Component mounting machine and component mounting method

Abstract

To provide technology that can improve component mounting efficiency.SOLUTION: A component mounting machine includes a component holding portion that holds a component supplied to the component supply position, a head that holds the component holding portion so as to be raised and lowered in a first stroke, a head drive mechanism that holds the head movably up and down in a second stroke and moves it horizontally, and a movement path control portion that controls a movement path of the head. When an upper end of the mounted component is located below a first lower end on a predetermined path toward the component mounting position, the movement path control portion moves the head along a predetermined path in a state of keeping the head at the lowest point of the second stroke, and when the top edge of the mounted component is located below a second bottom end, the movement path control portion moves the head along a predetermined path, and when the top end of the mounted component is located above the second bottom end, the movement path control portion moves the head along a detour route.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The technology disclosed in this specification relates to a technology for mounting components on a substrate. Specifically, it relates to a technology for determining the movement path of the head of a component mounter.

Background Art

[0002] Patent Document 1 discloses a component mounter that determines the movement path of a head when transporting a component adsorbed to the lower end of a nozzle to a mounting position on a circuit board based on the maximum separation distance, which is the distance between the upper surface of the circuit board and the lower end of the nozzle that has stroked to the uppermost point with respect to the head. When there are components previously mounted on the circuit board, the movement path of the head is determined based on the height of the components previously mounted on the circuit board, the maximum separation distance, and the height of the components to be mounted later (i.e., the components adsorbed to the lower end of the nozzle).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Some component mounters have a head that can move up and down with respect to the substrate. By moving the head up and down, it may be possible to avoid interference between the components previously mounted on the circuit board and the components to be mounted later on the circuit board. In Patent Document 1, although the lifting and lowering of the nozzle is considered, the lifting and lowering of the head is not considered at all. This specification provides a technology that can improve the component mounting efficiency in a component mounter where the head, in addition to the nozzle, can also move up and down.

Means for Solving the Problems

[0005] The technology disclosed herein is embodied by a component mounting machine that mounts components to mounting positions on a substrate. The component mounting machine may include a component holding unit that holds the component supplied to a component supply position, a head that holds the component holding unit so as to be able to move up and down in a first stroke, a head drive mechanism that holds the head so as to be able to move up and down in a second stroke and moves it horizontally relative to the substrate, and a movement path control unit that controls the path along which the head moves along the substrate from the component supply position to the mounting position. The movement path control unit moves the head along the predetermined path while maintaining the head at the lowest point of the second stroke, when the upper end of a mounted component already mounted on the substrate is located below a first lower end, which is the lower end of the component held by the component holding unit when the head is at the lowest point of the second stroke and the component holding unit is at the highest point of the first stroke, so that the upper end of the mounted component is located above the first lower end, If the head is at the highest point in the second stroke and the part holder is at the highest point in the first stroke, the head may be raised so that the lower end of the part held by the part holder is higher than the upper end of the mounted part, and the head may be moved along the predetermined path. If the upper end of the mounted part is above the second lower end, the head may be moved along a bypass path that bypasses the mounted part.

[0006] The above-described component mounting machine moves the head along a predetermined path to the mounting position while maintaining the head at the lowest point of the second stroke when the upper end of a mounted component is located below the first lower end. By maintaining the head at the lowest point of the second stroke, the distance the component holder needs to be lowered at the mounting position can be reduced. This increases the efficiency of component mounting. Furthermore, when the upper end of a mounted component is located below the second lower end, the component mounting machine moves the head along a predetermined path to the mounting position while raising the head so that the lower end of the component is higher than the upper end of the mounted component. Thus, when the upper end of a mounted component is located below the second lower end, the above-described component mounting machine can move the head along the same predetermined path to the mounting position as when the upper end of a mounted component is located below the first lower end. This increases the efficiency of component mounting.

