Resin encapsulation apparatus and resin encapsulation method

Abstract

A resin sealing device (1) is provided with: a resin sealing mold (21) which seals an electronic component (P) with a resin by compression molding a resin material onto a workpiece (W); and a resin amount calculation unit (79) which calculates, for each workpiece, the resin amount in the resin material to be supplied to the workpiece (W) on the basis of the mounting state of the electronic component (P) on the workpiece (W). The resin material contains a first resin (R1) and a second resin (R2); the first resin (R1) is a sheet-like resin; the second resin is a granulated resin, a powdered resin or a liquid resin; and among the first resin (R1) and the second resin (R2), at least the amount of the second resin (R2) to be supplied is determined for each workpiece on the basis of the resin amount that is calculated by the resin amount calculation unit (79).

Description

Technical Field

[0001] The present invention relates to a resin encapsulation device and a resin encapsulation method.

Background Art

[0002] When resin-encapsulating electronic components such as semiconductor elements, the supply amount of the resin may be adjusted based on the mounting state of the electronic components. For example, Patent Document 1 discloses a resin molding device that removes excess sheet-shaped resin according to the mounting state of electronic components.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the resin molding device disclosed in Patent Document 1, in order to remove excess sheet-shaped resin from the workpiece, it is conceivable that unnecessary sheet-shaped resin will be generated. Further, it is conceivable that the device and process will become complicated for transporting and storing the unnecessary sheet-shaped resin.

[0005] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a resin encapsulation device and a resin encapsulation method capable of supplying an appropriate amount of resin to each workpiece while eliminating waste of the resin.

Means for Solving the Problems

[0006] A resin encapsulation apparatus according to one aspect of the present invention is a compression molding type resin encapsulation apparatus for resin encapsulating electronic components of a workpiece including a substrate and electronic components, comprising: a resin encapsulation mold for resin encapsulating electronic components by compression molding a resin material onto the workpiece; and a resin quantity calculation unit that calculates the amount of resin material to be supplied to the workpiece on a workpiece basis based on the mounting status of electronic components on the workpiece, wherein the resin material includes a first resin and a second resin, the first resin being a sheet-like resin, and the second resin being a granular resin, powder resin, or liquid resin, and the supply amount of at least the second resin among the first and second resins is determined on a workpiece basis based on the amount of resin calculated by the resin quantity calculation unit.

[0007] According to this embodiment, the amount of resin material to be supplied to the workpiece is calculated on a per-workpiece basis according to the workpiece mounting status, and the amount of the second resin to be supplied is determined on a per-workpiece basis based on that amount of resin. Therefore, for example, while supplying the first resin to the workpiece, the remaining amount of resin can be adjusted to an appropriate amount by the second resin. Thus, it is possible to supply an appropriate amount of resin to each workpiece while eliminating waste of supplied resin.

[0008] Another aspect of the present invention relates to a resin encapsulation method for resin encapsulating electronic components of a workpiece including a substrate and electronic components, comprising: calculating the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis based on the mounting arrangement of electronic components on the workpiece; supplying the workpiece to a resin encapsulation mold; supplying resin material to the resin encapsulation mold; and resin encapsulating the electronic components by compression molding the resin material onto the workpiece using the resin encapsulation mold, wherein the resin material comprises a first resin and a second resin, the first resin being a sheet-like resin, and the second resin being a granular resin, powdered resin, or liquid resin, and the amount of at least the second resin to be supplied is determined on a workpiece-by-workpiece basis based on the amount of resin material calculated on a workpiece-by-workpiece basis.

[0009] According to this embodiment, the amount of resin material to be supplied to the workpiece is calculated on a workpiece-by-workpiece basis according to the workpiece mounting status, and the amount of the second resin to be supplied is determined on a workpiece-by-workpiece basis based on that amount of resin. Therefore, for example, while supplying the first resin to the workpiece, the remaining amount of resin can be adjusted to an appropriate amount with the second resin. Thus, it is possible to supply an appropriate amount of resin to each workpiece while eliminating waste of supplied resin. [Effects of the Invention]

[0010] According to the present invention, it is possible to supply an appropriate amount of resin to each workpiece while eliminating waste of supplied resin. [Brief explanation of the drawing]

[0011] [Figure 1] This is a plan view of a resin encapsulation apparatus according to one embodiment of the present invention. [Figure 2] Figure 1 is a partially enlarged view of the resin encapsulation apparatus. [Figure 3] Figure 1 is a cross-sectional view of the resin encapsulation mold. [Figure 4] This is a flowchart showing a resin encapsulation method according to one embodiment of the present invention. [Figure 5] This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention. [Figure 6] This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention. [Figure 7] This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention. [Figure 8] This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention. [Figure 9] This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention. [Figure 10] This figure illustrates a resin encapsulation method according to another embodiment of the present invention. [Figure 11] This figure illustrates a resin encapsulation method according to another embodiment of the present invention. [Figure 12A]This is a diagram for explaining a resin encapsulation method according to another embodiment of the present invention. [Figure 12B] This is a diagram for explaining a resin encapsulation method according to another embodiment of the present invention. [Figure 12C] This is a diagram for explaining a resin encapsulation method according to another embodiment of the present invention. [Figure 12D] This is a diagram for explaining a resin encapsulation method according to another embodiment of the present invention. [Figure 13A] This is a diagram for explaining a resin encapsulation method according to another embodiment of the present invention. [Figure 13B] This is a diagram for explaining a resin encapsulation method according to another embodiment of the present invention. [Figure 14A] This is a diagram for explaining a resin encapsulation method according to another embodiment of the present invention. [Figure 14B] This is a diagram for explaining a resin encapsulation method according to another embodiment of the present invention.

Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of each embodiment are illustrative, and the dimensions and shapes of each part are schematic, and the technical scope of the present application should not be construed as being limited to the embodiments.

[0013] [First Embodiment] <Resin Encapsulation Device> While referring to FIGS. 1 to 3, the configuration of a resin encapsulation device 1 according to an embodiment of the present invention will be described. FIG. 1 is a plan view of the resin encapsulation device according to the present embodiment. FIG. 2 is a partially enlarged view of the resin encapsulation device, and FIG. 3 is a cross-sectional view of the resin encapsulation mold. In addition, in each of the drawings of FIGS. 1 to 3, for the purpose of clarifying the relationship between the respective drawings and assisting in understanding the positional relationship of each member, the directions of front and back, left and right, up and down are arbitrarily assigned.

