Power converter

Abstract

To provide a power conversion device capable of suppressing an increase in device size.SOLUTION: A power conversion device comprises: a power converter that includes modules 11 to 13 and converts an input power and outputs the resultant; and capacitors 31 and 32 electrically connected with the modules 11 to 13. The capacitors 31 and 32 have a terminal surface 33. The terminal surface 33 is arranged so as to be opposed to a terminal surface 14 of the modules 11 to 13 so that terminals on the capacitors 31 and 32 side can be prevented from being arranged in an exposed state on lateral faces of the capacitors 31 and 32 other than the modules 11 to 13 side. Therefore, a device to be arranged separately from the capacitors 31 and 32 and the modules 11 to 13 can be arranged adjacent to the capacitors 31 and 32 without considering an insulation distance, which can suppress an increase in size of the device.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a power conversion device, and particularly to a power conversion device including a semiconductor module.

Background Art

[0002] Conventionally, a power conversion device including a semiconductor module has been known (see, for example, Patent Document 1).

[0003] The power conversion device described in Patent Document 1 includes a plurality of semiconductor modules and a plurality of capacitors. In this power conversion device, a clamped diode type three-level circuit is configured by three semiconductor modules. The three semiconductor modules are arranged in a row along the cooling surface. And, four capacitors are arranged so as to face the three semiconductor modules arranged side by side. The four capacitors are arranged in two rows along the direction in which the three semiconductor modules are arranged. Further, each of the four capacitors has terminals arranged on the outer side surfaces in the direction in which the three semiconductor modules are arranged. And, a bus bar having a U shape is connected so as to cover the capacitors arranged in two rows from the outside.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the power conversion device described in Patent Document 1, the capacitor terminals are located on the outer side in the direction in which the three semiconductor modules are aligned. Therefore, when placing sensors such as voltage sensors and temperature sensors, or equipment including a circuit board such as a gate drive unit, separately from the semiconductor modules and capacitors, it is necessary to place the equipment while considering the insulation distance from the terminals located on the outside of the capacitor. As a result, it is not possible to place equipment placed separately from the semiconductor modules and capacitors close to the side of the capacitor, which leads to the problem of the device becoming larger.

[0006] This invention was made to solve the above-mentioned problems, and one of its objectives is to provide a power conversion device that can suppress the increase in size of the device. [Means for solving the problem]

[0007] To achieve the above objective, this invention 1 The power conversion device includes a semiconductor module having a switching element, a power conversion unit that converts and outputs input power, and a capacitor electrically connected to the semiconductor module of the power conversion unit, wherein the semiconductor module has a module-side terminal surface on which the module-side terminals, which are the terminals of the semiconductor module, are arranged, and the capacitor has a capacitor-side terminal surface on which the capacitor-side terminals, which are the terminals of the capacitor, are arranged, and the capacitor-side terminal surface is arranged to face the module-side terminal surface of the semiconductor module. The semiconductor module further comprises a module-side conductor connected to the module-side terminal and positioned along the module-side terminal surface, the module-side conductors forming a laminated conductor by being stacked in an insulated state from each other, and the semiconductor module is arranged in a plurality along a predetermined arrangement direction, and the plurality of semiconductor modules include an input / output module having an AC terminal to which AC power is input or output and to which an AC conductor, which is arranged separately from the laminated conductor, is directly connected, and the input / output module is located at one end of the arrangement direction in which the plurality of semiconductor modules are arranged in a plurality of semiconductor modules. .

[0008] This invention 1In a power conversion device using this configuration, as described above, the semiconductor module has a module-side terminal surface on which the module-side terminals, which are the terminals of the semiconductor module, are located. The capacitor has a capacitor-side terminal surface on which the capacitor-side terminals, which are the terminals of the capacitor, are located, and the capacitor-side terminal surface is positioned opposite the module-side terminal surface of the semiconductor module. As a result, since the capacitor-side terminal surface and the module-side terminal surface are positioned opposite each other, it is possible to prevent the capacitor-side terminals from being exposed on the side of the capacitor other than the semiconductor module side. Therefore, equipment that is positioned separately from the capacitor and semiconductor module can be positioned close to the capacitor without considering the insulation distance. As a result, the size of the device can be suppressed.

[0009] the above 1 In a power conversion device with a surface configuration, preferably, a capacitor-side guide is connected to the capacitor-side terminal and arranged along the capacitor-side terminal surface. body Furthermore, the capacitor-side conductor and the module-side conductor are connected to each other at the end of the capacitor-side terminal surface in the direction along the capacitor-side terminal surface, with the capacitor-side terminal surface and the module-side terminal surface facing each other. With this configuration, since the capacitor-side conductor and the module-side conductor are connected to each other at the end of the capacitor-side terminal surface, the capacitor-side conductor and the module-side conductor can be connected from the outside of the capacitor and semiconductor module at the end of the capacitor-side terminal surface, without inserting tools or other objects between the capacitor and the semiconductor module. Therefore, even when the capacitor-side terminal surface and the module-side terminal surface are arranged facing each other, there is no need to provide a gap between the capacitor and the semiconductor module for inserting tools or other objects, so the capacitor and semiconductor module can be arranged in close proximity to each other. As a result, the distance between the capacitor and the semiconductor module can be reduced, which further suppresses the increase in the size of the device.

[0010] In this case, preferably, an intermediate conductor is further provided to connect the capacitor-side conductor and the module-side conductor at the end of the capacitor-side terminal surface in the direction along the capacitor-side terminal surface. With this configuration, since the intermediate conductor is provided separately from the capacitor-side conductor and the module-side conductor, the capacitor-side conductor and the module-side conductor can be connected by the intermediate conductor without changing the shapes of the opposing capacitor-side conductor and module-side conductor. Therefore, the capacitor-side conductor and the module-side conductor can be connected by the intermediate conductor while suppressing the complexity of the shapes of the capacitor-side conductor and the module-side conductor.

[0011] In a power conversion device comprising a relay conductor connecting the capacitor-side conductor and the module-side conductor, preferably, the capacitor-side conductor has a capacitor-side mounting portion bent in a direction from along the capacitor-side terminal surface to along the surface adjacent to the capacitor-side terminal surface of the capacitor, the relay conductor has an L-shape extending along the module-side terminal surface and in a direction opposite to the module-side terminal surface, and in the portion extending in the direction opposite to the module-side terminal surface, it has a relay conductor-side mounting portion connected to the capacitor-side mounting portion, and the relay conductor-side mounting portion has a notched hole that opens in the direction opposite to the capacitor-side terminal surface and the module-side terminal surface. With this configuration, since the relay conductor-side mounting portion of the L-shaped relay conductor has a notched hole that opens in the direction opposite to the capacitor-side terminal surface and the module-side terminal surface, even if there is a manufacturing tolerance in the direction opposite to the capacitor-side terminal surface and the module-side terminal surface, the capacitor-side conductor and the relay conductor can be easily connected by connecting the notched hole and the capacitor-side mounting portion. Therefore, even if there are manufacturing tolerances in the direction in which the capacitor terminal surface and the module terminal surface face each other, assembly can be easily carried out.

[0012] the above 1In a power conversion device with a specific orientation, preferably the power conversion unit includes at least one of a converter unit that converts input AC power to DC power and an inverter unit that converts input DC power to AC power and outputs it. , intersection The current terminals are located on one side of the input / output module. This configuration allows the AC terminals to be located on one side of multiple semiconductor modules arranged side-by-side, thus suppressing the need to increase the length of the AC conductors connected to the input / output module. Consequently, this helps to reduce the overall weight of the device.

[0013] the above 1 In a power conversion device with a phase, preferably , electric The power conversion unit includes at least one of a 3-level inverter unit that receives three levels of potential (upper potential, intermediate potential, and lower potential) and a 3-level converter unit that outputs three levels of potential (upper potential, intermediate potential, and lower potential). The module-side conductor includes an upper conductor to which the upper potential is applied, an intermediate conductor to which the intermediate potential is applied, and a lower conductor to which the lower potential is applied. The capacitor-side terminal surface of the capacitor is arranged to face the upper conductor, intermediate conductor, and lower conductor. With this configuration, even when the power conversion unit has at least one of the 3-level inverter unit and the 3-level converter unit, the capacitor-side terminal surface is arranged to face the upper conductor, intermediate conductor, and lower conductor, thus preventing the capacitor-side terminal and the upper conductor, intermediate conductor, and lower conductor from being exposed on the side of the capacitor other than the semiconductor module side. Therefore, even when the power conversion unit has at least one of the 3-level inverter unit and the 3-level converter unit, equipment that is arranged separately from the capacitor and semiconductor module can be placed close to the capacitor, thus suppressing the increase in the size of the device.