[0007] Furthermore, the methods for mounting the components disclosed herein are novel and beneficial. [Brief explanation of the drawing]

[0008] [Figure 1] A diagram showing the schematic configuration of the component mounting machine according to Examples 1 and 2. [Figure 2] A diagram showing the schematic configuration of the component mounting machine according to Examples 1 and 2. [Figure 3] Cross-sectional view along line III-III in Figure 1. [Figure 4] A flowchart illustrating an example of movement path control processing. [Modes for carrying out the invention]

[0009] The main features of the embodiments described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0010] The component mounting machine disclosed herein may further include an imaging unit capable of imaging the lower surface and / or side surface of the component held by the component holding unit at a predetermined imaging position. In this case, the predetermined path may be a path that goes from the imaging position to the mounting position. With such a configuration, the lower surface and / or side surface of the component can be imaged while increasing the component mounting efficiency.

[0011] In the component mounting machine disclosed herein, the detour path may include an external path that passes outside the outline of the substrate in a plan view. With such a configuration, interference between components moving along the detour path and mounted components can be prevented more reliably than in a configuration in which the head passes over the substrate.

[0012] In the component mounting machine disclosed herein, the detour path may be a single-movement path consisting of a path that moves linearly in the board transport direction for transporting the board and a path that moves linearly in a direction perpendicular to the board transport direction. With such a configuration, it is easy to determine whether or not interference occurs between the components moving along the detour path and the mounted components.

[0013] (First embodiment) Referring to the drawings, the component mounting machine 10 according to this embodiment will be described. The component mounting machine 10 is a device that mounts electronic components 4 onto a circuit board 2 having conductive wiring. The component mounting machine 10 is also called an electronic component mounting device or a chip mounter. Typically, the component mounting machine 10 is installed together with other circuit board work machines such as a solder printing machine and a circuit board inspection machine to form a series of mounting lines. In this embodiment, the components 4 include various types of electronic components. Therefore, the components 4 have various sizes (i.e., width, depth, height). Hereafter, the circuit board 2 will be simply referred to as board 2, and the electronic components 4 will be simply referred to as components 4.

[0014] The configuration of the component mounting machine 10 will be described with reference to Figures 1 to 3. The component mounting machine 10 includes a component feeder 12, a component waste box 13, a feeder holding unit 14, a head 16, a head drive mechanism 30, a head moving device 18, a substrate conveyor 20, an imaging unit 40, a control unit 26, a touch panel 24, and a tray unit 50.

[0015] The parts feeder 12 is detachably attached to the feeder holding unit 14. The parts feeder 12 is a tape-type feeder that supplies multiple parts 4 contained on a tape. The tape mounted on the parts feeder 12 transports the parts 4 in the +Y direction. Parts 4 that have been transported to the tip of the parts feeder 12 on the +Y side are picked up by a nozzle 6 (described later) and mounted to the mounting position P2. In this way, the parts feeder 12 supplies parts 4 to the parts supply position P1. The parts waste box 13 is a box for storing parts 4 that have malfunctioned.

[0016] In particular, as shown in Figure 3, the tray unit 50 is a tray-type feeder that supplies multiple parts 4 arranged on a tray 56. In a modified example, a bulk-type feeder that supplies multiple parts 4 randomly arranged in a container may be used instead of the tray unit 50.

[0017] The tray unit 50 comprises a pair of pallet transport shuttles 52 extending in the Y direction and a tray pallet 54. The pair of pallet transport shuttles 52 transport the tray pallet 54 in the +Y direction. A tray 56 is placed on the top surface of the tray pallet 54. When the tray 56 is transported to the +Y end of the tray unit 50, each of the multiple components 4 placed on the tray 56 is picked up by a nozzle 6 (described later) and mounted to the mounting position P2. In this way, the tray unit 50 supplies components 4 to the component supply position P1.