[0014] The resin encapsulation apparatus 1 is a manufacturing apparatus that produces a molded product M by applying resin to a workpiece W. The workpiece W includes a base material B and an electronic component P. The molded product M can be produced by molding resin onto the workpiece W and encapsulating the electronic component P of the workpiece W with the resin. Here, the workpiece W has a surface on which the electronic component P is mounted (hereinafter referred to as the "front surface of the workpiece W") and a surface opposite to the said surface (hereinafter referred to as the "back surface of the workpiece W"). The back surface of the workpiece W is the surface on which the electronic component P is not mounted. In the following description, the top and bottom relationship between the front and back surfaces of the workpiece W can be reversed as appropriate depending on the structure of the resin encapsulation mold. For the convenience of explanation, the workpiece W after resin encapsulation may be referred to as the molded product M. The base material B is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, or a semiconductor substrate. The electronic component P is, for example, a semiconductor element such as an IC chip, but is not limited to this, and may be various active elements, passive elements, MEMS devices, etc. As shown in Figure 3, the resin is composed of a first resin R1 and a second resin R2. The first resin R1 and the second resin R2 may have different properties or the same properties. For example, the second resin R2 may have higher release properties than the first resin R1. Also, in this embodiment, the first resin R1 and the second resin R2 are in different states. Specifically, the first resin R1 is a sheet-like resin, while the second resin R2 is a granular resin, powder resin, or liquid resin. The sheet-like resin used as the first resin R1 is preferably a fixed quantity of resin with constant thickness, width, and length for each resin to be supplied. This makes it easier to determine how much additional resin needs to be supplied in relation to the total amount of resin required. In this embodiment, the combination of the first resin R1 and the second resin R2 is described as a combination of a sheet-like resin and a granular resin, but it is not limited to this combination, and for example, the second resin R2 may be powder or liquid.

[0015] The resin encapsulation apparatus 1 according to this embodiment is a compression molding type (in other words, a compression method) resin encapsulation apparatus. As shown in Figure 1, the resin encapsulation apparatus 1 comprises a work supply unit 10, resin molding units 20 and 30, a second resin supply unit 40, a first resin supply unit 50, a first loader 60, a second loader 70, and a molded product recovery unit 90. The first loader 60 is a loader that transports workpieces W and is configured to be movable along a first guide section 60R. The second loader 70 is a loader that transports first resin R1 (for example, sheet-like resin) and second resin R2 (for example, granular resin) and is configured to be movable along a second guide section 70R.

[0016] The planar layout of the resin encapsulation apparatus 1 is not particularly limited, but in the example shown in Figure 1, the work supply unit 10, resin molding unit 20, second resin supply unit 40, resin molding unit 30, and molded product recovery unit 90 are arranged in this order along the first guide section 60R from left to right in Figure 1. Also, with respect to the first guide section 60R, the second resin supply unit 41 is located at the rear and the first resin supply unit 50 is located at the front. The first resin supply unit 50 and the second resin supply unit 40 are arranged in this order along the second guide section 70R from front to back in Figure 1. Also, with respect to the second guide section 70R, the work supply unit 10 and resin molding unit 20 are located on the left side and the resin molding unit 30 and molded product recovery unit 90 are located on the right side.

[0017] The work supply unit 10 supplies workpieces W to the first loader hand 61 of the first loader 60. The work supply unit 10 includes a workpiece storage section 11, a workpiece transfer section 13, a workpiece preheating section 15, and a work supply control panel 19. Furthermore, for example, the work supply control panel 19 may integrate a display section that displays the control parameters of the molded product recovery unit 90, the second resin supply unit 40, the first resin supply unit 50, the first loader 60, and the second loader 70, as described later, and an input section for inputting those control parameters.

[0018] The workpiece storage unit 11 stores multiple workpieces W and sequentially feeds out the workpieces W. For example, the workpiece storage unit 11 includes multiple workpiece magazines and a workpiece elevation unit. Multiple workpieces W are stored in the workpiece magazines set in the workpiece storage unit 11 so as to overlap vertically. The workpiece elevation unit adjusts the position of the workpiece magazines in order to feed the workpieces W to the workpiece transfer unit 13.

[0019] The workpiece transfer unit 13 transfers the workpiece W received from the workpiece storage unit 11 to the workpiece preheating unit 15. For example, the workpiece transfer unit 13 includes a workpiece index that receives and aligns the workpiece W sent out by the workpiece storage unit 11, and a workpiece pick-and-place unit that transfers the workpiece W aligned by the workpiece index to the workpiece preheating unit 15.

[0020] The workpiece preheating unit 15 preheats the workpiece W received from the workpiece transfer unit 13 and hands it over to the first loader hand 61 of the first loader 60. Preheating the workpiece W before it is transported to the resin molding units 20 and 30 suppresses deformation of the workpiece W due to rapid temperature changes inside the resin sealing molds 21 and 31. For example, the workpiece preheating unit 15 is equipped with a preheating rail that heats the workpiece W from its edges. Alternatively, the workpiece preheating unit 15 may be equipped with a hot plate that heats the entire surface of the workpiece W. Note that the workpiece preheating unit 15 may not be provided, and the workpiece W may not be preheated. In this case, the time from when the workpiece W is transported to the resin molding units 20 and 30 until the start of loading the first resin R1 and the second resin R2 into the resin molding units 20 and 30 or the start of mold closing may be controlled.

[0021] The work supply control panel 19 controls the operation of the work supply unit 10. As shown in Figure 1, when viewed from above, the work supply control panel 19 is located in front of the work supply unit 10. For example, the work supply control panel 19 includes a display unit that displays the control parameters of the work supply unit 10 and an input unit that inputs the control parameters of the work supply unit 10.

[0022] The work supply unit 10 is equipped with a work mounting status measuring unit 16 that measures the mounting status of electronic components P on the workpiece W. For example, it may further include a volume measuring unit that measures the mounting status of electronic components P from the volume of the workpiece W, a weight measuring unit that measures the mounting status of electronic components P from the weight of the workpiece W, and an appearance measuring unit that measures from the appearance of the workpiece W.

[0023] The molded product recovery unit 90 recovers the molded product M from the first loader hand 61 of the first loader 60. The molded product recovery unit 90 includes a molded product receiving section 91, a molded product transfer section 93, and a molded product storage section 95. In the example shown in Figure 1, the molded product recovery unit 90 is located on the opposite side of the work supply unit 10 from the resin molding units 20 and 30 in the left-right direction. As a modification, the molded product recovery unit 90 may be located on the same side of the work supply unit 10 as the resin molding units 20 and 30 in the left-right direction.

