Display devices and tiled display devices

Abstract

To provide a display device and a tiled display device.SOLUTION: A display device and a tilted display device can be provided. The display device and the tilted display device comprise: a first substrate including a display area and a non-display area surrounding the display area; a light emitting device provided in the display area on the first substrate; a first pad part provided in the non-display area on an upper surface of the first substrate and arranged in one side edge of the first substrate; a second substrate provided on a lower surface of the first substrate; a second pad part provided in the non-display area on a lower surface of the second substrate and arranged in one side edge of the second substrate; a side surface link line electrically connecting the first pad part and the second pad part; a side surface coating layer arranged so as to cover the side surface link line; a side surface protection layer arranged so as to cover at least a part of the side surface coating layer; and a side surface sealing layer arranged so as to cover at least a part of the side surface protection layer.SELECTED DRAWING: Figure 1

Description

Technical Field

[0007]

[0001] Embodiments of the present disclosure relate to a display device and a tiled display device.

Background Art

[0002] Recently, with the development of multimedia, the importance of display devices has been increasing. Accordingly, display devices such as liquid crystal display devices, organic light-emitting display devices, and light-emitting diode display devices have become commonly used.

[0003] Due to excellent characteristics such as being thin, light, and having low power consumption, display devices are widely used not only in portable electronic devices such as e-books, PMPs (Portable Multimedia Players), navigation devices, mobile phones, smartphones, smart watches, tablet PCs (Personal Computers), watch phones, and mobile communication terminals, but also in display screens such as TVs, notebooks, and monitors.

[0004] Recently, the use of multi-display devices that arrange display devices in a grid form to achieve a large screen has been increasing.

Summary of the Invention

Problems to be Solved by the Invention

[0005] Embodiments of the present disclosure can provide a display device and a tiled display device that can prevent electrostatic inflow to the side surface of a display module.

[0006] Embodiments of the present disclosure can provide a display device and a tiled display device that can absorb light incident on a gap between adjacent display modules so that a seam is not visible to a user.

[0007] Embodiments of this disclosure can provide a display device and a tiled display device that can prevent moisture permeation on the side surface of a display module. [Means for solving the problem]

[0008] Embodiments of the present disclosure can provide a display device including a first substrate including a display area and a non-display area surrounding the display area, a light-emitting element provided in the display area on the first substrate, a first pad portion provided in the non-display area on the upper surface of the first substrate and arranged on one side edge of the first substrate, a second substrate provided on the lower surface of the first substrate, a second pad portion provided in the non-display area on the lower surface of the second substrate and arranged on one side edge of the second substrate, a side link line electrically connecting the first pad portion and the second pad portion, a side coating layer arranged to cover the side link line, a side protective layer arranged to cover at least a portion of the side coating layer, and a side sealing layer arranged to cover at least a portion of the side protective layer.

[0009] Embodiments of the present disclosure include a plurality of display modules, each of which provides a tiled display device including a display device comprising: a first substrate including a display area and a non-display area surrounding the display area; a light-emitting element provided in the display area on the first substrate; a first pad portion provided in the non-display area on the upper surface of the first substrate and positioned on one side edge of the first substrate; a second substrate provided on the lower surface of the first substrate; a second pad portion provided in the non-display area on the lower surface of the second substrate and positioned on one side edge of the second substrate; a side link line electrically connecting the first pad portion and the second pad portion; a side coating layer positioned to cover the side link line; a side protective layer positioned to cover at least a portion of the side coating layer; and a side sealing layer positioned to cover at least a portion of the side protective layer. [Effects of the Invention]

[0010] According to embodiments of this disclosure, it is possible to provide a display device and a tiled display device that can prevent static electricity from flowing into the side of the display module.

[0011] According to embodiments of this disclosure, it is possible to provide a display device and a tiled display device that absorb light incident on the gaps between adjacent display modules so that seams are not visible to the user.

[0012] According to embodiments of this disclosure, it is possible to provide a display device and a tiled display device that can prevent moisture permeation on the side surface of the display module.

[0013] According to the embodiments of this disclosure, a low-power display device and a tiled display device can be provided by preventing static electricity inflow and moisture permeation into the display module and improving its lifespan. [Brief explanation of the drawing]

[0014] [Figure 1] This is a system configuration diagram of a display device according to an embodiment of the present disclosure. [Figure 2] This is an equivalent circuit of a subpixel in a display device according to an embodiment of the present disclosure. [Figure 3] This drawing schematically shows a tiled display device according to an embodiment of the present disclosure. [Figure 4] This is an exemplary cross-sectional view taken along line AB in Figure 3. [Figure 5] This diagram schematically shows the ESD flow of a display device according to an embodiment of the present disclosure. [Figure 6] This is an exemplary cross-sectional view of a partial configuration of a display device according to an embodiment of the present disclosure. [Figure 7] This is another exemplary cross-sectional view of a partial configuration of a display device according to an embodiment of the present disclosure. [Figure 8] Similarly, this is another exemplary cross-sectional view of a part of the configuration of a display device according to an embodiment of the present disclosure. [Figure 9] Similarly, this is another exemplary cross-sectional view of a part of the configuration of a display device according to an embodiment of the present disclosure. [Figure 10] Similarly, this is another exemplary cross-sectional view of a part of the configuration of a display device according to an embodiment of the present disclosure. [Figure 11]The drawing schematically shows the manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 12] Similarly, it is a drawing schematically showing the manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 13] Similarly, it is a drawing schematically showing the manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 14] Similarly, it is a drawing schematically showing the manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 15] Similarly, it is a drawing schematically showing the manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 16] Similarly, it is a drawing schematically showing the manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 17] Similarly, it is a drawing schematically showing the manufacturing process of a display device according to an embodiment of the present disclosure.

Mode for Carrying Out the Invention

[0015] Hereinafter, some embodiments of the present embodiments will be described in detail with reference to exemplary drawings. When adding reference numerals to the components of each drawing, equal components can have equal numerals as much as possible even if they are shown on other drawings. Also, in describing the present embodiments, if it is determined that a specific description of a related known configuration or function may obscure the gist of the present embodiments, the detailed description thereof can be omitted. When terms such as "including", "having", and "performed" are used in this specification, other parts can be added as long as "only" is not used. When a component is expressed in the singular, it can include the case of including a plurality unless there is a special explicit description.

[0016] Also, in describing the components of the present embodiments, terms such as first, second, A, B, (a), (b), etc. can be used. Such terms are only for distinguishing the components from other components, and the essence, order, sequence, or number of the corresponding components are not limited by such terms.

[0017] In descriptions of the positional relationships of constituent elements, when it is stated that two or more constituent elements are “linked,” “joined,” or “connected,” it should be understood that while two or more constituent elements can be directly “linked,” “joined,” or “connected,” they can also be “linked,” “joined,” or “connected” through the “intervening” of other constituent elements. Here, other constituent elements can also be included in one or more of the two or more constituent elements that are “linked,” “joined,” or “connected” to each other.