[0018] As particularly shown in FIG. 2, the head 16 is held by a head drive mechanism 30. The head drive mechanism 30 includes a Y-axis slider 32 and an X-axis slider 34. The Y-axis slider 32 is attached to the substrate 2 so as to be movable in the Y direction, and is driven by a drive device (not shown) to move in the Y direction with respect to the substrate 2. The X-axis slider 34 is attached to the Y-axis slider 32 so as to be movable in the X direction, and is driven by a drive device (not shown) to move in the X direction with respect to the Y-axis slider 32. The head 16 is held by the X-axis slider 34. By driving the X-axis slider 34 and the Y-axis slider 32, the head 16 can move in the X direction and the Y direction (i.e., the horizontal direction with respect to the substrate 2).

[0019] The head drive mechanism 30 further includes a Z-axis slider 36 attached to the X-axis slider 34 so as to be movable in the Z direction. The Z-axis slider 36 is driven by a drive device (not shown) to move in the Z direction with respect to the X-axis slider 34. When the Z-axis slider 36 moves in the Z direction, the head 16 attached to the Z-axis slider 36 also moves in the Z direction. As a result, the head 16 moves up and down in the second stroke S2.

[0020] The head 16 has a nozzle 6 (an example of a component holding portion) housed in a nozzle mounting hole 17. The nozzle 6 moves up and down in the first stroke S1 along the nozzle mounting hole 17. That is, the head 16 holds the nozzle 6 in the nozzle mounting hole 17 so that the nozzle 6 can move up and down in the first stroke S1. The nozzle 6 holds the component 4 by adsorbing the component 4 supplied to the component supply position P1 from above. With the component 4 held by the nozzle 6, the head 16 moves in the horizontal direction with respect to the substrate 2. When the head 16 reaches above the mounting position P2, which is the position on the substrate 2 where the component 4 is to be mounted, the nozzle 6 descends along the first stroke S1. As a result, the component 4 approaches the substrate 2, and the component 4 is mounted at the mounting position P2. In a modification, the nozzle 6 may be held so as to move up and down in the first stroke S1 along the outer surface of the head 16.

[0021] As particularly shown in FIG. 3, the substrate conveyor 20 is a device that carries in, positions, and carries out the substrate 2. Although it is an example, the substrate conveyor 20 of this embodiment has a pair of belt conveyors and a support device (not shown) that supports the circuit board 2 from below. As can be shown in FIG. 3, the substrate conveyor 20 conveys the substrate 2 in the substrate conveyance direction D1. Thereby, components 4 can be mounted on a new substrate 2.

[0022] The control unit 26 is configured using a computer including a CPU and a storage device. The control unit 26 controls the operations of each part of the component mounter 10 based on, for example, a production program transmitted from an external management device (not shown). The control unit 26 controls, for example, the height of the nozzle 6 and the positions of the X-axis slider 34, Y-axis slider 32, and Z-axis slider 36 respectively. Although details will be described with reference to FIG. 4, the control unit 26 further controls the path along which the head 16 moves from the component supply position P1 to the mounting position P2 along the substrate 2.

[0023] The imaging unit 40 is disposed between the component feeder 12 and the substrate conveyor 20 (specifically, the substrate conveyor 20 installed on the component feeder 12 side among the pair of substrate conveyors 20). The imaging unit 40 includes a camera and a light source (not shown). The camera of the imaging unit 40 is arranged such that its imaging direction is upward, and images the nozzle 6 in the state of adsorbing the component 4 from below. That is, the camera photographs the lower surface of the electronic component 4 adsorbed to the nozzle 6 when the nozzle 6 adsorbs the electronic component 4. For example, a CCD camera is used for the camera of the imaging unit 40. The light source is composed of an LED and illuminates the lower surface (imaging surface) of the component 4 adsorbed to the nozzle 6. The image data of the image captured by the imaging unit 40 is stored in the memory (not shown) of the control unit 26. The touch panel 24 is a display device that provides various information of the component mounter 10 to the operator and is an input device that receives instructions and information from the operator.

