Cold Plate

Abstract

To provide a cold plate which can easily form a refrigerant flow passage including both a high-temperature flow passage and a low-temperature flow passage.SOLUTION: A cold plate comprises: a metal-made base plate having a base part; a resin cover having an outer wall part joined to the base part; and a housing having an internal space surrounded by the base part and the outer wall part, a flow-in hole which communicates with the internal space and into which a refrigerant flows, and a flow-out hole which communicates with the internal space and from which the refrigerant flows out. The base plate has a heat exchange part located in the internal space and transmitting heat received from a heat generation part to the refrigerant. The resin cover has a low-temperature flow passage which is located in the internal space and in which the refrigerant before receiving the heat from the heat exchange part flows, and a high-temperature flow passage which is located in the internal space, in which the refrigerant after receiving the heat from the heat exchange part flows, and which is not opened in the low-temperature flow passage.SELECTED DRAWING: Figure 1

Description

Technical Field

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[0001] The present invention relates to a cold plate.

Background Art

[0002] Conventionally, a metal cold plate for cooling a heating element by a refrigerant flowing through the internal space of a housing has been known (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Due to the increasing heat generation density caused by the high integration of electronic components in recent years, higher cooling performance is required for cold plates. In response to this problem, cold plates with enhanced cooling performance by adopting so-called jet cooling or two-phase flow cooling have been proposed. For example, Patent Document 1 discloses a cold plate with a two-phase flow cooling method. Cold plates with a jet cooling method or a two-phase flow cooling method generally include a low-temperature flow path through which the refrigerant flows before receiving the heat of the heating element, and a high-temperature flow path through which the refrigerant flows after receiving the heat of the heating element.

[0005] However, when the cold plate is made of metal (for example, Patent Document 1), it may not be easy to form a complex refrigerant flow path including a high-temperature flow path and a low-temperature flow path.

[0006] The present invention has been made in consideration of such circumstances, and an object thereof is to provide a cold plate capable of easily forming a refrigerant flow path including both a high-temperature flow path and a low-temperature flow path.

Means for Solving the Problems

[0007] To solve the above problems, a cold plate according to embodiment 1 of the present invention comprises a housing having a metal base plate having a base and a resin cover having an outer wall joined to the base, the housing having an internal space surrounded by the base and the outer wall, an inlet hole through which a refrigerant flows in communicating with the internal space, and an outlet hole through which the refrigerant flows out communicating with the internal space, the base plate having a heat exchange section located in the internal space that transfers heat received from a heating element to the refrigerant, the resin cover having a low-temperature flow path located in the internal space through which the refrigerant flows before receiving heat from the heat exchange section, and a high-temperature flow path located in the internal space through which the refrigerant flows after receiving heat from the heat exchange section and which does not open to the low-temperature flow path.

[0008] According to embodiment 1 of the present invention, since the low-temperature channel and the high-temperature channel are provided in the resin cover, the channel can be formed more easily compared to, for example, the case where these channels are formed from metal.

[0009] Furthermore, in embodiment 2 of the present invention, in the cold plate of embodiment 1, the resin cover has a partition wall portion that separates the low-temperature flow path and the high-temperature flow path, and the partition wall portion is joined to the base plate.

[0010] Furthermore, in embodiment 3 of the present invention, in the cold plate of embodiment 2, the partition wall portion is joined to the heat exchange portion.

[0011] Furthermore, in embodiment 4 of the present invention, in any one of embodiments 1 to 3 of the cold plate, the portion where the low-temperature flow path opens to the heat exchange section and the portion where the high-temperature flow path opens to the heat exchange section are at different positions in a second direction that intersects the first direction in which the high-temperature flow path extends, and the heat exchange section has a plurality of fins extending in the second direction.

[0012] Furthermore, in embodiment 5 of the present invention, in any one of embodiments 1 to 4, the outer wall portion, the low-temperature channel, and the high-temperature channel are integrally formed in the cold plate.

