Manufacturing equipment for semiconductor devices and method for suction of components

Abstract

To provide a semiconductor device manufacturing device that can appropriately attract and hold both a semiconductor chip and a reference jig using one mounting tool.SOLUTION: A semiconductor device manufacturing device 10 includes a reference jig 40 larger in size than a semiconductor chip 60, and a mounting tool 15 that individually suctions and transfers the semiconductor chip 60 and the reference jig 40. The mounting tool 15 includes a base surface 26 that comes into contact with the top surface of the reference jig 40 when the reference jig 40 is held by suction, a second block 22 that protrudes from the base surface 26 and has a suction hole 28 formed therein, and the second block 22 coming into contact with the top surface of the semiconductor chip 60 when sucking and holding the semiconductor chip 60, and the reference jig 40 has a receiving recess 46 that receives the second block 22 and defines a closed space between it and the mounting tool 15 when the reference jig 40 is suction-held by the mounting tool 15.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] This specification discloses a manufacturing apparatus for a semiconductor device including a mounting tool that individually sucks and transfers a semiconductor chip and a reference jig larger in size than the semiconductor chip, and a method for transferring a member.

Background Art

[0002] In a manufacturing apparatus for a semiconductor device, a mounting tool sucks and holds a semiconductor chip. Then, with the semiconductor chip sucked, the mounting tool moves to bond the semiconductor chip to a substrate or the like.

[0003] Such a mounting tool may suck and hold not only a semiconductor chip but also a reference jig larger in size than the semiconductor chip. For example, for positioning and calibration of the mounting tool, a transparent flat calibration jig may be sucked and held by the mounting tool and transferred to a predetermined position. Also, for measuring the flatness of a substrate, a measuring jig larger in size than the semiconductor chip may be sucked and held by the mounting tool. Hereinafter, a jig that is larger in size than a semiconductor chip and is sucked and held by a mounting tool, such as a calibration jig and a measuring jig, is referred to as a "reference jig".

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] Here, the reference jig is significantly larger than the semiconductor chip. Thus, when attempting to suck and hold components with significantly different sizes using a single mounting tool, various problems were likely to occur.

[0006] For example, if the suction surface of the mounting tool is made smaller to match the size of the semiconductor chip, it may not be able to properly suction a large reference jig. On the other hand, if the suction surface of the mounting tool is made larger to match the size of the reference jig, when suctioning a semiconductor chip, a portion of the suction surface may protrude from the semiconductor chip, potentially interfering with other adjacent semiconductor chips.

[0007] Furthermore, Patent Document 1 discloses a technique in which the bottom surface of the collet is shaped like a hollow pyramidal pyramid. With such a collet, it is possible to suck up multiple types of objects of different sizes. However, even with the collet of Patent Document 1, the problem of the portion of the collet that protrudes from the object being sucked interfering with other adjacent components cannot be solved.

[0008] Therefore, this specification discloses a semiconductor device manufacturing apparatus and a method for collecting components that can appropriately hold both a semiconductor chip and a reference jig using a single mounting tool. [Means for solving the problem]

[0009] A semiconductor device manufacturing apparatus disclosed herein comprises a reference jig larger than a semiconductor chip, and a mounting tool for individually suctioning and transferring the semiconductor chip and the reference jig, wherein the mounting tool has a base surface that contacts the upper surface of the reference jig when suctioning and holding the reference jig, and a suction projection that protrudes from the base surface and has a suction hole formed therein, and a suction projection that contacts the upper surface of the semiconductor chip when suctioning and holding the semiconductor chip, and the reference jig has a receiving recess that receives the suction projection and forms a closed space between itself and the mounting tool when suctioned and held by the mounting tool.

[0010] In this case, the outer shape of the suction projection may be smaller than the outer shape of the semiconductor chip.

[0011] Furthermore, the receiving recess may not have a shape that includes sharp corners.

[0012] Furthermore, the reference fixture may be a calibration fixture or a measuring fixture.

[0013] Furthermore, the outer dimensions of the receiving recess may be 50% or more of the outer dimensions of the reference jig.

