Method for manufacturing adhesive sheets and semiconductor devices
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- LINTEC CORP
- Filing Date
- 2022-03-24
- Publication Date
- 2026-05-21
AI Technical Summary
Existing adhesive sheets for handling semiconductor wafers and chips require active energy ray irradiation for separation, increasing manufacturing costs and complexity, and suffer from static electricity issues that can damage or contaminate the workpieces.
An adhesive sheet with a base material containing an antistatic agent and an adhesive layer composed of a non-active energy ray curable adhesive, using an alkylene glycol-modified rosin ester as a tackifier, which allows easy separation of workpieces without irradiation and suppresses static charge.
The adhesive sheet effectively holds workpieces, enables easy separation without active energy ray irradiation, and provides excellent antistatic properties to prevent contamination and damage.
Smart Images

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