[0024] The molded product receiving unit 91 transfers the molded product M received from the first loader hand 61 of the first loader 60 to the molded product transfer unit 93. For example, the molded product receiving unit 91 is equipped with a cooling pallet for cooling the molded product M. Alternatively, the workpiece W may not be cooled by not providing a cooling pallet.

[0025] The molded product transfer unit 93 transfers the molded product M received from the molded product receiving unit 91 to the molded product storage unit 95. For example, the molded product transfer unit 93 includes a molded product index that receives and aligns the molded product M sent out by the molded product receiving unit 91, and a molded product pick-and-place unit that transfers the molded product M aligned by the molded product index to the molded product storage unit 95.

[0026] The molded product storage unit 95 receives and stores the molded product M. For example, the molded product storage unit 95 comprises multiple molded product magazines and a molded product elevation unit. Multiple molded products M are stored in the molded product magazines set in the molded product storage unit 95 so as to overlap in the vertical direction. The molded product elevation unit adjusts the position of the molded product magazines in order to receive the molded product M from the molded product transfer unit 93.

[0027] The molded product recovery unit 90 may further include a volume measuring unit for measuring the volume of the molded product M, and an appearance inspection unit for inspecting the appearance of the molded product M.

[0028] The resin molding unit 20 molds a first resin R1 and a second resin R2 onto a workpiece W. The resin molding unit 20 includes a resin sealing mold 21, a film handler 27, and a resin molding control panel 29.

[0029] As shown in Figure 3, the resin encapsulation mold 21 comprises a pair of openable and closable upper mold 22 and lower mold 23 that fill the internal cavity 25 with a first resin R1 and a second resin R2 for molding. In the example shown in Figure 3, the resin encapsulation mold 21 is a compression molding mold with a so-called movable upper cavity structure. Specifically, the surface of the lower mold 23 facing the upper mold 22 is flat, and a cavity 25 is formed on the surface of the upper mold 22 facing the lower mold 23. The cavity 25 is a recess that opens toward the lower mold 23 (an example of a cavity recess).

[0030] The upper mold 22 comprises an upper plate 22a, a cavity piece 22b, a clamper 22c, and a biasing member 22d. The cavity piece 22b is fixedly assembled to the lower surface (the surface on the lower mold 23 side) of the upper plate 22a. The clamper 22c is configured in a frame shape to surround the cavity piece 22b. The clamper 22c is assembled to be vertically movable relative to the upper plate 22a via the biasing member 22d. The cavity piece 22b constitutes the bottom surface of the cavity 25, and the clamper 22c constitutes the side surface of the cavity 25. The upper mold 22 is provided with suction holes 22e and 22f that pass through the clamper 22c, and a suction hole 22g that passes through the upper plate 22a and the cavity piece 22b. The suction hole 22e opens to the lower surface of the clamper 22c. The suction hole 22f opens on the inner surface of the clamper 22c facing the cavity piece 22b. A sealing member is inserted below the suction hole 22f (not shown). The suction hole 22g opens on the upper surface of the cavity piece 22b, i.e., the bottom surface of the cavity 25. The suction holes 22e, 22f, and 22g are suction holes for adsorbing the film F set in the upper mold 22.

[0031] The lower mold 23 comprises a lower plate 23a and a cavity plate 23b. The cavity plate 23b is fixedly assembled to the upper surface (the surface facing the upper mold 22) of the lower plate 23a. The lower mold 23 is provided with a suction hole 23c that penetrates the lower plate 23a and the cavity plate 23b. The suction hole 23c opens to the lower surface of the cavity plate 23b. The suction hole 23c is a suction hole for adsorbing the workpiece W set in the lower mold 23.

[0032] The film handler 27 supplies film F to the resin encapsulation mold 21. Film F is a release film that prevents the first resin R1 and the second resin R2 from entering the gaps in the upper mold 22 that form the recesses of the cavity 25, and facilitates the peeling of the molded product M from the upper mold 22. The film handler 27 handles, for example, roll-shaped film and includes an unwinding section for supplying unused film F and a winding section for collecting used film F. As shown in Figure 1, the unwinding and winding sections of the film handler 27 are arranged in the left-right direction of the resin encapsulation mold 21. As the material for film F, polymer materials with excellent heat resistance, ease of peeling, flexibility, and extensibility can be used, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene-ethylene copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), PET (polyethylene terephthalate), PP (polypropylene), PVDC (polyvinylidine chloride), etc. The thickness of film F is suitably selected according to the physical properties of the material, and is approximately 50 μm as an example. The shape of film F is not limited to a roll; it may also be in the form of strips.

[0033] The resin molding control panel 29 controls the operation of the resin molding unit 20. As shown in Figure 1, when viewed from above, the resin molding control panel 29 is located in front of the resin molding unit 20. For example, the resin molding control panel 29 includes a display unit that displays the control parameters of the resin molding unit 20 and an input unit that inputs the control parameters of the resin molding unit 20.

[0034] The resin molding unit 30 comprises a resin encapsulation mold 31, a film handler 37, and a resin molding control panel 39. Details of the resin encapsulation mold 31, film handler 37, and resin molding control panel 39 will be omitted in the following description, but configurations similar to those described for the resin molding unit 20 can be applied.

[0035] Furthermore, at least some of the functions of the resin molding control panels 29 and 39 may be integrated into the work supply control panel 19. For example, the control parameters of the resin molding units 20 and 30 may be displayed on the display unit of the work supply control panel 19, or the control parameters of the resin molding units 20 and 30 may be input into the input unit of the work supply control panel 19. If all the functions of the control panels of each unit are integrated into the work supply control panel 19, the resin molding control panels 29 and 39 may be omitted.

[0036] The first resin supply unit 50 includes a first resin storage section 51 and a first resin transfer section 53.

[0037] The first resin storage unit 51 stores multiple first resins R1 and sequentially feeds out the first resins R1. For example, the first resin storage unit 51 comprises multiple magazines and an elevation mechanism. The magazines set in the first resin storage unit 51 may be slit magazines in which multiple first resins R1 are stored overlapping in the vertical direction, or stack magazines in which multiple first resins R1 are stored stacked vertically. The elevation mechanism adjusts the position of the magazines in order to feed out the first resins R1 to the first resin transfer unit 53.

[0038] The first resin transfer unit 53 transfers the first resin R1 received from the first resin storage unit 51 to the holding tool 78. For example, the first resin transfer unit 53 receives the second resin R2 sent out by the first resin storage unit 51, aligns it, and transfers it to the holding tool 78. At this time, the first resin R1 may be picked up by a chucking function provided on the holding tool 78.

