Reconfigurable mainframe with interchangeable interface plates

Abstract

To provide a reconfigurable mainframe in an electronic device fabrication system including replaceable interface plates.SOLUTION: In a device fabrication system 100A, a mainframe 104 includes a base, a plurality of facets 101A-101D on the base, an a lid over the plurality of facets including frames. The base, the lid and the plurality of facets together define an interior volume 134 that includes a robot arm 136. Replaceable interface plates 128A-131 are attached to the frames of the facets. The replaceable interface plates include a plurality of substrate access ports 132. Substrate access ports are configured such that the robot arm can access process chambers 106-116.SELECTED DRAWING: Figure 1A

Description

Technical Field

[0001]

[0001] Embodiments of the present disclosure generally relate to an electronic device manufacturing system, and more specifically, to a reconfigurable mainframe of an electronic device manufacturing system including a replaceable interface plate. Embodiments also relate to a replaceable interface plate for a mainframe.

Background Art

[0002]

[0002] Conventional electronic device manufacturing systems (also referred to as device manufacturing systems) may include a mainframe with a plurality of processing chambers and load lock chambers disposed around it. The mainframe may have several sidewalls (commonly referred to as "facets") to which the processing chambers and / or load lock chambers are connected. The facets of a conventional mainframe are machined to have a predetermined configuration with substrate access ports having a predetermined size, position, etc. Once a conventional mainframe is manufactured, the type, size, arrangement, and position of the substrate access ports are fixed for that mainframe. If the owner of the mainframe desires a new configuration, a new mainframe with the new configuration is purchased.

Summary of the Invention

[0003]

[0003] According to a first aspect of the present disclosure, the main frame of a device manufacturing system includes a base, a plurality of facets on the base, and a lid on the plurality of facets. The first facet of the plurality of facets includes a first frame. The base, the lid, and the plurality of facets together define an internal space including a robotic arm. A first replaceable interface plate is mounted on the first frame of the first facet. The first replaceable interface plate includes a plurality of substrate access ports. The first substrate access port of the plurality of substrate access ports is configured to allow the robotic arm to access a first processing chamber. The second substrate access port of the plurality of substrate access ports is configured to allow the robotic arm to access a second processing chamber. In one embodiment, the first replaceable interface plate is load-bearing, and the frame is not load-bearing.

[0004]

[0004] According to a second aspect of the present disclosure, the replaceable interface plate is configured to be mounted on a facet of the main frame. The replaceable interface plate includes a plurality of board access ports. A first board access port of the plurality of board access ports is configured to provide access from the main frame to a first processing chamber. A second board access port of the plurality of board access ports is configured to provide access from the main frame to a second processing chamber. The replaceable interface plate is load-bearing against the main frame. Thus, the replaceable interface plate is configured to withstand vertical forces on the main frame caused by the pressure difference between the internal space of the main frame and the outside of the main frame.

[0005]

[0005] According to a third aspect of the present disclosure, a method for configuring a mainframe includes determining a first plurality of processing chambers connected to a first facet of the mainframe, determining the locations of a plurality of substrate access ports on the facet housing the first plurality of processing chambers, determining the configuration of a first interchangeable interface plate having one of the plurality of substrate access ports at each location, and manufacturing the first interchangeable interface plate. The method further includes mounting the first interchangeable interface plate to the first facet of the mainframe and mounting the plurality of processing chambers to the first interchangeable interface plate, wherein each of the plurality of processing chambers is accessible from the mainframe via the substrate access ports of the plurality of substrate access ports. The method may be performed after the mainframe has been manufactured (for example, to change the configuration of the mainframe).

[0006]

[0006] In this disclosure, similar elements are shown in the accompanying drawings by similar reference numerals, but these are examples and not limiting. It should be noted that various references to “an” or “one” embodiments in this disclosure do not necessarily refer to the same embodiment, but rather mean at least one. [Brief explanation of the drawing]

[0007] [Figure 1A] A schematic top view of an electronic device manufacturing system having a reconfigurable mainframe having a first configuration, according to one embodiment of the present disclosure, is shown. [Figure 1B] A schematic top view of an electronic device manufacturing system having a reconfigurable mainframe having a second configuration, according to one embodiment of the present disclosure, is shown. [Figure 1C] A schematic top view of an electronic device manufacturing system having a reconfigurable mainframe having a third configuration, according to one embodiment of the present disclosure, is shown. [Figure 2A]This is a perspective view showing a reconfigurable mainframe according to one embodiment of the present disclosure. [Figure 2B] This is a side view of a first exemplary interchangeable interface plate according to one embodiment of the present disclosure. [Figure 2C] This is a side view of a second exemplary interchangeable interface plate according to one embodiment of the present disclosure. [Figure 2D] This is a side view of a third exemplary interchangeable interface plate according to one embodiment of the present disclosure. [Figure 3] One embodiment of the present disclosure shows a side section view of the main frame and a mounted interchangeable interface plate, cut out at the location of the board access port. [Figure 4] One embodiment of the present disclosure shows a side section view of the main frame and an attached interchangeable interface plate, cut off at the position of the frame column of the main frame. [Figure 5] This invention illustrates a process for assembling a reconfigurable mainframe for an electronic device manufacturing system according to one embodiment of this disclosure. [Modes for carrying out the invention]

[0008]

[0017] The embodiments relate to a reconfigurable mainframe (also referred to as a transfer chamber) having one or more interchangeable interface plates. The reconfigurable mainframe comprises a plurality of facets, at least one of which comprises a frame configured to receive an interchangeable interface plate. In one embodiment, the reconfigurable mainframe comprises a frame for each facet of the reconfigurable mainframe. An interchangeable interface plate may be mounted on each of the frames. A lid may be positioned on the frame of the facet or fixed to the interchangeable interface plate. In the embodiment, the interchangeable interface plate is load-bearing, while the frame is not. Therefore, when the internal space of the mainframe is evacuated to a vacuum by a pump, vertical (and horizontal) forces are maintained by the interchangeable interface plate, but little to no force is applied to the frame.

