Resin encapsulation apparatus and resin encapsulation method

Abstract

To provide a resin sealing device and a resin sealing method which suppress positional deviation of a workpiece to achieve an improvement in reliability of a molded product.SOLUTION: A resin sealing device 1 is one for sealing an electronic component P of a workpiece W with a resin, including a resin sealing mold 21 which seals the electronic component P with a resin by compression molding a resin R onto the workpiece W. The resin sealing mold 21 includes a first mold 23 and a second mold 22 which pairs with the first mold. The first mold 23 has a cavity recess 25 and a workpiece guide 28 provided on the outer peripheral surface of the cavity recess 25 on a side facing the second mold 22. The workpiece guide 28 positions the workpiece W from outside the workpiece W in plan view of the first mold 23, while the resin sealing mold 21 is opened.SELECTED DRAWING: Figure 3A

Description

Technical Field

[0001] The present invention relates to a resin encapsulation device and a resin encapsulation method.

Background Art

[0002] A resin encapsulation device for resin-encapsulating electronic components of a workpiece including a base material and electronic components is known. This resin encapsulation device includes a resin encapsulation mold having an upper mold and a lower mold. The resin encapsulation mold is clamped by the relative vertical movement of the upper mold and the lower mold, and the electronic components are resin-encapsulated in the cavity of the clamped resin encapsulation mold. For example, Patent Document 1 discloses a semiconductor resin encapsulation device that places resin and a workpiece on a lower mold having a cavity recess and compresses and molds the resin by clamping the resin encapsulation mold.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the configuration of Patent Document 1, positional displacement of the workpiece may occur when the workpiece is placed on the resin encapsulation mold, or when the upper mold and the lower mold move relatively in the vertical direction. If the workpiece is displaced, the reliability of the resin-encapsulated molded product may be impaired.

[0005] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a resin encapsulation device and a resin encapsulation method capable of suppressing positional displacement of a workpiece and improving the reliability of a resin-encapsulated molded product.

Means for Solving the Problems

[0006] A resin encapsulation apparatus according to one aspect of the present invention is a resin encapsulation apparatus for resin encapsulating electronic components of a workpiece including a substrate and electronic components, comprising a resin encapsulation mold for compression molding resin onto the workpiece to resin encapsulate the electronic components, the resin encapsulation mold having a first mold and a second mold paired with the first mold, the first mold having a cavity recess and a workpiece guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, the workpiece guide portion positions the workpiece from the outside of the workpiece in a plan view of the first mold when the resin encapsulation mold is opened.

[0007] According to this embodiment, when setting the workpiece in the resin sealing mold, the workpiece guide portion positions the workpiece from the outside, thereby suppressing misalignment of the workpiece after it has been set.

[0008] Another aspect of the present invention relates to a resin encapsulation method using a resin encapsulation mold for encapsulating an electronic component of a workpiece including a substrate and an electronic component, wherein the resin encapsulation mold comprises a first mold and a second mold paired with the first mold, the first mold having a cavity recess and a workpiece guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, and the resin encapsulation method includes supplying resin to the cavity recess provided in the first mold, supplying a workpiece to the first mold such that the electronic component is positioned inside the cavity recess into which the resin has been supplied, and clamping the resin encapsulation mold by moving the first mold and the second mold relative to each other to encapsulate the electronic component, wherein supplying the workpiece includes positioning the workpiece from the outside of the workpiece using the workpiece guide portion in a plan view of the first mold while the resin encapsulation mold is open.

[0009] According to this embodiment, the workpiece can be positioned from the outside by the workpiece guide, thereby suppressing misalignment of the workpiece after it has been set. [Effects of the Invention]

[0010] According to the present invention, it is possible to suppress misalignment of the workpiece and improve the reliability of the molded product. [Brief explanation of the drawing]

[0011] [Figure 1] This is a plan view of a resin encapsulation apparatus according to one embodiment of the present invention. [Figure 2] Figure 1 is a partially enlarged view of the resin encapsulation apparatus. [Figure 3A] Figure 1 is a cross-sectional view of the resin encapsulation mold. [Figure 3B] Figure 3A shows enlarged sections of the upper and lower molds. [Figure 4] This is a flowchart showing a resin encapsulation method according to one embodiment of the present invention. [Figure 5] This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention. [Figure 6] This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention. [Figure 7] This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention. [Figure 8] This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention. [Figure 9] This figure illustrates a resin encapsulation mold and a resin encapsulation method using the same according to a second embodiment of the present invention. [Figure 10] This figure illustrates a resin encapsulation mold and a resin encapsulation method using the same according to a second embodiment of the present invention. [Figure 11] This is a diagram illustrating a resin encapsulation method according to a third embodiment of the present invention. [Modes for carrying out the invention]

[0012] The embodiments of the present invention will be described below with reference to the drawings. The drawings of each embodiment are illustrative, and the dimensions and shapes of each part are schematic; the technical scope of the present invention should not be limited to these embodiments.

[0013] [First Embodiment] <Resin encapsulation device> While referring to FIGS. 1 to 3B, the configuration of the resin encapsulation device 1 according to an embodiment of the present invention will be described. FIG. 1 is a plan view of the resin encapsulation device according to the present embodiment. Further, FIG. 2 is a partially enlarged view of the resin encapsulation device, FIG. 3A is a cross-sectional view of the resin encapsulation mold, and FIG. 3B is a partially enlarged view of the upper mold and the lower mold. In each drawing, for the sake of clarifying the relationship between the respective drawings and assisting in understanding the positional relationship of each member, the directions of front and back, left and right, and up and down are arbitrarily assigned. Also, in FIG. 3B, the illustration of the film F described later is omitted.

[0014] The resin encapsulation device 1 is a manufacturing device that manufactures a molded product M by providing resin to a workpiece W. The workpiece W includes a base material B and an electronic component P. By molding the resin R on the workpiece W to encapsulate the electronic component P of the workpiece W with resin, the molded product M can be manufactured. Here, the workpiece W has a surface on which the electronic component P is placed (hereinafter referred to as the "surface of the workpiece W") and a surface on which the electronic component P is not placed opposite to the surface (hereinafter referred to as the "back surface of the workpiece W"). Also, in the following description, the vertical relationship between the surface and the back surface of the workpiece W can be appropriately reversed depending on the structure of the resin encapsulation mold. Hereinafter, for the sake of convenience of description, the workpiece W after resin encapsulation may be referred to as the molded product M. The base material B is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, or a semiconductor substrate. The electronic component P is, for example, a semiconductor element such as an IC chip, but is not limited thereto, and may be various active elements, passive elements, or MEMS devices, etc. The resin R is, for example, a granular thermosetting resin. The form of the resin R is not limited to the above, and may be, for example, sheet-like, liquid-like, or powder-like.

