Electronic devices including electrostatic discharge paths

Abstract

An electronic device is provided that includes an electrostatic discharge path. [Solution] The electronic device of the present invention comprises a display module; a connecting member including a bending portion connected to a display panel of the display module and extending to a rear surface of the display module, and a protective layer made of an insulating material and covering the bending portion; a printed circuit board disposed on the rear surface of the display module and connected to the display module by the connecting member; a frame formed of a conductive material and arranged to surround at least a portion of the display module, a side member including a first partition portion arranged between the frame and the display module so as to be spaced apart from the frame, and a second partition portion arranged at a distance from the display module and covering at least a portion of an outer periphery of the display module; at least one opening formed in the first partition portion; and a first conductive connecting member extended from the second partition portion to the first partition portion, at least a portion of which is positioned in the opening and at least a portion of which faces the connecting member and is disposed on the side member.

Description

Technical Field

[0001] The present invention relates to an electronic device including an electrostatic discharge path.

Background Art

[0002] An ESD (electro static discharge) phenomenon occurs between electrical objects composed of electronic components and conductive materials. The ESD phenomenon means an electrical phenomenon in which charges accumulated due to various factors instantaneously move to other parts. The ESD phenomenon occurs in electronic components due to charges accumulated inside or outside the electronic device. Since ESD is accompanied by a strong voltage, when the ESD phenomenon occurs in an electronic component, it leads to damage to the electronic component. There has been a problem that the electronic device does not operate normally or its performance deteriorates due to such damage.

[0003] In order to solve the ESD phenomenon, it is becoming increasingly important to design an electronic device with a path for discharging ESD to the ground.

[0004] Charges are accumulated on the surface of the electronic device. For example, charges are accumulated on the surface of the electronic device when the user holds the electronic device or the electronic device comes into contact with an external object.

[0005] On the other hand, in the electronic device, a gap through which the outside and the inside of the electronic device communicate is formed by design. From such a gap, the charges accumulated on the surface of the electronic device cause an ESD phenomenon in the electronic components arranged inside the electronic device. In such a case, the electronic components are damaged by the ESD phenomenon.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The present invention has been made in view of the above conventional problems, and an object of the present invention is to provide an electronic device including an electrostatic discharge path through which ESD due to charges accumulated in the electronic device is discharged.

Means for Solving the Problems

[0007] An electronic device according to one aspect of the present invention, made to achieve the above objective, Includes display panel A display module and at least A part of it constitutes the appearance of the electronic device. Formed from conductive material Includes conductive frame portion Frame and 、 A first portion and 、 The display module edge The second covering at least a portion of portion and a side member including the first portion Formed adjacent to the conductive frame portion At least one opening, Located between the display module and the side member Second portion From the first portion It is extended to and at least a portion of the opening adjacent to or within the opening position do 1 conductive It comprises a component and

[0008] An electronic device according to one embodiment disclosed herein includes a display module, a connecting member including a bending portion connected to the display panel of the display module and extending to the back of the display module, and a protective layer formed of an insulating material and covering the bending portion, a printed circuit board disposed on the back of the display module and connected to the display module by the connecting member, and a component disposed to surround at least a portion of the display module and at least a portion of The appearance of the aforementioned electronic device is configured as follows: A frame formed of a conductive material, including a first frame facing the connecting member of the display module, and a second frame separated from the first frame by a segmentation portion, and a first frame disposed between the frame and the display module so as to be separated from the frame. portion And, arranged at a distance from the display module, the display module edge The second covering at least a portion of portion and, including formed from non-metallic materials Side member and the aforementioned 1 portion at least one opening formed therein, and the second portion extending from the first portion and at least a part thereof is located in the opening Set or in the opening and at least a part thereof faces the Display module and a first conductive connecting member disposed on the side member facing each other.

Advantages of the Invention

[0009] According to the present invention, ESD caused by charges accumulated in an electronic device can be grounded through a mechanism constituting the appearance of the electronic device. Thereby, the phenomenon that damage occurs to electronic components can be alleviated.

Brief Description of the Drawings

[0010] [Figure 1] It is a block diagram of an electronic device in a network environment according to an embodiment. [Figure 2A] It is a front perspective view of an electronic device according to an embodiment. [Figure 2B] It is a rear perspective view of the electronic device of FIG. 2A according to an embodiment. [Figure 3] It is an exploded perspective view of the electronic device of FIG. 2A according to an embodiment. [Figure 4] It is a plan view in which the P region shown in FIG. 2A is enlarged. [Figure 5A] It is a diagram showing a conductive connecting member disposed on a side member according to an embodiment. [Figure 5B] It is a perspective view cut along the line A-A shown in FIG. 2A. [Figure 6A] It is a diagram showing a conductive connecting member disposed on a side member according to another embodiment. [Figure 6B] It is a diagram showing a conductive connecting member disposed on a side member according to another embodiment. [Figure 6C] It is a diagram showing an auxiliary conductive connecting member disposed on a side member between a frame and the side member according to an embodiment. [Figure 7A]It is a diagram enlarging a second conductive connecting member according to an embodiment. [Figure 7B] It is a perspective view of a third conductive connecting member arranged on a second conductive connecting member according to an embodiment. [Figure 7C] It is a diagram showing a pattern of an insulating layer constituting a third conductive connecting member according to an embodiment. [Figure 8] It is a schematic diagram showing components of a foldable electronic device according to an embodiment of the present invention.

Embodiments for Carrying Out the Invention

[0011] Hereinafter, specific examples of embodiments for carrying out the present invention will be described in detail with reference to the drawings. In relation to the description of the drawings, the same or similar reference numerals are used for the same or similar components.

[0012] The embodiments in this specification and the terms used therein are not intended to limit the technical features described in this specification to specific embodiments, but should be understood to include various modifications, equivalents, or alternatives of the embodiments.

[0013] In relation to the description of the drawings, similar reference numerals are used for similar or related components. The singular form of the noun corresponding to an item includes one or more items unless otherwise specified in the relevant context.

[0014] In this specification, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” includes any one of the items listed together with the applicable phrase from these terms, or any possible combination thereof. Terms such as “first,” “second,” “first,” or “second” are used merely to distinguish one component from other applicable components and do not limit the component in any other respect (e.g., importance or order). When one component (e.g., the first) is said to be “combined” or “linked” to another component (e.g., the second) with or without the terms “functionally” or “communically,” it means that one component is linked to the other component directly (e.g., by wire), wirelessly, or via the third component.

[0015] Figure 1 is a block diagram of an electronic device 101 in a network environment 100 according to one embodiment. Referring to Figure 1, in the network environment 100, the electronic device 101 communicates with an electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or with an electronic device 104 or a server 108 through a second network 199 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 101 communicates with the electronic device 104 through the server 108. According to one embodiment, the electronic device 101 includes a processor 120, memory 130, input module 150, acoustic output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, and antenna module 197. In one embodiment, the electronic device 101 may omit at least one of these components (e.g., connection terminal 178) or may have one or more other components added. In one embodiment, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0016] The processor 120 executes software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120 and performs various data processing or calculations. According to one embodiment, as part of the data processing or calculation, the processor 120 stores instructions or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, processes the instructions or data stored in volatile memory 132, and stores the resulting data in non-volatile memory 134. According to one embodiment, the processor 120 includes a main processor 121 (e.g., central processing unit or application processor) or an auxiliary processor 123 (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor) that can operate independently or together with it. For example, if the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 is configured to use lower power than the main processor 121 or to specialize in a specified function. The auxiliary processor 123 is implemented separately from or as part of the main processor 121.

[0017] The auxiliary processor 123 controls at least a portion of the functions or states related to at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), for example, on behalf of the main processor 121 when the main processor 121 is inactive (e.g., sleep), or together with the main processor 121 when the main processor 121 is active (e.g., application execution). According to one embodiment, the auxiliary processor 123 (e.g., image signal processor or communication processor) is embodied as part of another functionally related component (e.g., camera module 180 or communication module 190). According to one embodiment, the auxiliary processor 123 (e.g., neural network processing unit) includes a hardware structure dedicated to processing artificial intelligence models. The artificial intelligence models are generated by machine learning. Such learning is performed, for example, on the electronic device 101 itself where the artificial intelligence is performed, or on a separate server (e.g., server 108). Learning algorithms include, but are not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. An artificial intelligence model includes multiple artificial neural network layers. These artificial neural networks are, but are not limited to, deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), deep Q-networks, or any combination of two or more of these. An artificial intelligence model includes a software structure in addition to, or as an alternative to, a hardware structure.

[0018] Memory 130 stores various data used by at least one component of the electronic device 101 (e.g., processor 120 or sensor module 176). The data includes, for example, software (e.g., program 140) and input or output data for related instructions. Memory 130 includes volatile memory 132 or non-volatile memory 134.

[0019] The program 140 is stored as software in memory 130 and includes, for example, an operating system (OS) 142, middleware 144, and an application 146.

[0020] The input module 150 receives instructions or data used by the components of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user). The input module 150 includes, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., a stylus pen).