[0014] In this case, preferably, the semiconductor module includes a first module having one switching element and one clamp diode and connected to an upper conductor and an intermediate conductor, a second module having one switching element and one clamp diode and connected to an intermediate conductor and a lower conductor, and a third module having two switching elements and connected to the first module and the second module, the module-side conductors include a first connecting conductor connecting the first module and the third module, and a second connecting conductor connecting the second module and the third module, the upper conductor, the intermediate conductor and the lower conductor are laminated in an insulated state to form a first laminated conductor, and the first connecting conductor and the second connecting conductor are laminated separately from the first laminated conductor in an insulated state to form a second laminated conductor. Here, when connecting each of the multiple laminated conductors, it is necessary to provide holes in the other conductors in order to place fastening members such as screws at the connection portion of one of the multiple conductors. Taking this into consideration, in the present invention, the upper conductor, intermediate conductor, and lower conductor are laminated in an insulated state to form a first laminated conductor, and the first connecting conductor and second connecting conductor are laminated separately from the first laminated conductor in an insulated state to form a second laminated conductor. With this configuration, the first laminated conductor formed by the upper conductor, intermediate conductor, and lower conductor, and the second laminated conductor formed by the first connecting conductor and second connecting conductor, can be connected separately to the semiconductor module. Therefore, compared to the case where the upper conductor, intermediate conductor, and lower conductor, and the first connecting conductor and second connecting conductor are formed together as a single laminated conductor, the number of holes to avoid connection parts can be reduced, thus suppressing a decrease in the cross-sectional area of ​​the conductor. As a result, localized heat generation due to current concentration can be suppressed in the upper conductor, intermediate conductor, and lower conductor, and the first connecting conductor and second connecting conductor, and an increase in inductance can be suppressed.

[0015] the above 1 In a power conversion device with a phase, preferably , electric The power conversion unit includes at least one of a two-level inverter unit that receives two levels of potential, an upper potential and a lower potential, and a two-level converter unit that outputs two levels of potential, an upper potential and a lower potential. The module-side conductor includes an upper conductor to which the upper potential is applied and a lower conductor to which the lower potential is applied. The capacitor-side terminal surface of the capacitor is positioned to face the upper and lower conductors. With this configuration, even when the power conversion unit has at least one of the two-level inverter unit and the two-level converter unit, the capacitor-side terminal surface is positioned to face the upper and lower conductors, thus preventing the capacitor-side terminal and the upper and lower conductors from being exposed on the side of the capacitor other than the semiconductor module side. Therefore, even when the power conversion unit has at least one of the two-level inverter unit and the two-level converter unit, equipment that is normally placed separately from the capacitor and semiconductor module can be placed close to the capacitor, thus suppressing the increase in the size of the device.

[0016] the above 1 In a power conversion device based on this aspect ratio, preferably, the power conversion unit and the capacitor are mounted on a railway vehicle. With this configuration, even when the power conversion unit and capacitor are mounted on a railway vehicle, separate equipment from the semiconductor module and capacitor can be placed close to the capacitor, thereby effectively suppressing the increase in size of the device mounted on the railway vehicle. A power conversion device according to a second aspect of this invention includes a semiconductor module having a switching element, and comprises a power conversion unit that converts and outputs input power, and a capacitor electrically connected to the semiconductor module of the power conversion unit, wherein the semiconductor module has a module-side terminal surface on which module-side terminals, which are terminals of the semiconductor module, are arranged, and the capacitor has a capacitor-side terminal surface on which capacitor-side terminals, which are terminals of the capacitor, are arranged, and the capacitor-side terminal surface is arranged to face the module-side terminal surface of the semiconductor module, and further comprises a capacitor-side conductor connected to the capacitor-side terminal and arranged along the capacitor-side terminal surface, and a module-side conductor connected to the module-side terminal and arranged along the module-side terminal surface, wherein a plurality of semiconductor modules are arranged in a row along a predetermined arrangement direction, and the capacitor-side conductor and the module-side conductor are connected to each other from the outside in the arrangement direction at the end side of the capacitor-side terminal surface in the arrangement direction along the capacitor-side terminal surface, with the capacitor-side terminal surface and the module-side terminal surface facing each other. [Effects of the Invention]

[0017] According to the present invention, as described above, it is possible to provide a power conversion device that can suppress the increase in size of the device. [Brief explanation of the drawing]

[0018] [Figure 1] This is a schematic diagram showing a railway vehicle equipped with a power converter according to the first embodiment. [Figure 2] It is a circuit diagram showing an equivalent circuit of a power conversion device according to the first embodiment. [Figure 3] It is a circuit diagram for explaining the connection of three modules. [Figure 4] It is a perspective view for explaining the terminals of a module. [Figure 5] It is a perspective view for explaining the arrangement of modules on the cooling surface. [Figure 6] It is a schematic diagram for explaining the arrangement of a capacitor and a module. [Figure 7] It is a perspective view for explaining the configuration of a capacitor. [Figure 8] It is a diagram for explaining the arrangement of a plurality of capacitors. [Figure 9] It is an exploded perspective view for explaining a conductor connecting modules. [Figure 10] It is a diagram for explaining a relay conductor. [Figure 11] It is a schematic diagram for explaining the arrangement of modules in a power conversion device according to the second embodiment. [Figure 12] It is a diagram for explaining the arrangement of a capacitor and a module according to the second embodiment. [Figure 13] It is a circuit diagram showing an equivalent circuit of a power conversion device according to the second embodiment. [Figure 14] It is a schematic diagram for explaining the arrangement of modules in a power conversion device according to a modification of the second embodiment. [Figure 15] It is a diagram for explaining the arrangement of a capacitor and a module according to a modification of the second embodiment. [Figure 16] It is a circuit diagram showing an equivalent circuit of a power conversion device according to a modification of the second embodiment.

Embodiments for Carrying Out the Invention

[0019] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0020] [First Embodiment] The configuration of the power converter 100 according to this embodiment will be described with reference to Figures 1 to 10. The power converter 100 is mounted on a railway vehicle 101.

[0021] (Railway vehicle configuration) As shown in Figures 1 and 2, the railway vehicle 101 is configured to run on rails using single-phase AC power supplied from an overhead line 102, which serves as an AC power source. The railway vehicle 101 is equipped with a pantograph 101a, a transformer 101b, a motor 101c, and a power converter 100. The pantograph 101a receives (collects) power supplied from the overhead line 102. The transformer 101b transforms the AC power received by the pantograph 101a and outputs it. The motor 101c includes an induction motor that rotates the drive wheels using AC power supplied from the power converter 100. When the railway vehicle 101 is running, the power converter 100 converts the power from the overhead line 102 by the switching operation of switching elements Q1 to Q4 (see Figure 3) to control the rotation of the motor 101c.

[0022] (Overall configuration of the power conversion device) As shown in Figure 2, the power converter 100 comprises a power conversion unit 10 and capacitors 31 and 32. In the power converter 100, the power conversion unit 10 mounted on the railway vehicle 101 and the capacitors 31 and 32 constitute a three-level power conversion circuit for driving the motor 101c. The power conversion unit 10 converts the input power and outputs it. The power conversion unit 10 includes converter units 10a and 10b, and inverter units 10c, 10d, and 10e. The two converter units 10a and 10b convert the input single-phase AC power into DC power. The inverter units 10c to 10e convert the DC power input from converter units 10a and 10b into three-phase AC power and output it to the motor 101c. Note that converter units 10a and 10b are examples of the "converter unit" and "three-level converter unit" in the claims. Furthermore, inverter units 10c, 10d, and 10e are examples of the "inverter unit" and "3-level inverter unit" as defined in the claims.

[0023] Converter unit 10a receives the U-phase of single-phase AC power, which has U-phase and V-phase input. Converter unit 10b receives the V-phase of single-phase AC power. Converter units 10a and 10b output DC power with three potential levels: upper potential, intermediate potential, and lower potential. Inverter units 10c to 10e receive the DC power with three potential levels (upper potential, intermediate potential, and lower potential) output from converter units 10a and 10b. Inverter unit 10c outputs the U-phase AC power of three-phase AC power, which has U-phase, V-phase, and W-phase input. Inverter unit 10d outputs the V-phase AC power of three-phase AC power, which has U-phase, V-phase, and W-phase input. Inverter unit 10e outputs the W-phase AC power of three-phase AC power, which has U-phase, V-phase, and W-phase input.

[0024] Furthermore, the power conversion unit 10 includes modules 11, 12, and 13. Specifically, each of the converter units 10a and 10b and the inverter units 10c to 10e includes modules 11, 12, and 13. Module 11 is an example of the "semiconductor module" and "first module" in the claims. Module 12 is an example of the "semiconductor module" and "second module" in the claims. Module 13 is an example of the "semiconductor module," "third module," and "input / output module" in the claims.

[0025] As shown in Figure 3, module 11 has one switching element Q1 and one clamp diode D1. Module 12 has one switching element Q4 and one clamp diode D2. Module 13 has two switching elements Q2 and Q3. Switching elements Q1 to Q4 are, for example, MOSFETs (metal-oxide-semiconductor field-effect transistors). In Figure 3, the diodes connected in parallel with switching elements Q1 to Q4 represent parasitic diodes (body diodes) of the MOSFETs. Alternatively, a diode element could be connected in parallel with each of the switching elements Q1 to Q4 instead of a parasitic diode.

[0026] Module 11 is located on the positive side. Module 11 connects the source side of the switching element Q1 to the cathode side of the clamp diode D1. Module 11 has terminals 11a, 11b, and 11c. Terminal 11a is connected to the drain side of the switching element Q1. Terminal 11b is connected to the anode side of the clamp diode D1. Terminal 11c is connected between the switching element Q1 and the clamp diode D1. That is, terminal 11c is connected to the source side of the switching element Q1 and the cathode side of the clamp diode D1. Terminals 11a, 11b, and 11c are examples of "module-side terminals" in the claims.

