Ceramic apparatus and method for manufacturing ceramic conductors

Abstract

To provide a ceramic member capable of suppressing the generation of cracking.SOLUTION: A ceramic member 10 comprises: a second surface 11S2; a ceramic main body part 11 that is arranged to the second surface 11S2, and provides a concave part 12 regulated by a bottom surface 13 and a side surface 14 extended from the bottom surface 13 to the second surface 11S2; internal electrodes 21A and 21B arranged into an inner part of the main body part 11; and a connection pad 22 that is electrically connected to the internal electrodes 21A and 21B, and is arranged to the bottom surface 13. A portion adjacent to the side surface 14 and the bottom surface 13 becomes a taper surface 14A inclined toward an outer side as closing to the bottom surface 13.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The technology disclosed by this specification relates to a ceramic member, a ceramic device, and a method for manufacturing a ceramic member.

Background Art

[0002] For electrostatic chucks and heaters used in semiconductor manufacturing equipment, ceramic members with electrodes embedded inside are used. The ceramic member has a recess on its surface, and a power supply pad electrically connected to the internal electrode is arranged on the inner surface of this recess. A power supply terminal for supplying power to the internal electrode is connected to the power supply pad (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the manufacturing process of the ceramic member with the above configuration, cracks may occur starting from the corner formed by the bottom surface and the side surface of the recess, and improvement has been demanded.

Means for Solving the Problems

[0005] The ceramic member disclosed by this specification includes a ceramic main body having an outer surface and a recess defined by a bottom surface and a side surface extending from the bottom surface to the outer surface arranged on the outer surface, an internal electrode arranged inside the main body, and a connection pad arranged on the bottom surface and electrically connected to the internal electrode. At least a part of the side surface adjacent to the bottom surface is a tapered surface that slopes outward as it approaches the bottom surface.

[0006] Furthermore, the method for manufacturing a ceramic member disclosed herein includes: a pad forming step of forming a conductive layer to be a connecting pad on the first bonding surface of a ceramic green sheet for a pad having a first bonding surface; a main block forming step of forming a main block by laminating another ceramic green sheet on a surface of the ceramic green sheet for a pad that is different from the first bonding surface; a subblock forming step of forming a subblock having a second bonding surface, which is composed of one or a plurality of laminated ceramic green sheets for recesses; a through hole forming step of forming a through hole in the subblock having an opening to the second bonding surface; a tapered surface forming step of forming a tapered surface on the inner circumferential surface of the through hole, at least in a portion adjacent to the second bonding surface, which slopes outward as it approaches the second bonding surface; a crimping step of laminating the main block and the subblock such that the first bonding surface and the second bonding surface are overlapped and the conductive layer is arranged inside the through hole, and then crimping them together to form a crimped body; and a firing step of firing the crimped body. [Effects of the Invention]

[0007] According to the ceramic members and methods for manufacturing ceramic members disclosed herein, the occurrence of cracks can be suppressed. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic perspective view of the ceramic apparatus according to the embodiment. [Figure 2] Figure 2 is a cross-sectional view of the ceramic apparatus according to the embodiment. [Figure 3] Figure 3 is an enlarged cross-sectional view of the area within frame F in Figure 2. [Figure 4] Figure 4 is a cross-sectional view showing the state in which a conductive layer and connecting vias have been formed on multiple ceramic green sheets during the manufacturing process of the ceramic member of the embodiment. [Figure 5] Figure 5 is a cross-sectional view showing the state in which the main block and sub-block have been formed during the manufacturing process of the ceramic member of the embodiment. [Figure 6] Figure 6 is a cross-sectional view showing the state in which the main block and sub-block are pressed together during the manufacturing process of the ceramic member of the embodiment. [Figure 7] Figure 7 is a cross-sectional view showing an enlarged view of the area surrounding the recess in the ceramic member of Modified Example 1. [Figure 8] Figure 8 is a cross-sectional view showing an enlarged view of the area surrounding the recess in the ceramic member of the modified example 2. [Figure 9] Figure 9 is a cross-sectional view showing an enlarged view of the area surrounding the recess in a conventional ceramic member. [Modes for carrying out the invention]

[0009] [Summary of the Embodiment] (1) The ceramic member disclosed herein comprises a ceramic body having an outer surface and disposed on the outer surface, having a recess defined by a bottom surface and a side surface extending from the bottom surface to the outer surface; an internal electrode disposed inside the body; and a connecting pad electrically connected to the internal electrode and disposed on the bottom surface, wherein at least the portion of the side surface adjacent to the bottom surface is a tapered surface that slopes outward as it approaches the bottom surface.

