Circuit board cleaning apparatus and circuit board processing method

Abstract

To provide a substrate cleaning device and a substrate processing method that can effectively prevent the occurrence of defects near the edges of a substrate.SOLUTION: A substrate cleaning device includes a rotating unit 35 that rotates a substrate W, a supply unit 90 that supplies a cleaning liquid to the substrate W, a cleaning member that comes into contact with and cleans the substrate W, a moving mechanism that moves the cleaning member, a cleaning mechanism 200 that cleans the cleaning member, and a control unit 350 that controls such that one substrate W is cleaned by the cleaning member a plurality of times, and the cleaning member is cleaned by the cleaning mechanism 200 at least once during the plurality of times of cleaning.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a substrate cleaning apparatus having a rotating unit that rotates a substrate, a supply unit that supplies a cleaning liquid to the substrate, and a cleaning member that contacts and cleans the substrate, and a substrate processing method.

Background Art

[0002] In recent years, regarding the removal performance of defects (particles) in the peripheral portion on a substrate, the conditions for the size of the particles to be removed have become stricter, and it is required to remove particles up to a region closer to the edge of the substrate. In Patent Document 1, in order to prevent problems such as deterioration, before the outer edge of the sponge, which is a pencil cleaning member, reaches the edge of the substrate, the moving speed and contact pressure of the arm start to decrease, and when the center of the sponge reaches the edge of the substrate, they are set to zero.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The configuration of Patent Document 1 is only for preventing problems such as deterioration of the cleaning member, and improvement was required to remove particles in a region close to the edge of the substrate. The inventors of the present application have found that, in addition to removing particles from the substrate, improvement is required to prevent the cleaning sponge from being contaminated and particles from reattaching to the substrate.

[0005] The present invention provides a substrate cleaning apparatus and a substrate processing method that can effectively prevent the occurrence of defects in the vicinity of the edge of the substrate.

Means for Solving the Problems

[0006] [Concept 1] The substrate cleaning apparatus according to the present invention is A rotating part that rotates the circuit board, A supply unit that supplies cleaning fluid to the substrate, A cleaning member that contacts and cleans the substrate, A cleaning mechanism for cleaning the cleaning member, A control unit that controls the cleaning mechanism to perform multiple cleanings on a single substrate using the cleaning member, and to clean the cleaning member at least once during the multiple cleanings. It may be provided.

[0007] [Concept 2] In a substrate cleaning apparatus according to Concept 1, The control unit may control the cleaning mechanism to clean the cleaning member at least before the final cleaning of one substrate.

[0008] [Concept 3] In a substrate cleaning apparatus according to Concept 1, The control unit may control the cleaning mechanism to clean the cleaning member each time the cleaning member has finished cleaning a substrate.

[0009] [Concept 4] In a substrate cleaning apparatus according to any one of concepts 1 to 3, The control unit may, in at least the last cleaning of a single substrate, control the pressing force of the cleaning member against the substrate near the edge of the substrate to be smaller than that near the center of the substrate.

[0010] [Concept 5] In a substrate cleaning apparatus based on Concept 4, The control unit may control the cleaning member to move away from the substrate near the edge of the substrate during at least the final cleaning of a single substrate.

[0011] [Concept 6] In a substrate cleaning apparatus according to concept 4 or 5, In cleaning cycles other than when the pressing force of the cleaning member against the substrate near the edge of the substrate is smaller than that near the center of the substrate, the control unit may control the pressing force of the cleaning member against the substrate near the edge of the substrate to be approximately the same as that near the center of the substrate.

[0012] [Concept 7] In a substrate cleaning apparatus according to any one of concepts 1 to 6, The control unit may, in at least the final cleaning of a single substrate, control the oscillation speed of the cleaning member relative to the substrate near the edge of the substrate to be faster than when it is near the center of the substrate.

[0013] [Concept 8] In a substrate cleaning apparatus according to any one of concepts 1 to 7, The cleaning member is a pencil-shaped cleaning member that rotates and contacts the substrate. The control unit may, in at least the final cleaning of a single substrate, control the rotation speed of the pencil cleaning member and the rotation speed of the substrate to be relatively smaller in the region near the edge of the substrate compared to when it is near the center of the substrate.

[0014] The substrate cleaning method according to the present invention is The rotating part rotates the substrate, The supply unit supplies cleaning fluid to the substrate, The cleaning member is brought into contact with the substrate for cleaning, The cleaning member is moved by the moving mechanism, The cleaning mechanism cleans the cleaning member, The control unit controls the cleaning mechanism to perform multiple cleanings on a single substrate using the cleaning member, and to ensure that the cleaning member is cleaned at least once during each of the multiple cleanings. The present invention may also include the following effects:

[0015] In the present invention, by adopting a mode in which a cleaning member performs cleaning on a single substrate a plurality of times, and the cleaning member is cleaned by a cleaning mechanism at least once during the plurality of cleaning operations, generation of defects can be effectively prevented in the vicinity of the edge of the substrate.

Brief Description of the Drawings

[0016] [Figure 1] FIG. 1 is an upper plan view showing the overall configuration of a substrate processing apparatus including a substrate cleaning apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a side cross-sectional view of a substrate cleaning apparatus according to an embodiment of the present invention. [Figure 3] FIG. 3 is a side cross-sectional view of a substrate cleaning apparatus according to another embodiment of the present invention. [Figure 4] FIG. 4 is a side cross-sectional view of a substrate cleaning apparatus according to yet another embodiment of the present invention. [Figure 5] FIG. 5 is a side cross-sectional view in the case where a gripping part such as a chuck is adopted as a support part. [Figure 6] FIG. 6 is an upper plan view of a mode in which the support part has a first support part and a second support part. [Figure 7A] FIG. 7A is a side cross-sectional view showing a mode in which the first support part is in a closed state in a mode where the support part has a first support part and a second support part. [Figure 7B] FIG. 7B is a side cross-sectional view showing a mode in which the first support part is in an open state in a mode where the support part has a first support part and a second support part. [Figure 8] FIG. 8 is a perspective view of a substrate cleaning apparatus according to an embodiment of the present invention. [Figure 9] FIG. 9 is a side view showing a mode in which a pencil cleaning member contacts a substrate at a position deviated from the center of the substrate and swings passing through the center of the substrate. [Figure 10A] FIG. 10A is an upper plan view showing a mode in which an additional cleaning part having an additional cleaning liquid nozzle composed of a two-fluid nozzle, a Mega cleaning nozzle, or the like is provided. [Figure 10B]Figure 10B is an overhead plan view showing another embodiment in which an additional cleaning unit is provided, which has additional cleaning fluid nozzles consisting of a two-fluid nozzle or a Mega cleaning nozzle. [Figure 11] Figure 11 is an overhead plan view showing the oscillating motion of the pencil cleaning member. [Figure 12] Figure 12 is an overhead plan view showing how the roll cleaning member moves in the in-plane direction of the substrate. [Figure 13] Figure 13 is a graph showing one aspect of the changes in the rotation speed of the substrate, the rotation speed of the pencil cleaning member, the oscillation speed of the oscillating arm, and the pressing pressure of the pencil cleaning member. [Figure 14] Figure 14 is a graph showing another aspect of the changes in the rotation speed of the substrate, the rotation speed of the pencil cleaning member, the oscillation speed of the oscillating arm, and the pressing pressure of the pencil cleaning member. [Figure 15] Figure 15 is a side view showing a method of cleaning by supplying cleaning fluid into the pencil cleaning member. [Figure 16] Figure 16 is a flowchart showing an example of a substrate cleaning method according to this embodiment. [Modes for carrying out the invention]

