such as liquid metal)). Furthermore, several other systems currently in use to achieve thermal performance targets increase the thermal capacity of the system near the SoC. Increasing the thermal capacity of the system near the SoC is typically achieved by increasing the thickness of the cold plate or heat spreader. However, this can directly affect the overall system thickness and Z-height.

[0021] The most typical thermal solution design involves using heat pipes and copper spreaders in combination with mounting springs to obtain the desired load. The mounting springs function solely for loading purposes and contribute minimally to thermal performance other than loading the heat source. Mounting springs are typically made of steel, which helps to deflect over a specified distance to apply the required load to the heat source and form a uniform thickness of the thermal inductance (TIM). The heat pipes, copper spreaders, and mounting springs are usually stacked in layers, which can increase the overall thickness of the thermal solution and potentially increase the Z-height of the system. What is needed is a heat pipe with an in-plane heat spreader and loading mechanism.

[0022] As outlined in Figure 1, a system enabling a heat pipe with an in-plane heat spreader and load mechanism can solve these problems (and other problems). For example, a heat pipe with an in-plane heat spreader and load mechanism (e.g., a heat pipe with an in-plane heat spreader and load mechanism 112) may include a heat pipe, a heat spreader, and a bimetallic load mechanism. With a heat pipe with an in-plane heat spreader and load mechanism, an electronic device can handle the same power as some current heat pipe systems, but with a thinner form factor, allowing it to handle higher power at the same thickness as some current systems, and / or improve computing performance in a shorter time by opportunistic overclocking and / or by extending the opportunistic overclocking period to improve computing performance.

[0023] Heat pipes can extend from a heat source to a heat sink (e.g., heat sink 114 or some other thermal cooling device or heat dissipator) to help dissipate the heat collected from the heat source. In one example, the heat sink may include a heat dissipator such as a heat sink with fins that are cooled by forced air from outside the housing or chassis. In a particular example, the airflow of forced air may enter from outside the electronic device including the heat sink, through an inlet vent, through a fan and fins, and then exit through an exhaust vent.

[0024] In certain examples, the load mechanism is a bimetallic spring (e.g., a composite bimetallic spring of steel and copper). The heat spreader and load mechanism are in-plane or on the same plane as the heat pipe to help reduce the overall system stack and to have a relatively low Z height that helps reduce the overall system stack. Heat pipes with in-plane heat spreaders and load mechanisms can help reduce the overall Z height or thickness by about 0.3 to about 0.5 millimeters compared to some current systems. The load mechanism can help apply a desired load to the heat source without compromising the heat diffusion function or the Z height of the system. Furthermore, as the temperature rises, the load mechanism can provide additional force when heated to assist in more TIM compression and improve thermal performance. More specifically, the applied load can allow the system to draw heat or thermal energy away from the heat source, helping to cool the heat source. In some examples, the applied load can compress the TIM and make heat transfer from the heat source to the heat pipe more efficient than if no load were applied. The applied load depends on the materials used in the load mechanism and the form factor of the device containing the load mechanism. The load can be 1 pound or between less than 100 pounds and more than 100 pounds, depending on the materials used in the load mechanism, the form factor, design constraints, etc.

[0025] The loading mechanism can be constructed from a bimetal. A bimetal is a composite material composed of two or more metal layers with different coefficients of thermal expansion. When these layers are permanently bonded together, they bend or change curvature when exposed to temperature changes. This bending or change in curvature in response to temperature changes is a characteristic of most bimetal materials. When the bimetal material is completely constrained when heated (for example, when fixed to a substrate), the bimetal material generates or produces force instead of bending. The force produced is equal to the mechanical force required to return the bimetal material to its original position, and this force can be used to apply pressure to a heat source.

[0026] More specifically, when a bimetallic material is exposed to temperature changes, it tends to bend or change its curvature due to the difference in thermal expansion coefficients between the two metals. If the bimetallic material is completely constrained during heating or cooling, it generates or produces force instead of bending. The force produced is equal to the mechanical force required to return the bimetallic material to its original position from the bending that would be expected due to the temperature change if the bimetallic material could move and bend without constraint. This additional force can also help to hold the TIM in place under higher loads between various operating conditions. The rate of increase in load due to temperature changes is a function of the bimetal's composition, flexibility, operating temperature, spring dimensions (e.g., length, thickness, width), and other design choices limited by design constraints.

[0027] In an illustrative example, for a typical cantilever spring element, the force generated by a change in temperature can be calculated using the following formula.

[0028] Thermal force P=(2.12EF(T2-T1)wt 2 / L

[0029] Here, "t" is the thickness of the load mechanism, "w" is the width of the load mechanism, "L" is the length of the load mechanism, "E" is the elastic modulus of the load mechanism, "(T2-T1)" is the temperature change of the load mechanism, "P" is the force applied by the load mechanism, and "F" is the flexibility of the load mechanism.

[0030] In certain exemplary cases, finite element structural simulations can be used to demonstrate the load generated by a composite spring (e.g., copper and steel) compared to a copper spreader as a spring element. Because steel (E:193GPa) has a higher Young's modulus than copper (E:112GPa), the composite spring helps achieve a higher load for a given spring deflection. Limiting the deflection to achieve the desired load helps to avoid the Z-height constraint of the component. The thicknesses of the copper and steel in the composite spring can be configured to satisfy the thermal and structural requirements of a given design.