[0010] According to the above configuration, the stress concentrated at the corner formed by the bottom and side surfaces of the recess can be relieved, and the occurrence of cracks originating from this corner can be suppressed.

[0011] (2) In the ceramic member described in (1) above, the tapered surface may be arranged only on a portion of the side surface adjacent to the bottom surface.

[0012] When the internal space of the recess becomes relatively large, the volume of the ceramic member having a higher thermal conductivity than air becomes relatively small. Therefore, there is a concern that the amount of heat transfer (heat extraction) from the connection pad through the ceramic member may relatively decrease, and the connection pad may become hot. By arranging the tapered surface only at a portion adjacent to the bottom surface on the side surface, the size of the internal space of the recess can be minimized, and it is possible to avoid the connection pad from becoming hot.

[0013] (3) The ceramic member of (1) or (2) above may be connected to the connection pad and may further include a first external member containing metal.

[0014] The above configuration can be suitably applied to a recess in which a connection pad to which a member containing metal is connected is arranged.

[0015] (4) The ceramic device disclosed by this specification includes the ceramic member described in (1), (2), or (3) above, and a second external member containing metal adhered to the outer surface of the ceramic member. Alternatively, the ceramic device disclosed by this specification includes the ceramic member described in (1), (2), or (3) above, and a third external member adhered to the outer surface of the ceramic member via a metal adhesive.

[0016] When a high voltage is applied to the internal electrode, there is a concern that abnormal discharge may occur between the connection pad and the second external member containing metal, or between the connection pad and the metal adhesive. When a tapered surface is arranged on the side surface of the recess, the creepage distance between the connection pad and the second external member or the metal adhesive becomes longer compared to the case where the tapered surface is not arranged, so that abnormal discharge can be suppressed.

[0017] (5) The manufacturing method of the ceramic member disclosed by this specification includes a pad forming step of forming a conductive layer serving as a connection pad on the first joint surface of a ceramic green sheet for a pad having the first joint surface, a main block forming step of laminating another ceramic green sheet on the other surface different from the first joint surface of the ceramic green sheet for a pad to form a main block, a sub-block forming step of forming a sub-block composed of one or a plurality of laminated ceramic green sheets for recesses and having a second joint surface, a through-hole forming step of forming a through-hole having an opening on the second joint surface in the sub-block, a tapered surface forming step of forming a tapered surface that inclines outward toward the second joint surface on at least a portion adjacent to the second joint surface on the inner peripheral surface of the through-hole, a pressing step of laminating and pressing the main block and the sub-block such that the first joint surface and the second joint surface are overlapped and the conductive layer is disposed inside the through-hole to form a pressed body, and a firing step of firing the pressed body.

[0018] According to the above configuration, the stress concentrated at the corner portion composed of the bottom surface and the side surface of the recess can be relaxed, and the generation of cracks starting from this corner portion can be suppressed.

[0019] (6) In the tapered surface forming step in the manufacturing method of the ceramic member in (5) above, a chamfering process may be performed on the opening portion to form the tapered surface only on a part adjacent to the second joint surface on the inner peripheral surface of the through-hole.

[0020] According to such a configuration, compared with the case where the entire inner peripheral surface of the through-hole is a tapered surface, in the pressing step after the tapered surface is formed, deformation of the peripheral portion of the through-hole can be suppressed.

[0021] [Details of the Embodiment] Specific examples of the technology disclosed herein will be described below with reference to Figures 1 to 9. However, the present invention is not limited to these examples, and is intended to include all modifications within the meaning and scope of the claims as defined herein.

[0022] [Configuration of Ceramic Device 1] The ceramic apparatus 1 of this embodiment is an electrostatic chuck that attracts and holds a semiconductor wafer W (hereinafter abbreviated as "wafer W"), which is the object to be processed, by electrostatic attraction while heating it to a predetermined processing temperature. As shown in Figures 1 and 2, the ceramic apparatus 1 comprises a ceramic member 10 and a base member 30 (an example of a second external member and a third external member) that is bonded to the ceramic member 10 via a bonding layer 40.

[0023] [Ceramic component 10] As shown in Figure 1, the ceramic member 10 is generally disc-shaped. As shown in Figure 2, the ceramic member 10 comprises a main body 11 and internal electrodes (first electrode 21A and second electrode 21B) arranged inside the main body 11. The main body 11 is formed of ceramics mainly composed of, for example, aluminum nitride or alumina. One surface of the main body 11 is the first surface 11S1, and the other surface located opposite the first surface 11S1 and parallel to the first surface 11S1 is the second surface 11S2 (an example of an outer surface). The first surface 11S1 is an adsorption surface that adsorbs and holds the wafer W.

