Charged particle beam apparatus and method for adjusting the charged particle beam apparatus

Abstract

The present invention appropriately selects an adjustment to be executed, and executes the adjustment at an appropriate timing.　Provided is a charged particle beam device that generates an observation image of a sample by irradiating the sample with a charged particle beam, in which a control unit: executes a program to execute processing with respect to the sample (S601); selects an adjustment recipe to be executed from among a plurality of adjustment recipes on the basis of an adjustment history of the charged particle beam device or an observation image (S604); determines a timing for performing adjustment during execution of the program, on the basis of a status of the charged particle beam device and a program execution state (S605 to S607); and executes the selected adjustment recipe (S608).

Description

Technical Field

[0001] The present disclosure relates to a charged particle beam device and a method for adjusting a charged particle beam device.

Background Art

[0002] Charged particle beam devices such as a scanning electron microscope (SEM) and a focused ion beam (FIB) device are suitable for observing and processing semiconductor patterns formed on a semiconductor wafer with increasing miniaturization.

[0003] In order to perform high-precision observation and processing using devices such as SEM and FIB, the device conditions need to be properly adjusted. Patent Document 1 discloses a charged particle beam device that performs automatic adjustment such as axis adjustment of a charged particle beam at an appropriate timing. In the charged particle beam device of Patent Document 1, it is determined whether automatic adjustment is necessary at the timing when the optical conditions are changed (see S903 in FIG. 9), and automatic adjustment is executed when a considerable amount of time has elapsed since the previous automatic adjustment time.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Patent Document 1 discloses that automatic adjustment is executed at the timing when the optical conditions are changed or the measurement point is moved, but the content of the automatic adjustment executed in Patent Document 1 is fixed. Although various adjustments are required depending on the adjustment history of the charged particle beam device and the change in the observed image, in Patent Document 1, the adjustment incorporated in the recipe is automatically executed, so appropriate adjustment cannot be executed at an appropriate timing.

[0006] Therefore, this disclosure provides a charged particle beam apparatus capable of appropriately selecting and executing adjustments at the appropriate time. [Means for solving the problem]

[0007] To solve the above problems, the charged particle beam apparatus of the present disclosure is a charged particle beam apparatus that generates an observation image of a sample by irradiating the sample with a charged particle beam, and comprises a storage unit that stores a program for performing processing on the sample and a plurality of adjustment recipes for performing adjustments to the apparatus conditions of the charged particle beam apparatus, and a control unit that performs processing on the sample by executing the program stored in the storage unit and performs adjustments to the apparatus conditions by executing the adjustment recipes stored in the storage unit, wherein the control unit selects an adjustment recipe to be executed from the plurality of adjustment recipes stored in the storage unit based on the adjustment history or observation image of the charged particle beam apparatus, determines the timing to perform the adjustment during program execution based on the status of the charged particle beam apparatus and the execution status of the program, and executes the selected adjustment recipe. [Effects of the Invention]

[0008] According to this disclosure, it is possible to appropriately select and execute the necessary adjustments at the appropriate time.

[0009] Other issues, configurations, and effects not mentioned above will be clarified by the following description of the embodiments. [Brief explanation of the drawing]

[0010] [Figure 1] This figure shows the overall configuration of the FIB-SEM combined device according to the embodiment. [Figure 2] This is a block diagram showing the hardware configuration of the control device according to the embodiment. [Figure 3] This figure shows multiple adjustment recipes and application programs stored in the storage device of the embodiment. [Figure 4] This figure shows the adjustment recipe display screen shown on the display device of the embodiment. [Figure 5] This figure shows how to customize the adjustment recipe of the embodiment. [Figure 6] This is a flowchart showing the adjustment method for the FIB-SEM combined device of the embodiment. [Modes for carrying out the invention]

[0011] The embodiments of this disclosure will be described below with reference to the drawings.