[0024] Referring to Figure 2, the positional relationship between the lower end 4B of component 4 held by the nozzle 6 and the upper end 5T of a pre-mounted component (so-called pre-attached component) 5 already mounted on the substrate 2 will be explained. For example, if the upper end 5T of the pre-mounted component 5 is located above the lower end 4B of component 4, and the head 16 passes above the pre-mounted component 5, component 4 will interfere with the pre-mounted component 5. When the nozzle 6 is raised to the highest point in the first stroke S1, the lower end 4B of component 4 rises to the first lower end B1. If the upper end 5T of the pre-mounted component 5 is located below the first lower end B1, when the nozzle 6 is raised to the highest point, component 4 will not interfere with the pre-mounted component 5 even if the head 16 passes above the pre-mounted component 5.

[0025] Furthermore, if the upper end 5T of the mounted component 5 is located above the first lower end B1, and the nozzle 6 is raised to the highest point in the first stroke S1, then the head 16 is raised to the highest point in the second stroke S2, the lower end 4B of component 4 will rise to the second lower end B2. If the upper end 5T of the mounted component 5 is located below the second lower end B2, component 4 will not interfere with the mounted component 5.

[0026] Referring to Figure 3, the positional relationship between the component supply position P1 and the mounting position P2 will be explained. As mentioned earlier, component 4 located at the +Y direction end of the component feeder 12 is attracted by the nozzle 6 and mounted at the mounting position P2. In other words, a component supply position P1 is provided for each tape of the component feeder 12. In this embodiment, the mounting path of component 4F, which is located on the central tape feeder among the three tape feeders included in the component feeder 12, will be mainly explained.

[0027] For example, the movement distance of the head 16 can be reduced by moving the head 16 along the shortest distance along a straight path R10 (an example of a predetermined path) extending from a component supply position P1 to a mounting position P2 on the component feeder 12. However, there may be mounted components 5 in the straight path R10. In that case, the head 16 moving along the straight path R10 will pass over the mounted components 5. As explained with reference to Figure 2, if the upper end 5T of the mounted component 5 located on the straight path R10 is above the lower end 4B of component 4F, the mounted component 5 and component 4F will interfere with each other when the head 16 moves along the straight path R10.

[0028] To avoid interference between the mounted component 5 and component 4F, the head 16 can move along a detour path R20. The detour path R20 includes a first detour path R21, a second detour path R22, and a third detour path R23. Along the detour path R20, the head 16 does not pass over the mounted component 5. Therefore, even if the upper end 5T of the mounted component 5 is located above the lower end 4B of component 4F, interference between the mounted component 5 and component 4F can be avoided.

[0029] As shown in Figure 3, the detour path R20 includes an external path (e.g., a first detour path R21, a second detour path R22) that passes outside the outer edge of the substrate 2 in a plan view. This makes it possible to more reliably prevent interference between component 4F and component 5 moving along the detour path R20 compared to a configuration in which the head 16 passes over the substrate 2.

[0030] Furthermore, the first bypass path R21 and the third bypass path R23 of the bypass path R20 are paths that move linearly along the substrate transfer direction D1. Also, the second bypass path R22 of the bypass path R20 is a path that moves linearly along a direction orthogonal to the substrate transfer direction D1. That is, the bypass path R20 is a single-acting path constituted by paths that move in the X direction and the Y direction. Thereby, compared with a configuration in which the mounted component 5 is bypassed by a path that moves in a diagonal direction inclined with respect to the substrate transfer direction D1, the mounted component 5 can be bypassed with relatively simple control. Also, by adopting a path that moves linearly as the bypass path, it is possible to easily confirm whether or not interference between the component 4F and the mounted component 5 is avoided. For example, as shown in FIG. 3, when mounting the component 4F on the substrate 2 while bypassing the mounted component 5, it is necessary to confirm whether or not interference between the mounted component 5 and the component 4F is avoided by the bypass path R20. Here, the position (x1, y1) where the mounted component 5 is mounted and the size of the mounted component 5 (d5x (dimension in the X direction), d5y (dimension in the Y direction)) are known. Also, the mounting position (x2, y2) of the component 4F and the size of the component 4F (d4x (dimension in the X direction), d4y (dimension in the Y direction)) are also known. For the bypass path R20 that moves outside the substrate 2 in the +X direction, then in the +Y direction, and finally in the -X direction as shown in FIG. 3, if the following formula y1 + d5y / 2 < y2 - d4y / 2 is satisfied, it can be determined that the component 4F can be mounted at the mounting position (x2, y2) without interfering with the component 5. Alternatively, it can be determined whether or not the bypass path R20 can avoid interference with the mounted component 5 based on whether or not a mounted component 5 of a predetermined height exists in a region where y2 - d4y / 2 - Δy < y < y2 + d4y / 2 + Δy. Thus, using the mounting positions and sizes of the components 4F and 5, it is possible to easily determine whether or not interference between the component 4F and the component 5 occurs for the bypass path.