[0024] The first electrode 21A and the second electrode 21B are formed from a conductive material, such as tungsten or molybdenum. In this embodiment, the first electrode 21A functions as a chuck electrode that generates an electrostatic attraction for adsorbing the wafer W onto the first surface 11S1, and the second electrode 21B functions as a heater electrode for heating the wafer W.

[0025] As shown in Figures 2 and 3, the main body 11 has a plurality of recesses 12 arranged on the second surface 11S2. Each of the plurality of recesses 12 has a shape that is recessed from the second surface 11S2 toward the first surface 11S1, and is located inside the second surface 11S2 (closer to the first surface 11S1). It is a space defined by a bottom surface 13 parallel to the second surface 11S2 and a side surface 14 extending from the bottom surface 13 toward the second surface 11S2. As shown in Figure 3, a part of the side surface 14 is a tapered surface 14A, and the remaining part is an upright surface 14B. The tapered surface 14A is located adjacent to the bottom surface 13 and is a surface that inclins outward as it approaches the bottom surface 13, that is, in a direction in which the inner diameter of the recess 12 increases. The vertical surface 14B is a surface that extends perpendicularly to the second surface 11S2 from the edge of the tapered surface 14A on the second surface 11S2 side to the second surface 11S2. By having the tapered surface 14A positioned on a part of the side surface 14, it is possible to suppress the occurrence of cracks originating from the corner 15 formed by the bottom surface 13 and the side surface 14. The first formation depth D1 of the tapered surface 14A, which is expressed as the distance from the bottom surface 13 to the edge of the tapered surface 14A on the second surface 11S2 side, is preferably 5% to 50% of the depth D0 of the recess 12, which is defined by the distance from the bottom surface 13 to the second surface 11S2. Furthermore, the second formation depth D2 of the tapered surface 14A, which is expressed as the distance between the position where the extended surface obtained by extending the vertical surface 14B intersects with the bottom surface 13 and the corner 15, is preferably 5% to 50% of the depth D0 of the recess 12. Furthermore, the first formation depth D1 and the second formation depth D2 may be equal or different.

[0026] As shown in Figures 2 and 3, a connecting pad 22 is provided on the bottom surface 13 of each recess 12. The connecting pad 22 is made of a conductive material, such as tungsten or molybdenum. Inside one of the multiple recesses 12, a connecting pad 22 is provided that is electrically connected to the first electrode 21A by a wiring section 23A, and inside another recess 12, a connecting pad 22 is provided that is electrically connected to the second electrode 21B by a wiring section 23B. The wiring sections 23A and 23B consist of connecting vias extending perpendicularly to the first surface 11S1 and the second surface 11S2, and internal wiring extending parallel to the first surface 11S1 and the second surface 11S2. For the sake of clarity in the drawing, the connecting vias and internal wiring are not shown in detail in Figure 2, and the wiring sections 23A and 23B are shown in a simplified manner.

[0027] [Base member 30] The base member 30 is a component mainly composed of metal (aluminum, aluminum alloy, etc.). As shown in Figure 1, the base member 30 is disc-shaped and has a larger diameter than the ceramic member 10. As shown in Figure 2, the base member 30 has a third surface 30S1 that faces the second surface 11S2 of the ceramic member 10, and a fourth surface 30S2 that is opposite to the third surface 30S1.

[0028] As shown in Figure 2, the base member 30 has a refrigerant channel 31 through which a refrigerant (for example, a fluorine-based inert liquid or water) can flow. The base member 30 also has a terminal insertion hole 32 that penetrates in the thickness direction between the third surface 30S1 and the fourth surface 30S2, and a cylindrical insulator 33 is embedded inside the terminal insertion hole 32. The insulator 33 is made of an insulating material (for example, a resin such as polyetherimide).

[0029] The base member 30 is bonded to the second surface 11S2 of the ceramic member 10 via a bonding layer 40 disposed on the third surface 30S1. As the bonding layer 40, for example, a bonding sheet containing a resin such as silicone resin or acrylic resin can be used. As shown in Figure 3, the bonding layer 40 has a communication hole 41 that penetrates in the thickness direction and connects the internal space of the insulator 33 and the internal space of the recess 12.

[0030] [Power supply terminal 50] Each of the multiple connection pads 22 is connected to a power supply terminal 50 (an example of a first external member) for supplying power to the first electrode 21A and the second electrode 21B. The power supply terminal 50 is located inside the insulator 33, as shown in Figure 2. A power supply pin 51 for connecting to the connection pad 22 is located at one end of the power supply terminal 50, as shown in Figure 3. The power supply pin 51 is made of metal and comprises a round bar-shaped pin body 51A and a disc-shaped head 51B located at one end of the pin body 51A. The head 51B is connected to the connection pad 22, for example, by brazing. The other end of the power supply terminal 50 is connected to a power source (not shown).