[0012] (Overall configuration of the FIB-SEM combined system 100) Figure 1 shows the overall configuration of the FIB-SEM combined system 100. The FIB-SEM combined system 100 is a charged particle beam device that generates an observation image of a sample by irradiating the sample with charged particle beams (electron beam, focused ion beam, gas ion beam). In Figure 1, the FIB-SEM combined system 100 includes an electron beam tube (SEM tube) 10 in which an optical system for irradiating the sample with an electron beam is arranged inside, a focused ion beam tube (FIB tube) 20 in which an optical system for irradiating the sample with a focused ion beam is arranged inside, a gas ion beam tube 30, a secondary electron detector 4, and a gas gun 5. The FIB-SEM combined system 100 also includes a control unit 6, which is a computer system with a CPU and memory, a display unit 7, such as a liquid crystal display, an input device 8, such as a keyboard and mouse, and a storage device 9, such as an HDD (Hard Disk Drive) or SSD (Solid State Drive). Furthermore, the FIB-SEM combined apparatus 100 includes a sample stage 50 and a sample holder 51 placed on the sample stage 50. Some or all of the components of the FIB-SEM combined apparatus 100 are placed inside a vacuum chamber 40, and the vacuum chamber 40 is reduced to a predetermined vacuum level.

[0013] The sample stage 50 movably supports the sample stage 51, on which the sample 200 is placed. The sample stage 50 has a movement mechanism that can displace the sample stage 51 in five axes. This movement mechanism can be realized by various actuators such as a piazo element or a stepping motor. By displacing the sample stage 51 in five axes, the sample stage 50 moves the sample 200 to multiple irradiation positions for the electron beam, focused ion beam, and gas ion beam. At these irradiation positions, the surface (cross-section) of the sample 200 is irradiated with the electron beam, focused ion beam, and gas ion beam, and the sample 200 is processed (processed, observed).

[0014] The SEM tube 10, although not shown in the diagram, includes an electron source that emits electrons and an electron optical system that shapes and scans the electrons emitted from the electron source into a beam. When the electron beam, which is a charged particle beam, is irradiated onto the sample 200 from the SEM tube 10, secondary electrons are generated from the sample 200. These generated secondary electrons are detected by a secondary electron detector (not shown) inside the tube or by a secondary electron detector 4 outside the tube to obtain an observation image of the sample 200. The electron optical system includes, for example, a condenser lens that focuses the electron beam, an aperture that narrows the electron beam, an aligner that adjusts the optical axis of the electron beam, an objective lens that focuses the electron beam onto the sample 200, and a deflector that scans the electron beam on the sample 200.

[0015] The FIB microscope tube 20, although not shown in the figure, includes an ion source that generates ions and an ion optical system that shapes the ions emitted from the ion source into a focused ion beam and scans it. When the focused ion beam, which is a charged particle beam, is irradiated onto the sample 200 from the FIB microscope tube 20, secondary charged particles such as secondary ions and secondary electrons are generated from the sample 200. These secondary charged particles are detected by the secondary electron detector 4 to obtain an observation image of the sample 200. The FIB microscope tube 20 also etches (processes the cross-section of) the sample 200 in the irradiated area by increasing the amount of focused ion beam irradiation. The ion optical system has a known configuration and includes, for example, a condenser lens that focuses the focused ion beam, an aperture that narrows the focused ion beam, an aligner that adjusts the optical axis of the focused ion beam, an objective lens that focuses the focused ion beam onto the sample, and a deflector that scans the focused ion beam on the sample 200.

[0016] The gas ion beam microscope tube 30, although not shown in the diagram, includes an ion source that generates ions, such as argon ions; a condenser lens that focuses the ion beam from the ion source; a blanking; an aperture that narrows the ion beam; and an objective lens that focuses the ion beam.

[0017] The gas gun 5 releases a predetermined gas, such as etching gas, onto the sample 200. By supplying etching gas from the gas gun 5 while irradiating the sample 200 with an electron beam, focused ion beam, or gas ion beam, the etching rate of the sample by beam irradiation can be increased. Furthermore, by supplying compound gas from the gas gun 5 while irradiating the sample 200 with an electron beam, focused ion beam, or gas ion beam, localized deposition of gas components can be performed near the beam irradiation area. Although this explanation describes an example of releasing gas for deposition, it is also possible to perform deposition by irradiating the sample with an electron beam, focused ion beam, or gas ion beam in a contamination environment without using gas.