[0009]

[0018] In some embodiments, the main frame may have a square or rectangular shape. One or more load lock chambers may be connected to one facet of the main frame. In one embodiment, one or more load lock chambers are connected to an interchangeable interface plate on one facet of the main frame. In one embodiment, additional interchangeable interface plates are connected to one or more additional facets of the main frame, and one or more processing chambers are connected to some or all of the additional interchangeable interface plates. The processing chambers can perform various board processing operations, and processing chambers connected to different interchangeable interface plates on a facet may, for example, be of different sizes, have different sized board access ports, have different connection types, and have different heights. For example, some board access ports may have heights that accommodate two end effectors at different pitches. Also, each interchangeable interface plate may be configured to connect to the same or different number of processing chambers and / or load lock chambers. For example, one interchangeable interface plate may be configured to connect to a single processing chamber of a first size, and a second interchangeable interface plate may be configured to connect to two processing chambers of a second size different from the first size, and so on. One or more substrate access ports on each interchangeable interface plate can interface with each of the load lock chamber and processing chambers to a transfer chamber, enabling the transfer of substrates between them. The substrate access ports may be sized and positioned on each interchangeable interface plate to accommodate the number and size of chambers that may be connected to each facet. An electronic device manufacturing system having such a mainframe can enable a wider range and more diverse sequence of substrate processing to be performed in a single system, thus improving the versatility, capability, and / or efficiency of such an electronic device manufacturing system.In another embodiment, a method for assembling an electronic device manufacturing system is provided.

[0010]

[0019] The reconfigurable mainframe and interchangeable interface plates disclosed in embodiments offer several advantages over conventional mainframes. Conventional mainframes have a single design determined at the time of manufacture. This single design has a fixed number of board access ports with fixed size and fixed positions. If it is advantageous to change the configuration of such a conventional mainframe in any case, a viable option would be to purchase a new mainframe with the new configuration. In contrast, a reconfigurable mainframe can be reconfigured at any time by manufacturing new interchangeable interface plates. If the new configuration is beneficial, one or more new interchangeable interface plates with the new configuration may be manufactured. The existing interchangeable interface plates can then be removed from the mainframe, and the new interchangeable interface plates can be mounted on the mainframe. Thus, the flexibility of the mainframe is greatly improved in embodiments. Furthermore, the effective lifespan of the mainframe can be extended for reasons such as the availability of new processing chambers, the development of new slit valve technology, the development of new local center detection (LCF) technology (e.g., using light-emitting diodes (LEDs), lasers and / or other scanning methods to determine where the wafer is located within the pockets of robotic blades or end effectors), etc. Older replaceable interface plates with older slit valve technology, older local center detection technology, etc., can be replaced, for example, with new replaceable interface plates with new slit valve technology and / or new local center detection technology.

[0011]

[0020] As used herein, the singular forms “a, an” and “the” refer to multiple objects unless otherwise specified in the context. For example, a reference to “substrate” includes a single substrate (e.g., a single wafer) as well as a mixture of two or more substrates, and a reference to “processing chamber” includes a processing chamber as well as a mixture of two or more processing chambers, and so on.

[0012]

[0021] As used herein, the term “about” in relation to a measured quantity refers to the normal variation of the measured quantity that is expected when a person skilled in the art performs the measurement, exercises a certain level of care, and utilizes the precision of the measuring instrument. In certain embodiments, the term “about” includes ±10% of the indicated number, for example, “about 10” includes 9 to 11.

[0013]

[0022] The ranges of values ​​shown herein are intended solely as abbreviations for referring individually to the individual values ​​that fall within those ranges, unless otherwise specified herein, and each value is incorporated into the specification as if it were individually enumerated herein. All methods described herein may be performed in any preferred order, unless otherwise specified herein or unless it is clearly inconsistent with the context. Any and all examples or exemplary expressions provided herein (e.g., "etc.") are intended merely to indicate specific materials and methods and not to imply limitations on scope. No expression herein should be construed as indicating any non-claimed element essential to the carrying out of the disclosed materials and methods.

[0014]

[0023] Figures 1A to 1C show schematic top views of an electronic device manufacturing system having a reconfigurable mainframe. Figure 1A shows a schematic top view of a first configuration 100A of the electronic device manufacturing system according to one embodiment of the present disclosure. Figure 1B shows a schematic top view of a second configuration 100B of the electronic device manufacturing system according to one embodiment of the present disclosure. Figure 1C shows a schematic top view of a third configuration 100C of the electronic device manufacturing system according to one embodiment of the present disclosure.

[0015]

[0024] An electronic device manufacturing system may include a main frame (also referred to as a transfer chamber) 104 configured to process a substrate and having four facets 101A to 101D. Although the four facets 101A to 101D are shown in a rectangular configuration, the main frame 104 may alternatively have other numbers of facets (e.g., five, six, seven, eight, etc.) and / or other shapes. In embodiments, the facets may be the same size (e.g., the same width) or of different widths. In one embodiment, the main frame 104 has a rectangular shape, with facets 101A and 101C being substantially parallel to each other, facets 101B and 101D being substantially parallel to each other, and facets 101A and 101C being substantially perpendicular to facets 101B and 101D. In one embodiment, facets 101B and 101D have a first length that is at least twice the second length of facets 101A and 101C. In one embodiment, facets 101B and 101D have a length of approximately 100 to 150 inches, and facets 101A and 101C have a length of approximately 40 to 60 inches. In one embodiment, the main frame 104 has a pentagonal shape. In one embodiment, the main frame includes a first facet having a first length, and second and third facets on either side of the first facet, each having a second length greater than the first length, and fourth and fifth facets connected to the second and third facets, respectively, each having a third length greater than or equal to the first length and less than the second length.

[0016]

[0025] The main frame 104 may include an internal space 134, and the facets 101A - 101D may define the side walls of the internal space 134. The main frame 104 may further include a base (not shown) and a lid (not shown). Together, the facets 101A - 101D, the base, and the lid may define the internal space 134. A robot arm (also referred to as a robot assembly) 136 may be disposed within the internal space 134 of the main frame 104. The internal space 134 may typically be under vacuum during operation of the main frame 104.