[0013] Furthermore, in embodiment 6 of the present invention, in any one of embodiments 1 to 5 of the cold plate, the high-temperature channel has a shape that gradually widens as it approaches the outflow hole. [Effects of the Invention]

[0014] According to the above aspects of the present invention, a cold plate is provided that can easily form a refrigerant flow path including both a high-temperature flow path and a low-temperature flow path. [Brief explanation of the drawing]

[0015] [Figure 1] This is a perspective view showing a cold plate according to the first embodiment of the present invention. [Figure 2] This is an exploded view showing a cold plate according to the first embodiment of the present invention. [Figure 3] This is a cross-sectional view along the line III-III shown in Figure 1. [Figure 4] This is a cross-sectional view along the line IV-IV shown in Figure 1. [Figure 5] This figure shows an enlarged view of region A shown in Figure 3. [Figure 6] This is a partially broken diagram showing a cold plate according to the first embodiment of the present invention. [Figure 7] This is an exploded view showing a cold plate according to a second embodiment of the present invention. [Figure 8] This is a perspective view showing a resin cover according to a second embodiment of the present invention. [Figure 9] This is a cross-sectional view including the entrance recess along the IX-IX line shown in Figure 7. [Figure 10] This is a cross-sectional view including the exit recess along line XX shown in Figure 7. [Figure 11] This is a perspective view showing a resin cover according to a modified example of the second embodiment of the present invention.

Best Mode for Carrying Out the Invention

[0016] (First Embodiment) Hereinafter, the cold plate according to the first embodiment of the present invention will be described based on the drawings.

[0017] As shown in FIGS. 1 and 2, the cold plate 100 according to the present embodiment includes a flat housing 1 having a metal base plate 10 and a resin cover 20. Further, as shown in FIGS. 2 to 4, the housing 1 is formed with an internal space S, an inflow hole H1 through which a refrigerant flows into the internal space S, and an outflow hole H2 through which the refrigerant flows out of the internal space S.

[0018] <Direction Definition> Here, in the present embodiment, the thickness direction of the cold plate 100 is simply referred to as the thickness direction Z. The thickness direction Z is also the direction in which the base plate 10 and the resin cover 20 face each other. Looking from the thickness direction Z is referred to as a plan view. Also, one direction intersecting (for example, orthogonal) to the thickness direction Z is referred to as the first direction X. Also, a direction intersecting (for example, orthogonal) to both the thickness direction Z and the first direction X is referred to as the second direction Y. Also, along the thickness direction Z, the direction from the base plate 10 toward the resin cover 20 is referred to as the +X direction or the upward direction. The direction opposite to the +Z direction is referred to as the -Z direction or the downward direction. One direction in the first direction X is referred to as the +X direction. The direction opposite to the +X direction is referred to as the -X direction. One direction in the second direction Y is referred to as the +Y direction. The direction opposite to the +Y direction is referred to as the -Y direction.

[0019] As the material of the base plate 10, metals such as copper, copper alloy, aluminum, and aluminum alloy can be preferably used. As shown in FIGS. 2 to 4, the base plate 10 according to the present embodiment has a plate-shaped base portion 11 and a heat exchange portion 12.

[0020] As shown in Figures 3 and 4, the base 11 has a first surface 11a facing upward and a second surface 11b located on the opposite side of the first surface 11a and facing downward. The heat exchange section 12 is formed on the first surface 11a. The base 11 and the heat exchange section 12 may be formed integrally or as separate parts. A heating element or heat transfer member (not shown) may come into contact with the second surface 11b.

[0021] As shown in Figures 2 to 4, the heat exchange section 12 according to this embodiment has a plurality of fins 13 extending in the second direction Y. Each fin 13 has a plate-like shape extending in the second direction Y and the thickness direction Z. Each fin 13 has an upper end surface 13a facing upward. The heat exchange section 12 has the role of transferring heat received from a heat-generating element (not shown) to the refrigerant. By having a plurality of fins 13 in the heat exchange section 12, the contact area between the heat exchange section 12 and the refrigerant is increased, improving the heat conduction efficiency.