[0031] Referring to Figure 4, the movement path control process performed by the control unit 26 will be described. The control unit 26 controls the movement path of the head drive mechanism 30 based on the movement path determined by the movement path control process. Hereinafter, the component that is the target of determining the movement path will be referred to as the "target component," the mounting position of the target component will be referred to as the "target mounting position," and the straight path extending from the component supply position P1 to the target mounting position will be referred to as the "target straight path."

[0032] First, the control unit 26 receives mounted component information from a management device (not shown) (S10). Here, the mounted component information includes identification information, mounting position P2, and size (i.e., width, depth, height) of all components mounted on the substrate 2.

[0033] Next, the control unit 26 receives the mounting order from the management device (S12). The mounting order is information that associates the identification information of the parts with the mounting order.

[0034] The control unit 26 determines the movement path of the target component according to the mounting order received in S12. The control unit 26 determines whether or not there is a mounted component (for example, mounted component 5) on the target linear path (S20). Specifically, the control unit 26 determines whether or not there is a mounting position of a pre-installed component with an earlier mounting order than the target component on the target linear path, based on the mounted component information received in S10 and the mounting order received in S12. If there is a mounting position of a pre-installed component on the target linear path (YES in S20), the control unit 26 determines that there is a mounted component on the target linear path and proceeds to S22. On the other hand, if there is no mounting position of a pre-installed component on the target linear path (NO in S20), the control unit 26 determines that there is no mounted component on the target linear path and proceeds to S60.

[0035] In S60, the control unit 26 selects a target linear path (for example, linear path R10) as the movement path for the target component. As a result, if there are no mounted components on the target linear path, the head 16 can move from the component supply position P1 to the target mounting position in the shortest distance.

[0036] In S22, the control unit 26 obtains the height of the mounted component that was determined to be on the target straight path in S20. Specifically, the control unit 26 obtains information regarding the height (for example, height 5H) of the component that was determined to be a pre-installed component in S20 from the mounted component information received from the management device in S10. This allows the control unit 26 to obtain the height of the upper end of the mounted component.

[0037] In S30, the control unit 26 determines whether the upper end of the mounted component is below the first lower end (for example, the first lower end B1). Specifically, the control unit 26 calculates the first lower end by subtracting the height of the target component (for example, height 4H) from the height of the lower end of the nozzle 6 raised to the highest point of the first stroke S1. If the upper end of the mounted component is above the first lower end B1 (NO in S30), the control unit 26 proceeds to S40. If the upper end of the mounted component is below the first lower end B1 (YES in S30), the control unit 26 proceeds to S32.

[0038] In S32, the control unit 26 adjusts the height of the nozzle 6. Specifically, the control unit 26 raises the nozzle 6 to the first stroke S1 so that the lower end of the target part (for example, the lower end 4B) is positioned above the upper end of the mounted part. This prevents interference between the target part and the mounted part even when the head 16 moves along the target straight path (S60).

[0039] In S40, the control unit 26 determines whether the upper end of the mounted component is below the second lower end B2. If the upper end of the mounted component is above the second lower end B2 (NO in S40), the control unit 26 proceeds to S50. If the upper end of the mounted component is below the second lower end B2 (YES in S40), the control unit 26 proceeds to S42.