[0031] [Method for manufacturing ceramic component 10] Next, an example of a manufacturing method for the ceramic member 10 that constitutes the ceramic device 1 described above will be explained.

[0032] Ceramic green sheets 61A, 61B, 61C, 61D, and 61E are manufactured, for example, by the following method: Aluminum oxide powder, magnesium oxide powder, acrylic resin (binder), dispersant, plasticizer, etc. are mixed, an organic solvent such as toluene is added, and the mixture is kneaded in a ball mill. The resulting mixture is formed into a sheet using the doctor blade method.

[0033] Next, the main block 60M and the subblock 60S are formed.

[0034] In this embodiment, the main block 60M is formed from four ceramic green sheets 61A, 61B, 61C, and 61D, and the subblock 60S is formed from one recess ceramic green sheet 61E.

[0035] First, the formation of the main block 60M will be described. As shown in Figure 4, holes are formed in the ceramic green sheets 61B, 61C, and 61D, for example by punching, and conductive paste is filled into these holes to form connecting vias 63. Next, conductive layers 62A, 62B, 62C, and 62D, which will form the first electrode 21A, the second electrode 21B, the connecting pad 22, and the internal wiring, are formed on the surfaces of the ceramic green sheets 61A, 61B, 61C, and 61D. The conductive layers 62A, 62B, 62C, and 62D can be formed by known methods such as screen printing or transfer printing. One of the multiple ceramic green sheets 61A, 61B, 61C, and 61D is the ceramic green sheet 61D for the pad, and a conductive layer 62C, which will become the connecting pad 22, is formed on one surface (first bonding surface 61S1) of this ceramic green sheet 61D for the pad (pad formation step).

[0036] Next, as shown in Figure 5, the main block 60M is formed by laminating the ceramic green sheet 61D for the pad with the other ceramic green sheets 61A, 61B, and 61C (main block formation step). On the other side 61S3 opposite the first bonding surface 61S1 of the ceramic green sheet 61D for the pad, the ceramic green sheet 61C is laminated, and then the ceramic green sheets 61B and 61A are sequentially laminated on top of that. After the multiple ceramic green sheets 61A, 61B, 61C, and 61D are laminated, they may be compressed together as needed.

[0037] Next, the formation of the subblock 60S will be described. In this embodiment, a single ceramic green sheet 61E for the recess becomes the subblock 60S. One surface of the subblock 60S (the upper surface in Figure 5) is the second bonding surface 61S2.

[0038] Next, a through hole 64 having an opening 64A in the second joint surface 61S2 is formed in the subblock 60S, for example, using a drill (through hole formation step). Next, a tapered surface 64B is formed on the inner circumferential surface of the through hole 64 by performing a chamfering process, for example, on the portion adjacent to the second joint surface 61S2 (upper end in Figure 5) (tapered surface formation step).

[0039] Next, as shown in Figure 6, the main block 60M and the subblock 60S are stacked such that the first joining surface 61S1 and the second joining surface 61S2 are overlapped, and the conductive layer 62C which will become the connecting pad 22 is placed inside the through hole 64, and then crimped together to form a crimped body 60P (crimping process).

[0040] The resulting compressed body 60P is fired to obtain the ceramic member 10 (firing process).

[0041] In conventional ceramic members 100 (see Figure 9) that do not have a tapered surface 14A, cracks 105 sometimes occurred starting from the corner 104 formed by the bottom surface 102 and the side surface 103 of the recess 101. One of the reasons for this is thought to be as follows.

[0042] During the manufacturing process of the ceramic component 100, shrinkage occurs in the main block 106M and the sub-block 106S during firing. In the main block 106M, which does not have a through hole that forms the recess 101, a force acts to shrink inward overall. However, in the sub-block 106S, which has a through hole that forms the recess 101, the force that tries to shrink acts in the direction that causes the through hole to expand in the region surrounding the through hole. Therefore, around the recess 101, as shown by the arrows in Figure 9, opposing forces act on the main block 106M and the sub-block 106S, causing stress to concentrate at the corner 104 and resulting in the occurrence of cracks 105.

[0043] Furthermore, it is possible that the area around the through-hole deforms during the crimping process, causing a crack 105 to form, and that this crack 105 may expand during the firing process.