[0021] The acoustic output module 155 outputs an acoustic signal to the outside of the electronic device 101. The acoustic output module 155 includes, for example, a speaker or a receiver. The speaker is used for general purposes such as multimedia playback or recording and playback. The receiver is used to receive incoming telephone calls. According to one embodiment, the receiver is embodied separately from or as part of the speaker.

[0022] The display module 160 provides information visually to an external party (e.g., a user) outside of the electronic device 101. The display module 160 includes, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device. According to one embodiment, the display module 160 includes a touch sensor configured to detect touches, or a pressure sensor configured to measure the intensity of the force generated by a touch.

[0023] The audio module 170 converts sound into electrical signals or, conversely, converts electrical signals into sound. According to one embodiment, the audio module 170 acquires sound from the input module 150 or outputs sound from an external electronic device (e.g., electronic device 102) (e.g., speaker or headphones) directly or wirelessly connected to the acoustic output module 155 or the electronic device 101.

[0024] The sensor module 176 senses the operating state of the electronic device 101 (e.g., power or temperature) or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the sensed state. According to one embodiment, the sensor module 176 includes, for example, a gesture sensor, a gyroscope, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0025] Interface 177 supports one or more designated protocols available for the electronic device 101 to connect directly or wirelessly to an external electronic device (e.g., electronic device 102). According to one embodiment, interface 177 includes, for example, HDMI® (high definition multimedia interface), USB (universal serial bus) interface, SD card® interface, or audio interface.

[0026] The connection terminal 178 includes a connector through which the electronic device 101 is physically connected to an external electronic device (e.g., electronic device 102). According to one embodiment, the connection terminal 178 includes, for example, an HDMI® connector, a USB connector, an SD card® connector, or an audio connector (e.g., a headphone connector).

[0027] The haptic module 179 converts electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that can be perceived by the user through touch or kinesthetic sense. According to one embodiment, the haptic module 179 includes, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0028] The camera module 180 captures still images and moving images. According to one embodiment, the camera module 180 includes one or more lenses, an image sensor, an image signal processor, or a flash.

[0029] The power management module 188 manages the power supplied to the electronic device 101. According to one embodiment, the power management module 188 is embodied, for example, as at least part of a PMIC (power management integrated circuit).

[0030] The battery 189 supplies power to at least one component of the electronic device 101. According to one embodiment, the battery 189 includes, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0031] The communication module 190 supports the establishment of a direct (e.g., wired) or wireless communication channel between the electronic device 101 and an external electronic slave device (e.g., electronic device 102, electronic device 104, or server 108), and communication over the established communication channel. The communication module 190 operates independently of the processor 120 (e.g., the application processor) and includes one or more communication processors that support direct (e.g., wired) or wireless communication. According to one embodiment, the communication module 190 includes a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module), a wired communication module 194 (e.g., a LAN (local area network) communication module, or a power line communication module). The relevant communication module among these communication modules communicates with the external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth®, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various communication modules may be integrated as a single component (e.g., a single chip) or embodied as multiple separate components (e.g., multiple chips). The wireless communication module 192 verifies or authenticates the electronic device 101 within a communication network such as the first network 198 or the second network 199 using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196.

[0032] The wireless communication module 192 supports 5G networks and next-generation communication technologies, such as NR (new radio access) technology, which are based on 4G networks. NR technology supports high-speed transmission of high-capacity data (eMBB: enhanced mobile broadband), minimization of terminal power and connection of many terminals (mMTC: massive machine type communications), or high reliability and low latency (URLLC: ultra-reliable and low-latency communications). The wireless communication module 192 supports high-frequency bands (e.g., mmWave bands) to achieve high data transmission rates, for example. The wireless communication module 192 supports various technologies to ensure performance in high-frequency bands, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or large-scale antennas. The wireless communication module 192 supports various requirements specified by the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to one embodiment, the wireless communication module 192 supports a peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or data processing delay (U-plane latency) for URLLC realization (e.g., downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip of 1 ms or less).

[0033] The antenna module 197 transmits or receives signals or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module 197 includes an antenna comprising a radiator consisting of a conductor or conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 197 includes a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as a first network 198 or a second network 199 is selected from the plurality of antennas, for example, by a communication module 190. Signals or power are transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. In one embodiment, other components (e.g., an RFIC: radio frequency integrated circuit) are further formed as part of the antenna module 197 in addition to the radiator.

[0034] According to one embodiment, the antenna module 197 forms an mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC located on or adjacent to a first surface of the printed circuit board (e.g., the bottom surface) that supports a specified high-frequency band (e.g., the mmWave band), and a plurality of antennas (e.g., array antennas) located on or adjacent to a second surface of the printed circuit board (e.g., the top or side surface) that transmit or receive signals in the specified high-frequency band.

[0035] At least some of the above components are connected to each other by a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., instructions or data) with each other.

[0036] According to one embodiment, commands or data are transmitted or received between the electronic device 101 and an external electronic device 104 via a server 108 connected to a second network 199. The external electronic devices (102 or 104) are, respectively, the same type of device as the electronic device 101 or a different type of device. According to one embodiment, all or part of the operation performed by the electronic device 101 is performed by one or more external electronic devices, including the external electronic devices (102, 104) or the server 108. For example, if the electronic device 101 must perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101, instead of performing the function or service itself, or in addition, requests one or more external electronic devices to perform at least part of that function or service. One or more external electronic devices that receive the request perform at least part of the requested function or service or additional functions or services related to the request and transmit the results of the execution to the electronic device 101. The electronic device 101 provides the results as they are or further processed as at least part of the response to the request. To achieve this, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing are used. The electronic device 101 provides ultra-low latency services using, for example, distributed computing or mobile edge computing. In other embodiments, the external electronic device 104 includes IoT (Internet of Things) devices, and the server 108 is an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 is contained within a second network 199, and the electronic device 101 is applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0037] Figure 2A is a front perspective view of an electronic device according to one embodiment of the present invention. Figure 2B is a rear perspective view of the electronic device of Figure 2A according to one embodiment of the present invention.

[0038] The electronic device 200 described below includes at least one of the components of the electronic device 101 described in Figure 1.

[0039] Referring to Figures 2A and 2B, an electronic device 200 according to one embodiment includes a housing 210 including a first surface (or entire surface) 210A, a second surface (or back surface) 210B, and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. In other embodiments (not shown), the housing refers to a structure that forms part of the first surface 210A, the second surface 210B, and the side surface 210C in Figure 2A. According to one embodiment, the first surface 210A is formed by a front plate 202 (e.g., a glass plate or polymer plate including various coating layers) that is at least partly transparent. The second surface 210B is formed by a back plate 211 that is substantially opaque. The back plate 211 is formed by, for example, coated or colored glass, ceramics, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or at least two of these materials. The side 210C is bonded to the front plate 202 and the back plate 211 and is formed by a side bezel structure 218 (or "side member") which includes metal and / or polymer. In one embodiment, the back plate 211 and the side bezel structure 218 are integrally formed and include the same material (e.g., a metallic material such as aluminum).

[0040] In the illustrated embodiment, the front plate 202 includes a first region 210D on both sides of the long edge of the front plate, which extends seamlessly from the first surface 210A towards the back plate. In the illustrated embodiment (see Figure 2B), the back plate 211 includes a second region 210E on both sides of the long edge, which extends seamlessly from the second surface 210B towards the front plate. In some embodiments, the front plate 202 or the back plate 211 includes only either the first region 210D or the second region 210E. In some embodiments, the front plate 202 includes only a flat plane that is parallel to the second surface 210B and does not include the first and second regions. In these embodiments, when viewed from the side of the electronic device, the side bezel structure 218 has a first thickness (or width) on the side that does not include the first region 210D or the second region 210E as described above, and a second thickness that is thinner than the first thickness on the side that includes the first region 210D or the second region 210E.

[0041] According to one embodiment, the electronic device 200 includes at least one of a display 201, an input device 203, an acoustic output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device 217, an indicator (not shown), and a connector 208. In one embodiment, the electronic device 200 may omit at least one of its components (for example, the key input device 217 or the indicator) or may further include other components.

[0042] The display 201 is visually exposed, for example, from a substantial portion of the front plate 202. In one embodiment, at least a portion of the display 201 is exposed from the front plate 202 forming a first region 210D of the first surface 210A and side surface 210C. The display 201 is coupled to or adjacent to a digitizer that detects a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a magnetic field type stylus pen. In one embodiment, at least a portion of the sensor modules (204, 219) and / or at least a portion of the key input device 217 are located in the first region 210D and / or the second region 210E.

[0043] The input device 203 includes a microphone 203. In one embodiment, the input device 203 includes a plurality of microphones 203 arranged to allow sensing of the direction of sound. The acoustic output devices (207, 214) include speakers (207, 214). The speakers (207, 214) include an external speaker 207 and a call receiver 214. In one embodiment, the microphone 203, speakers (207, 214), and connector 208 are at least partially located in the internal space of the electronic device 200 and exposed to the external environment through at least one hole formed in the housing 210. In one embodiment, the hole formed in the housing 210 is shared for the microphone 203 and the speakers (207, 214). In one embodiment, the acoustic output devices (207, 214) include a speaker (e.g., a piezo speaker) that operates while eliminating the hole formed in the housing 210.