[0017]

[0026] Each of the facets 101A - 101D may comprise a frame to which a replaceable interface plate may be attached. Alternatively, a subset of the facets 101A - 101D may comprise a frame to which a replaceable interface plate is attached. Other facets may be manufactured in a conventional manner with side walls having a fixed configuration. For each facet having a frame rather than a fixed configuration, a replaceable interface plate can be attached to the frame of the facet to form the side wall of the facet. At any time, an existing replaceable interface plate attached to the facet can be removed and a new replaceable interface plate having a different design can be attached to that facet. Thus, the main frame 104 is a reconfigurable main frame having a flexible design.

[0018]

[0027] In FIG. 1A, a replaceable interface plate 128A is attached to facet 101B, a replaceable interface plate 129 is attached to facet 101C, a replaceable interface plate 130A is attached to facet 101D, and a replaceable interface plate 131 is attached to facet 101A. The replaceable interface plate 128A has three substrate access ports 132. Each substrate access port 132 may be configured to allow a horizontally oriented substrate 140 to pass therethrough. The substrate 140 may be a wafer (e.g., a semiconductor wafer or a non-semiconductor device substrate), a glass plate or panel, and / or other workpiece used to fabricate electronic devices or circuit components. Each substrate access port 132 can be, for example, an elongated slot or slit formed in the sidewall of the main frame 104 or the replaceable interface plates 128A, 130A, each of which can include, for example, a slit valve or other suitable device for opening and closing the substrate access port 132, and / or a local centering detector (LCF) suitable for determining the position of the substrate 140 transferred through the substrate access port 132. The slit valve can be any suitable conventional structure, such as an L-motion slit valve. Other suitable devices can also be used to open and close the substrate access port 132. The substrate access port 132 may include, in an embodiment, a single gate or a dual gate (e.g., having a first gate inside the replaceable interface plate at the substrate access port and a second gate outside the replaceable interface plate at the substrate access port).

[0019]

[0028] Three processing chambers 106, 108, 110 are attached to the replaceable interface plate 128A. Each of the processing chambers 106 - 110 has a chamber port aligned with the substrate access port 132 within the replaceable interface plate 128A.

[0020]

[0029] The replaceable interface plate 130A has three board access ports 132. Three processing chambers 112, 114, and 116 are mounted on the replaceable interface plate 130A. Each of the processing chambers 112 to 116 has a chamber port adjacent to the board access ports 132 in the replaceable interface plate 130A.

[0021]

[0030] The replaceable interface plate 129 is a solid plate without board access ports. The replaceable interface plate 131 includes two board access ports 132. The replaceable interface plate 131 is connected to one or more load lock chambers 126 (for example, it may include two adjacent load lock chambers). Each load lock chamber 126 has a chamber port adjacent to one of the board access ports in the replaceable interface plate 129.

[0022]

[0031] Each load lock chamber 126 may be a batch-type or single-substrate-type load lock chamber. In some embodiments, the processing chamber 126 may be a multilayer load lock chamber. For example, the load lock chamber 126 may be a double-layer load lock chamber, a triple-layer load lock chamber, or a load lock chamber with four or more stacked load locks (e.g., a quad load lock chamber). Alternatively, the load lock chamber 126 may be a single-space load lock chamber. Each load lock chamber 126 may have one or more chamber ports corresponding to each substrate access port 132. For example, a multilayer load lock chamber 126 that may have two separate substrate spaces may have two vertically aligned chamber ports corresponding to vertically aligned substrate access ports 132. A triple-layer load lock chamber that may have three separate substrate spaces may have three vertically aligned chamber ports corresponding to vertically aligned substrate access ports. A single-space load lock chamber may have a single chamber port corresponding to a substrate access port 132. Any one or more load lock chambers 126 may be a stacked load lock chamber, a triple stacked load lock chamber, and / or a single-space load lock chamber. In some embodiments, any one or more load lock chambers 126 may also be processing chambers. That is, any one or more load lock chambers 126, or any one of the spaces located within them, may be capable of performing preheating, mitigation, cooling, and / or other processing steps on the substrate.

[0023]

[0032] The main frame 104, processing chambers 106-116, and / or load lock chamber 126 may each be operated under vacuum pressure. Processing chambers 106-116 may perform the same or different processes on the substrate 140, including, for example, deposition, oxidation, nitriding, etching, polishing, cleaning, lithography, inspection, etc. Other processes may be performed within them.

[0024]

[0033] The main frame 104 may further include a robot assembly 136 within an internal space 134. The robot assembly 136 may be configured to transfer one or more substrates 140 between each processing chamber 106-116 and the load lock chamber 126. The robot assembly 136 may be configured to directly transfer the substrates 140 from any one chamber to any other chamber of the main frame 104. In some embodiments, the substrates 140 may be transferred by the robot assembly 136 in any order or direction. In some embodiments, the robot assembly 136 may have dual transfer blades that can independently protrude from any chamber attached to the main frame 104 and can be retracted into any chamber, thereby increasing the system throughput by enabling simultaneous parallel transfer of substrates. In some embodiments, the robot assembly 136 may have only a single transfer blade and / or may be a SCARA (Selective Adaptive Articulated Robot Arm) robot. Alternatively, the robot assembly 136 may be any suitable mechanism for transferring the substrate between chambers attached to the main frame 104, such as a linear robot or a non-linear robot.

[0025]

[0034] The load lock chamber 126 may be connected to a factory interface 102 which can be connected to one or more FOUPs (Front Opening Unified Pods) 118. One or more load lock chambers 126 may provide a first vacuum interface between the factory interface 102 and the transfer chamber 126. In some embodiments, each of the load lock chambers 126 can increase substrate throughput by alternately communicating with the main frame (transfer chamber) 104 and the factory interface 102. That is, one load lock chamber 126, or any one space of a stacked load lock chamber or triple stacked load lock chamber, may communicate with the transfer chamber 104, while other load lock chambers 126, or other spaces of a stacked load lock chamber or triple stacked load lock chamber, may communicate with the factory interface 102. Substrate transfer between the factory interface 102, the load lock chambers 126, and the transfer chamber 104 may be carried out in any other suitable manner.