[0015] The resin encapsulation device 1 according to the present embodiment is a resin encapsulation device of a compression molding method (in other words, a compression method). As shown in FIG. 1, the resin encapsulation device 1 includes a workpiece supply unit 10, resin molding units 20, 30, a resin supply unit 40, a first loader 60, a second loader 70, and a molded product recovery unit 90.

[0016] The planar layout of the resin sealing device 1 is not particularly limited. However, in the example shown in FIG. 1, the work supply unit 10, the resin molding unit 20, the resin supply unit 40, the resin molding unit 30, and the molded product recovery unit 90 are arranged in this order along the first guide portion 60R from left to right in FIG. 1. Also, with reference to the second guide portion 70R, the work supply unit 10 and the resin molding unit 20 are arranged on the left side, and the resin molding unit 30 and the molded product recovery unit 90 are arranged on the right side.

[0017] The work supply unit 10 supplies the work W to the first loader hand 61 of the first loader 60. The work supply unit 10 includes a work storage unit 11, a work transfer unit 13, a work preheating unit 15, and a work supply control panel 19.

[0018] The work storage unit 11 stores a plurality of works W and sequentially sends out the works W. For example, the work storage unit 11 includes a plurality of work magazines and a work elevator. In the work magazine set in the work storage unit 11, a plurality of works W are stored so as to overlap in the vertical direction. The work magazine may be a slit magazine in which a plurality of works W are held at intervals in the vertical direction, or may be a stack magazine in which a plurality of works W are directly stacked. The work elevator adjusts the position of the work magazine in order to send out the work W to the work transfer unit 13.

[0019] The work transfer unit 13 delivers the work W received from the work storage unit 11 to the work preheating unit 15. For example, the work transfer unit 13 includes a work index that receives and aligns the work W sent out by the work storage unit 11, and a work pick-and-place that delivers the work W aligned by the work index to the work preheating unit 15.

[0020] The workpiece preheating unit 15 preheats the workpiece W received from the workpiece transfer unit 13 and hands it over to the first loader hand 61 of the first loader 60. Preheating the workpiece W before it is transported to the resin molding units 20 and 30 suppresses deformation of the workpiece W due to rapid temperature changes inside the resin sealing molds 21 and 31. For example, the workpiece preheating unit 15 is equipped with a preheating rail that heats the workpiece W from its edges. Alternatively, the workpiece preheating unit 15 may be equipped with a hot plate that heats the entire surface of the workpiece W. Note that preheating of the workpiece W is not limited to preheating in the workpiece preheating unit 15. For example, it may be preheated by the resin sealing mold 21 before clamping after it has been loaded into the resin molding units 20 and 30. In this case, the time from when the workpiece W is loaded until the start of clamping may be controlled, and the workpiece supply unit 10 may not be equipped with a workpiece preheating unit 15.

[0021] The work supply control panel 19 controls the operation of the work supply unit 10. As shown in Figure 1, when viewed from above, the work supply control panel 19 is located in front of the work supply unit 10. For example, the work supply control panel 19 includes a display unit that displays the control parameters of the work supply unit 10 and an input unit that inputs the control parameters of the work supply unit 10. The work supply control panel 19 also integrates display units that display the control parameters of the molded product recovery unit 90, resin supply unit 40, first loader 60, and second loader 70, which will be described later, and input units that input these control parameters.

[0022] The work supply unit 10 may further include a volume measuring unit for measuring the volume of the workpiece W, a weight measuring unit for measuring the weight of the workpiece W, a thickness measuring unit for measuring the thickness of the workpiece W, and an appearance inspection unit for inspecting the appearance of the workpiece W.

[0023] The molded product recovery unit 90 recovers the molded product M from the first loader hand 61 of the first loader 60. The molded product recovery unit 90 includes a molded product receiving section 91, a molded product transfer section 93, and a molded product storage section 95. In the example shown in Figure 1, the molded product recovery unit 90 is located on the opposite side of the work supply unit 10 from the resin molding units 20 and 30 in the left-right direction. As a modification, the molded product recovery unit 90 may be located on the same side of the work supply unit 10 as the resin molding units 20 and 30 in the left-right direction.

[0024] The molded product receiving unit 91 hands over the molded product M received from the first loader hand 61 of the first loader 60 to the molded product transfer unit 93. For example, the molded product receiving unit 91 is equipped with a cooling pallet for cooling the molded product M. Alternatively, the molded product receiving unit 91 may not be equipped with a cooling pallet. In this case, the time until transfer to the molded product transfer unit 93 may be adjusted to cool the molded product M while it is being transported by the first loader 60.

[0025] The molded product transfer unit 93 transfers the molded product M received from the molded product receiving unit 91 to the molded product storage unit 95. For example, the molded product transfer unit 93 includes a molded product index that receives and aligns the molded product M sent out by the molded product receiving unit 91, and a molded product pick-and-place unit that transfers the molded product M aligned by the molded product index to the molded product storage unit 95.

[0026] The molded product storage unit 95 receives and stores the molded product M. For example, the molded product storage unit 95 comprises multiple molded product magazines and a molded product elevation. Multiple molded products M are stored in the molded product magazines set in the molded product storage unit 95 so as to overlap in the vertical direction. The molded product magazines may be slit magazines in which multiple molded products M are held with vertical spacing between them, or they may be stack magazines in which multiple molded products M are directly stacked. The molded product elevation adjusts the position of the molded product magazines in order to receive the molded products M from the molded product transfer unit 93.

[0027] The molded product recovery unit 90 may further include a volume measuring unit for measuring the volume of the molded product M, a weight measuring unit for measuring the weight of the molded product M, a thickness measuring unit for measuring the thickness of the molded product M, and an appearance inspection unit for inspecting the appearance of the molded product M.

[0028] The resin molding unit 20 molds resin R onto the workpiece W. The resin molding unit 20 comprises a resin sealing mold 21, a film handler 27, and a resin molding control panel 29.

[0029] As shown in Figure 3A, the resin encapsulation mold 21 comprises a pair of openable and closable upper mold 22 and lower mold 23 that heat and compress resin R into an internal cavity recess 25 for resin molding. In the example shown in Figure 3A, the resin encapsulation mold 21 is a compression molding mold with a so-called lower cavity movable structure. Specifically, the surface of the upper mold 22 facing the cavity recess 25 is substantially flat, and the cavity recess 25 is formed on the surface of the lower mold 23 facing the upper mold 22.