[0014] The method for aspirating a component disclosed herein is a method for aspirating a component in which a semiconductor chip and a reference jig larger than the semiconductor chip are individually aspirated with a single mounting tool, wherein the mounting tool has a base surface and a suction projection that protrudes from the base surface and has a suction hole formed therein, and the reference jig has a receiving recess formed on its upper surface that completely accommodates the suction projection, and when aspirating the semiconductor chip with the mounting tool, the suction projection is brought into contact with the semiconductor chip, and when aspirating the reference jig with the mounting tool, the base surface is brought into contact with the upper surface of the reference jig with the suction projection housed in the receiving recess. [Effects of the Invention]

[0015] According to the technology disclosed herein, a single mounting tool can appropriately hold both a semiconductor chip and a reference fixture by suction. [Brief explanation of the drawing]

[0016] [Figure 1] This is a schematic diagram showing the configuration of semiconductor device manufacturing equipment. [Figure 2] This is a schematic diagram showing the configuration of semiconductor device manufacturing equipment. [Figure 3] This is a plan view of the reference jig. [Figure 4] This diagram shows the bonding process of semiconductor chips using an assembly tool. [Figure 5] This diagram shows how a reference jig is moved and positioned using an implementation tool. [Figure 6A] This figure shows an example of another reference fixture. [Figure 6B] This figure shows another example of a reference fixture. [Figure 7]It is a diagram showing how a semiconductor chip is bonded with a tool of a comparative example. [Figure 8] It is a diagram showing how a reference jig of a comparative example is transferred and arranged with an implementation tool.

Embodiments for Carrying out the Invention

[0017] Hereinafter, the configuration of a manufacturing apparatus 10 for a semiconductor device will be described with reference to the drawings. FIGS. 1 and 2 are schematic diagrams showing the configuration of the manufacturing apparatus 10. This manufacturing apparatus 10 manufactures a semiconductor device by bonding a semiconductor chip 60 onto an object to be joined. The object to be joined is a substrate 70 or another semiconductor chip 60 bonded to the substrate 70.

[0018] The manufacturing apparatus 10 includes a stage 12, an implementation head 14, and a reference jig 40. The stage 12 is a table on which the substrate 70 is placed. The stage 12 may have a heater (not shown) for heating the substrate 70.

[0019] An implementation head 14 is provided above the stage 12. The implementation head 14 has an implementation tool 15 that can move in the horizontal and vertical directions. The implementation tool_15 sucks and holds the semiconductor chip 60 on its bottom surface and transfers the semiconductor chip 60. The bottom of the implementation tool 15 has a two-stage structure in which a first block 20 and a second block 22 are stacked vertically. The outer dimension of the first block 20 in a top view is sufficiently larger than the outer dimension of the semiconductor chip 60. Also, the bottom surface of the first block 20 functions as a base surface 26 that contacts the upper surface of the reference jig 40 when sucking and holding the reference jig 40 described later.

[0020] The second block 22 protrudes downward from the bottom surface (i.e., the base surface 26) of the first block 20. This second block 22 functions as a suction projection that attracts and holds the semiconductor chip 60. The external dimensions of the second block 22 in a top view are smaller than the external dimensions of the semiconductor chip 60. The bottom surface of this second block 22 functions as a suction surface 24 that contacts the top surface of the semiconductor chip 60 when attracting and holding the semiconductor chip 60.

[0021] A suction hole 28 is formed in the suction surface 24. This suction hole 28 is fluidly connected to a suction pump 30 via a suction passage 29 formed inside the mounting tool 15. The suction pump 30 is located outside the mounting tool 15 and applies negative pressure to the suction hole 28.

[0022] Reference fixture 40 is a fixture used to calibrate or measure various components related to the manufacturing apparatus 10. Reference fixture 40 is, for example, a calibration fixture 42 for calibrating the positioning function of the mounting tool 15. Calibration fixture 42 is, for example, a flat plate-shaped member made of a transparent material such as glass. The calibration procedure using calibration fixture 42 is not particularly limited. For example, to calibrate the positioning function of the mounting tool 15, a fixture-side marker (not shown) may be attached to the calibration fixture 42 in advance. When calibrating, the calibration fixture 42 is held by suction and transported using the mounting tool 15, and the calibration fixture 42 is positioned relative to a reference point on the substrate 70. After positioning, the amount of calibration of the positioning function of the mounting tool 15 may be determined based on the amount of misalignment between the reference point, which can be observed through the transparent calibration fixture 42, and the fixture-side marker.