[0044] As in this embodiment, if a tapered surface 14A is provided on the side surface 14 of the recess 12, it is thought that stress concentration at the corner 15 formed by the bottom surface 13 and the side surface 14 of the recess 12 can be alleviated, thereby suppressing the occurrence of cracks.

[0045] [Adsorption of wafer W by ceramic device 1] The ceramic apparatus 1 is used, for example, as part of a semiconductor manufacturing apparatus. The ceramic apparatus 1 is installed in the chamber of the semiconductor manufacturing apparatus, and a wafer W is placed on the first surface 11S1 of the ceramic member 10. When power is supplied to the first electrode 21A, which functions as a chuck electrode, an electrostatic attraction is generated and the wafer W is attracted to the first surface 11S1. When power is supplied to the second electrode 21B, which functions as a heater electrode, the second electrode 21B generates heat, and the generated heat is transferred to the wafer W via the main body 11, heating the wafer W. When a raw material gas is introduced into the chamber and high-frequency power is applied to the base member 30, plasma is generated, a bias voltage is generated on the wafer W, and processing is performed.

[0046] At this time, there is a concern that abnormal discharge may occur between the metal base member 30 and the connecting pad 22. If a tapered surface 14A is provided on the side surface 14 of the recess 12, the creepage distance between the connecting pad 22 and the base member 30 becomes longer compared to the case where the tapered surface 14A is not provided, thereby suppressing abnormal discharge.

[0047] [Effects and Effects] As described above, according to this embodiment, the ceramic member 10 comprises a ceramic body 11 having a second surface 11S2 and a recess 12 disposed on the second surface 11S2, defined by a bottom surface 13 and a side surface 14 extending from the bottom surface 13 to the second surface 11S2; internal electrodes 21A and 21B disposed inside the body 11; and a connecting pad 22 electrically connected to the internal electrodes 21A and 21B and disposed on the bottom surface 13. The portion of the side surface 14 adjacent to the bottom surface 13 is a tapered surface 14A that slopes outward as it approaches the bottom surface 13.

[0048] Furthermore, the manufacturing method of the ceramic member 10 includes a pad forming step of forming a conductive layer 62C which will become a connecting pad 22 on the first bonding surface 61S1 of a ceramic green sheet 61D for pads having a first bonding surface 61S1; a main block forming step of forming a main block 60M by laminating other ceramic green sheets 61A, 61B, and 61C on another surface 61S3 of the ceramic green sheet 61D for pads that is different from the first bonding surface 61S1; and a subblock forming step of forming a subblock 60S which is made of a ceramic green sheet 61E for recesses and has a second bonding surface 61S2. The process includes forming steps, forming through-holes 64 in the sub-block 60S having openings 64A in the second joining surface 61S2, forming tapered surfaces 14A on the inner circumferential surface of the through-hole 64 adjacent to the second joining surface 61S2, tapering surfaces 14A that slope outward as they approach the second joining surface 61S2, a crimping step of stacking the main block 60M and the sub-block 60S such that the first joining surface 61S1 and the second joining surface 61S2 are stacked and the conductive layer 62C is arranged inside the through-hole 64, and then crimping them together to form a crimped body 60P, and a firing step of firing the crimped body 60P.

[0049] According to the above configuration, the stress concentrated at the corner 15 formed by the bottom surface 13 and the side surface 14 of the recess 12 can be relieved, and the occurrence of cracks originating from this corner 15 can be suppressed.

[0050] Furthermore, the tapered surface 14A is located only on a portion of the side surface 14 adjacent to the bottom surface 13.

[0051] Here, if the internal space of the recess 12 becomes relatively large, the volume of the ceramic member 10, which has a higher thermal conductivity than air, becomes relatively smaller. As a result, there is a concern that the amount of heat transferred (heat dissipated) from the connecting pad 22 through the ceramic member 10 will relatively decrease, causing the connecting pad 22 to become overheated. By arranging the tapered surface 14A only in the part of the side surface 14 adjacent to the bottom surface 13, the size of the internal space of the recess 12 can be kept to the minimum necessary, thereby preventing the connecting pad 22 from becoming overheated.

[0052] Furthermore, the ceramic member 10 further includes a power supply terminal 50 that is connected to the connection pad 22. The above configuration can be suitably applied to a recess 12 on which a connection pad 22 is disposed, to which a metal-containing member such as the power supply terminal 50 is connected.

[0053] Furthermore, the ceramic apparatus 1 comprises the ceramic member 10 described above, and a metal base member 30 bonded to the second surface 11S2 of the ceramic member 10 via a bonding layer 40.