[0039] The first resin supply unit 50 may further include a volume measuring unit for measuring the volume of the first resin R1, a weight measuring unit for measuring the weight of the first resin R1, an appearance inspection unit for inspecting the appearance of the first resin R1, or a first resin preheating unit for preheating the first resin R1.

[0040] The second resin supply unit 40 supplies granular second resin R2 onto the first resin R1. The second resin supply unit 40 comprises a second resin supply section 41 and a resin heater 80.

[0041] The second resin supply unit 41 supplies the second resin R2 onto the first resin R1 held by the holding tool 78. The second resin supply unit 41 includes a hopper 42 and a feeder 43. If the second resin is liquid, the resin supply unit may also include a syringe for storing the resin, a piston for pushing out the resin, and a pinch valve for opening and closing the tip of the syringe.

[0042] The resin heater 80 heats the first resin R1 and the second resin R2 supplied on top of the first resin R1. As the heat source for the resin heater 80, known heating mechanisms such as electric heating wires and infrared heaters can be used. Note that the resin heater 80 is optional.

[0043] In the second resin supply unit 40, it is preferable that the resin guard 44, described later, is positioned inside the holding tool 78. The resin guard 44 is configured in a frame shape along the outer shape of the first resin R1 and is used as a frame that defines the area in which the second resin R2 is dispersed. The resin guard 44 is attached to the holding tool 78, for example, before the supply of the second resin R2, and removed from the holding tool 78 after the heating of the second resin R2. However, if the holding tool 78 can be used as a frame that defines the area in which the resin R is dispersed, the resin guard 44 may be omitted.

[0044] Furthermore, the second resin supply unit 40 is equipped with a resin quantity calculation unit 79. The resin quantity calculation unit 79 calculates and sets the amount of resin to be supplied based on the mounting status of each workpiece obtained by the workpiece mounting status measurement unit 16. Specifically, as an indicator of the mounting status, the total amount of resin required for one resin encapsulation is calculated from the number of chips mounted on the workpiece and the chip stacking height, and the amount of second resin R2 to be supplied can be determined based on this amount of resin and the amount of first resin R1. At this time, the amount of first resin R1 to be supplied may be determined from the volume or weight etc. that has been determined in advance by using a fixed amount of resin sheet-like resin with constant thickness, width and length, or the amount of first resin R1 to be supplied may be determined by measuring the volume etc. of first resin R1. The amount of second resin R2 to be supplied may be determined based on the difference between the amount of resin calculated by the resin quantity calculation unit 79 and the amount of first resin R1 to be supplied. Furthermore, the amount of first resin R1 to be supplied is based on the amount of resin required when all electronic components P are mounted. In this embodiment, resin is supplied using a first resin R1 and a second resin R2, but it may also be supplied using only the first resin R1. Furthermore, the amount supplied by the second resin R2 may be less than the amount supplied by the first resin R1. In this case, by adjusting the amount supplied by the second resin R2 to compensate for the shortage, it is possible to supply an appropriate amount of resin to each workpiece while eliminating waste of supplied resin. The amount supplied by the second resin R2 is determined by the amount of resin needed to compensate for the volume of electronic components P that are lacking. Therefore, depending on the proportion of the cavity occupied by electronic components P, the amount supplied by the second resin R2 may be adjusted to be greater than or equal to the amount supplied by the first resin R1. In addition, if the number of workpieces with electronic components P installed does not reach the specified number, workpieces without electronic components P (i.e., dummy workpieces) may be added, in which case the second resin R2 will be supplied up to the maximum supply amount.

[0045] The second resin supply unit 40 may further include a weight measuring unit for measuring the weight of the second resin R2, a vibration unit for dispersing the second resin R2 by vibration, and an inspection unit for inspecting the degree of dispersion of the second resin R2.

[0046] The first loader 60 transports the workpiece W from the workpiece supply unit 10 to the resin molding units 20 and 30. The first loader 60 is configured to be movable along the first guide section 60R. The first guide section 60R extends in the left-right direction across the workpiece supply unit 10, the resin molding units 20 and 30, the second resin supply unit 40, and the molded product recovery unit 90. As shown in Figure 1, when viewed from above, the first guide section 60R is located, for example, behind the resin encapsulation molds 21 and 31 and in front of the second resin supply unit 41. In the configuration example shown in Figure 1, the first loader 60 transports the molded product M from the resin molding units 20 and 30 to the molded product recovery unit 90.

[0047] As shown in Figure 2, the first loader 60 comprises a first loader hand 61, a first base 62, and a first guide rod 63.

[0048] The first loader hand 61 is configured to move back and forth relative to the resin encapsulation mold 21. In other words, the first loader hand 61 has a transport path for the workpiece W or molded product M (an example of a workpiece) on the rear side of the resin encapsulation mold 21. The first loader hand 61 holds the workpiece W or molded product M. The first loader hand 61 has, for example, an L-shaped opening and closing claw that supports the lower surface of the workpiece W or molded product M, but is not limited to this. The first loader hand 61 may attract the workpiece W or molded product M by electrostatic force, or by intake and exhaust.

[0049] As shown in Figure 2, the first base 62 is connected to the first guide portion 60R so as to be movable in the left-right direction.

[0050] As shown in Figure 2, the first guide rod 63 is connected to the first base 62 and supports the first loader hand 61. The first guide rod 63 is configured to be extendable and retractable in the front-rear direction, allowing the first loader hand 61 to move in the front-rear direction.

[0051] As an example, after the first loader hand 61 receives the workpiece W at the workpiece transfer section 13, it is transported to the right by the first base 62 and moves to a position facing the resin encapsulation mold 21 in the front-rear direction. Next, while still holding the workpiece W, the first loader hand 61 enters the resin encapsulation mold 21 from the rear by the extension of the first guide rod 63. In other words, the first loader hand 61 loads the workpiece W into the resin encapsulation mold 21. After the first loader hand 61 transfers the workpiece W to the lower mold 23 of the resin encapsulation mold 21, it moves to the rear of the resin encapsulation mold 21 by the contraction of the first guide rod 63. After the molded product M is formed and the resin encapsulation mold 21 is opened, the first loader hand 61 unloads the molded product M from the resin encapsulation mold 21 by the same operation as when the workpiece W was loaded. Then, the first loader hand 61 is transported to the right by the first base 62 and delivers the molded product M at the molded product receiving section 91.

[0052] The second loader 70 transports the first resin R1 and the second resin R2. The second loader 70 is configured to be movable along the second guide section 70R. The second guide section 70R is provided, for example, on the second resin supply unit 40 and extends in the front-rear direction. As shown in Figure 1, when viewed from above, the second guide section 70R intersects, for example, the first guide section 60R.

