Conveying mechanism

Abstract

To provide a transfer mechanism that prevents drying of chips and prevents contact between adjacent chips during transfer of a plurality of chips.SOLUTION: A transfer mechanism for transferring a frame unit 19 in which a workpiece 11 having a plurality of chips 13a divided therein is attached to a tape 15 which is attached to a ring frame so as to close an opening of the ring frame 17 in an area corresponding to the opening and the ring frame, the tape and the plurality of chips are integrated with one another, includes a holding mechanism 36 for holding the frame unit and a moving mechanism for moving the holding mechanism. The holding mechanism includes a ring frame holding mechanism 26 having a plurality of holding members (suction pads 21c) each holding the ring frame, and a chip suction holding mechanism 34 which has a plate-like suction unit 28 having one or a plurality of fluid discharge portions at the bottom thereof, and sucks and holds the plurality of chips by a negative pressure generated by discharging liquid or a mixed fluid of liquid and gas radially from the one or plurality of fluid discharge portions.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a transport mechanism for transporting a ring frame unit in which a workpiece divided into a plurality of chips is attached in a region corresponding to an opening in a tape attached to a ring frame so as to close the opening in the central portion of the ring frame, and the ring frame, the tape, and the plurality of chips are integrated.

Background Art

[0002] When cutting a workpiece such as a semiconductor wafer, cutting water such as pure water is supplied to a cutting blade for lubrication between the cutting blade rotating at high speed and the workpiece, and cooling water such as pure water is supplied to the processing point where the workpiece and the cutting blade contact to cool the processing point.

[0003] During cutting, the chuck table is fed for processing with a cutting blade rotating at high speed being cut into a workpiece sucked and held by the chuck table. Thereby, the workpiece is cut along each of a plurality of division planned lines set in a grid pattern on one surface of the workpiece, and the workpiece is divided into a plurality of chips (device chips).

[0004] During cutting, contamination such as cutting dust is generated, and the chips are contaminated by the used cutting water and cooling water containing the contamination. Adhesion of contamination to the chips causes product defects.

[0005] Therefore, the workpiece after cutting (i.e., a plurality of chips) is transported from the chuck table to a spinner cleaning device by a transport mechanism, and the workpiece after cutting is cleaned by the spinner cleaning device.

[0006] However, if moisture dries and the contamination adheres firmly to the chips between the end of cutting and the start of cleaning, the contamination cannot be completely removed from the chips even by cleaning using a spinner cleaning device.

[0007] Therefore, in order to prevent the chips from drying out during transport, a transport mechanism has been proposed that includes a wash water storage member having an upper wall and an annular side wall (see, for example, Patent Document 1). When transporting the workpiece after cutting, first, the wash water storage member is placed on the tape so as to cover each chip supported by the ring frame via the tape.

[0008] Next, the cylindrical space defined by the cleaning water storage member and the tape (i.e., the cleaning water storage chamber) is filled with cleaning water. After that, the transport mechanism, while holding the ring frame by suction, transports the multiple chips together with the tape and ring frame to the spinner cleaning device. [Prior art documents] [Patent Documents]

[0009] [Patent Document 1] Japanese Patent Publication No. 2010-87443 [Overview of the Initiative] [Problems that the invention aims to solve]

[0010] However, the weight of the cleaning water stored in the cleaning water reservoir causes the tape to sag, which can cause adjacent chips on the tape to come into contact with each other, potentially resulting in cracks or chips in the chips.

[0011] This invention has been made in view of the aforementioned problems, and aims to prevent the drying of chips and to prevent contact between adjacent chips during the transport of multiple chips. [Means for solving the problem]

[0012] According to one aspect of the present invention, a conveying mechanism is provided for conveying a frame unit in which a workpiece divided into a plurality of chips is attached to a tape attached to a ring frame so as to close an opening in the ring frame, and the ring frame, tape and the plurality of chips are integrated, wherein the conveying mechanism comprises a holding mechanism for holding the frame unit and a moving mechanism for moving the holding mechanism, and the holding mechanism includes a ring frame holding mechanism having a plurality of holding members for each of the ring frame, and a chip suction holding mechanism having a plate-shaped suction part having one or more fluid discharge parts at the bottom, and suctioning and holding the plurality of chips by negative pressure generated by radially discharging a liquid or a mixture of liquid and gas from the one or more fluid discharge parts. [Effects of the Invention]