[0018] In descriptions of temporal relationships related to constituent elements, methods of operation, or methods of production, if the temporal sequence or flow sequence is described using phrases such as "after," "following," "next," or "before," it can include cases that are not continuous unless "immediately" or "directly" is used.

[0019] On the other hand, if numerical values ​​or corresponding information (e.g., levels) for a component are mentioned, even without further explicit mention, these numerical values ​​or corresponding information may be interpreted to include a range of errors that can occur due to various factors (e.g., process factors, internal or external shocks, noise, etc.).

[0020] Various embodiments of this disclosure will be described in detail below with reference to the attached drawings.

[0021] Figure 1 is a system configuration diagram of the display device 100 according to an embodiment of the present disclosure.

[0022] Referring to Figure 1, the display device 100 according to the embodiment of this disclosure may include a display panel 110 and a drive circuit for driving the display panel 110.

[0023] The drive circuit may include a data drive circuit 120 and a gate drive circuit 130, and may further include a controller 140 that controls the data drive circuit 120 and the gate drive circuit 130.

[0024] The display panel 110 may include a substrate (SUB) and signal wiring such as a plurality of data lines (DL) and a plurality of gate lines (GL) arranged on the substrate (SUB). The display panel 110 may also include a plurality of subpixels (SP) connected to the plurality of data lines (DL) and a plurality of gate lines (GL).

[0025] The display panel 110 may include a display area (AA) where an image is displayed and a non-display area (DA) where an image is not displayed. In the display panel 110, multiple subpixels (SP) for displaying an image are arranged in the display area (AA), and in the non-display area (DA), drive circuits 120, 130, and 140 are electrically connected, or the drive circuits 120, 130, and 140 can be mounted, and pads to which integrated circuits or printed circuits are connected may also be arranged.

[0026] The data drive circuit 120 is a circuit for driving multiple data lines (DLs) and can supply data signals to multiple data lines (DLs).

[0027] The gate drive circuit 130 is a circuit for driving multiple gate lines (GLs) and can supply gate signals to multiple gate lines (GLs).

[0028] The controller 140 can supply a data control signal (DCS) to the data drive circuit 120 to control the operation timing of the data drive circuit 120, and can supply a gate control signal (GCS) to the gate drive circuit 130 to control the operation timing of the gate drive circuit 130.

[0029] The controller 140 starts scanning according to the timing of each frame, switches the input video data received from the outside to match the data signal format used by the data drive circuit 120, and supplies the converted video data (Data) to the data drive circuit 120, allowing it to control the data drive at appropriate times in accordance with the scan.

[0030] The controller 140 receives various timing signals, including vertical synchronization signals (VSYNC), horizontal synchronization signals (HSYNC), input data enable signals (DE: Data Enable), and clock signals (CLK), along with the input video data, from an external source (e.g., a host system 150).

[0031] The controller 140 receives timing signals such as a vertical synchronization signal (VSYNC), a horizontal synchronization signal (HSYNC), an input data enable signal (DE), and a clock signal (CLK) to control the data drive circuit 120 and the gate drive circuit 130, and generates various control signals (DCS, GCS) which are output to the data drive circuit 120 and the gate drive circuit 130.

[0032] For example, the controller 140 outputs various gate control signals (GCS), including a gate start pulse (GSP), a gate shift clock (GSC), and a gate output enable signal (GOE), in order to control the gate drive circuit 130.

[0033] Furthermore, the controller 140 outputs various data control signals (DCS), including a source start pulse (SSP), a source sampling clock (SSC), and a source output enable signal (SOE), in order to control the data drive circuit 120.

[0034] The controller 140 can be composed of separate components from the data drive circuit 120, or it can be integrated with the data drive circuit 120 to form an integrated circuit.

[0035] The data drive circuit 120 receives video data (Data) input from the controller 140 and drives multiple data lines (DL) by supplying data voltage to them. Here, the data drive circuit 120 is also called the source drive circuit.

[0036] Such a data-driven circuit 120 may include one or more source driver integrated circuits (SDICs).

[0037] Each source driver integrated circuit (SDIC) may include a shift register, latch circuit, digital-to-analog converter (DAC), output buffer, etc. Each source driver integrated circuit (SDIC) may also include an analog-to-digital converter (ADC) as needed.

[0038] For example, each source driver integrated circuit (SDIC) can be connected to the display panel 110 by tape-automated bonding (TAB), or by a chip-on-glass (COG) or chip-on-panel (COP) method to the bonding pad of the display panel 110, or by a chip-on-film (COF) method to the display panel 110.

[0039] The gate drive circuit 130 can output a gate signal at the turn-on level voltage or a gate signal at the turn-off level voltage under the control of the controller 140. The gate drive circuit 130 can sequentially drive multiple gate lines (GL) by sequentially supplying gate signals at the turn-on level voltage to multiple gate lines (GL).

[0040] The gate drive circuit 130 can be connected to the display panel 110 by tape automatic bonding (TAB), or to the bonding pad of the display panel 110 by chip-on-glass (COG) or chip-on-panel (COP) method, or to the display panel 110 according to the chip-on-film (COF) method. Alternatively, the gate drive circuit 130 can be formed in the non-display area (DA) of the display panel 110 in a gate-in-panel (GIP) type configuration. The gate drive circuit 130 can be placed on or connected to a substrate (SUB). That is, in the case of the GIP type, the gate drive circuit 130 can be placed in the non-display area (DA) of the substrate (SUB). In the case of chip-on-glass (COG) type, chip-on-film (COF) type, etc., the gate drive circuit 130 can be connected to the substrate (SUB).

[0041] On the other hand, at least one of the data drive circuit 120 and gate drive circuit 130 can also be placed in the display area (AA).

[0042] For example, the gate drive circuit 130 can be placed in the display area (AA). In this case, the gate drive circuit 130 can be placed across the entire display area (AA) or in only a portion of the display area (AA). The gate drive circuit 130 can be placed so as not to overlap with the subpixels (SP), or it can be placed so that it partially or entirely overlaps with the subpixels (SP).

[0043] Another example is that the data driving circuit 120 can be placed in the display area (AA). In this case, the data driving circuit 120 can be placed across the entire display area (AA) or in only a portion of the display area (AA). The data driving circuit 120 can be placed so as not to overlap with the subpixels (SP), or it can be placed so that it partially or entirely overlaps with the subpixels (SP).

[0044] When a specific gate line (GL) is selected by the gate drive circuit 130, the data drive circuit 120 can convert the video data (Data) received from the controller 140 into an analog data voltage and supply it to multiple data lines (DL).

[0045] The data drive circuit 120 can also be connected to one side of the display panel 110 (e.g., the top or bottom). Depending on the drive method, panel design, etc., the data drive circuit 120 may be connected to both sides of the display panel 110 (e.g., the top and bottom), or to two or more of the four sides of the display panel 110.