[0053] As shown in Figure 2, the second loader 70 comprises a second loader hand 71, a second base 72, and a second guide rod 73.

[0054] As shown in Figure 2, the second base 72 is configured to be movable in the front-rear direction relative to the second guide portion 70R, but it is not limited to movement in the front-rear direction and may be configured to be movable in the left-right direction as well.

[0055] As shown in Figure 2, the second guide rod 73 is connected to the second base 72 and supports the second loader hand 71. The second guide rod 73 is configured to extend and retract and pivot from the point where it is connected to the second base 72. As a result, the second guide rod 73 moves the second loader hand 71 in the forward / backward or left / right direction, and also pivots the second loader hand 71 around the second base 72.

[0056] As an example, the second loader hand 71 transports the holding tool 78 to the first resin transfer section 53. After receiving the first resin R1 by the holding tool 78 at the first resin transfer section 53, the second loader hand 71 is transported backward by the second base 72 and transports the first resin R1 via the holding tool 78 to a position P2 behind the first resin transfer section 53. Next, the second loader hand 71 moves to a position P1 in front of the second resin supply section 41 by the rotation of the second guide rod 73. Next, the second loader hand 71 moves to the second resin supply section 41 by the extension of the second guide rod 73. At the second resin supply section 41, the second loader hand 71 releases the holding tool 78. A resin guard 44 is set inside the released holding tool 78. Then, after receiving the second resin R2 on top of the first resin R1 and inside the resin guard 44, the first resin R1 and the second resin R2 are heated, and after heating, the resin guard 44 is removed. After that, the second loader hand 71 picks up the holding tool 78 again and returns to position P1 by the contraction of the second guide rod 73. Next, the second loader hand 71 moves to position P3 to the right of the resin sealing mold 21 by the rotation of the second guide rod 73. Next, the second loader hand 71 enters the resin sealing mold 21 from the right by the extension of the second guide rod 73, while still holding the first resin R1 and the second resin R2 via the holding tool 78. In other words, the second loader hand 71 loads the first resin R1 and the second resin R2 into the resin sealing mold 21 via the holding tool 78. After transferring the first resin R1 and the second resin R2 to the resin encapsulation mold 21, the second loader hand 71 moves to the right of the resin encapsulation mold 21 due to the contraction of the second guide rod 73.

[0057] Thus, if the second loader hand 71 can move from the second resin supply unit 40 to the first resin transfer section 53 by the extension and retraction of the second guide rod 73, the first resin supply unit 50 can be added without extending the second guide section 70R to the first resin supply unit 50.

[0058] The first loader 60 and the second loader 70 operate on the resin encapsulation mold 31 of the resin molding unit 30 in the same way as they operate on the resin encapsulation mold 21 of the resin molding unit 20. Therefore, a description of the operation of the first loader 60 and the second loader 70 on the resin encapsulation mold 31 is omitted. However, the operation of the second loader 70 on the resin encapsulation mold 31 is the reverse of the operation of the second loader 70 on the resin encapsulation mold 21.

[0059] Next, the transport path when the first loader hand 61 supplies the workpiece to the resin encapsulation mold 21 will be described. The first loader hand 61 receives the workpiece W at the workpiece preheating section 15. Alternatively, the workpiece preheating section 15 may be configured to be movable along the first guide section 60R. In this case, the movement of the first loader 60 in the left-right direction is restricted. Subsequently, with the first loader hand 61 holding the workpiece W, the first loader 60 moves to the right along the first guide section 60R and transports the workpiece W to the rear of the resin encapsulation mold 21. Then, as shown in Figure 2, the first loader hand 61 and the workpiece W are transported to the resin encapsulation mold 21 by the extension and contraction of the first guide rod 63, and the workpiece W is placed in the resin encapsulation mold 21 by the first loader hand 61. After resin encapsulation in the resin encapsulation mold 21, with the workpiece W still held by the first loader hand 61, the workpiece W is moved away from the resin encapsulation mold 21 by the extension and contraction of the first guide rod 63.

[0060] On the other hand, the transport path when the first loader hand 61 removes a workpiece from the resin encapsulation mold 21 will be described. As shown in Figure 2, the first loader hand 61 is transported to the resin encapsulation mold 21 by the extension and retraction of the first guide rod 63, and with the workpiece W held by the first loader hand 61, the workpiece W is moved away from the resin encapsulation mold 21 by the extension and retraction of the first guide rod 63. After that, with the first loader hand 61 holding the workpiece W, the first loader 60 moves to the right along the first guide section 60R and hands over the workpiece W to the molded product receiving section 91. Alternatively, the molded product receiving section 91 may be configured to move along the first guide section 60R. In this case, the movement of the first loader 60 in the left and right directions is restricted. The transport path for supplying or removing the workpiece W described above is the same for the resin encapsulation mold 31.

[0061] In this embodiment, the first loader hand 61 transports the workpiece W and the second loader hand 71 transports the first resin R1 and the second resin R2 as described above, but the embodiment is not limited to this. For example, the workpiece and resin may be transported simultaneously by a single loader hand, or one of the workpiece and resin may be transported first, and then the other may be transported.

[0062] In the examples shown in Figures 1 and 2, the transport path of the first loader hand 61 is located behind the resin encapsulation molds 21 and 31. However, the configuration is not limited to this example. For instance, the first loader hand may be provided behind the resin encapsulation mold 21, and another first loader hand may be provided behind the resin encapsulation mold 31.

[0063] It is preferable that the second resin R2 has better release properties than the first resin R1. In this case, the second loader hand 71 transports the second resin to the resin sealing mold 21 with the second resin placed on top of the first resin. Then, the second resin R2 is pressed and placed in the recess of the cavity 25. According to this embodiment, the high release properties make it easy to remove the resin from the film F after molding.

[0064] As described above, the resin encapsulation apparatus described in this embodiment allows for adjustment of the amount of resin material depending on the workpiece mounting status. Therefore, it is possible to provide a resin encapsulation apparatus that can supply an appropriate amount of resin to each workpiece while eliminating waste of supplied resin.

[0065] <Method of resin encapsulation> Next, the resin encapsulation method will be described using Figures 4 to 9. Figure 4 is a flowchart showing an example of a resin encapsulation method using the resin encapsulation apparatus according to this embodiment. Figures 5 to 9 are diagrams illustrating the resin encapsulation method according to this embodiment. In the following description, a method using a resin encapsulation apparatus having a cavity in the upper mold will be described. Here, the resin encapsulation mold 21 of the resin molding unit 20 will be used as an example, and the resin encapsulation mold 31 of the resin molding unit 30, which operates similarly, will not be described.