[0013] A transport mechanism according to one aspect of the present invention prevents the chips from drying out when transporting a frame unit by using a liquid or a liquid-and-gas mixture to generate negative pressure, and also prevents contact between adjacent chips by using this negative pressure to suck and hold multiple chips together. [Brief explanation of the drawing]

[0014] [Figure 1] This is a perspective view of a cutting machine. [Figure 2] This is a perspective view showing the frame and other components of the upper transport mechanism. [Figure 3] Figure 3(A) is a bottom view showing the frame of the upper transport mechanism, and Figure 3(B) is a cross-sectional view of the Bernoulli chuck. [Figure 4] This is a perspective view of the frame unit after machining. [Figure 5] This is a side view showing how the frame unit is held and transported by suction. [Figure 6] This is a bottom view showing how the frame unit is held and transported by suction. [Figure 7] This is a bottom view showing the frame and other components of the upper transport mechanism in the second embodiment. [Figure 8] It is a side view showing how a frame unit is held in the second embodiment.

Mode for Carrying Out the Invention

[0015] An embodiment according to an aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a cutting device 2. In FIG. 1, a part of the components is shown as a functional block diagram. Also, the X-axis direction (machining feed direction), Y-axis direction (indexing feed direction), and Z-axis direction (vertical direction) in FIG. 1 are directions orthogonal to each other.

[0016] The cutting device 2 includes a base 4 that supports each component. An opening 4a is provided at the front corner of the base 4. An elevator 6a that moves up and down by a lifting mechanism (not shown) is provided in the opening 4a. A cassette 6b for accommodating a plurality of wafers (workpieces) 11 is placed on the upper surface of the elevator 6a.

[0017] The wafer 11 has, for example, a disk-shaped single crystal substrate made of a semiconductor material such as silicon. Note that there is no limitation on the material, shape, structure, size, etc. of the single crystal substrate. A plurality of division planned lines (streets) are set in a grid pattern on the surface 11a of the wafer 11.

[0018] Devices 13 such as ICs (Integrated Circuits) are formed in each rectangular region partitioned by a plurality of division planned lines. The central portion of a dicing tape (tape) 15 having a diameter larger than that of the wafer 11 is attached to the back surface 11b of the wafer 11 located on the side opposite to the surface 11a.

[0019] A ring frame 17 made of metal is attached to the outer peripheral portion of the dicing tape 15. That is, the dicing tape 15 is attached to the ring frame 17 so as to close an opening 17a formed in the central portion of the ring frame 17.

[0020] The wafer 11, before dicing, is attached to the region corresponding to the opening 17a and is supported by the ring frame 17 via the dicing tape 15. The wafer 11 and the ring frame 17 are integrated via the dicing tape 15 to form a frame unit 19.

[0021] The wafer 11 is housed in the cassette 6b in the form of a frame unit 19. A rectangular opening 4b is formed on the side of the elevator 6a, with its longest side aligned along the X-axis. A table cover 10 is provided inside the opening 4b.

[0022] On both sides of the table cover 10 in the X-axis direction, there are bellows-shaped cover members 12 that can expand and contract along the X-axis direction. A disc-shaped chuck table 14 is provided on the table cover 10.

[0023] The upper surface of the chuck table 14 is subjected to negative pressure transmitted from a suction source (not shown), such as a vacuum pump or ejector, and functions as a holding surface 14a that suctions and holds the frame unit 19. Multiple clamping units 16 capable of clamping the ring frame 17 in the thickness direction are provided on the outer circumference of the chuck table 14.

[0024] The chuck table 14 is configured to rotate around a rotation axis substantially parallel to the Z-axis direction by a rotational drive source such as a motor (not shown). The chuck table 14 is also configured to move along the X-axis direction by a ball screw type X-axis direction movement mechanism (machining feed unit) (not shown).

[0025] Above the area of ​​the opening 4b adjacent to the opening 4a, a pair of guide rails (not shown) are provided, which are used when loading and unloading the frame unit 19 to and from the cassette 6b. The pair of guide rails have their longitudinal sections arranged along the Y-axis and are movable to move closer to and further apart along the X-axis.