[0027] Module 12 is located on the negative side. Module 12 connects the drain side of the switching element Q4 to the anode side of the clamp diode D2. Module 12 has terminals 12a, 12b, and 12c. Terminal 12a is connected to the cathode side of the clamp diode D2. Terminal 12b is connected to the source side of the switching element Q4. Terminal 12c is connected between the clamp diode D2 and the switching element Q2. That is, terminal 12c is connected to the anode side of the clamp diode D2 and the drain side of the switching element Q4. Terminals 12a, 12b, and 12c are examples of "module-side terminals" in the claims.

[0028] Module 13 is connected to Module 11 and Module 12. In Module 13, the source side of switching element Q2 and the drain side of switching element Q3 are connected. Module 13 has terminals 13a, 13b, and 13c. Terminal 13a is connected to the drain side of switching element Q2. Terminal 13b is connected to the source side of switching element Q3. Terminal 13c is connected between switching element Q2 and switching element Q3. That is, terminal 13c is connected to the source side of switching element Q2 and the drain side of switching element Q3. Terminals 13a, 13b, and 13c are examples of "module-side terminals" in the claims. Terminal 13c is also an example of an "AC terminal" in the claims.

[0029] In modules 11 to 13, switching elements Q1 to Q4 are connected in series with each other from the higher potential side (positive side) to the lower potential side (negative side). Specifically, the drain side (terminal 11a) of switching element Q1 is connected to conductor 51, which is the higher potential conductor (upper conductor). The source side (terminal 12b) of switching element Q4 is connected to conductor 52, which is the lower potential conductor (lower conductor). The source side (terminal 11c) of switching element Q1 and the drain side (terminal 13a) of switching element Q2 are connected to each other via conductor 55. The source side (terminal 13b) of switching element Q3 and the drain side (terminal 12c) of switching element Q4 are connected to each other via conductor 54. The anode side of clamp diode D1 and the cathode side of clamp diode D2 are connected to conductor 53, which is the intermediate potential conductor (intermediate conductor). Furthermore, an AC conductor 70, which is either an input conductor or an output conductor for AC power, is connected to terminal 13c of module 13. That is, when modules 11 to 13 are included in converter sections 10a and 10b, AC power is input to terminal 13c. When modules 11 to 13 are included in inverter sections 10c to 10e, AC power is output to terminal 13c. Details of conductors 51 to 55 and the AC conductor 70 will be described later.

[0030] As shown in Figure 4, module 11 has a terminal surface 14. Module 11 also has a flattened rectangular parallelepiped shape. Terminals 11a, 11b, and 11c are arranged on the terminal surface 14 in this order along the Y1 direction. Modules 12 and 13 also have terminal surfaces 14 in the same way as module 11. In modules 12 and 13, terminals 12a, 12b, and 12c and terminals 13a, 13b, and 13c are arranged on the terminal surface 14 in this order, similar to module 11. In Figure 4, the terminal surface 14 and terminals 11a to 11c of module 11 are shown, but the terminal surface 14 and terminals 12a to 12c of module 12 and the terminal surface 14 and terminals 13a to 13c of module 13 are the same as the terminal surface 14 and terminals 11a to 11c of module 11, and are therefore not shown. Note that terminal surface 14 is an example of a "module-side terminal surface" in the claims.

[0031] As shown in Figure 5, modules 11 to 13 are arranged in parallel with all of the converter sections 10a and 10b and inverter sections 10c to 10e. Modules 12, 11, and 13 are arranged in this order along the Y2 direction. Also, converter sections 10a, 10b, 10c, 10d, and 10e are arranged in this order along the X1 direction. Furthermore, in the power conversion unit 10, there are two converter sections 10a and two converter sections 10b. That is, each converter section 10a and converter section 10b contains two of each of modules 11 to 13. The two converter sections 10a are connected in parallel with each other. Similarly, the two converter sections 10b are connected in parallel with each other. Also, in the power conversion unit 10, the inverter sections 10c to 10e are provided in parallel in pairs. Therefore, each of the converter sections 10a and 10b, and each of the inverter sections 10c to 10e, is provided with two modules 11 to 13. Note that in the circuit diagram of Figure 2, one converter section 10a and 10b and one inverter section 10c to 10e are shown, and the parallel connections are omitted from the diagram.

[0032] The power converter 100 includes a cooling body 20. The cooling body 20 cools each of the multiple modules 11 to 13. The cooling body 20 has a cooling surface 21. Each of the multiple modules 11 to 13 is arranged side by side on the cooling surface 21. The cooling body 20 has a cooling surface 21 that is aligned with the XY plane on the Z1 direction side. The cooling body 20 also has heat dissipation fins on the side opposite to the cooling surface 21 (the Z2 direction side). The cooling body 20 cools the modules 11 to 13 by exchanging heat with the modules 11 to 13 arranged on the cooling surface 21 on the Z1 direction side. The modules 11 to 13 are arranged so as to be in contact with the cooling surface 21 on the Z2 direction side. The terminal surfaces 14 of the modules 11 to 13 are provided on the Z1 direction side, opposite to the surface that is in contact with the cooling surface 21.

[0033] As shown in Figures 2 and 6, the power converter 100 includes capacitors 31 and 32. Capacitors 31 and 32 are electrically connected to the power conversion unit 10. Capacitors 31 and 32 smooth the DC power output from, for example, the converter units 10a and 10b and input to the inverter units 10c to 10e. Capacitors 31 and 32 are connected in series with each other. Capacitor 31 has a positive terminal 31a and a negative terminal 31b. Capacitor 32 has a positive terminal 32a and a negative terminal 32b. Terminal 31a of capacitor 31 is electrically connected to terminal 11a of module 11. Terminal 31b of capacitor 31 is connected to terminal 32a of capacitor 32. Terminal 32b of capacitor 32 is also connected to terminal 12b of module 12. Furthermore, terminal 31a of capacitor 31 is connected to conductor 41 (see Figure 7), which is the upper conductor (upper potential conductor). And terminal 32b of capacitor 32 is connected to conductor 42 (see Figure 7), which is the lower conductor (lower potential conductor). Also, terminal 31b of capacitor 31 and terminal 32a of capacitor 32 are connected to conductor 43 (see Figure 7), which is the intermediate conductor (intermediate potential conductor). Note that terminals 31a, 31b, 32a, and 32b are examples of "capacitor-side terminals" in the claims.

[0034] As shown in Figure 7, each of capacitors 31 and 32 has a terminal surface 33. Each of capacitors 31 and 32 has a substantially rectangular parallelepiped shape. In capacitors 31 and 32, the terminal surface 33 is located on the Z2 direction side. Capacitor 31 has two terminals 31a and two terminals 31b on its terminal surface 33. Terminals 31a and 31b are arranged alternately along the X direction on the terminal surface 33. Similarly, on the terminal surface 33 of capacitor 32, two terminals 32a and two terminals 32b are arranged alternately along the X direction. In other words, in capacitors 31 and 32, terminals of the same potential are arranged alternately. Note that the terminal surface 33 is an example of the "capacitor-side terminal surface" in the claims.

[0035] As shown in Figure 8, the power converter 100 is equipped with multiple capacitors 31 and multiple capacitors 32. For example, there are five capacitors 31 and five capacitors 32. That is, one capacitor 31 and one capacitor 32 are provided for each of the converter section 10a, converter section 10b, inverter section 10c, inverter section 10d, and inverter section 10e. In other words, one capacitor 31 and one capacitor 32 are provided for each of the two converter sections 10a and 10b connected in parallel. Similarly, one capacitor 31 and one capacitor 32 are provided for each of the two inverter sections 10c to 10e connected in parallel. The multiple capacitors 31 are arranged in a line along the X direction on the Y2 side. The multiple capacitors 32 are arranged in a line along the X direction on the Y1 side.

[0036] <Connection between module and capacitor> As shown in Figure 6, in the first embodiment, capacitors 31 and 32 are arranged such that their terminal surfaces 33 face the terminal surfaces 14 of modules 11 to 13. Specifically, the terminal surfaces 14 of modules 11 to 13, which are arranged side by side in the Y direction along the cooling surface 21, and the terminal surfaces 33 of capacitors 31 and 32, which are also arranged side by side in the Y direction, are arranged to face each other in the Z direction. That is, the terminal surfaces 33 of capacitors 31 and 32 are arranged to face the cooling surface 21.

[0037] The power converter 100 includes conductors 40 and 50. Conductor 40 is connected to terminals 31a, 31b, 32a, and 32b of capacitors 31 and 32. Conductor 40 is positioned along the terminal surfaces 33 of capacitors 31 and 32. Specifically, conductor 40 is positioned along the terminal surface 33 on the Z2 direction side and extends along the Y direction. Conductor 50 is connected to terminals 11a to 11c, 12a to 12c, 13a, and 13b of modules 11 to 13. Conductor 50 is positioned along the terminal surface 14 of modules 11 to 13. Specifically, conductor 50 is positioned along the terminal surface 14 on the Z1 direction side and extends along the Y direction. Conductors 40 and 50 are flat plate-shaped members. Conductor 40 is an example of a "capacitor-side conductor" in the claims. Furthermore, conductor 50 is an example of a "module-side conductor" in the claims.