[0040] In S42, the control unit 26 adjusts the height of the head 16. Specifically, if the nozzle 6 is not at the highest point in the first stroke S1, the control unit 26 first raises the nozzle 6 to the highest point in the first stroke S1. Furthermore, the control unit 26 raises the head 16 in the second stroke S2 ​​so that the lower end of the target part (for example, the lower end 4B) is higher than the upper end of the mounted part. This prevents interference between the target part and the mounted part even when the head 16 moves along the target straight path (S60).

[0041] In S50, the control unit 26 selects a detour route (for example, detour route R20). This allows the target component to be mounted at the target mounting position while avoiding interference between the target component and the mounted component, even if the upper end of the mounted component is above the second lower end B2. The determination of whether or not interference between the target component and the mounted component has been avoided by the detour route can be made using the method described above.

[0042] (Effects of this embodiment) In this embodiment, when the upper end 5T of a mounted component 5 is located below the first lower end B1 (YES in S30), the component mounting machine 10 moves the head 16 along the straight path R10 without adjusting the height of the head 16 (i.e., while maintaining the head 16 at the lowest point of the second stroke S2). This allows the component mounting machine 10 to move the head 16 along the straight path R10 to the mounting position over the shortest distance. By maintaining the head 16 at the lowest point of the second stroke S2, the distance the nozzle 6 needs to be lowered at the mounting position P2 can be reduced. This increases the efficiency of component mounting. Furthermore, when the upper end 5T of a mounted component 5 is located below the second lower end B2, the component mounting machine 10 moves the head along the straight path R10 with the head 16 raised so that the lower end 4B of component 4 is higher than the upper end 5T. As a result, the component mounting machine 10 can move the head 16 to the mounting position P2 along the shortest distance along the straight path R10, thereby reducing the travel distance of the head 16. Furthermore, if the upper end 5T of the mounted component 5 is located below the second lower end B2, the component mounting machine 10 can move the head to the mounting position along the same straight path R10 as when the upper end 5T of the mounted component 5 is located below the first lower end B1. As a result, the efficiency of component mounting can be increased.

[0043] (Second example) The component mounting machine 10 of the second embodiment will be described with reference to Figure 3. In this embodiment, the mounting path of the component 4S located furthest to the +Y and +X directions among the multiple components 4 arranged on the tray 56 will be mainly described. As shown by the dashed line in Figure 3, the component mounting machine 10 of the second embodiment moves the component 4S picked up at the component supply position P1 on the tray 56 to the imaging position P3 along the imaging preparation path R2, captures the lower surface of the component 4 with the camera of the imaging unit 40, and then moves it to the mounting position P2. In other words, the component mounting machine 10 of the second embodiment has a different path for moving the head 16 than the component mounting machine 10 of the first embodiment. The component mounting machine 10 of the second embodiment selects a path that goes to the mounting position P2 via the imaging position P3, rather than a straight path extending from the component supply position P1 to the mounting position P2 of the component 4S on the tray 56. However, in other respects, the component mounting machine 10 of the second embodiment has the same configuration as the component mounting machine 10 of the first embodiment.

[0044] In the component mounting machine 10 of this embodiment, a component 4S is supplied from the imaging position P3 to the mounting position P2. By moving the head 16 along the straight path R12 extending from the imaging position P3 to the mounting position P2 over the shortest distance, the travel distance of the head 16 can be reduced. However, if a mounted component 5 is present along the straight path R12, the head 16 moving along the straight path R12 will pass over the mounted component 5, potentially causing interference between component 4 and the mounted component 5. The control unit 26 of the second embodiment controls the path along which the head 16 moves from the imaging position P3 to the mounting position P2.