[0046] The gate drive circuit 130 can also be connected to one side of the display panel 110 (e.g., the left or right side). Depending on the drive method, panel design, etc., the gate drive circuit 130 may be connected to both sides of the display panel 110 (e.g., the left and right sides), or to two or more of the four sides of the display panel 110.

[0047] The controller 140 may be a timing controller used in typical display technology, or it may be a control device that includes a timing controller and can also perform other control functions, or it may be a control device different from the timing controller, or it may be a circuit within the control device. The controller 140 may consist of a variety of circuits and electronic components such as an IC (Integrate Circuit), FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit), or processor.

[0048] The controller 140 can be mounted on a printed circuit board, a flexible printed circuit, etc., and can be electrically connected to the data drive circuit 120 and the gate drive circuit 130 through the printed circuit board, flexible printed circuit, etc.

[0049] The controller 140 can send and receive signals with the data drive circuit 120 via one or more predetermined interfaces. For example, the interfaces may include LVDS (Low Voltage Differential Signaling) interfaces, EPI (Embedded Clock Point to Point Interface), SPI (Serial Peripheral Interface), and others.

[0050] The controller 140 may include one or more storage media such as registers.

[0051] The display device 100 according to the embodiments of this disclosure may be a display device in which the display panel 110 cannot emit light on its own. For example, the display device 100 according to the embodiments of this disclosure may be a liquid crystal display device including a backlight unit.

[0052] In contrast to the above, the display device 100 according to the embodiments of the present disclosure may be a self-emitting display device in which the display panel 110 can emit light itself. For example, the display device 100 according to the embodiments of the present disclosure may be one of the following: an organic light-emitting diode (OLED) display device, a quantum dot display, a micro light-emitting diode (Micro LED) display device, etc.

[0053] If the display device 100 according to the embodiment of this disclosure is an organic light-emitting diode display device, each subpixel (SP) may include an organic light-emitting diode (OLED) as a light-emitting element. If the display device 100 according to the embodiment of this disclosure is a quantum dot display device, each subpixel (SP) may include a light-emitting element made of a quantum dot, which is a semiconductor crystal that emits light itself. If the display device 100 according to the embodiment of this disclosure is a micro light-emitting diode display device, each subpixel (SP) may include a micro light-emitting diode (Micro Light Emitting Diode) made of an inorganic substrate that emits light itself as a light-emitting element.

[0054] Figure 2 shows the equivalent circuit of a subpixel (SP) in the display device 100 according to an embodiment of the present disclosure.

[0055] Referring to Figure 2, the display panel 110 can include a plurality of subpixels (SP) formed on a substrate (SUB).

[0056] Each of the multiple subpixels (SPs) may include a light-emitting diode (LED) as a light-emitting element, a drive transistor (DRT) for driving the LED, a scan transistor (SCT) for transmitting a data voltage (VDATA) to the first node (N1) of the drive transistor (DRT), and a storage capacitor (Cst) for maintaining a constant voltage for one frame.

[0057] The drive transistor (DRT) may include a first node (N1) to which a data voltage (VDATA) can be applied, a second node (N2) electrically connected to a light-emitting diode (LED), and a third node (N3) to which a first power supply signal (VDD) can be applied from a first power supply line (DVL). In the drive transistor (DRT), the first node (N1) is the gate node, the second node (N2) can be the source node or the drain node, and the third node (N3) can be the drain node or the source node.

[0058] Light-emitting diodes (LEDs) can also be called light-emitting diode chips (LED chips). For example, light-emitting diodes (LEDs) can also be called microlight-emitting diodes or microlight-emitting diode chips.

[0059] A light-emitting diode (LED) may include a first semiconductor layer (SEMI1), a second semiconductor layer (SEMI2), and an active layer (AL). The first semiconductor layer (SEMI1) is formed on at least one upper surface of the second semiconductor layer (SEMI2), and at least a portion of the other upper surface of the second semiconductor layer (SEMI2) can be exposed. An active layer (AL) may be interposed between the first semiconductor layer (SEMI1) and the second semiconductor layer (SEMI2). Here, the active layer (AL) may also be called the light-emitting layer. The light-emitting diode (LED) may further include a first electrode (AND) and a second electrode (CAT).

[0060] A first electrode (AND) is formed on a first semiconductor layer (SEMI1) and can be electrically connected to the first semiconductor layer (SEMI1). A second electrode (CAT) is formed on an exposed second semiconductor layer (SEMI2) and can be electrically connected to the second semiconductor layer (SEMI2). The first electrode (AND) and the second electrode (CAT) can be arranged separated by a predetermined distance.

[0061] The first semiconductor layer (SEMI1) can be composed of a p-type semiconductor layer.

[0062] The second semiconductor layer (SEMI2) can be composed of an n-type semiconductor layer.

[0063] The active layer (AL) can be a layer in which holes injected through the first semiconductor layer (SEMI1) and electrons injected through the second semiconductor layer (SEMI2) meet and emit light due to the band gap difference of the energy bands caused by the material forming the active layer (AL).

[0064] A light-emitting diode (LED) may further include an insulating film (PRT) for protecting the LED elements. The insulating film (PRT) surrounds the exposed outer surface of the LED, but may leave at least a portion of the first electrode (AND) and at least a portion of the second electrode (CAT) exposed. The insulating film (PRT) may contain an insulating material. For example, the insulating film (PRT) may be made of one selected from silicon oxide (SiOx) and silicon nitride (SiNx), or a laminated structure thereof.

[0065] On the other hand, the first electrode (AND) of the light-emitting diode (LED) can be electrically connected to the pixel electrode, and the second electrode (CAT) of the light-emitting diode (LED) can be electrically connected to the common electrode.

[0066] Pixel electrodes can be placed for each subpixel (SP) and can be electrically connected to the second node (N2) of the drive transistor (DRT) of each subpixel (SP). Common electrodes can be placed in common for multiple subpixels (SP).

[0067] The display panel 110 may further include a second power line (BVL) for supplying a second power signal (VSS) to the common electrode, and the second power line (BVL) may be electrically connected to the common electrode.

[0068] On the other hand, another example is that a light-emitting diode (LED) may also be an organic light-emitting diode (OLED) that includes an organic light-emitting layer between the first electrode (AND) and the second electrode (CAT).

[0069] A scan transistor (SCT) is connected between the first node (N1) of the drive transistor (DRT) and the corresponding data line (DL), and can control the voltage state of the first node (N1) of the drive transistor (DRT).

[0070] A scan transistor (SCT) can control the connection between the first node (N1), which is the gate node of a drive transistor (DRT), and the data lines (DL) among multiple data lines (DL) by receiving a scan signal (SCAN) supplied from the scan line (SCL), which is a type of gate line (GL).

[0071] The drain or source node of a scan transistor (SCT) can be electrically connected to the corresponding data line (DL). The source or drain node of a scan transistor (SCT) can be electrically connected to the first node (N1) of a drive transistor (DRT). The gate node of a scan transistor (SCT) can be electrically connected to a scan line (SCL) to receive a scan signal (SCAN).