[0022] As shown in Figure 2, a fitting groove 11c is formed on the first surface 11a of the base portion 11 according to this embodiment. In plan view, the fitting groove 11c has an annular shape that surrounds the heat exchange portion 12.

[0023] A hydrophobic resin can be suitably used as the material for the resin cover 20. Examples of thermoplastic crystalline plastics that can be used as the resin for the resin cover 20 include polyphenylene sulfide (PPS), polyamide, polypropylene, polyethylene terephthalate, polyetheretherketone (PEEK), and polyacetal (POM). The thermal conductivity of the resin cover 20 is lower than that of the metal base plate 10.

[0024] As shown in Figures 1 to 4, the resin cover 20 according to this embodiment has two components, including a plate-shaped top plate portion 20A and a main component 20B. The top plate portion 20A and the main component 20B are joined to each other by, for example, heat fusion or ultrasonic bonding.

[0025] As shown in Figures 3 and 4, the main member 20B according to this embodiment has a first recess 21 that is recessed downward from the upper surface of the main member 20B, and a second recess 22 that is recessed upward from the lower surface of the main member 20B. The first recess 21 and the second recess 22 are formed over the entire main member 20B, excluding the peripheral edge in a plan view (see also Figure 2).

[0026] The first recess 21 and the communication hole 25a (described later) function as a low-temperature flow path P1 through which the refrigerant flows before receiving heat from the heat exchange section 12. As shown in Figure 2, an inlet hole H1 opens in the first recess 21. As shown in Figures 3 and 4, the heat exchange section 12 is housed in the second recess 22. As shown in Figure 4, the dimension of the second recess 22 in the first direction X is larger than the dimension of the heat exchange section 12 in the first direction X. As a result, a gap in the first direction X (hereinafter referred to as the confluence space S2) is provided between the second recess 22 and the heat exchange section 12. An outlet hole H2 opens in the confluence space S2.

[0027] Hereinafter, the portion of the resin cover 20 in which recesses 21 and 22 are not formed in a plan view (the peripheral edge in a plan view) will be referred to as the peripheral wall portion 24 (see also Figure 2). The peripheral wall portion 24 has a cylindrical shape. The shape of the peripheral wall portion 24 corresponds to the shape of the fitting groove 11c formed in the base portion 11. The peripheral wall portion 24 is joined to the base portion 11 while fitted into the fitting groove 11c. Details of the joining of the peripheral wall portion 24 and the base portion 11 will be described later.

[0028] Furthermore, as shown in Figures 3 and 4, the portion of the resin cover 20 located between the first recess 21 and the second recess 22 in the thickness direction Z is referred to as the closure portion 25. The closure portion 25 closes the inside of the cylindrical peripheral wall portion 24 so as to separate the first recess 21 and the second recess 22 in the thickness direction Z. The closure portion 25 is located in the central part of the peripheral wall portion 24 in the thickness direction Z. In this embodiment, the peripheral wall portion 24 and the closure portion 25 are formed integrally. The closure portion 25 is joined to the heat exchange portion 12. Details of the joining of the closure portion 25 and the heat exchange portion 12 will be described later.

[0029] The closure portion 25 has a plurality of communication holes 25a that open into both the first recess 21 and the second recess 22. In other words, each communication hole 25a penetrates the closure portion 25 in the thickness direction Z. The communication holes 25a (low-temperature flow path P1) open into the heat exchange portion 12. As shown in Figure 2, the communication holes 25a according to this embodiment have an elongated hole shape in which the dimension in the first direction X is longer than the dimension in the second direction Y. Furthermore, the closure portion 25 according to this embodiment has a plurality of rows R in which a plurality of communication holes 25a (four in the illustrated example) are arranged at intervals in the first direction X. The plurality of rows R are arranged at intervals in the second direction Y.