[0031] For a typical cantilever spring with a thickness of 0.5 mm, a width of 5 mm, and a length of 20 mm, operating at temperatures ranging from 25°C to 80°C, the thermal load due to the bimetallic material will be on the order of 0.2 to 0.5 pounds, depending on the material selection. The total load increase with a typical four-point mounting system can be between approximately 0.8 and 2 pounds. This corresponds to an 11 to 27 percent increase in force due to the thermal effect of the bimetal.

[0032] In a specific exemplary case, a composite spring generated 10 percent more load compared to a copper spring element alone with the same dimensions and deflection. The increase in load due to the composite spring compared to a copper spring alone depends on other factors such as the thickness of the substrate (e.g., printed circuit board), the mounting position of the substrate, and the mounting location. A high percentage (up to approximately 23%) increase in force was observed with the composite spring, and the increase depends on the design choice. For comparison, increasing the substrate thickness from 0.6 mm to 0.7 mm resulted in an 11% increase in load.

[0033] In some examples, a heat pipe with an in-plane heat spreader and a load mechanism 112 can help reduce the overall Z thickness by approximately 0.3 to 0.5 millimeters in some systems. The load mechanism 112, acting as a composite in-plane spring (e.g., a composite material of steel and copper), helps achieve the desired load on the heat source without impairing heat diffusion. Due to temperature changes, the additional force generated by the load mechanism 112 acting as a composite spring during system operation can help create additional TIM compression (which can be beneficial to thermal performance). As an additional benefit, in some examples, the heat spreader can be used as an EMI shield.

[0034] In exemplary embodiments, electronic device 100a (and 100b shown in Figure 8) means encompassing other devices, components, elements, or objects, including computers, personal digital assistants (PDAs), laptops or electronic notebooks, mobile phones, tablets, smartphones, network elements, network equipment, servers, routers, switches, gateways, bridges, load balancers, processors, modules, or heat sources. Electronic device 100a (and 100b) may include appropriate hardware, software, components, modules, or objects that facilitate their operation, as well as appropriate interfaces for receiving, transmitting, and / or communicating data or information in a network environment. This may include appropriate algorithms and communication protocols that enable the effective exchange of data or information. Electronic device 100a (and 100b) may include virtual elements.

[0035] Regarding the internal structure, the electronic device 100a (and 100b) may include memory elements for storing information used in operation. The electronic device 100a (and 100b) may hold information (as needed, based on specific needs) in any suitable memory element (e.g., random access memory (RAM), read-only memory (ROM), erasable programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), application-specific integrated circuit (ASIC), etc.), software, hardware, firmware, or other suitable components, devices, elements, or objects. All memory items described herein should be interpreted as being included in the broad sense of “memory elements.” Furthermore, information used, tracked, transmitted, or received may be provided to any database, register, queue, table, cache, control list, or other storage structure, all of which can be referenced within an appropriate time frame. Such storage options may also be included in the broad sense of “memory elements” as used herein.

[0036] In certain exemplary embodiments, functionality may be implemented by logic encoded in one or more tangible media (e.g., ASICs, digital signal processor (DSP) instructions, software executed by a processor (potentially including object code and source code), or embedded logic provided on other similar machines, etc.), which may include non-temporary computer-readable media. In some of these examples, memory elements may store data used for the operations described herein. This includes memory elements that can store software, logic, code, or processor instructions executed to perform an activity or operation.

[0037] Furthermore, the heat source 110 may be one or more processors capable of executing software or algorithms, or may include such processors. In one example, a processor can convert an element or article (e.g., data) from one state or thing to another. In another example, an activity may be implemented with fixed logic or programmable logic (e.g., software / computer instructions executed by a processor), and the heat element identified herein may be any type of programmable processor, programmable digital logic (e.g., field-programmable gate array (FPGA), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM)), or ASIC including digital logic, software, code, electronic instructions, or a suitable combination thereof). Any of the potential processing elements, modules, and machines described herein should be interpreted as being included in the broad sense of “processor”.

[0038] Looking at Figure 2A, which is a simplified block diagram of the second housing 104a with the top surface cut off. The second housing 104a may include a heat pipe with an in-plane heat spreader and load mechanism 112a, and a substrate 116. The heat pipe with the in-plane heat spreader and load mechanism 112a may include a heat pipe 118a, a heat spreader 120a, and one or more load mechanisms 122a and 122b.

[0039] The heat pipe 118a may be a vibrating heat pipe, a pulsating heat pipe, a steam chamber heat pipe, or any other type of heat transfer device capable of transferring heat away from one or more heat sources (dissipating heat). The heat pipe 118a may have a thickness between approximately 2 mm and approximately 12 mm. In other examples, the heat pipe 118a may have a thickness of approximately 1.4 mm, approximately 10 mm, approximately 3 mm to approximately 8 mm, or any other thickness that allows the heat pipe 118a to transfer heat away from one or more heat sources. The heat spreader 120a is capable of transferring heat away from one or more heat sources. The load mechanisms 122a and 122b may be bimetallic springs that apply a load to the heat sources. The heat pipe 118a can be almost any shape, and can be virtually any heat pipe, depending on the design constraints. The heat spreader 120a can have any profile, depending on the design constraints. The load mechanisms 122a and 122b can be coupled to a substrate (e.g., a motherboard or chassis) using one or more substrate fixing means. The number and location of the substrate fixing means depend on design constraints and the number and location that allow the load mechanisms 122a and 122b to be firmly attached to the substrate, and when the load mechanisms 122a and 122b are heated, they bend, generating load and pressure on the heat source.