[0018] (Hardware configuration of control unit 6) FIG. 2 is a block diagram showing the hardware configuration of the control device 6. The control device 6 includes a processor 201, a main memory unit 202, an auxiliary storage unit 203, an input / output I / F 204, and a bus 205 that communicably connects each module. The processor 201 is, for example, a CPU (Central Processing Unit), a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), or the like. The processor 201 expands an application program or an adjustment recipe stored in the storage device 9 into an executable work area of the main memory unit 202. The main memory unit 202 stores an application program or an adjustment recipe executed by the processor 201, data processed by the processor, and the like. The main memory unit 202 is a flash memory, a RAM (Random Access Memory), or the like. The auxiliary storage unit 203 stores a boot program of the FIB-SEM composite device 100 and is, for example, a ROM (Read Only Memory).

[0019] The input / output I / F 204 is communicably connected to the above-described SEM column 10, FIB column 20, gas ion beam column 30, secondary electron detector 4, gas gun 5, and sample stage 50. The input / output I / F 204 is also communicably connected to a display device 7 that displays an observation image of the sample 200 and the like, an input device 8 that acquires an input instruction from an operator, and a storage device 9 that stores an application program or an adjustment recipe. By the processor 201 executing an application program or an adjustment recipe stored in the storage device 9 and performing various arithmetic processes, the control device 6 controls each component of the FIB-SEM composite device 100.

[0020] FIG. 3 is a diagram showing a plurality of adjustment recipes 60 and 61 and application programs 62 and 63 stored in the storage device 9. The application program is a program for executing processing (processing, observation) on a sample. The adjustment recipe is a program for executing adjustment of the device conditions (conditions of the optical system, conditions of the gas supply system) of the FIB-SEM composite device 100. In the example of FIG. 3, a plurality of adjustment recipes 60 and 61 and a plurality of application programs 62 and 63 are stored in the storage device 9, but the adjustment recipes 60 and 61 and the application programs 62 and 63 may be stored in different storage devices. The control device 6 executes the application program, whereby processing (processing, observation) on the sample is executed. Further, the control device 6 executes the adjustment recipe, whereby adjustment of the device conditions is executed.

[0021] (Adjustment recipes 60, 61) A plurality of adjustment recipes 60 and 61 are stored in the storage device 9. The adjustment recipes 60 and 61 are programs for executing adjustment of the device conditions of the FIB-SEM composite device 100. The device conditions include conditions of the optical system in the SEM column 10 and conditions of the gas supply system of the gas discharged by the gas gun 5. The adjustment recipe 60 has a plurality of adjustment items 60A to 60D whose execution order is defined. When the control device 6 executes the adjustment recipe 60, the adjustment items 61A, 6B, 60C, and 60D are executed in this execution order. Further, the adjustment recipe 61 has a plurality of adjustment items 61A to 61D whose execution order is defined. When the control device 6 executes the adjustment recipe 61, the adjustment items 61A, 61B, 61C, and 61D are executed in this execution order. <00001*1> (Examples of adjustment items) Here, specific examples of the adjustment items 60A to 60D and 61A to 61D will be described.

[0023] The adjustment items include, for example, powering on (starting up) the FIB-SEM combined unit 100, powering on (starting up) the FIB tube 20, powering on (starting up) the SEM tube 10, flashing and degassing of the SEM tube 10, axis alignment of the charged particle beam (electron beam, focused ion beam), contrast adjustment, focus adjustment, stigma adjustment, and setting of the Depo Rate coefficient.

[0024] Furthermore, the storage device 9 stores a continuous cross-sectional observation application program 62 and a thin section sample preparation application program 63 for TEM observation. The application programs stored in the storage device 9 are not limited to these application programs 62 and 63.

[0025] (Continuous Cross-Sectional Observation Application Program 62) The continuous cross-sectional observation application program 62 is used for 3D structural analysis of a sample and is an application program that alternately and continuously performs equally spaced slicing by FIB and observation of the processed surface by SEM.

[0026] (Application program 63 for preparing thin section samples for TEM observation) This is an application program for creating thin section samples for observation with a TEM (Transmission Electron Microscope). By running this application program 63, a thin section sample for TEM observation is created by performing a finishing process to reduce the film thickness so that it contains only the desired object of observation (for example, a single device structure of interest).

[0027] (Adjustment recipe display screen 70) Figure 4 shows the adjustment recipe display screen displayed on the display device 7. The adjustment recipe display screen 70 is a screen that displays the selected adjustment recipe. The user can customize the adjustment items on this adjustment recipe display screen 70. Customizing the adjustment items includes rearranging the order of the adjustment items, adding adjustment items, deleting adjustment items, changing parameters within the adjustment items, etc.