[0030] As shown in Figure 3, the closure portion 25 has a plurality of third recesses 23 that are recessed upward from the lower surface of the closure portion 25. The plurality of third recesses 23 are spaced apart in the second direction Y. Also, as shown in Figure 4, the third recesses 23 extend in the first direction X (see also Figure 6). More specifically, the third recesses 23 in this embodiment extend throughout the entire heat exchange portion 12 in the first direction X. The third recesses 23 function as a high-temperature flow path P2 through which the refrigerant, after receiving heat from the heat exchange portion 12, flows. The third recesses 23 (high-temperature flow path P2) open to the heat exchange portion 12.

[0031] Here, the third recess 23 (high-temperature flow path P2) does not open into the first recess 21 (low-temperature flow path P1). In other words, the third recess 23 does not penetrate the closure portion 25 in the thickness direction Z. Also, as shown in Figures 3 and 4, the third recess 23 and the communication hole 25a are at different positions in the second direction Y, and the third recess 23 does not open into the communication hole 25a. As a result, the closure portion 25 functions as a partition wall B separating the first recess 21 (low-temperature flow path P1) and the third recess 23 (high-temperature flow path P2). The partition wall B has the role of preventing the refrigerant flowing in the low-temperature flow path P1 and the refrigerant flowing in the high-temperature flow path P2 from mixing without going through the heat exchange portion 12.

[0032] As shown in Figures 3 and 4, a fitting recess 24a is formed at the upper end of the peripheral wall portion 24, opening to the inner side of the peripheral wall portion 24 (the inner side in the first direction X or second direction Y) and upward. As shown in Figure 2, the fitting recess 24a is formed around the entire circumference of the peripheral wall portion 24. In addition, a pair of support protrusions 25b projecting upward are provided at the center of the first recess 21 in a plan view. As shown in Figures 3 and 4, the top plate portion 20A is fixed to the main member 20B while fitted into the fitting recess 24a and in contact with the support protrusions 25b. More specifically, the top plate portion 20A is joined to the fitting recess 24a and the support protrusions 25b by, for example, heat fusion or ultrasonic bonding.

[0033] Hereinafter, the peripheral wall portion 24 of the main member 20B and the top plate portion 20A may be collectively referred to as the outer wall portion W of the resin cover 20. The outer wall portion W has a top-cylindrical shape. The aforementioned internal space S is the space enclosed by the top-cylindrical outer wall portion W and the plate-shaped base portion 11 of the base plate 10. As shown in Figures 3 and 4, the aforementioned heat exchange portion 12, low-temperature flow path P1, and high-temperature flow path P2 are located in the internal space S.

[0034] The details of the joining of the base plate 10 and the resin cover 20 will be described below. In this embodiment, the fitting groove 11c and the peripheral wall portion 24 (outer wall portion W) are joined by heat fusion, and the upper end surface 13a of the fin 13 and the closing portion 25 (partition wall portion B) are joined by heat fusion.

[0035] As shown in Figures 3 and 4, roughened surfaces 40 are formed on the fitting groove 11c of the base 11 and the upper end surface 13a of the fin 13 by appropriate surface treatment described later. Hereinafter, the roughened surface 40 formed on the fitting groove 11c will be referred to as the first roughened surface 40A, and the roughened surface 40 formed on the upper end surface 13a of the fin 13 will be referred to as the second roughened surface 40B. As shown in Figure 5, each roughened surface 40A and 40B has a plurality of micropores 41.

[0036] During heat fusion, the base plate 10 is heated, and the peripheral wall portion 24 and the closing portion 25 are pressed against the roughened fitting groove 11c and upper end surface 13a (i.e., the first roughened portion 40A and the second roughened portion 40B), respectively. At this time, the base plate 10 is heated to a temperature above the melting point of the resin that makes up the resin cover 20. As a result, a portion of the peripheral wall portion 24 and the closing portion 25 pressed against the base plate 10 melts and enters the micropores 41.

[0037] Then, by cooling the base plate 10 after heating, the molten resin solidifies inside the micropores 41. The solidified resin functions as an anchor, and the resin cover 20 and the base plate 10 are firmly joined at both the first roughened section 40A and the second roughened section 40B. By firmly joining the base plate 10 and the resin cover 20, the airtightness of the internal space S can be improved.