[0017] Embodiment Hereinafter, embodiments of a substrate processing apparatus having a substrate cleaning apparatus according to the present invention will be described with reference to the drawings. In this embodiment, the "front side of the substrate W" means the upper side in Figures 2 to 4, and the "back side of the substrate W" means the lower side in Figures 2 to 4. The normal direction of the substrate W is called the "first direction," and the in-plane direction of the substrate W is called the "in-plane direction." The plane including the second direction in Figures 2 to 4 and the front-back direction (third direction) of the paper constitutes the in-plane direction. The "front side of the substrate W" is also called the "one side," and the "back side of the substrate W" is also called the "other side." In this embodiment, the description uses a configuration in which the substrate W, such as a wafer, extends in the horizontal direction, but the embodiment is not limited to this configuration. The substrate W may extend in the vertical direction, or in a direction inclined from the horizontal direction.

[0018] As shown in Figure 1, the substrate processing apparatus has a substantially rectangular housing 310 and a load port 312 on which a substrate W cassette for storing a large number of substrates W is mounted. The load port 312 is located adjacent to the housing 310. The load port 312 can be equipped with an open cassette, an SMIF (Standard Mechanical Interface) pod, or a FOUP (Front Opening Unified Pod). The SMIF pod and FOUP are sealed containers that house a substrate W cassette inside and are covered with a partition wall, thereby maintaining an environment independent of the external space. Examples of substrates W include semiconductor wafers.

[0019] The housing 310 contains a plurality of polishing units 314a to 314d (four in the embodiment shown in Figure 1), a first cleaning unit 316 and a second cleaning unit 318 for cleaning the substrate W after polishing, and a drying unit 320 for drying the substrate W after cleaning. The polishing units 314a to 314d are arranged along the longitudinal direction of the substrate processing apparatus, and the cleaning units 316, 318 and the drying unit 320 are also arranged along the longitudinal direction of the substrate processing apparatus. According to the substrate processing apparatus of this embodiment, various substrates W can be polished in the manufacturing process of semiconductor wafers with diameters of 150 mm, 200 mm, 300 mm, or 450 mm, flat panels, image sensors such as CMOS (Complementary Metal Oxide Semiconductor) and CCD (Charge Coupled Device), and magnetic films in MRAM (Magnetoresistive Random Access Memory).

[0020] A first transport robot 322 is positioned in the area surrounded by the load port 312, the polishing unit 314a located on the load port 312 side, and the drying unit 320. A transport unit 324 is also positioned parallel to the polishing units 314a to 314d, the washing units 316 and 318, and the drying unit 320. The first transport robot 322 receives the substrate W before polishing from the load port 312 and passes it to the transport unit 324, and also receives the substrate W after drying from the drying unit 320.

[0021] A second transport robot 326 is positioned between the first cleaning unit 316 and the second cleaning unit 318 to transfer the substrate W between the two units, and a third transport robot 328 is positioned between the second cleaning unit 318 and the drying unit 320 to transfer the substrate W between the two units. Furthermore, a control unit 350 that controls the movement of each component of the substrate processing apparatus is positioned inside the housing 310. In this embodiment, the description uses a configuration in which the control unit 350 is positioned inside the housing 310, but it is not limited to this configuration. The control unit 350 may be positioned outside the housing 310, or it may be remotely operated from a remote location. In addition, the control unit 350 may be composed of multiple devices, and if the control unit 350 is composed of multiple devices, the devices constituting the control unit 350 may be installed in different rooms or different locations, and part of the control unit 350 and the remainder of the control unit 350 may be located in a remote location.

[0022] As the first cleaning unit 316, a roll cleaning device (see Figure 11) may be used, which, in the presence of a cleaning solution, contacts a roll cleaning member that extends linearly over almost the entire length of the diameter of the substrate W and scrubs the surface of the substrate W while rotating it around a central axis parallel to the substrate W. Alternatively, as the second cleaning unit 318, a pencil cleaning device (see Figure 8, etc.) may be used, which, in the presence of a cleaning solution, contacts the lower end contact surfaces of vertically extending cylindrical pencil cleaning members 11, 12 with the surface of the substrate W and scrubs the surface of the substrate W by moving the pencil cleaning members 11, 12 in one direction while rotating them. Furthermore, as the drying unit 320, a spin drying unit may be used, which dries the substrate W by spraying IPA vapor from a moving spray nozzle toward the horizontally rotating substrate W and further dries the substrate W by centrifugal force while rotating the substrate W at high speed.

[0023] Furthermore, instead of a roll cleaning device, a pencil cleaning device similar to the second cleaning unit 318 may be used as the first cleaning unit 316, or a two-fluid jet cleaning device that cleans the surface of the substrate W using a two-fluid jet may be used. Also, instead of a pencil cleaning device, a roll cleaning device similar to the first cleaning unit 316 may be used as the second cleaning unit 318, or a two-fluid jet cleaning device that cleans the surface of the substrate W using a two-fluid jet may be used. Embodiments of the present invention can be applied to both the first cleaning unit 316 and the second cleaning unit 318, and can also be used in conjunction with a roll cleaning device, a pencil cleaning device, and / or a two-fluid jet cleaning device.