[0044] The sensor modules (204, 219) generate electrical signals or data values ​​corresponding to the internal operating state of the electronic device 200 or the external environmental state. The sensor modules (204, 219) include, for example, a first sensor module 204 (e.g., proximity sensor) located on the first surface 210A of the housing 210, a second sensor module (not shown) (e.g., fingerprint sensor), and / or a third sensor module 219 (e.g., HRM (heart rate monitor) sensor) located on the second surface 210B of the housing 210. The fingerprint sensor is located on the first surface 210A of the housing 210 (e.g., home key button), in a portion of the second surface 210B, and / or below the display 201. The electronic device 200 further includes at least one of the following sensor modules (not shown): a gesture sensor, a gyroscope, a barometric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0045] The camera modules (205, 212) include a first camera module 205 located on the first surface 210A of the electronic device 200, a second camera module 212 located on the second surface 210B, and / or a flash 213. The camera modules (205, 212) include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 includes, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (wide-angle lenses, ultra-wide-angle lenses, or telephoto lenses) and an image sensor are located on one surface of the electronic device 200.

[0046] The key input device 217 is located on the side surface 210C of the housing 210. In other embodiments, the electronic device 200 does not include some or all of the key input devices 217 described above, and the not included key input devices 217 are embodied in other forms, such as soft keys, on the display 201. In other embodiments, the key input device 217 is embodied using a pressure sensor included in the display 201.

[0047] The indicator is located, for example, on the first surface 210A of the housing 210. The indicator provides, for example, status information of the electronic device 200 in the form of light (e.g., a light-emitting element). In other embodiments, the light-emitting element provides, for example, a light source that is synchronized with the operation of the camera module 205. The indicator includes, for example, an LED, an IR LED, and / or a xenon lamp.

[0048] The connector hole 208 includes a first connector hole 208 for housing a connector (e.g., a USB (universal serial bus) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) for housing a connector for transmitting and receiving audio signals with an external electronic device.

[0049] Some camera modules (205, 212), some sensor modules (204, 219), or indicators are positioned to be exposed from the display 201. For example, the camera modules 205, sensor modules 204, or indicators are positioned in the internal space of the electronic device 200 to be in contact with the external environment through an opening or transparent area perforated to the front plate 202 of the display 201. In one embodiment, the area where the display 201 and the camera module 205 face each other is part of the area for displaying content and is formed as a transparent area having a certain transmittance. In one embodiment, the transparent area is formed to have a transmittance in the range of about 5% to about 20%. Such a transparent area includes an area that overlaps with the effective area (e.g., the field of view) of the camera module 205 through which light for imaging and generating an image by the image sensor passes. For example, the transparent area of ​​the display 201 includes an area with a lower pixel density than the periphery. For example, the transparent area replaces an opening. For example, camera module 205 includes an under-display camera (UDC). In other embodiments, some sensor modules 204 are positioned within the internal space of the electronic device to perform their functions without being visually exposed from the front plate 202. For example, in such a case, the area of ​​the display 201 facing the sensor module does not have a perforated opening.

[0050] According to one embodiment, the electronic device 200 has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device 200 is part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. A "foldable electronic device," a "slidable electronic device," a "stretchable electronic device," and / or a "rollable electronic device" means an electronic device in which the display (e.g., the display 330 in Figure 3) is bendable and can be folded, wound or rolled, expanded in area, and / or housed inside a housing (e.g., the housing 210 in Figures 2A and 2B). Foldable electronic devices, slidable electronic devices, stretchable electronic devices, and / or rollable electronic devices can be used to extend their screen display area by unfolding the display or exposing a larger area of ​​the display to the outside, as required by the user.

[0051] Figure 3 is an exploded perspective view of the electronic device 200 of Figure 2A according to one embodiment of the present invention.

[0052] The electronic device 300 in Figure 3 is at least partially similar to the electronic device 200 in Figures 2A and 2B, or includes other embodiments of the electronic device.

[0053] Referring to Figure 3, the electronic device 300 (for example, the electronic device 200 in Figure 2A or Figure 2B) includes a side member 310 (for example, a side bezel structure), a first support member 311 (for example, a bracket or support structure), a front plate 320 (for example, a front cover), a display 330 (for example, the display 201 in Figure 2A), a substrate 340 (for example, a PCB: printed circuit board, FPCB: flexible PCB, or RFPCB: rigid-flexible PCB), a battery 350, a second support member 360 (for example, a rear case), an antenna 370, and a back plate 380 (for example, a back cover). In some embodiments, the electronic device 300 may omit at least one of its components (for example, the first support member 311 or the second support member 360) or may further include other components. Since at least one of the components of the electronic device 300 is identical or similar to at least one of the components of the electronic device 200 shown in Figure 2A or Figure 2B, redundant explanations will be omitted below.

[0054] The first support member 311 is located inside the electronic device 300 and is connected to or integrally formed with the side member 310. The first support member 311 is made of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member 311 has a display 330 bonded to one side and a substrate 340 bonded to the other side. The substrate 340 is mounted with a processor, memory, and / or interfaces. The processor includes, for example, one or more of a central processing unit, application processor, graphics processing unit, image signal processor, sensor hub processor, and communication processor.

[0055] Memory includes, for example, volatile memory or non-volatile memory.

[0056] The interface includes, for example, HDMI® (High Definition Multimedia Interface), USB (Universal Serial Bus) interface, SD Card® interface, and / or audio interface. The interface electrically or physically connects the electronic device 300 to an external electronic device and includes a USB connector, an SD Card® / MMC connector, or an audio connector.

[0057] The battery 350 is a device for supplying power to at least one component of the electronic device 300, and includes, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 is arranged substantially coplanar with, for example, the substrate 340. The battery 350 is integrally arranged inside the electronic device 300. In other embodiments, the battery 350 is detachably arranged from the electronic device 300.

[0058] The antenna 370 is positioned between the back plate 380 and the battery 350. The antenna 370 includes, for example, an NFC (near-field communication) antenna, a wireless charging antenna, and / or an MST (magnetic secure transmission) antenna. The antenna 370 communicates with an external device, for example, or wirelessly transmits and receives power necessary for charging. In other embodiments, the antenna structure is formed by part of the side bezel structure 310 and / or the first support member 311, or a combination thereof.

[0059] Hereafter, the same reference numeral shall be used for identical or similar components unless otherwise specified.

[0060] Figure 4 is an enlarged plan view of area P shown in Figure 2A. Figure 5A shows a conductive connecting member 450 arranged on a side member 550 according to one embodiment. (For example, conductive member 450)This figure shows the same. Figure 5B is a perspective view taken by cutting along line AA shown in Figure 2A. Figures 6A and 6B show conductive connecting members 450 arranged on the side member 550 according to another embodiment. Figure 6C shows an auxiliary conductive connecting member 450 arranged on the side member 550 between the frame 420 and the side member 550 according to one embodiment.

[0061] The electronic device 400 shown in Figure 4 is an example of the electronic device 101 in Figure 1, the electronic device 200 in Figure 2A, and / or the electronic device 300 in Figure 3 described above.

[0062] An electronic device 400 according to one embodiment disclosed herein includes a frame 420 (e.g., a side bezel structure 218 in Figure 2A or a side member 310 in Figure 3) that constitutes the appearance of a side of the electronic device 400 (e.g., side 210C in Figure 2A), as shown in Figure 4. In one embodiment, the frame 420 is positioned to surround a display module 410 of the electronic device 400 (e.g., a display module 160 in Figure 1, a display 201 in Figure 2A, or a display 330 in Figure 3). In one embodiment, the frame 420 is formed of a conductive material such as a metal. For example, the frame 420 is formed of a metal material including aluminum (Al).

[0063] According to one embodiment, the frame 420 is electrically connected to a printed circuit board (for example, the board 340 in Figure 3) which is electrically connected to at least one ground. In one embodiment, as will be described later, the charge accumulated in the electronic device 400 is conducted through the frame 420, which is made of a conductive material, and moves to the ground, which has a relatively lower potential. Here, the accumulated charge refers to the charge generated by the operation of electronic components arranged inside the electronic device 400, and also refers to the charge accumulated outside (or on the surface) of the electronic device 400 and conducted into the inside of the electronic device 400 through gaps formed in the electronic device 400. Hereafter, the accumulated charge encompasses all of the above charges.

[0064] In one embodiment, the frame 420 is formed of a conductive material and is used as an antenna for the electronic device 400. The frame 420 is electrically connected to the communication module of the electronic device 400 and transmits / receives communication signals (e.g., RF signals) to and from an external device. In one embodiment, the frame 420 is electrically connected to the communication module via RF wiring, where RF wiring is a component that transmits RF (radio frequency) signals. The RF wiring transmits the RF signals processed by the communication module of the electronic device 400 to the frame 420, which acts as an antenna, or transmits the RF signals received from the frame 420 to the communication module.