[0045] The control unit 26 of the second embodiment performs the movement path control process shown in Figure 4. At this time, in S20, the control unit 26 of the second embodiment determines whether or not there is a mounted component (e.g., mounted component 5) on a straight path (e.g., straight path R12) extending from the imaging position P3 to the mounting position P2. In other words, in this embodiment, the straight path extending from the imaging position P3 to the target mounting position corresponds to the "target straight path". Other processing in the movement path control process performed by the control unit 26 of the second embodiment is the same as in the movement path control process of the first embodiment. The component mounting machine 10 of this embodiment can improve the efficiency of mounting the component 4 whose lower surface has been imaged. In this embodiment, the imaging preparation path R2 and the straight path R12 are examples of "predetermined paths".

[0046] The following points should be noted regarding the component mounting machine 10 described in the examples. In this specification, the first embodiment, in which a component 4 is moved from a component supply position P1 to a mounting position P2, and the second embodiment, in which a component 4 is moved from a component supply position P1 to a mounting position P2 via an imaging position P3, are described as separate embodiments. However, in modified examples, for instance, each component to be mounted may be assigned a path for moving from the component supply position P1 to the mounting position P2, and a path for moving from the component supply position P1 to the mounting position P2 via an imaging position P3. In that case, for example, the mounted component information may include information indicating whether or not the component has been imaged, associated with the component identification information. The control unit 26 may execute a movement path control process based on a linear path R12 moving from the imaging position P3 to the mounting position P2 if information indicating that imaging has been performed is included, and may execute a movement path process based on a linear path R10 moving from the component supply position P1 to the mounting position P2 if information indicating that imaging has been performed is not included. Furthermore, in another modified example, if it is not necessary to image the lower surface of component 4, the component mounting machine 10 of the first embodiment does not need to include the imaging unit 40.

[0047] In the embodiment described above, the imaging unit 40 is positioned so that its imaging direction is upward. However, in a modified example, the imaging unit 40 may further include a camera for imaging the side of the component 4, in addition to the camera whose imaging direction is upward. In that case, the imaging unit 40 may further image the side of the component 4 in addition to the bottom surface at imaging position P3. Furthermore, in a further modified example, the imaging unit 40 may only image the side of the component 4. In that case, the imaging unit 40 does not need to include a camera whose imaging direction is upward.

[0048] Furthermore, in the above-described embodiment, the control unit 26 of the component mounting machine 10 determined the movement path of the head drive mechanism 30 through movement path processing. However, in this modified example, an external management device may perform the movement path processing. In that case, the management device may transmit the component mounting program generated by the movement path processing to the component mounting machine 10. In that case, the control unit 26 of the component mounting machine 10 may move the head drive mechanism 30 based on the component mounting program received from the management device.

[0049] Furthermore, although the component 4 was attracted by the nozzle 6 in the above-described embodiment, the configuration is not limited to this, and the component mounting machine 10 may, for example, be equipped with a chuck for gripping the component 4 instead of the nozzle 6.

[0050] Furthermore, in the above-described embodiment, the detour route R20 includes an external route (for example, a first detour route R21 and a second detour route R22), but the detour route R20 may also be a route on the substrate 2.

[0051] Furthermore, in the above-described embodiment, the detour path R20 is a single-movement path consisting of a path that moves linearly along the substrate transport direction D1 and a path that moves linearly along a direction perpendicular to the substrate transport direction D1. However, the detour path R20 may also include a path that moves in an oblique direction inclined with respect to the substrate transport direction D1.

[0052] Furthermore, in the above-described embodiment, the control unit 26 adjusts the height of the nozzle 6 in S32 of Figure 4, and then adjusts the height of the head 16 in S42. However, in a modified example, the control unit 26 may adjust the height of the head 16 first, and then adjust the height of the nozzle 6.