[0026] A gate-shaped support 4c is provided in the center of the base 4 in the X-axis direction, straddling the opening 4b. On one side of the support 4c, which is substantially parallel to the Y-Z plane, a lower transport mechanism 18 and an upper transport mechanism 22 are provided, respectively for transporting the frame units 19.

[0027] The lower transport mechanism 18 is used when unloading the frame unit 19 from the cassette 6b and when loading the cleaned frame unit 19 into the cassette 6b. The lower transport mechanism 18 has an air cylinder 18a that includes a piston rod that is movable along the Z-axis.

[0028] The base end of an arm section, which is positioned along the X-axis, is fixed to the lower end of the piston rod. A frame 18b, which is roughly H-shaped when viewed from above, is fixed to the tip of the arm section. Suction pads 18c are provided on the bottom sides of the four corners of the frame 18b.

[0029] Negative pressure is transmitted to each suction pad 18c from a suction source (not shown), such as a vacuum pump or ejector, via a flexible tube (not shown). The suction pads 18c can hold the frame unit 19 by suction-holding the ring frame 17.

[0030] A gripping unit 18d capable of gripping the ring frame 17 is provided at the tip of the frame 18b on the elevator 6a side. The lower transport mechanism 18 includes a lower moving mechanism 20 provided on the support 4c.

[0031] The lower moving mechanism 20 in this embodiment is a ball screw type moving mechanism and has a rail 20a arranged along the Y-axis direction. The upper end of the air cylinder 18a is slidably attached to the rail 20a.

[0032] A nut portion (not shown) is provided at the upper end of the air cylinder 18a. A screw shaft (not shown), which is arranged along the Y-axis, is rotatably connected to the nut portion via a ball (not shown).

[0033] A drive source (not shown), such as a motor, is connected to one end of the screw shaft. By operating the drive source, the lower transport mechanism 18 moves along the Y-axis. Next, the upper transport mechanism 22 will be described.

[0034] The upper transport mechanism (transport mechanism) 22 is used to transport the frame unit 19 from the chuck table 14 to the spinner cleaning device 50, which will be described later. The upper transport mechanism 22 has an arm that protrudes along the X-axis, and an air cylinder 22a including a piston rod that is movable along the Z-axis is provided at the tip of the arm.

[0035] A frame 22b, which is roughly H-shaped in top view, is fixed to the lower end of the piston rod. The frame 22b is made of a metal such as aluminum alloy or stainless steel and has a pair of first straight sections 22b1 arranged along the Y-axis (see Figure 2).

[0036] As shown in Figure 2, a pair of first linear sections 22b1 are connected to each other by a second linear section 22b2 positioned along the X-axis at their midpoint in the longitudinal direction. Suction pads (holding members) 22c are provided on the bottom side of the tip of each first linear section 22b1 (i.e., the four corners of the frame 22b).

[0037] Negative pressure is transmitted to each suction pad 22c from a suction source 24, such as a vacuum pump or ejector, via a flexible tube 22d. The upper transport mechanism 22 will be described in detail with reference to Figures 2, 3(A), and 3(B).

[0038] Figure 2 is a perspective view showing the frame 22b of the upper transport mechanism 22. Note that in Figure 2, some of the components are shown by lines and functional block diagrams. Figure 3(A) is a bottom view showing the frame 22b of the upper transport mechanism.

[0039] The frame 22b and the four suction pads 22c constitute a ring frame holding mechanism 26 that holds the ring frame 17 by suction using negative pressure.

[0040] Alternatively, instead of the suction pad 22c, a ring frame holding mechanism 26 may be configured to hold the ring frame 17 by providing clamp units (not shown) capable of clamping the ring frame 17 in its thickness direction.

[0041] The lower end of the piston rod of the air cylinder 22a is fixed to the upper surface of the second linear section 22b2. A disc-shaped (plate-shaped) base plate (suction section) 28 is provided on the lower surface of the second linear section 22b2.

[0042] A through-hole 28a (see Figure 3(B)) is formed in the radial center of the base substrate 28, penetrating the base substrate 28 in the thickness direction. A fluid supply source 30 is connected to the through-hole 28a via a flexible tube 28b (see Figure 2).

[0043] The fluid supply source 30 of this embodiment includes, for example, a pure water supply source having a tank containing pure water 32e (see Figure 5). However, the fluid supply source 30 may also include a pure water supply source having a tank containing pure water 32e and an air supply source having a tank containing compressed dry air.