[0038] To form the roughened portions 40A and 40B, surface treatments such as laser irradiation and etching can be used on the fitting groove 11c and the upper end surface 13a. For example, multiple micropores 41 with a depth of about 10 to 100 μm may be formed in the bonding region (fitting groove 11c and upper end surface 13a) using a laser. Alternatively, multiple micropores 41 may be formed in a closed loop shape with predetermined intervals between them. The spacing between the micropores 41 may be, for example, about 500 μm in diameter. The bonding region may also be oxidized. These methods ensure a sufficient bonding surface area between the base plate 10 and the resin cover 20.

[0039] Next, we will explain the operation of the cold plate 100 configured as described above.

[0040] The cold plate 100 is a heat dissipation module that receives heat from the heat-generating element via the base plate 10 and releases the received heat to the outside. The principle of heat dissipation will be explained below.

[0041] A refrigerant is supplied to the internal space S of the cold plate 100 through the inlet hole H1. The refrigerant supplied from the inlet hole H1 flows through the first recess 21 (low-temperature flow path P1) as shown in Figures 4 and 6 (illustrated as flow F1). Subsequently, the refrigerant reaches the heat exchange section 12 through the communication hole 25a (low-temperature flow path P1) as shown in Figures 3 and 6 (illustrated as flow F2). The refrigerant that reaches the heat exchange section 12 moves along the fins 13 in the second direction Y while receiving heat from the heat exchange section 12 (illustrated as flow F3) and reaches one of the multiple third recesses 23 (high-temperature flow path P2) (illustrated as flow F4). The refrigerant that reaches the third recess 23 moves along the third recess 23 in the first direction X as shown in Figures 4 and 6 and reaches the confluence space S2 (illustrated as flow F5). The refrigerant that reaches the confluence space S2 is discharged to the outside of the cold plate 100 through the outlet hole H2. As described above, in the cold plate 100 according to this embodiment, the refrigerant flows in the order of low-temperature channel P1, heat exchange section 12, and high-temperature channel P2. Through this process, the cold plate 100 can receive heat from the heating element and release the received heat to the outside.

[0042] The cold plate 100 may be a so-called two-phase flow cooling type cold plate. That is, the cold plate 100 may be configured such that the refrigerant evaporates from liquid to gas in the heat exchange section 12. In this case, the heat-generating element can be efficiently cooled by the latent heat of vaporization of the refrigerant. In the two-phase flow cooling type cold plate 100, liquid refrigerant flows in the low-temperature flow path P1, and gaseous refrigerant flows in the high-temperature flow path P2.

[0043] Furthermore, the cold plate 100 may be a so-called jet-cooled cold plate. That is, the cold plate 100 may be configured such that the refrigerant is accelerated by the flow resistance of the communication hole 25a and ejected to the heat exchange section 12 at a high flow velocity. With this configuration as well, the heat-generating element can be efficiently cooled by the cold plate 100. In a jet-cooled cold plate 100, liquid refrigerant flows through both the low-temperature flow path P1 and the high-temperature flow path P2.

[0044] As described above, the cold plate 100 according to this embodiment comprises a housing 1 having a base plate 10 having a base portion 11, and a resin cover 20 having an outer wall portion W (top plate portion 20A and peripheral wall portion 24) joined to the base portion 11. The housing 1 has an internal space S surrounded by the base portion 11 and the outer wall portion W, an inlet H1 through which refrigerant flows in and communicates with the internal space S, and an outlet H2 through which refrigerant flows out and communicates with the internal space S. The base plate 10 has a heat exchange portion 12 located in the internal space S that transfers heat received from a heating element to the refrigerant, and the resin cover 20 has a low-temperature flow path P1 (first recess 21) located in the internal space S through which refrigerant flows before receiving heat from the heat exchange portion 12, and a high-temperature flow path P2 (third recess 23) located in the internal space S through which refrigerant flows after receiving heat from the heat exchange portion 12 and does not open to the low-temperature flow path P1.