[0054] When a high voltage is applied to the internal electrodes 21A and 21B, there is a concern that abnormal discharge may occur between the base member 30 and the connecting pad 22. If a tapered surface 14A is provided on the side surface 14 of the recess 12, the creepage distance between the connecting pad 22 and the base member 30 becomes longer compared to the case where the tapered surface 14A is not provided, thereby suppressing abnormal discharge.

[0055] Furthermore, in the tapered surface formation step in the manufacturing method of the ceramic member 10 described above, a chamfer is applied to the opening 64A to form a tapered surface 14A only on a portion of the inner circumferential surface of the through hole 64 adjacent to the second joining surface 61S2.

[0056] With this configuration, compared to the case where the entire inner surface of the through hole 64 is tapered, deformation of the peripheral portion of the through hole 64 can be suppressed during the crimping process after tapering surface formation.

[0057] <Example 1> The ceramic member 80 shown in Figure 7, similar to the embodiment described above, is positioned inward from the second surface 11S2 and has a recess 81 defined by a bottom surface 82 parallel to the second surface 11S2 and a side surface 83 extending from the bottom surface 82 to the second surface 11S2. Part of the recess 81 serves as a jig receiving portion 81A for receiving a jig used to align the power supply terminal 50 with the connection pad 22 when connecting the power supply terminal 50 to the connection pad 22. The side surface 83 is configured with a tapered surface 83A, a first upright surface 83B, a jig receiving surface 83C, and a second upright surface 83D in that order from the bottom surface 82 side, and the jig receiving portion 81A is the space defined by the jig receiving surface 83C and the second upright surface 83D. The tapered surface 83A, as in the above embodiment, is positioned adjacent to the bottom surface 82 and is inclined outward as it approaches the bottom surface 82, that is, so that the inner diameter of the recess 81 increases. The first upright surface 83B is a surface that extends perpendicularly to the second surface 11S2 from the edge of the tapered surface 83A on the second surface 11S2 side toward the second surface 11S2. The jig receiving surface 83C is a surface that extends radially outward from the edge of the first upright surface 83B on the second surface 11S2 side and is positioned closer to the second surface 11S2 than the bottom surface 82, and is parallel to the second surface 11S2. The second upright surface 83D is a surface that extends perpendicularly to the second surface 11S2 from the edge of the jig receiving surface 83C toward the second surface 11S2. The jig receiving portion 81A can be formed, for example, by polishing the edge of the opening of the recess 81 after the firing process. The other components are the same as in the above embodiment, so the same components are denoted by the same reference numerals and their descriptions are omitted.

[0058] As the recess 81 has a jig receiving portion 81A, the creepage distance between the connecting pad 22 and the base member 30 becomes even longer compared to the case where the jig receiving portion 81A is not present, thereby further suppressing abnormal discharge.

[0059] <Modification 2> The ceramic member 90 shown in Figure 8, similar to the embodiment described above, is positioned inward from the second surface 11S2 and has a recess 91 defined by a bottom surface 92 parallel to the second surface 11S2 and a side surface 93 extending from the bottom surface 92 to the second surface 11S2. A portion of the recess 91 is a jig receiving portion 91A with a different shape from the modified example 1 described above. The side surface 93 is composed of a tapered surface 93A, a jig receiving surface 93B, and an upright surface 93C, arranged in that order from the bottom surface 92 side, and the jig receiving portion 91A is the space defined by the jig receiving surface 93B and the upright surface 93C. The tapered surface 93A, similar to the embodiment described above, is positioned adjacent to the bottom surface 92 and is a surface that slopes outward as it approaches the bottom surface 92, that is, as the inner diameter of the recess 91 increases. The jig receiving surface 93B extends radially outward from the edge of the tapered surface 93A on the second surface 11S2 side, and is positioned closer to the second surface 11S2 than the bottom surface 92, and is parallel to the second surface 11S2. The vertical surface 93C is a surface that extends perpendicularly to the second surface 11S2 from the edge of the jig receiving surface 93B to the second surface 11S2. The other configurations are the same as in the above embodiment, so the same reference numerals are used for the same components and their descriptions are omitted.

[0060] Similar to the first modification, if the recess 91 has a jig receiving portion 91A, the creepage distance between the connecting pad 22 and the base member 30 becomes even longer, thereby suppressing abnormal discharge.