[0040] Looking at Figure 2B, which is a simplified block diagram of the second housing 104a with a side view cut off. The second housing 104a may include a heat pipe with an in-plane heat spreader and load mechanism 112a, and a substrate 116. The heat pipe with an in-plane heat spreader and load mechanism 112a may include a heat pipe 118a, a heat spreader 120a, and one or more load mechanisms 122a.

[0041] The heat pipe 118a can have a thickness between approximately 2 mm and approximately 12 mm. In other examples, the heat pipe 118a can have a thickness of approximately 1.4 mm, approximately 10 mm, approximately 3 mm to approximately 8 mm, or any other thickness that allows the heat pipe 118a to transfer heat away from one or more heat sources. The heat spreader 120a can have a thickness approximately equal to or less than that of the heat pipe 118a. For example, as shown in Figure 2B, the thickness of the heat spreader 120a is slightly thinner than that of the heat pipe 118a. The load mechanism 122a can have a thickness approximately equal to or less than that of the heat pipe 118a. For example, as shown in Figure 2B, the thickness of the load mechanism 122a is slightly thinner than that of the heat pipe 118a. By keeping the thickness of the heat spreader 120a and the load mechanisms 122a and 122b less than or equal to the heat pipe 118a, the heat spreader 120a and the load mechanisms 122a and 122b are in plane with the heat pipe 118a, which can help reduce the Z height of the second housing 104a.

[0042] The load mechanisms 122a and 122b can be fixed to the substrate 116 using load mechanism fixing means 124. In one example, the load mechanism fixing means 124 may be screws extending through the substrate 116 to the load mechanisms 122a and 122b or some other fixing means. In one example, the load mechanisms 122a and 122b may be bimetals in which one material has a larger coefficient of thermal expansion than the other material. When the load mechanisms 122a and 122b are heated, they tend to bend or change their curvature due to the difference in thermal expansion coefficients between the two metals. Since the load mechanisms 122a and 122b are fixed to the substrate 116 using load mechanism fixing means 124, the load mechanisms 122a and 122b are constrained and cannot bend, and instead generate a downward force toward the heat source 110. If the load mechanisms 122a and 122b are allowed to move without constraint, a force equal to the mechanical force required to return the load mechanisms 122a and 122b to their original positions from the bending that would have been expected to occur due to the temperature change will be generated.

[0043] Looking at Figure 3A, which is a simplified block diagram of the second housing 104b with the top surface cut off. The second housing 104b may include a heat pipe with an in-plane heat spreader and load mechanism 112b, and a substrate 116. The heat pipe with the in-plane heat spreader and load mechanism 112b may include one or more heat pipes 118b and 118c, a heat spreader 120b, and one or more load mechanisms 122c and 122d.

[0044] Each of the heat pipes 118b and 118c may be a vibrating heat pipe, a pulsating heat pipe, a steam chamber heat pipe, or another type of heat transfer device capable of transferring heat away from one or more heat sources. Each of the heat pipes 118b and 118c may have a thickness between approximately 2 mm and approximately 12 mm. In other examples, each of the heat pipes 118b and 118c may have a thickness of approximately 1.4 mm, approximately 10 mm, approximately 3 mm to approximately 8 mm, or other thicknesses that allow the heat pipes 118b and 118c to transfer heat away from one or more heat sources. The heat pipes 118b and 118c do not have to be the same thickness, and heat pipe 118b may have a different thickness from heat pipe 118c. The heat spreader 120b can transfer heat away from one or more heat sources. The loading mechanisms 122c and 122d may be made of bimetallic material that helps to load the heat sources.

[0045] Looking at Figure 3B, which is a simplified block diagram of the second housing 104b with a side view cut off. The second housing 104b may include a heat pipe with an in-plane heat spreader and load mechanism 112b, and a substrate 116. The heat pipe with the in-plane heat spreader and load mechanism 112b may include a heat pipe 118c, a heat spreader 120b (not shown), and one or more load mechanisms 122d.

[0046] The heat pipe 118c can have a thickness between approximately 2 mm and approximately 12 mm. In other examples, the heat pipe 118a can have a thickness of approximately 1.4 mm, approximately 10 mm, approximately 3 mm to approximately 8 mm, or other thicknesses that allow the heat pipe 118c to transfer heat away from one or more heat sources. The heat spreader 120b can have a thickness approximately equal to or less than the thickness of the heat pipe 118b (and / or 118c). For example, as shown in Figure 3B, the thickness of the heat spreader 120b is approximately the same as that of the heat pipe 118c and is therefore not visible in Figure 3B. The load mechanism 122d can have a thickness approximately equal to or less than that of the heat pipe 118b (and / or 118c). For example, as shown in Figure 3B, the thickness of the load mechanism 122d is approximately the same as that of the heat pipe 118c. By keeping the thickness of the heat spreader 120b and the load mechanisms 122c and 122d less than or equal to the heat pipes 118b and 118c, the heat spreader 120b and the load mechanisms 122c and 122d are in plane with the heat pipes 118b and 118c, which can help reduce the Z height of the second housing 104b.