[0045] With this configuration, since the cold plate 100 has a low-temperature channel P1 and a high-temperature channel P2, a two-phase flow cooling method or a jet cooling method can be applied to the cold plate 100. Furthermore, since the low-temperature channel P1 and the high-temperature channel P2 are provided in the resin cover 20, the formation of the channels P1 and P2 can be made easier compared to, for example, when the channels P1 and P2 are formed from metal. In addition, since the low-temperature channel P1 is made of resin, which has lower thermal conductivity than metal, when a two-phase flow cooling method is applied to the cold plate 100, it is possible to prevent the refrigerant from evaporating in the low-temperature channel P1 instead of the heat exchange section 12. Furthermore, by forming the high-temperature channel P2 from a hydrophobic resin, it is possible to prevent the refrigerant that has evaporated once in the heat exchange section 12 from adhering as a liquid to the high-temperature channel P2. This makes it possible to stabilize the cooling efficiency of the cold plate 100.

[0046] Furthermore, the resin cover 20 has a partition wall B (closing portion 25) that separates the low-temperature flow path P1 and the high-temperature flow path P2, and the partition wall B is joined to the base plate 10. This configuration allows for a stronger bond between the base plate 10 and the resin cover 20 compared to, for example, the case where only the outer wall portion W is joined to the base plate 10. In addition, by joining the partition wall B to the resin cover 20, the possibility of the refrigerant moving between the low-temperature flow path P1 and the high-temperature flow path P2 without passing through the heat exchange portion 12 can be reduced. In particular, when a two-phase flow cooling method is applied to the cold plate 100, the internal pressure of the cold plate 100 increases due to the increase in the volume of the refrigerant due to evaporation. This increases the possibility that the refrigerant will move between the low-temperature flow path P1 and the high-temperature flow path P2 without passing through the heat exchange portion 12. Therefore, a configuration in which the partition wall B is joined to the base plate 10 to prevent the movement of refrigerant between the flow paths P1 and P2 is preferred.

[0047] Furthermore, partition wall B is joined to the heat exchange section 12. More specifically, partition wall B is joined to a plurality of fins 13. This configuration allows the heat exchange section 12 to be suitably utilized as a target for joining partition wall B.

[0048] Furthermore, the portion where the low-temperature flow path P1 opens to the heat exchange section 12 (third recess 23) and the portion where the high-temperature flow path P2 opens to the heat exchange section 12 (communication hole 25a) are located at different positions in the second direction Y, which intersects the first direction X from which the high-temperature flow path P2 extends. The heat exchange section 12 has a plurality of fins 13 extending in the second direction Y. With this configuration, the refrigerant can be guided from the low-temperature flow path P1 to the high-temperature flow path P2 using the fins 13.

[0049] (Second Embodiment) Next, a second embodiment will be described, but its basic configuration is the same as that of the first embodiment. Therefore, the same reference numerals are used for similar components, and their descriptions are omitted; only the differences will be described.

[0050] As shown in Figure 7, the cold plate 200 according to this embodiment has a resin cover 50 with a different shape from the resin cover 20 according to the first embodiment. Unlike the resin cover 20 according to the first embodiment, the resin cover 50 according to this embodiment is formed from a single integrated component.

[0051] Specifically, as shown in Figure 8, the resin cover 50 according to this embodiment has a top plate portion 51, a peripheral wall portion 52, and a meandering wall portion 53. The top plate portion 51, the peripheral wall portion 52, and the meandering wall portion 53 are integrally formed with respect to each other. As shown in Figures 7 to 10, the top plate portion 51 and the peripheral wall portion 52 constitute a top-cylindrical outer wall portion W, similar to the top plate portion 20A and peripheral wall portion 24 according to the first embodiment. The peripheral wall portion 52 (outer wall portion W) is joined to the fitting groove 11c of the base portion 11, similar to the first embodiment.