[0026]

[0035] Each FOUP118 may be a container having an internal cassette for holding multiple substrates. Each FOUP118 may have a forward-opening interface configured for use with a factory interface 102. The factory interface 102 may have a buffer chamber (not shown) and one or more robot assemblies 138 configured to transport substrates 140 via linear, rotational, and / or vertical motion between the FOUP118 and the load lock chamber 126. The substrates may be transported between the FOUP118 and the load lock chamber 126 in any order or direction. The load lock chamber 126 may be a batch-type or single-substrate-type load lock chamber.

[0027]

[0036] The controller 171 may control the operation of robot assembly 138, robot assembly 136 and / or the electronic device manufacturing system. The controller 171 may control the processing and transfer of substrates 140 within and through the electronic device manufacturing system. The controller 171 may be, for example, a general-purpose computer and / or include a microprocessor or other suitable CPU (central processing unit), memory for storing software routines that control the electronic device manufacturing system, input / output peripherals, and support circuitry (e.g., power supply, clock circuit, drive circuits for robot assemblies 138 and 136, cache, and / or equivalent). The controller 171 may be programmed to process one or more substrates sequentially through each of the processing chambers mounted on the mainframe 104. In other embodiments, the controller 171 may be programmed to process the substrates in any order through the processing chambers. In yet another embodiment, the controller 171 may be programmed to skip and / or repeat the processing of one or more substrates in one or more processing chambers. Alternatively, the controller 171 may be programmed to process one or more substrates in an electronic device manufacturing system in any suitable manner.

[0028]

[0037] The electronic device manufacturing system may have an appropriate number of other FOUPs 118 and / or load lock chambers 126. In some embodiments, the number of load lock chambers connected to facet 101A may be independent of the number of processing chambers connected to any one of facets 101B to 101D. For example, the number of load lock chambers may be different from the maximum number of processing chambers connected to a facet. Also, in some embodiments, up to four processing chambers may be connected to a single facet, or more than four processing chambers may be connected to a single facet, depending on the size of the main frame 104 relative to the size of four processing chambers.

[0029]

[0038] Figure 1B shows the same FOUP 118, factory interface 102, load lock 126, and mainframe 104 as shown in Figure 1A. However, in Figure 1B, the replaceable interface plate 128A is removed from facet 101B and the replaceable interface plate 128B is mounted on facet 101B. Similarly, the replaceable interface plate 130A is removed from facet 101D and the replaceable interface plate 130B is mounted on facet 101D. The replaceable interface plate 128B has two board access ports 132, in contrast to the three board access ports 132 of the replaceable interface plate 128A. Similarly, the replaceable interface plate 130B has two board access ports 132, in contrast to the three board access ports 132 of the replaceable interface plate 130A. Therefore, in the second configuration 100B, processing chambers 106, 108, 112, and 114 are rearranged, and processing chambers 110 and 116 are removed.

[0030]

[0039] Figure 1C shows the same FOUP 118, factory interface 102, load lock 126, and mainframe 104 as shown in Figures 1A and 1B. However, in Figure 1C, the replaceable interface plate 128A is removed from facet 101B, and the replaceable interface plate 128C is mounted on facet 101B. Similarly, the replaceable interface plate 130A is removed from facet 101D, and the replaceable interface plate 130C is mounted on facet 101D. The replaceable interface plate 128C has four board access ports 132, in contrast to the three board access ports 132 of the replaceable interface plate 128A. The replaceable interface plate 130C has three board access ports 132, but they are in different positions than the three board access ports 132 of the replaceable interface plate 130A. In the third configuration 100C, processing chamber 112 is in the same position, but processing chambers 106, 108, 110, 114, and 116 have been removed and replaced with processing chambers 122, 124, 125, and 127.

[0031]

[0040] As illustrated, any type of processing chamber may be connected to a facet of the main frame 104 via an interchangeable interface plate. Some embodiments of the processing chambers include a quad processing chamber (e.g., including processing chambers 106-116), a single processing chamber (e.g., including processing chambers 125, 127), and a twin processing chamber (e.g., including processing chambers 122, 124). One exemplary processing chamber is:

[0032]

[0041] Each of the substrate access ports 132 may be the same size or of different sizes. Each interchangeable interface plate 128A-128C, 130A-130C, 129, 131 may contain the same or different number of substrate access ports 132, which may be of similar or different sizes. For example, some substrate access ports may have a first width (e.g., to accept a 200 mm wafer), some may have a second width (e.g., to accept a 300 mm wafer), and some may have a third width. The width of each substrate access port 132 is sufficient to allow the substrate 140 to pass through. The different sizes of the substrate access ports will allow the robot assembly 136 to reach different areas within the chamber connected to any of the facets 101A-101D. In some embodiments where the interchangeable interface plate has two or more board access ports, the board access ports do not have to be located at the lateral center within the board interface plate and / or are not equally spaced apart from one another. In some embodiments where the interchangeable interface plate has a single board access port, the board access port may be located at the lateral center in a facet or offset.

[0033]

[0042] In one embodiment, the interchangeable interface plate 128A is compatible with a plurality of additional interchangeable interface plates having a) a different number of substrate access ports than the interchangeable interface plate 128A, b) one or more substrate access ports located in different positions compared to the plurality of substrate access ports in the interchangeable interface plate 128A, c) one or more substrate access ports of different sizes compared to the plurality of substrate access ports in the interchangeable interface plate 128A, d) a different type of slit valve than the interchangeable interface plate 128A, and / or e) a different type of local center detector than the interchangeable interface plate 128A.