[0066] First, the amount of resin material to be supplied to workpiece W is calculated on a workpiece-by-workpiece basis (S10).

[0067] Specifically, the work supply unit 10 in Figure 1 is equipped with a work mounting status measuring unit 16 that measures the mounting status of electronic components P on the workpiece W. The amount of resin to be supplied is calculated using a volume measuring unit that measures the mounting status of electronic components P from the volume of the workpiece W, a weight measuring unit that measures the mounting status of electronic components P from the weight of the workpiece W, and an appearance inspection unit that inspects the appearance of the workpiece W. Alternatively, the amount of resin to be supplied may be calculated using data on the mounting status measured in advance. The amount of second resin R2 to be supplied may be calculated in the resin amount calculation unit 79 based on the mounting status obtained by the work mounting status measuring unit 16.

[0068] Next, the first loader hand 61 supplies the workpiece W to the resin sealing molds 21 and 31 (S20).

[0069] Specifically, the workpiece W received from the workpiece transfer unit 13 in Figure 1 is preheated in the workpiece preheating unit 15 and held by the first loader hand 61 of the first loader 60. Then, the first loader hand 61, while holding the workpiece W, moves to the resin molding unit 20 as shown in Figure 5. Before and after this process, the film F is moved to the cavity 25 provided on the upper mold 22 side. After the film F is moved, the film F is sucked in by the suction hole 22g and set in the cavity 25.

[0070] Next, the first resin R1 is supplied (S30).

[0071] Specifically, the first resin R1 stored in the first resin storage unit 51 is transferred to the first resin transfer unit 53. The first resin transfer unit 53 then transfers the first resin R1 received from the first resin storage unit 51 to the holding tool 78. The amount of first resin supplied at this time may be constant, or it may be adjusted based on the mounting status obtained by the workpiece mounting status measurement unit 16. Alternatively, the amount of supply may be adjusted using data on the mounting status measured in advance. In addition, a first resin R1 for a workpiece without electronic components P (i.e., a dummy workpiece) may be prepared. After that, the holding tool 78, while holding the first resin R1, is picked up by the second loader hand 71 and transported to the second resin supply unit 40.

[0072] Next, the second resin R2 is supplied (S40).

[0073] Specifically, the first resin R1, transported by the second loader hand 71, is delivered to the second resin supply unit 41. Then, as shown in Figure 6, a resin guard 44 is placed on the first resin R1, and the second resin R2 is supplied. At this time, the amount of second resin supplied is adjusted based on the mounting status obtained by the workpiece mounting status measurement unit 16. As an indicator of the mounting status at this time, the amount of resin required for one resin encapsulation may be calculated from the number of chips mounted on the workpiece and the chip stacking height, and the amount of second resin R2 supplied may be determined.

[0074] Next, the first resin R1 and the second resin R2 are fused together (S50).

[0075] Specifically, the first resin R1 and the second resin R2 are heated by the resin heater 80. The resin heater 80 may also be used to heat the second resin R2 from above. The heating temperature of the resin should preferably be 90°C or lower. After heating the resin, the resin guard 44 is removed as shown in Figure 7. In this embodiment, an example in which the first resin R1 and the second resin R2 are fused in S50 has been described, but the process is not limited to this, and the transport process described later may be performed without necessarily fusing the resins.

[0076] Next, the first resin R1 and the second resin R2 are transported to the resin sealing mold 21 by the second loader hand 71 (S60).

[0077] Specifically, as shown in Figure 8, the first resin R1 and the second resin R2 are transported to the resin sealing mold 21 while placed on the second loader hand 71.

[0078] Next, the first resin R1 and the second resin R2 are molded (S70).

[0079] Specifically, as shown in Figure 9, the resin sealing mold 21 is clamped, and the first resin R1 and the second resin R2 are heated under pressure by the upper mold 22 and the lower mold 23. Once the first resin R1 and the second resin R2 have hardened, the mold is opened.

[0080] As described above, the resin encapsulation method described in this embodiment allows for adjustment of the amount of resin material depending on the workpiece mounting conditions. Therefore, it is possible to provide a resin encapsulation method that can supply the appropriate amount of resin to each workpiece while eliminating waste of supplied resin.

[0081] [Second Embodiment] <Resin encapsulation device> Next, the structure of the resin encapsulation mold 121 according to the second embodiment will be described with reference to Figures 10 to 11.

[0082] In this embodiment, unlike the first embodiment, a cavity 125 is provided on the lower mold 123 side. The resin encapsulation mold 21 is a pair of openable and closable molds that mold by filling the internal cavity 125 with a first resin R1 and a second resin R2. The resin encapsulation mold 121 comprises an upper mold 122 and a lower mold 123. The surface of the lower mold 123 facing the upper mold 122 is flat, and a cavity 125 is formed on the surface of the upper mold 122 facing the lower mold 123. That is, the resin encapsulation mold 121 is a compression molding mold with a so-called lower cavity movable structure. The cavity 125 is a recess that opens toward the lower mold 123 and corresponds to an example of a "cavity recess" according to the present invention.

[0083] The upper mold 122 comprises an upper plate 122a and a cavity plate 122b. The cavity plate 122b is fixedly assembled to the lower surface (the surface on the lower mold 123 side) of the upper plate 122a. The upper mold 122 is provided with a suction hole 122c that penetrates the upper plate 122a and the cavity plate 122b. The suction hole 122c opens to the lower surface of the cavity plate 122b. The suction hole 122c is a suction hole for adsorbing the workpiece W set in the upper mold 122.

[0084] The lower mold 123 comprises a lower plate 123a, a cavity piece 123b, a clamper 123c, and a biasing member 123d. The cavity piece 123b is fixedly assembled to the upper surface (the surface on the upper mold 122 side) of the lower plate 123a. The clamper 123c is configured in a frame shape to surround the cavity piece 123b. The clamper 123c is assembled to be vertically movable relative to the lower plate 123a via the biasing member 123d. The cavity piece 123b constitutes the bottom surface of the cavity 125, and the clamper 123c constitutes the side surface of the cavity 125. The lower mold 123 is provided with suction holes 123e and 123f that pass through the clamper 123c, and a suction hole 123g that passes through the lower plate 123a and the cavity piece 123b. Suction hole 123e opens on the upper surface of clamper 123c. Suction hole 123f opens on the inner surface of clamper 123c facing the cavity piece 123b. A sealing member is inserted below suction hole 123f (not shown). Suction hole 123g opens on the upper surface of cavity piece 123b, i.e., the bottom surface of cavity 125. Suction holes 123e, 123f, and 123g are suction holes for adsorbing the film F set in the lower mold 123.