[0065] In one embodiment, as shown in Figure 4, the frame 420 includes a plurality of first segmental parts 430. The frame 420 is physically divided into a plurality of parts by the first segmental parts 430. Here, the first segmental part 430 is a space formed in the frame 420 such that a single frame 420 is divided into a plurality of parts. In another embodiment, the first segmental part 430 is a space formed by a plurality of frames 420 being arranged at a distance from each other.

[0066] In one embodiment, referring to Figure 4, the frame 420 is physically divided into a first frame 420-1 and a second frame 420-2 by a first segment 430. In one embodiment, the first frame 420-1 is a part of the frame 420 that is positioned between the corners (edges) of the electronic device 400 and constitutes the external appearance of the electronic device 400. The second frame 420-2 is a part of the frame 420 that is positioned at the corners (edges) of the electronic device 400 and constitutes the external appearance of the electronic device 400.

[0067] In one embodiment, the frame 420 is electrically separated by placing a first insulating member 440 in the first segmented portion 430. Here, the first insulating member 440 means a material with low electrical conductivity or a material with low dielectric constant. In one embodiment, when the frame 420 is used as an antenna for an electronic device 400, the antenna resonant frequency is determined by the physical length of the frame 420. The frame 420 is divided into multiple parts having different lengths by the first insulating member 440 placed in the first segmented portion 430. In this way, each divided frame 420 has a different resonant frequency. By utilizing frames 420 each having a different resonant frequency, communication in various frequency bands (e.g., short-range communication, long-range communication) becomes possible.

[0068] According to one embodiment, various electronic components that transmit or receive electrical signals are arranged inside the electronic device 400. Such components are hereinafter referred to as "electrical components". The electrical components are formed of a conductive material or include at least one conductive material. In one embodiment, the electrical components are arranged in a portion adjacent to a first insulating member 440 that electrically divides the frame 420 into multiple parts. The arrangement of the electrical components adjacent to the first insulating member 440 causes a coupling phenomenon to occur between the divided multiple frames 420. As described above, each frame 420 has a preset resonant frequency. When a coupling phenomenon occurs between multiple frames 420, the resonant frequency of the frame 420 is changed. Therefore, the efficiency of transmitting or receiving communication signals via the frame 420 is reduced.

[0069] In one embodiment, the electronic device 400 includes a conductive connecting member 450. When the conductive connecting member 450 is positioned adjacent to the first insulating member 440, a coupling phenomenon occurs between the multiple frames 420, as described above. To prevent such a phenomenon, the conductive connecting member 450 is divided into multiple parts by a second segment 460. For example, referring to Figure 4, the conductive connecting member 450 is divided into a first conductive connecting member 450-1 and a second conductive connecting member 450-2 with respect to the second segment 460. The second segment 460 is located corresponding to the first segment 430. For example, when viewing the electronic device 400 in the +Y direction with respect to Figure 4, the first segment 430 and the second segment 460 coincide, or one of the first segment 430 and the second segment 460 includes the other. As described later, the first conductive connecting member 450-1 is attached to a side member 550 that is positioned between the frame 420 and the display module 410, at least in part, so as to correspond to the first frame 420-1. The second conductive connecting member 450-2 is attached to the side member 550 so as to correspond to the second frame 420-2. The conductive connecting member 450 is positioned separated based on the second segmented portion 460 corresponding to the first segmented portion 430, so as to avoid being positioned adjacent to the first insulating member 440 that fills the first segmented portion 430. Therefore, the coupling phenomenon between the multiple frames 420 is mitigated or resolved.

[0070] In one embodiment, the frame 420 is positioned to surround a housing (e.g., the housing 210 in Figures 2A and 2B) on which electronic components are arranged, thereby forming the side view of the electronic device 400. The housing is formed of a material other than metal, at least in part. For example, the portion of the housing adjacent to the first insulating member 440 is formed of a material other than metal. Referring to Figure 5B, the internal injection molding 580 constituting the housing is located adjacent to the first insulating member 440. The internal injection molding 580 is formed of a non-metallic material such as synthetic resin, ceramics, or engineering plastic. Thus, the coupling phenomenon between the multiple frames 420 separated by the first insulating member 440 is mitigated or resolved.

[0071] According to one embodiment, as shown in Figure 4, the electronic device 400 includes a side member 550, at least a portion of which is positioned between the frame 420 and the display module 410. The side member 550 is positioned on the outer periphery of the frame 420 and the display module 410. (For example, edges) The first partition wall section 550-1 is positioned between them. (For example, Part 1, 550-1) And, extending from the first partition wall 550-1, a second partition wall 550-2 is formed to cover at least a portion of the outer periphery of the display module 410. (For example, Part 2, pp. 550-2) This includes the following. In one embodiment, the first partition wall 550-1 is positioned between the frame 420 and the display module 410, spaced apart from the first frame 420-1. By positioning the first partition wall 550-1 apart from the frame 420, a space is formed between the first partition wall 550-1 and the frame 420. In one embodiment, the second partition wall 550-2 covers at least a portion of the outer periphery of the display module 410 when the display module 410 is viewed from the -Z direction in Figure 2A with respect to the electronic device 400.

[0072] In one embodiment, the side member 550 is formed of a non-metallic material such as synthetic resin, ceramics, or engineering plastic so as not to cause coupling between the multiple frames 420 separated by the first segment 430. When the side member 550 is formed of a non-electrically conductive material, electric charge accumulates on the side member 550. If there is no path for the accumulated charge on the side member 550 to flow, electrostatic discharge (ESD) occurs. In particular, the side member 550 is a part that is frequently touched when the user grasps the electronic device 400, and is a part where charge often accumulates. According to one embodiment disclosed herein, a conductive connecting member 450 can be used to induce the flow of charge and reduce the electrostatic discharge phenomenon on the side member 550.

[0073] In one embodiment, as shown in Figure 5A, the conductive connecting member 450 is positioned on the side member 550. The conductive connecting member 450 can be positioned on the side member 550 in various ways. For example, the conductive connecting member 450 can be attached to the side member 550 by an adhesive such as a bond (registered trademark) or double-sided tape. In one embodiment, the conductive connecting member 450 is deposited on the side member 550 in the form of a thin film. For example, the conductive connecting member 450 can be deposited using various methods such as CVD (chemical vapor deposition) or PVD (physical vapor deposition). In addition, the conductive connecting member 450 can be positioned on the side member 550 in various ways within a range that is deformable by an ordinary technician.

[0074] In one embodiment, as shown in Figure 5B, the conductive connecting member 450 is positioned in the first partition section 550-1 and the second partition section 550-2 so as to face the display module 410. In one embodiment, referring to Figures 5A and 5B, the conductive connecting member 450 is in a form that extends from the second partition section 550-2 to the first partition section 550-1. As described above, the conductive connecting member 450 is divided into the first conductive connecting member 450-1 and the second conductive connecting member 450-2 by the second segmented section 460. The first conductive connecting member 450-1 is attached to the side member 550 so as to correspond to the first frame 420-1. In one embodiment, referring to Figure 4, the first conductive connecting member 450-1 is positioned between the corners of the electronic device 400 so as to correspond to the first frame 420-1, and faces the connecting members (520, 530) including the bending portion 520 and protective layer 530 of the display module 410, which will be described later. The second conductive connecting member 450-2 is positioned on the side member 550 so as to correspond to the second frame 420-2. By positioning the second conductive connecting member 450-2 at the corner of the electronic device 400 so as to correspond to the second frame 420-2, it is adjacent to the support member 540 of the display module 410, which is located in the inner region of the bending portion 520 of the display module 410. On the other hand, the first conductive connecting member 450-1 does not need to be adjacent to the support member 540 because the bending portion 520 covers the support member 540 which is located in the inner region of the bending portion 520.

[0075] According to one embodiment, as shown in Figure 5B, the display module 410 includes a connecting member (520, 530) comprising a bending portion 520 connected to a display panel and extending to the back of the display module 410, and a protective layer 530 surrounding the outer surface of the bending portion 520. The connecting member (520, 530) is electrically connected to a printed circuit board located on the back of the display module 410 (for example, the surface oriented in the -Z direction with reference to Figure 5B). The protective layer constituting the connecting member (520, 530) is formed of a flexible material so as to bend together with the bending portion 520 in response to the rotation of the bending portion 520. The protective layer is made of an insulating material and protects the bending portion 520 from charges accumulated in the electronic device 400. The bending portion 520 includes a DDI (display driver IC). The bending portion 520 is formed integrally with a substrate (not shown) located on the display module 410. For example, the display module 410 includes a COP (chip on panel) structure in which the DDI is placed on a bending portion 520 formed integrally with the substrate of the display module 410. In one embodiment, the display module 410 includes a COF (chip on film) structure in which the bending portion 520 on which the DDI is placed is manufactured separately and connected to the substrate of the display module 410. In this case, the bending portion 520 is a flexible printed circuit board (FPCB).