[0030] The upper mold 22 comprises an upper plate 22a and a cavity piece 22b. The cavity piece 22b is fixed to the lower surface (the surface facing the lower mold 23) of the upper plate 22a. The upper mold 22 is provided with a workpiece through-pin 26 that protrudes from the surface of the cavity piece 22b facing the lower mold 23. The workpiece through-pin 26 is an example of a workpiece insertion part that positions the workpiece W when clamping the mold.

[0031] As shown in Figure 2, three workpiece through pins 26 are arranged in the front-to-back direction along the long side of the workpiece W. Furthermore, when viewing the lower mold 23 from the upper mold 22 in plan, the pins are located outside the cavity recess 25 and inside the area where the workpiece W is set. The workpiece W is provided with workpiece through holes H, and the workpiece W is positioned relative to the upper mold 22 by inserting the workpiece through pins 26 into the workpiece through holes H during mold clamping. Note that the position and number of workpiece through pins 26 and workpiece through holes H are not limited to this embodiment and may be appropriately selected depending on the shape of the workpiece. Also, as shown in Figure 3B, the workpiece through pin 26 has a through pin tip portion 26a facing the lower mold 23 and a through pin base portion 26b facing the cavity piece 22b. The workpiece through pin 26 also has a through pin side wall 26c connecting the ends of the through pin tip portion 26a and the through pin base portion 26b. The workpiece through pin 26 has a tapered portion that is narrower towards the lower mold 23. Therefore, when the lower mold 23 is viewed from above from the upper mold 22, the area of ​​the through-pin base portion 26b is larger than the area of ​​the through-pin tip portion 26a, and the angle between the through-pin side wall 26c and the through-pin tip portion 26a is obtuse. When positioning the workpiece W relative to the upper mold 22, the through-pin side wall 26c abuts against the inner wall of the workpiece through-hole H of the workpiece W.

[0032] Furthermore, the shape of the workpiece through-pin 26 is not limited to having a tapered portion. For example, the shape of the workpiece through-pin 26 may be cylindrical or prismatic in which the through-pin side wall 26c is approximately perpendicular to the through-pin tip 26a and the through-pin base 26b.

[0033] The lower mold 23 comprises a lower plate 23a, a cavity plate 23b, a clamper 23c, and a biasing member 23d. The cavity plate 23b is fixed to the upper surface (the surface on the upper mold 22 side) of the lower plate 23a. The clamper 23c is configured in a frame shape so as to surround the cavity plate 23b. The clamper 23c is assembled to the lower plate 23a via the biasing member 23d so as to be vertically movable. The cavity plate 23b constitutes the bottom surface of the cavity recess 25, and the clamper 23c constitutes the side surface of the cavity recess 25. The lower mold 23 is provided with suction holes 23e and 23f that pass through the clamper 23c, and a suction hole 23g that passes through the lower plate 23a and the cavity plate 23b. The suction hole 23e opens to the upper surface of the clamper 23c. Suction hole 23f opens on the inner surface of the clamper 23c facing the cavity plate 23b. Suction hole 23g opens on the upper surface of the cavity plate 23b, i.e., the bottom surface of the cavity recess 25. Suction holes 23e, 23f, and 23g are suction holes for adsorbing the film F set in the lower mold 23. The lower mold 23 is provided with work guide pins 28 that protrude from the surface of the clamper 23c facing the upper mold 22. The work guide pins 28 are an example of multiple protrusions included in the work guide section that position the workpiece W when it is placed on the lower mold 23.

[0034] As shown in Figure 2, the work guide pins 28 are provided on the outer circumferential surface of the cavity recess 25 on the side facing the upper mold 22 when viewed from the upper mold 22 to the lower mold 23 in a plan view. The work guide pins 28 position the workpiece W from the outside when viewed from the upper mold 22 to the lower mold 23 in a plan view when the resin sealing mold 21 is opened. At this time, the work guide pins 28 position the workpiece W via a film F provided on the lower mold 23 so as to cover the cavity recess 25 and the work guide pins 28. It is desirable that the work guide pins 28 be adjacent to the workpiece from the front-rear and left-right directions. In this embodiment, the workpiece W has a rectangular shape in a plan view, and at least one work guide pin 28 is arranged on each side of the rectangular shape of the workpiece W in a plan view of the lower mold 23. For example, as shown in Figure 2, three work guide pins 28 are arranged on the long side of the workpiece W and one on the short side. This arrangement can suppress rotational misalignment of the workpiece. However, the configuration of the work guide pins 28 is not limited to this, and the number and arrangement of the work guide pins 28 may be appropriately selected depending on the shape of the workpiece, etc. Also, although the work guide pins 28 are configured as pins, they are not limited to this, and may be bar-shaped or frame-shaped extending along the edge of the workpiece. Furthermore, as shown in Figure 3B, the work guide pin 28 has a guide pin tip portion 28a facing the upper mold 22 and a guide pin base portion 28b facing the clamper 23c. The work guide pin 28 also has a guide pin side wall 28c connecting the ends of the guide pin tip portion 28a and the guide pin base portion 28b. The guide pin side wall 28c is the side wall of the work guide pin 28 that faces the workpiece W when positioning the workpiece W, connecting the ends of the guide pin base portion 28b and the guide pin tip portion 28a. The work guide pin 28 has a tapered portion that is narrower in width toward the upper mold 22. Therefore, when viewing the lower mold 23 from the upper mold 22 in plan view, the area of ​​the guide pin base portion 28b is larger than the area of ​​the guide pin tip portion 28a.

[0035] The tip portion 28a of the guide pin has a larger area in plan view than the tip portion 26a of the through pin. Also, the base portion 28b of the guide pin has a larger area in plan view than the base portion 26b of the through pin. The area ratio of the tip portion 28a of the guide pin to the base portion 28b of the guide pin in plan view is smaller than the area ratio of the tip portion 26a of the through pin to the base portion 26b of the through pin in plan view. The taper angle of the workpiece guide pin 28 is larger than the taper angle of the workpiece through pin 26. That is, the angle formed by the guide pin sidewall 28c and the tip portion 28a of the guide pin is larger than the angle formed by the through pin sidewall 26c and the tip portion 26a of the through pin.