[0024] The cleaning solution in this embodiment includes a rinsing solution such as distilled water (DIW) and a chemical solution such as ammonia hydrogen peroxide (SC1), hydrochloric acid hydrogen peroxide (SC2), sulfuric acid hydrogen peroxide (SPM), sulfuric acid hydrogen peroxide, or hydrofluoric acid. Unless otherwise specified in this embodiment, the cleaning solution refers to either the rinsing solution or the chemical solution.

[0025] As shown in Figure 2, the substrate cleaning apparatus according to an embodiment of the present invention includes a housing 5, a support part 100 for supporting a substrate W, a rotating part 35 for rotating the substrate W, a supply part 90 for supplying cleaning fluid to the substrate W, a pencil cleaning member 11 which is an example of a cleaning member that contacts and cleans the substrate W, a moving mechanism including a swing arm 15 for moving the cleaning member, and a cleaning mechanism 200 for cleaning the cleaning member. In this embodiment, the control unit 350 described above has the function of issuing commands to control each component of the substrate cleaning apparatus. The control unit 350 may control the cleaning member to perform cleaning multiple times (for example, 2 to 5 times) on one substrate W, and to clean the cleaning member by the cleaning mechanism 200 at least once during the multiple cleanings. In this case, using a single substrate cleaning apparatus, the process of bringing the cleaning member into contact with the substrate W and then separating from it is considered one cycle, and this process is repeated multiple times. The pencil cleaning member 11 is oscillated by the swing arm 15 (see Figure 8). In this case, the swinging arm 15 may swing the pencil cleaning member 11 to the location where the cleaning mechanism 200 is provided, and the pencil cleaning member 11 may be cleaned using the cleaning mechanism 200. The pencil cleaning member 11 may be hollow and configured to allow cleaning liquid to easily enter the interior, but it is not limited to this configuration.

[0026] The cleaning member is a member that physically cleans the substrate W, and may be provided only on the front surface of the substrate W, only on the back surface, or on both the front and back surfaces. The cleaning member may have a first cleaning member that contacts and cleans one side (front surface) of the substrate W, and a second cleaning member that contacts and cleans the other side (back surface) of the substrate W (see Figure 3). The first cleaning member and the second cleaning member may each have a roll cleaning member 13 and pencil cleaning members 11, 12, or they may each have only one of the roll cleaning member and the pencil cleaning members 11, 12. In the embodiment shown in Figure 3, the first cleaning member is a first pencil cleaning member 11, and the second cleaning member is a second pencil cleaning member 12.

[0027] In the following description, the cleaning members will primarily be described using the pencil cleaning members 11 and 12. The cleaning unit 10 of this embodiment includes the pencil cleaning members 11 and 12 and the swinging arm 15. The configuration of this embodiment can also be applied when a roll cleaning member 13 is used as the cleaning member.

[0028] In this application, "support" includes the concept of "holding," and the support portion 100 also includes chucks and the like that which hold the substrate W. The support portion 100 may be a rotating support portion such as a spindle that rotates and supports the periphery of the substrate W, or it may be a chuck or the like that which holds the substrate W, as described above. In the case of a spindle, the rotating portion and the support portion are realized by the spindle, and such a substrate cleaning device will have a rotating portion and a support portion. In this embodiment, as an example, a configuration in which the rotating portion 35 and the support portion 100 are separate will be described. Note that the support portion 100 may be a configuration that adsorbs the back surface of the substrate W or a configuration that can grip the substrate W without contact, such as a Bernoulli chuck. Compared with the rotation speed of the substrate W by a rotating support portion such as a spindle, the rotation speed can be increased when a configuration that grips the substrate W, such as a chuck, is adopted.

[0029] Self-cleaning may be performed in the cleaning mechanism 200. For example, as shown in Figures 2 to 4, cleaning members such as pencil cleaning members 11, 12 and roll cleaning member 13 may rotate in a cleaning cup 205 filled with cleaning liquid C to perform self-cleaning. In this case, self-cleaning may also be performed by pressing the cleaning members against a cleaning plate 210 made of quartz or the like.

[0030] As another example, cleaning members such as pencil cleaning members 11, 12 and roll cleaning member 13 may be cleaned by supplying cleaning liquid from the cleaning liquid supply source 220 for cleaning members from the inside of the cleaning members (see Figure 15). In addition, when cleaning in this manner, the cleaning members may be rotated while being pressed against a cleaning plate 210 made of quartz or the like (see Figure 2, etc.). If the substrate W is being cleaned with a chemical solution, the cleaning members may also be cleaned with the chemical solution, and if the substrate W is being cleaned with a rinsing solution, the cleaning members may also be cleaned with the rinsing solution. The same chemical solution may be used to clean the substrate W and the same chemical solution may be used to clean the cleaning members. By adopting this configuration, the effects of mixing the cleaning liquids such as chemical solutions and rinsing solutions used in the cleaning mechanism 200 with the cleaning liquids such as chemical solutions and rinsing solutions used to clean the substrate W can be suppressed. The chemical solutions used to clean the substrate W and the chemical solutions used to clean the cleaning members may be the same chemical solution, including their concentration, but chemical solutions of different concentrations may also be used.

[0031] As shown in Figure 15, by moving the pencil cleaning member 11 to the outer edge of the substrate W, and then cleaning it after it rises, the cleaning liquid can be pushed outward from the substrate W while the pencil cleaning member 11 is cleaned from the inside outside the substrate W. Furthermore, by raising the pencil cleaning member 11 in this way, the possibility of contact between the support part 100 and the pencil cleaning member 11 can be reduced. The same configuration may also be adopted for the pencil cleaning member 12 located on the back side of the substrate W. In this case, the pencil cleaning member 12 will move to the outer edge of the substrate W, move downward, and then be cleaned from the inside.

[0032] The cleaning mechanism 200 may include a cleaning fluid supply source 220 for supplying cleaning fluid to the inside of the pencil cleaning members 11 and 12, and an introduction pipe 225 for guiding the cleaning fluid from the cleaning fluid supply source 220 (see Figure 15). The cleaning fluid supply source 220 for the cleaning members may be the same as the cleaning fluid supply source 95 (see Figures 2 to 4) that supplies cleaning fluid to the cleaning fluid supply unit 90.