[0034]

[0043] Each interchangeable interface plate can have various numbers, sizes, and / or combinations of board access ports, provided that the width of the facets is suitable for accommodating the number, size, and / or combination of board access ports. For example, in some embodiments, an interchangeable interface plate may have one board access port 132 instead of three board access ports 132. In other embodiments, one interchangeable interface plate may have one board access port 132 of a first width and one board access port 132 of a second width, and another interchangeable interface plate may have one board access port of a first width and one board access port of a third width. Various combinations of board access ports are possible, provided that the facets have appropriate widths. This allows the mainframe 104 to be customized to connect to specific types and numbers of processing chambers and load lock chambers. In one embodiment, the first width may be about 1.2 meters, the second width about 2.4 meters, and the third width about 800 mm.

[0035]

[0044] In some embodiments, two electronic device manufacturing systems can be clustered. That is, one facet of each mainframe 104, such as facet 101C of the first mainframe and a facet of the second mainframe 202, may each include a replaceable interface plate that allows the two mainframes to be linked together (for example, with one or more load locks inserted between the two mainframes). The mainframes may be linked together to provide a pass-through chamber for transporting substrates between the two mainframes. This can further improve the versatility, capability, and / or efficiency of such an electronic device manufacturing system.

[0036]

[0045] Figure 2A shows a perspective view of a reconfigurable mainframe 200 according to one embodiment of the present disclosure. In one embodiment, the reconfigurable mainframe 200 may correspond to the mainframe 104 shown in Figures 1A to 1C.

[0037]

[0046] The reconfigurable main frame 200 includes a base 206 on which a pair of frames are mounted. Each frame can be framed, corresponding to a side or facet of the main frame 200. Conceptually, a pair of frames may be a single three-dimensional frame 201 having multiple frame faces, each of which faces a facet of the main frame 200. Frame 201 may include columns 204A-204D, and may further include beams 208A-208D connecting the columns 204A-204D. Each frame (or frame face) may include a portion of the base, a pair of columns, and corresponding beams connecting the pairs of columns. For example, base 206, columns 204B-204C and beam 208A can constitute a first frame (or frame surface) for a first facet; base 206, columns 204A-204B and beam 208B can constitute a second frame (or frame surface) for a second facet; base 206, columns 204A and 204D and beam 208C can constitute a third frame (or frame surface) for a third facet; and base 206, columns 204C-204D and beam 208D can constitute a fourth frame (or frame surface) for a fourth facet.

[0038]

[0047] Each frame (or frame surface) may include lips 210A, 210B within the base 206. Lips 210A-210B may be configured to support forces transmitted to them by interchangeable interface plates mounted on facets. In addition, each frame (or frame surface) may include grooves or other features to receive O-rings 215, 220. The O-rings can seal the interchangeable interface plates to the frame (or frame surface).

[0039]

[0048] As shown in the figure, the interchangeable interface plate 230 is mounted to the frame (or frame surface) of the facet of the main frame 200. The interchangeable interface plate 230 can be mounted to the frame via bolts, screws, and / or other mounting mechanisms. The interchangeable interface plate 230 may include a configured number, size, and position of board access ports 234, 236, each of which may be configured to provide access for a robotic arm to the processing chamber. The interchangeable interface plate 230 may also have slit valves (not shown), LCFs (not shown), and / or other components mounted to or integrated with them.

[0040]

[0049] The replaceable interface plate 230 may be a metal plate. For example, the replaceable interface plate can be formed from aluminum, an aluminum alloy, steel, or another metal. In some embodiments, the replaceable interface plate includes a surface treatment such as a coating or an anodized layer (e.g., an Al2O3 anodized layer). Examples of coatings include coatings deposited by chemical vapor deposition (CVD), atomic layer deposition (ALD), electroplating, etc. Examples of coatings include dielectric coatings, Al2O3 coatings, nickel plating, Y2O3 coatings, etc. The replaceable interface plate 230 can be coated before being mounted on the main frame 200. Alternatively, the main frame 200 may be coated after the replaceable interface plate has been mounted. Thus, in some embodiments, a portion of the replaceable interface plate 230 has a surface treatment.

[0041]

[0050] The replaceable interface plate 230 further includes a step 232 on the inner bottom surface of the replaceable interface plate 230. The step can engage with a lip on the side wall of the base 206 which forms the frame (or frame surface) to which the replaceable interface plate 230 is mounted.

[0042]

[0051] The mainframe is configured to operate under vacuum, which allows large vertical and horizontal forces to be applied to the mainframe 200 based on the pressure difference between the internal space of the mainframe and the outside of the mainframe (which may be atmospheric pressure). When exposed to forces, the frame 201 may bend and / or deform. Therefore, in the embodiment, a replaceable interface plate (e.g., replaceable interface plate 230) is designed to be load-bearing against the mainframe 200, while the frame of the first facet is not load-bearing. Thus, the replaceable interface plate 230 withstands the vertical forces against the mainframe 200 caused by the pressure difference between the internal space of the mainframe and the outside of the mainframe. These vertical forces can be transmitted from the replaceable interface plate 230 to the base at the interface (boundary) between step 232 and the lip of the base that engages with step 232.

[0043]

[0052] In one embodiment, under vacuum, a vertical force of approximately 95,000 pounds of pressure is applied to the main frame 200. In embodiments where two facets are approximately 100–150 inches long and two facets are approximately 40–60 inches long, approximately 30–40% of the vertical force is supported by each of the interchangeable interface plates mounted on the longer facets, and approximately 10–15% of the force is supported by each of the interchangeable interface plates mounted on the shorter facets. Thus, a single interchangeable interface plate may be configured to withstand a force of approximately 28,500–38,000 pounds without bending.

[0044]

[0053] In alternative embodiments, steps and lips are not used to transmit vertical forces from one or more interchangeable interface plates to the base 206. Instead of engaged steps and lips, the interchangeable interface plate 230 may include pins on the inner bottom surface of the interchangeable interface plate. The pins may be, for example, square or round, and may be arranged at periodic intervals. Multiple pins may engage with one or more features on the sidewall of the base, and vertical forces may be transmitted from the interchangeable interface plate to the base at one interface of the multiple pins and multiple features. The features may be, for example, holes, lips, or other features that engage with pins.