[0038] As shown in Figure 7, the conductor 40 connected to capacitors 31 and 32 has conductors 41, conductor 42, and conductor 43. Conductor 41 is connected to terminal 31a of capacitor 31. Specifically, conductor 41 has a flat shape extending along the terminal surface 33 of capacitor 31. Conductor 41 is positioned along the XY plane, intersecting both the X and Y directions, so as to connect to the two terminals 31a of capacitor 31. A higher potential is also applied to conductor 41. Conductor 42 is connected to terminal 32b of capacitor 32. Specifically, conductor 42, like conductor 41, has a flat shape extending along the terminal surface 33 of capacitor 32. Conductor 42 is positioned along the XY plane, intersecting both the X and Y directions, so as to connect to the two terminals 32b of capacitor 32. A lower potential is also applied to conductor 42. Conductor 43 is connected across terminal 31b of capacitor 31 and terminal 32a of capacitor 32. Specifically, the conductor 43 has a flat plate shape that extends along the terminal surfaces 33 of capacitors 31 and 32. The conductor 43 is arranged in a zigzag pattern along the XY plane so as to connect to the two terminals 31b of capacitor 31 and the two terminals 32a of capacitor 32. An intermediate potential is also applied to the conductor 43.

[0039] The flat conductors 41-43 are laminated in a state of mutual insulation. That is, the conductors 41-43 are formed as a laminated conductor. Specifically, conductors 41 and 42 are arranged so as to be laminated on the Z1 direction side of conductor 43. A plate-shaped insulating member (not shown) is placed between conductor 43 and conductors 41 and 42.

[0040] Furthermore, each of the conductors 41 to 43 has a mounting portion 44 that is connected to a relay conductor 60 (see Figure 6), which will be described later. The mounting portion 44 is provided so as to be bent from the direction along the terminal surface 33 to the direction along the surface adjacent to the terminal surface 33 of the capacitors 31 and 32 (Z1 direction). The mounting portion 44 is also provided with a hole into which a fastening member 65 (see Figure 6), such as a screw, is screwed in for connection to the relay conductor 60. Details of the connection by the relay conductor 60 will be described later. Note that the mounting portion 44 is an example of the "capacitor-side mounting portion" in the claims.

[0041] As shown in Figure 9, the conductor 50 connected to modules 11-13 includes conductors 51, 52, 53, 54, and 55. Conductor 51 is an example of a "higher conductor" in the claims. Conductor 52 is an example of a "lower conductor" in the claims. Conductor 53 is an example of an "intermediate conductor" in the claims. Conductor 54 is an example of a "second connecting conductor" in the claims. Conductor 55 is an example of a "first connecting conductor" in the claims.

[0042] Conductors 51-55 have a flat plate shape that extends along the terminal surfaces 14 of modules 11-13. In other words, the terminal surfaces 33 of capacitors 31 and 32 and the terminal surfaces 14 of modules 11-13 are positioned opposite to conductors 51-55. A higher potential is applied to conductor 51. That is, conductor 51 is a higher conductor (higher potential conductor) connected to terminal 11a of module 11. A lower potential is applied to conductor 52. That is, conductor 52 is a lower conductor (lower potential conductor) connected to terminal 12b of module 12. An intermediate potential is applied to conductor 53. That is, conductor 53 is an intermediate conductor (intermediate potential conductor) connected to terminal 11b of module 11 and terminal 12a of module 12. Conductor 54 connects module 12 and module 13. Specifically, conductor 54 is connected to terminal 12c of module 12 and terminal 13b of module 13. Conductor 55 connects module 11 and module 13. Specifically, conductor 55 is connected to terminal 11c of module 11 and terminal 13a of module 13. That is, conductors 51, 53, and 55 are connected to module 11. Conductors 52, 53, and 54 are connected to module 12. Conductors 54 and 55 are connected to module 13. Conductors 51 to 55 are electrically connected to terminals 11a to 11c, 12a to 12c, 13a, and 13b of modules 11 to 13, respectively, by fastening them from the Z1 direction using fastening members such as screws.

[0043] Furthermore, in the first embodiment, conductors 51, 52, and 53 are laminated together in an insulated state to form a laminated conductor 50a. Conductors 54 and 55 are laminated together separately from the laminated conductor 50a in an insulated state to form a laminated conductor 50b. Laminated conductor 50a is an example of the "first laminated conductor" in the claims. Laminated conductor 50b is an example of the "second laminated conductor" in the claims.

[0044] Specifically, in laminated conductor 50a, conductors 51 and 52 are arranged so as to overlap conductor 53 on the Z1 direction side. Conductors 51 and 52 are arranged along the XY plane and are adjacent to each other in the Y direction. Conductors 51 and 52 and conductor 53 are insulated from each other by an insulating member (not shown). In laminated conductor 50b, conductor 54 is arranged so as to overlap conductor 55 on the Z1 direction side. Conductors 54 and conductor 55 are insulated from each other by an insulating member (not shown). Two laminated conductors 50a are provided to integrally connect converter sections 10a and 10b and inverter sections 10c to 10e, respectively. That is, one of the two laminated conductors 50a is provided so as to extend along the X direction to integrally connect modules 11 to 13 of converter section 10a and converter section 10b. The other of the two laminated conductors 50a is provided to extend along the X direction to integrally connect modules 11 to 13 of inverter sections 10c to 10e. The two laminated conductors 50a are connected to each other between converter sections 10a and 10b and inverter sections 10c to 10e. On the other hand, one laminated conductor 50b is provided separately for each converter section 10a, converter section 10b, inverter section 10c, inverter section 10d, and inverter section 10e.

[0045] Furthermore, conductors 53, 54, and 55 are positioned to avoid terminals 11a and 12b when viewed from the Z1 direction, so that conductors 51 and 52, which are located on the Z1 side, are connected to modules 11 and 12 by fastening members. Specifically, conductors 53 to 55 have holes in the region that overlaps with terminal 11a when viewed from the Z1 direction. Also, conductors 53 and 54 have holes in the region that overlaps with terminal 12b when viewed from the Z1 direction. Similarly, conductors 54 and 55 are positioned to avoid terminals 11b and 12a when viewed from the Z1 direction, so that conductor 53 is connected to modules 11 and 12. Specifically, conductors 54 and 55 have holes in the region that overlaps with terminal 11b when viewed from the Z1 direction. Also, conductor 54 has a hole in the region that overlaps with terminal 12a when viewed from the Z1 direction. Laminated conductors 50a and 50b are connected separately to modules 11-13. That is, conductors 54 and 55 are fastened and connected to modules 11-13 as laminated conductors 50b using fastening members, and then conductors 51-53 are fastened and connected to modules 11-13 as laminated conductors 50a using fastening members. Therefore, conductors 54 and 55 are integrally connected to modules 11-13, and then conductors 51-53 are integrally connected to modules 11-13. For this reason, conductors 51-53 do not have holes to avoid the connection parts for connecting conductors 54 and 55. And since conductors 51-53 are integrally connected as laminated conductors 50a, conductors 51 and 52 are positioned to avoid terminals 11b and 12a to which conductor 53 is connected when viewed from the Z1 direction. Furthermore, terminals 11a to 11c of module 11, terminals 12a and 12b of module 12, and terminals 13a and 13b of module 13 are connected to the conductor 50 (laminated conductors 50a and 50b) via an intermediate conductor 15 and fastening member.

[0046] As shown in Figure 6, the power converter 100 includes a relay conductor 60 that connects the conductors 40 on the capacitor 31 and 32 side and the conductors 50 on the module 11 to 13 side. Conductors 40 and 50 are connected by the relay conductor 60 when the terminal surfaces 33 of capacitors 31 and 32 and the terminal surfaces 14 of modules 11 to 13 are facing each other. Specifically, conductors 40 and 50 are connected at the end side of the terminal surface 33 in the direction along the terminal surface 33 (Y direction). That is, the relay conductor 60 connects conductors 40 and 50 at the end side of the terminal surface 33 in the Y direction. More specifically, the relay conductor 60 connects conductor 40 and conductor 50 at the Y2 direction end side of the terminal surface 33 of capacitor 31 and at the Y1 direction end side of the terminal surface 33 of capacitor 32, respectively. In other words, conductors 40 and 50 are connected to each other at the ends of capacitors 31 and 32 in the direction in which they are aligned. To put it another way, conductors 40 and 50 are connected to each other on the outside in the direction (Y direction) that intersects the direction (Z direction) in which the terminal faces 33 of capacitors 31 and 32 and the terminal faces 14 of modules 11 to 13 face each other.