[0023] Figure 3 is a plan view of the reference fixture 40. In Figure 3, the dashed lines indicate the outlines of the first block 20 and the second block 22 of the mounting tool 15. As is clear from Figures 2 and 3, the external dimensions of the reference fixture 40 are significantly larger than those of the semiconductor chip 60. Furthermore, the external dimensions of the reference fixture 40 are larger than those of the first block 20 (and consequently, the external dimensions of the base surface 26). In addition, a receiving recess 46 for receiving the second block 22 is formed on the upper surface of the reference fixture 40. The external dimensions of the receiving recess 46 are significantly larger than those of the second block 22. Furthermore, the depth of the receiving recess 46 is significantly greater than the height of the second block 22. Therefore, when the reference fixture 40 is held by the mounting tool 15, the base surface 26 of the mounting tool 15 adheres closely to the upper surface of the reference fixture 40, thereby creating a closed space in the receiving recess 46 that is sealed by the mounting tool 15.

[0024] As is clear from the explanation so far, the implementation tool 15 in this example has a two-tiered bottom structure, and a receiving recess 46 is formed on the upper surface of the reference jig 40. The reason for this configuration will be explained in comparison with the comparative example.

[0025] Figure 7 shows the bonding of a semiconductor chip 60 using a comparative example mounting tool 15*. This mounting tool 15* does not have a second block 22 smaller than the semiconductor chip 60. The bottom surface of the mounting tool 15*, i.e., the bottom surface of the first block 20, is a flat surface without protrusions, and a suction hole 28 is formed on the bottom surface of this first block 20. When bonding the semiconductor chip 60 using such a mounting tool 15*, the top surface of the semiconductor chip 60 is brought into contact with the bottom surface of the first block 20, and the semiconductor chip 60 is held in place by suction. In this case, as is clear from Figure 7, a part of the bottom surface of the first block 20 protrudes outside the semiconductor chip 60. Consider the case where the semiconductor chip 60 is picked up from a chip supply source (e.g., a diced wafer) in this state, or when the suction-held semiconductor chip 60 is bonded to a substrate 70. In this case, as shown in Figure 7, the portion of the first block 20 that protrudes outward from the semiconductor chip 60 may interfere with other adjacent semiconductor chips 60, potentially causing damage to those other semiconductor chips 60.

[0026] Therefore, in this example, a second block 22 smaller than the outer dimensions of the semiconductor chip 60 is provided on the bottom surface of the mounting tool 15. With this configuration, as shown in Figure 4, it is possible to effectively prevent a part of the second block 22 from interfering with other semiconductor chips 60 when bonding the semiconductor chips 60.

[0027] However, with this mounting tool 15, there was a problem in that it was difficult to hold the reference jig 40* of the comparative example by suction. Figure 8 shows how the reference jig 40* of the comparative example is held by suction using the mounting tool 15. The upper surface of the reference jig 40* of the comparative example is a flat surface, and the reference jig 40* does not have a receiving recess 46. When such a reference jig 40* is held by suction using the mounting tool 15, the suction force acts only on the part of the reference jig 40* that faces the suction hole 28. Since the suction hole 28 is very small compared to the reference jig 40*, in this case, excessive stress concentration occurs on the part of the reference jig 40* that faces the suction hole 28, which may lead to damage to the reference jig 40*. In addition, when the area on which the suction force acts is small, it becomes difficult to maintain the gravitational balance when holding the reference jig 40* by suction, which may lead to the reference jig 40 tilting or falling.

[0028] Therefore, in this example, a receiving recess 46 for receiving the second block 22 is formed on the upper surface of the reference jig 40. With this configuration, as shown in Figure 5, when the reference jig 40 is held by suction, a suction force acts on the entire receiving recess 46. Since the receiving recess 46 is sufficiently larger than the suction hole 28, stress concentration can be reduced and gravity balance can be maintained more easily compared to the comparative example in Figure 8.

[0029] In this example, the receiving recess 46 has a shape without sharp corners. Specifically, as shown in Figures 2 and 3, the receiving recess 46 has a shape with filleted corners. This configuration is to prevent stress concentration at the corners when the reference jig 40 is held in place by suction. Furthermore, the larger the outer size of the receiving recess 46, the more stress concentration is reduced and the more stable the gravitational balance becomes. Therefore, the outer size of the receiving recess 46 may be 50% or more, or even 80% or more, of the outer size of the reference jig 40.

[0030] In any case, as is clear from the above explanation, the manufacturing apparatus 10 in this example allows for the proper transfer of both the semiconductor chip 60 and the reference jig 40 using a single mounting tool 15. Note that the above explanation is merely an example. Therefore, other configurations may be modified as long as the mounting tool 15 includes a base surface 26 that contacts the upper surface of the reference jig 40 and a suction projection protruding from the base surface 26, and the reference jig 40 includes a receiving recess 46 that receives the suction projection.