[0052] As shown in Figures 9 and 10, the meandering wall portion 53 protrudes downward from the top plate portion 51. The meandering wall portion 53 is located in the internal space S enclosed by the outer wall portion W (top plate portion 51 and peripheral wall portion 52) and the base portion 11 of the base plate 10. As shown in Figure 8, the meandering wall portion 53 is located in the center of the meandering wall portion 53 in a plan view.

[0053] The dimension of the meandering wall section 53 in the first direction X is smaller than the inner diameter of the outer wall section W in the first direction X. As a result, there are two gaps in the first direction X between the meandering wall section 53 and the outer wall section W. These two gaps are located on both sides of the meandering wall section 53 in the first direction X. An inlet hole H1 opens into one of the two gaps (hereinafter referred to as the branching space S1). An outlet hole H2 opens into the other of the two gaps (hereinafter referred to as the confluence space S2).

[0054] As shown in Figure 8, the meandering wall section 53 has a wave-like shape that meanders in the first direction X and extends in the second direction Y. As a result, the meandering wall section 53 has a plurality of inlet recesses 54 that open into the branching space S1 and a plurality of outlet recesses 55 that open into the confluence space S2. The plurality of inlet recesses 54 and the plurality of outlet recesses 55 are arranged alternately in the second direction Y. Both ends of the meandering wall section 53 in the second direction Y are connected to the outer wall section W.

[0055] As shown in Figure 9, the inlet recess 54 does not open into the confluence space S2. As shown in Figure 10, the outlet recess 55 does not open into the branch space S1. In this embodiment, the inlet recess 54 functions as a low-temperature flow path P1, and the outlet recess 55 functions as a high-temperature flow path P2. The meandering wall 53 functions as a partition wall B separating the low-temperature flow path P1 (inlet recess 54) and the high-temperature flow path P2 (outlet recess 55). The meandering wall 53, which is partition wall B, is joined to the heat exchange section 12 (upper end surface 13a of the fin 13) located in the internal space S. The inlet recess 54 and the outlet recess 55 open into the heat exchange section 12.

[0056] The cold plate 200, configured as described above, functions as a heat dissipation module that receives heat from the heating element via the base plate 10 and releases the received heat to the outside, similar to the cold plate 100 according to the first embodiment. The principle of heat dissipation will be explained below.

[0057] As shown in Figure 9, the refrigerant supplied from the inlet hole H1 branches out from the branching space S1 into a plurality of inlet recesses 54 (low-temperature flow paths P1), and then flows in a first direction X along the inlet recesses 54 (low-temperature flow paths P1) (shown as flow F6). Subsequently, the refrigerant is blocked at the tip 54a of the inlet recess 54 and moves to the heat exchange section 12 (shown as flow F7). The refrigerant that reaches the heat exchange section 12 moves in a second direction Y along the fins 13 while receiving heat from the heat exchange section 12, and as shown in Figure 10, reaches one of the plurality of outlet recesses 55 (high-temperature flow paths P2) (shown as flow F8). The refrigerant that reaches the outlet recess 55 moves in a first direction X along the outlet recess 55 and reaches the confluence space S2 (shown as flow F9). The refrigerant that reaches the confluence space S2 is discharged to the outside of the cold plate 200 through the outlet hole H2. As described above, in the cold plate 200 according to this embodiment, the refrigerant flows in the order of low-temperature channel P1, heat exchange section 12, and high-temperature channel P2. Through this process, the cold plate 200 can receive heat from the heat-generating element and release the received heat to the outside.

[0058] As shown in Figure 9, the tip 54a of the inlet recess 54 may have an arc shape in a cross-section intersecting the second direction Y. This configuration promotes the flow of refrigerant from the inlet recess 54 (low-temperature flow path P1) to the heat exchange section 12. Similarly, the tip 55a of the outlet recess 55 may have an arc shape in a cross-section intersecting the second direction Y (see Figure 10). This configuration suppresses the accumulation of refrigerant at the tip 55a.