[0028] The adjustment recipe display screen 70 has a selection box 71 for selecting an adjustment recipe. The user can select an adjustment recipe using the selection box 71. In the example in Figure 4, adjustment recipe 60 is selected in the selection box 71. Therefore, the adjustment items 60A to 60D of adjustment recipe 60 are displayed on the adjustment recipe display screen 70 in that order.

[0029] (Customizing the adjustment recipe) The FIB-SEM combined system 100 allows for the customization of adjustment recipes automatically or manually. Figure 5 shows a diagram illustrating how to customize the adjustment recipes.

[0030] This section explains how to manually customize the adjustment recipe according to user instructions. First, the user selects an adjustment recipe from among several adjustment recipes in the selection box 71 (see Figure 4). For example, if adjustment recipe 60 is selected, the adjustment items 60A to 60D of adjustment recipe 60 will be displayed on the display device 7 in that order.

[0031] To change the order of adjustment items 60B and 60C in adjustment recipe 60, for example, the user moves adjustment item 60B below adjustment item 60C. This allows adjustment recipe 60 to be customized into adjustment recipe 60a, in which adjustment items 61A, 60C, 60B, and 60D are executed in that order.

[0032] To add adjustment item 60E to adjustment recipe 60, for example, the user can drag adjustment item 60E from another window and drop it onto adjustment recipe 60 displayed on the display device 7. This allows adjustment recipe 60 to be customized into adjustment recipe 60b, in which adjustment items 61A, 60B, 60C, and 60D and 60E are executed in that order. Here, adjustment item 60E was added to the final stage of adjustment recipe 60b, but adjustment item 60E may also be added to the position where it was dragged.

[0033] To delete adjustment item 60D from adjustment recipe 60, for example, the user selects adjustment item 60D from adjustment recipe 60 and deletes it. This allows adjustment recipe 60 to be customized into adjustment recipe 60c, in which adjustment items 61A, 60B, and 60C are executed in that order.

[0034] (Method for adjusting the FIB-SEM combined device 100) Figure 6 is a flowchart showing the adjustment method for the FIB-SEM combined device 100.

[0035] First, the control device 6 executes an application program stored in the storage device 9 (for example, a continuous cross-sectional observation application program 62, a thin section sample preparation application program 63 for TEM observation) (step S601). While the application program is being executed, the control device 6 determines whether or not it is time to make a determination (step S602). If it determines that it is time to make a determination (step S602: Yes), it determines whether or not adjustment is necessary based on the implementation determination criteria (step S603). In this embodiment, the control device 6 determines whether or not adjustment is necessary based on the adjustment history or observation image of the FIB-SEM combined device 100 as the implementation determination criteria. If it determines that it is not time to make a determination (step S602: No), and if it determines that no adjustment is necessary (step S603: No), it determines whether or not it is time to make a determination again after a predetermined time has elapsed (step S602).

[0036] If it determines that adjustment is necessary (step S603: Yes), the control device 6 selects an adjustment recipe to be executed from among several adjustment recipes based on the execution criteria (step S604). For example, if adjustments are to be performed periodically based on the adjustment history, it selects an adjustment recipe that includes adjustment items that need to be performed periodically. If adjustments are to be performed based on changes in the observed image, it selects an adjustment recipe related to brightness adjustment if a change in brightness is observed in the observed image. The control device 6 may also automatically customize the selected adjustment recipe based on the execution criteria (for example, the adjustment history or observed image related to adjustments performed on the FIB-SEM combined device 100).

[0037] Next, the control device 6 acquires the status of the FIB-SEM combined device 100 (e.g., processing, observation, standby, etc.) (step S605). The control device 6 also acquires the execution status of the application program that was executed (step S606).

[0038] Then, the control device 6 determines the timing to perform the adjustment based on the status of the FIB-SEM combined device 100 acquired in step S605 and the execution status of the application program acquired in step S606 (step S607). Then, the control device 6 performs the adjustment by executing the selected adjustment recipe at the determined timing (step S608). The control device 6 sequentially executes the adjustment items in the adjustment recipe in the order specified in the adjustment recipe.

[0039] The control device 6 then determines whether the application program has completed (step S609). If the application program has completed (step S609: Yes), it terminates this flowchart. If the application program has not completed (step S609: No), it determines again whether it is time to make another determination (step S602).