[0072] A scan transistor (SCT) is turned on by a scan signal (SCAN) of the turn-on level voltage, and can transmit the data voltage (VDATA) supplied from the corresponding data line (DL) to the first node (N1) of the drive transistor (DRT).

[0073] A scan transistor (SCT) is turned on by a scan signal (SCAN) of the turn-on level voltage and turned off by a scan signal (SCAN) of the turn-off level voltage. Here, if the scan transistor (SCT) is of type n, the turn-on level voltage may be a high level voltage and the turn-off level voltage may be a low level voltage. If the scan transistor (SCT) is of type p, the turn-on level voltage may be a low level voltage and the turn-off level voltage may be a high level voltage.

[0074] A storage capacitor (Cst) can be electrically connected between the first node (N1) and the second node (N2) of the drive transistor (DRT). The storage capacitor (Cst) may be an external capacitor intentionally designed outside the drive transistor (DRT), rather than a parasitic capacitor (e.g., Cgs, Cgd) which is an internal capacitor that can exist between the first node (N1) and the second node (N2) of the drive transistor (DRT).

[0075] The drive transistor (DRT) and the scan transistor (SCT) can each be either an n-type transistor or a p-type transistor.

[0076] As shown in Figure 2, each subpixel (SP) may have a 2T (Transistor) 1C (Capacitor) structure containing two transistors (DRT, SCT) and one capacitor (Cst), and may also contain one or more transistors or one or more capacitors, depending on the circumstances.

[0077] The display device 100 may have a top-emitting structure in which light is emitted in the opposite direction from the substrate (SUB) of the display panel 110.

[0078] Figure 3 is a schematic diagram showing a tiled display device according to an embodiment of the present disclosure.

[0079] Referring to Figure 3, a tiled display device according to one embodiment of the present disclosure may include a plurality of display modules (DM1, DM2, DM3, DM4).

[0080] Each of the multiple display modules (DM1, DM2, DM3, DM4) can display an individual image or display a single image in a divided format. Each of these multiple display modules (DM1, DM2, DM3, DM4) includes the display device 100 according to the embodiment of this disclosure shown in Figure 1, and a redundant explanation of this will be omitted.

[0081] Multiple display modules (DM1, DM2, DM3, DM4) may be tiled on a separate tiling frame so that their sides are in contact with each other. For example, multiple display modules (DM1, DM2, DM3, DM4) can be tiled in an N×M configuration to form a large multi-screen display device. For example, N may be a positive integer greater than or equal to 1, and M may be a positive integer greater than or equal to 2.

[0082] Each of the multiple display modules (DM1, DM2, DM3, DM4) may have an air bezel structure in which the display area (AA) is surrounded by air, without including a bezel area (or non-display area) surrounding the entire display area (AA) where the image is displayed. In other words, each of the multiple display modules (DM1, DM2, DM3, DM4) may have the entire first surface of the first substrate 200 formed as the display area (AA).

[0083] A tiled display device can be configured by combining multiple display modules (DM1, DM2, DM3, DM4). In this case, external foreign matter and moisture can enter through the sides of each display module. Moisture can enter in liquid or gaseous form. It can also enter in the form of water droplets or water vapor, and even in forms smaller than water vapor. Moisture can enter through the empty spaces on the sides of the display modules or directly through the side coating layer or side sealing layer. Moisture can be prevented by filling the empty spaces on the sides of the display modules or by applying a moisture-proof treatment to the side coating layer or side sealing layer. However, even in this case, there is a problem that moisture, including forms smaller than water vapor, can permeate and enter.

[0084] Figure 4 is an exemplary cross-sectional view taken along line AB in Figure 3. Specifically, Figure 4 shows a cross-sectional view of the portion where the first display module (DM1) and the third display module (DM3) are in contact.

[0085] Referring to Figure 4, the first display module (DM1) may include a first substrate 200, a first layer 210, a first pad portion 220, a light-emitting element 230, a second layer 240, a functional film layer 250, a second substrate 300, a third layer 310, a second pad portion 320, an adhesive layer 410, a side link line 420, a side coating layer 430, a side sealing layer 440, and a side protective layer 500. In this case, the remaining display modules, including the second display module (DM2), may be substantially the same in structure as the first display module (DM1), and may be configured partially differently as needed.

[0086] The first substrate 200 is a base substrate for supporting many components of the first display module (DM1), and may be an insulating substrate. The first substrate 200 can be made of glass or plastic. The first substrate 200 may also be formed of a flexible material so that it can be bent.

[0087] The first substrate 200 can have a display area (AA) and a non-display area (NA) surrounding the display area (AA) defined. The display area (AA) is the area where the image is actually displayed on the display panel 200, and light-emitting elements 230 can be placed in the display area (AA). The non-display area (NA) is the area where the image is not displayed and can be defined as the area surrounding the display area (AA).

[0088] A first layer 210 can be placed on the first substrate 200. The first layer 210 can have multiple insulating layers and multiple signal lines. Various transistors and capacitors as described above can be placed on the first layer 210.

[0089] A first pad portion 220 connected to various signal lines can be placed in the non-display area (NA) of the first substrate 200. The first pad portion 220 can be placed on one side edge of the non-display area (NA). The first pad portion 220 may be an area electrically connected to a side link line 420, which will be described later. The first pad portion 220 may be a metal layer extending from multiple signal lines.

[0090] A light-emitting element 230 and a second layer 240 surrounding the light-emitting element 230 can be arranged on the first layer 210. As mentioned above, the light-emitting element 230 may be a light-emitting diode (LED) or a micro-light-emitting diode (μLED).

[0091] The second layer 240 may include multiple planarizing layers and insulating layers.

[0092] A functional film layer 250 may be included on the second layer 240. The functional film layer 250 may include an anti-reflective layer (or anti-reflective film) to prevent reflection of external light and improve outdoor visibility and brightness ratio of images displayed on the display device. The functional film layer 250 may include a barrier layer (or barrier film) to temporarily prevent moisture or oxygen penetration. The functional film layer 250 may further include an optical path control layer (or optical path control film) to control the path of light emitted from each pixel (P) to the outside.

[0093] A second substrate 300 can be placed below the first substrate 200. The second substrate 300 is an auxiliary substrate that supports components placed below the display device and can be an insulating substrate. For example, it can be made of glass or plastic. The second substrate 300 can also be formed of a flexible material so that it can be bent. The second substrate 200 can be made of the same material as the first substrate 200.

[0094] A third layer 310 can be placed on the back of the second substrate 200. Multiple insulating layers and multiple link lines can be placed on the third layer 310.

[0095] A second pad portion 320 can be positioned on one side edge of the second substrate 200. The second pad portion 320 can be a region electrically connected to a side link line 420, which will be described later. The second pad portion 320 may be a metal layer extending from multiple link lines.

[0096] An adhesive layer 410 can be placed between the first substrate 200 and the second substrate 300. The adhesive layer 410 can bond the first substrate 200 and the second substrate 300. The adhesive layer 410 can be made of a material that can be cured through various curing methods to bond the first substrate 200 and the second substrate 200 together. The adhesive layer 2410 can be placed in a portion of the area between the first substrate 200 and the second substrate 300, or it can be placed in the entire area.