[0085] It is preferable that the first resin R1 has better release properties than the second resin R2. In this case, the second loader hand 71 transports the second resin on top of the first resin to the resin sealing mold 21. Then, the first resin R1 is pressed and placed in the recess of the cavity 25. According to this embodiment, the high release properties make it easy to remove the resin from the film F after molding.

[0086] By using such a resin encapsulation mold, it becomes possible to perform compression molding of a lower cavity movable structure having a cavity 125 on the lower mold 123 side. Furthermore, the amount of resin material can be adjusted according to the workpiece loading situation. Therefore, it is possible to provide a resin encapsulation device that can supply an appropriate amount of resin to each workpiece while eliminating waste of supplied resin.

[0087] <Method of resin encapsulation> Next, a resin sealing method using the resin sealing mold 121 according to the second embodiment will be described with reference to Figures 10 to 11. Figures 10 to 11 are diagrams illustrating the resin sealing method according to this embodiment. In the following description, a method using a resin sealing apparatus having a cavity in the lower mold will be described. The resin sealing mold 121 of this embodiment has a cavity 125 in the lower mold 123. Therefore, unlike the first embodiment in which the workpiece W is placed on the lower mold 23, in this embodiment the workpiece W is placed on the upper mold 122.

[0088] As shown in Figure 10, the second loader hand 71 enters the resin encapsulation mold 121 while holding the first resin R1 and the second resin R2. As shown in Figure 11, the first resin R1 and the second resin R2 are set in the cavity 125 provided in the lower mold 123.

[0089] [Differentiation] A modified example different from the above embodiment will be described.

[0090] [First variation] In the above embodiment, the second resin R2 is supplied on top of the first resin R1, but the order may be reversed. That is, the first resin may be supplied on top of the second resin. Specifically, as shown in Figure 12A, the second resin R2 is supplied to the area surrounded by the holding tool 78 and the plunger 81. Next, as shown in Figure 12B, the first resin R1 is supplied on top of the second resin R2. Next, as shown in Figure 12C, the first resin R1 and the second resin R2 are heated and fused together. Next, as shown in Figure 12D, the first resin R1 is pushed up by the plunger 81 while being sucked from the top by the suction pad 82. After that, the first resin R1 and the second resin R2 are transported to the resin sealing mold 121. The suction pad 82 may be an electrostatic chuck.

[0091] [Second variation] When using a single-sheet film as the film, the first resin R1 is supplied to the area surrounded by the single-sheet film and the holding tool 78, as shown in Figure 13A. Then, the second resin R2 is supplied on top of the first resin R1, as shown in Figure 13B. In this modified example, the second resin R2 may be supplied as shown in Figure 14A, and then the first resin R1 may be supplied as shown in Figure 14B.

[0092] As described above, a resin encapsulation apparatus according to one aspect of the present invention is a compression molding type resin encapsulation apparatus for resin encapsulating electronic components of a workpiece including a substrate and electronic components, comprising a resin encapsulation mold for resin encapsulating electronic components by compression molding a resin material onto a workpiece, and a resin quantity calculation unit 79 that calculates the amount of resin material to be supplied to the workpiece on a workpiece basis based on the mounting status of electronic components on the workpiece, wherein the resin material includes a first resin and a second resin, the first resin being a sheet-like resin, and the second resin being a granular resin, powder resin, or liquid resin, and of the first and second resins, at least the supply amount of the second resin is determined on a workpiece basis based on the amount of resin calculated by the resin quantity calculation unit 79.

[0093] According to this, the amount of resin material can be adjusted according to the workpiece loading configuration. Therefore, it is possible to provide a resin sealing device that can supply the appropriate amount of resin to each workpiece while eliminating waste of supplied resin.

[0094] In the above embodiment, the second resin is a resin having the same or different properties as the first resin.

[0095] In the above embodiment, the system further comprises a first resin supply unit for supplying a first resin and a second resin supply unit for supplying a second resin, wherein the second resin supply unit is configured to supply the second resin into the opening of the guide unit on the first resin supplied by the first resin supply unit.

[0096] In the above embodiment, the resin sealing mold includes an upper mold and a lower mold, the upper mold having a cavity recess that opens toward the lower mold.

[0097] In the above embodiment, the loader hand further comprises a loader hand for transporting the resin material to a resin encapsulation mold, wherein the second resin has higher release properties than the first resin, and the loader hand is configured to position the first resin and the second resin in the cavity recess so that the second resin faces the upper mold.

[0098] In the above embodiment, the resin sealing mold includes an upper mold and a lower mold, the lower mold having a cavity recess that opens toward the upper mold.

[0099] In the above embodiment, the system further comprises a loader hand for transporting the resin material to a resin encapsulation mold, wherein the first resin has higher release properties than the second resin, and the loader hand is configured to arrange the first resin and the second resin in the cavity recess so that the first resin faces the lower mold.

[0100] In the above embodiment, the system further comprises a first resin supply unit for supplying a first resin and a second resin supply unit for supplying a second resin, wherein the second resin supply unit is configured to supply the second resin into the opening of the guide unit, and the first resin supply unit is configured to supply the first resin on the second resin.

[0101] In the above embodiment, the loader hand further comprises a loader hand for transporting resin material to a resin encapsulation mold, the loader hand having a suction pad or an electrostatic chuck.

[0102] In the above embodiment, the system further comprises a loader hand for transporting resin material to a resin encapsulation mold, wherein the loader hand is configured to transport the first resin and the second resin to the resin encapsulation mold in a fused state.

[0103] In the above embodiment, the amount of the second resin to be supplied is determined based on the difference between the amount of resin calculated by the resin amount calculation unit and the amount of the first resin to be supplied.

[0104] In the above embodiment, the supply amount of the second resin is less than the supply amount of the first resin. The supply amount of the second resin may be adjusted to be greater than or equal to the supply amount of the first resin. Also, if the number of workpieces with electronic components mounted does not reach the specified number, workpieces without electronic components (i.e., dummy workpieces) may be added, in which case the second resin will be supplied up to the maximum supply amount. Furthermore, if there is variation or a shortage in the supply amount of the first resin, the shortage or excess may be adjusted with the second resin.

[0105] Another aspect of the present invention relates to a resin encapsulation method for resin encapsulating electronic components of a workpiece including a substrate and electronic components, comprising: calculating the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis based on the mounting arrangement of electronic components on the workpiece; supplying the workpiece to a resin encapsulation mold; supplying resin material to the resin encapsulation mold; and resin encapsulating the electronic components by compression molding the resin material onto the workpiece using the resin encapsulation mold, wherein the resin material comprises a first resin and a second resin, the first resin being a sheet-like resin, and the second resin being a granular resin, powder resin, or liquid resin, and the amount of at least the second resin to be supplied is determined on a workpiece-by-workpiece basis based on the amount of resin material calculated on a workpiece-by-workpiece basis.

