Method for manufacturing adhesive sheets and semiconductor devices

JP7863440B2Active Publication Date: 2026-05-21LINTEC CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
LINTEC CORP
Filing Date
2022-03-24
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

Existing adhesive sheets for handling semiconductor wafers and chips require active energy ray irradiation for separation, increasing manufacturing costs and complexity, and suffer from static electricity issues that can damage or contaminate the workpieces.

Method used

An adhesive sheet with a base material containing an antistatic agent and an adhesive layer composed of a non-active energy ray curable adhesive, using an alkylene glycol-modified rosin ester as a tackifier, which allows easy separation of workpieces without irradiation and suppresses static charge.

Benefits of technology

The adhesive sheet effectively holds workpieces, enables easy separation without active energy ray irradiation, and provides excellent antistatic properties to prevent contamination and damage.

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Patent Text Reader

Abstract

To provide an adhesive sheet that can hold a workpiece well and separate the workpiece well without requiring irradiation with active energy ray, and, furthermore, that has excellent antistatic property.SOLUTION: Provided is an adhesive sheet, which is an adhesive sheet for handling a workpiece that includes a substrate and an adhesive layer laminated on one side of the substrate, and in which the substrate contains an antistatic agent, the adhesive layer is made of a non-active energy ray-curable adhesive formed from an adhesive composition containing at least an acrylic polymer and a tackifier, and the tackifier is an alkylene glycol modified rosin ester.SELECTED DRAWING: None
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