[0097] Referring to Figure 4, side link lines 420 can be arranged on the sides of the first substrate 200 and the second substrate 300. The side link line 420 can include multiple side link lines. The side link line 420 can electrically connect multiple signal lines arranged on the top surface of the first substrate 200 and multiple link lines arranged on the back surface of the second substrate 300. The side link line 420 can be arranged to cover the ends of the multiple signal lines arranged on the top surface of the first substrate 200, the sides of the first substrate 200 and the second substrate 300, and the ends of the multiple link lines arranged on the back surface of the second substrate 300. That is, the side link line 420 can be arranged to continuously cover the first pad portion 220 to which the multiple signal lines are connected, the sides of the first substrate 200 and the second substrate 300, and the second pad portion 320 to which the multiple link lines are connected.

[0098] The side link lines 420 can be made of a patterned metal layer such that the corresponding signal lines and each link line are connected to one another. In this case, the patterned metal layer can be formed by a printing method using conductive paste. For example, the side link lines 420 can be formed by a pad printing method using silver (Ag) paste, but the embodiments of this disclosure are not limited thereto.

[0099] Referring to Figure 4, the side coating layer 430 can be positioned to cover the side link line 420. The side coating layer 430 can be positioned to cover not only the side link line 420, but also one side edge and the entire side of the first substrate 200, and one side edge and the entire side of the second substrate 300. The side coating layer 430 can prevent corrosion of each link line made of conductive material and prevent electrical short circuits between the side link lines 420. In addition, the side coating layer 430 can prevent or minimize the reflection of external light by the side link line 420 and the pad of the first pad portion 220. The side coating layer 430 may contain a black ink containing at least one of carbon black, black dye, and black pigment. The side coating layer 430 can be formed by a printing method using black ink. For example, the side coating layer 430 can be formed by a pad printing method using black ink containing carbon black, but the embodiments of this disclosure are not limited thereto.

[0100] Referring to Figure 4, the side protection layer 500 can be positioned to cover the side coating layer 430. The side protection layer 500 can be positioned to cover not only the side coating layer 430, but also one side edge and the entire side of the first substrate 200, and one side edge and the entire side of the second substrate 300. The side protection layer 500 can include multiple layers. The side protection layer 500 can include a moisture-proofing material. The side protection layer 500 can include a conductive material. The side protection layer 500 can include a light-absorbing material. The side protection layer 500 can prevent static electricity from entering the side of the display module. The side protection layer 500 can absorb light incident on the gap between the contacting display modules so that the seam is not visible to the user. The side protection layer 500 can prevent moisture permeability on the side of the display module.

[0101] The moisture-blocking material may contain aromatic hydrocarbon compounds. The moisture-blocking material may contain vapor-deposited powder of aromatic hydrocarbon compounds. The moisture-blocking material may contain aromatic hydrocarbon compounds using a parylene coating method.

[0102] The aromatic hydrocarbon compound can be at least one selected from the following compounds.

[0103] [ka]

[0104] Conductive materials may include conductive particles and conductive polymers.

[0105] The conductive particles can be carbon nanotubes. The carbon nanotubes can be at least one selected from single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes.

[0106] Conductive polymers include polyfluorene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polyacetylene (PAC), poly-p-phenylenevinylene (PPV), polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polythienylenevinylene (poly(thienylene vinylene), polyaniline (PANI), poly(thiophene)), poly(p-phenylenesulfide (PPS), poly3,4-ethylenedioxythiophene (PEDOT), and polystyrene sulfonic acid (poly(styrene It can be at least one selected from the group consisting of poly(3,4-ethylenedeoxythiophene) (PEDOT:PSS), poly(3,4-ethylenedeoxythiophene)-tetramethacrylate (PEDOT-TMA), and polyfuran, doped with sulfonate (PSS).

[0107] The conductive material may include conductive particles and black rubber.

[0108] Conductive particles can be equivalent to the carbon nanotubes mentioned above.

[0109] The black rubber may include at least one of carbon black, black dye, and black pigment, and isoprene-based rubber.

[0110] The light-absorbing substance can be black ink. The black ink may contain at least one of carbon black, black dye, and black pigment.

[0111] Referring to Figure 4, the side sealing layer 440 can be positioned to cover the side protective layer 500. The side sealing layer 440 can be positioned to cover not only the side protective layer 500, but also one side edge and the entire side of the first substrate 200, and one side edge and the entire side of the second substrate 300. The side sealing layer 440 can prevent corrosion of each link line made of conductive material and electrical short circuits between the side link lines 420. In addition, the side sealing layer 440 can prevent or minimize the reflection of external light by the side link lines 420 and the pads of the first pad portion 220. The side sealing layer 440 may contain at least one of carbon black, black dye, and black pigment. The side sealing layer 440 can fill the space formed between the functional film layer 250 and the side of the display module. This allows the side sealing layer 440 to prevent foreign matter or moisture from entering the space between the substrates 200, 300 and the functional film layer 250 from the outside.

[0112] Referring to Figure 4, the side edges of the functional film layer 250 and the side edges of the side sealing layer 440 can be aligned on the same line. By aligning the side edges of the functional film layer 250 and the side sealing layer 440 on the same line, the separation formed between the display modules can be minimized, thereby minimizing the seam caused by the separation.

[0113] Figure 5 is a schematic diagram showing the ESD flow of a display device according to an embodiment of the present disclosure.

[0114] Figure 5 may be substantially identical to a portion of the display device shown in Figure 4, except that the side protective layer 500 is not positioned between the side coating layer 430 and the side sealing layer 440.

[0115] Referring to Figure 5, when static electricity is generated externally, it can flow into the thin portions of the insulating side coating layer 430 and side sealing layer 440 and be transmitted to the side link line 420. The incoming static electricity can then travel along the side link line 420, which is formed containing silver (Ag), to the various lines formed on the display panel. In this case, if the amount of static electricity flowing in exceeds the capacity of the static electricity prevention circuit placed on the display panel, a problem may occur in which the lines are damaged.

[0116] Figure 6 is an exemplary cross-sectional view of a partial configuration of a display device according to an embodiment of the present disclosure.

[0117] Referring to Figure 6, the side protection layer 500 is substantially the same as the content shown in Figure 4, except that it includes the first side protection layer 510 and the second side protection layer 520. Therefore, redundant explanations can be omitted or simplified.

[0118] Referring to Figure 6, the side protection layer 500 may include a first side protection layer 510 and a second side protection layer 520.

[0119] The first side protection layer 510 may contain a moisture-proofing material. This moisture-proofing material may be the same as the moisture-proofing material contained in the side protection layer 500 described in Figure 4.

[0120] The second side protective layer 520 may contain a conductive material. The conductive material may contain conductive particles and conductive polymers. The conductive particles and conductive polymers may be the same as those contained in the side protective layer 500 described in Figure 4.