[0047] Specifically, conductors 41 and 51 to which a higher potential is applied are connected to each other by an intermediate conductor 60. That is, the Y2-direction end of conductor 41 and the Y2-direction end of conductor 51 are connected via the intermediate conductor 60, thereby electrically connecting terminal 31a of capacitor 31 and terminal 11a of module 11. Also, conductors 42 and 52 to which a lower potential is applied are connected to each other by an intermediate conductor 60. That is, the Y1-direction end of conductor 42 and the Y1-direction end of conductor 52 are connected via the intermediate conductor 60, thereby electrically connecting terminal 32b of capacitor 32 and terminal 12b of module 12. Furthermore, conductors 43 and 53 to which an intermediate potential is applied are connected to each other by an intermediate conductor 60. In other words, the ends of conductor 43 and conductor 53 on the Y1 direction and the ends on the Y2 direction are connected via the intermediate conductor 60, thereby electrically connecting the terminal 31b of capacitor 31, the terminal 32a of capacitor 32, the terminal 11b of module 11, and the terminal 12a of module 12 to each other.

[0048] As shown in Figure 10, the intermediate conductor 60 has an L-shape that extends along the terminal surfaces 14 of modules 11-13 and in the direction opposite to the terminal surfaces 14 (Z direction). Specifically, the intermediate conductor 60 has a portion 61 that extends along the terminal surfaces 14 of modules 11-13 and a portion 62 that extends along the Z direction, which is the direction opposite to the terminal surfaces 14. That is, portion 61 is the portion that extends along the XY plane (see Figure 6). Therefore, portion 61 is arranged parallel to the conductors 51-55. And portion 62 is the portion that extends along the XZ plane (see Figure 6). Portion 62 is arranged parallel to the mounting portions 44 of the conductors 41-43. In the intermediate conductor 60, portion 61 is connected to conductors 51-55 by fastening members 64 such as screws (see Figure 6), and portion 62 is connected to conductors 41-43 by fastening members 65 such as screws (see Figure 6). At portion 62, the intermediate conductor 60 is connected to the mounting portion 44 of conductors 41-43. Note that portion 62 is an example of the "intermediate conductor side mounting portion" in the claims.

[0049] Furthermore, portion 62 has a notched hole portion 63. The notched hole portion 63 opens in the direction (Z direction) where the terminal surfaces 33 of capacitors 31 and 32 and the terminal surfaces 14 of modules 11 to 13 face each other. Specifically, a fastening member (not shown) for connecting the mounting portion 44 of conductors 41 to 43 and portion 62 of the intermediate conductor 60 is screwed into the notched hole portion 63. The notched hole portion 63 opens toward the direction (Z1 direction) toward where capacitors 31 and 32 move away from modules 11 to 13.

[0050] In the power converter 100, laminated conductor 50b is connected to modules 11-13 located on the cooling surface 21, followed by laminated conductor 50a. Then, conductor 40 is connected to capacitors 31 and 32 separately from modules 11-13. The conductor 40 connected to capacitors 31 and 32 and the conductor 50 (laminated conductors 50a and 50b) connected to modules 11-13 are connected by a relay conductor 60. The notched hole 63 provided in portion 62 of the relay conductor 60 is configured to allow connection between the relay conductor 60 and the conductor 40 while adjusting the position of the relay conductor 60 in the Z direction relative to the conductor 40.

[0051] As shown in Figure 6, an AC conductor 70 is connected to terminal 13c of module 13. AC power is input to or output from the AC conductor 70. Specifically, AC power is input from transformer 101b to the AC conductor 70 (input conductor) connected between the secondary winding of transformer 101b and terminal 13c of module 13 in converter sections 10a and 10b. Also, AC power is output from inverter sections 10c to 10e to the AC conductor 70 (output conductor) connected between terminal 13c of module 13 in inverter sections 10c to 10e and winding of motor 101c.

[0052] Furthermore, in each of the converter section 10a, converter section 10b, inverter section 10c, inverter section 10d, and inverter section 10e, modules 11 to 13 are arranged in a common order. Similarly, in each of the converter section 10a, converter section 10b, inverter section 10c, inverter section 10d, and inverter section 10e, the direction of the arrangement of the terminals of each of the modules 11 to 13 is also common. That is, from the Y1 direction side toward the Y2 direction side, modules 12, module 11, and then module 13 are arranged in that order. In terms of terminal arrangement, from the Y1 direction side toward the Y2 direction side, terminals 12c, terminal 12b, terminal 12a, terminal 11c, terminal 11b, terminal 11a, terminal 13a, terminal 13b, and then terminal 13c are arranged in that order. That is, module 13, which has terminal 13c, is located at the end of one side (Y2 direction side) in the direction in which the three modules 11 to 13 are arranged side by side. Furthermore, in module 13, which is located at the end on the Y2 direction side, terminal 13c to which the AC conductor 70 is connected is located further towards the Y2 direction side. Therefore, the AC conductor 70 is located at the Y2 direction end of modules 11 to 13, which are arranged side by side. More specifically, in the power converter 100, the AC conductor 70 to which AC power is input and the AC conductor 70 to which AC power is output are located on the common Y2 direction side. Note that module 11 may be arranged so that the arrangement of terminals 11a to 11c is reversed.

[0053] Furthermore, as shown in Figure 8, the power converter 100 includes a gate board 80. The gate board 80 outputs gate signals to control the switching operation of switching elements Q1 to Q4 based on control signals from a control unit (not shown). The gate signals are, for example, signals based on PWM (pulse width modulation) signals. The gate signals output from the gate board 80 are input between a gate terminal (not shown) and a source terminal provided on the terminal surface 14. The gate board 80 is located on the Y1 direction side, opposite to the Y2 direction side where the AC conductor 70 is located, with capacitors 31 and 32 in between.

[0054] [Effects of the First Embodiment] In the first embodiment, the following effects can be obtained.

[0055] In the first embodiment, modules 11 to 13 (semiconductor modules) have a terminal surface 14 (module-side terminal surface) on which terminals 11a to 11c, 12a to 12c, and 13a to 13c (module-side terminals), which are the terminals of modules 11 to 13, are arranged. Capacitors 31 and 32 have a terminal surface 33 (capacitor-side terminal surface) on which terminals 31a, 31b, 32a, and 32b (capacitor-side terminals), which are the terminals of capacitors 31 and 32, are arranged so as to face the terminal surface 14 of modules 11 to 13. As a result, since the terminal surface 33 and the terminal surface 14 are arranged to face each other, it is possible to prevent the terminals 31a, 31b, 32a, and 32b from being exposed on the sides of capacitors 31 and 32 other than the module 11 to 13 side. Therefore, the capacitors 31 and 32, and the equipment that is placed separately from modules 11 to 13, can be placed close to the capacitors 31 and 32 without considering the insulation distance. As a result, the size of the power converter 100 can be suppressed.

[0056] Furthermore, in the first embodiment, the device includes a conductor 40 (capacitor-side conductor) connected to terminals 31a, 31b, 32a, and 32b (capacitor-side terminals) and arranged along the terminal surface 33 (capacitor-side terminal surface), and a conductor 50 (module-side conductor) connected to terminals 11a~11c, 12a~12c, and 13a~13c (module-side terminals) and arranged along the terminal surface 14 (module-side terminal surface). Conductors 40 and 50 are connected to each other at the end of terminal surface 33 in the direction along terminal surface 33, with terminal surface 33 and terminal surface 14 facing each other. As a result, since conductors 40 and 50 are connected to each other at the end of terminal surface 33, conductors 40 and 50 can be connected from the outside of capacitors 31 and 32 and modules 11~13 at the end of terminal surface 33 without inserting tools or the like between capacitors 31 and 32 and modules 11~13. Therefore, even when terminal surfaces 33 and 14 are arranged facing each other, there is no need to provide a gap between capacitors 31 and 32 and modules 11-13 for inserting tools or the like, allowing capacitors 31 and 32 and modules 11-13 to be placed in close proximity to each other. As a result, the distance between capacitors 31 and 32 and modules 11-13 can be reduced, further suppressing the need to increase the size of the device.

[0057] Furthermore, in the first embodiment, an intermediate conductor 60 is provided that connects the conductor 40 (capacitor-side conductor) and the conductor 50 (module-side conductor) to each other at the end of the terminal surface 33 (capacitor-side terminal surface) in the direction along the terminal surface 33. As a result, since the intermediate conductor 60 is provided separately from the conductors 40 and 50, the conductors 40 and 50 can be connected by the intermediate conductor 60 without changing the shapes of the opposing conductors 40 and 50. Therefore, the conductors 40 and 50 can be connected by the intermediate conductor 60 while suppressing the complexity of the shapes of the conductors 40 and 50.

[0058] Furthermore, in the first embodiment, the conductor 40 (capacitor-side conductor) has a mounting portion 44 (capacitor-side mounting portion) that is bent from a direction along the terminal surface 33 (capacitor-side terminal surface) to a direction along the surface adjacent to the terminal surface 33 of the capacitors 31 and 32, and the intermediate conductor 60 has an L-shape that extends along the terminal surface 14 (module-side terminal surface) and in a direction opposite to the terminal surface 14, and in the portion that extends in a direction opposite to the terminal surface 14, it has a portion 62 (intermediate conductor-side mounting portion) that is connected to the mounting portion 44, and the portion 62 has a notched hole 63 that opens in the direction in which the terminal surface 33 and the terminal surface 14 face each other. As a result, the portion 62 of the L-shaped intermediate conductor 60 has a notched hole 63 that opens in the direction in which the terminal surface 33 and the terminal surface 14 face each other. Therefore, even if there are manufacturing tolerances in the direction in which the terminal surface 33 and the terminal surface 14 face each other, the conductor 40 and the intermediate conductor 60 can be easily connected by connecting the notched hole 63 and the mounting portion 44. Thus, even if there are manufacturing tolerances in the direction in which the terminal surface 33 and the terminal surface 14 face each other, the assembly work can be easily performed.