[0033] In cleaning the pencil cleaning members 11, 12 and the roll cleaning member 13, etc., using the cleaning mechanism 200, the cleaning solution may be supplied from the outside of the cleaning member. The cleaning from the inside and the cleaning from the outside of the cleaning member may be combined as appropriate, and cleaning may be performed only from the inside of the cleaning member, only from the outside of the cleaning member, or both.

[0034] The opening and closing of the support section 100 may be controlled based on commands from the control unit 350, or the support section 100 may automatically close when the substrate W is placed on it and automatically open when the substrate W is removed (when a certain amount of force is applied). In the embodiments shown in Figures 2 to 4, as an example, the cleaning fluid supply unit 90 includes a chemical supply nozzle 91 for supplying chemical solution, a fluid jet nozzle 92 for supplying two fluids, and a rinse fluid supply nozzle 93 for supplying rinse fluid. The supply of cleaning fluid from the cleaning fluid supply unit 90 may be controlled by the control unit 350 reading a recipe stored in the storage unit 360 (see Figure 1). In this embodiment, the control unit 350 of the substrate processing apparatus controls the substrate cleaning device, but the invention is not limited to this, and control may be performed by a dedicated control unit for controlling the substrate cleaning device.

[0035] The support portion 100 may be a gripping portion 105 such as a chuck that has been used conventionally (see Figures 2, 3, and 5). In Figure 5, the substrate 200 is gripped by the substrate mounting portion 106 and the gripping portion 105. Also, as shown in Figure 4, the support portion 100 may have a first support portion 110 that is swingable and has a contact area that can contact the periphery of the substrate W when closed, and a second support portion 120 that supports the other side of the substrate W.

[0036] Multiple arm portions 160 may be provided on the other side of the substrate W, extending outward in the in-plane direction from the rotation center of the rotating portion 20 toward the peripheral edge. In the embodiment shown in Figure 6, four arm portions 160 are provided, and a second support portion 120 that supports the back surface of the substrate W is provided on the front side of the arm portions 160.

[0037] The oscillation of the first support portion 110 may be achieved by magnetic force (see Figures 7A and 7B). However, the first support portion 110 may also be oscillated by applying physical force through contact (see Figure 4).

[0038] As shown in Figures 7A and 7B, the first support portion 110 may have a first extended portion 111 extending along the in-plane direction of the substrate W, a second extended portion 112 extending to one side from the first extended portion 111, and a bent portion 113 provided between the first extended portion 111 and the second extended portion 112. The tip of the second extended portion 112 becomes the tip portion 112a of the first support portion 110, and a contact area with the substrate W is provided. On the other hand, the end of the second extended portion 112 becomes the base end of the first support portion 110. The first extended portion 111 is located on the other side of the substrate W and may extend linearly outward from the rotation center of the rotating portion 20 on the other side of the substrate W.

[0039] As an example, a first support part movement part 140 may be provided on the back side of the substrate W, and the first support part movement part 140 may move the first extension part 111 to one side, thereby moving the tip part 112a of the second extension part 112 outward from the periphery. For example, the tip of the first support part movement part 140 may contact the other side of the first extension part 111, thereby moving the first extension part 111 to one side (see Figure 4). Alternatively, a third magnet 143 may be provided on the first support part movement part 140, and the first magnet 151 provided inside the first extension part 111 may receive the repulsive force due to the magnetic force from the third magnet 143, thereby moving the first extension part 111 to one side (see Figures 7A and 7B).

[0040] A second magnet 152 may be provided inside an arm portion 160 positioned opposite the first magnet 151 and between the substrate W and the first extension portion 111. In this case, the repulsive force between the first magnet 151 and the second magnet 152 will impart a swinging force toward the periphery inward of the contact area. Specifically, the force of the first magnet 151 moving away from the second magnet 152 will cause the base end of the first extension portion 111 to receive a downward force, and as a result, the tip portion 112a of the second extension portion 112 will receive a force toward the periphery inward. In this case, the swing axis 130 may be provided in any of the first extension portion 111, the second extension portion 112, or the bent portion 113.

[0041] The first support portion 110 may have a contact area that contacts only one side of the substrate W, or one side and one side, and not contact the other side of the substrate W. One side of the substrate W is, for example, the upper surface of the bevel portion of the wafer.

[0042] If the support portion 100 consists of a gripping portion 105 such as a chuck, the pencil cleaning members 11 and 12 will not be able to clean the outermost periphery of the edge (see Figure 5). On the other hand, adopting the configuration having the first support portion 110 and the second support portion 120 described above is advantageous because the pencil cleaning members 11 and 12 can clean the outermost periphery of the edge (see Figures 7A and 7B). The configuration using the first support portion 110 and the second support portion 120 can be incorporated by reference from the contents described in Japanese Patent Application No. 2021-099799.

[0043] As shown in Figures 2 to 4, the rotating part 35 may include a motor 36, a first rotating part 31 rotated by the motor 36, and a second rotating part 32 connected to the first rotating part 31 via a belt 37 and rotating together with the first rotating part 31. When the second rotating part 32 rotates, the part to be rotated 20 and the arm part 160 are rotated, and as a result, the substrate W supported by the support part 100 is rotated.

[0044] As mentioned above, the cleaning mechanism 200 cleans the cleaning members at least once during the multiple cleaning cycles of the substrate W by the cleaning members, thereby increasing the cleanliness of the cleaning members. This prevents particles from adhering to the substrate W due to the cleaning members, which can cause many defects on the substrate W. Conventionally, cleaning the cleaning members in the middle of multiple cleaning cycles was not done because it could reduce throughput. However, recently the required standards for cleaning substrates W have been increasing. Therefore, in order to eliminate defects at a level that was not a problem in the past, this embodiment prioritizes defect prevention over throughput improvement, and the cleaning members such as the pencil cleaning members 11, 12 and the roll cleaning member 13 are cleaned by the cleaning mechanism 200 while a single substrate W is being cleaned.

[0045] The control unit 350 may control the cleaning mechanism 200 to clean the cleaning member at least before the final cleaning of a single substrate W. By cleaning the cleaning member with the cleaning mechanism 200 before the final cleaning in this way, the cleanliness of the cleaning member can be increased during the final cleaning before cleaning the substrate W, thereby effectively suppressing the occurrence of defects in the substrate W caused by the cleaning member. Note that "final cleaning" means the "nth" cleaning if the substrate W is cleaned by the cleaning member "n times". Also, "at least the final cleaning" means "at least the nth cleaning", and is a concept that includes the nth cleaning as well as the (n-1)th, ..., and the 2nd cleaning. Therefore, "at least before the final cleaning" is a concept that includes the (n-1)th, ..., and the 2nd cleaning as well as the nth cleaning.