[0040] (Judgment timing) Next, we will explain the specific timing of the determination in step S602 in Figure 6.

[0041] The timing of the determination in step S602 in Figure 6 is: This may be at specified intervals during sample processing and / or observation, This may be done at intervals of the range during sample processing and / or observation, It may be every predetermined time unit (for example, a few seconds), This may be done each time a sample is transported, It may be for each specified location (for example, a specified processing location, a specified observation location), This may also occur when a predetermined GUI button displayed on the display device 7 is selected.

[0042] (Implementation criteria) Next, we will explain a specific example of the criteria for determining whether to implement step S604 in Figure 6.

[0043] The criteria for implementation are: It could be a predetermined time, This could be the number of times a recipe is executed to perform processing and / or observation on a sample, This may be a specified time during sample processing and / or observation, This may be done at intervals of the range during sample processing and / or observation, It may be every predetermined time unit (for example, a few seconds), It could also be the number of times the sample is transported, It may also be done for each specified location (for example, a specified processing location, a specified observation location).

[0044] Furthermore, the charged particle beam device 1 is You may decide to perform adjustments based on a comparison between the previous observation and the current observation, You may decide to perform adjustments based on a comparison between the correct image and the observed image, It may be determined that adjustments should be made based on the shape and area of ​​the holes formed by the FIB hole machining process. It may be determined that adjustments should be performed based on the film thickness deposited by Depo, You may decide to perform adjustments if the sample processing fails, You may decide to perform the adjustment based on the discrepancy between the mark position of the created drift correction and the processed position of the sample after processing. Alternatively, the created drift correction marks can be observed using the parameters of the charged particle beam used in processing, and adjustments can be performed if the amount of deviation exceeds a threshold. Alternatively, one could decide to use AI to determine the features of the observed image and then perform adjustments based on the AI's determination results. It may be determined that adjustments should be performed based on the amount of edge, the amount of edge vector, and the blob between the observed image and the normal image.

[0045] The observation images described above may be those of a sample processed by irradiating it with an electron beam, or those of a sample processed by irradiating it with a focused ion beam.

[0046] (Effects of the embodiment) In this embodiment, the necessity of performing adjustments is determined based on the adjustment history or observed images of the FIB-SEM combined device 100, and an adjustment recipe to be executed is selected from among multiple adjustment recipes. Furthermore, in this embodiment, the timing for executing adjustments during the execution of the application program is determined based on the status of the FIB-SEM combined device 100 and the execution status of the application program. This allows for the appropriate selection of the adjustment to be performed and the execution of the selected adjustment at the appropriate timing.

[0047] The automatic adjustment function described above can improve the efficiency of operations in the FIB-SEM combined device 100.

[0048] Furthermore, because adjustments are made as needed by the automatic adjustment function described above, it is possible to standardize sample processing and observation images.

[0049] Furthermore, in this embodiment, the selected adjustment recipe can be automatically customized based on the adjustment history or observed image of the FIB-SEM combined device 100. This makes it possible to create an appropriate adjustment recipe that matches the adjustment history or observed image. The user can also manually customize the adjustment recipe.

[0050] Although the present disclosure has been specifically described based on the embodiments described above, the present disclosure is not limited to the embodiments described above and can be modified in various ways without departing from its essence.

[0051] For example, in the embodiments described above, a FIB-SEM composite apparatus 100 comprising a SEM tube 10 and a FIB tube 20 was described as an example of a charged particle beam apparatus of the present disclosure. However, the charged particle beam apparatus of the present disclosure may be an SEM apparatus comprising only the SEM tube 10, or an FIB apparatus comprising only the FIB tube 20. [Explanation of Symbols]

[0052] 100: FIB-SEM combined system, 10: SEM tube, 20: FIB tube, 30: Gas ion beam tube, 4: Secondary electron detector, 5: Gas gun, 6: Control device, 7: Display device, 8: Input device, 9: Memory device, 40: Vacuum chamber, 50: Sample stage, 51: Sample holder, 200: Sample

Claims

1. A charged particle beam apparatus that generates an observation image of a sample by irradiating the sample with a charged particle beam, A storage unit that stores a program for performing processing on the sample and a plurality of adjustment recipes for adjusting the device conditions of the charged particle beam apparatus, The system comprises a control unit which executes the program stored in the storage unit to perform processing on the sample and which executes the adjustment recipe stored in the storage unit to adjust the apparatus conditions, The control unit, Based on the adjustment history of the charged particle beam apparatus or the observed image, the adjustment recipe to be executed is selected from among the multiple adjustment recipes stored in the memory unit. Based on the status of the charged particle beam apparatus and the execution status of the program, the timing for performing the adjustment during the execution of the program is determined, and the selected adjustment recipe is executed at the determined timing. A charged particle beam apparatus characterized by the following features.