[0059] Furthermore, in the first embodiment, the power conversion unit 10 includes converter units 10a and 10b that convert the input AC power to DC power, and inverter units 10c to 10e that convert the input DC power to AC power and output it. Multiple modules 11 to 13 (semiconductor modules) are arranged in a row, and each of the multiple modules 11 to 13 includes a module 13 (input / output module) having a terminal 13c (AC terminal) to which an AC conductor 70, to which AC power is input or output, is connected. Module 13 is located at one end in the direction in which the multiple modules 11 to 13 are arranged in a row, and the terminal 13c is located on one side of module 13. As a result, since the terminal 13c is located on one side of the multiple modules 11 to 13 that are arranged in a row, it is possible to suppress the length of the AC conductor 70 connected to module 13 from becoming too large. Therefore, it is possible to suppress the overall weight of the power conversion device 100 from becoming too large.

[0060] Furthermore, in the first embodiment, the power conversion unit 10 includes a conductor 50 (module-side conductor) connected to terminals 11a-11c, 12a-12c, and 13a-13c (module-side terminals) and arranged along the terminal surface 14 (module-side terminal surface). The power conversion unit 10 includes inverter units 10c-10e (3-level inverter units) that receive three levels of potential: a higher potential, an intermediate potential, and a lower potential, and converter units 10a and 10b (3-level converter units) that output three levels of potential: a higher potential, an intermediate potential, and a lower potential. The conductor 50 includes a conductor 51 (upper conductor) to which the higher potential is applied, a conductor 53 (intermediate conductor) to which the intermediate potential is applied, and a conductor 52 (lower conductor) to which the lower potential is applied. The terminal surfaces 33 (capacitor-side terminal surfaces) of capacitors 31 and 32 are arranged to face conductors 51, conductor 52, and conductor 53. As a result, even when the power conversion unit 10 has at least one of a 3-level inverter unit and a 3-level converter unit, the terminal surface 33 is positioned to face conductors 51, conductor 52, and conductor 53. This prevents the terminals 31a, 31b, 32a, and 32b (capacitor-side terminals) and conductors 51-53 from being exposed on the sides of capacitors 31 and 32 other than the module 11-13 (semiconductor module) side. Therefore, even when the power conversion unit 10 has at least one of a 3-level inverter unit and a 3-level converter unit, equipment that is arranged separately from capacitors 31 and 32 and modules 11-13 can be placed close to capacitors 31 and 32, thus preventing the power conversion device 100 from becoming larger.

[0061] Furthermore, in the first embodiment, modules 11 to 13 (semiconductor modules) include module 11 (first module) having one switching element Q1 and one clamp diode D1 and connected to conductor 51 (upper conductor) and conductor 53 (intermediate conductor), module 12 (second module) having one switching element Q4 and one clamp diode D2 and connected to conductor 53 and conductor 52 (lower conductor), and module 13 (third module) having two switching elements Q2 and Q3 and connected to module 11 and module 12. The conductor 50 (module-side conductor) includes a conductor 55 (first connecting conductor) that connects module 11 and module 13, and a conductor 54 (second connecting conductor) that connects module 12 and module 13. Conductors 51, 52, and 53 are laminated together in an insulated state to form a laminated conductor 50a (first laminated conductor), and conductors 54 and 55 are laminated together separately from laminated conductor 50a in an insulated state to form a laminated conductor 50b (second laminated conductor). When connecting each of the multiple laminated conductors 50, it is necessary to provide holes in the other conductors in order to place fastening members such as screws at the connection portion of one of the multiple conductors 50. Taking this into consideration, in the first embodiment, conductors 51, 52, and 53 are laminated together in an insulated state to form a laminated conductor 50a, and conductors 54 and 55 are laminated together separately from the laminated conductor 50a in an insulated state to form a laminated conductor 50b. This allows the laminated conductor 50a formed by conductors 51, 52, and 53 and the laminated conductor 50b formed by conductors 54 and 55 to be connected separately to modules 11 to 13. Therefore, compared to the case where conductors 51, 52, and 53 and conductors 54 and 55 are formed together as a single laminated conductor, the number of holes to avoid connection parts can be reduced, thus suppressing a decrease in the cross-sectional area of ​​the conductors.As a result, localized heat generation due to current concentration can be suppressed in conductors 51, 52, and 53, and in conductors 54 and 55, and the increase in inductance can also be suppressed.

[0062] Furthermore, in the first embodiment, the power conversion unit 10 and capacitors 31 and 32 are mounted on the railway vehicle 101. This allows separate equipment from modules 11-13 (semiconductor modules) and capacitors 31 and 32 to be placed close to the capacitors 31 and 32, even when the power conversion unit 10 and capacitors 31 and 32 are mounted on the railway vehicle 101, thereby effectively suppressing the increase in size of the power conversion device 100 mounted on the railway vehicle 101.

[0063] [Second Embodiment] Next, a second embodiment will be described with reference to Figures 11-13. Unlike the first embodiment, which was equipped with a three-level power conversion unit 10, the second embodiment is equipped with a two-level power conversion unit 210. In the second embodiment, components similar to those in the first embodiment are denoted by the same reference numerals as in the first embodiment and their descriptions are omitted.

[0064] As shown in Figures 11 and 12, the power converter 200 of the second embodiment comprises a power conversion unit 210, a cooler 220, and a capacitor 230. The power conversion unit 210 includes three modules 211, 212, and 213. Modules 211 to 213 are arranged in the X direction on the cooling surface of the cooler 220. Each of modules 211 to 213 has terminals 210a, 210b, and 210c. Terminals 210a to 210c are located on terminal surfaces 214 provided on modules 211 to 213. The power conversion unit 210 is an example of the "power conversion unit," "inverter unit," and "two-level inverter unit" in the claims. Terminals 210a to 210c are an example of the "module-side terminals" in the claims. Modules 211 to 213 are an example of the "semiconductor module" in the claims. Furthermore, terminal surface 214 is an example of a "module-side terminal surface" as defined in the claims.

[0065] As shown in Figure 12, the capacitor 230 has terminals 230a and 230b. Terminals 230a and 230b are arranged on the terminal surface 233. In the second embodiment, the terminal surface 233 of the capacitor 230 is arranged to correspond to the terminal surfaces 214 of modules 211 to 213. Note that terminal surface 233 is an example of the "capacitor-side terminal surface" in the claims. Terminals 230a and 230b are examples of the "capacitor-side terminals" in the claims.

[0066] As shown in Figure 13, each of modules 211 to 213 has a pair of switching elements connected in series with each other. The pair of switching elements are, for example, MOSFETs. Note that in Figure 13, the diode connected in parallel with the switching elements is a parasitic diode of the MOSFET. Terminal 210a is connected to the positive side of the pair of switching elements. Terminal 210b is connected to the negative side of the pair of switching elements. Terminal 210c is connected between the pair of switching elements. In other words, a two-level power conversion circuit is formed in the power conversion unit 210. For example, the positive and negative switching elements of the pair of switching elements included in each of modules 211 to 213 constitute the upper arm and lower arm of the inverter circuit, respectively.

[0067] As shown in Figures 12 and 13, the power converter 200 comprises conductors 241, 242, 251, and 252. Conductors 241 and 242 are examples of "capacitor-side conductors" in the claims. Conductor 251 is an example of a "module-side conductor" and "upper conductor" in the claims. Conductor 252 is an example of a "module-side conductor" and "lower conductor" in the claims.

[0068] Conductor 241 is connected to terminal 230a of capacitor 230. Conductor 242 is connected to terminal 230b of capacitor 230. Conductors 241 and 242 are positioned along the terminal surface 233 of capacitor 230 and are bent in the Z2 direction on the Y1 direction side. Conductor 251 is connected to terminal 210a of modules 211-213. Conductor 252 is connected to terminal 210b of modules 211-213. Conductors 251 and 252 are positioned along the terminal surface 214 of modules 211-213 and are bent in the Z1 direction on the Y1 direction side. In other words, the terminal surface 233 of capacitor 230 is positioned opposite conductors 251 and 252.

[0069] Conductors 241 and 251 are connected to each other from the outside (Y1 direction side) at the Y1 direction end of the terminal surface 233 of the capacitor 230. Similarly, conductors 242 and 252 are connected to each other from the outside (Y1 direction side) at the Y1 direction end of the terminal surface 233 of the capacitor 230.

[0070] As described above, a two-level power conversion circuit is configured by connecting the power conversion unit 210 of the power conversion device 200 with the capacitor 230. That is, in the second embodiment, a higher potential is applied to conductors 251 and 241, while a lower potential is applied to conductors 252 and 242. The power conversion unit 210 outputs three-phase AC power to operate the motor 101c by configuring an inverter circuit that receives two levels of potential, a higher potential and a lower potential.