[0045]

[0054] In an alternative embodiment, the base extends beneath the interchangeable interface plate, and vertical forces can be transmitted from the interchangeable interface plate to the base without using any steps, lips, pins, or other features within the base or the interchangeable interface plate.

[0046]

[0055] Although not shown, additional interchangeable interface plates can be attached to the remaining facets of the main frame 200. In addition, the lid may be fixed to the top of the main frame on the frame 201 and on the interchangeable interface plates. In this embodiment, the lid is in contact with the interchangeable interface plates but not with the frame 201. This ensures that the frame will not be unable to withstand any load, even if there is a slight misalignment in the vertical spacing of the lips, steps, tops of the interchangeable interface plates and / or the top of the frame 201.

[0047]

[0056] Figure 2B shows a side view of a first exemplary interchangeable interface plate 250 according to one embodiment of the present disclosure. The first interchangeable interface plate 250 includes a step 232 and three board access ports 252, 254, and 256, all having the same width, height, and vertical position.

[0048]

[0057] Figure 2C shows a side view of a second exemplary interchangeable interface plate 260 according to an embodiment of the present disclosure. The second interchangeable interface plate 260 includes a step 232 and three board access ports 262, 264, and 266 having varying widths and heights.

[0049]

[0058] Figure 2D shows a side view of a third exemplary interchangeable interface plate 270 according to an embodiment of the present disclosure. The third interchangeable interface plate 270 includes a step 232 and two board access ports 272, 274 having equal width and height but different vertical positions.

[0050]

[0059] In this embodiment, one of the first exemplary replaceable interface plate 250, the second exemplary replaceable interface plate 260, or the third exemplary replaceable interface plate 270 can be attached to the main frame 200.

[0051]

[0060] Figure 3 shows a side section view of the main frame 300 and the attached interchangeable interface plate 330, cut out at the location of a machined substrate access port 335 on the interchangeable interface plate 330 according to one embodiment of the present disclosure. The main frame 300 includes a base 315, a frame surface (including a beam 320, a plurality of columns (not shown), and a portion of the base), and a lid 325. The beam 320, the base 315, and the columns (not shown) define the frame (or frame surface) for the facets 310 of the main frame 300. The interchangeable interface plate 330 is attached to the frame that forms the facets 310 of the main frame 300.

[0052]

[0061] The base 315 includes a lip 340 on its sidewall. The interchangeable interface plate 330 includes a step 342 on its internal bottom surface, which engages with the lip 340 on the sidewall of the base 315. As previously mentioned, when the internal space 305 of the main frame 300 is evacuated to a vacuum, a force 350 can be applied to the main frame 300. These forces can become a concentrated force 352 supported by the interchangeable interface plate 330. As illustrated, the lid 325 may be in contact with the interchangeable interface plate 330 but not with the beam 320. For example, there may be a small gap 354 between the bottom of the lid 325 and the top of the beam 320. Thus, the force is transmitted from the lid 325 through the interchangeable interface plate 330 to the lip 352 of the base 315.

[0053]

[0062] The lid 325 may include a notch or groove 346 into which an O-ring can be inserted to ensure a seal between the lid 325 and the beam 320 (for example, between the lid and the top of the frame including the beam 320). In addition, the frames for the facets to which the replaceable interface plate 330 is attached (for example, including the beam 320, the column (not shown), and the base sidewalls) may each include a notch or groove 344 into which an O-ring can be inserted to ensure a seal between the replaceable interface plate 330 and the frame.

[0054]

[0063] In one embodiment, the replaceable interface plate 330 includes a lip 390 at the top of its inner surface. The beam 320 may include a corresponding step 392 that can engage with the lip 390. In particular, the top of the step 392 does not contact the bottom of the lip 390. In other embodiments, the replaceable interface plate 330 does not include a lip, and the beam 320 does not include a step.

[0055]

[0064] Figure 4 shows a side section view of a main frame 400 and an attached interchangeable interface plate 430, cut off at the position of a column 420 of the frame of the main frame according to one embodiment of the present disclosure. The main frame 400 includes a base 415, a frame (including a plurality of beams 421, a plurality of columns 420, and a portion of the base), and a lid 325. A first beam (not shown), a column 420, and a first portion of the base 415 define a first frame surface for the facets 410 of the main frame 400. A second beam 421, a column 420, a second column (not shown), and a second portion of the base 415 define a second surface frame for the second facets. The interchangeable interface plate 430 is attached to the frame that forms the facets 410 of the main frame 400.

[0056]

[0065] The base 415 includes a lip 440 on its sidewall. The interchangeable interface plate 540 includes a step 442 on the inner bottom surface of the interchangeable interface plate 430, the step 442 engaging with the lip 440 on the sidewall of the base 415. As previously stated, a force 450 may be applied to the main frame 400 when the internal space of the main frame 400 is evacuated and becomes a vacuum. These forces may become a concentrated force 452 supported by the interchangeable interface plate 430. As illustrated, the lid 425 may be in contact with the interchangeable interface plate 430, but may not be in contact with the frame. For example, there may be a small gap 454 between the bottom of the lid 425 and the top of the frame. Thus, the force is transmitted from the lid 425 through the interchangeable interface plate 440 to the lip 442 of the base 415.

[0057]

[0066] The lid 425 may include a pair of notches or grooves 446, 448 into which an O-ring can be inserted to ensure a seal between the lid 425 and the frame. In one embodiment, notch 446 is substantially concentric with notch 448. In addition, the frames for the facets to which the interchangeable interface plate 430 is mounted (e.g., including a beam (not shown), a column 420, an additional column (not shown), and the base sidewalls) may each include a pair of notches or grooves 444, 445 into which an O-ring can be inserted to ensure a seal between the interchangeable interface plate 430 and the frame. In some embodiments, notches 444 and 445 may be substantially concentric.