[0076] In one embodiment, referring to Figure 5B, the display module 410 includes a support member 540 made of a conductive material. The support member 540 is a ground point with a relatively low potential compared to its surroundings. For example, the support member 540 is electrically connected to a printed circuit board connected to at least one ground. Charges accumulated in the electronic device 400 are induced to the support member 540, which acts as a ground point with a relatively low potential. By moving the charge to the support member 540, charge does not accumulate around the support member 540.

[0077] According to one embodiment, an ESD (electrostatic discharge) phenomenon occurs due to accumulated charge. Here, the ESD phenomenon refers to an electrical phenomenon that occurs when accumulated charge due to various factors instantaneously moves to another part. Since ESD is accompanied by a strong voltage, if the ESD phenomenon occurs in an electronic component, it can lead to damage to the electronic component. Such damage can cause problems such as the electronic device 400 not being able to operate normally or its performance degrading.

[0078] In one embodiment, charges accumulated in the electronic device 400 move into the electronic device 400 through gaps formed by the design of the electronic device 400. For example, the second partition portion 550-2 of the side member 550 is separated from the display module 410 in the +Z direction with reference to Figure 5B. In such a case, a gap is created between the second partition portion 550-2 and the display module 410. Charges accumulated outside the electronic device 400 move into the electronic device 400 through the gap between the second partition portion 550-2 of the side member 550 and the display module 410. In one embodiment, if a structure is not designed to ground the charges accumulated in the electronic device 400, the accumulated charges will discharge to electronic components and damage them. For example, the electronic components constituting the display module 410 will be damaged by the ESD phenomenon, where the accumulated charges discharge to the electronic components constituting the display module 410. Embodiments disclosed herein present paths through which the accumulated charges move. The formation of charge transfer paths within the electronic device 400 mitigates or resolves the phenomenon of damage to electronic components.

[0079] According to one embodiment, the charge accumulated in the electronic device 400 is moved to the ground, which has a relatively lower potential, through the conductive connecting member 450 located on the side member 550.

[0080] In one embodiment, the first conductive connecting member 450-1 is positioned on the side member 550 so as to face the connecting members (520, 530) of the display module 410, which include a bending portion 520 covered with a protective layer 530 made of an insulating material, as described above. The bending portion 520, as described above, shields the conductive support member 540, which is located in the inner region of the bending portion 520, from the first conductive connecting member 450-1. In this case, it is impossible for the accumulated charge to be conducted to the support member 540 through the first conductive connecting member 450-1. In such a structure, the accumulated charge moves through the first conductive connecting member 450-1 to the relatively lower potential ground. Consequently, the accumulated charge is conducted to an electronic component located in a portion adjacent to the first conductive connecting member 450-1, inducing damage to the electronic component. According to embodiments disclosed herein, a path is presented for moving the charge accumulated in an electronic device 400 to a relatively lower potential using the first conductive connecting member 450-1. The following describes the charge transfer paths presented in this invention.

[0081] According to one embodiment, as shown in Figures 5A and 5B, an opening 560 is formed in the side member 550. The opening 560 is formed in at least one of the first partition wall portion 550-1 and the second partition wall portion 550-2 that constitute the side member 550. In one embodiment, referring to Figure 5A, the opening 560 is formed in the first partition wall portion 550-1 of the side member 550. Here, as shown in Figure 5B, the opening 560 is a passage connecting the space between the first frame 420-1 and the first partition wall portion 550-1 and the internal space of the electronic device 400.

[0082] In one embodiment, the first conductive connecting member 450-1 is positioned to extend from the second partition portion 550-2 to the first partition portion 550-1, with at least a portion of the first conductive connecting member 450-1 positioned in the opening 560. In one embodiment, referring to Figure 5B, the first conductive connecting member 450-1 includes a pad portion 610, at least a portion of which is positioned in the opening 560.

[0083] According to one embodiment disclosed herein, the first conductive connecting member 450-1 is a path through which accumulated charge moves to ground. The first conductive connecting member 450-1 guides the flow of charge from the second partition 550-2 to the frame 420. As described above, the first conductive connecting member 450-1 extends from the second partition 550-2 to the first partition 550-1 and is positioned on the side member 550. A portion of the first conductive connecting member 450-1 is located in an opening 560 formed in the first partition 550-1. In one embodiment, referring to Figure 5B, accumulated charge outside the electronic device 400 moves into the electronic device 400 through the gap between the side member 550 and the display module 410. The accumulated charge moves along the first conductive connecting member 450-1 positioned on the second partition 550-2 to the first conductive connecting member 450-1 positioned on the first partition 550-1. Because a portion of the first conductive connecting member 450-1 is positioned adjacent to the opening 560, the accumulated charge is discharged into the air through the opening 560. The charge discharged into the air is conducted to the first frame 420-1, which is made of a conductive material. The first frame 420-1 is electrically connected to at least one ground, so the accumulated charge flows to the ground, which has a relatively lower potential. In addition, the first conductive connecting member 450-1 is a path for conducting the accumulated charge to the opening 560 so that the charge accumulated inside the electronic device 400 by the operation of electronic components passes through the opening 560 and is conducted to the first frame 420-1. Therefore, by moving the accumulated charge to the ground, the ESD phenomenon generated by the accumulated charge is mitigated or resolved.

[0084] However, this does not mean that the accumulated charge is limited to moving to the opening 560 only through the first conductive connecting member 450-1. In other embodiments, the accumulated charge moves along the second conductive connecting member 450-2 to an opening 560 formed in the side member 550 and discharges into the air from the opening 560. The accumulated charge is conducted through the opening 560 to the second frame 420-2. The accumulated charge flows to a relatively lower potential ground as the second frame 420-2 is electrically connected to at least one ground.

[0085] According to one embodiment, the accumulated charge is conducted to the second conductive connecting member 450-2. As described above, the second conductive connecting member 450-2 is located at the corner of the electronic device 400 corresponding to the second frame 420-2, and is positioned adjacent to the support member 540 of the display module 410, which is located in the inner region of the bending portion 520 of the display module 410. The second conductive connecting member 450-2 induces a flow of charge to the support member 540. The accumulated charge moves along the second conductive connecting member 450-2 and is conducted to the conductive support member 540 located on the display module 410. By moving the accumulated charge to the support member 540 which is electrically connected to ground, the ESD phenomenon caused by the accumulated charge is mitigated or resolved.

[0086] According to one embodiment, a second insulating member 570 is placed between the side member 550 and the display module 410. Referring to Figure 5B, in a part of the display module 410, the electronic components constituting the display module 410 are exposed. If the charge accumulated in the electronic device 400 is conducted to the electronic components constituting the display module 410, damage will occur to the electronic components. To mitigate this problem, the second insulating member 570 is placed so as to cover the area of ​​the display module 410 where the electronic components are exposed.

[0087] In one embodiment, the second insulating member 570 guides the accumulated charge to be conducted to the conductive connecting member 450 without being conducted to areas where the electronic components constituting the display module 410 are exposed. For example, referring to Figure 5B, the second insulating member 570 is positioned to cover the first conductive connecting member 450-1 which is located between the display module 410 and the second partition 550-2. The second insulating member 570 also seals the gap between the second partition 550-2 and the display module 410. When the charge accumulated outside the electronic device 400 moves inside the electronic device 400 through the gap in the electronic device 400, it is conducted to the first conductive connecting member 450-1 without being conducted to areas where the electronic components constituting the display module 410 are exposed.

[0088] According to one embodiment, the conductive connecting member 450 is positioned adjacent to an opening 560 formed in the side member 550 in various ways. In one embodiment, the conductive connecting member 450 includes a pad portion 610. The pad portion 610 is positioned adjacent to the opening 560. Referring to Figures 5A and 5B, the pad portion 610 is positioned adjacent to the opening 560 such that a portion of the opening 560 is obscured. In another embodiment, the pad portion 610 is positioned inside the opening 560. Referring to Figure 6A, the pad portion 610 is positioned inside the opening 560 adjacent to the frame 420. In yet another embodiment, referring to Figure 6B, the pad portion 610 fills the opening 560. For example, the pad portion 610 is manufactured in a form corresponding to the opening 560 and positioned in the opening 560, or it is deposited inside the opening 560 by various methods such as CVD or PVD. In addition, the pad portion 610 can be positioned in the opening 560 in various ways within the range of deformation possible by an ordinary technician.

[0089] According to one embodiment, the pad portion 610 is either filled inside the opening 560 or positioned inside the opening 560 and in contact with the frame 420, which is made of a conductive material. In such a case, the resonant frequency of the frame 420 may be changed by the electrical connection between the frame 420 and the conductive connecting member 450, making communication in the desired frequency band impossible. Therefore, the pad portion 610 is positioned at a distance from the frame 420 so as not to come into contact with it.