[0044] As shown in Figure 3(B), a recess 28c1 smaller in diameter than the disc-shaped base substrate 28 is formed at the bottom 28c of the base substrate 28, and a Bernoulli chuck (fluid discharge part) 32 is provided so as to fit into this recess 28c1.

[0045] Figure 3(B) is a cross-sectional view of the Bernoulli chuck 32. The Bernoulli chuck 32 is also called a Bernoulli pad. The Bernoulli chuck 32 has a disc-shaped body portion 32a made of metal, resin, or the like. A disc-shaped recess 32b, smaller in diameter than the body portion 32a, is formed at the bottom of the body portion 32a.

[0046] A disc-shaped plate 32c, having a smaller diameter than the inner diameter of the recess 32b, is fixed to this recess 32b. Four nozzles 32d are provided on the side of the plate 32c at approximately equal intervals along the circumferential direction of the plate 32c. However, the number of nozzles 32d is not particularly limited as long as there are four or more.

[0047] Each nozzle 32d is connected to the flexible tube 28b via a flow path formed in the plate 32c. When the fluid supply source 30 is a pure water supply source, pure water (liquid) 32e is supplied from the fluid supply source 30 to each nozzle 32d (see Figure 5).

[0048] The pure water 32e injected from the side of the plate 32c is discharged radially along the radial direction of the body 32a through the annular gap formed between the body 32a and the plate 32c. The discharge of the pure water 32e generates a negative pressure directly below the Bernoulli chuck 32 according to Bernoulli's principle.

[0049] Incidentally, if the fluid supply source 30 has not only a pure water supply source but also a pure water supply source and an air supply source, a mixed fluid 32f of pure water (liquid) 32e and air (gas) is supplied to each nozzle 32d (see Figures 7 and 8).

[0050] In this case, the pure water (liquid) 32e and the air (gas) are mixed at a predetermined position between the fluid supply source 30 and the nozzle 32d, and the mixed fluid 32f is discharged radially from the nozzle 32d. This generates negative pressure at the bottom of the Bernoulli chuck 32.

[0051] In any case, when the frame unit 19 is transported from the chuck table 14 to the spinner cleaning device 50 by the upper transport mechanism 22, drying can be prevented by wetting the wafer 11 (i.e., multiple device chips 13a (see Figure 4)) that has been cut and divided with the pure water 32e used to generate negative pressure.

[0052] The base substrate 28 and the Bernoulli chuck 32 constitute the chip suction and holding mechanism 34. In this embodiment, the ring frame holding mechanism 26 and the chip suction and holding mechanism 34 together constitute the holding mechanism 36 that holds the frame unit 19.

[0053] Now, returning to Figure 1, we will describe the other components of the cutting apparatus 2. The upper transport mechanism 22 includes an upper moving mechanism (moving mechanism) 40 provided on the support 4c. The upper moving mechanism 40 is, for example, a ball screw type moving mechanism.

[0054] The upper moving mechanism 40 has a rail 40a arranged along the Y-axis. The base end of the arm of the upper transport mechanism 22 is slidably attached to the rail 40a. A nut portion (not shown) is provided at the base end of this arm.

[0055] A screw shaft (not shown), positioned along the Y-axis, is rotatably connected to the nut via a ball (not shown). A drive source (not shown), such as a motor, is connected to one end of the screw shaft.

[0056] By operating the drive source, the holding mechanism 36 moves along the Y-axis. On the opposite side of the support 4c from the lower transport mechanism 18 and the upper transport mechanism 22, a gate-shaped support 4d is provided so as to straddle the opening 4b.

[0057] A pair of cutting unit moving mechanisms (indexing feed unit and depth feed unit) 42 are provided on one side of the support 4d which is substantially parallel to the Y-Z plane. Each cutting unit moving mechanism 42 has a ball screw type Y-axis movement mechanism and a Z-axis movement mechanism, respectively.

[0058] Each cutting unit moving mechanism 42 moves the cutting unit 44 along the Y-axis and Z-axis directions. The cutting unit 44 has a spindle housing. A portion of a cylindrical spindle (not shown), which is arranged substantially parallel to the Y-axis direction, is rotatably housed in the spindle housing.