[0036] In this embodiment, both the guide pin side wall 28c on the side facing the workpiece W on which the workpiece guide pin 28 is set, and the side wall on the opposite side are inclined with respect to the guide pin tip 28a and the guide pin base end 28b. However, the shape of the workpiece guide pin is not limited to the above. For example, if the side wall on the side facing the workpiece on which the workpiece guide pin is set is inclined with respect to the guide pin tip and the guide pin base end, the side wall on the opposite side of the workpiece on which the workpiece guide pin is set may be provided substantially perpendicular to the guide pin tip and the guide pin base end.

[0037] The film handler 27 supplies film F to the lower mold 23 of the resin encapsulation mold 21. Film F is a release film that prevents resin R from entering gaps between the cavity plate 23b and clampers 23c23c of the lower mold 23, and facilitates the peeling of molded product M from the lower mold 23. The film handler 27 handles film in roll form, for example, and includes an unwinding section for supplying unused film F and a winding section for collecting used film F. As shown in Figure 1, the unwinding and winding sections of the film handler 27 are arranged in the left-right direction of the resin encapsulation mold 21. As the material for film F, polymer materials with excellent heat resistance, ease of peeling, flexibility, and extensibility can be used, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene-ethylene copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), PET (polyethylene terephthalate), PP (polypropylene), and PVDC (polyvinylidine chloride). The thickness of film F is suitably selected according to the physical properties of the material, and is approximately 50 μm as an example. The shape of film F is not limited to a roll; it may also be in the form of strips.

[0038] The resin molding control panel 29 controls the operation of the resin molding unit 20. As shown in Figure 1, when viewed from above, the resin molding control panel 29 is located in front of the resin molding unit 20. For example, the resin molding control panel 29 includes a display unit that displays control parameters for the resin molding unit 20 and an input unit that inputs control parameters for the resin molding unit 20.

[0039] The resin molding unit 30 comprises a resin encapsulation mold 31, a film handler 37, and a resin molding control panel 39. Details of the resin encapsulation mold 31, film handler 37, and resin molding control panel 39 will be omitted in the following description, but configurations similar to those described for the resin molding unit 20 can be applied.

[0040] Furthermore, at least some of the functions of the resin molding control panels 29 and 39 may be integrated into the work supply control panel 19. For example, the control parameters of the resin molding units 20 and 30 may be displayed on the display unit of the work supply control panel 19, or the control parameters of the resin molding units 20 and 30 may be input into the input unit of the work supply control panel 19. If all the functions of the control panels of each unit are integrated into the work supply control panel 19, the resin molding control panels 29 and 39 may be omitted.

[0041] The resin supply unit 40 supplies resin R to the second loader 70. The resin supply unit 40 comprises a resin supply section 41 and a resin heater 80.

[0042] The resin supply unit 41 is positioned at the rear of the first guide unit 60R. The resin supply unit 41 supplies resin R to the second loader 70. For example, if the resin R is granular resin, the resin supply unit 41 includes a hopper and a feeder. If the resin R is liquid, the resin supply unit 41 may include a syringe for storing the resin, a piston for pushing out the resin, and a pinch valve for opening and closing the tip of the syringe.

[0043] The resin heater 80 heats the resin R supplied by the resin supply unit 41. Known heating mechanisms such as electric heating wires and infrared heaters can be used as the heat source for the resin heater 80. The resin heater 80 is optional.

[0044] A resin guard may be provided in the resin supply unit 40. The resin guard is used as a frame that defines the area to which the resin R is supplied. For example, the resin guard is provided below the resin supply section 41 immediately before the resin R is supplied to the second loader 70, thereby defining the area to which the resin R is supplied as described above.

[0045] Furthermore, if the resin R is a granular resin, the resin supply unit 40 may further include an excitation unit for dispersing the resin R by vibration, and an inspection unit for checking the degree of dispersion of the resin R. Also, if the resin R is a liquid resin, the resin supply unit 40 may further include a squeegee for leveling the resin R.

[0046] The first loader 60 transports the workpiece W from the workpiece supply unit 10 to the resin molding units 20 and 30. The first loader 60 is configured to be movable along the first guide section 60R. The first guide section 60R extends in the left-right direction across the workpiece supply unit 10, the resin molding units 20 and 30, the resin supply unit 40, and the molded product recovery unit 90. As shown in Figure 1, when viewed from above, the first guide section 60R is located, for example, behind the resin encapsulation molds 21 and 31 and in front of the resin supply unit 41. In the configuration example shown in Figure 1, the first loader 60 transports the molded product M from the resin molding units 20 and 30 to the molded product recovery unit 90. However, the resin encapsulation device 1 may further include an unloader for recovering the molded product M, separate from the first loader 60 that transports the workpiece W. Such an unloader may be configured to be movable along the first guide section 60R, or it may be configured to be movable along another guide section.

[0047] The first loader 60 is equipped with a first loader hand 61 that has a mechanism for holding the workpiece W and the molded product M.

[0048] The first loader hand 61 is configured to move back and forth relative to the resin encapsulation mold 21 from the rear. In other words, the first loader hand 61 has a transport path for the workpiece W or molded product M (an example of a workpiece) on the rear side of the resin encapsulation mold 21. Next, the first loader hand 61 holds the workpiece W or molded product M. The first loader hand 61 has, for example, an L-shaped opening and closing claw that supports the lower surface of the workpiece W or molded product M, but is not limited to this. The first loader hand 61 may hold the workpiece W or molded product M by electrostatic force, or it may attract the back surface of the workpiece W or molded product M by intake and exhaust.

[0049] As an example, the transport path when the first loader hand 61 supplies the workpiece W to the resin encapsulation mold 21 will be described. After receiving the workpiece W in the workpiece preheating unit 15, the first loader hand 61 is transported to the right and moves to a position facing the resin encapsulation mold 21 in the front-rear direction. Next, while still holding the workpiece W, the first loader hand 61 enters the resin encapsulation mold 21 from the rear. That is, the first loader hand 61 loads the workpiece W into the resin encapsulation mold 21. After transferring the workpiece W to the lower mold 23 of the resin encapsulation mold 21, the first loader hand 61 moves to the rear and exits the resin encapsulation mold 21. At this time, the workpiece W is positioned from the outside by the workpiece guide pins 28. Specifically, the workpiece W released from the first loader hand 61 is transferred to the lower mold 23, the end of the workpiece W contacts the guide pin side wall 28c via the film F, and the workpiece W is guided along the guide pin side wall 28c. Furthermore, the workpiece W is set with its surface facing the lower mold 23, and the electronic component P is set so that it is housed in the cavity recess 25. After the molded product M is formed and the resin encapsulation mold 21 is opened, the first loader hand 61 unloads the molded product M from the resin encapsulation mold 21 using the same operation as when the workpiece W was loaded. The first loader hand 61 is then transported to the right and the molded product M is handed over at the molded product receiving section 91. The supply of the workpiece W and the removal of the molded product M described above are the same for the resin encapsulation mold 31.