[0090] According to one embodiment, an auxiliary connecting member 620 is positioned between the frame 420 and the side member 550. Referring to Figure 6C, the auxiliary connecting member 620 is positioned on the first partition 550-1 so as to cover at least a portion of the opening 560 in the region between the frame 420 and the first partition 550-1. The auxiliary connecting member 620 is formed of a conductive material such as metal. The auxiliary connecting member 620 increases the electrical conductivity that allows charge discharged into the air from the opening 560 to be conducted to the frame 420. In one embodiment, the auxiliary connecting member 620 is attached to the side member 550 by an adhesive such as Bond® or double-sided tape so as to cover at least a portion of the opening 560. In another embodiment, the auxiliary connecting member 620 is deposited onto the side member 550 by CVD or PVD so as to cover at least a portion of the opening 560. In addition, the auxiliary connecting member 620 may be positioned on the side member 550 in various ways within the range of deformation possible by an ordinary technician.

[0091] Figure 7A is an enlarged view of the second conductive connecting member 450-2 according to one embodiment. Figure 7B is a perspective view of the third conductive connecting member 730 arranged on the second conductive connecting member 450-2 according to one embodiment. Figure 7C is a diagram showing the pattern of the insulating layer 760 constituting the third conductive connecting member 730 according to one embodiment.

[0092] According to one embodiment, the conductive connecting member 450 is formed in various forms depending on the shape of the side member 550 to which the conductive connecting member 450 is attached or vapor-deposited. For example, depending on the design of the electronic device 400, some areas of the side member 550 are formed to be relatively narrower than other areas. In such cases, the conductive connecting member 450 is formed to correspond to the shape of the side member 550 so as to be attached to the side member 550, or is vapor-deposited onto the side member 550 to correspond to the shape of the side member 550.

[0093] In one embodiment, referring to Figure 7A, the second conductive connecting member 450-2 is located at the corner of the electronic device 400. A portion of the side member 550 that constitutes the corner of the electronic device 400 is formed such that a part of it is relatively narrower than other parts, depending on the design of the electronic device 400. The second conductive connecting member 450-2 is formed to correspond to the shape of the side member 550 so as to be attached to the side member 550 that constitutes the corner of the electronic device 400. For example, as shown in Figure 7A, the second conductive connecting member 450-2 includes a first region 710 and a second region 720 that is narrower than the first region 710. In such a case, when the charge accumulated in the electronic device 400 moves through the second conductive connecting member 450-2 to the conductive support member 540 located in the display module 410 (for example, the display module 160 in Figure 1, the display 201 in Figure 2A, or the display 330 in Figure 3), a charge bottleneck phenomenon occurs in the second region 720 because the second region 720 connected to the first region 710 is narrow. In such a case, the electrical conductivity at which the accumulated charge is conducted to the support member 540 located in the display module 410 decreases. In addition, some of the accumulated charge is conducted to electronic components, inducing damage to those electronic components.

[0094] According to one embodiment, a third conductive connecting member 730 is placed on the second conductive connecting member 450-2. The third conductive connecting member 730 is placed in the second region 720 of the second conductive connecting member 450-2. By placing the third conductive connecting member 730, the conductive region is substantially expanded by the thickness H of the third conductive connecting member 730. Therefore, the third conductive connecting member 730 expands the path through which the accumulated charge moves, and the bottleneck phenomenon of charge generated in the second region 720 is eliminated.

[0095] In one embodiment, as shown in Figure 7B, the third conductive connecting member 730 is laminated in the order of first conductive layer 740 - insulating layer 760 - second conductive layer 750. In another embodiment, the third conductive connecting member 730 has a structure in which a plurality of conductive layers and a plurality of insulating layers are laminated. Here, the insulating layer 760 is formed to be relatively thinner than the first conductive layer 740 and the second conductive layer 750 so that charge moves between the first conductive layer 740 and the second conductive layer 750. For example, referring to Figure 7B, the thickness c of the insulating layer 760 is formed to be relatively thinner than the thickness a of the first conductive layer 740 and the thickness b of the second conductive layer 750.

[0096] In one embodiment, the third conductive connecting member 730 is positioned such that the first conductive layer 740 is in contact with the second region 720 of the second conductive connecting member 450-2. Charges accumulated in the electronic device 400 travel along the second conductive connecting member 450-2 and pass through the first conductive layer 740-insulating layer 760-second conductive layer 750 of the third conductive connecting member 730 in that order to be conducted to the conductive support member 540 located in the display module 410. In one embodiment, the third conductive connecting member 730 means the second conductive connecting member 450-2. For example, the second conductive connecting member 450-2 includes the first conductive layer 740, the second conductive layer 750, and the insulating layer 760.

[0097] According to one embodiment disclosed herein, the third conductive connecting member 730 has the effect of increasing its surface area by having an insulating layer 760 positioned between the first conductive layer 740 and the second conductive layer 750. In such a case, the resistance of the third conductive connecting member 730 is reduced, and the flow of charge passing through the third conductive connecting member 730 becomes smoother. Therefore, the charge accumulated in the electronic device 400 moves smoothly along the third conductive connecting member 730 to the conductive support member 540 positioned in the display module 410.

[0098] In one embodiment, as shown in Figure 7C, the insulating layer 760 includes a hole 760-1 formed to allow conductivity between the first conductive layer 740 and the second conductive layer 750. When the hole 760-1 is formed, the charge moves more smoothly between the first conductive layer 740 and the second conductive layer 750 compared to when only the insulating layer 760 is present between the first conductive layer 740 and the second conductive layer 750. In one embodiment, referring to Figure 7C, the insulating layer 760 includes a slit pattern 760-2. In this case, the charge can move more smoothly between the first conductive layer 740 and the second conductive layer 750 compared to when only the insulating layer 760 is present between the first conductive layer 740 and the second conductive layer 750.

[0099] In the above description, for the sake of clarity, the third conductive connecting member 730 has been described as being located in a portion of the second conductive connecting member 450-2, but it is not necessarily limited to being located in the second conductive connecting member 450-2. In one embodiment, the first conductive connecting member 450-1 experiences a charge bottleneck phenomenon due to one region being formed narrower than other regions. In such a case, the third conductive connecting member 730 is positioned in the relatively narrow region of the first conductive connecting member 450-1 so as to mitigate or resolve the charge bottleneck phenomenon occurring in the narrow region of the first conductive connecting member 450-1.

[0100] Figure 8 is a schematic diagram showing the components of a foldable electronic device 800 according to one embodiment of the present invention.

[0101] The above description assumes that the electronic device 400 according to one embodiment disclosed herein (for example, the electronic device 101 in Figure 1, the electronic device 200 in Figure 2A, and / or the electronic device 300 in Figure 3) is a bar-shaped electronic device. However, the embodiments disclosed herein also apply to the foldable electronic device 800 shown in Figure 8. The electronic device 800 shown in Figure 8 is an example of the electronic device 101 in Figure 1, the electronic device 200 in Figure 2A, the electronic device 300 in Figure 3, and / or the electronic device 400 in Figure 4 described above.

[0102] According to one embodiment disclosed herein, as shown in Figure 8, the electronic device 800 includes a first housing 811 (e.g., housing 210 in Figures 2A and 2B), a second housing 812 (e.g., housing 210 in Figures 2A and 2B), and a hinge device 813. The first housing 811 houses a camera module 820 (e.g., camera module 180 in Figure 1 or camera module 205 in Figure 2A), a first battery (not shown) (e.g., battery 189 in Figure 1 or battery 350 in Figure 3), a first acoustic output device 831 (e.g., acoustic output module 155 in Figure 1 or acoustic output device 214 in Figure 2A), and a first printed circuit board 841 which is electrically connected to the electronic components located in the first housing 811. Here, the first acoustic output device 831 located in the first housing 811 is a telephone receiver. The receiver is used to receive incoming telephone calls. The second housing 812 houses a second battery (not shown) (e.g., battery 189 in Figure 1 or battery 350 in Figure 3), a second sound output device 832 (e.g., audio module 170 in Figure 1 or sound output device 207 in Figure 2A), and a second printed circuit board 842 which is electrically connected to the electronic components located in the second housing 812. Here, the first sound output device 831 and the second sound output device 832 are connected to a plurality of speaker holes for radiating sound generated by the electronic device 800. In addition, various other electronic components are located in at least one of the first housing 811 and the second housing 812. At least some of the components described above may be omitted, or other components may be added.

[0103] In one embodiment, the first housing 811 and the second housing 812 are rotatably connected to each other via a hinge device 813. Here, the hinge device 813 is a general term for a hinge structure that rotatably connects the first housing 811 and the second housing 812. For example, the second housing 812 rotates and folds relative to the first housing 811.

[0104] According to one embodiment, the overall shape of the electronic device 800 is changed by folding the first housing 811 and the second housing 812 relative to each other. For example, the overall shape of the pair of housings 810 (e.g., the housings 210 in Figures 2A and 2B) is changed by the angle and distance between them depending on whether the electronic device 800 is in an unfolded state (flat state or unfolding state), a folded state, or an intermediate state where the first housing 811 and the second housing 812 are at a predetermined angle.