[0046] The control unit 350 may control the cleaning mechanism 200 to clean the cleaning member each time the cleaning of a substrate W is completed. By cleaning the cleaning member so frequently, the cleanliness of the cleaning member can be further enhanced before cleaning the substrate W, thereby effectively suppressing the occurrence of defects caused by the cleaning member. Alternatively, instead of cleaning the cleaning member with the cleaning mechanism 200 each time the cleaning of a substrate W is completed, the cleaning member may be cleaned with the cleaning mechanism 200 after a predetermined number of cleanings of the substrate W with the cleaning member are completed.

[0047] If the cleaning members consist of pencil cleaning members 11 and 12, the control unit 350 may control the pressing force of the pencil cleaning members 11 and 12 against the substrate W near the edge of the substrate W to be smaller than when they are near the center of the substrate W, at least in the last cleaning of a single substrate W (see Figures 13 and 14). One of the causes of defects to the substrate W caused by the cleaning members is thought to be that when the cleaning members are pressed against the substrate W, foreign matter such as particles attached to the cleaning members adheres to the substrate W. Therefore, by controlling the pressing force of the pencil cleaning members 11 and 12 against the substrate W near the edge of the substrate W to be smaller than when they are near the center of the substrate W, it is possible to prevent foreign matter such as particles attached to the pencil cleaning members 11 and 12 from returning to the vicinity of the edge of the substrate W, at least in the last cleaning of a single substrate W. Note that the vicinity of the edge of the substrate W is a situation where particles and the like tend to accumulate, and as a result, foreign matter such as particles tends to adhere to the pencil cleaning members 11 and 12 that have cleaned the vicinity of the edge. The horizontal axis in Figures 13 and 14 indicates the position of the outermost edge of the pencil cleaning members 11 and 12, showing the state from the center of the substrate W to the outermost edge of the substrate W.

[0048] In this embodiment, "near the edge" means the region within 10% of the radius of the substrate W from the outer edge (the outermost position) of the substrate W, when the substrate W is circular in shape like a wafer. "Near the center" means the region within 10% of the radius of the substrate W from the center of the substrate W, when the substrate W is circular in shape like a wafer.

[0049] The aforementioned methods for reducing the pressing force also include methods for not applying any pressing force, and the control unit 350 may control the pencil cleaning members 11 and 12 to move away from the substrate W near the edge of the substrate W at least during the final cleaning of one substrate W. In this case, it is possible to more reliably prevent foreign matter such as particles attached to the pencil cleaning members 11 and 12 from returning to the edge of the substrate W at least during the final cleaning of one substrate W. The control unit 350 may also control the pressing force of the pencil cleaning members 11 and 12 against the substrate W to be "0" near the edge of the substrate W at least during the final cleaning of one substrate W. The load of the pressing force of the pencil cleaning members 11 and 12 against the substrate W may be measured by a load sensor installed in the swing arm 15, or by the air pressure applied from a pressurizing part 19 (see Figure 11) such as an actuator. Even if the pressing force of the pencil cleaning members 11 and 12 against the substrate W is controlled to be "0", there is still a possibility that the pencil cleaning members 11 and 12 will generate a pressing force against the substrate W due to their own weight.

[0050] In cleaning cycles other than when the pressing force of the cleaning member against the substrate W near the edge of the substrate W is smaller than when it is near the center of the substrate W (for example, from cleaning cycle 1 to n-1 if cleaning is performed n times), the control unit 350 may control the pressing force of the pencil cleaning members 11 and 12 against the substrate W near the edge of the substrate W to be approximately the same as when it is near the center of the substrate W. As described above, by reducing the pressing force of the pencil cleaning members 11 and 12 against the edge of the substrate W in at least the last cleaning of a single substrate W (for example, in the nth cleaning), it is possible to ensure cleaning near the center of the substrate W while preventing the return of foreign matter such as particles attached to the cleaning member near the edge of the substrate W. For example, in a configuration where cleaning is performed five times, the pressing force of the pencil cleaning members 11 and 12 against the substrate W may be kept approximately the same for the first four cleanings, and in the final fifth cleaning, the pressing force of the pencil cleaning members 11 and 12 near the edges of the substrate W may be made smaller compared to the cleaning near the center of the substrate W. In this embodiment, "approximately the same" means that the difference between the maximum value Pa and the minimum value Pb of the pressing force against the substrate W is 10% or less of the maximum value Pa, meaning that Pa × 0.1 ≥ Pa - Pb.

[0051] The pencil cleaning members 11 and 12 may start oscillating from the center of the substrate W, or, as shown in Figures 10A and 10B, they may oscillate from one edge (entrance edge) to another edge (exit edge) of the substrate W. In this case, the pressing force of the pencil cleaning members 11 and 12 against the substrate W may be controlled to be approximately the same from the entrance edge through the vicinity of the center of the substrate W to just before reaching the exit edge, and then at the exit edge, the pressing force of the pencil cleaning members 11 and 12 against the substrate W may be controlled to be smaller than that at the entrance edge and near the center of the substrate W. This is because when the pencil cleaning members 11 and 12 contact the entrance edge, the contact occurs before the pencil cleaning members 11 and 12 clean the substrate W, resulting in a high degree of cleanliness of the pencil cleaning members 11 and 12 and making it less likely for defects caused by the pressing of the pencil cleaning members 11 and 12 against the substrate W to occur. In particular, when the pencil cleaning members 11 and 12 are cleaned by the cleaning mechanism 200 and then come into contact with the entrance edge, defects caused by the pressing of the pencil cleaning members 11 and 12 against the substrate W are even less likely to occur. However, the pressing force of the cleaning members against the substrate W near the edges of the substrate W, including the entrance edge, may be controlled to be smaller than when they are near the center of the substrate W. For example, this configuration can be adopted when the pencil cleaning members 11 and 12 are not cleaned by the cleaning mechanism 200. Alternatively, instead of cleaning from edge to edge, the pencil cleaning members 11 and 12 may come into contact with the substrate W at a position offset from the center of the substrate W and oscillate through the center of the substrate W (see Figure 9).