[0058]

[0067] The region between notches 446 and 448 may be an intermediate vacuum region. Similarly, the region between notches 444 and 445 may be another intermediate vacuum region. Column 420 may include one or more channels (i.e., holes) that fluidly connect the intermediate vacuum regions to the vacuum port 490. For example, column 420 may include a vertical channel 452 that fluidly connects the intermediate vacuum region between notches 446 and 448 to the vacuum port 490, and may further include a horizontal channel 450 that fluidly connects the intermediate vacuum region between notches 444 and 445 to the vertical channel 452.

[0059]

[0068] Differential pumping may be performed to pump the intermediate vacuum region to a pressure between the pressure in the internal space of the main frame 400 and atmospheric pressure. A first O-ring may be placed in a notch 445 of the frame, with its outer surface exposed to the external environment and its inner surface exposed to the intermediate vacuum region. A second O-ring may be placed in a notch 444 of the frame, with its outer surface exposed to the intermediate vacuum region and its inner surface exposed to the internal space of the main frame 400. The external environment will have a first pressure, the intermediate vacuum region will maintain a second pressure lower than the first pressure, and the internal space will maintain a third pressure lower than the second pressure.

[0060]

[0069] A second frame surface for a second facet perpendicular to facet 410 is also shown. The second frame surface includes the beam 421, column 420, and base 415. A large opening 405 is formed by the second frame surface. As illustrated, notches or grooves 460, 462 are machined into the beam 421, base 415, and column 420, where the notches 460, 462 each receive O-rings to seal additional replaceable interface plates (not shown) to the second facet of the main frame 400. The frame (or frame surface) of facet 410 may further include one or more additional channels in column 420 that fluidly connect to channel 452. These one or more additional channels can fluidly connect an intermediate vacuum region between the notches 460, 462 to a vacuum port 490.

[0061]

[0070] Additional frames (or frame surfaces) of the main frame may also include channels perforated therein or otherwise formed therein. These channels can connect to further intermediate vacuum regions between other notch / O-ring pairs. These channels can be fluid-coupled to channels 452 of column 420 and thus to the vacuum port 490. The frames (or frame surfaces) of facet 410 may further comprise a base 415 that fluid-couples one or more additional channels to beam 421 and / or an additional beam (not shown) and / or one or more channels of column 420. These channels may further fluid-couple to one or more additional channels of an additional column that fluid-couples further intermediate vacuum regions to the vacuum port 490.

[0062]

[0071] In one embodiment, the first frame (or first frame surface) includes a first column on the first side of the first facet, a second column on the second side of the first facet, and a first beam connecting the first column to the second column. The second frame (or second frame surface) includes a first column on the first side of the second facet, a third column on the second side of the second facet, and a second beam connecting the first column to the third column. The third frame (or third frame surface) includes a second column on the first side of the third facet, a fourth column on the second side of the third facet, and a third beam connecting the second column to the fourth column. The fourth frame (or fourth frame plane) includes a third column on the first side of the fourth facet, a fourth column on the second side of the fourth facet, and a fourth beam connecting the third column to the fourth column.

[0063]

[0072] The first frame may include one or more first channels in a first column, each of which fluidly connects a first intermediate vacuum region to a vacuum port. The first frame may further include one or more second channels in a first beam that fluidly connects the first column to one or more channels.

[0064]

[0073] The first frame may further comprise one or more third channels in a second column that fluid-connects to one or more second channels of the beam. The one or more third channels may fluid-connect vacuum ports to an additional intermediate vacuum region between a pair of O-rings positioned on the outer surface of the second frame.

[0065]

[0074] Alternatively, or additionally, the third frame may include one or more additional channels in the third beam of the third frame. In addition, the third frame may include one or more additional channels in a fourth column that fluidly connects one or more intermediate vacuum regions between additional pairs of O-rings to a vacuum port.

[0066]

[0075] The vacuum port 490 may be connected to a vacuum pump (not shown). Differential pumping may be performed to reduce the pressure difference across the O-ring. The O-ring may have a large linear surface (for example, in embodiments where the facets may have a length of about 130–150 inches and a height of about 20–50 inches). This can increase leakage across the O-ring and reduce its sealing ability. By using differential pumping, the leakage rate can be significantly reduced. A single vacuum port 490 can, in embodiments, be fluidly connected to the intermediate vacuum region between all pairs of O-rings between the main frame and the lid and a replaceable interface plate. These connections can be made by drilling channels (i.e., holes) in one or more of the beams and / or columns of the frame of the main frame 400, providing a connection to the vacuum port 490 without using plug fixing, cross drilling, or welding (e.g., plug welding). This can improve the operation of differential pumping by minimizing any further potential leak points.

[0067]

[0076] In further embodiments, multiple stages of differential pumping are used, which may include a set of three concentric notches or grooves, each having its own O-ring, and two adjacent intermediate vacuum regions.

[0068]

[0077] Figure 5 shows a method 500 for assembling a reconfigurable mainframe for an electronic device manufacturing system according to one embodiment of the present disclosure. Some operations of method 500 may be performed by processing logic, which may be executed on a computing device such as a general-purpose computer. For example, certain operations may be performed using computer-aided drafting software and / or computer-aided manufacturing (CAM) software installed on the computer.

[0069]

[0078] Block 502 of Method 500 determines a mainframe configuration which includes determining a first set of processing chambers to be connected to a first facet of the mainframe. In addition, load lock chambers and / or processing chambers to be connected to one or more other facets of the mainframe can be determined.

[0070]

[0079] In block 504, the locations of the substrate access ports may be determined to be suitable for the determined mainframe configuration (for example, adapted to access to each of the processing chambers and / or load locks). In block 506, the configuration of one or more interchangeable interface plates is determined. The interchangeable interface plates may be configured to have substrate access ports at each of the determined locations. In block 508, the interchangeable interface plates can be manufactured. This may include machining a metal (for example, aluminum) and / or surface treatment of at least a portion of the interchangeable interface plates.