[0105] In one embodiment, the folded state of the electronic device 800 is such that the first housing 811 and the second housing 812 are substantially facing each other. When the electronic device 800 is folded in this way, it is transformed into a more compact form overall, thereby improving its portability. In addition, when the electronic device 800 is folded, the portion of the display module 410 (for example, the display module 160 in Figure 1, the display 201 in Figure 2A, the display 330 in Figure 3, or the display module 410 in Figure 4) that is exposed to the outside is reduced. This reduces the risk of damage to the display module 410 due to external impact.

[0106] According to one embodiment, the first housing 811 and the second housing 812 are arranged on either side of a folding axis (for example, the BB axis in Figure 8) and have a substantially symmetrical shape with respect to the folding axis. Here, the folding axis refers to a virtual axis.

[0107] According to one embodiment, the pair of housings 810 are formed in various ways. For example, they are formed by injection molding, die casting, etc. The pair of housings 810 are formed from various materials. For example, they are formed from metallic materials and / or non-metallic materials. Here, metallic materials include aluminum, stainless steel (STS, SUS), iron, magnesium, or titanium alloys, and non-metallic materials include synthetic resins, ceramics, or engineering plastics. The pair of housings 810 are connected in various ways by multiple parts separated from each other. For example, they can be joined by adhesive, welding, or bolting. The form, material, or method of forming the housing 810 in Figure 8 described above is merely illustrative, and the housing 810 can be modified in various ways to the extent that it is possible for an ordinary technician in the art to do so.

[0108] According to one embodiment, a display module 410 supported by a pair of housings 810 is positioned on the front of the electronic device 800. The display module 410 includes any of various devices for displaying visual information. According to one embodiment, at least a portion of the display module 410 is folded by rotation of the first housing 811 and the second housing 812.

[0109] According to one embodiment, the display module 410 is a flexible display in which at least a portion of the area is folded. In one embodiment, the substrate of the display module 410 is formed of a flexible material. For example, the substrate of the display module 410 is formed of a polymer material such as polyethylene terephthalate (PET), polyimide (PI), or ultra-thin glass (UTG) processed to an extremely thin thickness.

[0110] According to one embodiment, as shown in Figure 8, a flexible printed circuit board 850 (for example, the board 340 in Figure 3) electrically connects electronic components arranged in an electronic device 800. For example, the flexible printed circuit board 850 electrically connects electronic components arranged in the first housing 811 and electronic components arranged in the second housing 812.

[0111] An electronic device 800 according to one embodiment disclosed herein includes a frame 420 (e.g., a side bezel structure 218 in Figure 2A or a side member 310 in Figure 3) that constitutes the appearance of a side of the electronic device 800 (e.g., side 210C in Figure 2A), as shown in Figure 4. In one embodiment, the frame 420 is arranged to surround the display module 410 of the electronic device 800. In one embodiment, the frame 420 is formed of a conductive material such as a metal. For example, the frame 420 is formed of a metal material including aluminum (Al).

[0112] In one embodiment, as shown in Figure 4, the frame 420 includes a plurality of first segmental parts 430. The frame 420 is physically divided into a plurality of parts by the first segmental parts 430. Here, the first segmental part 430 is a space formed in the frame 420 such that a single frame 420 is divided into a plurality of parts. In another embodiment, the first segmental part 430 is a space formed by a plurality of frames 420 being arranged at a distance from each other.

[0113] In one embodiment, referring to Figure 4, the frame 420 is physically divided into a first frame 420-1 and a second frame 420-2 by a first segment 430. In one embodiment, the first frame 420-1 is a part of the frame 420 that is positioned between the corners (edges) of the electronic device 800 and constitutes the external appearance of the electronic device 800. The second frame 420-2 is a part of the frame 420 that is positioned at the corners (edges) of the electronic device 800 and constitutes the external appearance of the electronic device 800.

[0114] In one embodiment, the electronic device 800 includes a conductive connecting member 450. When the conductive connecting member 450 is positioned adjacent to the first insulating member 440, a coupling phenomenon occurs between the multiple frames 420, as described above. To prevent such a phenomenon, the conductive connecting member 450 is divided into multiple parts by a second segment 460. For example, referring to Figure 4, the conductive connecting member 450 is divided into a first conductive connecting member 450-1 and a second conductive connecting member 450-2 with respect to the second segment 460. The second segment 460 is located corresponding to the first segment 430. For example, when viewing the electronic device 800 in the +Y direction with respect to Figure 4, the first segment 430 and the second segment 460 coincide, or one of the first segment 430 or the second segment 460 includes the other. The first conductive connecting member 450-1 is attached to a side member 550 that is positioned between the frame 420 and the display module 410, at least in part, so as to correspond to the first frame 420-1. The second conductive connecting member 450-2 is attached to the side member 550 so as to correspond to the second frame 420-2. The conductive connecting member 450 is positioned separated based on the second segmented portion 460 corresponding to the first segmented portion 430, so as not to be positioned adjacent to the first insulating member 440 that fills the first segmented portion 430. This mitigates or resolves the coupling phenomenon between the multiple frames 420.

[0115] According to one embodiment disclosed herein, as shown in Figure 5B, the conductive connecting member 450 is a path through which accumulated charge moves to ground. The first conductive connecting member 450-1 guides the flow of charge from the second partition 550-2 to the frame 420. As described above, the first conductive connecting member 450-1 extends from the second partition 550-2 to the first partition 550-1 and is positioned on the side member 550. A portion of the first conductive connecting member 450-1 is located in an opening 560 formed in the first partition 550-1. In one embodiment, referring to Figure 5B, accumulated charge outside the electronic device 800 moves into the electronic device 800 through the gap between the side member 550 and the display module 410. The accumulated charge moves along the first conductive connecting member 450-1 positioned on the second partition 550-2 to the first conductive connecting member 450-1 positioned on the first partition 550-1. Because a portion of the first conductive connecting member 450-1 is positioned adjacent to the opening 560, the accumulated charge is discharged into the air through the opening 560. The charge discharged into the air is conducted to the first frame 420-1, which is made of a conductive material. Because the first frame 420-1 is electrically connected to at least one ground, the accumulated charge flows to the ground, which has a relatively lower potential. In addition, the first conductive connecting member 450-1 is a path for conducting the accumulated charge to the opening 560 so that the charge accumulated inside the electronic device 800 by the operation of electronic components is conducted through the opening 560 to the first frame 420-1. Therefore, by moving the accumulated charge to the ground, the ESD phenomenon caused by the accumulated charge is mitigated or resolved. However, this does not mean that the accumulated charge is limited to moving to the opening 560 only through the first conductive connecting member 450-1. In another embodiment, the accumulated charge moves along the second conductive connecting member 450-2 to an opening 560 formed in the side member 550 and is discharged into the air through the opening 560. The accumulated charge is conducted through the opening 560 to the second frame 420-2. The accumulated charge flows to the relatively lower potential ground as the second frame 420-2 is electrically connected to at least one ground.

[0116] According to one embodiment, the accumulated charge is conducted to the second conductive connecting member 450-2. As described above, the second conductive connecting member 450-2 is located at the corner of the electronic device 800 corresponding to the second frame 420-2, and is positioned adjacent to the support member 540 of the display module 410, which is located in the inner region of the bending portion 520 of the display module 410. The second conductive connecting member 450-2 induces a flow of charge to the support member 540. The accumulated charge moves along the second conductive connecting member 450-2 and is conducted to the conductive support member 540 located on the display module 410. By moving the accumulated charge to the support member 540 which is electrically connected to ground, the ESD phenomenon caused by the accumulated charge is mitigated or resolved.

[0117] According to one embodiment, a third conductive connecting member 730 is placed on the second conductive connecting member 450-2. The third conductive connecting member 730 is placed in the second region 720 of the second conductive connecting member 450-2. By placing the third conductive connecting member 730, the conductive region is substantially expanded by the thickness H of the third conductive connecting member 730. Therefore, the third conductive connecting member 730 expands the path through which the accumulated charge moves, eliminating the bottleneck phenomenon of charge generated in the second region 720.

[0118] An electronic device 400 according to one embodiment disclosed herein (for example, electronic device 101 in Figure 1, electronic device 200 in Figure 2A, electronic device 300 in Figure 3, or electronic device 800 in Figure 8) includes a display module 410 (for example, display module 160 in Figure 1, display 201 in Figure 2A, or display 330 in Figure 3), a connecting member (520, 530) including a bending portion 520 connected to the display panel of the display module and extending to the back of the display module (for example, the surface oriented in the -Z direction with reference to Figure 5B), and a protective layer 530 formed of an insulating material that covers the bending portion, and a printed circuit board (for example, The device comprises a substrate 340 (as shown in Figure 3), a frame 420 (for example, the side bezel structure 218 in Figure 2A) made of a conductive material and arranged to surround at least a portion of the display module, a side member 550 including a first partition 550-1 arranged between the frame and the display module so as to be spaced away from the frame, and a second partition 550-2 arranged spaced away from the display module and covering at least a portion of the outer periphery of the display module, at least one opening 560 formed in the first partition, and a first conductive connecting member 450-1 extending from the second partition to the first partition, with at least a portion located in the opening and at least a portion facing the connecting member and arranged on the side member.