[0061] <Other Embodiments> (1) In the above embodiment, one connection pad 22 was placed inside one recess 12, 81, 91, but multiple connection pads may be placed inside one recess. (2) In the above embodiment, the tapered surfaces 14A, 83A, and 93A were arranged only on a portion of the side surfaces 14, 83, and 93 that define the recesses 12, 81, and 91, but the entire side surface that defines the recess may be a tapered surface. (3) The tapered surface does not have to be flat; for example, it may be concave or convex. (4) The angle between the tapered surface and the base surface is arbitrary; it is sufficient if it is an acute angle. (5) In the above embodiment, an example was shown in which a metal power supply terminal 50 is connected to the connection pad 22, but the first external member may be a member other than the power supply terminal, for example, it may be a temperature sensor equipped with a metal terminal. (6) The electrodes embedded inside the ceramic component may be other than heater electrodes and chuck electrodes, for example, drive electrodes. (7) In the above embodiment, an example was shown in which the main block is formed from four ceramic green sheets, but the number of ceramic green sheets constituting the main block may be three or fewer, or five or more. (8) In the above embodiment, an example was shown in which one main block is stacked on a subblock, but there may be two or more main blocks. In this case, there are no particular restrictions on the order of stacking and crimping. For example, two main blocks may be stacked and then a subblock may be stacked, or one main block may be stacked on a subblock and crimped, and then another main block may be stacked and crimped. (9) The ceramic green sheets constituting the main block may include, for example, ceramic green sheets having holes for forming flow channels through which fluids can flow. (10) In the above embodiment, the subblock was made of one ceramic green sheet, but the subblock may be made of two or more ceramic green sheets. (11) In the above embodiments and modifications, an example is shown in which a metal base member 30 is bonded to the ceramic member 10 with a bonding layer 40 containing a resin adhesive. However, a base member (second external member) made of a composite material of metal and non-metallic material (e.g., ceramics) may also be bonded with a bonding layer containing a resin adhesive. (12) In the above embodiments and modifications, an example is shown in which a metal base member 30 is bonded to a ceramic member 10 with a bonding layer 40 containing a resin adhesive. However, the base members (second external member, third external member) composed of only a metal material or a composite material of a metal material and a non-metal material (e.g., ceramics) may be bonded with a bonding layer containing a metal adhesive layer. Alternatively, the base member (third external member) composed of only a non-metal material may be bonded with a bonding layer containing a metal adhesive layer. When the bonding layer contains a metal adhesive, there is concern that abnormal discharge may occur between the bonding layer and the connecting pad. However, if a tapered surface is provided on the side surface of the recess, the creepage distance between the connecting pad and the bonding layer becomes longer compared to the case where a tapered surface is not provided, thus suppressing abnormal discharge. [Explanation of symbols]

[0062] 1: Ceramic device 10, 80, 90: Ceramic components 11: Main body 11S1: 1st surface 11S2: 2nd surface (outer surface) 12, 81, 91: Recessed 13, 82, 92: Base 14, 83, 93: Side view 14A, 83A, 93A: Tapered surface 14B, 93C: Standing surface 15: Corner 21A: 1st electrode (internal electrode) 21B: 2nd electrode (internal electrode) 22: Connection pad 23A, 23B: Wiring section 30: Base member (second external member) 30S1: 3rd surface 30S2: 4th surface 31: Refrigerant flow path 32: Terminal insertion hole 33: Insulator 40: Bonding layer 41:Communication hole 50: Power supply terminal (first external component) 51: Power supply pin 51A: Pin body 51B: Head 60M: Main Block 60P: Crimping body 60S: Subblock 61A, 61B, 61C: Ceramic Green Sheet 61D: Ceramic green sheet for pads 61E: Ceramic green sheet for recessed areas 61S1: 1st joint surface 61S2: 2nd joint surface 61S3: Other side 62A, 62B, 62C, 62D: Conductive layer 63: Connection via 64: Through hole 64A: Opening 64B: Tapered surface 81A: Jig receiving part 83B: 1st standing surface 83C: Jig receiving surface 83D: 2nd standing surface 91A: Jig receiving part 93B: Jig receiving surface 100: Conventional ceramic components 101: Recess 102: Bottom 103: Side view 104: Corner 105: Crack 106M: Main block 106S: Subblock D0: Depth of the recess D1: First formation depth D2: Second formation depth W: wafer

Claims

1. A ceramic member having an outer surface, A ceramic device comprising a second external member containing metal, which is bonded to the outer surface of the ceramic member, or a third external member which is bonded to the outer surface of the ceramic member via a metal adhesive, The aforementioned ceramic member is A ceramic body portion disposed on the outer surface and having a recess defined by a bottom surface and a side surface extending from the bottom surface to the outer surface, The internal electrode is located inside the main body, The system comprises a connection pad electrically connected to the internal electrode and located on the bottom surface, At least the portion of the side surface adjacent to the bottom surface is a tapered surface that slopes outward as it approaches the bottom surface. The second external member or the third external member has a third surface facing the outer surface in a first direction, a fourth surface located on the opposite side of the third surface in a first direction, and a terminal insertion hole penetrating in a first direction between the third surface and the fourth surface. A ceramic device wherein, when viewed from the first direction, the corner between the tapered surface and the bottom surface is positioned inward from the inner circumferential surface of the terminal insertion hole, and the dimensions of the recess in a second direction perpendicular to the first direction are smaller than the dimensions of the terminal insertion hole.