[0050] The second loader 70 transports the resin R. The second loader 70 is configured to be movable along the second guide section 70R. The second guide section 70R is provided, for example, on the resin supply unit 40 and extends in the front-rear direction. As shown in Figure 1, when viewed from above, the second guide section 70R intersects, for example, the first guide section 60R.

[0051] The second loader 70 comprises a second loader hand 71, a second base, and a second guide rod.

[0052] As an example, the second loader hand 71 moves to position P1 in front of the resin supply unit 41. Next, the second loader hand 71 moves to the resin supply unit 41. At the resin supply unit 41, the second loader hand 71 receives the resin R inside the resin guard, the resin R is heated, and after heating, the resin guard is removed from the loader hand 71. Alternatively, the resin guard does not need to be removed from the loader hand 71 after the resin R is heated. After that, the second loader hand 71 returns to position P1 while still holding the resin R. Next, the second loader hand 71 moves to position P3 to the right of the resin encapsulation mold 21. Next, the second loader hand 71 enters the resin encapsulation mold 21 from the right while still holding the resin R. That is, the second loader hand 71 delivers the resin R into the resin encapsulation mold 21. After transferring the resin R to the resin encapsulation mold 21, the second loader hand 71 moves to the right due to the contraction of the second guide rod and exits the resin encapsulation mold 21.

[0053] The first loader 60 and the second loader 70 operate on the resin encapsulation mold 31 of the resin molding unit 30 in the same way as they operate on the resin encapsulation mold 21 of the resin molding unit 20. Therefore, a description of the operation of the first loader 60 and the second loader 70 on the resin encapsulation mold 31 is omitted. However, the operation of the second loader 70 on the resin encapsulation mold 31 is the reverse of the operation of the second loader 70 on the resin encapsulation mold 21.

[0054] In this embodiment, the first loader hand 61 transports the workpiece W and the second loader hand 71 transports the resin R as described above, but the transport methods for the workpiece W and resin R are not limited to this. For example, the second loader 70 may be omitted, and the first loader hand may transport the workpiece W and resin R simultaneously or in any order.

[0055] <Method of resin encapsulation> Next, the resin encapsulation method will be described using Figures 4 to 8. Figure 4 is a flowchart showing an example of a resin encapsulation method using the resin encapsulation apparatus according to this embodiment. Figures 5 to 8 are diagrams illustrating the resin encapsulation method according to this embodiment. In the following description, the resin encapsulation mold 21 of the resin molding unit 20, which has a cavity recess 25 in the lower mold 23, will be used as an example, and the resin encapsulation mold 31 of the resin molding unit 30, which operates similarly, will not be described.

[0056] First, set the film in the lower mold (S10).

[0057] Specifically, as shown in Figure 5, the film F is supplied to the lower mold 23 by the film handler 27. Next, the film F is adsorbed into the cavity recess 25 by suction from the suction holes 23e, 23f, and 23g of the lower mold 23. The film F continuously covers from the cavity plate 23b to the clamper 23c, sealing the gap between the cavity plate 23b and the clamper 23c. At this time, the film F is adsorbed so as to cover the cavity recess 25 and the work guide pins 28.

[0058] Next, resin is supplied to the lower mold (S20).

[0059] Specifically, the resin R supplied by the resin supply unit 41 is transported to the resin sealing mold 21 by the second loader 70. Next, as shown in Figure 5, the resin R is supplied to the cavity recess 25 via the film F by the second loader hand 71. The supplied resin R is heated and melted in the cavity recess 25.

[0060] Next, the workpiece is positioned using the workpiece guide pins (S30).

[0061] Specifically, as shown in Figure 6, the workpiece W transported by the first loader 60 is set in the lower mold 23. At this time, with the resin sealing mold 21 open, the workpiece W is positioned from the outside by the workpiece guide pins 28. A film F is also adsorbed between the workpiece W and the workpiece guide pins 28, and the workpiece W is positioned via the film F. The workpiece W is set so that the surface on which the electronic components P are mounted faces the lower mold 23 and the resin R, but at this time a part of the electronic components P is in contact with the resin R inside the cavity recess 25. At this time, since the resin R is molten as described above, it does not hinder the positioning of the workpiece W.

[0062] Next, the resin and workpiece are heated in the mold (S40).

[0063] Specifically, the resin R and workpiece W set in the lower mold 23 are heated from the lower mold 23. By heating from the lower mold 23, the workpiece W can be preheated from the surface side on which the electronic components P are mounted via the resin R before the mold is clamped.

[0064] Next, the resin is molded (S50).

[0065] Specifically, as shown in Figure 7, the resin sealing mold 21 is clamped as the upper mold 22 and lower mold 23 move closer to each other in the vertical direction. At this time, the workpiece W is positioned relative to the upper mold 22 by inserting the workpiece through pin 26 into the workpiece through hole H provided in the workpiece W. After the workpiece W is positioned, the clamper 23c is pushed toward the lower plate 23a by the upper mold 22, reducing the volume of the cavity recess 25, and the resin R is heated and compressed.

[0066] Next, the molded product is removed from the mold (S60).

[0067] Specifically, as shown in Figure 8, after the resin R is molded, the resin encapsulation mold 21 is opened. After the mold is opened, the first loader hand 61 enters the resin encapsulation mold 21. With the film F attached to the lower mold 23, the first loader hand 61 picks up the molded product M. After picking, the molded product M is carried out of the resin encapsulation mold 21 while being held by the first loader hand 61. Subsequently, the molded product M is transported to the molded product recovery unit 90.

[0068] As described above, the resin encapsulation apparatus 1 according to the first embodiment has a resin encapsulation mold 21 including a lower mold 23 in which a cavity recess 25 is formed, and the lower mold 23 has work guide pins 28 that position the workpiece W from the outside in a plan view when the resin encapsulation mold 21 is opened.

[0069] According to this, when the workpiece W is set in the lower mold 23, the guide pin side wall 28c of the workpiece guide pin 28 restricts the movement of the workpiece W from the outside. Therefore, the workpiece W is guided and positioned in a predetermined position relative to the lower mold 23 which has a cavity recess 25. In other words, by positioning the workpiece W from the outside when setting it in the resin sealing mold 21, displacement of the workpiece W after it has been set can be suppressed.