[0047] The load mechanisms 122c and 122d can be fixed to the substrate 116 using load mechanism fixing means 124. In one example, the load mechanism fixing means 124 may be screws extending through the substrate 116 to the load mechanisms 122c and 122d or some other fixing means. In one example, the load mechanisms 122c and 122d may be bimetals in which one material has a larger coefficient of thermal expansion than the other. When the load mechanisms 122c and 122d are heated, they tend to bend or change their curvature due to the difference in thermal expansion coefficients between the two metals. Since the load mechanisms 122c and 122d are fixed to the substrate 116 using load mechanism fixing means 124, the load mechanisms 122c and 122d are constrained and cannot bend, and instead generate a downward force toward the heat source 110. If the load mechanisms 122c and 122d are allowed to move without constraint, a force equal to the mechanical force required to return the load mechanisms 122c and 122d to their original positions from the bending that would have been expected in them due to temperature changes is generated.

[0048] Looking at Figure 4A, which is a simplified block diagram of the initial stages of forming a heat pipe with an in-plane heat spreader and load mechanism 112b. In one example, heat pipe 118b can be joined or coupled to heat pipe 118c. In some examples, heat pipes 118b and 118c can be formed together and do not need to be joined. In other examples, only one heat pipe (e.g., heat pipe 118a) exists. During the initial stages of forming the heat pipe with the in-plane heat spreader and load mechanism 112b, the profiles of heat pipes 118b and 118c are determined.

[0049] Looking at Figure 4B, which is a simplified block diagram of the initial stages of forming a heat pipe with an in-plane heat spreader and load mechanism 112b. In one example, the heat spreader 120b is cut to include the profiles of the heat pipes 118b and 118c. In other examples, if the other heat pipes use different profiles, the heat spreader is cut to include the profiles of the other heat pipes.

[0050] Looking at Figure 4C, which is a simplified block diagram of the steps for forming a heat pipe with an in-plane heat spreader and a load mechanism 112b. In one example, the heat spreader 120b is cut to include the profiles of the heat pipes 118b and 118c. The heat pipes 118b and 118c can be coupled to the heat spreader 120b which includes the profiles of the heat pipes 118b and 118c.

[0051] Looking at Figure 4D, which is a simplified block diagram of the steps for forming a heat pipe with an in-plane heat spreader and load mechanism 112b. As shown in Figure 4D, the heat pipes 118b and 118c can be coupled to a heat spreader 120b that includes the profiles of the heat pipes 118b and 118c. In one example, the heat pipes 118b and 118c can be soldered to the heat spreader 120b. In another example, the heat pipes 118b and 118c can be coupled to the heat spreader 120b using copper tape, conductive adhesive tape, or other material that can help to bond the heat pipes 118b and 118c to the heat spreader 120b.

[0052] Looking at Figure 4E, which is a simplified block diagram of the steps for forming a heat pipe with an in-plane heat spreader and a load mechanism 112b. As shown in Figure 4E, the heat spreader 120b is cut to include the profiles of the load mechanisms 122c and 122d. The load mechanisms 122c and 122d can be coupled to the sides of the heat pipes 118b and 118c. For example, the load mechanism 122c can be coupled to one side of the heat pipe 118b, and the load mechanism 122d can be coupled to one side of the heat pipe 118c. If there is only one heat pipe, the load mechanism 122c can be coupled to one side of the heat pipe, and the load mechanism 122d can be coupled to the opposite side of the heat pipe.

[0053] Looking at Figure 4F, which is a simplified block diagram of the steps for forming a heat pipe with an in-plane heat spreader and a load mechanism 112b. As shown in Figure 4F, the load mechanisms 122c and 122d are coupled to the sides of the heat pipes 118b and 118c. In one example, the load mechanisms 122c and 122d can be soldered to the heat pipes 118b and 118c. In some examples, a bimetal is useful in the joining process when soldering the load mechanisms 122c and 112d to the heat pipes 118b and 118c. More specifically, if the load mechanisms 122c and 112d include a copper-steel bimetal, the copper in the bimetal is useful in the joining process when soldering the load mechanisms 122c and 122d to the heat pipes 118b and 118c. In other examples, the load mechanisms 122c and 122d can be coupled to the heat pipes 118b and 118c using copper tape, conductive adhesive tape, or other materials that can help couple the load mechanisms 122c and 122d to the heat pipes 118b and 118c.