[0059] As described above, the cold plate 200 according to this embodiment, like the cold plate 100 according to the first embodiment, has a resin cover 50 that includes a low-temperature channel P1 and a high-temperature channel P2. This configuration makes it easier to form the channels P1 and P2 compared to, for example, the case where the channels P1 and P2 are formed from metal.

[0060] Furthermore, in the cold plate 200 according to this embodiment, the outer wall W, the low-temperature channel P1, and the high-temperature channel P2 are integrally formed. This configuration makes it easier to manufacture the resin cover 50 compared to, for example, the case where the outer wall W, the low-temperature channel P1, and the high-temperature channel P2 are formed separately.

[0061] The technical scope of the present invention is not limited to the embodiments described above, and various modifications can be made without departing from the spirit of the invention.

[0062] Figure 11 shows a modified example of the resin cover 50 according to the second embodiment. As shown in Figure 11, the width (dimension in the second direction Y) of the outlet recess 55 (high-temperature flow path P2) does not have to be constant in the first direction X. In this modified example, the outlet recess 55 (high-temperature flow path P2) has a shape that gradually widens as it approaches the outlet hole H2. With this configuration, the refrigerant that reaches the outlet recess 55 (high-temperature flow path P2) can easily flow toward the outlet hole H2. This makes it possible to further improve the cooling efficiency of the cold plate 200.

[0063] Furthermore, the heat exchange section 12 does not necessarily have fins 13. The configuration of the heat exchange section 12 can be changed as appropriate, as long as it is possible to transfer the heat received from the heat-generating element to the refrigerant.

[0064] Furthermore, depending on the position and shape of the partition wall B, the partition wall B may be joined to a part of the base plate 10 other than the heat exchange section 12.

[0065] Furthermore, the partition wall B does not need to be joined to the base plate 10 if it is possible to suppress the movement of the refrigerant between the low-temperature channel P1 and the high-temperature channel P2.

[0066] Furthermore, without departing from the spirit of the present invention, the components in the above-described embodiments may be replaced with well-known components as appropriate, and the above-described embodiments and modifications may be combined as appropriate. [Explanation of symbols]

[0067] 100, 200...Cold plate 1...Housing 10...Base plate 11...Base 12...Heat exchange section 13...Fin 20, 50...Resin cover W...Outer wall B...Partition wall H1...Inlet H2...Outlet P1...Low temperature flow path P2...High temperature flow path

Claims

1. A cold plate, The housing comprises a metal base plate having a base portion and a resin cover having an outer wall portion joined to the base portion, The housing has an internal space enclosed by the base and the outer wall, an inlet for refrigerant to flow into the internal space and communicating with the internal space, and an outlet for refrigerant to flow out of the internal space. The base plate has a heat exchange section located in the internal space that transfers heat received from the heating element to the refrigerant. The resin cover has a low-temperature channel through which the refrigerant flows before it receives heat from the heat exchanger, located in the internal space, and a high-temperature channel through which the refrigerant flows after it has received heat from the heat exchanger, and which does not open to the low-temperature channel. In the thickness direction of the cold plate, the low-temperature channel and the high-temperature channel overlap. Cold plate.

2. The resin cover has a partition wall that separates the low-temperature channel and the high-temperature channel. The partition wall is joined to the base plate. The cold plate according to claim 1.

3. The partition wall is joined to the heat exchange section. The cold plate according to claim 2.

4. The portion where the low-temperature channel opens to the heat exchange section and the portion where the high-temperature channel opens to the heat exchange section are located at different positions in a second direction that intersects the first direction in which the high-temperature channel extends. The heat exchange section has a plurality of fins extending in the second direction. A cold plate according to any one of claims 1 to 3.

5. The outer wall portion, the low-temperature channel, and the high-temperature channel are formed integrally. A cold plate according to any one of claims 1 to 3.

6. The high-temperature channel has a shape that gradually widens as it approaches the outflow hole. A cold plate according to any one of claims 1 to 3.

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