[0070] Furthermore, the resin encapsulation mold 21 is equipped with a film handler 27, and the workpiece guide pins 28 position the workpiece W via a film F provided on the lower mold 23 so as to cover the cavity recess 25 and the workpiece guide pins 28.

[0071] According to this method, compared to a configuration in which a pin provided in the lower die is inserted through the film into through holes or recesses in the workpiece to position the workpiece, the load on the film, such as shear stress, can be reduced. Therefore, the workpiece W can be positioned without making holes in the film F.

[0072] Furthermore, the upper mold 22 has workpiece through-pins 26 that are inserted into the workpiece through-holes H of the workpiece W, and when the mold is clamped, the workpiece W is positioned relative to the upper mold 22 by inserting the workpiece through-pins 26 into the workpiece through-holes H.

[0073] According to this method, the workpiece W can be positioned first by the workpiece guide pin 28, and then further positioned by the workpiece through pin 26. Therefore, misalignment of the workpiece W can be further suppressed. In addition, since the workpiece W is roughly positioned by the workpiece guide pin 28 before being positioned by the workpiece through pin 26, a decrease in production efficiency caused by collision between the workpiece through pin 26 and the workpiece W due to misalignment between the workpiece through hole H and the workpiece through pin 26 can be suppressed.

[0074] Furthermore, the work guide pin 28 has a tapered portion.

[0075] This configuration allows for a wider range of release positions for the workpiece W from the first loader hand 61 compared to a configuration where the guide pin sidewall 28c is substantially perpendicular to the guide pin base end 28b and the guide pin tip 28a. Therefore, setting the workpiece W onto the lower die 23 becomes easier.

[0076] Furthermore, multiple work guide pins 28 are provided along the outer circumference of the workpiece W in a plan view. In addition, at least one work guide pin 28 is arranged on each side of the workpiece W in a plan view.

[0077] According to this, the multiple work guide pins 28 position the workpiece W, thereby suppressing translation and rotation of the workpiece W. Therefore, misalignment of the workpiece W can be suppressed even more effectively.

[0078] Furthermore, the area of ​​the guide pin tip 28a in a plan view is larger than the area of ​​the through pin tip 26a in a plan view.

[0079] According to this, the sharpness of the work guide pins 28 is reduced, so even when the work guide pins 28 are covered with film F, damage to film F caused by the work guide pins 28 piercing through film F can be suppressed.

[0080] Furthermore, the area of ​​the guide pin base end 28b in a plan view is larger than the area of ​​the through pin base end 26b in a plan view.

[0081] According to this, the taper angle of the work guide pin 28 can be made larger than the taper angle of the work through pin 26. In this case, the positioning of the workpiece W by the work guide pin 28 is more forgiving than the positioning of the workpiece W by the work through pin 26, so when setting the workpiece W in the lower die 23, problems such as the workpiece W riding up on the work guide pin 28 are less likely to occur. Furthermore, the positioning of the workpiece W by the work through pin 26 is more rigorous than the positioning of the workpiece W by the work guide pin 28, so the work through pin 26 can suppress the misalignment of the workpiece W even more effectively than the work guide pin 28.

[0082] As described above, the resin sealing method using the resin sealing apparatus 1 according to the first embodiment includes supplying resin R to the cavity recess 25 of the lower mold 23, supplying workpiece W to the lower mold 23 so that the electronic component P is placed inside the cavity recess 25, and sealing the electronic component P with resin by clamping the resin sealing mold 21. Supplying the workpiece W includes positioning the workpiece W from the outside using workpiece guide pins 28 while the resin sealing mold 21 is open.

[0083] According to this, compared to a configuration in which a pin provided on the lower mold is inserted through a film into a through hole or recess provided in the workpiece to position the workpiece, the positioning and movement of the workpiece W can be restricted in advance by the workpiece guide pin 28. Therefore, it is possible to suppress significant displacement of the workpiece W that occurs when the resin sealing mold 21 is clamped, and to prevent collision between the pin and the back surface of the workpiece.

[0084] Furthermore, the resin sealing method further includes supplying a film F so as to cover the cavity recess 25 and the work guide pins 28, and supplying the workpiece W includes positioning the workpiece W via the film F using the work guide pins 28.

[0085] According to this method, the workpiece W can be positioned without making holes in the film F.

[0086] Furthermore, the resin encapsulation of the electronic component P includes positioning the workpiece W relative to the upper mold 22 by inserting a workpiece through-pin 26 provided in the upper mold 22 into a workpiece through-hole H provided in the workpiece W while the resin encapsulation mold 21 is clamped.

[0087] According to this, the workpiece W can be first positioned by the workpiece guide pin 28, and then further positioned by the workpiece through pin 26. Therefore, misalignment of the workpiece W can be further suppressed.

[0088] Furthermore, supplying the workpiece W includes bringing at least a portion of the electronic components P provided on the workpiece W into contact with the resin R inside the cavity recess 25.

[0089] According to this, the resin R supports the load concentrated near the center of the workpiece W from the lower mold 23 side, thereby suppressing deflection in the center of the workpiece W.

[0090] Furthermore, the resin sealing method further includes heating the workpiece W through the resin R provided inside the cavity recess 25 before clamping the resin sealing mold 21.

[0091] According to this, if the workpiece W is preheated from the base material B side by preheating outside the mold before being loaded into the resin encapsulation mold 21, then after being loaded into the resin encapsulation mold 21 but before clamping, the workpiece W is preheated from the electronic component P side via the resin R by preheating inside the mold, thereby preheating the workpiece W from both the back and front surfaces. Therefore, the workpiece W can be heated uniformly, and warping of the workpiece W due to temperature differences can be suppressed.

[0092] The configurations of a resin encapsulation apparatus and resin encapsulation method according to other embodiments of the present invention are described below. In the following embodiments, descriptions of matters common to the first embodiment described above will be omitted, and only the differences will be described. In particular, similar effects and advantages due to similar configurations will not be mentioned sequentially.

[0093] [Second Embodiment] <Resin encapsulation device> Next, the structure of the resin encapsulation mold 121 according to the second embodiment will be described with reference to Figures 9 and 10. Figures 9 and 10 are diagrams illustrating the resin encapsulation mold and the resin encapsulation method using the same according to the second embodiment.

[0094] In this embodiment, unlike the first embodiment, a cavity recess 125 is provided in the upper mold 123, as shown in Figures 9 and 10. The resin encapsulation mold 121 comprises a pair of openable and closable upper mold 123 and lower mold 122 that supply resin R to the cavity recess 125 for molding. In other words, the resin encapsulation mold 121 is a compression molding mold with a so-called movable upper cavity structure. Specifically, the surface of the lower mold 122 facing the cavity recess 125 is substantially flat, and the cavity recess 125 is formed on the surface of the upper mold 123 facing the lower mold 122.