[0054] Looking at Figure 4G, which is a simplified block diagram of a heat pipe with an in-plane heat spreader and a load mechanism 112b coupled to a heat source 110. As shown in Figure 4G, the load mechanism 122d is not in plane with the heat pipe 118c because the load mechanism 112d is not yet fixed to the load mechanism fixing means 124. Once the load mechanism 112d is fixed to the load mechanism fixing means 124 (for example, as shown in Figure 3B), when the load mechanism 122d (and 112c, not shown) is heated, the load mechanism 122d (and 112c) tends to bend or change its curvature due to the difference in the coefficients of thermal expansion between the two metals containing the load mechanism 112d (and 112c). Since the load mechanism 122d (and 112c) is fixed to the substrate 116 using the load mechanism fixing means 124, the load mechanism 122d (and 112c) is constrained and cannot bend, instead generating a downward force on the heat source 110. If the load mechanism 122d (and 112c) were allowed to move without constraint, a force equal to the mechanical force required to return the load mechanism 122d (and 112c) to its original position from the bending that would have been expected due to the temperature change would generate.

[0055] Looking at Figure 5A, which is a simplified exploded view of a heat pipe with an in-plane heat spreader and a load mechanism 112c. The heat pipe with the in-plane heat spreader and load mechanism 112c may include one or more heat pipes 118d and 118e, a heat spreader 120c, and one or more load mechanisms 122e and 122f. As shown in Figure 5A, the load mechanisms 122e and 122f are coupled to the sides of the heat pipes 118d and 118e before the heat pipes 118d and 118e are coupled to the heat spreader 120b. In one example, the load mechanisms 122e and 122f can be soldered to the heat pipes 118d and 118e. In some examples, a bimetallic strip is used to aid in the bonding process when soldering the load mechanisms 122e and 122f to the heat pipes 118d and 118e. More specifically, if the load mechanisms 122e and 112f include a copper-steel bimetal, the copper in the bimetal is useful in the bonding process when soldering the load mechanisms 122e and 122f to the heat pipes 118d and 118e. In other examples, the load mechanisms 122e and 122f can be bonded to the heat pipes 118d and 118e using copper tape, conductive adhesive tape, or other materials that can help bond the load mechanisms 122e and 122f to the heat pipes 118d and 118e. The heat spreader 120c may have notches that match the profiles of the heat pipes 118d and 118e and the load mechanisms 122e and 122f.

[0056] Each of the heat pipes 118d and 118e may be a vibrating heat pipe, a pulsating heat pipe, a steam chamber heat pipe, or another type of heat transfer device capable of transferring heat away from one or more heat sources. Each of the heat pipes 118d and 118e may have a thickness between approximately 2 mm and approximately 12 mm. In other examples, each of the heat pipes 118d and 118e may have a thickness of approximately 1.4 mm, approximately 10 mm, approximately 3 mm to approximately 8 mm, or other thicknesses that allow the heat pipes 118d and 118e to transfer heat away from one or more heat sources. The heat pipes 118d and 118e do not have to be the same thickness, and the heat pipe 118d may have a different thickness from the heat pipe 118e. The heat spreader 120c can transfer heat away from one or more heat sources. The load mechanisms 122e and 122f can be made of bimetallic material that helps to apply a load to the heat source.

[0057] The heat spreader 120c may have a thickness approximately equal to or less than the thickness of the heat pipes 118d and / or 118e. The load mechanisms 122e and 122f may have a thickness approximately equal to or less than the thickness of the heat pipes 118d and / or 118e. By keeping the thickness of the heat spreader 120c and the load mechanisms 122e and 122f less than or equal to the thickness of the heat pipes 118d and 118e, the heat spreader 120c and the load mechanisms 122e and 122f are in plane with the heat pipes 118d and 118e and may help reduce the Z height between the heat pipe with the in-plane heat spreader and load mechanism 112c and the device including the heat pipe with the in-plane heat spreader and load mechanism 112c.

[0058] Looking at Figure 5B, which is a simplified exploded view of a heat pipe with an in-plane heat spreader and load mechanism 112c. The heat pipe with the in-plane heat spreader and load mechanism 112c may include one or more heat pipes 118d and 118e, a heat spreader 120c, and one or more load mechanisms 122e and 122f. As shown in Figure 5B, the heat pipes 118d and 118e can be coupled to the heat spreader 120c. For example, the heat pipes 118d and 118e can be soldered to the heat spreader 120c. In other examples, the heat pipes 118d and 118e can be coupled to the heat spreader 120c using copper tape, conductive adhesive tape, or other materials that may help to bond the heat pipes 118d and 118e to the heat spreader 120c.

[0059] Each of the one or more load mechanisms 122e and 122f may include one or more substrate fixing means 128. The substrate fixing means 128 may be coupled with load mechanism fixing means 124 (not shown) to help fix each of the one or more load mechanisms 122e and 122f to the substrate. When the load mechanisms 122e and 122f are fixed to the substrate using the load mechanism fixing means 124, when the load mechanisms 122e and 122f are heated, the load mechanisms 122e and 122f tend to bend or change their curvature due to the difference in thermal expansion coefficients between the two metals in the bimetallic material containing the load mechanisms 122e and 122f. Since the load mechanisms 122e and 122f are fixed to the substrate, the load mechanisms 122e and 122f are constrained and cannot bend, and instead generate a downward force on one or more heat sources. The number and position of the substrate fixing means 128 depend on design constraints and the number and position that allow the load mechanisms 122e and 122f to be firmly attached to the substrate, and pressure is applied to the heat source when the load mechanisms 122e and 122f are heated.