2. The ceramic apparatus according to claim 1, wherein the tapered surface is arranged only on a portion of the side surface adjacent to the bottom surface.

3. The ceramic apparatus according to claim 1 or claim 2, further comprising a first external member including metal, which is connected to the connecting pad.

4. A cylindrical insulator having an end located on the recessed side is housed inside the terminal insertion hole. A step is formed between the recess and the terminal insertion hole, with the outer surface exposed. The ceramic apparatus according to claim 1 or claim 2, wherein the end portion is arranged along the step.

5. A ceramic member having an outer surface, A ceramic device comprising a second external member containing metal, which is bonded to the outer surface of the ceramic member, or a third external member which is bonded to the outer surface of the ceramic member via a metal adhesive, The aforementioned ceramic member is A ceramic body portion disposed on the outer surface and having a recess defined by a bottom surface and a side surface extending from the bottom surface to the outer surface, The internal electrode is located inside the main body, The system comprises a connection pad electrically connected to the internal electrode and located on the bottom surface, At least the portion of the side surface adjacent to the bottom surface is a tapered surface that slopes outward as it approaches the bottom surface. The second external member or the third external member has a third surface facing the outer surface in a first direction, a fourth surface located on the opposite side of the third surface in a first direction, and a terminal insertion hole penetrating in a first direction between the third surface and the fourth surface. When viewed from the first direction, the recess is located inside the terminal insertion hole, and the dimensions of the recess in the second direction perpendicular to the first direction are smaller than the dimensions of the terminal insertion hole. A ceramic device in which the portion of the side surface adjacent to the outer surface is an enlarged portion that is wider in diameter than the side surface.

6. A ceramic member having an outer surface, A ceramic device comprising a second external member containing metal, which is bonded to the outer surface of the ceramic member, or a third external member which is bonded to the outer surface of the ceramic member via a metal adhesive, The aforementioned ceramic member is A ceramic body portion disposed on the outer surface and having a recess defined by a bottom surface and a side surface extending from the bottom surface to the outer surface, The internal electrode is located inside the main body, The system comprises a connection pad electrically connected to the internal electrode and located on the bottom surface, At least the portion of the side surface adjacent to the bottom surface is a tapered surface that slopes outward as it approaches the bottom surface. The second external member or the third external member has a third surface facing the outer surface in a first direction, a fourth surface located on the opposite side of the third surface in a first direction, and a terminal insertion hole penetrating in a first direction between the third surface and the fourth surface. When viewed from the first direction, the recess is located inside the terminal insertion hole, and the dimensions of the recess in the second direction perpendicular to the first direction are smaller than the dimensions of the terminal insertion hole. The aforementioned side surface is composed of the tapered surface, the jig receiving surface, and the vertical mounting surface, arranged in that order from the bottom surface side. The jig receiving surface is a surface that extends radially outward from the outer edge of the tapered surface, is positioned closer to the outer surface than the bottom surface, and is parallel to the outer surface. The aforementioned vertical surface is a surface that extends from the edge of the jig receiving surface to the outer surface, in a ceramic device.

7. A pad forming step of forming a conductive layer that will serve as a connecting pad on the first bonding surface of a ceramic green sheet for a pad having a first bonding surface, A main block forming step is performed by laminating another ceramic green sheet on a surface different from the first bonding surface of the ceramic green sheet for the pad to form a main block, A subblock forming step is performed to form a subblock having a second bonding surface, which is composed of one or multiple laminated ceramic green sheets for recesses, The subblock comprises a through-hole forming step of forming a through-hole having an opening in the second joint surface, A tapered surface forming step is performed on the inner circumferential surface of the through hole, in which a tapered surface is formed at least in the portion adjacent to the second joining surface, the tapered surface being inclined outward as it approaches the second joining surface. A crimping step in which the main block and the subblock are stacked such that the first joining surface and the second joining surface are overlapped and the conductive layer is arranged inside the through hole, and then crimped together to form a crimped body, The process includes a firing step for firing the aforementioned crimped body, A method for manufacturing a ceramic member, wherein in the tapered surface forming step, the tapered surface is formed only on a portion of the inner circumferential surface of the through hole adjacent to the second joining surface by chamfering the opening.

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