[0071]

[0080] In block 510, a replaceable interface plate is mounted to the main frame (transfer chamber). This may involve bolting or screwing the replaceable interface plate to the frame of the appropriate facet of the main frame. In block 512, the determined processing chamber and / or load lock may be mounted to the appropriate interface plate according to the determined configuration.

[0072]

[0081] An engineer can determine a new configuration of the mainframe at any time. At such a point, method 500 can be repeated. For example, a determination may be made for a second plurality of processing chambers to be connected to a first facet of the mainframe, new locations for a second plurality of substrate access ports on the facet housing the second plurality of processing chambers may be determined, and a configuration of a second interchangeable interface plate having one of the second plurality of substrate access ports at each of the new locations may be determined, and a second interchangeable interface plate may be manufactured. The second interchangeable interface plate may have at least one of the following: a) a different number of substrate access ports than the first interchangeable interface plate, b) one or more substrate access ports in different locations compared to the plurality of substrate access ports in the first interchangeable interface plate, c) one or more substrate access ports of different size compared to the plurality of substrate access ports in the first interchangeable interface plate, d) a different type of slit valve than the first interchangeable interface plate, or e) a different type of local center detector than the first interchangeable interface plate.

[0073]

[0082] Before block 510, the existing processing chamber may be removed from the first interchangeable interface plate, and then the first interchangeable interface plate may be removed from the main frame. Subsequently, the operations of blocks 510 and 512 can be performed to make the main frame have an entirely new configuration (e.g., a different number of board access ports, board access ports in different positions, a different number and / or type of processing chambers, etc.).

[0074]

[0083] The preceding description includes numerous specific details, such as particular materials, dimensions, and process parameters, to provide a complete understanding of the Disclosure. Certain features, structures, materials, or properties may be combined in any suitable manner in one or more embodiments. The terms “example” or “exemplary” are used herein to mean that an example, case, or illustration is provided. Any embodiment or design described herein as “example” or “exemplary” should not necessarily be construed as being preferable or advantageous to any other embodiment or design. Rather, the use of the terms “example” or “exemplary” is intended simply to present a concept in a concrete form. As used in this Application, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless otherwise specified or evident from the context, “X includes A or B” is intended to mean any natural inclusive substitution. That is, if X includes A, X includes B, or X includes both A and B, then “X includes A or B” is satisfied under any of the aforementioned examples. Throughout this specification, the terms “embodiment,” “a particular embodiment,” or “one embodiment” mean that any specific feature, structure, or characteristic described in relation to an embodiment is included in at least one embodiment. Therefore, even if the phrases “in an embodiment,” “in a particular embodiment,” or “in one embodiment” appear in different parts of this specification, they do not necessarily refer to the same embodiment.

[0075]

[0084] This disclosure is described with reference to certain exemplary embodiments. Therefore, this specification and the drawings should be considered illustrative, not limiting. In addition to those shown and described herein, various modifications of this disclosure will be apparent to those skilled in the art and are intended to fall within the scope of the appended claims.

Claims

1. The mainframe of a device manufacturing system, Bass and, A plurality of facets on the base, wherein the first facet of the plurality of facets includes a first frame comprising a first column on the first side of the first facet, a second column on the second side of the first facet, and a beam connecting the first column and the second column, A lid on the plurality of facets, wherein the base, the lid, and the plurality of facets together define an internal space, A first replaceable interface plate sealed to the first frame of the first facet, A first channel provided in the first column of the first facet, the first channel fluidly connecting a first vacuum region associated with the first replaceable interface plate to a vacuum port, A first O-ring disposed on the outer surface of the first frame, wherein the inner surface of the first O-ring is exposed to the first vacuum region, A second O-ring disposed on the outer surface of the first frame, wherein the second O-ring is substantially concentric with the first O-ring and the outer surface of the second O-ring is exposed to the first vacuum region. Mainframe.

2. The mainframe according to claim 1, wherein the beam further includes a second channel that fluidly connects a second vacuum region to the first channel.

3. The mainframe according to claim 2, wherein the second column includes a third channel that fluidly connects a third vacuum region associated with a second interchangeable interface plate to the second channel in the beam.

4. The second facet of the plurality of facets includes a second frame comprising the second column on the first side of the second facet, a third column on the second side of the second facet, and a second beam connecting the second column to the third column. The main frame according to claim 3, further comprising a second replaceable interface plate sealed to the second frame of the second facet.

5. The outer surface of the first O-ring is exposed to the external environment, and the inner surface of the second O-ring is exposed to the internal space, The mainframe according to claim 1, wherein the external environment has a first pressure, the first vacuum region maintains a second pressure lower than the first pressure, and the internal space maintains a third pressure lower than the second pressure.

6. The mainframe according to claim 1, wherein the first replaceable interface plate includes at least one of a first substrate access port configured to provide a robot arm in the internal space with access to a first processing chamber, or a second substrate access port configured to provide the robot arm with access to a second processing chamber.

7. The main frame according to claim 1, wherein the main frame is configured to operate under vacuum, the first frame of the first facet is not load-bearing, the first replaceable interface plate is load-bearing, and the first replaceable interface plate withstands a vertical force on the main frame caused by a pressure difference between the internal space of the main frame and the outside of the main frame.

8. The mainframe of a device manufacturing system, Bass and, A plurality of facets on the base, wherein the first facet among the plurality of facets includes a plurality of facets including a first frame, A lid on the plurality of facets, wherein the base, the lid, and the plurality of facets define an internal space, A replaceable interface plate, attached to the first frame of the first facet, comprising a replaceable interface plate including one or more substrate access ports configured to provide a robot arm with access to one or more processing chambers, The main frame is configured to operate under vacuum, and the replaceable interface plate is load-bearing and can withstand the vertical forces on the main frame caused by the pressure difference between the internal space of the main frame and the outside of the main frame. The lid engages with the upper surface of the replaceable interface plate, such that there is a gap between the lid and the upper surface of the first frame of the first facet, so that the lid does not come into contact with the first frame of the first facet.

Images