[0052] The pencil cleaning members 11 and 12 may move along the surface of the substrate W all the way to the outside of the substrate W (see Figure 9), but as mentioned above, when they reach the outermost edge of the substrate W, the pencil cleaning members 11 and 12 may move diagonally to the outside of the substrate W (see Figure 15).

[0053] As shown in Figures 10A and 10B, the vicinity of the edges of the substrate W may be cleaned by an additional cleaning unit having an additional cleaning liquid nozzle 116 consisting of a two-fluid nozzle or a Mega cleaning nozzle. In this case, as shown in Figure 10A, the vicinity of the edges may be cleaned using an additional cleaning liquid nozzle 116 consisting of a two-fluid nozzle or a Mega cleaning nozzle provided on a swing arm 115, or as shown in Figure 10B, the vicinity of the edges may be cleaned using an additional cleaning liquid nozzle 116 consisting of a two-fluid nozzle or a Mega cleaning nozzle located in a fixed position. In this case, the additional cleaning liquid nozzle 116 consisting of a two-fluid nozzle or a Mega cleaning nozzle may be equipped with a swivel mechanism or the like to change the cleaning position within a narrow range, or a wider area may be cleaned by moving the additional cleaning liquid nozzle 116 consisting of a two-fluid nozzle or a Mega cleaning nozzle up and down.

[0054] The control unit 350 may, at least during the final cleaning of a single substrate W, control the oscillation speed of the pencil cleaning members 11 and 12 relative to the substrate W near the edge of the substrate W to be faster than when they are near the center of the substrate W. In this case, the oscillation speed of the pencil cleaning members 11 and 12 relative to the substrate W near the edge of the substrate W may be 1.1 to 1.8 times faster than when they are near the center of the substrate W. As mentioned above, one of the causes of defects to the substrate W caused by the cleaning members is thought to be that when the pencil cleaning members 11 and 12 are pressed against the substrate W, foreign matter such as particles attached to the pencil cleaning members 11 and 12 adheres to the substrate W. In this regard, by controlling the oscillation speed of the pencil cleaning members 11 and 12 relative to the substrate W to be faster than when they are near the center of the substrate W, the contact time of the pencil cleaning members 11 and 12 with the substrate W can be shortened, and consequently, the occurrence of defects to the substrate W caused by the pencil cleaning members 11 and 12 can be suppressed.

[0055] If the cleaning members are pencil cleaning members 11 and 12 that rotate and contact the substrate W, the control unit 350 may control the rotation speed of the pencil cleaning members 11 and 12 to be relatively smaller in the region on the edge side of the substrate W compared to when near the center of the substrate W, at least in the last cleaning of one substrate W (see Figures 13 and 14). In an embodiment where the rotation direction of the outer circumference of the pencil cleaning members 11 and 12 and the rotation direction of the substrate W are the same, the difference between the rotation speed of the pencil cleaning members 11 and 12 and the rotation speed of the substrate W may be reduced on the outer circumference (bevel side) of the pencil cleaning members 11 and 12. By adopting this embodiment, the frictional force generated between the pencil cleaning members 11 and 12 and the substrate W can be suppressed, and it is expected that the occurrence of defects to the substrate W caused by the cleaning members can be suppressed. As an example, the rotation speed of the pencil cleaning members 11 and 12 may be increased and the rotation speed of the substrate W may be decreased (see Figures 13 and 14). As shown in Figure 13, the control unit 350 may control the rotation speed of the pencil cleaning members 11 and 12 to match the rotation speed of the substrate W, but as shown in Figure 14, it is not necessary to match the rotation speed of the pencil cleaning members 11 and 12 to that of the substrate W. Increasing the rotation speed of the pencil cleaning members 11 and 12 and decreasing the rotation speed of the substrate W is beneficial because it can reduce the difference in rotation speed between the pencil cleaning members 11 and 12 and the substrate W in a short time. When the substrate W is made of a wafer, the rotation speed of the wafer is typically around 600 to 1000 rpm, while the rotation speed of the pencil cleaning members 11 and 12 is typically around 100 rpm. Therefore, to reduce the difference in rotation speed in a short time, it is beneficial to increase the rotation speed of the pencil cleaning members 11 and 12 and decrease the rotation speed of the substrate W.

[0056] "method" An example of a method for cleaning a substrate W using the substrate cleaning apparatus of this embodiment (substrate processing method) is as follows (Figure 16 shows an example in which the pencil cleaning member is cleaned only before the nth substrate cleaning). In the following description, the embodiment shown in Figure 2 will be mainly used, but all embodiments described in the "Configuration" above can be applied to the "Method," and the same method can be adopted in the embodiments shown in Figures 3 and 4. The same embodiment can also be adopted in the roll cleaning member 13 shown in Figure 12. However, in the case of the roll cleaning member 13, it is typical that the cleaning method (control method) near the edge of the substrate W is not changed from the method near the center of the substrate W.

[0057] The program for implementing the method of this embodiment may be recorded on a recording medium such as a USB drive, and the method of this embodiment may be implemented in a substrate processing device by reading this recording medium with a computer (not shown). The recording medium may be a non-temporary, tangible, computer-readable recording medium.

[0058] First, the substrate W, which has been transported into the housing 5 by the transport unit 324 or the second transport robot 326, is supported by the support unit 100 (see Figures 1 and 2). At this time, the cleaning unit 10 is positioned in standby position.

[0059] Next, the rotating part 20 is rotated by the motor 36 of the rotating part 35, and as a result, the substrate W supported by the support part 100 is rotated (see Figure 16, S1).

[0060] While the substrate W is rotating, the pencil cleaning member 11 is raised above the substrate W and oscillated to move to above the center of the substrate W (see Figure 16, S2).

[0061] Next, a chemical solution is supplied to the substrate W from the chemical solution supply nozzle 91. While the chemical solution is being supplied in this manner, one side of the substrate W is pressed with a predetermined pressure by the pencil cleaning member 11 to perform physical cleaning (scrubbing) (see Figure 16, S3). Alternatively, a rinsing solution such as pure water may be supplied from the rinsing solution supply nozzle 93 instead of the chemical solution, and Figure 16 uses the concept of a cleaning solution that includes both the chemical solution and the rinsing solution.