[0071] [Effects of the second embodiment] In the second embodiment, the following effects can be obtained.

[0072] In the second embodiment, the power conversion unit 210 includes conductors 251 and 252 (module-side conductors) connected to terminals 210a to 210c (module-side terminals) and arranged along the terminal surface 214 (module-side terminal surface), and the power conversion unit 210 includes a two-level inverter unit to which two levels of potential, an upper potential and a lower potential, are input, and the conductors 251 and 252 include a conductor 251 (upper conductor) to which the upper potential is applied and a conductor 252 (lower conductor) to which the lower potential is applied, and the terminal surface 233 (capacitor-side terminal surface) of the capacitor 230 is arranged to face the conductors 251 and 252. With this configuration, even when the power conversion unit 210 has a two-level inverter section, which is at least one of a two-level inverter section and a two-level converter section, the terminal surface 233 is positioned to face the conductors 251 and 252. This prevents the terminals 230a and 230b (capacitor-side terminals) and the conductors 251 and 252 from being exposed on the side of the capacitor 230 other than the module 211-213 (semiconductor module) side. Therefore, even when the power conversion unit 210 has at least one of a two-level inverter section and a two-level converter section, equipment that is positioned separately from the capacitor 230 and modules 211-213 can be positioned close to the capacitor 230, thus preventing the power conversion device 200 from becoming larger.

[0073] Furthermore, the other effects of the second embodiment are the same as those of the first embodiment described above.

[0074] [Differentiation] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than the description of the embodiments above, and further includes all modifications (modifications) within the meaning and scope equivalent to the claims.

[0075] For example, in the second embodiment described above, an example was shown in which one module 211 to 213 (semiconductor module) is provided in the power conversion unit 210 that outputs three-phase AC power, but the present invention is not limited to this. In the present invention, two modules 211 to 213 may be provided, as in the modified power conversion unit 310 shown in Figures 14 to 16. Specifically, in the cooling body 320, modules 211 to 213 are arranged in two rows so that one module is lined up along the Y direction. In this case as well, the terminal surface 233 of the capacitor 230 and the terminal surfaces 214 of the arranged modules 211 to 213 face each other.

[0076] In the power conversion unit 310, terminals 210a of two modules 211-213, which are arranged in the Y direction, are connected by conductor 351. Also, terminals 210b of two modules 211-213, which are arranged in the Y direction, are connected by conductor 352. Conductors 351 and 352 are the same as conductors 251 and 252, respectively. That is, conductors 351 and 352 are arranged along the terminal surfaces 214 of modules 211-213 and are bent toward the Z1 direction. Conductor 351 is connected to conductor 241, and conductor 352 is connected to conductor 242. In the power conversion unit 310, two inverter circuits are configured by providing two sets of modules 211-213, which are connected in parallel to each other.

[0077] In addition, in the power conversion unit 310 according to the above modified example, conductors 241 and 242 (capacitor-side conductors) and conductors 351 and 352 (module-side conductors) may be connected to each other at the end on the side in the direction (X direction) where modules 211 to 213 are aligned. That is, the capacitor-side conductors and module-side conductors may be arranged along the X direction, and the capacitor-side conductors and module-side conductors may be connected on the X1 direction side or the X2 direction side. In particular, when operating one set of modules 211 to 213 in parallel with another set of modules 211 to 213, connecting from the X direction can suppress the difference between the inductance on the module 211 to 213 side in the Y1 direction and the inductance on the module 211 to 213 side in the Y2 direction.

[0078] In addition, in the power conversion unit 310, the arrangement of modules 211 to 213 in the Y direction may be reversed. That is, the arrangement direction of terminals 210a to 210c of modules 211 to 213 may be reversed.

[0079] In the modified power conversion unit 310 described above, an example was shown in which two inverter circuits are configured in parallel using two modules 211 to 213 (semiconductor modules), but the present invention is not limited to this. In the present invention, a two-group inverter circuit configuration may be made by changing the connection on the output side of the power conversion unit 310. That is, by changing the connection of terminal 210c, which is the output side of modules 211 to 213, the two inverter circuits may be configured to connect to different loads.

[0080] Furthermore, while the second embodiment described above shows an example in which the power conversion unit 210 constitutes a two-level inverter unit, the present invention is not limited thereto. For example, the power conversion unit may be configured as a two-level converter unit. That is, the power conversion unit may be configured to output DC power having two levels of potential, an upper potential and a lower potential, from the input AC power. In that case, by using semiconductor modules similar to those in the second embodiment, a rectifier circuit using a bridge circuit with switching elements can be configured to form a two-level converter circuit. Also, as in the modified power conversion unit 310, when two inverter circuits are configured using two modules 211 to 213 (semiconductor modules), one of the two inverter circuits may be made into a converter circuit by changing the connection of terminal 210c (see Figure 16), which is the output side of modules 211 to 213. In other words, one set of modules 211-213 may be configured as a converter circuit that converts the input AC power into DC power, while the DC power output by one set of modules 211-213 may be converted back into AC power by an inverter circuit formed by the other set of modules 211-213 and output. Alternatively, two sets of modules 211-213 may be used to form a pair of converter circuits connected in parallel.

[0081] As described above, by using two modules 211 to 213, a capacitor 230, conductors 241 and 242, and conductors 351 and 352, which are arranged on a common cooling body 320, as common components, and by changing the connection destination of each terminal 210c of modules 211 to 213, multiple circuit configurations can be realized.

[0082] Furthermore, in the second embodiment described above, an example was shown in which conductors 241 and 242 (capacitor-side conductors) and conductors 251 and 252 (module-side conductors) are connected in the Y1 direction, which is the direction of the positive terminal 210a among the terminals 210a to 210c (module-side terminals) of modules 211 to 213 (semiconductor modules). However, the present invention is not limited to this. In the present invention, module-side conductors and capacitor-side conductors may be connected to each other at the ends on the side in the direction in which the semiconductor modules are arranged (X direction).

[0083] Alternatively, modules 211 to 213 (semiconductor modules) may be arranged not in the X direction, but along the direction in which terminals 210a to 210c are aligned (Y direction). In this case, multiple modules 211 to 213 may be arranged along the Y direction to form a multi-parallel power conversion circuit of two or more parallel configurations. In this case, capacitor 230 may be made of two capacitors connected in parallel with each other, and the capacitor-side conductor and module-side conductor may be connected from both ends in the Y direction where modules 211 to 213 are aligned (the Y1 direction end and the Y2 direction end). By arranging the parallel-connected capacitor 230 along the same Y direction as modules 211 to 213, and connecting the capacitor-side conductor and module-side conductor to each other from both outer ends in the Y direction (Y1 direction and Y2 direction), the increase in inductance in the power conversion unit 310 can be suppressed.

[0084] Furthermore, in the first embodiment described above, an example was shown in which the switching elements Q1 to Q4 included in modules 11 to 13 (semiconductor modules) are MOSFETs, but the present invention is not limited to this. In the present invention, the switching elements included in the semiconductor modules may be IGBTs (Insulated Gate Bipolar Transistors). In that case, a diode element is connected in antiparallel to each IGBT. Similarly, the switching elements included in modules 211 to 213 of the second embodiment may also be IGBTs.

[0085] In the first and second embodiments described above, examples were shown in which conductors 40, 241, 242 (capacitor-side conductors) and conductors 50, 251, 252 (module-side conductors) are connected to each other at the end of the terminal faces 33, 233 (capacitor-side terminal faces) of capacitors 31, 32, and 230. However, the present invention is not limited to this. In the present invention, the capacitor-side conductors and module-side conductors may be connected to each other on the inside (central part) of the capacitor-side terminal face.

[0086] In the first embodiment described above, an example was shown in which conductor 40 (capacitor-side conductor) and conductor 50 (module-side conductor) are connected via an intermediate conductor 60, but the present invention is not limited thereto. In the present invention, the capacitor-side conductor and the module-side conductor may be connected directly without using an intermediate conductor. Also, in the second embodiment described above, an example was shown in which conductors 241 and 242 (capacitor-side conductors) and conductors 251 and 252 (module-side conductors) are connected directly, but even in a two-level circuit configuration, the module-side conductor and the capacitor-side conductor may be connected via an intermediate conductor as in the first embodiment.

[0087] Furthermore, although the first embodiment described above shows an example in which the relay conductor 60 has a notched hole 63, the present invention is not limited thereto. In the present invention, the relay conductor may be provided with an elongated hole that extends in the direction opposite to the capacitor-side terminal surface and the module-side terminal surface, rather than a notched hole that opens in the direction opposite to the capacitor-side terminal surface and the module-side terminal surface.

[0088] Furthermore, although the first embodiment described above shows an example in which a bent mounting portion 44 (capacitor-side mounting portion) is provided on the conductor 40 (capacitor-side conductor) on the capacitor 31 and 32 side, the present invention is not limited to this. In the present invention, a bent module-side bent portion may be provided on the conductor 50 (module-side conductor) on the module 11 to 13 (semiconductor module) side.