[0060] Looking at Figure 6, which is a simplified exploded view of a heat pipe with an in-plane heat spreader and load mechanism 112d. The heat pipe with the in-plane heat spreader and load mechanism 112d may include one or more heat pipes 118d and 118e, a heat spreader 120d, and one or more load mechanisms 122e and 122f. As shown in Figure 6, the heat spreader 120d may include one or more bumps 130. The bumps 130 may be configured to accommodate different heights of components below the heat spreader 120d. Region 146 may be defined as the region where one or more heat pipes 118d and 118e, the heat spreader 120d, and one or more load mechanisms 122e and 122f are in the same plane. For example, in addition to the bump 130, one or more heat pipes 118d and 118e, a heat spreader 120d, and one or more load mechanisms 122e and 122f are in the same plane. In one example, region 146 may be the region around a heat source (e.g., heat source 110, not shown) associated with one or more heat pipes 118d and 118e. In another example, region 146 may be the region of the heat spreader 120d that does not include the bump 130.

[0061] In areas where the heat spreader 120d does not include the bump 130, the heat spreader 120d may have a thickness approximately equal to or less than the thickness of the heat pipes 118d and / or 118e. The load mechanisms 122e and 122f may have a thickness approximately equal to or less than the thickness of the heat pipes 118d and / or 118e. By keeping the thickness of the heat spreader 120d and the load mechanisms 122e and 122f less than or equal to the thickness of the heat pipes 118d and 118e, the heat spreader 120d and the load mechanisms 122e and 122f are in plane with the heat pipes 118d and 118e and may help reduce the Z height between the heat pipe with the in-plane heat spreader and load mechanism 112c and the device containing the heat pipe with the in-plane heat spreader and load mechanism 112c. The heat spreader 120d may have notches that match the profiles of the heat pipes 118d and 118e and the load mechanisms 122e and 122f. The heat spreader 120d can transfer heat away from one or more heat sources.

[0062] Looking at Figures 7A and 7B, Figures 7A and 7B are simplified exploded views of a heat pipe with an in-plane heat spreader and load mechanism 112e. The heat pipe with the in-plane heat spreader and load mechanism 112e may include one or more heat pipes 118f and 118f and a heat spreader 120e. As shown in Figures 7A and 7B, the heat spreader 120e may include one or more heat spreader load mechanisms 134. One or more heat spreader load mechanisms 134 may be formed using a cutting and bending method or other means that allows each of the one or more heat spreader load mechanisms 134 to be biased upward. Each of the one or more heat spreader load mechanisms 134 may include substrate fixing means 136. Since each of the one or more heat spreader load mechanisms 134 is biased upward, when the substrate fixing means 136 is attached to the substrate, the applied load can be generated on one or more heat sources.

[0063] The heat spreader 120e may have notches that match the profiles of the heat pipes 118f and 118g. Each of the heat pipes 118f and 118g may be an oscillating heat pipe, a pulsating heat pipe, a steam chamber heat pipe, or another type of heat transfer device capable of transferring heat away from one or more heat sources. Each of the heat pipes 118f and 118g may have a thickness between approximately 2 mm and approximately 12 mm. In other examples, each of the heat pipes 118f and 118g may have a thickness of approximately 1.4 mm, approximately 10 mm, approximately 3 mm to approximately 8 mm, or other thicknesses that allow the heat pipes 118f and 118g to transfer heat away from one or more heat sources. The heat pipes 118f and 118g do not have to be the same thickness, and the heat pipe 118f may have a different thickness from the heat pipe 118g. The heat spreader 120e can transfer heat away from one or more heat sources.

[0064] The heat spreader 120e may have a thickness approximately equal to or less than the thickness of the heat pipes 118f and / or 118g. By keeping the thickness of the heat spreader 120e less than or equal to that of the heat pipes 118f and 118g, the heat spreader 120e is in plane with the heat pipes 118f and 118g and may help reduce the Z height between the heat pipe with the in-plane heat spreader and load mechanism 112e and the device containing the heat pipe with the in-plane heat spreader and load mechanism 112e.

[0065] Looking at Figure 8, which is a simplified block diagram of part of an electronic device 100b comprising a heat pipe with an in-plane heat spreader and a load mechanism according to one embodiment of the present disclosure. The electronic device 100b may be a tablet computer, a smartphone, or other similar type of device. The electronic device 100b (and electronic device 100a, not shown) may communicate with a cloud service 138, one or more servers 140, and / or one or more network elements 142 using a network 144. In some examples, the electronic device 100b (and electronic device 100a) may be a standalone device and may not be connected to the network 144 or another device. The electronic device 100b may include one or more heat sources 110, a heat pipe with an in-plane heat spreader and a load mechanism 112, and one or more electronic devices 132. Each of the electronic devices 132 may be a device or group of devices available to support the operation or function of the electronic device 100b.

[0066] The elements in Figure 8 may be coupled to one or more interfaces using any suitable connection (wired or wireless) that provides a viable path for network (e.g., network 144) communication. Furthermore, one or more of these elements in Figure 8 may be combined or removed from the architecture based on specific configuration needs. Network 144 may include a configuration capable of transmit control protocol / Internet protocol (TCP / IP) communication for sending or receiving packets within the network. Electronic devices 100b (and electronic devices 100a) may also operate in conjunction with user datagram protocol / IP (UDP / IP) or any other suitable protocol, as needed and based on specific needs.