[0119] The frame also includes a first frame 420-1, at least a portion of which faces the connecting member of the display module, and a second frame 420-2, which is segmented from the first frame by a segmentation portion (for example, the first segmentation portion 430 in Figure 4).

[0120] The present invention further includes a second conductive connecting member 450-2 positioned on the side member to correspond to the second frame.

[0121] Furthermore, the first conductive connecting member induces a flow of charge from the second partition to the frame.

[0122] Furthermore, the printed circuit board is electrically connected to at least one ground located in the electronic device, and the frame is electrically connected to the printed circuit board.

[0123] The display module also includes a support member 540 made of a conductive material that is connected to at least one ground located in the electronic device.

[0124] Furthermore, the second conductive connecting member induces a flow of charge to the support member.

[0125] Furthermore, the first conductive connecting member includes a pad portion 610 that is positioned in an opening formed in the side member.

[0126] Furthermore, the pad portion of the first conductive connecting member is filled into the opening formed in the side member.

[0127] The system further includes an auxiliary connecting member 620, which is positioned in the first partition wall and is made of a conductive material, so as to cover at least a portion of the opening formed in the side member in the region between the frame and the first partition wall.

[0128] The material further includes a first insulating member 440 made of an insulating material, which is filled into the segmented portion formed in the frame.

[0129] The system further includes a second insulating member 570 made of an insulating material and positioned between the second partition and the display module.

[0130] Furthermore, the second conductive connecting member includes the first region 710 and a second region 720 which is narrower than the first region.

[0131] The present invention further includes a third conductive connecting member 730 disposed in the second region, the third conductive connecting member comprising a first conductive layer 740, a second conductive layer 750, and an insulating layer 760 disposed between the first conductive layer and the second conductive layer.

[0132] Furthermore, the insulating layer includes holes (for example, hole 760-1 in Figure 7C, or slit pattern 760-2 in Figure 7C) formed to allow conductivity between the first conductive layer and the second conductive layer.

[0133] An electronic device 400 according to other embodiments disclosed herein (e.g., electronic device 101 in Figure 1, electronic device 200 in Figure 2A, electronic device 300 in Figure 3, or electronic device 800 in Figure 8) includes a display module 410 (e.g., display module 160 in Figure 1, display 201 in Figure 2A, or display 330 in Figure 3), a connecting member (520, 530) including a bending portion 520 connected to the display panel of the display module and extending to the back of the display module (e.g., the surface oriented in the -Z direction with reference to Figure 5B), and a protective layer 530 made of an insulating material that covers the bending portion, a printed circuit board (e.g., board 340 in Figure 3) disposed on the back of the display module and connected to the display module by the connecting member, and at least one that is arranged to surround at least a portion of the display module. The structure comprises a frame 420 (for example, the side bezel structure 218 in Figure 2A) made of a conductive material, which includes a first frame 420-1, part of which faces the connecting member of the display module, and a second frame 420-2, which is segmented from the first frame by a segment (for example, the first segment 430 in Figure 4); a side member 550, which includes a first partition wall 550-1, which is positioned between the frame and the display module so as to be spaced away from the frame, and a second partition wall 550-2, which is positioned spaced away from the display module and covers at least a portion of the outer periphery of the display module; at least one opening 560 formed in the first partition wall; and a first conductive connecting member 450-1, which extends from the second partition wall to the first partition wall, with at least a portion located in the opening and at least a portion facing the connecting member and positioned on the side member.

[0134] The present invention further includes a second conductive connecting member 450-2 positioned on the side member to correspond to the second frame.

[0135] Furthermore, the first conductive connecting member induces a flow of charge from the second partition to the frame.

[0136] The display module also includes a support member 540 made of a conductive material that is connected to at least one ground located in the electronic device.

[0137] Furthermore, the second conductive connecting member induces a flow of charge to the support member.

[0138] The embodiments of the present invention disclosed herein and in the drawings are intended to facilitate the technical details of the embodiments disclosed herein and to present specific forms in order to aid in the understanding of the embodiments disclosed herein, and are not intended to limit the scope of the embodiments of the present invention. Accordingly, the scope of the embodiments disclosed herein should be interpreted to include not only the embodiments disclosed herein but also any modified or altered forms derived from the technical idea of ​​the present invention. [Explanation of symbols]

[0139] 100 Network Environment 101, 102, 104, 200, 300, 400, 800 Electronic equipment 108 servers 120 processors 121 Main Processor 123 Auxiliary processors 130 memory 132 Volatile memory 134 Non-volatile memory 136 Interior memory 138 External memory 140 programs 142 Operating Systems (OS) 144 Middleware 146 applications 150 Input Modules 155 Audio Output Module 160, 410 display modules 170 Audio Modules 176 Sensor Modules 177 Interface 178 Connection terminals 179 Haptic Modules 180, 820 Camera Module 188 Power Management Modules 189,350 batteries 190 Communication Module 192 Wireless Communication Module 194 Wired communication module 196 Subscriber Identification Module 197 Antenna Module 198, 199 First and Second Networks 201,330 displays 202 Front Plate 203 Input device (microphone) 204, 219 (1st, 3rd) sensor modules 205, 212 (1st and 2nd) camera modules 207 Audio output device (speaker: external speaker) 208 (1st) Connector, Connector Hole 210, 810 Housing 210A, 210B 1st, 2nd side 210C side 210D, 710 1st area 210E, 720 2nd area 211 Back plate 213 Flash 214. Audio output device (speaker: receiver for telephone calls) 217 Key Input Device 218 Side bezel structure (side components) 310, 550 Side components (side bezel structure) 311 First support member (bracket or support structure) 320 Front plate (front cover) 340 circuit boards 360 Second support member (rear case) 370 Antenna 380 Back plate (back cover) 420 frames 420-1, 420-2, Frames 1 and 2 430, 460 Sections 1 and 2 440, 570 First and second insulating members 450 Conductive connecting member 450-1, 450-2, 730 First, second, and third conductive connecting members 520 Bending section (connecting member) 530 Protective layer (connecting member) 540 Support member 550-1, 550-2 1st and 2nd bulkhead parts 560 aperture 580 Internal injections 610 Pad section 620 Auxiliary connecting member 740, 750 First and second conductive layers 760 Insulating layer 760-1 Hole 760-2 Slit Pattern 811, 812 First and Second Housings 813 Hinge device 831, 832 First and second acoustic output devices 841, 842 1st, 2nd printed circuit board 850 Flexible Printed Circuit Boards

Claims

1. An electronic device, A display module including a display panel, A frame including a conductive frame portion which at least part constitutes the external appearance of the electronic device and is made of a conductive material, A side member comprising a first portion disposed between the frame and the display module, and a second portion covering at least a portion of the edge of the display module, At least one opening formed in the first portion and adjacent to the conductive frame portion, An electronic device comprising: a first conductive member located between the display module and the side member, extending from the second portion to the first portion, with at least a portion adjacent to or located within the opening.

2. A connecting member further comprising a bending portion connected to the display panel of the display module and extending to the back of the display module, and a protective layer formed of an insulating material and covering the bending portion, The electronic device according to claim 1, characterized in that the frame includes a first frame, at least a portion of which faces the connecting member of the display module, and a second frame, which is segmented from the first frame by a segmentation portion.

3. The electronic device according to claim 2, further comprising a second conductive member disposed on the side member so as to correspond to the second frame.

4. The electronic device according to claim 1, characterized in that an electric charge is induced from the first conductive member located in the second portion of the side member to the frame through the opening.

5. A printed circuit board disposed on the back of the display module and connected to the display module via the connecting member, further comprising at least one ground, The electronic device according to claim 2, characterized in that the frame is electrically connected to the printed circuit board.

6. The electronic device according to claim 3, characterized in that the display module includes a support member made of a conductive material connected to at least one ground located in the electronic device.

7. The electronic device according to claim 6, characterized in that the second conductive member induces a flow of charge in the support member.

8. The electronic device according to claim 1, characterized in that the first conductive member includes a pad portion disposed in the opening formed in the side member.

9. The electronic device according to claim 8, characterized in that the pad portion of the first conductive member is filled into the opening formed in the side member.

10. The electronic device according to claim 1, further comprising an auxiliary connecting member disposed in the first portion and made of a conductive material so as to cover at least a portion of the opening formed in the side member in the region between the frame and the first portion.

11. The electronic device according to claim 2, further comprising a first insulating member formed of an insulating material and filled into the segmented portion formed in the frame.

12. The electronic device according to claim 1, further comprising a second insulating member formed of an insulating material and disposed between the second portion and the display module.

13. The electronic device according to claim 3, characterized in that the second conductive member includes a first region and a second region that is narrower than the first region.

14. The invention further includes a third conductive member disposed in the second region, The electronic device according to claim 13, characterized in that the third conductive member includes a first conductive layer, a second conductive layer, and an insulating layer disposed between the first conductive layer and the second conductive layer.

15. The electronic device according to claim 14, characterized in that the insulating layer includes holes formed so that the first conductive layer and the second conductive layer conduct electricity.

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