[0095] The upper mold 123 is equipped with work guide pins 128, and the lower mold 122 is equipped with work through pins 126. The resin sealing mold 121 further includes a work holding section 129. The work holding section 129 holds the workpiece W, which has been transported to the resin sealing mold 121, in the upper mold 123. Specifically, the work holding section 129 is retracted from the space between the lower mold 122 and the upper mold 123 until the workpiece W is loaded, and when the workpiece W is loaded, it enters the space and holds the outer edge of the workpiece W from below.

[0096] <Method of resin encapsulation> Next, a resin sealing method using the resin sealing mold 121 according to the second embodiment will be described with reference to Figures 9 and 10. Figures 9 and 10 are diagrams illustrating the resin sealing mold and the resin sealing method using the same according to the second embodiment. The resin sealing mold 121 of this embodiment has a cavity recess 125 in the upper mold 123, so the film F, resin R, and workpiece W are supplied to the upper mold 123.

[0097] Specifically, as shown in Figure 9, in this embodiment, the film F and resin R are set to cover the cavity recess 125 and work guide pin 128 provided in the upper mold 123.

[0098] Furthermore, as shown in Figure 10, in this embodiment, the workpiece W is held in the upper mold 123 by a workpiece holding portion 129 provided on the upper mold 123.

[0099] As described above, the upper mold 123 is equipped with a workpiece holding section 129, and the workpiece holding section 129 holds the workpiece W, enabling compression molding by a resin sealing mold 121 with an upper cavity movable structure having a cavity recess 125 on the upper mold 123 side.

[0100] [Third Embodiment] Next, a resin encapsulation method according to the third embodiment will be described with reference to Figure 11. Here, a resin encapsulation method using the resin encapsulation mold 21 according to the first embodiment will be described, but the resin encapsulation mold used in the resin encapsulation method according to the third embodiment is not limited to the above, as long as it is a resin encapsulation mold according to one embodiment of the present invention.

[0101] In the resin encapsulation method according to the third embodiment, as shown in Figure 11, when the workpiece W is set in the lower mold 23, the electronic components P provided on the workpiece W are separated from the resin R inside the cavity recess 25. Furthermore, the base material B may be in contact with the resin R inside the cavity recess 25, or it may be separated from it.

[0102] According to this, by separating the electronic component P and the resin R, it is possible to suppress thermal variations due to the contact area between the part where the electronic component P is placed and the part where it is not placed, compared to when they are in contact. Therefore, it is possible to suppress warping of the workpiece W due to temperature differences on the electronic component P side.

[0103] In the above embodiment, the first loader hand 61 was described as receiving the workpiece W at the workpiece preheating unit 15 and handing over the workpiece W at the molded product receiving unit 91, but it is not limited to this. For example, the workpiece preheating unit 15 and the molded product receiving unit 91 may be configured to be movable along the first guide unit 60R. Alternatively, for example, loader hands configured to move back and forth in the resin encapsulation mold 21 for transporting the workpiece W or molded product M may be provided in the resin encapsulation molds 21 and 31, respectively. In this case, the workpiece W may be placed on a table configured to be movable in the left-right direction along the guide unit, transported from the workpiece supply unit 10 to the resin molding units 20 and 30, and picked up from the table by the loader hand in the resin molding units 20 and 30. Similarly, the molded product M may be released from the loader hand in the resin molding units 20 and 30, placed on a table configured to be movable in the left-right direction along the guide, and transported from the resin molding units 20 and 30 to the molded product recovery unit 90.

[0104] As described above, a resin encapsulation apparatus according to one aspect of the present invention is a resin encapsulation apparatus for resin encapsulating electronic components of a workpiece including a substrate and electronic components, comprising a resin encapsulation mold for compression molding resin onto the workpiece to resin encapsulate the electronic components, the resin encapsulation mold having a first mold and a second mold paired with the first mold, the first mold having a cavity recess and a workpiece guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, the workpiece guide portion positions the workpiece from the outside of the workpiece in a plan view of the first mold when the resin encapsulation mold is opened.

[0105] According to this design, the workpiece is positioned from the outside by the workpiece guide, thereby suppressing misalignment of the workpiece after it has been set. Therefore, a resin encapsulation device with improved reliability of molded products can be provided.

[0106] In the above embodiment, the workpiece guide portion may position the workpiece via a film provided on the first mold so as to cover the cavity recess and the workpiece guide portion.

[0107] According to this method, the workpiece can be positioned without making holes in the film.

[0108] In the above embodiment, the workpiece is provided with a through hole for positioning, and the second mold has a workpiece insertion portion that is inserted into the through hole. The workpiece may be positioned relative to the second mold by inserting the workpiece insertion portion into the through hole while the resin sealing mold is clamped.

[0109] This allows for improved positioning accuracy.

[0110] In the above embodiment, the work guide portion may have a plurality of protrusions arranged along the outer circumference of the workpiece in a plan view of the first mold.

[0111] According to this, the misalignment of the workpiece can be further suppressed.

[0112] In the above embodiment, each of the multiple protrusions may have a tapered portion that is narrower in width toward the second mold.

[0113] According to this, the workpiece is positioned along the side walls of multiple protrusions, making it easier to set the workpiece.

[0114] In the above embodiment, the workpiece has a rectangular shape in plan view, and the multiple protrusions may be arranged at least once on each side of the rectangular shape of the workpiece in plan view of the first mold.

[0115] According to this method, rotational and translational misalignment of the workpiece can be suppressed.

[0116] In the above embodiment, the tip of each of the multiple protrusions may have a larger area in plan view than the tip of the workpiece insertion portion.

[0117] According to this, when the leading edge of a workpiece is covered with a film, damage to the film can be suppressed.

[0118] In the above embodiment, the base end of each of the multiple protrusions may have a larger area in plan view than the base end of the workpiece insertion portion.

[0119] This makes it easier to set the workpiece into the first mold. Furthermore, it can suppress workpiece displacement even more effectively than multiple protrusions.

[0120] In the above embodiment, the first mold may be a lower mold, and the second mold may be an upper mold.

[0121] In the above embodiment, the first mold is an upper mold, the second mold is a lower mold, and the first mold may further have a workpiece holding portion for holding a workpiece.