[0053] The specific examples of the technologies disclosed herein have been described in detail above, but these are merely illustrative and do not limit the scope of the claims. The technologies described in the claims include various modifications and changes to the specific examples described above. Furthermore, the technical elements described herein or in the drawings exhibit technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technologies illustrated herein or in the drawings achieve multiple objectives simultaneously, and achieving even one of these objectives constitutes technical usefulness in itself. [Explanation of symbols]

[0054] 2: Circuit board 4: Electronic components 4B: Bottom edge 4H: Height 5: Pre-installed components 5T:Top end 6: Nozzle 10: Component mounting machine 12: Parts feeder 14: Feeder holding section 16: Head 17: Nozzle mounting hole 18: Head moving device 20: Circuit board conveyor 24: Touch panel 26: Control Unit 30: Head drive mechanism 32: Y-axis slider 34: X-axis slider 36: Z-axis slider 40: Imaging Unit 50: Tray Unit 52: Pallet transport shuttle 54: Tray Palette 56: Tray B1: First lower end B2: Second lower end D1: Substrate transport direction P1: Part supply location P2: Implementation location P3: Imaging position R10, R12: Straight path R2: Imaging preparation route Route 20: Detour R21: First detour route R22: Second detour route Route 23: Third detour route S1: First stroke S2: Second stroke

Claims

1. A component mounting machine that mounts components to mounting positions on a circuit board, A component holding unit that holds the component supplied to the component supply position, A head that holds the aforementioned component holding portion so that it can be raised and lowered in a first stroke, A head drive mechanism holds the head so that it can be raised and lowered in a second stroke and moves it horizontally relative to the substrate, A movement path control unit controls the path along which the head moves from the component supply position toward the mounting position along the substrate, Equipped with, The aforementioned movement path control unit, In a predetermined path from the component supply position to the mounting position, if the upper end of a mounted component already mounted on the substrate is located below the first lower end, which is the lower end of the component held by the component holder when the head is at the lowest point of the second stroke and the component holder is at the highest point of the first stroke, the head is moved along the predetermined path while maintaining the head at the lowest point of the second stroke. When the upper end of the mounted component is located above the first lower end, and the head is at the highest point in the second stroke and the component holder is located below the second lower end, which is the lower end of the component held by the component holder when the component holder is at the highest point in the first stroke, the head is raised so that the lower end of the component held by the component holder is higher than the upper end of the mounted component, and the head is moved along the predetermined path. If the upper end of the mounted component is located above the second lower end, the head is moved along a bypass path that bypasses the mounted component. Component mounting machine.

2. The system further comprises an imaging unit capable of imaging the lower surface and / or side surface of the component held by the component holding unit at a predetermined imaging position, The predetermined path is a path that goes through the imaging position and proceeds to the mounting position. The component mounting machine according to claim 1.

3. The component mounting machine according to claim 1, wherein the detour path includes an external path that passes outside the outer shape of the substrate as viewed from above.

4. The component mounting machine according to any one of claims 1 to 3, wherein the detour path is a single-movement path composed of a path that moves linearly in the substrate transport direction for transporting the substrate and a path that moves linearly in a direction perpendicular to the substrate transport direction.

5. A component mounting method in which a component is mounted to a mounting position on a circuit board using a component mounting machine, The aforementioned component mounting machine is A component holding unit that holds the component supplied to the component supply position, A head that holds the aforementioned component holding portion so that it can be raised and lowered in a first stroke, A head drive mechanism holds the head so that it can be raised and lowered in a second stroke and moves it horizontally relative to the substrate, A movement path control unit controls the path along which the head moves from the component supply position toward the mounting position along the substrate, Equipped with, The aforementioned component mounting method is In a predetermined path from the component supply position to the mounting position, if the upper end of a mounted component already mounted on the substrate is located below the first lower end, which is the lower end of the component held by the component holder when the head is at the lowest point of the second stroke and the component holder is at the highest point of the first stroke, the head is moved along the predetermined path while maintaining the head at the lowest point of the second stroke. When the upper end of the mounted component is located above the first lower end, and the head is at the highest point in the second stroke and the component holder is located below the second lower end, which is the lower end of the component held by the component holder when the component holder is at the highest point in the first stroke, the head is raised so that the lower end of the component held by the component holder is higher than the upper end of the mounted component, and the head is moved along the predetermined path. If the upper end of the mounted component is located above the second lower end, the head is moved along a bypass path that bypasses the mounted component. Equipped with, Component mounting method.

Images