[0121] Referring to Figure 6, the first side protection layer 510 can be positioned in contact with the side coating layer 430, the second side protection layer 510 can be positioned in contact with the first side protection layer 510, and the side sealing layer 440 can be positioned in contact with the second side protection layer 520.

[0122] The first side protective layer 510 may be a parylene coating layer. The parylene coating layer is a coating layer formed by depositing at least one parylene dimer selected from parylene-based compounds onto the substrate at room temperature. In this case, one parylene dimer or a selective mixture can be used.

[0123] The first side protective layer 510 may contain a moisture-proofing substance. The first side protective layer 510 may contain vapor-deposited powder of an aromatic hydrocarbon compound. The first side protective layer 510 may contain an aromatic hydrocarbon compound using a parylene coating method. The first side protective layer 510 can be formed with a parylene coating layer containing a moisture-proofing substance, thereby preventing moisture from penetrating from the outside to the inside of the display module. The first side protective layer 510 can provide not only moisture protection but also moisture-proofing functionality.

[0124] The second side protective layer 520 can be formed by a pad printing method. For example, it can be formed using a pad unit consisting of a silicone pad and a head, which comprises a mixture of conductive particles, such as multi-walled carbon nanotubes, and a conductive polymer, such as PEDOT:PSS.

[0125] The second side protective layer 520 is formed containing conductive particles and conductive polymers, thereby preventing the inflow of static electricity from the outside.

[0126] Figures 7 to 10 are other exemplary cross-sectional views of some configurations of a display device according to embodiments of the present disclosure.

[0127] Referring to Figure 7, the side protection layer 500 includes the third side protection layer 530, and is substantially the same as the contents of the drawing shown in Figure 6, except for the arrangement procedure of the side protection layer 500. Therefore, redundant explanations can be omitted or simplified.

[0128] Referring to Figure 7, the side protection layer 500 may include a first side protection layer 510, a second side protection layer 520, and a third side protection layer 530.

[0129] The third side protective layer 530 may contain a light-absorbing material. The light-absorbing material may be the same as the light-absorbing material contained in the side protective layer 500 described in Figure 4.

[0130] Referring to Figure 7, the first side protection layer 510 can be positioned in contact with the side coating layer 430, the second side protection layer 510 can be positioned in contact with the first side protection layer 510, and the side sealing layer 440 can be positioned in contact with the second side protection layer 520.

[0131] The second side protection layer 520 is arranged in contact with the side coating layer 430, the third side protection layer 530 is arranged in contact with the second side protection layer 520, the first side protection layer 510 is arranged in contact with the third side protection layer 530, and the side sealing layer 440 is arranged in contact with the first side protection layer 510.

[0132] The third side protective layer 530 can be formed by a pad printing method. For example, black ink containing carbon particles, which are light-absorbing materials, can be formed using a pad unit consisting of a silicone pad and a print head.

[0133] The third side protective layer 530 is formed containing a light-absorbing material, which absorbs light incident on the gap between the display modules in contact with it, preventing the seam from being visible to the user.

[0134] Referring to Figure 7, the side protection layer 500 includes the third side protection layer 530, and is substantially the same as the drawing shown in Figure 6, except for the arrangement procedure of the side protection layer 500. Therefore, redundant explanations can be omitted or simplified.

[0135] Referring to Figure 7, the side protection layer 500 may include a first side protection layer 510, a second side protection layer 520, and a third side protection layer 530.

[0136] The third side protective layer 530 may contain a light-absorbing material. The light-absorbing material may be the same as the light-absorbing material contained in the side protective layer 500 described in Figure 4.

[0137] Referring to Figure 7, the first side protection layer 510 can be positioned in contact with the side coating layer 430, the second side protection layer 510 can be positioned in contact with the first side protection layer 510, and the side sealing layer 440 can be positioned in contact with the second side protection layer 520.

[0138] The second side protection layer 520 is arranged in contact with the side coating layer 430, the third side protection layer 530 is arranged in contact with the second side protection layer 520, the first side protection layer 510 is arranged in contact with the third side protection layer 530, and the side sealing layer 440 is arranged in contact with the first side protection layer 510.

[0139] The third side protective layer 530 can be formed by a pad printing method. For example, black ink containing carbon particles, which are light-absorbing materials, can be formed using a pad unit consisting of a silicone pad and a print head.

[0140] The third side protective layer 530 is formed containing a light-absorbing material, which absorbs light incident on the gap between the display modules in contact with it, preventing the seam from being visible to the user.

[0141] Referring to Figures 8 and 9, the side protection layer 500 may include a first side protection layer 510 and a fourth side protection layer 540.

[0142] The first side protection layer 510 is the same as the first side protection layer 510 described in Figure 6, so a detailed explanation is omitted.

[0143] The fourth side protective layer 540 may contain a conductive material. The conductive material may include conductive particles and black rubber. The conductive particles and black rubber may be the same as those contained in the side protective layer 500 described in Figure 4.

[0144] Referring to Figure 8, the first side protection layer 510 can be positioned in contact with the side coating layer 430, the fourth side protection layer 540 can be positioned in contact with the first side protection layer 510, and the side sealing layer 440 can be positioned in contact with the fourth side protection layer 540.

[0145] The fourth side protective layer 540 is formed containing conductive particles and black rubber, which prevents static electricity from entering from the outside.

[0146] Referring to Figure 9, the fourth side protection layer 540 can be positioned in contact with the side coating layer 430, the first side protection layer 510 can be positioned in contact with the fourth side protection layer 540, and the side sealing layer 440 can be positioned in contact with the first side protection layer 510.

[0147] The fourth side protective layer 540 is formed containing conductive particles and black rubber, which prevents static electricity from entering from the outside.

[0148] Referring to Figure 10, it may be substantially the same as the drawing shown in Figure 4, except that it includes the adhesive pad 610 and the cover bottom 620, so redundant explanations can be omitted or simplified.

[0149] Referring to Figure 10, the adhesive pad 610 and the cover bottom 620 can be placed on the third layer 310.

[0150] The cover bottom 620 is positioned to surround the display panel and can prevent external impacts and the penetration of foreign matter. The cover bottom 620 can be made of a polymer material such as polypropylene or polyethylene, and can be made of an elastic material.

[0151] Referring to Figure 10, the side protective layer 500, etc., positioned on the side may not extend to the adhesive pad 610 or cover bottom 620. The side protective layer 500 in the embodiments of this disclosure contains a conductive material including conductive particles and a conductive polymer, or a conductive material including conductive particles and black rubber, thereby preventing the inflow of static electricity generated externally. Therefore, the cover bottom, which generally uses a metal material, can be replaced with a plastic cover bottom 620 containing a polymer material.

[0152] Figures 11 to 17 are schematic diagrams illustrating the manufacturing process of a display device according to an embodiment of the present disclosure.