[0031] For example, in the above example, the calibration jig 42 was given as the reference jig 40, but the reference jig 40 can be any other jig that is larger than the semiconductor chip 60 and is held by the mounting tool 15. For example, the reference jig 40 may be a measuring jig 44 as shown in Figure 6A. This measuring jig 44 is used when measuring the parallelism of the stage 12 or the substrate 70. The measuring jig 44 shown in Figure 6A includes a flat plate and a cone that protrudes downward from the flat plate. When measuring the parallelism of the surface to be measured, the tip of the cone is brought into contact with two or more points on the surface to be measured in sequence while the measuring jig 44 is held by the mounting tool 15. The parallelism is then measured based on the height of the mounting tool 15 at each point of contact. A receiving recess 46 for receiving the second block 22 may also be formed on the upper surface of such a measuring jig 44.

[0032] The reference jig 40 may also be a measuring jig 44 as shown in Figure 6B. The measuring jig 44 shown in Figure 6B includes a flat plate and a cone protruding upward from the flat plate. In this case, the measuring jig 44 is placed on the stage 12 or substrate 70 while being held in place by the mounting tool 15. Then, the tip of the cone is brought into contact with two or more points on the bottom surface of the mounting tool 15, and the parallelism is measured based on the height of the mounting tool 15 at each point of contact. A receiving recess 46 for receiving the second block 22 may also be formed on the upper surface of such a measuring jig 44. In this case, of course, the receiving recess 46 is formed in a position that avoids the cone.

[0033] Furthermore, the shape and size of the receiving recess 46 may be modified as appropriate, as long as it can fully receive the second block 22. For example, the receiving recess 46 may have a shape with sharp corners. Also, the external dimensions of the receiving recess 46 may be less than 50% of the external dimensions of the reference fixture 40. In addition, the first block 20 and the second block 22 may be integrated with the mounting tool 15, or they may be detachable from the mounting tool 15. For example, the first block 20 and the second block 22 may be detachable attachments from the mounting tool 15. [Explanation of Symbols]

[0034] 10 Manufacturing equipment, 12 Stage, 14 Mounting head, 15 Mounting tool, 20 First block, 22 Second block, 24 Suction surface, 26 Base surface, 28 Suction hole, 29 Suction passage, 30 Suction pump, 40 Reference fixture, 42 Calibration fixture, 44 Measurement fixture, 46 Receiving recess, 60 Semiconductor chip, 70 Substrate.

Claims

1. A reference jig larger than a semiconductor chip, A mounting tool for individually suctioning and transferring the semiconductor chip and the reference jig, The implementation tool is equipped with, When the reference jig is held in place by suction, the base surface that contacts the upper surface of the reference jig, A suction projection that protrudes from the base surface and has a suction hole formed therein, the suction projection that contacts the upper surface of the semiconductor chip when the semiconductor chip is held in suction, The reference fixture has a receiving recess that receives the suction projection and forms a closed space between itself and the mounting tool when it is held by the mounting tool. A semiconductor device manufacturing apparatus characterized by the following features.

2. A semiconductor device manufacturing apparatus according to claim 1, A semiconductor device manufacturing apparatus characterized in that the outer shape of the suction protrusion is smaller than the outer shape of the semiconductor chip.

3. A semiconductor device manufacturing apparatus according to claim 1, A semiconductor device manufacturing apparatus characterized in that the receiving recess does not have sharp corners.

4. A semiconductor device manufacturing apparatus according to claim 1, A semiconductor device manufacturing apparatus characterized in that the aforementioned reference jig is a calibration jig or a measuring jig.

5. A semiconductor device manufacturing apparatus according to claim 1, A semiconductor device manufacturing apparatus characterized in that the external dimensions of the receiving recess are 50% or more of the external dimensions of the reference jig.

6. A method for aspirating components, comprising individually aspirating a semiconductor chip and a reference jig larger than the semiconductor chip using a single mounting tool, The aforementioned mounting tool has a base surface and a suction projection that protrudes from the base surface and has a suction hole formed therein. The aforementioned reference jig has a receiving recess formed on its upper surface that completely accommodates the suction projection. When using the mounting tool to attract the semiconductor chip, the attraction projection is brought into contact with the semiconductor chip. When the reference jig is sucked in by the mounting tool, the base surface is brought into contact with the upper surface of the reference jig while the suction projection is housed in the receiving recess. A method for suctioning a component, characterized by the above.

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