[0067] Looking at the infrastructure in Figure 8, network 144 represents a series of points or nodes in an interconnected communication path for sending and receiving packets of information. Network 144 provides communication interfaces between nodes and can be configured as any local area network (LAN), virtual local area network (VLAN), wide area network (WAN), wireless local area network (WLAN), metropolitan area network (MAN), intranet, extranet, virtual private network (VPN), and other suitable architectures or systems that facilitate communication in a network environment, or a suitable combination thereof, including wired and / or wireless communication.

[0068] In network 144, network traffic, including packets, frames, signals, and data, can be transmitted and received according to any suitable communication messaging protocol. Suitable communication messaging protocols may include multi-layer schemes such as the Open Systems Interconnection (OSI) model, or their derivatives or variations (e.g., Transmission Control Protocol / Internet Protocol (TCP / IP), User Datagram Protocol / IP (UDP / IP)). Messages over the network can be created according to various network protocols (Ethernet, Infiniband, OmniPath, etc.). Furthermore, wireless signaling communication over cellular networks may also be provided. Appropriate interfaces and infrastructure may be provided to enable communication with cellular networks.

[0069] As used herein, the term “packet” refers to a unit of data that can be routed between a source node and a destination node on a packet-switched network. A packet includes a source network address and a destination network address. These network addresses may be Internet Protocol (IP) addresses for the TCP / IP messaging protocol. As used herein, the term “data” refers to any type of binary, numerical, audio, video, text, or script data, or any type of source or object code, or any other suitable information in any suitable form that can be communicated from one point to another in an electronic device and / or network.

[0070] While this disclosure has been described in detail with reference to specific arrangements and configurations, these exemplary arrangements and configurations can be substantially modified without departing from the scope of this disclosure. Furthermore, specific components can be combined, separated, removed, or added based on specific needs and embodiments. In addition, while specific elements and operations are shown with reference to the heat pipe with the in-plane heat spreader and load mechanism 112, these elements and operations can be replaced by any suitable architecture, configuration, and / or design that achieves the intended function of the heat pipe with the heat pipe with the in-plane heat spreader and load mechanism 112.

[0071] Many other variations, substitutions, alterations, changes, and modifications can be seen by those skilled in the art, and this disclosure is intended to encompass all such variations, substitutions, alterations, changes, and modifications as falling within the scope of the attached claims. In order to assist the United States Patent and Trademark Office (USPTO), and further to assist readers of patents issued relating to this application in interpreting the attached claims, the applicant wishes to note that (a) unless the words “means for” or “steps for” are used specifically in a particular claim, the applicant does not intend to invoke § 112(6) of the United States Patent Act as existing as of the filing date of this application, and (b) nothing in the specification is intended to limit this disclosure in any way that does not otherwise reflect the scope of the attached claims.

[0072] Other precautions and examples In Example A1, the apparatus may include one or more heat pipes thermally coupled to one or more heat sources, a heat spreader coupled to one or more heat pipes and in plane with the heat pipes, and one or more load mechanisms coupled to at least a portion of one or more heat pipes and in plane with the heat spreader and one or more heat pipes.

[0073] In Example A2, the subject of Example A1 may optionally include a case where the heat spreader has a height that does not exceed the height of one or more heat pipes.

[0074] In Example A3, any one of the themes in Examples A1 to A2 may optionally include a case where one or more load mechanisms each have a height not exceeding the height of one or more heat pipes.

[0075] In Example A4, any one of the themes in Examples A1 to A3 may optionally include a case where the heat spreader has a notch profile that matches the profiles of at least some of the heat pipes and load mechanisms.

[0076] In Example A5, one of the themes from Examples A1 to A4 may optionally include a case where one or more loading mechanisms are composed of relatively high-expansion materials and relatively low-expansion materials.

[0077] In Example A6, one of the themes from Examples A1 to A5 may optionally include a case where one or more loading mechanisms are made of bimetallic material.

[0078] In Example A7, one of the subjects from Examples A1 to A6 may optionally include the case where the bimetallic material is copper and steel.

[0079] Example M1 is a method comprising the steps of: determining the profiles of one or more heat pipes; determining the profiles of one or more load mechanisms; cutting a heat spreader to include profiles matching the profiles of one or more heat pipes; cutting a heat spreader to include profiles at least partially matching the profiles of one or more load mechanisms; fixing one or more heat pipes to the heat spreader; and fixing one or more load mechanisms to at least a portion of one or more heat pipes, wherein one or more heat pipes, a heat spreader, and one or more load mechanisms are all on the same plane.

[0080] In Example M2, the subject of Example M1 may optionally include a case where the heat spreader has a height that does not exceed the height of one or more heat pipes.

[0081] In Example M3, any one of the themes in Examples M1 to M2 may optionally include a case where one or more load mechanisms each have a height not exceeding the height of one or more heat pipes.

[0082] In Example M4, one of the themes from Examples M1 to M3 may optionally include a case where one or more loading mechanisms are composed of relatively high-expansion materials and relatively low-expansion materials.

[0083] In Example M5, one of the themes from Examples M1 to M4 may optionally include a case where one or more loading mechanisms are made of bimetallic material.