[0059] A rotational drive source (not shown), such as a servo motor, is provided at one end of the spindle, and a cutting blade having an annular cutting edge is attached to the other end of the spindle. The cutting unit 44 is also provided with a camera unit 46 positioned to face the holding surface 14a.

[0060] When cutting the wafer 11, the lower transport mechanism 18 first uses a pair of guide rails (not shown) to transport one frame unit 19 from the cassette 6b to the chuck table 14.

[0061] The frame unit 19, held by suction on the holding surface 14a and four clamping units 16, is cut along each planned division line by one or two cutting units 44, dividing it into multiple device chips (chips) 13a (see Figure 4).

[0062] Figure 4 is a perspective view of the frame unit 19 after cutting. The wafer 11 is divided into multiple device chips 13a by cutting grooves 13b formed along each planned division line. The multiple device chips 13a are attached to the dicing tape 15 in the area corresponding to the opening 17a of the ring frame 17.

[0063] After cutting, multiple device chips 13a, dicing tape 15, and ring frame 17 form a frame unit 19. As described above, contamination such as chips is generated during cutting, and the device chips 13a are contaminated by used cutting water and cooling water containing the contamination.

[0064] After cutting, the upper transport mechanism 22 suction-holds the frame unit 19 and transports it from the chuck table 14 to the spinner cleaning device 50 in order to clean each device chip 13a.

[0065] Figure 5 is a side view showing how the upper transport mechanism 22 suction-holds and transports the frame unit 19 after cutting is complete. Note that in Figure 5, some of the components are shown with lines and functional block diagrams. Figure 6 is a bottom view showing how the upper transport mechanism 22 suction-holds and transports the frame unit 19 after cutting is complete.

[0066] In this embodiment, after cutting is completed, the arm of the upper transport mechanism 22 is moved above the chuck table 14, the ring frame holding mechanism 26 holds the ring frame 17 at four points by suction, and the chip suction holding mechanism 34 holds all the device chips 13a by suction.

[0067] The ring frame holding mechanism 26 holds the ring frame 17 by suction with the suction pad 22c in contact with the ring frame 17, while the tip suction holding mechanism 34 holds each device tip 13a by suction with the Bernoulli chuck 32 not in contact with each device tip 13a.

[0068] When suction is performed by the tip suction holding mechanism 34, pure water 32e is discharged radially toward the outer circumference of the ring frame 17, as shown in Figure 6. Although the pure water 32e comes into contact with the suction pad 22c, the suction holding of the ring frame 17 is performed without any problems.

[0069] Some of the discharged pure water 32e falls from the frame unit 19, while other parts may remain on the inner circumference of the ring frame 17.

[0070] However, even if the dicing tape 15, located between the wafer 11 and the ring frame 17, bends due to the weight of the pure water 32e during transport, each device chip 13a is held in place by the chip suction holding mechanism 34, so the device chips 13a do not come into contact with each other.

[0071] In this embodiment, the pure water 32e used to generate negative pressure prevents the device chip 13a from drying out, and by using this negative pressure to suction and hold multiple device chips 13a together, contact between adjacent device chips 13a can be prevented.

[0072] Now, let's return to Figure 1. In the Y-axis direction, a circular opening 4e is formed on the opposite side of opening 4a from opening 4b. A spinner cleaning device 50 is provided in opening 4e.

[0073] The spinner cleaning device 50 has a spinner table 52 that can rotate at high speed while holding the frame unit 19 by suction. A swinging arm 54 is provided near the spinner table 52. A nozzle (not shown) is provided at the tip of the swinging arm 54.

[0074] During cleaning, the device chip 13a is cleaned by rapidly rotating the spinner table 52, which holds the frame unit 19 by suction, and by oscillating the oscillating arm 54 while spraying a mixed fluid of pure water and air downwards.

[0075] After cleaning, the frame unit 19 is transported from the spinner cleaning device 50 to the cassette 6b via a pair of guide rails by the lower transport mechanism 18. The operation of each component of the cutting device 2 is controlled by the control unit 56.

[0076] The control unit 56 is composed of a computer that includes, for example, a processing unit such as a processor represented by a CPU (Central Processing Unit), a main memory, and an auxiliary memory.

[0077] Main memory includes DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read Only Memory), etc., while auxiliary memory includes flash memory, hard disk drives, solid state drives, etc.