[0106] According to this method, the amount of resin material can be adjusted according to the workpiece loading configuration. Therefore, it is possible to provide a resin encapsulation method that can supply an appropriate amount of resin to each workpiece while eliminating waste of supplied resin.

[0107] The embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit its interpretation. The elements, arrangement, materials, conditions, shapes, and sizes of the embodiments are not limited to those exemplified and can be modified as appropriate. Furthermore, it is possible to partially substitute or combine the configurations shown in different embodiments. [Explanation of Symbols]

[0108] 1… Resin encapsulation device 10…Work supply unit 20, 30… Resin molding units 21,31…Resin sealing mold 25, 35... Cavity 27,37… Film handler 40…Second resin supply unit 44... Resin Guard 50…First resin supply unit 60...1st Loader 61...First Loader Hand 70... Second loader 71... Second Loader Hand 80... Resin heater 90…Molded product recovery unit W...work P…Electronic parts B...Base material R1...First resin R2…Second resin F... Film

Claims

1. A compression molding resin encapsulation apparatus for resin encapsulating the electronic components of a workpiece including a base material and electronic components, A resin encapsulation mold for compressing and molding a resin material onto the workpiece to resin-encapsulate the electronic component, A loader hand for transporting the resin material to the resin sealing mold, A resin quantity calculation unit calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis based on the mounting status of the electronic components in the workpiece. Equipped with, The resin sealing mold includes an upper mold and a lower mold, the upper mold having a cavity recess that opens toward the lower mold, The aforementioned resin material includes a first resin and a second resin. The first resin is a sheet-like resin, The second resin is a granular resin, a powdered resin, or a liquid resin. Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the amount of resin calculated by the resin amount calculation unit. The loader hand is configured to arrange the first resin and the second resin in the cavity recess so that the second resin faces the upper mold.

2. A compression molding resin encapsulation apparatus for resin encapsulating the electronic components of a workpiece including a base material and electronic components, A resin encapsulation mold for compressing and molding a resin material onto the workpiece to resin-encapsulate the electronic component, A loader hand for transporting the resin material to the resin sealing mold, A resin quantity calculation unit calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis based on the mounting status of the electronic components in the workpiece. Equipped with, The resin sealing mold includes an upper mold and a lower mold, and the upper mold faces the lower mold. It has an opening cavity recess, The aforementioned resin material includes a first resin and a second resin. The first resin is a sheet-like resin, The second resin is a granular resin, a powdered resin, or a liquid resin. Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the amount of resin calculated by the resin amount calculation unit. The loader hand is configured to arrange the first resin and the second resin in the cavity recess so that the first resin faces the upper mold.

3. A first resin supply unit that supplies the first resin, A second resin supply unit that supplies the second resin and Furthermore, The second resin supply unit is configured to supply the second resin into the opening of the guide unit on the first resin supplied by the first resin supply unit. The resin encapsulation apparatus according to claim 1.

4. A compression molding resin encapsulation apparatus for resin encapsulating the electronic components of a workpiece including a base material and electronic components, A resin encapsulation mold for compressing and molding a resin material onto the workpiece to resin-encapsulate the electronic component, A loader hand for transporting the resin material to the resin sealing mold, A resin quantity calculation unit calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis based on the mounting status of the electronic components in the workpiece. Equipped with, The resin sealing mold includes an upper mold and a lower mold, the lower mold having a cavity recess that opens toward the upper mold, The aforementioned resin material includes a first resin and a second resin. The first resin is a sheet-like resin, The second resin is a granular resin, a powdered resin, or a liquid resin. Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the amount of resin calculated by the resin amount calculation unit. The loader hand is configured to arrange the first resin and the second resin in the cavity recess so that the first resin faces the lower mold, and the loader hand is configured to do so.

5. A compression molding resin encapsulation apparatus for resin encapsulating the electronic components of a workpiece including a base material and electronic components, A resin encapsulation mold for compressing and molding a resin material onto the workpiece to resin-encapsulate the electronic component, A loader hand for transporting the resin material to the resin sealing mold, A resin quantity calculation unit calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis based on the mounting status of the electronic components in the workpiece. Equipped with, The resin sealing mold includes an upper mold and a lower mold, the lower mold having a cavity recess that opens toward the upper mold, The aforementioned resin material includes a first resin and a second resin. The first resin is a sheet-like resin, The second resin is a granular resin, a powdered resin, or a liquid resin. Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the amount of resin calculated by the resin amount calculation unit. The loader hand is configured to arrange the first resin and the second resin in the cavity recess so that the second resin faces the lower mold, in a resin encapsulation apparatus.

6. The loader hand has a suction pad or an electrostatic chuck. A resin encapsulation apparatus according to any one of claims 1 to 5.

7. The loader hand is configured to transport the first resin and the second resin to the resin sealing mold while the first resin and the second resin are fused together. A resin encapsulation apparatus according to any one of claims 1 to 5.

8. The amount of the second resin to be supplied is determined based on the difference between the amount of resin calculated by the resin amount calculation unit and the amount of the first resin to be supplied. A resin encapsulation apparatus according to any one of claims 1 to 5.

9. The supply amount of the second resin is less than the supply amount of the first resin. A resin encapsulation apparatus according to any one of claims 1 to 5.

10. A compression molding resin encapsulation method for a workpiece including a base material and electronic components, wherein the electronic components are resin-encapsulated, Based on the mounting arrangement of the electronic components in the workpiece, the amount of resin material to be supplied to the workpiece is calculated on a per-workpiece basis. To supply the aforementioned workpiece to a resin sealing mold, Supplying the resin material to the resin encapsulation mold, and The resin material is compressed and molded onto the workpiece using the resin encapsulation mold to resin-encapsulate the electronic component. Includes, The resin sealing mold includes an upper mold and a lower mold, the upper mold having a cavity recess that opens toward the lower mold, The resin material comprises a first resin and a second resin, wherein the first resin is a sheet-like resin, and the second resin is a granular resin, a powdered resin, or a liquid resin. Of the first resin and the second resin, the supply amount of at least the second resin is determined on a per-workpiece basis based on the amount of the resin material calculated on a per-workpiece basis. A resin sealing method comprising a loader hand that transports the resin material to the resin sealing mold, wherein the first resin and the second resin are arranged in the cavity recess so that the second resin faces the upper mold.

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