[0084] In Example M6, one of the subjects in Examples M1 to M5 may optionally include cases where the bimetallic material is copper and steel.

[0085] Example AA1 is an electronic device comprising a substrate, one or more heat sources on the substrate, one or more heat pipes thermally coupled to one or more heat sources, a heat spreader coupled to one or more heat pipes and in plane with the heat spreader, and one or more load mechanisms coupled to at least a portion of one or more heat pipes and the substrate, including the spreader and one or more load mechanisms in plane with one or more heat pipes.

[0086] In Example AA2, the subject of Example AA1 may optionally include a case where the heat spreader has a height that does not exceed the height of one or more heat pipes.

[0087] In example AA3, one of the themes in examples AA1 to AA2 may optionally include a case where one or more load mechanisms each have a height not exceeding the height of one or more heat pipes.

[0088] In Example AA4, any one of the themes in Examples AA1 to AA3 may optionally include a case where the heat spreader has a notch profile that matches the profiles of at least some of the heat pipes and load mechanisms.

[0089] In Example AA5, one of the themes from Examples AA1 to AA4 may optionally include a case where one or more loading mechanisms are composed of relatively high-expansion materials and relatively low-expansion materials.

[0090] In Example AA6, one of the themes from Examples AA1 to AA5 may optionally include a case where one or more loading mechanisms are made of bimetallic material.

[0091] In example AA7, one of the subjects in examples AA1 to AA6 may optionally include the case where the bimetallic material is copper and steel.

Claims

1. The device is, One or more heat pipes thermally coupled to one or more heat sources, A heat spreader coupled to one or more heat pipes, wherein the heat spreader is in plane with the heat pipes, One or more load mechanisms coupled to at least a portion of the one or more heat pipes, comprising the heat spreader and one or more load mechanisms in plane with the one or more heat pipes, The one or more load mechanisms are bimetallic springs that deflect in the direction in which a load is applied to the one or more heat sources. Device.

2. The apparatus according to claim 1, wherein the heat spreader has a height not exceeding the height of the one or more heat pipes.

3. The apparatus according to claim 1 or 2, wherein each of the one or more load mechanisms has a height not exceeding the height of the one or more heat pipes.

4. The apparatus according to any one of claims 1 to 3, wherein the heat spreader has a notch profile that matches the profiles of at least some of the heat pipes and the load mechanism.

5. The apparatus according to any one of claims 1 to 4, wherein the one or more loading mechanisms are composed of a relatively high-expansion material and a relatively low-expansion material.

6. The apparatus according to any one of claims 1 to 5, wherein the one or more load mechanisms are made of a bimetallic material.

7. The apparatus according to claim 6, wherein the bimetallic material is copper and steel.

8. A method, and said method is A step of determining the profile of one or more heat pipes, The steps include determining the profile of one or more load mechanisms, The steps include cutting a heat spreader to include a profile that matches the profile of one or more heat pipes, The steps include cutting the heat spreader to include a profile that at least partially matches the profile of one or more load mechanisms, The steps include fixing one or more heat pipes to the heat spreader, The step of fixing one or more load mechanisms to at least a portion of one or more heat pipes, wherein the one or more heat pipes, the heat spreader, and the one or more load mechanisms are all on the same plane, The one or more load mechanisms are bimetallic springs that deflect in the direction in which a load is applied to a heat source thermally coupled to the one or more heat pipes. method.

9. The method according to claim 8, wherein the heat spreader has a height that does not exceed the height of the one or more heat pipes.

10. The method according to claim 8 or 9, wherein each of the one or more load mechanisms has a height not exceeding the height of the one or more heat pipes.

11. The method according to any one of claims 8 to 10, wherein the one or more loading mechanisms are composed of a relatively high-expansion material and a relatively low-expansion material.

12. The method according to any one of claims 8 to 11, wherein the one or more loading mechanisms are made of a bimetallic material.

13. The method according to claim 12, wherein the bimetallic material is copper and steel.

14. An electronic device, said electronic device, circuit board and One or more heat sources on the substrate, One or more heat pipes thermally coupled to one or more heat sources, A heat spreader coupled to one or more heat pipes, wherein the heat spreader is in plane with the heat pipes, A load mechanism coupled to at least a portion of the one or more heat pipes and the substrate, comprising the heat spreader and the one or more load mechanisms in plane with the one or more heat pipes, The one or more load mechanisms are bimetallic springs that deflect in the direction in which a load is applied to the one or more heat sources. electronic equipment.

15. The electronic device according to claim 14, wherein the heat spreader has a height not exceeding the height of the one or more heat pipes.

16. The electronic device according to claim 14 or 15, wherein each of the one or more load mechanisms has a height not exceeding the height of the one or more heat pipes.

17. The electronic device according to any one of claims 14 to 16, wherein the heat spreader has a notched profile that matches the profiles of at least some of the heat pipes and the load mechanism.

18. The electronic device according to any one of claims 14 to 17, wherein the one or more load mechanisms are composed of a relatively high-expansion material and a relatively low-expansion material.

19. The electronic device according to any one of claims 14 to 18, wherein the one or more load mechanisms are made of a bimetallic material.

20. The electronic device according to claim 19, wherein the bimetallic material is copper and steel.

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