2. The aforementioned adjustment recipe includes one or more adjustment items whose execution order is specified. The control unit, Based on the adjustment history or observation image of the charged particle beam apparatus, the execution order of one or more adjustment items in the adjustment recipe is changed, adjustment items are added, adjustment items are deleted, or the parameters of the adjustment items are changed. The charged particle beam apparatus according to feature 1.

3. The aforementioned adjustment recipe includes one or more adjustment items whose execution order is specified. The control unit, In accordance with user instructions, the system performs actions such as changing the execution order of one or more adjustment items in the adjustment recipe, adding adjustment items, deleting adjustment items, or changing the parameters of adjustment items. The charged particle beam apparatus according to feature 1.

4. The system further comprises at least one optical system for irradiating the sample with the charged particle beam, or a gas supply system for supplying gas to the sample irradiated with the charged particle beam. The apparatus conditions include at least one of the optical system conditions or the gas supply system conditions. The charged particle beam apparatus according to feature 1.

5. The system comprises at least one of an electron beam microscope tube for irradiating the sample with an electron beam, or a focused ion beam microscope tube for irradiating the sample with a focused ion beam. The charged particle beam apparatus according to feature 1.

6. The charged particle beam apparatus is an apparatus that processes the sample by irradiating it with an electron beam and generates the observation image of the processed sample, The control unit selects the adjustment recipe to be executed from among a plurality of adjustment recipes stored in the storage unit, based on the observed image of the sample processed by the electron beam. The charged particle beam apparatus according to feature 1.

7. The charged particle beam apparatus is an apparatus that processes the sample by irradiating the sample with a focused ion beam and generates the observation image of the sample, The control unit selects the adjustment recipe to be executed from among a plurality of adjustment recipes stored in the storage unit, based on the observed image of the sample processed by the focused ion beam. The charged particle beam apparatus according to feature 1.

8. The program includes a program that sequentially performs the processing of the sample and the observation of the processed surface of the sample. The control unit, Based on the changes in the observed image of the processed surface, the adjustment recipe to be executed is selected from among the multiple adjustment recipes stored in the memory unit. The charged particle beam apparatus according to feature 1.

9. The control unit, At specified intervals during the processing or observation of the aforementioned sample, In processing the aforementioned sample, at each specified range pitch, Every specified time interval, Each time the aforementioned sample is transported, For each of the specified positions of the sample, or When a GUI button displayed on the display unit is selected, the system determines whether the adjustment is necessary. The charged particle beam apparatus according to feature 1.

10. A method for adjusting a charged particle beam apparatus that generates an observation image of a sample by irradiating the sample with a charged particle beam, Execute a program that performs processing on the sample, and perform the processing on the sample. Based on the adjustment history of the charged particle beam apparatus or the observed image, select the adjustment recipe to be executed from among a plurality of adjustment recipes that cause adjustment of the apparatus conditions of the charged particle beam apparatus, and The system includes determining the timing for performing the adjustments during program execution based on the status of the charged particle beam apparatus and the execution status of the program, and executing the selected adjustment recipe at the determined timing. A method for adjusting a charged particle beam apparatus, characterized by the following features.

11. The aforementioned adjustment recipe includes one or more adjustment items whose execution order is specified. The system further includes changing the execution order of one or more adjustment items in the adjustment recipe selected based on the adjustment history or observation image of the charged particle beam apparatus, adding adjustment items, deleting adjustment items, or changing the parameters of the adjustment items. A method for adjusting a charged particle beam apparatus according to claim 10.

12. The aforementioned adjustment recipe includes one or more adjustment items whose execution order is specified. The system further includes, in accordance with user instructions, changing the execution order of the one or more adjustment items in the adjustment recipe, adding adjustment items, deleting adjustment items, or changing the parameters of the adjustment items. A method for adjusting a charged particle beam apparatus according to claim 10.

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