[0122] Another aspect of the present invention relates to a resin encapsulation apparatus and a resin encapsulation method using a resin encapsulation mold for encapsulating electronic components of a workpiece including a substrate and electronic components, wherein the resin encapsulation mold comprises a first mold and a second mold paired with the first mold, the first mold having a cavity recess and a workpiece guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, and the resin encapsulation method includes supplying resin to the cavity recess provided in the first mold, supplying a workpiece to the first mold such that the electronic components are positioned inside the cavity recess into which the resin has been supplied, and clamping the resin encapsulation mold by moving the first mold and the second mold relative to each other to encapsulate the electronic components with resin, wherein supplying the workpiece includes positioning the workpiece from the outside of the workpiece using the workpiece guide portion in a plan view of the first mold while the resin encapsulation mold is open.

[0123] According to this method, the workpiece is positioned from the outside by the workpiece guide, thereby suppressing misalignment of the workpiece after it has been set. Therefore, a resin encapsulation method that improves the reliability of molded products can be provided.

[0124] In the above embodiment, the method further includes supplying a film so as to cover the cavity recess and the work guide portion, supplying a resin includes supplying a resin to the cavity recess via the film, and supplying a workpiece includes positioning the workpiece by the work guide portion via the film.

[0125] According to this method, the workpiece can be positioned without making holes in the film.

[0126] In the above embodiment, resin encapsulation of electronic components includes positioning the workpiece relative to the second mold by inserting a workpiece insertion portion provided in the second mold into a through hole provided in the workpiece while the resin encapsulation mold is clamped.

[0127] This allows for improved positioning accuracy.

[0128] In the above embodiment, supplying the workpiece includes bringing at least a portion of the electronic components provided on the workpiece into contact with the resin inside the cavity recess.

[0129] According to this, the bending of the workpiece can be suppressed by having the resin support the workpiece.

[0130] In the above embodiment, the workpiece is further heated via the resin provided inside the cavity recess before the resin-sealing mold is clamped.

[0131] According to this method, the workpiece can be preheated uniformly, and warping of the workpiece can be suppressed.

[0132] In the above embodiment, supplying the workpiece includes positioning the electronic components provided on the workpiece so that they are separated from the resin inside the cavity recess.

[0133] According to this method, warping caused by temperature differences in the workpiece W can be suppressed.

[0134] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments. [Explanation of Symbols]

[0135] 1… Resin encapsulation device 10…Work supply unit 20, 30… Resin molding units 21,31…Resin sealing mold 25, 35… Cavity recess 26…Workpiece through-pin 28…Work guide pin 27,37… Film handler 40… Resin supply unit 60...1st Loader 61...First Loader Hand 70... Second loader 71... Second Loader Hand 80... Resin heater 90…Molded product recovery unit W...work P…Electronic parts B...Base material R…Resin F... Film

Claims

1. A resin sealing apparatus for resin sealing an electronic component of a workpiece including a substrate and an electronic component, The system includes a resin encapsulation mold for compressing and molding a resin onto the workpiece to encapsulate the electronic component, The resin encapsulation mold comprises a first mold and a second mold paired with the first mold. The first mold has a cavity recess and a work guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, The workpiece is provided with a through hole for positioning, The second mold has a workpiece insertion portion that is inserted into the through hole, The work guide portion positions the workpiece from the outside of the workpiece in a plan view of the first mold when the resin sealing mold is opened. A resin sealing device in which the workpiece is positioned relative to the second mold by inserting the workpiece insertion portion into the through hole while the resin sealing mold is clamped.

2. A resin sealing apparatus for sealing an electronic component of a workpiece including a substrate and an electronic component, The system includes a resin encapsulation mold for compressing and molding a resin onto the workpiece to encapsulate the electronic component, The resin encapsulation mold comprises a first mold and a second mold paired with the first mold. The first mold has a cavity recess and a work guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, The work guide portion has a plurality of protrusions arranged along the outer circumference of the workpiece in a plan view of the first mold, The work guide portion is a resin sealing device that positions the workpiece from the outside of the workpiece in a plan view of the first mold when the resin sealing mold is opened.

3. A resin sealing method using a resin sealing mold for resin sealing an electronic component of a workpiece including a substrate and an electronic component, The resin encapsulation mold comprises a first mold and a second mold paired with the first mold. The first mold has a cavity recess and a work guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, The resin sealing method described above is To supply resin to the cavity recess provided in the first mold, The workpiece is supplied to the first mold such that the electronic component is positioned inside the cavity recess into which the resin is supplied, and The resin sealing mold is clamped by moving the first mold and the second mold relative to each other, thereby sealing the electronic component in resin. Includes, Supplying the workpiece includes positioning the workpiece from the outside of the workpiece using the workpiece guide portion in a plan view of the first mold, with the resin sealing mold in the open state. A resin sealing method for the aforementioned electronic component, which includes positioning the workpiece relative to the second mold by inserting a workpiece insertion portion provided in the second mold into a through hole provided in the workpiece while the resin sealing mold is clamped.

4. A resin sealing method using a resin sealing mold for resin sealing an electronic component of a workpiece including a substrate and an electronic component, The resin encapsulation mold comprises a first mold and a second mold paired with the first mold. The first mold has a cavity recess and a work guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, The resin sealing method described above is To supply resin to the cavity recess provided in the first mold, The workpiece is supplied to the first mold such that the electronic component is positioned inside the cavity recess into which the resin is supplied, and The resin sealing mold is clamped by moving the first mold and the second mold relative to each other, thereby sealing the electronic component in resin. Includes, A resin encapsulation method comprising supplying the workpiece, positioning the workpiece from the outside of the workpiece using the workpiece guide portion in a plan view of the first mold while the resin encapsulation mold is open, and bringing at least a portion of the electronic component provided on the workpiece into contact with the resin inside the cavity recess.

5. A resin sealing method using a resin sealing mold for resin sealing an electronic component of a workpiece including a substrate and an electronic component, The resin encapsulation mold comprises a first mold and a second mold paired with the first mold. The first mold has a cavity recess and a work guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, The work guide portion has a plurality of protrusions arranged along the outer circumference of the workpiece in a plan view of the first mold, The resin sealing method described above is To supply resin to the cavity recess provided in the first mold, The workpiece is supplied to the first mold such that the electronic component is positioned inside the cavity recess into which the resin is supplied, and The resin sealing mold is clamped by moving the first mold and the second mold relative to each other, thereby sealing the electronic component in resin. Includes, A resin sealing method comprising supplying the workpiece, wherein the resin sealing mold is opened, and the workpiece is positioned from the outside of the workpiece by the plurality of protrusions in a plan view of the first mold.

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