[0153] Referring to Figure 11, a side link line 420 can be formed on the side of the display panel. The side link line 420 can be formed using a pad unit 700 consisting of conductive paste 420a, a silicone pad 710, and a head 720. Specifically, the conductive paste 420a is applied to the silicone pad 710, and then the pad unit 700 is moved to the side of the display panel, moving the silicone pad 710 to the side of the display panel where the side link line 420 will be formed. Subsequently, the conductive paste 420a applied to the silicone pad 710 is transferred to the side of the display panel to form the side link line 420.

[0154] Referring to Figure 12, a side coating layer 430 can be formed on the side of the display panel. The side coating layer 430 can be formed using a pad unit 700 consisting of a black ink composition 430a, a silicone pad 710, and a head 720. Specifically, the black ink composition 430a is applied to the silicone pad 710, and then the pad unit 700 is moved to the side of the display panel, moving the silicone pad 710 to the side of the display panel where the side coating layer 430 will be formed. Subsequently, the black ink composition 430a applied to the silicone pad 710 is transferred to the side of the display panel to form the side coating layer 430.

[0155] Referring to Figure 13, a first side protection layer 510 can be formed on the side of the display panel. The first side protection layer 510 can be formed using a parylene coating method. A parylene dimer 510a, which is an aromatic hydrocarbon compound, is heated and vaporized in a vapor deposition machine 800. Thereafter, the parylene dimer is thermally decomposed at high temperature to form a parylene monomer, and thereafter, the thermally decomposed parylene monomer is used to vapor deposition at room temperature to form the first side protection layer 510.

[0156] If the first side protective layer 510 is formed using vapor-deposited powder of aromatic hydrocarbon compounds, a uniform coating is possible, and the coating can be densely applied according to the shape of the substrate. Furthermore, if vapor-deposited powder of aromatic hydrocarbon compounds is coated onto the substrate using the parylene coating method, the thickness of the coating layer can be easily adjusted without applying thermal stress to the substrate.

[0157] Referring to Figure 14, a second side protection layer 520 can be formed on the side of the display panel. The second side protection layer 520 can be formed using a pad unit 700 consisting of a conductive material 520a, a silicone pad 710, and a head 720. Specifically, the conductive material 520a is attached to the silicone pad 710, and then the pad unit 700 is moved to the side of the display panel, moving the silicone pad 710 to the side of the display panel where the second side protection layer 520 will be formed. Subsequently, the conductive material 520a attached to the silicone pad 710 is transferred to the side of the display panel to form the second side protection layer 520.

[0158] Referring to Figure 15, a side sealing layer 440 can be formed on the side of the display panel. The side sealing layer 440 can be formed using a pad unit 700 consisting of a light-absorbing material 440a, a silicone pad 710, and a head 720. Specifically, the light-absorbing material 440a is attached to the silicone pad 710, and then the pad unit 700 is moved to the side of the display panel, moving the silicone pad 710 to the side of the display panel where the side sealing layer 440 will be formed. Referring to Figure 16, the light-absorbing material 440a attached to the silicone pad 710 is then transferred to the side of the display panel to form the side sealing layer 440.

[0159] Referring to Figure 17, a functional film layer 250 can be formed on the display panel. After the functional film layer 250 is attached to the display panel, the sides can be cut so that the side edge of the functional film layer 250 and the side edge of the side sealing layer 440 are aligned on the same line.

[0160] A brief description of the embodiments of this disclosure described above is as follows.

[0161] A display device according to an embodiment of the present disclosure may include a first substrate including a display area and a non-display area surrounding the display area, a light-emitting element provided in the display area on the first substrate, a first pad portion provided in the non-display area on the upper surface of the first substrate and positioned on one side edge of the first substrate, a second substrate provided on the lower surface of the first substrate, a second pad portion provided in the non-display area on the lower surface of the second substrate and positioned on one side edge of the second substrate, a side link line electrically connecting the first pad portion and the second pad portion, a side coating layer positioned to cover the side link line, a side protective layer positioned to cover at least a portion of the side coating layer, and a side sealing layer positioned to cover at least a portion of the side protective layer.

[0162] In the display device according to the embodiments of this disclosure, the light-emitting element may be a micro-LED (Light Emitting Diode).

[0163] In the display device according to the embodiments of this disclosure, the side protective layer may include a first side protective layer containing a moisture-proofing substance, and a second side protective layer containing conductive particles and a conductive polymer.

[0164] In the display device according to the embodiments of this disclosure, the moisture-proofing material may include aromatic hydrocarbon compounds.

[0165] In the display device according to the embodiments of this disclosure, the aromatic hydrocarbon compound can be at least one selected from the following compounds.

[0166] [ka]

[0167] In the display device according to the embodiments of this disclosure, the conductive particles may be at least one carbon nanotube selected from single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes.

[0168] In the display devices according to the embodiments of this disclosure, the conductive polymer is polyfluorene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polyacetylene (PAC), poly-p-phenylenevinylene (poly(p-phenylenevinylene, PPV), polypyrrole (PPY), polycarbazole, polyindole, polyazepine, or polythienylenevinylene (poly(thienylenevinyl It can be at least one selected from the group consisting of poly(ene), polyaniline (PANI), polythiophene (poly(thiophene)), poly(p-phenylenesulfide, PPS), poly3,4-ethylenedioxythiophene (PEDOT), poly(styrenesulfonate, PSS) doped with poly3,4-ethylenedioxythiophene (PEDOT:PSS), poly3,4-ethylenedioxythiophene)-tetramethacrylate (PEDOT-TMA), and polyfuran.

[0169] In the display device according to the embodiment of the present disclosure, the first side protective layer may be arranged in contact with the side coating layer, and the second side protective layer may be arranged in contact with the first side protective layer.

[0170] In the display device according to the embodiments of this disclosure, the side protective layer may further include a third side protective layer containing a light-absorbing material.

[0171] In the display device according to the embodiments of this disclosure, the light-absorbing material may include a black ink comprising at least one of carbon black, a black dye, and a black pigment.

[0172] In the display device according to the embodiment of the present disclosure, the second side protective layer may be arranged in contact with the side coating layer, the third side protective layer may be arranged in contact with the second side protective layer, and the first side protective layer may be arranged in contact with the third side protective layer.

[0173] In the display device according to the embodiments of this disclosure, the side protective layer may include a first side protective layer containing a moisture-proofing substance, and a fourth side protective layer containing conductive particles and black rubber.

[0174] In the display device according to the embodiments of this disclosure, the moisture-preventing substance may be an aromatic hydrocarbon compound.

[0175] In the display device according to the embodiments of this disclosure, the aromatic hydrocarbon compound can be at least one selected from the following compounds.

[0176] [ka]

[0177] In the display device according to the embodiments of this disclosure, the conductive particles may be at least one carbon nanotube selected from single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes.

[0178] In the display devices according to the embodiments of this disclosure, the black rubber may include at least one of carbon black, black dye, and black pigment, and isoprene-based rubber.

[0179] In the display device according to the embodiment of the present disclosure, the first side protective layer may be arranged in contact with the side coating layer, and the fourth side protective layer may be arranged in contact with the first side protective layer.