[0062] The pencil cleaning members 11 and 12 are in contact with the substrate W (see Figure 16, S11), and as shown in Figure 11, a swing arm 15, which is an example of a swinging part (swinging part of the cleaning member), swings about a swing axis (not shown in Figure 11). As a result, the pencil cleaning member 11 is swung by the swing arm 15 to near the edge of the substrate W. When a configuration is adopted in which the amount of protrusion of the support part 100 from the front surface side of the substrate W is small (see Figures 4, 7A and 7B), the pencil cleaning member 11 may not be stopped in front of the first support part 110, but may continue to swing outward to the periphery of the substrate W. In this application, "the cleaning member swings outward to the periphery of the substrate W" means that at least a part of the cleaning member swings outward beyond the periphery of the substrate W.

[0063] The cleaning with the pencil cleaning member 11 is repeated multiple times. When the first cleaning of the substrate W by the pencil cleaning member 11 is completed, the pencil cleaning member 11 is positioned at the starting position for oscillation while separated from the substrate W, and the second cleaning of the substrate W by the pencil cleaning member 11 is started. This cleaning operation is repeated a predetermined number of times (see Figure 16, S12, S13, and S11). During this cleaning of the substrate W with the pencil cleaning member 11, the control unit 350 may control the cleaning mechanism 200 to clean the cleaning member at least once. In other words, if one cycle is defined as the time from when the pencil cleaning member 11 is brought into contact with the substrate 200 until it is separated, the control unit 350 may control the cleaning mechanism 200 to clean the pencil cleaning member 11 at least once before the n cleaning cycles of the substrate 200 by the pencil cleaning member 11 are completed. Furthermore, the cleaning mechanism 200 may be controlled to clean the pencil cleaning member 11 two or more times before the n cleaning cycles of the substrate 200 by the pencil cleaning member 11 are completed.

[0064] Furthermore, as mentioned above, the following control measures may be implemented. (1) The control unit 350 may control the cleaning mechanism 200 to clean the cleaning member at least before the last cleaning of one substrate W. (2) The control unit 350 may control the cleaning mechanism 200 to clean the cleaning member each time the cleaning member has finished cleaning a substrate W. (3) The control unit 350 may control the pressing force of the cleaning member against the substrate W near the edge of the substrate W to be smaller than when it is near the center of the substrate W, at least in the last cleaning of one substrate W (see Figures 13 and 14). In this case, the cleaning member may be moved away from the substrate W near the edge of the substrate W, at least in the last cleaning of one substrate W. (4) In cleaning cycles other than when the pressing force of the cleaning member against the substrate W near the edge of the substrate W is smaller than when it is near the center of the substrate W, the control unit 350 may control the pressing force of the cleaning member against the substrate W near the edge of the substrate W to be approximately the same as when it is near the center of the substrate W. (5) The control unit 350 may control the movement speed of the cleaning member by oscillation near the edge of the substrate W in at least the last cleaning of a single substrate W to be faster than when it is near the center of the substrate W. (6) The control unit 350 may, at least during the final cleaning of a single substrate W, control the rotation speed of the pencil cleaning members 11 and 12 and the rotation speed of the substrate W to be relatively smaller in the region on the edge side of the substrate W compared to when it is near the center of the substrate W (see Figures 13 and 14).

[0065] In Figure 16, the nth cleaning is the final cleaning, and the (n-1)th cleaning is the cleaning before the final cleaning. From the first to the (n-1)th cleaning, once the cleaning of the substrate W by the pencil cleaning member 11 is complete, the pencil cleaning member 11 is positioned at the starting position, separated from the substrate W, and the next cleaning of the same substrate W by the pencil cleaning member 11 is started (see Figure 16, S12, S13, and S11). Once the (n-1)th cleaning of the substrate W by the pencil cleaning members 11 and 12 is complete, the pencil cleaning member 11 is oscillated to the cleaning mechanism 200 located outside the periphery of the substrate W, and the pencil cleaning member 11 is cleaned by the cleaning mechanism 200 (see Figure 16, S21).

[0066] Subsequently, the pencil cleaning member 11 is positioned at the starting position of the oscillation while separated from the substrate W (Figure 16, S22). Then, the pencil cleaning member 11 is brought into contact with the substrate W, and the pencil cleaning member 11 is oscillated by the oscillation arm 15 to the outer edge of the substrate W (Figure 16, S23). At this time, as described above, the control unit 350 may control the pressing force of the cleaning member against the substrate W near the edge of the substrate W to be smaller than when it is near the center of the substrate W (see (3) above), and as an example, the cleaning member may be separated from the substrate W near the edge of the substrate W (see Figures 13 and 14). The control unit 350 may also control the movement speed of the cleaning member due to oscillation against the substrate W near the edge of the substrate W to be faster than when it is near the center of the substrate W (see (5) above). The control unit 350 may also control the rotation speed of the pencil cleaning member 11 and the rotation speed of the substrate W to be relatively smaller in the region on the edge side of the substrate W compared to when it is near the center of the substrate W (see (6) above).

[0067] In the embodiment shown in Figure 16, once cleaning by the pencil cleaning member 11 is complete, the pencil cleaning member 11 moves to a standby position outside the peripheral edge of the substrate (Figure 16, S24). Then, the supply of cleaning fluid to the substrate W is stopped (Figure 16, S31), and after that, the substrate W is removed from the support part 100. In this case, as an example, the substrate W is removed from the housing 5 by the second transport robot 326 or the third transport robot 328 while still wet (Figure 16, S32).

[0068] In the final cleaning stage, if the substrate W has been cleaned in the second cleaning unit 318, the substrate W may be removed from the housing 5 by the third transport robot 328 and transported into the drying unit 320. Once the substrate W is transported into the drying unit 320 in this manner, the drying unit 320 will dry the substrate W.

[0069] Alternatively, after rinsing, the supply of rinsing fluid from the rinsing fluid supply nozzle 93 may be stopped, and the substrate W supported by the support part 100 may be rotated at high speed to shake off the rinsing fluid and allow it to dry.

[0070] Although the above description uses an example of cleaning only one side of the substrate W, the invention is not limited to this example, and an example of cleaning both one and the other side of the substrate W simultaneously may be adopted. In this case, the pencil cleaning members 11 and 12 should be positioned between the arm portion 160 and the back surface of the substrate W. Furthermore, as shown in Japanese Patent Application Publication No. 2019-003977, a rotating portion 35 that rotates the rotating portion 20 may be provided outside the periphery of the rotating portion 20. More specifically, the rotating portion 35 may be a stator, the rotating portion 20 may be a rotor, and the rotating portion 20 may be rotated in a non-contact state by magnetic force. In this case, the rotating portion 20 may have a magnet, and the rotating portion 35 may have a coil or a coil and a magnet. In this case, the rotating portion 35 and the rotating portion 20 constitute a so-called bearingless motor that can rotate the rotating portion 20 while controlling its position in the in-plane direction in a non-contact manner without supporting it with bearings.