[0089] Furthermore, in the first embodiment described above, an example was shown in which the terminal 13c (AC terminal) that receives or outputs AC power is located at the end of modules 11 to 13 (semiconductor modules) that are arranged side by side. However, the present invention is not limited to this. In the present invention, the AC terminal may be located in the central part of the semiconductor modules that are arranged side by side, rather than at the ends.

[0090] Furthermore, although the first embodiment described above shows an example in which the conductor 50 (module-side conductor) is laminated in a state where it is divided into laminate conductor 50a (first laminate conductor) and laminate conductor 50b (second laminate conductor), the present invention is not limited thereto. In the present invention, the conductor 50 may be formed integrally as a single laminate conductor.

[0091] Furthermore, in the first embodiment described above, each of module 11 (first module) and module 12 (second module) has one switching element Q1 (Q4), and module 13 (third module) has two switching elements Q2 and Q3, but the present invention is not limited thereto. In the present invention, each of the first module and the second module may have two switching elements connected in series with each other, and the third module may have two clamp diodes.

[0092] Furthermore, in the first embodiment described above, an example was shown in which terminals of the same potential are arranged diagonally and alternately on the terminal surfaces 33 (capacitor-side terminal surfaces) of capacitors 31 and 32, but the present invention is not limited to this. In the present invention, the terminals of the capacitor may be arranged side by side with terminals of the same potential. Also, the number of terminals of the capacitor may be more than four.

[0093] Furthermore, while the first and second embodiments described above show the power conversion unit 10(210) and capacitors 31 and 32(230) mounted on a railway vehicle 101, the present invention is not limited thereto. For example, the power conversion unit and capacitors may be configured to be mounted on a vehicle other than a railway vehicle, such as an electric vehicle. Alternatively, the power conversion unit and capacitors may be configured to supply power to a stationary electric motor or the like, rather than to a vehicle.

[0094] Furthermore, in the first embodiment described above, an example was shown in which each of the converter sections 10a and 10b of the power conversion unit 10 is configured in two parallel units, and each of the inverter sections 10c to 10e is similarly configured in two parallel units. However, the present invention is not limited to this. For example, the power conversion unit (converter section and inverter section) may be configured with one unit each instead of in parallel. Alternatively, each of the power conversion unit (converter section and inverter section) may be configured in a multi-parallel configuration of three or more units. Furthermore, the number of parallel units of the converter section and the inverter section may be different from each other. [Explanation of symbols]

[0095] 10 Power conversion unit 10a, 10b Converter section (Converter section, 3-level converter section) 10c, 10d, 10e Inverter section (Inverter section, 3-level inverter section) 11 Modules (Semiconductor Module, Module 1) 11a, 11b, 11c, 12a, 12b, 12c, 13a, 13b, 210a, 210b, 210c terminals (module side terminals) 13c terminal (module side terminal, AC terminal) 12 modules (semiconductor module, second module) 13 modules (semiconductor module, third module, input / output module) 14, 214 Terminal side (module side terminal side) 31, 32, 230 Capacitors Terminals 31a, 31b, 32a, 32b, 230a, 230b (capacitor side terminals) 33, 233 Terminal side (capacitor side terminal side) 40, 41, 42, 43, 241, 242 Conductors (Capacitor side conductors) 44 Mounting section (capacitor side mounting section) 50 Conductors (Module-side conductors) 50a Laminated conductor (first laminated conductor) 50b Laminated conductor (second laminated conductor) 51, 251, 351 conductors (module-side conductors, upper-level conductors) 52, 252, 352 conductors (module-side conductors, lower conductors) 53 Conductors (module-side conductors, intermediate conductors) 54 Conductors (module-side conductor, second connecting conductor) 55 Conductors (module-side conductor, first connecting conductor) 60 relay conductors 70 AC conductor 62 Section (Mounting section on the intermediate conductor side) 63 Notched hole 100, 200 Power Converters 101 Railway Vehicles 210, 310 Power Conversion Unit (Power Conversion Unit, Inverter Unit, 2-Level Inverter Unit) 211, 212, 213 modules (semiconductor modules)

Claims

1. A power conversion unit that includes a semiconductor module having a switching element and converts and outputs the input power, The power conversion unit comprises a capacitor electrically connected to the semiconductor module, The semiconductor module has a module-side terminal surface on which the module-side terminals, which are the terminals of the semiconductor module, are arranged. The capacitor has a capacitor-side terminal surface on which the capacitor-side terminals, which are the terminals of the capacitor, are arranged, and the capacitor-side terminal surface is arranged to face the module-side terminal surface of the semiconductor module. The module side conductor is further connected to the module side terminal and arranged along the module side terminal surface, The module-side conductors are laminated together in an insulated state to form a laminated conductor. The semiconductor modules are arranged in a row along a predetermined orientation, The plurality of semiconductor modules include input / output modules having AC terminals to which AC power is input or output and to which AC conductors, which are arranged separately from the laminated conductors, are directly connected. The input / output module is a power converter located at one end of the arrangement direction in which the plurality of semiconductor modules are arranged side by side.

2. The capacitor side conductor is further connected to the capacitor side terminal and arranged along the surface of the capacitor side terminal, The power conversion device according to claim 1, wherein the capacitor-side conductor and the module-side conductor are connected to each other at the end of the capacitor-side terminal surface in a direction along the capacitor-side terminal surface, with the capacitor-side terminal surface and the module-side terminal surface facing each other.

3. The power conversion device according to claim 2, further comprising a relay conductor that connects the capacitor-side conductor and the module-side conductor to each other at the end of the capacitor-side terminal surface in a direction along the capacitor-side terminal surface.

4. The capacitor-side conductor has a capacitor-side mounting portion that is bent in a direction from along the capacitor-side terminal surface to along the surface of the capacitor adjacent to the capacitor-side terminal surface. The relay conductor has an L-shape that extends along the module-side terminal surface and in a direction opposite to the module-side terminal surface, and in the portion extending in the direction opposite to the module-side terminal surface, it has a relay conductor-side mounting portion that is connected to the capacitor-side mounting portion. The power conversion device according to claim 3, wherein the relay conductor side mounting portion has a notched hole portion that opens in a direction in which the capacitor side terminal surface and the module side terminal surface face each other.

5. The power conversion unit includes at least one of a converter unit that converts the input AC power into DC power and an inverter unit that converts the input DC power into AC power and outputs it. The AC terminal is located on one side of the input / output module, as described in any one of claims 1 to 4.

6. The power conversion unit includes at least one of a three-level inverter unit that receives three levels of potential, namely a higher potential, an intermediate potential, and a lower potential, and a three-level converter unit that outputs three levels of potential, namely a higher potential, an intermediate potential, and a lower potential. The module-side conductor includes an upper conductor to which a higher potential is applied, an intermediate conductor to which an intermediate potential is applied, and a lower conductor to which a lower potential is applied. The power conversion device according to any one of claims 1 to 4, wherein the capacitor-side terminal surface of the capacitor is arranged to face the upper conductor, the intermediate conductor, and the lower conductor.

7. The aforementioned semiconductor module is A first module having one switching element and one clamp diode, and connected to the upper conductor and the intermediate conductor, A second module having one switching element and one clamp diode, and connected to the intermediate conductor and the lower conductor, The system includes a third module having two of the switching elements and connected to the first module and the second module, The module-side conductor includes a first connecting conductor that connects the first module and the third module, and a second connecting conductor that connects the second module and the third module. The upper conductor, the intermediate conductor, and the lower conductor are laminated together in an insulated state to form a first laminated conductor. The power conversion device according to claim 6, wherein the first connecting conductor and the second connecting conductor are laminated separately from the first laminate conductor in an insulated state from each other to form a second laminate conductor.

8. The power conversion unit includes at least one of a two-level inverter unit that receives two levels of potential, an upper potential and a lower potential, and a two-level converter unit that outputs two levels of potential, an upper potential and a lower potential. The module-side conductor includes an upper conductor to which a higher potential is applied and a lower conductor to which a lower potential is applied. The power conversion device according to any one of claims 1 to 4, wherein the capacitor-side terminal surface of the capacitor is arranged to face the upper conductor and the lower conductor.

9. The power conversion device according to any one of claims 1 to 4, wherein the power conversion unit and the capacitor are mounted on a railway vehicle.

10. A power conversion unit comprising a semiconductor module having a switching element, which converts and outputs input power, The power conversion unit comprises a capacitor electrically connected to the semiconductor module, The semiconductor module has a module-side terminal surface on which the module-side terminals, which are the terminals of the semiconductor module, are arranged. The capacitor has a capacitor-side terminal surface on which the capacitor-side terminals, which are the terminals of the capacitor, are arranged, and the capacitor-side terminal surface is arranged to face the module-side terminal surface of the semiconductor module. A capacitor-side conductor connected to the capacitor-side terminal and positioned along the surface of the capacitor-side terminal, The module further comprises a module-side conductor connected to the module-side terminal and arranged along the surface of the module-side terminal, The semiconductor modules are arranged in a row along a predetermined orientation, A power conversion device in which the capacitor-side conductor and the module-side conductor are connected to each other from the outside in the arrangement direction, at the end of the capacitor-side terminal surface in the arrangement direction along the capacitor-side terminal surface, with the capacitor-side terminal surface and the module-side terminal surface facing each other.

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