[0180] In the display device according to the embodiment of the present disclosure, the fourth side protective layer may be arranged in contact with the side coating layer, and the first side protective layer may be arranged in contact with the fourth side protective layer.

[0181] In the display device according to the embodiment of this disclosure, the side link lines may include conductive paste.

[0182] In the display device according to the embodiments of this disclosure, the side coating layer may include a black ink comprising at least one of carbon black, a black dye, and a black pigment.

[0183] In the display device according to the embodiments of this disclosure, the side sealing layer may contain at least one of carbon black, black dye, and black pigment.

[0184] In the display device according to the embodiment of the present disclosure, a functional film layer is further included, and the side edge of the functional film layer and the side edge of the side sealing layer can be arranged on the same line.

[0185] The display device according to the embodiment of the present disclosure may further include an adhesive layer disposed between the first substrate and the second substrate.

[0186] A tiled display device according to an embodiment of the present disclosure includes a plurality of display modules, each of which may include a display device comprising: a first substrate including a display area and a non-display area surrounding the display area; a light-emitting element provided in the display area on the first substrate; a first pad portion provided in the non-display area on the upper surface of the first substrate and positioned on one side edge of the first substrate; a second substrate provided on the lower surface of the first substrate; a second pad portion provided in the non-display area on the lower surface of the second substrate and positioned on one side edge of the second substrate; a side link line electrically connecting the first pad portion and the second pad portion; a side coating layer positioned to cover the side link line; a side protective layer positioned to cover at least a portion of the side coating layer; and a side sealing layer positioned to cover at least a portion of the side protective layer.

[0187] The above explanation is merely illustrative of the technical concept of this disclosure, and a person with ordinary skill in the art to which this disclosure belongs could make various modifications and variations without deviating from the essential characteristics of this disclosure. Furthermore, the embodiments disclosed in this disclosure are for illustrative purposes only, not to limit the technical concept of this disclosure, and therefore the scope of the technical concept of this disclosure is not limited by such embodiments.

Claims

1. A first substrate including a display area and a non-display area surrounding the display area, A light-emitting element provided in the display area on the first substrate, A first pad portion is provided in the non-display area on the upper surface of the first substrate and is positioned on one side edge of the first substrate, A second substrate provided on the lower surface of the first substrate, A second pad portion is provided in the non-display area on the lower surface of the second substrate and is positioned on one side edge of the second substrate, A side link line electrically connects the first pad portion and the second pad portion, A side coating layer is arranged to cover the aforementioned side link line, A side protective layer is disposed to cover at least a portion of the side coating layer, A side sealing layer is disposed to cover at least a portion of the side protective layer. Includes, The aforementioned side protective layer includes a moisture-proofing material and conductive particles. Display device.

2. The display device according to claim 1, wherein the light-emitting element is a micro-LED (Light Emitting Diode).

3. The aforementioned side protective layer is A first side protective layer containing the moisture-proofing material, A second side protective layer comprising the conductive particles and conductive polymer, The display device according to claim 1, including the following:

4. The display device according to claim 3, wherein the moisture-preventing substance is an aromatic hydrocarbon compound.

5. The display device according to claim 4, wherein the aromatic hydrocarbon compound is selected from the following compounds, at least one of which is selected. 【Chemistry 1】

6. The display device according to claim 3, wherein the conductive particle is at least one carbon nanotube selected from single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes.

7. The conductive polymers include polyfluorene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polyacetylene (PAC), poly(p-phenylenevinylene) (PPV), polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polythienylenevinylene (poly(thienylenevinylene)), and polyaniline. A display device according to claim 3, selected from the group consisting of polyaniline (PANI), poly(thiophene), poly(p-phenylenesulfide, PPS), poly(3,4-ethylenedioxythiophene, PEDOT), poly(styrenesulfonate, PSS) doped with poly(3,4-ethylenedioxythiophene) (PEDOT:PSS), poly(3,4-ethylenedioxythiophene)-tetramethacrylate (PEDOT-TMA), and polyfuran.

8. The first side protective layer is arranged in contact with the side coating layer, The display device according to claim 3, wherein the second side protective layer is arranged in contact with the first side protective layer.

9. The display device according to claim 3, wherein the side protective layer further comprises a third side protective layer containing a light-absorbing material.

10. The display device according to claim 9, wherein the light-absorbing material comprises a black ink containing at least one of carbon black, a black dye, and a black pigment.

11. The second side protective layer is arranged in contact with the side coating layer, The third side protection layer is arranged in contact with the second side protection layer. The display device according to claim 9, wherein the first side protective layer is arranged in contact with the third side protective layer.

12. The aforementioned side protective layer is A first side protective layer containing the moisture-proofing material, A fourth side protective layer containing the conductive particles and black rubber The display device according to claim 1, including the following:

13. The display device according to claim 12, wherein the moisture-preventing substance is an aromatic hydrocarbon compound.

14. The display device according to claim 13, wherein the aromatic hydrocarbon compound is selected from the following compounds, at least one of which is selected. 【Chemistry 2】

15. The display device according to claim 12, wherein the conductive particles are at least one carbon nanotube selected from single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes.

16. The display device according to claim 12, wherein the black rubber comprises at least one of carbon black, black dye, and black pigment, and isoprene rubber.

17. The first side protective layer is arranged in contact with the side coating layer, The display device according to claim 12, wherein the fourth side protective layer is arranged in contact with the first side protective layer.

18. The fourth side protective layer is arranged in contact with the side coating layer, The display device according to claim 12, wherein the first side protective layer is arranged to be in contact with the fourth side protective layer.

19. The display device according to claim 1, wherein the side link line includes a conductive paste.

20. The display device according to claim 1, wherein the side coating layer comprises a black ink containing at least one of carbon black, black dye, and black pigment.

21. The display device according to claim 1, wherein the side sealing layer comprises at least one of carbon black, black dye, and black pigment.

22. It further includes a functional film layer, The display device according to claim 1, wherein the side edge of the functional film layer and the side edge of the side sealing layer are arranged on the same line.

23. The display device according to claim 1, further comprising an adhesive layer disposed between the first substrate and the second substrate.

24. In a tiled display device including multiple display modules, Each of the aforementioned multiple display modules is: A first substrate including a display area and a non-display area surrounding the display area, A light-emitting element provided in the display area on the first substrate, A first pad portion is provided in the non-display area on the upper surface of the first substrate and is positioned on one side edge of the first substrate, The second substrate is provided on the lower surface of the first substrate, A second pad portion is provided in the non-display area on the lower surface of the second substrate and is positioned on one side edge of the second substrate, A side link line electrically connects the first pad portion and the second pad portion, A side coating layer is arranged to cover the aforementioned side link line, A side protective layer is disposed to cover at least a portion of the side coating layer, Includes a side sealing layer disposed to cover at least a portion of the side protective layer, The aforementioned side protective layer includes a moisture-proofing material and conductive particles. A tiled display device including a display unit.

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