[0071] Furthermore, although the above description mainly uses pencil cleaning members 11 and 12 as examples of cleaning members, as mentioned above, the embodiment is not limited to this configuration, and this embodiment may also be used for cleaning using a roll cleaning member (see Figure 12). In this case, the roll cleaning member may be positioned between the arm portion 160 and the back surface of the substrate W so that both sides of the substrate W can be cleaned.

[0072] The above-described embodiments and the disclosure of the drawings are merely examples for illustrating the invention described in the claims, and the above-described embodiments or the disclosure of the drawings do not limit the invention described in the claims. For example, a substrate processing apparatus having a substrate cleaning apparatus according to the present invention may include a bevel polishing apparatus for polishing the edges of the substrate W, a back surface polishing apparatus for polishing the back surface of the substrate W, or a substrate plating apparatus for forming a metal film on the surface of the substrate W. In addition to semiconductor substrates, the substrate W in the present invention includes various substrates such as glass substrates for liquid crystal display devices (LCDs), plasma displays (PDPs), organic light-emitting diodes (OLEDs), field emission displays (Field Emission Displays), vacuum fluorescent displays (VFDs), and solar cell panels, as well as glass and ceramic substrates for magnetic and optical disks. [Explanation of Symbols]

[0073] 11,12 Pencil cleaning member 13 Roll cleaning component 35 Rotating part 90 Supply section 100 Support part 200 Cleaning Mechanism 350 Control Unit W board

Claims

1. A rotating part that rotates the circuit board, A supply unit that supplies cleaning fluid to the substrate, A cleaning member that contacts and cleans the substrate, A cleaning mechanism for cleaning the cleaning member, A control unit that controls the cleaning mechanism to clean the cleaning member only before the final cleaning of a single substrate, and performs cleaning three or more times on a single substrate. A circuit board cleaning device equipped with the following features.

2. A rotating part for rotating the substrate, A supply unit that supplies cleaning fluid to the substrate, A cleaning member that contacts and cleans the substrate, A cleaning mechanism for cleaning the cleaning member, A control unit that controls the cleaning mechanism to perform multiple cleanings on a single substrate using the cleaning member, and to clean the cleaning member at least once during the multiple cleanings. Equipped with, A substrate cleaning apparatus comprising a control unit that, in at least the final cleaning of a single substrate, controls the oscillation speed of the cleaning member relative to the substrate near the edge of the substrate to be faster than when it is near the center of the substrate.

3. A rotating part for rotating the substrate, A supply unit that supplies cleaning fluid to the substrate, A cleaning member that contacts and cleans the substrate, A cleaning mechanism for cleaning the cleaning member, A control unit that controls the cleaning mechanism to perform multiple cleanings on a single substrate using the cleaning member, and to clean the cleaning member at least once during the multiple cleanings. Equipped with, The cleaning member is a pencil-shaped cleaning member that rotates and contacts the substrate. A substrate cleaning apparatus, wherein the control unit controls the rotation speed of the pencil cleaning member and the rotation speed of the substrate to be relatively smaller in the region of the substrate near the edge of the substrate compared to when it is near the center of the substrate, at least during the final cleaning of a single substrate.

4. The substrate cleaning apparatus according to claim 2 or 3, wherein the control unit controls the cleaning mechanism to clean the cleaning member at least before the final cleaning of one substrate.

5. The substrate cleaning apparatus according to claim 2 or 3, wherein the control unit controls the cleaning mechanism to clean the cleaning member each time cleaning of a substrate by the cleaning member is completed.

6. The substrate cleaning apparatus according to any one of claims 1 to 3, wherein the control unit controls the pressing force of the cleaning member against the substrate near the edge of the substrate to be smaller than that when it is near the center of the substrate, at least in the last cleaning of one substrate.

7. The substrate cleaning apparatus according to claim 6, wherein the control unit controls the cleaning member to move away from the substrate near the edge of the substrate in at least the last cleaning of one substrate.

8. The substrate cleaning apparatus according to claim 6, wherein, in cleaning cycles other than when the pressing force of the cleaning member against the substrate near the edge of the substrate is smaller than that near the center of the substrate, the control unit controls the pressing force of the cleaning member against the substrate near the edge of the substrate to be substantially the same as that near the center of the substrate.

9. The rotating part rotates the circuit board, The supply unit supplies cleaning fluid to the substrate, The cleaning member is brought into contact with the substrate for cleaning, The cleaning member is moved by the moving mechanism, The cleaning mechanism cleans the cleaning member, The control unit controls the cleaning mechanism to perform three or more cleanings on a single substrate using the cleaning member, and to clean the cleaning member only before the final cleaning of the substrate. A substrate cleaning method comprising the following:

10. The rotating part rotates the circuit board, The supply unit supplies cleaning fluid to the substrate, The cleaning member is brought into contact with the substrate for cleaning, The cleaning member is moved by the moving mechanism, The cleaning mechanism cleans the cleaning member, The control unit controls the cleaning mechanism to perform multiple cleanings on a single substrate using the cleaning member, and to ensure that the cleaning member is cleaned at least once during each of the multiple cleanings. Equipped with, A substrate cleaning method comprising the control unit controlling, in at least the final cleaning of a single substrate, the oscillation speed of the cleaning member relative to the substrate near the edge of the substrate to be faster than when it is near the center of the substrate.

11. The rotating part rotates the circuit board, The supply unit supplies cleaning fluid to the substrate, The cleaning member is brought into contact with the substrate for cleaning, The cleaning member is moved by the moving mechanism, The cleaning mechanism cleans the cleaning member, The control unit controls the cleaning mechanism to perform multiple cleanings on a single substrate using the cleaning member, and to ensure that the cleaning member is cleaned at least once during each of the multiple cleanings. Equipped with, The cleaning member is a pencil-shaped cleaning member that rotates and contacts the substrate. A substrate cleaning method comprising the control unit controlling, in at least the final cleaning of a single substrate, the rotation speed of the pencil cleaning member and the rotation speed of the substrate to be relatively smaller in the region on the edge of the substrate compared to when near the center of the substrate.

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