[0078] The auxiliary storage device stores software, including a predetermined program. The functions of the control unit 56 are realized by operating the processing unit and other components according to this software.

[0079] In this embodiment, when transporting a frame unit 19 containing multiple device chips 13a, the drying of the device chips 13a is prevented by using pure water 32e to generate negative pressure, and contact between adjacent device chips 13a can be prevented by using this negative pressure to hold the multiple device chips 13a in place.

[0080] (Second Embodiment) Next, a second embodiment will be described with reference to Figures 7 and 8. Figure 7 is a bottom view showing the frame 22b, etc., of the upper transport mechanism 22 of the second embodiment. In the second embodiment, four recesses (not shown) are formed in the bottom 28c of the base substrate 28.

[0081] The four recesses are arranged at approximately equal intervals in the circumferential direction of the base substrate 28, and a Bernoulli chuck 32 is provided to fit into each recess. However, the number of Bernoulli chucks 32 is not limited to four; there may be two, three, or five or more.

[0082] Figure 8 is a side view showing how the upper transport mechanism 22 of the second embodiment holds the frame unit 19. Note that in Figure 8, some of the components are shown by lines and functional block diagrams. The Bernoulli chuck 32 of the second embodiment discharges a mixed fluid 32f of pure water 32e and air (gas).

[0083] In Figure 8, for convenience, the mixed fluid 32f released from the two Bernoulli chucks 32 is shown. In this embodiment as well, the pure water 32e used to generate negative pressure prevents the device chip 13a from drying out, and by using this negative pressure to attract and hold multiple device chips 13a, contact between adjacent device chips 13a can be prevented.

[0084] Furthermore, the structures, methods, etc., according to the embodiments described above can be modified as appropriate without departing from the scope of the object of the present invention. For example, in the second embodiment, pure water 32e can be discharged instead of the mixed fluid 32f. [Explanation of Symbols]

[0085] 2:Cutting device 4: Base, 4a, 4b: Opening, 4c, 4d: Support, 4e: Opening 6a: Elevator, 6b: Cassette 10: Table cover, 12: Cover component 11: Wafer (workpiece), 11a: Front side, 11b: Back side 13: Device, 13a: Device chip (chip), 13b: Cutting groove 14: Chuck table, 14a: Holding surface, 16: Clamp unit 15: Dicing tape (tape), 17: Ring frame, 17a: Opening 18: Lower transport mechanism 18a: Air cylinder, 18b: Frame, 18c: Suction pad, 18d: Gripping unit 19: Frame Unit 20: Lower moving mechanism, 20a: Rail 22: Upper conveying mechanism (conveying mechanism), 22a: Air cylinder 22b: Frame, 22b1: First straight section, 22b2: Second straight section 22c: Suction pad (holding member), 22d: Flexible tube 24: Suction source, 26: Ring frame holding mechanism 28: Base substrate (suction part), 28a: Through hole, 28b: Flexible tube 28c: bottom, 28c1: recess 30: Fluid supply source, 32: Bernoulli chuck (fluid discharge section) 32a: Body, 32b: Recess, 32c: Plate, 32d: Nozzle 32e: Pure water (liquid), 32f: Mixed fluid 34: Tip suction and holding mechanism, 36: Holding mechanism 40: Upper moving mechanism (moving mechanism), 40a: Rail 42: Cutting unit movement mechanism, 44: Cutting unit, 46: Camera unit 50: Spinner cleaning device, 52: Spinner table, 54: Swivel arm 56: Control Unit

Claims

[Claim 1] A transport mechanism for transporting a frame unit in which the ring frame, tape, and multiple chips are integrated, wherein a workpiece divided into multiple chips is attached to a tape that is attached to the ring frame so as to close the opening of the ring frame, and the workpiece divided into multiple chips is attached to the area corresponding to the opening, The transport mechanism is, A retaining mechanism for holding the frame unit, A moving mechanism for moving the holding mechanism, Equipped with, The holding mechanism is, A ring frame holding mechanism having a plurality of holding members that each hold the ring frame, A chip suction and holding mechanism having a plate-shaped suction section with one or more fluid discharge sections at its bottom, which uses negative pressure generated by radially discharging liquid or a mixture of liquid and gas from the one or more fluid discharge sections to suction and hold the multiple chips, A transport mechanism characterized by including the following.

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